WO2019206064A1

WO2019206064A1 - Welding piece, packaging assembly and electronic device

Info

Publication number: WO2019206064A1
Application number: PCT/CN2019/083627
Authority: WO
Inventors: 张岳刚; 杨俊�
Original assignee: 维沃移动通信有限公司
Priority date: 2018-04-24
Filing date: 2019-04-22
Publication date: 2019-10-31
Also published as: CN108550562B; CN108550562A

Abstract

The present disclosure provides a welding piece, a packaging assembly and an electronic device, the welding piece comprising: a support, the support being a void structure; and a solder layer provided on the outer surface of the support, the melting point of the solder layer being less than the melting point of the support.

Description

Weldments, package components and electronics

Cross-reference to related applications

The present application claims priority to Chinese Patent Application No. 201101374180.8, filed on Jan. 24, s.

Technical field

The present disclosure relates to the field of welding technology, and in particular, to a welding member, a package assembly, and an electronic device.

Background technique

With the development of communication technology, the functions of electronic devices are becoming more and more powerful. The number of devices in electronic devices is increasing and the size of devices is increasing, which affects the portability of electronic devices. Therefore, system-in-package (System In a The Package, SIP) scheme compresses the size of the devices within the electronic device. A system-level packaging solution that integrates multiple chips, such as processors, memories, etc., into one package component. By three-dimensionally stacking the device, the device size is greatly reduced, so that the overall size of the electronic device can meet the portability requirements.

In a related art system level packaging scheme, a chip is soldered to a substrate by a solder ball to form a package assembly. When the package component is attached to the main board of the electronic device for reflow soldering, the solder ball, the chip, and the substrate are expanded and squeezed at the high temperature of the reflow soldering to generate stress, and the generated stress cannot be absorbed, which may cause cracking of the interface of the material after cooling and shrinkage. . Since the solder ball is still in a molten state at this time, it penetrates along the gap, eventually causing a short circuit between the solder balls, affecting the normal use of the electronic device.

It can be seen that the system-level packaging scheme of the related art has the technical problem that the extrusion stress cannot be absorbed, the interface of the material in the package component is cracked, the solder ball is infiltrated, and the internal short circuit of the package component is caused.

Summary of the invention

Embodiments of the present disclosure provide a soldering member, a package assembly, and an electronic device to solve the technical problem that the electronic device of the related art has a system-level packaging scheme that causes an internal short circuit of the package component due to the inability to absorb the pressing stress.

In order to solve the above technical problems, the present disclosure is implemented as follows:

In a first aspect, an embodiment of the present disclosure provides a welded component, including:

a support body, wherein the support body is a void structure;

And a solder layer disposed on an outer surface of the support, the solder layer having a melting point smaller than a melting point of the support.

In a second aspect, an embodiment of the present disclosure provides a package assembly comprising: a substrate, a chip, and at least one soldering member, the soldering member being the soldering member according to any one of the first aspects, each soldering member being disposed Between the substrate and the chip, the substrate and the chip are both soldered to a solder layer of the soldering member, and the substrate and the chip are electrically connected through the solder layer.

In a third aspect, an embodiment of the present disclosure provides an electronic device, comprising the package assembly of any of the second aspects.

In the embodiment of the present disclosure, the solder layer of the soldering member is disposed on the outer surface layer of the support body, and the support body has a void structure having a melting point larger than that of the solder layer. Thus, when the solder layer is melted and deformed, the support body absorbs the deformation stress of the solder layer through the internal void under the deformation pressure of the solder layer. In the embodiment of the present disclosure, the weldable member capable of absorbing deformation stress is applied to the package assembly, and the support body of the weldment member can absorb the deformation stress of the solder layer by compressive deformation, thereby avoiding cracking of the material interface in the package assembly, thereby causing the package assembly. The shortcoming of internal short circuit enhances the reliability of electronic equipment.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments of the present disclosure will be briefly described. It is obvious that the drawings in the following description are only some embodiments of the present disclosure. Other drawings may also be obtained from those of ordinary skill in the art in view of the drawings.

1 is a schematic structural view of a welded member according to an embodiment of the present disclosure;

2 is a schematic structural view of another welding member according to an embodiment of the present disclosure;

3 is a schematic structural view of another welding member according to an embodiment of the present disclosure;

4 is a schematic structural diagram of a package assembly according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of a welded part of a package assembly according to an embodiment of the present disclosure; FIG.

FIG. 6 is a schematic structural view of another welding member according to an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.

Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of a soldering member according to an embodiment of the present disclosure. As shown in FIG. 1, a weldment 100 includes:

a support body 110, the support body 110 is a void structure;

And a solder layer 120 disposed on an outer surface of the support 110, the solder layer 120 having a melting point smaller than a melting point of the support 110.

The soldering piece 100 provided in this embodiment includes a support body 110 and a solder layer 120. Wherein, the solder layer 120 is disposed on the outer surface of the support body 110 for achieving the basic soldering function of the soldering member 100. The soldering member 100 can be disposed within the package assembly 200 for connecting components within the package assembly 200. The components to be connected are connected to the solder layer 120 of the soldering member 100, and electrical connections can be made between the components through the solder layer 120. The solder layer 120 can be implemented in a variety of ways to achieve a soldering function.

In a specific embodiment, as shown in FIG. 1 , the solder layer 120 may be wrapped around the entire outer surface of the support 110 such that the components in contact with the outer surface of the support 110 may be soldered through the solder layer 120, and Electrical connections are made between these elements by solder layer 120.

In another embodiment, as shown in FIG. 2, the solder layer 120 may also only wrap a portion of the outer surface of the support 110. In this embodiment, the solder layer 120 may also be an integrally connected solder tab distributed on the outer surface of the support body 110, so that components that are in contact with the solder tabs on the outer surface of the support body 110 can be soldered through the solder tab. And the electrical connection of the part of the components can also be achieved by the integrally connected solder tabs.

In other embodiments, the solder layer 120 may be partially disposed on the outer surface of the support 110. The solder layer 120 may also be a separate solder tab distributed on the outer surface of the support 110. The mutually separated soldering pieces may be electrically connected by wires (not shown) or by a support body 110 having a conductive function. Thus, the components in contact with the portion of the solder tab can be soldered by the solder tab, and the portions are electrically connected by the separate solder tab. Other solutions that can achieve the soldering function of the solder layer 120 can be applied to the embodiment, and are not limited.

The support body 110 is a support member of the weldment 100, and the support body 110 is provided with a gap therein. Thus, when the solder layer 120 is melted to deform, the support 110 can absorb the deformation pressure generated by the deformation stress of the solder layer 120.

The support body 110 serves as a support member and has an attribute of absorbing stress. A gap is formed in the support body 110, and the compression stress can be absorbed by the internal cavity to absorb the compressive stress, and the void can also be filled with the molten solder to form a compressed state, thereby absorbing the external deformation stress. The support body 110 can also be a compressible elastic member such as a cavity housing or a foam sphere. In view of the fact that the support 110 needs to achieve a supporting and stress absorbing function when the solder layer 120 is melted, the melting point of the solder layer 120 is set to be smaller than the melting point of the support 110. In one embodiment, the difference between the melting point of the solder layer 120 and the melting point of the support 110 may be greater than 10 degrees Celsius, for example, the difference in melting point between the two is set to be between 10 degrees Celsius and 20 degrees Celsius. Thus, the support body 110 does not melt when the solder layer 120 is melted, but is compressible to serve as a support to ensure an effective spacing of the package assembly 200.

In a specific embodiment, the solder layer 120 may be made of tin, and the support 110 may be made of copper or silver. In other embodiments, the solder layer 120 may be made of a tin-copper silver alloy, and the support 110 may be made of copper. Other material selection schemes that can achieve the above-described functions of the weldment 100 can be applied to the present embodiment without limitation.

The welding piece 100 provided by the embodiment of the present disclosure may be used in the following processes:

The soldering member 100 is disposed between at least two components to be connected such that the at least two components are soldered to the solder layer 120 of the soldering member 100, and the solder layer between the at least two components passing through the soldering member 100 is ensured. 120 achieves electrical connection.

The soldering member 100 provided by the embodiment of the present disclosure may be applied to a package assembly. As shown in FIG. 4 , the package assembly 200 includes a substrate 210 , a chip 220 , and at least one soldering member 100 .

Each of the soldering members 100 is disposed between the substrate 210 and the chip 220. The substrate 210 and the chip 220 are soldered to the solder layer 120 of the soldering member 100. The substrate 210 and the chip 220 pass through. The solder layer 120 is electrically connected.

The at least two soldering members 100 are disposed between the substrate 210 and the chip 220 in the package assembly 200 such that both the substrate 210 and the chip 220 are soldered to the solder layer 120 of the soldering member 100, and between the substrate 210 and the chip 220 are ensured. Electrical connection is achieved by solder layer 120. The package assembly 200 can also include a mold 230 and a passive member 240 to implement packaging functions and other functions.

Thus, when the solder layer 120 of the soldering member 100 is deformed by melting, as shown in FIG. 5, the support body 110 of the soldering member 100 is pressed by the plastic seal 230 under the deformation stress of the solder layer 120, and the support body 110 passes through the gap. The structure, which compresses and/or deforms under external deformation stress, absorbs the deformation stress of the solder layer 120, and can effectively improve the reliability of the electronic device to which the package assembly is applied.

Specifically, when the package assembly 200 is over-reflow soldered, the soldering member 100 disposed between the substrate 210 and the chip 220 can still maintain a certain shape. At this time, the solder layer 120 is melted and deformed, the substrate 210 and the chip 220 press the solder layer 120 of the soldering member 100 and the support 110, and the voids in the support 110 can be absorbed by the substrate 210 by absorbing the melt of the solder layer 120. The stress, or the support body 110 can also absorb the stress of the substrate 210 by extrusion deformation, so as to effectively protect the substrate 210 and the chip 220 from cracking, and the molten material of the solder layer 120 cannot flow into the substrate 210. Therefore, the internal short circuit of the package component 200 can be effectively avoided.

The soldering member provided by the embodiment of the present disclosure provides a solder layer of the soldering member on the outer surface of the supporting body, and the supporting body is a void structure larger than the solder layer. The support body is a void structure, so that when the solder layer is melted and deformed, the support body can absorb the deformation stress of the solder layer, thereby avoiding cracking of the material interface in the package component to which the soldering member is applied, solder penetration, and further short circuit inside the package component. Defects enhance the reliability of electronic devices.

On the basis of the above embodiments, as shown in FIG. 1 to FIG. 5, the support body 110 may be a supporting sphere, and at least one gap is opened in the supporting sphere.

In the welding piece 100 provided by this embodiment, the support body 110 is a supporting sphere with a gap inside. The solder layer 120 of the soldering member 100 may be a curved solder layer 120 attached to the compressible sphere, and the entire soldering member 100 is a sphere to realize connection between the components. The support body 110 is disposed to support the ball, and the contact position between the weldment 100 and the component can be not particularly limited, which facilitates installation and welding.

Based on the above embodiment, as shown in FIG. 1 to FIG. 4, the support body 110 may be a support sphere, and the support body is a hollow spherical shell.

In the welding member 100 provided in this embodiment, the support body 110 is provided as a hollow spherical shell, and the support function can be simultaneously compressed and deformed to absorb stress. The center of the hollow spherical shell is a cavity, which can absorb the stress in various directions of the outer shell of the spherical shell to improve the stress absorption efficiency of the welded member 100. In addition, the support body 110 is provided as a hollow spherical shell, and the manufacturing material and processing cost of the support body 110 can also be saved.

The thickness of the support body 110 in the present embodiment can be flexibly set according to the magnitude of the stress, which is not limited in this embodiment.

Based on the above embodiment, as shown in FIG. 6, the support body 110 is a support sphere, and the support body is a porous sphere.

In the welding piece 100 provided in this embodiment, the support body 110 is provided as a porous sphere. In view of the fact that a large gap may be required between the components to which the weldment 100 is joined, it is required that the support body 110 can provide a large supporting force and that the deformation is small when the stress is absorbed. Therefore, the support body 110 is provided as a porous sphere or as a metal foam sphere. The porous sphere, or having a void in the foam sphere, can be filled with molten solder so that the entire support forms a compressed state and can absorb external deformation stress compression. The support body 110 is a porous sphere having a plurality of absorbable stress deformation compressions, and at the same time, can provide a large supporting force and a small deformation when absorbing stress.

On the basis of the above embodiments, the stress absorbing holes of the support body 110 may be arranged in various ways, for example, an opening is provided in a portion in contact with the support body 110 and the component, or a portion in the support body 110. There are openings in the area, etc., and are not limited. In order to prevent the external solder layer 120 from melting into the support body 110 to affect the absorption of stress, the stress absorption holes of the support body 110 are disposed inside the support body 110, and do not communicate with the outer surface of the support body 110, that is, the outer surface of the support body 110. The structure is closed to effectively prevent the molten layer 120 from melting and infiltrating to affect the stress absorption.

Based on the above embodiment, as shown in FIG. 1, the solder layer 120 is a metal spherical shell wrapped around the outer surface of the support body 110.

The soldering member 100 provided in this embodiment is provided with the solder layer 120 as a metal spherical shell wrapped around the outer surface of the support body 110. In this way, the components in contact with the soldering member 100 can be soldered through the solder layer 120, and the conductive solder layer 120 wraps the entire outer surface of the support body 110, and the components in contact with the soldering member 100 can be realized by the solder layer 120. Electrical connection. The solder layer 120 is disposed to cover the outer surface of the support body 110 of the compressible sphere, and the contact position between the soldering member 100 and the contact member may not be specifically limited to facilitate mounting and soldering.

Based on the above embodiments, the support may also be a metal foam.

In the welding piece 100 provided in this embodiment, the support body 110 is selected as a metal foam. Thus, when the welded member 100 is pressed, the support body 110 made of foam metal can be deformed by the compressive stress applied to the welded member 100 to absorb the compressive stress received by the welded member; and the solder can be partially absorbed. , reduce the volume of the support body and increase the supporting force.

Based on the above embodiment, the support body 110 is a conductor.

In view of the fact that the solder layer 120 is generally used for soldering and electrical connection of components, it is possible to provide separate solder tabs only at the locations in contact with the components. To achieve electrical connection between components, it is necessary to electrically connect the separate solder tabs. Therefore, the support body 110 can be selected as a conductor, so that the soldering piece disposed on the outer surface of the support body 110 can be electrically connected through the support body 110, thereby achieving electrical connection between the soldered components. . The solder is saved while the soldering and electrical connections are made.

Embodiments of the present disclosure are also directed to a package assembly that can be a package assembly provided in the embodiment illustrated in FIG. When the solder layer 120 of the soldering member 100 is deformed by melting, the support body 110 of the soldering member 100 absorbs the deformation stress of the outside when the solder layer 120 is melted, and the reliability of the product can be effectively improved.

On the basis of the above embodiments, as shown in FIG. 4 and FIG. 5, the number of the soldering members 100 may be at least two, and at least two soldering members 100 are spaced apart between the chip 220 and the substrate 210. . In this way, the relative isolation between the various components on the chip 220 can be effectively ensured, and the risk of short circuit is not generated due to the contact of the soldering member 100, thereby further ensuring the user's use.

Embodiments of the present disclosure are also directed to an electronic device including a package assembly, which may be the package assembly provided by the embodiment illustrated in FIG. 4 above.

In the electronic device provided by the embodiment of the present disclosure, when the package component is assembled, the soldering member capable of absorbing the deformation stress is applied to the package component, and the support body of the soldering member can absorb the deformation stress of the solder layer by compressive deformation, thereby avoiding the package. Cracking of the material interface within the component leads to defects in the internal short circuit of the package component, which enhances the reliability of the electronic device. For a specific implementation process of the embodiment of the present disclosure, reference may be made to the specific implementation process of the package component provided by the embodiment shown in FIG. 4 , and details are not described herein again.

The above is only the specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the disclosure. It should be covered within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosure should be determined by the scope of the claims.

Claims

A welded part comprising:

a support body, wherein the support body is a void structure;

And a solder layer disposed on an outer surface of the support, the solder layer having a melting point smaller than a melting point of the support.
The welded part according to claim 1, wherein the support body is a support sphere, and the support body is a hollow spherical shell.
The weldment according to claim 1, wherein the support body is a support sphere, and the support body is a porous sphere.
The weldment according to claim 3, wherein the support is a metal foam.
The weldment according to any one of claims 2 to 3, wherein the solder layer is a metal spherical shell wrapped around an outer surface of the support.
The weldment of claim 5 wherein the support is a conductor.
The soldering member according to claim 1, wherein a difference between a melting point of the solder layer and a melting point of the support is greater than 10 degrees Celsius.
The soldering member according to claim 1, wherein the support body is used for compressive deformation under external deformation stress to melt the external deformation stress when the solder layer is melted.
A package assembly comprising: a substrate, a chip, and at least one soldering member, the soldering member being the soldering member according to any one of claims 1 to 8;

Each soldering member is disposed between the substrate and the chip, the substrate and the chip are both soldered to a solder layer of the soldering member, and the substrate and the chip are electrically connected through the solder layer.
The package assembly of claim 9, wherein the number of the soldering members is at least two, and at least two soldering members are spaced apart between the chip and the substrate.
An electronic device comprising the package assembly of claim 9 or 10.