WO2019232930A1 - 一种温度-压力一体式传感器 - Google Patents

一种温度-压力一体式传感器 Download PDF

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Publication number
WO2019232930A1
WO2019232930A1 PCT/CN2018/100742 CN2018100742W WO2019232930A1 WO 2019232930 A1 WO2019232930 A1 WO 2019232930A1 CN 2018100742 W CN2018100742 W CN 2018100742W WO 2019232930 A1 WO2019232930 A1 WO 2019232930A1
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WO
WIPO (PCT)
Prior art keywords
pressure sensor
sensor element
temperature
pressure
conductive extension
Prior art date
Application number
PCT/CN2018/100742
Other languages
English (en)
French (fr)
Inventor
徐文
Original Assignee
深圳安培龙科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳安培龙科技股份有限公司 filed Critical 深圳安培龙科技股份有限公司
Priority to EP18922005.6A priority Critical patent/EP3805710A4/en
Priority to US16/972,589 priority patent/US11422050B2/en
Publication of WO2019232930A1 publication Critical patent/WO2019232930A1/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings

Definitions

  • the present application belongs to the technical field of sensors, and specifically relates to a temperature-pressure integrated sensor.
  • a sensor is an important component in an industrial control system. It is used to sense the measured information and convert the measured information into electrical signals or other required forms of information output according to a certain rule. Can be used to measure a physical quantity. With the rapid development of automated monitoring technology, a single sensor with a measuring function can no longer meet the needs. In actual use, it is often necessary to measure multiple parameters at the same time, especially temperature and pressure parameters. For acquisition, if separate temperature and pressure sensors are used to measure parameters separately, it is difficult to ensure the identity of the measured points. It is also costly to purchase the two types separately.
  • the temperature and pressure integrated sensor has become a research hotspot in the industry.
  • the temperature sensor and the pressure sensor are the two types of sensors most used in the sensor industry, and they often need to be used together. Problems of large space occupied by independent sensors and inaccurate test data
  • Chinese patent CN102980714 discloses a compact pressure / temperature combined sensor assembly.
  • the sensor assembly is provided with a middle plate assembly.
  • the middle plate assembly includes at least one disc-shaped element and a hollow probe element.
  • the temperature sensor element is mounted.
  • the lead wires of the temperature sensor element need to pass through the hollow probe element and pass through the middle plate assembly to reach the hollow volume portion of the recess, and finally be coupled with the terminals of the electronic circuit.
  • the threading operation of the temperature sensor element wires is very inefficient, and the coupling between the wires and the terminals requires a suitable process. This process may cause damage to the wires, thereby affecting the electrical connection performance of the sensor.
  • Patent EP2749855A2 discloses a sensor component.
  • the sensor component has a protective cover formed by plastic injection molding, which is used to install and expose the sensor component to a medium measured by the sensor.
  • the sensor component has a large installation size and is applied. The occasion is limited.
  • the length of the sensor probe is changed to meet the requirements of different temperature measurements, which means that different measurement occasions need to be injection-molded to make sensor probes of different lengths, which is complicated and expensive to manufacture.
  • this application is to solve the above technical problems, so as to propose a temperature-pressure integrated sensor with compact structure, small size, easy assembly, and low cost.
  • the present application provides a temperature-pressure integrated sensor, which includes an electrical connector, a pressure sensor element, and a base assembly that are sequentially connected, and a flexible conditioning circuit is provided between the pressure sensor element and the electrical connector.
  • a plate, the pressure sensor element is electrically connected to the flexible conditioning circuit board, the flexible conditioning circuit board is connected with a conductive extension, and the conductive extension extends from a top end of the pressure sensor element to a bottom end of the base component, and A temperature sensor element is provided at the bottom end of the conductive extension.
  • the housing component comprising an accommodation cavity and a probe communicating with the accommodation cavity, and the accommodation cavity is used to accommodate the flexible conditioning circuit board, pressure The sensor element, the base component, and a part of the electrical connector, the conductive extension portion extends to the inner bottom of the probe via the pressure sensor element and the base component.
  • the pressure sensor assembly includes a base and a pressure-sensitive film disposed on a bottom surface of the base, and the flexible conditioning circuit board is disposed on a top surface of the base.
  • the base body assembly includes a cylindrical base body and two flow guiding columns provided at the bottom of the cylindrical base body, and the flow guiding columns have through holes provided in the axial direction for guiding the test fluid.
  • the pressure sensor element is disposed on the top of the cylindrical base.
  • the side wall and the bottom surface of the cylindrical base body are provided with a vertical guide groove and a horizontal guide groove for accommodating the conductive extension portion; and the electrical connecting member has a shape suitable for the vertical guide groove.
  • the engaging portion is engaged with the vertical guide groove.
  • a mounting groove is provided on an outer wall of each of the flow guiding columns, and a first sealing ring is provided in the mounting groove; a second is provided between the cylindrical base and the pressure sensor element Sealing ring.
  • the housing part is provided with a counterbore for mounting the guidepost at a position corresponding to the guidepost, and the bottom of the counterbore is provided with a connection for introduction to the counterbore. Test fluid flow path.
  • the probe is a hollow cylindrical probe with a closed bottom, the probe is provided with a reinforcing layer on the outside, the probe is provided with a thermally conductive material layer on the inner bottom, and the thermally conductive material layer is wrapped on The temperature sensor element is external.
  • the conductive extension portion is integrally formed with the flexible conditioning circuit board and can be freely bent, and the conductive extension portion is disposed close to the vertical guide groove and the horizontal guide groove and is away from the pressure.
  • the direction of the sensor element is bent and extended, perpendicular to the center of the bottom surface of the cylindrical base, and the conductive extension is fixed to the horizontal guide groove by an I-shaped buckle.
  • the side wall of the cylindrical base body is further provided with two mounting card slots
  • the electrical connector has a card connector adapted to the mounting card slot, and the electrical connector and the mounting Card slot snap-in connection.
  • the temperature-pressure integrated sensor includes an electrical connector, a pressure sensor element, and a base assembly that are sequentially connected, and a flexible conditioning circuit is provided between the pressure sensor element and the electrical connector.
  • Board the pressure sensor element is electrically connected to the flexible conditioning circuit board
  • the flexible conditioning circuit board is connected with a conductive extension
  • a temperature sensor element is provided at the bottom end of the conductive extension
  • the conductive extension is a pressure sensor
  • the top of the element extends to the bottom of the base assembly.
  • the conductive extension is installed externally of the pressure sensor element and the base assembly and extends below the base assembly, which solves the problems of difficult operation, low efficiency, and easy damage to the wires in the traditional sensor. It is easy to assemble and has high production efficiency.
  • the hollow cylindrical probe effectively prevents the temperature sensor element from being exposed to the measured medium, especially the corrosive measuring medium.
  • FIG. 1 is an exploded schematic view of a temperature-pressure integrated sensor according to an embodiment of the present application
  • 2 is a cross-sectional view of a temperature-pressure integrated sensor according to an embodiment of the present application
  • FIG. 3 is a cross-sectional view of the temperature-pressure integrated sensor according to the embodiment of the present application in another direction;
  • FIG. 4 is an assembly schematic diagram of a temperature-pressure integrated sensor according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a pressure sensor element and a flexible conditioning circuit board in the temperature-pressure integrated sensor according to the embodiment of the present application;
  • FIG. 6 is a schematic diagram when a temperature-pressure integrated sensor according to an embodiment of the present application is not assembled with a housing component
  • the reference numerals in the figure are represented as: 1-electrical connector; 101-clamping section; 102-clamping member; 2-pressure sensor element; 201-base; 202-pressure-sensitive film; 3-base assembly 301-cylindrical base body 302-guiding pillar 3 03-vertical guide groove 304-horizontal guide groove 305-I-shaped buckle 306-mounting groove 307-first seal ring 308-second Sealing ring; 309-mounting slot; 4-flexible conditioning circuit board; 401-conductive extension; 5-temperature sensor element; 6-housing component; 601-receiving cavity; 602-probe; 603-flow channel; 604-reinforcement layer; 6 05-layer of thermally conductive material; 606-threaded interface.
  • This embodiment provides a temperature-pressure integrated sensor, which is a sensor that can simultaneously measure a pressure signal and a temperature signal.
  • the integrated sensor is shown in FIG.
  • the electrical connector 1, the pressure sensor element 2, and the base assembly 3 that are connected in a secondary manner, and a flexible conditioning circuit board 4 is disposed between the pressure sensor element 2 and the electrical connector 1.
  • the electrical connector 1 is used to achieve electrical connection with other mechanisms.
  • the electrical connector can be customized according to requirements or can be a standard component.
  • the bottom of the electrical connector 1 has a capacity
  • the flexible conditioning circuit board 4 is disposed on the top surface of the pressure sensor element 2 and in the accommodating space.
  • the flexible conditioning circuit board 4 is made of a suitable material such as polyimide material. Reliable, soft texture with certain toughness and strength, can be freely bent and deformed without being damaged, the flexible conditioning circuit board 4 is integrally connected with a conductive extension 401, and the conductive extension 401 is made of a material and a flexible conditioning circuit
  • the plate 4 has the same body, and is also a suitable material such as polyimide material.
  • a temperature sensor element 5 is provided at the bottom end of the conductive extension 401.
  • the temperature sensor element 5 may be a platinum thin film temperature sensor, which is connected to the bottom end of the conductive extension 401 through a patch or other reliable connection methods.
  • the sensor described in this embodiment The physical circuit board 4 is coupled with the pressure sensor element 2 and the temperature sensor element 5, and realizes the simultaneous processing and conversion of the pressure signal and the temperature signal by the flexible conditioning circuit board 4, and is a sensor that can simultaneously detect the pressure and temperature signals.
  • the pressure sensor element 2 includes a base 201, and a bottom surface of the base 201 (a surface remote from the electrical connection member) is provided with a pressure-sensitive film 202, the base 201 is a cylindrical shape, and the corresponding pressure-sensitive film 202 is circular.
  • the pressure-sensitive film is disposed on the top surface of the base 201, and the flexible extension circuit board 4 is covered with the conductive extension 401, as shown in FIG.
  • the top surface and the side surface of the base 201 are bent downward and extend.
  • the pressure sensor element 2 may be a ceramic capacitive sensor element, or a ceramic piezoresistive sensor element or other suitable sensor element.
  • the base assembly 3 includes a cylindrical base 301, and two cylindrical guide pillars 302 are provided at the bottom of the cylindrical base 301, and the cylindrical base 301 and the guide pillars 302 can be made by plastic injection molding, and the production cost is low.
  • the pressure sensor element 2 is disposed on the top of the cylindrical base 301.
  • the cylindrical base 301 is provided with a through hole corresponding to the position of the flow guiding post 302.
  • the flow guiding post 302 is also a hollow cylinder with A through hole provided in the axial direction of the guide pillar 302 allows the guide pillar 302 to communicate with the cylindrical base 201, and provides a necessary path for introducing the measurement medium into the circular pressure-sensitive membrane 202.
  • the side wall and the bottom surface of the cylindrical base 301 are provided with a vertical guide groove 303 and a horizontal guide groove 304 for receiving the conductive extension 401.
  • the conductive extension 401 extends from the top surface of the base 201 and Bend to the side wall of the base 201, then cover the vertical guide groove 303 and extend downward to the bottom surface of the cylindrical base 301, bend and cover the horizontal guide groove 304 to extend to the center of the cylindrical base 301, again It is bent, extends vertically downward, and is finally disposed perpendicularly to the bottom surface of the cylindrical base 301.
  • the width dimension of the vertical guide groove 303 and the horizontal guide groove 304 is adapted to the conductive extension 401, and the conductive extension is accommodated in the vertical guide groove 303 and the horizontal guide groove 304 to fully fix the conductive
  • the extension 401 further includes an I-shaped buckle 305 that is adapted to the horizontal guide groove 304, and the I-shaped buckle 305 and the horizontal guide groove 304 are slightly tightly matched, so that the conductive extension can be installed more tightly on the
  • the guide groove is bent and shaped so as not to be shaken or dropped randomly.
  • the bottom surface of the I-shaped buckle 305 is flat with the outer bottom surface of the horizontal guide groove 304, and the I-shaped buckle 305 can be connected to the cylindrical base 301 At the same time, injection molding does not need to be opened separately or processed in other ways, which reduces production costs.
  • the electrical connector 1 has a vertical guide A snap-fitting portion 101 having a matching slot 303 size, the snap-fitting portion 101 and the vertical guide groove 303 are gap-fitted, and the clearance between the snap-fitting portion 101 and the vertical guide slot 303 in the depth direction of the guide groove can at least accommodate the space.
  • the latching portion 101 fixes the conductive extension portion 401 in the vertical guide groove 303, which further improves the installation stability of the conductive extension portion 401.
  • the side wall of the cylindrical base body 301 is further provided with two mounting clip grooves 309.
  • the electrical connector 1 has a clip piece 102 adapted to the mounting clip groove 309, and the clip piece 102 It is connected with the mounting groove 309 in a snap-fit manner, so that the electrical connection piece 1 is firmly connected with the cylindrical base 301.
  • a mounting groove 306 is provided on the outer wall of each of the flow guiding columns 302, the mounting groove A first seal ring 307 is installed in the slot 3 06, a volume portion is provided on the top of the cylindrical base 301, a second seal ring 308 is installed in the volume portion, and the pressure sensor element 2 is disposed on the second seal ring.
  • 308 top that is, the second sealing ring is disposed between the pressure sensor element 2 and the cylindrical base body 3
  • a housing part 6 which includes a cup-shaped accommodation cavity 601 and a cylindrical hollow probe 602 communicating with the accommodation cavity 601, and the accommodation cavity 601 is used for
  • the conductive extension 401 extends from the accommodation cavity 601 to the hollow probe 602 through the pressure sensor assembly 2 and the base assembly 3 to accommodate the entire flexible conditioning circuit board 4, the pressure sensor element 2, the base assembly 3, and some electrical connections 1.
  • a counterbore for mounting the guidepost 302 is provided in the housing part 6 at the bottom of the cup-shaped receiving cavity 601 corresponding to the guidepost 302, and the counterbore is the guide
  • the column 302 provides an installation space and plays a guiding role.
  • a bottom of the counterbore is provided with a flow channel 60 03 for introducing a measurement medium, which is in communication with the counterbore.
  • One end communicates with the guide post 302 through a counterbore.
  • the case member 6 may be made of stainless steel, copper, or the like.
  • a strengthening layer 604 may be further provided outside the probe 602, and the strengthening layer 604 is a metal layer integrally formed with the casing 6 and the probe 602 to prevent The sensor falls and damages the probe 602.
  • the probe 602 and the cup-shaped receiving cavity 601 are integrally formed by machining, and no additional injection mold or stamping mold is needed for manufacturing. The manufacturing process is simple, and the external dimensions of the sensor are effectively reduced. It takes up less space.
  • a thermally conductive material layer 605 is provided on the inner bottom of the probe 602, and the thermally conductive material layer 605 Fill at least 1/3 of the capacity in the probe 602, and the thermally conductive material layer 605 is wrapped around the outside of the temperature sensor element 5.
  • the thermally conductive material layer can be made of thermally conductive silicone, thermally conductive ceramics, or thermally conductive metal.
  • Thermal adhesive which can fully fill the inside of the probe after curing. The enclosed probe described in this embodiment effectively prevents the temperature sensor element from being exposed to the measured medium, especially a corrosive measuring medium.
  • the housing part 6 also has a threaded interface 606, which is provided at the outer bottom of the accommodation cavity 601 and is used to mount the sensor to a device or other measurement system .

Abstract

一种温度压力一体式传感器，其包括顺次连接的电气连接件（1）、压力传感器元件（2）、基体组件（3），压力传感器元件（2）与电气连接件（1）之间设置有柔性调理电路板（4），压力传感器元件（2）与柔性调理电路板（4）电连接，柔性调理电路板（4）连接有一导电延伸部（401），导电延伸部（401）底端设置有温度传感器元件（5）；柔性调理电路板（4）与压力传感器单元（2）、温度传感器元件（5）的耦合实现了柔性调理电路（4）对压力信号与温度信号的同时处理与转换，得到了温度、压力集成式传感器，结构简单、紧凑，便于安装于测试环境中，应用范围更广；导电延伸部（401）由压力传感器元件（2）、基体组件（3）的外部安装并延伸至基体组件（3）下方，解决了传统传感器穿线作业难以操作、效率低、容易损伤导线的问题，易于组装，制作效率高。

Description

一种温度 -压力一体式传感器
[0001] 本申请是以申请号为 201810575009.3、 申请日为 2018年 6月 6日的中国专利申请 为基础， 并主张其优先权， 该申请的全部内容在此作为整体引入本申请中。
[0002] 技术领域
[0003] 本申请属于传感器技术领域， 具体地说涉及一种温度-压力一体式传感器。
[0004] 背景技术
[0005] 传感器是工业控制系统中的一种重要部件， 用于感受被测量的信息并将被测量 的信息按照一定规律转换为电信号或其它所需形式的信息输出， 传统的传感器 每种只能用于测量一种物理量， 随着自动化监控技术日益发展， 单一测量功能 的传感器已无法满足需要， 实际使用中， 在一个位置往往需要同时测量多个参 数， 特别是温度和压力参数时常需要同时获取， 如采用分立的温度传感器和压 力传感器对参数进行单独测量， 难以保证被测点位置的同一性， 分别购买两种 成本也较高。
[0006] 为解决上述问题， 温压一体传感器成为了行业的研究热点， 温度传感器、 压力 传感器是传感器行业使用量最大的两种传感器， 而且经常需要一同使用， 温压 一体传感器的出现解决了传统独立传感器占用空间大、 测试数据不精确的问题
[0007] 如中国专利 CN102980714公开了一种组合压力 /温度的紧凑型传感器组件， 该传 感器组件设有中板组件， 该中板组件包括至少一个盘形元件和中空探针元件， 温度传感器元件安装于中空探针元件内， 温度传感器元件的引出导线需通过中 空探针元件并穿过中板组件到达凹口的中空容积部， 并最终与电子电路的端子 耦合在一起。 这种传感器组件中， 温度传感器元件导线的穿线作业效率很低， 而且导线与端子耦合需要合适的工艺实现， 这一过程可能会造成导线损伤， 从 而影响传感器的电气连接性能。 另外， 组成中板组件的盘型元件和中空探针元 件需要分别加工成型后再组装， 使得传感器制造工艺繁琐， 同时也增加了传感 器的制造成本。 [0008] 专利 EP2749855A2公开了一种传感器组件， 传感器组件具有由塑料注模成型的 防护罩， 其用于将传感器组件安装并暴露于传感器所测量的介质中， 该传感器 组件安装尺寸较大， 应用场合受到限制， 另外， 这种传感器组件中通过改变传 感器探头长度来适应不同温度测量的要求， 这意味着对不同测量场合需根据需 求进行注模制作不同长度的传感器探头， 制作复杂且成本高昂。
[0009] 申请内容
[0010] 为此， 本申请正是要解决上述技术问题， 从而提出一种结构紧凑、 尺寸小、 易 于组装、 成本低廉的温度-压力一体式传感器。
[0011] 为解决上述技术问题， 本申请的技术方案为：
[0012] 本申请提供一种温度-压力一体式传感器， 其包括顺次连接的电气连接件、 压 力传感器元件、 基体组件， 所述压力传感器元件与所述电气连接件之间设置有 柔性调理电路板， 所述压力传感器元件与所述柔性调理电路板电连接， 所述柔 性调理电路板连接有一导电延伸部， 所述导电延伸部由压力传感器元件顶端延 伸至所述基体组件底端， 所述导电延伸部底端设置有温度传感器元件。
[0013] 作为优选， 还包括壳体部件， 所述壳体部件包括一容置腔和与所述容置腔连通 的探针， 所述容置腔用于容纳所述柔性调理电路板、 压力传感器元件、 基体组 件和部分电气连接件， 所述导电延伸部经压力传感器元件、 基底组件延伸至所 述探针内底部。
[0014] 作为优选， 所述压力传感器组件包括基座和设置于所述基座底面的感压膜， 所 述柔性调理电路板设置于所述基座顶面。
[0015] 作为优选， 所述基体组件包括圆柱形基体和设置于所述圆柱形基体底部的两个 导流柱， 所述导流柱具有沿轴向设置的通孔， 用于将测试流体导向所述压力传 感器元件， 所述压力传感器元件设置于所述圆柱形基体顶部。
[0016] 作为优选， 所述圆柱形基体侧壁和底面设置有用于容置所述导电延伸部的竖直 导向槽和水平导向槽； 所述电气连接件具有与所述竖直导向槽相适配的卡接部 ， 所述卡接部卡合于所述竖直导向槽。
[0017] 作为优选， 每个所述导流柱外壁设置有安装沟槽， 所述安装沟槽内设置有第一 密封圈； 所述圆柱形基体与所述压力传感器元件之间设置有第二密封圈。 [0018] 作为优选， 所述壳体部件对应于所述导流柱的位置设置有用于安装所述导流柱 的沉孔， 所述沉孔底部设置有与所述沉孔连通的用于导入测试流体的流道。
[0019] 作为优选， 所述探针为底端封闭的中空圆柱形探针， 所述探针外部设置有加强 层， 所述探针内底部设置有导热材料层， 所述导热材料层包裹于所述温度传感 器元件外部。
[0020] 作为优选， 所述导电延伸部与所述柔性调理电路板一体成型且可自由弯折， 所 述导电延伸部紧贴所述竖直导向槽和水平导向槽设置并向远离所述压力传感器 元件的方向弯折、 延伸， 垂直于所述圆柱形基体底面中心处， 所述导电延伸部 通过一工字扣固定于所述水平导向槽。
[0021] 作为优选， 所述圆柱形基体侧壁还设置有两个安装卡槽， 所述电气连接件具有 与所述安装卡槽适配的卡接件， 所述电气连接件与所述安装卡槽卡扣式连接。
[0022] 本申请的上述技术方案相比现有技术具有以下优点：
[0023] 本申请所述的温度-压力一体式传感器， 其包括顺次连接的电气连接件、 压力 传感器元件、 基体组件， 所述压力传感器元件与所述电气连接件之间设置有柔 性调理电路板， 所述压力传感器元件与所述柔性调理电路板电连接， 所述柔性 调理电路板连接有一导电延伸部， 所述导电延伸部底端设置有温度传感器元件 ， 所述导电延伸部由压力传感器元件顶端延伸至所述基体组件底端。 其中柔性 调理电路板与压力传感器单元、 温度传感器单元的耦合实现了柔性调理电路对 压力信号与温度信号的同时处理与转换， 从而得到了温度、 压力集成式传感器 ， 其结构简单、 紧凑， 便于安装于测试环境中， 应用范围更广。 导电延伸部由 压力传感器元件、 基体组件的外部安装并延伸至基体组件下方， 解决了传统传 感器中穿线作业难以操作、 效率低、 容易损伤导线的问题， 其易于组装， 制作 效率高。 另外，中空圆柱形探针有效地防止了温度传感器元件暴露在被测介质中 ， 特别是带有腐蚀性的测量介质。
[0024] 附图说明
[0025] 为了使本申请的内容更容易被清楚的理解， 下面根据本申请的具体实施例并结 合附图， 对本申请作进一步详细的说明， 其中
[0026] 图 1是本申请实施例所述的温度-压力一体式传感器的分解示意图； [0027] 图 2是本申请实施例所述的温度-压力一体式传感器的截面图；
[0028] 图 3是本申请实施例所述的温度-压力一体式传感器另一方向截面图；
[0029] 图 4是本申请实施例所述的温度-压力一体式传感器的组装示意图；
[0030] 图 5是本申请实施例所述的温度 -压力一体式传感器中压力传感器元件与柔性调 理电路板的示意图；
[0031] 图 6是本申请实施例所述的温度 -压力一体式传感器未组装壳体部件时的示意图
[0032] 图中附图标记表示为： 1-电气连接件； 101-卡接部； 102 -卡接件； 2 -压力传感 器元件； 201-基座； 202 -感压膜； 3 -基体组件； 301-圆柱形基体； 302 -导流柱； 3 03 -竖直导向槽； 304 -水平导向槽； 305 -工字扣； 306 -安装沟槽； 307 -第一密封圈 ； 308 -第二密封圈； 309 -安装卡槽； 4 -柔性调理电路板； 401-导电延伸部； 5 -温 度传感器元件； 6 -壳体部件； 601 -容置腔； 602 -探针； 603 -流道； 604 -加强层； 6 05 -导热材料层； 606 -螺纹接口。
[0033] 具体实施方式
[0034] 本实施例提供一种温度-压力一体式传感器， 其是一种可同时测量压力信号与 温度信号的传感器， 所述一体式传感器如图 1-6所示， 包括由上至下顺次连接的 电气连接件 1、 压力传感器元件 2、 基体组件 3 , 所述压力传感器元件 2与所述电 气连接件 1之间设置有柔性调理电路板 4。
[0035] 其中所述电气连接件 1用于与其它机构实现电气连接所述电气连接件可根据需 求定制， 亦可为标准件， 如图 1所示， 所述电气连接件 1底部具有一容置空间， 所述柔性调理电路板 4设置于所述压力传感器元件 2顶面、 所述容置空间内， 所 述柔性调理电路板 4由聚酰亚胺材料等合适材料制得， 其具有高可靠性， 质地柔 软且具有一定韧度和强度， 可自由弯折变形而不被损坏， 所述柔性调理电路板 4 一体成型连接有一导电延伸部 401， 所述导电延伸部 401材质与柔性调理电路板 4 本体一致， 也为聚酰亚胺材料等合适材料， 由于其具有一定韧性和强度， 可按 照设计需求自由弯折为一定形状， 所述导电延伸部 401底端设置有温度传感器元 件 5 , 所述温度传感器元件 5可以为铂薄膜温度传感器， 其通过贴片或其它可靠 连接方式连接于所述导电延伸部 401底端。 本实施例所述的传感器通过将柔性调 理电路板 4与压力传感器元件 2和温度传感器元件 5耦合， 实现了柔性调理电路板 4对压力信号与温度信号的同时处理与转换， 是一种可同时检测压力和温度信号 的传感器。
[0036] 如图 1-2所示， 所述压力传感器元件 2包括一基座 201， 所述基座 201底面 （远离 所述电气连接件的表面） 设置有感压膜 202, 所述基座 201为圆柱体形状， 对应 的感压膜 202为圆形， 感压膜所述柔性调理电路板 4设置于所述基座 201顶面， 如 图 1所示， 所述导电延伸部 401贴覆所述基座 201顶面、 侧面向下弯折延伸。 其中 ， 所述压力传感器元件 2可为陶瓷电容式传感器元件， 亦可为陶瓷压阻式传感器 元件或其他合适传感器元件。
[0037] 如图 1-4所示， 所述基体组件 3包括圆柱形基体 301， 所述圆柱形基体 301底部设 置有两个圆柱形导流柱 302， 所述圆柱形基体 301和导流柱 302可通过塑料注模成 型制得， 生产成本低廉。 所述压力传感器元件 2设置于所述圆柱形基体 301顶部 ， 所述圆柱形基体 301对应于所述导流柱 302的位置设置有通孔， 所述导流柱 302 也为中空圆柱， 具有沿导流柱 302轴向设置的通孔， 使得所述导流柱 302与所述 圆柱形基体 201连通， 为将测量介质导入圆形感压膜 202提供了必要路径。
[0038] 所述圆柱形基体 301侧壁和底面设置有用于容置所述导电延伸部 401的竖直导向 槽 303和水平导向槽 304， 所述导电延伸部 401由基座 201顶面延伸并折弯至基座 2 01侧壁， 然后贴覆于所述竖直导向槽 303向下延伸至圆柱形基体 301底面， 弯折 并贴覆水平导向槽 304延伸至圆柱形基体 301中心位置， 再次弯折， 竖直向下延 伸， 最终与所述圆柱形基体 301底面垂直设置。 所述竖直导向槽 303、 水平导向 槽 304的宽度尺寸与所述导电延伸部 401相适配， 将导电延伸部容纳与竖直导向 槽 303与水平导向槽 304中， 为充分固定所述导电延伸部 401， 还包括一与所述水 平导向槽 304向适配的工字扣 305， 所述工字扣 305与所述水平导向槽 304稍紧配 合， 使得导电延伸部可更紧密地安装于导向沟槽内折弯定型， 不会随意晃动或 掉落， 配合后， 工字扣 305的底面与所述水平导向槽 304外底面持平， 并且， 所 述工字扣 305可与圆柱形基体 301同时注塑成型， 无需单独开模或用其它方式加 工成型， 降低了生产成本。
[0039] 为了将电气连接件 1与基体组件 3组装， 所述电气连接件 1具有与所述竖直导向 槽 303尺寸相适配的卡接部 101， 所述卡接部 101与所述竖直导向槽 303间隙配合 ， 卡接部 101与竖直导向槽 303在导向槽深度方向的间隙至少可容纳所述导电延 伸部 401的厚度， 卡接部 101将导电延伸部 401固定在竖直导向槽 303内， 进一步 提高了导电延伸部 401安装的稳定性。
[0040] 所述圆柱形基体 301侧壁还设置有两个安装卡槽 309 , 所述电气连接件 1具有与 所述安装卡槽 309相适配的卡接件 102, 所述卡接件 102与所述安装沟槽 309卡扣 式连接， 从而使电气连接件 1与圆柱形基体 301连接牢固。
[0041] 由于所述传感器通常用来检测流体压力及温度， 因此需保证传感器的密封性， 为达到这一目的， 每个所述导流柱 302外壁开设有安装沟槽 306 , 所述安装沟槽 3 06内安装有第一密封圈 307， 所述圆柱形基体 301顶部具有一容积部， 所述容积 部内安装有第二密封圈 308 , 所述压力传感器元件 2设置于所述第二密封圈 308顶 部 （即所述第二密封圈设置于所述压力传感器元件 2与圆柱形基体 3之间） ， 起 到测量介质的密封效果， 防止测量介质进入压力传感器元件 2和柔性调理电路板 4对其造成破坏。
[0042] 进一步地， 还包括壳体部件 6 , 所述壳体部件 6包括一杯型容置腔 601和与所述 容置腔 601连通的圆柱形中空探针 602, 所述容置腔 601用于容纳整个柔性调理电 路板 4、 压力传感器元件 2、 基体组件 3和部分电气连接件 1， 所述导电延伸部 401 经压力传感器组件 2、 基底组件 3由容置腔 601延伸至中空探针 602内底部。 所述 壳体部件 6内、 所述杯型容置腔 601底部对应于所述导流柱 302的位置设置有用于 安装所述导流柱 302的沉孔， 所述沉孔为所述导流柱 302提供了安装空间， 并起 到导向作用， 所述沉孔底部设置有与所述沉孔连通的用于导入测量介质的流道 6 03 , 所述流道 603—端与外界连通、 另一端通过沉孔与所述导流柱 302连通。 所 述壳体部件 6可以由不锈钢、 铜等材质制成。
[0043] 为提高传感器的使用寿命， 所述探针 602外部还可设置一层加强层 604, 所述加 强层 604为与所述壳体 6和探针 602—体加工成型的金属层， 防止传感器跌落将探 针 602损伤， 所述探针 602与所述杯型容置腔 601通过机加工方式一体成型， 无需 额外开注模或冲压模制造， 制造工艺简单， 且传感器外形尺寸得到有效缩减， 占用空间更小。 所述探针 602内底部设置有导热材料层 605， 所述导热材料层 605 至少填充探针 602内 1/3的容量， 且所述导热材料层 605包裹于所述温度传感器元 件 5外部， 所述导热材料层可由导热硅胶、 导热陶瓷或导热金属制得本实施例中 采用导热胶， 导热胶固化后能充分填充探针内部。 本实施例所述的封闭式探针 有效地防止了温度传感器元件暴露在被测介质中， 特别是带有腐蚀性的测量介 质。
[0044] 如图所示， 所述壳体部件 6还具有一螺纹接口 606， 所述螺纹接口 606设置于所 述容置腔 601外底部， 用于将传感器安装到设备上或其它测量系统中。
[0045] 显然， 上述实施例仅仅是为清楚地说明所作的举例， 而并非对实施方式的限定 。 对于所属领域的普通技术人员来说， 在上述说明的基础上还可以做出其它不 同形式的变化或变动。 这里无需也无法对所有的实施方式予以穷举。 而由此所 引伸出的显而易见的变化或变动仍处于本申请创造的保护范围之中。
发明概述
技术问题
问题的解决方案
发明的有益效果

Claims

权利要求书
[权利要求 1] 一种温度-压力一体式传感器， 其特征在于， 包括顺次连接的电气连 接件、 压力传感器元件、 基体组件， 所述压力传感器元件与所述电气 连接件之间设置有柔性调理电路板， 所述压力传感器元件与所述柔性 调理电路板电连接， 所述柔性调理电路板连接有一导电延伸部， 所述 导电延伸部由压力传感器元件顶端延伸至所述基体组件底端， 所述导 电延伸部底端设置有温度传感器元件。
[权利要求 2] 根据权利要求 i所述的温度-压力一体式传感器， 其特征在于， 还包括 壳体部件， 所述壳体部件包括一容置腔和与所述容置腔连通的探针， 所述容置腔用于容纳所述柔性调理电路板、 压力传感器元件、 基体组 件和部分电气连接件， 所述导电延伸部经压力传感器元件、 基底组件 延伸至所述探针内底部。
[权利要求 3] 根据权利要求 1或 2所述的温度-压力一体式传感器， 其特征在于， 所 述压力传感器元件包括基座和设置于所述基座底面的感压膜， 所述柔 性调理电路板设置于所述基座顶面。
[权利要求 4] 根据权利要求 3所述的温度-压力一体式传感器， 其特征在于， 所述基 体组件包括圆柱形基体和设置于所述圆柱形基体底部的两个导流柱， 所述导流柱具有沿轴向设置的通孔， 用于将测试流体导向所述压力传 感器元件， 所述压力传感器元件设置于所述圆柱形基体顶部。
[权利要求 5] 根据权利要求 4所述的温度-压力一体式传感器， 其特征在于， 所述圆 柱形基体侧壁和底面设置有用于容置所述导电延伸部的竖直导向槽和 水平导向槽； 所述电气连接件具有与所述竖直导向槽相适配的卡接部 ， 所述卡接部卡合于所述竖直导向槽。
[权利要求 6] 根据权利要求 5所述的温度-压力一体式传感器， 其特征在于， 每个所 述导流柱外壁设置有安装沟槽， 所述安装沟槽内设置有第一密封圈； 所述圆柱形基体与所述压力传感器元件之间设置有第二密封圈。
[权利要求 7] 根据权利要求 6所述的温度-压力一体式传感器， 其特征在于， 所述壳 体部件对应于所述导流柱的位置设置有用于安装所述导流柱的沉孔， 所述沉孔底部设置有与所述沉孔连通的用于导入测试流体的流道。
[权利要求 8] 根据权利要求 7所述的温度-压力一体式传感器， 其特征在于， 所述探 针为底端封闭的中空圆柱形探针， 所述探针外部设置有加强层， 所述 探针内底部设置有导热材料层， 所述导热材料层包裹于所述温度传感 器元件外部。
[权利要求 9] 根据权利要求 8所述的温度-压力一体式传感器， 其特征在于， 所述导 电延伸部与所述柔性调理电路板一体成型且可自由弯折， 所述导电延 伸部紧贴所述竖直导向槽和水平导向槽设置并向远离所述压力传感器 元件的方向弯折、 延伸， 垂直于所述圆柱形基体底面中心处， 所述导 电延伸部通过一工字扣固定于所述水平导向槽。
[权利要求 10] 根据权利要求 9所述的温度-压力一体式传感器， 其特征在于， 所述圆 柱形基体侧壁还设置有两个安装卡槽， 所述电气连接件具有与所述安 装卡槽适配的卡接件， 所述卡接件与所述安装卡槽卡扣式连接。
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