WO2019232792A1 - Three-dimensional tomography systems and method - Google Patents

Three-dimensional tomography systems and method Download PDF

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Publication number
WO2019232792A1
WO2019232792A1 PCT/CN2018/090456 CN2018090456W WO2019232792A1 WO 2019232792 A1 WO2019232792 A1 WO 2019232792A1 CN 2018090456 W CN2018090456 W CN 2018090456W WO 2019232792 A1 WO2019232792 A1 WO 2019232792A1
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WO
WIPO (PCT)
Prior art keywords
light beam
light
frequency
signal
diffraction
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Application number
PCT/CN2018/090456
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French (fr)
Chinese (zh)
Inventor
祁春超
潘子祥
谭信辉
刘艳丽
Original Assignee
深圳市华讯方舟太赫兹科技有限公司
华讯方舟科技有限公司
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Application filed by 深圳市华讯方舟太赫兹科技有限公司, 华讯方舟科技有限公司 filed Critical 深圳市华讯方舟太赫兹科技有限公司
Priority to PCT/CN2018/090456 priority Critical patent/WO2019232792A1/en
Publication of WO2019232792A1 publication Critical patent/WO2019232792A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3581Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
    • G01N21/3586Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation by Terahertz time domain spectroscopy [THz-TDS]

Definitions

  • the present application relates to the technical field of material detection, and in particular, to a three-dimensional tomography system and method.
  • infrared light detection and X-ray detection can be used to three-dimensionally image the material to detect whether there is a defect in the internal structure of the material.
  • the rays used by these methods have a short depth of field, and the resolution of the detection image is low.
  • the structure, especially the internal structure of composite materials, has low detection accuracy.
  • the present application mainly provides a three-dimensional tomography system and method, which can improve the accuracy of material detection.
  • a technical solution adopted in the present application is to provide a three-dimensional tomography method, which includes: using a transmitter to emit a first light beam to a non-diffraction device, wherein the first light beam is too small at a frequency of not less than 0.5 THz.
  • the light-condensing device is disposed on the light-exiting side of the non-diffraction device, a through-hole is formed on the light-concentrating device, and the second light beam is transmitted to the scanning device through the through-hole; the receiver receives the third light beam collected by the light-concentrating device, and the receiver
  • the light-condensing device is arranged in the light-concentrating area of the light-concentrating device; the three-dimensional image of the material to be inspected is constructed using the information of the third light beam; wherein the light-concentrating device is a concave mirror, the reflective surface of the concave mirror faces the scanning device, and the diameter of the through hole is 0.3 mm.
  • a three-dimensional tomography imaging system which includes: a non-diffractive device, a light-concentrating device, a scanning device, and a receiver; A light beam is condensed into a second light beam; the light condensing device is arranged on the light-emitting side of the non-diffraction device; a through hole is formed in the light condensing device; the second light beam is radiated to the scanning device through the through hole;
  • the scanning method reflects the material to be inspected, and reflects the third beam reflected by the inspected material to the light-concentrating device; the receiver is arranged in the light-concentrating area of the light-concentrating device, and is used for receiving the third light beam condensed by the light-concentrating device to utilize The information of the third light beam constructs a three-dimensional image of the inspected material.
  • a three-dimensional tomography method which includes: using a non-diffraction device to converge an incident first light beam into a second light beam; using a scanning device to condense the second light beam Reflected to the test material in a scanning manner, and reflected the third light beam reflected by the test material to the light-concentrating device, where the light-concentrating device is arranged on the light exit side of the non-diffraction device, a through-hole is formed on the light-concentrating device, and the second light beam The through-hole is radiated to the scanning device; the receiver is used to receive the third light beam condensed by the light-condensing device, and the receiver is arranged in the light-concentrating area of the light-condensing device;
  • a non-diffractive device is used to converge the incident first light beam into a second light beam;
  • a scanning device is used to reflect the second light beam in a scanning manner To the inspected material, and the third beam reflected by the inspected material is reflected to the light-concentrating device, and the receiver set in the light-concentrating area of the light-concentrating device receives the third light beam condensed by the light-concentrating device to use the information of the third light beam Construct a three-dimensional image of the inspected material, so that using a non-diffractive device, the first beam can be converged into a second beam that is approximately non-diffracted, so that the second beam does not diverge and light during the subsequent propagation and scanning to the inspected material
  • the field energy is highly concentrated, and the size of the central bright spot is small, so that the resolution of the three-dimensional image of the inspected material constructed by using the information of the third beam after scanning is high,
  • FIG. 1 is a schematic structural diagram of a first embodiment of a three-dimensional tomography system of the present application
  • FIG. 2 is a schematic structural diagram of a second embodiment of a three-dimensional tomography system of the present application.
  • FIG. 3 is a schematic structural diagram of a transmitter and a receiver in a second embodiment of the three-dimensional tomography system of the present application;
  • FIG. 4 is a schematic structural diagram of a third embodiment of a three-dimensional tomography system of the present application.
  • FIG. 5 is a schematic flowchart of an embodiment of a three-dimensional tomography method according to the present application.
  • FIG. 6 is a detailed flowchart of each step in FIG. 5.
  • the first embodiment of the three-dimensional tomography system 10 of the present application includes: a non-diffraction device 101, a light condensing device 102, a scanning device 103, and a receiver 104.
  • the non-diffraction device 101 is used for converging the incident first light beam into a second light beam; the light-concentrating device 102 is disposed on the light-exiting side of the non-diffraction device 101; a through-hole 1021 is formed in the light-concentrating device 102; 1021 hits the scanning device 103; the scanning device 103 is configured to scan the second light beam to the test material A in a scanning manner, and reflect the third light beam reflected by the test material A to the light collecting device 102; the receiver 104 is provided at the light collecting device 102
  • the light-condensing area of the optical device 102 is configured to receive a third light beam condensed by the light-concentrating device 102 to construct a three-dimensional image of the material A to be inspected by using the information of the third light beam.
  • the non-diffraction device 101 is a device for converging an incident first light beam into an approximately non-diffraction light beam, that is, the second light beam is an approximately non-diffraction light beam, such as a non-diffraction Bessel beam.
  • the non-diffraction device 101 may be a lens or a lens combination capable of generating an approximately non-diffractive light beam, and may use a super-surface material, high-density polyethylene (high-density) Polyethylene (HDPE), Polytetrafluoroethylene (PTFE), Polypropylene or Poly 4-methylpentene-1 (TPX) and other materials are not limited here.
  • the type of the non-diffraction device 101 can be specifically selected according to the frequency of the incident first light beam. For example, when the incident first light beam is terahertz light, the non-diffraction device 101 can select a non-diffraction lens in the terahertz frequency band.
  • the first light beam may be a collimated light beam directly generated by a light source, such as a laser beam, or a collimated light beam processed by some devices after the light source is generated.
  • the first light beam may penetrate the material A to be inspected. Rays, such as terahertz light.
  • the tested material can be a composite material with high quality requirements, or it can be other (non-polar) material, which is not specifically limited here. The thickness of the tested material will affect the penetrability of the light beam and is generally not greater than 10 cm.
  • the condensing device 102 may be a concave mirror, or a combination of a condensing lens and a reflecting mirror.
  • the concave mirror or the reflecting mirror is formed with a through hole 1021 through which the second light beam may enter the scanning device 103.
  • the size of the through hole 1021 is not smaller than the size of the light spot generated by the second light beam.
  • the light-concentrating area of the light-concentrating device 102 may be a light-condensing point or a light-concentrating area, which depends on the specific type of the light-concentrating device 102, and is not specifically limited here.
  • the scanning device 103 may be a three-dimensionally movable mirror, or may be a set of galvanometers that can change the exit direction of the second light beam, so that the emitted second light beam is reflected to the surface of the material A in a scanning manner.
  • the scanning frequency of the scanning device 103 can be set according to actual requirements such as imaging time and material size. For example, when the size of the inspected material A is 50cm * 50cm * 10cm and the central spot of the second beam is 0.3mm, controlling the scanning frequency of the scanning device 103 can make the imaging time not longer than 5s and the imaging resolution It reaches 0.3 * 0.3 * 1.5mm.
  • the receiver 104 may include a detector and a signal processor, wherein the detector may detect and receive the third light beam, and the signal processor may acquire information in the received third light beam to construct a three-dimensional image of the material A to be inspected.
  • a collimated first light beam generated by a light source is incident on the non-diffraction device 101, and is converged by the non-diffraction device 101 into a nearly non-diffraction second light beam, and the second light beam passes through the condensing
  • the through hole 1021 on the device 102 is incident on the scanning device 103, and the scanning device 103 reflects the second light beam to the surface of the material A to be inspected, wherein the scanning device 103 can be moved, so that the exit direction of the second light beam can be changed
  • the second light beam can be reflected in a scanning manner on the surface of the material A to be inspected.
  • the second light beam is reflected and transmitted on the surface of the material A to be inspected, and the flatness, reflectance, and refractive index of the material at different positions of the material to be inspected A are different, and there may be defects in the internal defects.
  • the second light beam is absorbed or reflected to different degrees. Therefore, the information (phase and intensity information) in the third light beam finally reflected back to the scanning device 103 can reflect the structure of the inspected material A.
  • the third light beam is reflected to the scanning device 103, it is reflected by the scanning device 103 to the light-concentrating device 102.
  • the light-concentrating device 102 converges the incident third light beam into the light-concentrating area and is set in the light-concentrating area.
  • the receiver 104 After the receiver 104 receives the third beam using the detector, its signal processor can extract the information in the third beam, so that according to the phase and intensity information in the third beam, it can analyze and know that each position should be
  • the internal structure of the inspection material A can further form a three-dimensional image of the inspection material A.
  • a non-diffraction device is used to converge the incident first light beam into a second light beam; a scanning device is used to reflect the second light beam to the test material in a scanning manner, and a third light beam reflected by the test material is reflected to the light beam.
  • the optical device receives a third light beam collected by the light-condensing device by a receiver provided in the light-concentrating area of the light-concentrating device, and uses the information of the third light beam to construct a three-dimensional image of the inspected material.
  • the light beam converges into a second beam with almost no diffraction, so that the second beam does not diverge during subsequent propagation and scanning to the detected material, the light field energy is highly concentrated, and the size of the central bright spot is small.
  • the three-dimensional image of the tested material constructed by the information of the light beam has high resolution and improves the accuracy of material detection.
  • the three-dimensional tomography system may further include a light source, that is, a transmitter, which may emit the first light beam.
  • the second embodiment of the three-dimensional tomography system 20 of the present application is based on the first embodiment of the three-dimensional tomography system of the present application, and further includes: a transmitter 100, which is disposed at The light incident side of the diffractive device 101 is configured to emit a first light beam to the non-diffractive device 101.
  • Light waves in the terahertz band not only have good penetrating properties for materials, but also have low photon energy, which will not cause harmful ionization reactions. It can realize non-destructive testing of materials, and is especially suitable for composite materials with high quality requirements and high manufacturing costs. Detection.
  • the transmitter 100 may use a terahertz optical transmitter to form a first light beam in the terahertz frequency band, wherein the frequency of the first light beam is not less than 0.5 THz.
  • the non-diffraction device 101 is a non-diffraction lens, such as a PTFE lens in a terahertz frequency band.
  • the non-diffraction lens 101 can focus the first incident parallel light beam into a second non-diffraction light beam (vortex light), wherein the depth of field of the second light beam is not less than 1.5 m, and the diameter of the central spot can be 0.3 mm.
  • the light condensing device 102 is a concave mirror, the reflective surface of the concave mirror faces the scanning device 103, and the diameter of the through hole formed in the concave mirror is not less than 0.3 mm, so that the second light beam can pass through the through hole
  • the concave mirror can be made of the same material as the non-diffraction device 101, such as a PTFE material.
  • the size of the through hole can be set according to actual needs, and is usually a millimeter level, for example, 0.1 mm to 3 mm.
  • the transmitter 100 may use solid-state electronic technology to form a terahertz solid-state transmitting front end.
  • the receiver 104 may also use solid-state electronic technology to form a terahertz solid-state receiving front-end.
  • a frequency doubling technology may be used to multiply a lower frequency signal to a required terahertz frequency band.
  • the transmitter 100 includes a signal source 1001, a first frequency multiplier 1002, and a transmitting antenna 1003.
  • the signal source 1001 is used to generate a local oscillator signal, and the frequency of the local oscillator signal is lower than the frequency of the first beam;
  • the first frequency multiplier 1002 is connected to the signal source 1001 and is used to raise the frequency of the local oscillator signal to the terahertz frequency band, so as to A first light beam is formed;
  • the transmitting antenna 1003 is connected to the first frequency multiplier 1002 and is used for transmitting the first light beam.
  • the first frequency multiplier 1002 may be formed by connecting multiple frequency multipliers (such as a second frequency multiplier, a fourth frequency multiplier, etc.) in series. Specifically, the type and number of frequency multipliers are selected according to the required frequency multiplier. No specific restrictions are made here.
  • the signal source 1001 can generate a 12.5 GHz local oscillator signal.
  • the frequency required for the first light beam is 600 GHz (that is, 0.6 THz).
  • the frequency multiplier of the first frequency multiplier 1002 is 48. Times, a third frequency multiplier and two four frequency multipliers can be used in series to form the first frequency multiplier 1002.
  • two second frequency multipliers, a fourth frequency multiplier, and a third frequency multiplier can also be used.
  • the first frequency multiplier 1002 is formed in series, or a third frequency multiplier and a sixteen frequency multiplier are connected in series to form the first frequency multiplier 1002, or a second frequency multiplier, a third frequency multiplier, and a The eight multiplier is connected in series to form the first multiplier 1002.
  • frequency multipliers with other frequency multipliers may also be used, as long as signals of a desired frequency band can be obtained.
  • the transmitting antenna 1003 After receiving the signal outputted by the first frequency multiplier 1002 by the transmitting antenna 1003, the transmitting antenna 1003 can form the signal into a first light beam and transmit it to the non-diffraction device 101.
  • the receiver 104 specifically includes a receiving antenna 1041, a baseband signal source 1042, a modulator 1043, a second frequency multiplier 1044, a mixer 1045, and a signal processing device 1046.
  • the baseband signal source 1042 is used to generate a low-frequency baseband signal, and the frequency of the low-frequency baseband signal is lower than the frequency of the local oscillator signal; the input end of the modulator 1043 is connected to the signal source 1001 and the baseband signal source 1042 respectively, and the output end is connected to the second frequency multiplier.
  • the processing device 1046 is connected to the mixer 1045 and is configured to process the mixed low-frequency signal to obtain information of the third light beam for imaging.
  • the receiving antenna 1041 can receive a third beam and generate a third beam signal.
  • the frequency of the first beam emitted by the transmitting antenna is 600 GHz (that is, 0.6 THz)
  • the frequency of the third beam It is also 600GHz.
  • the baseband signal source 1042 generates a 1MHz low-frequency baseband signal.
  • the modulator 1043 obtains a 12.5GHz local oscillator signal generated by the signal source 1001 of the transmitter 100, and modulates the 1MHz baseband signal onto the 12.5GHz local oscillator signal to form 12.501. GHz signals.
  • the frequency multiplier number of the second frequency multiplier 1044 is the same as that of the first frequency multiplier 1002, both of which are 48 times.
  • a signal of 600.048GHz can be obtained.
  • the second frequency multiplier 1044 A form in which multiple frequency multipliers are connected in series may also be adopted, and the structure may be the same as or different from the first frequency multiplier 1002, as long as the frequency multipliers are the same. Due to the convenience of low frequency signal processing, the mixer 1045 obtains a signal of 600.048 GHz and a signal of the third beam of 600 GHz and then performs mixing to obtain a low frequency signal of 48 MHz. The low frequency signal retains the information of the third beam.
  • phase information and intensity information can be extracted from the low-frequency signal, so that the three-dimensional material A can be constructed based on the phase information and intensity information reflecting the structure of the material A to be inspected.
  • the image can further intuitively determine from the three-dimensional image whether there is a defect in the material A to be inspected.
  • the signal processing device 1046 includes: an orthogonal signal (I / Q) demodulator 10461, an analog-to-digital converter (A / D) 10462, and a field connected in sequence.
  • the orthogonal signal demodulator 10461 is used to demodulate the low frequency signal; the analog-to-digital converter 10462 is used to convert the demodulated low frequency signal into a digital signal; the field programmable gate array 10463 is used to collect the digital Data in the signal; the imaging circuit 10464 is used to construct a three-dimensional image of the material A to be inspected using the collected data.
  • the signal processing device 1046 first uses the I / Q signal demodulator 10461 to convert the low-frequency signal. After demodulation, the A / D converter 10462 is used to convert the demodulated analog low-frequency signal into a digital signal, and then FPGA circuit 10463 is used to collect the data (such as phase and amplitude information) in the digital signal. Finally, the imaging circuit 10464 can The collected data is used to analyze the internal structure of the inspected material A, and finally a three-dimensional image of the inspected material A is constructed.
  • the receiver 104 may also be directly connected to an independent imaging device, and the independent imaging device constructs a three-dimensional image of the material A to be inspected according to the information of the third light beam.
  • a terahertz band optical transmitter is used to transmit a first light beam in the terahertz frequency range to a non-diffractive device.
  • the non-diffraction device converges the incident first light beam into a second light beam
  • the scanning device is used to scan the second light beam.
  • the method reflects the material to be inspected, and reflects the third beam reflected by the inspected material to the light-concentrating device, and a receiver provided in the light-concentrating area of the light-concentrating device receives the third light beam condensed by the light-concentrating device to use the third light beam.
  • the three-dimensional image of the inspected material is constructed based on the information of the inspected material, so that the non-diffraction device can be used to converge the first beam into a second beam that is approximately non-diffracted, so that the second beam does not diverge during subsequent propagation and scanning to the inspected material
  • the light field energy is highly concentrated and the size of the central bright spot is small, so that the three-dimensional image of the inspected material constructed by using the information of the third beam after scanning is high in resolution, improving the accuracy of material detection, and using the strong penetration of the terahertz band beam
  • the characteristics of permeability and low photon energy can penetrate the test material with higher thickness without damaging the test material and realize non-destructive testing.
  • the third embodiment of the three-dimensional tomography system 30 of the present application is based on the first embodiment of the three-dimensional tomography system of the present application, and further defines the scanning device 103 as a scanning galvanometer, including the first A lens 1031 and a second vibrating lens 1032.
  • the first vibrating lens 1031 rotates in a first direction
  • the second vibrating lens 1032 rotates in a second direction perpendicular to the first direction, so that the second beam is scanned line by line or column by column.
  • ⁇ ⁇ A ⁇ Inspection material A is based on the first embodiment of the three-dimensional tomography system of the present application, and further defines the scanning device 103 as a scanning galvanometer, including the first A lens 1031 and a second vibrating lens 1032.
  • the first vibrating lens 1031 rotates in a first direction
  • the second vibrating lens 1032 rotates in a second direction perpendicular to the first direction, so that the second beam is scanned line by line or column by column.
  • the scanning mode of the second light beam may be scanning along a “Z” or “bow” shape.
  • the first vibrating lens 1031 may be a row-direction vibrating mirror, that is, after the first vibrating lens 1031 is rotated, the exit direction of the second light beam may be changed, so that the second beam is scanned in the row direction of the surface of the material A to be inspected; and
  • the second vibrating lens 1032 is a column direction vibrating mirror, that is, after the second vibrating lens 1032 is rotated, the exit direction of the second light beam can be changed, so that the second beam is scanned in the column direction of the surface of the material A to be inspected.
  • the first vibrating lens 1031 and the second vibrating lens 1032 can be set in parallel.
  • the first vibrating lens 1031 starts to rotate, and the second vibrating lens 1032 is not moved, and one line is scanned.
  • the second vibrating lens 1032 is rotated by a certain angle, and the first vibrating lens 1031 is not moved, so that the second light beam can be irradiated to the next line, and then the above steps are repeated until the inspected material A is scanned.
  • the first galvanometer lens 1031 may be a column direction galvanometer
  • the second galvanometer lens 1032 may be a row direction galvanometer.
  • the scanning method may also be column-by-column scanning, or other scanning methods. No specific restrictions are made here.
  • the light-concentrating device 102 may also be formed by using a combination of a plane reflecting mirror 1022 and a condenser lens 1023, wherein the reflecting surface of the plane reflecting mirror 1022 faces the scanning device 103 and the plane reflecting mirror 1022.
  • a through-hole 1021 is formed, and the first light beam can be incident on the scanning device 103 through the through-hole 1021, and the third light beam reflected by the scanning device 103 can be reflected by the reflecting surface of the plane mirror 1022.
  • the condenser lens 1023 is disposed in the reflection area of the plane mirror 1022, that is, the light exit side of the reflected light, and the receiver 104 is disposed in the condenser area (such as the focal position) of the condenser lens 1023.
  • the condenser lens 1023 The third light beam reflected by the plane mirror 1022 can be converged to the receiver 104, and processed by the receiver 104 after receiving.
  • the three-dimensional tomography system in this embodiment can also be combined with the second embodiment of the three-dimensional tomography system in this application.
  • the three-dimensional tomography method of the present application is applied to the three-dimensional tomography system of the present application.
  • the three-dimensional tomography method includes:
  • S101 Converge an incident first light beam into a second light beam using a non-diffraction device.
  • S102 Use the scanning device to reflect the second light beam to the test material in a scanning manner, and reflect the third light beam reflected by the test material to the light concentrating device.
  • the light-concentrating device is disposed on the light-exiting side of the non-diffraction device.
  • a through-hole is formed in the light-concentrating device, and the second light beam is transmitted to the scanning device through the through-hole.
  • S103 Use the receiver to receive the third light beam collected by the light-concentrating device.
  • the receiver is disposed in a light-concentrating area of the light-concentrating device.
  • S104 Use the information of the third light beam to construct a three-dimensional image of the test material.
  • the method further includes:
  • S100 Use the transmitter to emit the first light beam to the non-diffraction device.
  • the transmitter is disposed on the light incident side of the non-diffraction device, and the first light beam may be a light beam in a terahertz frequency band with a frequency of not less than 0.5 THz.
  • step S100 specifically includes:
  • S1001 Use the signal source to generate a local oscillator signal with a frequency lower than the frequency of the first beam.
  • S1002 Use the first frequency multiplier to multiply the local oscillator signal into a signal in the terahertz band.
  • S1003 Use a transmitting antenna to transform the signal in the terahertz frequency band into a collimated terahertz frequency band first light beam and transmit it to the terahertz non-diffraction lens.
  • step S101 specifically includes:
  • S1011 using a terahertz non-diffraction lens to condense the first light beam into an approximately non-diffraction second light beam in the terahertz frequency band.
  • step S102 specifically includes:
  • S1021 Control the scanning galvanometer to reflect the second light beam passing through the through hole on the concave mirror to the surface of the material to be inspected in a scanning manner.
  • S1022 Use a concave mirror to focus the third light beam reflected by the scanning galvanometer to a focal region.
  • the focus area is an area of a preset range centered on the focal point of the concave mirror.
  • step S103 specifically includes:
  • S1031 Use a receiving antenna to receive the third light beam reflected by the concave mirror
  • S1032 using a modulator to modulate a low-frequency baseband signal generated by a baseband signal source onto a local oscillator signal;
  • the frequency multiplier of the second frequency multiplier is the same as that of the first frequency multiplier.
  • S1034 Use a mixer to mix the frequency-multiplied signal with the received third beam signal to obtain a low-frequency signal.
  • the low-frequency signal carries information of the third light beam.
  • step S104 specifically includes:
  • S1041 Use the signal processing device to process the low-frequency signal to obtain phase and intensity information of the third light beam, and analyze the structure of the inspected material according to the phase and intensity information to construct a three-dimensional image of the inspected material.
  • a non-diffraction device is used to converge the incident first light beam into a second light beam; a scanning device is used to reflect the second light beam to the test material in a scanning manner, and a third light beam reflected by the test material is reflected to the light beam.
  • the optical device receives a third light beam collected by the light-condensing device by a receiver provided in the light-concentrating area of the light-concentrating device, and uses the information of the third light beam to construct a three-dimensional image of the inspected material.
  • the light beam converges into a second beam with almost no diffraction, so that the second beam does not diverge during subsequent propagation and scanning to the detected material, the light field energy is highly concentrated, and the size of the central bright spot is small.
  • the three-dimensional image of the tested material constructed by the information of the light beam has high resolution and improves the accuracy of material detection.

Abstract

Three-dimensional tomography systems (10, 20, 30) and a method, the systems (10, 20, 30) comprising: a non-diffractive device (101), a condensing device (102), a scanning device (103), and a receiver (104). The non-diffractive device (101) is used for condensing an incident first light beam into a second light beam; the condensing device (102) is disposed at a light emergent side of the non-diffractive device (101), the condensing device (102) is formed thereon with a through hole (1021), and the second light beam is emitted to the scanning device (103) by means of the through hole (1021); the scanning device (103) is used for reflecting the second light beam in a scanning manner to a material to be detected (A), and reflecting a third light beam reflected by the material to be detected (A) to the condensing device (102); and the receiver (104) is disposed in a condensing area of the condensing device (102) and used for receiving the third light beam condensed by the condensing device (102) so as to construct a three-dimensional image of the material to be detected (A) by using information of the third light beam. By means of the described manner, the accuracy of material detection may be improved.

Description

一种三维层析成像系统及方法 Three-dimensional tomography imaging system and method Ranch
【技术领域】[Technical Field]
本申请涉及材料检测技术领域,特别是涉及一种三维层析成像系统及方法。The present application relates to the technical field of material detection, and in particular, to a three-dimensional tomography system and method.
【背景技术】 【Background technique】
实际工业生产应用中,各种材料在生产制造过程中可能产生缺陷,引起质量问题,甚至导致采用该材料的整个结构件的报废,造成重大经济损失,尤其是应用于航空航天领域的各种复合材料,对材料质量要求更高,一旦采用的材料内部产生缺陷,将造成重大损失,甚至是发生重大事故。In actual industrial production applications, various materials may produce defects during the manufacturing process, cause quality problems, and even lead to the scrapping of the entire structural parts using the material, causing significant economic losses, especially in the various composites used in the aerospace field. Materials have higher requirements on the quality of materials. Once the internal defects of the materials used, major losses will occur, and even major accidents will occur.
目前可以利用红外光线检测、X射线检测等方法,对材料进行三维成像,从而检测材料内部结构是否存在缺陷,但这些方法所用射线的成像景深距离短,探测图像的分辨率较低,对材料内部结构,尤其是对复合材料内部结构的检测精度低。At present, methods such as infrared light detection and X-ray detection can be used to three-dimensionally image the material to detect whether there is a defect in the internal structure of the material. However, the rays used by these methods have a short depth of field, and the resolution of the detection image is low. The structure, especially the internal structure of composite materials, has low detection accuracy.
【发明内容】 [Summary of the Invention]
本申请主要提供一种三维层析成像系统及方法,能够提高材料检测的精度。The present application mainly provides a three-dimensional tomography system and method, which can improve the accuracy of material detection.
为解决上述技术问题,本申请采用的一个技术方案是:提供一种三维层析成像方法,包括:利用发射器发射第一光束至无衍射器件,其中第一光束是频率不小于0.5THz的太赫兹光;利用无衍射器件将入射的第一光束汇聚成第二光束;利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,其中聚光器件设置于无衍射器件的出光侧,聚光器件上形成有通孔,第二光束通过通孔射到扫描器件;利用接收器接收聚光器件汇聚的第三光束,其中接收器设置于聚光器件的聚光区;利用第三光束的信息构建被检材料的三维图像;其中,聚光器件是凹面镜,凹面镜的反射面朝向扫描器件,通孔的直径为0.3mm。In order to solve the above technical problem, a technical solution adopted in the present application is to provide a three-dimensional tomography method, which includes: using a transmitter to emit a first light beam to a non-diffraction device, wherein the first light beam is too small at a frequency of not less than 0.5 THz. Hertz light; using a non-diffractive device to converge the incident first light beam into a second light beam; using a scanning device to scan the second light beam to the test material in a scanning manner, and reflecting the third light beam reflected by the test material to the light collecting device Wherein, the light-condensing device is disposed on the light-exiting side of the non-diffraction device, a through-hole is formed on the light-concentrating device, and the second light beam is transmitted to the scanning device through the through-hole; the receiver receives the third light beam collected by the light-concentrating device, and the receiver The light-condensing device is arranged in the light-concentrating area of the light-concentrating device; the three-dimensional image of the material to be inspected is constructed using the information of the third light beam; wherein the light-concentrating device is a concave mirror, the reflective surface of the concave mirror faces the scanning device, and the diameter of the through hole is 0.3 mm.
为解决上述技术问题,本申请采用的另一个技术方案是:提供一种三维层析成像系统,包括:无衍射器件、聚光器件、扫描器件以及接收器;无衍射器件用于将入射的第一光束汇聚成第二光束;聚光器件设置于无衍射器件的出光侧,聚光器件上形成有通孔,第二光束通过该通孔射到扫描器件;扫描器件用于将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件;接收器设置于聚光器件的聚光区,用于接收聚光器件汇聚的第三光束,以利用第三光束的信息构建被检材料的三维图像。In order to solve the above technical problem, another technical solution adopted in the present application is to provide a three-dimensional tomography imaging system, which includes: a non-diffractive device, a light-concentrating device, a scanning device, and a receiver; A light beam is condensed into a second light beam; the light condensing device is arranged on the light-emitting side of the non-diffraction device; a through hole is formed in the light condensing device; the second light beam is radiated to the scanning device through the through hole; The scanning method reflects the material to be inspected, and reflects the third beam reflected by the inspected material to the light-concentrating device; the receiver is arranged in the light-concentrating area of the light-concentrating device, and is used for receiving the third light beam condensed by the light-concentrating device to utilize The information of the third light beam constructs a three-dimensional image of the inspected material.
为解决上述技术问题,本申请采用的又一个技术方案是:提供一种三维层析成像方法,包括:利用无衍射器件将入射的第一光束汇聚成第二光束;利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,其中聚光器件设置于无衍射器件的出光侧,聚光器件上形成有通孔,第二光束通过该通孔射到扫描器件;利用接收器接收聚光器件汇聚的第三光束,其中接收器设置于聚光器件的聚光区;利用第三光束的信息构建被检材料的三维图像。In order to solve the above technical problem, another technical solution adopted in the present application is to provide a three-dimensional tomography method, which includes: using a non-diffraction device to converge an incident first light beam into a second light beam; using a scanning device to condense the second light beam Reflected to the test material in a scanning manner, and reflected the third light beam reflected by the test material to the light-concentrating device, where the light-concentrating device is arranged on the light exit side of the non-diffraction device, a through-hole is formed on the light-concentrating device, and the second light beam The through-hole is radiated to the scanning device; the receiver is used to receive the third light beam condensed by the light-condensing device, and the receiver is arranged in the light-concentrating area of the light-condensing device;
本申请的有益效果是:区别于现有技术的情况,本申请的部分实施例中,利用无衍射器件将入射的第一光束汇聚成第二光束;利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,由设置于聚光器件聚光区的接收器接收聚光器件汇聚的第三光束,以利用第三光束的信息构建被检材料的三维图像,从而利用无衍射器件,可以将第一光束汇聚成近似无衍射的第二光束,使得该第二光束在后续传播和扫描到被检测材料的过程中不发散、光场能量高度集中、中心亮斑尺寸小,进而使得扫描后利用第三光束的信息构建的被检材料的三维图像分辨率高,提高材料检测的精度。The beneficial effects of this application are: different from the situation of the prior art, in some embodiments of this application, a non-diffractive device is used to converge the incident first light beam into a second light beam; a scanning device is used to reflect the second light beam in a scanning manner To the inspected material, and the third beam reflected by the inspected material is reflected to the light-concentrating device, and the receiver set in the light-concentrating area of the light-concentrating device receives the third light beam condensed by the light-concentrating device to use the information of the third light beam Construct a three-dimensional image of the inspected material, so that using a non-diffractive device, the first beam can be converged into a second beam that is approximately non-diffracted, so that the second beam does not diverge and light during the subsequent propagation and scanning to the inspected material The field energy is highly concentrated, and the size of the central bright spot is small, so that the resolution of the three-dimensional image of the inspected material constructed by using the information of the third beam after scanning is high, and the accuracy of the material detection is improved.
【附图说明】 [Brief Description of the Drawings]
图1是本申请三维层析成像系统第一实施例的结构示意图;FIG. 1 is a schematic structural diagram of a first embodiment of a three-dimensional tomography system of the present application;
图2是本申请三维层析成像系统第二实施例的结构示意图;2 is a schematic structural diagram of a second embodiment of a three-dimensional tomography system of the present application;
图3是本申请三维层析成像系统第二实施例中发射器和接收器的结构示意图;3 is a schematic structural diagram of a transmitter and a receiver in a second embodiment of the three-dimensional tomography system of the present application;
图4是本申请三维层析成像系统第三实施例的结构示意图;4 is a schematic structural diagram of a third embodiment of a three-dimensional tomography system of the present application;
图5是本申请三维层析成像方法一实施例的流程示意图;5 is a schematic flowchart of an embodiment of a three-dimensional tomography method according to the present application;
图6是图5中各步骤的具体流程示意图。FIG. 6 is a detailed flowchart of each step in FIG. 5.
【具体实施方式】【Detailed ways】
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In the following, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
如图1所示,本申请三维层析成像系统10第一实施例包括:无衍射器件101、聚光器件102、扫描器件103以及接收器104。As shown in FIG. 1, the first embodiment of the three-dimensional tomography system 10 of the present application includes: a non-diffraction device 101, a light condensing device 102, a scanning device 103, and a receiver 104.
无衍射器件101用于将入射的第一光束汇聚成第二光束;聚光器件102设置于无衍射器件101的出光侧,聚光器件102上形成有通孔1021,第二光束通过该通孔1021射到扫描器件103;扫描器件103用于将第二光束以扫描方式反射到被检材料A,并将被检材料A反射的第三光束反射到聚光器件102;接收器104设置于聚光器件102的聚光区,用于接收聚光器件102汇聚的第三光束,以利用第三光束的信息构建被检材料A的三维图像。The non-diffraction device 101 is used for converging the incident first light beam into a second light beam; the light-concentrating device 102 is disposed on the light-exiting side of the non-diffraction device 101; a through-hole 1021 is formed in the light-concentrating device 102; 1021 hits the scanning device 103; the scanning device 103 is configured to scan the second light beam to the test material A in a scanning manner, and reflect the third light beam reflected by the test material A to the light collecting device 102; the receiver 104 is provided at the light collecting device 102 The light-condensing area of the optical device 102 is configured to receive a third light beam condensed by the light-concentrating device 102 to construct a three-dimensional image of the material A to be inspected by using the information of the third light beam.
其中,无衍射器件101是将入射的第一光束汇聚成近似无衍射光束的器件,即该第二光束是近似无衍射光束,如无衍射贝塞尔光束。该无衍射器件101可以是能够产生近似无衍射光束的透镜或者透镜组合等,其可以采用超表面材料、高密度聚乙烯(high-density polyethylene,HDPE)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚丙烯或聚4-甲基戊烯-1(TPX)等材料制作,此处不做具体限定。该无衍射器件101的类型具体可以根据入射的第一光束的频率选择,例如入射的第一光束是太赫兹光时,该无衍射器件101可以选择太赫兹频段的无衍射透镜。Wherein, the non-diffraction device 101 is a device for converging an incident first light beam into an approximately non-diffraction light beam, that is, the second light beam is an approximately non-diffraction light beam, such as a non-diffraction Bessel beam. The non-diffraction device 101 may be a lens or a lens combination capable of generating an approximately non-diffractive light beam, and may use a super-surface material, high-density polyethylene (high-density) Polyethylene (HDPE), Polytetrafluoroethylene (PTFE), Polypropylene or Poly 4-methylpentene-1 (TPX) and other materials are not limited here. The type of the non-diffraction device 101 can be specifically selected according to the frequency of the incident first light beam. For example, when the incident first light beam is terahertz light, the non-diffraction device 101 can select a non-diffraction lens in the terahertz frequency band.
该第一光束可以是光源直接产生的准直光束,例如激光器产生的光束,也可以是光源产生后经过某些器件处理后的准直光束,该第一光束是可以穿透被检材料A的射线,如太赫兹光等。该被检材料可以是质量要求较高的复合材料,也可以是其他(非极性)材料,此处不做具体限定。该被检材料的厚度会影响光束的穿透性,一般不大于10cm。The first light beam may be a collimated light beam directly generated by a light source, such as a laser beam, or a collimated light beam processed by some devices after the light source is generated. The first light beam may penetrate the material A to be inspected. Rays, such as terahertz light. The tested material can be a composite material with high quality requirements, or it can be other (non-polar) material, which is not specifically limited here. The thickness of the tested material will affect the penetrability of the light beam and is generally not greater than 10 cm.
该聚光器件102可以是凹面镜,或者聚光透镜和反射镜的组合,其中凹面镜或反射镜上形成有一通孔1021,第二光束可以通过该通孔1021入射到扫描器件103。该通孔1021的尺寸不小于第二光束产生的光斑的尺寸。该聚光器件102的聚光区可以是一个聚光点,也可以是一个聚光区域,具体视聚光器件102的具体类型而定,此处不做具体限定。The condensing device 102 may be a concave mirror, or a combination of a condensing lens and a reflecting mirror. The concave mirror or the reflecting mirror is formed with a through hole 1021 through which the second light beam may enter the scanning device 103. The size of the through hole 1021 is not smaller than the size of the light spot generated by the second light beam. The light-concentrating area of the light-concentrating device 102 may be a light-condensing point or a light-concentrating area, which depends on the specific type of the light-concentrating device 102, and is not specifically limited here.
该扫描器件103可以是一可三维移动的反射镜,也可以是一组可改变第二光束出射方向的振镜,使得出射的第二光束以扫描方式反射到被检材料A表面。其中,该扫描器件103的扫描频率可以根据成像时间和材料尺寸等实际需求设置。例如,当该被检材料A的尺寸为50cm*50cm*10cm,且第二光束的中心光斑为0.3mm时,控制该扫描器件103的扫描频率,可以使得该成像时间不大于5s,成像分辨率达到0.3*0.3*1.5mm。The scanning device 103 may be a three-dimensionally movable mirror, or may be a set of galvanometers that can change the exit direction of the second light beam, so that the emitted second light beam is reflected to the surface of the material A in a scanning manner. The scanning frequency of the scanning device 103 can be set according to actual requirements such as imaging time and material size. For example, when the size of the inspected material A is 50cm * 50cm * 10cm and the central spot of the second beam is 0.3mm, controlling the scanning frequency of the scanning device 103 can make the imaging time not longer than 5s and the imaging resolution It reaches 0.3 * 0.3 * 1.5mm.
该接收器104可以包括探测器和信号处理器,其中探测器可以探测接收该第三光束,信号处理器可以获取接收到的第三光束中的信息,以构建被检材料A的三维图像。The receiver 104 may include a detector and a signal processor, wherein the detector may detect and receive the third light beam, and the signal processor may acquire information in the received third light beam to construct a three-dimensional image of the material A to be inspected.
具体地,在一个应用例中,光源产生的准直第一光束,入射到该无衍射器件101,由该无衍射器件101汇聚成近似无衍射的第二光束,该第二光束通过该聚光器件102上的通孔1021,入射到扫描器件103上,由该扫描器件103将该第二光束反射到被检材料A表面,其中该扫描器件103可以移动,从而可以改变第二光束的出射方向,控制该扫描器件103(如可三维方向移动的反射镜)的移动方向和移动角度,可以使得该第二光束以扫描方式反射到被检材料A表面。该第二光束会在被检材料A表面进行反射、透射,且由于被检材料A不同位置的材料平整度、材料的反射率、折射率等不尽相同,且内部缺陷可能存在缺陷等,不同位置该第二光束被吸收或反射的程度不同,因此,最终反射回到扫描器件103的第三光束中的信息(相位和强度等信息)可以反映该被检材料A的结构。该第三光束被反射到扫描器件103后,由该扫描器件103反射到聚光器件102,该聚光器件102会将射入的第三光束汇聚到聚光区,设置于该聚光区的接收器104利用探测器接收该第三光束后,其信号处理器可以提取该第三光束中的信息,以根据该第三光束中的相位和强度等信息,可以分析得知每个位置该被检材料A的内部结构,进而可以形成该被检材料A的三维图像。Specifically, in an application example, a collimated first light beam generated by a light source is incident on the non-diffraction device 101, and is converged by the non-diffraction device 101 into a nearly non-diffraction second light beam, and the second light beam passes through the condensing The through hole 1021 on the device 102 is incident on the scanning device 103, and the scanning device 103 reflects the second light beam to the surface of the material A to be inspected, wherein the scanning device 103 can be moved, so that the exit direction of the second light beam can be changed By controlling the moving direction and the moving angle of the scanning device 103 (such as a three-dimensionally movable mirror), the second light beam can be reflected in a scanning manner on the surface of the material A to be inspected. The second light beam is reflected and transmitted on the surface of the material A to be inspected, and the flatness, reflectance, and refractive index of the material at different positions of the material to be inspected A are different, and there may be defects in the internal defects. The second light beam is absorbed or reflected to different degrees. Therefore, the information (phase and intensity information) in the third light beam finally reflected back to the scanning device 103 can reflect the structure of the inspected material A. After the third light beam is reflected to the scanning device 103, it is reflected by the scanning device 103 to the light-concentrating device 102. The light-concentrating device 102 converges the incident third light beam into the light-concentrating area and is set in the light-concentrating area. After the receiver 104 receives the third beam using the detector, its signal processor can extract the information in the third beam, so that according to the phase and intensity information in the third beam, it can analyze and know that each position should be The internal structure of the inspection material A can further form a three-dimensional image of the inspection material A.
本实施例中,利用无衍射器件将入射的第一光束汇聚成第二光束;利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,由设置于聚光器件聚光区的接收器接收聚光器件汇聚的第三光束,以利用第三光束的信息构建被检材料的三维图像,从而利用无衍射器件,可以将第一光束汇聚成近似无衍射的第二光束,使得该第二光束在后续传播和扫描到被检测材料的过程中不发散、光场能量高度集中、中心亮斑尺寸小,进而使得扫描后利用第三光束的信息构建的被检材料的三维图像分辨率高,提高材料检测的精度。In this embodiment, a non-diffraction device is used to converge the incident first light beam into a second light beam; a scanning device is used to reflect the second light beam to the test material in a scanning manner, and a third light beam reflected by the test material is reflected to the light beam. The optical device receives a third light beam collected by the light-condensing device by a receiver provided in the light-concentrating area of the light-concentrating device, and uses the information of the third light beam to construct a three-dimensional image of the inspected material. The light beam converges into a second beam with almost no diffraction, so that the second beam does not diverge during subsequent propagation and scanning to the detected material, the light field energy is highly concentrated, and the size of the central bright spot is small. The three-dimensional image of the tested material constructed by the information of the light beam has high resolution and improves the accuracy of material detection.
在其他实施例中,该三维层析成像系统还可以包括光源,即发射器,可以发射该第一光束。In other embodiments, the three-dimensional tomography system may further include a light source, that is, a transmitter, which may emit the first light beam.
具体如图2所示,本申请三维层析成像系统20第二实施例是在本申请三维层析成像系统第一实施例的基础上,进一步包括:发射器100,该发射器100设置于无衍射器件101的入光侧,用于发射第一光束至无衍射器件101。Specifically, as shown in FIG. 2, the second embodiment of the three-dimensional tomography system 20 of the present application is based on the first embodiment of the three-dimensional tomography system of the present application, and further includes: a transmitter 100, which is disposed at The light incident side of the diffractive device 101 is configured to emit a first light beam to the non-diffractive device 101.
由于太赫兹频段的光波不仅对材料有良好的穿透特性,而且光子能量低,不会引起有害的电离反应,可以实现材料的无损检测,尤其适合用于质量要求高、制造成本高的复合材料的检测。Light waves in the terahertz band not only have good penetrating properties for materials, but also have low photon energy, which will not cause harmful ionization reactions. It can realize non-destructive testing of materials, and is especially suitable for composite materials with high quality requirements and high manufacturing costs. Detection.
本实施例中,该发射器100可以采用太赫兹光发射器,形成太赫兹频段的第一光束,其中,该第一光束的频率不小于0.5THz。In this embodiment, the transmitter 100 may use a terahertz optical transmitter to form a first light beam in the terahertz frequency band, wherein the frequency of the first light beam is not less than 0.5 THz.
可选地,本实施例中该无衍射器件101为无衍射透镜,如太赫兹频段的PTFE透镜。该无衍射透镜101可以将平行入射的第一光束汇聚为近似无衍射的第二光束(涡旋光),其中该第二光束的景深不小于1.5m,中心光斑直径可以为0.3mm。Optionally, in this embodiment, the non-diffraction device 101 is a non-diffraction lens, such as a PTFE lens in a terahertz frequency band. The non-diffraction lens 101 can focus the first incident parallel light beam into a second non-diffraction light beam (vortex light), wherein the depth of field of the second light beam is not less than 1.5 m, and the diameter of the central spot can be 0.3 mm.
可选地,该聚光器件102是凹面镜,该凹面镜的反射面朝向扫描器件103,该凹面镜上形成的通孔的直径不小于0.3mm,从而可以使得该第二光束通过该通孔入射到扫描器件103,而该凹面镜具有聚光作用,该扫描器件103反射的第三光束入射到凹面镜的反射面时,该凹面镜会将第三光束汇聚到其焦点。该凹面镜可以采用与无衍射器件101相同的材料,如PTFE材料制作。其中,该通孔的尺寸可以根据实际需求设置,通常为毫米级,例如0.1mm~3mm。Optionally, the light condensing device 102 is a concave mirror, the reflective surface of the concave mirror faces the scanning device 103, and the diameter of the through hole formed in the concave mirror is not less than 0.3 mm, so that the second light beam can pass through the through hole When the incident light enters the scanning device 103 and the concave mirror has a light-concentrating effect, when the third light beam reflected by the scanning device 103 is incident on the reflecting surface of the concave mirror, the concave mirror will converge the third light beam to its focus. The concave mirror can be made of the same material as the non-diffraction device 101, such as a PTFE material. The size of the through hole can be set according to actual needs, and is usually a millimeter level, for example, 0.1 mm to 3 mm.
本实施例中,该发射器100可以采用固态电子技术,形成太赫兹固态发射前端,类似的,该接收器104也可以采用固态电子技术,形成太赫兹固态接收前端。其中,当该发射器需要产生频率较高的太赫兹波时,可以采用倍频技术将较低频率的信号倍频到所需的太赫兹频段。In this embodiment, the transmitter 100 may use solid-state electronic technology to form a terahertz solid-state transmitting front end. Similarly, the receiver 104 may also use solid-state electronic technology to form a terahertz solid-state receiving front-end. Wherein, when the transmitter needs to generate a terahertz wave with a higher frequency, a frequency doubling technology may be used to multiply a lower frequency signal to a required terahertz frequency band.
可选地,如图3所示,本实施例中,该发射器100包括:信号源1001、第一倍频器1002和发射天线1003。该信号源1001用于产生本振信号,该本振信号的频率小于第一光束的频率;第一倍频器1002连接信号源1001,用于将本振信号的频率提升至太赫兹频段,以形成第一光束;发射天线1003连接第一倍频器1002,用于发射第一光束。Optionally, as shown in FIG. 3, in this embodiment, the transmitter 100 includes a signal source 1001, a first frequency multiplier 1002, and a transmitting antenna 1003. The signal source 1001 is used to generate a local oscillator signal, and the frequency of the local oscillator signal is lower than the frequency of the first beam; the first frequency multiplier 1002 is connected to the signal source 1001 and is used to raise the frequency of the local oscillator signal to the terahertz frequency band, so as to A first light beam is formed; the transmitting antenna 1003 is connected to the first frequency multiplier 1002 and is used for transmitting the first light beam.
其中,该第一倍频器1002可以采用多个倍频器(如二倍频器、四倍频器等)串联而成,具体根据所需的倍频数选择倍频器的类型和数量,此处不做具体限定。The first frequency multiplier 1002 may be formed by connecting multiple frequency multipliers (such as a second frequency multiplier, a fourth frequency multiplier, etc.) in series. Specifically, the type and number of frequency multipliers are selected according to the required frequency multiplier. No specific restrictions are made here.
具体地,在一个应用例中,该信号源1001可以产生12.5GHz的本振信号,该第一光束所需的频率是600GHz(即0.6THz),该第一倍频器1002的倍频数为48倍,则可以利用一个三倍频器和两个四倍频器串联形成该第一倍频器1002,当然,也可以采用两个二倍频器和一个四倍频器、一个三倍频器串联形成该第一倍频器1002,或者采用一个三倍频器和一个十六倍频器串联形成该第一倍频器1002,又或者采用一个二倍频器、一个三倍频器和一个八倍频器串联形成该第一倍频器1002。当然,在其他实施例中,也可以采用其他倍频数的倍频器,只要能够得到所需频段的信号即可。该发射天线1003接收到该第一倍频器1002倍频后输出的信号后,可以将该信号形成第一光束发射至无衍射器件101。Specifically, in an application example, the signal source 1001 can generate a 12.5 GHz local oscillator signal. The frequency required for the first light beam is 600 GHz (that is, 0.6 THz). The frequency multiplier of the first frequency multiplier 1002 is 48. Times, a third frequency multiplier and two four frequency multipliers can be used in series to form the first frequency multiplier 1002. Of course, two second frequency multipliers, a fourth frequency multiplier, and a third frequency multiplier can also be used. The first frequency multiplier 1002 is formed in series, or a third frequency multiplier and a sixteen frequency multiplier are connected in series to form the first frequency multiplier 1002, or a second frequency multiplier, a third frequency multiplier, and a The eight multiplier is connected in series to form the first multiplier 1002. Of course, in other embodiments, frequency multipliers with other frequency multipliers may also be used, as long as signals of a desired frequency band can be obtained. After receiving the signal outputted by the first frequency multiplier 1002 by the transmitting antenna 1003, the transmitting antenna 1003 can form the signal into a first light beam and transmit it to the non-diffraction device 101.
可选地,继续参阅图3,该接收器104具体包括:接收天线1041、基带信号源1042、调制器1043、第二倍频器1044、混频器1045、信号处理装置1046。Optionally, continuing to refer to FIG. 3, the receiver 104 specifically includes a receiving antenna 1041, a baseband signal source 1042, a modulator 1043, a second frequency multiplier 1044, a mixer 1045, and a signal processing device 1046.
该基带信号源1042用于产生低频基带信号,该低频基带信号的频率小于本振信号的频率;调制器1043的输入端分别连接信号源1001和基带信号源1042,输出端连接第二倍频器1044,用于将基带信号调制到本振信号上后输入到第二倍频器1044中进行倍频;混频器1045的输入端分别连接该接收天线1041和第二倍频器1044,用于将第二倍频器1044倍频后的信号与接收天线1041接收的信号进行混频,以得到一低频信号,其中该第二倍频器1044的倍频数与第一倍频器1002相同;信号处理装置1046连接混频器1045,用于对混频后的低频信号进行处理,以得到第三光束的信息进行成像。The baseband signal source 1042 is used to generate a low-frequency baseband signal, and the frequency of the low-frequency baseband signal is lower than the frequency of the local oscillator signal; the input end of the modulator 1043 is connected to the signal source 1001 and the baseband signal source 1042 respectively, and the output end is connected to the second frequency multiplier. 1044, which is used to modulate the baseband signal to the local oscillator signal and input it to the second frequency multiplier 1044 for frequency doubling; the input ends of the mixer 1045 are connected to the receiving antenna 1041 and the second frequency multiplier 1044, respectively, for Mixing the signal multiplied by the second frequency multiplier 1044 with the signal received by the receiving antenna 1041 to obtain a low frequency signal, wherein the number of frequency multiplications of the second frequency multiplier 1044 is the same as that of the first frequency multiplier 1002; The processing device 1046 is connected to the mixer 1045 and is configured to process the mixed low-frequency signal to obtain information of the third light beam for imaging.
具体地,在一个应用例中,该接收天线1041可以接收第三光束,生成第三光束信号,当该发射天线发射的第一光束频率为600GHz(即0.6THz)时,该第三光束的频率也为600GHz。该基带信号源1042产生1MHz的低频基带信号,调制器1043获取发射器100的信号源1001产生的12.5GHz本振信号,将该1MHz的基带信号调制到该12.5GHz的本振信号上,形成12.501GHz的信号。第二倍频器1044的倍频数与该第一倍频器1002相同,均为48倍,则该12.501GHz的信号经过倍频后,可以得到600.048GHz的信号,其中该第二倍频器1044也可以采用多个倍频器串联的形式,其结构可以与第一倍频器1002相同,也可以不同,只要倍频数相同即可。由于低频信号处理方便,该混频器1045获取600.048GHz的信号和该600GHz的第三光束信号后,进行混频,可以得到48MHz的低频信号,该低频信号保留有第三光束的信息。该信号处理装置1046获取该48MHz的低频信号后,可以从该低频信号中提取相位信息和强度信息等,从而可以根据反映被检材料A结构的上述相位信息和强度信息构建被检材料A的三维图像,进而可以从三维图像中直观得到该被检材料A内部是否存在缺陷。Specifically, in an application example, the receiving antenna 1041 can receive a third beam and generate a third beam signal. When the frequency of the first beam emitted by the transmitting antenna is 600 GHz (that is, 0.6 THz), the frequency of the third beam It is also 600GHz. The baseband signal source 1042 generates a 1MHz low-frequency baseband signal. The modulator 1043 obtains a 12.5GHz local oscillator signal generated by the signal source 1001 of the transmitter 100, and modulates the 1MHz baseband signal onto the 12.5GHz local oscillator signal to form 12.501. GHz signals. The frequency multiplier number of the second frequency multiplier 1044 is the same as that of the first frequency multiplier 1002, both of which are 48 times. After the frequency multiplication of the 12.501GHz signal, a signal of 600.048GHz can be obtained. The second frequency multiplier 1044 A form in which multiple frequency multipliers are connected in series may also be adopted, and the structure may be the same as or different from the first frequency multiplier 1002, as long as the frequency multipliers are the same. Due to the convenience of low frequency signal processing, the mixer 1045 obtains a signal of 600.048 GHz and a signal of the third beam of 600 GHz and then performs mixing to obtain a low frequency signal of 48 MHz. The low frequency signal retains the information of the third beam. After the signal processing device 1046 obtains the 48 MHz low-frequency signal, phase information and intensity information can be extracted from the low-frequency signal, so that the three-dimensional material A can be constructed based on the phase information and intensity information reflecting the structure of the material A to be inspected. The image can further intuitively determine from the three-dimensional image whether there is a defect in the material A to be inspected.
可选地,进一步参阅图3,该接收器104中,该信号处理装置1046包括:依次连接的正交信号(I/Q)解调器10461、模数转换器(A/D)10462、现场可编程门阵列(FPGA)10463以及成像电路10464。Optionally, referring further to FIG. 3, in the receiver 104, the signal processing device 1046 includes: an orthogonal signal (I / Q) demodulator 10461, an analog-to-digital converter (A / D) 10462, and a field connected in sequence. Programmable gate array (FPGA) 10463 and imaging circuit 10464.
该正交信号解调器10461用于将该低频信号进行解调;该模数转换器10462用于将解调后的低频信号转换为数字信号;该现场可编程门阵列10463用于采集该数字信号中的数据;成像电路10464用于利用采集到的数据构建被检材料A的三维图像。The orthogonal signal demodulator 10461 is used to demodulate the low frequency signal; the analog-to-digital converter 10462 is used to convert the demodulated low frequency signal into a digital signal; the field programmable gate array 10463 is used to collect the digital Data in the signal; the imaging circuit 10464 is used to construct a three-dimensional image of the material A to be inspected using the collected data.
具体地,在一个应用例中,由于数字信号处理较为简单方便,而混频后的低频信号是经过调制的模拟信号,该信号处理装置1046首先利用I/Q信号解调器10461将该低频信号进行解调后,利用A/D转换器10462将解调后的模拟低频信号转换为数字信号,再采用FPGA电路10463采集该数字信号中的数据(如相位和幅度信息),最后成像电路10464可以利用采集到的数据分析被检材料A的内部结构,最终构建被检材料A的三维图像。当然,在其他实施例中,该接收器104也可以直接连接一独立的成像装置,由该独立的成像装置根据该第三光束的信息构建被检材料A的三维图像。Specifically, in an application example, since digital signal processing is relatively simple and convenient, and the mixed low-frequency signal is a modulated analog signal, the signal processing device 1046 first uses the I / Q signal demodulator 10461 to convert the low-frequency signal. After demodulation, the A / D converter 10462 is used to convert the demodulated analog low-frequency signal into a digital signal, and then FPGA circuit 10463 is used to collect the data (such as phase and amplitude information) in the digital signal. Finally, the imaging circuit 10464 can The collected data is used to analyze the internal structure of the inspected material A, and finally a three-dimensional image of the inspected material A is constructed. Of course, in other embodiments, the receiver 104 may also be directly connected to an independent imaging device, and the independent imaging device constructs a three-dimensional image of the material A to be inspected according to the information of the third light beam.
本实施例中,利用太赫兹波段光发射器发射太赫兹频段的第一光束至无衍射器件,由无衍射器件将入射的第一光束汇聚成第二光束,利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,由设置于聚光器件聚光区的接收器接收聚光器件汇聚的第三光束,以利用第三光束的信息构建被检材料的三维图像,从而利用无衍射器件,可以将第一光束汇聚成近似无衍射的第二光束,使得该第二光束在后续传播和扫描到被检测材料的过程中不发散、光场能量高度集中、中心亮斑尺寸小,进而使得扫描后利用第三光束的信息构建的被检材料的三维图像分辨率高,提高材料检测的精度,并且利用太赫兹频段光束的强穿透性和低光子能量的特性,可以穿透厚度较高的被检材料,且不损伤被检材料,实现无损检测。In this embodiment, a terahertz band optical transmitter is used to transmit a first light beam in the terahertz frequency range to a non-diffractive device. The non-diffraction device converges the incident first light beam into a second light beam, and the scanning device is used to scan the second light beam. The method reflects the material to be inspected, and reflects the third beam reflected by the inspected material to the light-concentrating device, and a receiver provided in the light-concentrating area of the light-concentrating device receives the third light beam condensed by the light-concentrating device to use the third light beam. The three-dimensional image of the inspected material is constructed based on the information of the inspected material, so that the non-diffraction device can be used to converge the first beam into a second beam that is approximately non-diffracted, so that the second beam does not diverge during subsequent propagation and scanning to the inspected material The light field energy is highly concentrated and the size of the central bright spot is small, so that the three-dimensional image of the inspected material constructed by using the information of the third beam after scanning is high in resolution, improving the accuracy of material detection, and using the strong penetration of the terahertz band beam The characteristics of permeability and low photon energy can penetrate the test material with higher thickness without damaging the test material and realize non-destructive testing.
如图4所示,本申请三维层析成像系统30第三实施例是在本申请三维层析成像系统第一实施例的基础上,进一步限定该扫描器件103为扫描振镜,包括第一振镜片1031和第二振镜片1032,该第一振镜片1031沿第一方向转动,第二振镜片1032沿垂直于第一方向的第二方向转动,以使得第二光束逐行或逐列扫描被检材料A。As shown in FIG. 4, the third embodiment of the three-dimensional tomography system 30 of the present application is based on the first embodiment of the three-dimensional tomography system of the present application, and further defines the scanning device 103 as a scanning galvanometer, including the first A lens 1031 and a second vibrating lens 1032. The first vibrating lens 1031 rotates in a first direction, and the second vibrating lens 1032 rotates in a second direction perpendicular to the first direction, so that the second beam is scanned line by line or column by column.测 材料 A。 Inspection material A.
其中,该第二光束的扫描方式可以是沿“Z”或“弓”字形扫描。该第一振镜片1031可以是行方向振镜,即该第一振镜片1031转动后,可以改变第二光束的出射方向,使得该第二光束在被检材料A表面的行方向上扫描;而该第二振镜片1032则是列方向振镜,即该第二振镜片1032转动后,可以改变第二光束的出射方向,使得该第二光束在被检材料A表面的列方向上扫描。The scanning mode of the second light beam may be scanning along a “Z” or “bow” shape. The first vibrating lens 1031 may be a row-direction vibrating mirror, that is, after the first vibrating lens 1031 is rotated, the exit direction of the second light beam may be changed, so that the second beam is scanned in the row direction of the surface of the material A to be inspected; and The second vibrating lens 1032 is a column direction vibrating mirror, that is, after the second vibrating lens 1032 is rotated, the exit direction of the second light beam can be changed, so that the second beam is scanned in the column direction of the surface of the material A to be inspected.
具体地,初始状态时,该第一振镜片1031和第二振镜片1032可以平行设置,开始逐行扫描时,该第一振镜片1031开始转动,该第二振镜片1032不动,扫描完一行后,该第二振镜片1032转动一定角度,第一振镜片1031不动,使得第二光束可以照射下一行,然后重复上述步骤,直至该被检材料A被扫描完毕。Specifically, in the initial state, the first vibrating lens 1031 and the second vibrating lens 1032 can be set in parallel. When the progressive scanning is started, the first vibrating lens 1031 starts to rotate, and the second vibrating lens 1032 is not moved, and one line is scanned. Then, the second vibrating lens 1032 is rotated by a certain angle, and the first vibrating lens 1031 is not moved, so that the second light beam can be irradiated to the next line, and then the above steps are repeated until the inspected material A is scanned.
当然,在其他实施例中,该第一振镜片1031可以是列方向振镜,该第二振镜片1032可以是行方向振镜,扫描方式也可以是逐列扫描,或者采用其他扫描方式,此处不做具体限定。Of course, in other embodiments, the first galvanometer lens 1031 may be a column direction galvanometer, and the second galvanometer lens 1032 may be a row direction galvanometer. The scanning method may also be column-by-column scanning, or other scanning methods. No specific restrictions are made here.
可选地,继续参阅图4,该聚光器件102也可以采用平面反射镜1022和聚光透镜1023组合形成,其中,该平面反射镜1022的反射面朝向该扫描器件103,该平面反射镜1022形成有一通孔1021,第一光束可以通过该通孔1021入射到扫描器件103,该扫描器件103反射的第三光束可以被该平面反射镜1022的反射面反射。该聚光透镜1023设置于该平面反射镜1022的反射区,即其反射的光线的出光侧,接收器104设置于该聚光透镜1023的聚光区(如焦点位置),该聚光透镜1023可以将该平面反射镜1022反射的第三光束汇聚到该接收器104,由接收器104接收后进行处理。Optionally, continuing to refer to FIG. 4, the light-concentrating device 102 may also be formed by using a combination of a plane reflecting mirror 1022 and a condenser lens 1023, wherein the reflecting surface of the plane reflecting mirror 1022 faces the scanning device 103 and the plane reflecting mirror 1022. A through-hole 1021 is formed, and the first light beam can be incident on the scanning device 103 through the through-hole 1021, and the third light beam reflected by the scanning device 103 can be reflected by the reflecting surface of the plane mirror 1022. The condenser lens 1023 is disposed in the reflection area of the plane mirror 1022, that is, the light exit side of the reflected light, and the receiver 104 is disposed in the condenser area (such as the focal position) of the condenser lens 1023. The condenser lens 1023 The third light beam reflected by the plane mirror 1022 can be converged to the receiver 104, and processed by the receiver 104 after receiving.
本实施例中的三维层析成像系统也可以与本申请三维层析成像系统第二实施例相结合。The three-dimensional tomography system in this embodiment can also be combined with the second embodiment of the three-dimensional tomography system in this application.
如图5所示,本申请三维层析成像方法应用于本申请三维层析成像系统,该三维层析成像系统的具体结构可以参考本申请三维层析成像系统第一至第三任一实施例的结构。本实施例中,该三维层析成像方法包括:As shown in FIG. 5, the three-dimensional tomography method of the present application is applied to the three-dimensional tomography system of the present application. For the specific structure of the three-dimensional tomography system, refer to any one of the first to third embodiments of the three-dimensional tomography system of the present application. Structure. In this embodiment, the three-dimensional tomography method includes:
S101:利用无衍射器件将入射的第一光束汇聚成第二光束。S101: Converge an incident first light beam into a second light beam using a non-diffraction device.
S102:利用扫描器件将所述第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件。S102: Use the scanning device to reflect the second light beam to the test material in a scanning manner, and reflect the third light beam reflected by the test material to the light concentrating device.
其中,聚光器件设置于无衍射器件的出光侧,聚光器件上形成有通孔,第二光束通过该通孔射到扫描器件。The light-concentrating device is disposed on the light-exiting side of the non-diffraction device. A through-hole is formed in the light-concentrating device, and the second light beam is transmitted to the scanning device through the through-hole.
S103:利用接收器接收聚光器件汇聚的第三光束。S103: Use the receiver to receive the third light beam collected by the light-concentrating device.
其中,接收器设置于聚光器件的聚光区。The receiver is disposed in a light-concentrating area of the light-concentrating device.
S104:利用第三光束的信息构建被检材料的三维图像。S104: Use the information of the third light beam to construct a three-dimensional image of the test material.
可选地,步骤S101之前,进一步包括:Optionally, before step S101, the method further includes:
S100:利用发射器发射第一光束至无衍射器件。S100: Use the transmitter to emit the first light beam to the non-diffraction device.
其中,该发射器设置于无衍射器件的入光侧,该第一光束可以是太赫兹频段的光束,频率不小于0.5THz。Wherein, the transmitter is disposed on the light incident side of the non-diffraction device, and the first light beam may be a light beam in a terahertz frequency band with a frequency of not less than 0.5 THz.
可选地,如图6所示,步骤S100具体包括:Optionally, as shown in FIG. 6, step S100 specifically includes:
S1001:利用信号源产生频率小于第一光束频率的本振信号。S1001: Use the signal source to generate a local oscillator signal with a frequency lower than the frequency of the first beam.
S1002:利用第一倍频器将该本振信号倍频为太赫兹频段的信号。S1002: Use the first frequency multiplier to multiply the local oscillator signal into a signal in the terahertz band.
S1003:利用发射天线将该太赫兹频段的信号转变为准直的太赫兹频段的第一光束,并发射至太赫兹无衍射透镜。S1003: Use a transmitting antenna to transform the signal in the terahertz frequency band into a collimated terahertz frequency band first light beam and transmit it to the terahertz non-diffraction lens.
可选地,步骤S101具体包括:Optionally, step S101 specifically includes:
S1011:利用太赫兹无衍射透镜将第一光束汇聚成太赫兹频段的近似无衍射的第二光束。S1011: using a terahertz non-diffraction lens to condense the first light beam into an approximately non-diffraction second light beam in the terahertz frequency band.
可选地,步骤S102具体包括:Optionally, step S102 specifically includes:
S1021:控制扫描振镜以扫描方式将穿过凹面镜上通孔的该第二光束反射到被检材料表面。S1021: Control the scanning galvanometer to reflect the second light beam passing through the through hole on the concave mirror to the surface of the material to be inspected in a scanning manner.
S1022:利用凹面镜将扫描振镜反射的第三光束汇聚到焦点区域。S1022: Use a concave mirror to focus the third light beam reflected by the scanning galvanometer to a focal region.
其中,该焦点区域是以凹面镜焦点为中心的预设范围的区域。The focus area is an area of a preset range centered on the focal point of the concave mirror.
可选地,步骤S103具体包括:Optionally, step S103 specifically includes:
S1031:利用接收天线接收凹面镜反射的第三光束;S1031: Use a receiving antenna to receive the third light beam reflected by the concave mirror;
S1032:利用调制器将基带信号源产生的低频基带信号调制到本振信号上;S1032: using a modulator to modulate a low-frequency baseband signal generated by a baseband signal source onto a local oscillator signal;
S1033:利用第二倍频器将调制后的信号倍频到太赫兹频段;S1033: using a second frequency multiplier to multiply the modulated signal to the terahertz frequency band;
其中,该第二倍频器的倍频数与该第一倍频器相同。The frequency multiplier of the second frequency multiplier is the same as that of the first frequency multiplier.
S1034:利用混频器将倍频后的信号与接收的第三光束信号进行混频,得到一低频信号。S1034: Use a mixer to mix the frequency-multiplied signal with the received third beam signal to obtain a low-frequency signal.
其中,该低频信号携带该第三光束的信息。The low-frequency signal carries information of the third light beam.
可选地,步骤S104具体包括:Optionally, step S104 specifically includes:
S1041:利用信号处理装置将该低频信号进行处理,得到该第三光束的相位和强度信息,并根据该相位和强度信息分析该被检材料的结构,构建该被检材料的三维图像。S1041: Use the signal processing device to process the low-frequency signal to obtain phase and intensity information of the third light beam, and analyze the structure of the inspected material according to the phase and intensity information to construct a three-dimensional image of the inspected material.
本实施例中,利用无衍射器件将入射的第一光束汇聚成第二光束;利用扫描器件将第二光束以扫描方式反射到被检材料,并将被检材料反射的第三光束反射到聚光器件,由设置于聚光器件聚光区的接收器接收聚光器件汇聚的第三光束,以利用第三光束的信息构建被检材料的三维图像,从而利用无衍射器件,可以将第一光束汇聚成近似无衍射的第二光束,使得该第二光束在后续传播和扫描到被检测材料的过程中不发散、光场能量高度集中、中心亮斑尺寸小,进而使得扫描后利用第三光束的信息构建的被检材料的三维图像分辨率高,提高材料检测的精度。In this embodiment, a non-diffraction device is used to converge the incident first light beam into a second light beam; a scanning device is used to reflect the second light beam to the test material in a scanning manner, and a third light beam reflected by the test material is reflected to the light beam. The optical device receives a third light beam collected by the light-condensing device by a receiver provided in the light-concentrating area of the light-concentrating device, and uses the information of the third light beam to construct a three-dimensional image of the inspected material. The light beam converges into a second beam with almost no diffraction, so that the second beam does not diverge during subsequent propagation and scanning to the detected material, the light field energy is highly concentrated, and the size of the central bright spot is small. The three-dimensional image of the tested material constructed by the information of the light beam has high resolution and improves the accuracy of material detection.
以上所述仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。The above description is only an implementation of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of the application, or directly or indirectly applied to other related technologies The fields are equally covered by the patent protection scope of this application.

Claims (20)

  1. 一种三维层析成像方法,其中,包括:A three-dimensional tomography method, including:
    利用发射器发射第一光束至无衍射器件,其中所述第一光束是频率不小于0.5THz的太赫兹光;Using a transmitter to emit a first light beam to a non-diffractive device, wherein the first light beam is a terahertz light having a frequency of not less than 0.5 THz;
    利用所述无衍射器件将入射的所述第一光束汇聚成第二光束;Using the non-diffraction device to converge the incident first light beam into a second light beam;
    利用扫描器件将所述第二光束以扫描方式反射到被检材料,并将所述被检材料反射的第三光束反射到所述聚光器件,其中所述聚光器件设置于所述无衍射器件的出光侧,所述聚光器件上形成有通孔,所述第二光束通过所述通孔射到所述扫描器件;Using a scanning device to scan the second light beam to the test material in a scanning manner, and to reflect the third light beam reflected by the test material to the light condensing device, wherein the light condensing device is arranged in the non-diffraction device A light emitting side of the device, a through hole is formed in the light condensing device, and the second light beam is emitted to the scanning device through the through hole;
    利用接收器接收所述聚光器件汇聚的所述第三光束,其中所述接收器设置于所述聚光器件的聚光区;Using a receiver to receive the third light beam condensed by the light-concentrating device, wherein the receiver is disposed in a light-concentrating area of the light-concentrating device;
    利用所述第三光束的信息构建所述被检材料的三维图像;Constructing a three-dimensional image of the inspected material by using the information of the third light beam;
    其中,所述聚光器件是凹面镜,所述凹面镜的反射面朝向所述扫描器件。Wherein, the light condensing device is a concave mirror, and a reflective surface of the concave mirror faces the scanning device.
  2. 根据权利要求1所述的三维层析成像方法,其中,所述无衍射器件为无衍射透镜,所述利用无衍射器件将入射的第一光束汇聚成第二光束包括:The three-dimensional tomographic imaging method according to claim 1, wherein the non-diffraction device is a non-diffraction lens, and the using the non-diffraction device to focus an incident first light beam into a second light beam comprises:
    利用所述无衍射透镜将平行入射的所述第一光束汇聚为所述第二光束,其中所述第二光束的成像景深不小于1.5m。The first incident light beam that is incident in parallel is collected into the second light beam by using the non-diffraction lens, wherein an imaging depth of field of the second light beam is not less than 1.5m.
  3. 一种三维层析成像系统,其中,包括:无衍射器件、聚光器件、扫描器件以及接收器;A three-dimensional tomography system, which includes: a non-diffraction device, a light-concentrating device, a scanning device, and a receiver;
    所述无衍射器件用于将入射的第一光束汇聚成第二光束;The non-diffraction device is configured to focus an incident first light beam into a second light beam;
    所述聚光器件设置于所述无衍射器件的出光侧,所述聚光器件上形成有通孔,所述第二光束通过所述通孔射到所述扫描器件;The light-concentrating device is disposed on a light-exiting side of the non-diffraction device, a through-hole is formed on the light-concentrating device, and the second light beam is emitted to the scanning device through the through-hole;
    所述扫描器件用于将所述第二光束以扫描方式反射到被检材料,并将所述被检材料反射的第三光束反射到所述聚光器件;The scanning device is configured to reflect the second light beam to the material under inspection in a scanning manner, and reflect a third light beam reflected by the material to be inspected to the condensing device;
    所述接收器设置于所述聚光器件的聚光区,用于接收所述聚光器件汇聚的所述第三光束,以利用所述第三光束的信息构建所述被检材料的三维图像。The receiver is disposed in a light-concentrating area of the light-concentrating device, and is configured to receive the third light beam condensed by the light-concentrating device, so as to use the information of the third light beam to construct a three-dimensional image of the inspected material .
  4. 根据权利要求3所述的系统,其中,所述系统进一步包括:The system of claim 3, wherein the system further comprises:
    发射器,设置于所述无衍射器件的入光侧,用于发射所述第一光束至所述无衍射器件,其中所述第一光束是频率不小于0.5THz的太赫兹光。The transmitter is disposed on a light incident side of the non-diffraction device and is configured to emit the first light beam to the non-diffraction device, wherein the first light beam is a terahertz light having a frequency of not less than 0.5 THz.
  5. 根据权利要求4所述的系统,其中,所述无衍射器件为无衍射透镜,所述无衍射透镜用于将平行入射的所述第一光束汇聚为所述第二光束,其中所述第二光束的成像景深不小于1.5m。The system according to claim 4, wherein the non-diffraction device is a non-diffraction lens, and the non-diffraction lens is used for converging the first incident light beam which is incident in parallel into the second light beam, wherein the second The imaging depth of field of the light beam is not less than 1.5m.
  6. 根据权利要求3所述的系统,其中,所述聚光器件是凹面镜,所述凹面镜的反射面朝向所述扫描器件。The system of claim 3, wherein the light concentrating device is a concave mirror, and a reflective surface of the concave mirror faces the scanning device.
  7. 根据权利要求3所述的系统,其中,所述扫描器件为扫描振镜,包括第一振镜片和第二振镜片,所述第一振镜片沿第一方向转动,所述第二振镜片沿垂直于所述第一方向的第二方向转动,以使得所述第二光束逐行或逐列扫描所述被检材料。 The system according to claim 3, wherein the scanning device is a scanning galvanometer, comprising a first vibration mirror and a second vibration mirror, the first vibration mirror rotates in a first direction, and the second vibration mirror moves along The second direction is perpendicular to the first direction, so that the second light beam scans the test material row by row or column by column. Ranch
  8. 根据权利要求4所述的系统,其中,所述发射器包括:信号源、第一倍频器和发射天线;The system according to claim 4, wherein the transmitter comprises: a signal source, a first frequency multiplier, and a transmitting antenna;
    所述信号源用于产生本振信号,所述本振信号的频率小于所述第一光束的频率;The signal source is used to generate a local oscillator signal, and a frequency of the local oscillator signal is smaller than a frequency of the first light beam;
    所述第一倍频器连接所述信号源,用于将所述本振信号的频率提升至太赫兹频段,以形成所述第一光束;The first frequency multiplier is connected to the signal source, and is configured to increase the frequency of the local oscillator signal to a terahertz frequency band to form the first light beam;
    所述发射天线连接所述第一倍频器,用于发射所述第一光束。The transmitting antenna is connected to the first frequency multiplier and is configured to transmit the first light beam.
  9. 根据权利要求8所述的系统,其中,所述接收器包括:接收天线、基带信号源、调制器、第二倍频器、混频器、信号处理装置;The system according to claim 8, wherein the receiver comprises: a receiving antenna, a baseband signal source, a modulator, a second frequency multiplier, a mixer, and a signal processing device;
    所述基带信号源用于产生低频基带信号,所述基带信号的频率小于所述本振信号的频率;The baseband signal source is used to generate a low-frequency baseband signal, and the frequency of the baseband signal is less than the frequency of the local oscillator signal;
    所述调制器的输入端分别连接所述信号源和所述基带信号源,输出端连接所述第二倍频器,用于将所述基带信号调制到所述本振信号上后输入到所述第二倍频器中进行倍频;An input end of the modulator is respectively connected to the signal source and the baseband signal source, and an output end is connected to the second frequency multiplier, which is used to modulate the baseband signal onto the local oscillator signal and then input the signal to the local oscillator. The frequency doubling is performed in the second frequency multiplier;
    所述混频器的输入端分别连接所述接收天线和所述第二倍频器,用于将所述第二倍频器倍频后的信号与所述接收天线接收的信号进行混频,以得到一低频信号,其中所述第二倍频器的倍频数与所述第一倍频器相同;The input end of the mixer is respectively connected to the receiving antenna and the second frequency multiplier, and is configured to mix the frequency-multiplied signal of the second frequency multiplier with a signal received by the receiving antenna, To obtain a low frequency signal, wherein the frequency multiplier of the second frequency multiplier is the same as that of the first frequency multiplier;
    所述信号处理装置连接所述混频器,用于对所述低频信号进行处理,以得到所述第三光束的信息进行成像。The signal processing device is connected to the mixer and is configured to process the low-frequency signal to obtain information of the third light beam for imaging.
  10. 根据权利要求9所述的系统,其中,所述信号处理装置包括:依次连接的正交信号解调器、模数转换器、现场可编程门阵列以及成像电路;The system according to claim 9, wherein the signal processing device comprises: a quadrature signal demodulator, an analog-to-digital converter, a field programmable gate array, and an imaging circuit connected in sequence;
    所述正交信号解调器用于将所述低频信号进行解调;The orthogonal signal demodulator is configured to demodulate the low-frequency signal;
    所述模数转换器用于将解调后的所述低频信号转换为数字信号;The analog-to-digital converter is configured to convert the demodulated low-frequency signal into a digital signal;
    所述现场可编程门阵列用于采集所述数字信号中的数据;The field programmable gate array is used to collect data in the digital signal;
    所述成像电路用于利用采集到的所述数据构建所述被检材料的三维图像。The imaging circuit is configured to use the collected data to construct a three-dimensional image of the inspected material.
  11. 根据权利要求3所述的系统,其中,所述第三光束的信息包括所述第三光束的相位和强度。 The system of claim 3, wherein the information of the third light beam includes a phase and an intensity of the third light beam.
  12. 一种三维层析成像方法,其中,包括:A three-dimensional tomography method, including:
    利用无衍射器件将入射的第一光束汇聚成第二光束;Converging the incident first light beam into a second light beam using a non-diffraction device;
    利用扫描器件将所述第二光束以扫描方式反射到被检材料,并将所述被检材料反射的第三光束反射到所述聚光器件,其中所述聚光器件设置于所述无衍射器件的出光侧,所述聚光器件上形成有通孔,所述第二光束通过所述通孔射到所述扫描器件;Using a scanning device to scan the second light beam to the test material in a scanning manner, and to reflect the third light beam reflected by the test material to the light condensing device, wherein the light condensing device is arranged in the non-diffraction device A light emitting side of the device, a through hole is formed in the light condensing device, and the second light beam is emitted to the scanning device through the through hole;
    利用接收器接收所述聚光器件汇聚的所述第三光束,其中所述接收器设置于所述聚光器件的聚光区;Using a receiver to receive the third light beam condensed by the light-concentrating device, wherein the receiver is disposed in a light-concentrating area of the light-concentrating device;
    利用所述第三光束的信息构建所述被检材料的三维图像。Use the information of the third light beam to construct a three-dimensional image of the test material.
  13. 根据权利要求12所述的三维层析成像方法,其中,所述利用无衍射器件将入射的第一光束汇聚成第二光束之前,包括:The three-dimensional tomography method according to claim 12, wherein before the using the non-diffraction device to focus the incident first light beam into a second light beam, comprising:
    利用发射器发射所述第一光束至所述无衍射器件,其中所述第一光束是频率不小于0.5THz的太赫兹光。The first light beam is transmitted to the non-diffraction device by a transmitter, wherein the first light beam is a terahertz light having a frequency of not less than 0.5 THz.
  14. 根据权利要求13所述的三维层析成像方法,其中,所述无衍射器件为无衍射透镜,所述利用无衍射器件将入射的第一光束汇聚成第二光束包括:The three-dimensional tomography method according to claim 13, wherein the non-diffraction device is a non-diffraction lens, and the using the non-diffraction device to focus an incident first light beam into a second light beam comprises:
    利用所述无衍射透镜将平行入射的所述第一光束汇聚为所述第二光束,其中所述第二光束的成像景深不小于1.5m。The non-diffraction lens is used to converge the first incident parallel light beam into the second light beam, and the imaging depth of field of the second light beam is not less than 1.5m.
  15. 根据权利要求12所述的三维层析成像方法,其中,所述聚光器件是凹面镜,所述凹面镜的反射面朝向所述扫描器件。The three-dimensional tomography method according to claim 12, wherein the light condensing device is a concave mirror, and a reflective surface of the concave mirror faces the scanning device.
  16. 根据权利要求12所述的三维层析成像方法,其中,所述扫描器件为扫描振镜,包括第一振镜片和第二振镜片;The three-dimensional tomography method according to claim 12, wherein the scanning device is a scanning galvanometer, comprising a first galvanometer lens and a second galvanometer lens;
    所述利用扫描器件将所述第二光束以扫描方式反射到被检材料并将所述被检材料反射的第三光束反射到所述聚光器件,包括:The step of using a scanning device to reflect the second light beam to the test material in a scanning manner and to reflect a third light beam reflected by the test material to the light collecting device includes:
    控制所述第一振镜片沿第一方向转动,控制所述第二振镜片沿垂直于所述第一方向的第二方向转动,以将所述第二光束以逐行或逐列扫描方式反射到所述被检材料;Controlling the first vibrating lens to rotate in a first direction and controlling the second vibrating lens to rotate in a second direction perpendicular to the first direction to reflect the second light beam in a row-by-row or column-by-row scanning manner To the tested material;
    利用所述第一振镜片和所述第二振镜片将所述被检材料反射的所述第三光束反射回所述聚光器件。Using the first vibrating lens and the second vibrating lens to reflect the third light beam reflected by the inspected material back to the condensing device.
  17. 根据权利要求13所述的三维层析成像方法,其中,所述发射器包括:依次连接的信号源、第一倍频器和发射天线;The three-dimensional tomography method according to claim 13, wherein the transmitter comprises: a signal source, a first frequency multiplier, and a transmitting antenna connected in order;
    所述利用发射器发射所述第一光束至所述无衍射器件包括:The transmitting the first light beam to the non-diffraction device by using a transmitter includes:
    利用所述信号源产生本振信号,其中所述本振信号的频率小于所述第一光束的频率;Using the signal source to generate a local oscillator signal, wherein the frequency of the local oscillator signal is less than the frequency of the first light beam;
    利用所述第一倍频器将所述本振信号的频率提升至太赫兹频段,以形成所述第一光束;Using the first frequency multiplier to raise the frequency of the local oscillator signal to a terahertz frequency band to form the first light beam;
    利用所述发射天线发射所述第一光束。The first light beam is transmitted using the transmitting antenna.
  18. 根据权利要求17所述的三维层析成像方法,其中,所述接收器包括:接收天线、基带信号源、调制器、第二倍频器、混频器、信号处理装置;The three-dimensional tomography method according to claim 17, wherein the receiver comprises: a receiving antenna, a baseband signal source, a modulator, a second frequency multiplier, a mixer, and a signal processing device;
    所述利用所述第三光束的信息构建所述被检材料的三维图像之前,还包括:Before the using the information of the third beam to construct a three-dimensional image of the inspected material, the method further includes:
    利用所述基带信号源产生低频基带信号,其中所述基带信号的频率小于所述本振信号的频率;Generating a low-frequency baseband signal by using the baseband signal source, wherein a frequency of the baseband signal is smaller than a frequency of the local oscillator signal;
    利用所述调制器将所述基带信号调制到所述本振信号上后输入到所述第二倍频器中进行倍频;Using the modulator to modulate the baseband signal onto the local oscillator signal and input the baseband signal to the second frequency doubler for frequency doubling;
    利用所述第二倍频器将调制后的信号进行倍频,其中所述第二倍频器的倍频数与所述第一倍频器相同Frequency-modulating the modulated signal by using the second frequency multiplier, wherein the frequency multiplier of the second frequency multiplier is the same as that of the first frequency multiplier
    利用所述混频器将所述第二倍频器倍频后的信号与所述接收天线接收的信号进行混频,以得到一低频信号;Using the mixer to mix the frequency-multiplied signal of the second frequency multiplier with the signal received by the receiving antenna to obtain a low-frequency signal;
    利用所述信号处理装置对所述低频信号进行处理,以得到所述第三光束的信息进行成像。The signal processing device is used to process the low-frequency signal to obtain information of the third light beam for imaging.
  19. 根据权利要求18所述的三维层析成像方法,其中,所述信号处理装置包括:依次连接的正交信号解调器、模数转换器、现场可编程门阵列以及成像电路;The three-dimensional tomography method according to claim 18, wherein the signal processing device comprises: an orthogonal signal demodulator, an analog-to-digital converter, a field programmable gate array, and an imaging circuit connected in order;
    所述利用所述第三光束的信息构建所述被检材料的三维图像包括:The constructing a three-dimensional image of the inspected material by using the information of the third light beam includes:
    利用所述正交信号解调器将所述低频信号进行解调;Demodulating the low-frequency signal by using the orthogonal signal demodulator;
    利用所述模数转换器将解调后的所述低频信号转换为数字信号;Using the analog-to-digital converter to convert the demodulated low-frequency signal into a digital signal;
    利用所述现场可编程门阵列采集所述数字信号中的数据;Collecting data in the digital signal by using the field programmable gate array;
    利用所述成像电路根据采集到的所述数据构建所述被检材料的三维图像。The imaging circuit is used to construct a three-dimensional image of the inspected material according to the collected data.
  20. 根据权利要求12所述的三维层析成像方法,其中,所述第三光束的信息包括所述第三光束的相位和强度。The three-dimensional tomography method according to claim 12, wherein the information of the third light beam includes a phase and an intensity of the third light beam.
PCT/CN2018/090456 2018-06-08 2018-06-08 Three-dimensional tomography systems and method WO2019232792A1 (en)

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