WO2013180519A1 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
WO2013180519A1
WO2013180519A1 PCT/KR2013/004822 KR2013004822W WO2013180519A1 WO 2013180519 A1 WO2013180519 A1 WO 2013180519A1 KR 2013004822 W KR2013004822 W KR 2013004822W WO 2013180519 A1 WO2013180519 A1 WO 2013180519A1
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WO
WIPO (PCT)
Prior art keywords
light
lighting device
light emitting
resin layer
pattern
Prior art date
Application number
PCT/KR2013/004822
Other languages
French (fr)
Korean (ko)
Inventor
김진희
박무룡
박광호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of WO2013180519A1 publication Critical patent/WO2013180519A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/26Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/0035Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G02B6/0041Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided in the bulk of the light guide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091Scattering means in or on the semiconductor body or semiconductor body package
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Definitions

  • LED Light Emitted Diode
  • LED is a device that converts an electric signal into infrared or light by using compound semiconductor characteristics, and unlike fluorescent lamps, it does not use harmful substances such as mercury, and causes less environmental pollution. It has the advantage of long life. In addition, it has a low power consumption compared to the conventional light source, and because of the high color temperature has excellent visibility and less glare.
  • the current lighting apparatus has evolved from a conventional light source such as an incandescent lamp or a fluorescent lamp to a form using the above-described LED element as a light source, and a lighting apparatus that performs a surface light emitting function by using a light guide plate is provided.
  • FIG. 1 and 2 schematically show a conventional lighting device 1 performing a surface light emitting function.
  • a flat light guide plate 30 is disposed on a substrate 20, and a plurality of side type LEDs 10 are disposed on a side of the light guide plate 30. (Only one) is arranged in the form of an array.
  • the light L incident from the LED 10 to the light guide plate 30 is reflected upward by a minute reflection pattern or a reflective sheet 40 provided on the bottom surface of the light guide plate 30, and exits from the light guide plate 30. 30) the light is emitted to the top to provide light to the outside through the outer housing 50 of the transparent material.
  • a plurality of diffusion apparatuses 31, prism sheets 32 and 33, and protective sheet 34 may be provided between the lighting apparatus 1 and the light guide plate 30 and the outer housing 50. It can be formed into a structure to further add the optical sheet of.
  • the above-described lighting device 1 serves to supply light evenly to the outside, and the light guide plate 30 is a component that performs the function of improving the brightness of the lighting device 1 and supplying uniform light in the light source LED. It is one of the plastic molded lenses to uniformly transmit the emitted light. Therefore, the light guide plate 30 is basically used as an essential component of the conventional lighting device 1, but due to the thickness of the light guide plate 30 itself, the thickness of the entire product is limited, and the light guide plate 30 is shown. As the material itself is not flexible, it is difficult to apply to the outer housing 50, which is formed with a bend, and thus has a problem in that product design and design deformation are not easy.
  • the present invention has been proposed to solve the above-mentioned conventional problems, and in one embodiment of the present invention, by using the resin layer to guide the light emitted from the light emitting unit to the outside without using the light guide plate, the overall thickness is reduced. In addition, it is possible to provide a lighting device structure that can secure reliability while improving flexibility of product design through securing flexibility.
  • Lighting device for solving the above problems is formed on a flexible printed circuit board and a light emitting unit consisting of one or more side-emitting LED and top emitting LED; It may include a light guide member formed on the light emitting unit to bury the light emitting unit.
  • the light guide member may be formed of a resin layer filling all of the side-emitting LED and part or all of the top-emitting LED.
  • the number of light emitting units can be reduced, and the overall thickness of the lighting device can be reduced.
  • a reflective sheet and a reflection pattern which is a structure capable of efficiently reflecting the light emitted from the light emitting unit, thereby providing an effect and a uniform surface light source to maximize the improvement of the brightness and the luminance improvement It can work.
  • the present invention by forming a first optical substrate or a second optical substrate having an optical pattern, and having an air gap in the adhesive layer, it is possible to eliminate the occurrence of hot spots and dark areas generated in the light shielding pattern portion.
  • the reliability between the adhesive layer and the parts to be bonded is secured, and at the same time, it is possible to realize a lighting device without significant differences in optical characteristics, and precise alignment between parts is possible.
  • 1 and 2 schematically show a conventional lighting device structure.
  • FIG. 3 schematically shows a lighting device structure according to the present invention.
  • Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
  • FIG. 5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
  • the lighting device according to the present invention is applicable to various lamp devices that require lighting, for example, vehicle lamps, home lighting devices, industrial lighting devices. For example, when applied to a vehicle lamp, it is also applicable to headlights, vehicle interior lighting, doorscar, rear lights and the like.
  • the lighting apparatus of the present invention can be applied to the field of the backlight unit applied to the liquid crystal display device, and can be applied to all the lighting related fields that are currently developed and commercialized or can be implemented according to future technology development.
  • Figure 3 schematically shows the structure of the lighting apparatus according to the present invention
  • Figure 3 (a) is a lighting device 100a of the structure in which the top light emitting LED is completely embedded by the light guide member
  • Figure 3 (b) shows a lighting device 100b having a structure in which the top emitting LED protrudes above the light guide member.
  • the light guide member may be composed of a resin layer formed of a resin material, and the resin layer may be buried in a structure in close contact with the LED.
  • the lighting apparatus 100a may apply various substrates on which optical devices such as LEDs are mounted, and in one embodiment of the present invention, a printed circuit board having flexibility. Can be used.
  • the light emitting devices mounted on the flexible flexible printed circuit board (FPCB) 110 may have a structure in which at least two light emitting devices having different light output directions are provided.
  • the light emitting device one or more side view type LEDs 131 and top view type LEDs 133 formed on the flexible printed circuit board 110 may be applied. have.
  • the light emitting unit 130 is formed on the flexible printed circuit board 110 and includes one or more side view type LEDs (131) and a top view type LED (133). And a resin layer 150 formed on the flexible printed circuit board 110 to bury the light emitting unit 130 and guide the emitted light upward.
  • a reflective sheet may be further formed on the flexible circuit board 110, and a first optical sheet 170 and a second optical sheet 190 may be further formed on the resin layer 150.
  • a diffusion plate 290 may be further provided on the resin layer 150 to diffuse the incident light uniformly and radiate it to the outside.
  • the light emitting unit 130 is arranged on the flexible printed circuit board 110 in one or more numbers to emit light
  • the light emitting unit 130 of the present invention is one or more side-emitting LED (131) and It may be made of one or more top emitting LEDs 133.
  • the side emitting type LED 131 is an LED having a structure in which the direction of the emitted light does not go straight to the top but is directed toward the side
  • the top emitting LED 133 is an LED having the structure where the emitted light goes straight to the top. to be.
  • the light emitting unit 130 by configuring the light emitting unit 130 to include not only the side light emitting type LED 131 but also the top light emitting type LED 133 as described above, the surface light emitting as well as the additional light emitting device without additional additional lighting device Advantages that can be realized, by the combination of surface light emission and point light emission has the advantage of realizing the emission light of various shapes.
  • the resin layer 150 is formed on the flexible printed circuit board 110 to fill the light emitting unit 130 so that the resin layer 150 diffuses the light emitted from the light emitting unit 130 to the front. That is, the function of the conventional light guide plate is performed in the resin layer 150.
  • the shape of the resin layer 130 is mainly formed in a plate shape and may be formed in a structure in close contact with the light emitting unit 130, but is not limited thereto and may be appropriately changed in design as necessary.
  • Resin layer 150 of the present invention instead of the function of the light guide plate may be basically made of a resin of a material capable of diffusing light.
  • the resin layer 150 of the present invention may be made of a self-curing resin containing an oligomer, and more specifically, the resin layer 150 may be formed using a resin containing a urethane acrylate oligomer as a main raw material.
  • the resin which mixed the urethane acrylate oligomer which is a synthetic oligomer, and the polymer type which is polyacryl can be used.
  • the resin layer 150 of the present invention can be formed of all resins.
  • the resin layer 150 of the present invention may further include a form in which a plurality of beads 151 having hollows (or voids) formed therein are mixed and diffused, and the beads 151 reflect and diffuse light. It plays a role in improving characteristics. For example, when the light emitted from the light emitting unit 130 is incident on the bead 151 inside the resin layer 150, the light is reflected and transmitted by the hollow of the bead 151 to diffuse and condense and the resin layer 150. ) It is emitted to the top.
  • the reflectivity and the diffusion rate of the light is increased by the bead 151, thereby improving the light quantity and uniformity of the light emitted to the outside later, and as a result, it is possible to achieve the effect of improving the brightness of the lighting device.
  • the content of the beads 151 may be appropriately adjusted in order to obtain a desired light diffusing effect, and more specifically, the content of the beads 151 may be adjusted in a range of 0.01 to 0.3% based on the total weight of the resin layer 150. . That is, the light emitted from the light emitting unit 130 in the lateral direction is diffused and reflected through the resin layer 150 and the beads 151 so that the light can travel upward.
  • the bead 151 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al 2 O 3 , and acryl.
  • the particle diameter of the bead 151 may be formed in the range of 1 ⁇ m ⁇ 20 ⁇ m, but is not limited thereto.
  • the resin layer 150 of the present invention is formed by the height of the side light emitting LED 131 and the top light emitting LED 133 as shown in (a) of Figure 3 and the side light emitting LED 131 and The entire top emitting type LED 133 may be buried.
  • the thickness of the resin layer 150 for example, depending on the degree of coating of the resin, as shown in Figure 3 (b) above the height of the side-emitting LED 131 and the upper light-emitting type By forming below the height of the LED 135, all of the side-emitting LED 131 and a portion of the top-emitting LED 135 may be embedded.
  • the degree of embedding of the top light emitting LEDs 133 and 135 may be adjusted by adjusting the thickness of the resin layer 150, and as a result, various types of point light emitting supplied to the outside may be realized.
  • the resin layer 150 due to the presence of the resin layer 150 it is possible to innovatively reduce the thickness occupied by the conventional light guide plate, it is possible to realize the thinning of the entire product, to have a flexible material bar bending It has the advantage that it can be easily applied to the surface, improves the freedom of design, and can be applied to other flexible displays.
  • a reflective sheet 120 may be further formed on the upper surface of the flexible printed circuit board 110, and the reflective sheet 120 may have a structure penetrated by the light emitting unit 130.
  • Reflective sheet 120 of the present invention is formed of a material having a high reflection efficiency to serve to reduce the light loss by reflecting the light emitted from the light emitting unit 130 in the upper direction of the resin layer 150.
  • Reflective sheet 120 of the present invention may be formed in the form of a film, it may be formed to include a synthetic resin containing a dispersion of white pigments in order to implement the characteristics of promoting the reflection characteristics and the dispersion of light. For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc.
  • polyethylene terephthalate polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin may be used as the synthetic resin.
  • Cellulose source acetate, weather resistant vinyl chloride, etc. may be used, but is not limited thereto.
  • a reflective pattern 121 may be formed on a surface of the reflective sheet 120, and the reflective pattern 121 serves to improve uniformity of light emitted to the upper portion of the resin layer 150 by scattering and dispersing incident light. Do it.
  • the reflection pattern 121 may be formed by printing on the surface of the reflective sheet 120 using a reflective ink including any one of TiO 2 , CaCo 3 , BaSo 4 , Al 2 O 3, Silicon, and PS, but is not limited thereto. It doesn't happen.
  • the reflective pattern 121 has a structure having a plurality of protruding patterns, and may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the light scattering effect.
  • the cross-sectional shape of the reflective pattern 121 may have a structure having various shapes such as a triangle, a square, a semicircle, and a sinusoidal wave.
  • the density or pattern size of the reflective pattern 121 may be changed depending on the degree of separation from the light emitting unit 130.
  • Illumination apparatus (100a, 100b) of the present invention is the first optical sheet 170 formed on the resin layer upper surface 150, the second optical sheet 190 and the first optical sheet formed on the first optical sheet 170 (
  • the adhesive layer 180 may be further formed between the 170 and the second optical sheet 190, and the first air gap 181 may be further formed on the adhesive layer 180. That is, the adhesive layer 180 forms a space (first air gap 181) spaced around the optical pattern 183, and applies the adhesive material to the other portions to form the first optical sheet 170 and the second optical sheet. It may be implemented as a structure for bonding the 190 to each other.
  • an optical pattern 183 may be further formed on an upper surface of the first optical sheet 170 or a lower surface of the second optical sheet 190, and one or more optical sheets may be further formed on the second optical sheet 190. It is also possible.
  • the structure including the first optical sheet 170, the second optical sheet 190, the adhesive layer 180, and the optical pattern 183 may be defined as the optical pattern layer A.
  • the optical pattern 183 may be formed as a light shielding pattern formed to prevent concentration of light emitted from the light emitting unit 130, and for this purpose, an alignment between the optical pattern 183 and the position of the light emitting unit 130 is aligned.
  • the first optical sheet 170 and the second optical sheet 190 are bonded to each other using the adhesive layer 180 to secure the fixing force after the alignment.
  • the first optical sheet 170 and the second optical sheet 190 may be formed using a material having excellent light transmittance, and PET may be used as an example.
  • the upper light emitting LED 135 when the upper light emitting LED 135 partially protrudes above the resin layer 150, that is, only a part of the upper light emitting LED 135 is formed by the resin layer 150.
  • the protruding portion of the top emitting LED 135 may be inserted below the first optical sheet 170. In this case, there is an advantage that can improve the light density of the point light source supplied to the outside as needed.
  • the optical pattern 183 disposed between the first optical sheet 170 and the second optical sheet 190 basically serves to prevent the light emitted from the light emitting unit 130 from being concentrated.
  • the optical pattern 153 may be formed as a light shielding pattern so that a part of the light shielding effect may be implemented in order to prevent a phenomenon in which the light is excessively strong so that optical characteristics deteriorate or yellowish light is emitted.
  • the pattern may be formed by performing a printing process on the top surface of the first optical sheet 170 or the bottom surface of the second optical sheet 190 using the light shielding ink.
  • the optical pattern 183 may not be a function of completely blocking the light, but may be implemented to adjust the light shielding degree or the diffusivity of the light with one optical pattern to perform a function of blocking and diffusing the light. Furthermore, more specifically, the optical pattern 183 according to the present invention may be implemented as a superimposed printed structure of a complex pattern.
  • the superimposed printing structure refers to a structure that forms one pattern and prints another pattern shape on the upper portion thereof.
  • the optical pattern 183 at least one selected from TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and Silicon on the lower surface of the polymer film (eg, the second optical sheet) in the light emitting direction.
  • the light emitting pattern may include a diffusion pattern formed using a light shielding ink including a material and a light shielding pattern formed using a light shielding ink including Al or a mixture of Al and TiO 2 . That is, after the diffusion pattern is formed by white printing on the surface of the polymer film, a light shielding pattern may be formed thereon, or a double structure may be formed in the reverse order.
  • the patterned design of the pattern may be variously modified in consideration of light efficiency, intensity, and light blocking rate.
  • the light-shielding pattern which is a metal pattern
  • the middle layer in the sequentially stacked structure
  • a triple structure may be formed on the upper and lower portions thereof to implement the diffusion pattern.
  • the diffusion patterns is implemented using TiO 2 having excellent refractive index, and CaCO 3 having excellent light stability and color sense is used together with TiO 2. It is possible to realize different diffusion patterns, and to secure light efficiency and uniformity through the triple structure of the structure implementing the light shielding pattern using Al having excellent concealment.
  • CaCO 3 functions to subtract the exposure of yellow light to finally realize white light, thereby realizing more stable light.
  • particles such as BaSO 4 , Al 2 O 3 , and silicon beads Larger, similarly structured inorganic materials may be used.
  • the optical pattern 183 is preferably formed by adjusting the pattern density so that the pattern density is lowered farther from the emission direction of the light emitting unit 130 in terms of light efficiency.
  • the adhesive layer 180 may have a structure surrounding the periphery of the optical pattern 183 and forming the first air gap 181 at other portions, or forming the first air gap 181 at the periphery of the optical pattern 183. It can be formed, thereby aligning the two optical sheets (170, 190) by aligning. That is, the adhesive structure of the first optical sheet 170 and the second optical sheet 190 can be implemented with a function of fixing the printed optical pattern 183.
  • the adhesive layer 180 may use a thermosetting PSA, a thermosetting adhesive, or a UV curing PSA type material, but is not limited thereto.
  • the diffusion plate 290 may be formed on the resin layer 150. When the first optical sheet 170 and the second optical sheet 190 are further formed, the diffusion plate 290 may be formed on the upper side of the second optical sheet 190. Can be formed.
  • the diffusion plate 290 serves to uniformly spread the light emitted through the resin layer 150 over the entire surface, and may be generally formed of an acrylic resin, but is not limited thereto.
  • polystyrene (PS) Polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), high permeability plastics such as resin (resin) can be made of any material capable of performing the diffusion function .
  • an air layer (second air gap 280) may be further formed between the diffusion plate 290 and the resin layer 150, and the first optical sheet 170 and the second optical sheet 190 are further formed.
  • the second air gap 280 may be formed between the second optical sheet 190 and the diffusion plate 290.
  • the height (H1) of the second air gap 280 may be formed in the range of more than 0 and 30mm or less, but is not limited thereto and as necessary Design changes can be made accordingly.
  • Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
  • the light emitting unit included in the lighting apparatus of the present invention may include a side light emitting LED 131 and a top light emitting LED 133 as described above in FIG. 3.
  • the side light emitting LEDs 131 are disposed in two or more rows on the flexible printed circuit board 110, and the top light emitting LEDs 133 are disposed between the rows of the side light emitting LEDs 131.
  • It may be made of a structure that is arranged. However, this is only one example, and in addition, the arrangement of the top emitting type LED 133 and the arrangement of the side emitting type LED 131 may be appropriately changed as necessary.
  • the present invention it is possible not only to implement the surface emission using the side emitting type LED and the resin layer without additional additional lighting device, but also has the advantage of implementing the point emitting through the top emitting type LED, surface emitting And by the combination of the point light emission has the advantage that can implement the emission light of various shapes as described above.
  • FIG. 5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
  • the lighting apparatus 100a according to the present invention is formed using a flexible circuit board and a resin layer, and thus has a certain flexibility. Therefore, as shown in FIG. 5, the curved headlight housing 300 can be easily mounted, and thus, even in spite of the effect of improving the design freedom of the finished product combined with the housing and the design freedom, the uniformity is improved. It is possible to achieve the effect of ensuring the brightness and illuminance. Meanwhile, although FIG. 5 shows that the lighting apparatus shown in FIG. 3 (a) is mounted, this is only one example and the lighting apparatus shown in FIG. 3 (b) may be mounted.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

The present invention can implement surface emission and point emission using one device, reduce entire thickness, and improve effects and a degree of freedom in the design by providing a lighting device, comprising: a light emitting unit formed on a flexible printed circuit board and composed of one or more lateral light emitting type LEDs and upper light emitting type LEDs; and a resin layer formed on the flexible printed circuit board so as to embed the light emitting unit.

Description

조명 장치Lighting device
본 발명은 조명장치 기술분야에 관한 것이다The present invention relates to the field of lighting devices
LED(Light Emitted Diode) 소자는 화합물 반도체 특성을 이용하여 전기신호를 적외선 또는 빛으로 변환시키는 소자로서, 형광등과 달리 수은 등의 유해물질을 사용하지 않아 환경오명 유발원인이 적고, 종래의 광원에 비해 수명이 오래가는 장점을 가지고 있다. 또한, 종래 광원과 비교하여 저전력을 소비하고, 높은 색온도로 인해 시인성이 우수하며 눈부심이 적은 장점을 갖고 있다.LED (Light Emitted Diode) is a device that converts an electric signal into infrared or light by using compound semiconductor characteristics, and unlike fluorescent lamps, it does not use harmful substances such as mercury, and causes less environmental pollution. It has the advantage of long life. In addition, it has a low power consumption compared to the conventional light source, and because of the high color temperature has excellent visibility and less glare.
따라서 현재의 조명장치는 종래의 백열전구나 형광등과 같은 전통적인 광원을 이용하는 형태에서 상술한 LED소자를 광원으로 이용하는 형태로 발전하고 있으며, 도광판을 이용함으로써 면발광 기능을 수행하는 조명장치가 제공되고 있다.Therefore, the current lighting apparatus has evolved from a conventional light source such as an incandescent lamp or a fluorescent lamp to a form using the above-described LED element as a light source, and a lighting apparatus that performs a surface light emitting function by using a light guide plate is provided.
도 1 및 도 2는 면발광 기능을 수행하는 종래의 조명장치(1)를 개략적으로 도시한 것이다. 도 1 및 2를 참조하면, 종래의 조명장치(lamp device)(1)는 기판(20) 상에 평탄한 도광판(30)이 배치되고 이 도광판(30)의 측면에는 복수의 측면형 LED(10)(하나만 도시)가 어레이 형태로 배치된다. 1 and 2 schematically show a conventional lighting device 1 performing a surface light emitting function. 1 and 2, in a conventional lamp device 1, a flat light guide plate 30 is disposed on a substrate 20, and a plurality of side type LEDs 10 are disposed on a side of the light guide plate 30. (Only one) is arranged in the form of an array.
LED(10)에서 도광판(30)으로 입사된 빛(L)은 도광판(30)의 밑면에 제공된 미세한 반사 패턴 또는 반사 시트(40)에 의해 상부로 반사되어 도광판(30)에서 출사된 다음 도광판(30) 상부로 출사됨으로써 투명재질의 외부 하우징(50) 등을 통해 외부에 광을 제공하게 된다. 이러한 조명장치(1)에는 도 2에 도시된 개념도와 같이, 도광판(30)과 외부 하우징(50) 사이에 확산시트(31)나 프리즘 시트(32, 33), 보호시트(34) 등의 복수의 광학시트를 더 부가하는 구조로 형성될 수 있다.The light L incident from the LED 10 to the light guide plate 30 is reflected upward by a minute reflection pattern or a reflective sheet 40 provided on the bottom surface of the light guide plate 30, and exits from the light guide plate 30. 30) the light is emitted to the top to provide light to the outside through the outer housing 50 of the transparent material. As illustrated in FIG. 2, a plurality of diffusion apparatuses 31, prism sheets 32 and 33, and protective sheet 34 may be provided between the lighting apparatus 1 and the light guide plate 30 and the outer housing 50. It can be formed into a structure to further add the optical sheet of.
상술한 조명장치(1)는 외부로 고르게 광을 공급하는 역할을 하며, 도광판(30)은 조명장치(1)의 휘도향상 및 균일한 광을 공급하는 기능을 수행하는 부품으로서 광원(LED)에서 발산되는 광을 균일하게 전달하는 플라스틱 성형렌즈의 하나이다. 따라서 이러한 도광판(30)은 기본적으로 이러한 종래 조명장치(1)의 필수적인 부품으로 사용되지만, 도광판(30) 자체의 두께로 인해 전체적인 제품의 두께를 박형화할 수 있는데 한계를 나타내고 있으며, 도광판(30) 자체 재질이 유연하지 못함에 따라 굴곡이 형성된 외부 하우징(50) 등에는 적용하기 어려운 단점, 이에 따라 제품설계 및 디자인 변형이 용이하지 못한 문제점을 내포하고 있었다.The above-described lighting device 1 serves to supply light evenly to the outside, and the light guide plate 30 is a component that performs the function of improving the brightness of the lighting device 1 and supplying uniform light in the light source LED. It is one of the plastic molded lenses to uniformly transmit the emitted light. Therefore, the light guide plate 30 is basically used as an essential component of the conventional lighting device 1, but due to the thickness of the light guide plate 30 itself, the thickness of the entire product is limited, and the light guide plate 30 is shown. As the material itself is not flexible, it is difficult to apply to the outer housing 50, which is formed with a bend, and thus has a problem in that product design and design deformation are not easy.
또한, 종래의 조명장치(1)의 경우, 측광형 LED(10)만을 광원으로 이용하는 바, 면발광 이외에 추가적인 점발광을 수행할 수 없어, 별도의 시그널을 표시하기 위해서는 추가적인 조명장치가 필요한 단점도 내포하고 있었다.In addition, in the case of the conventional lighting device 1, since only the light emitting type LED 10 is used as a light source, it is not possible to perform additional point emission in addition to the surface light emission, so that additional lighting device is required to display a separate signal. It was implicated.
본 발명은 상술한 종래의 문제점을 해결하기 위해 제안된 것으로서, 본 발명의 일 실시예에서는 도광판을 사용하지 않고 레진층을 이용하여 발광유닛에서 출사되는 광을 외부로 유도하도록 함으로써, 전체 두께를 박형화하고, 유연성 확보를 통해 제품디자인의 자유도를 향상시키면서도 신뢰성을 확보할 수 있는 조명장치 구조를 제공할 수 있도록 한다.. The present invention has been proposed to solve the above-mentioned conventional problems, and in one embodiment of the present invention, by using the resin layer to guide the light emitted from the light emitting unit to the outside without using the light guide plate, the overall thickness is reduced. In addition, it is possible to provide a lighting device structure that can secure reliability while improving flexibility of product design through securing flexibility.
또한, 서로 상이한 타입의 LED를 발광유닛으로 사용함으로써 면발광과 점발광을 동시에 수행할 수 있는 조명장치의 실시예를 제공할 수 있도록 한다.In addition, by using different types of LED as the light emitting unit, it is possible to provide an embodiment of the lighting device that can perform surface emission and point emission at the same time.
상술한 과제를 해결하기 위한 본 발명의 일실시예에 따른 조명장치는, 연성인쇄회로기판 상에 형성되고 하나 이상의 측면발광형 LED 및 상부발광형 LED로 이루어진 발광유닛; 상기 발광유닛 상에 형성되어 상기 발광유닛을 매립하는 광가이드부재를 포함할 수 있다.Lighting device according to an embodiment of the present invention for solving the above problems is formed on a flexible printed circuit board and a light emitting unit consisting of one or more side-emitting LED and top emitting LED; It may include a light guide member formed on the light emitting unit to bury the light emitting unit.
본 발명의 조명장치에 있어서, 상기 광가이드부재는, 상기 측면발광형 LED 전부와 상기 상부발광형 LED 일부 또는 전부를 매립하는 레진층으로 형성될 수 있다.In the lighting apparatus of the present invention, the light guide member may be formed of a resin layer filling all of the side-emitting LED and part or all of the top-emitting LED.
본 발명에 따르면 도광판을 제거하고, 레진층을 이용하여 광을 유도하도록 함으로써, 발광유닛의 수를 절감할 수 있는 효과, 조명장치의 전체적인 두께를 박형화할 수 있는 효과를 갖게 된다.According to the present invention, by removing the light guide plate and inducing the light using the resin layer, the number of light emitting units can be reduced, and the overall thickness of the lighting device can be reduced.
또한 본 발명에 따르면, 연성인쇄회로기판 및 레진층을 이용하여 조명장치를 형성함으로써 유연성을 확보할 수 있게 되어 제품 디자인의 자유도를 높일 수 있는 효과가 있다.In addition, according to the present invention, it is possible to secure flexibility by forming a lighting device using a flexible printed circuit board and a resin layer has the effect of increasing the degree of freedom of product design.
아울러 본 발명에 따르면, 발광유닛에서 출사되는 광을 효율적으로 반사시킬 수 있는 구조물인 반사시트 및 반사패턴을 구비함으로써, 광의 반사율 향상과 함께 휘도향상을 극대화할 수 있는 효과 및 균일한 면광원을 제공할 수 있는 효과가 있다.In addition, according to the present invention, by providing a reflective sheet and a reflection pattern which is a structure capable of efficiently reflecting the light emitted from the light emitting unit, thereby providing an effect and a uniform surface light source to maximize the improvement of the brightness and the luminance improvement It can work.
또한, 본 발명에 따르면 광학패턴을 구비하는 제1광학기판 또는 제2광학기판을 형성하되, 접착층에 에어갭을 구비하도록 함으로써, 차광패턴부분에 발생하는 핫스팟의 발생 및 암부의 발생을 제거할 수 있으며, 접착층과 접착되는 부품간의 신뢰성이 확보됨과 동시에 광학적 특성의 유의차가 없는 조명장치를 구현할 수 있는 효과, 부품간의 정밀한 어라인(align)이 가능한 효과가 있다.Further, according to the present invention, by forming a first optical substrate or a second optical substrate having an optical pattern, and having an air gap in the adhesive layer, it is possible to eliminate the occurrence of hot spots and dark areas generated in the light shielding pattern portion. In addition, the reliability between the adhesive layer and the parts to be bonded is secured, and at the same time, it is possible to realize a lighting device without significant differences in optical characteristics, and precise alignment between parts is possible.
도 1 및 도 2는 종래의 조명장치 구조를 개략적으로 도시한 것이다. 1 and 2 schematically show a conventional lighting device structure.
도 3은 본 발명에 따른 조명장치 구조를 개략적으로 도시한 것이다.3 schematically shows a lighting device structure according to the present invention.
도 4는 도 3에 도시된 본 발명의 조명장치 중, 발광유닛 배치에 대한 예시를 도시한 것이다.Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
도 5는 본 발명에 따른 조명장치를 차량용 헤드라이트에 적용한 구조를 개략적으로 도시한 것이다.5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
이하 첨부된 도면을 참조하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있는 바람직한 실시예를 상세히 설명한다. 다만 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 바람직한 일 실시예에 불과할 뿐이고, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다. 또한, 본 발명의 바람직한 실시예에 대한 동작 원리를 상세하게 설명함에 있어 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다. 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서, 각 용어의 의미는 본 명세서 전반에 걸친 내용을 토대로 해석되어야 할 것이다. 도면 전체에 걸쳐 유사한 기능 및 작용을 하는 부분에 대해서는 동일한 도면 부호를 사용한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it is to be understood that the embodiments shown in the specification and the drawings shown in the drawings are only exemplary embodiments of the present invention, and that various equivalents and modifications may be substituted for them at the time of the present application. In addition, in describing the operating principle of the preferred embodiment of the present invention in detail, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. The following terms are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the contents throughout the present specification. The same reference numerals are used for parts having similar functions and functions throughout the drawings.
본 발명에 따른 조명장치는 조명이 필요로 하는 다양한 램프장치, 이를테면 차량용 램프, 가정용 조명장치, 산업용 조명장치에 적용이 가능하다. 예컨대 차량용 램프에 적용되는 경우, 헤드라이트, 차량실내조명, 도어스카프, 후방라이트 등에도 적용이 가능하다. 추가적으로 본 발명의 조명장치는 액정표시장치에 적용되는 백라이트 유닛 분야에도 적용 가능하며, 이외에도 현재 개발되어 상용화되었거나 향후 기술발전에 따라 구현 가능한 모든 조명관련 분야에 적용 가능하다고 할 것이다.The lighting device according to the present invention is applicable to various lamp devices that require lighting, for example, vehicle lamps, home lighting devices, industrial lighting devices. For example, when applied to a vehicle lamp, it is also applicable to headlights, vehicle interior lighting, doorscar, rear lights and the like. In addition, the lighting apparatus of the present invention can be applied to the field of the backlight unit applied to the liquid crystal display device, and can be applied to all the lighting related fields that are currently developed and commercialized or can be implemented according to future technology development.
도 3은 본 발명에 따른 조명장치의 구조를 개략적으로 도시한 것으로서, 보다 구체적으로 도 3의 (a)는 상부발광형 LED가 광가이드부재에 의해 완전매립되는 구조의 조명장치(100a), 도 3의 (b)는 상부발광형 LED가 광가이드부재 상부로 돌출되는 구조의 조명장치(100b)를 도시한 것이다. 이 경우 상기 광가이드부재는 레진물질로 형성되는 레진층으로 구성될 수 있으며, 상기 레진층은 상술한 LED와 밀착하는 구조로 매립시킬 수 있다.Figure 3 schematically shows the structure of the lighting apparatus according to the present invention, and more specifically, Figure 3 (a) is a lighting device 100a of the structure in which the top light emitting LED is completely embedded by the light guide member, Figure 3 (b) shows a lighting device 100b having a structure in which the top emitting LED protrudes above the light guide member. In this case, the light guide member may be composed of a resin layer formed of a resin material, and the resin layer may be buried in a structure in close contact with the LED.
도 3의 (a)를 참조하면, 본 발명에 따른 조명장치(100a)는 상술한 LED 등의 광소자가 실장되는 다양한 기판을 적용할 수 있으며, 본 발명의 일실시예에서는 연성을 가지는 인쇄회로기판을 사용할 수 있다.Referring to FIG. 3A, the lighting apparatus 100a according to the present invention may apply various substrates on which optical devices such as LEDs are mounted, and in one embodiment of the present invention, a printed circuit board having flexibility. Can be used.
본 발명의 일실시예에서는 유연성을 갖는 연성인쇄회로기판(FPCB, 110) 상에 실장되는 발광소자의 광출사방향이 서로 다른 발광소자가 적어도 2 이상 구비되는 구조를 가질 수 있도록 형성한다. 이러한 발광소자의 일실시예로서는 상기 연성인쇄회로기판(110)상에 형성되고 하나 이상의 측면발광형 LED(Side view type LED, 131) 및 상부발광형 LED(Top view type LED, 133)를 적용할 수 있다. In an embodiment of the present invention, the light emitting devices mounted on the flexible flexible printed circuit board (FPCB) 110 may have a structure in which at least two light emitting devices having different light output directions are provided. As an embodiment of the light emitting device, one or more side view type LEDs 131 and top view type LEDs 133 formed on the flexible printed circuit board 110 may be applied. have.
본 실시예에서는 상기 연성인쇄회로기판(110)상에 형성되고 하나 이상의 측면발광형 LED(Side view type LED, 131) 및 상부발광형 LED(Top view type LED, 133)를 포함하는 발광유닛(130)과, 상기 연성인쇄회로기판(110) 상에 형성되어 상기 발광유닛(130)을 매립하고, 출사되는 광을 상부로 유도하는 레진층(150)을 포함하여 이루어질 수 있다. In the present embodiment, the light emitting unit 130 is formed on the flexible printed circuit board 110 and includes one or more side view type LEDs (131) and a top view type LED (133). And a resin layer 150 formed on the flexible printed circuit board 110 to bury the light emitting unit 130 and guide the emitted light upward.
또한, 상기 연성회로기판(110) 상에는 반사시트가 더 형성될 수 있으며, 레진층(150) 상부에는 제1광학시트(170), 제2광학시트(190)가 더 형성될 수 있다. 아울러, 레진층(150) 상측에는 입사광을 균일하게 확산하여 외부로 발산하는 확산판(290)이 더 구비될 수 있다.In addition, a reflective sheet may be further formed on the flexible circuit board 110, and a first optical sheet 170 and a second optical sheet 190 may be further formed on the resin layer 150. In addition, a diffusion plate 290 may be further provided on the resin layer 150 to diffuse the incident light uniformly and radiate it to the outside.
상기 발광유닛(130)은 상기 연성인쇄회로기판(110) 상에 하나 이상의 개수로 배열되어 광을 출사하는 부분으로서, 본 발명의 상기 발광유닛(130)은 하나 이상의 측면발광형 LED(131) 및 하나 이상의 상부발광형 LED(133)로 이루어질 수 있다. 측면발광형 LED(131)는 출사되는 광의 방향이 바로 상부로 직진하는 것이 아니라 측면을 향해서 출사하는 구조의 LED이며, 상부발광형 LED(133)는 출사되는 광이 바로 상부로 직진하는 구조의 LED이다. 본 발명에 따르면 상술한 바와 같이 발광유닛(130)을 측면발광형 LED(131) 뿐만 아니라 상부발광형 LED(133)도 포함하도록 구성함으로써, 별도의 추가적 조명장치 없이도 면발광뿐만 아니라 추가적으로 점발광도 구현할 수 있는 이점, 면발광 및 점발광의 조합에 의해 다양한 형상의 출사광을 구현할 수 있는 이점을 갖게 된다.The light emitting unit 130 is arranged on the flexible printed circuit board 110 in one or more numbers to emit light, the light emitting unit 130 of the present invention is one or more side-emitting LED (131) and It may be made of one or more top emitting LEDs 133. The side emitting type LED 131 is an LED having a structure in which the direction of the emitted light does not go straight to the top but is directed toward the side, and the top emitting LED 133 is an LED having the structure where the emitted light goes straight to the top. to be. According to the present invention, by configuring the light emitting unit 130 to include not only the side light emitting type LED 131 but also the top light emitting type LED 133 as described above, the surface light emitting as well as the additional light emitting device without additional additional lighting device Advantages that can be realized, by the combination of surface light emission and point light emission has the advantage of realizing the emission light of various shapes.
상기 레진층은(150)은 연성인쇄회로기판(110)상에 형성되어 발광유닛(130)을 매립함으로써 레진층(150)은 발광유닛(130)에서 출사되는 광을 전방으로 확산 유도하게 된다. 즉, 종래의 도광판의 기능을 레진층(150)에서 수행하게 된다. 레진층(130)의 형태는 주로 판상형으로 이루어지고, 발광유닛(130)과 밀착하는 구조로 형성될 수 있으나, 이에 한정되는 것은 아니며 필요에 따라 적절히 설계변경 가능하다. The resin layer 150 is formed on the flexible printed circuit board 110 to fill the light emitting unit 130 so that the resin layer 150 diffuses the light emitted from the light emitting unit 130 to the front. That is, the function of the conventional light guide plate is performed in the resin layer 150. The shape of the resin layer 130 is mainly formed in a plate shape and may be formed in a structure in close contact with the light emitting unit 130, but is not limited thereto and may be appropriately changed in design as necessary.
이러한 도광판의 기능을 대신하는 본 발명의 레진층(150)은, 기본적으로 광을 확산할 수 있는 재질의 수지로 이루어질 수 있다. 예컨대 본 발명의 레진층(150)은 올리고머를 포함하는 자와선경화수지로 이루어질 수 있으며, 보다 구체적으로 레진층(150)은 우레탄 아크릴레이트 올리고머를 주원료로 하는 레진을 이용하여 형성될 수 있다. 이를테면, 합성올리고머인 우레탄 아크릴레이트 올리고머와 폴리아크릴인 폴리머 타입을 혼합한 수지를 사용할 수 있다. 물론, 여기에 저비점 희석형 반응성 모노머인 IBOA(isobornyl acrylate), HPA(Hydroxylpropyl acrylate, 2-HEA(2-hydroxyethyl acrylate) 등이 혼합된 모노머를 더 포함할 수 있으며, 첨가제로서 광개시제(이를 테면, 1-hydroxycyclohexyl phenyl-ketone 등) 또는 산화방지제 등을 혼합할 수 있다. 다만, 상술한 내용은 하나의 예시일 뿐이며, 이외에도 현재 개발되어 상용화되었거나 향후 기술발전에 따라 구현 가능한, 광 확산기능을 수행할 수 있는 모든 수지로 본 발명의 레진층(150)을 형성할 수 있다고 할 것이다.Resin layer 150 of the present invention instead of the function of the light guide plate may be basically made of a resin of a material capable of diffusing light. For example, the resin layer 150 of the present invention may be made of a self-curing resin containing an oligomer, and more specifically, the resin layer 150 may be formed using a resin containing a urethane acrylate oligomer as a main raw material. For example, the resin which mixed the urethane acrylate oligomer which is a synthetic oligomer, and the polymer type which is polyacryl can be used. Of course, it may further include a monomer mixed with low boiling point dilution-type reactive monomers such as IBOA (isobornyl acrylate), HPA (Hydroxylpropyl acrylate, 2-HEA (2-hydroxyethyl acrylate)), and as an additive photoinitiator (eg, 1 -hydroxycyclohexyl phenyl-ketone, etc.) or antioxidants, etc. However, the above description is just one example, and in addition, it can perform a light diffusing function that is currently developed and commercialized or can be implemented according to future technological developments. It will be said that the resin layer 150 of the present invention can be formed of all resins.
한편, 본 발명의 레진층(150)에는 내부에 중공(또는 공극)이 형성된 다수의 비드(bead, 151)가 혼합 및 확산된 형태로 더 포함될 수 있으며, 이러한 비드(151)는 광의 반사 및 확산특성을 향상시키는 역할을 한다. 예컨대, 발광유닛(130)에서 출사된 광이 레진층(150) 내부의 비드(151)에 입사하게 되면, 광은 비드(151)의 중공에 의해 반사 및 투과되어 확산 및 집광되고 레진층(150) 상부로 출사된다. 이때, 비드(151)에 의해 광의 반사율 및 확산율이 증가하게 되어 추후 외부로 출사되는 광의 광량 및 균일도가 향상되고, 결과적으로 조명장치의 휘도를 향상시키는 효과를 거둘 수 있게 된다.Meanwhile, the resin layer 150 of the present invention may further include a form in which a plurality of beads 151 having hollows (or voids) formed therein are mixed and diffused, and the beads 151 reflect and diffuse light. It plays a role in improving characteristics. For example, when the light emitted from the light emitting unit 130 is incident on the bead 151 inside the resin layer 150, the light is reflected and transmitted by the hollow of the bead 151 to diffuse and condense and the resin layer 150. ) It is emitted to the top. At this time, the reflectivity and the diffusion rate of the light is increased by the bead 151, thereby improving the light quantity and uniformity of the light emitted to the outside later, and as a result, it is possible to achieve the effect of improving the brightness of the lighting device.
이러한 비드(bead, 151)의 함량은 원하는 광 확산효과를 얻기 위하여 적절히 조절될 수 있으며, 보다 구체적으로는 전체 레진층(150) 중량 대비 0.01~0.3% 범위에서 조절될 수 있으나 이에 한정되는 것은 아니다. 즉 발광유닛(130)에서 측방향으로 출사되는 광은 레진층(150)과 비드(151)를 통해 확산 및 반사되어 상부방향으로 진행할 수 있게 된다. 이러한 비드(151)는 실리콘(sillicon), 실리카(silica), 글라스버블(glass bubble), PMMA, 우레탄(urethane), Zn, Zr, Al2O3, 아크릴(acryl) 중 선택되는 어느 하나로 구성될 수 있으며, 비드(151)의 입경은 1㎛~20㎛의 범위에서 형성될 수 있으나, 이에 한정되는 것은 아니다.The content of the beads 151 may be appropriately adjusted in order to obtain a desired light diffusing effect, and more specifically, the content of the beads 151 may be adjusted in a range of 0.01 to 0.3% based on the total weight of the resin layer 150. . That is, the light emitted from the light emitting unit 130 in the lateral direction is diffused and reflected through the resin layer 150 and the beads 151 so that the light can travel upward. The bead 151 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al 2 O 3 , and acryl. The particle diameter of the bead 151 may be formed in the range of 1㎛ ~ 20㎛, but is not limited thereto.
특히 본 발명의 레진층(150)은 도 3의 (a)에 도시된 바와 같이 측면발광형 LED(131) 및 상부발광형 LED(133)의 높이 이상으로 형성됨으로써 측면발광형 LED(131) 및 상부발광형 LED(133) 전부를 매립할 수 있다. 또한, 레진층(150)의 형성두께차이, 예컨대 레진의 코팅 정도에 따라 도 3의 (b)에 도시된 바와 같이 레진층(150)을 측면발광형 LED(131)의 높이 이상 및 상부발광형 LED(135)의 높이 미만으로 형성함으로써 측면발광형 LED(131) 전부 및 상부발광형 LED(135) 일부를 매립할 수도 있다. 이와 같이 레진층(150)의 두께를 조절하여 상부발광형 LED(133, 135)의 매립 정도를 조절할 수 있으며, 결과적으로 외부로 공급되는 점발광의 형태를 다양하게 구현할 수 있게 된다.In particular, the resin layer 150 of the present invention is formed by the height of the side light emitting LED 131 and the top light emitting LED 133 as shown in (a) of Figure 3 and the side light emitting LED 131 and The entire top emitting type LED 133 may be buried. In addition, the thickness of the resin layer 150, for example, depending on the degree of coating of the resin, as shown in Figure 3 (b) above the height of the side-emitting LED 131 and the upper light-emitting type By forming below the height of the LED 135, all of the side-emitting LED 131 and a portion of the top-emitting LED 135 may be embedded. As such, the degree of embedding of the top light emitting LEDs 133 and 135 may be adjusted by adjusting the thickness of the resin layer 150, and as a result, various types of point light emitting supplied to the outside may be realized.
또한, 본 발명에 따르면, 레진층(150)의 존재로 인해 종래의 도광판의 차지하던 두께를 혁신적으로 감소시킬 수 있게 되어, 전체 제품의 박형화를 구현할 수 있게 되고, 연성의 재질을 가지게 되는바 굴곡면에도 용이하게 적용할 수 있는 이점, 디자인의 자유도를 향상시킬 수 있는 이점 및 기타 플렉서블 디스플레이에도 응용적용이 가능한 이점을 갖게 된다.In addition, according to the present invention, due to the presence of the resin layer 150 it is possible to innovatively reduce the thickness occupied by the conventional light guide plate, it is possible to realize the thinning of the entire product, to have a flexible material bar bending It has the advantage that it can be easily applied to the surface, improves the freedom of design, and can be applied to other flexible displays.
한편, 연성인쇄회로기판(110)의 상면에는 반사시트(120)가 더 형성될 수 있으며, 이러한 반사시트(120)는 발광유닛(130)에 의해 관통되는 구조로 이루어질 수 있다. 본 발명의 반사시트(120)는 반사효율의 높은 재질로 형성됨으로써 발광유닛(130)에서 출사되는 광을 레진층(150)의 상부방향으로 반사시켜 광손실을 줄이는 역할을 한다. 본 발명의 반사시트(120)는 필름형태로 이루어질 수 있으며, 빛의 반사특성 및 빛의 분산을 촉진하는 특성을 구현하여 위하여 백색안료를 분산 함유하는 합성 수지를 포함하여 형성될 수 있다. 예컨대 백색안료로서는 산화티탄, 산화알루미늄, 산화아연, 탄산연, 황산바륨, 탄산칼슘 등이 이용될 수 있으며, 합성 수지로서는 폴리에틸엔 테레프탈레이트, 폴리에틸렌 나프탈레이트, 아크릴수지, 콜리카보네이트, 폴리스티렌, 폴리올레핀, 셀룰로소스 아세테이트, 내후성 염화비닐 등이 이용될 수 있으나, 이에 한정되는 것은 아니다.Meanwhile, a reflective sheet 120 may be further formed on the upper surface of the flexible printed circuit board 110, and the reflective sheet 120 may have a structure penetrated by the light emitting unit 130. Reflective sheet 120 of the present invention is formed of a material having a high reflection efficiency to serve to reduce the light loss by reflecting the light emitted from the light emitting unit 130 in the upper direction of the resin layer 150. Reflective sheet 120 of the present invention may be formed in the form of a film, it may be formed to include a synthetic resin containing a dispersion of white pigments in order to implement the characteristics of promoting the reflection characteristics and the dispersion of light. For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. may be used as the white pigment, and polyethylene terephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin may be used as the synthetic resin. , Cellulose source acetate, weather resistant vinyl chloride, etc. may be used, but is not limited thereto.
또한, 반사시트(120)의 표면에는 반사패턴(121)이 형성될 수 있으며, 반사패턴(121)은 입사되는 광을 산란 및 분산시킴으로써 레진층(150) 상부로 출사되는 광의 균일도를 향상시키는 역할을 한다. 반사패턴(121)의 형성은 TiO2, CaCo3, BaSo4, Al2O3, Silicon, PS 중 어느 하나를 포함하는 반사잉크를 이용하여 반사시트(120) 표면에 인쇄함으로써 이루어질 수 있으나 이에 한정되는 것은 아니다. 또한 반사패턴(121)의 구조는 복수의 돌출된 패턴을 구비하는 구조로 이루어지며, 빛의 산란효과를 증대시키기 위하여 프리즘 형상, 렌티큘러 형상, 렌즈형상 또는 이들의 조합형상으로 이루어질 수 있으나, 이에 한정되는 것은 아니며, 또한 반사패턴(121)의 단면 형상은 삼각형, 사각형, 반원형, 사인파형 등 다양한 형상을 갖는 구조로 이루어질 수 있다. 아울러, 반사패턴(121)의 밀집도 또는 패턴크기는 발광유닛(130)과의 이격된 정도에 따라 변화될 수도 있다.In addition, a reflective pattern 121 may be formed on a surface of the reflective sheet 120, and the reflective pattern 121 serves to improve uniformity of light emitted to the upper portion of the resin layer 150 by scattering and dispersing incident light. Do it. The reflection pattern 121 may be formed by printing on the surface of the reflective sheet 120 using a reflective ink including any one of TiO 2 , CaCo 3 , BaSo 4 , Al 2 O 3, Silicon, and PS, but is not limited thereto. It doesn't happen. In addition, the reflective pattern 121 has a structure having a plurality of protruding patterns, and may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the light scattering effect. In addition, the cross-sectional shape of the reflective pattern 121 may have a structure having various shapes such as a triangle, a square, a semicircle, and a sinusoidal wave. In addition, the density or pattern size of the reflective pattern 121 may be changed depending on the degree of separation from the light emitting unit 130.
본 발명의 조명장치(100a, 100b)는 레진층 상면(150)에 형성된 제1광학시트(170), 제1광학시트(170) 상에 형성된 제2광학시트(190) 및 제1광학시트(170)와 제2광학시트(190) 사이에 형성된 접착층(180)을 더 포함하여 형성될 수 있으며, 접착층(180)에는 제1에어갭(181)이 더 형성될 수 있다. 즉 접착층(180)은, 광학패턴(183) 주위에 이격된 공간(제1에어갭, 181)을 형성하고, 그 외 부분에는 접착물질을 도포하여 제1광학시트(170) 및 제2광학시트(190)를 상호 접착하는 구조로 구현될 수 있다. 또한 제1광학시트(170)의 상면 또는 제2광학시트(190)의 하면에는 광학패턴(183)이 더 형성될 수 있으며, 제2광학시트(190) 상에 추가적으로 하나 이상의 광학시트를 더 형성하는 것도 가능하다. 제1광학시트(170), 제2광학시트(190), 접착층(180) 및 광학패턴(183)을 포함하는 구조는 광학패턴층(A)으로 정의 가능하다.Illumination apparatus (100a, 100b) of the present invention is the first optical sheet 170 formed on the resin layer upper surface 150, the second optical sheet 190 and the first optical sheet formed on the first optical sheet 170 ( The adhesive layer 180 may be further formed between the 170 and the second optical sheet 190, and the first air gap 181 may be further formed on the adhesive layer 180. That is, the adhesive layer 180 forms a space (first air gap 181) spaced around the optical pattern 183, and applies the adhesive material to the other portions to form the first optical sheet 170 and the second optical sheet. It may be implemented as a structure for bonding the 190 to each other. In addition, an optical pattern 183 may be further formed on an upper surface of the first optical sheet 170 or a lower surface of the second optical sheet 190, and one or more optical sheets may be further formed on the second optical sheet 190. It is also possible. The structure including the first optical sheet 170, the second optical sheet 190, the adhesive layer 180, and the optical pattern 183 may be defined as the optical pattern layer A. FIG.
광학패턴(183)은 발광유닛(130)에서 출사하는 광의 집중을 막기 위해 형성되는 차광패턴으로 형성될 수 있으며, 이를 위해서는 광학패턴(183)과 발광유닛(130)의 위치 사이에 어라인(align)이 필요하며, 어라인 이후 고정력을 확보하기 위한 접착층(180)를 이용하여 제1광학시트(170) 및 제2광학시트(190)를 접착하게 된다.The optical pattern 183 may be formed as a light shielding pattern formed to prevent concentration of light emitted from the light emitting unit 130, and for this purpose, an alignment between the optical pattern 183 and the position of the light emitting unit 130 is aligned. The first optical sheet 170 and the second optical sheet 190 are bonded to each other using the adhesive layer 180 to secure the fixing force after the alignment.
제1광학시트(170) 및 제2광학시트(190)는 광투과율이 우수한 재질을 이용하여 형성할 수 있으며, 일례로 PET를 이용할 수 있다. The first optical sheet 170 and the second optical sheet 190 may be formed using a material having excellent light transmittance, and PET may be used as an example.
한편, 도 3의 (b)에 도시된 바와 같이 상부발광형 LED(135)가 레진층(150) 상부로 일부 돌출된 경우, 즉 레진층(150)에 의해 상부발광형 LED(135)의 일부만이 매립된 경우, 상부발광형 LED(135)의 돌출된 부분은 제1광학시트(170) 하부에 삽입될 수 있다. 이러한 경우, 필요에 따라 외부로 공급되는 점광원의 광 밀집도를 향상시킬 수 있는 이점을 갖게 된다.Meanwhile, as shown in FIG. 3B, when the upper light emitting LED 135 partially protrudes above the resin layer 150, that is, only a part of the upper light emitting LED 135 is formed by the resin layer 150. When buried, the protruding portion of the top emitting LED 135 may be inserted below the first optical sheet 170. In this case, there is an advantage that can improve the light density of the point light source supplied to the outside as needed.
제1광학시트(170)와 제2광학시트(190) 사이에 배치되는 광학패턴(183)은 기본적으로 발광유닛(130)에서 출사되는 광이 집중되지 않도록 하는 기능을 한다. 이러한 광학패턴(153)은 빛이 강도가 과하게 강하여 광학특성이 나빠지거나 황색광이 도출(yellowish)되는 현상을 방지하기 위하여 일정 부분 차광효과가 구현될 수 있도록 차광패턴으로 형성될 수 있으며, 이러한 차광패턴은 차광잉크를 이용하여 제1광학시트(170) 상면 또는 제2광학시트(190) 하면에 인쇄공정을 수행함으로써 형성될 수 있다. The optical pattern 183 disposed between the first optical sheet 170 and the second optical sheet 190 basically serves to prevent the light emitted from the light emitting unit 130 from being concentrated. The optical pattern 153 may be formed as a light shielding pattern so that a part of the light shielding effect may be implemented in order to prevent a phenomenon in which the light is excessively strong so that optical characteristics deteriorate or yellowish light is emitted. The pattern may be formed by performing a printing process on the top surface of the first optical sheet 170 or the bottom surface of the second optical sheet 190 using the light shielding ink.
광학패턴(183)은 광을 완전차단하는 기능이 아니라, 광의 일부 차광 및 확산의 기능을 수행할 수 있도록 하나의 광학패턴으로 광의 차광도나 확산도를 조절할 수 있도록 구현할 수 있다. 나아가 더욱 구체적으로는 본 발명에 따른 광학패턴(183)은 복합적인 패턴의 중첩인쇄구조로 구현할 수도 있다. 중첩인쇄의 구조란 하나의 패턴을 형성하고, 그 상부에 또 하나의 패턴형상을 인쇄하여 구현하는 구조를 말한다.The optical pattern 183 may not be a function of completely blocking the light, but may be implemented to adjust the light shielding degree or the diffusivity of the light with one optical pattern to perform a function of blocking and diffusing the light. Furthermore, more specifically, the optical pattern 183 according to the present invention may be implemented as a superimposed printed structure of a complex pattern. The superimposed printing structure refers to a structure that forms one pattern and prints another pattern shape on the upper portion thereof.
일례로는 광학패턴(183)을 구현함에 있어서, 광의 출사방향으로 고분자필름(예컨대 제2광학시트)의 하면에 TiO2, CaCO3, BaSO4, Al2O3, Silicon 중 선택되는 어느 하나 이상의 물질을 포함하는 차광잉크를 이용하여 형성되는 확산패턴과, Al 또는 Al과 TiO2의 혼합물질을 포함하는 차광잉크를 이용하여 형성된 차광패턴의 중첩구조로 구현할 수 있다. 즉 고분자필름의 표면에 확산패턴을 화이트인쇄 하여 형성한 후, 그 위에 차광패턴을 형성하거나, 이와 반대의 순서로 2중 구조로 형성하는 것도 가능하다. 물론 이러한 패턴의 형성 디자인은 광의 효율과 강도, 차광율을 고려하여 다양하게 변형할 수 있음은 자명하다 할 것이다. 또는, 순차 적층구조에서 가운데층에 금속패턴인 차광패턴을 형성하고, 그 상부와 하부에 각각 확산패턴을 구현하는 3 중구조로 형성하는 것도 가능하다. 이러한 3 중구조에서는 상술한 물질을 선택하여 구현하는 것이 가능하며, 바람직한 일례로서는 굴절율이 뛰어난 TiO2를 이용하여 확산패턴 중 하나를 구현하고, 광안정성과 색감이 뛰어난 CaCO3를 TiO2와 함께 사용하여 다른 확산패턴을 구현하며, 은폐가 뛰어난 Al을 이용하여 차광패턴을 구현하는 구조의 3 중 구조를 통해 빛의 효율성과 균일성을 확보할 수 있다. 특히 CaCO3는 황색광의 노출을 차감하는 기능을 통해 최종적으로 백색광을 구현하도록 하는 기능을 하여 더욱 안정적인 효율의 광을 구현할 수 있게 되며, CaCO3이외에도 BaSO4, Al2O3, Silicon 비드 등의 입자 사이즈가 크고, 유사한 구조를 가진 무기 재료들을 활용할 수도 있다. 아울러, 광학패턴(183)은 상기 발광유닛(130)의 출사방향에서 멀어질수록 패턴밀도가 낮아지도록 패턴밀도를 조절하여 형성함이 광효율의 측면에서 바람직하다.For example, in implementing the optical pattern 183, at least one selected from TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and Silicon on the lower surface of the polymer film (eg, the second optical sheet) in the light emitting direction. The light emitting pattern may include a diffusion pattern formed using a light shielding ink including a material and a light shielding pattern formed using a light shielding ink including Al or a mixture of Al and TiO 2 . That is, after the diffusion pattern is formed by white printing on the surface of the polymer film, a light shielding pattern may be formed thereon, or a double structure may be formed in the reverse order. Of course, it will be apparent that the patterned design of the pattern may be variously modified in consideration of light efficiency, intensity, and light blocking rate. Alternatively, the light-shielding pattern, which is a metal pattern, may be formed on the middle layer in the sequentially stacked structure, and a triple structure may be formed on the upper and lower portions thereof to implement the diffusion pattern. In such a triple structure, it is possible to select and implement the above-described materials. As a preferred example, one of the diffusion patterns is implemented using TiO 2 having excellent refractive index, and CaCO 3 having excellent light stability and color sense is used together with TiO 2. It is possible to realize different diffusion patterns, and to secure light efficiency and uniformity through the triple structure of the structure implementing the light shielding pattern using Al having excellent concealment. In particular, CaCO 3 functions to subtract the exposure of yellow light to finally realize white light, thereby realizing more stable light. In addition to CaCO 3 , particles such as BaSO 4 , Al 2 O 3 , and silicon beads Larger, similarly structured inorganic materials may be used. In addition, the optical pattern 183 is preferably formed by adjusting the pattern density so that the pattern density is lowered farther from the emission direction of the light emitting unit 130 in terms of light efficiency.
접착층(180)은 광학패턴(183)의 주변부를 포위하고 이외 부분에 제1에어갭(181)을 형성하는 구조 또는 광학패턴(183)의 주변부에 제1에어갭(181)을 형성하는 구조로 형성될 수 있으며, 이에 따라 두 광학시트(170, 190)를 접착하여 어라인(align)을 구현할 수 있게 된다. 즉, 제1광학시트(170) 및 제2광학시트(190)의 접착구조는 인쇄된 광학패턴(183)을 고정하는 기능을 아울러 구현할 수 있게 된다. The adhesive layer 180 may have a structure surrounding the periphery of the optical pattern 183 and forming the first air gap 181 at other portions, or forming the first air gap 181 at the periphery of the optical pattern 183. It can be formed, thereby aligning the two optical sheets (170, 190) by aligning. That is, the adhesive structure of the first optical sheet 170 and the second optical sheet 190 can be implemented with a function of fixing the printed optical pattern 183.
이때 접착층(180)은, 열경화 PSA, 열경화접착제, UV 경화 PSA 타입의 물질을 이용할 수 있으나 이에 한정되는 것은 아니다.In this case, the adhesive layer 180 may use a thermosetting PSA, a thermosetting adhesive, or a UV curing PSA type material, but is not limited thereto.
확산판(290)은 레진층(150)의 상측에 형성될 수 있으며, 상술한 제1광학시트(170) 및 제2광학시트(190)가 더 형성된 경우, 제2광학시트(190) 상측에 형성될 수 있다. 이러한 확산판(290)은 레진층(150)을 통과하여 출사되는 광을 전면에 걸쳐 균일하게 확산시키는 역할을 하며, 일반적으로 아크릴 수지로 형성될 수 있으나, 이에 한정되는 것은 아니며 이외에도 폴리스티렌(PS), 폴리메틸 메타크릴레이트(PMMA), 환상 올레핀 코폴리(COC), 폴리에틸렌 테레프탈레이트(PET), 레진(resin)과 같은 고투과성 플라스틱 등 확산기능을 수행할 수 있는 모든 재질로 이루어질 수 있다고 할 것이다.The diffusion plate 290 may be formed on the resin layer 150. When the first optical sheet 170 and the second optical sheet 190 are further formed, the diffusion plate 290 may be formed on the upper side of the second optical sheet 190. Can be formed. The diffusion plate 290 serves to uniformly spread the light emitted through the resin layer 150 over the entire surface, and may be generally formed of an acrylic resin, but is not limited thereto. In addition, polystyrene (PS) , Polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), high permeability plastics such as resin (resin) can be made of any material capable of performing the diffusion function .
이때 확산판(290)과 레진층(150) 사이에는 에어층(제2에어갭, 280)을 더 형성할 수 있으며, 제1광학시트(170) 및 제2광학시트(190)가 더 형성된 경우, 상술한 제2에어갭(280)은 제2광학시트(190)와 확산판(290) 사이에 형성될 수 있다.In this case, an air layer (second air gap 280) may be further formed between the diffusion plate 290 and the resin layer 150, and the first optical sheet 170 and the second optical sheet 190 are further formed. The second air gap 280 may be formed between the second optical sheet 190 and the diffusion plate 290.
이러한 제2에어갭(280)의 존재로 인해 확산판(290)에 공급되는 광의 균일도를 증가시킬 수 있게 되고, 결과적으로 확산판(290)을 통과하여 확산 및 출사되는 광의 균일도(uniformity)를 향상시키는 효과를 구현할 수 있게 된다. 이때, 레진층(150)을 투과한 광의 편차를 최소화 하기 위해, 제2에어갭(280)의 높이(H1)는 0 초과 30mm 이하의 범위에서 형성될 수 있으나, 이에 한정되는 것은 아니며 필요에 따라 적절히 설계변경 가능하다고 할 것이다.Due to the presence of the second air gap 280, it is possible to increase the uniformity of the light supplied to the diffuser plate 290, and consequently, to improve the uniformity of light diffused and emitted through the diffuser plate 290. Can be implemented. At this time, in order to minimize the deviation of the light transmitted through the resin layer 150, the height (H1) of the second air gap 280 may be formed in the range of more than 0 and 30mm or less, but is not limited thereto and as necessary Design changes can be made accordingly.
도 4는 도 3에 도시된 본 발명의 조명장치 중, 발광유닛 배치에 대한 예시를 도시한 것이다. Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
도 4를 참조하면, 본 발명의 조명장치에 포함된 발광유닛은, 도 3의 설명에서 상술한 바와 같이 측면발광형 LED(131) 및 상부발광형 LED(133)로 이루어질 수 있으며, 이의 배치는 도 4에 도시된 바와 같이 연성인쇄회로기판(110) 상에 측면발광형 LED(131)가 2열 이상의 형태로 배치되고, 측면발광형 LED(131)의 열 사이에 상부발광형 LED(133)가 배치되는 구조로 이루어질 수 있다. 다만 이는 하나의 예시일 뿐이며, 이외에도 필요에 따라 상부발광형 LED(133)의 배치 및 측면발광형 LED(131)의 배치를 적절히 변경할 수 있다고 할 것이다. 이러한 본 발명에 따르면, 별도의 추가적 조명장치 없이도 측면발광형 LED 및 레진층을 이용하여 면발광을 구현할 수 있을 뿐만 아니라 추가적으로 상부발광형 LED를 통해 점발광도 구현할 수 있는 이점을 갖게 되며, 면발광 및 점발광의 조합에 의해 다양한 형상의 출사광을 구현할 수 있는 이점을 갖게 됨은 상술한 바와 같다.Referring to FIG. 4, the light emitting unit included in the lighting apparatus of the present invention may include a side light emitting LED 131 and a top light emitting LED 133 as described above in FIG. 3. As shown in FIG. 4, the side light emitting LEDs 131 are disposed in two or more rows on the flexible printed circuit board 110, and the top light emitting LEDs 133 are disposed between the rows of the side light emitting LEDs 131. It may be made of a structure that is arranged. However, this is only one example, and in addition, the arrangement of the top emitting type LED 133 and the arrangement of the side emitting type LED 131 may be appropriately changed as necessary. According to the present invention, it is possible not only to implement the surface emission using the side emitting type LED and the resin layer without additional additional lighting device, but also has the advantage of implementing the point emitting through the top emitting type LED, surface emitting And by the combination of the point light emission has the advantage that can implement the emission light of various shapes as described above.
도 5는 본 발명에 따른 조명장치를 차량용 헤드라이트에 적용한 구조를 개략적으로 도시한 것이다.5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
도 5를 참조하면, 본 발명에 따른 조명장치(100a)는 연성회로기판 및 레진층을 사용하여 형성되는 바, 그 자체가 일정 유연성을 갖게 된다. 따라서 도 5에 도시된 바와 같이 굴곡이 형성된 차량용 헤드라이트 하우징(300)에도 용이하게 장착 가능하며, 이에 따라 하우징과 결합한 완제품의 디자인 자유도를 향상시킬 수 있는 효과 및 디자인 자유도 향상에도 불구하고 균일한 휘도 및 조도를 확보할 수 있는 효과를 거둘 수 있게 된다. 한편, 도 5에는 도 3의 (a)에 도시된 조명장치가 장착된 것으로 표시되어 있으나, 이는 하나의 예시일 뿐이며 도 3의 (b)에 도시된 조명장치가 장착될 수도 있다.Referring to FIG. 5, the lighting apparatus 100a according to the present invention is formed using a flexible circuit board and a resin layer, and thus has a certain flexibility. Therefore, as shown in FIG. 5, the curved headlight housing 300 can be easily mounted, and thus, even in spite of the effect of improving the design freedom of the finished product combined with the housing and the design freedom, the uniformity is improved. It is possible to achieve the effect of ensuring the brightness and illuminance. Meanwhile, although FIG. 5 shows that the lighting apparatus shown in FIG. 3 (a) is mounted, this is only one example and the lighting apparatus shown in FIG. 3 (b) may be mounted.
이상으로 본 발명의 기술적 사상을 예시하기 위한 바람직한 실시예와 관련하여 설명하고 도시하였지만, 본 발명은 이와 같이 도시되고 설명된 그대로의 구성 및 작용에만 국한되는 것은 아니며, 기술적 사상의 범주를 일탈함 없이 본 발명에 대해 다수의 적절한 변형 및 수정이 가능함을 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자들은 잘 이해할 수 있을 것이다. 따라서 그러한 모든 적절한 변형 및 수정과 균등물들도 본 발명의 범위에 속하는 것으로 간주되어야 할 것이다.As described above and described with reference to a preferred embodiment for illustrating the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described as such, without departing from the scope of the technical idea It will be appreciated by those skilled in the art that many suitable modifications and variations of the present invention are possible. Accordingly, all such suitable modifications and variations and equivalents should be considered to be within the scope of the present invention.

Claims (20)

  1. 기판;Board;
    상기 기판상의 광출사 방향이 서로 다른 적어도 하나 이상의 광원을 포함하는 발광유닛; 및A light emitting unit including at least one light source having different light emission directions on the substrate; And
    상기 발광유닛을 매립하는 광가이드부재;An optical guide member embedding the light emitting unit;
    를 포함하는 조명장치.Lighting device comprising a.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 발광유닛은,The light emitting unit,
    측면발광형 LED 및 상부발광형 LED를 포함하는 조명장치.Lighting device comprising a side emitting type LED and a top emitting type LED.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 광가이드부재는,The optical guide member,
    상기 측면발광형 LED 전부와, All of the side-emitting LEDs,
    상기 상부발광형 LED 일부 또는 전부를 매립하는 레진층인 조명장치.Illumination device that is a resin layer to bury a part or all of the top light emitting LED.
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 레진층의 상면에 광을 분산하는 제1광학시트를 더 포함하는 조명장치.Lighting device further comprises a first optical sheet for dispersing light on the upper surface of the resin layer.
  5. 청구항 4에 있어서,The method according to claim 4,
    상기 상부발광형 LED는,The upper light emitting type LED,
    상기 레진층 상부로 일부 돌출되어 상기 제1광학시트 하부에 삽입된 조명장치.Is partially protruded above the resin layer is inserted into the lower portion of the first optical sheet.
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 제1광학시트 상에 제2광학시트를 더 포함하는 조명장치.Lighting device further comprises a second optical sheet on the first optical sheet.
  7. 청구항 6에 있어서,The method according to claim 6,
    상기 기판은 연성회로기판인 조명장치.The substrate is a flexible circuit board.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 제1광학시트와 상기 제2광학시트 사이에 접착층을 더 포함하며,Further comprising an adhesive layer between the first optical sheet and the second optical sheet,
    상기 접착층은 제1에어갭을 포함하는 조명장치.The adhesive layer is a lighting device including a first air gap.
  9. 청구항 5에 있어서,The method according to claim 5,
    상기 제1광학시트 상면 또는 상기 제2광학시트 하면에 광을 차광 또는 반사하는 광학패턴을 포함하는 조명장치.And an optical pattern for blocking or reflecting light on an upper surface of the first optical sheet or a lower surface of the second optical sheet.
  10. 청구항 9에 있어서,The method according to claim 9,
    상기 광학패턴은,The optical pattern,
    TiO2, CaCO3, BaSO4, Al2O3, Silicon 중 선택되는 어느 하나 이상의 물질을 함유하는 차광잉크를 포함한 확산패턴과,A diffusion pattern including a light shielding ink containing at least one selected from TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and Silicon,
    Al 또는 Al과 TiO2의 혼합물질을 함유하는 차광잉크를 포함한 차광패턴의 중첩구조로 이루어진 조명장치.An illumination device comprising an overlapping structure of a light shielding pattern including a light shielding ink containing Al or a mixture of Al and TiO 2 .
  11. 청구항 10에 있어서,The method according to claim 10,
    상기 확산패턴은,The diffusion pattern is,
    상기 차광패턴의 상면 및 하면 중 적어도 어느 한 면에 인쇄된 구조를 포함하는 조명장치.Lighting device comprising a structure printed on at least one of the upper surface and the lower surface of the light shielding pattern.
  12. 청구항 1에 있어서,The method according to claim 1,
    상기 레진층 상측에 확산판; 을 더 포함하는 조명장치.A diffusion plate on the resin layer; Lighting device further comprising.
  13. 청구항 12에 있어서,The method according to claim 12,
    상기 레진층과 상기 확산판 사이에 제2에어갭을 포함하는 조명장치.Lighting device including a second air gap between the resin layer and the diffusion plate.
  14. 청구항 13에 있어서,The method according to claim 13,
    상기 제2에어갭은, 0 초과 30mm 이하의 범위를 가지는 조명장치.The second air gap is a lighting device having a range of more than 0 and 30mm or less.
  15. 청구항 1에 있어서,The method according to claim 1,
    상기 연성인쇄회로기판 상에, 상기 발광유닛에 의해 관통되는 구조로 반사시트를 더 포함하는 조명장치.And a reflective sheet on the flexible printed circuit board having a structure penetrating by the light emitting unit.
  16. 청구항 15에 있어서,The method according to claim 15,
    상기 반사시트 상에 반사패턴을 더 포함하는 조명장치.Lighting device further comprising a reflective pattern on the reflective sheet.
  17. 청구항 16에 있어서,The method according to claim 16,
    상기 반사패턴은, TiO2, CaCo3, BaSo4, Al2O3, Silicon, PS 중 어느 하나를 함유하는 반사잉크를 포함한 조명장치.The reflective pattern is a lighting device including a reflective ink containing any one of TiO 2 , CaCo 3 , BaSo 4 , Al 2 O 3 , Silicon, PS.
  18. 청구항 3에 있어서,The method according to claim 3,
    상기 레진층은,The resin layer,
    올리고머를 포함하는 자외선경화수지로 이루어진 조명장치.Lighting device consisting of an ultraviolet curable resin containing an oligomer.
  19. 청구항 18에 있어서,The method according to claim 18,
    상기 올리고머는,The oligomer,
    Urethane Acrylate, Epoxy Acrylate, polyester Acrylate, Acrylic Acrylate 중 선택되는 어느 하나의 물질을 포함하는 조명장치.Lighting device comprising any one selected from urethane Acrylate, Epoxy Acrylate, polyester Acrylate, Acrylic Acrylate.
  20. 청구항 18에 있어서,The method according to claim 18,
    상기 레진층은,The resin layer,
    실리콘(sillicon), 실리카(silla), 글라스버블(glass bubble), PMMA, 우레탄(urethane), Zn, Zr, Al2O3, 아크릴(acryl) 중 선택되는 어느 하나로 이루어진 비드를 더 포함하는 조명장치.Lighting device further comprises a bead made of any one selected from silicon (sillicon), silica (silla), glass bubble (glass bubble), PMMA, urethane (urethane), Zn, Zr, Al 2 O 3 , acrylic (acryl) .
PCT/KR2013/004822 2012-05-31 2013-05-31 Lighting device WO2013180519A1 (en)

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