WO2020020380A1 - 有源植入式医疗仪器自动遍历测试的方法和设备 - Google Patents

有源植入式医疗仪器自动遍历测试的方法和设备 Download PDF

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Publication number
WO2020020380A1
WO2020020380A1 PCT/CN2019/100405 CN2019100405W WO2020020380A1 WO 2020020380 A1 WO2020020380 A1 WO 2020020380A1 CN 2019100405 W CN2019100405 W CN 2019100405W WO 2020020380 A1 WO2020020380 A1 WO 2020020380A1
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WIPO (PCT)
Prior art keywords
charging
circuit board
under test
programmer
board under
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PCT/CN2019/100405
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English (en)
French (fr)
Inventor
王伟明
李冰
李路明
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清华大学
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Application filed by 清华大学 filed Critical 清华大学
Publication of WO2020020380A1 publication Critical patent/WO2020020380A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere

Definitions

  • the invention relates to the technical field of medical device detection, and in particular, to a method and device for automatic traversal test of an active implantable medical instrument.
  • IMD Human implantable medical device
  • This device has a battery and a circuit board (with sensors, chips and other components).
  • the IMD relies on a set program. And operating parameters to achieve the corresponding therapy, these operating parameters can be taken according to the user's condition to take different settings.
  • implantable medical devices installed in different users generally have different operating states. These operating states are reflected in the battery voltage, operating time, power, and current of the implantable medical device. Size, frequency, etc.
  • the invention provides a method for detecting a circuit board of an implanted medical device, which includes: obtaining a inherent information of a circuit board under test of the implanted device through a charging programmer; determining a distance value and a charging parameter according to the inherent information; and sending the charging parameter.
  • obtaining a inherent information of a circuit board under test of the implanted device through a charging programmer determining a distance value and a charging parameter according to the inherent information; and sending the charging parameter.
  • controlling the mobile tool to adjust the distance between the charging programmer and the induction coil according to the distance value, and controlling the charging programmer through the induction coil and the circuit board under test
  • Charging the power supply line based on the charging parameter receiving the working parameter fed back by the circuit board under test according to the charging parameter; and judging whether the circuit board under test is normal according to the working parameter.
  • the acquiring the inherent information of the circuit board under test of the implanted device through a charging programmer includes:
  • the charging parameters include power output parameters suitable for the charging programmer and power receiving parameters suitable for the circuit board under test.
  • the charging parameters include a charging time and a charging current, wherein each of the distance values corresponds to the same charging time and a plurality of charging currents, respectively.
  • the mobile tool is controlled to adjust the distance between the charging programmer and the induction coil according to the distance value, and controls the charging programmer to supply power to the power source through the induction coil and the circuit board under test based on the charging parameter.
  • In-line charging including:
  • the method further includes:
  • the determining whether the circuit board under test is normal according to the working parameters includes:
  • the method further includes:
  • the control power supplies power to the circuit board under test
  • the method further includes:
  • the determining whether the circuit board under test is normal according to the waveform signal includes:
  • the method further includes:
  • the present invention also provides a computer device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer executable by the at least one processor A program, the computer program being executed by the at least one processor, so that the at least one processor executes the above-mentioned method for detecting a circuit board of an implanted medical device.
  • the detection method and device provided by the present invention determine the corresponding test parameters by automatically acquiring the inherent information of the circuit board under test, sending appropriate charging parameters to the charging programmer and the circuit board under test, so that the circuit board under test is in an actual working environment.
  • the relative position of the coil of the charging programmer and the induction coil is changed by using a shifting tool to simulate the charging operation that may occur during actual use by the user.
  • the computer controls the charging process and reads the work of the circuit board under test. Parameters, in order to carry out a more targeted detection of the circuit board of the implanted device.
  • the detection process is automated and has a high working efficiency.
  • FIG. 1 is a schematic structural diagram of a system for detecting a circuit board of an implanted medical device according to an embodiment of the present invention
  • FIG. 2 shows a schematic structural diagram of a shifting tool for automatic testing of a circuit board of an implanted medical instrument according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of another perspective of a displacement tool for automatic testing of a circuit board of an implanted medical instrument according to an embodiment of the present invention
  • FIG. 4 shows a schematic structural diagram of a shifting tool for automatic testing of a circuit board of an implanted medical instrument according to another embodiment of the present invention
  • FIG. 5 is a schematic structural view from another perspective of a displacement tool for automatic testing of a circuit board of an implanted medical instrument according to another embodiment of the present invention.
  • FIG. 6 is a flowchart of a circuit board detection method according to an embodiment of the present invention.
  • FIG. 7 is a flowchart of another circuit board detection method according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a circuit board in an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a test board according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of a specific structure of a test board in an embodiment of the present invention.
  • the implanted device communicates wirelessly and charges / powers the implanted battery / capacitor in the body.
  • the implanted device generally includes a circuit board, a charging and communication coil, a battery, an output electrode, and several sampling resistors.
  • the circuit board under test in the embodiment of the present invention is a circuit board in an implanted device.
  • the circuit board is provided with a variety of electrical components, and is a core component of the implanted device, which is used to control the working state of the implanted device.
  • An embodiment of the present invention provides an automatic test system for detecting a circuit board of an implanted medical instrument.
  • the system includes: a shifting tool 11, a power source 12, and a computer 13.
  • the shifting tool 11 is provided with a charging programmer 14, an induction coil 15 and a test board 16.
  • the shifting tool 11 is used to change the relative position of the charging programmer 14 and the induction coil 15.
  • the specific structure of the shifting tool 11 can be an electric device with one or more guide rails.
  • the charging programmer 14 and the induction coil 15 can be placed on two platforms that can achieve relative movement. Can change the position between the two.
  • the tested object in the embodiment of the present invention is only the tested circuit board 10, and the induction coil 15 is a part of the test system, which simulates the charging and communication coils of the implanted device; the charging programmer 14 simulates an external charging device and charges
  • the programmer 14 is also provided with an induction coil.
  • the relative position in this embodiment may be a relative distance, may also include a relative angle, etc., depending on the structure of the shifting tool 11, the present invention provides a preferred structure, which will be described in detail in subsequent embodiments.
  • the test board 16 is provided with components for providing a load to the circuit board 10 to be tested, peripheral circuits of the circuit board 10 to be tested, and interfaces connecting the circuit board 10 to be tested and the induction coil 15.
  • the induction coil 15 is connected to the test board 16 through the test board 16.
  • the circuit board 10 is connected.
  • the components on the test board 16 may include, for example, several components that simulate loads, relays, analog switches, electrodes, and resistors. These components are used to simulate the connected circuit board 10 in the actual product such as output electrodes, sampling resistors, etc. Device and simulate the actual load of the circuit board 10 under test.
  • the computer 13 is respectively connected to the test board 16, the charging programmer 14, and the power source 12, and is used to control the components on the test board 16 to provide a load to the circuit board 10 to be tested, and to control the coil of the charging programmer 14 through the induction coil 15 and the measured
  • the circuit board 10 charges a power source (this power source is a battery simulator and is set as a rechargeable battery during the charging test) 12 and obtains the working parameters of the circuit board 10 under test through the charging programmer 14. These operating parameters can be collected by peripheral circuits (such as temperature sampling resistors) on the test board 16 and passed to the charging programmer 14 through the induction coil 15.
  • the shifting tool 11 can change the relative position of the coil of the charging programmer 14 and the induction coil 15. The change in the distance or angle between the two will affect the working parameters of the circuit board 10 under test. Including charging current, charging voltage, temperature, etc.
  • the coil of the charging programmer 14 will communicate with the induction coil 15 by wireless communication to read these parameters.
  • an ammeter 17 can be set between the power source 12 and the test board 16 to measure the charging current, and then the computer 13 can compare this data with the charging current of the current sensor on the circuit board 10 transmitted through wireless communication. These operating parameters will be used as test results to determine whether the circuit board 10 under test is qualified and reliable.
  • the ammeter 17 can be used for reading power supply power consumption test data.
  • the test system uses a power supply (battery simulator) to simulate the battery of the implanted device, uses a charging programmer to simulate an external charging device, uses an induction coil to simulate the coil of the implanted device, and uses a test board to simulate the circuit board under test. Peripheral circuit, so that the circuit board under test is in the actual working environment. At the same time, the relative position of the charging programmer coil and the induction coil is changed by using a shifting tool to simulate the charging operation that may occur during actual use by the user.
  • the computer controls the charging Process and read the working parameters of the circuit board under test. This system performs a targeted test on the circuit board of the implanted device. The entire test process is automated and has high work efficiency.
  • the computer 13 in this embodiment can also read the operating parameters of the charging programmer 14 and calculate the charging efficiency according to the operating parameters of the circuit board 10 under test and the operating parameters of the charging programmer 14.
  • Charging efficiency charging current of the circuit board 10 under test * voltage of the circuit board 10 under test / (charging programmer voltage * charging programmer current).
  • the charging current and voltage of the tested circuit board 10 can be sampled by the tested circuit board 10 itself, the voltage and current of the charging programmer 14 can be sampled by the charging programmer, and the charging efficiency can also be calculated by the charging programmer 14 and sent to the computer. 13.
  • Another embodiment of the present invention provides a system for detecting a circuit board of an implanted medical instrument. Based on the previous embodiment, a magnet is also provided on the displacement tool 11 of this embodiment.
  • the implanted device is usually provided with an electromagnetic switch for resetting. The user can trigger this switch by a magnet to achieve corresponding control.
  • the magnet in this embodiment is used to detect the reset function of the circuit board 10 under test.
  • the computer 13 can control the displacement tool. 11 Change the relative position of the magnet and the circuit board under test 10, and detect the working state of the electromagnetic switch on the circuit board under test 10.
  • the displacement tool 11 of this embodiment needs to control the position change of the two groups of devices, that is, the relative position of the magnet and the circuit board 10 to be tested, and the relative position of the coil of the charging programmer 14 and the induction coil 15.
  • this embodiment provides a preferred structure of a shifting tool 11.
  • the shifting tool 11 includes: a Y-axis guide A, an X-axis guide B, a translation stage 111, and an induction coil tooling. 112, charging programmer coil tooling 113, magnet tooling tool 114, and test board platform 115.
  • the X-axis guide rail B is movably arranged on the Y-axis guide rail A and is driven by the Y-axis guide rail A.
  • the X-axis guide rail B and the Y-axis guide rail A are arranged perpendicularly to each other, and the translation stage 111 is movably disposed on the X-axis guide rail B and received Driven by the X-axis guide rail B, the induction coil tooling 112 and the magnet tooling 114 are fixedly installed on the translation table 111, and the induction coil tooling 112 and the magnet tooling 114 are arranged orthogonally on the translation table 111.
  • a charging programmer coil tool 113 is located at one end of the X-axis guide rail B and is relatively fixedly disposed with the X-axis guide rail B; a test board platform 115 is located at one end of the Y-axis guide rail A and is relatively fixedly disposed with the Y-axis guide rail A.
  • the induction coil tooling 112 is used to install the induction coil
  • the charging programmer coil tooling 113 is used to install the coil of the charging programmer.
  • the induction coil tooling 112 and the charging programmer coil tooling 113 can realize the detachable installation of the induction coil and the charging programmer.
  • the coil of the charging programmer 14 is installed in the charging programmer coil tool 113, and the induction coil 15 is installed in the induction coil tool 112.
  • the charging programmer coil tooling and induction coil tooling 1 use a uniform fixing and wiring method. When testing different products, only need to replace the charging programmer Coil tooling and induction coil tooling are sufficient.
  • the coil of the charging programmer coil tool 113 and the coil of the charging programmer 14 are fixedly installed at one end of the X-axis guide rail B; the coil corresponding to the coil of the charging programmer 14 is movably disposed at
  • the translation stage 111 on the X-axis guide rail B is provided with an induction coil tool 112 aligned with the coil of the charging programmer 14, the induction coil 15 is installed on the induction coil tool 112, and the translation table 111 is also provided with The magnet tooling 114 and the magnets mounted on the magnet tooling 114 are arranged orthogonally to the induction coil tooling.
  • the translation stage 111 is controlled by the X-axis guide rail B.
  • the induction coil moves with the magnet.
  • a test board platform 115 is provided at one end of the Y-axis guide A, and a test board 16 is provided on the test platform;
  • the X-axis guide B is vertically arranged on the Y-axis guide A, the X-axis guide B and All structures installed on the X-axis guide B are controlled by the Y-axis guide A.
  • the motion control of the Y-axis guide A and the X-axis guide B can be performed independently.
  • the alignment of the coils of the induction coil 15 and the charging programmer 14 is not affected by the movement of the translation stage 111; the induction coil 15 The relative distance from the coil of the charging programmer 14 is controlled by the X-axis guide rail B, and changes with the movement of the translation stage 111.
  • the charging programmer coil tooling can also be set on the translation stage, and moves with the translation stage, and the induction coil tooling is fixedly set at one end of the X-axis guide.
  • the position of the induction coil tooling and the charging programmer tooling are interchanged.
  • the shifting tool 11 in this embodiment can adjust the relative position of the magnet and the circuit board 10 under test.
  • the magnet is mounted on the magnet tool 114, and the position of the magnet on the magnet tool 114 is adjustable.
  • a test board platform 115 is provided at one end of the Y-axis guide rail A, a test board 16 is provided on the test platform, and a circuit board 10 to be tested is installed on the test board 16.
  • the magnet tooling 114 and the X-axis guide B can adjust the alignment of the magnet and the electromagnetic switch on the circuit board 10 under test, and the Y-axis guide A controls the movement of the X-axis guide B to realize the magnet and the circuit board 10 under test. Relative distance adjustment.
  • the translation stage 111 of the shifting tool of this embodiment is provided with a second mounting frame 1111 and a first mounting frame 1112 arranged orthogonally.
  • the induction coil tool 112 is detachably mounted on the second mounting frame 1111.
  • the magnet tool 114 can It is detachably mounted on the first mounting bracket 1112.
  • the magnet tooling 114 includes a sliding frame 1141 and a slider. 1142, the sliding frame 1141 is slidably mounted on the first mounting frame 1112 through a vertical sliding rail provided on the first mounting frame 1112.
  • the sliding frame 1141 is provided with a horizontal sliding rail along the X-axis direction, and the slider 1142
  • the horizontal slide rail can be horizontally slidably mounted on the slide frame 1141, and the slider 1142 is provided with a magnet mounting portion 1142a for mounting a magnet.
  • the magnet can be moved up and down relative to the circuit board to be adjusted during the magnet function test. To ensure alignment with the magnetic switch on the circuit board under test.
  • the induction coil tooling 112 and the magnet tooling 114 are both disposed on the translation stage 111, in order to avoid interference of the induction coil by the magnet tooling 114, the center distance of the center of the induction coil tooling 112 from the center of the magnet mounting portion 1142a on the magnet tooling 114 Not less than 5cm.
  • the shifting tool of this embodiment is further provided with a first locking structure for locking the sliding frame 1141 on the first mounting frame 1112 and a slider for locking the slider on the sliding frame 1141.
  • a first locking structure for locking the sliding frame 1141 on the first mounting frame 1112
  • a slider for locking the slider on the sliding frame 1141.
  • the shifting tool of this embodiment also includes a tooling base 116, and the X-axis guide rail B, the Y-axis guide rail A, the charging programmer coil tooling 113, and the test board platform 115 are fixedly disposed on the Tooling base 116.
  • the charging programmer coil communicates with the induction coil to read the test results.
  • the charging programmer coil communicates with the induction coil and reads the test results.
  • control the translation stage 111 to move along the X-axis guide rail B, so that the distance between the charging programmer coil and the induction coil reaches 0cm, 1cm, 2cm, up to 10cm;
  • the relative position control of the shifting tool 11 may be performed independently, for example, it may be independently controlled by a controller provided in the shifting tool 11.
  • this embodiment uses a computer 13 to control the shifting tool 11, that is, the computer 13 in this embodiment is also used to control the change of the induction tool 15 and the charging programming of the shifting tool 11 during charging or communication.
  • the implementation of the present invention is not limited to the above-mentioned preferred embodiment, but also includes other embodiments, for example, as shown in FIG. 4 and FIG.
  • the board and the circuit board under test are fixedly disposed on one side of the induction coil 112 of the translation stage, and a magnet is fixed on one end of the Y-axis guide and is fixedly disposed relative to the Y-axis guide.
  • the advantage of placing the test board and the induction coil on the translation stage is that the connection between the two will not move with the movement of the translation stage, which further ensures the stability and accuracy of the test.
  • the test board and the circuit board under test of the shifting tool are also disposed on the translation stage, and the test board is located on the side of the coil or induction coil of the charging programmer on the translation stage, and The circuit board is orthogonally arranged with the coil or induction coil of the charging programmer;
  • the magnet tooling includes a second fixing table 118 provided at one end of the Y-axis guide rail and fixedly disposed with respect to the Y-axis guide rail, and movably disposed at the
  • the magnet position adjustment mechanism on the second fixed base 118 is a magnet mounted on the magnet adjustment mechanism, and the position of the magnet can be adjusted by the magnet adjustment mechanism so that the magnet is aligned with the circuit board under test. Adjust and adjust the distance between the two.
  • the magnet position adjustment mechanism includes a sliding table 119, a first mounting frame, and a sliding frame, wherein the sliding table 119 is slidably disposed on the second fixing table 118 along the X-axis direction, and the first mounting frame is fixed on
  • the sliding table 119 is disposed on the side of the circuit board under test, and the slide frame is slidably mounted on the surface of the first mounting frame on the side of the circuit board under test, and the magnet is fixedly mounted on the board.
  • An end of the first sliding frame remote from the coil or the induction coil of the charging programmer.
  • the slider is provided with a slider capable of sliding along the X-axis direction, and the slider is provided with a magnet mounting portion for mounting the magnet.
  • the slider can also adjust the position of the X axis of the magnet.
  • the charging programmer coil communicates with the induction coil to read the test results.
  • the charging programmer coil communicates with the induction coil and reads the test results.
  • control the translation stage 111 to move along the X-axis guide rail B, so that the distance between the charging programmer coil and the induction coil reaches 0cm, 1cm, 2cm ... up to 10cm;
  • the relative position control of the shifting tool 11 may be performed independently, for example, it may be independently controlled by a controller provided in the shifting tool 11.
  • this embodiment uses a computer 13 to control the shifting tool 11, that is, the computer 13 in this embodiment is also used to control the shifting tool 11 to change the induction coil 15 and charge programming during charging or communication.
  • the relative position of the circuit board 10 to be tested and the operator is convenient for the operator to plug and unplug the circuit board under test from the gold finger socket with both hands.
  • the magnet is placed in the magnet tooling on the translation stage.
  • the translation stage can adjust the distance between the circuit board under test and the magnet along the Y axis.
  • the magnet is close to the magnet at 0-2cm when testing the hardware reset function, and the distance is maintained when testing the other items. Above 8cm to prevent the magnet from having an unexpected effect on the reed switch on the circuit board under test.
  • the coil of the charging programmer is placed in the coil of the charging programmer on the translation stage.
  • the induction coil is placed at the fixed end of the X-axis guide.
  • the translation stage can adjust the distance between the coil of the induction coil and the induction coil along the X axis to meet Testing of communication distance (0-5cm) and charging distance (0-2cm).
  • the hardware reset function requires the coordination of the X axis and the Y axis.
  • the distance between the circuit board under test and the magnet is adjusted to 0-2cm, and the distance between the coil of the charging programmer and the induction coil is adjusted to 0-5cm.
  • the magnet and the coil of the charging programmer are located on the tooling placed on the translation platform 99, and the distance between them is not less than 5cm.
  • the coil of the charging programmer and the induction coil must move synchronously, and the center axis is always centered.
  • the circuit board under test and the magnet are always kept at a distance of more than 8cm, and only approached during the hardware reset and magnet function test.
  • this embodiment also collects the output signals of the circuit board under test 10.
  • the power supply 12 in this embodiment is also used to provide power to the charging programmer 14, the test board 16, and the circuit board 10 to be tested, so that the circuit under test outputs a waveform signal according to the load board provided by the test board 16, such as an electric pulse stimulation. signal.
  • the system further includes a capture card 18 for collecting a waveform signal output from the circuit board 10 under test, and the computer 13 obtains a waveform signal output from the circuit board 10 under test through the acquisition card.
  • the computer 13 can also set the output parameters of the circuit board under test through the charging programmer 14 and the induction coil 15.
  • the computer 13 controls the charging programmer to program the circuit board 10 to be tested through wireless communication.
  • the pulse output amplitude and frequency of the circuit board 10 to be tested can be set according to test requirements.
  • the test of the output waveform, the test of the charging process, and the test of the reset function can be performed in any order. These detection operations do not conflict.
  • the charging programmer 14 in this embodiment is also used to read the circuit board 10 under test through the induction coil 15 Based on the inherent information, the computer 13 can determine signals for controlling the components on the test board 16. Therefore, suitable load signals can be provided to different types of circuit boards, so that the system has better scalability.
  • an embodiment of the present invention also provides a detection method, which is executed by the computer 13 as shown in FIG. 6. The method includes the following steps:
  • the distance value and the charging parameter are determined according to the inherent information. This distance value indicates the distance between the coil of the charging programmer 14 and the induction coil 15.
  • the charging parameter may be, for example, a charging current.
  • the charging parameters in this embodiment include power output parameters suitable for the charging programmer 14 and power receiving parameters suitable for the circuit board 10 under test. These charging parameters may, for example, specify that the charging programmer 14 outputs electric energy with a certain charging current or more, and correspondingly may also specify that the circuit board under test 10 switches a suitable resistance parameter to adapt to the magnitude of the charging current.
  • the computer 13 is connected to the test board 16, and the charging parameters can be transmitted to the circuit board 10 under test through the test board 16.
  • the mobile tool 11 is controlled to adjust the distance between the coil of the charging programmer 14 and the induction coil 15 according to the distance value.
  • the computer 13 sets the power source 12 to be charged, and controls the charging programmer 14 through the induction coil 15 and the circuit board under test.
  • 10 Charge the power supply 12 into the line based on the charging parameters.
  • This step can have multiple specific implementations. For example, one or more of the above distance values can be set, that is, the two can be wirelessly charged at a fixed or multiple different distances; at each distance, the corresponding charging parameters You can also set one or more, and flexibly detect the charging effect according to the product and user needs.
  • S5A Receives the working parameters fed back by the circuit board 10 according to the charging parameters.
  • the working parameters recorded by the sensors on the circuit board 10 can be read through the test board 16.
  • it can include the charging voltage, charging current, and temperature. Wait;
  • the test board 16 also has some peripheral circuits.
  • the peripheral circuit can include temperature sampling resistors, that is, the test board 16 can also collect operating parameters such as temperature generated during the charging process.
  • the above operating parameters may also include parameters detected by the test board 16.
  • S6A Determine whether the circuit board 10 is normal according to the working parameters. For example, it can be determined whether the charging voltage, charging current, temperature value, etc. of the circuit board 10 are in line with expectations, so as to determine whether the state is normal.
  • the detection method provided by the embodiment of the present invention determines the corresponding test parameters by automatically acquiring the inherent information of the circuit board under test, sending appropriate charging parameters to the charging programmer and the circuit board under test, so that the circuit board under test is in an actual working environment.
  • the relative position of the coil of the charging programmer and the induction coil is changed by using a shifting tool to simulate the charging operation that may occur during actual use by the user.
  • the computer controls the charging process and reads the work of the circuit board under test. Parameters, in order to carry out a more targeted detection of the circuit board of the implanted device.
  • the detection process is automated and has a high working efficiency.
  • step S1 may specifically include the following steps:
  • the start signal can be a simple digital signal. After receiving the start signal, the charging programmer 14 can wirelessly send a handshake signal to the circuit board 10 under test.
  • the signal can be a waveform signal; the circuit board under test 10 can analyze the handshake signal. In response, the unique information is transmitted to the charging programmer 14 and then to the computer 13.
  • the charging parameters in this embodiment include a charging time and a charging current, where each distance value corresponds to the same charging time and multiple charging currents, respectively.
  • each distance value corresponds to the same charging time and multiple charging currents, respectively.
  • four distance values X1 ... X4, charging time t, and charging current A1 ... A4 can be preset. These parameters can form various combinations.
  • S4A can include the following steps:
  • S4A1 controlling the mobile tooling 11 to set the charging programmer 14 and the induction coil 15 at respective distances to stay corresponding charging time;
  • the charging programmer 14 is controlled to charge the power source 12 based on a plurality of charging currents through the induction coil 15 and the circuit board 10 to be tested during the stay.
  • S5A is performed synchronously with S4A, and the computer 13 collects the working parameters of the circuit board 10 under test during the charging in real time, thereby obtaining four sets of parameters, that is, the working parameters corresponding to four different distances, each of which includes the same The operating parameters corresponding to the four charging currents.
  • the above preferred detection scheme can accurately detect the working state of the circuit board under test at different distances and under different charging parameters, thereby improving the reliability of the test results.
  • the method may further include:
  • S1A Determine the criterion parameters according to the inherent information. This step can be performed in synchronization with S2A.
  • the criterion parameters therein should correspond to the working parameters collected in step S5A, and may include, for example, a standard charging voltage, a standard charging current, and an upper temperature limit.
  • step S6A may include the following steps:
  • S6A2 Determine whether the tested circuit board 10 is normal according to the comparison result, for example, determine whether the working parameter is consistent with the criterion parameter, or whether the error between the two is within an acceptable range, so as to determine whether the tested circuit board 10 is normal.
  • the computer 13 can control the charging programmer 14 to set the tested circuit board 10 through wireless communication, for example, it can set its output amplitude and frequency, etc., and then perform the detection process of the output signal.
  • the method may further include the following steps:
  • the load parameters and power supply parameters can also be part of the test plan. This step can be performed in synchronization with the above step S2A.
  • the load parameters and power supply parameters of different types or models of products are different.
  • the load parameters are, for example, 1k resistors for nerve stimulators and 500 ohm resistors for spinal cord stimulators; and the power supply parameters are, for example, the supply voltage.
  • the power source 12 is controlled to supply power to the circuit board 10 to be tested, and the computer 13 sets the power source 12 to output the power state, and powers the circuit board 10 to be tested to simulate the actual working state;
  • S4B Send the load parameters to the test board 16 connected to the circuit board 10 under test.
  • the test board 16 will adjust its component state according to the received load parameters to simulate the load of the circuit board 10 under test, so that the circuit board 10 under test is under load.
  • S6B Determine whether the circuit board 10 under test is normal according to the waveform signal.
  • steps S3B-S6B and steps S3A-S6A are performed in isolation and do not interfere with each other.
  • This method performs full-automatic detection on the output signal of the circuit board 10 under test, further improving the comprehensiveness and convenience of the detection operation.
  • step S1A For the judgment of the output waveform, similarly to step S1A, after step S1, it may further include:
  • step S6B may include:
  • S6B2 it is determined whether the circuit board 10 to be tested is normal or not according to the comparison result. There are various specific ways of signal comparison, which are not described in the present invention.
  • a step of detecting the reset function of the circuit board 10 under test may be added. This step is performed under the condition that the power source 12 is supplying power to the circuit board 10 under test.
  • the computer 13 controls the mobile tooling 11 The magnet above is close to the circuit board 10 to be tested, and at the same time, it is sufficient to verify whether the circuit board 10 to be tested is reset (the various parameters are restored to the initial values) through the charging programmer 14.
  • An embodiment of the present invention provides a computer device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor.
  • the processor executes, so that at least one processor executes the above-mentioned method for detecting a circuit board of an implanted medical instrument.
  • test board 16 and the tested circuit board 10 in the embodiment of the present invention will be described in detail below with reference to FIGS. 8 and 9.
  • An embodiment of the present invention provides a circuit board 10 to be tested.
  • the circuit board includes a base portion 101 and a measured portion 102, where the measured portion 102 is a circuit board of an implanted device.
  • the base portion 101 is provided with a through hole for receiving the measured portion 102.
  • the measured portion 102 is an approximately arc-shaped structure, and accordingly, an adapted shape is cut out in the middle of the base portion 101 to form a through hole.
  • the edge of the measured portion 102 and the edge of the through hole are connected through a plurality of cutable portions 103, and the measured portion 102 and the base portion 101 are on the same plane.
  • a plurality of cuttable portions 103 are provided in this embodiment, and a gap is left at a position other than the cuttable portion 103.
  • a plurality of conductive contacts 104 for connecting external test equipment are provided.
  • These conductive contacts 104 form a gold finger plug (test board A corresponding golden finger socket is provided on 16) and is laid on the end of the base 101.
  • the conductive contacts 104 are connected to various connection points on the measured portion 102 through wires provided in the base portion 101 and the measured portion 102, and the wires can pass through the gap between the base portion 101 and the measured portion 102 through the adjacent cutable portion 103. .
  • the components (peripheral circuits, such as sampling resistors, output electrodes, etc.) on the test board 16 and the connection points on the test unit 102 form an electrical connection relationship.
  • the board 16 provides an analog load, provides power, provides a charging coil and a communication coil, and provides a titanium case temperature sampling analog resistor and a battery temperature sampling analog resistor to the measured portion 102, so that the measured portion 102 responds.
  • the base portion surrounds the measured portion.
  • an operator or a robot can hold the base portion to plug in the test equipment, and the base portion is the actual force object. It can better protect the tested part, and after the test is completed, the tested part can be cut off from the base, making the whole testing process safe and convenient.
  • a charging coil connection point 105 and a communication antenna connection point 106 are provided on the tested portion 102 in the tested circuit board provided in the embodiment of the present invention, both of which extend to the outside of the measured portion 102, and in the present embodiment, the two are distributed. On both sides of the measured part 102, it extends outward from a straight end. In order to effectively protect the coil connection point, the area of the through hole must be sufficient to accommodate the measured part, the charging coil connection point 105 and the communication coil connection point 106. The shape of the through hole is also set according to the length of the antenna connection point. Further, the charging antenna connection point 105 and the communication antenna connection point 106 are respectively connected to the edge of the through hole through a plurality of cutable portions 103.
  • the connection points related to the charging function on the circuit board 10 to be tested need to be connected to the test board 16.
  • the conductive contact 104 in this embodiment includes a connection for the charging coil on the part under test.
  • the first conductive contact of the connection point 105 and the communication coil connection point 106 In conjunction with the system shown in FIG. 1, when the charging programmer 14 is charged through the induction coil 15, the charging antenna and the communication antenna connected to the test board 16 start to work, so that the charging coil connection point 105 and the communication coil connection point 106 receive signals.
  • the conductive contact pad 104 further includes a second conductive contact pad for connecting the temperature sampling resistor connection point 107 on the measured part.
  • the second conductive contact piece may include a conductive contact piece for connecting a temperature sampling resistance connection point of a titanium metal case and a conductive contact piece for connecting a battery temperature sampling resistance connection point.
  • the conductive contact piece 104 further includes a third conductive contact piece for connecting the power supply connection point 108 on the part under test, so that the part under test 102 is connected to the power source 12 for power supply or charging operation.
  • the conductive contact 104 further includes a fourth conductive contact for connecting the signal output electrode connection point 109 on the part under test.
  • sixteen signal output electrode connection points are provided on the measured portion 102, and conductive contacts corresponding to each electrode connection point are provided on the base portion 101, which are respectively connected to multiple loads on the test board 16. .
  • the signal output electrode connection point 109 will output a waveform signal and pass it to the signal output electrode on the test board 16, and finally pass it to the computer 13 through the acquisition card 18.
  • the conductive contact pad 104 also includes a fifth conductive contact pad for writing a program, which is mainly used to write a program for the single-chip microcomputer on the circuit board 10 under test.
  • a fifth conductive contact pad for writing a program which is mainly used to write a program for the single-chip microcomputer on the circuit board 10 under test.
  • the automatic writing of the single-chip microcomputer may The test procedure is different. Setting the fifth conductive contact can improve the efficiency of the writing procedure.
  • the specifications of the base 101 of the circuit board under test provided by the embodiment of the present invention may be fixed, that is, a base 101 may be applicable to the tested unit 102 of different products.
  • the types of connection points may be different; the number may be different, for example, the number of output electrode connection points is different.
  • enough conductive contacts need to be provided on the base 101 to cope with different measured parts 102.
  • the number of conductive contacts 104 needs to be greater than or equal to the number of connection points on the tested part 102 to improve versatility. It is not necessary to produce a different base 101 for each type of the measured part 102, which can reduce production costs.
  • the circuit boards of different implanted products have the same definition of the gold finger legs.
  • the test board 16 can be used universally, that is, a test board 16 can take into account DBS (deep brain stimulation), VNS (vagusneve stimulation), SCS ( Spinal cord stimulation (Spine Spinal Cord Stimulation) and SNM (Sacral Neuromodulation, sacral nerve stimulation system) and other charging and non-charging products, good versatility, high testing efficiency.
  • DBS deep brain stimulation
  • VNS vagusneve stimulation
  • SCS Spinal cord stimulation
  • SNM Scacral Neuromodulation, sacral nerve stimulation system
  • an embodiment of the present invention provides an implanted medical instrument detection circuit board as the above-mentioned test board 16.
  • the test board 16 includes:
  • the test circuit board connection portion 161 is used to connect the test circuit board 10, and in this embodiment, a gold finger socket is used to connect to the gold finger plug (the conductive sheet arranged at the end) of the test circuit board 10, and the gold finger Sockets can accommodate circuit boards of different thicknesses.
  • the peripheral circuit 162 of the circuit under test includes a variety of electrical components, all of which are required in the implanted device and work in cooperation with the circuit board 10 under test, such as a sampling resistor, a communication antenna, an output electrode, and the like. These components are connected to the connection points on the circuit board 10 to be tested through the connection portion 161 of the circuit board under test, to simulate the actual working conditions of the circuit board to be tested, and to ensure the normal operation of the circuit board 10 under test.
  • the load unit 163 is used to simulate the load of the circuit board under test.
  • the implanted device will bear a certain load in the human body.
  • the load of different types and uses of implanted devices is different.
  • This unit can be equipped with multiple load components to simulate the load on different circuit boards 10 under test. For example, there may be Use 1k resistors for nerve stimulators and 500 ohm resistors for spinal cord stimulators.
  • the selection unit 164 and the acquisition device connection section 165 connects the electrical components in the peripheral circuit 162 of the circuit board under test through the selection unit 164, for example, it can connect output electrodes.
  • the function of the selection unit 164 is to control the connection relationship between the acquisition device connection section 165 and the electrical components connected to it.
  • the acquisition device connection section 165 is connected to an external acquisition device, that is, the acquisition card 18. The acquisition card 18 can obtain the influence of the connected electrical components on the load. Signal.
  • peripheral circuits usually include more electrical components.
  • a pacemaker may have more than ten output electrodes, and each output electrode can independently emit a stimulation signal.
  • the detection program may only control some output electrodes to emit signals at the same time.
  • the acquisition device connection section 165 may connect all output electrodes through the selection unit 164, and the selection unit 164 may only be connected at the same time. Some electrodes that are outputting signals.
  • the circuit board under test can be connected with an external detection device, and the circuit board under test can be simulated with an actual working state through a peripheral circuit and a load unit, and simultaneously controlled by a selection unit.
  • the communication status of the external device and the tested component so as to obtain the signal sent by the tested component controlled by the tested circuit board.
  • the system does not need to rely on other components in the implanted device to target the circuit board of the medical instrument. Strong detection, at the same time, the selection unit can be flexibly set to meet different detection needs, and has higher work efficiency.
  • the peripheral circuit 162 of the circuit board under test includes a plurality of output electrodes 1621 implanted in the medical instrument and a metal shell interface 1622 implanted in the medical instrument.
  • the selection unit 164 includes a plurality of analog switches, and the analog switches are respectively connected to the corresponding output electrodes 1621 and the metal shell interface 1622, one end of the metal shell interface 1622 is connected to the metal shell (not shown in FIG. 10, the metal shell can be used The positive end of the pulse output), and the other end is connected to one of the analog switches of the selection unit 164.
  • the open and closed states of the analog switch are used to control the connection relationship between the output electrode and the acquisition device connection section 165, Connected relationship of metal shell.
  • the acquisition device connection section 165 outputs to the external acquisition device a waveform signal emitted by the electrode under the influence of the load.
  • the selection unit 164 is provided with two switch groups, and the acquisition device connection section 165 is provided with two corresponding access ports Out1 and Out2, and each access port is connected to a peripheral circuit through a different switch group. Electrical components, that is, the output electrode and metal shell interface.
  • port Out1 is connected to one end of the first switch group 1641, and the other end of the first switch group 1641 is connected to all output electrodes and metal shell interfaces;
  • port Out2 is connected to one end of the second switch group 1642, and the second switch group 1642 The other end is connected to all output electrodes and the metal shell interface.
  • the two ports Out1 and Out2 of the acquisition device connection section 165 are connected to any two of the sixteen output electrodes 1621 and the metal shell interface 1622 in the peripheral circuit 162 of the circuit board under test.
  • the states of the first switch group 1641 and the second switch group 1642 can be controlled by a single chip microcomputer. Specifically, any two output electrodes are connected to a computer, a serial port chip and a single-chip microcomputer, and the computer controls the corresponding analog switches in the first switch group 1641 and the second switch group 1642 according to the test requirements, thereby achieving collection Connection of card and electrode output.
  • the load unit 163 may include:
  • Multiple sets of load elements 1631 are used to simulate the load of different types of implanted equipment
  • a plurality of analog switches constitute a third switch group 1632, which is used to control the connection states of the multiple sets of load elements 1631, the acquisition device connection portion 165, and the output electrode 1621.
  • Two ports Out1 and Out2 are connected to both ends of the load.
  • the computer can control the corresponding analog switches in the third switch group 1632 according to the test requirements, thereby achieving the connection of the two ports Out1 and Out2 and different loads.
  • Optional loads include DBS load, SCS load, VNS load, and SNM (Sacral Neuromodulation) load.
  • the power supply 12 can provide two power supplies, one of which is a variable voltage power supply 10 (range 4.1V ⁇ 2V). It uses a battery analog power supply (the charging product is tested for the charging function).
  • the circuit board 10 is powered; the other is a constant voltage, and the electrical components on the test board 16 are powered by a voltage chip.
  • the peripheral circuit 162 of the circuit board under test includes a power supply circuit.
  • One end of the power supply circuit is connected in series with the external power source 12 and the ammeter 17, and the other end is connected to a corresponding power connection point on the circuit board 10 under test.
  • the power supply circuit can be used to receive the power input by the external charging programmer through the circuit board 10 under test and charge the external power source 12, and the ammeter 17 can show the charging current.
  • the power supply circuit may be used to receive power input from an external power source 12 and power the circuit board 10 under test.
  • the circuit board under test 10 For different products, you can choose to connect the circuit board under test 10 with different charging and communication antennas, such as SCS charging and communication antennas and DBS charging and communication antennas.
  • the peripheral circuit 162 of the circuit board under test may include multiple communication antennas and / or multiple charging antennas.
  • the single-chip microcomputer on the detection circuit board can be controlled by a computer, and the single-chip microcomputer is set to connect the communication circuit board and / or a charging antenna to the circuit board under test.
  • the peripheral circuit of the circuit board under test may further include a temperature sampling resistor, such as a battery temperature sampling resistor and a metal case temperature sampling resistor.
  • the temperature sampling resistor is connected to the corresponding connection point on the circuit board 10 through the circuit board connection portion 161.
  • the collection of temperature parameters can be obtained through wireless communication between the external charging programmer and the circuit board 10 under test, without the need to set up additional ports and devices to connect temperature sampling resistors.

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Abstract

一种有源植入式医疗仪器自动遍历测试的方法和设备，该方法包括：通过充电编程器（14）获取植入设备的被测电路板（16）的固有信息（S1）；根据固有信息确定距离值和充电参数（S2A）；将充电参数发送至充电编程器（14）和被测电路板（10）（S3A）；根据距离值控制移动工装（11）调整充电编程器（14）与感应线圈（15）间的距离，并控制充电编程器（14）通过感应线圈（15）和被测电路板（10）基于充电参数对电源（12）进线充电（S4A）；接收被测电路板（10）根据充电参数反馈的工作参数（S5A）；根据工作参数判断被测电路板（10）是否正常（S6A）。

Description

有源植入式医疗仪器自动遍历测试的方法和设备 技术领域
本发明涉及医疗设备检测技术领域，具体涉及一种有源植入式医疗仪器自动遍历测试的方法和设备。
背景技术
人体植入式医疗装置(Implantable Medical Device,IMD)是一种安装于用户身体内部的医疗器械，这种设备内部具有电池，电路板(设有传感器、芯片等元件)，IMD依靠设定的程序和运行参数来实现相应的疗法，这些运行参数可以按照用户的病症情况采用取不同的设置。因为用户病因、病情不相同，因此不同的用户体内安装的可植入式医疗设备，一般具有不同的运行状态，这些运行状态体现在可植入医疗设备的电池电压、运行时间、功率、电流的大小、频率等很多方面。
为了确保植入部的稳定性和安全性，通常需要对植入部进行全面检测，现有方案采用人工对整机进行检测，这种检测方式效率较低，并且整机中包括电路板、电池和电极等部件，检测过程的针对性有待提高。
发明内容
本发明提供一种植入医疗设备电路板检测方法，包括：通过充电编程器获取植入设备的被测电路板的固有信息；根据所述固有信息确定距离值 和充电参数；将所述充电参数发送至所述充电编程器和被测电路板；根据所述距离值控制移动工装调整所述充电编程器与感应线圈间的距离，并控制所述充电编程器通过所述感应线圈和被测电路板基于所述充电参数对电源进线充电；接收被测电路板根据所述充电参数反馈的工作参数；根据所述工作参数判断被测电路板是否正常。
优选地，所述通过充电编程器获取植入设备的被测电路板的固有信息，包括：
向所述充电编程器发送启动信号，并等待所述充电编程器通过所述感应线圈与被测电路板进行通信以获取所述固有信息；
接收所述充电编程器反馈的所述固有信息。
优选地，所述充电参数包括适用于所述充电编程器的电能输出参数和适用于被测电路板的电能接收参数。
优选地，所述距离值设有多个，所述充电参数包括充电时间和充电电流，其中每个所述距离值分别对应相同的充电时间和多个充电电流。
优选地，所述根据所述距离值控制移动工装调整所述充电编程器与感应线圈间的距离，并控制所述充电编程器通过所述感应线圈和被测电路板基于所述充电参数对电源进线充电，包括：
控制所述移动工装将所述充电编程器与所述感应线圈间分别设置在各个距离上停留相应的充电时间；
在停留时控制所述充电编程器通过所述感应线圈和被测电路板分别基于多个充电电流对所述电源进行充电。
优选地，在所述通过充电编程器获取植入设备的被测电路板的固有信 息之后，还包括：
根据所述固有信息确定判据参数；
所述根据所述工作参数判断被测电路板是否正常，包括：
将所述工作参数与所述判据参数进行比对；
根据比对结果判断被测电路板是否正常。
优选地，在所述通过充电编程器获取植入设备的被测电路板的固有信息之后，还包括：
根据所述固有信息确定负载参数；
控制电源对被测电路板供电；
向连接被测电路板的测试板发送所述负载参数，以使被测电路板根据所述负载参数输出波形信号；
通过采集卡获取所述波形信号；
根据所述波形信号判断被测电路板是否正常。
优选地，在所述通过充电编程器获取植入设备的被测电路板的固有信息之后，还包括：
根据所述固有信息确定判据信号；
所述根据所述波形信号判断被测电路板是否正常，包括：
将所述波形信号与所述判据信号进行比对；
根据比对结果判断被测电路板是否正常。
优选地，在所述接收被测电路板根据所述充电参数反馈的工作参数后，还包括：
根据所述充电编程器的充电参数和所述被测电路板反馈的工作参数计 算充电效率；
根据所述充电效率判断被测电路板是否正常。
相应地，本发明还提供一种计算机设备，包括：至少一个处理器；以及与所述至少一个处理器通信连接的存储器；其中，所述存储器存储有可被所述至少一个处理器执行的计算机程序，所述计算机程序被所述至少一个处理器执行，以使所述至少一个处理器执行上述的植入医疗设备电路板检测方法。
本发明提供的检测方法和设备通过自动获取被测电路板的固有信息来确定相应的测试参数，向充电编程器和被测电路板发送合适的充电参数，使被测电路板处于实际工作环境下，同时利用移位工装来改变充电编程器的线圈与感应线圈的相对位置，以模拟用户在实际使用过程中可能出现的充电操作，本方法由计算机控制充电过程并读取被测电路板的工作参数，以此对植入设备的电路板进行针对性较强的检测，该检测过程实现自动化操作，具有较高的工作效率。
附图说明
通过参考附图会更加清楚的理解本发明的特征和优点，附图是示意性的而不应理解为对本发明进行任何限制，在附图中：
图1为本发明实施例中用于检测植入医疗设备电路板的系统的结构示意图；
图2示出了根据本发明实施例的植入医疗仪器电路板自动测试用移位工装的结构示意图；
图3示出了根据本发明实施例的植入医疗仪器电路板自动测试用移位 工装的另一视角的结构示意图；
图4示出了根据本发明另一实施例的植入医疗仪器电路板自动测试用移位工装的结构示意图；
图5示出了根据本发明另一实施例的植入医疗仪器电路板自动测试用移位工装的另一视角的结构示意图；
图6为本发明实施例中的一种电路板检测方法的流程图；
图7为本发明实施例中的另一种电路板检测方法的流程图；
图8为本发明实施例中的电路板的结构示意图；
图9为本发明实施例中的测试板的结构示意图；
图10为本发明实施例中的测试板的具体结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
植入设备是通过无线的方式进行通信和对体内植入电池/电容进行充/供电的。植入设备一般包括电路板、充电和通信线圈、电池、输出电极和若干采样电阻。本发明实施例中的被测电路板是植入设备内的电路板，该电路板上设有多种电器元件，是植入设备的核心部件，用于控制植入设备的工作状态。
本发明实施例提供一种用于检测植入医疗仪器电路板的自动测试系统， 如图1所示，该系统包括：移位工装11、电源12和计算机13。移位工装11上设有充电编程器14、感应线圈15和测试板16，移位工装11用于改变充电编程器14与感应线圈15的相对位置。
移位工装11的具体结构有多种选择，例如可以是设有一个或多个导轨的电动装置，充电编程器14和感应线圈15可分别放置在能够实现相对运动的两个平台上，如此则可以实现二者间的位置变化。本发明实施例中的被测对象只有被测电路板10，感应线圈15是本测试系统的一部分，模拟的是植入设备的充电和通信线圈；充电编程器14模拟的是体外充电设备，充电编程器14内部也设有感应线圈。本实施例所述相对位置可以是相对距离，同时也可以包括相对角度等，具体取决于移位工装11的结构，本发明提供了一种优选的结构，将在后续实施例中进行详细介绍。
测试板16上设有用于向被测电路板10提供负载的元件、被测电路板10的外围电路以及连接被测电路板10和感应线圈15的接口，感应线圈15通过测试板16与被测电路板10连接。测试板16上的元件例如可以包括若干模拟负载的元件、继电器、模拟开关、电极、电阻等器件，这些元件用来模拟被测电路板10在实际产品中所连接的如输出电极、采样电阻等器件以及模拟被测电路板10的实际负载情况。
计算机13分别与测试板16、充电编程器14和电源12连接，用于控制测试板16上的元件向被测电路板10提供负载，以及控制充电编程器14的线圈通过感应线圈15和被测电路板10对电源(此电源为电池模拟器，在充电测试过程中设定为可充电电池)12进行充电，并通过充电编程器14获取被测电路板10的工作参数。这些工作参数可以由测试板16上的外围电路(如温度采样电阻)进行采集，通过感应线圈15传递给充电编程器14。
在电源12被充电的过程中，移位工装11可以改变充电编程器14的线圈与感应线圈15的相对位置，二者距离或角度的改变将影响到被测电路板10的工作参数，例如可以包括充电电流、充电电压、温度等。充电编程器 14的线圈将通过无线通信方式与感应线圈15进行通信以读取这些参数。对于采集充电电流，可以在电源12与测试板16之间设置电流表17来测量充电电流，之后计算机13可以将该数据与通过无线通信传出的被测电路板10自带电流传感器的充电电流对照，这些工作参数将作为测试结果用来判断被测电路板10是否合格可靠。在非充电状态，即被测电路板10进行治疗测试的阶段，电流表17可以用于电源供电功耗测试数据的读取。
本发明实施例提供的测试系统利用电源(电池模拟器)模拟植入设备的电池，利用充电编程器模拟体外充电设备，利用感应线圈模拟植入设备的线圈，利用测试板模拟被测电路板的外围电路，使被测电路板处于实际工作环境下，同时利用移位工装来改变充电编程器线圈与感应线圈的相对位置，以模拟用户在实际使用过程中可能出现的充电操作，通过计算机控制充电过程并读取被测电路板的工作参数，该系统对植入设备的电路板进行针对性较强的测试，整个测试过程实现自动化操作，具有较高的工作效率。
作为一个优选的实施方式，本实施例中的计算机13还可以读取充电编程器14的工作参数，并根据被测电路板10的工作参数和充电编程器14的工作参数计算充电效率。充电效率＝被测电路板10的充电电流*被测电路板10的电压/(充电编程器电压*充电编程器电流)。
被测电路板10的充电电流和电压可以由被测电路板10自身采样，充电编程器14的电压和电流可以由充电编程器采样，充电效率也可以由充电编程器14进行计算后发送给计算机13。
本发明的另一个实施例提供一种用于检测植入医疗仪器电路板的系统，在前一实施例的基础上，本实施例的移位工装11上还设有磁铁。植入设备通常设有用于复位的电磁开关，用户可以通过磁铁来触发此开关实现相应控制，本实施例中的磁铁则用于检测被测电路板10的复位功能，计算机13可以控制移位工装11变化磁铁与被测电路板10的相对位置，并检测被测 电路板10上的电磁开关的工作状态。
作为本发明的优选实施例，本实施例的移位工装11要控制两组装置的位置变化，即磁铁与被测电路板10的相对位置、充电编程器14线圈与感应线圈15的相对位置。为此，本实施例提供了一种优选的移位工装11结构，如图2和图3所示，移位工装11包括：Y轴导轨A，X轴导轨B，平移台111，感应线圈工装112，充电编程器线圈工装113，磁铁工装114，测试板平台115。X轴导轨B可移动地设置在Y轴导轨A上并受Y轴导轨A驱动，X轴导轨B与Y轴导轨A交叉垂直布置，平移台111可移动地设置在X轴导轨B上并受X轴导轨B驱动，感应线圈工装112和磁铁工装114固定安装在平移台111上，且感应线圈工装112与磁铁工装114在平移台111上正交布置。充电编程器线圈工装113位于所述X轴导轨B一端且与所述X轴导轨B相对固定设置；测试板平台115位于所述Y轴导轨A一端且与所述Y轴导轨A相对固定设置。
感应线圈工装112是用来安装感应线圈的，充电编程器线圈工装113是用来安装充电编程器的线圈的。感应线圈工装112和充电编程器线圈工装113能够实现感应线圈和充电编程器的可拆卸安装。
在本实施例的移位工装11中，充电编程器14的线圈安装于充电编程器线圈工装113中，感应线圈15安装在感应线圈工装112中。为了适应不同类型产品的测试，增强移位工装11的通用性，充电编程器线圈工装和感应线圈工装1采用统一的固定和接线方式，在进行不同产品测试时，只需更换带有充电编程器线圈工装和感应线圈工装即可。
本实施例的移位工装11中，充电编程器线圈工装113和充电编程器14的线圈固定安装在在X轴导轨B的一端；与充电编程器14的线圈相对应的是可移动地设置在所述X轴导轨B上的平移台111，平移台111上设有与充电编程器14的线圈对准的感应线圈工装112，感应线圈15安装在感应线圈工装112上，平移台111还设有与感应线圈工装正交布置的磁铁工装114 及安装在磁铁工装114上的磁铁，平移台111受X轴导轨B控制运动，平移台111移动时带动感应线圈和磁铁一起移动。本实施例的移位工装11中，Y轴导轨A的一端设有测试板平台115，测试平台上设有测试板16；X轴导轨B垂直布置于Y轴导轨A上，X轴导轨B以及安装在X轴导轨B上的所有结构均受Y轴导轨A控制运动。本实施例的移位工装11中，Y轴导轨A与X轴导轨B的运动控制是可以独立进行的。
为了满足通信测试需求并保证了测试过程中的通信稳定，本实施例的移位工装11中，感应线圈15与充电编程器14的线圈对准情况不受平移台111运动的影响；感应线圈15与充电编程器14的线圈相对距离受X轴导轨B控制，随平移台111的运动而变化。
一种可替代的方式，如图4所示，充电编程器线圈工装还可以设置在平移台上，随平移台的移动而移动，而将感应线圈工装固定设置在X轴导轨的一端，即将本实施例中感应线圈工装和充电编程器工装互换下位置。
为了满足被测电路10的复位功能检测并增强移位工装11的通用性，本实施例中的移位工装11，能够实现磁铁与被测电路板10的相对位置调节。在本实施例的移位工装11中，磁铁安装在磁铁工装114上，磁铁在磁铁工装114上的位置可调节。Y轴导轨A的一端设有测试板平台115，测试平台上设有测试板16，测试板16上安装有被测电路板10。在移位平台11中，磁铁工装114和X轴导轨B能够调节磁铁与被测电路板10上电磁开关的对准情况，Y轴导轨A控制X轴导轨B运动实现磁铁与被测电路板10的相对距离调节。
本实施例的移位工装的平移台111上设有正交布置的第二安装架1111和第一安装架1112，感应线圈工装112可拆卸地安装于第二安装架1111上，磁铁工装114可拆卸地安装于第一安装架1112上，为了确保在磁铁功能测试时，X轴导轨B上的磁铁能够与被测电路板10上的电磁开关对准，磁铁工装114包括滑动架1141和滑块1142，滑动架1141通过设置在第一安装 架1112上的竖向滑轨可上下滑动地安装在第一安装架1112上，滑动架1141上设有沿X轴方向的水平滑轨，滑块1142通过水平滑轨可左右水平滑动地安装于滑动架1141上，滑块1142上设有用于安装磁铁的磁铁安装部1142a，这样，在磁铁功能测试时磁铁可相对被测电路板上下左右移动进行调整以确保对准被测电路板上的电磁开关。由于感应线圈工装112和磁铁工装114都设置在平移台111上，为了避免感应线圈受到磁铁工装114的干扰，本实施例的感应线圈工装112的中心距离磁铁工装114上磁铁安装部1142a的中心距离不小于5cm。
此外，本实施例的移位工装还设有用于将所述滑动架1141锁定在所述第一安装架1112上的第一锁定结构和用于将所述滑块锁定在所述滑动架1141上的第二锁定结构，当磁铁与被测电路板的电磁开关对准后通过第一锁定结构和第二锁定结构锁定磁铁位置，所述第一锁定结构和第二锁定结构优选为紧固件。
本实施例的移位工装除包含上述部件外，还包括工装底座116，所述X轴导轨B、所述Y轴导轨A、充电编程器线圈工装113和测试板平台115均固定设置在所述工装底座116上。
以下结合附图对使用本实施例的移位工装涉及到的测试功能进行介绍，如图2和图3所示：
一、通信功能：
控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离，进行通信距离测试。
二、磁铁控制功能：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行磁铁控制测试；
b控制平移台111沿X轴导轨B运动，使平移台111上的磁铁对准被测电路板上的电磁开关；控制X轴导轨B沿所述Y轴导轨A运动，使磁铁 靠近被测电路板上的电磁开关；
c控制X轴导轨B沿Y轴导轨A运动，使磁铁远离被测电路板上的电磁开关；
d充电编程器线圈与感应线圈通信，读取测试结果。
三、硬件复位功能：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行硬件复位测试；
b控制平移台111沿X轴导轨B运动，使感应线圈靠近充电编程器线圈，使磁铁对准被测电路板上的电磁开关；
c控制X轴导轨B沿Y轴导轨A运动，使磁铁靠近被测电路板上的电磁开关；
d等待一段时间；
e控制X轴导轨B沿Y轴导轨A运动，使磁铁远离被测电路板上的电磁开关；控制平移台111沿X轴导轨B运动，使感应线圈远离充电编程器线圈，回到初始位置。
f充电编程器线圈与感应线圈通信，读取测试结果。
四、充电距离：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行磁铁控制测试；
b根据测试需求，控制平移台111沿X轴导轨B运动，使得充电编程器线圈与感应线圈的距离分别达到0cm,1cm,2cm，直至10cm；
c在不同距离情况下，进行充电并返回测试结果。
移位工装11对上述相对位置的控制可以是独立进行的，例如可以是由设置在移位工装11中的控制器单独进行控制。而为了提高整体便利性，本实施例采用计算机13对移位工装11进行控制，即本实施例中的计算机13还用于在充电或者通信过程中控制移位工装11变化感应线圈15与充电编 程器14线圈的相对位置。
本发明的实现并不限于上述优选实施例，还包括其他实施例，例如图4和图5所示，该移位工装与上述优选实施例的移位工装的区别在于：该移位工装的测试板及被测电路板固定设置在平移台的感应线圈112的一侧，磁铁工装于所述Y轴导轨一端且相对所述Y轴导轨固定设置。将测试板与感应线圈设置在平移台上的好处在于两者之间的连线不会随着平移台的运动而动，进一步地保证了测试的稳定性和准确性。
具体地，该移位工装的测试板及被测电路板也设置在所述平移台上，所述测试板位于同处于平移台上的充电编程器的线圈或感应线圈的一侧，且被测电路板与该充电编程器的线圈或感应线圈呈正交设置；磁铁工装，包括设于所述Y轴导轨一端且相对所述Y轴导轨固定设置的第二固定台118以及可移动地设置在所述第二固定台118上的磁铁位置调节机构，磁铁安装于所述磁铁调节机构上，通过所述磁铁调节机构能够调节所述磁铁的位置以使所述磁铁与所述被测电路板对准及调节两者之间的距离。
进一步地，所述磁铁位置调节机构包括滑动台119、第一安装架和滑动架，其中滑动台119可沿X轴方向滑动地设置在所述第二固定台118上，第一安装架固定在所述滑动台119并朝向被测电路板一侧设置，滑动架可上下滑动地安装在所述第一安装架朝向所述被测电路板一侧的板面上，所述磁铁固定安装在所述第一滑动架远离所述充电编程器的线圈或感应线圈的一端。通过上述磁铁位置调节机构的设置，磁铁可相对被测电路板在X轴方向、Y轴方向以及上下的高度方向进行位置调整，从而实现测试时所需的对准或远离操作。
再进一步，所述滑动架上还设有可沿X轴方向滑动地滑块，所述滑块上设有用于安装所述磁铁的磁铁安装部。通过滑块也可以对磁铁X轴方向进行位置调整。
以下结合附图对使用该替换实施例的移位工装涉及到的测试功能进行 介绍，如图4和图5所示：
一、通信功能：
控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离，进行通信距离测试。
二、磁铁控制功能：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行磁铁控制测试；
b控制滑动台119在第二固定台118上沿X轴方向运动，使磁铁对准平移台上的被测电路板上的电磁开关；控制X轴导轨B沿所述Y轴导轨A运动，使被测电路板的电磁开关靠近磁铁；
c控制X轴导轨B沿Y轴导轨A运动，使被测电路板的电磁开关远离磁铁；
d充电编程器线圈与感应线圈通信，读取测试结果。
三、硬件复位功能：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行硬件复位测试；
b控制平移台111沿X轴导轨B运动，使感应线圈靠近充电编程器线圈，并控制滑动台119在第二固定台118上沿X轴方向运动，使磁铁对准被测电路板上的电磁开关；
c控制X轴导轨B沿Y轴导轨A运动，使磁铁靠近被测电路板上的电磁开关；
d等待一段时间；
e控制X轴导轨B沿Y轴导轨A运动，使被测电路板上的电磁开关远离磁铁；控制平移台111沿X轴导轨B运动，使感应线圈远离充电编程器线圈，回到初始位置。
f充电编程器线圈与感应线圈通信，读取测试结果。
四、充电距离：
a控制平移台111沿X轴导轨B运动，调节充电编程器线圈与感应线圈的距离,实现通信，确认进行磁铁控制测试；
b根据测试需求，控制平移台111沿X轴导轨B运动，使得充电编程器线圈与感应线圈的距离分别达到0cm,1cm,2cm……直至10cm；
c在不同距离情况下，进行充电并返回测试结果。
移位工装11对上述相对位置的控制可以是独立进行的，例如可以是由设置在移位工装11中的控制器单独进行控制。而为了提高整体便利性，本实施例采用计算机13对移位工装11进行控制，即本实施例中的计算机13还用于在充电或者通信过程中控制移位工装11变化感应线圈15与充电编程器14线圈的相对位置。
需要说明的是，使用本实施例的移位工装，被测电路板10与操作者的相对位置便于操作者双手从金手指插座中插拔被测电路板。磁铁放置在平移台上的磁铁工装内，平移台沿Y轴可调节被测电路板和磁铁的距离，磁铁在测试硬件复位功能的时候靠近磁铁在0-2cm，测试其余项目的时候保持距离在8cm以上，以避免磁铁对被测电路板上的干簧开关产生非预期的作用。充电编程器的线圈放置在平移台上的充电编程器线圈工装内，感应线圈置于X轴导轨的尾部固定端，平移台沿X轴可调节充电编程器的线圈和感应线圈的距离，以满足通信距离(0-5cm)，充电距离(0-2cm)的测试。硬件复位功能需要X轴和Y轴配合，当测试硬件复位功能时，被测电路板与磁铁距离调到0-2cm，充电编程器的线圈与感应线圈的距离调到0-5cm。磁铁与充电编程器线圈均位于置于平移台99的工装上，相互之间距离不小于5cm。充电编程器的线圈和感应线圈必须同步移动，始终保持中心轴对中。被测电路板与磁铁始终保持8cm以上距离，只有在硬件复位和磁铁功能测试的时候靠近。
为了更加全面地检测电路板的性能，本实施例还对被测电路板10的输 出信号进行采集。本实施例中的电源12还用于向充电编程器14、测试板16和被测电路板10提供电能，以使被测电路根据测试板16提供的负载板输出波形信号，例如是电脉冲刺激信号。
相应地，本系统还包括采集卡18，用于采集被测电路板10输出的波形信号，计算机13通过采集卡获取被测电路板10输出的波形信号。
计算机13还可以通过充电编程器14和感应线圈15设置被测电路板的输出参数。计算机13控制充电编程器通过无线通信的方式，对被测电路板10进行编程，根据测试需求例如可以设置被测电路板10的脉冲输出幅值和频率等。
对输出波形的测试、对充电过程的测试、对复位功能的测试可以以任一顺序先后进行，这些检测操作并不冲突。
本领域技术人员可以理解，厂商提供的植入设备的种类和型号也通常有多种，例如有脑起搏器、脊髓刺激器等。为了使本发明提供的检测系统能够检测来自不同植入设备的电路板，作为一个优选的实施方式，本实施例中的充电编程器14还用于通过感应线圈15读取被测电路板10的固有信息，计算机13可根据该固有信息确定用于控制测试板16上的元件的信号。由此可以向不同型号的电路板提供合适的负载信号，使本系统具有较好的扩展性。
上述读取固有信息的过程应当在检测开始之前进行，综合上述检测功能，本发明实施例还提供一种检测方法，该方法由上述计算机13执行，如图6所示，该方法包括如下步骤：
S1，通过充电编程器14获取植入设备的被测电路板10的固有信息，该信息可以记录在被测电路板10中，也可以记录在充电编程器14中，具体可以是类型信息、型号信息等等；
S2A，根据固有信息确定距离值和充电参数，此距离值表示的是充电编程器14线圈与感应线圈15间的距离；充电参数例如可以是充电电流。在 进行测试之前，可以将各个固有信息及其对应的测试方案(包括距离值和充电参数)存储在计算机13中，在检测开始后测试板16与被测电路板10连接时，计算机13即可获取到固有信息，并查询与其相应的测试方案(包括距离值和充电参数)。
S3A，将充电参数发送至充电编程器14和被测电路板10。本实施例中的充电参数包括适用于充电编程器14的电能输出参数和适用于被测电路板10的电能接收参数。这些充电参数例如可以指定充电编程器14以某一个或多个充电电流输出电能，相应地还可以指定被测电路板10切换合适的电阻参数以适应该充电电流的大小。如上所述，计算机13连接的是测试板16，该充电参数可以通过测试板16传递给被测电路板10。
S4A，根据距离值控制移动工装11调整充电编程器14的线圈与感应线圈15间的距离，计算机13将电源12设置成被充电状态，并控制充电编程器14通过感应线圈15和被测电路板10基于充电参数对电源12进线充电。此步骤可以有多种具体实施方式，例如上述距离值可以设置一个或多个，也即可以使二者在一个固定的或者多个不同距离上进行无线充电；在各个距离上，相应的充电参数也可以设置一个或多个，灵活按照产品和用户需求全面地检测充电效果。
S5A，接收被测电路板10根据充电参数反馈的工作参数，具体可以通过测试板16来读取被测电路板10上的传感器所记录的工作参数，例如可以包括充电电压、充电电流、温度值等；
对于某些工作参数，例如温度值，测试板16上也具有一些外围电路，外围电路中可以包括温度采样电阻，也即测试板16也可以同时采集充电过程中所产生的温度等工作参数，所以上述工作参数还可以包括测试板16所检测到的参数。
S6A，根据工作参数判断被测电路板10是否正常，例如可以分别判断被测电路板10的充电电压、充电电流、温度值等是否符合预期，从而确定 其状态是否正常。
本发明实施例提供的检测方法通过自动获取被测电路板的固有信息来确定相应的测试参数，向充电编程器和被测电路板发送合适的充电参数，使被测电路板处于实际工作环境下，同时利用移位工装来改变充电编程器的线圈与感应线圈的相对位置，以模拟用户在实际使用过程中可能出现的充电操作，本方法由计算机控制充电过程并读取被测电路板的工作参数，以此对植入设备的电路板进行针对性较强的检测，该检测过程实现自动化操作，具有较高的工作效率。
为了提高便利性和准确性，上述固有信息优选存储在被测电路板10中，上述步骤S1具体可以包括如下步骤：
S11，向充电编程器14发送启动信号，并等待充电编程器14通过感应线圈15与被测电路板10进行通信以获取固有信息。
S12，接收充电编程器14反馈的固有信息。
启动信号可以是简单的数字信号，充电编程器14接收到启动信号后可以通过无线方式向被测电路板10发送握手信号，该信号可以是一个波形信号；被测电路板10可以解析该握手信号并进行响应，将固有信息发送至充电编程器14，然后再发送到计算机13。
作为一个优选的实施方式，本实施例中的充电参数包括充电时间和充电电流，其中每个距离值分别对应相同的充电时间和多个充电电流。例如可以预设四个距离值X1……X4、充电时间t、充电电流A1……A4，这些参数可以形成多种组合，S4A可以包括如下步骤：
S4A1，控制移动工装11将充电编程器14与感应线圈15间分别设置在各个距离上停留相应的充电时间；
S4A2，在停留时控制充电编程器14通过感应线圈15和被测电路板10分别基于多个充电电流对电源12进行充电。
例如可以在X1距离上停留至少4*t(四个长度相同的时间段)，并在各 个时间段分别采用A1……A4进行充电，由此完成X1相应的充电动作；然后将距离调整到X2,同样停留四个长度相同的时间段，并在各个时间段分别采用A1……A4进行充电，之后在X3、X4距离采用相同的操作方式，即可完成X1……X4相应的充电动作。
S5A随S4A同步进行，计算机13实时采集上述充电过程中被测电路板10的工作参数，由此可以得到四组参数，即四种不同距离所对应的工作参数，其中每组参数中又包括与四个充电电流对应的工作参数。
上述优选的检测方案可以准确检测到不同距离下、不同充电参数下被测电路板的工作状态，由此来提高检测结果的可靠性。
为了进一步提高检测操作的可靠性和便利性，在上述步骤S1之后，还可以包括：
S1A，根据固有信息确定判据参数，此步骤可以与S2A同步进行。其中的判据参数应当与步骤S5A中所采集的工作参数相对应，例如可以包括标准充电电压、标准充电电流、温度上限值等。
在能够得到判据参数的情况下，步骤S6A可以包括如下步骤：
S6A1，将工作参数与判据参数进行比对；
S6A2，根据比对结果判断被测电路板10是否正常，例如判断工作参数与判据参数是否一致，或者二者误差是否在可接受的范围内，从而确定被测电路板10是否正常。
下面对输出波形的检测操作进行介绍。在步骤S1之后，计算机13可以控制充电编程器14通过无线通信方式对被测电路板10进行设置，例如可以设置其输出幅值和频率等，随后进行输出信号的检测过程，具体地，如图7所示，本方法还可以包括如下步骤：
S2B，根据固有信息确定负载参数和供电参数，负载参数和供电参数也可以是测试方案的一部分内容，这一步骤可以与上述步骤S2A同步进行。 各个类型或型号的产品的负载参数和供电参数不尽相同，负载参数例如是神经刺激器用1k电阻，脊髓刺激器用500欧姆电阻；供电参数例如是供电电压等。
S3B，根据供电参数控制电源12对被测电路板10供电，计算机13将电源12设置成输出电能状态，对被测电路板10供电以模拟实际工作状态；
S4B，向连接被测电路板10的测试板16发送负载参数，测试板16将根据接收到的负载参数调整自身的元件状态以模拟被测电路板10的负载，使被测电路板10在负载参数的影响下输出波形信号；
S5B，通过采集卡18获取被测电路板10输出的波形信号；
S6B，根据波形信号判断被测电路板10是否正常。
上述步骤S3B-S6B与步骤S3A-S6A隔离执行互不干扰，本方法对被测电路板10的输出信号进行全自动检测，进一步提高检测操作的全面性和便利性。
对于输出波形的判断，与步骤S1A类似地，在步骤S1之后还可以包括：
S1B，根据固有信息确定判据信号；
在此情况下步骤S6B可以包括：
S6B1，将波形信号与判据信号进行比对；
S6B2，根据比对结果判断被测电路板10是否正常，信号比对的具体方式有多种，本发明不再赘述。
除充电功能和输出信号的检测外，还可以加入检测被测电路板10复位功能的步骤，此步骤在保证电源12处于为被测电路板10进行供电的状态下进行，计算机13控制移动工装11上的磁铁靠近被测电路板10，同时通过充电编程器14检验被测电路板10是否被复位(各种参数恢复初始值)即可。
本发明实施例提供了一种计算机设备，包括：至少一个处理器；以及与至少一个处理器通信连接的存储器；其中，存储器存储有可被至少一个 处理器执行的计算机程序，计算机程序被至少一个处理器执行，以使至少一个处理器执行上述植入医疗仪器电路板检测方法。
下面结合图8，图9对本发明实施例中的测试板16及被测电路板10进行详细介绍。
本发明实施例提供了一种被测电路板10，该电路板包括基部101和被测部102，其中被测部102即为植入设备的电路板。
基部101上设有用于容纳被测部102的通孔。在本实施例中，被测部102是一种近似弧形的结构，相应地基部101中部被挖除一个适应的形状以形成通孔。
被测部102的边缘与通孔的边缘通过若干可切割部103连接，被测部102与基部101处在同一平面。为了使二者连接的比较稳固，本实施例设置了多个可切割部103，在可切割部103以外的位置留有缝隙。
基部101的一端，即图8的上部位置设有多个用于连接外部测试设备(例如上述实施例中的测试板16)的导电触片104，这些导电触片104形成金手指插头(测试板16上设置相应的金手指插座)铺设在基部101的端部。导电触片104分别通过设置在基部101以及被测部102内的导线连接被测部102上的各个连接点，导线可以通过临近的可切割部103穿过基部101和被测部102间的缝隙。
如此设置，当被测电路板10插入测试板16后，使测试板16上的元件(外围电路，如采样电阻、输出电极等)与被测部102上的连接点间形成电连接关系，测试板16提供模拟负载，提供供电，提供充电线圈和通信线圈，提供钛壳温度采样模拟电阻和电池温度采样模拟电阻给被被测部102，使被测部102产生响应。
根据本发明实施例提供的被测电路板，其基部四周包围被测部，当需要进行检测时，操作人员或机械手等设备可以夹持基部向测试设备进行插接，基部作为实际受力对象，能够对被测部起到较好的保护作用，在完成 检测后可以将被测部从基部上切除，使得整个检测过程安全和方便。
本发明实施例提供的被测电路板中的被测部102上设有充电线圈连接点105和通信天线连接点106，二者均延伸至被测部102外侧，在本实施例中二者分布在被测部102的两侧，从直线端向外延伸。为了对线圈连接点进行有效保护，通孔的面积需足够容纳被测部、充电线圈连接点105和通信线圈连接点106，通孔的形状也随天线连接点伸出的长度而设置。进一步地，充电天线连接点105和通信天线连接点106分别通过若干可切割部103与通孔的边缘连接。
为了实现对充电功能的检测，被测电路板10上与充电功能相关的连接点均需要与测试板16相连，为此本实施例中的导电触片104包括用于连接被测部上充电线圈连接点105和通信线圈连接点106的第一导电触片。结合图1所示系统，当充电编程器14通过感应线圈15充电时，测试板16所连接的充电天线和通信天线开始工作，从而使充电线圈连接点105和通信线圈连接点106接收到信号。
导电触片104还包括用于连接被测部上温度采样电阻连接点107的第二导电触片。例如第二导电触片可以包括用于连接钛金属外壳温度采样电阻连接点的导电触片和用于连接电池温度采样电阻连接点的导电触片。结合图1所示系统，当充电编程器14通过感应线圈15充电时，测试板16上的钛金属外壳温度采样电阻和电池温度采样电阻产生温度信号，并通过第二导电触片传递至被测电路板10的温度采样电阻连接点107，使得被测部上的相关元件完成对温度值的采集。
导电触片104还包括用于连接被测部上供电连接点108的第三导电触片，以使被测部102连接电源12实现供电或充电操作。
为了实现对输出波形的检测，导电触片104还包括用于连接被测部上信号输出电极连接点109的第四导电触片。在本实施例中，被测部102上设有十六个信号输出电极连接点，基部101上设有与每个电极连接点相应 的导电触片，分别与测试板16上的多个负载相连。结合图1所示系统，当电源12开始供电时，信号输出电极连接点109将输出波形信号，并传递至测试板16上的信号输出电极，最终通过采集卡18传递给计算机13。
导电触片104还包括用于写入程序的第五导电触片，主要用于给被测电路板10上的单片机写程序，当电路板焊接完成和可靠性试验后，可能写入单片机的自动测试程序是不同的，设置第五导电触片可以提高写入程序的效率。
本发明实施例提供的被测电路板的基部101的规格可以是固定的，也即一种基部101可以适用于不同产品的被测部102，对于不同产品的被测部102而言，其上设置连接点的种类可能不相同；数量可能不相同，例如输出电极连接点的数量不同。为此基部101上需要设置足够多的导电触片，以应对不同的被测部102，导电触片104的数量需要大于或等于被测部102上连接点的数量，以提高通用性，这样则不必为每一种被测部102生产不同的基部101，可以降低生产成本。
不同植入产品的电路板，金手指管腿定义相同，测试板16可以通用，即一块测试板16可以兼顾DBS(deep brain stimulation，脑深部刺激)、VNS(vagusneve stimulation，迷走神经刺激)、SCS(Spinal cord stimulation,脊髓电刺激)和SNM(Sacral Neuromodulation，骶神经刺激系统)等充电和非充电产品，通用性好，测试效率高。
相应地，本发明实施例提供了一种植入医疗仪器检测电路板，作为上述测试板16，如图9所示测试板16包括：
被测电路板连接部161，用于连接被测电路板10，在本实施例中采用金手指插座的形式与被测电路板10的金手指插头(端部排列的导电片)连接，金手指插座可以兼顾不同厚度电路板。
被测电路板外围电路162，包括多种电气元件，均为植入设备中所需的、与被测电路板10配合进行工作的元件，例如采样电阻、通信天线、输出电 极等等。这些元件通过被测电路板连接部161与被测电路板10上的连接点相连，模拟被测电路板的实际工况，确保被测电路板10正常工作。
负载单元163，用于模拟被测电路板的负载。植入设备在人体内将会承受一定的负载，不同种类和用途的植入设备的负载不相同，此单元可以设置多种负载元件以模拟不同被测电路板10所承受的负载，例如可以有神经刺激器用1k电阻，脊髓刺激器用500欧姆电阻等。
选择单元164和采集设备连接部165。采集设备连接部165通过选择单元164连接被测电路板外围电路162中的电气元件，例如可以连接输出电极。其中选择单元164的作用是控制采集设备连接部165与其连接的电气元件的连通关系，采集设备连接部165连接外部采集设备，即采集卡18，采集卡18可以获得所连通的电气元件在负载影响下发出的信号。
实际情况中，外围电路通常包括较多的电气元件，以输出电极为例，脑起搏器可能具有十余个输出电极，每一个输出电极都可以单独发出刺激信号。为了进行精确检测，检测程序在同一时间可能只会控制部分输出电极发出信号，相应地，采集设备连接部165可以通过选择单元164连接所有的输出电极，而同一时间选择单元164可以只接通其中正在输出信号的部分电极。
根据本发明实施例提供的植入医疗仪器检测电路板，可以将被测电路板和外部检测设备连接起来，并通过外围电路和负载单元使被测电路板模拟实际工作状态，同时利用选择单元控制外部设备与被检测元件的连通状态，从而获得被测电路板所控制的被检测元件发出的信号，该系统不需依赖植入设备中的其它元件，对植入医疗仪器的电路板进行针对性较强的检测，同时可以对选择单元进行灵活设置，以适应不同的检测需求，具有较高的工作效率。
作为一个优选的实施方式，如图10所示，被测电路板外围电路162包括植入医疗仪器的多个输出电极1621和植入医疗仪器的金属外壳接口1622。
选择单元164包括多个模拟开关，模拟开关分别一一对应地连接相应的输出电极1621和金属外壳接口1622，其中金属外壳接口1622的一端连接金属外壳(图10中未示出，金属外壳可以作为脉冲输出的正极)，另一端连接选择单元164的其中一个模拟开关由此，通过模拟开关的断开和闭合状态控制输出电极与采集设备连接部165的连通关系，以及控制采集设备连接部165与金属外壳的连通关系。采集设备连接部165向外部采集设备输出电极在负载影响下发出的波形信号。
在本实施例中，选择单元164设有两个开关组，采集设备连接部165上设有相应的两个接入端口Out1和Out2，各个接入端口分别通过不同的开关组连接外围电路上的电器元件，即输出电极和金属外壳接口。在本实施例中，端口Out1连接第一开关组1641的一端，第一开关组1641的另一端连接全部输出电极和金属外壳接口；端口Out2连接第二开关组1642的一端，第二开关组1642的另一端连接全部输出电极和金属外壳接口。
采集设备连接部165的两个端口Out1和Out2与被测电路板外围电路162中的十六个输出电极1621和金属外壳接口1622中的任意两个相连。第一开关组1641和第二开关组1642的状态可以通过单片机进行控制。具体而言，任意两个输出电极，通过与计算机连接接口，串口芯片和单片机，由计算机根据测试需求，实现对第一开关组1641和第二开关组1642中对应模拟开关的控制，从而实现采集卡和电极输出端的连接。
实际应用中，为了同时采集更多路的输出信号，也可以设置更多的接入端口和更多的开关组。
在一个优选地实施例中，负载单元163可以包括：
多组负载元件1631，分别用于模拟不同种类植入设备的负载；
多个模拟开关，这些模拟开关组成第三开关组1632，用于控制多组负载元件1631与采集设备连接部165以及输出电极1621的连接状态。两个端口Out1和Out2与负载的两端相连接。通过与计算机连接接口、串口芯 片和单片机，由计算机根据测试需求，实现对第三开关组1632中对应模拟开关的控制，从而实现两个端口Out1和Out2和不同负载的连接。可选负载包括DBS负载，SCS负载，VNS负载和SNM(Sacral Neuromodulation，骶神经刺激系统)负载等。
由此实现不同产品类别的负载与任意两个输出电极相连，同时被测电路板10输出波形连接到端口Out1和Out2，反馈给采集卡18进行处理。
关于测试板16的供电和充电电流的采集，可以将电源12和电流表17连接到测试板16。电源12可提供两路供电，一路是可变的电压供电10(范围为4.1V～2V)，采用电池模拟电源(充电产品做充电功能测试)，通过测试板16上的金手指插座连接被测电路板10供电；另一路是恒定电压，通过电压芯片给测试板16上的电气元件供电。
具体地，被测电路板外围电路162包括供电电路，供电电路的一端串联外部电源12和电流表17，另一端连接被测电路板10上相应的供电连接点。
在充电检测应用中，供电电路可以用于接收外部充电编程器通过被测电路板10输入的电能，并对外部电源12进行充电，电流表17可以示出充电电流。
在信号输出等其他性能检测应用中，供电电路可以用于接收外部电源12输入的电能，并对被测电路板10进行供电。
针对不同产品，可以选择被测电路板10接入不同的充电和通信天线的，例如SCS充电和通信天线和DBS充电和通信天线等。在一个优选的实施例中，被测电路板外围电路162可以包括多种通信天线和/或多种充电天线。具体可以利用计算机控制检测电路板上的单片机，由单片机设置被测电路板10连接一种通信天线和/或一种充电天线。
被测电路板外围电路还可以包括温度采样电阻，例如电池温度采样电阻和金属外壳温度采样电阻，温度采样电阻通过被测电路板连接部161连 接被测电路板10上相应的连接点。对于温度参数的采集，可以通过体外充电编程器与被测电路板10进行无线通信而获得，无需另设端口和装置连接温度采样电阻。
以上所述的具体实施例，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施例而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种有源植入式医疗仪器自动遍历测试的方法，其特征在于，包括：
    通过充电编程器获取植入设备的被测电路板的固有信息；
    根据所述固有信息确定距离值和充电参数；
    将所述充电参数发送至所述充电编程器和被测电路板；
    根据所述距离值控制移动工装调整所述充电编程器与感应线圈间的距离，并控制所述充电编程器通过所述感应线圈和被测电路板基于所述充电参数对电源进线充电；
    接收被测电路板根据所述充电参数反馈的工作参数；
    根据所述工作参数判断被测电路板是否正常。
  2. 根据权利要求1所述的方法，其特征在于，所述通过充电编程器获取植入设备的被测电路板的固有信息，包括：
    向所述充电编程器发送启动信号，并等待所述充电编程器通过所述感应线圈与被测电路板进行通信以获取所述固有信息；
    接收所述充电编程器反馈的所述固有信息。
  3. 根据权利要求1所述的方法，其特征在于，所述充电参数包括适用于所述充电编程器的电能输出参数和适用于被测电路板的电能接收参数。
  4. 根据权利要求1所述的方法，其特征在于，所述距离值设有多个，所述充电参数包括充电时间和充电电流，其中每个所述距离值分别对应相同的充电时间和多个充电电流。
  5. 根据权利要求4所述的方法，其特征在于，所述根据所述距离值控 制移动工装调整所述充电编程器与感应线圈间的距离，并控制所述充电编程器通过所述感应线圈和被测电路板基于所述充电参数对电源进线充电，包括：
    控制所述移动工装将所述充电编程器与所述感应线圈间分别设置在各个距离上停留相应的充电时间；
    在停留时控制所述充电编程器通过所述感应线圈和被测电路板分别基于多个充电电流对所述电源进行充电。
  6. 根据权利要求1所述的方法，其特征在于，在所述通过充电编程器获取植入设备的被测电路板的固有信息之后，还包括：
    根据所述固有信息确定判据参数；
    所述根据所述工作参数判断被测电路板是否正常，包括：
    将所述工作参数与所述判据参数进行比对；
    根据比对结果判断被测电路板是否正常。
  7. 根据权利要求1所述的方法，其特征在于，在所述通过充电编程器获取植入设备的被测电路板的固有信息之后，还包括：
    根据所述固有信息确定负载参数和供电参数；
    根据供电参数控制电源对被测电路板供电；
    向连接被测电路板的测试板发送所述负载参数，以使被测电路板根据所述负载参数输出波形信号；
    通过采集卡获取所述波形信号；
    根据所述波形信号判断被测电路板是否正常。
  8. 根据权利要求7所述的方法，其特征在于，在所述通过充电编程器 获取植入设备的被测电路板的固有信息之后，还包括：
    根据所述固有信息确定判据信号；
    所述根据所述波形信号判断被测电路板是否正常，包括：
    将所述波形信号与所述判据信号进行比对；
    根据比对结果判断被测电路板是否正常。
  9. 根据权利要求1所述的方法，其特征在于，在所述接收被测电路板根据所述充电参数反馈的工作参数后，还包括：
    根据所述充电编程器的充电参数和所述被测电路板反馈的工作参数计算充电效率；
    根据所述充电效率判断被测电路板是否正常。
  10. 一种计算机设备，其特征在于，包括：至少一个处理器；以及与所述至少一个处理器通信连接的存储器；其中，所述存储器存储有可被所述至少一个处理器执行的计算机程序，所述计算机程序被所述至少一个处理器执行，以使所述至少一个处理器执行权利要求1-9中任一项所述的植入医疗设备电路板检测方法。
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