TWI753595B - Communication module and wearable device having the same - Google Patents
Communication module and wearable device having the same Download PDFInfo
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- TWI753595B TWI753595B TW109134379A TW109134379A TWI753595B TW I753595 B TWI753595 B TW I753595B TW 109134379 A TW109134379 A TW 109134379A TW 109134379 A TW109134379 A TW 109134379A TW I753595 B TWI753595 B TW I753595B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
Description
本發明是有關於一種通訊模組,且特別是有關於一種應用於穿戴式裝置之領域的通訊模組。 The present invention relates to a communication module, and more particularly, to a communication module applied in the field of wearable devices.
就現有的穿戴式裝置而言,皆知其內所含的天線所需的尺寸與操作頻率呈負相關,故在有限的空間中如何設計多支天線架構以滿足低頻帶與高頻帶等不同的通訊頻段之產品需求,係為業界所面臨的挑戰。對此,亟需提出一種新的通訊模組具有其之穿戴式裝置。 As far as the existing wearable devices are concerned, it is known that the required size of the antenna contained in it is negatively related to the operating frequency, so how to design multiple antenna structures in a limited space to meet different low-frequency and high-frequency bands. The demand for products in the communication frequency band is a challenge faced by the industry. Therefore, there is an urgent need to propose a wearable device with a new communication module.
根據本發明的第一方面,提出一種通訊模組,包括一主板、至少一第一通訊電路、至少一輻射元件、至少一第二通訊電路、一射頻元件以及一導體元件。第一通訊電路耦接主板,且第一通訊電路用以產生一第一頻帶訊號。輻射元件耦接第一通訊電路。第二通訊電路用以產生一第二頻帶訊號,其中第一頻帶訊號的操作頻率低於第二頻帶訊號的操作頻率。射頻元件耦接主板和第二通訊電路。導體元件耦接射頻元件並透過射頻元件耦接 第二通訊電路以作為第二通訊電路的一輻射體,其中主板透過射頻元件耦接導體元件。 According to a first aspect of the present invention, a communication module is provided, which includes a main board, at least one first communication circuit, at least one radiation element, at least one second communication circuit, a radio frequency element and a conductor element. The first communication circuit is coupled to the main board, and the first communication circuit is used for generating a first frequency band signal. The radiation element is coupled to the first communication circuit. The second communication circuit is used for generating a second frequency band signal, wherein the operation frequency of the first frequency band signal is lower than the operation frequency of the second frequency band signal. The radio frequency element is coupled to the main board and the second communication circuit. The conductor element is coupled to the radio frequency element and is coupled through the radio frequency element The second communication circuit is used as a radiator of the second communication circuit, wherein the main board is coupled to the conductor element through the radio frequency element.
根據本發明的第二方面,提出一種具有如本發明的第一方面所述之通訊模組的穿戴式裝置,包括一主體部分以及一穿戴部分。穿戴部分耦接主體部分。前述主板、輻射元件、第一通訊電路、第二通訊電路及射頻元件設置於主體部分中。前述導體元件設置於穿戴部分中。 According to a second aspect of the present invention, a wearable device having the communication module according to the first aspect of the present invention is provided, comprising a main body part and a wearable part. The wearing portion is coupled to the body portion. The main board, the radiation element, the first communication circuit, the second communication circuit and the radio frequency element are arranged in the main body part. The aforementioned conductor element is provided in the wearing portion.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given and described in detail in conjunction with the accompanying drawings as follows:
100,100’:通訊模組 100,100’: Communication module
110:主板 110: Motherboard
120:輻射元件 120: Radiating element
130:第一通訊電路 130: The first communication circuit
140:第二通訊電路 140: Second communication circuit
150:射頻元件 150: RF Components
160:導體元件 160: Conductor element
170:可變元件 170: Variable element
200:穿戴式裝置 200: Wearables
210:主體部分 210: Main body part
211:金屬殼體 211: Metal shell
212:金屬構件 212: Metal Components
213:塑料殼體 213: Plastic housing
220:穿戴部分 220: Wear part
C:共用端 C: Common terminal
D:間距 D: Spacing
R1,R2:端 R1, R2: terminal
S1:第一部分
S1:
S2:第二部分 S2: Part II
S3:第三部分 S3: Part Three
P1,P2:傳輸路徑 P1,P2: Transmission path
第1圖繪示根據本發明實施例的通訊模組之立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a communication module according to an embodiment of the present invention.
第2圖繪示根據本發明實施例的通訊模組之配置方塊圖。 FIG. 2 is a block diagram illustrating a configuration of a communication module according to an embodiment of the present invention.
第3圖繪示根據本發明實施例的通訊模組所含的一元件之示意圖。 FIG. 3 is a schematic diagram of an element included in a communication module according to an embodiment of the present invention.
第4A~4C圖繪示根據本發明實施例的通訊模組所含的一元件的不同形狀態樣之示意圖。 FIGS. 4A to 4C are schematic diagrams illustrating different shapes and states of an element included in a communication module according to an embodiment of the present invention.
第5圖繪示根據本發明另一實施例的通訊模組之配置方塊圖。 FIG. 5 is a block diagram illustrating a configuration of a communication module according to another embodiment of the present invention.
第6圖繪示根據本發明實施例的通訊模組所應用於的裝置的一實施態樣之立體示意圖。 FIG. 6 is a three-dimensional schematic diagram of an implementation of a device to which the communication module according to the embodiment of the present invention is applied.
第7圖繪示根據本發明實施例的通訊模組所應用於的裝置的另一實施態樣之立體示意圖。 FIG. 7 is a three-dimensional schematic diagram of another implementation of the device to which the communication module according to the embodiment of the present invention is applied.
以下結合附圖和具體實施方式對本發明進行詳細描述,但不作為對本發明的限定。然而,應瞭解到此些實務上的細節不應用以限制本發明。亦即,在本發明部分實施方式中,此些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。並且,除非有其他表示,在不同圖式中相同之元件符號可視為相對應的元件。此些圖式之繪示是為了清楚表達此些實施方式中各元件之間的耦接關係,並非繪示各元件的實際尺寸。另外,「耦接」用語在此包含任何直接及間接的耦接手段。因此,若本文中描述一元件耦接於另一元件,則代表一元件可通過電性耦接、接地耦接或訊號傳輸耦接等方式而直接地耦接於另一元件,或者透過其他元件或耦接手段間接地電性、接地或訊號傳輸耦接至另一元件。 The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. It should be understood, however, that such practical details should not be used to limit the invention. That is, in some embodiments of the invention, such practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. Also, the same reference numerals in different drawings may be regarded as corresponding elements unless otherwise indicated. The drawings in the drawings are for the purpose of clearly expressing the coupling relationship between the various elements in these embodiments, and do not depict the actual size of the various elements. Additionally, the term "coupled" herein includes any means of coupling, both direct and indirect. Therefore, if an element is described as being coupled to another element herein, it means that an element can be directly coupled to another element through electrical coupling, ground coupling, or signal transmission coupling, or through other elements. Or the coupling means is indirectly electrically, grounded, or signal-transmitting coupled to another element.
請參照第1~2圖,第1圖繪示根據本發明實施例的通訊模組100的立體示意圖,第2圖繪示根據本發明實施例的通訊模組100之配置方塊圖。如第1圖所示,通訊模組100包括一主板110、至少一輻射元件120、至少一第一通訊電路130、至少一第二通訊電路140、一射頻元件150以及一導體元件160。詳細而言,主板110可以是一印刷電路板(Printed Circuit Board,PCB),其上可包括與其耦接的電子元件,如用於無線通訊所需的IC電路、儲存元件及處理元件等。輻射元件120可以是一較低頻帶的無線通訊天線,即一低頻天線,例如是用於LTE(Long Term Evolution)、WCDMA(Wideband
CDMA)、或GPS(Global Position System)的天線元件,具體地可選用PIFA(Planar inverted-F antenna)天線、Loop天線、Monopole天線、Slot天線或其他任意形式的天線元件。輻射元件120耦接第一通訊電路130。具體而言,第一通訊電路130以直接饋入或耦合饋入的方式與輻射元件120耦接。
Please refer to FIGS. 1-2. FIG. 1 is a three-dimensional schematic diagram of the
第一通訊電路130耦接主板110,第一通訊電路130用以產生一第一頻帶訊號。具體而言,第一通訊電路130接地連接至主板110。由此,主板110可作為通訊模組100的系統接地面。詳細而言,第一通訊電路130係為一操作在較低頻帶的無線通訊系統之電路,例如是操作在1.7GHz以下的無線行動通訊系統的低頻帶之電路,如LTE或WCDMA電路,或是例如是操作在1.7GHz以下的GPS系統之電路。第二通訊電路140用以發射一第二頻帶訊號,詳細而言,第二通訊電路140係為一操作在較高頻帶的無線通訊系統之電路,例如是操作在1.7GHz以上的無線行動通訊系統的中高頻帶或是無線區域網路系統之電路,如Wi-Fi、BT(Bluetooth)或BLE(Bluetooth Low Energy)電路。也就是說,第一頻帶訊號的操作頻率係設置成低於第二頻帶訊號的操作頻率。
The
如第1~2圖所示,射頻元件150耦接主板110和第二通訊電路140。此外,導體元件160耦接射頻元件150並透過射頻元件150耦接第二通訊電路140以作為第二通訊電路140的一輻射體。並且,主板110透過射頻元件150耦接導體元件160。由此,
對於操作在較高頻帶的無線通訊系統之高頻路徑,藉由導體元件160透過射頻元件150耦接第二通訊電路140,導體元件160可作為如第二通訊電路140之高頻天線架構所需的輻射體。同時,對於操作在較低頻帶的無線通訊系統之低頻路徑,藉由主板110透過射頻元件150耦接導體元件160,導體元件160也能同時作為如第一通訊電路130之低頻帶的輻射元件120的一延伸接地面,從而增加如第一通訊電路130之低頻天線架構的整體尺寸來提升天線的效能。
As shown in FIGS. 1 to 2 , the
詳細而言,射頻元件150可以是一三埠的電路元件,例如是一晶片或是由電感電容之一組合所組成,射頻元件150可具有分離不同頻帶的功能。在一實施例中,當訊號方向為順向傳輸時(即,自導體元件160朝向主板110),射頻元件150用於將較低頻的第一頻帶訊號和較高頻的第二頻帶訊號分離;而當訊號方向為反向傳輸時(即,自主板110朝向導體元件160),射頻元件150用於將較低頻的第一頻帶訊號和較高頻的第二頻帶訊號混合。由此,當操作在一較低操作頻率時,主板110(即,系統接地面)透過射頻元件150之設置可等效於僅和導體元件160耦接,而能夠忽略如較高頻無線通訊系統之第二通訊電路140的存在。並且,當操作在一較高操作頻率時,較高頻無線通訊系統之第二通訊電路140透過射頻元件150之設置可等效於僅和導體元件160所耦接,而能夠將主板110(即,系統接地面)和射頻元件150之間的耦接視為斷路。
Specifically, the
也就是說,當通訊模組100操作於一較低操作頻率時,訊號的傳輸僅會經由第一頻帶訊號的低頻的傳輸路徑P1,而當通訊模組100操作於一較高操作頻率時,訊號的傳輸僅會經由第二頻帶訊號的高頻的傳輸路徑P2,從而達到同一個導體元件160由二個不同頻帶的通訊電路所利用之效果,使得較低頻帶的無線通訊系統(如第一通訊電路130)和較高頻帶的無線通訊系統(如第二通訊電路140)可各自具有獨立的天線架構。
That is to say, when the
請參照第3圖,第3圖繪示根據本發明實施例的通訊模組100的射頻元件150之示意圖。如第3圖所示射頻元件150為一三埠電路元件,一端R1可作為用於低頻輸入/輸出的第一埠,與主板110耦接;另一端R2可作為用於高頻輸入/輸出的第二埠,與較高頻的第二通訊電路140耦接;還可包括一共用端C作為共用埠,與導體元件160耦接。在一實施例中,此二端R1、R2的訊號隔離度較佳設計成至少大於15dB,從而可避免二端R1、R2彼此訊號互相干擾。
Please refer to FIG. 3 , which is a schematic diagram of the
請參照第4A~4C圖,第4A~4C圖繪示根據本發明實施例的通訊模組100的導體元件160的不同形狀態樣之示意圖。在一實施例中,導體元件160的形狀可大致成如第4A圖所示的C形結構,其具有長度不同的第一部分S1及第二部分S2,其中第一部分S1的長度大於第二部分S2的長度,較長的第一部分S1可供低頻帶的無線通訊系統之輻射元件120作為延伸接地面之使用,以提供較長的共振長度,從而提供較佳的低頻效能。較短的第二部分S2可供高頻帶的無線通訊系統之第二通訊電路140作為輻射體之使
用,由於天線之輻射體的尺寸與操作頻率成負相關,故第二部分S2的長度越短,可支援的無線電通訊頻率越高。在一實施例中,就以高頻帶的無線通訊系統是BLE系統(無線電頻率約為2.4GHz)為例來說,第二部分S2的長度係設計約為該第二頻帶訊號的操作頻率之1/4波長。一般而言,由於介質因素的影響,第二部分S2的長度可能會小於該第二頻帶訊號的操作頻率之1/4波長。
Please refer to FIGS. 4A to 4C. FIGS. 4A to 4C are schematic diagrams illustrating different shapes and states of the
在一實施例中,導體元件160的形狀亦可大致成如第4B圖所示的E形結構,其具有長度不同的第一部分S1、第二部分S2及第三部分S3,其中第一部分S1的長度大於第二部分S2的長度大於第三部分S3的長度,同如第4A圖所述,最長的第一部分S1係供低頻帶的無線通訊系統之輻射元件120作為延伸接地面之使用。較第一部分S1短的第二部分S2和第三部分S3則可供高頻帶的無線通訊系統之第二通訊電路140作為輻射體之使用,而導體元件160之第4B圖的態樣可透過二個較短的第二部分S2及第三部分S3來支援不同的高頻帶無線電通訊頻率。舉例來說,基於天線之輻射體的尺寸與操作頻率成負相關之原理,次長的第二部分S2可用於支援2.4GHz的BLE頻帶,而最短的第三部分S3可用於支援5GHz的Wi-Fi頻帶。
In one embodiment, the shape of the
在一實施例中,導體元件160的形狀亦可大致成如第4C圖所示的不規則的彎折結構,而不限於如第4A圖或第4B圖所示之直線條狀的平行分隔結構。導體元件160的長度或形狀之設計
係與製造端的欲支援頻帶之需求相關,導體元件160的形狀亦可呈如一U形或一J形等形狀,本發明並不限制於此。
In one embodiment, the shape of the
請參照第5圖,第5圖繪示根據本發明另一實施例的通訊模組100’的之示意方塊圖,其中通訊模組100’的大多元件之設計及運作和特點同於前述的通訊模組100,其中差異僅在於通訊模組100’可更包括一可變元件170,可變元件170耦接主板110和射頻元件150,且可變元件170可用以調整較低頻的第一頻帶天線之輻射元件120的共振頻率。詳細而言,係透過來自第一通訊電路130的一控制訊號來控制可變元件170的狀態。在一實施例中,調整低頻帶的天線共振頻率的範圍約為±100MHz之間。此外,詳細而言,可變元件170可以是一可變電感元件或一可變電容元件,若採用可變電感元件,其可變電感範圍可實施於0~40nH之間,較佳為5nH;而若採用可變電容元件,可變電容範圍可實施於0~40pF之間。在另一實施方式中,可變元件170之配置亦可選以由一射頻開關搭配數個電感元件或一(壓控)電容元件來等效實施,或是使用一天線調諧器(antenna tuner)來等效實施。透過增設可變元件170來控制低頻天線的共振頻率,可達到頻率可調整之有益效果,從而增加天線架構可操作的頻寬。
Please refer to FIG. 5. FIG. 5 shows a schematic block diagram of a communication module 100' according to another embodiment of the present invention, wherein the design, operation and characteristics of most components of the communication module 100' are the same as the above-mentioned communication In the
此外,在第一通訊電路130的其他實施方式中,第一通訊電路130的數量亦可採為複數個,各別支援不同的操作在較低的無線電通訊頻率(如700MHz的LTE、1.5GHz的GPS),且輻射元件120的數量亦可採為複數個。並且,對於多個第一通訊電路130和多個輻射元件120之實施態樣,此些輻射元件120係可各自獨立並耦接至對應的每一
第一通訊電路130,或者,此些輻射元件係可統整合為一天線架構並耦接至此些第一通訊電路130。並且,在第二通訊電路140的其他實施方式中,第二通訊電路140的數量亦可採為複數個,各別支援不同的操作在較高的無線電通訊頻率(如2.4GHz及5GHz),導體元件160透過射頻元件150分別耦接此些第二通訊電路140。此些第二通訊電路140可利用同一導體元件160作為天線架構的輻射體而整合為一天線架構。
In addition, in other implementations of the
綜上,本發明該等實施例之通訊模組包括透過射頻元件耦接至主板(即,系統接地面)和第二通訊電路的導體元件,其中導體元件可作為如第二通訊電路之高頻天線架構所需的輻射體,以支援較高頻率的通訊要求;同時,導體元件也能作為如第一通訊電路之低頻帶的天線架構的一延伸接地面,以增加低頻天線架構的整體尺寸來改善天線的低頻效能。由此,本發明該等實施例之通訊模組能夠使同一導體元件由複數個不同頻帶的通訊電路所利用,藉以最大化通訊模組的空間使用,亦能滿足不同頻段的通訊要求。 To sum up, the communication modules of the embodiments of the present invention include conductor elements coupled to the main board (ie, the system ground plane) and the second communication circuit through radio frequency elements, wherein the conductor elements can serve as the high frequency of the second communication circuit. The radiator required by the antenna structure supports higher frequency communication requirements; at the same time, the conductor element can also be used as an extended ground plane for the low frequency antenna structure such as the first communication circuit to increase the overall size of the low frequency antenna structure. Improve the low frequency performance of the antenna. Therefore, the communication modules of the embodiments of the present invention can enable the same conductor element to be used by a plurality of communication circuits of different frequency bands, thereby maximizing the space utilization of the communication module and meeting the communication requirements of different frequency bands.
就通訊模組的應用端而言,請參照第2、5圖所示,本文所述的通訊模組100/100’可設置於一穿戴式裝置200中,以作為一穿戴式裝置(例如是智慧型手錶)的應用產品。穿戴式裝置200包括一主體部分210以及一穿戴部分220,穿戴部分220耦接主體部分210。如本文所述之主板110、輻射元件120、第一通訊電路130、第二通訊電路140、射頻元件150和/或可變元件170設置於主體部分210中,而導體元件160設置於穿戴部分220中。
As for the application side of the communication module, please refer to Figures 2 and 5. The
請參照第6圖,第6圖繪示穿戴式裝置200的一實施態樣的立體示意圖。如第6圖所示,在穿戴式裝置200的此實施態樣中,主體部分210可係由一金屬材料所製成,包括一金屬構件211和一金屬殼體212(頂部露出以示出通訊模組100/100’),導體元件160透過金屬構件211耦接射頻元件150(為清楚表示導體元件160而省略繪示穿戴部分220)。金屬構件211與金屬殼體212之間具有一間距D,即金屬構件211與金屬殼體212無直接相連以實現電性絕緣。在一實施例中,間距D係可設計成至少大於0.2mm。
Please refer to FIG. 6 , which is a three-dimensional schematic diagram of an embodiment of the
請參照第7圖,第7圖繪示穿戴式裝置200的另一實施態樣的立體示意圖。如第7圖所示,在穿戴式裝置200的此實施態樣中,主體部分210可係由一金屬材料和一塑膠材料所製成,包括一金屬構件211和一塑料殼體213(頂部露出以示出通訊模組100/100’),導體元件160透過金屬構件211耦接射頻元件150(為清楚表示導體元件160而省略繪示穿戴部分220)。在本實施態樣中,金屬構件211與塑料殼體213之間不必設計具有間距而可直接相連,即可實現電性絕緣。
Please refer to FIG. 7 , which is a schematic three-dimensional view of another embodiment of the
就應用本發明實施例的通訊模組的穿戴式裝置之產品效果而言,根據穿戴式裝置進行單體之一實驗模擬測試,設置有導體元件的穿戴式裝置相較於無設置導體元件的穿戴式裝置,透過導體元件作為低頻帶天線的延伸接地面,能達到天線效率約7.5%而改善低頻帶(以LTE通訊為準)效率約3dB;且透過導體元件同時作為高頻帶的輻射體,能達到高頻帶(以BLE通訊為準)天線效率為20%。此外,根 據穿戴式裝置進行配戴於人體之另一實驗模擬測試,考量到人體加手的效應,設置有導體元件的穿戴式裝置相較於無設置導體元件的穿戴式裝置,透過導體元件作為低頻帶天線的延伸接地面,能達到天線效率約6.3%而改善低頻帶(以LTE通訊為準)效率約2dB;且透過導體元件同時作為高頻帶天線的輻射體,能達到高頻帶(以BLE通訊為準)天線效率為6%,亦符合常用的使用需求。 As far as the product effect of the wearable device using the communication module of the embodiment of the present invention is concerned, according to the wearable device to conduct an experimental simulation test of a single unit, the wearable device with the conductor element is compared with the wearable device without the conductor element. It can achieve an antenna efficiency of about 7.5% and improve the efficiency of the low-frequency band (based on LTE communication) by about 3dB through the conductor element as the extended ground plane of the low-band antenna. Achieving high frequency band (based on BLE communication), the antenna efficiency is 20%. Furthermore, the root According to another experimental simulation test in which the wearable device is worn on the human body, considering the effect of adding a hand to the human body, the wearable device with the conductor element is compared with the wearable device without the conductor element, and the conductor element is used as a low frequency band. The extended ground plane of the antenna can achieve an antenna efficiency of about 6.3% and improve the efficiency of the low-frequency band (based on LTE communication) by about 2dB; and through the conductor element at the same time as the radiator of the high-band antenna, it can reach the high-frequency band (based on BLE communication as the radiator). Standard) The antenna efficiency is 6%, which is also in line with common usage requirements.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.
100:通訊模組 100: Communication module
110:主板 110: Motherboard
120:輻射元件 120: Radiating element
130:第一通訊電路 130: The first communication circuit
140:第二通訊電路 140: Second communication circuit
150:射頻元件 150: RF Components
160:導體元件 160: Conductor element
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