WO2015174622A1 - Photo-functional flexible circuit board for led lighting device - Google Patents

Photo-functional flexible circuit board for led lighting device Download PDF

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Publication number
WO2015174622A1
WO2015174622A1 PCT/KR2015/002010 KR2015002010W WO2015174622A1 WO 2015174622 A1 WO2015174622 A1 WO 2015174622A1 KR 2015002010 W KR2015002010 W KR 2015002010W WO 2015174622 A1 WO2015174622 A1 WO 2015174622A1
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Prior art keywords
circuit board
light
flexible substrate
led lighting
flexible
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PCT/KR2015/002010
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French (fr)
Korean (ko)
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이영식
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이영식
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Publication of WO2015174622A1 publication Critical patent/WO2015174622A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to a flexible printed circuit board, and more particularly, to a flexible printed circuit board for an LED lighting device to which optical functionality is imparted.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • LED has been attracting much attention in recent years because it is environmentally friendly, has a relatively long lifespan, and has a very low power consumption, and technology development for LED lighting devices using LEDs has been actively made.
  • the LED lighting apparatus includes a substrate 10, a conductive layer 20 formed on the substrate 10, an LED chip 30 mounted on the conductive layer 20, and an LED chip ( It is configured to include a diffusion plate 40 spaced apart from the upper portion of the 30 by a predetermined interval.
  • LED lighting Since the light emitted from the LED chip 30 is transmitted through the diffusion plate 40 and is configured to prevent glare, LED lighting has a strong straightness, and thus does not sufficiently prevent glare.
  • Embodiments of the present invention are to apply a flexible circuit board having a flexible property as a circuit board for the LED lighting device, and to provide an optical functional flexible circuit board integrating a light diffusion function or a light reflection function.
  • the flexible substrate having a light transmission; A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And a light diffusing layer formed on the other surface of the flexible substrate, the optical functional flexible circuit board for the LED lighting apparatus may be provided.
  • the metal thin film layer may include at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
  • the light reflection film may be disposed spaced apart from the upper portion of the conductive layer by a predetermined interval.
  • the flexible substrate having a light transmission; A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And a light reflecting layer formed on the other surface of the flexible board.
  • the light reflection layer may be formed including at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
  • the optical functional flexible printed circuit board increases the design freedom of the LED lighting apparatus by using the flexible printed circuit board having a flexible property, and forms a light diffusion layer or a light reflective layer on the rear surface of the flexible printed circuit board. Therefore, it is possible to increase the light efficiency even with a relatively simple structure without having to densely mount the LED chip.
  • FIG. 1 is a view schematically showing a conventional LED lighting apparatus.
  • FIG. 2 is a view schematically showing a light functional flexible circuit board for an LED lighting device according to an embodiment of the present invention.
  • FIG. 3 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board of FIG. 2 is applied.
  • FIG. 4 is a view schematically showing a light functional flexible circuit board for an LED lighting device according to another embodiment of the present invention.
  • FIG. 5 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board of FIG. 4 is applied.
  • substrate 20 conductive layer
  • LED chip 40 diffuser plate
  • FIG. 2 is a view schematically showing an optical functional flexible circuit board 100 (hereinafter, referred to as an optical functional flexible circuit board) for an LED lighting apparatus according to an embodiment of the present invention.
  • the optical functional flexible printed circuit board 100 may include a flexible substrate 110, a conductive layer 130 formed on one surface of the flexible substrate 110, and light formed on the other surface of the flexible substrate 110.
  • the diffusion layer 140 is included.
  • the flexible substrate 110 is a flexible substrate having a flexible (flexible) property, and has a higher degree of design freedom than a conventional rigid type printed circuit board, thereby making it possible to form lighting of various designs.
  • the flexible substrate 110 may be light-transmitting, for example, a light-transmissive polycarbonate, polypropylene, acrylic, polyether ether ketone (PEEK) or polyethylene terephthalate, which is not damaged even at high temperatures, may be used.
  • a light-transmissive polycarbonate polypropylene, acrylic, polyether ether ketone (PEEK) or polyethylene terephthalate, which is not damaged even at high temperatures, may be used.
  • the heat resistance may be good, and thus curling of the flexible substrate 110 may be prevented in the reflow process after mounting the LED chip.
  • the flexible substrate 110 may be in the form of a film, which has advantages in terms of manufacturing cost. Since flexible substrates having light transmittance and heat resistance are relatively expensive, the use of them in the form of a film may lower the manufacturing cost.
  • the conductive layer 130 is formed on one surface of the flexible substrate 110 and the LED chip 30 is mounted. That is, the conductive layer 130 corresponds to a circuit layer for applying power for driving the LED chip 30.
  • the conductive layer 130 may be made of a flexible metal material such as copper or a conductive polymer. Therefore, even if the flexible substrate 110 is bent or curved, the conductive layer 130 may be bent or curved together with the flexible substrate 110.
  • the conductive polymer include polyacetylene, polyaniline, polythiophene, polysulfuride, polypyrrole, and the like, but are not limited thereto.
  • the conductive layer 130 is formed of copper
  • a copper seed may be formed on one surface of the flexible substrate 110 by sputtering, and then the conductive layer 130 may be formed using an electrolytic copper plating method.
  • the conductive layer 130 is formed of a conductive polymer, it is also possible to use a photolithography method which is a known method.
  • the thickness of the conductive layer 130 is advantageous when considering the heat dissipation, there is an advantageous side, but in this case it is preferable to form so as to have a thickness in the range of 3 to 12 ⁇ m because there is a problem that the manufacturing cost increases.
  • the light diffusion layer 140 is formed on the other surface of the flexible substrate 110. That is, the conductive layer 130 is formed on one surface of the flexible substrate 110 and the light diffusion layer 140 is formed on the other surface.
  • the light diffusion layer 140 diffuses the light uniformly when the light irradiated from the LED chip 30 is reflected by the light reflection film 50 (see FIG. 3) disposed on the LED chip 30. Function to implement
  • the light diffusion layer 140 may be formed using a material commonly used in the art, and may be, for example, in a form including ceramic powder in a polymer resin.
  • Formation of the light diffusion layer 140 may be made using a known process such as silk screen, gravure printing, comma coating on the other surface of the flexible substrate 110 is not limited thereto.
  • the optical functional flexible circuit board 100 may further include a metal thin film layer 120 formed between the flexible substrate 110 and the conductive layer 130.
  • the metal thin film layer 120 is formed on the entire upper surface of the flexible substrate 110, but the metal thin film layer 120 is formed on the same layer as the conductive layer 130 except for the conductive layer 130. It may be formed in the space.
  • the metal thin film layer 120 may include at least one of aluminum, silver, chromium, nickel, titanium, copper, and alloys thereof, and the metal thin film layer 120 may suppress a change in light color or coordinate value of the LED lighting. Can function.
  • FIG. 3 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board 100 of FIG. 2 is applied.
  • the optical functional flexible printed circuit board 100 is disposed such that the conductive layer 130 on which the LED chip 30 is mounted faces upward, and the conductive layer 130 is disposed. It may be used together with the light reflection film 50 is spaced apart from the upper portion by a predetermined interval. That is, the light reflection film 50 is disposed on the opposite side of the light irradiated from the LED chip 30.
  • the material of the light reflection film 50 is not specified and may correspond to, for example, a wall or a ceiling. However, in order to increase the light efficiency, it is preferable that the light reflection film 50 uses a separate reflection sheet or reflector.
  • the light reflection film 50 may be generally made of a metal material to reflect light well, and may have a concave shape or a plate shape.
  • a phosphor (not shown) may be applied to the inside of the light reflection film 50.
  • the phosphor receives a light emitted from the LED chip 30 and emits light having a predetermined wavelength. It can be used to implement the illumination light of. Examples of such phosphors include silicates, TAG (Terbium Aluminum Garnet), and the like.
  • the operation of the LED lighting apparatus will be briefly described.
  • the light irradiated from the LED chip 30 mounted on the optical functional flexible printed circuit board 100 is reflected by the light reflection film 50 and returns, the optical functional flexible
  • the light is uniformly diffused by the light diffusion layer 140 formed on the lower surface of the circuit board 100 and the surface is emitted. Therefore, there is an effect that can increase the light efficiency with a relatively simple structure without having to densely mount the LED chip as before.
  • FIG. 4 is a view schematically showing an optical functional flexible circuit board 200 (hereinafter, referred to as an optical functional flexible circuit board) for an LED lighting apparatus according to another embodiment of the present invention.
  • the optical functional flexible circuit board 200 is formed on the flexible substrate 210, the conductive layer 220 on which one surface of the flexible substrate 210 is mounted, and the flexible substrate 210 is mounted on the flexible substrate 210. And a light reflection layer 230 formed on the other surface of the 210.
  • the flexible substrate 210 is the same as or similar to the flexible substrate 110 (refer to FIG. 2) of the above-described embodiment, redundant description thereof will be omitted.
  • the conductive layer 220 is also the same as or similar to the conductive layer 130 (refer to FIG. 2) of the above-described embodiment, redundant description thereof will be omitted.
  • the light reflection layer 230 is formed on the other surface of the flexible substrate 210. That is, the conductive layer 220 is formed on one surface of the flexible substrate 210 and the light reflection layer 230 is formed on the other surface. If the optical functionality imparted to the flexible circuit board in the above embodiment was a light diffusion function, the optical functionality imparted to the flexible circuit board in this embodiment is a light reflection function.
  • the light reflection layer 230 may include at least one of aluminum, silver, chromium, nickel, titanium, copper, and alloys thereof.
  • the light reflection layer 230 may be formed of a single layer or multiple layers of two or more layers, and the materials forming each layer may be the same or different.
  • the light reflection layer 230 functions to increase the reflected light efficiency by reflecting the light scattered toward the rear of the LED chip 30 to the front again. This contributes to reducing the number of mounting of the LED chip 30 and has an effect of lowering the manufacturing cost.
  • FIG. 5 is a view schematically showing an LED lighting device to which the photofunctional flexible printed circuit board 200 of FIG. 4 is applied.
  • the conductive layer 220 on which the LED chip 30 is mounted faces downward.
  • the operation of the LED lighting apparatus according to the present embodiment will be briefly described.
  • the LED chip 30 is directed toward the rear side of the LED chip 30.
  • a predetermined amount of light is scattered.
  • the scattered light is reflected by the light reflection layer 230 and irradiated forward. Accordingly, the reflected light efficiency can be increased as compared with the case in which there is no light reflection layer 230, and the light efficiency can be increased even with a relatively simple structure without the densely mounted LED chip as in the past.
  • the optical functional flexible printed circuit board according to the embodiments of the present invention not only increases the design freedom of the LED lighting apparatus by using the flexible printed circuit board having the flexible property, but also the light diffusion layer on the rear surface of the flexible printed circuit board.
  • the light reflection layer it is possible to increase the light efficiency even with a relatively simple structure without the densely mounted LED chip. That is, since it is possible to secure a constant light irrespective of the array of LED chips, the overall manufacturing cost is reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Disclosed is a photo-functional flexible circuit board for an LED lighting device. A photo-functional flexible circuit board for an LED lighting device according to an embodiment of the present invention comprises: a flexible substrate having photo-transmissivity; a conductive layer formed on one surface of the flexible substrate and having an LED chip mounted thereon; and a light diffusion layer formed on the other surface of the flexible substrate.

Description

엘이디 조명장치용 광기능성 연성회로기판Optical functional flexible circuit board for LED lighting device
본 발명은 연성회로기판에 관한 것으로, 보다 상세하게는 광기능성이 부여된 엘이디 조명장치용 연성회로기판에 관한 것이다.The present invention relates to a flexible printed circuit board, and more particularly, to a flexible printed circuit board for an LED lighting device to which optical functionality is imparted.
엘이디(LED, Light Emitting Diode)는 화합물 반도체 단자에 전류를 흘려서 P-N 접합 부근이나 활성층에서 전자와 홀의 결합에 의해 빛을 방출하는 소자다. 엘이디는 친환경적이고 상대적으로 수명이 길고 소비 전력이 현저히 낮으므로 근래에 크게 주목받고 있으며, 엘이디를 이용한 엘이디 조명장치에 관한 기술 개발 역시 활발히 이루어지고 있다. An LED (Light Emitting Diode) is a device that emits light by coupling electrons and holes in the vicinity of a P-N junction or in an active layer by flowing a current through a compound semiconductor terminal. LED has been attracting much attention in recent years because it is environmentally friendly, has a relatively long lifespan, and has a very low power consumption, and technology development for LED lighting devices using LEDs has been actively made.
도 1은 종래 엘이디 조명장치를 개략적으로 도시한 도면이다. 도 1을 참고하면, 엘이디 조명장치는 기판(10)과, 기판(10)의 상부에 형성되는 도전층(20)과, 도전층(20)에 실장되는 엘이디칩(30)과, 엘이디칩(30)의 상부와 소정 간격 이격되어 배치되는 확산판(40)을 포함하여 구성된다. 1 is a view schematically showing a conventional LED lighting apparatus. Referring to FIG. 1, the LED lighting apparatus includes a substrate 10, a conductive layer 20 formed on the substrate 10, an LED chip 30 mounted on the conductive layer 20, and an LED chip ( It is configured to include a diffusion plate 40 spaced apart from the upper portion of the 30 by a predetermined interval.
엘이디칩(30)에서 조사된 광이 확산판(40)을 투과하여 방출되므로 눈부심을 방지하도록 구성이 되고는 있으나, 엘이디 조명은 직진성이 강한 바, 충분히 눈부심을 방지하지 못하는 단점이 있다. Since the light emitted from the LED chip 30 is transmitted through the diffusion plate 40 and is configured to prevent glare, LED lighting has a strong straightness, and thus does not sufficiently prevent glare.
또한 기판(10)에 배치되는 엘이디칩(30)의 어레이에 따라 조사되는 빛의 형상이 달라지게 되는 바, 엘이디칩(30)의 어레이를 적절하게 설정하지 않으면 휘선이 발생하거나 빛의 명암이 생기는 문제점이 있다. In addition, since the shape of light to be irradiated varies depending on the array of LED chips 30 disposed on the substrate 10, if the array of LED chips 30 is not properly set, bright lines may occur or light and shade may occur. There is a problem.
상술한 눈부심을 방지하기 위해서는 엘이디 조명장치의 밝기를 다소 낮추는 방법을 사용할 수는 있으나, 이 경우에는 조명의 역할이 한정되는 문제가 있다. 또한 휘선이나 명암 발생을 줄이기 위해서는 엘이디칩을 조밀하게 실장하여야 하므로 엘이디 조명장치의 제조단가가 상승하는 문제가 있다. In order to prevent the above-described glare may be used a method of slightly lowering the brightness of the LED lighting device, in this case there is a problem that the role of the illumination is limited. In addition, since LED chips must be densely mounted in order to reduce bright lines or light and shade, there is a problem that the manufacturing cost of the LED lighting apparatus increases.
게다가 종래 엘이디 조명장치에서는 리지드 타입의 인쇄회로기판(PCB)을 사용하는 경우가 일반적이므로, 조명장치의 디자인 자유도가 낮다는 문제도 존재하고 있다.In addition, in the conventional LED lighting apparatus, since a rigid type printed circuit board (PCB) is generally used, there is a problem of low design freedom of the lighting apparatus.
본 발명의 실시예들은 엘이디 조명장치용 회로기판으로 플렉시블한 성질을 갖는 연성회로기판을 적용하고, 광확산 기능 또는 광반사 기능을 일체화한 광기능성 연성회로기판을 제공하고자 한다.Embodiments of the present invention are to apply a flexible circuit board having a flexible property as a circuit board for the LED lighting device, and to provide an optical functional flexible circuit board integrating a light diffusion function or a light reflection function.
본 발명의 일 측면에 따르면, 광투과성을 갖는 연성기판; 상기 연성기판의 일면에 형성되며 엘이디칩이 실장되는 도전층; 및 상기 연성기판의 타면에 형성되는 광확산층을 포함하는 엘이디 조명장치용 광기능성 연성회로기판이 제공될 수 있다. According to an aspect of the invention, the flexible substrate having a light transmission; A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And a light diffusing layer formed on the other surface of the flexible substrate, the optical functional flexible circuit board for the LED lighting apparatus may be provided.
또한, 상기 연성기판과 도전층 사이에 형성되는 금속박막층을 더 포함하고, 상기 금속박막층은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성될 수 있다.In addition, further comprising a metal thin film layer formed between the flexible substrate and the conductive layer, the metal thin film layer may include at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
또한, 상기 도전층의 상부와 소정 간격 이격되어 광반사막이 배치될 수 있다. In addition, the light reflection film may be disposed spaced apart from the upper portion of the conductive layer by a predetermined interval.
본 발명의 다른 측면에 따르면, 광투과성을 갖는 연성기판; 상기 연성기판의 일면에 형성되며 엘이디칩이 실장되는 도전층; 및 상기 연성기판의 타면에 형성되는 광반사층을 포함하는 엘이디 조명장치용 광기능성 연성회로기판이 제공될 수 있다. According to another aspect of the invention, the flexible substrate having a light transmission; A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And a light reflecting layer formed on the other surface of the flexible board.
이 때, 상기 광반사층은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성될 수 있다.In this case, the light reflection layer may be formed including at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
본 발명의 실시예들에 따른 광기능성 연성회로기판은 플렉시블한 성질을 갖는 연성회로기판을 사용함으로써 엘이디 조명장치의 디자인 자유도를 높일 뿐만 아니라, 상기 연성회로기판의 배면에 광확산층 또는 광반사층을 형성함으로써 엘이디칩을 조밀하게 실장할 필요 없이 상대적으로 간단한 구조로도 광효율을 높일 수 있다.The optical functional flexible printed circuit board according to the embodiments of the present invention increases the design freedom of the LED lighting apparatus by using the flexible printed circuit board having a flexible property, and forms a light diffusion layer or a light reflective layer on the rear surface of the flexible printed circuit board. Therefore, it is possible to increase the light efficiency even with a relatively simple structure without having to densely mount the LED chip.
도 1은 종래 엘이디 조명장치를 개략적으로 도시한 도면이다. 1 is a view schematically showing a conventional LED lighting apparatus.
도 2는 본 발명의 일 실시예에 따른 엘이디 조명장치용 광기능성 연성회로기판을 개략적으로 도시한 도면이다. 2 is a view schematically showing a light functional flexible circuit board for an LED lighting device according to an embodiment of the present invention.
도 3은 도 2의 광기능성 연성회로기판이 적용된 엘이디 조명장치를 개략적으로 도시한 도면이다. FIG. 3 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board of FIG. 2 is applied.
도 4는 본 발명의 다른 실시예에 따른 엘이디 조명장치용 광기능성 연성회로기판을 개략적으로 도시한 도면이다. 4 is a view schematically showing a light functional flexible circuit board for an LED lighting device according to another embodiment of the present invention.
도 5는 도 4의 광기능성 연성회로기판이 적용된 엘이디 조명장치를 개략적으로 도시한 도면이다.FIG. 5 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board of FIG. 4 is applied.
(부호의 설명)(Explanation of the sign)
10: 기판 20: 도전층10: substrate 20: conductive layer
30: 엘이디칩 40: 확산판30: LED chip 40: diffuser plate
50: 광반사막 100,200: 광기능성 연성회로기판50: light reflection film 100,200: optical functional flexible circuit board
110,210: 연성기판 120: 금속박막층110, 210: flexible substrate 120: metal thin film layer
130,220: 도전층 140: 광확산층130,220: conductive layer 140: light diffusion layer
230: 광반사층230: light reflection layer
이하에서는 첨부된 도면을 참조하여 본 발명을 구체적으로 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.
도 2는 본 발명의 일 실시예에 따른 엘이디 조명장치용 광기능성 연성회로기판(100, 이하 광기능성 연성회로기판)을 개략적으로 도시한 도면이다. FIG. 2 is a view schematically showing an optical functional flexible circuit board 100 (hereinafter, referred to as an optical functional flexible circuit board) for an LED lighting apparatus according to an embodiment of the present invention.
도 2를 참조하면, 광기능성 연성회로기판(100)은 연성기판(110)과, 연성기판(110)의 일면에 형성되는 도전층(130)과, 연성기판(110)의 타면에 형성되는 광확산층(140)을 포함한다. Referring to FIG. 2, the optical functional flexible printed circuit board 100 may include a flexible substrate 110, a conductive layer 130 formed on one surface of the flexible substrate 110, and light formed on the other surface of the flexible substrate 110. The diffusion layer 140 is included.
연성기판(110)은 플렉서블(가요성)한 성질을 갖는 플렉서블 기판이며, 종래 리지드 타입의 인쇄회로기판보다 디자인 자유도가 높아 다양한 디자인의 조명을 형성하는 것을 가능케 한다. The flexible substrate 110 is a flexible substrate having a flexible (flexible) property, and has a higher degree of design freedom than a conventional rigid type printed circuit board, thereby making it possible to form lighting of various designs.
연성기판(110)은 광투과성을 가지며, 예컨대 다른 수지에 비해 고온에서도 손상되지 않는 광투과성 폴리카보네이트, 폴리프로필렌, 아크릴, 폴리에테르에테르케톤(Polyetheretherketone, PEEK) 또는 폴리에틸렌테레프탈레이트 등을 사용할 수 있다. The flexible substrate 110 may be light-transmitting, for example, a light-transmissive polycarbonate, polypropylene, acrylic, polyether ether ketone (PEEK) or polyethylene terephthalate, which is not damaged even at high temperatures, may be used.
연성기판(110)이 상기 나열된 소재로 형성되는 경우에는 내열성이 좋아서 엘이디칩의 장착 후 리플로우 공정 등에서 연성기판(110)이 휘어지는 등의 컬링(culing)이 방지될 수 있다. When the flexible substrate 110 is formed of the above-listed materials, the heat resistance may be good, and thus curling of the flexible substrate 110 may be prevented in the reflow process after mounting the LED chip.
연성기판(110)은 필름 형태일 수 있으며, 이는 제조 단가 측면에서 장점을 갖는다. 광투과성 및 내열성을 갖는 연성기판의 경우 상대적으로 고가이므로 이들을 필름 형태로 사용하게 되면 제조 단가가 낮아질 수 있기 때문이다. The flexible substrate 110 may be in the form of a film, which has advantages in terms of manufacturing cost. Since flexible substrates having light transmittance and heat resistance are relatively expensive, the use of them in the form of a film may lower the manufacturing cost.
도전층(130)은 연성기판(110)의 일면에 형성되며 엘이디칩(30)이 실장된다. 즉 도전층(130)은 엘이디칩(30)의 구동을 위해 전원을 인가하는 회로층에 해당한다. The conductive layer 130 is formed on one surface of the flexible substrate 110 and the LED chip 30 is mounted. That is, the conductive layer 130 corresponds to a circuit layer for applying power for driving the LED chip 30.
도전층(130)은 구리와 같은 연성의 금속 소재나 전도성 폴리머로 이루어질 수 있다. 따라서 연성기판(110)이 구부러지거나 휘어지더라도 도전층(130)이 연성기판(110)과 함께 구부러지거나 휘어질 수 있다. 상기 전도성 폴리머의 예로는 폴리아세틸렌, 폴리아닐린, 폴리티오펜, 폴리설퍼나이트라이드, 폴리피롤 등이 있으며, 이에 한정되는 것은 아니다. The conductive layer 130 may be made of a flexible metal material such as copper or a conductive polymer. Therefore, even if the flexible substrate 110 is bent or curved, the conductive layer 130 may be bent or curved together with the flexible substrate 110. Examples of the conductive polymer include polyacetylene, polyaniline, polythiophene, polysulfuride, polypyrrole, and the like, but are not limited thereto.
도전층(130)이 구리로 형성되는 경우에는 구리 시드(seed)를 스퍼터링(sputtering) 법으로 연성기판(110)의 일면에 형성한 후에 전해 동도금 법을 이용하여 도전층(130)을 형성할 수 있으며, 도전층(130)이 전도성 폴리머로 형성되는 경우에는 공지된 방법인 포토리소그래피 방법을 이용하는 것도 가능하다. When the conductive layer 130 is formed of copper, a copper seed may be formed on one surface of the flexible substrate 110 by sputtering, and then the conductive layer 130 may be formed using an electrolytic copper plating method. In addition, when the conductive layer 130 is formed of a conductive polymer, it is also possible to use a photolithography method which is a known method.
도전층(130)의 두께는 방열을 고려할 때에는 높을수록 유리한 측면이 있으나, 이 경우 제조 단가가 높아지는 문제가 있으므로 3 내지 12㎛ 범위의 두께를 가지도록 형성하는 것이 바람직하다. Although the thickness of the conductive layer 130 is advantageous when considering the heat dissipation, there is an advantageous side, but in this case it is preferable to form so as to have a thickness in the range of 3 to 12㎛ because there is a problem that the manufacturing cost increases.
광확산층(140)은 연성기판(110)의 타면에 형성된다. 즉 연성기판(110)의 일면에는 도전층(130)이 형성되고 타면에는 광확산층(140)이 형성된다. 광확산층(140)은 엘이디칩(30)에서 점조사된 광이 엘이디칩(30) 상부에 배치되는 광반사막(50, 도 3 참조)에 의해 반사되어 돌아오면 상기 광을 균일하게 확산시켜 면발광을 구현하는 기능을 한다. The light diffusion layer 140 is formed on the other surface of the flexible substrate 110. That is, the conductive layer 130 is formed on one surface of the flexible substrate 110 and the light diffusion layer 140 is formed on the other surface. The light diffusion layer 140 diffuses the light uniformly when the light irradiated from the LED chip 30 is reflected by the light reflection film 50 (see FIG. 3) disposed on the LED chip 30. Function to implement
광확산층(140)은 본 기술 분야에서 통상적으로 사용되는 소재를 이용하여 형성될 수 있으며, 예컨대 고분자 수지 내에 세라믹 파우더를 포함하는 형태일 수 있다. The light diffusion layer 140 may be formed using a material commonly used in the art, and may be, for example, in a form including ceramic powder in a polymer resin.
광확산층(140)의 형성은 연성기판(110)의 타면에 실크 스크린, 그라비아 인쇄, 콤마 코팅 등의 공지된 공정을 이용하여 이루어질 수 있으며 이에 한정되는 것으 아니다. Formation of the light diffusion layer 140 may be made using a known process such as silk screen, gravure printing, comma coating on the other surface of the flexible substrate 110 is not limited thereto.
한편, 광기능성 연성회로기판(100)은 연성기판(110)과 도전층(130) 사이에 형성되는 금속박막층(120)을 더 포함할 수 있다. 도 2,3에서는 금속박막층(120)이 연성기판(110)의 상부면 전면에 형성된 경우를 도시하고 있으나, 금속박막층(120)은 도전층(130)과 같은 레이어상에서 도전층(130)을 제외한 공간에 형성될 수도 있다. The optical functional flexible circuit board 100 may further include a metal thin film layer 120 formed between the flexible substrate 110 and the conductive layer 130. In FIGS. 2 and 3, the metal thin film layer 120 is formed on the entire upper surface of the flexible substrate 110, but the metal thin film layer 120 is formed on the same layer as the conductive layer 130 except for the conductive layer 130. It may be formed in the space.
금속박막층(120)은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성될 수 있으며, 이러한 금속박막층(120)은 엘이디 조명의 광색이나 좌표값의 변화를 억제하는 기능을 할 수 있다. The metal thin film layer 120 may include at least one of aluminum, silver, chromium, nickel, titanium, copper, and alloys thereof, and the metal thin film layer 120 may suppress a change in light color or coordinate value of the LED lighting. Can function.
도 3은 도 2의 광기능성 연성회로기판(100)이 적용된 엘이디 조명장치를 개략적으로 도시한 도면이다. FIG. 3 is a view schematically showing an LED lighting apparatus to which the photofunctional flexible printed circuit board 100 of FIG. 2 is applied.
도 3을 참조하면, 본 발명의 일 실시예에 따른 광기능성 연성회로기판(100)은 엘이디칩(30)이 실장된 도전층(130)이 상방향을 바라보도록 배치되고, 도전층(130)의 상부와 소정 간격 이격되어 배치되는 광반사막(50)과 함께 사용될 수 있다. 즉 광반사막(50)은 엘이디칩(30)에서 조사되는 빛의 대향측면에 배치된다. Referring to FIG. 3, the optical functional flexible printed circuit board 100 according to the exemplary embodiment of the present invention is disposed such that the conductive layer 130 on which the LED chip 30 is mounted faces upward, and the conductive layer 130 is disposed. It may be used together with the light reflection film 50 is spaced apart from the upper portion by a predetermined interval. That is, the light reflection film 50 is disposed on the opposite side of the light irradiated from the LED chip 30.
광반사막(50)의 소재는 특정되지 않으며 예컨대 벽면이나 천정에 해당할 수도 있다. 그러나 광효율을 높이기 위해서 광반사막(50)은 별도의 반사시트나 리플렉터를 사용하는 것이 바람직하다. The material of the light reflection film 50 is not specified and may correspond to, for example, a wall or a ceiling. However, in order to increase the light efficiency, it is preferable that the light reflection film 50 uses a separate reflection sheet or reflector.
광반사막(50)은 통상적으로 빛을 잘 반사할 수 있도록 금속소재로 이루어질 수 있으며, 오목 형상 또는 플레이트 형상을 가질 수 있다. 또한 광반사막(50)의 내부에는 형광체(미도시)가 도포될 수도 있는데, 상기 형광체는 엘이디칩(30)으로부터 방출되는 빛을 받아 소정의 다른 파장을 갖는 빛을 발광하는 기능을 함으로써 목적한 색상의 조명광을 구현하는데에 이용될 수 있다. 이러한 형광체의 예로는 실리케이트, TAG(Terbium Aluminium Garnet) 등이 있다 .The light reflection film 50 may be generally made of a metal material to reflect light well, and may have a concave shape or a plate shape. In addition, a phosphor (not shown) may be applied to the inside of the light reflection film 50. The phosphor receives a light emitted from the LED chip 30 and emits light having a predetermined wavelength. It can be used to implement the illumination light of. Examples of such phosphors include silicates, TAG (Terbium Aluminum Garnet), and the like.
본 엘이디 조명장치의 동작을 간략하게 설명하면, 광기능성 연성회로기판(100)의 상부에 실장되는 엘이디칩(30)으로부터 점조사된 광이 광반사막(50)에 의해 반사되어 되돌아오면 광기능성 연성회로기판(100)의 하부면에 형성되는 광확산층(140)에 의해 광이 균일하게 확산되어 면발광된다. 따라서 종전과 같이 엘이디칩을 조밀하게 실장할 필요 없이 상대적으로 간단한 구조로도 광효율을 높일 수 있는 효과가 있다. The operation of the LED lighting apparatus will be briefly described. When the light irradiated from the LED chip 30 mounted on the optical functional flexible printed circuit board 100 is reflected by the light reflection film 50 and returns, the optical functional flexible The light is uniformly diffused by the light diffusion layer 140 formed on the lower surface of the circuit board 100 and the surface is emitted. Therefore, there is an effect that can increase the light efficiency with a relatively simple structure without having to densely mount the LED chip as before.
이하, 본 발명의 다른 실시예에 대하여 설명한다. Hereinafter, another embodiment of the present invention will be described.
도 4는 본 발명의 다른 실시예에 따른 엘이디 조명장치용 광기능성 연성회로기판(200, 이하 광기능성 연성회로기판)을 개략적으로 도시한 도면이다. FIG. 4 is a view schematically showing an optical functional flexible circuit board 200 (hereinafter, referred to as an optical functional flexible circuit board) for an LED lighting apparatus according to another embodiment of the present invention.
도 4를 참조하면, 광기능성 연성회로기판(200)은 연성기판(210)과, 연성기판(210)의 일면에 형성되며 엘이디칩(30)이 실장되는 도전층(220)과, 연성기판(210)의 타면에 형성되는 광반사층(230)을 포함한다. Referring to FIG. 4, the optical functional flexible circuit board 200 is formed on the flexible substrate 210, the conductive layer 220 on which one surface of the flexible substrate 210 is mounted, and the flexible substrate 210 is mounted on the flexible substrate 210. And a light reflection layer 230 formed on the other surface of the 210.
연성기판(210)은 전술한 실시예의 연성기판(110, 도 2 참조)와 동일 또는 유사하므로 중복 설명을 생략한다. Since the flexible substrate 210 is the same as or similar to the flexible substrate 110 (refer to FIG. 2) of the above-described embodiment, redundant description thereof will be omitted.
도전층(220) 역시 전술한 실시예의 도전층(130, 도 2 참조)와 동일 또는 유사하므로 중복 설명을 생략한다. Since the conductive layer 220 is also the same as or similar to the conductive layer 130 (refer to FIG. 2) of the above-described embodiment, redundant description thereof will be omitted.
광반사층(230)은 연성기판(210)의 타면에 형성된다. 즉 연성기판(210)의 일면에는 도전층(220)이 형성되고 타면에는 광반사층(230)이 형성된다. 전술한 실시예에서 연성회로기판에 부여된 광기능성이 광확산 기능이었다면, 본 실시예에서 연성회로기판에 부여되는 광기능성은 광반사 기능이다. The light reflection layer 230 is formed on the other surface of the flexible substrate 210. That is, the conductive layer 220 is formed on one surface of the flexible substrate 210 and the light reflection layer 230 is formed on the other surface. If the optical functionality imparted to the flexible circuit board in the above embodiment was a light diffusion function, the optical functionality imparted to the flexible circuit board in this embodiment is a light reflection function.
광반사층(230)은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성될 수 있다. 또한, 광반사층(230)은 단층 또는 2층 이상의 복수층으로 형성될 수 있으며 각 층을 이루는 소재는 동일하거나 다를 수 있다. The light reflection layer 230 may include at least one of aluminum, silver, chromium, nickel, titanium, copper, and alloys thereof. In addition, the light reflection layer 230 may be formed of a single layer or multiple layers of two or more layers, and the materials forming each layer may be the same or different.
광반사층(230)은 엘이디칩(30)의 뒷 방향으로 스캐터링(scattering) 되는 광을 다시 전방으로 반사시킴으로써, 반사 광효율을 증가시키는 기능을 한다. 이는 엘이디칩(30)의 탑재 수를 줄이는 데에 기여하며 제조 단가를 낮추는 효과가 있다. The light reflection layer 230 functions to increase the reflected light efficiency by reflecting the light scattered toward the rear of the LED chip 30 to the front again. This contributes to reducing the number of mounting of the LED chip 30 and has an effect of lowering the manufacturing cost.
도 5는 도 4의 광기능성 연성회로기판(200)이 적용된 엘이디 조명장치를 개략적으로 도시한 도면이다. FIG. 5 is a view schematically showing an LED lighting device to which the photofunctional flexible printed circuit board 200 of FIG. 4 is applied.
도 5를 참조하면, 본 발명의 다른 실시예에 따른 광기능성 연성회로기판(200)은 엘이디칩(30)이 실장된 도전층(220)이 하방향을 바라보도록 배치된다. 본 실시예에서의 엘이디 조명장치의 동작을 간략하게 설명하면, 광기능성 연성회로기판(200)의 상부에 실장되는 엘이디칩(30)으로부터 광이 조사되면, 엘이디칩(30)의 뒷 방향으로는 소정 정도의 광량이 스캐터링 된다. 이 때, 연성기판(210)의 배면에는 광반사층(230)이 형성되어 있으므로, 상기 스캐터링 되는 광이 광반사층(230)에 의해 반사되어 다시 전방으로 조사된다. 이에 따라 광반사층(230)이 없는 경우에 비해 반사 광효율이 증대할 수 있으며, 종전과 같이 엘이디칩을 조밀하게 실장할 필요 없이 상대적으로 간단한 구조로도 광효율을 높일 수 있는 효과가 있다. Referring to FIG. 5, in the optical functional flexible printed circuit board 200 according to another exemplary embodiment, the conductive layer 220 on which the LED chip 30 is mounted faces downward. The operation of the LED lighting apparatus according to the present embodiment will be briefly described. When light is irradiated from the LED chip 30 mounted on the optical functional flexible printed circuit board 200, the LED chip 30 is directed toward the rear side of the LED chip 30. A predetermined amount of light is scattered. In this case, since the light reflection layer 230 is formed on the rear surface of the flexible substrate 210, the scattered light is reflected by the light reflection layer 230 and irradiated forward. Accordingly, the reflected light efficiency can be increased as compared with the case in which there is no light reflection layer 230, and the light efficiency can be increased even with a relatively simple structure without the densely mounted LED chip as in the past.
상술한 바와 같이, 본 발명의 실시예들에 따른 광기능성 연성회로기판은 플렉시블한 성질을 갖는 연성회로기판을 사용함으로써 엘이디 조명장치의 디자인 자유도를 높일 뿐만 아니라, 상기 연성회로기판의 배면에 광확산층 또는 광반사층을 형성함으로써 엘이디칩을 조밀하게 실장할 필요 없이 상대적으로 간단한 구조로도 광효율을 높일 수 있다. 즉 엘이디칩의 어레이와는 무관하게 일정한 조명을 확보 가능하므로, 전체적인 제조 단가를 줄이는 효과가 있다. As described above, the optical functional flexible printed circuit board according to the embodiments of the present invention not only increases the design freedom of the LED lighting apparatus by using the flexible printed circuit board having the flexible property, but also the light diffusion layer on the rear surface of the flexible printed circuit board. Alternatively, by forming the light reflection layer, it is possible to increase the light efficiency even with a relatively simple structure without the densely mounted LED chip. That is, since it is possible to secure a constant light irrespective of the array of LED chips, the overall manufacturing cost is reduced.
이상, 본 발명의 실시예들에 대하여 설명하였다. 그러나 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 특허청구범위에 기재된 본 발명의 기술적 사상의 범위 내에서 기술의 구체적 적용에 따른 단순한 설계변경, 일부 구성요소의 생략, 단순한 용도의 변경 등의 형태로 본 발명을 다양하게 변형할 수 있을 것이며, 이 또한 본 발명의 권리범위 내에 포함됨은 자명하다. In the above, embodiments of the present invention have been described. However, those skilled in the art to which the present invention pertains, within the scope of the technical spirit of the present invention described in the claims, simple design changes, omission of some components, simple use changes, etc. It will be apparent that the present invention may be variously modified in the form of the present invention, which is also included within the scope of the present invention.

Claims (5)

  1. 광투과성을 갖는 연성기판;Flexible substrate having light transmittance;
    상기 연성기판의 일면에 형성되며 엘이디칩이 실장되는 도전층; 및A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And
    상기 연성기판의 타면에 형성되는 광확산층을 포함하는 엘이디 조명장치용 광기능성 연성회로기판.Optical functional flexible circuit board for an LED lighting device comprising a light diffusion layer formed on the other surface of the flexible substrate.
  2. 청구항 1에 있어서, The method according to claim 1,
    상기 연성기판과 도전층 사이에 형성되는 금속박막층을 더 포함하고, Further comprising a metal thin film layer formed between the flexible substrate and the conductive layer,
    상기 금속박막층은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성되는 엘이디 조명장치용 광기능성 연성회로기판.The metal thin film layer is an optical functional flexible circuit board for an LED lighting device is formed comprising at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
  3. 청구항 1 또는 청구항 2에 있어서, The method according to claim 1 or 2,
    상기 도전층의 상부와 소정 간격 이격되어 광반사막이 배치되는 엘이디 조명장치용 광기능성 연성회로기판.The optical functional flexible circuit board for the LED lighting device is disposed a light reflection film spaced apart from the upper portion of the conductive layer by a predetermined interval.
  4. 광투과성을 갖는 연성기판;Flexible substrate having light transmittance;
    상기 연성기판의 일면에 형성되며 엘이디칩이 실장되는 도전층; 및A conductive layer formed on one surface of the flexible substrate and mounted with an LED chip; And
    상기 연성기판의 타면에 형성되는 광반사층을 포함하는 엘이디 조명장치용 광기능성 연성회로기판.Optical functional flexible circuit board for an LED lighting device comprising a light reflection layer formed on the other surface of the flexible substrate.
  5. 청구항 4에 있어서, The method according to claim 4,
    상기 광반사층은 알루미늄, 은, 크롬, 니켈, 티타늄, 구리 및 이들의 합금 중 적어도 하나를 포함하여 형성되는 엘이디 조명장치용 광기능성 연성회로기판.The light reflection layer is an optical functional flexible circuit board for an LED lighting device is formed comprising at least one of aluminum, silver, chromium, nickel, titanium, copper and alloys thereof.
PCT/KR2015/002010 2014-05-16 2015-03-03 Photo-functional flexible circuit board for led lighting device WO2015174622A1 (en)

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