WO2019242523A1 - 光模块 - Google Patents
光模块 Download PDFInfo
- Publication number
- WO2019242523A1 WO2019242523A1 PCT/CN2019/090646 CN2019090646W WO2019242523A1 WO 2019242523 A1 WO2019242523 A1 WO 2019242523A1 CN 2019090646 W CN2019090646 W CN 2019090646W WO 2019242523 A1 WO2019242523 A1 WO 2019242523A1
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- WO
- WIPO (PCT)
- Prior art keywords
- bracket
- base
- optical module
- optical
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
Definitions
- the present disclosure relates to an optical module.
- the optical devices inside the optical modules are required to be isolated from the housings of the optical modules in order to be able to effectively improve Conducted Emission (CE), Electro-Static Discharge (ESD) And other electromagnetic interference test indicators.
- CE Conducted Emission
- ESD Electro-Static Discharge
- An embodiment of the present invention provides an optical module including: a base; an optical fiber adapter on which a chuck is provided; an optical sub-module connected to the optical fiber adapter; a first bracket made of an insulating material and provided on the base Is connected to the chuck and is configured to support the fiber optic adapter so that the base is electrically isolated from the fiber optic adapter.
- FIG. 1A shows a first schematic diagram of a partial structure of an optical module
- FIG. 1B shows a second schematic diagram of a partial structure of an optical module
- FIG. 2 is a schematic structural diagram of an optical component inside an optical module
- FIG. 3A illustrates an exploded view of an optical module provided by an embodiment of the present disclosure
- FIG. 3B shows an exploded view of an optical module provided by an embodiment of the present disclosure
- 3C shows an exploded view of an optical module provided by an embodiment of the present disclosure
- FIG. 4A is a schematic structural diagram of a base of an optical module according to an embodiment of the present disclosure.
- FIG. 4B is a schematic diagram showing a partial structure of an optical module according to an embodiment of the present disclosure.
- FIG. 4C is a schematic structural diagram of a part of an optical module according to an embodiment of the present disclosure.
- FIG. 4D shows a partial structural diagram of the base shown in FIG. 4A
- FIG. 4E shows a schematic plan view of a part of the base shown in FIG. 4A;
- FIG. 5A shows a partial structural diagram of an optical module provided by an embodiment of the present disclosure
- FIG. 5B shows a partial structural diagram of an optical module according to an embodiment of the present disclosure
- 6A is a schematic structural diagram of a first bracket of an optical module according to an embodiment of the present disclosure.
- 6B is a schematic structural diagram of a first bracket of an optical module according to an embodiment of the present disclosure.
- FIG. 7A is a schematic structural diagram of a second bracket of an embodiment of an optical module provided by the present disclosure.
- FIG. 7B is a schematic structural diagram of a second bracket of an embodiment of an optical module provided by the present disclosure.
- first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features.
- the terms “installation,” “connected,” “connected,” and “fixed” should be understood broadly unless otherwise specified and limited. For example, they can be fixed or detachable. , Or integrated; can be directly connected, or indirectly connected through an intermediate medium, can be the internal connection of the two elements or the interaction between the two elements, unless explicitly defined otherwise.
- the specific meanings of the above terms in the present disclosure can be understood according to specific situations.
- the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
- the first feature is “above”, “above”, and “above” the second feature.
- the first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature.
- the first feature is “below”, “below”, and “below” of the second feature.
- the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
- the optical module Due to the requirements of life, heat dissipation and electromagnetic shielding, the optical module usually uses zinc alloy material. Because of the requirements of strength and processing accuracy of optical devices, the optical fiber adapter connected to the optical devices usually uses stainless steel. As shown in FIG. 1A and FIG. 1B, the fixing of the optical device inside the housing 110 is achieved by clamping the chuck 121 of the optical fiber adapter 120 into the groove 111 of the housing 110, which is integrally formed with the housing 110 The optical device includes an optical fiber adapter 120 and an optical sub-module 130.
- the optical fiber adapter 120 and the housing 110 are both metal materials, and the chuck 121 and the groove 111 are also metal materials, the optical fiber adapter 120 and optical The module housing 110 is in an electrically conducting state, that is, the optical device is not electrically isolated from the housing 110 of the optical module.
- the chuck 121 and the optical sub-module located on the rear side of the optical fiber adapter 120 A ceramic sleeve 122 is added between 130 to achieve the electrical isolation between the optical fiber adapter 120 and the optical module housing 110.
- the added ceramic sleeve 122 will cause the overall length of the optical device to increase, occupying the printed circuit board cloth. Board space, or the increase in the length of the optical module, is not conducive to the miniaturization design of the optical module and the layout of related components on the circuit board.
- an embodiment of the present disclosure provides an optical module.
- the optical module includes a base 1, a first bracket 3, an optical sub-module 4, and an optical fiber adapter 2.
- the optical sub-module 4 is connected to the optical fiber adapter 2, and the first bracket 3 is disposed on the base 1.
- the chuck 21 provided on the optical fiber adapter 2 is connected to the first bracket 3.
- the first bracket 3 supports the optical fiber adapter 2 so that the base 1 and the optical fiber adapter 2 are electrically isolated from each other.
- the first bracket 3 is an insulating material.
- FIGS. 3A, 3B, and 3C are exploded views of the optical module at different angles.
- the first bracket 3 is disposed on the base 1; the chuck 21 of the optical fiber adapter 2 is supported on the first bracket 3, so as to fix the optical device such as the optical fiber adapter 2 .
- the base 1 includes a bottom plate 14 and a side plate 15 connected to the bottom plate 14.
- the first bracket 3 supports the optical fiber adapter 2 so that the optical fiber adapter 2 is electrically isolated from the bottom plate 14 and the side plate 15, respectively, so that the optical fiber adapter 2 can be prevented.
- the emitted electromagnetic signals are transmitted to the outside through the directly-contacting bottom plate 14 and the side plate 15.
- optical device in the embodiment of the present disclosure includes an optical sub-module 4 and an optical fiber adapter 2.
- the first bracket 3 is an insulating material, the optical fiber adapter 2 and the base 1 disposed on the first bracket 3 are electrically isolated from each other.
- the optical fiber adapter 2 and the base 1 are not in contact with each other to isolate the transmission of electromagnetic signals, thereby realizing the optical fiber adapter. 2 is electrically isolated from base 1. Therefore, there is no need to provide a ceramic sleeve 122 as shown in FIG. 2 between the optical fiber adapter 2 and the optical sub-module 4, and accordingly the length direction of the optical module will not be increased (as shown in the L direction in FIG. 4A, that is, the bottom plate 14 Length).
- the material of the first bracket 3 is, for example, a plastic material or a ceramic material.
- the optical module provided by the embodiment of the present disclosure includes a base 1, a first bracket 3, an optical sub-module 4 and an optical fiber adapter 2.
- the optical sub-module 4 is connected to the optical fiber adapter 2; the first bracket 3 is provided on the base 1, and a chuck 21 provided on the optical fiber adapter 2 is connected to the first bracket 3.
- the first bracket 3 supports the optical fiber adapter 2 so that the base 1 is electrically isolated from the optical fiber adapter 2.
- the first bracket 3 is an insulating material, and the first bracket 3 of the insulating material supports and fixes the optical fiber adapter 2, so that the optical fiber adapter 2 supported by the first bracket 3 and the base 1 are electrically isolated from each other. The electrical isolation between the optical fiber adapter 2 and the optical module base 1 is realized.
- the optical module may further include: an upper case 6 operatively connected to the base 1; and a second bracket 5.
- the second bracket 5 is connected to the chuck 21 and abuts against the upper case 6.
- the second bracket 5 is an insulating material, so that the second bracket 5 can be used to electrically isolate the optical fiber adapter 2 from the base 1 and the upper case 6, respectively.
- the first bracket 3 and the second bracket 5 are oppositely disposed in a direction in which the bottom plate 14 is directed toward the upper case 6.
- the optical module includes a base 1, a first bracket 3, an optical device (including an optical fiber adapter 2 and an optical sub-module 4), a second bracket 5, and an upper case 6.
- the first bracket 3 can be placed on the base 1 first, and then the chuck 21 on the optical fiber adapter 2 can be connected to the first bracket 3 To place the optical fiber adapter 2 and the optical sub-module 4 connected to the optical fiber adapter 2 on the first bracket 3; then fix the second bracket 5 on the chuck 21 of the optical fiber adapter 2; finally, the upper shell 6 abuts on The second bracket 5 is connected to the base 1.
- the second bracket 5 clamps and fixes the optical fiber adapter 2 and the optical sub-module 4 in the base 1.
- the fixing of the second bracket 5 realizes the precise coupling between the optical fiber adapter 2 and the ferrule of the optical sub-module 4.
- the first bracket 3, the optical device (including the optical fiber adapter 2 and the optical sub-module 4), and the second bracket 5 are electrically isolated inside the optical module.
- the strength of the optical device is effectively improved, the design complexity of the optical device is reduced, and the light is effectively shortened.
- the length of the device conforms to the trend of miniaturization of optical modules.
- the base 1 in order to achieve the fixing of the first bracket 3 on the base 1, optionally, as shown in FIGS. 4A and 6A, the base 1 includes a bottom plate 14 and a side plate 15 connected to the bottom plate 14,
- the bottom plate 14 or the side plate 15 is provided with a first positioning portion 12, and the first bracket 3 is provided with a first latching portion 31.
- the first positioning portions 12 may be configured as one or more, and accordingly, the first latching portions 31 may also be configured as one or more, and one or more first positioning portions.
- the part 12 cooperates.
- the first positioning portion 12 cooperates with the first latching portion 31 to restrict the first bracket 3 from moving along the length direction of the bottom plate 14 (see the direction of L in FIG. 5A).
- the side plate 15 connected to the bottom plate 14 is used for This restricts the first bracket 3 from moving in the width direction of the bottom plate 14 (see the direction indicated by W in FIG. 5A).
- the base 1 includes a bottom plate 14 and a side plate 15 connected to the bottom plate 14, and the two side plates 15 are oppositely disposed; the bottom plate 14 or the side plate 15 is provided with a first positioning portion 12; As shown in FIG. 6A, the first bracket 3 is provided with a first locking portion 31; during assembly, the first locking portion 31 provided on the first bracket 3 is locked in the base 1 to correspond to the first locking portion 31 The first positioning portion 12 realizes positioning of the first bracket 3, thereby restricting movement of the first bracket 3 along the length and width directions of the bottom plate 14.
- the L direction is the length direction of the bottom plate 14
- the W direction is the width direction of the bottom plate 14.
- the first latching portions 31 may be respectively disposed on both sides of the first bracket 3. Accordingly, as shown in FIG. 4E, the first latching portions 31 may be connected to the first latch in the base 1.
- the first positioning portion 12 is provided at a position corresponding to the portion 31.
- the first engaging portion 31 is a protrusion, and the first positioning portion 12 is a groove; or, the first engaging portion 31 is a groove, and the first positioning portion 12 is a protrusion.
- a first fixing portion 13 may be provided on the base 1, and a first bracket 3 may be provided on the first bracket 3.
- Connection section 32 may be configured as one or more, and correspondingly, the first connecting portion 32 may also be configured as one or more, and one or more first fixing portions 13 cooperation.
- the first fixing portion 13 is connected to the first connecting portion 32 and is used to connect the first bracket 3 to the base 1.
- the first connection portion 32 may be provided at the bottom of the first bracket 3, and the first fixing portion 13 may be provided at a position corresponding to the first connection portion 32 in the base 1.
- the first fixing portion 13 is a positioning block, and the first connecting portion 32 is a positioning hole.
- the first fixing portion 13 is a positioning hole, and the first connecting portion 32 is a positioning block.
- the first connecting portion 32 (the positioning hole at this time) at the bottom of the first bracket 3 can be sleeved on the first fixing portion 13 on the base 1, and the first The first latching portions 31 on both sides of a bracket 3 are respectively latched in the first positioning portions 12 corresponding to the first latching portions 31 in the base 1, so that the first bracket 3 is firmly fixed in the base 1.
- the depth of the positioning hole may be smaller than the height of the main body of the first bracket 3.
- the above positioning hole may be a "blind hole".
- the blind hole in the embodiment of the present disclosure refers to that the material is not completely drilled when drilling the material.
- the number of the first connection portions 32 may be two, and the two first connection portions 32 are symmetrically disposed on the bottom of the first bracket 3.
- a second fixing portion may be provided on the upper casing 6, and a second connection portion 56 is provided on the second bracket.
- the part is connected to the second connection part 56 to realize the fixation between the second bracket 3 and the upper case 6.
- the second connection portion 56 may be fixed in the second fixing portion.
- the specific setting is similar to the first fixing portion 13 and the first connecting portion 32 described above, so it will not be repeated here.
- the first bracket 3 is provided with first latching portions 31 on both sides along the length direction
- the base 1 is provided with the first positioning portion 12 corresponding to the first latching portion 31, and the first bracket 3
- the bottom has a first connection portion 32
- the base 1 has a first fixing portion 13 corresponding to the first connection portion 32.
- the first connection portion 32 at the bottom of the first bracket 3 is fixed to the first connection portion 32 in the base 1.
- a fixing portion 13, and the first latching portions 31 on both sides of the first bracket 3 are respectively latched in the first positioning portion 12 corresponding to the first latching portion 31 in the base 1, thereby reinforcing the first bracket 3.
- the second bracket 5 includes a beam 51 and first and second arms 52 and 55 provided at both ends of the beam 51, and the first and second arms 52 and 52 The arm 55 is in contact with the side plate 15.
- the second bracket 5 is provided with a second engaging portion 53, and the base 1 is provided with a second positioning portion 16.
- the second latching portion 53 may be configured as one or more, and accordingly, the second positioning portion 16 may also be configured as one or more, and one or more second cards.
- the joint portion 53 cooperates.
- the second positioning portion 16 cooperates with the second clamping portion 53 to restrict the second bracket 5 from moving along the length direction of the bottom plate 14 (see the direction of L in FIG. 5A), and the side plate 15 connected to the bottom plate 14 is restricted.
- the second bracket 5 moves in the width direction of the bottom plate 14 (see the direction indicated by W in FIG. 5A).
- FIG. 7A and FIG. 7B are schematic diagrams of the second bracket at different angles.
- the second bracket 5 cooperates with the second positioning portion 16 of the base 1 through the second engaging portion 53, so as to restrict the second bracket 5 from moving in the length direction of the bottom plate 14 of the base 1.
- the second positioning portion 16 is disposed on the upper case 6. Accordingly, the second latching portion 53 is disposed at a position of the second bracket 5 corresponding to the second positioning portion 16.
- the structure of the second bracket 5 shown in FIG. 7A and FIG. 7B is only an example. In actual applications, the structures of the first arm 52 and the second arm 55 of the second bracket 5 may be based on The space in the base 1 is adjusted.
- the second positioning portion 16 may be disposed on the side plate 15 of the base 1, and the second latching portion 53 is disposed on the first arm 52 of the second bracket 5. And the second arm 55.
- the second engaging portion 53 is a protrusion
- the second positioning portion 16 is a groove
- the second engaging portion 53 is a groove
- the second positioning portion 16 is a protrusion.
- the first bracket 3 is provided with a first groove 33
- the second bracket 5 is provided with a second groove 54
- the optical fiber adapter 2 is provided with The chuck 21 is engaged in a space formed by the first groove 33 and the second groove 54.
- the first groove 33 and the second groove 54 restrict the optical fiber adapter 2 along the length direction of the bottom plate 14 (see FIG. 5A). (Shown in the middle L direction) to realize the fixation of the optical fiber adapter 2.
- the second groove 54 is provided on the beam 51 and the first arm 52 and the second arm 55, and the chuck 21 is engaged with the second recess In the groove 54, the cross beam 51 and the first support arm 52 and the second support arm 55 are used to electrically isolate the optical fiber adapter 2 from the base 1 and the upper case 6, respectively.
- the second groove 54 of the second bracket 5 is provided on the beam 51 and the first and second arms 52 and 55.
- the chuck 21 of the optical fiber adapter 2 is engaged with the first groove 33 and the second recess.
- the groove 54 is configured to electrically isolate the optical fiber adapter 2 from the base 1 and the upper case 6 respectively.
- the beam 51 is disposed opposite to the first bracket 3, and the first arm 52 and the second arm 55 are disposed at both ends of the beam 51 along the length direction of the base 1.
- the first support arm 52 and the second support arm 55 are in contact with the first support 3.
- the second bracket 5 can electrically isolate the optical fiber adapter 2 from the base 1 and the upper case 6, respectively.
- an insulating material is provided between the optical sub-module 4 and the base 1 and the upper case 6.
- a layer of insulating material may be coated on the inner wall of the base 1 and the upper case 6 of the optical sub-module 4 above and below the circular tube body of the optical sub-module 4, and the transmitting ports and receiving ports of the optical sub-module 4, so as to avoid the optical sub-module 4 and the base 1 and the upper case 6 are electrically connected.
- An insulating material is provided between the optical sub-module 4 and the base 1 and the upper case 6.
- the optical module in the embodiment of the present application further includes:
- PCBA Printed Circuit Board Assembly
- the PCBA is insulated from a casing, which includes a base 1 and an upper casing 6.
- the PCBA is insulated from the housing at a location in contact with the housing.
- the PCBA and the optical sub-module 4 are connected through a flexible circuit board.
- the position where the PCBA and the base 1 are in fixed contact does not have electrical properties, that is, to ensure that the PCBA is insulated from the base 1 so as to reach the interior of the optical module and the base. 1 for the purpose of galvanic isolation.
- an insulating material is provided between the optical sub-module 4 and the base 1 and the upper shell 6, and the PCBA is in contact with the shell. Is insulated from the housing, thereby achieving the purpose of electrically isolating the entire interior of the optical module from the base 1 and the housing 6.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
一种光模块,包括:底座(1);光纤适配器(2),光纤适配器(2)上设置有卡盘(21);光学次模块(4),光学次模块(4)与光纤适配器(2)连接;第一支架(3),第一支架(3)设置在底座(1)上,卡盘(21)与第一支架(3)连接,第一支架(3)用于支撑光纤适配器(2)并将底座(1)与光纤适配器(2)电隔离设置,其中,第一支架(3)为绝缘材料。
Description
相关申请的交叉引用
本专利申请要求于2018年6月20日提交的、申请号为2018106376632的中国专利申请的优先权,该申请的全文以引用的方式并入本文中。
本公开涉及一种光模块。
随着光模块性能的提升,要求光模块内部的光器件与光模块的外壳进行绝缘隔离,以能够有效地改善传导发射(Conducted Emission,简称CE)、静电抗扰(Electro-Static discharge,ESD)等电磁干扰测试指标。
发明内容
本发明实施例提供一种光模块,包括:底座;光纤适配器,其上设置有卡盘;光学次模块,与所述光纤适配器连接;第一支架,由绝缘材料制成,设置在所述底座上,与所述卡盘连接,配置为支撑所述光纤适配器以使所述底座与所述光纤适配器电隔离。
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本公开的实施例,并与说明书一起用于解释本公开的原理。
图1A示出了一种光模块的局部结构示意图一;
图1B示出了一种光模块的局部结构示意图二;
图2示出了一种光模块内部的光组件的结构示意图;
图3A示出了本公开实施例所提供的光模块的爆炸图;
图3B示出了本公开实施例所提供的光模块的爆炸图;
图3C示出了本公开实施例所提供的光模块的爆炸图;
图4A示出了本公开实施例所提供的光模块的底座结构示意图;
图4B示出了本公开实施例所提供的光模块的局部结构示意图;
图4C示出了本公开实施例所提供的光模块的部分结构示意图;
图4D示出了图4A所示的底座的局部结构示意图;
图4E示出了图4A所示的底座的局部俯视结构示意图;
图5A示出了本公开实施例所提供的光模块的部分结构示意图;
图5B示出了本公开实施例所提供的光模块的部分结构示意图;
图6A示出了本公开实施例所提供的光模块的第一支架结构示意图;
图6B示出了本公开实施例所提供的光模块的第一支架的结构示意图;
图7A示出了本公开提供的光模块一实施例的第二支架结构示意图;
图7B示出了本公开提供的光模块一实施例的第二支架的结构示意图。
通过上述附图,已示出本公开明确的实施例,后文中将有更详细的描述。这些附图和文字描述并不是为了通过任何方式限制本公开构思的范围,而是通过参考特定实施例为本领域技术人员说明本公开的概念。
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反,它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
本公开的说明书和权利要求书及所述附图中的术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。
在本公开的描述中,需要理解的是,术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。
在本公开中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本公开中的具体含义。
在本公开中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。
下面以具体的实施例对本公开的技术方案进行详细说明。下面这几个具体的实施例可以相互结合,对于相同或相似的概念或过程可能在某些实施例中不再赘述。
光模块由于有寿命、散热和电磁屏蔽的需求,外壳通常采用锌合金材料。光器件因为强度和加工精度的要求,与光器件连接的光纤适配器通常采用不锈钢材料。如图1A、图1B所示,光器件在外壳110内部的固定是通过将光纤适配器120的卡盘121卡入外壳110的凹槽111内实现的,所述凹槽111与外壳110是一体成型设置的,光器件包括光纤适配器120和光学次模块130;由于光纤适配器120和外壳110都是金属材料,并且,所述卡盘121和所述凹槽111也为金属材料,因此光纤适配器120和光模块外壳110处于电气导通状态,即光器件与光模块的外壳110未实现电隔离。
为了实现光纤适配器120与光模块外壳110的电隔离,如图2所示,在图1A、图1B所示的光模块的基础上,在位于光纤适配器120后侧的卡盘121与光学次模块130之间增加一个陶瓷套筒122连接,进而实现光纤适配器120与光模块外壳110之间的电隔离,但因所增设的陶瓷套筒122会导致光器件整体长度增加,占用印刷电路板的布板空间,或导致光模块的长度尺寸增大,不利于光模块的小型化设计以及电路板上相关元器件的布设。
本公开实施例提供一种光模块,如图3A所示,光模块包括底座1、第一支架3、光学次模块4和光纤适配器2。其中,光学次模块4与光纤适配器2连接,第一支架3设置在底座1上。如图4C,设置在光纤适配器2上的卡盘21与第一支架3连接。这样,第一支架3支撑光纤适配器2以使底座1与光纤适配器2电隔离设置。第一支架3为绝缘材料。
具体地,图3A、图3B和图3C均为光模块的不同角度的爆炸图。如图4A、图4B、图4C所示,第一支架3设置在底座1上;光纤适配器2的卡盘21支撑在第一支架3上,从而实现对例如光纤适配器2等的光器件的固定。底座1包括底板14和与底板14相接的侧板15,第一支架3承托光纤适配器2以使光纤适配器2分别与底板14以及侧板15电隔离设置,从而可防止由光纤适配器2所发出的电磁信号经直接抵接的底板14以及侧板15向外界所发射。
需要说明的是,本公开实施例中的光器件包括光学次模块4和光纤适配器2。
由于第一支架3为绝缘材料,从而使得设置在第一支架3上的光纤适配器2与底座1相互电隔离设置,光纤适配器2与底座1不相互抵接以隔离电磁信号的传输,实现光纤适配器2与底座1的电隔离。因此在光纤适配器2和光学次模块4之间无需设置如图2所示的陶瓷套筒122,相应地也不会增加光模块的长度方向(如图4A中L方向所示,即底板14的长度方向)的尺寸。其中,第一支架3的材质例如为塑料材质或陶瓷材质。
本公开实施例提供的光模块包括底座1、第一支架3、光学次模块4和光纤适配器2。其中,所述光学次模块4与所述光纤适配器2连接;所述第一支架3设置在所述底座1上,设置在所述光纤适配器2上的卡盘21与所述第一支架3连接,所述第一支架3支撑所述光纤适配器2以使所述底座1与所述光纤适配器2电隔离设置。所述第一支架3为绝缘材料,由绝缘材料的第一支架3实现对光纤适配器2的支撑固定,进而使得由第一支架3所支撑的光纤适配器2与底座1之间电隔离设置,以实现光纤适配器2与光模块底座1的电隔离。这样,无需在光学次模块4与光纤适配器2之间增设陶瓷套筒122以实现电隔离,减小光器件的整体长度,进而保证后方电路板的布设空间,利于光模块的小型化设计。
如图3A、图5A、图5B所示,所述光模块还可以包括:上壳6,与底座1可操作地连接;以及第二支架5。其中,第二支架5与卡盘21相连接且抵接于上壳6。第二支架5为绝缘材料,从而第二支架5可用于将光纤适配器2分别与底座1以及上壳6电隔离设置。第一支架3与第二支架5在底板14指向上壳6的方向上相对设置。
具体的,如图3A-图3C所示,光模块包括底座1、第一支架3、光器件(包括光纤适配器2和光学次模块4)、第二支架5、上壳6。
在装配时,可以如图4A-图4C、图5A-图5B所示,先将第一支架3放置在底座1上;再将光纤适配器2上的卡盘21与所述第一支架3连接,以将光纤适配器2和与光纤适配器2连接的光学次模块4放置在第一支架3上;然后将第二支架5固定在光纤适配器2的卡盘21上;最后将上壳6抵接在第二支架5上并与底座1连接。第二支架5将光纤适配器2和光学次模块4卡设固定在底座1内,第二支架5的固定实现了光纤适配器2与光学次模块4插芯的精准耦合。在图5B所示的光模块中,第一支架3、光器件(包括光纤适配器2和光学次模块4)、第二支架5电隔离于光模块内部。
在图3A-图5B所示的方案中,相比如图2所示通过陶瓷套筒122实现电磁隔离的方案,有效改善了光器件的强度,降低了光器件的设计复杂度,有效缩短了光器件的长度,符合光模块小型化趋势。
在上述实施例的基础上,为了实现第一支架3在底座1上的固定,可选的,如图4A、图6A所示,底座1包括底板14和与底板14相接的侧板15,底板14或侧板15上设置有第一定位部12,第一支架3上设置有第一卡接部31。需要说明的是,所述第一定位部12可以被配置为一个或多个,相应地,所述第一卡接部31也可以被配置为一个或多个,与一个或多个第一定位部12配合。第一定位部12与第一卡接部31相配合,用于限制第一支架3沿底板14的长度方向(参见图5A中L方向所示)移动,与底板14相接的侧板15用于限制第一支架3在沿底板14宽度方向(参见图5A中W方向所示)移动。
具体的,如图4A所示,底座1包括底板14以及与底板14相接的侧板15,两个侧板15相对设置;底板14或侧板15上设置有第一定位部12;如图6A所示,第一支架3上设置有第一卡接部31;在装配时,将第一支架3上设置的第一卡接部31卡设在底座1内与第一卡接部31对应的第一定位部12,实现对第一支架3的定位,从而限制第一支架3沿底板14的长度和宽度方向所移动。图4A、5A中L方向为底板14的长度方向,W方向为底板14的宽度方向。
在一些实施例中,如图6A所示,第一卡接部31可以分别设置在第一支架3的两侧,相应地,如图4E所示,可以在底座1内与该第一卡接部31对应的位置设置第一定位部12。而且,第一卡接部31为凸块,第一定位部12为凹槽;或,第一卡接部31为凹槽,第一定位部12为凸块。
在一些实施例中,为了增强第一支架3在底座1内的牢固性,如图4A、图6B所示,底座1上可设置有第一固定部13,第一支架3上设置有第一连接部32。需要说明的是,所述第一固定部13可以被配置为一个或多个,相应地,所述第一连接部32也可以被配置为一个或多个,与一个或多个第一固定部13配合。第一固定部13与第一连接部32相连接,用于将第一支架3与底座1相连接。
具体地,如图4A、图6B所示,第一连接部32可以设置在第一支架3的底部,第一固定部13可以设置在底座1内与第一连接部32对应的位置。其中,第一固定部13为定位块,第一连接部32为定位孔;或,第一固定部13为定位孔,第一连接部32为定位块。
在装配时,可以如图4A、图6B所示,将第一支架3底部的第一连接部32(此时为定位孔)套设在底座1上的第一固定部13上,并将第一支架3两侧的第一卡接部31分别卡设在底座1内与第一卡接部31对应的第一定位部12内,从而将第一支架3牢固地固定在底座1内。
在一些实施例中,当第一连接部32为定位孔时,定位孔的深度可以小于第一支架3的主体的高度。上述定位孔可以为“盲孔”,本公开实施例中的盲孔是指在材料上钻孔时,没有把材料全部钻透。
在一些实施例中,第一连接部32的数量可以为两个,两个第一连接部32对称设置在第一支架3的底部。相应地,第一固定部13也可以为两个,两个第一固定部13对称设置在底座1上。
为了增强第二支架5与上壳6之间连接的稳定性,在一些实施例中,上壳6上可设置有第二固定部,第二支架上设置有第二连接部56,第二固定部与第二连接部56连接以实现第二支架3与上壳6之间的固定。第二连接部56可以被固定在第二固定部中。其具体设置与前述第一固定部13和第一连接部32类似,故在此不再赘述。
在上述实施例中,第一支架3沿长度方向的两侧各设有第一卡接部31,底座1内设有与第一卡接部31对应的第一定位部12,第一支架3的底部具有第一连接部32,底座1内具有与第一连接部32相对应的第一固定部13,在装配时将第一支架3底部的第一连接部32固定在底座1内的第一固定部13上,并将第一支架3两侧的第一卡接部31分别卡设在底座1内与第一卡接部31对应的第一定位部12内,从而增强第一支架3与底座1的稳定性。
如图4A、图5A、图7A、图7B所示,第二支架5包括横梁51和设置在横梁51两端的第一支臂52和第二支臂55,第一支臂52和第二支臂55与侧板15相抵接,第二支架5上设置有第二卡接部53,底座1上设置有第二定位部16。需要说明的是,所述第二卡接部53可以被配置为一个或多个,相应地,所述第二定位部16也可以被配置为一个或多个,与一个或多个第二卡接部53配合。第二定位部16与第二卡接部53相配合,用于限制第二支架5沿底板14的长度方向(参见图5A中L方向所示)移动,与底板14相接的侧板15限制第二支架5在沿底板14宽度方向(参见图5A中W方向所示)移动。
如图5A、图7A、图7B所示,图7A和图7B为不同角度的第二支架的示意图,第二支架5通过两侧的第一支臂52和第二支臂55抵接在底座1的侧板15上,第二支架5通过第二卡接部53与底座1的第二定位部16相配合,从而限制第二支架5沿底座1的底板14的长度方向移动。
在一些实施例中,第二定位部16设置在上壳6上,相应地,第二卡接部53设置在第二支架5对应于所述第二定位部16的位置。
需要说明的是,图7A和图7B中所示的第二支架5的结构仅仅是作为一个示例,在实际应用中第二支架5的第一支臂52和第二支臂55的结构可以根据底座1内的空间调整。
在一些实施例中,如图4E和图7A中所示,第二定位部16可以设置在底座1的侧板15上,第二卡接部53设置在第二支架5的第一支臂52和第二支臂55上。作为一个示例,第二卡接部53为凸块,第二定位部16为凹槽;或,第二卡接部53为凹槽,第二定位部16为凸块。
在一些实施例中,如图5A、图6A、图7A所示,第一支架3上设置有第一凹槽33,第二支架5上设置有第二凹槽54,光纤适配器2上设置的卡盘21卡接于第一凹槽33和第二凹槽54所围设形成的空间内,第一凹槽33和第二凹槽54限制光纤适配器2沿底板14的长度方向(参见图5A中L方向所示)移动,实现对光纤适配器2的固定。
在一些实施例中,如图5A、图7A和图7B所示,第二凹槽54设置于横梁51及第一支臂52和第二支臂55上,卡盘21卡接于第二凹槽54内,横梁51及第一支臂52和第二支臂55用于将光纤适配器2分别与底座1以及上壳6电隔离设置。
具体地,第二支架5的第二凹槽54设置于横梁51及第一支臂52和第二支臂55上, 光纤适配器2的卡盘21卡接于第一凹槽33和第二凹槽54内,以将光纤适配器2分别与底座1和上壳6电隔离设置。
在一些实施例中,如图5A、图7A所示,横梁51与第一支架3相对设置,第一支臂52和第二支臂55沿底座1的长度方向设置于横梁51的两端,且第一支臂52和第二支臂55与第一支架3相抵接。
在上述实施例中,描述了第二支架5的具体结构,以及与底座1的固定方式,而且第二支架5可以将光纤适配器2分别与底座1和上壳6电隔离设置。
在上述实施例的基础上,在实现光纤适配器2分别与底座1和上壳6的电隔离设置后,在光学次模块4与底座1和上壳6之间设有绝缘材料。
具体的,可以在光学次模块4的圆方管体上下、光学次模块4的发射端口、接收端口对应的底座1和上壳6的内壁上覆一层绝缘材料,避免光学次模块4与底座1和上壳6电气导通。光学次模块4与底座1和上壳6之间设有绝缘材料。
可选的,本申请实施例的光模块还包括:
印刷电路板组件(Printed Circuit Board Assembly,简称PCBA)(图中未示出);光学次模块4的发射端口和接收端口通过柔性线路板与PCBA连接;
PCBA与外壳绝缘,所述外壳包括底座1和上壳6。
在一些实施例中,PCBA在与外壳接触的位置处与外壳绝缘。
具体地,PCBA与光学次模块4通过柔性线路板进行连接,在电路设计时使PCBA与底座1固定接触的位置不具有电属性,即保证PCBA与底座1绝缘,以达到光模块内部整体与底座1的电隔离的目的。
上述具体实施方式中,在实现光纤适配器2分别与底座1和上壳6绝缘隔离基础上,光学次模块4与底座1和上壳6之间设有绝缘材料,而且PCBA在与外壳接触的位置处与外壳绝缘,从而实现了光模块内部整体与底座1和外壳6的电隔离的目的。
在本说明书的描述中,参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合 适的方式结合。
以上仅为本公开的较佳实施例而已,并不用以限制本公开,凡在本公开的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本公开的保护范围之内
Claims (17)
- 一种光模块,包括:底座;光纤适配器,其上设置有卡盘;光学次模块,与所述光纤适配器连接;和第一支架,由绝缘材料制成,设置在所述底座上,与所述卡盘连接,配置为支撑所述光纤适配器以使所述底座与所述光纤适配器电隔离。
- 根据权利要求1所述的光模块,其中,所述底座包括底板和与所述底板相接的侧板,所述第一支架,还配置为支撑所述光纤适配器以使所述光纤适配器分别与所述底板以及所述侧板电隔离。
- 根据权利要求2所述的光模块,其中,所述第一支架上设置有第一凹槽,所述第一凹槽沿朝向于所述底板的方向凹陷形成,所述卡盘卡接于所述第一凹槽内。
- 根据权利要求3所述的光模块,还包括:上壳,与所述底座可操作地连接;和第二支架,由绝缘材料制成,包括横梁和设置在所述横梁两端的第一支臂和第二支臂,所述横梁和所述第一支臂和第二支臂内设置有第二凹槽,所述卡盘卡接于所述第二凹槽内,以便所述横梁和所述第一支臂和第二支臂使得所述光纤适配器分别与所述底座及所述上壳电隔离。
- 根据权利要求2所述的光模块,还包括:一个或多个第一定位部,设置于所述底板或所述侧板上,一个或多个第一卡接部,设置于所述第一支架上,与所述一个或多个第一定位部配合,所述第一定位部,配置为与所述第一卡接部可操作地连接以限制所述第一支架沿所述底板的长度方向的移动,所述侧板,配置为限制所述第一支架沿所述底板的宽度方向所移动。
- 根据权利要求4所述的光模块,还包括:一个或多个第二卡接部,设置于所述第二支架上,一个或多个第二定位部,设置于所述底座上,与所述一个或多个第二卡接部配合,所述第二定位部,配置为与所述第二卡接部可操作地连接以限制所述第二支架沿所述底板的长度方向的移动,所述侧板,配置为限制所述第二支架沿所述底板的宽度方向的移动。
- 根据权利要求4所述的光模块,还包括:一个或多个第二卡接部,设置于所述第二支架上,一个或多个第二定位部,设置于所述上壳上,与所述一个或多个第二卡接部配合,所述第二定位部,配置为与所述第二卡接部可操作地连接以限制所述第二支架沿所述底板的长度方向的移动,所述侧板,配置为限制所述第二支架沿所述底板的宽度方向的移动。
- 根据权利要求4所述的光模块,其中,所述卡盘,配置为卡接于由所述第一凹槽和所述第二凹槽所围设形成的空间内。
- 根据权利要求4所述的光模块,其中,所述第一支架与所述第二支架沿所述底板指向所述上壳的方向所相对,所述第一支臂和第二支臂的端部与所述第一支架相抵接。
- 根据权利要求5所述的光模块,其中,所述第一定位部为凸块,所述第一卡接部为与所述凸块配合的凹槽。
- 根据权利要求5所述的光模块,其中,所述第一定位部为凹槽,所述第一卡接部为与所述凹槽配合的凸块。
- 根据权利要求1所述的光模块,还包括:一个或多个第一固定部,设置于所述底座上;一个或多个第一连接部,设置于所述第一支架上,与所述一个或多个第一固定部配合。
- 根据权利要求12所述的光模块,其中,所述第一固定部为定位块,所述第一连接部为与所述定位块配合的定位孔。
- 根据权利要求12所述的光模块,其中,所述第一固定部为定位孔,所述第一连接部为与所述定位孔配合的定位块。
- 根据权利要求6所述的光模块,其中,所述第二定位部为凸块,所述第二卡接部为与所述凸块配合的凹槽。
- 根据权利要求6所述的光模块,其中,所述第二定位部为凹槽,所述第二卡接部为与所述凹槽配合的凸块。
- 根据权利要求4所述的光模块,其中,在所述光学次模块与所述底座和所述上 壳之间设有绝缘材料。
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| US16/454,592 US20190391349A1 (en) | 2018-06-20 | 2019-06-27 | Optical module |
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| CN201810637663.2A CN108627927A (zh) | 2018-06-20 | 2018-06-20 | 光模块 |
| CN201810637663.2 | 2018-06-20 |
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| US16/454,592 Continuation US20190391349A1 (en) | 2018-06-20 | 2019-06-27 | Optical module |
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| PCT/CN2019/090646 Ceased WO2019242523A1 (zh) | 2018-06-20 | 2019-06-11 | 光模块 |
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| CN109212693A (zh) * | 2018-11-29 | 2019-01-15 | 四川光恒通信技术有限公司 | 一种多用途光模块结构及其组装方法 |
| CN113359245B (zh) * | 2020-03-05 | 2023-01-20 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| CN116088105A (zh) * | 2021-11-05 | 2023-05-09 | 苏州旭创科技有限公司 | 一种光模块 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2682647Y (zh) * | 2003-11-19 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | 连接器组件 |
| US20100247021A1 (en) * | 2009-03-31 | 2010-09-30 | Sun Microsystems, Inc. | Optical device with large thermal impedance |
| CN107329217A (zh) * | 2015-11-17 | 2017-11-07 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| CN107526137A (zh) * | 2016-06-21 | 2017-12-29 | 住友电工光电子器件创新株式会社 | 光收发器 |
| CN108061948A (zh) * | 2017-12-28 | 2018-05-22 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| CN207488559U (zh) * | 2017-08-24 | 2018-06-12 | 绵阳思迈光联通信技术有限公司 | 一种光模块结构壳体 |
-
2018
- 2018-06-20 CN CN201810637663.2A patent/CN108627927A/zh active Pending
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2682647Y (zh) * | 2003-11-19 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | 连接器组件 |
| US20100247021A1 (en) * | 2009-03-31 | 2010-09-30 | Sun Microsystems, Inc. | Optical device with large thermal impedance |
| CN107329217A (zh) * | 2015-11-17 | 2017-11-07 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| CN107526137A (zh) * | 2016-06-21 | 2017-12-29 | 住友电工光电子器件创新株式会社 | 光收发器 |
| CN207488559U (zh) * | 2017-08-24 | 2018-06-12 | 绵阳思迈光联通信技术有限公司 | 一种光模块结构壳体 |
| CN108061948A (zh) * | 2017-12-28 | 2018-05-22 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
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