WO2019203442A1 - White-light-emitting device package - Google Patents

White-light-emitting device package Download PDF

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Publication number
WO2019203442A1
WO2019203442A1 PCT/KR2019/002827 KR2019002827W WO2019203442A1 WO 2019203442 A1 WO2019203442 A1 WO 2019203442A1 KR 2019002827 W KR2019002827 W KR 2019002827W WO 2019203442 A1 WO2019203442 A1 WO 2019203442A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
light
device package
blue light
Prior art date
Application number
PCT/KR2019/002827
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French (fr)
Korean (ko)
Inventor
이영식
김충섭
박양호
한유석
Original Assignee
주식회사 옵티맥
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Publication of WO2019203442A1 publication Critical patent/WO2019203442A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to a white light emitting device package for outputting white light.
  • Light emitting devices used in light emitting device packages having light emitting devices are widely used as light emitting diodes (LEDs) as next-generation light sources due to low power consumption, low environmental pollution, and high lifetime.
  • Such light emitting diodes are widely used as backlight light sources and lighting devices of display devices such as liquid crystal displays (LCDs).
  • LCDs liquid crystal displays
  • the light emitting diode is manufactured using a semiconductor material, the spectrum of light output from the light emitting diode depends on the semiconductor material used, so that the color of light emitted from the light emitting diode is limited.
  • the red light emitting diode when white light is generated using white light emitting diodes, the red light emitting diode outputs red light as red light, the green light emitting diode outputs green light as green light, and the blue light emitting diode outputs blue light as blue light.
  • the white light is output by mixing the red light, the green light, and the blue light output from each of the red light emitting diodes, the green light emitting diodes, and the blue light emitting diodes.
  • the spectrum of each light output from the red light emitting diode, the green light emitting diode, and the blue light emitting diode is not wide, so color rendering is inferior.
  • red light emitting diodes and green light emitting diodes are not as versatile, and are much more expensive than blue light emitting diodes.
  • the problem to be solved by the present invention is to reduce the manufacturing cost of the white light emitting device package for outputting white light.
  • Another problem to be solved by the present invention is to increase the user's satisfaction with the white light output from the white light emitting device package.
  • a white light emitting device package includes a substrate, first to third blue light emitting devices respectively disposed on the substrate, and red fluorescent light containing red phosphors disposed on the first blue light emitting devices. And a green fluorescent film located on the second blue light emitting device and containing a green phosphor.
  • the white light emitting device package according to the above feature may further include a diffusion film positioned on the third blue light emitting device and containing a light diffusing agent.
  • the light diffusing agent is polymethylmethacrylate (PMMA), polystyrene (PS), polyurethane (PU), silicon dioxide (SiO 2 ), calcium carbonate, barium sulfate, silica (silica), oxide Titanium or glass beads.
  • Each of the first to third blue light emitting devices may be formed of a blue light emitting diode.
  • the white light emitting device package according to the above feature may further include a lens positioned on the first to third blue light emitting devices and refracting the light of the first to third blue light emitting devices.
  • the lens may be a single lens that refracts all the light of the first to third blue light emitting devices.
  • the white light emitting device package according to the above feature may further include a controller for controlling the amount of light of the first to third blue light emitting devices.
  • this example generates a red light and green light required for white light by using a red fluorescent film and a green fluorescent film each having a red phosphor and a green phosphor on a blue light emitting diode.
  • the range of the spectrum of the red light and the green light of the present example output through the red phosphor and the green phosphor increases, compared to the red light and the green light directly output from the red light emitting diode and the green light emitting diode.
  • the color temperature range of the white light output from the white light emitting device package of the present example is widened, thereby improving color rendering, thereby improving user satisfaction with color.
  • FIG. 1 is a cross-sectional view of a white light emitting device package according to an embodiment of the present invention.
  • FIG. 2 is a block diagram of a main configuration of a white light emitting device package according to an embodiment of the present invention.
  • the white light emitting device package 1 of the present example may include a substrate 10, first to third light emitting devices 21 to 23 positioned on the substrate 10, first and third light emitting devices ( 21-23 on the first to third optical films 31-33 positioned above each other, on the side walls 40 surrounding the first to third light emitting elements 21-23, and on the side walls 40.
  • the lens 50 is positioned.
  • the substrate 10 is a part of the lower surface of the white light emitting device package 1.
  • the board 10 is a printed circuit board on which wiring and pads are printed, and devices necessary for operation are mounted, for electrical and physical connection with the light emitting devices 21-23 positioned on the substrate 10.
  • printed circuit board, PCB printed circuit board
  • each of the light emitting devices 21-23 is electrically and physically connected to the substrate 10 through the connection between the corresponding terminals 221, 221, 231, and a corresponding pad or device of the substrate 10 disposed below.
  • each of the light emitting devices 21-23 is electrically and physically connected to the substrate 10 using various methods such as ball gray array (BGA) or surface mounting technology (SMT).
  • BGA ball gray array
  • SMT surface mounting technology
  • the substrate 10 may be a rigid printed circuit board (rigid PCB) or a flexible printed circuit board (flexible PCB).
  • rigid PCB rigid printed circuit board
  • flexible PCB flexible printed circuit board
  • Each of the first to third light emitting elements 21 to 23 may be a first to third blue light emitting diode made of a blue light emitting diode emitting blue light.
  • the first and second optical films positioned on the first and second light emitting elements 21 and 22 are fluorescent films containing phosphors
  • the third optical film 33 positioned on the third light emitting element 23 is a diffusion film.
  • the first optical film 31 positioned on the first light emitting element 21 is a red fluorescent film containing a phosphor for red light (hereinafter, a phosphor for red light is referred to as a 'red phosphor').
  • the second optical film 32 positioned on the second light emitting element 22 is a green fluorescent film containing a phosphor for green light (hereinafter, a phosphor for green light is referred to as a 'green phosphor').
  • the red phosphor and the green phosphor absorb the blue light output from the first and second light emitting elements 21 and 22, respectively, and change the wavelength to a desired size to output red light and green light, which are light whose wavelength is converted.
  • red phosphor and the green phosphor used in the red phosphor film 31 and the green phosphor film 32 of the present example a known phosphor that outputs red light and green light such as an inorganic phosphor, an organic phosphor, a fluorescent pigment, a fluorescent dye, etc. may be used. Can be.
  • An example of a method of manufacturing the first and second fluorescent films 31 and 32, respectively, is a solution in which phosphors for a corresponding color (i.e., red and green) are dispersed in a resin (hereinafter referred to as 'resin liquid for film production'). Is applied onto the fabrication substrate, printed, and then dried.
  • 'resin liquid for film production' a resin
  • Coating methods for applying the resin liquid for film production on a production substrate include a reverse roll coater, a blade coater, a slit die coater, a slot die coater, and the like.
  • the printing method may be screen printing, gravure printing or lithographic printing.
  • the manufacturing substrate may be made of metal, glass, ceramic, paper, or the like.
  • the production substrate may be provided with an adhesive layer in order to increase the adhesiveness with each of the light emitting elements (21, 22) located below, the adhesive layer is preferably made of an adhesive excellent in heat resistance, insulation and transparency, for example, rubber-based adhesive , Acrylic adhesives, urethane adhesives, silicone adhesives, and the like.
  • the diffusion film 33 positioned on the third light emitting element 23 contains a light diffusing agent, and scatters blue light output from the third light emitting element 23 so that the light is uniformly distributed to the entire surface. To spread. For this reason, the blue light passing through the diffusion film 33 is uniformly distributed on the surface to improve color reproducibility.
  • the third light emitting part BD3 including the third light emitting element 23 and the diffusion film 33 disposed thereon is different from the first and second light emitting parts BD1 and BD2.
  • the blue light output from 23) is diffused and output.
  • the diffusion film 33 of this example is a light composed of spherical particles having a size of several micrometers on a substrate made of polyester, polyethylene teraphthalate (PET), polycarbonate (PC), or silicon (silicon). It is prepared by coating or dispersing a diffusing agent.
  • Types of light diffusing agents include polymethylmethacrylate (PMMA), polystyrene (PS), polyurethane (PU), silicon dioxide (SiO 2 ), calcium carbonate, barium sulfate, silica, Titanium oxide, glass beads, or the like.
  • the diffusion film 33 positioned on the third light emitting element 23 can be omitted.
  • the white light emitting device package 1 of the present example since the red light, the green light, and the blue light are respectively output from the first to third light emitting parts BR1 to BR3, the white light emitting device package 1 is output. The light output from the outside becomes white light.
  • the first and second light emitting units BR1 and BR2 output red light and green light using the corresponding fluorescent films 31 and 32 containing phosphors, the red light directly output from the red light emitting diodes and the green light emitting diodes.
  • the range of light spectrum increases and the range of color temperature increases.
  • the color temperature of the white light according to the present example may be 2,000K to 10,000K.
  • the color rendering property of the white light of the present example output due to the mixing of the red light, the green and the blue light output from the first to third light emitting parts BR1 to BR3, respectively, improves the user's satisfaction.
  • the first to third light emitting units BR1 to BR3 all use a blue light emitting diode that is more versatile and inexpensive to manufacture than a red light emitting diode and a green light emitting diode, it is a red light emitting diode and a green light emitting diode.
  • the manufacturing cost of the white light emitting device package 1 for outputting white light according to the present example is reduced than when white light is output using both the blue light emitting diodes.
  • the side wall 40 is positioned on the substrate 10 and surrounds the first to third light emitting units BD1-BD3 positioned on the substrate 10.
  • the side wall 40 constitutes a side surface of the light emitting device package 1 and faces the first to third light emitting units BD1 to BD3 in order to increase the operating efficiency of the white light emitting device package 1.
  • the side surface may be coated with a reflective film.
  • the lens 50 forms an upper surface of the optical device package 1, and may refract or collect light from the first to third light emitting parts BD1 to BD3 located below.
  • the lens 50 is a single lens in which one refraction unit is formed, and light of the first to third light emitting units BD1 to BD3 may be refracted by one refraction unit.
  • the lens 50 is a composite lens in which three refractive portions corresponding to the first to third light emitting parts BD1 to BD3 are formed, and the light of the first to third light emitting parts BD1 to BD3 is respectively. It is also possible to be refracted by the corresponding refraction.
  • the lens 50 protects the first, second, and third light emitting parts BD1-BD3 located below from external impact or contaminants.
  • the lens 50 may be made of a transparent material such as glass, plastic, silicone, or epoxy.
  • a molding portion made of a transparent epoxy resin or the like may be located in the empty space surrounded by the substrate 10, the side wall 40 and the lens 50.
  • the first to third light emitting parts BD1 to BD3 are located in the molding part, the positions of the first to third light emitting parts BD1 to BD3 are fixed and protected by an external impact, so that the white optical device package ( 1) The risk of damage or breakage is reduced.
  • the white light emitting device package 1 may be controlled by the controller 60.
  • the controller 60 may adjust the amount of light of the first to third light emitting units BD1 to BD3.
  • the controller 60 may collectively adjust the light amounts of the first to third light emitting units BD1 to BD3, or may individually adjust the amounts of light. Through this, color sense such as color temperature and luminance of the white light generated by the white light emitting device package 1 may be adjusted.
  • first to third light emitting elements 31 red fluorescent film

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a white-light-emitting device package, and the white-light-emitting device package comprises: a substrate; first to third blue-light-emitting devices respectively positioned on the substrate; a red fluorescent film positioned on the first blue-light-emitting device and containing a red fluorescent substance; and a green fluorescent film positioned on the second blue-light-emitting device and containing a green fluorescent substance.

Description

백색 발광 소자 패키지White light emitting device package
본 발명은 백색광을 출력하는 백색 발광 소자 패키지에 관한 것이다.The present invention relates to a white light emitting device package for outputting white light.
발광 소자를 구비하고 있는 발광 소자 패키지에 사용되는 발광 소자는 낮은 소비 전력 및 낮은 환경 오염도, 그리고 고수명 등의 이유로 차세대 광원으로서 발광 다이오드(Light Emitting Diode, LED)가 널리 사용되고 있다.BACKGROUND ART Light emitting devices used in light emitting device packages having light emitting devices are widely used as light emitting diodes (LEDs) as next-generation light sources due to low power consumption, low environmental pollution, and high lifetime.
이러한 발광 다이오드는 액정 표시 장치(liquid crystal display, LCD)와 같은 디스플레이 장치의 백라이트 광원이나 조명장치 등으로 많이 사용되고 있다.Such light emitting diodes are widely used as backlight light sources and lighting devices of display devices such as liquid crystal displays (LCDs).
발광 다이오드는 반도체 재료를 이용하여 제조되므로 발광 다이오드에서 출력되는 빛의 스펙트럼은 사용되는 반도체 재료에 의존하게 되어, 발광 다이오드에서 발광되는 빛의 색상은 한정된다.Since the light emitting diode is manufactured using a semiconductor material, the spectrum of light output from the light emitting diode depends on the semiconductor material used, so that the color of light emitted from the light emitting diode is limited.
따라서, 발광 다이오드를 이용하여 백색의 빛인 백색광을 생성할 경우, 적색의 빛인 적색광을 출력하는 적색 발광 다이오드, 녹색의 빛인 녹색광을 출력하는 녹색 발광 다이오드, 및 청색의 빛인 청색광을 출력하는 청색 발광 다이오드를 모두 이용하여 각 적색 발광 다이오드, 녹색 발광 다이오드 및 청색 발광 다이오드에서 출력되는 각각의 적색광, 녹색광 및 청색광을 혼합해 백색광이 출력되도록 한다.Therefore, when white light is generated using white light emitting diodes, the red light emitting diode outputs red light as red light, the green light emitting diode outputs green light as green light, and the blue light emitting diode outputs blue light as blue light. By using all of them, the white light is output by mixing the red light, the green light, and the blue light output from each of the red light emitting diodes, the green light emitting diodes, and the blue light emitting diodes.
이때, 적색 발광 다이오드, 녹색 발광 다이오드 및 청색 발광 다이오드에서 출력되는 각 빛의 스펙트럼(spectrum) 범위가 넓지 않아 연색성(color rendering)이 떨어지는 문제가 있다.In this case, the spectrum of each light output from the red light emitting diode, the green light emitting diode, and the blue light emitting diode is not wide, so color rendering is inferior.
또한 청색 발광 다이오드와 달리 적색 발광 다이오드와 녹색 발광 다이오드는 범용성이 떨어져 가격면에서도 청색 발광 다이오드에 비해 훨씬 비싸다.In addition, unlike blue light emitting diodes, red light emitting diodes and green light emitting diodes are not as versatile, and are much more expensive than blue light emitting diodes.
선행기술문헌Prior art literature
대한민국 공개 특허 제10-2014-0110368호(공개일자: 2014년 09월 17일, 발명의 명칭: UV LED칩을 이용하는 백색 발광소자)Republic of Korea Patent Publication No. 10-2014-0110368 (published date: September 17, 2014, the name of the invention: a white light emitting device using a UV LED chip)
대한민국 공개 특허 제 10-2013-0143059호(공개일자: 2013년 12월 30일, 발명의 명칭: 형광체 시트, 이것을 사용한 LED 및 발광 장치, 그리고 LED 제조 방법)Republic of Korea Patent Publication No. 10-2013-0143059 (published date: December 30, 2013, the title of the invention: phosphor sheet, LED and light emitting device using the same, and LED manufacturing method)
본 발명이 해결하려는 과제는 백색광을 출력하는 백색 발광 소자 패키지의 제조 비용을 절감하기 위한 것이다.The problem to be solved by the present invention is to reduce the manufacturing cost of the white light emitting device package for outputting white light.
본 발명이 해결하려는 다른 과제는 백색 발광 소자 패키지에서 출력되는 백색광에 대한 사용자의 만족도를 높이기 위한 것이다.Another problem to be solved by the present invention is to increase the user's satisfaction with the white light output from the white light emitting device package.
상기 과제를 해결하기 위한 본 발명의 한 특징에 따른 백색 발광 소자 패키지는 기판, 상기 기판 위에 각각 위치하는 제1 내지 제3 청색 발광 소자, 상기 제1 청색 발광 소자 위에 위치하고 적색 형광체를 함유하는 적색 형광 필름, 및 상기 제2 청색 발광 소자 위에 위치하고 녹색 형광체를 함유하는 녹색 형광 필름을 포함한다.According to an aspect of the present invention, a white light emitting device package includes a substrate, first to third blue light emitting devices respectively disposed on the substrate, and red fluorescent light containing red phosphors disposed on the first blue light emitting devices. And a green fluorescent film located on the second blue light emitting device and containing a green phosphor.
상기 특징에 따른 백색 발광 소자 패키지는 상기 제3 청색 발광 소자 위에 위치하고 광확산제를 함유하는 확산 필름을 더 포함할 수 있다.The white light emitting device package according to the above feature may further include a diffusion film positioned on the third blue light emitting device and containing a light diffusing agent.
상기 광확산제는 폴리 메타크릴산메틸(polymethylmethacrylate, PMMA), 폴리스티렌(polystyrene, PS), 폴리우레탄(polyurethane, PU), 이산화규소(SiO2), 탄산 칼슘, 황산바륨, 실리카(silica), 산화티탄 또는 글래스 비드(glass bead)일 수 있다.The light diffusing agent is polymethylmethacrylate (PMMA), polystyrene (PS), polyurethane (PU), silicon dioxide (SiO 2 ), calcium carbonate, barium sulfate, silica (silica), oxide Titanium or glass beads.
상기 제1 내지 제3 청색 발광 소자는 각각 청색 발광 다이오드로 이루어질 수 있다.Each of the first to third blue light emitting devices may be formed of a blue light emitting diode.
상기 특징에 따른 포함하는 백색 발광 소자 패키지는 상기 제1 내지 제3 청색 발광 소자의 상부에 위치하고, 상기 제1 내지 제3 청색 발광 소자의 광을 굴절시키는 렌즈를 더 포함할 수 있다.The white light emitting device package according to the above feature may further include a lens positioned on the first to third blue light emitting devices and refracting the light of the first to third blue light emitting devices.
상기 렌즈는 상기 제1 내지 제3 청색 발광 소자의 광을 모두 굴절시키는 단일 렌즈일 수 있다.The lens may be a single lens that refracts all the light of the first to third blue light emitting devices.
상기 특징에 따른 포함하는 백색 발광 소자 패키지는 상기 제1 내지 제3 청색 발광 소자의 광량을 조절하는 제어부를 더 포함할 수 있다. The white light emitting device package according to the above feature may further include a controller for controlling the amount of light of the first to third blue light emitting devices.
이러한 특징에 따르면, 적색 발광 다이오드와 녹색 발광 다이오드에 비해 가격이 저렴한 청색 발광 다이오드를 기본 광학 소자로 이용하여 백색광을 생성하므로, 백색 발광 소자 패키지의 제조 비용이 절감된다.According to this feature, since white light is generated using a blue light emitting diode, which is less expensive than a red light emitting diode and a green light emitting diode, as a basic optical element, manufacturing cost of the white light emitting device package is reduced.
또한, 본 예는 청색 발광 다이오드 위에 적색 형광체와 녹색 형광체를 각각 구비한 적색 형광 필름과 녹색 형광 필름을 이용하여 백색광에 필요한 적색광과 녹색광을 생성한다. In addition, this example generates a red light and green light required for white light by using a red fluorescent film and a green fluorescent film each having a red phosphor and a green phosphor on a blue light emitting diode.
이로 인해, 적색 발광 다이오드와 녹색 발광 다이오드에서 바로 출력되는 적색광과 녹색광에 비해 적색 형광체와 녹색 형광체를 통해 각각 출력되는 본 예의 적색광과 녹색광의 스펙트럼의 범위가 증가한다.As a result, the range of the spectrum of the red light and the green light of the present example output through the red phosphor and the green phosphor increases, compared to the red light and the green light directly output from the red light emitting diode and the green light emitting diode.
따라서, 본 예의 백색 발광 소자 패키지에서 출력되는 백색광의 색온도 범위가 넓어져 연색성이 향상되고, 이로 인해 색감에 대한 사용자의 만족도가 향상된다.Therefore, the color temperature range of the white light output from the white light emitting device package of the present example is widened, thereby improving color rendering, thereby improving user satisfaction with color.
도 1은 본 발명의 일 실시예에 따른 백색 발광 소자 패키지의 단면도이다.1 is a cross-sectional view of a white light emitting device package according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 백색 발광 소자 패키지의 주요 구성의 블록도이다.2 is a block diagram of a main configuration of a white light emitting device package according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; In describing the present invention, if it is determined that adding specific descriptions of techniques or configurations already known in the art may make the gist of the present invention unclear, some of them will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.
여기서 사용되는 전문용어는 단지 특정 실시예를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다. 명세서에서 사용되는 '포함하는'의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분을 구체화하며, 다른 특정 특성, 영역, 정수, 단계, 동작, 요소, 성분 및/또는 군의 존재나 부가를 제외시키는 것은 아니다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the meaning of “comprising” specifies a particular characteristic, region, integer, step, operation, element, and / or component, and other specific characteristics, region, integer, step, operation, element, component, and / or group. It does not exclude the presence or addition of.
다음, 첨부된 도 1 및 도 2를 참조하여 본 발명의 일 실시예에 따른 백색 발광 소자 패키지에 대해서 설명하도록 한다.Next, a white light emitting device package according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.
도 1을 참고로 하면, 본 예의 백색 발광 소자 패키지(1)는 기판(10), 기판(10) 위에 위치하는 제1 내지 제3 발광 소자(21-23), 제1 및 제3 발광 소자(21-23) 각각의 위에 위치하는 제1 내지 제3 광학용 필름(31-33), 제1 내지 제3 발광 소자(21-23)를 에워싸고 있는 측벽(40), 그리고 측벽(40) 위에 위치하는 렌즈(50)를 구비한다.Referring to FIG. 1, the white light emitting device package 1 of the present example may include a substrate 10, first to third light emitting devices 21 to 23 positioned on the substrate 10, first and third light emitting devices ( 21-23 on the first to third optical films 31-33 positioned above each other, on the side walls 40 surrounding the first to third light emitting elements 21-23, and on the side walls 40. The lens 50 is positioned.
기판(10)은 백색 발광 소자 패키지(1)의 하부면을 이루는 부분이다.The substrate 10 is a part of the lower surface of the white light emitting device package 1.
기판(10)은 그 상부에 위치하는 각 발광 소자(21-23)와의 전기적 및 물리적인 연결을 위하여 배선과 패드(pad) 등이 인쇄되어 있고 동작에 필요한 소자 등이 실장되어 있는 인쇄회로기판(printed circuit board, PCB)일 수 있다. The board 10 is a printed circuit board on which wiring and pads are printed, and devices necessary for operation are mounted, for electrical and physical connection with the light emitting devices 21-23 positioned on the substrate 10. printed circuit board, PCB).
따라서 각 발광 소자(21-23)는 해당 단자(221, 221, 231)와 하부에 위치한 기판(10)의 해당 패드나 소자 등과의 연결을 통해 기판(10)과 전기적 및 물리적으로 연결된다. Therefore, each of the light emitting devices 21-23 is electrically and physically connected to the substrate 10 through the connection between the corresponding terminals 221, 221, 231, and a corresponding pad or device of the substrate 10 disposed below.
이때, 각 발광 소자(21-23)는 BGA(ball gray array)나 SMT 표면 실장 기술(surface mounting technology, SMT) 등과 같은 다양한 방식을 이용하여 기판(10)과 전기적 및 물리적으로 연결된다.In this case, each of the light emitting devices 21-23 is electrically and physically connected to the substrate 10 using various methods such as ball gray array (BGA) or surface mounting technology (SMT).
이러한 기판(10)은 경성 인쇄회로기판(rigid PCB)이나 연성 인쇄회로 기판(flexible PCB)일 수 있다.The substrate 10 may be a rigid printed circuit board (rigid PCB) or a flexible printed circuit board (flexible PCB).
제1 내지 제3 발광 소자(21-23) 각각은 청색광을 발광하는 청색 발광 다이오드로 이루어진 제1 내지 제3 청색 발광 다이오드일 수 있다.Each of the first to third light emitting elements 21 to 23 may be a first to third blue light emitting diode made of a blue light emitting diode emitting blue light.
각 발광 소자(21-23) 위에 위치하고 있는 제1 내지 제3 광학용 필름(31-33) 중에서, 제1 및 제2 발광 소자(21, 22) 위에 위치하고 있는 제1 및 제2 광학용 필름(31, 32)은 형광체를 함유하고 있는 형광 필름이고, 제3 발광 소자(23) 위에 위치하고 있는 제3 광학용 필름(33)은 확산 필름이다.Of the first to third optical films 31 to 33 positioned on the light emitting elements 21 to 23, the first and second optical films positioned on the first and second light emitting elements 21 and 22 ( 31 and 32 are fluorescent films containing phosphors, and the third optical film 33 positioned on the third light emitting element 23 is a diffusion film.
이때, 제1 발광 소자(21) 위에 위치하는 제1 광학용 필름(31)은 적색광을 위한 형광체(이하, 적색광을 위한 형광체를 '적색 형광체'라 함)를 함유하고 있는 적색 형광 필름이고, 이때, 제2 발광 소자(22) 위에 위치하는 제2 광학용 필름(32)은 녹색광을 위한 형광체(이하, 녹색광을 위한 형광체를 '녹색 형광체'라 함)를 함유하고 있는 녹색 형광 필름이다.In this case, the first optical film 31 positioned on the first light emitting element 21 is a red fluorescent film containing a phosphor for red light (hereinafter, a phosphor for red light is referred to as a 'red phosphor'). The second optical film 32 positioned on the second light emitting element 22 is a green fluorescent film containing a phosphor for green light (hereinafter, a phosphor for green light is referred to as a 'green phosphor').
이때, 적색 형광체와 녹색 형광체는 각각 제1 및 제2 발광 소자(21, 22)에서 출력되는 청색광을 흡수하여 파장을 원하는 크기로 변화시켜 파장이 변환된 빛인 적색광과 녹색광을 각각 출력하기 위한 것이다.In this case, the red phosphor and the green phosphor absorb the blue light output from the first and second light emitting elements 21 and 22, respectively, and change the wavelength to a desired size to output red light and green light, which are light whose wavelength is converted.
이로 인해, 제1 발광 소자(21)와 그 위에 위치한 적색 형광 필름(21)을 구비하고 있는 제1 발광부(BD1)는 청색광 대신 적색광을 출력하고, 제2 발광 소자(22)와 그 위에 위치한 녹색 형광 필름(22)을 구비하고 있는 제2 발광부(BD2)는 청색광 대신 녹색광을 출력한다.As a result, the first light emitting unit BD1 including the first light emitting device 21 and the red fluorescent film 21 disposed thereon outputs red light instead of blue light, and the second light emitting device 22 and the light emitting device 22 disposed thereon. The second light emitting part BD2 including the green fluorescent film 22 outputs green light instead of blue light.
본 예의 적색 형광 필름(31)과 녹색 형광 필름(32)에 사용되는 적색 형광체와 녹색 형광체는 무기 형광체, 유기 형광체, 형광 안료, 형광 염료 등과 같이 적색광과 녹색광을 출력하도록 하는 공지의 형광체가 이용될 수 있다.As the red phosphor and the green phosphor used in the red phosphor film 31 and the green phosphor film 32 of the present example, a known phosphor that outputs red light and green light such as an inorganic phosphor, an organic phosphor, a fluorescent pigment, a fluorescent dye, etc. may be used. Can be.
제1 및 제2 형광 필름(31, 32)을 각각 제조하는 방법의 한 예는 해당 색상(즉, 적색과 녹색)을 위한 형광체를 수지에 분산시킨 용액(이하, '필름 제작용 수지액'이라 함)을 제작 기판 상에 도포하거나 인쇄한 후 건조시킨다.An example of a method of manufacturing the first and second fluorescent films 31 and 32, respectively, is a solution in which phosphors for a corresponding color (i.e., red and green) are dispersed in a resin (hereinafter referred to as 'resin liquid for film production'). Is applied onto the fabrication substrate, printed, and then dried.
필름 제작용 수지액을 제작 기판 상에 도포하는 도포 방법은 리버스롤 코터(reverse roll coater), 블레이드 코터(blade coater), 슬릿다이 코터(slit die coater), 슬롯다이 코터(slot die coater) 등을 이용할 수 있고, 인쇄 방법은 스크린 인쇄(screen printing), 그라비아 인쇄(gravure printing) 또는 평판 인쇄(lithographic printing) 등을 이용할 수 있다.Coating methods for applying the resin liquid for film production on a production substrate include a reverse roll coater, a blade coater, a slit die coater, a slot die coater, and the like. The printing method may be screen printing, gravure printing or lithographic printing.
제작 기판은 금속, 유리, 세라믹(ceramic)이나 종이 등으로 이루어질 수 있다.The manufacturing substrate may be made of metal, glass, ceramic, paper, or the like.
또한, 제작 기판은 하부에 위치한 각 발광 소자(21, 22)와의 접착성을 높이기 위해 접착층을 구비할 수 있고, 접착층은 내열성, 절연성 및 투명성에 우수한 접착제로 이루어지는 것이 좋고, 예를 들어, 고무계 접착제, 아크릴계 접착제, 우레탄 접착제나 실리콘 접착제 등일 수 있다.In addition, the production substrate may be provided with an adhesive layer in order to increase the adhesiveness with each of the light emitting elements (21, 22) located below, the adhesive layer is preferably made of an adhesive excellent in heat resistance, insulation and transparency, for example, rubber-based adhesive , Acrylic adhesives, urethane adhesives, silicone adhesives, and the like.
다시 도 1로 되돌아가서, 제3 발광 소자(23) 위에 위치하는 확산 필름(33)은 광확산제를 함유하고 있어, 제3 발광 소자(23)에서 출력되는 청색광을 산란시켜 전면으로 빛이 골고루 퍼지게 한다. 이로 인해, 확산 필름(33)을 통과한 청색광은 해당 면에 균일하게 분포되어 색재현성을 향상시킨다.1 again, the diffusion film 33 positioned on the third light emitting element 23 contains a light diffusing agent, and scatters blue light output from the third light emitting element 23 so that the light is uniformly distributed to the entire surface. To spread. For this reason, the blue light passing through the diffusion film 33 is uniformly distributed on the surface to improve color reproducibility.
이로 인해, 제3 발광 소자(23)와 그 위에 위치한 확산 필름(33)을 구비하고 있는 제3 발광부(BD3)는 제1 및 제2 발광부(BD1, BD2)와 달리 제3 발광 소자(23)에서 출력되는 청색광을 확산시켜 출력한다.Accordingly, the third light emitting part BD3 including the third light emitting element 23 and the diffusion film 33 disposed thereon is different from the first and second light emitting parts BD1 and BD2. The blue light output from 23) is diffused and output.
본 예의 확산 필름(33)은 폴리에스터(polyester), 폴리에틸렌 테레프탈레이트(polyethyleneteraphthalate, PET), 폴리카보네이트(polycarbonate, PC) 또는 실리콘(silicon) 등으로 이루어져 있는 기판에 수 ㎛ 크기의 구형 입자로 이루어진 광확산제를 코팅하거나 분산시켜 제조된다. The diffusion film 33 of this example is a light composed of spherical particles having a size of several micrometers on a substrate made of polyester, polyethylene teraphthalate (PET), polycarbonate (PC), or silicon (silicon). It is prepared by coating or dispersing a diffusing agent.
광확산제의 종류는 폴리메타크릴산 메틸(polymethylmethacrylate, PMMA), 폴리스티렌(polystyrene, PS), 폴리우레탄(polyurethane, PU), 이산화규소(SiO2), 탄산 칼슘, 황산바륨, 실리카(silica), 산화티탄 또는 글래스 비드(glass bead) 등일 수 있다.Types of light diffusing agents include polymethylmethacrylate (PMMA), polystyrene (PS), polyurethane (PU), silicon dioxide (SiO 2 ), calcium carbonate, barium sulfate, silica, Titanium oxide, glass beads, or the like.
하지만, 대안적인 예에서, 제3 발광 소자(23) 위에 위치하는 확산 필름(33)은 생략될 수 있다. However, in an alternative example, the diffusion film 33 positioned on the third light emitting element 23 can be omitted.
이와 같이, 본 예의 백색 발광 소자 패키지(1)에 따르면, 제1 내지 제3 발광부(BR1-BR3)에서 각각 적색광, 녹색광 및 청색광이 출력된 후 혼합되어 출력되므로, 백색 발광 소자 패키지(1)에서 외부로 출력되는 빛은 백색광이 된다.As described above, according to the white light emitting device package 1 of the present example, since the red light, the green light, and the blue light are respectively output from the first to third light emitting parts BR1 to BR3, the white light emitting device package 1 is output. The light output from the outside becomes white light.
이때, 제1 및 제2 발광부(BR1, BR2)는 형광체가 함유된 각 해당 형광 필름(31, 32)을 이용하여 적색광과 녹색광을 출력하므로, 적색 발광 다이오드와 녹색 발광 다이오드에서 바로 출력되는 적색광과 녹색광보다 빛의 스펙트럼의 범위가 증가하고 색온도의 범위가 증가한다. 본 예의 따른 백색광의 색온도는 2,000K 내지 10,000K일 수 있다.In this case, since the first and second light emitting units BR1 and BR2 output red light and green light using the corresponding fluorescent films 31 and 32 containing phosphors, the red light directly output from the red light emitting diodes and the green light emitting diodes. The range of light spectrum increases and the range of color temperature increases. The color temperature of the white light according to the present example may be 2,000K to 10,000K.
따라서, 제1 내지 제3 발광부(BR1-BR3)에서 각각 출력되는 적색광, 녹색과 및 청색광의 혼합으로 인해 출력되는 본 예의 백색광에 의한 연색성이 향상되어 사용자의 만족도가 높아진다.Therefore, the color rendering property of the white light of the present example output due to the mixing of the red light, the green and the blue light output from the first to third light emitting parts BR1 to BR3, respectively, improves the user's satisfaction.
또한, 제1 내지 제3 발광부(BR1-BR3)는 모두 적색 발광 다이오드와 녹색 발광 다이오드에 비해 범용성이 높고 제조 비용이 저렴한 청색 발광 다이오드를 기본적인 발광 소자로 이용하므로, 적색 발광 다이오드, 녹색 발광 다이오드 및 청색 발광 다이오드 모두를 이용하여 백색광을 출력하는 경우보다 본 예에 따라 백색광을 출력하는 백색 발광 소자 패키지(1)의 제조 비용이 절감된다. In addition, since the first to third light emitting units BR1 to BR3 all use a blue light emitting diode that is more versatile and inexpensive to manufacture than a red light emitting diode and a green light emitting diode, it is a red light emitting diode and a green light emitting diode. In addition, the manufacturing cost of the white light emitting device package 1 for outputting white light according to the present example is reduced than when white light is output using both the blue light emitting diodes.
측벽(40)은 기판(10) 위에 위치하고, 기판(10) 위에 위치하고 있는 제1 내지 제3 발광부(BD1-BD3)를 에워싸고 있다. The side wall 40 is positioned on the substrate 10 and surrounds the first to third light emitting units BD1-BD3 positioned on the substrate 10.
따라서, 측벽(40)은 발광 소자 패키지(1)의 측면을 구성하며, 백색 발광 소자 패키지(1)의 동작 효율을 높이기 위해, 제1 내지 제3 발광부(BD1-BD3)와 대면하고 있는 내측면은 반사막이 도포될 수 있다.Therefore, the side wall 40 constitutes a side surface of the light emitting device package 1 and faces the first to third light emitting units BD1 to BD3 in order to increase the operating efficiency of the white light emitting device package 1. The side surface may be coated with a reflective film.
렌즈(50)는 광학 소자 패키지(1)의 상부면을 이루는 것으로서, 하부에 위치한 제1 내지 제3 발광부(BD1-BD3)의 광을 굴절시키거나 집광시킬 수 있다. 렌즈(50)는 하나의 굴절부가 형성된 단일 렌즈이고, 제1 내지 제3 발광부(BD1-BD3)의 광이 하나의 굴절부에 의해 굴절되는 것이 가능하다. 또한, 경우에 따라서 렌즈(50)는 제1 내지 제3 발광부(BD1-BD3)에 대응되는 3개의 굴절부가 형성된 복합 렌즈이고, 제1 내지 제3 발광부(BD1-BD3)의 광은 각각 대응되는 굴절부에 의해 굴절되는 것도 가능하다.The lens 50 forms an upper surface of the optical device package 1, and may refract or collect light from the first to third light emitting parts BD1 to BD3 located below. The lens 50 is a single lens in which one refraction unit is formed, and light of the first to third light emitting units BD1 to BD3 may be refracted by one refraction unit. In some cases, the lens 50 is a composite lens in which three refractive portions corresponding to the first to third light emitting parts BD1 to BD3 are formed, and the light of the first to third light emitting parts BD1 to BD3 is respectively. It is also possible to be refracted by the corresponding refraction.
렌즈(50)는 하부에 위치한 제1 내지 제3 발광부(BD1-BD3)를 외부 충격이나 오염 물질로부터 보호한다.The lens 50 protects the first, second, and third light emitting parts BD1-BD3 located below from external impact or contaminants.
이러한 렌즈(50)는 유리, 플라스틱, 실리콘 또는 에폭시 등의 투명한 재료로 이루어질 수 있다.The lens 50 may be made of a transparent material such as glass, plastic, silicone, or epoxy.
대안적인 예에서, 기판(10), 측벽(40)과 렌즈(50)에 에워싸여져 있는 빈 공간에는 투명한 에폭시 수지 등으로 이루어진 몰딩부가 위치할 수 있다. 이 경우, 제1 내지 제3 발광부(BD1-BD3)가 몰딩부 속에 위치하므로, 제1 내지 제3 발광부(BD1-BD3)의 위치가 고정되고 외부 충격 등에 의해 보호되어 백색 광학 소자 패키지(1)의 손상이나 파손의 위험이 감소한다. In an alternative example, a molding portion made of a transparent epoxy resin or the like may be located in the empty space surrounded by the substrate 10, the side wall 40 and the lens 50. In this case, since the first to third light emitting parts BD1 to BD3 are located in the molding part, the positions of the first to third light emitting parts BD1 to BD3 are fixed and protected by an external impact, so that the white optical device package ( 1) The risk of damage or breakage is reduced.
도 2를 참고로 하면, 백색 발광 소자 패키지(1)는 제어부(60)에 의해 제어될 수 있다. 구체적으로, 제어부(60)는 제1 내지 제3 발광부(BD1-BD3)의 광량을 조절할 수 있다. 제어부(60)는 제1 내지 제3 발광부(BD1-BD3)의 광량을 일괄적으로 조절하는 것도 가능하고, 개별적으로 조절하는 것도 가능하다. 이를 통해, 백색 발광 소자 패키지(1)가 생성하는 백색광의 색온도, 휘도 등의 색감을 조절할 수 있다.Referring to FIG. 2, the white light emitting device package 1 may be controlled by the controller 60. In detail, the controller 60 may adjust the amount of light of the first to third light emitting units BD1 to BD3. The controller 60 may collectively adjust the light amounts of the first to third light emitting units BD1 to BD3, or may individually adjust the amounts of light. Through this, color sense such as color temperature and luminance of the white light generated by the white light emitting device package 1 may be adjusted.
이상, 본 발명의 백색 광학 소자 패키지의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 청구범위뿐만 아니라 이 청구범위와 균등한 것들에 의해 정해져야 한다.In the above, embodiments of the white optical device package of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.
1: 백색 발광 소자 패키지 10: 기판1: white light emitting device package 10: substrate
21-23: 제1 내지 제3 발광 소자 31: 적색 형광 필름21-23: first to third light emitting elements 31: red fluorescent film
32: 청색 형광 필름 33: 확산 필름32: blue fluorescent film 33: diffusion film
60: 제어부60: control unit

Claims (7)

  1. 기판;Board;
    상기 기판 위에 각각 위치하는 제1 내지 제3 청색 발광 소자;First to third blue light emitting devices positioned on the substrate, respectively;
    상기 제1 청색 발광 소자 위에 위치하고 적색 형광체를 함유하는 적색 형광 필름; 및A red fluorescent film on the first blue light emitting device and containing a red phosphor; And
    상기 제2 청색 발광 소자 위에 위치하고 녹색 형광체를 함유하는 녹색 형광 필름A green fluorescent film located on the second blue light emitting device and containing a green phosphor
    을 포함하는 백색 발광 소자 패키지. White light emitting device package comprising a.
  2. 제1 항에 있어서,According to claim 1,
    상기 제3 청색 발광 소자 위에 위치하고 광확산제를 함유하는 확산 필름을 더 포함하는 백색 발광 소자 패키지.The white light emitting device package further comprises a diffusion film positioned on the third blue light emitting device and containing a light diffusing agent.
  3. 제2 항에 있어서,The method of claim 2,
    상기 광확산제는 폴리 메타크릴산메틸(polymethylmethacrylate, PMMA), 폴리스티렌(polystyrene, PS), 폴리우레탄(polyurethane, PU), 이산화규소(SiO2), 탄산 칼슘, 황산바륨, 실리카(silica), 산화티탄 또는 글래스 비드(glass bead)인 백색 발광 소자 패키지. The light diffusing agent is polymethylmethacrylate (PMMA), polystyrene (PS), polyurethane (PU), silicon dioxide (SiO 2 ), calcium carbonate, barium sulfate, silica (silica), oxide White light emitting device package, which is titanium or glass beads.
  4. 제1 항에 있어서,According to claim 1,
    상기 제1 내지 제3 청색 발광 소자는 각각 청색 발광 다이오드로 이루어져 있는 백색 발광 소자 패키지.The first to third blue light emitting device is a white light emitting device package consisting of a blue light emitting diode, respectively.
  5. 제1 항에 있어서,According to claim 1,
    상기 제1 내지 제3 청색 발광 소자의 상부에 위치하고, 상기 제1 내지 제3 청색 발광 소자의 광을 굴절시키는 렌즈를 더 포함하는 백색 발광 소자 패키지.The white light emitting device package further comprises a lens positioned on the first to third blue light emitting device, the lens for refracting the light of the first to third blue light emitting device.
  6. 제5 항에 있어서,The method of claim 5,
    상기 렌즈는 상기 제1 내지 제3 청색 발광 소자의 광을 모두 굴절시키는 단일 렌즈인 백색 발광 소자 패키지.The lens is a white light emitting device package that is a single lens for refracting all the light of the first to third blue light emitting device.
  7. 제1 항에 있어서,According to claim 1,
    상기 제1 내지 제3 청색 발광 소자의 광량을 조절하는 제어부를 더 포함하는 백색 발광 소자 패키지.The white light emitting device package further comprises a control unit for controlling the amount of light of the first to third blue light emitting device.
PCT/KR2019/002827 2018-04-16 2019-03-12 White-light-emitting device package WO2019203442A1 (en)

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