TWI497818B - Antenna and electronic device - Google Patents
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本發明係指一種天線及電子裝置,尤指一種具有良好整合性之天線及電子裝置。The invention relates to an antenna and an electronic device, in particular to an antenna and an electronic device with good integration.
一般具有行動通訊功能之電子裝置係透過天線發射或接收行動電波,以傳遞或交換行動電訊號,進而存取一行動通訊系統。為了讓使用者能更方便地存取行動通訊系統,理想天線的頻寬應在許可範圍內盡可能地增加,而尺寸則應盡量減小,以配合電子產品小型化之趨勢。因此,隨著電子裝置體積以及天線空間縮小之趨勢,如何有效利用電子裝置內部的空間配置,將天線整合入電子裝置之中,已成為業界的挑戰之一。Generally, an electronic device having a mobile communication function transmits or receives a mobile radio wave through an antenna to transmit or exchange a mobile electric signal, thereby accessing a mobile communication system. In order to make it easier for users to access the mobile communication system, the bandwidth of the ideal antenna should be increased as much as possible within the permissible range, and the size should be minimized to match the trend of miniaturization of electronic products. Therefore, with the trend of the size of the electronic device and the reduction of the antenna space, how to effectively utilize the spatial arrangement inside the electronic device and integrate the antenna into the electronic device has become one of the challenges in the industry.
因此,本發明之主要目的在於提供一種具良好整合性之天線及電子裝置。Accordingly, it is a primary object of the present invention to provide an antenna and an electronic device that are well integrated.
本發明揭露一種天線,用於一電子裝置,該天線包含有一輻射體;一訊號饋入端,電性連接於該輻射體,用來饋入一射頻訊號至該輻射體,以透過該輻射體發射該射頻訊號;一接地部,用來提供接地於該天線;一接地端,電性連接於該接地部;一第一連接單元, 電性連接於該訊號饋入端;一第二連接單元,電性連接於該接地端;以及一傳輸線,電性連接於該第一連接單元與該第二連接單元,用來傳遞該射頻訊號,並透過該第一連接單元將該射頻訊號傳遞至該訊號饋入端,以及透過該第二連接單元電性連接於該接地端。The present invention discloses an antenna for an electronic device, the antenna includes a radiator, and a signal feeding end electrically connected to the radiator for feeding an RF signal to the radiator to transmit the radiator Transmitting the RF signal; a grounding portion for providing grounding to the antenna; a grounding end electrically connected to the grounding portion; a first connecting unit, Electrically connected to the signal feeding end; a second connecting unit electrically connected to the grounding end; and a transmission line electrically connected to the first connecting unit and the second connecting unit for transmitting the RF signal The RF signal is transmitted to the signal feed end through the first connection unit, and is electrically connected to the ground terminal through the second connection unit.
本發明另揭露一種電子裝置,包含有一射頻訊號處理單元,用來產生一第一射頻訊號;以及一第一天線,耦接於該射頻訊號處理單元,該第一天線包含有一第一輻射體;一第一訊號饋入端,電性連接於該第一輻射體,用來饋入該第一射頻訊號至該第一輻射體,以透過該第一輻射體發射該第一射頻訊號;一第一接地部,用來提供接地於該第一天線;一第一接地端,電性連接於該第一接地部;一第一連接單元,電性連接於該第一訊號饋入端一第二連接單元,電性連接於該第一接地端;以及一傳輸線,電性連接於該第一連接單元與該第二連接單元,用來傳遞該第一射頻訊號,並透過該第一連接單元將該第一射頻訊號傳遞至該第一訊號饋入端,以及透過該第二連接單元電性連接於該第一接地端。The present invention further discloses an electronic device including an RF signal processing unit for generating a first RF signal, and a first antenna coupled to the RF signal processing unit, the first antenna including a first radiation a first signal feed end electrically connected to the first radiator for feeding the first RF signal to the first radiator to transmit the first RF signal through the first radiator; a first grounding portion is provided to be grounded to the first antenna; a first grounding end is electrically connected to the first grounding portion; and a first connecting unit is electrically connected to the first signal feeding end a second connection unit electrically connected to the first ground end; and a transmission line electrically connected to the first connection unit and the second connection unit for transmitting the first RF signal and transmitting the first RF signal The connecting unit transmits the first RF signal to the first signal feeding end, and is electrically connected to the first ground end through the second connecting unit.
請參考第1圖,第1圖為本發明實施例一電子裝置MS之示意圖。電子裝置MS包含有天線11、一殼體13、一系統電路板45以及一射頻訊號處理單元40。殼體13可用於任何電子裝置,如手機、平板電腦、全球定位系統(Global Positioning System,GPS)或USB適配器(Dongle)等具有無線通訊功能之電子裝置,殼體13除了用 來包覆電子裝置MS之外,其上同時形成有天線11,用來發射及接收一射頻訊號RF_1,達到無線通訊之功能。其中,天線11可透過一雷射直接成形(Laser Direct Structuring,LDS)等技術形成於殼體13之上,因此殼體13以及天線11之組合也可視為一天線模組AMD。射頻訊號處理單元40設置於系統電路板45之上,用來產生射頻訊號RF_1以及處理天線11收發之射頻訊號RF_1。系統電路板45較佳為一多層結構的印刷電路板(Printed Circuit Board,PCB),其中至少一層可為一接地層,用來作為系統電路板45上其餘電子元件之一參考接地部GND_2。Please refer to FIG. 1 , which is a schematic diagram of an electronic device MS according to an embodiment of the present invention. The electronic device MS includes an antenna 11 , a casing 13 , a system circuit board 45 , and an RF signal processing unit 40 . The housing 13 can be used for any electronic device, such as a mobile phone, a tablet computer, a Global Positioning System (GPS) or a USB adapter (Dongle), and has an electronic device with wireless communication function. In addition to the electronic device MS, an antenna 11 is formed thereon for transmitting and receiving an RF signal RF_1 to achieve wireless communication. The antenna 11 can be formed on the casing 13 through a laser direct structuring (LDS) technology. Therefore, the combination of the casing 13 and the antenna 11 can also be regarded as an antenna module AMD. The RF signal processing unit 40 is disposed on the system circuit board 45 for generating the RF signal RF_1 and processing the RF signal RF_1 transmitted and received by the antenna 11. The system board 45 is preferably a printed circuit board (PCB) of a multi-layer structure, at least one of which may be a ground layer for reference to the ground portion GND_2 as one of the remaining electronic components on the system board 45.
詳細來說,天線11包含有一輻射體110、一訊號饋入端112、一接地端113、一接地部GND、一分支111、連接單元41、42以及一傳輸線44。訊號饋入端112電性連接於輻射體110,用來饋入射頻訊號RF_1至輻射體110,以透過輻射體110發射射頻訊號RF_1至空中。接地部GND電性連接於接地端113,用來提供接地於天線11。分支111電性連接於輻射體110與接地部GND之間,在其他實施例中,天線設計者可依照實際應用需求選擇增加分支或不使用。連接單元41、42分別電性連接於訊號饋入端112以及接地端113。傳輸線44電性連接於連接單元41、42,用來傳遞射頻訊號RF_1,並透過連接單元41將射頻訊號RF_1傳遞至訊號饋入端112,以及透過連接單元42電性連接於接地端113以及接地部GND。連接單元41、42以及傳輸線44係設置系統電路板45之上,其中連接單元41、42較佳為一頂針(Pogo Pin)。另外,系統電路板45可另設置 匹配電路M1於其上,其中匹配電路M1耦接於連接單元41、42之間,以耦接於接地部GND與天線11之間,用來匹配天線11。匹配電路M1可由電容、電感或電阻等電子元件所組成,其中匹配電路M1較佳地設置於靠近連接單元41、42的位置。In detail, the antenna 11 includes a radiator 110, a signal feeding end 112, a grounding end 113, a grounding portion GND, a branch 111, connecting units 41, 42 and a transmission line 44. The signal feeding end 112 is electrically connected to the radiator 110 for feeding the RF signal RF_1 to the radiator 110 to transmit the RF signal RF_1 to the air through the radiator 110. The grounding portion GND is electrically connected to the grounding end 113 for providing grounding to the antenna 11. The branch 111 is electrically connected between the radiator 110 and the ground GND. In other embodiments, the antenna designer may choose to add or not use according to actual application requirements. The connecting units 41 and 42 are electrically connected to the signal feeding end 112 and the grounding end 113, respectively. The transmission line 44 is electrically connected to the connection unit 41, 42 for transmitting the RF signal RF_1, and transmits the RF signal RF_1 to the signal feeding end 112 through the connection unit 41, and is electrically connected to the ground terminal 113 and the ground through the connection unit 42. Part GND. The connection units 41, 42 and the transmission line 44 are disposed above the system circuit board 45, wherein the connection units 41, 42 are preferably a pedestal (Pogo Pin). In addition, the system board 45 can be additionally set The matching circuit M1 is coupled thereto, and the matching circuit M1 is coupled between the connecting units 41 and 42 to be coupled between the grounding portion GND and the antenna 11 for matching the antenna 11. The matching circuit M1 may be composed of electronic components such as capacitors, inductors or resistors, wherein the matching circuit M1 is preferably disposed at a position close to the connection units 41, 42.
如第1圖所示,天線11可視為一雙極天線(Dipole Antenna)或一平面倒F天線(Planar Inverted-F Antenna,PIFA)。具體來說,輻射體110與接地部GND形成雙極天線的架構,而輻射體110另包含分支111,電性連接於輻射體110與接地部GND之間,以形成平面倒F天線之架構。接地部GND及輻射體110可具有一蜿蜒狀或至少一彎折,以在殼體13的有限空間中,延伸接地部GND及輻射體110的長度。除此之外,傳輸線44可用來等效增加輻射體110的電氣長度,使天線11共振出低頻帶所需之頻寬。因此,天線設計者可依照實際應用需求,適度調整輻射體110及接地部GND的長度或彎折的數量,或是調整傳輸線44的長度,以求得最佳天線效能。As shown in FIG. 1, the antenna 11 can be regarded as a dipole antenna or a Planar Inverted-F Antenna (PIFA). Specifically, the radiator 110 and the ground portion GND form a structure of the dipole antenna, and the radiator 110 further includes a branch 111 electrically connected between the radiator 110 and the ground portion GND to form a structure of the planar inverted-F antenna. The grounding portion GND and the radiator 110 may have a meandering shape or at least one bend to extend the grounding portion GND and the length of the radiator 110 in a limited space of the casing 13. In addition, transmission line 44 can be used to equivalently increase the electrical length of radiator 110 to cause antenna 11 to resonate to the desired bandwidth of the low frequency band. Therefore, the antenna designer can appropriately adjust the length or the number of bends of the radiator 110 and the ground portion GND according to actual application requirements, or adjust the length of the transmission line 44 to obtain the optimum antenna performance.
值得注意的是,連接單元42用來電性連接接地端113與射頻訊號處理單元40之接地部GND,使天線11的回返電流由接地部GND經過連接單元42回流至射頻訊號處理單元40。傳輸線44的兩端包含有I-PEX連接器46,透過系統電路板45上的U.FL連接器47相結合以傳遞射頻訊號RF_1。具體來說,請參考第2圖,第2圖為傳輸線44、I-PEX連接器46及U.FL連接器47之詳細結構圖。如第2圖所示,傳輸線44較佳為一具有特定阻抗值的傳輸線,例如阻抗值 50歐姆(ohm)的同軸電纜(coaxial cable)等,其包含有一外導體(編織屏蔽)441以及一內導體(內芯線)442。外導體441電性連接於I-PEX連接器46的接地部(即其外觀之金屬鐵件),內導體442電性連接於I-PEX連接器46的內針腳(Inner pin,未繪於圖中),用來傳遞射頻訊號RF_1。值得注意的是,傳輸線44的外導體441、I-PEX連接器46的接地部以及U.FL連接器47外圍環型的接地部471須電性連接至接地部GND(或連接單元42),使得射頻訊號RF_1的傳遞路線得以參考連續的接地部GND。舉例來說,I-PEX連接器46的接地部以及U.FL連接器47的接地部471可經由多層系統電路板45之一層的走線(Trace,未繪於圖中)與接地部GND(或連接單元42)電性連接,因此射頻訊號RF_1的傳遞路線得以參考連續的接地部GND。如此一來,當I-PEX連接器46與U.FL連接器47相結合時,射頻訊號RF_1可由傳輸線44的內導體442、I-PEX連接器46的內針腳、U.FL連接器47的內針腳472乃至連接單元42傳遞至天線11,並且射頻訊號RF_1的傳遞路線皆是參考相同的接地部GND。在此架構下,當包含有天線11以及殼體13的天線模組AMD與系統電路板45相結合時,天線11即可透過連接單元41及42與系統電路板45中的射頻訊號處理單元40相連結,以達成無線通訊之功能。It should be noted that the connecting unit 42 is electrically connected to the grounding end 113 and the grounding portion GND of the RF signal processing unit 40, so that the return current of the antenna 11 is returned from the grounding portion GND through the connecting unit 42 to the RF signal processing unit 40. Both ends of the transmission line 44 include an I-PEX connector 46 that is coupled through a U.FL connector 47 on the system board 45 to deliver an RF signal RF_1. Specifically, please refer to FIG. 2, which is a detailed structural diagram of the transmission line 44, the I-PEX connector 46, and the U.FL connector 47. As shown in FIG. 2, the transmission line 44 is preferably a transmission line having a specific impedance value, such as an impedance value. A 50 ohm coaxial cable or the like includes an outer conductor (woven shield) 441 and an inner conductor (internal core) 442. The outer conductor 441 is electrically connected to the grounding portion of the I-PEX connector 46 (ie, the metal iron member of the outer appearance), and the inner conductor 442 is electrically connected to the inner pin of the I-PEX connector 46 (inner pin, not shown in the figure). Medium), used to transmit RF signal RF_1. It should be noted that the outer conductor 441 of the transmission line 44, the grounding portion of the I-PEX connector 46, and the grounding portion 471 of the peripheral ring type of the U.FL connector 47 must be electrically connected to the ground portion GND (or the connecting unit 42). The transmission path of the RF signal RF_1 is made to refer to the continuous ground GND. For example, the ground portion of the I-PEX connector 46 and the ground portion 471 of the U.FL connector 47 can be routed through one of the layers of the multi-layer system circuit board 45 (Trace, not shown) and the ground GND ( Or the connection unit 42) is electrically connected, so the transmission path of the RF signal RF_1 can be referred to the continuous ground GND. In this way, when the I-PEX connector 46 is combined with the U.FL connector 47, the RF signal RF_1 can be made by the inner conductor 442 of the transmission line 44, the inner pin of the I-PEX connector 46, and the U.FL connector 47. The inner pin 472 or the connecting unit 42 is transmitted to the antenna 11, and the transmission path of the radio frequency signal RF_1 is referred to the same ground portion GND. In this architecture, when the antenna module AMD including the antenna 11 and the casing 13 is combined with the system circuit board 45, the antenna 11 can pass through the connection units 41 and 42 and the radio frequency signal processing unit 40 in the system circuit board 45. Connected to achieve the function of wireless communication.
請參考第3圖,第3圖為本發明實施例另一電子裝置MS_3之示意圖。相較於電子裝置MS,電子裝置MS_3另包含有一天線32,因此電子裝置MS_3可利用兩個以上的天線同時發射及接收行動電 波,用來執行多輸入多輸出(Multiple Input Multiple Output,MIMO)技術,以提升電子裝置MS_3的資料吞吐量(Throughput)。電子裝置MS_3包含有天線11、32、殼體13、系統電路板45以及射頻訊號處理單元40,其中天線11、32以及殼體13也可視為一天線模組AMD_3。天線32用來發射及接收一射頻訊號RF_2,其中天線32也可透過一雷射直接成形等技術形成於殼體13之上。射頻訊號處理單元40用來產生另一射頻訊號RF_2以及處理天線32收發之射頻訊號RF_2。Please refer to FIG. 3, which is a schematic diagram of another electronic device MS_3 according to an embodiment of the present invention. Compared with the electronic device MS, the electronic device MS_3 further includes an antenna 32, so the electronic device MS_3 can simultaneously transmit and receive mobile power by using more than two antennas. The wave is used to perform Multiple Input Multiple Output (MIMO) technology to improve the data throughput (Throughput) of the electronic device MS_3. The electronic device MS_3 includes an antenna 11, 32, a housing 13, a system circuit board 45, and an RF signal processing unit 40. The antennas 11, 32 and the housing 13 can also be regarded as an antenna module AMD_3. The antenna 32 is configured to transmit and receive an RF signal RF_2, wherein the antenna 32 can also be formed on the housing 13 by a laser direct forming technique. The RF signal processing unit 40 is configured to generate another RF signal RF_2 and process the RF signal RF_2 transmitted and received by the antenna 32.
詳細來說,天線32包含有一輻射體320、一訊號饋入端322以及連接單元43,其中系統電路板45的接地部GND_2可另用來作為天線32的接地部。訊號饋入端322電性連接於輻射體320,用來饋入射頻訊號RF_2至輻射體320,以透過輻射體320發射射頻訊號RF_2至空中。連接單元43設置系統電路板45之上,用來電性連接訊號饋入端322,以傳遞射頻訊號RF_2至訊號饋入端322,其中連接單元43較佳為一頂針。另外,系統電路板45可另設置一匹配電路M2於其上,其中匹配電路M2耦接於接地部GND_2與連接單元43之間,用來匹配天線32。匹配電路M2可由電容、電感或電阻等電子元件所組成,匹配電路M2較佳地設置於靠近連接單元43的位置。In detail, the antenna 32 includes a radiator 320, a signal feeding end 322, and a connecting unit 43. The grounding portion GND_2 of the system circuit board 45 can be used as a grounding portion of the antenna 32. The signal feeding end 322 is electrically connected to the radiator 320 for feeding the RF signal RF_2 to the radiator 320 to transmit the RF signal RF_2 to the air through the radiator 320. The connecting unit 43 is disposed on the system circuit board 45 for electrically connecting the signal feeding end 322 to transmit the RF signal RF_2 to the signal feeding end 322. The connecting unit 43 is preferably a thimble. In addition, the system circuit board 45 can be further provided with a matching circuit M2, wherein the matching circuit M2 is coupled between the grounding portion GND_2 and the connecting unit 43 for matching the antenna 32. The matching circuit M2 may be composed of electronic components such as a capacitor, an inductor or a resistor, and the matching circuit M2 is preferably disposed at a position close to the connecting unit 43.
如第3圖所示,天線32的輻射體320與接地部GND_2形成一雙極天線的架構。輻射體320可具有一蜿蜒狀或至少一彎折,以在 殼體13的有限空間中,延伸輻射體320的長度,以調整天線32的輻射頻率。因此,天線設計者可依照實際應用需求,適度調整輻射體320的長度或彎折的數量,以求得最佳天線效能。As shown in FIG. 3, the radiator 320 of the antenna 32 and the ground portion GND_2 form a structure of a dipole antenna. The radiator 320 may have a meandering shape or at least one bend to In the limited space of the housing 13, the length of the radiator 320 is extended to adjust the radiation frequency of the antenna 32. Therefore, the antenna designer can appropriately adjust the length of the radiator 320 or the number of bends according to actual application requirements to obtain the best antenna performance.
在此架構下,當包含有天線11、32以及殼體13的天線模組AMD_3與系統電路板45相結合時,天線11、32即可透過連接單元41、42及43與系統電路板45中的射頻訊號處理單元40相連結,以達成無線通訊之功能。值得注意的是,天線11的接地部GND與天線32的接地部GND_2彼此絕緣,如此可使天線11、32具有較佳的隔離度(Isolation)。舉例來說,在小型電子裝置中,天線與天線之間往往距離很近,若天線11、32共用相同的接地部,如系統電路板的接地部GND_2,使得天線11、32的鏡像電流(Image Current)或是回返電流(Return Current)流通至相同的接地部GND_2,導致天線11、32間的隔離度不佳。不佳的隔離度表示天線11輻射的射頻訊號RF_1有大部分的能量會被天線32所接收;反之亦然,天線32輻射的射頻訊號RF_2有大部分的能量會被天線11所接收。因此,縱使天線11、32具有良好的匹配,但不佳的隔離度卻等效弱化天線11、32的發射效能。Under this architecture, when the antenna module AMD_3 including the antennas 11, 32 and the casing 13 is combined with the system circuit board 45, the antennas 11, 32 can pass through the connection units 41, 42 and 43 and the system circuit board 45. The RF signal processing unit 40 is coupled to achieve the function of wireless communication. It is to be noted that the ground portion GND of the antenna 11 and the ground portion GND_2 of the antenna 32 are insulated from each other, so that the antennas 11, 32 can have better isolation. For example, in a small electronic device, the distance between the antenna and the antenna is often very close. If the antennas 11 and 32 share the same grounding portion, such as the grounding portion GND_2 of the system board, the mirror currents of the antennas 11 and 32 (Image) Current) or the return current flows to the same ground portion GND_2, resulting in poor isolation between the antennas 11, 32. The poor isolation means that most of the energy of the RF signal RF_1 radiated by the antenna 11 is received by the antenna 32; vice versa, most of the energy of the RF signal RF_2 radiated by the antenna 32 is received by the antenna 11. Therefore, even if the antennas 11, 32 have a good match, the poor isolation is equivalent to weakening the emission performance of the antennas 11, 32.
請參考第4圖,第4圖繪示了天線11、32的電壓駐波比以及隔離度。其中天線11的電壓駐波比以虛線表示,天線32的電壓駐波比以實線表示,隔離度以點線表示。由於天線11、32的接地部GND、GND_2相互絕緣,使得天線11、32具有較佳的隔離度。如第4圖 所示,天線11、32在頻率867MHz的電壓駐波比約為1.4,但是彼此間的隔離度僅有-8.34dB。相當於射頻訊號RF_1饋入天線11以輻射至空中時,射頻訊號RF_1僅有-8.34dB(或14%)的能量被天線32所接收;反之,當射頻訊號RF_2饋入天線32以輻射至空中時,射頻訊號RF_2僅有14%的能量會被天線11所接收。不共用接地部的天線11、32可維持良好的匹配,且具有較佳的隔離度,以在有限空間中,使天線11、32的發射效能不致受太大的影響。Please refer to FIG. 4, which shows the voltage standing wave ratio and isolation of the antennas 11, 32. The voltage standing wave ratio of the antenna 11 is indicated by a broken line, the voltage standing wave ratio of the antenna 32 is indicated by a solid line, and the isolation is represented by a dotted line. Since the ground portions GND and GND_2 of the antennas 11, 32 are insulated from each other, the antennas 11, 32 have better isolation. As shown in Figure 4 As shown, the antennas 11, 32 have a voltage standing wave ratio of about 1.4 at a frequency of 867 MHz, but the isolation between them is only -8.34 dB. When the RF signal RF_1 is fed into the antenna 11 to radiate into the air, the RF signal RF_1 has only -8.34dB (or 14%) of the energy received by the antenna 32; conversely, when the RF signal RF_2 is fed into the antenna 32 to radiate into the air. At the time, only 14% of the energy of the RF signal RF_2 is received by the antenna 11. The antennas 11, 32 that do not share the ground portion can maintain good matching and have better isolation so that the transmission performance of the antennas 11, 32 is not greatly affected in a limited space.
綜上所述,隨著電子裝置體積以及天線空間縮小之趨勢,本發明係有效地利用電子裝置內部的空間配置,將天線的輻射體以及接地部形成於殼體之上,並在系統電路板上增加傳輸線,以共振出天線低頻的輻射頻段,將天線整合入電子裝置之中。除此之外,本發明亦將多個天線以及殼體整合為一天線模組,增加電子裝置內部空間的利用率,並利用天線不共用接地部之設計,使天線的回返電流各自流通於相異的接地部,改善天線與天線之間的隔離度,以在有限空間中,使天線的發射效能不致受太大的影響。In summary, with the trend of the volume of the electronic device and the shrinking of the antenna space, the present invention effectively utilizes the spatial configuration inside the electronic device to form the radiator and the ground portion of the antenna on the housing, and on the system circuit board. The transmission line is added to resonate the radiated frequency band of the antenna at a low frequency, and the antenna is integrated into the electronic device. In addition, the present invention also integrates multiple antennas and a casing into an antenna module, increases the utilization of the internal space of the electronic device, and uses the design of the antenna not sharing the grounding portion, so that the return currents of the antennas are respectively circulated in the phase. Different grounding parts improve the isolation between the antenna and the antenna, so that the transmitting performance of the antenna is not greatly affected in a limited space.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
MS、MS_3‧‧‧電子裝置MS, MS_3‧‧‧ electronic device
AMD、AMD_3‧‧‧天線模組AMD, AMD_3‧‧‧ antenna module
11、32‧‧‧天線11, 32‧‧‧ antenna
13‧‧‧殼體13‧‧‧Shell
110、320‧‧‧輻射體110, 320‧‧‧ radiator
112、322‧‧‧訊號饋入端112, 322‧‧‧ signal feed end
RF_1、RF_2‧‧‧射頻訊號RF_1, RF_2‧‧‧ RF signals
GND、GND_2、471‧‧‧接地部GND, GND_2, 471‧‧‧ Grounding
111‧‧‧分支111‧‧‧ branch
113‧‧‧接地端113‧‧‧ Grounding terminal
40‧‧‧射頻訊號處理單元40‧‧‧RF signal processing unit
41、42、43‧‧‧連接單元41, 42, 43‧‧‧ Connection unit
44‧‧‧傳輸線44‧‧‧ transmission line
45‧‧‧系統電路板45‧‧‧System Board
46‧‧‧I-PEX連接器46‧‧‧I-PEX connector
47‧‧‧U.FL連接器47‧‧‧U.FL connector
441‧‧‧外導體441‧‧‧Outer conductor
442‧‧‧內導體442‧‧‧ inner conductor
472‧‧‧內針腳472‧‧‧insert
M1、M2‧‧‧匹配電路M1, M2‧‧‧ matching circuit
第1圖為本發明實施例一電子裝置之示意圖。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.
第2圖為第1圖之傳輸線、I-PEX連接器及U.FL連接器之詳細 結構圖。Figure 2 shows the details of the transmission line, I-PEX connector and U.FL connector of Figure 1. Structure diagram.
第3圖為本發明實施例另一電子裝置之示意圖。FIG. 3 is a schematic diagram of another electronic device according to an embodiment of the present invention.
第4圖為第3圖之天線的電壓駐波比以及其隔離度之示意圖。Figure 4 is a schematic diagram of the voltage standing wave ratio of the antenna of Figure 3 and its isolation.
MS‧‧‧電子裝置MS‧‧‧Electronic device
AMD‧‧‧天線模組AMD‧‧‧Antenna Module
11‧‧‧天線11‧‧‧Antenna
13‧‧‧殼體13‧‧‧Shell
40‧‧‧射頻訊號處理單元40‧‧‧RF signal processing unit
41、42‧‧‧連接單元41, 42‧‧‧ Connection unit
44‧‧‧傳輸線44‧‧‧ transmission line
45‧‧‧系統電路板45‧‧‧System Board
46‧‧‧I-PEX連接器46‧‧‧I-PEX connector
47‧‧‧U.FL連接器47‧‧‧U.FL connector
110‧‧‧輻射體110‧‧‧ radiator
111‧‧‧分支111‧‧‧ branch
112‧‧‧訊號饋入端112‧‧‧ Signal Feeder
113‧‧‧接地端113‧‧‧ Grounding terminal
RF_1‧‧‧射頻訊號RF_1‧‧‧RF signal
GND、GND_2‧‧‧接地部GND, GND_2‧‧‧ Grounding
M1‧‧‧匹配電路M1‧‧‧ matching circuit
Claims (18)
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TW101118150A TWI497818B (en) | 2012-05-22 | 2012-05-22 | Antenna and electronic device |
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TW101118150A TWI497818B (en) | 2012-05-22 | 2012-05-22 | Antenna and electronic device |
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TW201349658A TW201349658A (en) | 2013-12-01 |
TWI497818B true TWI497818B (en) | 2015-08-21 |
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TWI618296B (en) * | 2017-03-15 | 2018-03-11 | 智易科技股份有限公司 | Antenna structure |
Citations (3)
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TWI291783B (en) * | 2006-01-20 | 2007-12-21 | Aiptek Int Inc | Antenna device having coupled feeding unit |
US20080055160A1 (en) * | 2006-08-29 | 2008-03-06 | Samsung Electronics Co., Ltd. | Dual-band inverted F antenna reducing SAR |
CN101853977A (en) * | 2009-04-03 | 2010-10-06 | 宏达国际电子股份有限公司 | Mobile device |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI291783B (en) * | 2006-01-20 | 2007-12-21 | Aiptek Int Inc | Antenna device having coupled feeding unit |
US20080055160A1 (en) * | 2006-08-29 | 2008-03-06 | Samsung Electronics Co., Ltd. | Dual-band inverted F antenna reducing SAR |
CN101853977A (en) * | 2009-04-03 | 2010-10-06 | 宏达国际电子股份有限公司 | Mobile device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI618296B (en) * | 2017-03-15 | 2018-03-11 | 智易科技股份有限公司 | Antenna structure |
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