WO2020015169A1 - Solar cell and preparation method therefor - Google Patents

Solar cell and preparation method therefor Download PDF

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WO2020015169A1
WO2020015169A1 PCT/CN2018/107723 CN2018107723W WO2020015169A1 WO 2020015169 A1 WO2020015169 A1 WO 2020015169A1 CN 2018107723 W CN2018107723 W CN 2018107723W WO 2020015169 A1 WO2020015169 A1 WO 2020015169A1
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solar cell
back electrode
electrode layer
layer
structures
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PCT/CN2018/107723
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French (fr)
Chinese (zh)
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白安琪
王雪戈
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北京铂阳顶荣光伏科技有限公司
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Publication of WO2020015169A1 publication Critical patent/WO2020015169A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441Electrode arrangements specially adapted for back-contact solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02327Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the technical field of solar cells, and in particular, to a solar cell and a method for preparing the same.
  • thin film solar cells Compared with general crystalline silicon solar cells, thin film solar cells have the advantages of good flexibility, high power generation, excellent low-light performance and high-temperature performance, and light weight. Among them, CIS (copper indium tin) based thin-film solar cells have a wider application range.
  • a typical preparation method of a CIS-based thin-film solar cell is as follows: firstly, a uniform Mo film is prepared as a back electrode layer by a magnetron sputtering process on a base substrate; and then the co-evaporation method or A uniform CIS-based absorption layer is prepared by processes such as sputtering selenization; a buffer layer is prepared by a chemical water bath method or a sputtering method on the CIS-based absorption layer, and an n-type layer and a TCO are prepared by magnetron sputtering. In the window layer, a gate line electrode is finally prepared.
  • the CIS-based thin-film solar cell prepared by this method has a small amount of light absorption and a large amount of carrier recombination, which are the main sources affecting the efficiency loss of the CIS-based thin-film solar cell. If the thickness of the CIS-based absorption layer is increased to increase the light absorption, The result is not only increased manufacturing costs, but also increased carrier recombination, which is contrary to reducing carrier recombination; if the carrier recombination is reduced by reducing the thickness of the CIS-based absorption layer, it will also reduce the amount of light absorption, Therefore, the research and development of a solar cell that can both increase the light absorption and reduce the carrier recombination is a technical problem to be solved urgently at present.
  • the embodiments of the present disclosure provide a solar cell and a method for preparing the same, the main purpose of which is to improve the light absorption of the light absorption layer and reduce the carrier recombination in the light absorption layer, thereby improving the performance of the solar cell.
  • a solar cell including:
  • the surface of the back electrode layer in contact with the light absorption layer is a three-dimensional structure.
  • the solar cell provided by the embodiment of the present disclosure not only enhances the light reflection and light scattering of the interface between the back electrode layer and the light absorption layer through the three-dimensional structure contact surface provided between the back electrode layer and the light absorption layer, but also increases the light of the light absorption layer.
  • Absorption thereby increasing the photoelectric efficiency without increasing the thickness of the light absorbing layer, and enabling photo-generated carriers to be efficiently collected by the back electrode layer on the three-dimensional structure contact surface, reducing photo-generated carriers in the light-absorbing layer Recombination improves the collection efficiency of photo-generated carriers and improves the performance of solar cells.
  • a surface of the back electrode layer in contact with the light absorbing layer has a convex portion and / or a concave portion, and the convex portion and / or the concave portion form a three-dimensional structure.
  • the height of the protruding portion is in a range of 10 nm to 500 nm.
  • the depth of the depression is in a range of 10 nm to 500 nm.
  • the protruding portion includes a plurality of strip structures and / or a plurality of dot structures.
  • the recessed portion includes a plurality of strip structures and / or a plurality of dot structures.
  • a distance between two adjacent strip structures is in a range of 10 nm to 1000 nm.
  • a plurality of the point-like structures are divided into a plurality of point-like structure groups, and each of the point-like structure groups consists of point-like structures located on the same straight line, and two adjacent point-like structure groups
  • the pitch is in the range of 10nm to 1000nm.
  • a method for preparing a solar cell includes:
  • a buffer layer and a window layer are prepared on the light absorbing layer.
  • the method for preparing a solar cell provided in the embodiment of the present disclosure, the preparation method prepares a three-dimensional structure on the surface of the back electrode layer after the back electrode layer is deposited, so that the interface between the light absorption layer and the back electrode layer is a three-dimensional structure interface. Through the formation of the three-dimensional structure interface, the light absorption amount of the light absorption layer is enhanced and the photogenerated carrier recombination in the light absorption layer is reduced.
  • FIG. 1 is a schematic structural diagram of a solar cell according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of a three-dimensional structure contact surface according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure.
  • FIG. 6 is a flowchart of a method for manufacturing a solar cell according to an embodiment of the present disclosure.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise stated, "a plurality" means two or more.
  • the solar cell includes: a base substrate 1, which is disposed on the base substrate 1 and is stacked in a direction away from the base substrate 1.
  • the surface of the back electrode layer 2 in contact with the light absorption layer 3 is a three-dimensional structure 201
  • a light trapping structure can be formed.
  • the light trapping structure can enhance the back surface.
  • the light reflection, scattering, and refraction at the interface between the electrode layer 2 and the light absorption layer 3 can effectively increase the light absorption compared to the two-dimensional structure contact surface, and effectively increase the light absorption without increasing the thickness of the light absorption layer.
  • the effect of improving the photoelectric efficiency of the solar cell compared with increasing the thickness of the light absorbing layer 3, the method of the present disclosure for setting the three-dimensional structure 201 also reduces the manufacturing cost.
  • a surface of the back electrode layer 2 in contact with the light absorption layer 3 has a convex portion and / or a concave portion, and the convex portion and / or the concave portion form a three-dimensional structure 201.
  • the three-dimensional structure may be formed by a convex portion, a concave portion, or a combination of a convex portion and a concave portion.
  • the height of the protruding portion is in a range of 10 nm to 500 nm.
  • the depth of the recessed portion is between In the range of 10nm to 500nm.
  • a height of the protruding portion is in a range of 100 nm to 300 nm, and a depth of the recessed portion is in a range of 100 nm to 300 nm.
  • the protruding portion may have various structures.
  • the protruding portion may include a plurality of strip-shaped structures and / or a plurality of dot-shaped structures, and the protruding portion may include a plurality of strip-shaped structures.
  • the structural composition (refer to FIG. 2) may be composed of a plurality of dot-like structures (refer to FIG. 3), or may be composed of a plurality of strip-like structures and a plurality of dot-like structures arranged at intervals or other layout methods.
  • the cross-sectional shape of the strip structure may have various shapes, for example: rectangular, trapezoidal, triangular, semi-circular, fan-shaped, or arc-shaped.
  • the strip structure may be one of the above-mentioned various shapes. A plurality of combinations may be used, which is not limited here.
  • the point structure may have multiple types, such as a cylinder, a trapezoidal cube, a conical cube, or a hemisphere.
  • the point structure may be one of the above shapes, or a combination of multiple types may be used. It is not limited here.
  • the strip-like structures when a plurality of the strip-like structures form a three-dimensional structure, or a plurality of dot-like structures form a three-dimensional structure, in order to achieve better light trapping and reduce the effect of photogenerated carrier recombination, two adjacent ones
  • the spacing between the strip structures can be in the range of 10 nm to 1000 nm.
  • a distance between two adjacent strip structures may be in a range of 100 nm to 800 nm.
  • the spacing between each two adjacent strip-shaped structures is equal, and a plurality of the point-shaped structures are divided into a plurality of point-shaped structure groups, and each of the point-shaped structure groups is composed of It is composed of a dot structure, and the distance between two adjacent dot structure groups is in a range of 10 nm to 1000 nm.
  • the distance between two adjacent dot structure groups is in a range of 100 nm to 800 nm, and the distance between two adjacent dot structures in each of the dot structure groups is also in a range of 10 nm to 1000 nm.
  • the distance between two adjacent dot-like structures is also in the range of 100 nm to 800 nm, and the distance between two adjacent dot-like structures can be similar to that of two adjacent dot-like structures.
  • the spacing between the dot structures may be equal or unequal.
  • at least part of the dot-like structure groups have equal pitches between each two adjacent dot-like structures or each of the dot-like structure groups have equal pitches between each two adjacent dot-like structures, Such a design is also convenient for preparing the above-mentioned strip structure or dot structure, so that the strip structure or dot structure has a periodic layout, but the strip structure or dot structure may also be laid irregularly.
  • the recessed portion may also have various structures.
  • the recessed portion may include a plurality of strip structures and / or a plurality of dot structures, wherein the recessed portions may include a plurality of strip structures.
  • the composition (refer to FIG. 4) may be composed of a plurality of dot-like structures (refer to FIG. 5), or may be composed of a plurality of strip-like structures and a plurality of dot-like structures arranged at intervals or other layout methods.
  • the cross-sectional shape of the strip structure may be various, for example: rectangular, trapezoidal, triangular, semi-circular, fan-shaped, or arc-shaped.
  • the strip structure may be one of the above-mentioned various shapes, or may be It is a combination of a plurality of types, and is not specifically limited.
  • the point structure also has multiple types, such as a cylinder, a trapezoidal cube, a conical cube, or a hemisphere.
  • the point structure may be one of the above shapes, or a combination of multiple types. It is not limited here.
  • a distance between two adjacent strip structures is 10 nm to 1000 nm, and optionally, adjacent The distance between the two strip structures can be in the range of 100 nm to 800 nm.
  • the spacing between each two adjacent strip-shaped structures is equal, and a plurality of the point-shaped structures are divided into a plurality of point-shaped structure groups, and each of the point-shaped structure groups is composed of It is composed of a dot structure, and the distance between two adjacent dot structure groups is in a range of 10 nm to 1000 nm.
  • the distance between two adjacent dot-like structure groups is in a range of 100 nm to 800 nm, and the distance between two adjacent dot-like structures in each of the dot-like structure groups is within a range of 10 nm-1000 nm.
  • the distance between two adjacent dot-like structures is in a range of 100 nm to 800 nm, and the distance between the two adjacent dot-like structures may be the same as that of two adjacent dots in each of the dot-like structures.
  • the spacing between the structures may be equal or unequal.
  • the dot-like structure groups have equal pitches between each two adjacent dot-like structures or each of the dot-like structure groups have equal pitches between each two adjacent dot-like structures,
  • Such a design is also convenient for preparing the above-mentioned strip structure or dot structure, so that the strip structure or dot structure has a periodic layout, but the strip structure or dot structure may also be laid irregularly.
  • composition of the three-dimensional structure and the composition of the back electrode layer may be the same, for example, molybdenum or other metal materials are used.
  • the solar cell may be a CIS-based thin-film solar cell, a cadmium telluride cell, a gallium arsenide cell, or an amorphous silicon thin-film solar cell.
  • An embodiment of the present disclosure also provides a preparation method for preparing the solar cell.
  • the preparation method includes:
  • the base substrate is a stainless steel substrate.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • Magnetron sputtering, low pressure chemical vapor deposition (LPCVD), atmospheric pressure chemical vapor deposition (APCVD), or reactive plasma can be used for deposition.
  • Bulk deposition (RPD) is used for deposition. Among them, magnetron sputtering is a more commonly used deposition method.
  • the back electrode layer is a Mo back electrode layer, and other metals may also be used as the material of the back electrode layer.
  • S3 preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate, wherein a component of the three-dimensional structure and a component of the back electrode layer may be the same.
  • One method is to print the three-dimensional structure on the back electrode layer by using an optical lithography process, and the optical lithography process may be electronic lithography, atomic lithography, extreme ultraviolet lithography, or X-ray lithography.
  • Another method is to emboss the three-dimensional structure on the back electrode layer by using a nano-imprint process or a soft engraving process.
  • a third exemplary method is to use a scanning probe process to imprint the three-dimensional structure on the back electrode layer.
  • the preparation of the three-dimensional structure is achieved by using atomic lithography and nano-imprinting processes.
  • the light absorption layer is prepared on the back electrode layer having a three-dimensional structure, and the light absorption layer is embedded on the back electrode layer having the three-dimensional structure to form a light trapping structure.
  • the light absorption layer can be prepared by a co-evaporation method or a sputtering method. Generally, the light absorption layer is a CIS-based light absorption layer. After the light absorption layer is prepared, the light absorption layer forms a light trapping structure on a three-dimensional structure. The technical effects achieved by the light trapping structure have been described in detail above, and are not repeated here.
  • a buffer layer and a window layer are sequentially prepared on the light absorbing layer to obtain a solar cell.
  • a buffer layer is prepared on a light absorbing layer by a chemical bath deposition method for the first time.
  • the buffer layer is a cadmium sulfide buffer layer, and then a window layer is prepared on the buffer layer by magnetron sputtering.
  • the material of the window layer may be one of indium oxide, indium tin oxide, titanium-doped indium oxide, tungsten oxide, boron-doped zinc oxide, or aluminum-doped zinc oxide.

Abstract

The present disclosure relates to a solar cell and a preparation method therefor, and relates to the technical field of solar cells. The solar cell is designed for improving photoelectric conversion efficiency. The solar cell comprises a base substrate; a back electrode layer, a light-absorbing layer, a buffer layer and a window layer are stacked on the base substrate successively in a direction away from said base substrate. The contact surface between the back electrode layer and the light-absorbing layer is a three-dimensional structure. The present solar cell and preparation method therefor improve the photoelectric conversion efficiency of solar cells.

Description

一种太阳能电池及其制备方法Solar cell and preparation method thereof 技术领域Technical field
本公开涉及太阳能电池技术领域,尤其涉及一种太阳能电池及其制备方法。The present disclosure relates to the technical field of solar cells, and in particular, to a solar cell and a method for preparing the same.
背景技术Background technique
薄膜太阳能电池相比一般晶硅太阳能电池具有柔性好、发电量高,弱光性能和高温性能优异,以及轻量化等优点,已被广泛的应用。其中,CIS(铜铟锡)基薄膜太阳能电池的应用范围更广。Compared with general crystalline silicon solar cells, thin film solar cells have the advantages of good flexibility, high power generation, excellent low-light performance and high-temperature performance, and light weight. Among them, CIS (copper indium tin) based thin-film solar cells have a wider application range.
目前现有的CIS基薄膜太阳能电池的典型制备方法为:首先在基层衬底上通过磁控溅射工艺制备一层均匀的Mo薄膜作为背电极层;再在背电极层上通过共蒸发法或者溅射硒化法等工艺制备一层均匀的CIS基吸收层;在CIS基吸收层之上再依次用化学水浴法或溅射法制备缓冲层、用磁控溅射法制备n型层和TCO窗口层,最后制备栅线电极。At present, a typical preparation method of a CIS-based thin-film solar cell is as follows: firstly, a uniform Mo film is prepared as a back electrode layer by a magnetron sputtering process on a base substrate; and then the co-evaporation method or A uniform CIS-based absorption layer is prepared by processes such as sputtering selenization; a buffer layer is prepared by a chemical water bath method or a sputtering method on the CIS-based absorption layer, and an n-type layer and a TCO are prepared by magnetron sputtering. In the window layer, a gate line electrode is finally prepared.
通过该方法制备的CIS基薄膜太阳能电池,光吸收量少和载流子复合多是影响该CIS基薄膜太阳能电池效率损失的主要来源,若通过增加CIS基吸收层的厚度提高光吸收量,造成的结果是不仅提高了制造成本,还导致载流子复合增加,这样与减少载流子复合相悖;若通过减小CIS基吸收层的厚度减少载流子复合,但是又将降低光吸收量,所以研发一种既能提高光吸收量,又可减小载流子复合的太阳能电池是目前亟待解决的技术问题。The CIS-based thin-film solar cell prepared by this method has a small amount of light absorption and a large amount of carrier recombination, which are the main sources affecting the efficiency loss of the CIS-based thin-film solar cell. If the thickness of the CIS-based absorption layer is increased to increase the light absorption, The result is not only increased manufacturing costs, but also increased carrier recombination, which is contrary to reducing carrier recombination; if the carrier recombination is reduced by reducing the thickness of the CIS-based absorption layer, it will also reduce the amount of light absorption, Therefore, the research and development of a solar cell that can both increase the light absorption and reduce the carrier recombination is a technical problem to be solved urgently at present.
发明内容Summary of the invention
本公开的实施例提供一种太阳能电池及其制备方法,主要目的是提高光吸收层的光吸收量、减少光吸收层内的载流子复合,进而提高太阳能电池的性能。The embodiments of the present disclosure provide a solar cell and a method for preparing the same, the main purpose of which is to improve the light absorption of the light absorption layer and reduce the carrier recombination in the light absorption layer, thereby improving the performance of the solar cell.
根据本公开的一方面,提供了一种太阳能电池,包括:According to an aspect of the present disclosure, a solar cell is provided, including:
基层衬底;和Base substrate; and
在所述基层衬底上且沿背离所述基层衬底方向层叠设置的背电极层、光吸收层、缓冲层和窗口层;A back electrode layer, a light absorption layer, a buffer layer, and a window layer, which are stacked and arranged on the base substrate and in a direction away from the base substrate;
其中,所述背电极层与所述光吸收层相接触的表面为三维结构。Wherein, the surface of the back electrode layer in contact with the light absorption layer is a three-dimensional structure.
本公开实施例提供的太阳能电池通过背电极层与光吸收层之间设置的三维结构接触面,不仅增强了背电极层与光吸收层界面的光反射和光散射,增大了光吸收层的光吸收量,从而在不增加光吸收层厚度的前提下,提高光电效率,且可以使光生载流子能够在三维结构接触面上被背电极层有效收集,减少光吸收层内的光生载流子复合,进而提高光生载流子收集效率,提高太阳能电池的性能。The solar cell provided by the embodiment of the present disclosure not only enhances the light reflection and light scattering of the interface between the back electrode layer and the light absorption layer through the three-dimensional structure contact surface provided between the back electrode layer and the light absorption layer, but also increases the light of the light absorption layer. Absorption, thereby increasing the photoelectric efficiency without increasing the thickness of the light absorbing layer, and enabling photo-generated carriers to be efficiently collected by the back electrode layer on the three-dimensional structure contact surface, reducing photo-generated carriers in the light-absorbing layer Recombination improves the collection efficiency of photo-generated carriers and improves the performance of solar cells.
可选的,所述背电极层与所述光吸收层相接触的表面上具有凸出部和/或凹陷部,所述凸出部和/或凹陷部形成三维结构。Optionally, a surface of the back electrode layer in contact with the light absorbing layer has a convex portion and / or a concave portion, and the convex portion and / or the concave portion form a three-dimensional structure.
在一实施例中,所述凸出部的高度在10nm~500nm范围内。In one embodiment, the height of the protruding portion is in a range of 10 nm to 500 nm.
可选的,所述凹陷部的深度在10nm~500nm范围内。Optionally, the depth of the depression is in a range of 10 nm to 500 nm.
可选的,所述凸出部包括多个条状结构和/或多个点状结构。Optionally, the protruding portion includes a plurality of strip structures and / or a plurality of dot structures.
可选的,所述凹陷部包括多个条状结构和/或多个点状结构。Optionally, the recessed portion includes a plurality of strip structures and / or a plurality of dot structures.
在一实施例中,相邻两个所述条状结构之间的间距在10nm~1000nm范围内。In one embodiment, a distance between two adjacent strip structures is in a range of 10 nm to 1000 nm.
可选的,多个所述点状结构分成多个点状结构组,每个所述点状结构组由位于同一条直线上的点状结构组成,且相邻两个所述点状结构组的间距在10nm~1000nm范围内。Optionally, a plurality of the point-like structures are divided into a plurality of point-like structure groups, and each of the point-like structure groups consists of point-like structures located on the same straight line, and two adjacent point-like structure groups The pitch is in the range of 10nm to 1000nm.
根据本公开的另一方面,提供了一种太阳能电池的制备方法,所述制备方法包括:According to another aspect of the present disclosure, a method for preparing a solar cell is provided, and the method includes:
在所述基层衬底上沉积所述背电极层;Depositing the back electrode layer on the base substrate;
在所述背电极层背离所述基层衬底的一侧的表面上制备所述三维结构;Preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate;
在具有三维结构的所述背电极层上制备所述光吸收层;Preparing the light absorption layer on the back electrode layer having a three-dimensional structure;
在光吸收层上制备缓冲层和窗口层。A buffer layer and a window layer are prepared on the light absorbing layer.
本公开实施例提供的太阳能电池的制备方法,该制备方法在完成背电极层的沉积后在背电极层的表面制备三维结构,以使光吸收层与背电极层之间的界面为三维结构界面,通过形成的三维结构界面增强了光吸收层的光吸收量和减少了光吸收层内的光生载流子复合。The method for preparing a solar cell provided in the embodiment of the present disclosure, the preparation method prepares a three-dimensional structure on the surface of the back electrode layer after the back electrode layer is deposited, so that the interface between the light absorption layer and the back electrode layer is a three-dimensional structure interface. Through the formation of the three-dimensional structure interface, the light absorption amount of the light absorption layer is enhanced and the photogenerated carrier recombination in the light absorption layer is reduced.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本公开实施例提供的一种太阳能电池的结构示意图;1 is a schematic structural diagram of a solar cell according to an embodiment of the present disclosure;
图2为本公开实施例提供的一种三维结构接触面的结构示意图;2 is a schematic structural diagram of a three-dimensional structure contact surface according to an embodiment of the present disclosure;
图3为本公开实施例提供的另一种三维结构接触面的结构示意图;3 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure;
图4为本公开实施例提供的另一种三维结构接触面的结构示意图;4 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure;
图5为本公开实施例提供的另一种三维结构接触面的结构示意图;5 is a schematic structural diagram of another three-dimensional structure contact surface according to an embodiment of the present disclosure;
图6为本公开实施例提供的一种太阳能电池的制备方法的流程框图。FIG. 6 is a flowchart of a method for manufacturing a solar cell according to an embodiment of the present disclosure.
具体实施方式detailed description
下面结合附图对本公开实施例太阳能电池及其制备方法进行详细描述。The solar cell and the manufacturing method thereof according to the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
在本公开的描述中,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中,除非另有说明,“多个”的含义是两个或两个以上。In the description of the present disclosure, the terms “first” and “second” are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise stated, "a plurality" means two or more.
在本公开的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内段的连通。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本公开中的含义。In the description of this disclosure, it should be noted that the terms "installation", "connected", and "connected" should be understood in a broad sense unless explicitly stated and limited otherwise. For example, they can be fixed or removable. Connected or integrated; it can be mechanical or electrical; it can be directly connected or it can be indirectly connected through an intermediate medium, or it can be the communication between the two segments. For those of ordinary skill in the art, the meanings of the above terms in the present disclosure can be understood according to specific situations.
本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。The term "and / or" in this document is only a kind of association relationship describing related objects, which means that there can be three kinds of relationships, for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and exists alone B these three cases. In addition, the character "/" in this article generally indicates that the related objects are an "or" relationship.
本公开实施例提供了一种太阳能电池,参照图1至图5,所述太阳能电池包括:基层衬底1,在所述基层衬底1上且沿背离所述基层衬底1方向层叠设置的背电极层2、光吸收层3、缓冲层4和窗口层5,其中,所述背电极层2与所述光吸收层3相接触的表面为三维结构201。An embodiment of the present disclosure provides a solar cell. Referring to FIG. 1 to FIG. 5, the solar cell includes: a base substrate 1, which is disposed on the base substrate 1 and is stacked in a direction away from the base substrate 1. The back electrode layer 2, the light absorption layer 3, the buffer layer 4 and the window layer 5, wherein a surface of the back electrode layer 2 and the light absorption layer 3 in contact is a three-dimensional structure 201.
由于背电极层2与所述光吸收层3相接触的表面为三维结构201,这样使光吸收层3沉积在所述三维结构201上时就可形成陷光结构,通过陷光结构能够增强背电极层2和光吸收层3界面的光反射、散射和折射,相比二维结构的接触面能够有效增加光的吸收量,达到在不增加光吸收层厚度的前提下,有效提高光吸收量,提高太阳能电池的光电效率的效果,此外,相比于增加光吸收层3的厚度,本公开设置三维结构201的方法还降低了制造成本。同时,由于三维结构的存在,使光吸收层3内产生的光生载流子在被背电极层2收集时,能够缩短光生载流子的路径,减少光生载流子在光吸收层3内复合的几率,进而提高背电极层2对光生载流子的收集效率,改善太阳能电池的性能。Since the surface of the back electrode layer 2 in contact with the light absorption layer 3 is a three-dimensional structure 201, when the light absorption layer 3 is deposited on the three-dimensional structure 201, a light trapping structure can be formed. The light trapping structure can enhance the back surface. The light reflection, scattering, and refraction at the interface between the electrode layer 2 and the light absorption layer 3 can effectively increase the light absorption compared to the two-dimensional structure contact surface, and effectively increase the light absorption without increasing the thickness of the light absorption layer. The effect of improving the photoelectric efficiency of the solar cell. In addition, compared with increasing the thickness of the light absorbing layer 3, the method of the present disclosure for setting the three-dimensional structure 201 also reduces the manufacturing cost. At the same time, due to the existence of the three-dimensional structure, when the photo-generated carriers generated in the light-absorbing layer 3 are collected by the back electrode layer 2, the path of the photo-generated carriers can be shortened, and the photo-generated carriers can be reduced to recombine in the light-absorbing layer 3. Probability, thereby increasing the collection efficiency of photo-generated carriers by the back electrode layer 2 and improving the performance of the solar cell.
示例的,所述背电极层2与所述光吸收层3相接触的表面上具有凸出部和/或凹陷部,所述凸出部和/或凹陷部形成三维结构201。三维结构可以是由凸出部形成,也可以是由凹陷部形成,也可以是由凸出部和凹陷部组合形成。For example, a surface of the back electrode layer 2 in contact with the light absorption layer 3 has a convex portion and / or a concave portion, and the convex portion and / or the concave portion form a three-dimensional structure 201. The three-dimensional structure may be formed by a convex portion, a concave portion, or a combination of a convex portion and a concave portion.
当所述三维结构包括所述凸出部的情况下,所述凸出部的高度在10nm~500nm范围内,当所述三维结构包括所述凹陷部的情况下,所述凹陷部的深度在10nm~500nm范围内。采用高度在10nm~500nm范围内的凸出部、深度在10nm~500nm范围内的凹陷部,能够使光吸收量和光生载流子的收集效率达到最优;若尺寸过大,会减少光吸收层的厚度,则相比于三维结构增加的光吸收量,关吸收层厚度减少所降低的光吸收量更大,进而影响整个太阳能电池的光电效率;若尺寸较小,又不能有效起到增加光吸收量的效果,以及提高光生载流子收集效率的效果。在一个实施例中,所述凸出部的高度在100nm~300nm范围内,所述凹陷部的深度在100nm~300nm范围内。When the three-dimensional structure includes the protruding portion, the height of the protruding portion is in a range of 10 nm to 500 nm. When the three-dimensional structure includes the recessed portion, the depth of the recessed portion is between In the range of 10nm to 500nm. The use of convex portions with a height in the range of 10nm to 500nm and depressions with a depth in the range of 10nm to 500nm can optimize the light absorption and collection efficiency of photo-generated carriers; if the size is too large, light absorption will be reduced The thickness of the layer, compared with the increased light absorption of the three-dimensional structure, decreases the light absorption of the reduced absorption layer thickness, which affects the photoelectric efficiency of the entire solar cell; if the size is small, it cannot effectively increase The effect of the amount of light absorption and the effect of improving the collection efficiency of photo-generated carriers. In one embodiment, a height of the protruding portion is in a range of 100 nm to 300 nm, and a depth of the recessed portion is in a range of 100 nm to 300 nm.
所述凸出部可以具有各式各样的结构,示例的,所述凸出部可包括多个条状结构和/或多个点状结构,其中,凸出部可以是由多个条状结构组成(参照图2),也可以是由多个点状结构组成(参照图3),也可以是由多个条状结构和多个点状结构以间隔布设或者其他布设方式组成。The protruding portion may have various structures. For example, the protruding portion may include a plurality of strip-shaped structures and / or a plurality of dot-shaped structures, and the protruding portion may include a plurality of strip-shaped structures. The structural composition (refer to FIG. 2) may be composed of a plurality of dot-like structures (refer to FIG. 3), or may be composed of a plurality of strip-like structures and a plurality of dot-like structures arranged at intervals or other layout methods.
示例的,所述条状结构的截面形状可以具有多种,例如:矩形、梯形、三角形、半圆形、扇形或者弧形,所述条状结构可以是上述各种形状中的一种,也可以是多种进行组合,这里不进行限定。For example, the cross-sectional shape of the strip structure may have various shapes, for example: rectangular, trapezoidal, triangular, semi-circular, fan-shaped, or arc-shaped. The strip structure may be one of the above-mentioned various shapes. A plurality of combinations may be used, which is not limited here.
示例的,所述点状结构也可以具有多种,例如:柱体、梯形立方体、锥形立方体或者半球形,同样,点状结构可以是上述形状中的一种,也可以是多种进行组合,这里不进行限定。For example, the point structure may have multiple types, such as a cylinder, a trapezoidal cube, a conical cube, or a hemisphere. Similarly, the point structure may be one of the above shapes, or a combination of multiple types may be used. It is not limited here.
在实施时,多个所述条状结构形成三维结构,或多个点状结构形成三维结构时,为了能够实现更好的陷光和降低光生载流子复合的效果,相邻两个所述条状结构之间的间距可以在10nm~1000nm范围内。可选的,相邻两个所述条状结构之间的间距可以在100nm~800nm范围内。可选的,每相邻两个所述条状结构之间的间距相等,多个所述点状结构分成多个点状结构组,每个所述点状结构组由位于同一条直线上的点状结构组成,且相邻两个所述点状 结构组的间距在10nm~1000nm范围内。可选的,相邻两个所述点状结构组的间距在100nm~800nm范围内,且每个所述点状结构组中相邻两个点状结构之间的间距也在10nm~1000nm范围内。可选的,相邻两个点状结构之间的间距也在100nm~800nm范围内,相邻两个所述点状结构组之间的间距可以与每个点状结构组中相邻两个点状结构之间的间距相等或者不等均可。可选的,至少部分所述点状结构组中每相邻两个所述点状结构的间距相等或每一个所述点状结构组中每相邻两个所述点状结构的间距相等,这样设计也便于制备上述条状结构或点状结构,使所述条状结构或点状结构具有周期性的布设,但是,所述条状结构或点状结构也可以无规律的进行布设。In implementation, when a plurality of the strip-like structures form a three-dimensional structure, or a plurality of dot-like structures form a three-dimensional structure, in order to achieve better light trapping and reduce the effect of photogenerated carrier recombination, two adjacent ones The spacing between the strip structures can be in the range of 10 nm to 1000 nm. Optionally, a distance between two adjacent strip structures may be in a range of 100 nm to 800 nm. Optionally, the spacing between each two adjacent strip-shaped structures is equal, and a plurality of the point-shaped structures are divided into a plurality of point-shaped structure groups, and each of the point-shaped structure groups is composed of It is composed of a dot structure, and the distance between two adjacent dot structure groups is in a range of 10 nm to 1000 nm. Optionally, the distance between two adjacent dot structure groups is in a range of 100 nm to 800 nm, and the distance between two adjacent dot structures in each of the dot structure groups is also in a range of 10 nm to 1000 nm. Inside. Optionally, the distance between two adjacent dot-like structures is also in the range of 100 nm to 800 nm, and the distance between two adjacent dot-like structures can be similar to that of two adjacent dot-like structures. The spacing between the dot structures may be equal or unequal. Optionally, at least part of the dot-like structure groups have equal pitches between each two adjacent dot-like structures or each of the dot-like structure groups have equal pitches between each two adjacent dot-like structures, Such a design is also convenient for preparing the above-mentioned strip structure or dot structure, so that the strip structure or dot structure has a periodic layout, but the strip structure or dot structure may also be laid irregularly.
所述凹陷部也可以具有各式各样的结构,示例的,所述凹陷部也可以包括多个条状结构和/或多个点状结构,其中,凹陷部可以是由多个条状结构组成(参照图4),也可以是由多个点状结构组成(参照图5),也可以是由多个条状结构和多个点状结构以间隔布设或者其他布设方式组成。The recessed portion may also have various structures. For example, the recessed portion may include a plurality of strip structures and / or a plurality of dot structures, wherein the recessed portions may include a plurality of strip structures. The composition (refer to FIG. 4) may be composed of a plurality of dot-like structures (refer to FIG. 5), or may be composed of a plurality of strip-like structures and a plurality of dot-like structures arranged at intervals or other layout methods.
示例的,所述条状结构的截面形状具有多种,例如:矩形、梯形、三角形、半圆形、扇形或者弧形,所述条状结构可以是上述各种形状中的一种,也可以是多种进行组合,具体不进行限定。By way of example, the cross-sectional shape of the strip structure may be various, for example: rectangular, trapezoidal, triangular, semi-circular, fan-shaped, or arc-shaped. The strip structure may be one of the above-mentioned various shapes, or may be It is a combination of a plurality of types, and is not specifically limited.
示例的,所述点状结构也具有多种,例如:柱体、梯形立方体、锥形立方体或者半球形,同样,点状结构可以是上述形状中的一种,也可以是多种进行组合,这里不进行限定。For example, the point structure also has multiple types, such as a cylinder, a trapezoidal cube, a conical cube, or a hemisphere. Similarly, the point structure may be one of the above shapes, or a combination of multiple types. It is not limited here.
在实施时,多个所述条状结构形成三维结构,或多个点状结构形成三维结构时,相邻两个所述条状结构之间的间距为10nm~1000nm,可选的,相邻两个所述条状结构之间的间距可以在100nm~800nm范围内。可选的,每相邻两个所述条状结构之间的间距相等,多个所述点状结构分成多个点状结构组,每个所述点状结构组由位于同一条直线上的点状结构组成,且相邻两个所述点状结构组的间距在10nm~1000nm范围内。可选的,相邻两个所述点状结构组的间距在100nm~800nm范围内,且每个所述点状结构组中相邻两个点状结构之间的间距在10nm~1000nm范围内。可选的,相邻两个点状结构之间的间距在100nm~800nm范围内,相邻两个所述点状结构组之间的间距可以与每个点状结构组中相邻两个点状结构之间的间距相等或者不等均可。可选的,至少部分所述点状结构组中每相邻两个所述点状结构的间距相等或每一个所述点状结构组中每相邻两个所述点状结构的间距相等,这样设计也便于制备上述条状结构或点状结构,使所述条状结构或点状结构具有周期性的布设,但是,所述条状结构或点状结构也可以无规律的进行布设。During implementation, when a plurality of the strip structures form a three-dimensional structure, or when a plurality of dot structures form a three-dimensional structure, a distance between two adjacent strip structures is 10 nm to 1000 nm, and optionally, adjacent The distance between the two strip structures can be in the range of 100 nm to 800 nm. Optionally, the spacing between each two adjacent strip-shaped structures is equal, and a plurality of the point-shaped structures are divided into a plurality of point-shaped structure groups, and each of the point-shaped structure groups is composed of It is composed of a dot structure, and the distance between two adjacent dot structure groups is in a range of 10 nm to 1000 nm. Optionally, the distance between two adjacent dot-like structure groups is in a range of 100 nm to 800 nm, and the distance between two adjacent dot-like structures in each of the dot-like structure groups is within a range of 10 nm-1000 nm. . Optionally, the distance between two adjacent dot-like structures is in a range of 100 nm to 800 nm, and the distance between the two adjacent dot-like structures may be the same as that of two adjacent dots in each of the dot-like structures. The spacing between the structures may be equal or unequal. Optionally, at least part of the dot-like structure groups have equal pitches between each two adjacent dot-like structures or each of the dot-like structure groups have equal pitches between each two adjacent dot-like structures, Such a design is also convenient for preparing the above-mentioned strip structure or dot structure, so that the strip structure or dot structure has a periodic layout, but the strip structure or dot structure may also be laid irregularly.
所述三维结构的组分和背电极层的组分可以是相同的,例如:采用钼或者其他金属材料。The composition of the three-dimensional structure and the composition of the back electrode layer may be the same, for example, molybdenum or other metal materials are used.
示例性而言,所述太阳能电池可以为CIS基薄膜太阳能电池、碲化镉电池、砷化镓电池或非晶硅薄膜太阳能电池。Exemplarily, the solar cell may be a CIS-based thin-film solar cell, a cadmium telluride cell, a gallium arsenide cell, or an amorphous silicon thin-film solar cell.
本公开实施例还提供了一种用于制备所述太阳能电池的制备方法:参照图6,所述制备方法包括:An embodiment of the present disclosure also provides a preparation method for preparing the solar cell. Referring to FIG. 6, the preparation method includes:
S1:提供基层衬底。其中,所述基层衬底为不锈钢衬底。S1: Provide a base substrate. Wherein, the base substrate is a stainless steel substrate.
S2:在所述基层衬底上沉积所述背电极层。S2: depositing the back electrode layer on the base substrate.
通过物理气相沉积(PVD)或化学气相沉积(CVD)中的其中一种进行沉积,可以采用磁控溅射法沉积、低压化学气相沉积(LPCVD)、常压化学气相沉积(APCVD)或反应等离子体沉积(RPD)中的一种进行沉积,其中,磁控溅射法沉积是较常用的沉积方法。Deposition by one of physical vapor deposition (PVD) or chemical vapor deposition (CVD). Magnetron sputtering, low pressure chemical vapor deposition (LPCVD), atmospheric pressure chemical vapor deposition (APCVD), or reactive plasma can be used for deposition. Bulk deposition (RPD) is used for deposition. Among them, magnetron sputtering is a more commonly used deposition method.
其中,所述背电极层为Mo背电极层,也可以采用其他金属作为背电极层的材料。The back electrode layer is a Mo back electrode layer, and other metals may also be used as the material of the back electrode layer.
S3:在所述背电极层背离所述基层衬底的一侧的表面上制备所述三维结构,其中,所述三维结构的组分与所述背电极层的组分可以相同。S3: preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate, wherein a component of the three-dimensional structure and a component of the back electrode layer may be the same.
在制备所述三维结构时,可采用多种方法制备三维结构。When preparing the three-dimensional structure, a variety of methods can be used to prepare the three-dimensional structure.
一种方法是,采用光学光刻工艺在所述背电极层上刻印所述三维结构,所述光学光刻工艺可以为电子光刻、原子光刻、极紫外光刻或X射线光刻。One method is to print the three-dimensional structure on the back electrode layer by using an optical lithography process, and the optical lithography process may be electronic lithography, atomic lithography, extreme ultraviolet lithography, or X-ray lithography.
另一种方法是,采用纳米压印工艺或软刻印工艺在所述背电极层上压印所述三维结构。Another method is to emboss the three-dimensional structure on the back electrode layer by using a nano-imprint process or a soft engraving process.
第三种示例性方法是,采用扫描探针工艺在所述背电极层上压印所述三维结构。A third exemplary method is to use a scanning probe process to imprint the three-dimensional structure on the back electrode layer.
在本公开的一个实施例中,采用原子光刻和纳米压印工艺实现三维结构的制备。In one embodiment of the present disclosure, the preparation of the three-dimensional structure is achieved by using atomic lithography and nano-imprinting processes.
S4:在具有三维结构的所述背电极层上制备所述光吸收层,所述光吸收层嵌入在具有所述三维结构的所述背电极层上形成陷光结构。S4: The light absorption layer is prepared on the back electrode layer having a three-dimensional structure, and the light absorption layer is embedded on the back electrode layer having the three-dimensional structure to form a light trapping structure.
可以采用共蒸发法或溅射法制备所述光吸收层,一般所述光吸收层为CIS基光吸收层,光吸收层制得后所述光吸收层在三维结构上就形成了陷光结构,陷光结构所达到的技术效果上述已经详细描述,在此不再赘述。The light absorption layer can be prepared by a co-evaporation method or a sputtering method. Generally, the light absorption layer is a CIS-based light absorption layer. After the light absorption layer is prepared, the light absorption layer forms a light trapping structure on a three-dimensional structure. The technical effects achieved by the light trapping structure have been described in detail above, and are not repeated here.
S5:在光吸收层上依次制备缓冲层和窗口层,以制得太阳能电池。S5: A buffer layer and a window layer are sequentially prepared on the light absorbing layer to obtain a solar cell.
示例性而言,首次采用化学浴沉积方法在光吸收层上制备缓冲层,一般所述缓冲层为硫化镉缓冲层,再采用磁控溅射法在所述缓冲层上制备窗口层,所述窗口层的材料可以是氧化铟、氧化铟锡、掺钛氧化铟、氧化钨、掺硼氧化锌或掺铝氧化锌中的其中一种。Exemplarily, a buffer layer is prepared on a light absorbing layer by a chemical bath deposition method for the first time. Generally, the buffer layer is a cadmium sulfide buffer layer, and then a window layer is prepared on the buffer layer by magnetron sputtering. The material of the window layer may be one of indium oxide, indium tin oxide, titanium-doped indium oxide, tungsten oxide, boron-doped zinc oxide, or aluminum-doped zinc oxide.
在本说明书中描述的特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。The features, structures, materials, or characteristics described in this specification may be combined in any suitable manner in any one or more embodiments or examples.
以上所述,仅为本公开的示例性实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以所述权利要求的保护范围为准。The foregoing is merely an exemplary embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present disclosure. All should be covered by the protection scope of this disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (14)

  1. 一种太阳能电池,包括:A solar cell includes:
    基层衬底;和Base substrate; and
    在所述基层衬底上且沿背离所述基层衬底方向层叠设置的背电极层、光吸收层、缓冲层和窗口层;A back electrode layer, a light absorption layer, a buffer layer, and a window layer, which are stacked and arranged on the base substrate and in a direction away from the base substrate;
    其中,所述背电极层的与所述光吸收层相接触的表面为三维结构。Wherein, a surface of the back electrode layer that is in contact with the light absorption layer is a three-dimensional structure.
  2. 根据权利要求1所述的太阳能电池,其中,所述背电极层与所述光吸收层相接触的表面上具有凸出部和/或凹陷部,所述凸出部和/或凹陷部形成三维结构。The solar cell according to claim 1, wherein a surface of the back electrode layer in contact with the light absorption layer has a protrusion and / or a depression, and the protrusion and / or the depression form a three-dimensional shape. structure.
  3. 根据权利要求2所述的太阳能电池,其中,所述凸出部的高度在10nm~500nm范围内。The solar cell according to claim 2, wherein a height of the protruding portion is in a range of 10 nm to 500 nm.
  4. 根据权利要求2所述的太阳能电池,其中,所述凹陷部的深度在10nm~500nm范围内。The solar cell according to claim 2, wherein a depth of the recessed portion is in a range of 10 nm to 500 nm.
  5. 根据权利要求2所述的太阳能电池,其中,所述凸出部包括多个条状结构和/或多个点状结构。The solar cell according to claim 2, wherein the protruding portion includes a plurality of strip structures and / or a plurality of dot structures.
  6. 根据权利要求2所述的太阳能电池,其中,所述凹陷部包括多个条状结构和/或多个点状结构。The solar cell according to claim 2, wherein the recessed portion includes a plurality of strip-like structures and / or a plurality of dot-like structures.
  7. 根据权利要求5或6所述的太阳能电池,其中,相邻两个所述条状结构之间的间距在10nm~1000nm范围内。The solar cell according to claim 5 or 6, wherein a pitch between two adjacent strip structures is in a range of 10 nm to 1000 nm.
  8. 根据权利要求5或6所述的太阳能电池,其中,多个所述点状结构分成多个点状结构组,每个所述点状结构组由位于同一条直线上的点状结构组成,且相邻两个所述点状结构组的间距在10nm~1000nm范围内。The solar cell according to claim 5 or 6, wherein a plurality of the dot-like structures are divided into a plurality of dot-like structure groups, each of the dot-like structure groups is composed of dot-like structures located on a same straight line, and The distance between two adjacent dot-shaped structures is in a range of 10 nm to 1000 nm.
  9. 根据权利要求1所述的太阳能电池,其中,所述缓冲层和所述窗口层依次形成在所述光吸收层上。The solar cell according to claim 1, wherein the buffer layer and the window layer are sequentially formed on the light absorption layer.
  10. 一种太阳能电池的制备方法,包括:A method for preparing a solar cell includes:
    在基层衬底上沉积背电极层;Depositing a back electrode layer on a base substrate;
    在所述背电极层背离所述基层衬底的一侧的表面上制备三维结构;Preparing a three-dimensional structure on a surface of the back electrode layer facing away from the base substrate;
    在具有三维结构的所述背电极层上制备光吸收层;Preparing a light absorption layer on the back electrode layer having a three-dimensional structure;
    在光吸收层上依次制备缓冲层和窗口层。A buffer layer and a window layer are sequentially prepared on the light absorbing layer.
  11. 根据权利要求10所述的制备方法,其中,在所述背电极层背离所述基层衬底的一侧的表面上制备所述三维结构的步骤包括:采用光学光刻工艺在所述背电极层上刻印所述三维结构。The manufacturing method according to claim 10, wherein the step of preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate substrate comprises: using an optical lithography process on the back electrode layer The three-dimensional structure is engraved.
  12. 根据权利要求11所述的制备方法,其中,所述光学光刻工艺包括电子光刻、原子光刻、极紫外光刻或X射线光刻中的一种。The manufacturing method according to claim 11, wherein the optical lithography process comprises one of electronic lithography, atomic lithography, extreme ultraviolet lithography, or X-ray lithography.
  13. 根据权利要求10所述的制备方法,其中,在所述背电极层背离所述基层衬底的一侧的表面上制备所述三维结构的步骤包括:采用纳米压印工艺或软刻印技术在所述背电 极层上压印所述三维结构。The manufacturing method according to claim 10, wherein the step of preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate comprises: applying a nano-imprint process or a soft engraving technique on the surface. The three-dimensional structure is imprinted on the back electrode layer.
  14. 根据权利要求10所述的制备方法,其中,在所述背电极层背离所述基层衬底的一侧的表面上制备所述三维结构的步骤包括:采用扫描探针工艺在所述背电极层上压印所述三维结构。The method according to claim 10, wherein the step of preparing the three-dimensional structure on a surface of the back electrode layer facing away from the base substrate substrate comprises: using a scanning probe process on the back electrode layer The three-dimensional structure is embossed.
PCT/CN2018/107723 2018-07-19 2018-09-26 Solar cell and preparation method therefor WO2020015169A1 (en)

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