WO2020000902A1 - 触控面板及其制造方法及显示装置 - Google Patents

触控面板及其制造方法及显示装置 Download PDF

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Publication number
WO2020000902A1
WO2020000902A1 PCT/CN2018/119004 CN2018119004W WO2020000902A1 WO 2020000902 A1 WO2020000902 A1 WO 2020000902A1 CN 2018119004 W CN2018119004 W CN 2018119004W WO 2020000902 A1 WO2020000902 A1 WO 2020000902A1
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Prior art keywords
layer
metal wire
nano
touch panel
conductive layer
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PCT/CN2018/119004
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English (en)
French (fr)
Inventor
杜佳梅
刘东坤
刘金强
刘亚伟
吴耀燕
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to US16/718,209 priority Critical patent/US11256380B2/en
Publication of WO2020000902A1 publication Critical patent/WO2020000902A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to the field of display technology, and in particular, to a touch panel, a manufacturing method thereof, and a display device.
  • the material of a touch electrode in a conventional touch panel is usually indium tin oxide (ITO), which has high light transmittance and good conductivity.
  • ITO indium tin oxide
  • the surface resistance of ITO is very large. When it is applied to a large-sized touch panel, the conductive performance and sensitivity of the touch panel cannot be guaranteed.
  • the overall manufacturing cost of ITO is very expensive, and it is easily damaged. Therefore, nano metal wires have gradually become a material to replace ITO.
  • the purpose of the present application is to provide a touch panel, a manufacturing method thereof, and a display device, so as to solve the problem that the traditional nano metal wire manufacturing process cannot meet the requirements of adhesion and conductivity simultaneously.
  • an embodiment of the present application provides a touch panel, including:
  • the nano-metal wire conductive layer and the adhesion-promoting layer are stacked on the substrate, and the adhesion-promoting layer has a three-dimensional three-dimensional network structure.
  • the nano metal wire conductive layer includes a plurality of nano metal wires stacked in a stack; the nano metal wires overlap each other to form a conductive network.
  • the nano metal wire conductive layer further includes a matrix, and a plurality of the nano metal wires are stacked in the matrix.
  • the adhesion-promoting layer includes:
  • the communication hole is formed by the three-dimensional skeleton communicating with each other in a three-dimensional network.
  • the tackifier layer is located on the substrate, the nano metal wire conductive layer is located on the tackifier layer, and at least a part of the nano metal wire in the nano metal wire conductive layer extends outward to enter In the communication hole of the adhesion-promoting layer.
  • the adhesion-promoting layer and the nano-metal wire conductive layer are embedded with each other, and at least a part of the nano-metal wire in the nano-metal wire conductive layer enters the communication hole of the adhesion-promoting layer.
  • the communication hole is a combination of one or more of a circular hole, an oval hole, or an irregular hole.
  • the thickness of the nano metal wire conductive layer is 10 nm-200 nm, and the thickness of the adhesion-promoting layer is 10 nm-300 nm.
  • the sum of the thicknesses of the nano metal wire conductive layer and the adhesion-promoting layer is less than 400 nm.
  • the material of the adhesion-promoting layer includes at least one of a polymer, a nitride, and an oxide.
  • the adhesion-promoting layer is prepared by using any one or more of polyamide resin, polyurethane resin, and epoxy resin.
  • the nano metal wire conductive layer is a nano silver wire conductive layer.
  • the nano metal wire has a line length of 20 ⁇ m to 50 ⁇ m, a line diameter of less than 50 nm, and an aspect ratio of more than 500.
  • an opening size of the communication hole is larger than a wire diameter of the nano metal wire.
  • the touch panel further includes a cover plate and an adhesive layer, and the adhesive layer is located between the nano metal wire conductive layer and the cover plate to attach the substrate and the cover plate.
  • a wiring layer is further provided between the metal wire conductive layer and the bonding layer, and the wiring layer is located on an edge region of the touch panel.
  • An embodiment of the present application further provides a display device including the touch panel described above.
  • An embodiment of the present application further provides a method for manufacturing a touch panel, including:
  • a nano metal wire conductive layer and a tackifier layer are formed on the substrate, and the tackifier layer has a three-dimensional three-dimensional network structure.
  • the step of forming a nano-wire conductive layer and a tackifier layer disposed on the substrate in a stacked manner includes:
  • the nano metal wire conductive layer is formed on the adhesion-promoting layer.
  • the step of forming a nano-wire conductive layer and a tackifier layer disposed on the substrate in a stacked manner includes:
  • a tackifier layer is formed on the nano metal wire conductive layer.
  • the step of forming a tackifier layer on the substrate by using a template method includes:
  • An acid solution is used to dissolve the metal particles in the template solution, and the thickened layer formed has a three-dimensional three-dimensional network structure.
  • the touch panel and display device provided in this application include a substrate and a nano metal wire conductive layer and a tackifier layer laminated on the substrate.
  • the tackifier layer increases the distance between the substrate and the nano metal wire conductive layer.
  • the tackifier layer has a three-dimensional three-dimensional network structure, which can prevent the tackifier layers from agglomerating together, causing a dead volume, and Reduced conductivity.
  • the present application increases the conductivity of the nano metal wire conductive layer without reducing the adhesion between the nano metal wire conductive layer and the substrate, thereby improving the conductivity of the touch panel and the display device. And sensitivity.
  • FIG. 1 is a schematic structural diagram of a touch panel according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a three-dimensional skeleton provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a nano metal wire according to an embodiment of the present application.
  • a nano metal wire solution is usually directly coated on a substrate to form a nano metal wire conductive layer.
  • a nano metal wire conductive layer due to the poor adhesion of the nano metal wire conductive layer to the substrate, it is necessary to apply an additional adhesion layer on the nano metal wire conductive layer to improve the adhesion between the nano metal wire conductive layer and the substrate.
  • the adhesion-promoting layer solves the problem of the adhesion between the conductive layer of the metal nanowires and the substrate to a certain extent, because the adhesion-promoting layer is sticky, it is easy to agglomerate itself, resulting in dead volume, which cannot be fully utilized
  • the conductivity of the metal nanowire conductive layer reduces the conductivity of the metal nanowire conductive layer, so that the requirements of adhesion and conductivity cannot be met at the same time.
  • An embodiment of the present application provides a touch panel and a display device including a substrate and a nano metal wire conductive layer and a tackifier layer laminated on the substrate.
  • the tackifier layer adds the substrate and the nano metal wire conductive layer.
  • the adhesion promoting layer has a three-dimensional three-dimensional network structure, and the three-dimensional network structure can prevent the adhesion promoting layers from agglomerating together, causing a dead volume and causing the nano-metal wires to conduct electricity.
  • the conductivity of the layer is reduced.
  • the present application increases the conductivity of the nano metal wire conductive layer without reducing the adhesion between the nano metal wire conductive layer and the substrate, thereby improving the conductivity of the touch panel and the display device. And sensitivity.
  • FIG. 1 is a schematic diagram of a touch panel provided in this embodiment.
  • the touch panel includes a substrate 1 and a nano metal wire conductive layer 3 and an adhesion-promoting layer 2 laminated on the substrate 1.
  • the thickening layer 2 has a three-dimensional three-dimensional network structure.
  • the substrate 1 provides support for the entire touch panel.
  • the substrate 1 includes a visible area and a frame area, and the frame area surrounds the visible area.
  • the frame region is located at an edge of the substrate 1 and has a "back" shape.
  • the visible area of the substrate is usually used for light-transmissive display, and the frame area is usually opaque to highlight the display content of the visible area.
  • the substrate 1 is generally made of a transparent insulating material.
  • the substrate 1 may be a rigid substrate formed of a material such as glass, metal, or ceramics; it may also be made of acrylic or polymethyl methacrylate.
  • PMMA polyacrylonitrile-butadiene-styrene
  • ABS polyamide
  • PA polyimide
  • PB polybenzimidazole polybutene
  • PBT polybutylene terephthalate Alcohol ester
  • PC polycarbonate
  • PEEK polyetheretherketone
  • PEI polyetherimide
  • PES polyethersulfone
  • PE polyethylene
  • PET polyethylene tetrafluoroethylene
  • ETFE polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), polyoxymethylene (POM), polyphenylene ether (PPE), Polypropylene (PP), polystyrene (PS), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinylidene chloride (PVDC), poly A flexible substrate made of any suitable insulating material such as vinyl
  • the tackifier layer 2 increases the adhesion between the substrate 1 and the nano metal wire conductive layer 3, and since the tackifier layer 2 has a three-dimensional three-dimensional network structure, the tackifier layer 2 is prevented Agglomeration together causes a dead volume, resulting in a decrease in the conductivity of the nano-metal wire conductive layer 3.
  • the three-dimensional network-like adhesion-promoting layer 2 includes a three-dimensional skeleton 4 and a communication hole 5 formed by the three-dimensional skeleton 4 communicating into a three-dimensional network.
  • the shape of the communication hole 5 is one or more of a circular hole, a square hole, or an irregular hole.
  • the material of the tackifier layer 2 may be one or more of materials such as a polymer, nitride and oxide, and the polymer may be polyvinyl alcohol (PVA), polyvinyl alcohol Butyraldehyde (PVB resin), polyaniline (PAN or PANI), polyphenylene ether (PPE), polyparaphenylene acetylene (PPV), poly3,4-ethylenedioxyphene (PEDOT), polystyrene Sulfonic acid (PSS), poly3-hexylthiophene (P3HT), poly3-octylthiophene (P3OT), poly-C-61-butyric acid-methyl ester (PCBM), poly [2-methoxy-5- ( 2-ethyl-hexyloxy) -1,4-phenylenevinyl] (MEH-PPV) and other organic materials having viscosity
  • the nitride may be silicon nitride
  • the oxide may be silicon oxide.
  • the three-dimensional network-like adhesion-promoting layer 2 may be prepared by a template method, for example, metal particles are added to an organic optical glue solution to form a template solution, and the template solution is coated on the substrate 1 Then, the template solution coated on the substrate 1 is cured, and finally the acid particles (for example, a 5% phosphoric acid solution) are used to dissolve the metal particles, and the thickened layer 2 is formed into a three-dimensional three-dimensional network structure.
  • the curing method may be air-drying, simple baking or heat curing, and the heat curing is, for example, infrared heating, hot air heating, or the like.
  • the adhesion-promoting layer 2 may be formed on the substrate 1 by using a template method, and then the nano-metal wire conductive layer 3 is formed on the adhesion-promoting layer 2 to avoid acidic liquid on the nano-metal wires.
  • the conductive layer 3 has an influence.
  • the nano metal wire conductive layer 3 may also be formed on the substrate 1 first, and then the adhesion promoting layer 2 is formed on the nano metal wire conductive layer 3, so that the nano metal wire conductive layer 3 and the The tackifier layers 2 can be better embedded with each other.
  • the nano metal wire conductive layer 3 includes a plurality of cross-stacked nano metal wires 31, and a plurality of nano metal wires 31 are overlapped to form a conductive network by molecular force.
  • the nano metal wire conductive layer 3 may further include a matrix and the nano metal wires are stacked in the matrix, and the matrix is used to protect the nano metal wires 31 from external environments such as corrosion and abrasion. Impact.
  • the nano metal wire may be a nano wire of gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), or the like. Since silver has the characteristics of good electrical conductivity and light transmission, the nano metal wire is preferably a silver nano wire.
  • the adhesion-promoting layer 2 is located on the substrate 1, and the nano-metal wire conductive layer 3 is disposed on the adhesion-promoting layer 2. At least part of the nano metal wire 31 in the nano metal wire conductive layer 3 extends outward (close to the substrate 1 direction) and enters the communication hole 5 of the adhesion promoting layer 2.
  • the adhesion-promoting layer 2 may also be embedded with the nano-metal wire conductive layer 3, and the nano-metal wires in the nano-metal wire conductive layer 3 at least partially enter the communication holes 5 of the adhesion-promoting layer 2.
  • the line length of the nano metal wire 31 is, for example, 20 ⁇ m to 50 ⁇ m
  • the line diameter is, for example, less than 50 nm
  • the aspect ratio (that is, the ratio of the line length to the line diameter) is, for example, greater than 500.
  • At least a part of the nano metal wire 31 in the nano metal wire conductive layer 3 is embedded in the communication hole 5; optionally, one nano metal wire 31 may be located in a plurality of the communication holes 5 at the same time, Alternatively, a part of the nano-metal wire 31 is located in the communication hole 5 of the adhesion-promoting layer 2, and a portion is located on the adhesion-promoting layer 2.
  • an opening size of the communication hole 5 may be larger than a wire diameter of the nano metal wire 31 so that the nano metal wire 31 is better embedded in the communication hole 5.
  • the shape of the communication hole 5 is a circular hole, and the diameter of the circular communication hole 5 may be greater than or equal to 50 nm.
  • the thickness of the nano metal wire conductive layer 3 may be 10 nm-200 nm, for example, 50 nm, 100 nm, or 150 nm.
  • the thickness of the adhesion-promoting layer 2 may be 10 nm to 300 nm, for example, 100 nm, 200 nm, or 150 nm.
  • the sum of the thicknesses of the nano metal wire conductive layer 3 and the adhesion-promoting layer 2 may be less than 400 nm to avoid the touch panel from being too thick.
  • the touch panel may further include a cover plate and a bonding layer, and the bonding layer is located between the nano metal wire conductive layer 3 and the cover plate to bond the substrate and the cover plate.
  • a wiring layer is further provided between the metal wire conductive layer 3 and the bonding layer, and the wiring layer is located on an edge region of the touch panel.
  • the material of the wiring layer may be one or more of silver, gold, indium tin oxide, metal mesh, or graphene.
  • an embodiment of the present application further provides a display device, and the display device includes the touch panel described above.
  • the display device may be a touch screen of a mobile phone, a tablet, a watch, a computer, a refrigerator, a washing machine, an induction cooker, or the like.
  • the touch panel and display device provided in the embodiments of the present application include a nano metal wire conductive layer and a tackifier layer, and the tackifier layer increases the adhesion between the substrate and the nano metal wire conductive layer.
  • the tackifier layer has a three-dimensional three-dimensional network structure, and the nano metal wire conductive layer is at least partially embedded in the three-dimensional network structure of the tackifier layer in the thickness direction to prevent the tackifier layer.
  • the present application adds the above without reducing the adhesion between the nano metal wire conductive layer and the substrate
  • the conductivity of the nano-metal wire conductive layer further improves the conductivity and sensitivity of the touch panel.

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Abstract

本申请提供了一种触控面板及其制造方法及显示装置。所述触控面板包括基板及层叠设置于基板上的纳米金属线导电层和增粘层，所述增粘层增加了基板与所述纳米金属线导电层之间的粘附力；并且，所述增粘层呈立体的三维网络状结构，这种三维网络状结构能防止所述增粘层团聚在一起，造成死体积，导致所述纳米金属线导电层的导电性降低。

Description

触控面板及其制造方法及显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种触控面板及其制造方法及显示装置。
背景技术
传统的触控面板中触控电极的材料通常为氧化铟锡(ITO)，其透光率较高，导电性能也不错。但是ITO的面电阻很大，其应用在大尺寸的触控面板上时，触控面板的导电性能及灵敏度无法保证。此外，ITO的整体制作成本非常昂贵，又极易被破坏。所以，目前纳米金属线已经逐渐成为替代ITO的材料。然而，传统的纳米金属线制作工艺难以同时满足粘附性和导电能力的要求。
发明内容
本申请的目的在于提供一种触控面板及其制造方法及显示装置，以解决传统的纳米金属线制作工艺难以同时满足粘附性和导电能力的要求的问题。
为了达到上述目的，本申请的实施例提供了一种触控面板，包括：
基板；
纳米金属线导电层和增粘层，层叠设置于所述基板上，其中，所述增粘层呈立体的三维网络状结构。
可选地，所述纳米金属线导电层包括若干交叉堆叠的纳米金属线；若干所述纳米金属线相互搭接构成导电网络。
可选地，所述纳米金属线导电层还包括有基质，若干所述纳米金属线堆叠于所述基质之中。
可选地，所述增粘层包括：
立体骨架；
连通孔，由所述立体骨架连通成三维网络状而构成。
可选地，所述增粘层位于所述基板上，所述纳米金属线导电层位于所述增粘层上，且所述纳米金属线导电层中的至少部分纳米金属线向外延伸以进入所述增粘层的连通孔中。
可选地，所述增粘层与所述纳米金属线导电层相互嵌入，且所述纳米金属线导电层中的至少部分纳米金属线进入所述增粘层的连通孔中。
可选地，所述连通孔为圆形孔、椭圆形孔或不规则孔中的一种或多种的组合。
可选地，所述纳米金属线导电层的厚度为10nm-200nm，所述增粘层的厚度为10nm-300nm。
可选地，所述纳米金属线导电层与所述增粘层的厚度之和小于400nm。
可选地，所述增粘层的材料包括高分子聚合物、氮化物及氧化物中的至少一种。
可选地，所述增粘层为聚酰胺树脂、聚氨酯树脂及环氧树脂中的任一种或多种调配而成。
可选地，纳米金属线导电层为纳米银线导电层。
可选地，所述纳米金属线的线长为20μm-50μm，线径小于50nm，长径比大于500。
可选地，所述连通孔的开口尺寸大于所述纳米金属线的线径。
可选地，所述触控面板还包括有盖板和贴合层，所述贴合层位于所述纳米金属线导电层及所述盖板之间以将所述基板及所述盖板贴合；所述金属线导电层与所述贴合层之间还设置有走线层，所述走线层位于所述触控面板的边缘区域上。
本申请的实施例还提供了一种显示装置，包括上述的触控面板。
本申请的实施例还提供了一种触控面板的制备方法，包括：
提供一基板；
在所述基板上形成层叠设置的纳米金属线导电层和增粘层；其中，所述增粘层呈立体的三维网络状结构。
可选地，所述在所述基板上形成层叠设置的纳米金属线导电层和增粘层的步骤包括：
采用模板法在所述基板上形成增粘层；
在所述增粘层上形成所述纳米金属线导电层。
可选地，所述在所述基板上形成层叠设置的纳米金属线导电层和增粘层的步骤包括：
在所述基板上形成纳米金属线导电层；
在所述纳米金属线导电层上形成增粘层。
可选地，所述采用模板法在所述基板上形成增粘层的步骤包括：
提供有机光学胶溶液；
在所述有机光学胶溶液中添加金属颗粒物以形成模板溶液；
将所述模板溶液涂布在所述基板上；
对所述基板上涂布的所述模板溶液进行固化；
采用酸液溶解掉所述模板溶液中的所述金属颗粒物，形成的所述增粘层呈立体的三维网络状结构。
在本申请提供的触控面板及显示装置中，包括基板及层叠设置于基板上的纳米金属线导电层及增粘层，所述增粘层增加了基板与所述纳米金属线导电层之间的粘附力；并且，所述增粘层呈立体的三维网络状结构，这种三维网络状结构能防止所述增粘层团聚在一起，造成死体积，导致所述纳米金属线导电层的导电性降低。本申请在不降低所述纳米金属线导电层与所述基板之间粘附力的基础上，增加了所述纳米金属线导电层的导电性能，进而提高了触控面板及显示装置的导电能力及灵敏度。
附图说明
图1为本申请实施例提供的触控面板的结构示意图；
图2为本申请实施例提供的立体骨架的结构示意图；
图3为本申请实施例提供的纳米金属线的结构示意图；
其中，1-基板，2-增粘层，3-纳米金属线导电层，31-纳米金属线，4-立体骨架，5-连通孔。
具体实施方式
目前的纳米金属线触控面板的制备工艺中，通常是将纳米金属线溶液直接涂布在基板上以形成纳米金属线导电层。但是，由于纳米金属线导电层对基板附着性很差，所以需要在纳米金属线导电层上再涂覆一层增粘层，以提高纳米金属线导电层与基板之间的附着力。然而，尽管涂覆增粘层在一定程度上解决了金属纳米线导电层与基板之间的黏附力问题，但由于增粘层具有粘性，其本身容易团聚在一起，造成死体积，不能充分发挥金属纳米线导电层的导电性，从而使金属纳米线导电层的导电性能下降，这样一来就无法同时满足粘附性和导电能力的要求。
本申请的实施例提供一种触控面板及显示装置，包括基板及层叠设置于基板上的纳米金属线导电层及增粘层，所述增粘层增加了基板与所述纳米金属线导电层之间的粘附力；并且，所述增粘层呈立体的三维网络状结构，这种三维网络状结构能防止所述增粘层团聚在一起，造成死体积，导致所述纳米金属线导电层的导电性降低。本申请在不降低所述纳米金属线导电层与所述基板之间粘附力的基础上，增加了所述纳米金属线导电层的导电性能，进而提高了触控面板及显示装置的导电能力及灵敏度。
下面将结合示意图对本申请的具体实施方式进行更详细的描述。
请参阅图1，其为本实施例提供的触控面板的示意图，所述触控面板包括基板1及层叠设置于所述基板1上的纳米金属线导电层3和增粘层2，所述增粘层2呈立体的三维网络状结构。
具体地，所述基板1为整个所述触控面板提供支撑。所述基板1包括可视区及边框区，所述边框区围绕所述可视区。例如，所述基板1呈矩形状，则所述边框区位于所述基板1的边缘并且呈“回”字形。所述基板的可视区通常用于透光显示，所述边框区通常不透光以突出所述可视区的显示内容。所述基板1通常是由透明的绝缘材料制成，具体而言，所述基板1可以是采用如玻璃、金属、或陶瓷材料形成的刚性基板；也可以是采用亚克力、聚甲基丙烯酸甲酯(PMMA)、聚丙烯腈-丁二烯-苯乙烯(ABS)、聚酰胺(PA)、聚酰亚胺(PI)、聚苯并咪唑聚丁烯(PB)、聚对苯二甲酸丁二醇酯(PBT)、聚碳酸酯(PC)、聚醚醚酮(PEEK)、聚醚酰亚胺(PEI)、聚醚砜(PES)、聚乙烯(PE)、聚 对苯二甲酸乙二醇酯(PET)、聚乙烯四氟乙烯(ETFE)、聚环氧乙烷、聚乙醇酸(PGA)、聚甲基戊烯(PMP)、聚甲醛(POM)、聚苯醚(PPE)、聚丙烯(PP)、聚苯乙烯(PS)、聚四氟乙烯(PTFE)、聚氨酯(PU)、聚氯乙烯(PVC)、聚氟乙烯(PVF)、聚偏二氯乙烯(PVDC)、聚偏二氟乙烯(PVDF)或苯乙烯-丙烯腈(SAN)等任意合适的绝缘材料形成的柔性基板。本实施例中，所述基板1为柔性基板。
所述增粘层2增加了所述基板1与所述纳米金属线导电层3的粘附力，并且，由于所述增粘层2呈立体的三维网络状结构，防止所述增粘层2团聚在一起，造成死体积，导致所述纳米金属线导电层3的导电性降低。请参阅图2，所述三维网络状结构的增粘层2包括立体骨架4及由所述立体骨架4连通成三维网络状而构成的连通孔5。所述连通孔5的形状为圆形孔、方形孔或不规则形孔中的一种或多种。所述增粘层2的材料可以是如高分子聚合物、氮化物及氧化物等材料中的一种或多种，所述高分子聚合物可以是聚乙烯醇(PVA)、聚乙烯醇缩丁醛(PVB树脂)、聚苯胺(PAN或PANI)、聚苯撑醚(PPE)、聚对苯撑乙炔(PPV)、聚3，4-亚乙基二氧吩(PEDOT)、聚苯乙烯磺酸(PSS)、聚3-己基噻吩(P3HT)、聚3-辛基噻吩(P3OT)、聚C-61-丁酸-甲酯(PCBM)、聚[2-甲氧基-5-(2-乙基-己氧基)-1，4-苯撑乙烯](MEH-PPV)等具有粘性的有机材料，所述氮化物可以是氮化硅，所述氧化物可以是氧化硅。本实施例中，所述增粘层2为采用聚酰胺树脂、聚氨酯树脂及环氧树脂等胶粘剂材料中的一种或多种调配而成的有机光学胶，并且所述立体骨架4之间构成的所述连通孔5为圆形孔。
可选地，所述三维网络状结构的增粘层2可以采用模板法制作，例如：在有机光学胶溶液中添加金属颗粒物以形成模板溶液，将所述模板溶液涂布在所述基板1上，再对所述基板1上涂布的模板溶液进行固化，最后采用酸液(例如是5％磷酸溶液)溶解掉所述金属颗粒物，形成的所述增粘层2呈立体的三维网络状结构。所述固化的方法可以自然晾干、简单烘烤或加热固化等，所述加热固化例如是红外加热、热风加热等。进一步，所述增粘层2可以先采用模板法形成于所述基板1上，再在所述增粘层2上形成所述纳米金属线导电层3，以避免酸液对所述纳米金属线导电层3造成影响。当然也可以先在所述基板1上形成所述纳米金属线导电层3，再在所述纳米金属线导电层3上形成所述增粘层 2，使得所述纳米金属线导电层3与所述增粘层2能够更好的相互嵌入。
进一步，请参阅图3，所述纳米金属线导电层3包括若干交叉堆叠的纳米金属线31，若干纳米金属线31之间通过分子力搭接形成导电网络。可选地，所述纳米金属线导电层3还可以包括基质且所述纳米金属线堆叠于所述基质之中，所述基质用于保护所述纳米金属线31不被腐蚀、磨损等外界环境的影响。所述纳米金属线可以是金(Au)、银(Ag)、铂(Pt)、铜(Cu)、钴(Co)、钯(Pd)等的纳米线。由于银具有导电性和透光性好等特点，所述纳米金属线优选为银纳米线。
如图1所示，本实施例中，所述增粘层2位于所述基板1上，所述纳米金属线导电层3位于所述增粘层2上。所述纳米金属线导电层3中的至少部分纳米金属线31向外(靠近所述基板1的方向)延伸并进入所述增粘层2的连通孔5中。当然，所述增粘层2也可以与所述纳米金属线导电层3相互嵌入，所述纳米金属线导电层3中的纳米金属线至少部分进入所述增粘层2的连通孔5中。
进一步，所述纳米金属线31的线长例如为20μm-50μm，线径例如是小于50nm，长径比(即，线长与线径之比)例如是大于500。所述纳米金属线导电层3中的至少部分所述纳米金属线31嵌入所述连通孔5中；可选的，一根所述纳米金属线31可以同时位于多个所述连通孔5中，或者，一根所述纳米金属线31的部分位于所述增粘层2的连通孔5中，部分位于所述增粘层2上。进一步，所述连通孔5的开口尺寸可以大于所述纳米金属线31的线径，以便于所述纳米金属线31更好的嵌入所述连通孔5。如图2所示，本实施例中，所述连通孔5的形状为圆形孔，则所述圆形的连通孔5的直径可以大于等于50nm。
所述纳米金属线导电层3的厚度可以为10nm-200nm，例如是50nm、100nm或150nm等。所述增粘层2的厚度可以为10nm-300nm，例如是100nm、200nm或150nm等。所述纳米金属线导电层3与所述增粘层2的厚度之和可以小于400nm，以避免所述触控面板过厚。
所述触控面板还可进一步包括有盖板和贴合层，所述贴合层位于所述纳米金属线导电层3及所述盖板之间以将所述基板及所述盖板贴合。可选的，所述金属线导电层3与所述贴合层之间还设置有一走线层，所述走线层位于所述触控面板的边缘区域上。所述走线层的材料可以是银、金、氧化铟锡、金属筛网 或石墨烯中的一种或多种。
有基于此，本申请的实施例还提供了一种显示装置，所述显示装置包括上述触控面板。其中显示装置可以为手机、平板、手表、电脑、冰箱、洗衣机、电磁炉等的触控屏。
综上，在本申请实施例提供的触控面板及显示装置中，包括纳米金属线导电层及增粘层，所述增粘层增加了基板与所述纳米金属线导电层之间的粘附力，并且，所述增粘层呈立体的三维网络状结构，所述纳米金属线导电层在其厚度方向上至少部分嵌入所述增粘层的三维网络状结构中，防止所述增粘层团聚在一起，造成死体积，导致所述纳米金属线导电层的导电性降低；本申请在不降低所述纳米金属线导电层与所述基板之间粘附力的基础上，增加了所述纳米金属线导电层的导电性能，进而提高了触控面板的导电能力及灵敏度。
上述仅为本申请的优选实施例而已，并不对本申请起到任何限制作用。任何所属技术领域的技术人员，在不脱离本申请的技术方案的范围内，对本申请揭露的技术方案和技术内容做任何形式的等同替换或修改等变动，均属未脱离本申请的技术方案的内容，仍属于本申请的保护范围之内。

Claims (20)

  1. 一种触控面板，包括：
    基板；
    纳米金属线导电层和增粘层，层叠设置于所述基板上，其中，所述增粘层呈立体的三维网络状结构。
  2. 如权利要求1所述的触控面板，其中，所述纳米金属线导电层包括若干交叉堆叠的纳米金属线；若干所述纳米金属线相互搭接构成导电网络。
  3. 如权利要求2所述的触控面板，其中，所述纳米金属线导电层还包括基质，所述纳米金属线堆叠于所述基质之中。
  4. 如权利要求2所述的触控面板，其中，所述增粘层包括：
    立体骨架；
    连通孔，由所述立体骨架连通成三维网络状而构成。
  5. 如权利要求4所述的触控面板，其中，所述增粘层位于所述基板上，所述纳米金属线导电层位于所述增粘层上，且所述纳米金属线导电层中的至少部分纳米金属线向外延伸以进入所述增粘层的连通孔中。
  6. 如权利要求4所述的触控面板，其中，所述增粘层与所述纳米金属线导电层相互嵌入，且所述纳米金属线导电层中的至少部分纳米金属线进入所述增粘层的连通孔中。
  7. 如权利要求4所述的触控面板，其中，所述连通孔为圆形孔、椭圆形孔或不规则孔中的一种或多种的组合。
  8. 如权利要求1所述的触控面板，其中，所述纳米金属线导电层的厚度为10nm-200nm，所述增粘层的厚度为10nm-300nm。
  9. 如权利要求8所述的触控面板，其中，所述纳米金属线导电层与所述增粘层的厚度之和小于400nm。
  10. 如权利要求1所述的触控面板，其中，所述增粘层的材料包括高分子聚合物、氮化物及氧化物中的至少一种。
  11. 如权利要求10所述的触控面板，其中，所述增粘层为聚酰胺树脂、聚氨酯树脂及环氧树脂中的任一种或多种调配而成。
  12. 如权利要求1所述的触控面板，其中，纳米金属线导电层为纳米银线 导电层。
  13. 如权利要求2所述的触控面板，其中，所述纳米金属线的线长为20μm-50μm，线径小于50nm，长径比大于500。
  14. 如权利要求4所述的触控面板，其中，所述连通孔的开口尺寸大于所述纳米金属线的线径。
  15. 如权利要求1所述的触控面板，还包括有盖板和贴合层，所述贴合层位于所述纳米金属线导电层及所述盖板之间以将所述基板及所述盖板贴合；所述金属线导电层与所述贴合层之间还设置有走线层，所述走线层位于所述触控面板的边缘区域上。
  16. 一种显示装置，包括如权利要求1所述的触控面板。
  17. 一种触控面板的制备方法，包括：
    提供一基板；
    在所述基板上形成层叠设置的纳米金属线导电层和增粘层；其中，所述增粘层呈立体的三维网络状结构。
  18. 如权利要求17所述的制备方法，其中，所述在所述基板上形成层叠设置的纳米金属线导电层和增粘层的步骤包括：
    采用模板法在所述基板上形成增粘层；
    在所述增粘层上形成所述纳米金属线导电层。
  19. 如权利要求17所述的制备方法，其中，所述在所述基板上形成层叠设置的纳米金属线导电层和增粘层的步骤包括：
    在所述基板上形成纳米金属线导电层；
    在所述纳米金属线导电层上形成增粘层。
  20. 如权利要求18所述的制备方法，其中，所述采用模板法在所述基板上形成增粘层的步骤包括：
    提供有机光学胶溶液；
    在所述有机光学胶溶液中添加金属颗粒物以形成模板溶液；
    将所述模板溶液涂布在所述基板上；
    对所述基板上涂布的所述模板溶液进行固化；
    采用酸液溶解掉所述模板溶液中的所述金属颗粒物，形成所述增粘层。
PCT/CN2018/119004 2018-06-30 2018-12-03 触控面板及其制造方法及显示装置 Ceased WO2020000902A1 (zh)

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