CN100452534C

CN100452534C - Flexible ring interconnection system

Info

Publication number: CN100452534C
Application number: CNB2005800171837A
Authority: CN
Inventors: 野田敦人; 一条保博; 星川重之
Original assignee: Molex LLC
Current assignee: Molex LLC
Priority date: 2004-05-28
Filing date: 2005-05-27
Publication date: 2009-01-14
Anticipated expiration: 2025-05-27
Also published as: CN1961458A; CN100505420C; CN1930736A

Abstract

Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (8) and a microelectronic device package (4). Each ring is soldered to both the substrate and the device. A portion (20, 22) of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Description

Flexible ring interconnection system

Technical field

The present invention relates generally to the high density electrical interconnection structure, relate more specifically to and in plate is used, to use electric device is connected to the interconnection structure of circuit board.

Background technology

The microelectronic component for example microprocessor of current technological level needs a large amount of reliable connections in the area that dwindles day by day.The number of connection that will be installed between the substrate on it along with electronic device and this device increases, and not carrying out single connection or single connection increases the possibility of failure.

In " fluctuation welding ", electronic unit is by being welded to substrate at the scolder that flow of molten on the substrate of electronic unit is installed.Will the substrate that electronic unit is welded on it be passed through on the scolder of the fusing of flowing, exposing metal on the lower surface of substrate surface and the solder flux surface of handling is transmitted (wick) with the scolder of fusing from the solder bath capillary that makes progress like this.Remove from the melting hopper along with having the substrate of scolder that capillary transmits the fusing of (wicked), solder cools is also solidified, and sets up to be electrically connected between the face of weld of electronic device and substrate.

Along with the increase of Connection Density in electronic technology, and along with the minimizing from the wire length of electronic device, the accelerating of the connection that must finish makes more may not carry out single connection or single connection will be failed on statistics.Even the less erratic behavior in the flatness of substrate also can cause connectivity problem.

When the contact surface of substrate and electronic device are separated from one another with different spacing, utilize the solder technology of prior art to produce a problem.For example, if one or two contact lead-wire of microprocessor or one or two contact surface separate greatlyyer than other contact lead-wires or contact surface from planar substrates, the scolder of fusing may not capillary transmission between the farther contact surface of substrate and electronic device.Interval or the variable in distance during greater than little amount of the solder technology of prior art between the surface that the contact surface of two devices maybe will connect runs into the problem that can not connect.

Even do not finish or in use during fault being electrically connected and repairing this cost that is electrically connected and to exceed the wherein cost of the product of this electronic device and support substrate operation of manufacturing usually of identification fault when the single connection between electronic device and its support substrate during manufacture.Manufacturability that improvement is electrically connected and improvement are electrically connected reliability after making will become improvement on current techniques.

Target of the present invention is a kind of connector construction, and it is applicable in high-density applications and uses, and be easy to make and shortcoming that it was mentioned before avoiding in reliable contact force is provided.

Summary of the invention

Cardinal principle purpose of the present invention is for providing such electrical connector, and it has a plurality of compliant conductive rings of arranging with array way, with the contact or the contact pad of conductive welding disk on the contact circuit plate and relative electronic device.

Microelectronic component uses little hollow conductive rings between the electric contact of electronic device and circuit board or substrate, be electrically connected and be installed to circuit board or other plane surfaces.The band of easily bending electric conducting material of each ring for extending around central point.Rotating shaft extends by each ring.The rotating shaft of each ring is arranged essentially parallel to the plane of other rotating shafts and this substrate and the plane of this electronic device.

Each ring serves as the contact of little and round types of springs, and it will be out of shape when power is in any direction pointed to the inside of ring.When removing power, ring will be got back to its original-shape.The elastic performance of ring provides the less flexible interconnect of the variation that can adapt in apparent surface's flatness.The elasticity of each ring is adaptive circuit plate or substrate deflection and shock and vibration also.

These and other purposes of the present invention, feature and advantage will be easy to understand by following detailed description.

Description of drawings

During this detailed description, will be continually with reference to the accompanying drawings, in these accompanying drawings:

Fig. 1 is the perspective view according to the discrete hollow conductive rings of principles of construction of the present invention, and it is applicable to electronic installation is connected to circuit board or other substrates;

Figure 1A has shown that the discrete hollow conductive rings response external of Fig. 1 applies power and the deformation that takes place;

Fig. 2 is microelectronic component and the end view that is installed to the hollow installing ring of a plurality of conductions of substrate;

Fig. 3 is the end view that is filled with the conductive mounting ring of elasticity electrically non-conductive material, and substrate is received in this boxing;

Fig. 4 is substrate and the end view that is installed to the hollow installing ring of a plurality of conductions of electronic device; And

Fig. 5 has shown conducting ring and at electronic device be filled with interval between the substrate of non-conductive elastomeric material.

Embodiment

Fig. 1 is the perspective view according to the discrete hollow conductive rings 10 of principles of construction of the present invention, and it can be used for electronic device is installed to circuit board or other substrates.In an illustrated embodiment, hollow conductive rings 10 has the identical diameter D of length L of fundamental sum ring 10, but also can use other structure.

Ring is preferably made by easy curved electric conducting material band, for example copper or billon or be coated with or be coated with for example spring steel of copper or gold of good conductor.Alternate embodiments can comprise elastoplast plating or that otherwise apply conductively.Do not consider its material, set up for all rings: the material of making ring is the center with the point in the space 12, by the rotating shaft 14 of its extended loop 10.Power F is applied on the ring 10 from the outside, and radial finger will cause encircling 10 bendings, as shown in Figure 1A to the inside of ring.Such as everyone knows, exceed elastic limit of materials with putting forth effort the F increase, ring will subside, as long as but the power F that applies remains on below the elastic limit of ring material, and ring 10 will play the effect of spring, and get back to its original-shape when removing the power that applies.The class spring behavior of ring 10 when using in the mode of array ring, will provide the connection that can adapt to the flatness difference between substrate 8 and electronic device 6.It can also provide can deflection connection, and this connection will more can withstand shocks and vibrate.This improved physics robustness provides by the elastomeric material of making ring 10, and its part between substrate 8 and device 4 is welding not.Ring can easily drop to critical dimension and diameter by electroforming or edm so that tolerance is kept, for example 500 microns or the like.

The ring of describing 10 be provided with side along ring 10 from an openend to the other end two nickel plating bars or be with 20,22.

Nickel plating band

20 and 22 serves as and is called as

scolder grid

20 and 22 here.As showing like that, they are encircling on 10 the outer surface basically toward each other.Their stop on scolder one road direction and transmit around the circumference capillary of this ring, thereby guarantee will not be soldered to substrate 8 or apparent surface to the flexible ring sidewall of small part, but still keep easily curved.

As shown in Figure 3, when ring 10 was attached to substrate 8, the scolder of fusing transmitted the capillary that only makes progress and reaches

scolder grid

20 and 22 up to it.The scolder that capillary transmits of making progress along ring 10 outside will form leg 24 between the top of the following sweep of ring 10 and substrate 8, as the part of conventional welding

process.Scolder grid

20 and 22 guarantee that the flexible material of making ring 10 will be coated with scolder fully during welding process, guarantee to encircle 10 and keep flexible.

In preferred embodiment as shown in Figure 1, encircle 10 sidewall cross sections and be substantially the plane or rectangle.Can select among the embodiment, the ring-side wall cross section can be circular, ovate or other shapes, though the non-rectangle sidewall shape may trend towards having more rigidity.Because circular and oval all is the ellipse of special circumstances, more general here sidewall shape is designated as ellipse.

Fig. 2 is for just being placed on the end view of the microelectronic component 4 on the hollow installing ring 10 of a plurality of conductions, and its assembly comprises and is used for electronic device 4 is installed to connector 2 on the substrate 8 on circuit board or other basic planes.Each ring 10 in Fig. 2 basically with Fig. 1 in the ring 10 that shows be identical, though

scolder grid

20 and 22 are invisible in Fig. 2.

It is 14 parallel to each other and extend into the plane of this figure that installing ring 10 in Fig. 2 is arranged in they each.In the embodiment that replaces, ring 10 can be so that their axle conllinear.

Because axle 14 extends into the plane of Fig. 2, the axle 14 of ring 10 also will be parallel to the plane of substrate 8 and extend, and the plane of the downside 6 of the plane of substrate 8 and device 4 also extends into the plane of Fig. 2.Therefore the sidewall of each ring " is faced " downside 6 of substrate 8 and device 4.Encircle the downside 6 that plane that 10 openends are positioned at is substantially perpendicular to substrate 8 and electronic device 4.

A plurality of discrete hollow conductive rings 10 each along its main body, between tie point on the downside 6 of the lip-deep conductive trace of substrate 8 and electronic device 4 or node, the redundant signals path is set.Signal can pass the both sides of ring, the circuit on the substrate 8 below the circuit from device 4 obtains and is transferred to.The inductance of the system that wherein uses these contacts is also assisted to reduce in this dual signal path.As shown in Figure 2, a plurality of conducting ring 10 initially is attached to substrate 8 and is provided for the connector of device 4.

Fig. 3 has shown the alternative embodiment of conducting ring 10, wherein encircles 10 inside 18 and is filled with elasticity electrically non-conductive material 18, for example silicones.Above-mentioned scolder leg 24 will encircle 10 and mechanically and electrically be attached to substrate 8.Filling inner space 18 with elastomeric material has increased and has encircled 10 intensity, also stops scolder to pass through wick effect or capillarity flows into inner space 18.

Fig. 4 has shown the connector 2 that is used to install electronic device.In Fig. 4, connector 2 uses above-mentioned discrete conducting ring 10 to form, but the connector 2 in Fig. 4 comprises non-conductive packing material 26 down, and it relative to each other remains on the appropriate location with conducting ring 10.This time packing material 26 can be non-conductive silicone layer, and its thickness is less than the external diameter of conducting ring 10.When downward promotion electronic device 4, each ring will be out of shape slightly.Because they are easily curved, they each tend to resist downward pressure, so each conducting ring 10 will contact with the surface of substrate 8 under it and surface 6 physics of the electronic device 4 on it.Therefore each ring will provide than utilizing the available better electric contact of the straight pin that uses in the current techniques to contact with physics in addition.

Fig. 5 has shown packing material 26 under the non-conductive elasticity of arranging between device 4 and the substrate.It also shows the hollow conducting ring 10 that is filled with down packing material, wherein descends packing material to add rigidity for ring 10.

The connector 2 that shows in Fig. 4 can initially be attached to substrate 8 or be attached to electronic device 4.It can fluctuate be welded to substrate 8, device 4 or fluctuation simultaneously be welded to they two.

As shown in Fig. 2 and Fig. 3, have scolder grid (not being presented among Fig. 4) at each hollow contact ring 10 of the connector shown in Fig. 42, it stops scolder one tunnel capillary around ring 10 of fusing to transmit, thereby destroys the elasticity that the thin metal of making ring provides.

This hollow conducting ring is preferably made by conducting metal, and this conducting metal is also accepted the scolder grid.Copper, silver and gold are excellence conductors and can provide the metal of favorable elasticity to constitute alloy with other; They can also be coated with for example nickel of scolder grid metal in the part.Ring 10 can also be formed by the plastics of plating.

One skilled in the art will know that, because each ring 10 can be from its original-shape mild compression, so ring can overcome the slight variation in the flatness of substrate 8 and/or electronic device 4.Stop the scolder scolder grid that one tunnel capillary transmits around ring by providing, the flexible sidewall of each ring serves as little and spring circle, and is out of shape when power is pointed to the inside of ring.When removing this power, ring will be got back to its original-shape.The elastic performance of ring provides the little flexible interconnect of the variation that can adapt in apparent surface's flatness.The flexibility of each ring is adaptive circuit plate or substrate deflection and shock and vibration also.The connection of result between substrate 8 and electronic device 4 more can be stood substrate and/or device deflection.This connection also more is not vulnerable to impact or vibrate the influence of initiating failure.

Though shown and described the preferred embodiments of the present invention, clearly can make a change and revise for those skilled in the art and do not depart from spirit of the present invention, scope of the present invention be limited by additional claim.

Claims

1. a microelectronic component (6) that is used for having the Plane Installation surface is installed to the connector on the planar substrates (8), and this connector comprises:

A plurality of discrete, not supported hollow conductive rings (10), each ring (10) is the band around the easily curved electric conducting material of the corresponding central point of each ring, and extend the rotating shaft (14) of each ring (10) by this correspondence central point, should easily bend the band of material and enclose hollow volume, the rotating shaft (14) of ring (10) is parallel to each other, and be parallel to the plane of this substrate and the plane of this connector, and each ring (10) has elliptic cross-section;

Each described ring (10) comprises the first and second scolder grid (20 on the outer surface that is arranged in described ring (10), 22), described scolder grid (20,22) be arranged in relative to one another on the circumference of described ring (10), these first and second scolders grid (20,22) stop the whole circumference capillary transmission of the scolder of fusing around ring (10).

2. according to the connector of claim 1, wherein the hollow volume of each described ring (10) is filled with elasticity electrically non-conductive material (18).

3. according to the connector of claim 2, wherein said electrically non-conductive material (18) comprises silicones.