WO2019239985A1

WO2019239985A1 - Imaging device

Info

Publication number: WO2019239985A1
Application number: PCT/JP2019/022364
Authority: WO
Inventors: 岳司猪田; 智規有吉
Original assignee: オムロン株式会社
Priority date: 2018-06-14
Filing date: 2019-06-05
Publication date: 2019-12-19
Also published as: JP2019215491A

Abstract

An imaging device provided with: a base member (2) having a main surface (2u); a support member (4) that has an attachment surface (4a) extending in a direction intersecting the main surface (2u), and that is supported by the base member (2); an emission light optical system module (31) installed on the attachment surface (4a); and an incidence light optical system module (32) installed on the attachment surface (4a). The respective central axes (30a, 30b) of the emission light optical system module (31) and the incidence light optical system module (32) intersect the attachment surface (4a).

Description

Imaging device

The present invention relates to an imaging apparatus.

An imaging apparatus including two camera modules is described in Japanese Patent Laid-Open No. 2015-28548 (Patent Document 1).

Japanese Patent Laid-Open No. 2015-28548

Patent Document 1 describes a configuration in which two camera modules are arranged on one holding member. What is arranged is a camera module, that is, a device for receiving light. However, for example, in the case where one of the two devices emits light, that is, a device including a light source, the heat generated by the light source is transmitted to the other device through the holding member. When the other device is a device including an image sensor, the characteristics of the image sensor may be deteriorated by heat.

In addition, when a substrate on which a component that generates heat in addition to two optical devices is mounted in the housing of the imaging apparatus, heat generated from the component is transmitted to any one of the optical devices. This may be adversely affected, and is preferably avoided.

Accordingly, an object of the present invention is to provide an imaging apparatus capable of preventing characteristic deterioration due to heat transfer in an imaging apparatus including both an apparatus for emitting light and an apparatus for receiving light. To do.

In order to achieve the above object, an imaging apparatus according to an example of the present disclosure includes a base member having a main surface and a mounting surface extending in a direction intersecting the main surface and supported by the base member. And an output optical system module installed on the mounting surface, and an incident optical system module installed on the mounting surface, and the center axis of each of the output optical system module and the incident optical system module is the mounting Cross the face.

In the above configuration, the apparatus includes one or more substrates on which components are mounted, and the substrate is installed so as to be in contact with the base member along the base member, or viewed from the output optical system module and the incident optical system module. It is preferable that at least one of them is disposed on the side opposite to the base member.

In the above configuration, at least one of the emission optical system module and the incident optical system module is connected to the lens barrel along the central axis and has a diameter smaller than the maximum diameter of the lens barrel. It is preferable that the part including the lens holding part is disposed in a space generated by a difference between the maximum diameter of the lens barrel and the diameter of the lens holding part.

In the above configuration, it is preferable that the exit optical system module and the incident optical system module are connected only via the base member.

In the above configuration, the support member includes a first portion, a second portion, and a heat conduction blocking portion interposed between the first portion and the second portion, and the emission optical system module includes the first optical module. Preferably, the incident optical system module is installed on the mounting surface of the second part, and is installed on the mounting surface of the second part.

The said structure WHEREIN: It is preferable that the said heat conduction interruption | blocking part is an air layer.
In the above configuration, it is preferable that the first part and the second part are separate and independent members.

In the above configuration, it is preferable that an adjustment mechanism for adjusting a relative posture between the first portion and the second portion is provided.

According to the present disclosure, since the two optical system modules are installed on the mounting surface of the support member supported by the base member, it is possible to prevent characteristic deterioration due to heat transfer.

It is a perspective view of the imaging device in Embodiment 1 based on this invention. It is a perspective view of the state which removed a part of housing | casing from the imaging device in Embodiment 1 based on this invention. It is a side view of the state which removed a part of housing | casing from the imaging device in Embodiment 1 based on this invention. It is sectional drawing of the imaging device in Embodiment 1 based on this invention. It is explanatory drawing of the space in which the components of the imaging device in Embodiment 1 based on this invention enter. It is a perspective view of the supporting member with which the imaging device in Embodiment 1 based on this invention is equipped. It is a perspective view of the supporting member with which the 1st modification of the imaging device in Embodiment 1 based on this invention is equipped. It is a perspective view of the supporting member with which the 2nd modification of the imaging device in Embodiment 1 based on this invention is equipped. It is a perspective view of the supporting member with which the 3rd modification of the imaging device in Embodiment 1 based on this invention is equipped. It is explanatory drawing of the heat-transfer route from an output optical system module to an incident optical system module. It is sectional drawing of the imaging device in Embodiment 2 based on this invention. It is a perspective view of the state which removed a part of housing | casing from the imaging device in Embodiment 3 based on this invention. FIG. 3 is an exploded view of a first example of a housing provided in the imaging device according to the first to third embodiments based on the present invention. FIG. 7 is an exploded view of a second example of a housing provided in the imaging device according to the first to third embodiments based on the present invention. It is a perspective view of the housing | casing main body contained in the imaging device in Embodiment 4 based on this invention. It is a perspective view of what combined the output system optical module and 1st part which are contained in the imaging device in Embodiment 4 based on this invention. In the imaging device in Embodiment 4 based on this invention, it is the 1st explanatory drawing of a mode that the attitude | position of the 1st part of a support member is adjusted with an adjustment mechanism. In the imaging device in Embodiment 4 based on this invention, it is the 2nd explanatory drawing of a mode that the attitude | position of the 1st part of a support member is adjusted with an adjustment mechanism. In the imaging device in Embodiment 4 based on this invention, it is the 3rd explanatory drawing of a mode that the attitude | position of the 1st part of a support member is adjusted with an adjustment mechanism. It is explanatory drawing that the relative attitude | position between two optical modules is adjustable in the imaging device in Embodiment 4 based on this invention.

(Embodiment 1)
With reference to FIGS. 1 to 3, an imaging apparatus according to Embodiment 1 based on the present invention will be described. The appearance of this imaging apparatus is shown in FIG. The imaging device 101 includes a housing 1. Inside the housing 1, an output system optical module 31 and an incident system optical module 32 are arranged. The shape of the housing 1 shown in FIG. 1 is merely an example, and this is not necessarily the case. As shown in FIG. 1, the housing 1 is provided with two

openings

10a and 10b. The emission system optical module 31 is directed to the opening 10 a of the housing 1. The incident system optical module 32 is directed to the opening 10 b of the housing 1. Each of the two

openings

10a and 10b may be completely opened, or may be blocked with a member that can transmit light. The housing 1 may be provided with openings in addition to the two

openings

10a and 10b. The housing 1 may be provided with a connector.

FIG. 2 shows a state in which a part of the housing 1 is removed from the imaging apparatus 101. FIG. 3 shows a view of what is shown in FIG. 2 viewed from the arrow 90 side. In the example shown here, the base member 2 is assumed to be a part of the housing 1. 2 and 3, a portion other than the base member 2 of the housing 1 is removed. As shown in FIGS. 2 and 3, the base member 2 has a main surface 2u. A support member 4 is erected on the main surface 2u. Both the exit system optical module 31 and the entrance system optical module 32 are attached to the support member 4.

The imaging apparatus 101 includes a base member 2 having a main surface 2u and a support member 4. The support member 4 has an attachment surface 4a extending in a direction intersecting the main surface 2u. In the example shown here, the attachment surface 4a is perpendicular to the main surface 2u, but the attachment surface 4a may form an angle other than perpendicular to the main surface 2u. The support member 4 is supported by the base member 2. Further, the imaging apparatus 101 includes an emission optical system module 31 installed on the attachment surface 4a and an incident optical system module 32 installed on the attachment surface 4a. In the present embodiment, the support member 4 is divided into a first portion 41 and a second portion 42. The first portion 41 has a first surface 41a. The second portion 42 has a second surface 42a. The attachment surface 4a includes a first surface 41a and a second surface 42a. The

central axes

30a and 30b of the outgoing optical system module 31 and the incoming optical system module 32 intersect the mounting surface 4a. More specifically, the central axis 30a intersects the first surface 41a perpendicularly. The central axis 30b intersects the first surface 41b perpendicularly. The central axis 30 a may be the optical axis of the outgoing optical system module 31. The central axis 30 b may be the optical axis of the incident optical system module 32.

In the present embodiment, the output optical system module 31 and the incident optical system module 32 are not installed directly on the base member 2 but installed on the support member 4 erected on the main surface 2 u of the base member 2. Therefore, heat transfer from the outside to the output optical system module 31 and the incident optical system module 32 can be reduced. Since the output optical system module 31 is a device for emitting light, and the incident optical system module 32 is a device for receiving light, in this embodiment, a device for emitting light and a device for receiving light are used. In an image pickup apparatus including both the apparatus and the apparatus, characteristic deterioration due to heat transfer can be prevented.

FIG. 4 shows a cross-sectional view of the imaging device 101 including the housing 1 and the like. The imaging device 101 includes one or more substrates 5 on which components 6 are mounted. The substrate 5 is disposed so as to be in contact with the base member 2 along the base member 2, or at least the substrate 5 is disposed on the side opposite to the base member 2 when viewed from the emission optical system module 31 and the incident optical system module 32. Either is preferable. As an example, in FIG. 4, two substrates 5 are arranged in the housing 1. The lower substrate 5 in the figure is installed so as to be in contact with the base member 2 along the base member 2. Therefore, the heat generated from the substrate 5 is easily transmitted to the base member 2, and the base member 2 is a part of the housing 1, so that it can be radiated efficiently. The upper substrate 5 in the drawing is disposed on the opposite side of the base member 2 as viewed from the emission optical system module 31 and the incident optical system module 32, that is, above the emission optical system module 31 and the incident optical system module 32. Since the upper substrate 5 in the figure is located near the upper plate of the housing 1, the heat generated from the substrate 5 can be efficiently dissipated. The upper substrate 5 in the drawing may be in contact with the upper plate of the housing 1. Although FIG. 4 shows a configuration in which the substrate 5 is provided on both the upper side and the lower side of the emission optical system module 31 and the incident optical system module 32, only one of the substrates 5 may be disposed. .

At least one of the output optical system module 31 and the incident optical system module 32 includes a lens barrel and a lens holding portion connected to the lens barrel along the central axis and having a diameter smaller than the maximum diameter of the lens barrel. Including. In the present embodiment, both the outgoing optical system module 31 and the incident optical system module 32 satisfy this condition. That is, as shown in FIG. 2, the output optical system module 31 includes a lens barrel 31a and a lens holding portion 31b, and the incident optical system module 32 includes a lens barrel 32a and a lens holding portion 32b. As shown in FIG. 4, the component 6 is preferably disposed in a space generated by the difference between the maximum diameter of the lens barrel and the diameter of the lens holding portion. In the example shown in FIG. 4, the component 6 mounted on the lower substrate 5 in the drawing is arranged in the space 11. The component 6 mounted on the upper substrate 5 in the drawing is arranged in the space 12. The

spaces

11 and 12 are clearly shown in FIG. In FIG. 5, a bracket indicates which part of the emission optical system module 31 is the lens barrel 31a and which part is the lens holding portion 31b. The shapes of the lens barrel 31a and the lens holding portion 31b are also shown in more detail. As shown in FIG. 5,

spaces

11 and 12 that are generated by the difference between the maximum diameter of the lens barrel 31 a and the diameter of the lens holding portion 31 b are assumed. When the component 6 is mounted on the substrate 5, the component 6 protrudes from the surface of the substrate 5, but the component can be suitably accommodated by being disposed so as to enter the

spaces

11 and 12, and imaging. It is not necessary to increase the height of the entire apparatus.

As shown in the present embodiment, the support member 4 includes a first portion 41, a second portion 42, and a heat conduction blocking portion interposed between the first portion 41 and the second portion 42. The optical system module 31 is preferably installed on the mounting surface 41 a of the first portion 41, and the incident optical system module 32 is preferably installed on the mounting surface 42 a of the second portion 42. The heat conduction blocker may be any element that inhibits heat conduction between the first portion 41 and the second portion 42. As the heat conduction blocking portion, for example, a space may be provided, or some member may be disposed. As shown in FIG. 6, the heat conduction blocking part is preferably an air layer 40. The support member 4 includes an air layer 40. By adopting this configuration, heat conduction can be inhibited by the air layer 40, so that the degree to which heat generated in one of the outgoing optical system module 31 and the incoming optical system module 32 is transmitted to the other can be reduced. it can.

As shown in FIG. 6, the first portion 41 and the second portion 42 are preferably members that are separate and independent from each other. By adopting this configuration, heat conduction between the first portion 41 and the second portion 42 can be reduced, and the relative relationship between the output optical system module 31 and the incident optical system module 32 can be reduced. The positional relationship and individual posture can be easily adjusted.

Some examples of heat conduction block are shown below. The heat conduction blocking portion may be any heat insulating material. In the example shown in FIG. 7, a heat insulating material 43 is disposed as a heat conduction blocking portion between the first portion 41 and the second portion 42. The heat conduction blocking portion may have any shape provided in the support member 4. In the example shown in FIG. 8, a notch 44 is provided as a heat conduction blocking portion between the first portion 41 and the second portion 42. In the example shown in FIG. 9, a hole 45 is provided as a heat conduction blocking portion between the first portion 41 and the second portion 42. Here, although one long through-hole is provided as the hole 45, a plurality of through-holes may be provided.

As shown in the present embodiment, the output optical system module 31 and the incident optical system module 32 are preferably connected only via the base member 2. By adopting this configuration, heat generated in one of the outgoing optical system module 31 and the incident optical system module 32 becomes difficult to be transmitted to the other, and characteristic deterioration due to heat can be reduced. For example, when the outgoing optical system module 31 includes a heat source, heat transfer from the outgoing optical system module 31 to the incoming optical system module 32 passes through a route as indicated by an arrow 91 in FIG. The heat generated in the output optical system module 31 is once transferred to the base member 2 and then transferred to the incident optical system module 32. Actually, the outgoing optical system module 31 often includes a heat source such as an LED as a light source, and the incident optical system module 32 often includes a part that should avoid heat such as a CMOS. It is preferable that mutual heat transfer is difficult.

(Embodiment 2)
With reference to FIG. 11, an imaging apparatus according to Embodiment 2 based on the present invention will be described. FIG. 11 shows a cross-sectional view of the imaging device as seen from directly above, cut along a horizontal plane.

In the configuration in which the support member 4 is divided into the first portion 41 and the second portion 42, the first surface 41a of the first portion 41 and the second surface 42a of the second portion 42 are not necessarily in the same plane. Instead, they may be in different planes as shown in FIG. In the example shown in FIG. 11, the first surface 41a and the second surface 42a are parallel, but the first surface 41a and the second surface 42a are not necessarily parallel.

Also in the present embodiment, the same effect as in the first embodiment can be obtained.
(Embodiment 3)
With reference to FIG. 12, the imaging apparatus in Embodiment 3 based on this invention is demonstrated. FIG. 12 shows a state where a part of the housing is removed from the imaging apparatus according to the present embodiment. In this imaging apparatus, the support member 4 is not divided into two, but is an integrated object. The support member 4 has a mounting surface 4a. Both the outgoing optical system module 31 and the incoming optical system module 32 are installed on a single mounting surface 4a.

In the present embodiment, heat transfer between the outgoing optical system module 31 and the incident optical system module 32 is easy, so it can be said that it is inferior to that of the first embodiment. Since heat transfer to the system module 31 and the incident optical system module 32 can be reduced, a certain degree of effect can be obtained.

The case 1 will be described as common to the first to third embodiments. As shown in FIG. 13, the housing 1 may be a combination of a lid 26, a side wall 25, and a base member 2. The side wall 25 may be a cylindrical integrally formed member, and may be further divided into a plurality.

Alternatively, as shown in FIG. 14, the side wall 25 and the base member 2 may be integrally formed. In the example shown in FIG. 14, the housing 1 is a combination of a lid 26 and a housing body 27. In this example, the base member 2 is a part of the housing body 27.

(Embodiment 4)
With reference to FIGS. 15 to 16, an imaging apparatus according to Embodiment 4 of the present invention will be described. A housing main body 27 as a part of the housing 1 included in the imaging apparatus according to the present embodiment is shown in FIG. The housing body 27 includes the side wall 25 and the base member 2. The base member 2 is provided with positioning pins 13. Further, the base member 2 is provided with two screw fixing holes 14. The positioning pin 13 is located between the two screw fixing holes 14.

FIG. 16 shows a combination of the output system optical module 31 and the first portion 41 included in the imaging apparatus according to the present embodiment. The first portion 41 includes a plate 15. The plate 15 has two through holes 18. The plate 15 has a pin insertion hole 16 between the two through holes 18. The pin insertion hole 16 is circular. The two through holes 18 are for passing the screws 17.

The structure shown in FIG. 16 is attached to the right side of the inside of the casing main body 27 shown in FIG. At this time, the positioning pin 13 is inserted into the pin insertion hole 16. The two screws 17 shown in FIG. 16 are tightened into the two screw fixing holes 14 shown in FIG. 15 while passing through the two through holes 18.

The imaging apparatus according to the present embodiment includes an adjustment mechanism that adjusts the relative posture between the first portion 41 and the second portion 42. The adjustment mechanism includes a positioning pin 13, two screw fixing holes 14, a pin insertion hole 16, two screws 17, and two through holes 18.

In the present embodiment, since the imaging apparatus includes the adjustment mechanism, the relative posture between the first portion 41 and the second portion 42 can be adjusted. For example, as shown in FIGS. 17, 18 and 19, the angle of the first portion 41 can be changed. Thereby, the direction of the output system optical module 31 can be adjusted. In the example shown in FIG. 20, the optical axis 34 of the emission optical system module 31 can be adjusted by the adjustment mechanism. In the example shown in FIG. 20, an adjustment mechanism is provided for the outgoing optical system module 31, but a similar adjustment mechanism is not provided for the incident optical system module 32. As shown in FIG. 20, if at least one of the two optical modules is adjustable, the relative posture between the two optical modules can be adjusted.

The emission system optical module 31 may be a projector, for example. The incident system optical module 32 may be a camera, for example.

The

lens holding portions

31b and 32b may be S mount lenses, for example.
The imaging device may be a three-dimensional camera, for example. The imaging device may be a three-dimensional measurement sensor, for example.

In addition, you may employ | adopt combining suitably two or more among the said embodiment.
In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 housing, 2 base member, 2u main surface, 4 support member, 4a mounting surface, 5 substrate, 6 parts, 10a, 10b opening, 11, 12 space, 13 positioning pin, 14 screw fixing hole, 15 plate, 16 Pin insertion hole, 17 screw, 18 through hole, 25 side wall, 26 lid, 27 housing body, 30a, 30b central axis, 31 exit system optical module, 31a, 32a lens barrel, 31b, 32b lens holder, 32 entrance system Optical module, 34 optical axis, 40 air, 41 first part, 41a first surface, 42a second surface, 42 second part, 43 heat insulating material, 44 notch, 45 holes, 90, 91 arrows, 101 imaging device.

Claims

A base member having a main surface;
A support member having an attachment surface extending in a direction intersecting the main surface, and supported by the base member;
An output optical system module installed on the mounting surface;
An incident optical system module installed on the mounting surface;
An imaging apparatus in which the central axis of each of the emission optical system module and the incident optical system module intersects the mounting surface.
It has one or more boards with components mounted,
The substrate is disposed so as to be in contact with the base member along the base member, or at least disposed on the side opposite to the base member when viewed from the emission optical system module and the incident optical system module The imaging device according to claim 1, which is either one.
At least one of the exit optical system module and the entrance optical system module includes a lens barrel and a lens holding portion connected to the lens barrel along the central axis and having a diameter smaller than the maximum diameter of the lens barrel The imaging device according to claim 2, wherein the component is disposed in a space generated by a difference between a maximum diameter of the lens barrel and a diameter of the lens holding portion.
The imaging apparatus according to any one of claims 1 to 3, wherein the emission optical system module and the incident optical system module are connected only via the base member.
The support member includes a first part, a second part, and a heat conduction blocking part interposed between the first part and the second part, and the emission optical system module is attached to the first part. The imaging apparatus according to claim 1, wherein the imaging apparatus is installed on a surface, and the incident optical system module is installed on the mounting surface of the second portion.
The imaging apparatus according to claim 5, wherein the heat conduction blocking unit is an air layer.
The imaging apparatus according to claim 5 or 6, wherein the first part and the second part are members that are separate and independent from each other.
The imaging apparatus according to any one of claims 5 to 7, further comprising an adjustment mechanism that adjusts a relative posture between the first part and the second part.