WO2013180519A1 - Dispositif d'éclairage - Google Patents
Dispositif d'éclairage Download PDFInfo
- Publication number
- WO2013180519A1 WO2013180519A1 PCT/KR2013/004822 KR2013004822W WO2013180519A1 WO 2013180519 A1 WO2013180519 A1 WO 2013180519A1 KR 2013004822 W KR2013004822 W KR 2013004822W WO 2013180519 A1 WO2013180519 A1 WO 2013180519A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light
- lighting device
- light emitting
- resin layer
- pattern
- Prior art date
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/26—Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/281—Materials thereof; Structures thereof; Properties thereof; Coatings thereof
- F21S43/28135—Structures encapsulating the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/004—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
- G02B6/0041—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided in the bulk of the light guide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- LED Light Emitted Diode
- LED is a device that converts an electric signal into infrared or light by using compound semiconductor characteristics, and unlike fluorescent lamps, it does not use harmful substances such as mercury, and causes less environmental pollution. It has the advantage of long life. In addition, it has a low power consumption compared to the conventional light source, and because of the high color temperature has excellent visibility and less glare.
- the current lighting apparatus has evolved from a conventional light source such as an incandescent lamp or a fluorescent lamp to a form using the above-described LED element as a light source, and a lighting apparatus that performs a surface light emitting function by using a light guide plate is provided.
- FIG. 1 and 2 schematically show a conventional lighting device 1 performing a surface light emitting function.
- a flat light guide plate 30 is disposed on a substrate 20, and a plurality of side type LEDs 10 are disposed on a side of the light guide plate 30. (Only one) is arranged in the form of an array.
- the light L incident from the LED 10 to the light guide plate 30 is reflected upward by a minute reflection pattern or a reflective sheet 40 provided on the bottom surface of the light guide plate 30, and exits from the light guide plate 30. 30) the light is emitted to the top to provide light to the outside through the outer housing 50 of the transparent material.
- a plurality of diffusion apparatuses 31, prism sheets 32 and 33, and protective sheet 34 may be provided between the lighting apparatus 1 and the light guide plate 30 and the outer housing 50. It can be formed into a structure to further add the optical sheet of.
- the above-described lighting device 1 serves to supply light evenly to the outside, and the light guide plate 30 is a component that performs the function of improving the brightness of the lighting device 1 and supplying uniform light in the light source LED. It is one of the plastic molded lenses to uniformly transmit the emitted light. Therefore, the light guide plate 30 is basically used as an essential component of the conventional lighting device 1, but due to the thickness of the light guide plate 30 itself, the thickness of the entire product is limited, and the light guide plate 30 is shown. As the material itself is not flexible, it is difficult to apply to the outer housing 50, which is formed with a bend, and thus has a problem in that product design and design deformation are not easy.
- the present invention has been proposed to solve the above-mentioned conventional problems, and in one embodiment of the present invention, by using the resin layer to guide the light emitted from the light emitting unit to the outside without using the light guide plate, the overall thickness is reduced. In addition, it is possible to provide a lighting device structure that can secure reliability while improving flexibility of product design through securing flexibility.
- Lighting device for solving the above problems is formed on a flexible printed circuit board and a light emitting unit consisting of one or more side-emitting LED and top emitting LED; It may include a light guide member formed on the light emitting unit to bury the light emitting unit.
- the light guide member may be formed of a resin layer filling all of the side-emitting LED and part or all of the top-emitting LED.
- the number of light emitting units can be reduced, and the overall thickness of the lighting device can be reduced.
- a reflective sheet and a reflection pattern which is a structure capable of efficiently reflecting the light emitted from the light emitting unit, thereby providing an effect and a uniform surface light source to maximize the improvement of the brightness and the luminance improvement It can work.
- the present invention by forming a first optical substrate or a second optical substrate having an optical pattern, and having an air gap in the adhesive layer, it is possible to eliminate the occurrence of hot spots and dark areas generated in the light shielding pattern portion.
- the reliability between the adhesive layer and the parts to be bonded is secured, and at the same time, it is possible to realize a lighting device without significant differences in optical characteristics, and precise alignment between parts is possible.
- 1 and 2 schematically show a conventional lighting device structure.
- FIG. 3 schematically shows a lighting device structure according to the present invention.
- Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
- FIG. 5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
- the lighting device according to the present invention is applicable to various lamp devices that require lighting, for example, vehicle lamps, home lighting devices, industrial lighting devices. For example, when applied to a vehicle lamp, it is also applicable to headlights, vehicle interior lighting, doorscar, rear lights and the like.
- the lighting apparatus of the present invention can be applied to the field of the backlight unit applied to the liquid crystal display device, and can be applied to all the lighting related fields that are currently developed and commercialized or can be implemented according to future technology development.
- Figure 3 schematically shows the structure of the lighting apparatus according to the present invention
- Figure 3 (a) is a lighting device 100a of the structure in which the top light emitting LED is completely embedded by the light guide member
- Figure 3 (b) shows a lighting device 100b having a structure in which the top emitting LED protrudes above the light guide member.
- the light guide member may be composed of a resin layer formed of a resin material, and the resin layer may be buried in a structure in close contact with the LED.
- the lighting apparatus 100a may apply various substrates on which optical devices such as LEDs are mounted, and in one embodiment of the present invention, a printed circuit board having flexibility. Can be used.
- the light emitting devices mounted on the flexible flexible printed circuit board (FPCB) 110 may have a structure in which at least two light emitting devices having different light output directions are provided.
- the light emitting device one or more side view type LEDs 131 and top view type LEDs 133 formed on the flexible printed circuit board 110 may be applied. have.
- the light emitting unit 130 is formed on the flexible printed circuit board 110 and includes one or more side view type LEDs (131) and a top view type LED (133). And a resin layer 150 formed on the flexible printed circuit board 110 to bury the light emitting unit 130 and guide the emitted light upward.
- a reflective sheet may be further formed on the flexible circuit board 110, and a first optical sheet 170 and a second optical sheet 190 may be further formed on the resin layer 150.
- a diffusion plate 290 may be further provided on the resin layer 150 to diffuse the incident light uniformly and radiate it to the outside.
- the light emitting unit 130 is arranged on the flexible printed circuit board 110 in one or more numbers to emit light
- the light emitting unit 130 of the present invention is one or more side-emitting LED (131) and It may be made of one or more top emitting LEDs 133.
- the side emitting type LED 131 is an LED having a structure in which the direction of the emitted light does not go straight to the top but is directed toward the side
- the top emitting LED 133 is an LED having the structure where the emitted light goes straight to the top. to be.
- the light emitting unit 130 by configuring the light emitting unit 130 to include not only the side light emitting type LED 131 but also the top light emitting type LED 133 as described above, the surface light emitting as well as the additional light emitting device without additional additional lighting device Advantages that can be realized, by the combination of surface light emission and point light emission has the advantage of realizing the emission light of various shapes.
- the resin layer 150 is formed on the flexible printed circuit board 110 to fill the light emitting unit 130 so that the resin layer 150 diffuses the light emitted from the light emitting unit 130 to the front. That is, the function of the conventional light guide plate is performed in the resin layer 150.
- the shape of the resin layer 130 is mainly formed in a plate shape and may be formed in a structure in close contact with the light emitting unit 130, but is not limited thereto and may be appropriately changed in design as necessary.
- Resin layer 150 of the present invention instead of the function of the light guide plate may be basically made of a resin of a material capable of diffusing light.
- the resin layer 150 of the present invention may be made of a self-curing resin containing an oligomer, and more specifically, the resin layer 150 may be formed using a resin containing a urethane acrylate oligomer as a main raw material.
- the resin which mixed the urethane acrylate oligomer which is a synthetic oligomer, and the polymer type which is polyacryl can be used.
- the resin layer 150 of the present invention can be formed of all resins.
- the resin layer 150 of the present invention may further include a form in which a plurality of beads 151 having hollows (or voids) formed therein are mixed and diffused, and the beads 151 reflect and diffuse light. It plays a role in improving characteristics. For example, when the light emitted from the light emitting unit 130 is incident on the bead 151 inside the resin layer 150, the light is reflected and transmitted by the hollow of the bead 151 to diffuse and condense and the resin layer 150. ) It is emitted to the top.
- the reflectivity and the diffusion rate of the light is increased by the bead 151, thereby improving the light quantity and uniformity of the light emitted to the outside later, and as a result, it is possible to achieve the effect of improving the brightness of the lighting device.
- the content of the beads 151 may be appropriately adjusted in order to obtain a desired light diffusing effect, and more specifically, the content of the beads 151 may be adjusted in a range of 0.01 to 0.3% based on the total weight of the resin layer 150. . That is, the light emitted from the light emitting unit 130 in the lateral direction is diffused and reflected through the resin layer 150 and the beads 151 so that the light can travel upward.
- the bead 151 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al 2 O 3 , and acryl.
- the particle diameter of the bead 151 may be formed in the range of 1 ⁇ m ⁇ 20 ⁇ m, but is not limited thereto.
- the resin layer 150 of the present invention is formed by the height of the side light emitting LED 131 and the top light emitting LED 133 as shown in (a) of Figure 3 and the side light emitting LED 131 and The entire top emitting type LED 133 may be buried.
- the thickness of the resin layer 150 for example, depending on the degree of coating of the resin, as shown in Figure 3 (b) above the height of the side-emitting LED 131 and the upper light-emitting type By forming below the height of the LED 135, all of the side-emitting LED 131 and a portion of the top-emitting LED 135 may be embedded.
- the degree of embedding of the top light emitting LEDs 133 and 135 may be adjusted by adjusting the thickness of the resin layer 150, and as a result, various types of point light emitting supplied to the outside may be realized.
- the resin layer 150 due to the presence of the resin layer 150 it is possible to innovatively reduce the thickness occupied by the conventional light guide plate, it is possible to realize the thinning of the entire product, to have a flexible material bar bending It has the advantage that it can be easily applied to the surface, improves the freedom of design, and can be applied to other flexible displays.
- a reflective sheet 120 may be further formed on the upper surface of the flexible printed circuit board 110, and the reflective sheet 120 may have a structure penetrated by the light emitting unit 130.
- Reflective sheet 120 of the present invention is formed of a material having a high reflection efficiency to serve to reduce the light loss by reflecting the light emitted from the light emitting unit 130 in the upper direction of the resin layer 150.
- Reflective sheet 120 of the present invention may be formed in the form of a film, it may be formed to include a synthetic resin containing a dispersion of white pigments in order to implement the characteristics of promoting the reflection characteristics and the dispersion of light. For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc.
- polyethylene terephthalate polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin may be used as the synthetic resin.
- Cellulose source acetate, weather resistant vinyl chloride, etc. may be used, but is not limited thereto.
- a reflective pattern 121 may be formed on a surface of the reflective sheet 120, and the reflective pattern 121 serves to improve uniformity of light emitted to the upper portion of the resin layer 150 by scattering and dispersing incident light. Do it.
- the reflection pattern 121 may be formed by printing on the surface of the reflective sheet 120 using a reflective ink including any one of TiO 2 , CaCo 3 , BaSo 4 , Al 2 O 3, Silicon, and PS, but is not limited thereto. It doesn't happen.
- the reflective pattern 121 has a structure having a plurality of protruding patterns, and may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the light scattering effect.
- the cross-sectional shape of the reflective pattern 121 may have a structure having various shapes such as a triangle, a square, a semicircle, and a sinusoidal wave.
- the density or pattern size of the reflective pattern 121 may be changed depending on the degree of separation from the light emitting unit 130.
- Illumination apparatus (100a, 100b) of the present invention is the first optical sheet 170 formed on the resin layer upper surface 150, the second optical sheet 190 and the first optical sheet formed on the first optical sheet 170 (
- the adhesive layer 180 may be further formed between the 170 and the second optical sheet 190, and the first air gap 181 may be further formed on the adhesive layer 180. That is, the adhesive layer 180 forms a space (first air gap 181) spaced around the optical pattern 183, and applies the adhesive material to the other portions to form the first optical sheet 170 and the second optical sheet. It may be implemented as a structure for bonding the 190 to each other.
- an optical pattern 183 may be further formed on an upper surface of the first optical sheet 170 or a lower surface of the second optical sheet 190, and one or more optical sheets may be further formed on the second optical sheet 190. It is also possible.
- the structure including the first optical sheet 170, the second optical sheet 190, the adhesive layer 180, and the optical pattern 183 may be defined as the optical pattern layer A.
- the optical pattern 183 may be formed as a light shielding pattern formed to prevent concentration of light emitted from the light emitting unit 130, and for this purpose, an alignment between the optical pattern 183 and the position of the light emitting unit 130 is aligned.
- the first optical sheet 170 and the second optical sheet 190 are bonded to each other using the adhesive layer 180 to secure the fixing force after the alignment.
- the first optical sheet 170 and the second optical sheet 190 may be formed using a material having excellent light transmittance, and PET may be used as an example.
- the upper light emitting LED 135 when the upper light emitting LED 135 partially protrudes above the resin layer 150, that is, only a part of the upper light emitting LED 135 is formed by the resin layer 150.
- the protruding portion of the top emitting LED 135 may be inserted below the first optical sheet 170. In this case, there is an advantage that can improve the light density of the point light source supplied to the outside as needed.
- the optical pattern 183 disposed between the first optical sheet 170 and the second optical sheet 190 basically serves to prevent the light emitted from the light emitting unit 130 from being concentrated.
- the optical pattern 153 may be formed as a light shielding pattern so that a part of the light shielding effect may be implemented in order to prevent a phenomenon in which the light is excessively strong so that optical characteristics deteriorate or yellowish light is emitted.
- the pattern may be formed by performing a printing process on the top surface of the first optical sheet 170 or the bottom surface of the second optical sheet 190 using the light shielding ink.
- the optical pattern 183 may not be a function of completely blocking the light, but may be implemented to adjust the light shielding degree or the diffusivity of the light with one optical pattern to perform a function of blocking and diffusing the light. Furthermore, more specifically, the optical pattern 183 according to the present invention may be implemented as a superimposed printed structure of a complex pattern.
- the superimposed printing structure refers to a structure that forms one pattern and prints another pattern shape on the upper portion thereof.
- the optical pattern 183 at least one selected from TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and Silicon on the lower surface of the polymer film (eg, the second optical sheet) in the light emitting direction.
- the light emitting pattern may include a diffusion pattern formed using a light shielding ink including a material and a light shielding pattern formed using a light shielding ink including Al or a mixture of Al and TiO 2 . That is, after the diffusion pattern is formed by white printing on the surface of the polymer film, a light shielding pattern may be formed thereon, or a double structure may be formed in the reverse order.
- the patterned design of the pattern may be variously modified in consideration of light efficiency, intensity, and light blocking rate.
- the light-shielding pattern which is a metal pattern
- the middle layer in the sequentially stacked structure
- a triple structure may be formed on the upper and lower portions thereof to implement the diffusion pattern.
- the diffusion patterns is implemented using TiO 2 having excellent refractive index, and CaCO 3 having excellent light stability and color sense is used together with TiO 2. It is possible to realize different diffusion patterns, and to secure light efficiency and uniformity through the triple structure of the structure implementing the light shielding pattern using Al having excellent concealment.
- CaCO 3 functions to subtract the exposure of yellow light to finally realize white light, thereby realizing more stable light.
- particles such as BaSO 4 , Al 2 O 3 , and silicon beads Larger, similarly structured inorganic materials may be used.
- the optical pattern 183 is preferably formed by adjusting the pattern density so that the pattern density is lowered farther from the emission direction of the light emitting unit 130 in terms of light efficiency.
- the adhesive layer 180 may have a structure surrounding the periphery of the optical pattern 183 and forming the first air gap 181 at other portions, or forming the first air gap 181 at the periphery of the optical pattern 183. It can be formed, thereby aligning the two optical sheets (170, 190) by aligning. That is, the adhesive structure of the first optical sheet 170 and the second optical sheet 190 can be implemented with a function of fixing the printed optical pattern 183.
- the adhesive layer 180 may use a thermosetting PSA, a thermosetting adhesive, or a UV curing PSA type material, but is not limited thereto.
- the diffusion plate 290 may be formed on the resin layer 150. When the first optical sheet 170 and the second optical sheet 190 are further formed, the diffusion plate 290 may be formed on the upper side of the second optical sheet 190. Can be formed.
- the diffusion plate 290 serves to uniformly spread the light emitted through the resin layer 150 over the entire surface, and may be generally formed of an acrylic resin, but is not limited thereto.
- polystyrene (PS) Polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET), high permeability plastics such as resin (resin) can be made of any material capable of performing the diffusion function .
- an air layer (second air gap 280) may be further formed between the diffusion plate 290 and the resin layer 150, and the first optical sheet 170 and the second optical sheet 190 are further formed.
- the second air gap 280 may be formed between the second optical sheet 190 and the diffusion plate 290.
- the height (H1) of the second air gap 280 may be formed in the range of more than 0 and 30mm or less, but is not limited thereto and as necessary Design changes can be made accordingly.
- Figure 4 shows an example of the light emitting unit arrangement of the lighting apparatus of the present invention shown in FIG.
- the light emitting unit included in the lighting apparatus of the present invention may include a side light emitting LED 131 and a top light emitting LED 133 as described above in FIG. 3.
- the side light emitting LEDs 131 are disposed in two or more rows on the flexible printed circuit board 110, and the top light emitting LEDs 133 are disposed between the rows of the side light emitting LEDs 131.
- It may be made of a structure that is arranged. However, this is only one example, and in addition, the arrangement of the top emitting type LED 133 and the arrangement of the side emitting type LED 131 may be appropriately changed as necessary.
- the present invention it is possible not only to implement the surface emission using the side emitting type LED and the resin layer without additional additional lighting device, but also has the advantage of implementing the point emitting through the top emitting type LED, surface emitting And by the combination of the point light emission has the advantage that can implement the emission light of various shapes as described above.
- FIG. 5 schematically illustrates a structure in which the lighting apparatus according to the present invention is applied to a vehicle headlight.
- the lighting apparatus 100a according to the present invention is formed using a flexible circuit board and a resin layer, and thus has a certain flexibility. Therefore, as shown in FIG. 5, the curved headlight housing 300 can be easily mounted, and thus, even in spite of the effect of improving the design freedom of the finished product combined with the housing and the design freedom, the uniformity is improved. It is possible to achieve the effect of ensuring the brightness and illuminance. Meanwhile, although FIG. 5 shows that the lighting apparatus shown in FIG. 3 (a) is mounted, this is only one example and the lighting apparatus shown in FIG. 3 (b) may be mounted.
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- Optics & Photonics (AREA)
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Abstract
L'invention concerne un dispositif d'éclairage, qui assure une émission superficielle et une émission ponctuelle à partir d'un unique dispositif, qui permet une réduction d'épaisseur globale, qui est plus efficace, et qui laisse plus de liberté au concepteur. Ce dispositif d'éclairage comprend une unité électroluminescente, qui est réalisée sur une carte à circuit imprimé souple, et qui se compose d'une ou de plusieurs diodes électroluminescentes à émission latérale, et d'une ou de plusieurs diodes électroluminescentes à émission verticale, une couche de résine étant appliquée sur la carte à circuit imprimée souple de façon à réaliser l'inclusion de l'unité électroluminescente.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020120058907A KR101934427B1 (ko) | 2012-05-31 | 2012-05-31 | 조명 장치 |
KR10-2012-0058907 | 2012-05-31 |
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WO2013180519A1 true WO2013180519A1 (fr) | 2013-12-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/KR2013/004822 WO2013180519A1 (fr) | 2012-05-31 | 2013-05-31 | Dispositif d'éclairage |
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KR (1) | KR101934427B1 (fr) |
WO (1) | WO2013180519A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016064205A1 (fr) * | 2014-10-22 | 2016-04-28 | 엘지이노텍 주식회사 | Appareil d'éclairage et lampe de véhicule le comprenant |
WO2017191996A3 (fr) * | 2016-05-03 | 2018-08-09 | 엘지이노텍 주식회사 | Appareil d'éclairage |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015133813A1 (fr) * | 2014-03-07 | 2015-09-11 | 주식회사 금호에이치티 | Lampe luminescente plate et procédé de fabrication pour cette dernière |
WO2015174622A1 (fr) * | 2014-05-16 | 2015-11-19 | 이영식 | Carte de circuit imprimé souple photo-fonctionnelle pour des appareils d'éclairage à del |
KR101868014B1 (ko) | 2017-01-06 | 2018-06-15 | 이범 | 돌출 간판용 엘이디 조명장치. |
KR20220019975A (ko) * | 2020-08-11 | 2022-02-18 | 엘지이노텍 주식회사 | 조명 장치 및 이를 포함하는 램프 |
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US20080180599A1 (en) * | 2007-01-26 | 2008-07-31 | Samsung Electronics Co., Ltd. | Backlight unit, method for manufacturing the same, and display having the same |
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JP2011034801A (ja) * | 2009-07-31 | 2011-02-17 | Dainippon Printing Co Ltd | 導光板、導光板の製造方法、面光源装置および液晶表示装置 |
US20110163066A1 (en) * | 2010-01-06 | 2011-07-07 | Samsung Electronics Co., Ltd. | Methods of manufacturing surface light source devices |
KR20120003272A (ko) * | 2010-07-02 | 2012-01-10 | 엘지이노텍 주식회사 | 백라이트유닛 및 이를 이용한 액정표시장치 |
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- 2013-05-31 WO PCT/KR2013/004822 patent/WO2013180519A1/fr active Application Filing
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US20080180599A1 (en) * | 2007-01-26 | 2008-07-31 | Samsung Electronics Co., Ltd. | Backlight unit, method for manufacturing the same, and display having the same |
KR20100050276A (ko) * | 2008-11-05 | 2010-05-13 | 삼성전자주식회사 | 백라이트 어셈블리 및 이를 갖는 액정표시장치 |
JP2011034801A (ja) * | 2009-07-31 | 2011-02-17 | Dainippon Printing Co Ltd | 導光板、導光板の製造方法、面光源装置および液晶表示装置 |
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KR20120003272A (ko) * | 2010-07-02 | 2012-01-10 | 엘지이노텍 주식회사 | 백라이트유닛 및 이를 이용한 액정표시장치 |
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WO2016064205A1 (fr) * | 2014-10-22 | 2016-04-28 | 엘지이노텍 주식회사 | Appareil d'éclairage et lampe de véhicule le comprenant |
US10527250B2 (en) | 2014-10-22 | 2020-01-07 | Lg Innotek Co., Ltd. | Lighting apparatus having an optical module with a half-mirror member |
US10907790B2 (en) | 2014-10-22 | 2021-02-02 | Lg Innotek Co., Ltd. | Lighting apparatus having an optical module with a half-mirror member |
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WO2017191996A3 (fr) * | 2016-05-03 | 2018-08-09 | 엘지이노텍 주식회사 | Appareil d'éclairage |
Also Published As
Publication number | Publication date |
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KR20130134971A (ko) | 2013-12-10 |
KR101934427B1 (ko) | 2019-01-03 |
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