WO2019237975A1 - 摄像头结构及移动终端 - Google Patents

摄像头结构及移动终端 Download PDF

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Publication number
WO2019237975A1
WO2019237975A1 PCT/CN2019/090116 CN2019090116W WO2019237975A1 WO 2019237975 A1 WO2019237975 A1 WO 2019237975A1 CN 2019090116 W CN2019090116 W CN 2019090116W WO 2019237975 A1 WO2019237975 A1 WO 2019237975A1
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Prior art keywords
side wall
chip
camera
support
opening
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PCT/CN2019/090116
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English (en)
French (fr)
Inventor
杨文昌
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维沃移动通信有限公司
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Publication of WO2019237975A1 publication Critical patent/WO2019237975A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to the field of electronic technology, and in particular, to a camera structure and a mobile terminal.
  • the mobile terminal in the related technology uses a photo sensor chip that matches the camera.
  • the mainstream mobile phones on the market include a rear dual camera and a front single camera. Three cameras need to match three photo sensors and have a dual camera. Cell phones with dual front cameras require four sensors. Cell phones with rear three cameras and front single camera require four sensors.
  • Embodiments of the present disclosure provide a camera structure and a mobile terminal to solve the problem of excessively high camera cost investment of the mobile terminal in the related art.
  • a camera structure includes:
  • a support structure the support structure is provided with at least two chip card positions, each chip card position corresponds to a camera;
  • a chip holder which is slidably disposed in the support structure
  • a photosensitive chip is disposed on the chip holder.
  • An embodiment of the present disclosure further provides a mobile terminal, including the camera structure according to any one of the above.
  • the camera structure includes a support structure and a chip holder.
  • the chip holder is provided with a photosensitive chip.
  • the support structure is provided with at least two chip card slots. Each chip card slot corresponds to a camera.
  • the chip holder can slide into any chip card position in the supporting structure, and provide a photosensitive chip for the camera corresponding to the chip card position where the chip holder is located. Therefore, a camera structure design method in which the photosensitive chip can be moved is provided, so that two or more cameras share one photosensitive chip, which greatly reduces the number of camera chips, reduces the hardware cost of the camera, and improves product profitability and technological sense. .
  • FIG. 1 is a schematic diagram of a camera structure according to an embodiment of the present disclosure
  • FIG. 2 is a second schematic diagram of a structure of a camera provided by an embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view along A-A in FIG. 2;
  • FIG. 4 is a cross-sectional view taken along V-V of FIG. 2;
  • FIG. 5 is one of the schematic diagrams of a chip shared by two cameras in a camera structure provided by an embodiment of the present disclosure
  • FIG. 6 is the second schematic diagram of a chip shared by two cameras in a camera structure provided by an embodiment of the present disclosure.
  • a camera structure including:
  • a support structure 10 which is provided with at least two chip card positions, each chip card position corresponding to a camera;
  • a chip holder 20 which is slidably disposed in the support structure 10;
  • a photosensitive chip 30 is disposed on the chip holder 20.
  • the camera structure includes a support structure 10 and a chip holder 20.
  • the chip holder 20 is provided with a photosensitive chip 30.
  • the support structure 10 is provided with at least two chip card slots, and each chip card slot corresponds to a camera.
  • the chip holder 20 is slidably disposed in the support structure 10.
  • the chip holder 20 can slide into any chip card position in the support structure 10 to provide a photo sensor chip 30 for a camera corresponding to the chip card position of the chip holder 20. Therefore, a camera structural design method in which the photosensitive chip 30 can be moved is provided, and two or more cameras share one photosensitive chip 30, which greatly reduces the number of camera chips of the whole machine, reduces the hardware cost of the camera, and improves the profitability of the product. A sense of technology.
  • the support structure 10 includes:
  • a middle plate 11 which is provided with a first opening 110, and the at least two chip cards are disposed in the first opening 110;
  • the chip holder 20 is disposed in the first opening 110, and the chip holder 20 is slidably connected to the support structure 10 along a side wall of the first opening 110.
  • the chip holder 20 can slide inside the support structure 10 along the side wall of the first opening 110 into any chip card position to provide a photosensitive chip 30 for a camera corresponding to the chip card position of the chip holder 20.
  • FIGS. 5 and 6 two chip card slots are disposed in the first opening 110 of the middle plate 11.
  • a first camera 51 is installed above the chip card slot on the left and a chip card slot on the right is installed above.
  • a second camera 52 is provided.
  • the chip holder 20 is provided with a photosensitive chip 30.
  • the chip holder 20 is disposed in the first opening 110 and is slidably connected to the support structure 10 along the side wall of the first opening 110. When the first camera 51 needs to shoot, the chip holder 20 can be driven to slide to the left chip card position, that is, the position shown in FIG. 5, to provide a photosensitive chip 30 for the first camera 51.
  • the driving chip holder 20 slides to the right chip card position, that is, the position shown in FIG. 6, and provides a photosensitive chip for the second camera 52. In this way, the entire dual-camera system only needs one photosensitive chip 30 to take pictures, which reduces the number of camera chips and reduces the camera hardware cost.
  • the camera structure of the embodiment of the present disclosure can also be used in the design scheme of multiple cameras, so that multiple cameras can share one photosensitive chip 30, so as to reduce the number of camera chips of the entire machine and reduce the hardware cost of the camera.
  • the embodiment of the present disclosure does not limit the manner of driving the chip holder 20 to slide in the support structure 10, and any reasonable driving method may be adopted as long as the chip holder 20 can be driven to slide in the support structure 10.
  • electromagnetic drive or motor drive can be used, but it is not limited to this.
  • a first guide rail 15 is provided on a first hole side wall and a second hole side wall of the first opening 110, and the first hole side wall and the second hole The side walls of the hole are oppositely arranged;
  • a second guide rail 22 is respectively provided on the first support side wall and the second support side wall of the chip support 20, and the second guide rail 22 of the first support side wall is installed on the first side wall of the first hole.
  • the second guide rail 22 of the second support side wall is mounted on the first guide rail 15 of the second hole side wall, and the first support side wall and the second support side wall are oppositely disposed.
  • a first guide rail 15 is respectively provided on the two opposite side walls of the first opening 110 of the intermediate plate 11, and a second guide rail 22 is respectively provided on the two opposite side walls of the chip holder 20.
  • the cooperation between the two guide rails 22 and the first guide rail 15 can slide along the first guide rail 15 on the intermediate plate 11, thereby realizing the movement of the chip, so that the chip holder 20 can slide into any chip card position in the support structure 10.
  • the method of electromagnetic driving or motor driving may be adopted, and the chip holder 20 is driven to slide along the first guide rail 15, but is not limited thereto.
  • the first rail 15 is provided on the side wall of the first opening 110, and the second rail 22 provided on the side wall of the chip holder 20 to cooperate with the first rail 15 is only an optional implementation.
  • the chip holder 20 and the supporting structure 10 may also adopt other connection methods, as long as the sliding connection between the chip holder 20 and the supporting structure 10 can be achieved.
  • rollers are provided on the side wall of the chip holder 20, and guide rails for sliding the rollers are provided on the side wall of the first opening 110, which are not described here one by one.
  • a limiting slot 14 is respectively provided on the third hole side wall and the fourth hole side wall of the first opening 110, and the third hole side wall and the fourth hole Opposite side walls
  • the third bracket side wall and the fourth bracket side wall of the chip holder 20 are respectively provided with a protruding structure 21 capable of being inserted into the limiting slot 14.
  • the third bracket side wall and the fourth bracket side wall are oppositely disposed .
  • the limiting grooves 14 are respectively provided on the two opposite sidewalls of the first opening 110, and the convex structures 21 are respectively provided on the two opposite sidewalls of the chip holder 20, and the limiting grooves 14 and the limiting grooves 14 are provided through the convex structures 21 and the limiting grooves 14 respectively.
  • the supporting structure 10 further includes:
  • the first cover plate 13 is superposed on the first surface of the intermediate plate 11, and the first cover plate 13 covers the area where the first opening 110 is located.
  • the first cover plate 13 is superposed on the first surface of the intermediate plate 11 and covers the area where the first opening 110 is located, so that the chip holder 20 in the first opening 110 is located above the first cover plate 13 and the chip
  • the sliding range of the bracket 20 in the first opening 110, that is, the first cover plate 13 is covered under each chip card position.
  • the first cover plate 13 plays a good supporting role to the chip holder 20, ensuring the structure. Stability, and the first cover plate 13 plays a role of sealing and dustproofing the entire structure.
  • a first limiting structure corresponding to each chip card position on the first hole side wall, the second hole side wall of the first opening 110, or the first cover plate 13 is provided, and the chip holder
  • a second limiting structure that cooperates with the first limiting structure is provided on the first supporting side wall, the second supporting side wall, or the lower surface of 20, so that when the chip holder 20 moves to any chip card position, it passes the first
  • the cooperation of the limiting structure and the second limiting structure can realize the limiting and fixing of the chip holder 20.
  • the first limit structure may be a movable convex structure
  • the second limit structure may be a fixed convex structure.
  • the first limit structure may be The movable raised structure of the bit structure will be squeezed to be flat with the plane on which it is located.
  • the first cover 13 is provided with a first limiting structure corresponding to each chip card position.
  • the driving force is reduced to below a predetermined value.
  • the second position-limiting structure interferes with the first position-limiting structure to achieve the position-fixing of the chip holder 20.
  • the driving force is increased to a predetermined value.
  • the movable protruding structure of the first limiting structure is squeezed by the chip holder 20 and will be squeezed to the first position.
  • the surface of a cover plate 13 is flat, and the interference disappears, so that the chip holder 20 can smoothly slide to other chip card positions.
  • the supporting structure 10 further includes:
  • a second cover plate 12 which is superposed on the second surface of the intermediate plate 11, and a second opening is provided on the second cover plate 12, and the inner diameter of the second opening is smaller than The inner diameter of the first opening 110 is described.
  • the first surface and the second surface of the intermediate plate 11 face opposite directions, respectively.
  • the second cover plate 12 is superimposed on the second surface of the intermediate plate 11, and the inner diameter of the second opening of the second cover plate 12 is smaller than the inner diameter of the first opening 110, so that the inner edge of the second cover plate 12 is opposite to A part of the inner edge of the middle plate 11 extends to block the inner edge of the middle plate 11, so that when the chip holder 20 is moved to both sides of the first opening 110, the second cover plate 12 can be aligned above the chip holder 20.
  • the chip holder 20 is fixed at a limited position, and the second cover plate 12 plays a role of sealing and dustproofing the entire structure.
  • the intermediate board 11 is a printed circuit board.
  • the PCB is provided with a first opening 110, and the first opening 110 is provided with at least two chip slots.
  • the chip holder 20 can A light-sensitive chip 30 is provided for the camera corresponding to the chip card position where the chip holder 20 is located during sliding to any chip card position along the side wall of the first opening 110.
  • the support structure 10 is provided with a contact point; the chip support 20 is provided with a pin, and when the pin on the chip support 20 is in contact with the contact point, the support structure 10 and The chip holder 20 is electrically connected.
  • a contact point may be provided on the intermediate board 11, that is, the PCB, to achieve electrical conduction with the chip holder 20, but it is not limited thereto.
  • the above-mentioned support structure 10 is provided with a contact point, and the method of setting pins on the chip holder 20 to achieve electrical conduction is only an optional implementation.
  • the chip holder 20 and the support structure 10 may also adopt other methods.
  • the electrical connection method only needs to be able to achieve electrical conduction between the chip holder 20 and the support structure 10.
  • the chip holder 20 and the support structure 10 are electrically connected through a wire connection, etc., which are not described here one by one.
  • the camera structure further includes:
  • a camera bracket 40 The support structure 10 is disposed below the camera bracket 40.
  • the camera bracket 40 is provided with a camera mounting structure above each chip card position.
  • the camera bracket 40 is used to fix the camera, and the support structure 10 is disposed below the camera bracket 40.
  • the camera bracket 40 is provided with a camera mounting structure above each chip card slot, and each camera mounting structure can install a camera.
  • the chip holder 20 can be slid into any chip card position in the support structure 10 to provide a photosensitive chip 30 for a camera above the chip card position where the chip holder 20 is located.
  • the camera may be fixedly mounted on the camera bracket 40 through the dispensing 60.
  • the materials of the second cover plate 12 and the first cover plate 13 are not limited in the embodiment of the present disclosure.
  • plastics and steel sheets may be used, which are not described here one by one.
  • the embodiment of the present disclosure does not limit the fixing manner of the second cover plate 12 and the intermediate plate 11 and the fixing manner of the first cover plate 13 and the intermediate plate 11.
  • dispensing, welding, etc. may be used, which are not the same One note.
  • the photosensitive chip of the camera in the related art is fixed, and the positions of the chip and the lens are relatively fixed.
  • the photosensitive chip of the camera is designed to be movable.
  • the photosensitive chip in the embodiment of the present disclosure can accurately move the position, and switch between the required cameras, so that two or more cameras can share one photosensitive chip, which can greatly reduce the number of camera chips and reduce the hardware cost of the entire machine. Improve product profitability.
  • a mobile terminal including: the camera structure according to any one of the above.
  • the mobile terminal includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a car terminal, a wearable device, and a pedometer.

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Abstract

提供了一种摄像头结构及移动终端。该摄像头结构包括支撑结构、芯片支架以及感光芯片。支撑结构上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头。芯片支架滑动设置于支撑结构内。感光芯片设置于所述芯片支架上。

Description

摄像头结构及移动终端
相关申请的交叉引用
本申请主张在2018年6月12日在中国提交的中国专利申请号No.201810600409.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电子技术领域，尤其涉及一种摄像头结构及移动终端。
背景技术
随着智能移动终端的普及，利用移动终端进行视频影音娱乐已经成为现阶段的一种潮流，拍照、拍视频成为了移动终端必备的功能。相关技术中的移动终端实现拍照功能利用的是与摄像头匹配的感光芯片，市面上的主流手机包括后置双摄加前置单摄，三个摄像头需要匹配三个感光芯片，具有后置双摄加前置双摄的手机需要四个感光芯片，具有后置三摄加前置单摄的手机需要四个感光芯片。
相关技术中的移动终端运用场景都需要多个摄像头感光芯片，但相关技术中的移动终端硬件成本也不断攀升，摄像头感光芯片更是价格不菲，热门机型出货量都在上千万台，这对企业来说成本投入过高。
发明内容
本公开实施例提供一种摄像头结构及移动终端，以解决相关技术中移动终端的摄像头成本投入过高的问题。
为了解决上述技术问题，本公开是这样实现的：一种摄像头结构，包括：
支撑结构，所述支撑结构上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头；
芯片支架，所述芯片支架滑动设置于所述支撑结构内；
感光芯片，所述感光芯片设置于所述芯片支架上。
本公开的实施例还提供了一种移动终端，包括：如上任一项所述的摄像 头结构。
在本公开实施例中，摄像头结构包括支撑结构和芯片支架，芯片支架上设置有一个感光芯片，支撑结构上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头，芯片支架滑动设置于支撑结构内。芯片支架能够在支撑结构内滑动至任一个芯片卡位中，为芯片支架所在的芯片卡位对应的摄像头提供感光芯片。从而提供了一种感光芯片可以移动的摄像头结构设计方式，让两个或多个摄像头共用一个感光芯片，大幅减少了整机摄像头芯片数量，降低了摄像头硬件成本，提高了产品盈利能力和科技感。
附图说明
图1为本公开实施例提供的摄像头结构的示意图之一；
图2为本公开实施例提供的摄像头结构的示意图之二；
图3为图2沿A-A的剖视图；
图4为图2沿V-V的剖视图；
图5为本公开实施例提供的摄像头结构中两个摄像头共用芯片的示意图之一；
图6为本公开实施例提供的摄像头结构中两个摄像头共用芯片的示意图之二。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
在本公开的一些实施例中，参照图1至4所示，提供了一种摄像头结构，包括：
支撑结构10，所述支撑结构10上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头；
芯片支架20，所述芯片支架20滑动设置于所述支撑结构10内；
感光芯片30，所述感光芯片30设置于所述芯片支架20上。
本公开实施例的摄像头结构，包括支撑结构10和芯片支架20，芯片支架20上设置有一个感光芯片30，支撑结构10上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头，芯片支架20滑动设置于支撑结构10内。芯片支架20能够在支撑结构10内滑动至任一个芯片卡位中，为芯片支架20所在的芯片卡位对应的摄像头提供感光芯片30。从而提供了一种感光芯片30可以移动的摄像头结构设计方式，让两个或多个摄像头共用一个感光芯片30，大幅减少了整机摄像头芯片数量，降低了摄像头硬件成本，提高了产品盈利能力和科技感。
可选的，如图1、2所示，所述支撑结构10包括：
中间板11，所述中间板11上设置有第一开孔110，所述第一开孔110内设置有所述至少两个芯片卡位；
所述芯片支架20设置于所述第一开孔110内，所述芯片支架20沿所述第一开孔110的侧壁与所述支撑结构10滑动连接。
此时，芯片支架20能够在支撑结构10内沿第一开孔110的侧壁滑动至任一个芯片卡位中，为芯片支架20所在的芯片卡位对应的摄像头提供感光芯片30。
例如，如图5、6所示，中间板11的第一开孔110内设置有两个芯片卡位，左侧的芯片卡位上方安装有第一摄像头51，右侧的芯片卡位上方安装有第二摄像头52，芯片支架20上设置有感光芯片30，芯片支架20设置于第一开孔110内并沿第一开孔110的侧壁与支撑结构10滑动连接。当第一摄像头51需要拍摄时，可驱动芯片支架20滑动到左侧芯片卡位，即图5所示的位置，为第一摄像头51提供感光芯片30；当第二摄像头52需要拍摄时，可驱动芯片支架20滑动到右侧芯片卡位，即图6所示的位置，为第二摄像头52提供感光芯片。这样整个双摄系统就只需要一个感光芯片30就能进行拍照，减少了整机摄像头芯片数量，降低了摄像头硬件成本。
当然，本公开实施例的摄像头结构也能用于多个摄像头的设计方案中，使得多个摄像头能共用一个感光芯片30，以减少整机摄像头芯片数量，降低摄像头硬件成本。
其中，本公开实施例对于驱动芯片支架20在支撑结构10内滑动的方式不作限定，可采用任意合理的驱动方式，只要能够驱动芯片支架20在支撑结构10内滑动即可。如可采用电磁驱动或者电机驱动等，但不限于此。
可选的，如图4所示，所述第一开孔110的第一孔侧壁和第二孔侧壁上分别设置有第一导轨15，所述第一孔侧壁和所述第二孔侧壁相对设置；
所述芯片支架20的第一支架侧壁和第二支架侧壁上分别设置有第二导轨22，所述第一支架侧壁的第二导轨22安装于所述第一孔侧壁的第一导轨15上，所述第二支架侧壁的第二导轨22安装于所述第二孔侧壁的第一导轨15上，所述第一支架侧壁和所述第二支架侧壁相对设置。
此时，中间板11的第一开孔110相对的两个侧壁上分别设置有第一导轨15，芯片支架20相对的两个侧壁上分别设置有第二导轨22，芯片支架20通过第二导轨22与第一导轨15的配合作用，能够在中间板11上沿第一导轨15滑动，从而实现了芯片的移动，使得芯片支架20能够在支撑结构10内滑动至任一个芯片卡位中，为芯片支架20所在的芯片卡位对应的摄像头提供感光芯片30。
其中，如前述，可采用电磁驱动或电机驱动的方式等，驱动芯片支架20沿第一导轨15滑动，但不限于此。
上述第一开孔110的侧壁设置第一导轨15，芯片支架20的侧壁设置与第一导轨15配合的第二导轨22的方式仅仅为一种可选的实现方式，本公开实施例中，芯片支架20与支撑结构10也可采用其他连接方式，只要能实现芯片支架20与支撑结构10的滑动连接即可。如在芯片支架20的侧壁上设置滚轮，在第一开孔110的侧壁上设置供滚轮滑动的导轨等，在此不一一说明。
可选的，如图3所示，所述第一开孔110的第三孔侧壁和第四孔侧壁上分别设置有限位槽14，所述第三孔侧壁和所述第四孔侧壁相对设置；
所述芯片支架20的第三支架侧壁和第四支架侧壁上分别设置有能够嵌入所述限位槽14的凸起结构21，所述第三支架侧壁和第四支架侧壁相对设置。
此时，第一开孔110相对的两个侧壁上分别设置有限位槽14，芯片支架20相对的两个侧壁上分别设置有凸起结构21，通过凸起结构21与限位槽14 的配合作用，能够在芯片支架20移动到第一开孔110的两侧时，实现对芯片支架20限位固定。
可选的，如图3、4所示，所述支撑结构10还包括：
第一盖板13，所述第一盖板13叠加在所述中间板11的第一面，且所述第一盖板13覆盖第一开孔110所在区域。
此时，第一盖板13叠加在中间板11的第一面，且覆盖第一开孔110所在的区域，使得第一开孔110内的芯片支架20位于第一盖板13上方，且芯片支架20在第一开孔110内的滑动范围，即各个芯片卡位下方均覆盖有第一盖板13，如此第一盖板13对芯片支架20起到了很好的支撑作用，保证了结构的稳定性，且第一盖板13对结构整体起到了密封防尘的作用。
可选的，所述第一开孔110的第一孔侧壁、第二孔侧壁或者所述第一盖板13上对应每个芯片卡位设置有第一限位结构，所述芯片支架20的第一支架侧壁、第二支架侧壁或者下表面上设置有与第一限位结构配合的第二限位结构，如此芯片支架20移动到任一芯片卡位中时，通过第一限位结构与第二限位结构的配合作用，能够实现对芯片支架20的限位固定。
可选的，第一限位结构如可为活动凸起结构，第二限位结构如可为固定凸起结构，其中，第一限位结构受到挤压的外力大于预定值时，第一限位结构的活动凸起结构会被挤压至与所在平面持平。例如第一盖板13上对应每个芯片卡位设置有第一限位结构，当芯片支架20受驱动力的作用滑动至某芯片卡位中时，将驱动力减小到预定值以下，此时第二限位结构与第一限位结构形成干涉，实现对芯片支架20的限位固定。当需要芯片支架20滑动至其他的芯片卡位中时，将驱动力增加到预定值，此时第一限位结构的活动凸起结构受到芯片支架20的挤压，会被挤压至与第一盖板13的表面持平，干涉消失，使得芯片支架20能够顺利滑动至其他的芯片卡位中。
可选的，如图3、4所示，所述支撑结构10还包括：
第二盖板12，所述第二盖板12叠加在所述中间板11的第二面，所述第二盖板12上设置有第二开孔，所述第二开孔的内径小于所述第一开孔110的内径。
其中，中间板11的第一面和第二面分别朝向相反的方向。
此时，第二盖板12叠加在中间板11的第二面，第二盖板12的第二开孔的内径小于第一开孔110的内径，使得第二盖板12的内边缘相对于中间板11的内边缘延伸出一部分，对中间板11的内边缘形成遮挡，从而在芯片支架20移动到第一开孔110的两侧时，第二盖板12能够在芯片支架20上方实现对芯片支架20限位固定，且第二盖板12对结构整体起到了密封防尘的作用。
可选的，所述中间板11为印制电路板。
此时，至少两个摄像头共用印制电路板(Prin ted Circuit Board，PCB)，PCB上设有第一开孔110，第一开孔110内设有至少两个芯片卡位，芯片支架20能够在沿第一开孔110的侧壁滑动至任一个芯片卡位中，为芯片支架20所在的芯片卡位对应的摄像头提供感光芯片30。
可选的，所述支撑结构10上设置有接触点；所述芯片支架20上设置有引脚，所述芯片支架20上的引脚与所述接触点接触时，所述支撑结构10与所述芯片支架20电性导通。
其中，可在中间板11，即PCB上设置接触点实现与芯片支架20的电性导通，但不限于此。
上述支撑结构10上设置接触点，芯片支架20上设置引脚实现电性导通的方式仅仅为一种可选的实现方式，本公开实施例中，芯片支架20与支撑结构10也可采用其他电性连接方式，只要能实现芯片支架20与支撑结构10的电性导通即可。如将芯片支架20与支撑结构10通过导线连接实现电性导通等，在此不一一说明。
可选的，如图5、6所示，摄像头结构还包括：
摄像头支架40，所述支撑结构10设置于所述摄像头支架40下方，所述摄像头支架40在每个芯片卡位上方设置有一个摄像头安装结构。
此时，摄像头支架40用于固定摄像头，支撑结构10设置于摄像头支架40的下方，摄像头支架40在每个芯片卡位上方设置有一个摄像头安装结构，每个摄像头安装结构内可安装一个摄像头，芯片支架20能够在支撑结构10内滑动至任一个芯片卡位中，为芯片支架20所在的芯片卡位上方的摄像头提供感光芯片30。
可选的，如图5、6所示，摄像头可通过点胶60固定安装在摄像头支架 40上。
其中，本公开实施例对于第二盖板12和第一盖板13的材料不做限定，如可采用塑料、钢片等，在此不一一说明。
其中，本公开实施例对于第二盖板12与中间板11的固定方式，以及第一盖板13与中间板11的固定方式不做限定，如可采用点胶、焊接等，在此不一一说明。
相关技术中的摄像头的感光芯片是固定不动的，芯片与镜头的位置是相对固定死的。本公开实施例的摄像头结构中，把摄像头的感光芯片设计成可以移动的。本公开实施例的感光芯片可以精确移动位置，在需要的摄像头之间进行移动切换，使得两个或者多个摄像头能共用一个感光芯片，可以大幅减少整机摄像头芯片数量，降低整机硬件成本，提高产品盈利能力。
在本公开的一些实施例中，还提供了一种移动终端，包括：如上任一项所述的摄像头结构。
在本公开实施例中，移动终端包括但不限于手机、平板电脑、笔记本电脑、掌上电脑、车载终端、可穿戴设备、以及计步器等。
其中，上述摄像头结构的所述实现实例均适用于该移动终端的实施例中，也能达到相同的技术效果，为避免重复，在此不再赘述。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
在公开的描述中，需要理解的是，术语“纵向”、“径向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。在公开的描述中，除非另有说明，“多个”的含义是两个或两个 以上。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。

Claims (10)

  1. 一种摄像头结构，包括：
    支撑结构，所述支撑结构上设置有至少两个芯片卡位，每个芯片卡位对应一个摄像头；
    芯片支架，所述芯片支架滑动设置于所述支撑结构内；
    感光芯片，所述感光芯片设置于所述芯片支架上。
  2. 根据权利要求1所述的摄像头结构，其中，所述支撑结构包括：
    中间板，所述中间板上设置有第一开孔，所述第一开孔内设置有所述至少两个芯片卡位；
    所述芯片支架设置于所述第一开孔内，所述芯片支架沿所述第一开孔的侧壁与所述支撑结构滑动连接。
  3. 根据权利要求2所述的摄像头结构，其中，所述支撑结构还包括：
    第一盖板，所述第一盖板叠加在所述中间板的第一面，且所述第一盖板覆盖第一开孔所在区域。
  4. 根据权利要求2所述的摄像头结构，其中，所述支撑结构还包括：
    第二盖板，所述第二盖板叠加在所述中间板的第二面，所述第二盖板上设置有第二开孔，所述第二开孔的内径小于所述第一开孔的内径。
  5. 根据权利要求2所述的摄像头结构，其中，所述第一开孔的第一孔侧壁和第二孔侧壁上分别设置有第一导轨，所述第一孔侧壁和所述第二孔侧壁相对设置；
    所述芯片支架的第一支架侧壁和第二支架侧壁上分别设置有第二导轨，所述第一支架侧壁的第二导轨安装于所述第一孔侧壁的第一导轨上，所述第二支架侧壁的第二导轨安装于所述第二孔侧壁的第一导轨上，所述第一支架侧壁和所述第二支架侧壁相对设置。
  6. 根据权利要求2所述的摄像头结构，其中，所述第一开孔的第三孔侧壁和第四孔侧壁上分别设置有限位槽，所述第三孔侧壁和所述第四孔侧壁相对设置；
    所述芯片支架的第三支架侧壁和第四支架侧壁上分别设置有能够嵌入所 述限位槽的凸起结构，所述第三支架侧壁和第四支架侧壁相对设置。
  7. 根据权利要求2至6中任一项所述的摄像头结构，其中，所述中间板为印制电路板。
  8. 根据权利要求1所述的摄像头结构，其中，所述支撑结构上设置有接触点；
    所述芯片支架上设置有引脚，所述芯片支架上的引脚与所述接触点接触时，所述支撑结构与所述芯片支架电性导通。
  9. 根据权利要求1所述的摄像头结构，还包括：
    摄像头支架，所述支撑结构设置于所述摄像头支架下方，所述摄像头支架在每个芯片卡位上方设置有一个摄像头安装结构。
  10. 一种移动终端，包括：如权利要求1至9中任一项所述的摄像头结构。
PCT/CN2019/090116 2018-06-12 2019-06-05 摄像头结构及移动终端 WO2019237975A1 (zh)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108881680B (zh) * 2018-06-12 2021-05-07 维沃移动通信有限公司 一种摄像头结构及移动终端
CN112153261A (zh) * 2020-09-24 2020-12-29 维沃移动通信有限公司 电子设备
CN112911109B (zh) * 2021-01-20 2023-02-24 维沃移动通信有限公司 电子设备及拍摄方法
CN113067971B (zh) * 2021-03-10 2023-10-20 Oppo广东移动通信有限公司 镜头、摄像模组及电子设备
CN113660402A (zh) * 2021-08-19 2021-11-16 南昌逸勤科技有限公司 摄像头模组及电子设备
CN113766109A (zh) * 2021-09-02 2021-12-07 成都中科创达软件有限公司 一种摄像头模组、镜头的切换控制方法、装置和设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1963656A (zh) * 2005-11-11 2007-05-16 鸿富锦精密工业（深圳）有限公司 镜头模组及应用该镜头模组的便携式电子装置
CN201813486U (zh) * 2010-09-25 2011-04-27 王兆群 车载安防监控摄像机装置
CN105306791A (zh) * 2014-07-23 2016-02-03 西安司坤电子科技有限公司 一种高性能拼图数码相机
US9357116B1 (en) * 2015-07-22 2016-05-31 Ic Real Tech, Inc. Isolating opposing lenses from each other for an assembly that produces concurrent non-overlapping image circles on a common image sensor
CN107566707A (zh) * 2017-09-29 2018-01-09 努比亚技术有限公司 双镜头摄像装置及移动终端
CN107846535A (zh) * 2017-10-24 2018-03-27 信利光电股份有限公司 一种摄像模组
CN108881680A (zh) * 2018-06-12 2018-11-23 维沃移动通信有限公司 一种摄像头结构及移动终端

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004088604A (ja) * 2002-08-28 2004-03-18 Konica Minolta Holdings Inc 撮像装置
CN203691492U (zh) * 2013-11-01 2014-07-02 深圳市金立通信设备有限公司 一种摄像头及终端
CN204013814U (zh) * 2014-04-30 2014-12-10 深圳市金立通信设备有限公司 摄像头及终端
CN108141541A (zh) * 2015-10-28 2018-06-08 剑桥机电有限公司 提供光学图像稳定的相机组件
US10187636B2 (en) * 2016-01-08 2019-01-22 Asm Technology Singapore Pte Ltd Active lens alignment system
CN107181901A (zh) * 2017-06-23 2017-09-19 上海与德科技有限公司 摄像头模组、摄像装置及移动终端

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1963656A (zh) * 2005-11-11 2007-05-16 鸿富锦精密工业（深圳）有限公司 镜头模组及应用该镜头模组的便携式电子装置
CN201813486U (zh) * 2010-09-25 2011-04-27 王兆群 车载安防监控摄像机装置
CN105306791A (zh) * 2014-07-23 2016-02-03 西安司坤电子科技有限公司 一种高性能拼图数码相机
US9357116B1 (en) * 2015-07-22 2016-05-31 Ic Real Tech, Inc. Isolating opposing lenses from each other for an assembly that produces concurrent non-overlapping image circles on a common image sensor
CN107566707A (zh) * 2017-09-29 2018-01-09 努比亚技术有限公司 双镜头摄像装置及移动终端
CN107846535A (zh) * 2017-10-24 2018-03-27 信利光电股份有限公司 一种摄像模组
CN108881680A (zh) * 2018-06-12 2018-11-23 维沃移动通信有限公司 一种摄像头结构及移动终端

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