WO2020015420A1 - Led filament - Google Patents

Led filament Download PDF

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Publication number
WO2020015420A1
WO2020015420A1 PCT/CN2019/084584 CN2019084584W WO2020015420A1 WO 2020015420 A1 WO2020015420 A1 WO 2020015420A1 CN 2019084584 W CN2019084584 W CN 2019084584W WO 2020015420 A1 WO2020015420 A1 WO 2020015420A1
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WO
WIPO (PCT)
Prior art keywords
filament
led
powder
substrate
glass film
Prior art date
Application number
PCT/CN2019/084584
Other languages
French (fr)
Chinese (zh)
Inventor
林金填
蔡金兰
Original Assignee
旭宇光电（深圳）股份有限公司
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Publication of WO2020015420A1 publication Critical patent/WO2020015420A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Definitions

  • the invention belongs to the field of LED lighting, in particular to an LED filament.
  • LED Since the 20th century, LED has quickly become popular in the lighting market due to its advantages of energy saving, environmental protection, long life and small size. LED has become the mainstream lighting source in the future and is widely used in commercial lighting, industrial lighting, outdoor lighting and other fields.
  • the Japanese oxtail light source introduced a bulb-type lamp with an incandescent prototype configured with LEDs. "LED filament bulbs” have begun to emerge. Since the Japanese oxtail light source was first introduced and mass-produced, candles and bulb lamps with LED filament as the light source have gradually been favored by more and more consumers in the market.
  • LED filaments mainly have problems such as low power, poor heat dissipation, insufficient light efficiency, insufficient uniform light emitting surface, and poor filament protection.
  • Chinese patent 201510633662.7 discloses a filament and a method for preparing the same, mainly using a transparent glass tube to package the LED light bar.
  • the transparent glass tube can protect the LED filament, making the LED filament difficult to break.
  • by injecting a fluorescent powder adhesive layer into a glass tube it is beneficial to improve the anti-aging performance of the fluorescent layer.
  • this method still cannot take into account the problems of LED filament heat dissipation, light efficiency improvement, uniformity of light emission and protection of the filament. Therefore, it is very necessary to develop an LED filament technology to solve the problems of LED filament. There are technical issues.
  • the purpose of the present invention is to provide an LED filament with high light efficiency, good heat dissipation performance and good filament protection performance, which aims to solve the problems of low light efficiency, poor uniformity, poor heat dissipation performance and poor filament protection of existing LED filaments.
  • the invention provides an LED filament, including:
  • An LED filament substrate including a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and an outer surface of the filament substrate is provided with a plurality of grooves;
  • the LED chip is disposed in a groove of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
  • a weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5).
  • the LED filament provided by the present invention is seamlessly covered with a flexible glass film on the surface of the LED chip.
  • the flexible glass film is directly coated on the surface of the LED chip, which can effectively block air from entering the interior of the LED filament.
  • the stability of the LED filament device The vulcanization resistance has been greatly improved, thereby improving the photoelectric stability and service life of LED filaments.
  • the flexible glass film has a proper mechanical strength, which is beneficial to protect the filament device and protect the LED filament, especially the LED chip from damage. More importantly, the flexible glass film contains fluorescent powder and graphene. On the one hand, by uniformly compounding the fluorescent powder in the flexible glass film material, the LED filament can be improved without providing an additional phosphor powder layer.
  • the anti-aging performance of the LED chip while giving the LED filament a better light uniformity and stability, is beneficial to improving the light emitting effect of the LED filament.
  • the arrangement of the phosphor adhesive layer is reduced, the volume of the LED filament is reduced, making the structure more compact.
  • graphene is added to the flexible glass film, so that the heat dissipation performance of the LED filament can be effectively improved, and the photoelectric performance and service life of the LED filament can be further improved.
  • FIG. 1 is a schematic structural diagram of an LED filament provided with two sets of LED chip strings according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality” is two or more, unless specifically defined otherwise.
  • an LED filament including:
  • the LED filament substrate 1 includes a filament substrate 11 and a plurality of LED chips 12 arranged on the filament substrate 11, wherein the filament substrate 11 includes a cylindrical substrate, and a plurality of grooves 111 are formed on the outer surface of the filament substrate 11;
  • the chip 12 is disposed in the groove 111 of the filament substrate 11, and the LED chips 12 distributed radially on the outer wall of the filament substrate 11 are electrically connected;
  • the flexible glass film 2 seamlessly covers the surface of the recess 111, wherein the flexible glass film 2 is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene, and In the flexible fluorescent glass film, a weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5).
  • the surface of the LED chip 12 is seamlessly covered with a flexible glass film 2 on the surface of the LED chip 12, and the flexible glass film 2 is directly covered on the surface of the LED chip 12, which can effectively block air from entering the interior of the LED filament, and the LED filament device.
  • the stability and vulcanization resistance have been greatly improved, thereby improving the photoelectric stability and service life of LED filaments.
  • the flexible glass film 2 has a proper mechanical strength, which is beneficial for protecting the filament device and protecting the LED filament, especially the LED chip 12 from damage. More importantly, the flexible glass film 2 contains fluorescent powder and graphene. On the one hand, by uniformly compounding the fluorescent powder in the flexible glass film 2 material, the LED filament can be improved without providing an additional phosphor powder layer.
  • the anti-aging performance of the LED chip 12 also gives the LED filament a better uniformity and stability of light emission, which is beneficial to improving the light-emitting effect of the LED filament.
  • the arrangement of the phosphor adhesive layer is reduced, the volume of the LED filament is reduced, making the structure more compact.
  • graphene is added to the flexible glass film 2 so that the heat dissipation performance of the LED filament can be effectively improved, and the photoelectric performance and service life of the LED filament can be further improved.
  • the LED filament substrate 1 itself serves as a functional structure, and can realize the photoelectric function of the LED filament.
  • the LED filament substrate 1 includes a filament substrate 11.
  • the filament substrate 11 is used as a bracket structure, and is not only used to carry the LED chip 12.
  • the filament substrate 11 is also provided with a circuit system for electrically connecting the LED filaments.
  • the filament substrate 11 is a cylindrical substrate
  • the LED chip 12 is disposed on an outer wall of the cylindrical substrate, so as to improve the uniformity of light emitted by the LED filament.
  • the filament substrate 11 is a cylindrical transparent substrate.
  • the cylindrical transparent substrate helps the light emitted by the LED chip 12 to pass through the back of the substrate, and can further improve the uniformity of light output and the angle of light output.
  • the material of the filament base 11 can be selected from conventional filament base materials.
  • the filament substrate 11 is a metal / graphene composite substrate (a substrate made of a composite of a metal and a graphene material) or a ceramic / graphene composite substrate (a composite made of a ceramic and a graphene material) Substrate), more preferably a ceramic / graphene composite substrate.
  • the graphene has good material compatibility with conventional filament base materials such as metal and ceramics, and the obtained composite material can meet the requirements for the use of the filament base.
  • the filament substrate 11 is a SiC / graphene composite substrate.
  • the performance of SiC and graphene are relatively matched in terms of thermal conductivity and thermal expansion coefficient, so that the filament composite substrate can maintain its structural stability, while reducing the thermal resistance and enhancing the thermal conductivity of the substrate; on the other hand, SiC and graphene
  • the composite substrate has a very good heat dissipation effect, which can effectively improve the service life of the LED filament.
  • the weight of the graphene accounts for 10% -20% of the weight of the entire SiC / graphene composite substrate. If the graphene composite content is too low, the thermal conductivity and heat dissipation effect of the material will not be improved significantly; if the graphene composite content exceeds 20%, the structural stability, mechanical strength, and dielectric constant of the filament substrate 11 will be reduced.
  • a plurality of grooves 111 are formed on the outer surface of the filament substrate 11 for placing the LED chip 12.
  • the distribution of the grooves 111 depends on the distribution of the LED chips 12.
  • the grooves 111 are uniformly arranged in a radial direction (vertical direction) along the filament substrate 11, that is, the LED chips 12 are uniformly arranged in a radial direction (vertical direction) along the filament substrate 11, and adjacent LED chips 12 are passed through leads.
  • the depth of the groove 111 is 0.2-0.5 mm to better match the thickness of the LED chip 12.
  • the depth of the groove 111 should be controlled within a certain range.
  • a solid crystal portion is provided at the bottom of the groove 111, and the LED chip 12 is fixed in the groove 111 through the solid crystal portion.
  • the LED chip 12 includes several groups of chip strings (the chip strings are parallel to each other) radially distributed along the outer wall of the filament substrate 11, and the LED chips 12 in the chip string in the same group are combined in series, and the chips in different groups are combined. The strings are connected in parallel, thereby improving the large-area dead lamp phenomenon of the overall LED filament.
  • the LED chip 12 includes 2-12 groups of chip strings, and the distance between any two groups of adjacent chip strings is equal, which is beneficial to improving the luminous flux of the filament, and further improving the uniformity and intensity of light emitted by the LED filament. More preferably, the LED chip 12 includes 2-6 sets of chip strings, and the distance between any two adjacent sets of chip strings is equal.
  • the LED chip 12 includes two sets of chip strings, and the two sets of chip strings are respectively disposed in two opposite directions of the filament base 11, that is, in a cross-sectional direction, the LED chips 12 on the first group of chip strings and
  • the cross-section circle center line, the LED chip 12 on the second group of chip strings and the cross-section circle center line form an angle of 180 °.
  • the LED chip 12 includes four groups of chip strings, and the distance between any two groups of adjacent chip strings in the four groups of chip strings is equal. That is, in the cross-sectional direction, the LED chips 12 from the four groups of chip strings are located at the four vertices of the inscribed square of the cross-sectional circle, and the adjacent two LED chips 12 are connected to the center of the cross-sectional circle. 90 ° between them. As a result, the chip emits light uniformly at all four angles of the cylindrical filament substrate, which can significantly increase the luminous intensity of the filament.
  • the LED chip 12 includes six groups of chip strings, and the distance between any two groups of adjacent chip strings in the six groups of chip strings is equal. That is, in the cross-sectional direction, the LED chips 12 from the six groups of chip strings are located at the six vertices of the inscribed hexagon of the cross-sectional circle, and the adjacent two LED chips 12 are connected to the center of the cross-sectional circle. An angle of 60 ° is formed between the lines. As a result, the chip emits light uniformly at all six angles of the cylindrical filament substrate, which can significantly increase the luminous intensity of the filament.
  • the photoelectric function part of the LED filament is formed by the filament substrate 11 and the LED chip 12. It is worth noting that the LED filament substrate 1 further includes a first electrode pin 13 and a second electrode pin 13, and the first electrode pin The and second electrode pins are located at both ends of the filament substrate, respectively.
  • the surface of the groove 111 is provided with a flexible glass film 2.
  • the flexible glass film 2 is an integrated film, and the flexible glass film 2 is coated on the outer wall surface of the LED filament substrate 1.
  • the fluorescent glass film is seamlessly covered on the surface of the groove 111 or the surface of the filament substrate, which can block air from entering the device without providing a fluorescent glue, thereby improving the stability and vulcanization resistance of the LED filament device.
  • seamless cladding can be achieved by eutectic seamless welding technology.
  • the flexible glass film 2 is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene.
  • Flexible fluorescent glass film prepared by using glass powder, phosphor and graphene.
  • the light transmittance is high, and the light efficiency of the packaged LED chip 12 is high; on the other hand, the flexible fluorescent glass film has appropriate mechanics. The strength is conducive to protecting the filament device.
  • the fluorescent powder in the fluorescent glass film is evenly distributed in the glass powder, which has great advantages in terms of uniformity and stability of light output; and the addition of a small amount of graphene in the glass powder can effectively improve the heat dissipation performance of the device.
  • the content of the fluorescent powder in the flexible fluorescent glass film directly determines the light transmittance and uniformity of the flexible fluorescent glass film. If the content of the phosphor is too high, the light transmittance and the uniformity of the distribution of the flexible fluorescent glass film will be reduced; if the content of the phosphor is too low, the emission intensity of the phosphor will be insufficient, and the overall luminous efficacy of the LED filament will be insufficient.
  • the weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5), so that it can not only provide
  • the LED filament has excellent stability, vulcanization resistance, heat dissipation and good light efficiency.
  • the transmittance of the obtained fluorescent glass film can reach 93. %the above. Further preferably, a weight ratio of the glass powder, the fluorescent powder, and the graphene is 5.5: 1: 0.4. At this time, the transmittance of the obtained fluorescent glass film can reach 95% or more.
  • the thickness of the flexible fluorescent glass film is 0.05-1 mm. Further preferably, the flexible fluorescent glass has a thickness of 0.1-0.3 mm. If the thickness of the flexible fluorescent glass film is too thin, the stability of the LED filament device is not good enough; if the thickness of the flexible fluorescent glass film is too thick, the luminous intensity of the LED filament will be greatly reduced. As a preferred embodiment, the thickness of the flexible fluorescent glass film is 0.1 mm.
  • the phosphor includes at least one of aluminate green powder and nitrogen oxide green powder, and at least one of nitride red powder and fluoride red powder, so that the LED filament can emit white light.
  • the phosphor of the LED filament includes a nitride red powder
  • the nitride red powder is selected from (Ca, Sr) AlSiN 3 : Eu 2+ , (Sr, Ca) 2 Si 5 N 8 And SrLiAl 3 N 4 : Eu 2+
  • the nitride red powder is (Ca, Sr) AlSiN 3 : Eu 2+ , (Sr, Ca) 2 Si 5 N 8 , SrLiAl 3 N 4 : Two combinations of Eu 2+ and must contain SrLiAl 3 N 4 : Eu 2+ ).
  • the nitride red powder in the phosphor powder When the nitride red powder in the phosphor powder must contain SrLiAl 3 N 4 : Eu 2+ phosphor powder, it helps to improve the luminous efficiency of the filament.
  • the nitride red powder is a combination of (Ca, Sr) AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ phosphor.
  • the particle diameter of the phosphor is 1-5 microns.
  • the glass powder is a lead-free low-melting glass powder, and the particle size (D50) of the glass powder is 0.5-1 micrometer.
  • the flexible fluorescent glass film may be prepared by using a solution processing technology, and specifically includes: providing an organic slurry of glass powder, fluorescent powder, and graphene powder in proportion; and providing high light transmittance (light transmittance 93% or more) glass substrate, the organic slurry is deposited on the glass substrate by a solution processing method; the liquid film layer is sequentially dried (preferably 150 ° C) and sintered (preferably 600 ° C) to obtain flexibility Fluorescent glass film.
  • the solution processing method includes, but is not limited to, screen printing (a slurry is added to a screen, a scraper is given a certain pressure, and a constant speed is constant to form a uniform film).
  • the LED filament provided by the embodiment of the invention has the advantages of good light uniformity, high luminous efficiency, good heat dissipation performance, high reliability, and the like.
  • An LED filament includes:
  • the LED filament substrate includes a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and a plurality of grooves are formed on the outer surface of the filament substrate; LED The chip is disposed in a groove of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
  • the filament substrate is a copper / graphene composite substrate, in which graphene accounts for about 10%;
  • the LED chip includes 4 groups of chip strings, and the distance between any two groups of adjacent chip strings in the four groups of chip strings is equal;
  • the thickness of the flexible fluorescent glass film is 0.2mm, and the phosphor used in the phosphor is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ .
  • Example 1 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 10%.
  • Example 1 The difference from Example 1 is that the filament substrate is an AlN / graphene composite substrate, in which graphene accounts for about 10%; in a flexible fluorescent glass film, the weight ratio of the glass powder, fluorescent powder, and graphene is 4: 1: 0.3.
  • Example 1 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15% of the total weight.
  • Example 2 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 20%.
  • Example 1 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 25%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%;
  • the phosphor used is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , of which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 5% .
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%;
  • the phosphor used in the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and a mixture of SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 10%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%;
  • the phosphor used is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ mixture, among which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15% .
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and the phosphor used in the phosphor is aluminate.
  • nitride red powder (Ca, Sr) AlSiN 3 A mixture of Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : 15% of Eu 2+ phosphors.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the fluorescent glass is 0.05mm, and the phosphor used in the phosphor is aluminate green.
  • the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.3 mm, and the phosphor used in the phosphor is aluminum.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.5 mm, and the phosphor used in the phosphor is aluminate.
  • the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%;
  • the LED chip includes 6 groups of chip strings, and any two adjacent groups of the six groups of chip strings are adjacent.
  • the distance between the chip strings is the same;
  • the thickness of the flexible fluorescent glass film is 0.1mm,
  • the phosphor used in the phosphor is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr)
  • the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the vertical LED chip includes 12 groups of chip strings, and any two groups of twelve groups of chip strings are adjacent The distance between the chip strings is equal; the thickness of the flexible fluorescent glass film is 0.1mm, and the phosphor powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder.
  • (Ca, Sr) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , in which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
  • the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the LED chip includes two sets of chip strings, and the two sets of chip strings are respectively disposed on two opposite sides of the filament substrate.
  • the thickness of the flexible fluorescent glass film is 0.1mm, the phosphor used in the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 6: 1: 0.1, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film,
  • the weight ratio of the glass powder, the fluorescent powder and the graphene is 6: 1: 0.5, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr )
  • SrLiAl 3 N 4 Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.1, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film,
  • the weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.5, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr )
  • SrLiAl 3 N 4 Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.4, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
  • the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film,
  • the weight ratio of the glass powder, phosphor and graphene is 5.5: 1: 0.4, and the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr )
  • SrLiAl 3 N 4 Eu 2+ phosphors account for 15%.
  • the structure of the LED filament includes:
  • the LED filament substrate includes a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and the filament substrate A plurality of grooves are provided on the outer surface of the LED chip; the LED chips are arranged in the grooves of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
  • the filament substrate is a SiC / graphene composite substrate, and the proportion of graphene is about 15%;
  • the LED chip includes 4 groups of chip strings, and the distance between any two groups of adjacent chip strings among the four groups of chip strings is equal; glass The light transmittance of the sleeve is>95%;
  • the phosphor in the fluorescent glue is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2 + And a mixture of SrLiAl 3 N 4 : Eu 2+ , in which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
  • the LED filaments provided in Examples 1-22 and Comparative Example 1 were detected for light emission, and their light emission characteristics are shown in Table 1 below.
  • Example 1 Examples Relative luminous intensity at room temperature (%) Relative luminous intensity at 85 ° C (%) Example 1 100 90
  • Example 2 103 95
  • Example 3 101
  • Example 4 103 97
  • Example 5 102
  • Example 6 96
  • Example 7 108
  • Example 8 110
  • Example 9 106
  • Example 10 115
  • Example 11 109
  • Example 12 105
  • Example 13 99
  • Example 14 114
  • Example 15 110
  • Example 16 95 87
  • Example 17 118
  • Example 18 119
  • Example 19 Example 20
  • Example 21 Example 22 120 115 Contrast, Example 1 80 70
  • the LED filament provided in the embodiment of the present invention is not provided with a phosphor glue layer, and a flexible fluorescent glass film containing glass powder, phosphor and graphene is seamlessly covered in the recess
  • the surface of the groove can effectively improve the luminous intensity of the LED filament.
  • Example 22 The LED filaments provided in Example 22 and Comparative Example 1 were tested for light color performance, and the results are shown in Table 2 below.

Abstract

Provided is an LED filament, comprising: an LED filament substrate, the LED filament substrate comprising a filament substrate and several LED chips arranged on the filament substrate, the filament substrate comprising a cylindrical substrate, an outer surface of the filament substrate being provided with several recesses, the LED chips being arranged in the recesses of the filament substrate, the LED chips radially distributed on the outer wall of the filament substrate being electrically connected; a flexible glass film, the flexible glass film being seamlessly coated on surfaces of the recesses, the flexible glass film being a flexible fluorescent glass film, the flexible fluorescent glass film containing a glass powder, a fluorescent powder and graphene, the weight ratio of the glass powder, the fluorescent powder and the graphene in the flexible fluorescent glass film being (5-6):1:(0.1-0.5).

Description

一种LED灯丝LED filament 技术领域Technical field
本发明属于LED照明领域，尤其涉及一种LED灯丝。The invention belongs to the field of LED lighting, in particular to an LED filament.
背景技术Background technique
20世纪以来，LED凭借着节能环保，寿命长、体积小等优点迅速走红照明市场，LED成了未来主流的照明光源，广泛应用于商业照明、工业照明、户外照明等领域。2008年，日本牛尾光源推出以白炽灯原型配置LED的灯泡式灯具。“LED灯丝灯泡”开始涌现，自日本牛尾光源率先推出并量产，以LED灯丝为光源的蜡烛灯、球泡灯等产品在市场上逐渐受到愈来愈多消费者的青睐。Since the 20th century, LED has quickly become popular in the lighting market due to its advantages of energy saving, environmental protection, long life and small size. LED has become the mainstream lighting source in the future and is widely used in commercial lighting, industrial lighting, outdoor lighting and other fields. In 2008, the Japanese oxtail light source introduced a bulb-type lamp with an incandescent prototype configured with LEDs. "LED filament bulbs" have begun to emerge. Since the Japanese oxtail light source was first introduced and mass-produced, candles and bulb lamps with LED filament as the light source have gradually been favored by more and more consumers in the market.
近年来对LED灯丝的研究越来越广泛，目前LED灯丝主要存在功率小、散热差、光效不够高、发光面不够均匀、灯丝保护性差等问题。中国专利201510633662.7公布了一种灯丝及其制备方法，主要采用透明玻璃管来封装LED灯条。透明玻璃管能够起保护到LED灯丝的作用，使LED灯丝不易折断。另外通过向玻璃管中注塑荧光粉胶层，有利于提升荧光层的抗老化性能。但这种方法仍不能够兼顾有效解决LED灯丝散热、光效提升、发光均匀性及保护灯丝问题，故而针对现有技术问题，非常有必要开发一种LED灯丝技术，能够兼顾有效解决LED灯丝现有技术问题。In recent years, research on LED filaments has become more and more extensive. At present, LED filaments mainly have problems such as low power, poor heat dissipation, insufficient light efficiency, insufficient uniform light emitting surface, and poor filament protection. Chinese patent 201510633662.7 discloses a filament and a method for preparing the same, mainly using a transparent glass tube to package the LED light bar. The transparent glass tube can protect the LED filament, making the LED filament difficult to break. In addition, by injecting a fluorescent powder adhesive layer into a glass tube, it is beneficial to improve the anti-aging performance of the fluorescent layer. However, this method still cannot take into account the problems of LED filament heat dissipation, light efficiency improvement, uniformity of light emission and protection of the filament. Therefore, it is very necessary to develop an LED filament technology to solve the problems of LED filament. There are technical issues.
技术问题technical problem
本发明的目的在于提供一种高光效、散热性能好、灯丝保护性能好的LED灯丝，旨在解决现有的LED灯丝光效低、均匀性差、散热性能差、灯丝保护不好的问题。The purpose of the present invention is to provide an LED filament with high light efficiency, good heat dissipation performance and good filament protection performance, which aims to solve the problems of low light efficiency, poor uniformity, poor heat dissipation performance and poor filament protection of existing LED filaments.
技术解决方案Technical solutions
为实现上述发明目的，本发明采用的技术方案如下：In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is as follows:
本发明提供一种LED灯丝，包括：The invention provides an LED filament, including:
LED灯丝基底，所述LED灯丝基底包括灯丝基底以及布置在所述灯丝基底上的若干LED芯片，其中，所述灯丝基底包括圆柱形基底，所述灯丝基底的外表面开设有若干凹槽；所述LED芯片设置在所述灯丝基底的凹槽中，且在所述灯丝基底外壁径向分布的所述LED芯片电性连接；An LED filament substrate, the LED filament substrate including a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and an outer surface of the filament substrate is provided with a plurality of grooves; The LED chip is disposed in a groove of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
柔性玻璃膜，所述柔性玻璃膜无缝包覆在所述凹槽的表面，其中，所述柔性玻璃膜为柔性荧光玻璃膜，所述柔性荧光玻璃膜中含有玻璃粉、荧光粉和石墨烯，且所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为(5-6):1:(0.1-0.5)。A flexible glass film that seamlessly covers the surface of the groove, wherein the flexible glass film is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene In the flexible fluorescent glass film, a weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5).
有益效果Beneficial effect
本发明提供的LED灯丝，在LED芯片的表面无缝包覆有柔性玻璃膜，所述柔性玻璃膜直接包覆在LED芯片表面，能够有效阻隔空气进入LED灯丝内部，LED灯丝器件的稳定性、耐硫化性能有较大提升，从而提高LED灯丝的光电稳定性和使用寿命。同时，柔性玻璃膜具有适当的力学强度，有利于保护灯丝器件，使LED灯丝特别是LED芯片免受损坏。更重要的是，所述柔性玻璃膜中含有荧光粉和石墨烯，一方面，通过将荧光粉均匀复合在柔性玻璃膜材料中，可以在不额外提供荧光粉胶层的条件下，提高LED灯丝特别是LED芯片的抗老化性能，同时赋予所述LED灯丝较好的出光均匀性和稳定性，有利于改善LED灯丝的发光效果。此外，由于减少了荧光粉胶层的的设置，LED灯丝的体积缩小，使其结构更小巧化。另一方面，在所述柔性玻璃膜中添加有石墨烯，从而可以有效提高LED灯丝的散热性能，进一步提高LED灯丝的光电性能和使用寿命。The LED filament provided by the present invention is seamlessly covered with a flexible glass film on the surface of the LED chip. The flexible glass film is directly coated on the surface of the LED chip, which can effectively block air from entering the interior of the LED filament. The stability of the LED filament device, The vulcanization resistance has been greatly improved, thereby improving the photoelectric stability and service life of LED filaments. At the same time, the flexible glass film has a proper mechanical strength, which is beneficial to protect the filament device and protect the LED filament, especially the LED chip from damage. More importantly, the flexible glass film contains fluorescent powder and graphene. On the one hand, by uniformly compounding the fluorescent powder in the flexible glass film material, the LED filament can be improved without providing an additional phosphor powder layer. In particular, the anti-aging performance of the LED chip, while giving the LED filament a better light uniformity and stability, is beneficial to improving the light emitting effect of the LED filament. In addition, because the arrangement of the phosphor adhesive layer is reduced, the volume of the LED filament is reduced, making the structure more compact. On the other hand, graphene is added to the flexible glass film, so that the heat dissipation performance of the LED filament can be effectively improved, and the photoelectric performance and service life of the LED filament can be further improved.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明实施例提供的设置两组LED芯片串的LED灯丝的结构示意图。FIG. 1 is a schematic structural diagram of an LED filament provided with two sets of LED chip strings according to an embodiment of the present invention.
本发明的实施方式Embodiments of the invention
为了使本发明要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the technical problems, technical solutions, and beneficial effects to be more clearly understood by the present invention, the present invention will be further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of the present invention, it should be understood that the terms “first” and “second” are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless specifically defined otherwise.
结合图1，本发明实施例提供了一种LED灯丝，包括：With reference to FIG. 1, an embodiment of the present invention provides an LED filament, including:
LED灯丝基底1，LED灯丝基底1包括灯丝基底11以及布置在灯丝基底11上的若干LED芯片12，其中，灯丝基底11包括圆柱形基底，灯丝基底11的外表面开设有若干凹槽111；LED芯片12设置在灯丝基底11的凹槽111中，且在灯丝基底11外壁径向分布的LED芯片12电性连接；LED filament substrate 1, the LED filament substrate 1 includes a filament substrate 11 and a plurality of LED chips 12 arranged on the filament substrate 11, wherein the filament substrate 11 includes a cylindrical substrate, and a plurality of grooves 111 are formed on the outer surface of the filament substrate 11; The chip 12 is disposed in the groove 111 of the filament substrate 11, and the LED chips 12 distributed radially on the outer wall of the filament substrate 11 are electrically connected;
柔性玻璃膜2，柔性玻璃膜2无缝包覆在凹槽111的表面，其中，柔性玻璃膜2为柔性荧光玻璃膜，所述柔性荧光玻璃膜中含有玻璃粉、荧光粉和石墨烯，且所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为(5-6):1:(0.1-0.5)。The flexible glass film 2 seamlessly covers the surface of the recess 111, wherein the flexible glass film 2 is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene, and In the flexible fluorescent glass film, a weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5).
本发明实施例提供的LED灯丝，在LED芯片12的表面无缝包覆有柔性玻璃膜2，柔性玻璃膜2直接包覆在LED芯片12表面，能够有效阻隔空气进入LED灯丝内部，LED灯丝器件的稳定性、耐硫化性能有较大提升，从而提高LED灯丝的光电稳定性和使用寿命。同时，柔性玻璃膜2具有适当的力学强度，有利于保护灯丝器件，使LED灯丝特别是LED芯片12免受损坏。更重要的是，柔性玻璃膜2中含有荧光粉和石墨烯，一方面，通过将荧光粉均匀复合在柔性玻璃膜2材料中，可以在不额外提供荧光粉胶层的条件下，提高LED灯丝特别是LED芯片12的抗老化性能，同时赋予所述LED灯丝较好的出光均匀性和稳定性，有利于改善LED灯丝的发光效果。此外，由于减少了荧光粉胶层的的设置，LED灯丝的体积缩小，使其结构更小巧化。另一方面，在柔性玻璃膜2中添加有石墨烯，从而可以有效提高LED灯丝的散热性能，进一步提高LED灯丝的光电性能和使用寿命。The surface of the LED chip 12 is seamlessly covered with a flexible glass film 2 on the surface of the LED chip 12, and the flexible glass film 2 is directly covered on the surface of the LED chip 12, which can effectively block air from entering the interior of the LED filament, and the LED filament device. The stability and vulcanization resistance have been greatly improved, thereby improving the photoelectric stability and service life of LED filaments. At the same time, the flexible glass film 2 has a proper mechanical strength, which is beneficial for protecting the filament device and protecting the LED filament, especially the LED chip 12 from damage. More importantly, the flexible glass film 2 contains fluorescent powder and graphene. On the one hand, by uniformly compounding the fluorescent powder in the flexible glass film 2 material, the LED filament can be improved without providing an additional phosphor powder layer. In particular, the anti-aging performance of the LED chip 12 also gives the LED filament a better uniformity and stability of light emission, which is beneficial to improving the light-emitting effect of the LED filament. In addition, because the arrangement of the phosphor adhesive layer is reduced, the volume of the LED filament is reduced, making the structure more compact. On the other hand, graphene is added to the flexible glass film 2 so that the heat dissipation performance of the LED filament can be effectively improved, and the photoelectric performance and service life of the LED filament can be further improved.
本发明实施例中，LED灯丝基底1本身作为一个功能结构，可以实现LED灯丝的光电功能。具体的，LED灯丝基底1包括灯丝基底11，灯丝基底11作为一个支架结构，不仅用于承载LED芯片12，同时，灯丝基底11中还布设有用于实现LED灯丝电性连接的电路系统。In the embodiment of the present invention, the LED filament substrate 1 itself serves as a functional structure, and can realize the photoelectric function of the LED filament. Specifically, the LED filament substrate 1 includes a filament substrate 11. The filament substrate 11 is used as a bracket structure, and is not only used to carry the LED chip 12. At the same time, the filament substrate 11 is also provided with a circuit system for electrically connecting the LED filaments.
在一些实施例中，灯丝基底11为圆柱形基底，LED芯片12设置在所述圆柱形基底外壁，从而提高LED灯丝的发光均匀性。In some embodiments, the filament substrate 11 is a cylindrical substrate, and the LED chip 12 is disposed on an outer wall of the cylindrical substrate, so as to improve the uniformity of light emitted by the LED filament.
在一些实施例中，灯丝基底11为圆柱形透明基底，圆柱形透明基底有助于LED芯片12所散发出来的光线透过基底背部，进一步地能够提高出光均匀率和出光角度。In some embodiments, the filament substrate 11 is a cylindrical transparent substrate. The cylindrical transparent substrate helps the light emitted by the LED chip 12 to pass through the back of the substrate, and can further improve the uniformity of light output and the angle of light output.
灯丝基底11的材质可以选择常规的灯丝基底用材质。本发明实施例中，优选的，灯丝基底11为金属/石墨烯复合基底（将金属和石墨烯材料复合制成的基板）或陶瓷/石墨烯复合基底（将陶瓷和石墨烯材料复合制成的基板），更优选为陶瓷/石墨烯复合基板。所述石墨烯与常规的灯丝基底材料金属、陶瓷等材料具有较好的材料相容性，得到的复合材料能够满足灯丝基底的使用要求。更重要的是，通过在灯丝基底材料中添加石墨烯，不仅有助于提升灯丝基底11的导热率，进一步提升LED灯丝的发光效率；而且可以有效提高灯丝基底11的散热效果，解决现有灯丝基底散热效果差的技术难题，提升灯丝使用寿命。The material of the filament base 11 can be selected from conventional filament base materials. In the embodiment of the present invention, preferably, the filament substrate 11 is a metal / graphene composite substrate (a substrate made of a composite of a metal and a graphene material) or a ceramic / graphene composite substrate (a composite made of a ceramic and a graphene material) Substrate), more preferably a ceramic / graphene composite substrate. The graphene has good material compatibility with conventional filament base materials such as metal and ceramics, and the obtained composite material can meet the requirements for the use of the filament base. More importantly, by adding graphene to the filament base material, it not only helps to increase the thermal conductivity of the filament base 11 and further improve the luminous efficiency of the LED filament; it can also effectively improve the heat dissipation effect of the filament base 11 and solve the existing filament The technical problem of poor heat dissipation effect of the substrate improves the service life of the filament.
在一些具体实施例中，灯丝基底11为SiC/石墨烯复合基底。一方面，SiC和石墨烯在导热系数和热膨胀系数方面性能较为匹配，使得灯丝复合基底能够保持其结构稳定性，同时还能降低热阻，增强基底的导热性能；另一方面，SiC与石墨烯复合制备的基底散热效果非常好，能够有效提升LED灯丝的使用寿命。In some specific embodiments, the filament substrate 11 is a SiC / graphene composite substrate. On the one hand, the performance of SiC and graphene are relatively matched in terms of thermal conductivity and thermal expansion coefficient, so that the filament composite substrate can maintain its structural stability, while reducing the thermal resistance and enhancing the thermal conductivity of the substrate; on the other hand, SiC and graphene The composite substrate has a very good heat dissipation effect, which can effectively improve the service life of the LED filament.
进一步的，所述SiC/石墨烯复合基底中，所述石墨烯的重量占整个SiC/石墨烯复合基底重量的10%-20%。如果所述石墨烯复合含量过低，材料的导热性能和散热效果提升不明显；如果石墨烯复合含量超过20%，会导致灯丝基底11结构稳定性、机械强度、介电常数等性能下降。Further, in the SiC / graphene composite substrate, the weight of the graphene accounts for 10% -20% of the weight of the entire SiC / graphene composite substrate. If the graphene composite content is too low, the thermal conductivity and heat dissipation effect of the material will not be improved significantly; if the graphene composite content exceeds 20%, the structural stability, mechanical strength, and dielectric constant of the filament substrate 11 will be reduced.
本发明实施例中，灯丝基底11的外表面开设有用于放置LED芯片12的若干凹槽111。凹槽111的分布根据LED芯片12的分布情况而定。优选的，凹槽111在沿灯丝基底11径向（竖直方向）上均匀排列，即LED芯片12在沿灯丝基底11径向（竖直方向）上均匀排列，相邻的LED芯片12通过引线完成电性连接。在一些实施例中，凹槽111的深度为0.2-0.5毫米，以更好地与LED芯片12的厚度相配合。此外，由于灯丝基底11特别是凹槽111的表面与柔性玻璃膜2焊接在一起，若凹槽111深度太深的话，会造成焊接过程中工艺难度加大，且正面出光有所损失；若凹槽111深度太浅，LED芯片12本身发出的光和其他芯片发出的光照射到其侧面会被大量吸收，这样也会造成出光损失，因此凹槽111的深度应控制在一定的范围。In the embodiment of the present invention, a plurality of grooves 111 are formed on the outer surface of the filament substrate 11 for placing the LED chip 12. The distribution of the grooves 111 depends on the distribution of the LED chips 12. Preferably, the grooves 111 are uniformly arranged in a radial direction (vertical direction) along the filament substrate 11, that is, the LED chips 12 are uniformly arranged in a radial direction (vertical direction) along the filament substrate 11, and adjacent LED chips 12 are passed through leads. Complete electrical connection. In some embodiments, the depth of the groove 111 is 0.2-0.5 mm to better match the thickness of the LED chip 12. In addition, since the surface of the filament substrate 11, especially the groove 111, is welded with the flexible glass film 2, if the depth of the groove 111 is too deep, the process will be more difficult during the welding process, and the front light will be lost. The depth of the groove 111 is too shallow, and the light emitted by the LED chip 12 itself and the light emitted by other chips will be absorbed by a large amount on its side, which will also cause light loss. Therefore, the depth of the groove 111 should be controlled within a certain range.
凹槽111底部设置固晶部，LED芯片12通过所述固晶部固定在凹槽111中。在一些实施例中，LED芯片12包括若干组沿灯丝基底11外壁径向分布的芯片串（芯片串相互平行），且同组所述芯片串中的LED芯片12串联结合，不同组所述芯片串之间并联结合，由此改善整体LED灯丝大面积死灯现象。A solid crystal portion is provided at the bottom of the groove 111, and the LED chip 12 is fixed in the groove 111 through the solid crystal portion. In some embodiments, the LED chip 12 includes several groups of chip strings (the chip strings are parallel to each other) radially distributed along the outer wall of the filament substrate 11, and the LED chips 12 in the chip string in the same group are combined in series, and the chips in different groups are combined. The strings are connected in parallel, thereby improving the large-area dead lamp phenomenon of the overall LED filament.
进一步的，LED芯片12包括2-12组芯片串，且任意两组相邻的所述芯片串之间的距离相等，有利于提升灯丝的光通量，进而提高LED灯丝的发光均匀性和发光强度。更优选的，LED芯片12包括2-6组芯片串，且任意两组相邻的所述芯片串之间的距离相等。Further, the LED chip 12 includes 2-12 groups of chip strings, and the distance between any two groups of adjacent chip strings is equal, which is beneficial to improving the luminous flux of the filament, and further improving the uniformity and intensity of light emitted by the LED filament. More preferably, the LED chip 12 includes 2-6 sets of chip strings, and the distance between any two adjacent sets of chip strings is equal.
作为一种具体实施方式，LED芯片12包括2组芯片串，两组芯片串分别设置在灯丝基底11相对的两个方向，即在横截面方向上，第一组芯片串上的LED芯片12与横截面圆心的连线、第二组芯片串上的LED芯片12与横截面圆心的连线呈180°角度。As a specific embodiment, the LED chip 12 includes two sets of chip strings, and the two sets of chip strings are respectively disposed in two opposite directions of the filament base 11, that is, in a cross-sectional direction, the LED chips 12 on the first group of chip strings and The cross-section circle center line, the LED chip 12 on the second group of chip strings and the cross-section circle center line form an angle of 180 °.
作为另一种具体实施方式，LED芯片12包括4组芯片串，四组芯片串中任意两组相邻的所述芯片串之间的距离相等。即在横截面方向上，来自四组芯片串的LED芯片12，分处于所述横截面圆的内接正方形的四个顶点处，相邻的两个LED芯片12与横截面圆心的连线之间形成90°夹角。由此，在圆柱形灯丝基板的四个角度均有芯片均匀发光，能明显提高灯丝的发光强度。As another specific implementation manner, the LED chip 12 includes four groups of chip strings, and the distance between any two groups of adjacent chip strings in the four groups of chip strings is equal. That is, in the cross-sectional direction, the LED chips 12 from the four groups of chip strings are located at the four vertices of the inscribed square of the cross-sectional circle, and the adjacent two LED chips 12 are connected to the center of the cross-sectional circle. 90 ° between them. As a result, the chip emits light uniformly at all four angles of the cylindrical filament substrate, which can significantly increase the luminous intensity of the filament.
作为再一种具体实施方式，LED芯片12包括6组芯片串，六组芯片串中任意两组相邻的所述芯片串之间的距离相等。即在横截面方向上，来自六组芯片串的LED芯片12，分处于所述横截面圆的内接六边形的六个顶点处，相邻的两个LED芯片12与横截面圆心的连线之间形成60°夹角。由此，在圆柱形灯丝基板的六个角度均有芯片均匀发光，能明显提高灯丝的发光强度。As another specific implementation manner, the LED chip 12 includes six groups of chip strings, and the distance between any two groups of adjacent chip strings in the six groups of chip strings is equal. That is, in the cross-sectional direction, the LED chips 12 from the six groups of chip strings are located at the six vertices of the inscribed hexagon of the cross-sectional circle, and the adjacent two LED chips 12 are connected to the center of the cross-sectional circle. An angle of 60 ° is formed between the lines. As a result, the chip emits light uniformly at all six angles of the cylindrical filament substrate, which can significantly increase the luminous intensity of the filament.
本发明实施例通过灯丝基底11、LED芯片12形成LED灯丝的光电功能部件，值得注意的是，LED灯丝基底1还包括第一电极引脚13和第二电极引脚13，第一电极引脚和第二电极引脚分别位于灯丝基板的两端。In the embodiment of the present invention, the photoelectric function part of the LED filament is formed by the filament substrate 11 and the LED chip 12. It is worth noting that the LED filament substrate 1 further includes a first electrode pin 13 and a second electrode pin 13, and the first electrode pin The and second electrode pins are located at both ends of the filament substrate, respectively.
为了有效保护灯丝内部芯片以及引线结构，避免因为结构破坏或压线等原因导致死灯现象，凹槽111的表面设置有柔性玻璃膜2。进一步优选的，为了简化制备工艺，并获得保护性能更全的LED灯丝，柔性玻璃膜2为一体膜，且柔性玻璃膜2包覆在LED灯丝基底1的外壁面。荧光玻璃膜无缝包覆在凹槽111的表面或灯丝基板表面，可以在不设置荧光胶的前提下，阻隔空气进入器件内部，提高LED灯丝器件的稳定性、耐硫化性能。而无缝包覆可采用共晶无缝焊接技术实现。In order to effectively protect the chip inside the filament and the lead structure, and avoid the dead lamp phenomenon caused by structural damage or crimping, the surface of the groove 111 is provided with a flexible glass film 2. Further preferably, in order to simplify the manufacturing process and obtain LED filaments with more complete protection performance, the flexible glass film 2 is an integrated film, and the flexible glass film 2 is coated on the outer wall surface of the LED filament substrate 1. The fluorescent glass film is seamlessly covered on the surface of the groove 111 or the surface of the filament substrate, which can block air from entering the device without providing a fluorescent glue, thereby improving the stability and vulcanization resistance of the LED filament device. And seamless cladding can be achieved by eutectic seamless welding technology.
柔性玻璃膜2为柔性荧光玻璃膜，所述柔性荧光玻璃膜中含有玻璃粉、荧光粉和石墨烯。采用玻璃粉、荧光粉和石墨烯所制备的柔性荧光玻璃膜，一方面，透光率较高，所封装的LED芯片12的光效较高；另一方面，柔性荧光玻璃膜具有适当的力学强度，有利于保护灯丝器件。此外，荧光玻璃膜中荧光粉均匀分布于玻璃粉中，在出光的均匀性和稳定性方面具有很大的优势；而玻璃粉中添加有少量的石墨烯，能够有效提升器件的散热性能。The flexible glass film 2 is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene. Flexible fluorescent glass film prepared by using glass powder, phosphor and graphene. On the one hand, the light transmittance is high, and the light efficiency of the packaged LED chip 12 is high; on the other hand, the flexible fluorescent glass film has appropriate mechanics. The strength is conducive to protecting the filament device. In addition, the fluorescent powder in the fluorescent glass film is evenly distributed in the glass powder, which has great advantages in terms of uniformity and stability of light output; and the addition of a small amount of graphene in the glass powder can effectively improve the heat dissipation performance of the device.
所述柔性荧光玻璃膜中荧光粉的含量直接决定着柔性荧光玻璃膜的透光率和均匀性。若荧光粉含量过高，会导致柔性荧光玻璃膜的透光性和分布均匀性下降；若荧光粉含量过低，会引起荧光粉发射强度不够，进而导致LED灯丝整体光效不够。鉴于此，在一些实施例中，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为(5-6):1:(0.1-0.5)，由此不仅能够赋予所述LED灯丝优异的稳定性、耐硫化性能、散热性和较好的光效，而且，通过控制合适的玻璃粉、荧光粉和石墨烯，得到的性荧光玻璃膜的透光率能够达到93%以上。进一步优选的，所述玻璃粉、荧光粉和石墨烯的重量比为5.5:1:0.4。此时，得到的性荧光玻璃膜的透光率能够达到95%以上。The content of the fluorescent powder in the flexible fluorescent glass film directly determines the light transmittance and uniformity of the flexible fluorescent glass film. If the content of the phosphor is too high, the light transmittance and the uniformity of the distribution of the flexible fluorescent glass film will be reduced; if the content of the phosphor is too low, the emission intensity of the phosphor will be insufficient, and the overall luminous efficacy of the LED filament will be insufficient. In view of this, in some embodiments, in the flexible fluorescent glass film, the weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5), so that it can not only provide The LED filament has excellent stability, vulcanization resistance, heat dissipation and good light efficiency. In addition, by controlling suitable glass powder, fluorescent powder and graphene, the transmittance of the obtained fluorescent glass film can reach 93. %the above. Further preferably, a weight ratio of the glass powder, the fluorescent powder, and the graphene is 5.5: 1: 0.4. At this time, the transmittance of the obtained fluorescent glass film can reach 95% or more.
在一些实施例中，所述柔性荧光玻璃膜的厚度为0.05-1毫米。进一步优选的，所述柔性荧光玻璃厚度为0.1-0.3mm。若所述柔性荧光玻璃膜的厚度太薄，LED灯丝器件的稳定性不够好；若所述柔性荧光玻璃膜的厚度太厚，LED灯丝的发光强度会大大降低。作为最佳实施例，所述柔性荧光玻璃膜的厚度为0.1毫米。In some embodiments, the thickness of the flexible fluorescent glass film is 0.05-1 mm. Further preferably, the flexible fluorescent glass has a thickness of 0.1-0.3 mm. If the thickness of the flexible fluorescent glass film is too thin, the stability of the LED filament device is not good enough; if the thickness of the flexible fluorescent glass film is too thick, the luminous intensity of the LED filament will be greatly reduced. As a preferred embodiment, the thickness of the flexible fluorescent glass film is 0.1 mm.
在一些实施例中，所述荧光粉包括铝酸盐绿粉、氮氧化物绿粉中的至少一种，以及氮化物红粉、氟化物红粉中的至少一种，从而LED灯丝可以发射白光。In some embodiments, the phosphor includes at least one of aluminate green powder and nitrogen oxide green powder, and at least one of nitride red powder and fluoride red powder, so that the LED filament can emit white light.
在一些实施例中，所述LED灯丝所述荧光粉包括氮化物红粉，且所述氮化物红粉选自（Ca，Sr）AlSiN 3:Eu 2+、（Sr，Ca） 2Si 5N 8中的一种，以及SrLiAl 3N 4：Eu 2+（即：所述氮化物红粉为（Ca，Sr）AlSiN 3:Eu 2+、（Sr，Ca） 2Si 5N 8、SrLiAl 3N 4：Eu 2+的两种组合，且必含SrLiAl 3N 4：Eu 2+）。所述荧光粉只中氮化物红粉必含SrLiAl 3N 4：Eu 2+荧光粉时，有助于提升灯丝的发光效率。在一些实施例中，所述氮化物红粉为（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+荧光粉的组合。 In some embodiments, the phosphor of the LED filament includes a nitride red powder, and the nitride red powder is selected from (Ca, Sr) AlSiN 3 : Eu 2+ , (Sr, Ca) 2 Si 5 N 8 And SrLiAl 3 N 4 : Eu 2+ (that is, the nitride red powder is (Ca, Sr) AlSiN 3 : Eu 2+ , (Sr, Ca) 2 Si 5 N 8 , SrLiAl 3 N 4 : Two combinations of Eu 2+ and must contain SrLiAl 3 N 4 : Eu 2+ ). When the nitride red powder in the phosphor powder must contain SrLiAl 3 N 4 : Eu 2+ phosphor powder, it helps to improve the luminous efficiency of the filament. In some embodiments, the nitride red powder is a combination of (Ca, Sr) AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ phosphor.
在上述实施例的基础上，所述荧光粉的粒径为1-5微米。Based on the above examples, the particle diameter of the phosphor is 1-5 microns.
在一些实施例中，所述玻璃粉采用无铅低熔点玻璃粉，玻璃粉的粒径（D50）为0.5-1微米。In some embodiments, the glass powder is a lead-free low-melting glass powder, and the particle size (D50) of the glass powder is 0.5-1 micrometer.
作为一种具体实施方式，所述柔性荧光玻璃膜可以采用溶液加工技术制备，具体包括：按比例提供玻璃粉、荧光粉和石墨烯粉体的有机浆料；提供高透光率（透光率大于等于93%）的玻璃基板，采用溶液加工法将所述有机浆料沉积在所述玻璃基板上；对液态膜层依次进行干燥（优选150℃）和烧结处理（优选600℃），得到柔性荧光玻璃膜。其中，所述溶液加工法包括但不限于丝网印刷（采用丝网加入浆料，将刮刀给定一定压力，以恒定的速度一定，形成均匀的薄膜）。As a specific implementation manner, the flexible fluorescent glass film may be prepared by using a solution processing technology, and specifically includes: providing an organic slurry of glass powder, fluorescent powder, and graphene powder in proportion; and providing high light transmittance (light transmittance 93% or more) glass substrate, the organic slurry is deposited on the glass substrate by a solution processing method; the liquid film layer is sequentially dried (preferably 150 ° C) and sintered (preferably 600 ° C) to obtain flexibility Fluorescent glass film. Wherein, the solution processing method includes, but is not limited to, screen printing (a slurry is added to a screen, a scraper is given a certain pressure, and a constant speed is constant to form a uniform film).
本发明实施例提供的LED灯丝具有出光均匀性好、发光效率高、散热性能好、可靠性高等优点。The LED filament provided by the embodiment of the invention has the advantages of good light uniformity, high luminous efficiency, good heat dissipation performance, high reliability, and the like.
下面结合具体实施例进行说明。The following description is made with reference to specific embodiments.
实施例1Example 1
一种LED灯丝，包括：An LED filament includes:
LED灯丝基底，所述LED灯丝基底包括灯丝基底以及布置在所述灯丝基底上的若干LED芯片，其中，所述灯丝基底包括圆柱形基底，所述灯丝基底的外表面开设有若干凹槽；LED芯片设置在所述灯丝基底的凹槽中，且在所述灯丝基底外壁径向分布的LED芯片电性连接；LED filament substrate, the LED filament substrate includes a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and a plurality of grooves are formed on the outer surface of the filament substrate; LED The chip is disposed in a groove of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
柔性玻璃膜，柔性玻璃膜无缝包覆在所述凹槽的表面，其中，柔性玻璃膜为柔性荧光玻璃膜，所述柔性荧光玻璃膜中含有玻璃粉、荧光粉和石墨烯，且所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为5：1：0.3。A flexible glass film, the flexible glass film seamlessly covers the surface of the groove, wherein the flexible glass film is a flexible fluorescent glass film, the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene, and the In the flexible fluorescent glass film, a weight ratio of the glass powder, the fluorescent powder, and the graphene is 5: 1: 0.3.
其中，灯丝基板为铜/石墨烯复合基板，其中石墨烯占比重约10%；LED芯片包括4组芯片串，四组芯片串中任意两组相邻的所述芯片串之间的距离相等；所述柔性荧光玻璃膜的厚度为0.2mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+和氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+的混合物。 Wherein, the filament substrate is a copper / graphene composite substrate, in which graphene accounts for about 10%; the LED chip includes 4 groups of chip strings, and the distance between any two groups of adjacent chip strings in the four groups of chip strings is equal; The thickness of the flexible fluorescent glass film is 0.2mm, and the phosphor used in the phosphor is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ .
实施例2Example 2
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中石墨烯占比重约10%。The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 10%.
实施例3Example 3
与实施例1的不同之处在于，灯丝基板为AlN/石墨烯复合基板，其中，石墨烯占比重约10%；柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为4：1：0.3。The difference from Example 1 is that the filament substrate is an AlN / graphene composite substrate, in which graphene accounts for about 10%; in a flexible fluorescent glass film, the weight ratio of the glass powder, fluorescent powder, and graphene is 4: 1: 0.3.
实施例4Example 4
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%。The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15% of the total weight.
实施例5Example 5
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约20%。The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 20%.
实施例6Example 6
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约25%。The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 25%.
实施例7Example 7
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重5%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the phosphor used is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , of which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 5% .
实施例8Example 8
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中石墨烯占比重约15%；荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重10%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the phosphor used in the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and a mixture of SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 10%.
实施例9Example 9
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the phosphor used is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ mixture, among which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15% .
实施例10Example 10
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；柔性荧光玻璃膜的厚度为0.1mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and the phosphor used in the phosphor is aluminate. Salt green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : 15% of Eu 2+ phosphors.
实施例11Example 11
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；性荧光玻璃厚度为0.05mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the fluorescent glass is 0.05mm, and the phosphor used in the phosphor is aluminate green. Powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and a mixture of SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
实施例12Example 12
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；，柔性荧光玻璃膜的厚度为0.3mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.3 mm, and the phosphor used in the phosphor is aluminum. Acid green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ mixture, among them, SrLiAl 3 N 4 : The proportion of Eu 2+ phosphor is 15%.
实施例13Example 13
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；柔性荧光玻璃膜的厚度为0.5mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.5 mm, and the phosphor used in the phosphor is aluminate. Salt green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : A mixture of Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , among which SrLiAl 3 N 4 : 15% of Eu 2+ phosphors.
实施例14Example 14
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；LED芯片包括6组芯片串，六组芯片串中任意两组相邻的所述芯片串之间的距离相等；柔性荧光玻璃膜的厚度为0.1mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the LED chip includes 6 groups of chip strings, and any two adjacent groups of the six groups of chip strings are adjacent. The distance between the chip strings is the same; the thickness of the flexible fluorescent glass film is 0.1mm, the phosphor used in the phosphor is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , in which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
实施例15Example 15
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；竖LED芯片包括12组芯片串，十二组芯片串中任意两组相邻的所述芯片串之间的距离相等；柔性荧光玻璃膜的厚度为0.1mm，荧光粉采用中的采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the vertical LED chip includes 12 groups of chip strings, and any two groups of twelve groups of chip strings are adjacent The distance between the chip strings is equal; the thickness of the flexible fluorescent glass film is 0.1mm, and the phosphor powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder. (Ca, Sr) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ , in which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
实施例16Example 16
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；LED芯片包括2组芯片串，两组芯片串分别设置在灯丝基底相对的两个方向；所述柔性荧光玻璃膜的厚度为0.1mm，荧光粉采用中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, of which graphene accounts for about 15%; the LED chip includes two sets of chip strings, and the two sets of chip strings are respectively disposed on two opposite sides of the filament substrate. The thickness of the flexible fluorescent glass film is 0.1mm, the phosphor used in the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例17Example 17
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为6：1：0.1，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 6: 1: 0.1, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例18Example 18
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为6：1：0.5，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 6: 1: 0.5, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例19Example 19
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为5：1：0.1，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.1, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例20Example 20
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为5：1：0.5，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.5, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例21Example 21
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为5：1：0.4，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, the fluorescent powder and the graphene is 5: 1: 0.4, and the fluorescent powder is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
实施例22Example 22
与实施例1的不同之处在于，灯丝基板为SiC/石墨烯复合基板，其中，石墨烯占比重约15%；所述柔性荧光玻璃膜的厚度为0.1mm，所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为5.5：1：0.4，荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 The difference from Example 1 is that the filament substrate is a SiC / graphene composite substrate, in which graphene accounts for about 15%; the thickness of the flexible fluorescent glass film is 0.1 mm, and in the flexible fluorescent glass film, The weight ratio of the glass powder, phosphor and graphene is 5.5: 1: 0.4, and the phosphor uses aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ and nitride red powder (Ca, Sr ) A mixture of AlSiN 3 : Eu 2+ and SrLiAl 3 N 4 : Eu 2+ . Among them, SrLiAl 3 N 4 : Eu 2+ phosphors account for 15%.
对比例1Comparative Example 1
LED灯丝的结构包括：The structure of the LED filament includes:
玻璃套管；Glass sleeve
套设于所述玻璃套管中的LED灯丝基底，所述LED灯丝基底包括灯丝基底以及布置在所述灯丝基底上的若干LED芯片，其中，所述灯丝基底包括圆柱形基底，所述灯丝基底的外表面开设有若干凹槽；LED芯片设置在所述灯丝基底的凹槽中，且在所述灯丝基底外壁径向分布的LED芯片电性连接；An LED filament substrate sleeved in the glass sleeve, the LED filament substrate includes a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and the filament substrate A plurality of grooves are provided on the outer surface of the LED chip; the LED chips are arranged in the grooves of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
填充（灌注）于所述玻璃套管和所述LED灯丝基底之间的荧光胶，Filling (filling) a fluorescent glue between the glass sleeve and the LED filament substrate,
其中，灯丝基板为SiC/石墨烯复合基板，石墨烯占比重约15%；LED芯片包括4组芯片串，四组芯片串中任意两组相邻的所述芯片串之间的距离相等；玻璃套管的透光率＞95%；荧光胶中的荧光粉采用铝酸盐绿粉Y 3(Al,Ga) 5O 12:Ce 3+、氮化物红粉（Ca，Sr）AlSiN 3:Eu 2+和SrLiAl 3N 4：Eu 2+的混合物，其中，SrLiAl 3N 4：Eu 2+荧光粉占比重15%。 Among them, the filament substrate is a SiC / graphene composite substrate, and the proportion of graphene is about 15%; the LED chip includes 4 groups of chip strings, and the distance between any two groups of adjacent chip strings among the four groups of chip strings is equal; glass The light transmittance of the sleeve is>95%; the phosphor in the fluorescent glue is aluminate green powder Y 3 (Al, Ga) 5 O 12 : Ce 3+ , nitride red powder (Ca, Sr) AlSiN 3 : Eu 2 + And a mixture of SrLiAl 3 N 4 : Eu 2+ , in which SrLiAl 3 N 4 : Eu 2+ phosphor accounts for 15%.
将实施例1-22以及对比例1提供的LED灯丝进行发光检测，其发光特征如下表1所示。The LED filaments provided in Examples 1-22 and Comparative Example 1 were detected for light emission, and their light emission characteristics are shown in Table 1 below.
表1Table 1
实施例 Examples 室温相对发光强度（%） Relative luminous intensity at room temperature (%) 85℃相对发光强度（%） Relative luminous intensity at 85 ° C (%)
实施例1 Example 1 100 100 90 90
实施例2 Example 2 103 103 95 95
实施例3 Example 3 101 101 92 92
实施例4 Example 4 103 103 97 97
实施例5 Example 5 102 102 96 96
实施例6 Example 6 96 96 89 89
实施例7 Example 7 108 108 101 101
实施例8 Example 8 110 110 103 103
实施例9 Example 9 106 106 99 99
实施例10 Example 10 115 115 107 107
实施例11 Example 11 109 109 102 102
实施例12 Example 12 105 105 99 99
实施例13 Example 13 99 99 94 94
实施例14 Example 14 114 114 106 106
实施例15 Example 15 110 110 104 104
实施例16 Example 16 95 95 87 87
实施例17 Example 17 118 118 111 111
实施例18 Example 18 119 119 113 113
实施例19 Example 19 109 109 101 101
实施例20 Example 20 112 112 104 104
实施例21 Example 21 113 113 106 106
实施例22 Example 22 120 120 115 115
对比,例1 Contrast, Example 1 80 80 70 70
由表1可见，相较于对比例1，本发明实施例提供的LED灯丝，没有设置荧光粉胶层，而且将含有玻璃粉、荧光粉和石墨烯的柔性荧光玻璃膜无缝包覆在凹槽的表面，从而可以有效提高LED灯丝的发光强度。As can be seen from Table 1, compared to Comparative Example 1, the LED filament provided in the embodiment of the present invention is not provided with a phosphor glue layer, and a flexible fluorescent glass film containing glass powder, phosphor and graphene is seamlessly covered in the recess The surface of the groove can effectively improve the luminous intensity of the LED filament.
将实施例22以及对比例1提供的LED灯丝进行光色性能检测，结果如下表2所示。The LED filaments provided in Example 22 and Comparative Example 1 were tested for light color performance, and the results are shown in Table 2 below.
表2Table 2
实施例 Examples 坐标偏差（%） Coordinate deviation (%) 发光效率（%） Luminous efficiency(%) 良率（%） Yield rate (%)
实施例22 Example 22 0.5% 0.5% 100 100 98 98
对比实施例1 Comparative Example 1 10% 10% 90 90 80 80
由表2可知，采用柔性荧光玻璃膜相对于玻璃套管灌胶方式获得的LED灯丝，光色性能更稳定，良率更高，且发光效率有明显的提升。As can be seen from Table 2, compared with the LED filament obtained by the glass tube potting method using flexible fluorescent glass film, the light color performance is more stable, the yield is higher, and the luminous efficiency is significantly improved.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above description is only the preferred embodiments of the present invention, and is not intended to limit the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention shall be included in the protection of the present invention. Within range.

Claims (10)

  1. 一种LED灯丝，其特征在于，包括：An LED filament, comprising:
    LED灯丝基底，所述LED灯丝基底包括灯丝基底以及布置在所述灯丝基底上的若干LED芯片，其中，所述灯丝基底包括圆柱形基底，所述灯丝基底的外表面开设有若干凹槽；所述LED芯片设置在所述灯丝基底的凹槽中，且在所述灯丝基底外壁径向分布的所述LED芯片电性连接；An LED filament substrate, the LED filament substrate including a filament substrate and a plurality of LED chips arranged on the filament substrate, wherein the filament substrate includes a cylindrical substrate, and an outer surface of the filament substrate is provided with a plurality of grooves; The LED chip is disposed in a groove of the filament substrate, and the LED chips distributed radially on the outer wall of the filament substrate are electrically connected;
    柔性玻璃膜，所述柔性玻璃膜无缝包覆在所述凹槽的表面，其中，所述柔性玻璃膜为柔性荧光玻璃膜，所述柔性荧光玻璃膜中含有玻璃粉、荧光粉和石墨烯，且所述柔性荧光玻璃膜中，所述玻璃粉、荧光粉和石墨烯的重量比为(5-6):1:(0.1-0.5)。A flexible glass film that seamlessly covers the surface of the groove, wherein the flexible glass film is a flexible fluorescent glass film, and the flexible fluorescent glass film contains glass powder, fluorescent powder, and graphene In the flexible fluorescent glass film, a weight ratio of the glass powder, the fluorescent powder, and the graphene is (5-6): 1: (0.1-0.5).
  2. 如权利要求1所述的LED灯丝，其特征在于，所述柔性玻璃膜为一体膜，且所述柔性玻璃膜包覆在所述LED灯丝基底的外壁面。The LED filament according to claim 1, wherein the flexible glass film is an integrated film, and the flexible glass film covers an outer wall surface of the LED filament substrate.
  3. 如权利要求1所述的LED灯丝，其特征在于，所述玻璃粉、荧光粉和石墨烯的重量比为5.5:1:0.4。The LED filament of claim 1, wherein a weight ratio of the glass powder, the fluorescent powder, and the graphene is 5.5: 1: 0.4.
  4. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述LED芯片包括若干组沿所述灯丝基底外壁径向分布的芯片串，且同组所述芯片串中的LED芯片串联结合，不同组所述芯片串之间并联结合。The LED filament according to any one of claims 1 to 3, wherein the LED chip comprises a plurality of groups of chip strings distributed radially along an outer wall of the filament base, and the LED chips in the same group of chip strings Combined in series, and the chip strings in different groups are combined in parallel.
  5. 如权利要求4所述的LED灯丝，其特征在于，所述LED芯片包括2-12组芯片串，且任意两组相邻的所述芯片串之间的距离相等。The LED filament according to claim 4, wherein the LED chip comprises 2-12 sets of chip strings, and the distance between any two adjacent sets of chip strings is equal.
  6. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述柔性荧光玻璃膜的厚度为0.05-1毫米。The LED filament according to any one of claims 1-3, wherein a thickness of the flexible fluorescent glass film is 0.05-1 mm.
  7. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述凹槽的深度为0.2-0.5毫米。The LED filament according to any one of claims 1-3, wherein the depth of the groove is 0.2-0.5 mm.
  8. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述荧光粉包括铝酸盐绿粉、氮氧化物绿粉中的至少一种，以及氮化物红粉、氟化物红粉中的至少一种。The LED filament according to any one of claims 1 to 3, wherein the fluorescent powder comprises at least one of aluminate green powder and nitrogen oxide green powder, and nitride red powder and fluoride red powder. At least one.
  9. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述荧光粉包括氮化物红粉，且所述氮化物红粉选自（Ca，Sr）AlSiN 3:Eu 2+、（Sr，Ca） 2Si 5N 8中的一种，以及SrLiAl 3N 4：Eu 2+。 The LED filament according to any one of claims 1 to 3, wherein the phosphor powder comprises a nitride red powder, and the nitride red powder is selected from (Ca, Sr) AlSiN 3 : Eu 2+ , (Sr , Ca) 2 Si 5 N 8 , and SrLiAl 3 N 4 : Eu 2+ .
  10. 如权利要求1-3任一项所述的LED灯丝，其特征在于，所述荧光粉的粒径为1-5微米。The LED filament according to any one of claims 1-3, wherein a particle diameter of the phosphor is 1-5 microns.
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US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps

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