WO2019223727A1 - Terminal device antenna apparatus and implementation method - Google Patents
Terminal device antenna apparatus and implementation method Download PDFInfo
- Publication number
- WO2019223727A1 WO2019223727A1 PCT/CN2019/087992 CN2019087992W WO2019223727A1 WO 2019223727 A1 WO2019223727 A1 WO 2019223727A1 CN 2019087992 W CN2019087992 W CN 2019087992W WO 2019223727 A1 WO2019223727 A1 WO 2019223727A1
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- WIPO (PCT)
- Prior art keywords
- radiator
- terminal device
- metal
- main board
- antenna
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/328—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors between a radiating element and ground
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
Definitions
- the present disclosure relates to the field of antennas, and in particular, to a terminal device antenna device and an implementation method.
- the prior art provides a method for designing an antenna of a wireless terminal and a data card single board for the wireless terminal.
- the antenna design method includes: dividing a semi-closed area on the data card board of the wireless terminal without any metal wiring except for the antenna wiring; and coupling between the antenna wiring and the data card board .
- SAR specific absorption rate
- the radiation area is a semi-closed area, which is greatly affected by the environment, the metal ground current is unbalanced, the current path has a large ohmic loss, and the anti-static discharge (ESD) effect is poor;
- the headroom requirement is large, the headroom is about 1/4 wavelength of the lowest working frequency, and the working frequency band is narrow.
- An embodiment of the present disclosure provides a method for implementing a terminal device antenna device, including: dividing a fully-closed non-metal area configured to balance the metal ground current on a metal ground of a motherboard of the terminal device; and within the divided fully-closed non-metal area Arranging an antenna topology unit; the antenna topology unit uses a radio frequency signal provided by a motherboard of the terminal device to generate a working current, couples the working current to the metal ground, and uses a local resonance multi-stage echo differential suppression method, Achieve broadband impedance matching.
- An embodiment of the present disclosure further provides a terminal device antenna device, including: a metal ground located on a main board of the terminal device and having a fully enclosed non-metallic area configured to balance the current of the metallic ground; an antenna topology unit arranged in the fully enclosed non-metallic In a metal area, a radio frequency signal provided by the main board of the terminal device is used to generate a working current, and the working current is coupled to the metal ground, and a local resonance multi-stage echo differential suppression method is used to achieve broadband impedance matching.
- FIG. 1 is a flowchart of a method for implementing a terminal device antenna device according to an embodiment of the present disclosure
- FIG. 2 is a schematic diagram of a connection structure between an antenna device and a terminal device according to an embodiment of the present disclosure
- FIG. 3 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- FIG. 4 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- FIG. 5 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- FIG. 6 is a schematic structural diagram of still another antenna device of a terminal device according to an embodiment of the present disclosure.
- FIG. 7 is an equivalent circuit diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- FIG. 8 is an S11 parameter diagram when the antenna device according to the embodiment of the present disclosure is applied to a terminal device.
- FIG. 9 is a radiation efficiency diagram when an antenna device according to an embodiment of the present disclosure is applied to a terminal device.
- FIG. 1 is a flowchart of a method for implementing a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 1, a method for implementing a terminal antenna device according to an embodiment of the present disclosure includes the following steps S101 to S103.
- Step S101 A fully enclosed non-metallic area configured to balance the current of the metal ground is divided on the metal ground of the main board of the terminal device.
- the terminal device motherboard may have at least two printed circuit layers, and a fully enclosed non-metallic area may be divided on a metal ground of each layer of the printed circuit layer of the terminal device motherboard.
- a fully enclosed non-metallic area is divided on the metal ground on the top layer of the terminal equipment main board, and a fully enclosed non-metallic area is divided on the metal ground floor of the terminal equipment main board Metal area. If there is (at least one) inner layer between the top layer and the bottom layer of the main board of the terminal device, a fully enclosed non-metallic area is also divided on the metal ground of each layer of the inner layer.
- Step S102 Arrange the antenna topology unit in the completely enclosed non-metal area.
- the antenna topology unit is arranged in a fully enclosed non-metallic area of a metal ground of at least one printed circuit layer.
- the antenna topology unit is arranged in at least one of a fully enclosed non-metallic region of a top metal ground, a fully enclosed non-metallic region of a bottom metallic ground, and a fully enclosed non-metallic region of an inner metallic ground.
- the antenna topology unit may include: a first radiator with a gap between the terminal device main board; a second radiator, a third radiator, and a fourth radiator configured to generate an operating current; and a lumped element .
- Step S103 the antenna topology unit uses a radio frequency signal provided by the motherboard of the terminal device to generate a working current, couples the working current to the metal ground, and implements a local resonance multi-stage echo differential suppression method to achieve broadband Impedance matching.
- an equivalent signal formed by the second radiator, the first radiator, and the fourth radiator when the antenna topology unit is in a local resonance state, an equivalent signal formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal.
- An equivalent network formed by the third radiator, the lumped element, the metal ground, and the second radiator generates a reflected signal; and performs differential cancellation processing on the echo signal and the reflected signal to obtain a differential signal .
- the first radiator absorbs the differential signal, thereby achieving broadband impedance matching.
- the method for implementing a terminal antenna device may further include: arranging on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator A first metal coupling sheet having a gap with the terminal device main board, and through the gap between the first metal coupling sheet and the terminal device main board, the first metal coupling sheet and the terminal device The main board is coupled; and / or a second metal coupling sheet with a gap between the antenna topological unit and the main board of the terminal device is arranged in the non-metallic area, and the second metal coupling sheet is connected to the terminal device through the second metal coupling sheet In the gap between the motherboards, the second metal coupling piece is coupled to the terminal equipment motherboard.
- the radiation area of the terminal device antenna device implemented by the embodiments of the present disclosure is a fully enclosed area, which is less affected by the environment, the metal ground current presents a balanced current, and the radiation characteristics are good.
- the "O" closed loop of the terminal device antenna device implemented by the embodiments of the present disclosure has a smaller ohmic impedance, smaller loss, higher radiation efficiency, and better anti-ESD (electrostatic discharge) effect than the "C" shaped loop current path.
- the antenna headroom of the terminal device antenna device implemented by the embodiments of the present disclosure is small, and the headroom is approximately 0.05 ⁇ x0.025 ⁇ (minimum operating frequency 698MHz), which is far less than 1/4 wavelength, and meets the Operating frequency band.
- An embodiment of the present disclosure further provides a terminal device antenna device, including: a metal ground, located on a main board of the terminal device, and having a fully enclosed non-metallic area configured to balance the current of the metal ground; and an antenna topology unit disposed in the whole In a closed non-metallic area, a radio frequency signal provided by the motherboard of the terminal device is used to generate a working current, and the working current is coupled to the metal ground, and a local resonance multi-stage echo differential suppression method is used to achieve broadband impedance matching. .
- the terminal device motherboard may have at least two printed circuit layers, and each layer of the printed circuit layer may have a fully enclosed non-metallic area on a metal ground.
- the metal ground specifically includes a top metal ground located on the top printed circuit layer of the terminal device motherboard and a bottom metal ground located on the bottom printed circuit layer of the terminal device motherboard.
- the top metal ground and the bottom metal ground both have Enclose non-metallic areas.
- the motherboard of the terminal device has more than two printed circuit layers, that is, there is an inner layer (which has at least one printed circuit layer) between the top layer and the bottom layer
- the metal floor also includes an inner layer of each of the printed circuit layers of the inner layer Metal ground.
- the antenna topology unit is arranged in a fully enclosed non-metallic area of the metal ground of at least one printed circuit layer, such as a fully enclosed non-metallic area provided on the top metal ground or a fully enclosed non-metallic area provided on the top metal ground.
- Metal areas and fully enclosed non-metal areas such as inner metal ground.
- the antenna topology unit may include: a first radiator with a gap between the terminal device main board; a second radiator, a third radiator, and a fourth radiator configured to generate an operating current; and a lumped element .
- an equivalent network formed by the second radiator, the first radiator, and the fourth radiator When the antenna topology unit is in a local resonance state, an equivalent network formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal, and the third radiation
- the equivalent network formed by the body, the lumped element, the metal ground, and the second radiator generates a reflection signal, and performs differential cancellation processing on the echo signal and the reflection signal to obtain a differential signal.
- the radiator absorbs the differential signal, thereby achieving broadband impedance matching.
- the terminal device antenna device may further include a first metal coupling sheet disposed on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator, and There is a gap between the terminal equipment main boards, and the coupling with the terminal equipment main board is realized through the gap with the terminal equipment main board; and / or a second metal coupling sheet, which is arranged in an unarranged place There is a gap between the non-metallic area of the antenna topology unit and the main board of the terminal device, and the second coupling with the main board of the terminal device is realized through the gap with the main board of the terminal device.
- the applications of the antenna device according to the embodiments of the present disclosure are listed below.
- the antenna device according to the embodiments of the present disclosure is applied to a motherboard of a terminal device as an example.
- FIG. 2 is a schematic diagram of a connection structure of an antenna device and a terminal device according to an embodiment of the present disclosure
- FIG. 3 is a schematic diagram of a structure of a terminal device antenna device according to an embodiment of the present disclosure.
- the terminal device antenna device may be applied to terminal devices such as a notebook, a PC, and a PAD.
- the interface between the antenna device and the terminal device may be a USB interface, a PCMCIA interface (PC memory card interface), an Express interface, or other interfaces.
- the terminal device antenna device of the embodiment of the present disclosure may include a main board 12 and a USB interface 3, which may be connected to a terminal device such as a notebook or a PC through the USB interface 3.
- the main board 12 may be a double-sided copper-clad dielectric board, for example, a dielectric board including a non-metallic material and a copper layer overlying the top and bottom layers of the dielectric board.
- the remaining area on the main board 12 except the top non-metal area 4 and the bottom non-metal area 5 is a metal ground, and the top metal ground and the bottom metal ground are in common.
- the size of each non-metallic region may be 11 mm ⁇ 21 mm ⁇ 2 mm.
- FIG. 3 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- the terminal device antenna device according to the embodiment of the present disclosure may include a top metal ground 1 and a bottom metal ground 2.
- the top metal ground 1 may be a flat surface and is located on the front side of the motherboard 12.
- the bottom metal ground 2 may also be a flat surface, which is located on the bottom surface of the motherboard 12.
- the material of the main board 12 may include a non-metal material, and a region of the metal ground of the main board 12 may include a plurality of printed circuit layers.
- the terminal device antenna device according to the embodiment of the present disclosure may be connected to the terminal device through the USB interface 3.
- the antenna topology unit 9 may be disposed on the top non-metal region 4 and / or the bottom non-metal region 5 of the top metal ground 1 of the main board 12.
- the top non-metallic region 4 and the bottom non-metallic region 5 can be any regular or irregular shape such as square, circle, diamond, trapezoid, triangle, etc., and are not limited to the rectangle shown in FIG. 2 and FIG.
- the shapes of the region 4 and the underlying non-metallic region 5 are not necessarily exactly the same.
- the feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
- FIG. 4 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- the antenna topology unit 9 may be arranged on the top non-metal region 4 and may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, and a first lumped element. 7.
- the second lumped element 8 the third lumped element 10, and the first metal wall 6.
- the first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle.
- the first radiator 91, the second radiator 92, and the fourth radiator 94 may all adopt rectangular radiation patches, and the third radiator 93 may employ an inductor bending line as shown in FIG.
- the third radiator 93 is coupled to the first radiator 91 through a fourth radiator 94.
- the third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95.
- the first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8.
- the first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements may be adjusted, and the antenna may be adjusted. Resonance characteristics. A gap is left between the fourth radiator 94 and the top metal ground 1.
- the first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, and the first metal wall 6 are all made of a metal material.
- the radio frequency signal on the motherboard 12 is fed to the antenna topology unit 9 through the feeding port 11 to cause the antenna topology unit 9 to stimulate a working current.
- the working current is coupled to the top metal ground 1 and the bottom metal ground 2.
- the antenna topology unit 9 is equivalent to a resonant circuit.
- the working current flows into the top metal ground 1 and the bottom metal ground 2 through the shorting branch 95, thereby forming a complete radiation resonance. Circuit.
- the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, and a part of the working current passes through the first radiator 91 Enter the fourth radiator 94 and the third radiator 93, and then enter the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and the other part of the working current passes through the first radiator 91 and the top metal ground
- the gap between 1 is coupled to the metal ground of the motherboard 12, forming a current loop.
- FIG. 7 is an equivalent circuit diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- the second radiator 92 is equivalent to a first distributed inductance Lse
- the first radiator 91 is equivalent to a radiation resistance Rse
- the first radiator 91 and the fourth radiator 94 generate a first coupling capacitance Cse
- the third radiator 93 is equivalent to a second distributed inductance Lsh.
- a second coupling capacitor Csh and a radiative admittance Gr are generated between the second radiator 92 and the top metal ground 1.
- the third lumped element 10 generates a lumped capacitance C1. .
- the lower frequency radio frequency energy enters the network composed of the first distributed inductor Lse and the first coupling capacitor Cse from the feed port 11 and enters the echo signal generated by the second distributed inductor Lsh, the second coupling capacitor Csh and the collector.
- the reflected signal generated by the network composed of the total capacitance C1 has an inverted phase difference, and the echo signal is prevented from entering the feed port 11 by performing multiple differential cancellations.
- Part of the irreversible differential signal is absorbed by the radiation resistance Rse and radiation admittance Gr equivalent of the first radiator 91 in the course of multiple reflections, thereby increasing the frequency bandwidth.
- the local resonance state of the entire antenna device can be controlled.
- the gaps between the radiators and between the radiators and the main board 12 are optimized.
- the size of the antenna, as well as the parameters and distribution positions of the lumped elements, can adjust the resonance and matching state of the antenna device, and finally meet the requirement of completely covering the target bandwidth.
- FIG. 5 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- the structure of the terminal device antenna device shown in FIG. 4 is different in that a metal coupling sheet 13 is provided on the third radiator 93, and a non-metal is used between the metal coupling sheet 13 and the antenna radiator. Medium or air medium.
- the antenna topology unit 9 may be disposed on the top non-metal region 4 of the top metal ground 1 of the main board 12.
- the top non-metal region 4 may be any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle, and is not limited to the rectangle shown in FIG. 5.
- the feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
- the antenna topology unit 9 may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, a metal coupling sheet 13, a first lumped element 7, and a second The lumped element 8, the third lumped element 10 and the first metal wall 6.
- the first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle.
- the first radiator 91, the second radiator 92, and the fourth radiator 94 may all adopt rectangular radiation patches, and the third radiator 93 may employ an inductor bending line as shown in FIG.
- the metal coupling sheet 13 may be, but is not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle.
- the metal coupling sheet 13 may be a rectangular metal sheet.
- the metal coupling sheet 13 may be disposed on all or part of the top antenna radiator, and is not limited to being disposed on only the third radiator 93 shown in FIG. 5.
- the third radiator 93 is coupled to the first radiator 91 through the fourth radiator 94, and the third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95.
- the third radiator 93 and the metal coupling sheet 13 may be completely insulated, or may be conductively connected by adding one or more conductive connection points at appropriate positions.
- the first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8.
- the first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements may be adjusted, and the antenna may be adjusted. Resonance characteristics. A gap is left between the fourth radiator 94 and the top metal ground 1.
- the first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, the metal coupling sheet 13 and the first metal wall 6 may all be made of metal materials.
- the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, Part of the working current enters the fourth radiator 94 and the third radiator 93 through the first radiator 91, and then enters the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and another part of the working current
- One part is coupled to the metal ground of the main board 12 through a gap between the first radiator 91 and the top metal ground 1 to form a current loop.
- multiple couplings are generated between the third radiator 93 and the metal coupling sheet 13 and the main board 12 through the gap, thereby generating multiple resonance points, which widens the working frequency band of the antenna.
- the optimized radiators, the radiators and the The size of the gap between the main boards 12 and between the metal coupling sheet 13 and the antenna radiator, as well as optimizing the parameters and distribution positions of the lumped components, can adjust the resonance and matching state of the antenna device, and finally achieve a complete coverage of the target bandwidth.
- FIG. 6 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure.
- the structure of the terminal device antenna device shown in FIG. 4 is different: a metal coupling sheet 14 is provided in the non-metal region 5 on the bottom layer, and the metal coupling sheet 14 can be provided by printing or welding. Within the non-metallic region 5. There is a gap between the metal coupling sheet 14 and the main board 12, and the metal coupling sheet 14 is coupled with the main board 12 through the gap, thereby achieving secondary coupling between the antenna radiator and the main board 12.
- the antenna topology unit 9 may be disposed on the top non-metal region 4 of the top metal ground 1 of the main board 12, and the metal coupling sheet 14 may be disposed on the bottom non-metal region 5 of the bottom metal ground 2 of the main board 12.
- the top non-metallic region 4 and the bottom non-metallic region 5 may be any regular or irregular shape such as square, circle, diamond, trapezoid, triangle, etc., and are not limited to the rectangle shown in FIG. 6.
- the shape of the underlying non-metallic region 5 is not necessarily the same.
- the feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
- the antenna topology unit 9 may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, a metal coupling sheet 14, a first lumped element 7, and a second The lumped element 8, the third lumped element 10 and the first metal wall 6.
- the first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle.
- the printing or welding method is arranged on the top non-metal region 4 and the bottom non-metal region 5.
- the first radiator 91, the second radiator 92, and the fourth radiator 94 may each adopt a rectangular radiation patch, and the third radiator 93 may employ an inductor bending line shown in FIG.
- the metal coupling sheet 14 may be, but is not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, or a triangle.
- the metal coupling sheet 14 may be a rectangular metal sheet printed on the non-metal region 5 at the bottom.
- the non-metallic medium is used for coupling with the top-level antenna radiator, and it can be set in the projection area of all or part of the top-level antenna radiator, and is not limited to the projection area set only in the top-level third radiator 93 shown in FIG. .
- the third radiator 93 is coupled to the first radiator 91 through the fourth radiator 94.
- the third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95. .
- the third radiator 93 and the metal coupling sheet 14 may be completely insulated, or a conductive connection may be implemented by adding one or more conductive connection points at an appropriate position.
- the first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8.
- the first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements can be adjusted to adjust the antenna Resonance characteristics.
- a gap is left between the fourth radiator 94 and the top metal ground 1.
- the first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, the metal coupling sheet 14 and the first metal wall 6 may all be made of metal materials.
- the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, Part of the working current enters the fourth radiator 94 and the third radiator 93 through the first radiator 91, and then enters the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and another part of the working current
- One part is coupled to the metal ground of the main board 12 through a gap between the first radiator 91 and the top metal ground 1 to form a current loop.
- the third radiator 93 and the metal coupling sheet 14 and the main board 12 are coupled multiple times through the gap, thereby generating multiple resonance points and widening the operating frequency band of the antenna.
- the optimized radiators, the radiators and the The size of the gap between the main boards 12 and between the metal coupling sheet 14 and the antenna radiator, as well as optimizing the parameters and distribution positions of the lumped components, can adjust the resonance and matching state of the antenna device, and finally achieve a complete coverage of the target bandwidth Claim.
- the antenna device provides a non-metallic region including only an antenna radiator, a metal coupling sheet, and a slot on the main board, and optimizes the shape of the non-metallic region and the non-metallic region. Elements, and ultimately achieve the requirements of full coverage of the target frequency band.
- each antenna radiator of the embodiment of the present disclosure is not limited to the shape shown in the drawings, and the size of the radiators and the size of the gap between the radiators are not limited to the sizes shown in the drawings.
- the shape of the non-metallic region of the embodiment of the present disclosure may be any regular or irregular shape, and is not limited to the shape shown in the drawings.
- the shape of the non-metallic region on the top layer of the motherboard and the shape of the non-metallic region on the bottom layer of the motherboard are also not limited. Need to be exactly the same.
- the resonant network in the embodiments of the present disclosure may be composed of an inductor or a capacitor, or a combination of an inductor and a capacitor may be used.
- the antenna device of the embodiment of the present disclosure is not limited to operate in the frequency band range described in the embodiments of the present disclosure.
- the size of the antenna can be adjusted according to requirements to meet the requirements of the operating frequency band.
- FIG. 8 is an S11 parameter diagram when the antenna device according to the embodiment of the present disclosure is applied to a terminal device.
- the antenna device covers the required LTE frequency bands from 698MHz to 960MHz and 1710MHz to 2690MHz, which meets the requirements for high performance of the antenna.
- FIG. 9 is a radiation efficiency diagram when an antenna device according to an embodiment of the present disclosure is applied to a terminal device.
- the radiation efficiency of the antenna device in the low frequency band is greater than 60%, and the radiation efficiency in the high frequency band is greater than 60%. It can be seen that the antenna device covers the required LTE frequency bands from 698MHz to 960MHz and 1710MHz to 2690MHz, so it has the characteristics of high efficiency and meets the requirements of high performance of the antenna.
- the antenna device has the following technical effects:
- the metal enclosure structure is used to achieve a fully enclosed radiation area, and the metal ground current is balanced.
- the metal enclosure structure is used to achieve "O "" Closed loop, smaller than ohmic impedance of the current path of the "C" loop, less loss, high radiation efficiency, and good anti-ESD effect; through the local resonance multi-order echo differential suppression method, miniaturization and high reactance are realized.
- the wide-band impedance matching reduces the antenna headroom.
- the headroom is about 0.05 ⁇ ⁇ 0.025 ⁇ (minimum operating frequency 698MHz), which is far less than 1/4 wavelength, and covers the wide frequency bands of LTE698MHz-960MHz and 1710MHz-2690MHz.
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Abstract
Provided are a terminal device antenna apparatus and an implementation method therefor, relating to the field of antennas. The method comprises: dividing off, on a metallic floor of a terminal device main board, a fully enclosed non-metallic area configured to balance the current of the metallic floor; disposing an antenna topology unit in the divided off fully enclosed non-metallic area; and the antenna topology unit generating an operating current by using a radio frequency signal provided by the terminal device main board, and coupling the operating current to the metallic floor, so as to realize wideband impedance matching by means of local resonance multistage echo differential suppression.
Description
相关申请的交叉引用Cross-reference to related applications
本申请要求于2018年5月23日提交的题为“一种终端设备天线装置及实现方法”的中国专利申请NO.201810502731.4的优先权,该中国专利申请的全部内容通过引用的方式合并于此。This application claims the priority of Chinese Patent Application No. 201810502731.4, entitled "A Terminal Equipment Antenna Device and Implementation Method", filed on May 23, 2018, the entire contents of which are incorporated herein by reference. .
本公开涉及天线领域,特别涉及终端设备天线装置及实现方法。The present disclosure relates to the field of antennas, and in particular, to a terminal device antenna device and an implementation method.
现有的终端设备大多采用单极子天线、平面倒F天线(Planar Inverted-F Antenna,PIFA)、环形天线等类型的天线。这些天线若要满足所需覆盖的频段,其物理尺寸会很大,而且其中单一类型天线的带宽不能达到终端设备通信的工作要求。目前,对于要覆盖长期演进(Long Term Evolution,LTE)频段的天线而言,不仅要求天线的回波损耗及增益和效率等天线性能良好,而且还要求天线的尺寸尽可能小。根据天线原理可知,传统的天线尺寸需要达到工作波长的二分之一或者四分之一才能谐振工作,这对于体积较小的终端设备(例如无线移动终端)来说很难找到合适的空间放置这些天线,所以传统的天线形式不能满足无线数据传输对天线的要求。因此,如何在体积较小的终端设备内保证天线具有小型化且高性能的工作状态是亟待解决的问题。Most of the existing terminal devices use monopole antennas, Planar Inverted-F Antennas (PIFAs), and loop antennas. If these antennas need to meet the required frequency band, their physical size will be very large, and the bandwidth of a single type of antenna cannot meet the working requirements of terminal equipment communication. At present, for an antenna to cover the Long Term Evolution (LTE) frequency band, not only the antenna performance such as return loss, gain and efficiency of the antenna is required, but also the size of the antenna is required to be as small as possible. According to the antenna principle, the traditional antenna size needs to reach one-half or one-fourth of the working wavelength to work in resonance, which is difficult for small terminal equipment (such as wireless mobile terminals) to find a suitable space to place. These antennas, so the traditional antenna form can not meet the requirements of the antenna for wireless data transmission. Therefore, how to ensure that the antenna has a miniaturized and high-performance working state in a small-sized terminal device is an urgent problem to be solved.
现有技术给出了一种无线终端的天线设计方法及一种无线终端的数据卡单板。该天线设计方法包括:在无线终端的数据卡单板上划分出一个除了天线走线之外无其他金属布线的半封闭区域;在所述天线走线与所述数据卡单板之间进行耦合。通过该现有技术,能够在降低天线的比吸收率(Specific Absorption Rate,SAR)值的同时实 现宽频的工作带宽。然而,该现有技术的缺陷包括:辐射区域为半封闭区域,受环境影响大,金属地电流不平衡,电流路径欧姆损耗大,抗静电放电(Flectro-Static discharge,ESD)效果差;辐射天线净空要求大,净空约为最低工作频率的1/4波长,工作频带窄。The prior art provides a method for designing an antenna of a wireless terminal and a data card single board for the wireless terminal. The antenna design method includes: dividing a semi-closed area on the data card board of the wireless terminal without any metal wiring except for the antenna wiring; and coupling between the antenna wiring and the data card board . With this prior art, it is possible to achieve a wide-band operating bandwidth while reducing the specific absorption rate (SAR) value of the antenna. However, the shortcomings of the prior art include: the radiation area is a semi-closed area, which is greatly affected by the environment, the metal ground current is unbalanced, the current path has a large ohmic loss, and the anti-static discharge (ESD) effect is poor; The headroom requirement is large, the headroom is about 1/4 wavelength of the lowest working frequency, and the working frequency band is narrow.
公开内容Public content
本公开的实施例提供一种终端设备天线装置的实现方法,包括:在终端设备主板的金属地上划分出配置为平衡金属地电流的全封闭非金属区域;在所划分的全封闭非金属区域内布置天线拓扑单元;所述天线拓扑单元利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。An embodiment of the present disclosure provides a method for implementing a terminal device antenna device, including: dividing a fully-closed non-metal area configured to balance the metal ground current on a metal ground of a motherboard of the terminal device; and within the divided fully-closed non-metal area Arranging an antenna topology unit; the antenna topology unit uses a radio frequency signal provided by a motherboard of the terminal device to generate a working current, couples the working current to the metal ground, and uses a local resonance multi-stage echo differential suppression method, Achieve broadband impedance matching.
本公开的实施例还提供一种终端设备天线装置,包括:金属地,位于终端设备主板上,具有配置为平衡金属地电流的全封闭非金属区域;天线拓扑单元,布置在所述全封闭非金属区域内,利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。An embodiment of the present disclosure further provides a terminal device antenna device, including: a metal ground located on a main board of the terminal device and having a fully enclosed non-metallic area configured to balance the current of the metallic ground; an antenna topology unit arranged in the fully enclosed non-metallic In a metal area, a radio frequency signal provided by the main board of the terminal device is used to generate a working current, and the working current is coupled to the metal ground, and a local resonance multi-stage echo differential suppression method is used to achieve broadband impedance matching.
图1是本公开的实施例提供的终端设备天线装置的实现方法的流程图;1 is a flowchart of a method for implementing a terminal device antenna device according to an embodiment of the present disclosure;
图2是本公开的实施例提供的天线装置与终端设备的连接结构示意图;2 is a schematic diagram of a connection structure between an antenna device and a terminal device according to an embodiment of the present disclosure;
图3是本公开的实施例提供的终端设备天线装置的结构示意图;3 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure;
图4是本公开的实施例提供的终端设备天线装置的一种结构示意图;4 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure;
图5是本公开的实施例提供的终端设备天线装置的另一种结构示意图;5 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure;
图6是本公开的实施例提供的终端设备天线装置的再一种结构 示意图;6 is a schematic structural diagram of still another antenna device of a terminal device according to an embodiment of the present disclosure;
图7是本公开的实施例提供的终端设备天线装置的等效电路图;7 is an equivalent circuit diagram of a terminal device antenna device according to an embodiment of the present disclosure;
图8是本公开的实施例提供的天线装置应用于终端设备上时的S11参数图;以及FIG. 8 is an S11 parameter diagram when the antenna device according to the embodiment of the present disclosure is applied to a terminal device; and
图9是本公开的实施例提供的天线装置应用于终端设备上时的辐射效率图。FIG. 9 is a radiation efficiency diagram when an antenna device according to an embodiment of the present disclosure is applied to a terminal device.
以下结合附图对本公开的实施例进行详细说明,应当理解,以下所说明的实施例仅用于说明和解释本公开的技术方案,并不用于限制本公开的保护范围。The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the embodiments described below are only used to illustrate and explain the technical solutions of the present disclosure, and are not used to limit the protection scope of the present disclosure.
图1是本公开的实施例提供的终端设备天线装置的实现方法的流程图。如图1所示,本公开的实施例的终端天线装置的实现方法包括以下步骤S101至S103。FIG. 1 is a flowchart of a method for implementing a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 1, a method for implementing a terminal antenna device according to an embodiment of the present disclosure includes the following steps S101 to S103.
步骤S101:在终端设备主板的金属地上划分出配置为平衡金属地电流的全封闭非金属区域。Step S101: A fully enclosed non-metallic area configured to balance the current of the metal ground is divided on the metal ground of the main board of the terminal device.
具体地,所述终端设备主板可具有至少两层印刷电路层,在所述终端设备主板的每层印刷电路层的金属地上均可划分出全封闭非金属区域。例如,如果终端设备主板具有顶层和底层两层电路层,则在所述终端设备主板顶层的金属地上划分出全封闭非金属区域,并在所述终端设备主板底层的金属地上划分出全封闭非金属区域。如果终端设备主板的顶层和底层之间还具有(至少一层)内层,则在内层的每层的金属地上也划分出全封闭非金属区域。Specifically, the terminal device motherboard may have at least two printed circuit layers, and a fully enclosed non-metallic area may be divided on a metal ground of each layer of the printed circuit layer of the terminal device motherboard. For example, if the terminal equipment main board has two top and bottom circuit layers, a fully enclosed non-metallic area is divided on the metal ground on the top layer of the terminal equipment main board, and a fully enclosed non-metallic area is divided on the metal ground floor of the terminal equipment main board Metal area. If there is (at least one) inner layer between the top layer and the bottom layer of the main board of the terminal device, a fully enclosed non-metallic area is also divided on the metal ground of each layer of the inner layer.
步骤S102:在所划分的全封闭非金属区域内布置天线拓扑单元。Step S102: Arrange the antenna topology unit in the completely enclosed non-metal area.
具体地,在至少一层印刷电路层的金属地的全封闭非金属区域内布置所述天线拓扑单元。例如,在顶层金属地的全封闭非金属区域、底层金属地的全封闭非金属区域、和内层金属地的全封闭非金属区域的至少之一内布置所述天线拓扑单元。Specifically, the antenna topology unit is arranged in a fully enclosed non-metallic area of a metal ground of at least one printed circuit layer. For example, the antenna topology unit is arranged in at least one of a fully enclosed non-metallic region of a top metal ground, a fully enclosed non-metallic region of a bottom metallic ground, and a fully enclosed non-metallic region of an inner metallic ground.
所述天线拓扑单元可包括:与所述终端设备主板之间存在缝隙的第一辐射体;配置为产生工作电流的第二辐射体、第三辐射体、和 第四辐射体;以及集总元件。The antenna topology unit may include: a first radiator with a gap between the terminal device main board; a second radiator, a third radiator, and a fourth radiator configured to generate an operating current; and a lumped element .
步骤S103:所述天线拓扑单元利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。Step S103: the antenna topology unit uses a radio frequency signal provided by the motherboard of the terminal device to generate a working current, couples the working current to the metal ground, and implements a local resonance multi-stage echo differential suppression method to achieve broadband Impedance matching.
具体地,在所述天线拓扑单元处于局域谐振状态期间,由所述第二辐射体、所述第一辐射体和所述第四辐射体形成的等效网络产生回波信号,由所述第三辐射体、所述集总元件、所述金属地和所述第二辐射体形成的等效网络产生反射信号;对所述回波信号和所述反射信号进行差分抵消处理,得到差分信号,所述第一辐射体吸收所述差分信号,从而实现宽带阻抗匹配。Specifically, when the antenna topology unit is in a local resonance state, an equivalent signal formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal. An equivalent network formed by the third radiator, the lumped element, the metal ground, and the second radiator generates a reflected signal; and performs differential cancellation processing on the echo signal and the reflected signal to obtain a differential signal , The first radiator absorbs the differential signal, thereby achieving broadband impedance matching.
本公开的实施例的终端天线装置的实现方法还可包括:在所述第一辐射体、所述第二辐射体、所述第三辐射体和所述第四辐射体中的至少一个上布置与所述终端设备主板之间存在缝隙的第一金属耦合片,通过所述第一金属耦合片与所述终端设备主板之间的所述缝隙,所述第一金属耦合片与所述终端设备主板进行耦合;和/或在未布置所述天线拓扑单元的非金属区域布置与所述终端设备主板之间存在缝隙的第二金属耦合片,通过所述第二金属耦合片与所述终端设备主板之间的所述缝隙,所述第二金属耦合片与所述终端设备主板进行耦合。The method for implementing a terminal antenna device according to an embodiment of the present disclosure may further include: arranging on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator A first metal coupling sheet having a gap with the terminal device main board, and through the gap between the first metal coupling sheet and the terminal device main board, the first metal coupling sheet and the terminal device The main board is coupled; and / or a second metal coupling sheet with a gap between the antenna topological unit and the main board of the terminal device is arranged in the non-metallic area, and the second metal coupling sheet is connected to the terminal device through the second metal coupling sheet In the gap between the motherboards, the second metal coupling piece is coupled to the terminal equipment motherboard.
本公开的实施例所实现的终端设备天线装置的辐射区域为全封闭区域,受环境影响小,金属地电流呈现平衡电流,辐射特性好。而且,本公开的实施例所实现的终端设备天线装置的“O”形封闭回路比“C”形回路电流路径欧姆阻抗小,损耗小,辐射效率高,抗ESD(静电放电)效果良好。The radiation area of the terminal device antenna device implemented by the embodiments of the present disclosure is a fully enclosed area, which is less affected by the environment, the metal ground current presents a balanced current, and the radiation characteristics are good. Moreover, the "O" closed loop of the terminal device antenna device implemented by the embodiments of the present disclosure has a smaller ohmic impedance, smaller loss, higher radiation efficiency, and better anti-ESD (electrostatic discharge) effect than the "C" shaped loop current path.
另外,本公开的实施例所实现的终端设备天线装置的天线净空小,净空约为0.05λx 0.025λ(最低工作频率698MHz),远远小于1/4波长,满足LTE698-960MHz和1710-2690MHz的工作频带。In addition, the antenna headroom of the terminal device antenna device implemented by the embodiments of the present disclosure is small, and the headroom is approximately 0.05λx0.025λ (minimum operating frequency 698MHz), which is far less than 1/4 wavelength, and meets the Operating frequency band.
本公开的实施例还提供了一种终端设备天线装置,包括:金属地,位于终端设备主板上,具有配置为平衡金属地电流的全封闭非金属区域;以及天线拓扑单元,布置在所述全封闭非金属区域内,利用 所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。An embodiment of the present disclosure further provides a terminal device antenna device, including: a metal ground, located on a main board of the terminal device, and having a fully enclosed non-metallic area configured to balance the current of the metal ground; and an antenna topology unit disposed in the whole In a closed non-metallic area, a radio frequency signal provided by the motherboard of the terminal device is used to generate a working current, and the working current is coupled to the metal ground, and a local resonance multi-stage echo differential suppression method is used to achieve broadband impedance matching. .
具体地,所述终端设备主板可具有至少两层印刷电路层,每层印刷电路层的金属地上均可具有全封闭非金属区域。例如,金属地具体包括位于所述终端设备主板顶层印刷电路层的顶层金属地和位于所述终端设备主板底层印刷电路层的底层金属地,所述顶层金属地和所述底层金属地均具有全封闭非金属区域。如果所述终端设备主板具有两层以上印刷电路层,即顶层和底层之间存在内层(其具有至少一层印刷电路层),则金属地还包括内层的每层印刷电路层的内层金属地。Specifically, the terminal device motherboard may have at least two printed circuit layers, and each layer of the printed circuit layer may have a fully enclosed non-metallic area on a metal ground. For example, the metal ground specifically includes a top metal ground located on the top printed circuit layer of the terminal device motherboard and a bottom metal ground located on the bottom printed circuit layer of the terminal device motherboard. The top metal ground and the bottom metal ground both have Enclose non-metallic areas. If the motherboard of the terminal device has more than two printed circuit layers, that is, there is an inner layer (which has at least one printed circuit layer) between the top layer and the bottom layer, the metal floor also includes an inner layer of each of the printed circuit layers of the inner layer Metal ground.
该情况下,所述天线拓扑单元布置在至少一层印刷电路层的金属地的全封闭非金属区域,例如设置在顶层金属地的全封闭非金属区域,或者设置在顶层金属地的全封闭非金属区域和内层金属地的全封闭非金属区域等。In this case, the antenna topology unit is arranged in a fully enclosed non-metallic area of the metal ground of at least one printed circuit layer, such as a fully enclosed non-metallic area provided on the top metal ground or a fully enclosed non-metallic area provided on the top metal ground. Metal areas and fully enclosed non-metal areas such as inner metal ground.
所述天线拓扑单元可包括:与所述终端设备主板之间存在缝隙的第一辐射体;配置为产生工作电流的第二辐射体、第三辐射体、和第四辐射体;以及集总元件。The antenna topology unit may include: a first radiator with a gap between the terminal device main board; a second radiator, a third radiator, and a fourth radiator configured to generate an operating current; and a lumped element .
在所述天线拓扑单元处于局域谐振状态期间,由所述第二辐射体、所述第一辐射体和所述第四辐射体形成的等效网络产生回波信号,由所述第三辐射体、所述集总元件、所述金属地和所述第二辐射体形成的等效网络产生反射信号,对所述回波信号和所述反射信号进行差分抵消处理,得到差分信号,第一辐射体吸收所述差分信号,从而实现宽带阻抗匹配。When the antenna topology unit is in a local resonance state, an equivalent network formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal, and the third radiation The equivalent network formed by the body, the lumped element, the metal ground, and the second radiator generates a reflection signal, and performs differential cancellation processing on the echo signal and the reflection signal to obtain a differential signal. The radiator absorbs the differential signal, thereby achieving broadband impedance matching.
本公开的实施例的终端设备天线装置还可包括:第一金属耦合片,布置在所述第一辐射体、第二辐射体、第三辐射体和第四辐射体中的至少一个上,与所述终端设备主板之间存在缝隙,且通过与所述终端设备主板之间的所述缝隙,实现与所述终端设备主板的耦合;和/或第二金属耦合片,其布置在未布置所述天线拓扑单元的非金属区域,与所述终端设备主板之间存在缝隙,且通过与所述终端设备主板 之间的所述缝隙,实现与所述终端设备主板的二次耦合。The terminal device antenna device according to the embodiment of the present disclosure may further include a first metal coupling sheet disposed on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator, and There is a gap between the terminal equipment main boards, and the coupling with the terminal equipment main board is realized through the gap with the terminal equipment main board; and / or a second metal coupling sheet, which is arranged in an unarranged place There is a gap between the non-metallic area of the antenna topology unit and the main board of the terminal device, and the second coupling with the main board of the terminal device is realized through the gap with the main board of the terminal device.
下面列举本公开的实施例的天线装置的应用场合,以将本公开的实施例的天线装置应用于终端设备的主板为例。The applications of the antenna device according to the embodiments of the present disclosure are listed below. The antenna device according to the embodiments of the present disclosure is applied to a motherboard of a terminal device as an example.
图2是本公开的实施例提供的天线装置与终端设备的连接结构示意图,图3是本公开的实施例提供的终端设备天线装置的结构示意图。FIG. 2 is a schematic diagram of a connection structure of an antenna device and a terminal device according to an embodiment of the present disclosure, and FIG. 3 is a schematic diagram of a structure of a terminal device antenna device according to an embodiment of the present disclosure.
如图2和图3所示,本公开的实施例的终端设备天线装置可用于笔记本、PC机、PAD等终端设备上。天线装置与终端设备之间的接口可以是USB接口、PCMCIA接口(PC内存卡接口)、Express接口或其他接口。As shown in FIG. 2 and FIG. 3, the terminal device antenna device according to the embodiment of the present disclosure may be applied to terminal devices such as a notebook, a PC, and a PAD. The interface between the antenna device and the terminal device may be a USB interface, a PCMCIA interface (PC memory card interface), an Express interface, or other interfaces.
作为示例,本公开的实施例的终端设备天线装置可包括主板12和USB接口3,其可通过USB接口3与笔记本、PC机等终端设备相连。主板12可以是双面覆铜介质板,例如包括非金属材料的介质板和覆在介质板的顶层和底层上的铜层,但是,主板12上保留顶层非金属区域4和底层非金属区域5,用于布置天线拓扑单元9。主板12上除顶层非金属区域4和底层非金属区域5之外剩下的区域为金属地,并且顶层金属地和底层金属地共地。例如,每个非金属区域的尺寸可以为11mm×21mm×2mm。As an example, the terminal device antenna device of the embodiment of the present disclosure may include a main board 12 and a USB interface 3, which may be connected to a terminal device such as a notebook or a PC through the USB interface 3. The main board 12 may be a double-sided copper-clad dielectric board, for example, a dielectric board including a non-metallic material and a copper layer overlying the top and bottom layers of the dielectric board. For arranging the antenna topology unit 9. The remaining area on the main board 12 except the top non-metal area 4 and the bottom non-metal area 5 is a metal ground, and the top metal ground and the bottom metal ground are in common. For example, the size of each non-metallic region may be 11 mm × 21 mm × 2 mm.
图3是本公开的实施例提供的终端设备天线装置的结构示意图。如图3所示,本公开的实施例的终端设备天线装置可包括顶层金属地1和底层金属地2。顶层金属地1可为平面,位于主板12的正面。底层金属地2也可为平面,位于主板12的底面。主板12的材料可包括非金属材料,主板12的金属地的区域中可包含多层印刷电路层。本公开的实施例的终端设备天线装置可通过USB接口3与终端设备相连。FIG. 3 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 3, the terminal device antenna device according to the embodiment of the present disclosure may include a top metal ground 1 and a bottom metal ground 2. The top metal ground 1 may be a flat surface and is located on the front side of the motherboard 12. The bottom metal ground 2 may also be a flat surface, which is located on the bottom surface of the motherboard 12. The material of the main board 12 may include a non-metal material, and a region of the metal ground of the main board 12 may include a plurality of printed circuit layers. The terminal device antenna device according to the embodiment of the present disclosure may be connected to the terminal device through the USB interface 3.
天线拓扑单元9可布置在主板12的顶层金属地1的顶层非金属区域4和/或底层金属地2的底层非金属区域5。顶层非金属区域4和底层非金属区域5可以为方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,并不局限于图2和图3所示的矩形,且顶层非金属区域4和底层非金属区域5的形状不一定完全相同。天线拓扑单元9的馈电端口11与主板12提供的射频信号输出端口相连,天线 拓扑单元9的馈电端口11的地与主板12的金属地相连。The antenna topology unit 9 may be disposed on the top non-metal region 4 and / or the bottom non-metal region 5 of the top metal ground 1 of the main board 12. The top non-metallic region 4 and the bottom non-metallic region 5 can be any regular or irregular shape such as square, circle, diamond, trapezoid, triangle, etc., and are not limited to the rectangle shown in FIG. 2 and FIG. The shapes of the region 4 and the underlying non-metallic region 5 are not necessarily exactly the same. The feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
图4是本公开的实施例提供的终端设备天线装置的一种结构示意图。如图4所示,天线拓扑单元9可布置在顶层非金属区域4,可包括第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94、第一集总元件7、第二集总元件8、第三集总元件10和第一金属壁6。第一辐射体91、第二辐射体92、第三辐射体93和第四辐射体94可以为但不局限于方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,可采用印制或者焊接的方式设置于顶层非金属区域4。作为示例,第一辐射体91、第二辐射体92、和第四辐射体94可均采用矩形辐射贴片,第三辐射体93可采用图4所示的电感弯折线。第三辐射体93通过第四辐射体94与第一辐射体91形成耦合连接。第三辐射体93通过第三集总元件10与短路枝节95相连,并通过短路枝节95与顶层金属地1相连。第一金属壁6通过第一集总元件7和第二集总元件8与顶层金属地1相连。第一集总元件7、第二集总元件8和第三集总元件10可为电容、电感、电阻等器件的一种或组合,且调整这些集总元件的参数和分布位置,可以调整天线的谐振特性。第四辐射体94与顶层金属地1之间留有缝隙。第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94和第一金属壁6均采用金属材料。FIG. 4 is a schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 4, the antenna topology unit 9 may be arranged on the top non-metal region 4 and may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, and a first lumped element. 7. The second lumped element 8, the third lumped element 10, and the first metal wall 6. The first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle. Printed or soldered on the top non-metallic area 4. As an example, the first radiator 91, the second radiator 92, and the fourth radiator 94 may all adopt rectangular radiation patches, and the third radiator 93 may employ an inductor bending line as shown in FIG. The third radiator 93 is coupled to the first radiator 91 through a fourth radiator 94. The third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95. The first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8. The first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements may be adjusted, and the antenna may be adjusted. Resonance characteristics. A gap is left between the fourth radiator 94 and the top metal ground 1. The first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, and the first metal wall 6 are all made of a metal material.
基于上面描述的本公开的实施例的终端设备天线装置,在发射过程中,主板12上的射频信号通过馈电端口11馈入到天线拓扑单元9,使天线拓扑单元9激起工作电流,该工作电流耦合到顶层金属地1和底层金属地2中,其中天线拓扑单元9相当于一个谐振电路,工作电流通过短路枝节95流入顶层金属地1和底层金属地2,进而形成一个完整的辐射谐振电路。具体地说,在发射过程中,主板12上的射频信号从馈电端口11馈入到第二辐射体92,使得第二辐射体92激励起电流,该工作电流的一部分通过第一辐射体91进入第四辐射体94和第三辐射体93中,再经过第三集总元件10和短路枝节95进入到主板12的金属地,该工作电流的另一部分通过第一辐射体91与顶层金属地1之间的缝隙耦合到主板12的金属地,形成电流回路。Based on the terminal device antenna device of the embodiment of the present disclosure described above, during the transmission process, the radio frequency signal on the motherboard 12 is fed to the antenna topology unit 9 through the feeding port 11 to cause the antenna topology unit 9 to stimulate a working current. The working current is coupled to the top metal ground 1 and the bottom metal ground 2. The antenna topology unit 9 is equivalent to a resonant circuit. The working current flows into the top metal ground 1 and the bottom metal ground 2 through the shorting branch 95, thereby forming a complete radiation resonance. Circuit. Specifically, during the transmitting process, the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, and a part of the working current passes through the first radiator 91 Enter the fourth radiator 94 and the third radiator 93, and then enter the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and the other part of the working current passes through the first radiator 91 and the top metal ground The gap between 1 is coupled to the metal ground of the motherboard 12, forming a current loop.
图7是本公开的实施例提供的终端设备天线装置的等效电路图。如图7所示,第二辐射体92等效为第一分布电感Lse,第一辐射体91等效为辐射电阻Rse,第一辐射体91与第四辐射体94产生第一耦合电容Cse,第三辐射体93等效成第二分布电感Lsh,第二辐射体92与顶层金属地1之间产生第二耦合电容Csh和辐射导纳Gr,同时第三集总元件10产生集总电容C1。频率较低的射频能量从馈电端口11进入由第一分布电感Lse和第一耦合电容Cse所组成的网络而产生的回波信号与进入由第二分布电感Lsh、第二耦合电容Csh和集总电容C1所组成的网络而产生的反射信号具有反相的相差,通过进行多次差分相消,从而阻止回波信号进入馈电端口11。部分无法抵消的差分信号在多次反射的过程中经由第一辐射体91等效成的辐射电阻Rse以及辐射导纳Gr吸收,进而增加了频带宽度。FIG. 7 is an equivalent circuit diagram of a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 7, the second radiator 92 is equivalent to a first distributed inductance Lse, the first radiator 91 is equivalent to a radiation resistance Rse, and the first radiator 91 and the fourth radiator 94 generate a first coupling capacitance Cse, The third radiator 93 is equivalent to a second distributed inductance Lsh. A second coupling capacitor Csh and a radiative admittance Gr are generated between the second radiator 92 and the top metal ground 1. At the same time, the third lumped element 10 generates a lumped capacitance C1. . The lower frequency radio frequency energy enters the network composed of the first distributed inductor Lse and the first coupling capacitor Cse from the feed port 11 and enters the echo signal generated by the second distributed inductor Lsh, the second coupling capacitor Csh and the collector. The reflected signal generated by the network composed of the total capacitance C1 has an inverted phase difference, and the echo signal is prevented from entering the feed port 11 by performing multiple differential cancellations. Part of the irreversible differential signal is absorbed by the radiation resistance Rse and radiation admittance Gr equivalent of the first radiator 91 in the course of multiple reflections, thereby increasing the frequency bandwidth.
通过适当调节Lse、Cse、Lsh、Csh和C1的大小,可以控制整个天线装置的局域谐振状态。通过优化天线装置结构中第一辐射体91、第二辐射体92、第三辐射体93、和第四辐射体94的形状和尺寸,优化辐射体之间、辐射体与主板12之间的缝隙的大小,以及优化集总元件的参数以及分布位置,可以调节天线装置的谐振及匹配状态,并最终达到完全覆盖目标带宽的要求。By appropriately adjusting the sizes of Lse, Cse, Lsh, Csh, and C1, the local resonance state of the entire antenna device can be controlled. By optimizing the shape and size of the first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 in the antenna device structure, the gaps between the radiators and between the radiators and the main board 12 are optimized. The size of the antenna, as well as the parameters and distribution positions of the lumped elements, can adjust the resonance and matching state of the antenna device, and finally meet the requirement of completely covering the target bandwidth.
图5是本公开的实施例提供的终端设备天线装置的另一种结构示意图。如图5所示,与图4所示的终端设备天线装置的结构的不同之处在于:在第三辐射体93上设置金属耦合片13,金属耦合片13与天线辐射体之间采用非金属介质或者空气介质进行耦合。金属耦合片13与主板12之间存在缝隙,金属耦合片13通过所述缝隙与主板12之间进行耦合,从而实现天线辐射体与主板12之间的二次耦合。FIG. 5 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 5, the structure of the terminal device antenna device shown in FIG. 4 is different in that a metal coupling sheet 13 is provided on the third radiator 93, and a non-metal is used between the metal coupling sheet 13 and the antenna radiator. Medium or air medium. There is a gap between the metal coupling sheet 13 and the main board 12, and the metal coupling sheet 13 is coupled with the main board 12 through the gap, thereby achieving secondary coupling between the antenna radiator and the main board 12.
如图5所示,天线拓扑单元9可布置在主板12的顶层金属地1的顶层非金属区域4。顶层非金属区域4可以为方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,并不局限于图5所示的矩形。天线拓扑单元9的馈电端口11与主板12提供的射频信号输出端口相连,天线拓扑单元9的馈电端口11的地与主板12的金属地相连。As shown in FIG. 5, the antenna topology unit 9 may be disposed on the top non-metal region 4 of the top metal ground 1 of the main board 12. The top non-metal region 4 may be any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle, and is not limited to the rectangle shown in FIG. 5. The feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
如图5所示,天线拓扑单元9可包括第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94、金属耦合片13、第一集总元件7、第二集总元件8、第三集总元件10和第一金属壁6。第一辐射体91、第二辐射体92、第三辐射体93和第四辐射体94可以为但不局限于方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,可采用印制或者焊接的方式设置于顶层非金属区域4。作为示例,第一辐射体91、第二辐射体92和第四辐射体94可均采用矩形辐射贴片,第三辐射体93可采用图5所示的电感弯折线。金属耦合片13可以为但不局限于方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,例如,金属耦合片13可采用矩形金属片。金属耦合片13可以设置在顶层天线辐射体的全部或者部分上,不局限于图5所示的仅设置在第三辐射体93上。第三辐射体93通过第四辐射体94与第一辐射体91形成耦合连接,且第三辐射体93通过第三集总元件10与短路枝节95相连,并通过短路枝节95与顶层金属地1相连。第三辐射体93与金属耦合片13之间可以完全绝缘,或者可以在适当位置通过增加一个或者多个导电连接点实现导电连接。第一金属壁6通过第一集总元件7和第二集总元件8与顶层金属地1相连。第一集总元件7、第二集总元件8和第三集总元件10可为电容、电感、电阻等器件的一种或组合,且调整这些集总元件的参数和分布位置,可以调整天线的谐振特性。第四辐射体94与顶层金属地1之间留有缝隙。第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94、金属耦合片13和第一金属壁6可均采用金属材料。As shown in FIG. 5, the antenna topology unit 9 may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, a metal coupling sheet 13, a first lumped element 7, and a second The lumped element 8, the third lumped element 10 and the first metal wall 6. The first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle. Printed or soldered on the top non-metallic area 4. As an example, the first radiator 91, the second radiator 92, and the fourth radiator 94 may all adopt rectangular radiation patches, and the third radiator 93 may employ an inductor bending line as shown in FIG. The metal coupling sheet 13 may be, but is not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle. For example, the metal coupling sheet 13 may be a rectangular metal sheet. The metal coupling sheet 13 may be disposed on all or part of the top antenna radiator, and is not limited to being disposed on only the third radiator 93 shown in FIG. 5. The third radiator 93 is coupled to the first radiator 91 through the fourth radiator 94, and the third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95. Connected. The third radiator 93 and the metal coupling sheet 13 may be completely insulated, or may be conductively connected by adding one or more conductive connection points at appropriate positions. The first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8. The first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements may be adjusted, and the antenna may be adjusted. Resonance characteristics. A gap is left between the fourth radiator 94 and the top metal ground 1. The first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, the metal coupling sheet 13 and the first metal wall 6 may all be made of metal materials.
基于上面描述的本公开的实施例的终端设备天线装置,在发射过程中,主板12上的射频信号从馈电端口11馈入到第二辐射体92,使得第二辐射体92激励起电流,该工作电流的一部分通过第一辐射体91进入第四辐射体94和第三辐射体93中,再经过第三集总元件10和短路枝节95进入到主板12的金属地,该工作电流的另一部分通过第一辐射体91与顶层金属地1之间的缝隙耦合到主板12的金属地,形成电流回路。同时,第三辐射体93和金属耦合片13以及主板12之间通过缝隙产生多次耦合,从而产生多个谐振点,拓宽了天 线的工作频带。Based on the terminal device antenna device of the embodiment of the present disclosure described above, during the transmission process, the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, Part of the working current enters the fourth radiator 94 and the third radiator 93 through the first radiator 91, and then enters the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and another part of the working current One part is coupled to the metal ground of the main board 12 through a gap between the first radiator 91 and the top metal ground 1 to form a current loop. At the same time, multiple couplings are generated between the third radiator 93 and the metal coupling sheet 13 and the main board 12 through the gap, thereby generating multiple resonance points, which widens the working frequency band of the antenna.
通过优化天线装置结构中的第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94和金属耦合片13的形状和尺寸,优化的辐射体之间、辐射体与主板12之间、和金属耦合片13与天线辐射体之间的缝隙的大小,以及优化集总元件的参数以及分布位置,可以调节天线装置的谐振及匹配状态,并最终达到完全覆盖目标带宽的要求。By optimizing the shapes and sizes of the first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, and the metal coupling sheet 13 in the antenna device structure, the optimized radiators, the radiators and the The size of the gap between the main boards 12 and between the metal coupling sheet 13 and the antenna radiator, as well as optimizing the parameters and distribution positions of the lumped components, can adjust the resonance and matching state of the antenna device, and finally achieve a complete coverage of the target bandwidth. Claim.
图6是本公开的实施例提供的终端设备天线装置的再一种结构示意图。如图6所示,与图4所示的终端设备天线装置的结构的不同之处在于:在底层非金属区域5内设置金属耦合片14,金属耦合片14可采用印制或者焊接的方式设置于该非金属区域5内。金属耦合片14与主板12之间存在缝隙,金属耦合片14通过所述缝隙与主板12之间进行耦合,从而实现天线辐射体与主板12之间的二次耦合。FIG. 6 is another schematic structural diagram of a terminal device antenna device according to an embodiment of the present disclosure. As shown in FIG. 6, the structure of the terminal device antenna device shown in FIG. 4 is different: a metal coupling sheet 14 is provided in the non-metal region 5 on the bottom layer, and the metal coupling sheet 14 can be provided by printing or welding. Within the non-metallic region 5. There is a gap between the metal coupling sheet 14 and the main board 12, and the metal coupling sheet 14 is coupled with the main board 12 through the gap, thereby achieving secondary coupling between the antenna radiator and the main board 12.
如图6所示,天线拓扑单元9可布置在主板12的顶层金属地1的顶层非金属区域4,金属耦合片14可布置在主板12的底层金属地2的底层非金属区域5。顶层非金属区域4和底层非金属区域5可以为方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,并不局限于图6所示的矩形,且顶层非金属区域4和底层非金属区域5的形状不一定完全相同。天线拓扑单元9的馈电端口11与主板12提供的射频信号输出端口相连,天线拓扑单元9的馈电端口11的地与主板12的金属地相连。As shown in FIG. 6, the antenna topology unit 9 may be disposed on the top non-metal region 4 of the top metal ground 1 of the main board 12, and the metal coupling sheet 14 may be disposed on the bottom non-metal region 5 of the bottom metal ground 2 of the main board 12. The top non-metallic region 4 and the bottom non-metallic region 5 may be any regular or irregular shape such as square, circle, diamond, trapezoid, triangle, etc., and are not limited to the rectangle shown in FIG. 6. The shape of the underlying non-metallic region 5 is not necessarily the same. The feed port 11 of the antenna topology unit 9 is connected to a radio frequency signal output port provided by the main board 12, and the ground of the feed port 11 of the antenna topology unit 9 is connected to the metal ground of the main board 12.
如图6所示,天线拓扑单元9可包括第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94、金属耦合片14、第一集总元件7、第二集总元件8、第三集总元件10和第一金属壁6。第一辐射体91、第二辐射体92、第三辐射体93和第四辐射体94可以为但不局限于方形、圆形、菱形、梯形、三角形等任意规则或者不规则的形状,可采用印制或者焊接的方式设置于顶层非金属区域4和底层非金属区域5。作为示例,第一辐射体91、第二辐射体92和第四辐射体94可均采用矩形辐射贴片,第三辐射体93可采用图6中所示的电感弯折线。金属耦合片14可以为但不局限于方形、圆形、菱形、梯形、 三角形等任意规则或者不规则的形状,例如,金属耦合片14可采用矩形金属片印制于底层非金属区域5,其与顶层天线辐射体之间采用非金属介质进行耦合,且可以设置在顶层天线辐射体的全部或者部分的投影区域,不局限于图6所示的仅设置在顶层第三辐射体93的投影区域。第三辐射体93通过第四辐射体94与第一辐射体91形成耦合连接,第三辐射体93通过第三集总元件10与短路枝节95相连,并通过短路枝节95与顶层金属地1相连。第三辐射体93与金属耦合片14之间可以完全绝缘,或者可以在适当位置通过增加一个或者多个导电连接点实现导电连接。第一金属壁6通过第一集总元件7和第二集总元件8与顶层金属地1相连。第一集总元件7、第二集总元件8和第三集总元件10可为电容、电感、电阻等器件的一种或组合,且调整这些集总元件的参数和分布位置,可以调整天线的谐振特性。第四辐射体94与顶层金属地1之间留有缝隙。第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94、金属耦合片14和第一金属壁6可均采用金属材料。As shown in FIG. 6, the antenna topology unit 9 may include a first radiator 91, a second radiator 92, a third radiator 93, a fourth radiator 94, a metal coupling sheet 14, a first lumped element 7, and a second The lumped element 8, the third lumped element 10 and the first metal wall 6. The first radiator 91, the second radiator 92, the third radiator 93, and the fourth radiator 94 may be, but are not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, and a triangle. The printing or welding method is arranged on the top non-metal region 4 and the bottom non-metal region 5. As an example, the first radiator 91, the second radiator 92, and the fourth radiator 94 may each adopt a rectangular radiation patch, and the third radiator 93 may employ an inductor bending line shown in FIG. The metal coupling sheet 14 may be, but is not limited to, any regular or irregular shape such as a square, a circle, a diamond, a trapezoid, or a triangle. For example, the metal coupling sheet 14 may be a rectangular metal sheet printed on the non-metal region 5 at the bottom. The non-metallic medium is used for coupling with the top-level antenna radiator, and it can be set in the projection area of all or part of the top-level antenna radiator, and is not limited to the projection area set only in the top-level third radiator 93 shown in FIG. . The third radiator 93 is coupled to the first radiator 91 through the fourth radiator 94. The third radiator 93 is connected to the short-circuited branch 95 through the third lumped element 10, and is connected to the top metal ground 1 through the short-circuited branch 95. . The third radiator 93 and the metal coupling sheet 14 may be completely insulated, or a conductive connection may be implemented by adding one or more conductive connection points at an appropriate position. The first metal wall 6 is connected to the top metal ground 1 through a first lumped element 7 and a second lumped element 8. The first lumped element 7, the second lumped element 8, and the third lumped element 10 may be one or a combination of devices such as capacitors, inductors, and resistors, and the parameters and distribution positions of these lumped elements can be adjusted to adjust the antenna Resonance characteristics. A gap is left between the fourth radiator 94 and the top metal ground 1. The first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, the metal coupling sheet 14 and the first metal wall 6 may all be made of metal materials.
基于上面描述的本公开的实施例的终端设备天线装置,在发射过程中,主板12上的射频信号从馈电端口11馈入到第二辐射体92,使得第二辐射体92激励起电流,该工作电流的一部分通过第一辐射体91进入第四辐射体94和第三辐射体93中,再经过第三集总元件10和短路枝节95进入到主板12的金属地,该工作电流的另一部分通过第一辐射体91与顶层金属地1之间的缝隙耦合到主板12的金属地,形成电流回路。同时,第三辐射体93和金属耦合片14以及主板12之间通过缝隙产生多次耦合,从而产生多个谐振点,拓宽了天线的工作频带,Based on the terminal device antenna device of the embodiment of the present disclosure described above, during the transmission process, the radio frequency signal on the main board 12 is fed from the feeding port 11 to the second radiator 92, so that the second radiator 92 excites a current, Part of the working current enters the fourth radiator 94 and the third radiator 93 through the first radiator 91, and then enters the metal ground of the main board 12 through the third lumped element 10 and the short-circuit branch 95, and another part of the working current One part is coupled to the metal ground of the main board 12 through a gap between the first radiator 91 and the top metal ground 1 to form a current loop. At the same time, the third radiator 93 and the metal coupling sheet 14 and the main board 12 are coupled multiple times through the gap, thereby generating multiple resonance points and widening the operating frequency band of the antenna.
通过优化天线装置结构中的第一辐射体91、第二辐射体92、第三辐射体93、第四辐射体94和金属耦合片14的形状和尺寸,优化的辐射体之间、辐射体与主板12之间、和金属耦合片14与天线辐射体之间的缝隙的大小,以及优化集总元件的参数以及分布位置,可以调节天线装置的谐振及匹配状态,并最终达到完全覆盖目标带宽的要求。By optimizing the shapes and sizes of the first radiator 91, the second radiator 92, the third radiator 93, the fourth radiator 94, and the metal coupling plate 14 in the antenna device structure, the optimized radiators, the radiators and the The size of the gap between the main boards 12 and between the metal coupling sheet 14 and the antenna radiator, as well as optimizing the parameters and distribution positions of the lumped components, can adjust the resonance and matching state of the antenna device, and finally achieve a complete coverage of the target bandwidth Claim.
综上所述,本公开的实施例的天线装置通过在主板上设置仅包含有天线辐射体、金属耦合片和缝隙等要素的非金属区域,通过优化该非金属区域的形状及该非金属区域内的要素,最终实现完全覆盖目标频段的要求。In summary, the antenna device according to the embodiment of the present disclosure provides a non-metallic region including only an antenna radiator, a metal coupling sheet, and a slot on the main board, and optimizes the shape of the non-metallic region and the non-metallic region. Elements, and ultimately achieve the requirements of full coverage of the target frequency band.
本公开的实施例的各天线辐射体的形状并不局限于附图所示的形状,且辐射体的尺寸、辐射体间的缝隙的大小不限于附图所示的尺寸。The shape of each antenna radiator of the embodiment of the present disclosure is not limited to the shape shown in the drawings, and the size of the radiators and the size of the gap between the radiators are not limited to the sizes shown in the drawings.
本公开的实施例的非金属区域的形状可以是任意规则或者不规则的形状,并不限于附图所示的形状,主板顶层的非金属区域的形状与主板底层的非金属区域的形状也不需要完全相同。The shape of the non-metallic region of the embodiment of the present disclosure may be any regular or irregular shape, and is not limited to the shape shown in the drawings. The shape of the non-metallic region on the top layer of the motherboard and the shape of the non-metallic region on the bottom layer of the motherboard are also not limited. Need to be exactly the same.
本公开的实施例中进行谐振的网络可以采用电感或电容组成,或者可采用电感和电容的组合。The resonant network in the embodiments of the present disclosure may be composed of an inductor or a capacitor, or a combination of an inductor and a capacitor may be used.
本公开的实施例的天线装置不限于工作在本公开的实施例所描述的频带范围,可根据需求,调整天线的尺寸,以满足工作频带的要求。The antenna device of the embodiment of the present disclosure is not limited to operate in the frequency band range described in the embodiments of the present disclosure. The size of the antenna can be adjusted according to requirements to meet the requirements of the operating frequency band.
图8是本公开的实施例提供的天线装置应用于终端设备上时的S11参数图。天线装置覆盖了所需的LTE频段698MHz~960MHz和1710MHz~2690MHz,满足天线高性能的要求。FIG. 8 is an S11 parameter diagram when the antenna device according to the embodiment of the present disclosure is applied to a terminal device. The antenna device covers the required LTE frequency bands from 698MHz to 960MHz and 1710MHz to 2690MHz, which meets the requirements for high performance of the antenna.
图9是本公开的实施例提供的天线装置应用于终端设备上时的辐射效率图。天线装置在低频段的辐射效率大于60%,在高频段的辐射效率的大于60%。可以看出,该天线装置覆盖了所需的LTE频段698MHz~960MHz和1710MHz~2690MHz,因此具有高效率的特点,满足天线高性能的要求。FIG. 9 is a radiation efficiency diagram when an antenna device according to an embodiment of the present disclosure is applied to a terminal device. The radiation efficiency of the antenna device in the low frequency band is greater than 60%, and the radiation efficiency in the high frequency band is greater than 60%. It can be seen that the antenna device covers the required LTE frequency bands from 698MHz to 960MHz and 1710MHz to 2690MHz, so it has the characteristics of high efficiency and meets the requirements of high performance of the antenna.
综上所述,本公开的实施例的天线装置具有以下技术效果:通过金属围边封闭结构,实现了辐射区域为全封闭区域,金属地电流平衡;通过金属围边封闭结构,实现了“O”形封闭回路,比“C”形回路的电流路径的欧姆阻抗小,损耗小,辐射效率高,抗ESD效果良好;通过局域谐振多阶回波差分抑制方法,实现了小型化高电抗下的宽带阻抗匹配,减小了天线净空,净空约为0.05λ×0.025λ(最低工作频率698MHz),远远小于1/4波长,同时覆盖LTE698MHz-960MHz 和1710MHz-2690MHz的宽频段。In summary, the antenna device according to the embodiment of the present disclosure has the following technical effects: The metal enclosure structure is used to achieve a fully enclosed radiation area, and the metal ground current is balanced. The metal enclosure structure is used to achieve "O "" Closed loop, smaller than ohmic impedance of the current path of the "C" loop, less loss, high radiation efficiency, and good anti-ESD effect; through the local resonance multi-order echo differential suppression method, miniaturization and high reactance are realized. The wide-band impedance matching reduces the antenna headroom. The headroom is about 0.05λ × 0.025λ (minimum operating frequency 698MHz), which is far less than 1/4 wavelength, and covers the wide frequency bands of LTE698MHz-960MHz and 1710MHz-2690MHz.
尽管上文对本公开的一些实施例进行了详细说明,但是本公开不限于此,本技术领域技术人员可以根据本公开的原理进行各种修改。因此,凡按照本公开的原理所作的修改,都应当理解为落入本公开的保护范围。Although some embodiments of the present disclosure have been described in detail above, the present disclosure is not limited thereto, and those skilled in the art can make various modifications according to the principles of the present disclosure. Therefore, any modification made in accordance with the principles of this disclosure should be understood to fall within the protection scope of this disclosure.
Claims (12)
- 一种终端设备天线装置的实现方法,包括:A method for implementing a terminal device antenna device includes:在终端设备主板的金属地上划分出配置为平衡金属地电流的全封闭非金属区域;A fully enclosed non-metallic area configured to balance the current of the metal ground is divided on the metal ground of the motherboard of the terminal device;在所划分的全封闭非金属区域内布置天线拓扑单元;以及Arranging antenna topology elements in the divided fully enclosed non-metallic area; and所述天线拓扑单元利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。The antenna topology unit uses a radio frequency signal provided by the main board of the terminal device to generate a working current, couples the working current to the metal ground, and uses a local resonance multi-stage echo differential suppression method to achieve broadband impedance matching.
- 根据权利要求1所述的方法,其中,所述终端设备主板具有至少两层印刷电路层,在终端设备主板的金属地上划分出配置为平衡金属地电流的全封闭非金属区域包括:The method according to claim 1, wherein the main board of the terminal device has at least two printed circuit layers, and dividing a fully enclosed non-metallic area configured to balance the current of the metal ground on the metal ground of the main board of the terminal device comprises:在所述终端设备主板的每层印刷电路层的金属地上均划分出全封闭非金属区域。A fully enclosed non-metallic area is divided on the metal ground of each layer of the printed circuit layer of the main board of the terminal device.
- 根据权利要求2所述的方法,其中,在所划分的全封闭非金属区域内布置天线拓扑单元包括:The method according to claim 2, wherein arranging the antenna topology unit in the divided fully enclosed non-metallic area comprises:在至少一层印刷电路层的全封闭非金属区域内布置所述天线拓扑单元。The antenna topology unit is arranged in a totally enclosed non-metallic area of at least one printed circuit layer.
- 根据权利要求2所述的方法,其中,所述终端设备主板的每层印刷电路层的金属地共地。The method according to claim 2, wherein a metal ground of each printed circuit layer of the main board of the terminal device is common ground.
- 根据权利要求1至4中任意一项所述的方法,其中,所述天线拓扑单元包括:与所述终端设备主板之间存在缝隙的第一辐射体;配置为产生所述工作电流的第二辐射体、第三辐射体、和第四辐射体;以及集总元件,The method according to any one of claims 1 to 4, wherein the antenna topology unit comprises: a first radiator having a gap with a motherboard of the terminal device; and a second radiator configured to generate the working current. A radiator, a third radiator, and a fourth radiator; and a lumped element,所述天线拓扑单元利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多 阶回波差分抑制方式,实现宽带阻抗匹配包括:The antenna topology unit uses a radio frequency signal provided by the main board of the terminal device to generate a working current, and couples the working current to the metal ground. Using a local resonance multi-stage echo differential suppression method to achieve broadband impedance matching includes :在所述天线拓扑单元处于局域谐振状态期间,由所述第二辐射体、所述第一辐射体和所述第四辐射体形成的等效网络产生回波信号,由所述第三辐射体、所述集总元件、所述金属地和所述第二辐射体形成的等效网络产生反射信号;When the antenna topology unit is in a local resonance state, an equivalent network formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal, and the third radiation An equivalent network formed by the body, the lumped element, the metal ground, and the second radiator generates a reflected signal;对所述回波信号和所述反射信号进行差分抵消处理,得到差分信号,第一辐射体吸收所述差分信号,从而实现宽带阻抗匹配。Perform differential cancellation processing on the echo signal and the reflected signal to obtain a differential signal, and the first radiator absorbs the differential signal, thereby achieving broadband impedance matching.
- 根据权利要求5所述的方法,还包括:The method according to claim 5, further comprising:在所述第一辐射体、所述第二辐射体、所述第三辐射体和所述第四辐射体中的至少一个上布置与所述终端设备主板之间存在缝隙的第一金属耦合片,通过所述第一金属耦合片与所述终端设备主板之间的所述缝隙,所述第一金属耦合片与所述终端设备主板进行耦合;和/或A first metal coupling sheet having a gap between the first radiator, the second radiator, the third radiator, and the fourth radiator and a main board of the terminal device is arranged on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator. Through the gap between the first metal coupling sheet and the terminal device motherboard, the first metal coupling sheet is coupled with the terminal device motherboard; and / or在未布置所述天线拓扑单元的非金属区域布置与所述终端设备主板之间存在缝隙的第二金属耦合片,通过所述第二金属耦合片与所述终端设备主板之间的所述缝隙,所述第二金属耦合片与所述终端设备主板进行耦合。A second metal coupling sheet with a gap between the antenna topological unit and the motherboard of the terminal device is arranged in the non-metallic area where the antenna topology unit is not arranged, and the gap between the second metal coupling sheet and the motherboard of the terminal device is passed through , The second metal coupling piece is coupled to the terminal device motherboard.
- 一种终端设备天线装置,包括:A terminal equipment antenna device includes:金属地,位于终端设备主板上,具有配置为平衡金属地电流的全封闭非金属区域;以及A metal ground, located on the motherboard of the terminal, with a fully enclosed non-metallic area configured to balance the current of the metal ground; and天线拓扑单元,布置在所述全封闭非金属区域内,利用所述终端设备主板提供的射频信号,产生工作电流,并将所述工作电流耦合到所述金属地,利用局域谐振多阶回波差分抑制方式,实现宽带阻抗匹配。The antenna topology unit is arranged in the fully enclosed non-metallic area, and uses a radio frequency signal provided by the main board of the terminal device to generate a working current, and couples the working current to the metal ground, and utilizes a local resonance multi-stage return Wave differential suppression method to achieve broadband impedance matching.
- 根据权利要求7所述的装置,其中,所述终端设备主板具有至少两层印刷电路层,每层印刷电路层的金属地上均具有全封闭非金属区域。The device according to claim 7, wherein the main board of the terminal device has at least two printed circuit layers, and each layer of the printed circuit layer has a fully enclosed non-metal area on a metal ground.
- 根据权利要求8所述的装置,其中,所述天线拓扑单元布置在至少一层印刷电路层的金属地的全封闭非金属区域。The device according to claim 8, wherein the antenna topology unit is disposed in a fully enclosed non-metallic area of a metal ground of at least one printed circuit layer.
- 根据权利要求8所述的装置,其中,所述终端设备主板的每层印刷电路层的金属地共地。The device according to claim 8, wherein a metal ground of each printed circuit layer of the main board of the terminal device is common ground.
- 根据权利要求7所述的装置,其中,所述天线拓扑单元包括:与所述终端设备主板之间存在缝隙的第一辐射体;配置为产生所述工作电流的第二辐射体、第三辐射体、和第四辐射体;以及集总元件,The device according to claim 7, wherein the antenna topology unit comprises: a first radiator having a gap with the main board of the terminal device; a second radiator and a third radiator configured to generate the working current; And fourth radiator; and lumped elements,在所述天线拓扑单元处于局域谐振状态期间,由所述第二辐射体、所述第一辐射体和所述第四辐射体形成的等效网络产生回波信号,由所述第三辐射体、所述集总元件、所述金属地和所述第二辐射体形成的等效网络产生反射信号,对所述回波信号和所述反射信号进行差分抵消处理,得到差分信号,第一辐射体吸收所述差分信号,从而实现宽带阻抗匹配。When the antenna topology unit is in a local resonance state, an equivalent network formed by the second radiator, the first radiator, and the fourth radiator generates an echo signal, and the third radiation The equivalent network formed by the body, the lumped element, the metal ground, and the second radiator generates a reflection signal, and performs differential cancellation processing on the echo signal and the reflection signal to obtain a differential signal. The radiator absorbs the differential signal, thereby achieving broadband impedance matching.
- 根据权利要求11所述的装置,还包括:The apparatus according to claim 11, further comprising:第一金属耦合片,布置在所述第一辐射体、第二辐射体、第三辐射体和第四辐射体中的至少一个上,与所述终端设备主板之间存在有缝隙,且通过与所述终端设备主板之间的所述缝隙,实现与所述终端设备主板的耦合;和/或The first metal coupling sheet is arranged on at least one of the first radiator, the second radiator, the third radiator, and the fourth radiator, and a gap exists between the terminal radiator and the main board of the terminal device, and The gap between the terminal equipment main boards to achieve coupling with the terminal equipment main boards; and / or第二金属耦合片,其布置在未布置所述天线拓扑单元的非金属区域,与所述终端设备主板之间存在有缝隙,且通过与所述终端设备主板之间的所述缝隙,实现与所述终端设备主板的二次耦合。The second metal coupling piece is arranged in a non-metallic area where the antenna topology unit is not arranged, and a gap exists between the terminal equipment main board and the gap between the second metal coupling piece and the terminal equipment main board. Secondary coupling of the main board of the terminal equipment.
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EP19806600.3A EP3799206A4 (en) | 2018-05-23 | 2019-05-22 | Terminal device antenna apparatus and implementation method |
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EP3799206A1 (en) | 2021-03-31 |
EP3799206A4 (en) | 2021-08-04 |
CN110534874A (en) | 2019-12-03 |
CN110534874B (en) | 2022-02-25 |
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