WO2020010679A1 - 一种oled器件的封装结构以及显示面板 - Google Patents

一种oled器件的封装结构以及显示面板 Download PDF

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Publication number
WO2020010679A1
WO2020010679A1 PCT/CN2018/103583 CN2018103583W WO2020010679A1 WO 2020010679 A1 WO2020010679 A1 WO 2020010679A1 CN 2018103583 W CN2018103583 W CN 2018103583W WO 2020010679 A1 WO2020010679 A1 WO 2020010679A1
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Prior art keywords
groove
oled device
getter
substrate
package
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PCT/CN2018/103583
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English (en)
French (fr)
Inventor
张月
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/316,866 priority Critical patent/US20210367190A1/en
Publication of WO2020010679A1 publication Critical patent/WO2020010679A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present invention relates to the field of display technology, and particularly to a packaging structure of an OLED device and a display panel.
  • OLED Organic Light Emitting Diode (Organic Light-Emitting Diode)
  • OLED Organic Light Emitting Diode
  • the organic thin film material is mainly sensitive to oxygen and water vapor in the atmosphere, and chemical reactions will occur due to it. It fails, and the metal cathode material also causes electrochemical corrosion due to contact with water vapor. Therefore, the OLED light-emitting area must be effectively isolated from water and oxygen by packaging the OLED device to extend the working life of the OLED device.
  • the most commonly used package is mainly an ultraviolet (UV) curing frame adhesive packaging method.
  • UV curing adhesive cannot be completely pressed open during the lamination process, resulting in broken lines or The phenomenon of air bubbles, and even if the intact pressed and cured UV curing adhesive is cured by receiving ultraviolet light, it will shrink and form breaks, so that the organic materials inside will bear the risk of being attacked by water and oxygen. Therefore, the reliability of the OLED device package is reduced, thereby reducing the resistance of the OLED device to water and oxygen and reducing the service life of the OLED device.
  • the cover glass and the substrate are in plane contact, if the two are not flat or there is a foreign matter between them, the UV curing adhesive cannot be completely pressed open during the lamination process, resulting in broken lines or bubbles. In addition, even if the intact pressed UV curable adhesive is cured by receiving ultraviolet light, it will shrink and form broken lines.
  • the invention provides a packaging structure of an OLED device, including:
  • the package structure of the OLED device further includes a getter, the getter is located in the first groove, and the getter is disposed to surround the OLED device;
  • the material of the getter is titanium, zirconium, tantalum or hafnium.
  • the second groove includes an upper wall, and first and second side walls disposed opposite to each other, the upper wall is connected to the substrate, and the first side wall is disposed at The upper wall is on a side close to the first groove;
  • the distance between the first sidewall and the second sidewall is between 0.3 and 0.7 mm, and the distance between the first sidewall and the first groove is between 1 and 5 mm between.
  • a depth of the first groove is greater than a depth of the second groove.
  • a chamfer is further provided between the first groove and the second groove to avoid air bubbles and broken lines when the packaging cover is bonded to the substrate.
  • the chamfer is an acute angle, and the angle of the chamfer is between 5 and 15 degrees.
  • the getter has a ring structure to increase the contact area between the getter and water and oxygen.
  • the getter includes an outer side wall and an inner side wall, and the outer side wall and the inner side wall are oppositely disposed;
  • the inner sidewall is disposed on a side of the getter close to the OLED device, and a distance between the inner sidewall and the outer sidewall is between 1 and 5 millimeters.
  • the invention provides a packaging structure of an OLED device, including:
  • the packaging structure of the OLED device further includes a getter, the getter is located in the first groove, and the getter is disposed to surround the OLED device.
  • the second groove includes an upper wall, and first and second side walls disposed opposite to each other, the upper wall is connected to the substrate, and the first side wall is disposed at The upper wall is on a side close to the first groove;
  • the distance between the first sidewall and the second sidewall is between 0.3 and 0.7 mm, and the distance between the first sidewall and the first groove is between 1 and 5 mm between.
  • a depth of the first groove is greater than a depth of the second groove.
  • a chamfer is further provided between the first groove and the second groove to avoid air bubbles and broken lines when the packaging cover is bonded to the substrate.
  • the chamfer is an acute angle, and the angle of the chamfer is between 5 and 15 degrees.
  • the getter has a ring structure to increase the contact area between the getter and water and oxygen.
  • the getter includes an outer side wall and an inner side wall, and the outer side wall and the inner side wall are oppositely disposed;
  • the inner sidewall is disposed on a side of the getter close to the OLED device, and a distance between the inner sidewall and the outer sidewall is between 1 and 5 millimeters.
  • the material of the getter is titanium, zirconium, tantalum or hafnium.
  • the present invention also provides an OLED display panel, including: an OLED device packaging structure, and the OLED device packaging structure includes:
  • a depth of the first groove is greater than a depth of the second groove.
  • a chamfer is further provided between the first groove and the second groove to avoid air bubbles and broken lines when the packaging cover is bonded to the substrate.
  • the chamfer is an acute angle, and the angle of the chamfer is between 5 and 15 degrees.
  • the beneficial effect of the present invention is that the purpose of improving the reliability of the OLED device package is achieved by providing a first groove and a second groove on the package cover plate, and providing a viscous material in the second groove.
  • the resistance of the OLED device to water and oxygen is improved, thereby extending the service life of the OLED device.
  • FIG. 1 is a schematic cross-sectional view of a packaging structure of an OLED device according to an embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of a packaging structure of an OLED device according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic plan view of a packaging structure of an OLED device according to a preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a package cover of an OLED device according to a preferred embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of a package cover of an OLED device according to a preferred embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a getter provided by an embodiment of the present invention.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality” is two or more, unless specifically defined otherwise.
  • the "first” or “lower” of the first feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • FIG. 1 is a schematic cross-sectional view of a packaging structure of an OLED device according to an embodiment of the present invention.
  • An embodiment of the present invention provides a packaging structure of an OLED device, including:
  • an anode (not shown) can be formed on the glass substrate 10 by radio frequency sputtering, and then an organic thin film material and a metal cathode can be sequentially formed on the glass substrate 10 on which the anode is formed by an evaporation process (in the figure) (Not shown).
  • the package cover 20 is disposed on the glass substrate 10 on which the OLED device 101 is formed, and the package cover 20 is cut by laser to form a first groove 201 and a second groove 202.
  • the second groove 202 is disposed around the first groove 201, the OLED device 101 is disposed in the first groove 201, and the second groove 202 is filled with an adhesive material, so that the package cover 20 and the OLED device 101 are formed.
  • the substrate 10 is adhered and fixed.
  • the cross-sectional area of the first groove 201 is specifically determined according to the OLED device 101 to prevent the OLED device 101 from contacting the package cover 20.
  • the first groove 201 may be a square groove
  • the viscous material filled in the second groove 202 may be a UV curing glue.
  • an ultraviolet light source may be used to irradiate the UV curing adhesive in the second groove 202.
  • the UV curing adhesive is stimulated by the ultraviolet light source, and the glue hardens in a very short time.
  • FIG. 2 is a schematic cross-sectional view of a packaging structure of an OLED device according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic plan view of a packaging structure of the OLED device according to a preferred embodiment of the present invention.
  • the package structure of the OLED device further includes a getter 102, the getter 102 is located in the first groove 201, and the getter 102 is disposed around the OLED device 101.
  • the second groove 202 includes an upper wall 2021, and first and second side walls 2022 and 2023 opposite to each other.
  • the upper wall 2021 is connected to the substrate 10, and the first side wall 2022 is disposed on the substrate.
  • the upper wall 2021 is on a side close to the first groove 201; wherein a distance between the first side wall 2022 and the second side wall 2023 is between 0.3 mm and 0.7 mm, and the The distance between the first sidewall 2022 and the first groove 201 is between 1 mm and 5 mm.
  • the depth of the first groove 201 is greater than the depth of the second groove 202.
  • a ring-shaped getter 102 is further provided in the first groove 201.
  • the ring-shaped getter 102 is arranged around the OLED device 101, and the material of the getter 102 can be a desiccant for use.
  • the second groove 202 includes an upper wall 2021, and first and second sidewalls 2022 and 2023 opposite to each other.
  • the upper wall 2021 is connected to the substrate 10, and the first sidewall 2022 is disposed near the first wall 2021.
  • a groove 201 is on one side.
  • the distance between the first sidewall 2022 and the second sidewall 2023 is 0.5 mm
  • the distance between the first sidewall 2022 and the first groove 201 is 3 mm
  • the depth of the first groove 201 is greater than The depth of the two grooves 202.
  • FIG. 4 is a schematic structural diagram of a package cover of an OLED device according to a preferred embodiment of the present invention
  • FIG. 5 is a schematic cross-sectional view of a package cover of an OLED device according to a preferred embodiment of the present invention.
  • a chamfer 203 is further provided between the first groove 201 and the second groove 202 to avoid air bubbles and broken lines when the packaging cover 20 is bonded to the substrate 10.
  • a chamfer 203 is provided on the package cover 20.
  • the chamfer 203 is disposed between the first groove 201 and the second groove 202, and the chamfer 203 surrounds the first groove 201.
  • a UV curing method may be adopted, so that the sealant adheres the packaging cover 20 to the substrate 10.
  • part of the frame adhesive is squeezed back to the inside of the second groove 202 by the packaging cover 20, that is, part of the frame adhesive will remain on the chamfer 203, so that bubbles and broken lines can be avoided during UV curing. appear.
  • the chamfer 203 is an acute angle, and the angle of the chamfer is between 5 and 15 degrees. Preferably, the chamfer angle is 10 degrees.
  • the inside of the second groove 202 is chamfered at a small angle to form a chamfer 203, during the bonding process, the adhesive material between the substrate 10 and the package cover plate 20 will return to the inside due to the extrusion. Therefore, the occurrence of bubbles and broken lines can be avoided during UV curing, so the purpose of improving the reliability of the OLED device package is achieved, thereby improving the ability of the OLED device to resist water and oxygen, and extending the service life of the OLED device.
  • FIG. 6 is a schematic structural diagram of a getter provided by an embodiment of the present invention.
  • the getter 102 includes an outer sidewall 1021 and an inner sidewall 1022, and the outer sidewall 1021 and the inner sidewall 1022 are oppositely disposed;
  • the inner side wall 1022 is disposed on a side of the getter 102 near the OLED device 101, and a distance between the inner side wall 1022 and the outer side wall 1021 is between 1 and 5 millimeters. .
  • the material of the getter 102 is titanium, zirconium, tantalum or hafnium.
  • the present invention also provides an OLED display panel including a packaging structure of an OLED device according to any embodiment of the present invention.
  • a first groove 201 and a second groove 202 are provided on the package cover, and an adhesive material is provided in the second groove 202, and the first groove 201 and the second groove are provided.
  • a chamfer 203 is provided between the grooves 202 to avoid the occurrence of bubbles or broken lines during packaging, and the purpose of improving the reliability of the OLED device package is achieved. Therefore, the resistance of the OLED device to water and oxygen is improved, thereby extending the OLED device. Life.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供的OLED器件的封装结构，包括：形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定。

Description

一种OLED器件的封装结构以及显示面板 技术领域
本发明涉及显示技术领域，具体涉及一种OLED器件的封装结构以及显示面板。
 背景技术
目前，OLED（Organic Light Emitting Diode，有机发光二极管）通过在镀有阳极材料的玻璃基板上蒸镀有机薄膜材料和金属阴极材料来实现发光，但是有机薄膜材料主要对大气中的氧气和水汽很敏感，会因发生化学反应而失效，并且金属阴极材料还会由于接触到水汽而造成电化学腐蚀。因此，必须通过对OLED器件的封装来使OLED发光区域有效地隔绝水、氧以延长OLED器件的工作寿命。
目前最常用的封装主要采用的是紫外光（UV）固化框胶封装方式。然而，由于盖板玻璃和基板之间是平面相接，所以如果两者自身的不平整或者之间存在异物，会导致UV固化胶在压合过程中不能完全压合开，从而出现断纹或者气泡的现象，并且，即使完好压合开的UV固化胶在收到紫外光照射固化的过程中，也会出现收缩而形成断纹的现象，使得内部的有机材料承受着被水氧侵蚀的风险，因此降低了OLED器件封装的可靠性，从而使得OLED器件的抗水氧能力下降，降低OLED器件的使用寿命。
 技术问题
由于盖板玻璃和基板之间是平面相接，所以如果两者自身的不平整或者之间存在异物，会导致UV固化胶在压合过程中不能完全压合开，从而出现断纹或者气泡的现象，并且，即使完好压合开的UV固化胶在收到紫外光照射固化的过程中，也会出现收缩而形成断纹的现象。
 技术解决方案
本发明提供的技术方案如下：
本发明提供了一种OLED器件的封装结构，包括：
形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定；
所述OLED器件的封装结构还包括一吸气剂，所述吸气剂位于所述第一凹槽中，且所述吸气剂包围所述OLED器件设置；
所述吸气剂的材料为钛、锆、钽或者钍。
根据本发明一优选实施例，所述第二凹槽包括上壁，以及相对设置的第一侧壁和第二侧壁，所述上壁与所述基板相连，所述第一侧壁设置在所述上壁靠近所述第一凹槽的一侧上；其中，
所述第一侧壁与所述第二侧壁之间的距离介于0.3~0.7毫米之间，且所述第一侧壁与所述第一凹槽之间的距离介于1~5毫米之间。
根据本发明一优选实施例，所述第一凹槽的深度大于所述第二凹槽的深度。
根据本发明一优选实施例，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
根据本发明一优选实施例，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
根据本发明一优选实施例，所述吸气剂为环状结构，以增大所述吸气剂与水氧的接触面积。
根据本发明一优选实施例，所述吸气剂包括外侧壁和内侧壁，所述外侧壁和所述内侧壁相对设置；
其中，所述内侧壁设置在所述吸气剂靠近所述OLED器件的一侧上，且所述内侧壁与所述外侧壁之间的距离介于1~5毫米之间。
本发明提供了一种OLED器件的封装结构，包括：
形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定。
根据本发明一优选实施例，所述OLED器件的封装结构还包括一吸气剂，所述吸气剂位于所述第一凹槽中，且所述吸气剂包围所述OLED器件设置。
根据本发明一优选实施例，所述第二凹槽包括上壁，以及相对设置的第一侧壁和第二侧壁，所述上壁与所述基板相连，所述第一侧壁设置在所述上壁靠近所述第一凹槽的一侧上；其中，
所述第一侧壁与所述第二侧壁之间的距离介于0.3~0.7毫米之间，且所述第一侧壁与所述第一凹槽之间的距离介于1~5毫米之间。
根据本发明一优选实施例，所述第一凹槽的深度大于所述第二凹槽的深度。
根据本发明一优选实施例，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
根据本发明一优选实施例，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
根据本发明一优选实施例，所述吸气剂为环状结构，以增大所述吸气剂与水氧的接触面积。
根据本发明一优选实施例，所述吸气剂包括外侧壁和内侧壁，所述外侧壁和所述内侧壁相对设置；
其中，所述内侧壁设置在所述吸气剂靠近所述OLED器件的一侧上，且所述内侧壁与所述外侧壁之间的距离介于1~5毫米之间。
根据本发明一优选实施例，所述吸气剂的材料为钛、锆、钽或者钍。
本发明还提供了一种OLED显示面板，包括：OLED器件的封装结构，所述OLED器件的封装结构包括：
形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定。
根据本发明一优选实施例，所述第一凹槽的深度大于所述第二凹槽的深度。
根据本发明一优选实施例，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
根据本发明一优选实施例，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
 有益效果
本发明的有益效果为：通过在封装盖板上设置第一凹槽和第二凹槽，并且在所述第二凹槽中设置粘性材料，达到了提高OLED器件封装的可靠性的目的，因此提高了OLED器件的抗水氧能力，从而延长了OLED器件的使用寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的OLED器件的封装结构的截面示意图；
图2为本发明一优选实施例提供的OLED器件的封装结构的截面示意图；
图3为本发明一优选实施例提供的OLED器件的封装结构的平面示意图；
图4为本发明一优选实施例提供的OLED器件的封装盖板的结构示意图；
图5为本发明一优选实施例提供的OLED器件的封装盖板的截面示意图；
图6为本发明实施例提供的吸气剂的结构示意图。
 本发明的最佳实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，图1为本发明实施例提供的OLED器件的封装结构的截面示意图。
本发明实施例提供一种OLED器件的封装结构，包括：
形成有OLED器件101的基板10以及设置在所述基板10上的封装盖板20；其中，所述封装盖板20上设置有第一凹槽201和第二凹槽202，且所述第二凹槽202围绕所述第一凹槽201设置，所述OLED器件101设置在所述第一凹槽201中，所述第二凹槽202中设置有粘性材料，以使得所述封装盖板20与所述形成有OLED器件101的基板10粘合固定。
具体的，可以通过射频溅镀法在玻璃基板10上形成阳极（图中未示出），然后通过蒸镀工艺，在形成有阳极的玻璃基板10上依次形成有机薄膜材料以及金属阴极（图中均未示出）。封装盖板20设置在形成有OLED器件101的玻璃基板10上，且通过激光切割封装盖板20，以形成第一凹槽201和第二凹槽202。其中，第二凹槽202围绕第一凹槽201设置，OLED器件101设置在第一凹槽201中，第二凹槽202中填充有粘性材料，以使得封装盖板20与形成有OLED器件101的基板10粘合固定。需要说明的是，第一凹槽201的截面面积具体根据OLED器件101而定，以避免OLED器件101与封装盖板20接触。优选的，第一凹槽201可以为方形凹槽，第二凹槽202内填充的粘性材料可以为UV固化胶。具体粘合时，可以采用紫外线光源照射第二凹槽202中的UV固化胶，该UV固化胶受到紫外线光源的刺激，于极短时间内产生胶合硬化。
接着，请参阅图2以及图3，图2为本发明一优选实施例提供的OLED器件的封装结构的截面示意图，图3为本发明一优选实施例提供的OLED器件的封装结构的平面示意图。
所述OLED器件的封装结构还包括一吸气剂102，所述吸气剂102位于所述第一凹槽201中，且所述吸气剂102包围所述OLED器件101设置。
所述第二凹槽202包括上壁2021，以及相对设置的第一侧壁2022和第二侧壁2023，所述上壁2021与所述基板10相连，所述第一侧壁2022设置在所述上壁2021靠近所述第一凹槽201的一侧上；其中，所述第一侧壁2022与所述第二侧壁2023之间的距离介于0.3~0.7毫米之间，且所述第一侧壁2022与所述第一凹槽201之间的距离介于1~5毫米之间。
所述第一凹槽201的深度大于所述第二凹槽202的深度。
具体的，在第一凹槽201中，还设置有一环状的吸气剂102，该环状吸气剂102包围OLED器件101设置，且该吸气剂102的材料可以为干燥剂，以用于吸收外界的水氧，达到阻隔水氧的目的。其中，第二凹槽202包括上壁2021，以及相对设置的第一侧壁2022和第二侧壁2023，上壁2021与基板10相连，第一侧壁2022设置在上壁2021靠近所述第一凹槽201的一侧上。优选的，第一侧壁2022与第二侧壁2023之间的距离为0.5毫米，第一侧壁2022与第一凹槽201之间的距离为3毫米，第一凹槽201的深度大于第二凹槽202的深度。
进一步的，请结合参阅图4以及图5。图4为本发明一优选实施例提供的OLED器件的封装盖板的结构示意图，图5为本发明一优选实施例提供的OLED器件的封装盖板的截面示意图。
优选的，所述第一凹槽201与所述第二凹槽202之间还设置有一倒角203，以避免所述封装盖板20与所述基板10贴合时出现气泡以及断纹。
具体的，在封装盖板20上设置一倒角203，该倒角203设置在第一凹槽201与第二凹槽202之间，且倒角203包围第一凹槽201。具体封装时，可以采用UV固化的方式，使得框胶将封装盖板20贴合在基板10上。在贴合过程中，部分框胶受到封装盖板20挤压退至第二凹槽202的内侧，即部分框胶会保留在倒角203上，从而在UV固化时可以避免气泡和断纹的出现。
所述倒角203为锐角，且所述倒角的角度介于5~15度之间，优选的，倒角的角度为10度。
由于对第二凹槽202的内侧进行小角度的倒角处理，形成倒角203，在贴合的过程中，基板10与封装盖板20之间,的粘性材料会因挤压而退至内侧，从而在UV固化时可以避免气泡和断纹的出现，因此达到了提高OLED器件封装的可靠性的目的，从而提高了OLED器件抗水氧的能力，延长了OLED器件的使用寿命。
请参阅，图6为本发明实施例提供的吸气剂的结构示意图。
所述吸气剂102包括外侧壁1021和内侧壁1022，所述外侧壁1021和所述内侧壁1022相对设置；
其中，所述内侧壁1022设置在所述吸气剂102靠近所述OLED器件101的一侧上，且所述内侧壁1022与所述外侧壁1021之间的距离介于1~5毫米之间。
所述吸气剂102的材料为钛、锆、钽或者钍。
相应的，本发明还提供了一种OLED显示面板，包括本发明任一实施例的OLED器件的封装结构。
在本实施例中，通过在封装盖板上设置第一凹槽201和第二凹槽202，并且在所述第二凹槽202中设置粘性材料，并且在第一凹槽201和第二凹槽202之间设置一倒角203，避免在封装时产生气泡或者断纹的现象，达到了提高OLED器件封装的可靠性的目的，因此提高了OLED器件的抗水氧能力，从而延长了OLED器件的使用寿命。
以上对本发明实施例提供的OLED器件的封装结构以及显示面板进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明。同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种OLED器件的封装结构，其包括：
    形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定；
    所述OLED器件的封装结构还包括一吸气剂，所述吸气剂位于所述第一凹槽中，且所述吸气剂包围所述OLED器件设置；
    所述吸气剂的材料为钛、锆、钽或者钍。
  2. 根据权利要求1所述的OLED器件的封装结构，其中，所述第二凹槽包括上壁，以及相对设置的第一侧壁和第二侧壁，所述上壁与所述基板相连，所述第一侧壁设置在所述上壁靠近所述第一凹槽的一侧上；其中，
    所述第一侧壁与所述第二侧壁之间的距离介于0.3~0.7毫米之间，且所述第一侧壁与所述第一凹槽之间的距离介于1~5毫米之间。
  3. 根据权利要求2所述的的OLED器件的封装结构，其中，所述第一凹槽的深度大于所述第二凹槽的深度。
  4. 根据权利要求2所述的OLED器件的封装结构，其中，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
  5. 根据权利要求4所述的OLED器件的封装结构，其中，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
  6. 根据权利要求5所述的OLED器件的封装结构，其中，所述吸气剂为环状结构，以增大所述吸气剂与水氧的接触面积。
  7. 根据权利要求6所述的OLED器件的封装结构，其中，所述吸气剂包括外侧壁和内侧壁，所述外侧壁和所述内侧壁相对设置；
    其中，所述内侧壁设置在所述吸气剂靠近所述OLED器件的一侧上，且所述内侧壁与所述外侧壁之间的距离介于1~5毫米之间。
  8. 一种OLED器件的封装结构，其包括：
    形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定。
  9. 根据权利要求8所述的OLED器件的封装结构，其中，所述OLED器件的封装结构还包括一吸气剂，所述吸气剂位于所述第一凹槽中，且所述吸气剂包围所述OLED器件设置。
  10. 根据权利要求8所述的OLED器件的封装结构，其中，所述第二凹槽包括上壁，以及相对设置的第一侧壁和第二侧壁，所述上壁与所述基板相连，所述第一侧壁设置在所述上壁靠近所述第一凹槽的一侧上；其中，
    所述第一侧壁与所述第二侧壁之间的距离介于0.3~0.7毫米之间，且所述第一侧壁与所述第一凹槽之间的距离介于1~5毫米之间。
  11. 根据权利要求10所述的的OLED器件的封装结构，其中，所述第一凹槽的深度大于所述第二凹槽的深度。
  12. 根据权利要求10所述的OLED器件的封装结构，其中，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
  13. 根据权利要求12所述的OLED器件的封装结构，其中，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
  14. 根据权利要求13所述的OLED器件的封装结构，其中，所述吸气剂为环状结构，以增大所述吸气剂与水氧的接触面积。
  15. 根据权利要求14所述的OLED器件的封装结构，其中，所述吸气剂包括外侧壁和内侧壁，所述外侧壁和所述内侧壁相对设置；
    其中，所述内侧壁设置在所述吸气剂靠近所述OLED器件的一侧上，且所述内侧壁与所述外侧壁之间的距离介于1~5毫米之间。
  16. 根据权利要求15所述的OLED器件的封装结构，其中，所述吸气剂的材料为钛、锆、钽或者钍。
  17. 一种OLED显示面板，其包括OLED器件的封装结构，所述OLED器件的封装结构包括：
    形成有OLED器件的基板以及设置在所述基板上的封装盖板；其中，所述封装盖板上设置有第一凹槽和第二凹槽，且所述第二凹槽围绕所述第一凹槽设置，所述OLED器件设置在所述第一凹槽中，所述第二凹槽中设置有粘性材料，以使得所述封装盖板与所述形成有OLED器件的基板粘合固定。
  18. 根据权利要求17所述的OLED显示面板，其中，所述第一凹槽的深度大于所述第二凹槽的深度。
  19. 根据权利要求17所述的OLED显示面板，其中，所述第一凹槽与所述第二凹槽之间还设置有一倒角，以避免所述封装盖板与所述基板贴合时出现气泡以及断纹。
  20. 根据权利要求19所述的OLED显示面板，其中，所述倒角为锐角，且所述倒角的角度介于5~15度之间。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1404162A (zh) * 2001-09-05 2003-03-19 矶光显示科技股份有限公司 有机光发射二极管的密封构造、密封方法及密封装置
CN101262942B (zh) * 2005-07-29 2013-02-13 工程吸气公司 含一种或更多种吸气剂材料的沉积物和输送h2o的材料层的吸气剂体系
CN103325958A (zh) * 2013-06-19 2013-09-25 京东方科技集团股份有限公司 有机电致发光器件封装盖板、有机电致发光器件及显示器
CN104538555A (zh) * 2014-12-02 2015-04-22 深圳市华星光电技术有限公司 Oled封装结构及oled封装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101866943B (zh) * 2010-02-26 2013-12-25 信利半导体有限公司 一种有机电致发光显示器及其封装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1404162A (zh) * 2001-09-05 2003-03-19 矶光显示科技股份有限公司 有机光发射二极管的密封构造、密封方法及密封装置
CN101262942B (zh) * 2005-07-29 2013-02-13 工程吸气公司 含一种或更多种吸气剂材料的沉积物和输送h2o的材料层的吸气剂体系
CN103325958A (zh) * 2013-06-19 2013-09-25 京东方科技集团股份有限公司 有机电致发光器件封装盖板、有机电致发光器件及显示器
CN104538555A (zh) * 2014-12-02 2015-04-22 深圳市华星光电技术有限公司 Oled封装结构及oled封装方法

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