WO2020019861A1

WO2020019861A1 - Electronic device

Info

Publication number: WO2020019861A1
Application number: PCT/CN2019/088847
Authority: WO
Inventors: 杨自美; 黄茂昭
Original assignee: Oppo广东移动通信有限公司
Priority date: 2018-07-26
Filing date: 2019-05-28
Publication date: 2020-01-30

Abstract

An electronic device (10), comprising a terminal device (100) and an image acquisition module (200). The terminal device (100) is provided with an installation slot (119), and comprises a display screen (120) and a first extremely high frequency communication chip (130). The image acquisition module (200) comprises a first camera module (210) and a second extremely high frequency communication chip (220); the first camera module (210) has a first light entrance surface (211); the first camera module (210) is capable of being communicationally connected to the second extremely high frequency communication chip (220); the image acquisition module (200) is movably provided on the installation slot (119), and is capable of being positioned at a first location and a second location in the installation slot (119). At the first location, the first light entrance surface (211) is hidden in the terminal device (100), and at the second location, the first light entrance surface (211) is exposed to the side of the display screen (120), and the second extremely high frequency communication chip (220) is capable of matching the first extremely high frequency communication chip (130) so as to achieve communicational connection.

Description

Electronic equipment

Technical field

The present invention relates to the technical field of mobile terminals, and in particular, to an electronic device.

Background technique

In order to increase the screen ratio of mobile devices such as mobile phones, the usual solution is to install a scalable image acquisition module on the top of the terminal device. The scalable image acquisition module is connected to the motherboard of the terminal device through a flexible circuit board. The internal space of the terminal equipment and the available space of components such as the battery of the terminal equipment will be compressed.

Summary of the Invention

Based on this, it is necessary to provide an electronic device.

An electronic device includes:

A terminal device includes a display surface and a rear surface disposed opposite to each other, and a side peripheral surface connected between the display surface and the rear surface, and the side peripheral surface includes a left surface and a right surface disposed opposite to each other. And the top and bottom sides disposed opposite to each other, the left side is located between the top and bottom sides, and the right side is located between the top and bottom sides, the The top side is located between the left side and the right side, and the bottom side is located between the left side and the right side; the terminal device includes a display screen and a first extremely high frequency communication Chip, the displayable area of the display screen faces the display surface, and the terminal device is provided with a mounting slot penetrating the top side surface; and

An image acquisition module includes a first camera module and a second ultra-high frequency communication chip, the first camera module has a first light incident surface, and the first camera module can communicate with the second ultra-high frequency Chip communication connection; the image acquisition module is movably disposed in the mounting slot, and can be located in the mounting slot at a first position and a second position; wherein, in the first position, the first light incident surface Hidden in the terminal device; when in the second position, the first light incident surface is exposed on the side where the display screen is located, and the second ultra-high frequency communication chip can communicate with the first ultra-high frequency The communication chips are paired so that the first extremely high-frequency communication chip and the second extremely high-frequency communication chip realize a communication connection.

An electronic device includes:

A terminal device including a display screen and a first extremely high frequency communication chip, the terminal device is provided with a mounting slot; and

An image acquisition module includes a first camera module and a second ultra-high frequency communication chip, and the first camera module can communicate with the second ultra-high frequency communication chip; the image acquisition module is provided in the installation And the first slot can be moved to the first position and the second position in the mounting slot; the first camera module is accommodated in the mounting slot in the first position; the image acquisition module extends out of the mounting in the second position Slot, and the ambient light on the side where the display screen is located can be incident into the first camera module, and in the second position, the second ultra-high frequency communication chip can be paired with the first ultra-high frequency communication chip And realize communication connection.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely These are some embodiments of the present invention. For those of ordinary skill in the art, without any creative effort, drawings of other embodiments can be obtained according to these drawings.

FIG. 1 is a perspective view of an image acquisition module of an electronic device in a first position according to an embodiment; FIG.

FIG. 2 is a perspective view when the image acquisition module of the electronic device shown in FIG. 1 is located at a second position; FIG.

3 is a partial cross-sectional view when the image acquisition module of the electronic device shown in FIG. 2 is located at a second position;

4 is a perspective view of the electronic device shown in FIG. 3 after the image acquisition module is removed from the terminal device;

FIG. 5 is a schematic diagram of the spatial locations of the first extremely high frequency communication chip and the second extremely high frequency communication chip of the electronic device shown in FIG. 3; FIG.

FIG. 6 is a perspective view of an image acquisition module of an electronic device in a first position according to another embodiment; FIG.

7 is a perspective view of an angle of view when the image acquisition module of the electronic device shown in FIG. 6 is located at a second position;

8 is a perspective view of the electronic device shown in FIG. 7 from another perspective when the image acquisition module is located at the second position;

FIG. 9 is a perspective view of an angle of view when an image acquisition module of an electronic device is located at a first position in another embodiment; FIG.

FIG. 10 is a perspective view when the image acquisition module of the electronic device shown in FIG. 9 is located at a second position; FIG.

11 is a perspective view of the electronic device shown in FIG. 9 from another perspective when the image acquisition module is located at the first position;

12 is a partial cross-sectional view when the image acquisition module of the electronic device shown in FIG. 10 is located at a second position;

13 is a partial cross-sectional view when the image acquisition module of the electronic device shown in FIG. 11 is located at a first position;

14 is an exploded view of an embodiment of the image acquisition module of the electronic device shown in FIG. 4;

15 is a perspective view of the image acquisition module of the electronic device shown in FIG. 14 after the cover is removed;

16 is a schematic diagram of a usage scenario of the electronic device shown in FIG. 14;

17 is an exploded view of another embodiment of the image acquisition module of the electronic device shown in FIG. 4;

18 is a partial cross-sectional view of the electronic device shown in FIG. 11 when the image acquisition module is located at a second position;

19 is a partial cross-sectional view of the electronic device shown in FIG. 11 when the image acquisition module is located at the second position;

FIG. 20 is a schematic structural diagram of a terminal device according to an embodiment of the present application.

detailed description

In order to facilitate understanding of the present invention, the present invention will be described more fully with reference to the accompanying drawings. The drawings show a preferred embodiment of the invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough understanding of the present disclosure.

As used herein, a "terminal device" refers to a device capable of receiving and / or transmitting communication signals, including but not limited to being connected via any one or more of the following connection methods:

(1) Connected via wired lines, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

(2) Via a wireless interface method, such as a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, and an AM-FM broadcast transmitter.

A terminal device configured to communicate through a wireless interface may be referred to as a “mobile terminal”. Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) Satellite phone or cellular phone;

(2) Personal Communication System (PCS) terminals that can combine cellular radiotelephones with data processing, facsimile, and data communication capabilities;

(3) Radiotelephone, pager, Internet / Intranet access, Web browser, memo pad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

(4) conventional laptop and / or palm receivers;

(5) Conventional laptop and / or palm-type radiotelephone transceivers and the like.

Referring to FIGS. 1 and 2, in an embodiment, the electronic device 10 is a smart phone. The electronic device 10 includes a terminal device 100 and an image acquisition module 200. The terminal device 100 has a substantially rectangular block shape. The terminal device 100 includes a display surface 111 and a rear surface 113 disposed opposite to each other, and a side peripheral surface connected between the display surface 111 and the rear surface 113. The left side 115 and the right side 116 are opposite the top side 117 and the bottom side 118. The left side 115 is located between the top side 117 and the bottom side 118, and the right side 116 is located on the top side 117 and the bottom side 118. The top side surface 117 is located between the left side surface 115 and the right side surface 116, and the bottom side surface 118 is located between the left side surface 115 and the right side surface 116. Referring to FIG. 3 at the same time, the terminal device 100 includes a display screen 120 and a first extremely high frequency communication chip 130. The displayable area of the display screen 120 faces the display surface 111. The display screen 120 can be used to display information and provide an interactive interface for the user. Referring to FIG. 4, the terminal device 100 is provided with a mounting groove 119 penetrating the top side surface 117.

The image acquisition module 200 includes a first camera module 210 and a second VHF communication chip 220. The first camera module 210 has a first light incident surface 211, and ambient light can pass through the first light incident surface 211 and be incident on the first light incident surface 211. A camera module 210 is mounted on the photosensitive element. The first camera module 210 can be communicatively connected with the second VHF communication chip 220. The image acquisition module 200 is movably disposed in the mounting groove 119 and can be located in a first position and a second position within the mounting groove 119. Referring to FIG. 1, the first light incident surface 211 is hidden in the terminal device 100 when in the first position. Referring to FIG. 2 and FIG. 3, in the second position, the first light incident surface 211 is exposed on the side where the display screen 120 is located, and the second VHF communication chip 220 can be paired with the first VHF communication chip 130 to The first ultra-high-frequency communication chip 130 and the second ultra-high-frequency communication chip 220 are connected to each other. When the image acquisition module 200 is located in the second position, the first camera module 210 can perform the function of a front camera, and the user can perform operations such as self-timer, video call, and the like through the first camera module 210. It can be understood that, in other embodiments, the terminal device 100 may be a tablet or the like.

In one embodiment, the first and second extremely high

frequency communication chips

130 and 220 are both extremely high frequency communication chips. The VHF communication chip is an IC (Integrated Circuit) chip with an EHF (extremely high frequency) antenna packaged inside. Pairing can be completed for wireless communication when the two VHF communication chips are close enough. Communication. An example of an extremely high frequency communication chip is an EHF common link chip. The terms “common link chip”, “common link chip package”, and “EHF communication link chip package” are used to refer to an EHF antenna embedded in an IC package. For examples of very high frequency communication chips, please refer to the information described in US Patent Application Publication Nos. 2012/0263244 and 2012/0307932, and also refer to the information disclosed in the Chinese Patent Documents with publication numbers CN103563166A and CN104145380A.

For an example of an ultra-high frequency communication chip, please refer to the Chinese authorized patent document with authorization bulletin number CN105264785B. The VHF communication chip is packaged with an VHF antenna, and the image acquisition module 200 configured with the VHF communication chip may implement data based on a high carrier frequency (for example, 60 GHz) and the terminal device 100 configured with the VHF communication chip. High-speed wireless transmission (for example, transmission speeds up to 6GB / s).

It can be understood that short-range wireless communication based on high carrier frequency has the advantages of low power consumption, small size, fast transmission rate, non-contact transmission, etc., and can also realize the function of plug-and-play modules, which can greatly improve signal integrity. Support more flexible system implementation, reduce standby power consumption, increase bandwidth and data transmission security, compatible with support for high-speed video signals and other characteristics.

It can be understood that the high carrier frequency may be a carrier frequency capable of achieving high-speed wireless data transmission. The high carrier frequency may be a specific carrier frequency or a carrier frequency band, such as 30GHz-300GHz, which is not specifically limited in the embodiment of the present application. Optionally, the high carrier frequency is 60 GHz.

In one embodiment, the second EHF communication chip 220 may include a first transducer and a first integrated circuit (IC). The first transducer is used to convert electromagnetic signals into radio frequency electrical signals. Yu is coupled to the first transducer. The first integrated circuit includes a receiver circuit and a signal detector circuit. The receiver circuit is configured to receive a first radio frequency electrical signal from the first transducer, and convert the first radio frequency electrical signal into a first baseband signal. The first baseband signal is output when having the first state, and the first baseband signal is not output when the control signal has a second state different from the first state. The signal detector circuit is responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, A control signal having a second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. This type of ultra-high frequency communication chip is an ultra-high frequency communication chip having an electromagnetic signal reception.

The first extremely high-frequency communication chip 130 may include a second transducer and a second integrated circuit. The second transducer is used to convert radio frequency electrical signals into electromagnetic signals. The second transducer is sufficiently close to the first transducer to allow The first transducer receives an electromagnetic signal generated by the second transducer. The second integrated circuit is configured to be coupled to the second transducer. The second integrated circuit includes a transmitter circuit for receiving a second baseband signal and converting the second baseband signal into a second radio frequency electrical signal, and converting the second radio frequency electrical signal. The signal is conducted to a second transducer. This type of ultra-high frequency communication chip is an ultra-high frequency communication chip with an electromagnetic signal transmission.

Of course, the first ultra-high frequency communication chip 130 or the second ultra-high frequency communication chip 220 may be an ultra-high frequency communication chip having a function of transmitting and receiving signals at the same time. When the first ultra-high frequency communication chip 130 is an ultra-high frequency communication chip having a function of transmitting and receiving signals at the same time, the first ultra-high frequency communication chip 130 may include a transducer and an integrated circuit (IC). For converting between radio frequency electrical signals and electromagnetic signals. The integrated circuit is used for coupling to the transducer. The integrated circuit includes a transmitter circuit and a receiver circuit. The transmitter circuit can convert the baseband signal into a radio frequency electrical signal, and conduct the radio frequency electrical signal to the transducer, and then the transducer The radio frequency electrical signal is converted into an electromagnetic signal and transmitted; the transducer can be converted into a radio frequency electrical signal after receiving the electromagnetic signal, and the receiver circuit can receive the radio frequency electrical signal from the transducer and convert the radio frequency electrical signal into a baseband signal. The first extremely high-frequency communication chip 130 may further include an electromagnetic energy guiding assembly installed relative to the transducer for guiding in a region including the transducer and in a direction away from the integrated circuit. Electromagnetic energy.

Specifically, when the first ultra-high frequency communication chip 130 is an ultra-high frequency communication chip having a function of transmitting and receiving signals at the same time, the first ultra-high frequency communication chip 130 may include a first transducer and a second transducer. Controller, first integrated circuit, and second integrated circuit. The first transducer is configured to convert an electromagnetic signal into a radio frequency electrical signal, and the first integrated circuit is configured to be coupled to the first transducer. The first integrated circuit includes a receiver circuit and a signal detector circuit. The receiver circuit is configured to receive a first radio frequency electrical signal from the first transducer, and convert the first radio frequency electrical signal into a first baseband signal. The first baseband signal is output when having the first state, and the first baseband signal is not output when the control signal has a second state different from the first state. The signal detector circuit is responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, A control signal having a second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. The second transducer is used to convert a radio frequency electrical signal into an electromagnetic signal, and the second transducer is sufficiently close to the first transducer to allow the first transducer to receive the electromagnetic signal generated by the second transducer. The second integrated circuit is configured to be coupled to the second transducer. The second integrated circuit includes a transmitter circuit for receiving a second baseband signal and converting the second baseband signal into a second radio frequency electrical signal, and converting the second radio frequency electrical signal. The signal is conducted to a second transducer.

Referring to FIG. 5, in an embodiment, the first ultra-high frequency communication chip 130 is substantially a rectangular block, and the second ultra-high frequency communication chip 220 is approximately a rectangular block. When the first ultra-high frequency communication chip 130 and the second ultra-high frequency communication chip 220 are close enough to achieve pairing, the normal line passing through the centroid of the first ultra-high-frequency communication chip 130 and the second ultra-high-frequency communication chip 220 and There is an intersection point on the surface, and the distance between the intersection point and the centroid of the second extreme high-frequency communication chip 220 is less than or equal to 2.5 mm. The distance between the centroids is less than or equal to 8.5 mm. The above settings can achieve reliable communication between the first EHF communication chip 130 and the second EHF communication chip 220, which is beneficial to the terminal device 100 and the image acquisition module 200. Data transfer between.

In the terminal device 100 described above, the first light incident surface 211 of the first camera module 210 is hidden in the terminal device 100 in the first position, and the first light incident surface 211 is exposed to a position where the display screen 120 is located in the second position. On the other hand, the first camera module 210 does not need to occupy the area on the side where the display screen 120 is located, so the screen ratio of the terminal device 100 can be increased. For example, the screen ratio of the terminal device 100 adopting the above structure may be more than 85%, which is conducive to improving the expressiveness of the product and improving the user experience. When the image acquisition module 200 slides to the second position so that the first light incident surface 211 is exposed on the side where the display screen 120 is located, the image acquisition module 200 can communicate with the first pole of the terminal device 100 through the second extremely high frequency communication chip 220 The high-frequency communication chip 130 is communicatively connected. The above arrangement can avoid the use of a flexible circuit board to realize the communication connection between the image acquisition module 200 and the main board of the terminal device 100, and thus can increase the available space inside the terminal device 100. The saved available space can be used to set other electronic components, for example, a larger capacity battery can be set to improve the endurance of the terminal device 100.

Referring to FIGS. 6, 7 and 8, in one embodiment, the mounting groove 119 is located between the display surface 111 and the rear surface 113. In this embodiment, the image acquisition module 200 may include a second camera module 230. The second camera module 230 has a second light incident surface 231, and ambient light can pass through the second light incident surface 231 and enter the second camera. On the photosensitive element of the module 230. The second camera module 230 can be communicatively connected with the second extreme high-frequency communication chip 220. When in the second position, the second light incident surface 231 is exposed on the side facing away from the display screen 120. In the second position, the second camera module 230 can communicate with the terminal device 100 through the second VHF communication chip 220. In the second position, the second camera module 230 can perform the function of a rear camera. For example, The user can perform operations such as distant view shooting and video recording through the second camera module 230.

Referring to FIGS. 9, 10 and 11, in another embodiment, the mounting groove 119 penetrates the rear surface 113. In this embodiment, the image acquisition module 200 may include a second camera module 230. The second camera module 230 has a second light incident surface 231, and ambient light can pass through the second light incident surface 231 and enter the second camera. On the photosensitive element of the module 230. The second camera module 230 can be communicatively connected with the second VHF communication chip 220. Referring to both FIG. 12 and FIG. 13, the terminal device 100 includes a third extremely high-frequency communication chip 140. In the first position, the second light incident surface 231 is exposed from the mounting groove 119 on the side of the rear surface 113, and the third VHF communication chip 140 can be paired with the second VHF communication chip 220 to make the third The VHF communication chip 140 and the second VHF communication chip 220 implement a communication connection. When in the first position, the second camera module 230 can perform the functions of a rear camera. For example, the user can perform operations such as remote shooting and video recording through the second camera module 230. Since the image acquisition module 200 can perform the function of the rear camera without moving in the installation slot 119 when in the first position, the convenience of the user can be improved. It can be understood that when the second light incident surface 231 is exposed on the side facing away from the display screen 120 in the second position, the second camera module 230 can communicate with the first extremely high frequency through the second extremely high frequency communication chip 220 The chip 130 is paired for communication connection, and the second camera module 230 can also perform the function of a rear camera when in the second position.

In one embodiment, the mounting groove 119 is located between the left side surface 115 and the right side surface 116. The terminal device 100 with the above structure has better overall appearance. Referring to FIGS. 6, 7 and 8, in other embodiments, the mounting groove 119 penetrates the left side surface 115 and the right side surface 116. In the embodiment where the mounting groove 119 penetrates the left side 115 and the right side 116, since the two ends of the image acquisition module 200 can be exposed from the left side 115 and the right side 116 of the terminal device 100, the image acquisition module 200 The image acquisition module 200 may have a width substantially equal to that of the terminal device 100. Therefore, the image acquisition module 200 may include more electronic components to increase the functions of the image acquisition module 200 or improve the performance of the image acquisition module 200.

Referring to FIGS. 14 and 15, the image acquisition module 200 is substantially rectangular. The image acquisition module 200 may include a front surface 241 and a rear surface 243 disposed opposite to each other, and an outer peripheral surface connected between the front surface 241 and the rear surface 243. The outer peripheral surface includes a top surface 242 and a bottom surface 244 which are disposed opposite to each other, and a left end surface 246 and a right end surface 248 which are disposed opposite to each other. Between the bottom end surface 244, the top end surface 242 is located between the left side surface 115 and the right side surface 116, and the bottom end surface 244 is located between the left side surface 115 and the right side surface 116. The first light incident surface 211 is exposed on the side where the front end surface 241 is located, and the top end surface 242 is flush with the top side surface 117 in the first position. When in the first position, the above-mentioned structure makes the electronic device 10 have a higher overall appearance. Further, the image acquisition module 200 may include a cover 240, and the front end surface 241, the rear end surface 243, the left end surface 246, the right end surface 248, the top surface 242, and the bottom end surface 244 are located on the cover 240, and the cover 240 is provided with a light transmitting hole. 245. The first camera module 210 is disposed in the cover 240 and the first light incident surface 211 is exposed from the light transmission hole 245.

In one embodiment, the image acquisition module 200 includes a power module 250 and a module main board 260. The power module 250 can supply power to the module main board 260, the second VHF communication chip 220 can communicate with the module main board 260, and the image acquisition module 200 can After being detached from the terminal device 100, and after the image acquisition module 200 is detached from the terminal device 100, the image acquisition module 200 can be communicatively connected with the terminal device 100. After the image acquisition module 200 is removed from the installation slot 119, the image acquisition module 200 can independently operate and perform operations such as shooting and video recording and transmit data to the terminal device 100. The terminal device 100 can shoot or record the image acquisition module 200. Data is processed. For example, in one embodiment, the photos taken by the image acquisition module 200 can be viewed in real time through the terminal device 100. The image acquisition module 200 with the above structure can realize multi-angle and multi-scene shooting, which is beneficial to improving user experience.

Specifically, the main board 230 may include a first wireless communication module. The terminal device 100 may include a second wireless communication module, and the second wireless communication module can be communicatively connected with the first wireless communication module. After the image acquisition module 200 is detached from the terminal device 100, it can be communicatively connected with the second wireless communication module through the first wireless communication module. The first wireless communication module and the second wireless communication module can achieve short-distance communication and both use the same communication protocol. For example, the first wireless communication module and the second wireless communication module may both be Bluetooth communication modules, or All are WiFi (Wireless Fidelity) communication modules, or are both ZigBee communication modules, or are NFC (Near Field Communication) communication modules. In an embodiment, the terminal device 100 may include a third wireless communication module, and the third wireless communication module is configured to communicate with an external device such as a base station or other electronic device 1010, and details are not described herein again.

After the image acquisition module 200 is detached from the terminal device 100, the communication connection between the image acquisition module 200 and the terminal device 100 can be achieved through the first wireless communication module and the second wireless communication module. The user can hold the image acquisition module 200 for multi-angle and multi-scene shooting, and transmit the captured data to the terminal device 100. Referring to FIG. 16, in one embodiment, a user may hold the image acquisition module 200 with one hand and the terminal device 100 with the other hand. Through the image acquisition module 200, images of various positions and angles may be captured. The image is viewed through the display screen 120 of the terminal device 100. In other embodiments, the user may place the image acquisition module 200 somewhere and view the image captured by the image acquisition module 200 through the terminal device 100 at another place.

Referring to FIG. 14, in an embodiment in which the image acquisition module 200 includes a power module 250 and a module main board 260, a first through hole 261 is formed on the module main board 260 so that the module main board 260 is substantially annular, and a second The through hole 251 is configured so that the power module 250 is substantially annular, and the module main board 260 is stacked on the power module 250. The first camera module 210 includes a lens barrel 213, a camera flexible circuit board 215, and a first connection end 217, and the camera flexible circuit board 215 is connected to the lens barrel 213 and the first connection end 217, respectively. The module main board 260 is provided with a second connection terminal 263, and the first camera module 210 is connected to the second connection terminal 263 through the first connection terminal 217, so as to realize the communication connection between the first camera module 210 and the module main board 260. Referring also to FIG. 15, the module main board 260 is stacked on the power module 250240. The lens barrel 213 is disposed in the first through hole 261 and the second through hole 251. The above structure can prevent the lens barrel 213 of the first camera module 210 from being stacked on the module main board 260 or the power module 250, thereby facilitating the image. The overall thickness of the acquisition module 200 is reduced. Further, the first camera module 210 may include a camera circuit board, which is disposed in the lens barrel 213. The camera circuit board may integrate electronic components such as SENSOR (sensor) and DSP (digital signal processing chip). The DSP further communicates with The camera flexible circuit 215 board is connected. After the ambient light is processed by the SENSOR of the first camera module 210, it can be converted into a digital signal through a digital-to-analog conversion circuit. The digital signal can be further processed in the DSP and passed through the camera flexible circuit board 215 and the first connection terminal 217 The digital signal is transmitted to the main board of the terminal device 100, and then processed by the processor of the terminal device 100, and then output to the display screen 120. The user can view the image captured by the first camera module 210 through the display screen 120.

The first connection end 217 and the second connection end 263 are two terminals of a board-to-board connector (BTB) that can be mated with each other. The structure of the board-to-board connector is beneficial to the first connection end 217 and the first connection end. The standardization of the two connection ends 263 is beneficial to the communication connection between the first camera module 210 and the module main board 260.

Referring to FIG. 17, it can be understood that the power supply module 250 and the module main board 260 of the image acquisition module 200 may be omitted. When the power supply module 250 and the module main board 260 of the image acquisition module 200 are omitted, the terminal device 100 may be provided with a terminal device contact. Point, the image acquisition module 200 is provided with a module contact 219. In the second position, the terminal device contact can be connected to the module contact 219. Through the contact connection of the module contact 219 and the terminal device contact, the terminal device 100 can Power the image acquisition module 200 so that the image acquisition module 200 can work normally. It can be understood that the number of terminal device contacts can be two or more, the number of module contacts 219 can be set to correspond to the number of terminal device contacts, and two or more can be provided. Terminal device contacts and modules After the contact 219 is connected, a conductive loop can be formed, so that the terminal device 100 can supply power to the image acquisition module 200. Referring to FIG. 17, in an embodiment in which the power supply module 250 and the module main board 260 of the image acquisition module 200 are omitted, the second extremely high-frequency communication chip 220 may be communicatively connected to a camera circuit board. The above structure can improve the integration degree of the first camera module 210 to reduce the volume of the image acquisition module 200. It can be understood that, in the embodiment in which the mounting groove 119 penetrates the rear surface 113 of the terminal device 100 and the image acquisition module 200 includes the second camera module 230, a contact can be added to the terminal device 100 to enable the image acquisition module 200 to In the first position, the terminal device 100 can supply power to the image acquisition module 200.

It can be understood that, in the embodiment where the image acquisition module 200 includes the power module 250, the terminal device 100 may be provided with a terminal device contact, the image acquisition module 200 is provided with a module contact 219, and the terminal device is in the second position. The contact can be in contact with the module contact 219. Through the contact connection between the module contact 219 and the terminal device contact, the terminal device 100 can charge the image acquisition module 200 so that the image acquisition module 200 can retain sufficient power to enhance the image Convenience of the acquisition module 200. It can also be understood that, in the embodiment where the mounting groove 119 penetrates the rear surface 113 of the terminal device 100 and the image acquisition module 200 includes the second camera module 230, a contact can be added to the terminal device 100 to enable the image acquisition module 200 In the first position, the terminal device 100 can charge the image acquisition module 200, which will not be repeated here.

As an implementable embodiment, the terminal device 100 includes a rear case 110, the display screen 120 is connected to the rear case 110, and the rear surface 113 is located on a side of the rear case 110 facing away from the display screen 120. Referring to FIG. 18, the electronic device 10 includes a magnetic attraction assembly 150 including a magnet 151 and an attraction member 153. One of the magnet 151 and the adsorption member 153 is connected to the rear case 110, and the other of the magnet 151 and the adsorption member 153 is connected to the image acquisition module 200. In the second position, the magnet 151 can be adsorbed on the adsorption member 153. In an embodiment, the magnet 151 is a permanent magnet 151, and the adsorption member 153 is an iron piece. When the image acquisition module 200 is located at the second position, the magnet 151 may be adsorbed on the adsorption member 153, so that the image acquisition module 200 is in the mounting groove Reliable positioning within 119. In other embodiments, the adsorption member 153 may also be a permanent magnet 151, which is not described again here.

Referring to FIG. 19, as an implementable embodiment, the terminal device 100 may include a driving mechanism 160 including a motor 161, a screw rod 163, and a nut 165. The rear case 110 is connected to the motor 161, and the motor 161 is connected to the screw rod 163. The screw rod 163 is engaged with the nut 165, and the nut 165 is fixedly connected to the image acquisition module 200. The motor 161 can drive the screw rod 163 to rotate, the screw rod 163 can drive the nut 165 to move on the screw rod 163, and the nut 165 can drive the image acquisition module 200 to move in the mounting groove 119. The above-mentioned setting is beneficial to realize the motorized operation of the image acquisition module 200 on the terminal device 100 to improve the convenience of the user.

Referring to FIG. 20, FIG. 20 is a schematic structural diagram of a terminal device 100 according to an embodiment of the present application. The terminal device 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, and a wireless fidelity ( A WiFi (Fidelity) module 507 includes a processor 508 having one or more processing cores, a power supply 509, and other components. Those skilled in the art can understand that the structure of the terminal device 100 shown in FIG. 20 does not constitute a limitation on the terminal device 100, and may include more or fewer components than shown in the figure, or combine some components, or different components. Layout.

The radio frequency circuit 501 can be used to receive and send information, or to receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is processed by one or more processors 508. In addition, the uplink-related data is sent to the base station. . Generally, the radio frequency circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM, Subscriber Identity Module) card, a transceiver, a coupler, and a low noise amplifier (LNA, Low Noise Amplifier), duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with a network and other devices through wireless communication. This wireless communication can use any communication standard or protocol, including but not limited to Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA, Code Division Multiple Access), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), Email, Short Messaging Service (SMS), etc.

The memory 502 may be used to store application programs and data. The application program stored in the memory 502 contains executable code. Applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running an application program stored in the memory 502. The memory 502 may mainly include a storage program area and a storage data area, where the storage program area may store an operating system, at least one application required by a function (such as a sound playback function, an image playback function, etc.), etc .; the storage data area may store data according to The terminal device 100 uses the created data (such as audio data, phone book, etc.) and the like. In addition, the memory 502 may include a high-speed random access memory, and may further include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 may further include a memory controller to provide access to the memory 502 by the processor 508 and the input unit 503.

The input unit 503 can be used to receive inputted numbers, character information, or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. A touch-sensitive surface, also known as a touch display or touchpad, collects user touch operations on or near it (such as the user using a finger, stylus, or any suitable object or accessory on the touch-sensitive surface or touch-sensitive Operation near the surface), and drive the corresponding connection device according to a preset program. Optionally, the touch-sensitive surface may include two parts, a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch position, and detects the signal caused by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into contact coordinates, and sends it To the processor 508, and can receive the command sent by the processor 508 and execute it.

The display unit 504 may be used to display information input by the user or information provided to the user and various graphical user interfaces of the terminal device 100. These graphical user interfaces may be composed of graphics, text, icons, videos, and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel may be configured using a liquid crystal display (LCD, Liquid Crystal Display), an organic light emitting diode (OLED, Organic Light-Emitting Diode), or the like. Further, the touch-sensitive surface may cover the display panel. When the touch-sensitive surface detects a touch operation on or near the touch-sensitive surface, it is transmitted to the processor 508 to determine the type of the touch event, and the processor 508 then displays the The corresponding visual output is provided on the panel. Although in FIG. 20, the touch-sensitive surface and the display panel are implemented as two separate components to implement input and input functions, in some embodiments, the touch-sensitive surface and the display panel may be integrated to implement input and output functions. It can be understood that the display screen 120 may include an input unit 503 and a display unit 504.

The terminal device 100 may further include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light. The proximity sensor may close the display panel when the terminal device 100 is moved to the ear and / Or backlight. As a kind of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in various directions (generally three axes). It can detect the magnitude and direction of gravity when it is stationary. It can be used to identify the attitude of the mobile phone (such as horizontal and vertical screen switching, related Games, magnetometer attitude calibration), vibration recognition-related functions (such as pedometer, tap), etc .; as for the terminal device 100, other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. can be configured here. No longer.

The audio circuit 506 may provide an audio interface between the user and the terminal device 100 through a speaker or a microphone. The audio circuit 506 can convert the received audio data into an electrical signal and transmit it to a speaker. The speaker converts the audio signal into a sound signal and outputs the sound signal. On the other hand, the microphone converts the collected sound signal into an electrical signal. After the audio data is processed by the audio data output processor 508, it is sent to, for example, another terminal device 100 via the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may further include an earphone jack to provide communication between the peripheral earphone and the terminal device 100.

Wireless fidelity (WiFi) is a short-range wireless transmission technology. The terminal device 100 can help users send and receive email, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Although FIG. 20 shows the wireless fidelity module 507, it can be understood that it does not belong to the necessary configuration of the terminal device 100, and can be omitted as needed without changing the essence of the invention.

The processor 508 is the control center of the terminal device 100. It connects various parts of the entire terminal device 100 by using various interfaces and lines, and runs or executes the application programs stored in the memory 502, and calls the data stored in the memory 502 to execute Various functions and processing data of the terminal device 100 are performed to monitor the terminal device 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes an operating system, a user interface, and an application program, etc. The modem processor mainly handles wireless communication. It can be understood that the above-mentioned modem processor may not be integrated into the processor 508.

The terminal device 100 also includes a power source 509 (such as a battery) that supplies power to various components. Preferably, the power supply can be logically connected to the processor 508 through a power management system, so that functions such as managing charging, discharging, and power consumption management can be implemented through the power management system. The power source 509 may also include any one or more DC or AC power sources, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

Although not shown in FIG. 20, the terminal device 100 may further include a Bluetooth module and the like, and details are not described herein again. In specific implementation, the above modules may be implemented as independent entities, or may be arbitrarily combined, and implemented as the same or several entities. For specific implementation of the above modules, refer to the foregoing method embodiments, and details are not described herein again.

The technical features of the embodiments described above can be arbitrarily combined. In order to simplify the description, all possible combinations of the technical features in the above embodiments have not been described. However, as long as there is no contradiction in the combination of these technical features, It should be considered as the scope described in this specification.

The above-mentioned embodiments only express several implementation manners of the present invention, and their descriptions are more specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be noted that, for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims

An electronic device includes:

A terminal device includes a display surface and a rear surface disposed opposite to each other, and a side peripheral surface connected between the display surface and the rear surface, and the side peripheral surface includes a left surface and a right surface disposed opposite to each other. And the top and bottom sides disposed opposite to each other, the left side is located between the top and bottom sides, and the right side is located between the top and bottom sides, the The top side is located between the left side and the right side, and the bottom side is located between the left side and the right side; the terminal device includes a display screen and a first extremely high frequency communication Chip, the displayable area of the display screen faces the display surface, and the terminal device is provided with a mounting slot penetrating the top side surface; and

An image acquisition module includes a first camera module and a second ultra-high frequency communication chip, the first camera module has a first light incident surface, and the first camera module can communicate with the second ultra-high frequency Chip communication connection; the image acquisition module is movably disposed in the mounting slot, and can be located in the mounting slot at a first position and a second position; wherein, in the first position, the first light incident surface Hidden in the terminal device; when in the second position, the first light incident surface is exposed on the side where the display screen is located, and the second ultra-high frequency communication chip can communicate with the first ultra-high frequency The communication chips are paired so that the first extremely high-frequency communication chip and the second extremely high-frequency communication chip realize a communication connection.
The electronic device according to claim 1, wherein the mounting groove is located between the display surface and the rear surface.
The electronic device according to claim 2, wherein the image acquisition module includes a second camera module, the second camera module has a second light incident surface, and the second camera module can communicate with all The second extremely high-frequency communication chip is communicatively connected; when in the second position, the second light incident surface is exposed on a side facing away from the display screen.
The electronic device according to claim 1, wherein the mounting groove penetrates the rear surface.
The electronic device according to claim 4, wherein the image acquisition module includes a second camera module, the second camera module has a second light incident surface, and the second camera module can communicate with all The second extreme high-frequency communication chip is communicatively connected; the terminal device includes a third extreme high-frequency communication chip; and when the first position is in the first position, the second light incident surface is exposed from the mounting groove to a rear surface of the rear surface. Side, and the third extremely high frequency communication chip can be paired with the second extremely high frequency communication chip, so that the third extremely high frequency communication chip and the second extremely high frequency communication chip realize communication connection; When in the second position, the second light incident surface is exposed on a side facing away from the display screen.
The electronic device according to claim 1, wherein the image acquisition module includes a front end surface and a rear end surface disposed opposite to each other, and an outer peripheral surface connected between the front end surface and the rear end surface, and The outer peripheral surface includes a top surface and a bottom surface disposed opposite to each other, and a left surface and a right end surface disposed opposite to each other. The left end surface is located between the top surface and the bottom end surface, and the right end surface is located on the top surface. Between the bottom end surface, the top end surface is located between the left side surface and the right side surface, and the bottom end surface is located between the left side surface and the right side surface; the first The light incident surface is exposed on the side where the front end surface is located; when in the first position, the top end surface is flush with the top side surface.
The electronic device according to claim 1, wherein the terminal device comprises a rear case, the display screen is connected to the rear case, and the rear surface is located on the back of the rear case facing away from the display screen. One side; the electronic device includes a magnetic attraction assembly, the magnetic attraction assembly includes a magnet and an adsorption member; one of the magnet and the adsorption member is connected to the rear case, and the magnet and the adsorption member The other is connected to the image acquisition module, and the magnet can be adsorbed on the adsorption member in the second position.
The electronic device according to claim 1, wherein the terminal device includes a rear case and a driving mechanism, and the rear surface is located on a side of the rear case facing away from the display screen; the driving mechanism includes A motor, a screw rod and a nut, the rear shell is connected with the motor, the motor is connected with the screw rod; the screw rod is engaged with the nut, and the nut is fixedly connected with the image acquisition module; The motor can drive the screw rod to rotate, the screw rod can drive the nut to move, and the nut can drive the image acquisition module to move in the mounting groove.
The electronic device according to claim 1, wherein the mounting groove is located between the left side and the right side; or the mounting groove runs through the left side and the right side surface.
The electronic device according to any one of claims 1 to 9, wherein the image acquisition module includes a power module and a module main board, the power module is capable of supplying power to the module main board, and the second extremely high frequency The communication chip can be communicatively connected with the module main board; the image acquisition module can be detached from the terminal device, and after the image acquisition module is detached from the terminal device, the image acquisition module can be connected with the module Terminal equipment communication connection.
The electronic device according to claim 10, wherein the image acquisition module includes a cover, the cover is provided with a light-transmissive hole, and the first camera module is provided in the cover and The first light incident surface is exposed from the light transmitting hole; a first through hole is opened on the module main board, a second through hole is opened on the power module, and the module main board is stacked on the power module The first camera module includes a lens barrel, and the lens barrel passes through the first through hole and the second through hole.
The electronic device according to claim 1, wherein the terminal device is provided with a terminal device contact, and the image acquisition module is provided with a module contact, and the terminal device contact can be in a second position. In contact with the module contacts to enable the terminal device to power the image acquisition module.
The electronic device according to claim 12, wherein the first camera module includes a lens barrel and a camera circuit board disposed in the lens barrel, and the second VHF communication chip is capable of communicating with the Camera circuit board communication connection.
An electronic device includes:

A terminal device including a display screen and a first extremely high frequency communication chip, the terminal device is provided with a mounting slot; and

An image acquisition module includes a first camera module and a second ultra-high frequency communication chip, and the first camera module can communicate with the second ultra-high frequency communication chip; the image acquisition module is provided in the installation And the first slot can be moved to the first position and the second position in the mounting slot; the first camera module is accommodated in the mounting slot in the first position; the image acquisition module extends out of the mounting in the second position Slot, and the ambient light on the side where the display screen is located can be incident into the first camera module, and in the second position, the second ultra-high frequency communication chip can be paired with the first ultra-high frequency communication chip And realize communication connection.
The electronic device according to claim 14, wherein the terminal device comprises a display surface and a rear surface disposed opposite to each other, and a side peripheral surface connected between the display surface and the rear surface, and The direction of the displayable area of the display screen is the same as that of the display surface, and the mounting groove runs through the side peripheral surface.
The electronic device according to claim 15, wherein the side peripheral surface comprises a left side surface and a right side surface disposed opposite to each other, and a top side surface and a bottom side surface disposed opposite to each other, and the left side surface, the The right side surface is located between the top side surface and the bottom side surface, and the mounting groove runs through the top side surface.
The electronic device according to claim 15, wherein the mounting groove is located between the display surface and the rear surface; the image acquisition module includes a second camera module, and the second camera module It can be communicatively connected with the second ultra-high frequency communication chip, and the ambient light on the side where the rear surface is located can enter the second camera module in the second position.
The electronic device according to claim 15, wherein the mounting groove runs through the rear surface; the image acquisition module includes a second camera module, and the second camera module can communicate with the second electrode The high-frequency communication chip is communicatively connected; the terminal device includes a third extremely high-frequency communication chip, and the ambient light on the side of the rear surface can be incident into the second camera module when the first position is located, and the The third extremely high-frequency communication chip can be paired with the second extremely high-frequency communication chip and realize a communication connection.
The electronic device according to claim 14, wherein the terminal device includes a rear case and a driving mechanism; the driving mechanism includes a motor, a screw rod, and a nut; the rear case is connected to the motor; and the motor The output end is connected with the screw rod; the screw rod is engaged with the nut, and the nut is fixedly connected with the image acquisition module; the motor can drive the screw rod to rotate to drive the screw rod through the nut The image acquisition module moves in the mounting groove.
The electronic device according to claim 14, wherein the image acquisition module includes a power module and a module main board, the power module can supply power to the module main board, and the second ultra-high frequency communication chip can communicate with all The image acquisition module can be detached from the terminal device, and the image acquisition module can be communicatively connected with the terminal device after disassembly; the module main plate is provided with a first through hole, the The power module is provided with a second through hole, and the module main board is stacked on the power module; the first camera module includes a lens barrel, and the lens barrel passes through the first through hole and the second through hole. hole.