WO2020019941A1 - 模塑组件、摄像模组、模塑组件拼板以及制作方法 - Google Patents

模塑组件、摄像模组、模塑组件拼板以及制作方法 Download PDF

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Publication number
WO2020019941A1
WO2020019941A1 PCT/CN2019/093886 CN2019093886W WO2020019941A1 WO 2020019941 A1 WO2020019941 A1 WO 2020019941A1 CN 2019093886 W CN2019093886 W CN 2019093886W WO 2020019941 A1 WO2020019941 A1 WO 2020019941A1
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WO
WIPO (PCT)
Prior art keywords
molding
area
pad
mounting
circuit board
Prior art date
Application number
PCT/CN2019/093886
Other languages
English (en)
French (fr)
Inventor
黄威威
梅哲文
梅其敏
赵波杰
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201821197581.2U external-priority patent/CN208798053U/zh
Priority claimed from CN201810834100.2A external-priority patent/CN110769130B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to US17/262,359 priority Critical patent/US20210289112A1/en
Priority to CN201980038827.2A priority patent/CN112740646B/zh
Priority to EP19840033.5A priority patent/EP3820135A4/en
Publication of WO2020019941A1 publication Critical patent/WO2020019941A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/004—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053—Driving means for the movement of one or more optical element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of molding, and more particularly, to a molded component, a camera module, a molded component puzzle, and a manufacturing method.
  • FF fixed-focus camera modules
  • AF automatic zoom camera modules
  • the conventional auto-zoom camera module generally achieves zooming through an actuator such as a motor, which also requires an electrical connection between the actuator and a circuit board. Therefore, the circuit board of the conventional automatic zoom camera module will specifically reserve a pad area for electrical connection with an actuator such as a motor.
  • the capacitor located on the edge of the circuit board or even the edge portion of the photosensitive chip is covered by a molded lens holder, thereby achieving the purpose of increasing the strength of the circuit board and reducing the size of the circuit board.
  • the molding process is applied to an automatic zoom camera module, the molding area needs to avoid the pad area and the molding material should not cover the pad area to ensure that the motor can be electrically connected to the circuit board.
  • a subsequent problem is that, as shown in FIG. 1, the prior art reserved pad region 11A is set to be square, that is, the corner of the molding region 12A is provided with a concave concave corner 121A that is concave at a right angle.
  • the molding fluid needs to make continuous right-angle turns to avoid at the concave top corner 121A, which leads to the situation that the molding fluid flows back and the flow velocity is uneven, which is difficult to control.
  • the boundary of the square pad region 11A blocks the molding fluid.
  • the molding channel formed between the adjacent pad regions 11A may cause incomplete injection molding due to the blocking of the pad regions 11A.
  • the molding material encapsulates electronic components such as capacitors and gold wires located on the edge of the circuit board. Molding fluid with uneven speed will impact the gold wires and capacitors, resulting in poor contact of electronic components.
  • An object of the present invention is to provide a molded component, a camera module, a molded component puzzle, and a manufacturing method, wherein compared to the design of the prior art square pad area, the molded side of a pad area has an avoidance boundary This reduces the obstruction to the flow of molding fluid.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method. Compared with the design of the prior art square pad area, the avoidance boundary causes uneven flow velocity to occur. The probability is reduced.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method thereof. Compared with the design of the prior art square pad area, the variation range of the molding fluid flow rate is reduced and reduced. Shock the electronic components such as capacitors and gold wires encapsulated by the molding fluid to avoid poor contact of the electronic components.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method.
  • the avoidance boundary allows the molding fluid to be sufficient. Inflow, thereby reducing the possibility of undesirable phenomena such as incomplete injection and reducing the defect rate.
  • Another object of the present invention is to provide a molding module, a camera module, a molding module panel and a manufacturing method, wherein a buffer flow channel communicates with the side channel of the pad area and its flow channel entrance and exit, and is a molding fluid. Circulation provides a buffer space to adapt to changes in the flow channel, making it easier to control the flow rate.
  • Another object of the present invention is to provide a molding assembly, a camera module, a molding assembly and a manufacturing method, wherein the buffer flow channel avoids continuous right-angle turning of the molding fluid and avoids the backflow of the molding fluid and the flow rate. Parity.
  • Another object of the present invention is to provide a molding module, a camera module, a molding module panel, and a manufacturing method, wherein the molding fluid flows from the buffer flow channel into the pad region side flow channel, compared with the existing In the technology, continuous right-angle turning of the molding fluid is avoided, which reduces the possibility of splashing the molding fluid, thereby avoiding the possibility of undesirable phenomena such as incomplete injection molding.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method, wherein an angle formed by the pad region on the molded side is greater than 90 ° for the soldering. The avoidance boundary of the disk area and the buffer flow path are formed.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method, in which two of the pad regions can be disposed on the same side of the molded component, or can be opposed to each other. Angled on the circuit board, it is suitable for electrically connecting different actuators.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method, wherein when two of the pad regions can be disposed on the same side of the molded component, it is convenient for molding. Plastic component production.
  • Another object of the present invention is to provide a molded component, a camera module, a molded component panel, and a manufacturing method, wherein when two of the pad regions can be disposed on the same side of the molded component, the two
  • the actuators that are required or applicable are different and are not limited to being provided on a connector setting side, or on the opposite side of the connector setting side, or on any adjacent side of the connector setting side.
  • Another object of the present invention is to provide a molding module, a camera module, a molding module puzzle, and a manufacturing method, wherein the manufacturing method is applied to an automatic zoom camera module (AF, auto focus), and the molding process is reduced. Bad rate.
  • AF automatic zoom camera module
  • the present invention further provides a molded component, including:
  • a circuit board wherein the circuit board has a molding area, a mounting area, and at least two pad areas, wherein the molding area surrounds the mounting area, and wherein the pad area is disposed on the circuit board A corner located outside the corresponding corner of the molding area for power connection to the actuator, wherein the pad area has an avoidance boundary, wherein the angle formed by the avoidance boundary is greater than 90 °; and
  • a molding section wherein the molding section covers the molding area, the molding section surrounds the mounting area, and has a light window, wherein the molding section avoids the welding along the avoidance boundary. Disk area.
  • an angle formed by the avoidance boundary of the pad region is 180 °.
  • an angle formed by the avoidance boundary of the pad region is an obtuse angle.
  • the size of the narrowest part of the molding portion is at least 0.15 mm.
  • the adjacent disk regions are arranged symmetrically.
  • At least two of the pad regions are disposed on a mounting side of the circuit board, wherein the mounting side is used for mounting a connector.
  • At least two of the pad regions are disposed on opposite sides of a mounting side of the circuit board, wherein the mounting side is for mounting a connector.
  • At least two of the pad regions are disposed on adjacent sides of a mounting side of the circuit board, wherein the mounting side is for mounting a connector.
  • the molding assembly further includes a photosensitive element, wherein the photosensitive element is mounted on the mounting area and is closedly surrounded by the molding portion, wherein the light window corresponds to the The photosensitive element forms a photosensitive path.
  • the molding portion is encapsulated in an edge portion of the photosensitive element.
  • the molding assembly further includes at least one electronic component, wherein the electronic component is operatively mounted on the molding area, and wherein the molding portion encapsulates the electronic element. Device.
  • the present invention further provides a camera module, including:
  • an actuator wherein the actuator supports the lens assembly to the molding assembly in a drivable manner so that the lens assembly corresponds to a light window of the molding assembly, wherein the actuator Operatively connected to the pad area of the circuit board.
  • the present invention also provides a molded component panel for cutting to form a plurality of molded components as described above, including:
  • a circuit board assembly wherein the circuit board assembly has a plurality of molding regions, a plurality of mounting regions, and a plurality of main pad regions, wherein the molding regions are arranged in an array on the circuit board assembly, Wherein the adjacent molding areas border, wherein the molding areas correspondingly surround the mounting area, wherein the main pad area is cut and separated to form a pad area located at a corner of the molded component, where the cut
  • the land region formed later has an avoidance boundary, wherein the angle formed by the avoidance boundary is greater than 90 °;
  • a one-piece molding section wherein the one-piece molding section covers the molding area, surrounds the mounting area, and defines a plurality of light windows.
  • the main pad area is disposed at intervals on a length side of the circuit board panel, so that the pad area formed after cutting is located at a corner of a mounting side of the obtained molded component.
  • the main pad area is disposed at a corner of a side adjacent to the molding area adjacent to the molding area, so that the pad area formed after cutting is located at the obtained molding component installation Opposite side corners.
  • the main pad region is disposed at a corner of an adjacent side of the molding region in two adjacent columns in the same group, so that the pad region formed after cutting is located in the obtained mold. Adjacent side corners of the mounting side of the plastic component.
  • the main pad area is provided at a corner adjacent to the same side of the molding area in each column, so that the pad area formed after cutting is located at the installation of the obtained molding component Adjacent side corners of the side.
  • the main pad region is provided with a corner on an adjacent side of the mounting side of the molding region in the same row, so that the main pad region is formed by dividing the main pad region after cutting.
  • the pad region is located adjacent to a mounting side of the molded component.
  • an angle formed by the avoidance boundary forming the pad region after cutting is 180 °.
  • an angle formed by the avoidance boundary forming the pad region after cutting is an obtuse angle.
  • the molding assembly jig further includes a plurality of photosensitive elements, wherein the photosensitive elements are mounted on the corresponding mounting area and are closedly surrounded by the one-piece molding portion, wherein The light window corresponds to the photosensitive element for forming a photosensitive path.
  • the one-piece molded portion is enclosed at an edge portion of the photosensitive element.
  • the molding assembly jig further includes a plurality of electronic components, wherein the electronic components are operatively disposed in the corresponding molding area, and are molded by the one-piece molding portion Encapsulation.
  • the present invention further provides a method for molding a component, including:
  • a circuit board is fixed to a lower mold, wherein the circuit board has a molding area, a mounting area, and at least two pad areas, wherein the molding area surrounds the mounting area, and the pad area is provided
  • the corner of the circuit board is located outside the corresponding corner of the molding area, wherein the pad area has an avoidance boundary, and the angle formed by the avoidance boundary is greater than 90 °;
  • FIG. 1 is a perspective view of a molded component of the prior art.
  • FIG. 2 is a top view of a molded component circuit board according to a preferred embodiment of the present invention.
  • FIG. 3 is a perspective view of the molding assembly according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 4 is a top view of a circuit board jigsaw of a molded component jigsaw according to a preferred embodiment of the present invention.
  • FIG. 5 is a perspective view of the molding assembly according to the above-mentioned preferred embodiment of the present invention, which is applicable to the production of the molding assembly according to the above-mentioned preferred embodiment.
  • Fig. 6 is a cross-sectional view taken along the A-A direction during the molding of the molding assembly according to the above-mentioned preferred embodiment of the present invention.
  • Fig. 7 is a cross-sectional view taken along the B-B direction during the molding of the molding assembly according to the above-mentioned preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of a molded component according to a first modified embodiment of the above preferred embodiment of the present invention.
  • FIG. 9 is a perspective view of a first embodiment of a molded component according to the above preferred embodiment of the present invention, which is applicable to the production of the molded component according to the first modified embodiment.
  • FIG. 10 is a perspective view of a molded component according to a second modified embodiment of the above preferred embodiment of the present invention.
  • FIG. 11 is a perspective view of a second embodiment of a molded component according to the preferred embodiment of the present invention, which is applicable to the production of the molded component according to the second modified embodiment.
  • FIG. 12 is a perspective view of another molded component panel according to a second modified embodiment of the foregoing preferred embodiment of the present invention, which is applicable to the production of the molded component described in the second modified embodiment.
  • FIG. 13 is a perspective view of another molded component panel according to a second modified embodiment of the foregoing preferred embodiment of the present invention, which is applicable to the production of the molded component according to the second modified embodiment.
  • FIG. 14 is a top view of a molded component circuit board assembly according to a second preferred embodiment of the present invention.
  • FIG. 15 is a perspective view of the molding assembly according to a second preferred embodiment of the present invention.
  • FIG. 16 is a top view of a circuit board panel of a molded module panel according to a second preferred embodiment of the present invention.
  • FIG. 17 is a perspective view of the above-mentioned molded component jigsaw according to the second preferred embodiment of the present invention, which is applicable to the production of the molded component according to the second embodiment.
  • FIG. 18 is a perspective view of a molded component according to a modified embodiment of the second preferred embodiment of the present invention.
  • FIG. 19 is a perspective view of a molded component panel according to a modified embodiment of the second preferred embodiment of the present invention, which is applicable to the production of the molded component according to the modified embodiment.
  • FIG. 20 is a perspective view of a molded component according to another modification of the above-mentioned second preferred embodiment of the present invention.
  • Fig. 21 is a perspective view of a molded component panel according to another modified embodiment of the above-mentioned second preferred embodiment of the present invention, which is applicable to the production of the molded component according to the another modified embodiment.
  • FIG. 22 is a perspective view of another molded component panel according to another modified embodiment of the second preferred embodiment of the present invention, which is applicable to the production of the molded component according to the another modified embodiment.
  • FIG. 23 is a perspective view of another molded component panel according to another modified embodiment of the second preferred embodiment of the present invention, which is applicable to the production of the molded component according to the another modified embodiment.
  • FIG. 24 is a perspective view of an automatic zoom camera module according to an embodiment of the present invention.
  • FIG. 25 is a cross-sectional view of an automatic zoom camera module according to the above embodiment of the present invention.
  • FIG. 26 is a cross-sectional view of an automatic zoom camera module according to another embodiment of the present invention.
  • the present invention provides a molded component, a camera module, and a molded component puzzle.
  • the pad area is redesigned to reduce the automatic zoom camera module ( AF, auto focus).
  • FIGS 2 and 3 show a molded assembly 100 according to a preferred embodiment of the present invention.
  • the molding assembly 100 includes a circuit board 110 and a molding portion 120, wherein the molding portion 120 is integrally molded on the circuit board 110 to define a light window 130 for forming a photosensitive path.
  • the circuit board 110 has a molding area 111, a mounting area 112, and at least two pad areas 113.
  • the molding area 111 surrounds the mounting area 112, and the pad area 113 is closed. It is disposed at a corner of the circuit board 110 and is located outside the corresponding corner of the molding area 111. At least two of the pad areas 113 are respectively used to electrically connect the positive and negative poles of the actuator.
  • the present invention is described by taking the two pad regions 113 as an example, but it is not a limitation. Those skilled in the art may know that more than two of the pad regions 113 may be used and designed as required. As an example, for convenience of description and differentiation, the two pad regions 113 are respectively referred to as a first pad region 113 'and a second pad region 113 ", wherein the first pad region 113' and the first pad region 113 ' The characteristics of the two pad regions 113 ′′ can be applied to each other, which will not be repeated in the present invention.
  • the molding region 111 is covered with a molding fluid, and the molding portion 120 is formed after curing. That is, the molding portion 120 covers the molding region 111 and surrounds the mounting region 112 in a closed manner.
  • the mounting area 112 is not covered by the molding fluid, and provides space for mounting the photosensitive element 140 and / or the at least one electronic component 150.
  • the components mounted in the mounting area 112 may be different.
  • the photosensitive element 140 is electrically connected to the mounting area 112.
  • the edge region is located in the molding region 111, so that the cured molding part 120 is molded on the edge region of the photosensitive element 140.
  • the photosensitive element 140 is electrically attached to the photosensitive element 140.
  • the mounting area 112 and the electronic component 150 are mounted on the molding area 111, so that the molded part 120 encapsulates the electronic component 150 after curing.
  • the first pad region 113 ′ and the second pad region 113 ′′ are mirror-symmetrical and are not covered by the molding fluid, forming a first soldering space 160 ′ and a second pad region 160 ′′ for An actuator such as a motor is electrically connected, thereby assembling and manufacturing an automatic zoom camera module. That is, during molding, a molding fluid prevents the first pad region 113 ', the second pad region 113 ", and the mounting region 112 from flowing to form the molding portion 120.
  • the mold The outer corners of the plastic part 120 are formed with the first soldering space 160 ′ and the second land area 160 ′′ corresponding to the first land area 113 ′ and the second land area 113 ′′, respectively.
  • the first pad region 113 ′ and the second pad region 113 ′′ are implemented as triangles.
  • the first soldering space 160 ′ and the first A two-pad region 160 ′′ extends upward from the circuit board 110, as shown in FIGS. 2 and 3.
  • the first pad region 113 ′ of the triangle has two first outer sides 1131 ′, 1132 ′ and a first avoidance boundary side 1133 ′, wherein the first outer sides 1131 ′, 1132 ′ and the first An avoidance demarcation edge 1133 'meets end to end to form the first pad region 113'. Since the first pad region 113 'is disposed at a corner of the circuit board 110, the two first outer edges 1131', 1132 'are implemented as adjacent edges of the top corner of the circuit board 110.
  • the first avoidance demarcation edge 1133 ' coincides with the boundary of the molding area 111, that is, the first pad area 113' is formed on the molding side (the side in contact with the molding area 111).
  • the first avoidance boundary 1133 ′ separates and delimits the first pad region 113 ′ and the molding region 111.
  • the second pad region 113 "of the triangle is composed of two second outer edges 1131", 1132 "and a second avoidance dividing edge 1133", wherein two of the second outer edges 1131 ", 1132” is implemented as the adjacent edge of the top corner of the circuit board 110, wherein the second avoidance boundary edge 1133 "is also a part of the boundary of the molding area 111, and is used to separate and define the second solder
  • the second avoidance boundary 1133 is also located on the molding side of the second pad region 113" and is in contact with the molding region 111.
  • the angle formed by the first avoidance boundary edge 1133 'and the second avoidance boundary edge 1133 is greater than 90 °.
  • the angle formed by the side 1133 ′′ is 180 °, that is, it is implemented as a straight line, so that it is formed obliquely at the corresponding corner of the circuit board 110.
  • the molding fluid needs to avoid the first pad region 113 'along the inclined avoidance boundary edge 1133' and flow in the region defined by the molding region 111.
  • the inclined first avoidance boundary edge 1133 'and the second avoidance boundary edge 1133 "have less resistance to the molding fluid, reduce the obstacle to the flow of the molding fluid, and the molding fluid can Full inflow.
  • the increase of the flow rate of the molding fluid is reduced, and the uneven flow rate is reduced.
  • the molding fluid needs to pass through the electronic component 150,
  • the variation range is reduced, and the impact on the encapsulated capacitors and gold wires and other electronic components 150 is reduced, so as to avoid the poor contact of the electronic components 150 and the like.
  • the corresponding flow channel formed during molding is not a sudden change in the size of the continuous right-angle, but corresponds to the first avoidance boundary edge 1133 'and the second avoidance boundary edge 1133 ", respectively.
  • the minimum distance between the first avoidance boundary edge 1133 'and the second avoidance boundary edge 1133 "and the inner edge 1111 of the molding area 111 is the same in the same area.
  • the specific explanation is consistent with the basic common sense of mathematics.
  • the boundary of the square pad area constitutes a right-angled protrusion.
  • the triangular first pad area 113 ' will The convex right-angle regions are scattered, so the first inner edge vertex point 11111 is perpendicular to the first avoidance boundary edge 1133 ′ at a larger distance.
  • the triangle-shaped first pad region 113 ′ and the second pad region 113 ′′ are formed on a mounting side of a connector 114, respectively. It is disposed at two corners of the mounting side of the connector 114.
  • the first pad region 113 'and the second pad region 113 are located on the same side.
  • the first pad region 113' and the second pad region 113" A pad-side side flow channel is formed therebetween. Molding fluid entering and exiting the side flow channel of the pad area needs to avoid the first pad area 113 'and the second pad area 113 "on both sides, respectively.
  • the first avoidance dividing edge 1133' and The existence of the second avoidance demarcation edge 1133 "makes the restriction of the molding fluid in and out of the flow path on the pad region side lower than that in the prior art, so that the surface formed on the flow path on the pad region side is restricted.
  • the molding part 120 has a poor injection molding.
  • the design of the present invention adapts to the miniaturization trend of the camera module, it does not affect the molding process and the formation of the molding portion.
  • the size of the runner is reduced, or the size of the narrowest part of the molding part reaches the purpose of miniaturization, but this will affect the flow of molding fluid into and out of the pad region side flow path, and affect the formation of the molding part.
  • the present invention can meet the miniaturization trend of the camera module without affecting the molding process and the formation of the molding portion.
  • the size of the side channel of the pad area or the molding part is the narrowest at 0.1 mm, which affects the flow of molding materials.
  • the design of the present invention can make the narrowest dimension of the molding part be 0.15 mm, and even if the size of the narrowest part of the molding part is increased, it will not affect the overall miniaturization.
  • the molding assembly 200 of a preferred embodiment can be manufactured and cut to form the molding assembly. 100.
  • the molding assembly 200 includes a circuit board assembly 210 and a conjoined molding section 220, wherein the conjoined molding section 220 is integrally formed on the circuit board assembly 210 through a molding process.
  • the circuit board assembly 210 has a plurality of molding regions 111, a plurality of mounting regions 112, and a plurality of main pad regions 211.
  • the molding regions 111 are arranged in an array on the circuit board assembly 210.
  • the adjacent molding regions 111 border each other, wherein the molding regions 111 surround the mounting region 112 correspondingly, and the main pad region 211 of the triangle is disposed on the circuit board corresponding to the molding region 111.
  • Two length sides of the jigsaw 210 Two length sides of the jigsaw 210.
  • the molding area 111 is covered by a molding fluid, and since the adjacent molding areas 111 are bordered, when the molding fluid covers all the molding areas 111, it is cured to form the one-piece mold. ⁇ ⁇ 220 ⁇ The plastic part 220. That is, the one-piece molding portion 220 covers all the molding regions 111.
  • the mounting area 112 is not covered by the molding fluid, and the one-piece molded part 220 formed around the mounting area 112 is formed.
  • the photosensitive chip 140 is mounted on the mounting area 112, and the conjoined molding part 220 defines a light window 130 corresponding to the photosensitive chip 140 for forming a photosensitive path.
  • the circuit board assembly 210 includes a plurality of connectors 114, wherein the connectors 114 are correspondingly disposed on two opposite sides of the circuit board assembly 210 and are electrically connected to corresponding areas.
  • the two opposite installation sides of the connector 114 are described as the length of the circuit board assembly 210, and the two opposite sides where the connector 114 is not installed are described as wide, which is not a limitation.
  • the direction along the long extension of the circuit board assembly 210 is the length direction
  • the direction along the wide extension of the circuit board assembly 210 is the width direction.
  • the elements are arranged in a row along the length direction and in a column along the width direction. This is only for convenience of explanation and is not a limitation.
  • the main pad region 211 is formed on the length side of the circuit board assembly 210 and the corresponding mounting region of the molding region 111 One side of the corner of the connector 114 is outside the corner for cutting to form the pad region 113 located at the corner of the mounting side of the molding region 111.
  • the main pad areas 211 located at the two width ends of the molded assembly panel 200 are right-angled triangles, while the other main pad areas 211 are isosceles triangles, separated by widthwise cutting , Forming the pad regions 113 of two right triangles.
  • the molding fluid After the molding fluid is injected from a width end of the molding assembly panel 200, the molding fluid circulates along the longitudinal flow path and the width flow path defined by the molding area 111.
  • the molding fluid is evacuated along the avoidance boundary of the main pad region 211 (the edge that is in contact with the molding region 111), since the avoidance boundary is inclined, the resistance to the molding fluid is small.
  • the molding fluid can be filled sufficiently, which reduces the situation of incomplete injection molding in the jigsaw process and improves the overall yield.
  • a mold 300 used for making the molding assembly 200 includes an upper mold 310 and a lower mold 320, and the upper mold 310 and the lower mold 320 are closed to define a mold.
  • the molding part of the mold 300 is the same as a conventional mold, except that the bottom surface of the mold 310 of the present invention is in contact with the main pad region 211 to prevent the main pad region 211 from being covered and Molding, thereby forming the welding space.
  • the circuit board assembly 210 is fixed to the lower mold 320, wherein the upper mold 310 and the lower mold 320 are closed, and the molding space 330 defined by the two corresponds to the molding.
  • the one-piece molded part 220 formed on the circuit board assembly 210 at least integrally is formed after the molding material in a fluid state is cured.
  • a pressing edge is reserved at the periphery of the circuit board jigsaw 210 for the upper mold 310 to be pressed to seal the molding space 330 to prevent leakage of the molding material.
  • the reserved pressing edge can be removed by cutting to reduce the overall volume.
  • the pressing edge on the connection side may not be cut because it is connected to the connector, as shown in the drawings such as FIG. 3 and FIG. 8. That is, when the pad area of the molded component is located on the connection side, a pressing edge is not covered between the two pad areas.
  • the upper mold 310 further includes a plurality of first protrusions 311 corresponding to the mounting area 112 and a plurality of second protrusions 312 corresponding to the main pad area 211, wherein the first protrusions
  • the portion 311 and the second convex portion 312 are convexly formed by a bottom surface of the upper mold 310.
  • the formation and size of the second raised portion 312 correspond to the shape and size of the main pad region 211, so as to cover the main pad region 211 and prevent the molding fluid from covering the main pad region 211.
  • the cross section of the second raised portion 312 is implemented as a triangle corresponding to the main pad region 211.
  • the first raised portion 311 covers the mounting area 112, prevents the molding material from contaminating the photosensitive element 140, and forms a plurality of light windows 130.
  • the photosensitive element 140 and the electronic component 150 may be installed first and then molded, and the bottom surface of the first protrusion 311 is abutted against the surface of the photosensitive element 140; in the MOB process, the The photosensitive element 140 and the electronic component 150 are mounted, and the bottom surface of the first protruding portion 311 is abutted against the surface of the circuit board corresponding to the mounting area 112, which is merely an example and is not limited herein.
  • the sizes of the first protruding portion 311 and the second protruding portion 312 are gradually reduced from top to bottom, thereby reducing draft resistance.
  • the size of the light window 130 gradually decreases from top to bottom; the size of the soldering space corresponding to the main pad region 211 gradually decreases from top to bottom.
  • the molding assembly 200 is cut along a preset cutting line to form a plurality of the molding assemblies 100 of the above-mentioned preferred embodiments.
  • the circuit board assembly 210 is cut to form a plurality of circuit boards 110, the molding areas 111 are separated from each other, and the corresponding one-piece molding portion 220 is cut to form the molding portion 120.
  • the main pad region 211 is separated to form the pad region 113, which is located at a corner on the mounting side of the molding assembly 100.
  • the first pad of the triangle is The region 113 ′ A and the second pad region 113 ′′ A are disposed at opposite corners of the mounting side, instead of the mounting side where the connector 114A is mounted.
  • the main pad region 211A is disposed adjacent to the molding in the same column.
  • the corner of the side where the region 111A meets, so that the first pad region 113'A and the second pad region 113 "A formed by separating the main pad region 211A after cutting are provided in the molding Opposite the mounting side of the module 100A.
  • the main pad region 211A located at both width ends of the molding assembly panel 200A is implemented as a triangle, it is separated into Two copies, the other main pad area 211A located in the middle area are implemented as squares, and cut into four portions after cutting in the length and width directions, which are located at the corners of the corresponding molding component 100A.
  • the cross section of the first convex portion 311 located in the middle area is square.
  • the cross section of the first convex portion 311 located in the middle area is square.
  • the difference from the preferred embodiment is that, in the molding assembly 100B, the triangular first pads The region 113'B and the second pad region 113 "B are disposed on adjacent sides of the mounting side, instead of the mounting side on which the connector 114B is mounted.
  • the main pad region 211B is provided with the molding region 111B in the same row. Adjacent corners of the mounting side are provided so that the first pad region 113'B and the second pad region 113 "B formed by separating the main pad region 211B after cutting are provided at The mounting component 100B is adjacent to the mounting side. At this time, the pad areas obtained after cutting the molding area 111B in the same row are located at the same position, for example, all are located in the molding area 111B. The adjacent left side of the mounting side, or both of the adjacent right sides of the mounting side of the molding area 111B.
  • the molding assembly 200B may be designed in various ways. As shown in FIG. 13, the molding areas 111B of two adjacent columns are used as a group, and the main pad areas 211B are disposed on adjacent sides of the molding areas 111B of two adjacent columns in the same group.
  • the main pad region 211B of the molded component 100B obtained from the same group is located on the opposite side of the mounting side, that is, two on the left side of the mounting side and the other two on the mounting side. On the right.
  • the mold 300 corresponding to the main pad region 211B, except that the cross section of the first protruding portion 311 located at both length ends of the upper mold 310 is triangular, the other located in the middle region
  • the cross section of the first raised portion 311 is square, and corresponds to the size and shape of the main pad region 211.
  • the main pad region 211B is provided with corners on the same column side of the molding region 111B of each column, for example, are disposed on the left column side of the molding region 111B of each column.
  • the main pad region 211B of the molding module 100B obtained by cutting the molding region 111B in the same row is located on the same adjacent side of the mounting side, and the molding regions 111B in two adjacent rows are The main pad region 211B of the molded component 100B obtained after the cutting is located on the opposite side of the mounting side.
  • the cross-sections of the first protrusions 311 at the two length ends of the upper mold 310 are triangular, and the cross-sections of the other first protrusions 311 in the middle region are first-class.
  • the waist triangle corresponds to the size and shape of the main pad region 211.
  • a molding assembly 100C includes a circuit board 110C, a molding portion 120C, a photosensitive element 140C, and at least one electronic component 150C.
  • the circuit board 110C includes a connector 114C, and has a molding area 111C, a first pad area 113'C, a second pad area 113 "C, and a mounting area 112C.
  • the first pad area 113'C is formed by two first outer boundaries 1131'C, 1132'C and a first avoidance boundary edge 1133'C.
  • the second pad area 113 "C is formed by two first outer boundaries 1131" C. , 1132 "C and a second avoidance boundary edge 1133" C are first connected.
  • the first pad region 113'C is implemented as a trapezoid, wherein the first pad region 113'C is on the molding side (and the contact side with the molding region 111C) ) Forms an angle greater than 90 ° and less than 180 °. That is, the oblique oblique edge 1133'C constitutes an obtuse angle. Compared with the prior art right-angle design, the oblique oblique edge of the first oblique edge 1133'C can guide the molding fluid and move the fluid. The obstacle is small, avoiding the injection molding failure caused by continuous right-angle turning of the molding fluid, reducing the failure rate.
  • the second pad region 113 "C is also implemented as a trapezoid, which is mirror-symmetric with the first pad region 113'C.
  • the second avoidance dividing edge 1133" C is formed
  • An obtuse angle, that is, an angle formed on the molding side (contacting side with the molding area 111C) is greater than 90 ° and less than 180 °.
  • the first pad region 113 ′ C and the second pad region 113 ′′ C of a trapezoid are provided on the mounting side of the molding assembly 100C.
  • a flow channel is molded between the first land region 113'C and the second land region 113 "C, and an obtuse beveled edge of the first avoidance boundary edge 1133'C and the second avoidance boundary edge 1133" C Guided in and out, compared to the right-angle design, the molding fluid is less restricted and hindered, and can be guided to complete the injection molding.
  • the molding assembly 200C includes a circuit board 210C and a conjoined molding 220C.
  • the circuit board assembly 210C includes a plurality of molding regions 111C, a plurality of main pad regions 211C, a plurality of mounting regions 112C, and a plurality of connectors 114C.
  • the main pad region 211C is implemented as a trapezoid, wherein the angle of the main pad region 211C on the molding side is obtuse. .
  • the main pad area 211C of the trapezoid is provided with corners on the mounting side of the molding area 111C, in addition to the main welding located at the two width ends of the molding assembly panel 200C
  • the disk area 211C uses a right-angled trapezoid on the edge of the circuit board, and the other main pad areas 211C located in the middle are isosceles trapezoids. After cutting in the width direction, they are separated into two right-angled trapezoids, which are respectively located in the corresponding molding areas 111C. Corner of the mounting side.
  • the position, shape, and size of the second protrusion 312 are the same as those of the molding assembly 200C.
  • the pad area 211C is adapted. That is, in the second preferred embodiment, the cross section of the second convex portion 312 is implemented as a trapezoid.
  • the cross-section of the second convex portion 312 is implemented as a right-angled trapezoid; corresponding to other ones located in the middle In the main pad region 211C, the cross section of the second protrusion 312 is implemented as an isosceles trapezoid.
  • FIG. 18 to FIG. 19 it is a modified embodiment of the second preferred embodiment.
  • the difference from the second preferred embodiment is that the first pad region 113 ′ D of the trapezoid and the The second pad region 113 ′′ D is disposed on the side opposite to the mounting side of the molding assembly 100D, instead of the mounting side on which the connector 114D is mounted.
  • the main pad region 211D is disposed adjacent to the molding in the same column.
  • the corners on the side where the region 111D meets, so that the first pad region 113'D and the second pad region 113 "D formed by separating the main pad region 211D after cutting are set in the molding Opposite the mounting side of the module 100D.
  • the main pad region 211D located at the two width ends of the molding assembly panel 200D is implemented as two right-angled trapezoids with the length direction as the axis It is spliced in a mirror image and cut into two right-angled trapezoids after cutting in the length direction.
  • the other main pad regions 211D located in the middle area are implemented as hexagons and cut into four right-angled trapezoids after cutting in the length and width directions. It is located at a corner of the corresponding molding component 100D.
  • the mold 300 in addition to the cross section of the first protruding portion 311 located at the two width ends of the upper mold 310, two right-angled trapezoids are spliced in a mirror image with the length direction as the axis, and other
  • the cross section of the first raised portion 311 is hexagonal, corresponding to the size and shape of the main pad region 211D.
  • FIG. 20 to FIG. 23 it is another modified embodiment of the second preferred embodiment.
  • the difference from the second preferred embodiment is that, in the molding assembly 100E, the first A pad region 113 ′ E and the second pad region 113 ′′ E are disposed adjacent to the mounting side, instead of the mounting side on which the connector 114E is mounted.
  • the main pad region 211E is provided with the molding region 111E in the same row. Adjacent corners of the mounting side are provided so that the first pad region 113'E and the second pad region 113 "E formed by dividing the main pad region 211E after cutting are disposed at The adjacent side of the mounting side of the molding assembly 100E is described. At this time, the setting positions of the pad regions obtained by cutting the molding region 111B in the same row are the same, for example, they are all located in the molding region 111B. Adjacent left sides of the mounting side, or adjacent right sides of the mounting side of the molding area 111B.
  • the design manner of the molded assembly panel 200E may be various. As shown in FIG. 23, two adjacent columns of the molding region 111E are used as a group, and the main pad region 211E is disposed on an adjacent side of the molding regions 111E of two adjacent columns in the same group. In the corner, the main pad region 211E located at the length end of the molding assembly 200E is implemented as two right-angled trapezoids spliced in the width direction as an axis mirror image, and cut into two parts after cutting in the width direction; The main pad region 211E in the middle region is implemented as a hexagon, and is divided into four trapezoids after being cut in the length direction and the width direction. At this time, the main pad areas 211E of the four molded components 100E obtained from the same group are located on different adjacent sides of the mounting side, that is, two on the left side of the mounting side and the other two on the mounting side. Right side.
  • the mold 300 in addition to the cross section of the first protrusion 311 located at the two length ends of the upper mold 310, two right-angled trapezoids are spliced in a mirror image with the width direction as an axis, and other
  • the cross section of the first raised portion 311 is hexagonal, corresponding to the size and shape of the main pad region 211E.
  • the main pad region 211E is provided with a corner of the same column side of the molding region 111E of each column, for example, it is provided at the left column side of the molding region 111E of each column.
  • the main pad region 211E of the molding module 100E obtained by cutting the molding region 111E in the same row is located on the same adjacent side of the mounting side, and the opposite phase of the adjacent row is located on the mounting side.
  • the cross section of the first protruding portion 311 located at both length ends of the upper mold 310 is trapezoidal, and the cross section of the other first protruding portion 311 located in the middle area is two right angles
  • the trapezoid is spliced in a mirror image with the width direction as an axis, corresponding to the size and shape of the main pad region 211E.
  • first pad region and the second pad region may also be located at opposite corners of the circuit board, so as to adapt to corresponding actuators.
  • first pad region and the second pad region may also be other polygons, such as a hexagon, an octagon, etc., as long as the angle formed by the avoidance boundary is greater than 90 °, compared with the existing 90 ° Design, less blocking of the molding fluid, and the inclined edge can guide the molding fluid and form a buffer flow channel, so that the molding fluid can be fully filled.
  • the camera module 400 to which the molded component of the above embodiment is applied according to the present invention.
  • the camera module 400 includes the molded component 100, an actuator 410, and a lens component 420, wherein the actuator 410 supports the lens component 420 to the molded component 100 in a drivable manner,
  • the lens assembly 420 corresponds to the light window 130 of the molding assembly 100.
  • the actuator 410 is operatively connected to the first pad region 113 'and the second pad region 113 "of the circuit board 110.
  • the first pad region 113' and the second pad region 113" Features such as formation, shape, and position mentioned in the above embodiments may be adopted, and are not limited at this time.
  • the camera module 400 may further include a color filter, and the color filter is directly supported on the top side of the molding component 100 through a bracket, corresponding to the light window 130.
  • the defective rate of the molding assembly 100 is reduced, and the yield of the camera module 400 is improved.
  • the present invention further provides a method for manufacturing a molded component panel, as follows:
  • Step 501 Fix a circuit board assembly to a lower mold, wherein the circuit board assembly has a plurality of molding areas, a plurality of mounting areas, and a plurality of main pad areas, and the molding areas are arranged in an array.
  • the adjacent molding areas border, wherein the main pad area is cut and separated to form a pad area located at a corner of the mold area, and the formed area after cutting is
  • the pad region has an avoidance boundary edge, wherein the angle formed by the avoidance boundary is greater than 90 °.
  • Step 502 clamping an upper mold to the lower mold, wherein the upper mold is crimped to the main pad area and the mounting area, and the upper mold and the molding area of the circuit board imposition A molding space is formed therebetween, wherein the molding space has a buffer flow channel formed along the avoidance boundary.
  • Step 503 Inject a molding material into the molding space.
  • Step 504 curing the molding material to form a one-piece molding portion covering the molding area.
  • Step 505 Install a photosensitive chip and / or at least one electronic component in the mounting area, wherein the conjoined molding part surrounds the outside of the photosensitive chip and / or at least one electronic component.
  • Step 506 Remove the upper mold and the lower mold to form the molding assembly panel.
  • the step 505 may be performed after the step 504, or may be performed before the step 501.
  • the edge region of the photosensitive chip is located in the molding area, so that the one-piece molding part of the step 504 is packaged. Sealed on the edge area of the photosensitive chip. That is, according to different process requirements, the order and position of installing the photosensitive chip and / or the at least one electronic component in step 505 are correspondingly different. It can be known that the settings and features of the main pad region in the molded component puzzle are suitable for the formation and features of the main pad region described above, and the corresponding molded components are formed after cutting.

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Abstract

模塑组件、摄像模组、模塑组件拼板以及制作方法。该模塑组件包括一线路板，其中该线路板具有一模塑区域、一安装区域和至少两焊盘区域，其中该模塑区域环绕该安装区域，其中该焊盘区域被设置于该线路板的角落，位于该模塑区域对应角落的外侧，以供电连接一致动器，其中该焊盘区域具有一避让边界，其中所述避让边界构成的角大于90；和一模塑部，其中该模塑部覆盖该模塑区域，环绕该安装区域，并具有一光窗中所述模塑部沿所述避让边界避让所述焊盘区域，以使生产时的不良率降低。

Description

模塑组件、摄像模组、模塑组件拼板以及制作方法 技术领域
本发明涉及模塑领域，更具体地涉及一模塑组件、摄像模组、模塑组件拼板以及制作方法，适用于自动变焦摄像模组，降低不良率。
背景技术
目前随着摄像模组行业的发展，市场上常见的摄像模组分为定焦摄像模组(FF，fixed focus)和自动变焦摄像模组(AF，auto focus)。常规的自动变焦摄像模组一般通过马达等致动器实现变焦，这也就需要将致动器与线路板形成电连接。所以常规的自动变焦摄像模组的线路板会专门预留焊盘区域，用于和马达等致动器电连接。
由于摄像模组行业越来越趋向于小型化发展，生产商会使用模塑工艺尽量减小摄像模组的尺寸，例如MOC工艺或MOB工艺。即通过一模塑镜座包覆位于线路板边缘的电容、甚至是感光芯片的边缘部分，从而实现增大线路板强度，减小线路板尺寸的目的。，当模塑工艺应用到自动变焦摄像模组时，模塑区域需要避让焊盘区域，避免模塑材料覆盖焊盘区域，以保障马达能够和线路板电连接。
随之而来的问题就是，如图1所示，现有技术的预留焊盘区域11A被设置为方形，也就是模塑区域12A的角落处设有呈直角地内凹的内凹顶角121A，用于契合和形成所述焊盘区域11A。对应地，模塑流体需要在所述内凹顶角121A处连续直角转弯避让，这就导致模塑流体回流、流速不均等情况，难以控制。
此外，方形的所述焊盘区域11A的边界会阻挡模塑流体。相邻所述焊盘区域11A间的形成的模塑通道，会因为所述焊盘区域11A的阻挡发生注塑不全的情况。对于MOC工艺，模塑材料包封位于线路板边缘的电容和金线等电子元器件，速度不均的模塑流体会冲击金线和电容等，造成电子元器件接触不良等状况。
发明内容
本发明的一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作 方法，其中相比于现有技术方形焊盘区域的设计，一焊盘区域的模塑侧具有避让分界边，降低了对模塑流体流通的阻碍。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中相比于现有技术方形焊盘区域的设计，所述避让边界使得流速不均等情况发生的可能性降低。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中相比于现有技术方形焊盘区域的设计，模塑流体流通速度变化幅度降低，减少对模塑流体包封的电容和金线等电子元器件冲击，避免造成电子元器件接触不良等状况。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中相比于现有技术方形焊盘区域的设计，所述避让边界使得模塑流体可以充分流入，从而降低注塑不全等不良现象发生的可能，减少不良率。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中一缓冲流道连通所述焊盘区域侧流道和其流道出入口，为模塑流体流通提供缓冲空间，适应流道的变化，从而更易控制流速。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中所述缓冲流道避免模塑流体连续直角转弯避让，从而避免模塑流体回流、流速不均等情况。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中模塑流体从所述缓冲流道流入所述焊盘区域侧流道，相比现有技术中模塑流体连续直角转弯避让，降低模塑流体喷溅的可能，从而避免注塑不全等不良现象发生的可能。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中所述焊盘区域于所述模塑侧形成的角大于90°，以供所述焊盘区域的所述避让边界和所述缓冲流道形成。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中两所述焊盘区域可以被设置于所述模塑组件的同一侧，也可以呈对角地设置于所述线路板，从而适用于电连接不同的致动器。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中当两所述焊盘区域可以被设置于所述模塑组件的同一侧时，便于模 塑组件拼板生产。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中当两所述焊盘区域可以被设置于所述模塑组件的同一侧时，可以根据需要或适用的致动器不同，被设置于一连接器设置侧，或连接器设置侧的对侧，或连接器设置侧的任一相邻侧，并不限制。
本发明的另一个目的在于提供一模塑组件、摄像模组、模塑组件拼板以及制作方法，其中所述制造方法应用于自动变焦摄像模组(AF，auto focus)，减小模塑工艺的不良率。
为了实现以上至少一个目的，依本发明的一个方面，本发明进一步提供一模塑组件，包括：
一线路板，其中所述线路板具有一模塑区域、一安装区域和至少两焊盘区域，其中所述模塑区域环绕所述安装区域，其中所述焊盘区域被设置于所述线路板的角落，位于所述模塑区域对应角落的外侧，以供电连接一致动器，其中所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；和
一模塑部，其中所述模塑部覆盖所述模塑区域，所述模塑部环绕所述安装区域，并具有一光窗，其中所述模塑部沿所述避让边界避让所述焊盘区域。
根据本发明的一个实施例，所述焊盘区域的所述避让边界构成的角为180°。
根据本发明的一个实施例，所述焊盘区域的所述避让边界构成的角为钝角。
根据本发明的一个实施例，所述模塑部的最窄部位尺寸至少为0.15mm。
根据本发明的一个实施例，相邻的所述盘区域对称地设置。
根据本发明的一个实施例，至少两所述焊盘区域被设置于所述线路板的一安装侧，其中所述安装侧供安装一连接器。
根据本发明的一个实施例，至少两所述焊盘区域被设置于所述线路板的一安装侧的对侧，其中所述安装侧供安装一连接器。
根据本发明的一个实施例，至少两所述焊盘区域被设置于所述线路板的一安装侧的相邻侧，其中所述安装侧供安装一连接器。
根据本发明的一个实施例，所述模塑组件进一步包括一感光元件，其中所述感光元件被安装于所述安装区域，被所述模塑部闭合地环绕，其中所述光窗对应于所述感光元件，形成一感光路径。
根据本发明的一个实施例，所述模塑部封装于所述感光元件的边缘部分。
根据本发明的一个实施例，所述模塑组件进一步包括至少一电子元器件，其中所述电子元器件可工作地安装于所述模塑区域，其中所述模塑部包封所述电子元器件。
依本发明的另一方面，本发明还提供一摄像模组，包括：
一如上所述的任一模塑组件；
一镜头组件；以及
一致动器，其中所述致动器以可驱动地方式支撑所述镜头组件于所述模塑组件，以使所述镜头组件对应于所述模塑组件的光窗，其中所述致动器可工作地连接于所述线路板的所述焊盘区域。
依本发明的另一方面，本发明还提供一模塑组件拼板，用于经切割形成多个如上所述的模塑组件，包括：
一线路板拼板，其中所述线路板拼板具有多个模塑区域、多个安装区域和多个主焊盘区域，其中所述模塑区域阵列地排布于所述线路板拼板，其中相邻的所述模塑区域接壤，其中所述模塑区域对应地环绕所述安装区域，其中所述主焊盘区域经切割分离形成位于该模塑组件角落的焊盘区域，其中经切割后形成的所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；和
一连体模塑部，其中所述连体模塑部覆盖所述模塑区域，环绕所述安装区域，界定多个光窗。
根据本发明的一个实施例，所述主焊盘区域被间隔地设置于所述线路板拼板的长度侧，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的角落。
根据本发明的一个实施例，所述主焊盘区域被设置于同一列中相邻所述模塑区域相接侧的角落，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的对侧角落。
根据本发明的一个实施例，所述主焊盘区域被设置于同一组中相邻两列的所述模塑区域相邻侧的角落，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的相邻侧角落。
根据本发明的一个实施例，所述主焊盘区域被设置于每一列的所述模塑区域同一侧相邻侧角落，以供切割后形成的所述焊盘区域位于所得模塑组件的安装侧的相邻侧角落。
根据本发明的一个实施例，所述主焊盘区域被设置同一行中所述模塑区域的 所述安装侧的相邻一侧角落，以供切割后所述主焊盘区域分隔形成的所述焊盘区域位于所述模塑组件的安装侧的相邻一侧。
根据本发明的一个实施例，经切割后形成所述焊盘区域的所述避让边界构成的角为180°。
根据本发明的一个实施例，经切割后形成所述焊盘区域的所述避让边界构成的角为钝角。
根据本发明的一个实施例，所述模塑组件拼板进一步包括多个感光元件，其中所述感光元件被安装于对应的所述安装区域，被所述连体模塑部闭合地环绕，其中所述光窗对应于所述感光元件，以供形成一感光路径。
根据本发明的一个实施例，所述连体模塑部包封于所述感光元件的边缘部分。
根据本发明的一个实施例，所述模塑组件拼板进一步包括多个电子元器件，其中所述电子元器件可工作地设置于对应的所述模塑区域，被所述连体模塑部包封。
根据本发明的另一方面，本发明进一步提供一模塑组件作方法，包括：
(1)固定一线路板于一下模具，其中所述线路板具有模塑区域、安装区域和至少两焊盘区域，其中所述模塑区域环绕所述安装区域，其中所述焊盘区域被设置于所述线路板的角落，位于所述模塑区域对应角落的外侧，其中所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；
(2)合模一上模具于所述下模具，其中所述上模具压合于所述焊盘区域和所述安装区域，所述上模具与所述线路板的所述模塑区域间形成一成型空间，其中所述成型空间具有一沿所述避让边界形成的缓冲流道；
(3)注入成型材料于所述成型空间；
(4)固化所述成型材料，形成覆盖所述模塑区域的一连体模塑部；
(5)移除所述上模具和所述下模具，形成所述模塑组件。
附图说明
图1是现有技术的一模塑组件立体图。
图2是根据本发明的一较佳实施例的一模塑组件线路板的俯视图。
图3是根据本发明的上述较佳实施例的所述模塑组件的立体图。
图4是根据本发明的一较佳实施例的一模塑组件拼板的线路板拼板俯视图。
图5是根据本发明的上述较佳实施例的所述模塑组件拼板的立体图，适用于上述较佳实施例所述模塑组件生产。
图6是根据本发明的上述较佳实施例的所述模塑组件拼板模塑过程中的沿A-A方向的截面图。
图7是根据本发明的上述较佳实施例的所述模塑组件拼板模塑过程中的沿B-B方向的截面图。
图8是根据本发明的上述较佳实施例的一第一变形实施例模塑组件的立体图。
图9是根据本发明的上述较佳实施例的一第一变形实施例模塑组件拼板的立体图，适用于上述第一变形实施例所述模塑组件生产。
图10是根据本发明的上述较佳实施例的一第二变形实施例模塑组件的立体图。
图11是根据本发明的上述较佳实施例的一第二变形实施例模塑组件拼板的立体图，适用于上述第二变形实施例所述模塑组件生产。
图12根据本发明的上述较佳实施例的一第二变形实施例另一种模塑组件拼板的立体图，适用于上述第二变形实施例所述模塑组件生产。
图13是根据本发明的上述较佳实施例的一第二变形实施例另一种模塑组件拼板的立体图，适用于上述第二变形实施例所述模塑组件生产。
图14是根据本发明的第二较佳实施例的一模塑组件线路板拼板的俯视图。
图15是根据本发明的第二较佳实施例的所述模塑组件的立体图。
图16是根据本发明的第二较佳实施例的一模塑组件拼板的线路板拼板俯视图。
图17是根据本发明的第二较佳实施例的上述模塑组件拼板的立体图，适用于上述第二实施例所述模塑组件生产。
图18是根据本发明的第二较佳实施例的一变形实施例模塑组件的立体图。
图19是根据本发明的上述第二较佳实施例的一变形实施例模塑组件拼板的立体图，适用于上述变形实施例所述模塑组件生产。
图20是根据本发明的上述第二较佳实施例的另一变形实施例模塑组件的立体图。
图21是根据本发明的上述第二较佳实施例的另一变形实施例模塑组件拼板 的立体图，适用于上述另一变形实施例所述模塑组件生产。
图22是根据本发明的上述第二较佳实施例的另一变形实施例另一种模塑组件拼板的立体图，适用于上述另一变形实施例所述模塑组件生产。
图23是根据本发明的上述第二较佳实施例的另一变形实施例另一种模塑组件拼板的立体图，适用于上述另一变形实施例所述模塑组件生产。
图24是根据本发明的一实施例的自动变焦摄像模组的立体图。
图25是根据本发明的上述实施例的自动变焦摄像模组的截面图。
图26是根据本发明的上述另一实施例的自动变焦摄像模组的截面图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
如图2至24所示，本发明提供一模塑组件、摄像模组和模塑组件拼板，为 了解决现有技术的缺陷，对焊盘区域重新设计，以减小自动变焦摄像模组(AF，auto focus)生产的不良率。
如图2和图3示出了本发明的一较佳实施例的一模塑组件100。所述模塑组件100包括一线路板110和一模塑部120，其中所述模塑部120一体地模塑于所述线路板110，界定一光窗130，以供形成感光路径。
具体地，所述线路板110具有一模塑区域111、一安装区域112和至少两焊盘区域113，其中所述模塑区域111闭合地环绕所述安装区域112，其中所述焊盘区域113被设置于所述线路板110的角落，位于所述模塑区域111对应角落的外侧，其中至少两所述焊盘区域113分别用于电连接一致动器的正负极。
本发明以两所述焊盘区域113为例进行说明，并不是限制。本领域技术人员可以知道的是，根据需要可以使用和设计不止两个所述焊盘区域113。为例方便说明和区分，两所述焊盘区域113分别被称为一第一焊盘区域113’和一第二焊盘区域113”，其中所述第一焊盘区域113’和所述第二焊盘区域113”的特性可以相互适用，本发明不再赘述。
模塑时，所述模塑区域111被模塑流体覆盖，固化后形成所述模塑部120。也就是说，所述模塑部120覆盖所述模塑区域111，闭合地环绕所述安装区域112。所述安装区域112不被模塑流体覆盖，为安装感光元件140和\或至少一电子元器件150提供空间。而针对不同的模塑工艺，如图23和图24所示，所述安装区域112安装的元件可以不同，例如对于MOC工艺，所述感光元件140电连接地贴附于所述安装区域112，而边缘区域位于所述模塑区域111，以使固化后的所述模塑部120模塑于所述感光元件140的边缘区域；例如对于MOB工艺，所述感光元件140电连接地贴附于所述安装区域112，而所述电子元器件150被安装于所述模塑区域111，以使固化后的所述模塑部120包封所述电子元器件150。
所述第一焊盘区域113’和所述第二焊盘区域113”呈镜像对称，不被模塑流体覆盖，形成一第一焊接空间160’和一第二焊盘区域160”，用于电连接马达等致动器，从而组装制造自动变焦摄像模组。也就是说，模塑时，模塑流体避让所述第一焊盘区域113’、所述第二焊盘区域113”和所述安装区域112流通，形成所述模塑部120。所述模塑部120的外侧角落形成有分别对应于所述第一焊盘区域113’和所述第二焊盘区域113”的所述第一焊接空间160’和所述第二焊盘区域160”。
在本发明的一较佳实施例中，所述第一焊盘区域113’和所述第二焊盘区域113”被实施为三角形，对应地，所述第一焊接空间160’和所述第二焊盘区域160”从所述线路板110向上延伸，如图2和图3所示。
三角形的所述第一焊盘区域113’具有两第一外侧边1131’、1132’和一第一避让分界边1133’，其中所述第一外侧边1131’、1132’和所述第一避让分界边1133’首尾相接构成所述第一焊盘区域113’。由于所述第一焊盘区域113’被设置于所述线路板110的角落，两所述第一外侧边1131’、1132’被实施为所述线路板110顶角的邻边。所述第一避让分界边1133’和所述模塑区域111的边界重合，也就是说，所述第一焊盘区域113’于模塑侧(和所述模塑区域111接触侧)形成所述第一避让分界边1133’，分隔和界定所述第一焊盘区域113’和所述模塑区域111。
对应地，三角形的所述第二焊盘区域113”由两第二外侧边1131”、1132”和一第二避让分界边1133”首尾相接构成，其中两所述第二外侧边1131”、1132”被实施为所述线路板110顶角的邻边，其中所述第二避让分界边1133”也是所述模塑区域111的边界的一部分，用于分隔和界定所述第二焊盘区域113”和所述模塑区域111。所述第二避让分界边1133”也位于所述第二焊盘区域113”的模塑侧，和所述模塑区域111接触。
所述第一避让分界边1133’和所述第二避让分界边1133”构成的角大于90°。在该较佳实施例中，所述第一避让分界边1133’和所述第二避让分界边1133”构成的角为180°，即被实施为一条直线，从而倾斜地形成于所述线路板110对应角落。
模塑时，模塑流体需要沿着倾斜的所述避让分界边1133’避让所述第一焊盘区域113’，在所述模塑区域111界定的区域内流动。相比于方形的直角设计，倾斜的所述第一避让分界边1133’和所述第二避让分界边1133”对模塑流体的阻挡少，对模塑流体流通的阻碍降低，模塑流体可以充分流入。同时，模塑流体流通速度的增加幅度降低，流速不均的情况减轻。特别地，对于MOC或MOB工艺中，模塑流体需要经过所述电子元器件150，模塑流体流通速度的变化幅度降低，减少对包封的电容和金线等电子元器件150冲击，避免造成电子元器件150接触不良等状况。
相较于方形的直角设计，模塑时对应形成的流道并不是连续直角的尺寸突变，而是分别对应于所述第一避让分界边1133’和所述第二避让分界边1133”，形成 倾斜的第一缓冲流道和第二缓冲流道。模塑流体沿着倾斜的第一缓冲流道和第二缓冲流道流动，可以适应流道尺寸的变化，无需连续直角转弯，模塑流体喷溅、回流或流速不均的情况发生的可能性降低。
此外，相比于现有技术的方形设计，在同等面积下，所述第一避让分界边1133’和所述第二避让分界边1133”间距所述模塑区域111的内边缘1111的最小间距较大。具体的解释符合数学基本常识，在同等面积下，方形焊盘区域的分界边构成直角凸出，而本发明较佳实施例中，三角形第一焊盘区域113’将方形焊盘区域凸出的直角区域分散，所以所述第一内边缘顶角点11111垂直于所述第一避让分界边1133’的间距较大。
如图3所示，在本发明的较佳实施例中，三角形的所述第一焊盘区域113’和所述第二焊盘区域113”被形成于一连接器114的安装侧，分别被设置于所述连接器114的安装侧的两角落。
此时，所述第一焊盘区域113’和所述第二焊盘区域113”位于同一侧，模塑时，所述第一焊盘区域113’和所述第二焊盘区域113”之间形成一焊盘区域侧流道。模塑流体进出所述焊盘区域侧流道需要分别避让两侧的所述第一焊盘区域113’和所述第二焊盘区域113”。而由于所述第一避让分界边1133’和所述第二避让分界边1133”的存在，使得模塑流体进出所述焊盘区域侧流道受到的限制相比于现有技术降低，从而表面于所述焊盘区域侧流道形成的所述模塑部120部分出现注塑不良。
也就是说，本发明的设计适应摄像模组小型化趋势的同时，不会影响模塑过程和模塑部的形成。现有技术通过减小流道的尺寸，或者模塑部的最窄部位尺寸到达小型化的目的，但这会影响模塑流体进出所述焊盘区域侧流道，影响模塑部的形成。而本发明通过重新设计焊盘区域，使得满足摄像模组小型化趋势的同时，不会影响模塑过程和模塑部的形成。
实际生产中，为了实现摄像模组小型化，所述焊盘区域侧流道或者说所述模塑部的尺寸最窄为0.1mm，影响成型材料流通。而本发明的设计可以使所述模塑部的最窄尺寸为0.15mm，即使模塑部的最窄部位尺寸增大，也不会影响整体小型化。
如图4和图5所示，为了实现本发明的较佳实施例的所述模塑组件100，可以通过制造一较佳实施例的模塑组件拼板200，经过切割形成所述模塑组件100。 所述模塑组件拼板200包括一线路板拼板210和一连体模塑部220，其中所述连体模塑部220经过模塑工艺，一体地成型于所述线路板拼板210。
所述线路板拼板210具有多个模塑区域111、多个安装区域112和多个主焊盘区域211，其中所述模塑区域111阵列地排布于所述线路板拼板210，其中相邻的所述模塑区域111接壤，其中所述模塑区域111对应地环绕所述安装区域112，其中三角形的所述主焊盘区域211对应所述模塑区域111设置于所述线路板拼板210的两长度侧。
模塑时，所述模塑区域111被模塑流体覆盖，由于相邻的所述模塑区域111接壤，所以当模塑流体覆盖所有所述模塑区域111后固化，形成所述连体模塑部220。也就是说，所述连体模塑部220覆盖所有模塑区域111。所述安装区域112不被模塑流体覆盖，形成后的所述连体模塑部220环绕所述安装区域112。所述感光芯片140安装于所述安装区域112，所述连体模塑部220界定对应于所述感光芯片140的光窗130，以供形成感光路径。
所述线路板拼板210包括多个连接器114，其中所述连接器114被对应地设置于所述线路板拼板210的两相对侧，电连接对应区域。本发明以所述连接器114的两相对安装侧为所述线路板拼板210的长，两未安装所述连接器114的相对侧为宽进行说明，并不是限制。则沿所述线路板拼板210长延伸的方向为长度方向，沿所述线路板拼板210的宽延伸的方向为宽度方向。对应地，元件沿长度方向阵列排布为一行，沿宽度方向阵列排布为一列。此处只是为了方便说明，并不是限制。
为了得到上述较佳实施例的所述模塑组件100，所述主焊盘区域211被形成于所述线路板拼板210的长度侧，对应的所述模塑区域111安装侧(安装所述连接器114的一侧)的角落外侧，以供切割后，形成位于所述模塑区域111安装侧角落的所述焊盘区域113。在该较佳实施例中，位于所述模塑组件拼板200俩宽度端的所述主焊盘区域211呈直角三角形，而其他所述主焊盘区域211呈等腰三角形，经宽度方向切割分隔，形成两直角三角形的所述焊盘区域113。
模塑流体从所述模塑组件拼板200的一宽度端注入后，模塑流体沿着所述模塑区域111界定的长度方向流道和宽度方向流道流通。当模塑流体沿着所述主焊盘区域211的避让边界(和所述模塑区域111接触的边)避让时，由于所述避让边界倾斜，对模塑流体的阻挡小。尤其对于相邻两主焊盘区域211之间形成的流 道，模塑流体可以充分的填入，降低了拼板工艺注塑不全的情况，提高的整体成品率。
如图6和图7所示，为制作所述模塑组件拼板200使用的模具300，包括一上模具310和一下模具320，其中所述上模具310和所述下模具320合模界定一成型空间330，其中流体状的成型材料进入所述成型空间330从而执行模塑等步骤。所述模具300的模塑部分和常规模具相同，不同的是，本发明的所述模具310的底表面和所述主焊盘区域211接触，才能避免所述主焊盘区域211不被覆盖和模塑，进而形成所述焊接空间。
具体地，所述线路板拼板210被固定于所述下模具320，其中所述上模具310和所述下模具320合模，其中两者界定的所述成型空间330对应于所述模塑区域111，以供流体态的成型材料在固化后形成至少一体地成型在所述线路板拼板210的所述连体模塑部220。
优选地，所述线路板拼板210的周边预留有压合边沿，供所述上模具310压合，以使所述成型空间330密闭，避免成型材料泄漏。经模塑后，预留的压合边沿可以经切割去除，减少整体体积。而位于连接侧的压合边，由于连接所述连接器，可以不切割，即如图3和图8等附图所示。也就是说，当所述模塑组件的所述焊盘区域位于连接侧时，两焊盘区域之间设有压合边沿未被覆盖。
所述上模具310进一步包括多个对应于所述安装区域112的第一凸起部311和多个对应于所述主焊盘区域211的第二凸起部312，其中所述第一凸起部311和所述第二凸起部312由所述上模具310的底表面凸起形成。所述第二凸起部312的形成、尺寸和所述主焊盘区域211的形状、尺寸相对应，从而覆盖所述主焊盘区域211，阻止模塑流体覆盖所述主焊盘区域211。在该较佳实施例中，所述第二凸起部312的横截面被实施为和所述主焊盘区域211对应的三角形。
所述第一凸起部311覆盖所述安装区域112，阻止成型材料污染感光元件140，形成多个光窗130。例如在MOC工艺中，可以先安装感光元件140和电子元器件150再用模塑，所述第一凸起部311的底表面抵于感光元件140表面；在MOB工艺中，可以先模塑在安装感光元件140和电子元器件150，所述第一凸起部311的底表面抵于所述安装区域112对应的线路板表面，此处只是举例并不限制。
优选地，为了方便拔模，所述第一凸起部311和所述第二凸起部312由上至下的尺寸逐渐减小，从而减小拔模阻力。对应地，所述光窗130的尺寸从上至下 逐渐减小；对应于所述主焊盘区域211的焊接空间的尺寸从上至下逐渐减小。
固化拔模后，所述模塑组件拼板200沿预设的切割线切割，形成多个上述较佳实施例的所述模塑组件100。具体地，所述线路板拼板210被切割形成多个线路板110，所述模塑区域111被相互分离，对应的所述连体模塑部220被切割形成所述模塑部120。此时，所述主焊盘区域211被分隔形成所述焊盘区域113，位于所述模塑组件100安装侧的角落。
如图8至图9所示，为该较佳实施例的第一变形实施例，和所述较佳实施例不同的是，在所述模塑组件100A中，三角形的所述第一焊盘区域113’A和所述第二焊盘区域113”A被设置于所述安装侧的对侧角落，而非安装所述连接器114A的安装侧。
对应地，如图9所示，为了切割后形成所述模塑组件100A，在所述模塑组件拼板200A中，所述主焊盘区域211A被设置于同一列中相邻所述模塑区域111A相接侧的角落，以使切割后所述主焊盘区域211A分隔形成的所述第一焊盘区域113’A和所述第二焊盘区域113”A被设置于所述模塑组件100A的安装侧的对侧。
进一步，在该较佳实施例的第一变形实施例中，除了位于所述模塑组件拼板200A的两宽度端的所述主焊盘区域211A的被实施为三角形，经长度方向切割后分离为两份，其他位于中间区域的所述主焊盘区域211A的被实施为正方形，经长度方向和宽度方向切割后分隔为四份，位于对应的所述模塑组件100A的角落。
对应的，所述模具300中，除了位于所述上模具310两宽度端的所述第一凸起部311的横截面为三角形，其他位于中间区域的所述第一凸起部311横截面为正方形，对应于所述主焊盘区域211的尺寸和形状。
如图10至图13所示，为该较佳实施例的第二变形实施例，和所述较佳实施例不同的是，在所述模塑组件100B中，三角形的所述第一焊盘区域113’B和所述第二焊盘区域113”B被设置于所述安装侧的相邻一侧，而非安装所述连接器114B的安装侧。
对应地，如图11所示，为了切割后形成所述模塑组件100B，在所述模塑组件拼板200B中，所述主焊盘区域211B被设置同一行中所述模塑区域111B的所述安装侧的相邻一侧角落，以使切割后所述主焊盘区域211B分隔形成的所述第 一焊盘区域113’B和所述第二焊盘区域113”B被设置于所述模塑组件100B的安装侧的相邻一侧。此时，同一行中所述模塑区域111B经切割后得到的焊盘区域设置位置一致，例如均位于所述模塑区域111B的所述安装侧的相邻左侧，或均位于所述模塑区域111B的所述安装侧的相邻右侧。
此外，所述模塑组件拼板200B的设计方式可以多种。如图13所示，以两相邻列的所述模塑区域111B为一组，所述主焊盘区域211B被设置于同一组中相邻两列的所述模塑区域111B相邻侧的角落，其中位于所述模塑组件拼板200B长度端的所述主焊盘区域211B的被实施为三角形，经宽度方向切割后分离为两份；而位于中间区域的所述主焊盘区域211B被实施为正方形，经长度方向和宽度方向切割后分隔为四份。此时，同一组经切割后得到的所述模塑组件100B的所述主焊盘区域211B位于安装侧的相反相邻侧，也就是两个在安装侧的左侧而另两个在安装侧的右侧。
对应的，所述模具300中，对应于所述主焊盘区域211B，除了位于所述上模具310两长度端的所述第一凸起部311的横截面为三角形，其他位于中间区域的所述第一凸起部311横截面为正方形，对应于所述主焊盘区域211的尺寸和形状。
或者如图12所示，所述主焊盘区域211B被设置每一列的所述模塑区域111B同一列侧的角落，例如均被设置于每一列的所述模塑区域111B的左列侧的角落，或均被设置于每一列的所述模塑区域111B的右列侧的角落，其中位于所述模塑组件拼板200B长度端的所述主焊盘区域211B的横截面被实施为三角形，经宽度方向切割后分离为两份；而位于中间区域的所述主焊盘区域211B横截面被实施为一等腰三角形，经长度方向和宽度方向切割后分隔为两份。此时同一行所述模塑区域111B经切割后得到的所述模塑组件100B的所述主焊盘区域211B位于安装侧的同一相邻侧，而相邻两行所述模塑区域111B经切割后得到的所述模塑组件100B的所述主焊盘区域211B位于安装侧的相反相邻侧。
对应的，所述模具300中，位于所述上模具310两长度端的所述第一凸起部311的横截面为三角形，其他位于中间区域的所述第一凸起部311横截面为一等腰三角形，对应于所述主焊盘区域211的尺寸和形状。
如图14至图17所示，为本发明的第二较佳实施例，一模塑组件100C包括一线路板110C、一模塑部120C、一感光元件140C和至少一电子元器件150C。所述线路板110C包括一连接器114C和具有一模塑区域111C、一第一焊盘区域 113’C、一第二焊盘区域113”C和一安装区域112C。所述第一焊盘区域113’C由两第一外边界1131’C、1132’C和一第一避让分界边1133’C首位相接构成。所述第二焊盘区域113”C由两第一外边界1131”C、1132”C和一第二避让分界边1133”C首位相接构成。
和上述较佳实施例不同的是，所述第一焊盘区域113’C被实施为梯形，其中所述第一焊盘区域113’C于模塑侧(和所述模塑区域111C接触侧)形成的角大于90°且小于180°。也就是说，所述第一避让分界边1133’C构成钝角，相比于现有技术的直角设计，所述第一避让分界边1133’C的钝角斜边可以引导模塑流体，对流体运动的阻碍小，避免模塑流体连续直角转弯产生注塑不良，降低不良率。
对应的，所述第二焊盘区域113”C也被实施为梯形，与所述第一焊盘区域113’C呈镜像对称。同样地，所述所述第二避让分界边1133”C构成一钝角，也就是于模塑侧(和所述模塑区域111C接触侧)形成的角大于90°且小于180°。
在第二较佳实施例中，梯形的所述第一焊盘区域113’C和所述第二焊盘区域113”C被设置于所述模塑组件100C的安装侧。模塑时，位于所述第一焊盘区域113’C和所述第二焊盘区域113”C之间模塑流道，由第一避让分界边1133’C和第二避让分界边1133”C的钝角斜边引导进出，相比于直角设计，模塑流体受到的限制和阻碍小，可以被引导从而注塑完全。
如图16和图17所示，为生产所述模塑组件100C所用的模塑组件拼板200C。所述模塑组件拼板200C包括一线路板拼板210C和一连体模塑部220C。所述线路板拼板210C具有多个模塑区域111C、多个主焊盘区域211C、多个安装区域112C和多个连接器114C。
和上述较佳实施例不同的是，为了切割后形成所述模塑组件100C，所述主焊盘区域211C的被实施为梯形，其中所述主焊盘区域211C于模塑侧的角呈钝角。在第二较佳实施例中，梯形的所述主焊盘区域211C被设置所述模塑区域111C的安装侧的角落，其中除了位于所述模塑组件拼板200C两宽度端的所述主焊盘区域211C利用线路板边缘呈直角梯形，其他位于中间的所述主焊盘区域211C呈等腰梯形，经宽度方向的切割后，分隔形成两直角梯形，分别位于对应的所述模塑区域111C的安装侧的角落。
对应地，和上述较佳实施例不同的是，为了契合和形成所述模塑组件拼板 200C，其中所述第二凸起部312的位置、形状和尺寸与所述模塑组件200C的主焊盘区域211C适应。即，在该第二较佳实施例中，所述第二凸起部312的横截面被实施为梯形。具体地，对应于位于所述模塑组件拼板200C两宽度端的所述主焊盘区域211C，所述第二凸起部312的横截面被实施为直角梯形；对应于其他位于中间的所述主焊盘区域211C，所述第二凸起部312的横截面被实施为等腰梯形。
如图18至图19所示，为上述第二较佳实施例的一变形实施例，和上述第二较佳实施例不同的是，梯形的所述第一焊盘区域113’D和所述第二焊盘区域113”D被设置于所述模塑组件100D的安装侧的对侧，而非安装所述连接器114D的安装侧。
对应地，如图19所示，为了切割后形成所述模塑组件100D，在所述模塑组件拼板200D中，所述主焊盘区域211D被设置于同一列中相邻所述模塑区域111D相接侧的角落，以使切割后所述主焊盘区域211D分隔形成的所述第一焊盘区域113’D和所述第二焊盘区域113”D被设置于所述模塑组件100D的安装侧的对侧。
进一步，在该第二较佳实施例的该变形实施例中，除了位于所述模塑组件拼板200D的两宽度端的所述主焊盘区域211D的被实施为两直角梯形以长度方向为轴镜像地拼接状，经长度方向切割后分离为两直角梯形，其他位于中间区域的所述主焊盘区域211D的被实施为六边形，经长度方向和宽度方向切割后分隔为四直角梯形，位于对应的所述模塑组件100D的角落。
对应的，所述模具300中，除了位于所述上模具310两宽度端的所述第一凸起部311的横截面为两直角梯形以长度方向为轴镜像地拼接状，其他位于中间区域的所述第一凸起部311横截面为六边形，对应于所述主焊盘区域211D的尺寸和形状。
如图20至图23所示，为上述第二较佳实施例的另一变形实施例，和上述第二较佳实施例不同的是，在所述模塑组件100E中，梯形的所述第一焊盘区域113’E和所述第二焊盘区域113”E被设置于所述安装侧的相邻一侧，而非安装所述连接器114E的安装侧。
对应地，如图21所示，为了切割后形成所述模塑组件100E，在所述模塑组件拼板200E中，所述主焊盘区域211E被设置同一行中所述模塑区域111E的所 述安装侧的相邻一侧角落，以使切割后所述主焊盘区域211E分隔形成的所述第一焊盘区域113’E和所述第二焊盘区域113”E被设置于所述所述模塑组件100E的安装侧的相邻一侧。此时，同一行中所述模塑区域111B经切割后得到的焊盘区域设置位置一致，例如均位于所述模塑区域111B的所述安装侧的相邻左侧，或均位于所述模塑区域111B的所述安装侧的相邻右侧。
此外，所述模塑组件拼板200E的设计方式可以多种。如图23所示，以两相邻列的所述模塑区域111E为一组，所述主焊盘区域211E被设置于同一组中相邻两列的所述模塑区域111E相邻侧的角落，其中位于所述模塑组件拼板200E长度端的所述主焊盘区域211E的被实施为两直角梯形以宽度方向为轴镜像地拼接状，经宽度方向切割后分离为两份；而位于中间区域的所述主焊盘区域211E被实施为六边形，经长度方向和宽度方向切割后分隔为四个梯形。此时，同一组经切割后得到的四所述模塑组件100E的所述主焊盘区域211E位于安装侧的不同相邻侧，也就是两个在安装侧的左侧而另两个在安装侧的右侧。
对应的，所述模具300中，除了位于所述上模具310两长度端的所述第一凸起部311的横截面为两直角梯形以宽度方向为轴镜像地拼接状，其他位于中间区域的所述第一凸起部311横截面为六边形，对应于所述主焊盘区域211E的尺寸和形状。
或者如图22所示，所述主焊盘区域211E被设置每一列的所述模塑区域111E同一列侧的角落，例如均被设置于每一列的所述模塑区域111E的左列侧的角落，或均被设置于每一列的所述模塑区域111E的右列侧的角落，其中位于所述模塑组件拼板200E长度端的所述主焊盘区域211E的横截面被实施为梯形，经宽度方向切割后分离为两份；而位于中间区域的所述主焊盘区域211E横截面被实施为两直角梯形以宽度方向为轴镜像地拼接状，经长度方向和宽度方向切割后分隔为两份。此时同一行的所述模塑区域111E经切割后得到的所述模塑组件100E的所述主焊盘区域211E位于安装侧的同一相邻侧，而相邻行的位于安装侧的相反相邻侧。
对应的，所述模具300中，位于所述上模具310两长度端的所述第一凸起部311的横截面为梯形，其他位于中间区域的所述第一凸起部311横截面为两直角梯形以宽度方向为轴镜像地拼接状，对应于所述主焊盘区域211E的尺寸和形状。
也就是说，所述焊盘区域的形成和位置相互间不并限制，可以相互组合形成 不同的实施例，此处不再赘述。所述第一焊盘区域和所述第二焊盘区域还可以位于所述线路板的对角，从而适应对应的致动器。此外，第一焊盘区域和所述第二焊盘区域还可以是其他多边形，例如六边形、八边形等，只需其避让边界构成的角大于90°，相比于现有90°的设计，对模塑流体的阻挡少，且倾斜边可以引导模塑流体，并形成缓冲流道，使得模塑流体可以充分填充。
如图24至图26所示，为本发明适用上述实施例的模塑组件的摄像模组400。所述摄像模组400包括所述模塑组件100、一致动器410和一镜头组件420，其中所述致动器410以可驱动地方式支撑所述镜头组件420于所述模塑组件100，以供所述镜头组件420对应于所述模塑组件100的光窗130。所述致动器410可工作地连接于所述线路板110的第一焊盘区域113’和第二焊盘区域113”。所述第一焊盘区域113’和第二焊盘区域113”可以采用上述实施例提到的形成、形状和位置等特征，此时并不限制。进一步，所述摄像模组400还可以包括一滤色片，所述滤色片通过一支架或者直接被支撑于所述模塑组件100顶侧，对应于所述光窗130。
本发明中由于所述第一焊盘区域113’和第二焊盘区域113”的重新设计，使得所述模塑组件100的不良率降低，进而使得所述摄像模组400的成品率提高。
根据本发明的另一方面，本发明进一步提供一模塑组件拼板制作方法，如下：
步骤501:固定一线路板拼板于一下模具，其中所述线路板拼板具有多个模塑区域、多个安装区域和多个主焊盘区域，其中所述模塑区域阵列地排布于所述线路板拼板，其中所述相邻的所述模塑区域接壤，其中所述主焊盘区域经切割分离形成位于所述模区域角落的焊盘区域，其中经切割后形成的所述焊盘区域具有一避让分界边，其中所述避让边界构成的角大于90°。
步骤502：合模一上模具于所述下模具，其中所述上模具压合于所述主焊盘区域和所述安装区域，所述上模具与所述线路板拼版的所述模塑区域间形成一成型空间，其中所述成型空间具有一沿所述避让分界边形成的缓冲流道。
步骤503：注入成型材料于所述成型空间。
步骤504：固化所述成型材料，形成覆盖所述模塑区域的一连体模塑部。
步骤505：安装感光芯片和\或至少一电子元器件于所述安装区域，其中连体模塑部环绕于所述感光芯片和\或至少一电子元器件外侧。
步骤506：移除所述上模具和所述下模具，形成所述模塑组件拼板。
所述步骤505可以在所述步骤504之后实施，也可以在所述步骤501之前实施，此时感光芯片的边缘区域位于所述模塑区域，以使所述步骤504的连体模塑部包封于感光芯片的边缘区域。也就是说，根据工艺需求不同，所述步骤505安装感光芯片和\或至少一电子元器件的顺序和位置相应不同。可以知道的是，所述模塑组件拼板中的所述主焊盘区域的设置和特征适用于上述的所述主焊盘区域形成和特征，并经切割后形成上述对应的模塑组件。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (30)

  1. 一模塑组件，其特征在于，包括：
    一线路板，其中所述线路板具有一模塑区域、一安装区域和至少两焊盘区域，其中所述模塑区域环绕所述安装区域，其中所述焊盘区域被设置于所述线路板的角落，位于所述模塑区域对应角落的外侧，以供电连接一致动器，其中所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；和
    一模塑部，其中所述模塑部覆盖所述模塑区域，所述模塑部环绕所述安装区域，并具有一光窗，其中所述模塑部沿所述避让边界避让所述焊盘区域。
  2. 根据权利要求1所述的模塑组件，其中所述焊盘区域的所述避让边界构成的角为180°。
  3. 根据权利要求1所述的模塑组件，其中所述焊盘区域的所述避让边界构成的角为钝角。
  4. 根据权利要求1所述的模塑组件，其中所述模塑部的最窄部位尺寸至少为0.15mm。
  5. 根据权利要求1至4任一所述的模塑组件，其中相邻的所述焊盘区域对称地设置。
  6. 根据权利要求5所述的模塑组件，其中至少两所述焊盘区域被设置于所述线路板的一安装侧，其中所述安装侧供安装一连接器。
  7. 根据权利要求5所述的模塑组件，其中至少两所述焊盘区域被设置于所述线路板的一安装侧的对侧，其中所述安装侧供安装一连接器。
  8. 根据权利要求5所述的模塑组件，其中至少两所述焊盘区域被设置于所述线路板的一安装侧的相邻侧，其中所述安装侧供安装一连接器。
  9. 根据权利要求1至4任一所述的模塑组件，进一步包括一感光元件，其中所述感光元件被安装于所述安装区域，被所述模塑部闭合地环绕，其中所述光窗对应于所述感光元件，形成一感光路径。
  10. 根据权利要求9所述的模塑组件，其中所述模塑部封装于所述感光元件的边缘部分。
  11. 根据权利要求5所述的模塑组件，进一步包括一感光元件，其中所述感光元件被安装于所述安装区域，被所述模塑部闭合地环绕，其中所述光窗对应于所 述感光元件，形成一感光路径。
  12. 根据权利要求11所述的模塑组件，其中所述模塑部封装于所述感光元件的边缘部分。
  13. 根据权利要求1至4任一所述的模塑组件，进一步包括至少一电子元器件，其中所述电子元器件可工作地安装于所述模塑区域，其中所述模塑部包封所述电子元器件。
  14. 根据权利要求5所述的模塑组件，进一步包括至少一电子元器件，其中所述电子元器件可工作地安装于所述模塑区域，其中所述模塑部包封所述电子元器件。
  15. 一摄像模组，其特征在于，包括：
    一如权利要求1至14任一所述的模塑组件；
    一镜头组件；以及
    一致动器，其中所述致动器以可驱动地方式支撑所述镜头组件于所述模塑组件，以使所述镜头组件对应于所述模塑组件的光窗，其中所述致动器可工作地连接于所述线路板的所述焊盘区域。
  16. 一模塑组件拼板，用于经切割形成多个具有焊盘区域的模塑组件，其特征在于，包括：
    一线路板拼板，其中所述线路板拼板具有多个模塑区域、多个安装区域和多个主焊盘区域，其中所述模塑区域阵列地排布于所述线路板拼板，其中相邻的所述模塑区域接壤，其中所述模塑区域对应地环绕所述安装区域，其中所述主焊盘区域经切割分离形成位于该模塑组件角落的焊盘区域，其中经切割后形成的所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；和
    一连体模塑部，其中所述连体模塑部覆盖所述模塑区域，环绕所述安装区域，界定多个光窗。
  17. 根据权利要求16所述的模塑组件拼板，其中所述主焊盘区域被间隔地设置于所述线路板拼板的长度侧，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的角落。
  18. 根据权利要求16所述的模塑组件拼板，其中所述主焊盘区域被设置于同一列中相邻所述模塑区域相接侧的角落，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的对侧角落。
  19. 根据权利要求16所述的模塑组件拼板，其中所述主焊盘区域被设置于同一组中相邻两列的所述模塑区域相邻侧的角落，以供切割后形成的所述焊盘区域位于所得模塑组件安装侧的相邻侧角落。
  20. 根据权利要求16所述的模塑组件拼板，其中所述主焊盘区域被设置于每一列的所述模塑区域同一列侧角落，以供切割后形成的所述焊盘区域位于所得模塑组件的安装侧的相邻侧角落。
  21. 根据权利要求16所述的模塑组件拼板，其中所述主焊盘区域被设置同一行中所述模塑区域的安装侧的相邻一侧角落，以供切割后所述主焊盘区域分隔形成的所述焊盘区域位于所述模塑组件的安装侧的相邻一侧。
  22. 根据权利要求16至21任一所述的模塑组件拼板，其中经切割后形成所述焊盘区域的所述避让边界构成的角为180°。
  23. 根据权利要求16至21任一所述的模塑组件拼板，其中经切割后形成所述焊盘区域的所述避让边界构成的角为钝角。
  24. 根据权利要求16至21任一所述的模塑组件拼板，进一步包括多个感光元件，其中所述感光元件被安装于对应的所述安装区域，被所述连体模塑部闭合地环绕，其中所述光窗对应于所述感光元件，以供形成一感光路径。
  25. 根据权利要求24所述的模塑组件拼板，其中所述连体模塑部包封于所述感光元件的边缘部分。
  26. 根据权利要求16至21任一所述的模塑组件拼板，进一步包括多个电子元器件，其中所述电子元器件可工作地设置于对应的所述模塑区域，被所述连体模塑部包封。
  27. 一模塑组件拼板制作方法，其特征在于，包括：
    (a)固定一线路板拼板于一下模具，其中所述线路板拼板具有多个模塑区域、多个安装区域和多个主焊盘区域，其中所述模塑区域阵列地排布于所述线路板拼板，其中所述相邻的所述模塑区域接壤，其中所述主焊盘区域经切割分离形成位于所述模区域角落的焊盘区域，其中经切割后形成的所述焊盘区域具有一避让分界边，其中所述避让边界构成的角大于90°；
    (b)合模一上模具于所述下模具，其中所述上模具压合于所述主焊盘区域和所述安装区域，所述上模具与所述线路板拼版的所述模塑区域间形成一成型空间，其中所述成型空间具有一沿所述避让分界边形成的缓冲流道；
    (c)注入成型材料于所述成型空间；
    (d)固化所述成型材料，形成覆盖所述模塑区域的一连体模塑部；
    (e)移除所述上模具和所述下模具，形成所述模塑组件拼板。
  28. 根据权利要求27所述的模塑组件拼板制作方法，其中所述步骤(a)中进一步包括步骤：
    安装感光芯片和\或至少一电子元器件于所述安装区域，其中所述感光芯片的边缘区域位于所述模塑区域，以使所述步骤(d)的连体模塑部包封于感光芯片的边缘区域。
  29. 根据权利要求27所述的模塑组件拼板制作方法，其中所述步骤(d)之后还包括步骤：
    (f)安装感光芯片和\或至少一电子元器件于所述安装区域，其中连体模塑部环绕于所述感光芯片和\或至少一电子元器件外侧。
  30. 一模塑组件作方法，其特征在于，包括：
    (1)固定一线路板于一下模具，其中所述线路板具有模塑区域、安装区域和至少两焊盘区域，其中所述模塑区域环绕所述安装区域，其中所述焊盘区域被设置于所述线路板的角落，位于所述模塑区域对应角落的外侧，其中所述焊盘区域具有一避让边界，其中所述避让边界构成的角大于90°；
    (2)合模一上模具于所述下模具，其中所述上模具压合于所述焊盘区域和所述安装区域，所述上模具与所述线路板的所述模塑区域间形成一成型空间，其中所述成型空间具有一沿所述避让边界形成的缓冲流道；
    (3)注入成型材料于所述成型空间；
    (4)固化所述成型材料，形成覆盖所述模塑区域的一连体模塑部；
    (5)移除所述上模具和所述下模具，形成所述模塑组件。
PCT/CN2019/093886 2018-07-26 2019-06-28 模塑组件、摄像模组、模塑组件拼板以及制作方法 WO2020019941A1 (zh)

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