WO2019198220A1 - Maintenance management device, mounting device, and maintenance management method - Google Patents

Maintenance management device, mounting device, and maintenance management method Download PDF

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Publication number
WO2019198220A1
WO2019198220A1 PCT/JP2018/015461 JP2018015461W WO2019198220A1 WO 2019198220 A1 WO2019198220 A1 WO 2019198220A1 JP 2018015461 W JP2018015461 W JP 2018015461W WO 2019198220 A1 WO2019198220 A1 WO 2019198220A1
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WO
WIPO (PCT)
Prior art keywords
imaging
unit
maintenance
mounting
maintenance management
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Application number
PCT/JP2018/015461
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French (fr)
Japanese (ja)
Inventor
中井 健二
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2018/015461 priority Critical patent/WO2019198220A1/en
Priority to JP2020513031A priority patent/JP7382920B2/en
Publication of WO2019198220A1 publication Critical patent/WO2019198220A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Definitions

  • This specification discloses a maintenance management device, a mounting device, and a maintenance management method.
  • a mounting device for example, a part held by a suction nozzle is imaged by an LED, a mirror, and a camera, and the dirt of the mirror is recognized through image processing from the imaging data, and cleaning is performed according to the contrast and the amount of dust. What determines necessity is proposed (for example, refer patent document 1). In this mounting apparatus, when it is determined that cleaning is necessary, air is supplied from the air blow nozzle to automatically clean the mirror surface.
  • This indication is made in view of such a subject, and it aims at providing the maintenance management device, mounting device, and maintenance management method which can perform maintenance work relevant to an image pick-up part more appropriately. To do.
  • the maintenance management device, mounting device, and maintenance management method disclosed in this specification have taken the following measures in order to achieve the main purpose described above.
  • the maintenance management device of the present disclosure is: A maintenance management device that manages maintenance work of at least one of a reference pattern provided in a mounting device for mounting a component on a substrate and an imaging unit that images the reference pattern, Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus A determination unit that determines whether maintenance work is necessary for the related member, , With.
  • the necessity of maintenance work is determined.
  • a stable evaluation value can be obtained in a calibration process that is periodically and repeatedly performed under the same conditions, so that maintenance work for members related to the imaging unit can be performed more appropriately.
  • the reference pattern includes a reference portion, shape, structure, and the like, and may be a reference mark such as a figure or a character.
  • the evaluation value may be a correction value used in the mounting process.
  • FIG. 1 is a schematic explanatory diagram illustrating an example of a mounting system 10.
  • FIG. Explanatory drawing of the cleaning process of the components imaging part 15 by the cleaning jig 38 of the cleaning part 36.
  • FIG. The flowchart showing an example of a mounting process routine.
  • Explanatory drawing which shows the change of an evaluation value (correction value).
  • Explanatory drawing which shows an example which detects the outlier of an evaluation value (correction value).
  • FIG. Explanatory drawing showing an example of the captured image display screen 60 at the time of contamination of the reference
  • FIG. Explanatory drawing showing an example of the captured image display screen 60 at the time of contamination of the mark imaging part 25.
  • FIG. Explanatory drawing of the captured image display screen 60 at the
  • FIG. 1 is a schematic explanatory diagram of a mounting system 10 which is an example of the present disclosure.
  • FIG. 2 is an explanatory diagram of the cleaning process of the reference mark M by the cleaning member 37 of the cleaning unit 36.
  • FIG. 3 is an explanatory diagram of the cleaning process of the component imaging unit 15 by the cleaning jig 38 of the cleaning unit 36.
  • the mounting system 10 is a system for mounting the component P on the substrate S, for example.
  • the mounting system 10 includes a mounting device 11 and a management computer (PC) 40.
  • the mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 that perform mounting processing for mounting a component P on a substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
  • the mounting apparatus 11 includes a substrate processing unit 12, a component supply unit 14, a component imaging unit 15, an operation panel 16, a mounting unit 20, and a control unit 31.
  • the substrate processing unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position.
  • the substrate processing unit 12 has a pair of conveyor belts provided at intervals in the front and rear direction of FIG. 1 and spanned in the left-right direction. The board
  • substrate S is conveyed by this conveyor belt.
  • the component supply unit 14 is a unit that supplies the component P to the mounting unit 20.
  • the component supply unit 14 includes a plurality of feeders on which reels around which tapes holding components are wound are mounted.
  • the component supply unit 14 may include a tray unit having a tray as a holding member on which a plurality of components are arranged and placed.
  • the component imaging unit 15 is an apparatus that captures an image of one or more components P collected and held by the mounting head 22.
  • the component imaging unit 15 is disposed between the component supply unit 14 and the substrate processing unit 12.
  • the imaging range of the component imaging unit 15 is above the component imaging unit 15.
  • the component imaging unit 15 captures an image of the component P and outputs the captured image to the control unit 31.
  • the component imaging unit 15 images the reference mark M disposed on the mounting head 22 together with the component P.
  • the control unit 31 can execute an inspection as to whether or not the shape and part of the component P are normal, detection of a positional deviation amount when the component P is collected, and the like based on the captured image.
  • the operation panel 16 is a unit that exchanges information with the worker, and includes a display unit 17 that displays a screen and an operation unit 18 that is operated by the worker.
  • the mounting unit 20 is a unit that collects the component P from the component supply unit 14 and places the component P on the substrate S fixed to the substrate processing unit 12.
  • the mounting unit 20 includes a head moving unit 21, a mounting head 22, and a nozzle 23.
  • the head moving unit 21 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider.
  • the mounting head 22 collects one or more components P and moves them in the XY directions by the head moving unit 21.
  • the mounting head 22 is detachably mounted on the slider.
  • One or more nozzles 23 are detachably mounted on the lower surface of the mounting head 22.
  • the nozzle 23 collects parts using negative pressure.
  • the collecting member for collecting the component P may be a mechanical chuck that mechanically holds the component P in addition to the nozzle 23.
  • a reference mark M serving as a reference position of the nozzle 23 is disposed on the lower surface side of the mounting head 22 (see FIG. 2).
  • a mark imaging unit 25 is disposed on the lower surface side of the slider on which the mounting head 22 is mounted. The mark imaging unit 25 moves in the XY directions as the mounting head 22 moves, and images a mark or the like formed on the substrate S.
  • the control unit 31 is configured as a microprocessor centered on the CPU 32, and includes a storage unit 33 for storing various data.
  • the control unit 31 outputs control signals to the substrate processing unit 12, the component supply unit 14, the component imaging unit 15, the operation panel 16, and the mounting unit 20, and the mounting unit 20, the component supply unit 14, the component imaging unit 15, and the operation A signal from the panel 16 is input.
  • the storage unit 33 stores mounting condition information 34, calibration related information 35, and the like.
  • the mounting condition information 34 is information including information on the component P, an arrangement order in which the component P is mounted on the substrate S, an arrangement position, and the like.
  • the calibration related information 35 is information including a calibration result of each unit of the mounting apparatus 11 and a reference range used for determination.
  • the calibration result includes, for example, a correction value for correcting a deviation in the XY direction due to thermal expansion or the like or an assembly error.
  • the reference range may be determined empirically, for example, in a range in which a sudden event occurs in the mounting apparatus 11 and the correction value (evaluation value) in the calibration process is greatly changed.
  • the sudden event includes, for example, an object collision such that the reference mark M is displaced, contamination of the reference mark M and / or the component imaging unit 15, and the like.
  • the cleaning unit 36 is a unit that performs a cleaning process as a maintenance operation on the imaging-related members including the reference mark M, the component imaging unit 15, the glass surface of the mark imaging unit 25, and the like.
  • the cleaning unit 36 includes a cleaning member 37 and a cleaning jig 38.
  • the cleaning member 37 is a brush that cleans the glass surface of the reference mark M and the mark imaging unit 25, and is disposed at the base of the mounting apparatus 11 so as to be movable up and down. As shown in FIG. 2, the cleaning member 37 is lifted after moving a cleaning target (a reference mark M or the like) upward to clean it.
  • the cleaning jig 38 is a brush that cleans the component imaging unit 15 and the like, and is attached to the mounting head 22 instead of the nozzle 23. As shown in FIG. 3, the cleaning jig 38 moves the mounting head 22 to a position where a cleaning target (component imaging unit 15 or the like) is disposed below and then lowers the cleaning jig 38 to clean it.
  • the management PC 40 is a computer that manages information of each device of the mounting system 10. As illustrated in FIG. 1, the management PC 40 includes a control unit 41, a storage unit 43, a display unit 47, and an input device 48.
  • the control unit 41 is configured as a microprocessor centered on the CPU 42.
  • the storage unit 43 is a device that stores various data such as a processing program such as an HDD.
  • the storage unit 43 stores mounting condition information 44 similar to the mounting condition information 34, calibration related information 45 similar to the calibration related information 35, and the like.
  • the display unit 47 is a liquid crystal screen that displays various types of information.
  • the input device 48 includes a keyboard, a mouse, and the like through which an operator inputs various commands.
  • FIG. 4 is a flowchart illustrating an example of a mounting process routine executed by the CPU 32 of the control unit 31.
  • This routine is stored in the storage unit 33 and executed according to an instruction from the operator.
  • the CPU 32 reads out and acquires the mounting condition information 34 (S100), and determines whether it is time to execute the calibration process (S110).
  • the execution timing of the calibration process is set immediately after the mounting process of the mounting apparatus 11 is started, after a predetermined time (for example, 1 hour or 2 hours) has elapsed, or after a predetermined number of substrates (for example, 100 sheets) has been produced.
  • the CPU 32 executes the mounting process (S250).
  • the CPU 32 conveys and fixes the substrate S, collects the component P by the nozzle 23 based on the arrangement order of the mounting condition information 34, arranges the component P on the substrate S, and when the component P is arranged, Execute the discharging process.
  • the CPU 32 determines whether or not the production is completed (S260). When the production is not completed, the CPU 32 executes the processes after S110. On the other hand, when the production is completed in S260, the CPU 32 ends this routine.
  • the CPU 32 executes the calibration process (S120) and calculates the evaluation value (correction value) (S130).
  • the CPU 32 executes a process for obtaining a correction value for correcting a change according to the usage time and a process for obtaining a correction value for the assembly error.
  • the correction value corresponding to the usage time include calibration of moving coordinates, center position calibration of the mounting head 22, and resolution calibration of the component imaging unit 15.
  • the correction value for the assembly error include the position of the storage unit for storing the nozzles 23 and the correction value for the position of the nozzles 23 attached to the mounting head 22.
  • the CPU 32 moves the mounting head 22 so that the center coordinates of the component imaging unit 15 and the center coordinates of the reference mark M coincide with each other based on the correction value obtained by the previous calibration process.
  • the reference mark M is imaged by the component imaging unit 15.
  • the CPU 32 measures the shift amount of the center coordinate of the reference mark M with respect to the center coordinate of the component imaging unit 15 based on the captured image, and based on the shift amount, the mounting head 22 is positioned at an appropriate position.
  • a correction value for adjusting the amount of movement is obtained.
  • the deviation amount itself may be an evaluation value.
  • the CPU 32 images the reference mark M and the nozzle 23 with the component imaging unit 15 in a state where the nozzle 23 is mounted on the mounting head 22, and determines the tip of the nozzle 23 from the proper position. The degree of deviation is obtained and a correction value for correcting this is obtained.
  • the CPU 32 periodically executes such a calibration process under the same conditions to improve the operation accuracy of the mounting apparatus 11.
  • FIG. 5 is an explanatory diagram showing changes in evaluation values (correction values).
  • FIG. 6 is an explanatory diagram illustrating an example of detecting an outlier of an evaluation value (correction value).
  • the correction value to be obtained shows a substantially constant value although it may change depending on the use time.
  • the correction value may suddenly change greatly, for example, when the unit is deformed due to insufficient handling of the unit by an operator, when the unit deteriorates, or when some dirt is attached to the unit. In S140, a sudden accident with respect to such a unit is detected.
  • a predetermined period for example, 1 day or 10 days
  • / or a predetermined number for example, 100 cases, 5000 cases,
  • FIG. 7 is an explanatory diagram illustrating an example of a captured image display screen 60 when the reference mark M has a phase shift.
  • FIG. 8 is an explanatory diagram illustrating an example of a captured image display screen 60 when dirt is attached to the reference mark M.
  • FIG. 9 is an explanatory diagram illustrating an example of a captured image display screen 60 when dirt is attached to the component imaging unit 15.
  • the captured image display screen 60 is displayed on the display unit 17 of the operation panel 16. Note that the captured image display screen 60 may be displayed on the display unit 47 of the management PC 40.
  • a cursor 61 On this captured image display screen 60, a cursor 61, a captured image display field 62, a reference image display field 63, a recalibration command key 64, an imaging unit cleaning command key 65, a mark cleaning command key 66, a restart key 67, and maintenance information display are displayed.
  • a column 68 is provided.
  • the cursor 61 operates based on the operation of the operation unit 18 and is operated when selecting a display field, a key, or the like.
  • the captured image display column 62 is a column for displaying a captured image indicating an outlier.
  • the reference image display field 63 is a field for displaying a normal captured image as a reference image.
  • the operator can grasp the abnormal state occurring in the imaging-related member by comparing the images in the captured image display field 62 and the reference image display field 63.
  • the recalibration command key 64 is a key that is pressed when the calibration process is executed again. When this key is pressed, the CPU 32 executes the process of S120.
  • the imaging unit cleaning command key 65 is a key pressed by the operator when the cleaning unit 36 cleans the component imaging unit 15.
  • the mark cleaning command key 66 is a key pressed by the operator when the cleaning unit 36 cleans the reference mark M.
  • the resume key 67 is a key that is pressed when the mounting process is resumed.
  • the maintenance information display column 68 is a column for displaying maintenance information indicating that maintenance work is performed on the imaging-related member. Note that the CPU 32 may temporarily stop the mounting process routine or continue it as it is when the captured image display screen 60 is displayed and output.
  • the CPU 32 executes a process for estimating a factor that requires maintenance work based on the imaging result and a process for eliminating the process (S160 to S220).
  • the CPU 32 calculates the degree of coincidence between the captured image and the reference image (S160), and determines whether the degree of coincidence is equal to or greater than a predetermined threshold, thereby obtaining a maintenance factor estimation result (S170). For example, when the degree of coincidence between a captured image showing an outlier and a reference image is high, the shape of the reference mark M is normally captured, and therefore the physical displacement of the imaging-related member is estimated as a maintenance factor. (See FIG. 7).
  • the degree of coincidence is low, since the shape of the reference mark M is not normally imaged, it can be estimated as a maintenance factor that dirt is attached to the imaging-related member.
  • the predetermined threshold may be determined empirically as a value that can determine the displacement of the imaging-related member and the adhesion of dirt.
  • the CPU 32 notifies the operator of an error from the operation panel 16 (S180), and ends this routine. Upon confirming this error, the operator confirms the assembly position of the imaging-related member (reference mark M and / or component imaging unit 15).
  • the CPU 32 calculates a luminance difference when the phase of the captured image showing the outlier and the reference image is matched (S190), Is obtained (S200).
  • the CPU 32 analyzes the luminance of the captured image and estimates whether the reference mark M is contaminated or the component imaging unit 15 is contaminated based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated. . For example, when the reference mark M is contaminated, as shown in the captured image display field 62B of FIG. 8, the absolute value of the luminance difference tends to be relatively large but the area causing the luminance difference does not tend to be large.
  • the CPU 32 can estimate a contamination target (maintenance factor) requiring maintenance work.
  • the cleaning unit 36 is caused to perform maintenance work (cleaning process) of the reference mark M (see S210, FIG. 2). By this maintenance work, the reference mark M is cleaned and recognized in a normal shape.
  • the cleaning unit 36 see S220 and FIG. 3. By this maintenance work, the glass surface of the component imaging unit 15 is cleaned, and a normal captured image is obtained.
  • the CPU 32 executes processing subsequent to S120.
  • the CPU 32 executes the calibration process again in S120, and determines whether or not the evaluation value is an outlier in S140.
  • the evaluation value satisfies the reference range. If the evaluation value is an outlier that exceeds the reference range even after maintenance work is performed multiple times, the CPU 32 may notify an error and terminate this routine.
  • the CPU 32 when the evaluation value is within the reference range in S140, the CPU 32 performs reference range update setting processing (S230), and outputs the calibration result to the management PC 40 and the operation panel 16 (S240).
  • the CPU 32 In the reference range update setting process, for example, the CPU 32 accumulates newly obtained correction values, and performs a process of setting the reference range by including it in the predetermined period and the predetermined number of data. Then, after S240, the CPU 32 executes the processing after S250 and ends this routine.
  • the reference mark M of this embodiment corresponds to a reference pattern of the present disclosure
  • the component imaging unit 15 corresponds to an imaging unit
  • the CPU 32 corresponds to a determination unit, a notification processing unit, and a maintenance factor estimation unit
  • the control unit 31 performs maintenance. It corresponds to a management device.
  • the mounting device 11 corresponds to a mounting device
  • the substrate processing unit 12 corresponds to a substrate processing unit
  • the mounting unit 20 corresponds to a mounting unit
  • the cleaning unit 36 corresponds to a cleaning unit.
  • an example of the maintenance management method of the present disclosure is also clarified by describing the operation of the control unit 31.
  • the mounting apparatus 11 of the present embodiment described above has a function of a maintenance management apparatus that manages maintenance work of imaging related members including at least one of the provided reference mark M and the component imaging unit 15 that images the reference mark M. .
  • the mounting apparatus 11 requires maintenance work on the imaging-related members based on the evaluation values obtained from the imaging results captured by the component imaging unit 15 during the calibration process periodically performed to maintain mounting accuracy. Determine no.
  • the mounting apparatus 11 since a stable evaluation value can be obtained in the calibration process that is periodically performed under the same conditions, the maintenance work for the imaging-related member can be performed more appropriately.
  • the mounting apparatus 11 can more appropriately execute the maintenance work for the imaging-related member by notifying the operation panel 16 that the maintenance work is required.
  • the mounting apparatus 11 since the mounting apparatus 11 notifies the cleaning and maintenance work of the reference mark M and / or the glass surface of the component imaging unit 15, the maintenance work is performed against contamination of the reference mark M and the glass surface of the component imaging unit 15. Can be performed appropriately.
  • the CPU 32 determines that maintenance work is necessary when the evaluation value indicates an outlier that exceeds a predetermined reference range.
  • the evaluation value indicates an outlier
  • the mounting apparatus 11 the worker can perform maintenance work in such a sudden state.
  • the mounting apparatus 11 outputs a captured image and a reference image indicating the outlier when the evaluation value indicates an outlier exceeding a predetermined reference range.
  • the operator can compare the captured image indicating the outlier and the reference image, so that the necessity of maintenance work can be determined more accurately.
  • the CPU 32 sets a reference range based on a plurality of evaluation values obtained within a predetermined period or a predetermined number of two or more evaluation values.
  • the maintenance work for the imaging-related member can be performed more appropriately by using a more appropriate reference range.
  • the mounting apparatus 11 performs a process of estimating a factor that requires the maintenance work based on the imaging result.
  • the maintenance work target can be specified, and a more appropriate maintenance work can be executed.
  • the CPU 32 determines the displacement of the imaging-related member when the degree of coincidence between the captured image of the reference mark M that shows an outlier whose evaluation value exceeds a predetermined reference range and the reference image of the reference mark M is equal to or greater than a threshold value.
  • the degree of coincidence of images is lower than the threshold value, contamination of the imaging-related member is estimated as a maintenance factor.
  • the CPU 32 analyzes the luminance of the captured image, and based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated, the CPU 32 may contaminate the reference mark M or the glass surface of the component imaging unit 15. Estimate contamination.
  • the CPU 32 can estimate the object of maintenance work based on the degree of coincidence of images and the tendency of luminance difference.
  • the mounting apparatus 11 includes a cleaning unit 36 that cleans the imaging-related member with the cleaning member 37 and / or the cleaning jig 38. After determining that maintenance work is required for the imaging-related member, the mounting unit 11 performs imaging on the cleaning unit 36. Clean related members. In the mounting apparatus 11, maintenance work can be more reliably performed by the cleaning unit 36.
  • maintenance management device and the mounting device of the present disclosure are not limited to the above-described embodiments, and needless to say, can be implemented in various modes as long as they belong to the technical scope of the present disclosure.
  • the maintenance information is displayed in the maintenance information display column 68 and the captured image indicating the outlier and the reference image are displayed and output.
  • the mounting apparatus 11 automatically identifies an imaging-related member that requires maintenance work and executes a maintenance process, the maintenance work for the imaging-related member can be more appropriately executed even if these display outputs are omitted. .
  • the reference mark M is described as the reference pattern.
  • the reference mark M is not particularly limited as long as it includes a reference portion, shape, structure, and the like, and may be, for example, a figure or a character.
  • the evaluation value for determining whether maintenance work is necessary is a correction value used for the mounting process.
  • the evaluation value is not limited to this, and a value derived other than the correction value may be used. Good.
  • the notification process of the maintenance information is performed by the mounting apparatus 11.
  • any apparatus included in the mounting system 10 may be used, and the notification process may be executed by the management PC 40, or another apparatus.
  • the notification process may be executed by a printing apparatus or an inspection apparatus.
  • the mounting apparatus 11 has the functions of the maintenance management apparatus such as the evaluation value calculation, outlier detection, and maintenance factor estimation. If it is acquired from the mounting apparatus 11, the management PC 40 may have the function of the maintenance management apparatus, or another apparatus may have it. That is, the control unit such as the management PC 40, the printing apparatus, or the inspection apparatus may be a maintenance management apparatus. Even in this case, the maintenance work for the imaging-related member can be performed more appropriately.
  • the mounting apparatus 11 performs estimation of maintenance factors, maintenance work, and the like.
  • the present invention is not particularly limited to this as long as it notifies the worker that the maintenance work is required. Any of these may be omitted.
  • the mounting apparatus 11 shall be provided with the cleaning part 36, it is good also as a thing which abbreviate
  • the worker identifies a maintenance factor based on the notified maintenance information and executes the maintenance work.
  • the mounting apparatus 11 determines whether the maintenance factor is displacement of the imaging-related member or contamination, but any of these may be omitted.
  • the mounting apparatus 11 specifies whether the reference mark M is contaminated or the glass surface of the component imaging unit 15 is contaminated, these may not be specified. In this mounting apparatus 11 as well, the operator can perform maintenance work for the imaging-related member more appropriately.
  • the present invention is not particularly limited thereto, and the housing (base portion) of the mounting apparatus 11 is not limited thereto.
  • the arranged reference mark may be imaged by the mark imaging unit 25, and the reference mark and the mark imaging unit 25 may be used as an imaging-related member.
  • the cleaning member 37 can clean the mark imaging unit 25, and the cleaning jig 38 can clean the reference mark.
  • the present disclosure has been described as the mounting apparatus 11.
  • a maintenance management apparatus a maintenance management method, or a program for executing the maintenance management method may be used.
  • the mounting apparatus and the mounting method of the present disclosure may be configured as follows.
  • the maintenance management device performs a notification process for performing a notification process for notifying maintenance information indicating that a maintenance operation is performed on the imaging-related member based on a determination result of the necessity of the maintenance operation by the determination unit. It is good also as a thing provided with a part.
  • the apparatus that performs the notification process may be an apparatus included in the mounting system, and may be executed by the management apparatus of the mounting system or may be executed by the mounting apparatus.
  • the notification processing unit may execute the notification processing of the cleaning maintenance work of the reference pattern and / or the glass surface of the imaging unit.
  • maintenance work can be appropriately performed against dirt on the reference pattern, dirt on the glass surface of the imaging unit, and the like.
  • the notification processing unit when executing the notification processing, captures an image that indicates an outlier when the evaluation value indicates an outlier that exceeds a predetermined reference range.
  • the image and the reference image may be output.
  • an operator can compare an image showing an outlier with a reference image, so that the necessity of maintenance work can be determined more accurately.
  • This “predetermined reference range” may be determined empirically, for example, in a range in which a sudden event occurs in the mounting apparatus and the evaluation value is greatly changed.
  • the determination unit may determine that the maintenance work is necessary when the evaluation value indicates an outlier exceeding a predetermined reference range.
  • the evaluation value indicates an outlier, there may be a case where some dirt is attached or a strong impact is given to the imaging-related member.
  • the operator can perform maintenance work in such a sudden state.
  • the determination unit sets the reference range based on a plurality of the evaluation values or two or more predetermined evaluation values obtained within a predetermined period. It may be a thing.
  • the maintenance work of the members related to the imaging unit can be performed more appropriately by using a more appropriate reference range.
  • the maintenance management device is configured to estimate a factor that requires maintenance work based on the imaging result when the determination unit determines that maintenance work is required for the imaging-related member.
  • An estimation unit may be provided.
  • the maintenance factor estimation unit may estimate a maintenance factor by comparing a captured image showing a deviated value whose evaluation value exceeds a predetermined reference range with a reference image.
  • the maintenance factor estimation unit is configured to capture the image when the degree of coincidence between the image of the reference pattern indicating the outlier exceeding the predetermined reference range and the reference image of the reference pattern is equal to or greater than a threshold value.
  • the displacement of the related member may be estimated as the maintenance factor.
  • the maintenance factor estimation unit may perform the imaging-related when the degree of coincidence between the captured image of the reference pattern indicating the outlier that exceeds the predetermined reference range and the reference image of the reference pattern is lower than a threshold value.
  • the contamination of the member may be estimated as the maintenance factor.
  • the maintenance factor estimation unit analyzes the luminance of the captured image, and determines whether the reference pattern is contaminated based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated. It may be estimated whether the surface is contaminated.
  • the maintenance factor estimation unit can estimate the target of the maintenance work using such a relationship.
  • the mounting apparatus of the present disclosure is: A substrate processing unit for processing the substrate; A mounting part having a sampling member for sampling the component and arranging the sampled component on the substrate; An imaging unit for imaging a reference pattern; One of the maintenance management devices described above; It is equipped with.
  • this mounting device can obtain a stable evaluation value in a calibration process that is periodically and repeatedly performed under the same conditions, so that maintenance work for members related to the imaging unit is more appropriate. Can be executed.
  • the mounting device of the present disclosure includes a cleaning unit that cleans the imaging-related member with a cleaning member, and the maintenance management device determines that the maintenance work is necessary for the imaging-related member, and then the cleaning unit The imaging related member may be cleaned.
  • maintenance work can be more reliably performed by the cleaning unit.
  • the maintenance management method of the present disclosure is: A maintenance management method for managing maintenance work of at least one of a reference pattern provided in a mounting apparatus for mounting a component on a substrate and an imaging unit that images the reference pattern, Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus Determining whether maintenance work is necessary for related members; Is included.
  • This maintenance management method can obtain a stable evaluation value in a calibration process that is periodically and repeatedly performed under the same conditions as in the maintenance management apparatus described above. Can be implemented properly.
  • various aspects of the above-described maintenance management apparatus and mounting apparatus may be adopted, or a configuration that realizes the functions of the above-described maintenance management apparatus and mounting apparatus may be added. Good.
  • the present disclosure can be used in the technical field of devices for mounting components.

Abstract

This maintenance management device manages the maintenance work conducted on an imaging-related member that includes at least one of: a reference pattern provided to a mounting device that mounts a component onto a substrate; and an imaging unit that images the reference pattern. This maintenance management device comprises a determination unit that determines whether maintenance work is required for the imaging-related member that is either one of the reference pattern and the imaging unit, on the basis of an evaluation value obtained from imaging results from imaging performed by the imaging unit during calibration processing that is performed periodically in order to maintain mounting accuracy of the mounting device.

Description

保守管理装置、実装装置及び保守管理方法Maintenance management apparatus, mounting apparatus, and maintenance management method
 本明細書では、保守管理装置、実装装置及び保守管理方法を開示する。 This specification discloses a maintenance management device, a mounting device, and a maintenance management method.
 従来、実装装置としては、例えば、吸着ノズルに保持された部品をLED、ミラー及びカメラにより撮像し、撮像データより画像処理を経てミラーの汚れを認識し、コントラストや塵の量に応じてクリーニングの要否を判定するものが提案されている(例えば、特許文献1参照)。この実装装置では、クリーニングが必要であると判定されると、エアーブローノズルからエアーを供給しミラー面を自動的にクリーニングする。 Conventionally, as a mounting device, for example, a part held by a suction nozzle is imaged by an LED, a mirror, and a camera, and the dirt of the mirror is recognized through image processing from the imaging data, and cleaning is performed according to the contrast and the amount of dust. What determines necessity is proposed (for example, refer patent document 1). In this mounting apparatus, when it is determined that cleaning is necessary, air is supplied from the air blow nozzle to automatically clean the mirror surface.
特開平11-330799号公報JP 11-330799 A
 しかしながら、上述した実装装置では、クリーニングを適正に行うことができるとしているが、まだ十分でなく、例えば、撮像カメラによる基準パターンの撮像などについては考慮されていなかった。特に、基準パターンは、精度を高める原点であることから、これを撮像処理する構成については、特にメンテナンスを適切に行うことが求められていた。 However, in the mounting apparatus described above, it can be said that cleaning can be performed properly, but it is still not sufficient, and for example, imaging of a reference pattern by an imaging camera has not been considered. In particular, since the reference pattern is an origin for improving accuracy, it has been demanded that the configuration for performing the imaging process should be particularly appropriately maintained.
 本開示は、このような課題に鑑みなされたものであり、撮像部に関連する保守作業をより適切に実行することができる保守管理装置、実装装置及び保守管理方法を提供することを主目的とする。 This indication is made in view of such a subject, and it aims at providing the maintenance management device, mounting device, and maintenance management method which can perform maintenance work relevant to an image pick-up part more appropriately. To do.
 本明細書で開示する保守管理装置、実装装置及び保守管理方法は、上述の主目的を達成するために以下の手段を採った。 The maintenance management device, mounting device, and maintenance management method disclosed in this specification have taken the following measures in order to achieve the main purpose described above.
 本開示の保守管理装置は、
 部品を基板に実装する実装装置に設けられた基準パターン及び前記基準パターンを撮像する撮像部の少なくとも一方の保守作業を管理する保守管理装置であって、
 前記実装装置の実装精度を保つために定期的に行われる較正処理時に前記撮像部により撮像される撮像結果から得られた評価値に基づいて、前記基準パターン及び前記撮像部のいずれかである撮像関連部材に対して保守作業の要否を判定する判定部、
、を備えたものである。
The maintenance management device of the present disclosure is:
A maintenance management device that manages maintenance work of at least one of a reference pattern provided in a mounting device for mounting a component on a substrate and an imaging unit that images the reference pattern,
Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus A determination unit that determines whether maintenance work is necessary for the related member,
, With.
 この保守管理装置では、部品及び基準パターンのうち少なくとも一方を撮像する撮像部による較正処理時の撮像結果から得られた評価値に基づいて、基準パターン及び撮像部のいずれかである撮像関連部材に対して保守作業の要否を判定する。この保守管理装置では、定期的に同じ条件で繰り返し行われる較正処理において、安定した評価値を得ることができるため、撮像部に関連する部材の保守作業をより適切に実行することができる。ここで、基準パターンとは、基準となる部位、形状及び構造などを含み、例えば、図形や文字などの基準マークとしてもよい。また、評価値は、実装処理にて用いられる補正値としてもよい。 In this maintenance management device, on the imaging-related member that is either the reference pattern or the imaging unit, based on the evaluation value obtained from the imaging result during the calibration process by the imaging unit that images at least one of the component and the reference pattern On the other hand, the necessity of maintenance work is determined. In this maintenance management device, a stable evaluation value can be obtained in a calibration process that is periodically and repeatedly performed under the same conditions, so that maintenance work for members related to the imaging unit can be performed more appropriately. Here, the reference pattern includes a reference portion, shape, structure, and the like, and may be a reference mark such as a figure or a character. The evaluation value may be a correction value used in the mounting process.
実装システム10の一例を表す概略説明図。1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. 清掃部36の清掃部材37による基準マークMの清掃処理の説明図。Explanatory drawing of the cleaning process of the reference | standard mark M by the cleaning member 37 of the cleaning part 36. FIG. 清掃部36の清掃治具38による部品撮像部15の清掃処理の説明図。Explanatory drawing of the cleaning process of the components imaging part 15 by the cleaning jig 38 of the cleaning part 36. FIG. 実装処理ルーチンの一例を表すフローチャート。The flowchart showing an example of a mounting process routine. 評価値(補正値)の変化を示す説明図。Explanatory drawing which shows the change of an evaluation value (correction value). 評価値(補正値)の外れ値を検出する一例を示す説明図。Explanatory drawing which shows an example which detects the outlier of an evaluation value (correction value). 基準マークMの位相ずれ時の撮像画像表示画面60の一例を表す説明図。Explanatory drawing showing an example of the captured image display screen 60 at the time of the phase shift of the reference | standard mark M. FIG. 基準マークMの汚染時の撮像画像表示画面60の一例を表す説明図。Explanatory drawing showing an example of the captured image display screen 60 at the time of contamination of the reference | standard mark M. FIG. マーク撮像部25の汚染時の撮像画像表示画面60の一例を表す説明図。Explanatory drawing showing an example of the captured image display screen 60 at the time of contamination of the mark imaging part 25. FIG.
 本実施形態を図面を参照しながら以下に説明する。図1は、本開示の一例である実装システム10の概略説明図である。図2は、清掃部36の清掃部材37による基準マークMの清掃処理の説明図である。図3は、清掃部36の清掃治具38による部品撮像部15の清掃処理の説明図である。実装システム10は、例えば部品Pを基板Sに実装するシステムである。この実装システム10は、実装装置11と、管理コンピュータ(PC)40とを備えている。実装システム10は、部品Pを基板Sに実装する実装処理を実施する複数の実装装置11が上流から下流に配置された実装ラインとして構成されている。図1では、説明の便宜のため実装装置11を1台のみ示している。なお、本実施形態において、左右方向(X軸)、前後方向(Y軸)及び上下方向(Z軸)は、図1~3に示した通りとする。 This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 which is an example of the present disclosure. FIG. 2 is an explanatory diagram of the cleaning process of the reference mark M by the cleaning member 37 of the cleaning unit 36. FIG. 3 is an explanatory diagram of the cleaning process of the component imaging unit 15 by the cleaning jig 38 of the cleaning unit 36. The mounting system 10 is a system for mounting the component P on the substrate S, for example. The mounting system 10 includes a mounting device 11 and a management computer (PC) 40. The mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 that perform mounting processing for mounting a component P on a substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
 実装装置11は、図1に示すように、基板処理部12と、部品供給部14と、部品撮像部15と、操作パネル16と、実装部20と、制御部31とを備えている。基板処理部12は、基板Sの搬入、搬送、実装位置での固定、搬出を行うユニットである。基板処理部12は、図1の前後に間隔を開けて設けられ左右方向に架け渡された1対のコンベアベルトを有している。基板Sはこのコンベアベルトにより搬送される。 As illustrated in FIG. 1, the mounting apparatus 11 includes a substrate processing unit 12, a component supply unit 14, a component imaging unit 15, an operation panel 16, a mounting unit 20, and a control unit 31. The substrate processing unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate processing unit 12 has a pair of conveyor belts provided at intervals in the front and rear direction of FIG. 1 and spanned in the left-right direction. The board | substrate S is conveyed by this conveyor belt.
 部品供給部14は、実装部20へ部品Pを供給するユニットである。この部品供給部14は、部品を保持したテープを巻き付けたリールを装着したフィーダを複数備えている。この部品供給部14は、部品を複数配列して載置する保持部材としてのトレイを有するトレイユニットを備えていてもよい。 The component supply unit 14 is a unit that supplies the component P to the mounting unit 20. The component supply unit 14 includes a plurality of feeders on which reels around which tapes holding components are wound are mounted. The component supply unit 14 may include a tray unit having a tray as a holding member on which a plurality of components are arranged and placed.
 部品撮像部15は、実装ヘッド22に採取され保持された1以上の部品Pの画像を撮像する装置である。この部品撮像部15は、部品供給部14と基板処理部12との間に配置されている。この部品撮像部15の撮像範囲は、部品撮像部15の上方である。部品撮像部15は、部品Pを保持した実装ヘッド22が部品撮像部15の上方を通過する際、部品Pの画像を撮像し、撮像画像を制御部31へ出力する。また、部品撮像部15は、実装ヘッド22に配設された基準マークMを部品Pと共に撮像する。制御部31は、この撮像画像によって、部品Pの形状及び部位が正常であるか否かの検査や、部品Pの採取時の位置ずれ量の検出などを実行することができる。 The component imaging unit 15 is an apparatus that captures an image of one or more components P collected and held by the mounting head 22. The component imaging unit 15 is disposed between the component supply unit 14 and the substrate processing unit 12. The imaging range of the component imaging unit 15 is above the component imaging unit 15. When the mounting head 22 holding the component P passes above the component imaging unit 15, the component imaging unit 15 captures an image of the component P and outputs the captured image to the control unit 31. Further, the component imaging unit 15 images the reference mark M disposed on the mounting head 22 together with the component P. The control unit 31 can execute an inspection as to whether or not the shape and part of the component P are normal, detection of a positional deviation amount when the component P is collected, and the like based on the captured image.
 操作パネル16は、作業者と情報をやりとりするユニットであり、画面を表示する表示部17と作業者が操作する操作部18とを有している。 The operation panel 16 is a unit that exchanges information with the worker, and includes a display unit 17 that displays a screen and an operation unit 18 that is operated by the worker.
 実装部20は、部品Pを部品供給部14から採取し、基板処理部12に固定された基板Sへ配置するユニットである。実装部20は、ヘッド移動部21と、実装ヘッド22と、ノズル23とを備えている。ヘッド移動部21は、ガイドレールに導かれてXY方向へ移動するスライダと、スライダを駆動するモータとを備えている。実装ヘッド22は、1以上の部品Pを採取してヘッド移動部21によりXY方向へ移動するものである。この実装ヘッド22は、スライダに取り外し可能に装着されている。実装ヘッド22の下面には、1以上のノズル23が取り外し可能に装着されている。ノズル23は、負圧を利用して部品を採取するものである。なお、部品Pを採取する採取部材は、ノズル23のほか部品Pを機械的に保持するメカニカルチャックなどとしてもよい。実装ヘッド22の下面側には、ノズル23の基準位置となる基準マークMが配設されている(図2参照)。また、実装ヘッド22が装着されたスライダの下面側には、マーク撮像部25が配設されている。マーク撮像部25は、実装ヘッド22の移動に伴い、XY方向に移動し、基板Sに形成されたマークなどを撮像する。 The mounting unit 20 is a unit that collects the component P from the component supply unit 14 and places the component P on the substrate S fixed to the substrate processing unit 12. The mounting unit 20 includes a head moving unit 21, a mounting head 22, and a nozzle 23. The head moving unit 21 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 collects one or more components P and moves them in the XY directions by the head moving unit 21. The mounting head 22 is detachably mounted on the slider. One or more nozzles 23 are detachably mounted on the lower surface of the mounting head 22. The nozzle 23 collects parts using negative pressure. The collecting member for collecting the component P may be a mechanical chuck that mechanically holds the component P in addition to the nozzle 23. A reference mark M serving as a reference position of the nozzle 23 is disposed on the lower surface side of the mounting head 22 (see FIG. 2). A mark imaging unit 25 is disposed on the lower surface side of the slider on which the mounting head 22 is mounted. The mark imaging unit 25 moves in the XY directions as the mounting head 22 moves, and images a mark or the like formed on the substrate S.
 制御部31は、CPU32を中心とするマイクロプロセッサとして構成されており、各種データを記憶する記憶部33などを備えている。この制御部31は、基板処理部12、部品供給部14、部品撮像部15、操作パネル16及び実装部20へ制御信号を出力し、実装部20や部品供給部14、部品撮像部15、操作パネル16からの信号を入力する。記憶部33には、実装条件情報34や較正関連情報35などが記憶されている。実装条件情報34は、部品Pの情報や部品Pを基板Sへ実装する配置順、配置位置などを含む情報である。較正関連情報35は、実装装置11の各ユニットの較正結果や判定に用いる基準範囲などを含む情報である。較正結果としては、例えば、熱膨張などによるXY方向のずれや組付誤差を補正する補正値などが含まれる。基準範囲は、例えば実装装置11に突発的な事象が起き、較正処理における補正値(評価値)が大きく変動したことがわかる範囲に経験的に定められるものとしてもよい。突発的な事象としては、例えば、基準マークMが変位するような物体の衝突や、基準マークM及び/又は部品撮像部15の汚染などが含まれる。 The control unit 31 is configured as a microprocessor centered on the CPU 32, and includes a storage unit 33 for storing various data. The control unit 31 outputs control signals to the substrate processing unit 12, the component supply unit 14, the component imaging unit 15, the operation panel 16, and the mounting unit 20, and the mounting unit 20, the component supply unit 14, the component imaging unit 15, and the operation A signal from the panel 16 is input. The storage unit 33 stores mounting condition information 34, calibration related information 35, and the like. The mounting condition information 34 is information including information on the component P, an arrangement order in which the component P is mounted on the substrate S, an arrangement position, and the like. The calibration related information 35 is information including a calibration result of each unit of the mounting apparatus 11 and a reference range used for determination. The calibration result includes, for example, a correction value for correcting a deviation in the XY direction due to thermal expansion or the like or an assembly error. The reference range may be determined empirically, for example, in a range in which a sudden event occurs in the mounting apparatus 11 and the correction value (evaluation value) in the calibration process is greatly changed. The sudden event includes, for example, an object collision such that the reference mark M is displaced, contamination of the reference mark M and / or the component imaging unit 15, and the like.
 清掃部36は、基準マークMや部品撮像部15、マーク撮像部25のガラス面などを含む撮像関連部材に対して保守作業としての清掃処理を実行するユニットである。清掃部36は、清掃部材37と、清掃治具38とを備えている。清掃部材37は、基準マークMやマーク撮像部25のガラス面を清掃するブラシであり、上下動可能に実装装置11の基部に配設されている。清掃部材37は、図2に示すように、その上方に清掃対象(基準マークMなど)を移動したあと上昇されてこれを清掃する。清掃治具38は、部品撮像部15などを清掃するブラシであり、ノズル23の代わりに実装ヘッド22に装着される。清掃治具38は、図3に示すように、その下方に清掃対象(部品撮像部15など)が配置される位置に実装ヘッド22を移動したあと、下降されてこれを清掃する。 The cleaning unit 36 is a unit that performs a cleaning process as a maintenance operation on the imaging-related members including the reference mark M, the component imaging unit 15, the glass surface of the mark imaging unit 25, and the like. The cleaning unit 36 includes a cleaning member 37 and a cleaning jig 38. The cleaning member 37 is a brush that cleans the glass surface of the reference mark M and the mark imaging unit 25, and is disposed at the base of the mounting apparatus 11 so as to be movable up and down. As shown in FIG. 2, the cleaning member 37 is lifted after moving a cleaning target (a reference mark M or the like) upward to clean it. The cleaning jig 38 is a brush that cleans the component imaging unit 15 and the like, and is attached to the mounting head 22 instead of the nozzle 23. As shown in FIG. 3, the cleaning jig 38 moves the mounting head 22 to a position where a cleaning target (component imaging unit 15 or the like) is disposed below and then lowers the cleaning jig 38 to clean it.
 管理PC40は、実装システム10の各装置の情報を管理するコンピュータである。管理PC40は、図1に示すように、制御部41と、記憶部43と、表示部47と、入力装置48とを備えている。制御部41は、CPU42を中心とするマイクロプロセッサとして構成されている。記憶部43は、例えばHDDなど、処理プログラムなど各種データを記憶する装置である。記憶部43には、実装条件情報34と同様の実装条件情報44や、較正関連情報35と同様の較正関連情報45などが記憶されている。表示部47は、各種情報を表示する液晶画面である。入力装置48は、作業者が各種指令を入力するキーボード及びマウス等を含む。 The management PC 40 is a computer that manages information of each device of the mounting system 10. As illustrated in FIG. 1, the management PC 40 includes a control unit 41, a storage unit 43, a display unit 47, and an input device 48. The control unit 41 is configured as a microprocessor centered on the CPU 42. The storage unit 43 is a device that stores various data such as a processing program such as an HDD. The storage unit 43 stores mounting condition information 44 similar to the mounting condition information 34, calibration related information 45 similar to the calibration related information 35, and the like. The display unit 47 is a liquid crystal screen that displays various types of information. The input device 48 includes a keyboard, a mouse, and the like through which an operator inputs various commands.
 次に、こうして構成された本実施形態の実装システム10の動作、特に、較正処理を行うと共に実装処理を行う処理について説明する。図4は、制御部31のCPU32で実行される実装処理ルーチンの一例を表すフローチャートである。このルーチンは、記憶部33に記憶され、作業者の指示により実行される。このルーチンが実行されると、CPU32は、実装条件情報34を読み出して取得し(S100)、較正処理を実行するタイミングであるか否かを判定する(S110)。較正処理の実行タイミングは、実装装置11の実装処理開始直後や、所定時間(例えば、1時間や2時間など)経過後、所定基板数(例えば、100枚など)生産後などに設定されている。較正処理の実行タイミングでないときには、CPU32は、実装処理を実行する(S250)。実装処理では、CPU32は、基板Sを搬送及び固定させ、実装条件情報34の配置順に基づいて部品Pをノズル23で採取して基板Sに配置し、部品Pを配置し終わると、基板Sを排出する処理を実行する。次に、CPU32は、生産完了したか否かを判定し(S260)、生産完了していないときには、S110以降の処理を実行する。一方、S260で生産完了したときには、CPU32は、このルーチンを終了する。 Next, the operation of the mounting system 10 according to the present embodiment configured as described above, particularly the processing for performing the mounting process as well as the calibration process will be described. FIG. 4 is a flowchart illustrating an example of a mounting process routine executed by the CPU 32 of the control unit 31. This routine is stored in the storage unit 33 and executed according to an instruction from the operator. When this routine is executed, the CPU 32 reads out and acquires the mounting condition information 34 (S100), and determines whether it is time to execute the calibration process (S110). The execution timing of the calibration process is set immediately after the mounting process of the mounting apparatus 11 is started, after a predetermined time (for example, 1 hour or 2 hours) has elapsed, or after a predetermined number of substrates (for example, 100 sheets) has been produced. . When it is not the execution timing of the calibration process, the CPU 32 executes the mounting process (S250). In the mounting process, the CPU 32 conveys and fixes the substrate S, collects the component P by the nozzle 23 based on the arrangement order of the mounting condition information 34, arranges the component P on the substrate S, and when the component P is arranged, Execute the discharging process. Next, the CPU 32 determines whether or not the production is completed (S260). When the production is not completed, the CPU 32 executes the processes after S110. On the other hand, when the production is completed in S260, the CPU 32 ends this routine.
 一方、S110で較正処理の実行タイミングであるときには、CPU32は、較正処理を実行し(S120)、評価値(補正値)を算出する(S130)。較正処理において、CPU32は、使用時間に応じた変化を補正する補正値を求める処理と、組付誤差の補正値を求める処理とを実行する。使用時間に応じた補正値としては、例えば、移動座標の較正、実装ヘッド22の中心位置較正、部品撮像部15の分解能較正などが挙げられる。組付誤差の補正値としては、ノズル23を保管する保管部の位置や、実装ヘッド22に装着されたノズル23の位置の補正値などが挙げられる。例えば、移動座標の較正処理では、CPU32は、前回の較正処理によって求められた補正値に基づき部品撮像部15の中心座標と基準マークMの中心座標が一致するように実装ヘッド22を移動させ、その位置で部品撮像部15により基準マークMを撮像する。CPU32は、撮像画像に基づいて部品撮像部15の中心座標に対する基準マークMの中心座標のずれ量を計測し、ずれ量に基づいて、適正な位置に実装ヘッド22が位置するように実装ヘッド22の移動量を調整する補正値を求める。なお、ずれ量そのものが評価値であってもよい。また、ノズル23の位置較正処理では、CPU32は、実装ヘッド22にノズル23を装着した状態で基準マークMとノズル23とを部品撮像部15により撮像し、ノズル23の先端が適正な位置からどの程度ずれているかを求めこれを矯正する補正値を求める。CPU32は、定期的に同じ条件でこのような較正処理を繰り返し実行し、実装装置11の動作精度をより高める。 On the other hand, when it is the execution timing of the calibration process in S110, the CPU 32 executes the calibration process (S120) and calculates the evaluation value (correction value) (S130). In the calibration process, the CPU 32 executes a process for obtaining a correction value for correcting a change according to the usage time and a process for obtaining a correction value for the assembly error. Examples of the correction value corresponding to the usage time include calibration of moving coordinates, center position calibration of the mounting head 22, and resolution calibration of the component imaging unit 15. Examples of the correction value for the assembly error include the position of the storage unit for storing the nozzles 23 and the correction value for the position of the nozzles 23 attached to the mounting head 22. For example, in the movement coordinate calibration process, the CPU 32 moves the mounting head 22 so that the center coordinates of the component imaging unit 15 and the center coordinates of the reference mark M coincide with each other based on the correction value obtained by the previous calibration process. At that position, the reference mark M is imaged by the component imaging unit 15. The CPU 32 measures the shift amount of the center coordinate of the reference mark M with respect to the center coordinate of the component imaging unit 15 based on the captured image, and based on the shift amount, the mounting head 22 is positioned at an appropriate position. A correction value for adjusting the amount of movement is obtained. The deviation amount itself may be an evaluation value. Further, in the position calibration process of the nozzle 23, the CPU 32 images the reference mark M and the nozzle 23 with the component imaging unit 15 in a state where the nozzle 23 is mounted on the mounting head 22, and determines the tip of the nozzle 23 from the proper position. The degree of deviation is obtained and a correction value for correcting this is obtained. The CPU 32 periodically executes such a calibration process under the same conditions to improve the operation accuracy of the mounting apparatus 11.
 さて、評価値(補正値)を求めると、CPU32は、評価値が所定の基準範囲を超える外れ値を示しているか否かを判定する(S140)。図5は、評価値(補正値)の変化を示す説明図である。図6は、評価値(補正値)の外れ値を検出する一例を示す説明図である。求める補正値は、図5に示すように、使用時間に応じて変化することはあるものの、おおよそ一定値を示す。しかし、作業者によるユニットの取り扱いが不十分で変形した場合や、ユニットが劣化した場合、ユニットに何らかの汚れが付着した場合など、補正値は、突発的に大きな変化を示すことがある。このS140では、このようなユニットに対する突発的なアクシデントを検出するのである。外れ値の検出は、以下のように行うことができる。例えば、所定期間内(例えば1日や10日など)及び/又は所定数(例えば、100件や5000件など)得られた評価値を多数集積し、その第1四分位数Q1と第3四分位数Q3とを算出し、更にIQR=Q3-Q1を求める。このとき、外れ値とみなされた評価値は集積から除く。次に、下限値(Q1-n×IQR)と上限値(Q3+n×IQR)との間を基準範囲に設定し、この基準範囲を外れたものを外れ値とみなすものとする。nは、任意の数であり、検証によって適切な倍数に設定するものとする。このようにして、CPU32は、外れ値を検出する。また、CPU32は、上述した較正処理で得られた各々の補正値に対して、この判定を行うものとする。 Now, when the evaluation value (correction value) is obtained, the CPU 32 determines whether or not the evaluation value indicates an outlier that exceeds a predetermined reference range (S140). FIG. 5 is an explanatory diagram showing changes in evaluation values (correction values). FIG. 6 is an explanatory diagram illustrating an example of detecting an outlier of an evaluation value (correction value). As shown in FIG. 5, the correction value to be obtained shows a substantially constant value although it may change depending on the use time. However, the correction value may suddenly change greatly, for example, when the unit is deformed due to insufficient handling of the unit by an operator, when the unit deteriorates, or when some dirt is attached to the unit. In S140, a sudden accident with respect to such a unit is detected. Outlier detection can be performed as follows. For example, many evaluation values obtained within a predetermined period (for example, 1 day or 10 days) and / or a predetermined number (for example, 100 cases, 5000 cases, etc.) are accumulated, and the first quartile Q1 and the third The quartile Q3 is calculated, and IQR = Q3-Q1 is obtained. At this time, evaluation values regarded as outliers are excluded from the accumulation. Next, a reference range is set between the lower limit value (Q1−n × IQR) and the upper limit value (Q3 + n × IQR), and a value outside this reference range is regarded as an outlier. n is an arbitrary number and is set to an appropriate multiple by verification. In this way, the CPU 32 detects an outlier. In addition, the CPU 32 performs this determination on each correction value obtained by the calibration process described above.
 S140で、評価値が外れ値であるときには、外れ値を示す撮像画像と基準画像と共に保守情報を表示出力する(S150)。図7は、基準マークMが位相ずれを生じたときの撮像画像表示画面60の一例を表す説明図である。図8は、基準マークMに汚れが付着したときの撮像画像表示画面60の一例を表す説明図である。図9は、部品撮像部15に汚れが付着したときの撮像画像表示画面60の一例を表す説明図である。撮像画像表示画面60は、操作パネル16の表示部17に表示される。なお、撮像画像表示画面60は、管理PC40の表示部47に表示されるものとしてもよい。この撮像画像表示画面60には、カーソル61、撮像画像表示欄62、基準画像表示欄63、再較正指令キー64、撮像部清掃指令キー65、マーク清掃指令キー66、再開キー67及び保守情報表示欄68が配設されている。カーソル61は、操作部18の操作に基づいて動作し、表示欄やキーなどを選択する際に操作される。撮像画像表示欄62は、外れ値を示した撮像画像を表示する欄である。基準画像表示欄63は、基準画像としての正常時の撮像画像を表示する欄である。作業者は、撮像画像表示欄62及び基準画像表示欄63の画像を見比べることにより、撮像関連部材に生じている異常状態を把握することができる。再較正指令キー64は、較正処理を再度実行する際に押下されるキーである。このキーが押下されると、CPU32は、S120の処理を実行する。撮像部清掃指令キー65は、清掃部36により部品撮像部15を清掃する際に作業者によって押下されるキーである。マーク清掃指令キー66は、清掃部36により基準マークMを清掃する際に作業者によって押下されるキーである。再開キー67は、実装処理を再開する際に押下されるキーである。保守情報表示欄68は、撮像関連部材に対して保守作業を実行する旨の保守情報を表示する欄である。なお、CPU32は、撮像画像表示画面60を表示出力した時点において、実装処理ルーチンを一時停止してもよいし、そのまま継続してもよい。 When the evaluation value is an outlier in S140, maintenance information is displayed and output together with the captured image indicating the outlier and the reference image (S150). FIG. 7 is an explanatory diagram illustrating an example of a captured image display screen 60 when the reference mark M has a phase shift. FIG. 8 is an explanatory diagram illustrating an example of a captured image display screen 60 when dirt is attached to the reference mark M. FIG. 9 is an explanatory diagram illustrating an example of a captured image display screen 60 when dirt is attached to the component imaging unit 15. The captured image display screen 60 is displayed on the display unit 17 of the operation panel 16. Note that the captured image display screen 60 may be displayed on the display unit 47 of the management PC 40. On this captured image display screen 60, a cursor 61, a captured image display field 62, a reference image display field 63, a recalibration command key 64, an imaging unit cleaning command key 65, a mark cleaning command key 66, a restart key 67, and maintenance information display are displayed. A column 68 is provided. The cursor 61 operates based on the operation of the operation unit 18 and is operated when selecting a display field, a key, or the like. The captured image display column 62 is a column for displaying a captured image indicating an outlier. The reference image display field 63 is a field for displaying a normal captured image as a reference image. The operator can grasp the abnormal state occurring in the imaging-related member by comparing the images in the captured image display field 62 and the reference image display field 63. The recalibration command key 64 is a key that is pressed when the calibration process is executed again. When this key is pressed, the CPU 32 executes the process of S120. The imaging unit cleaning command key 65 is a key pressed by the operator when the cleaning unit 36 cleans the component imaging unit 15. The mark cleaning command key 66 is a key pressed by the operator when the cleaning unit 36 cleans the reference mark M. The resume key 67 is a key that is pressed when the mounting process is resumed. The maintenance information display column 68 is a column for displaying maintenance information indicating that maintenance work is performed on the imaging-related member. Note that the CPU 32 may temporarily stop the mounting process routine or continue it as it is when the captured image display screen 60 is displayed and output.
 S150のあと、CPU32は、撮像結果に基づいて保守作業が必要となった要因の推定処理及びその解消処理を実行する(S160~S220)。まず、CPU32は、撮像画像と基準画像との一致度を算出し(S160)、一致度が所定の閾値以上であるか否かを判定することによって、保守要因の推定結果を求める(S170)。例えば、外れ値を示した撮像画像と基準画像との一致度が高いときには、基準マークMの形状は正常に撮像されていることから、撮像関連部材の物理的な変位を保守要因として推定することができる(図7参照)。また、この一致度が低いときには、基準マークMの形状が正常に撮像されていないことから、撮像関連部材に汚れが付着していることを保守要因として推定することができる。なお、所定の閾値は、撮像関連部材の変位や汚れの付着を判定可能な値として経験的に求めるものとすればよい。S170で、撮像関連部材の変位が保守要因として推定されたときには、CPU32は、エラーを操作パネル16から作業者に報知し(S180)、このルーチンを終了する。作業者は、このエラーを確認すると、撮像関連部材(基準マークM及び/又は部品撮像部15)の組付位置などを確認する。 After S150, the CPU 32 executes a process for estimating a factor that requires maintenance work based on the imaging result and a process for eliminating the process (S160 to S220). First, the CPU 32 calculates the degree of coincidence between the captured image and the reference image (S160), and determines whether the degree of coincidence is equal to or greater than a predetermined threshold, thereby obtaining a maintenance factor estimation result (S170). For example, when the degree of coincidence between a captured image showing an outlier and a reference image is high, the shape of the reference mark M is normally captured, and therefore the physical displacement of the imaging-related member is estimated as a maintenance factor. (See FIG. 7). Further, when the degree of coincidence is low, since the shape of the reference mark M is not normally imaged, it can be estimated as a maintenance factor that dirt is attached to the imaging-related member. The predetermined threshold may be determined empirically as a value that can determine the displacement of the imaging-related member and the adhesion of dirt. When the displacement of the imaging-related member is estimated as a maintenance factor in S170, the CPU 32 notifies the operator of an error from the operation panel 16 (S180), and ends this routine. Upon confirming this error, the operator confirms the assembly position of the imaging-related member (reference mark M and / or component imaging unit 15).
 一方、S170で撮像関連部材の汚染が保守要因として推定されたときには、CPU32は、外れ値を示した撮像画像と基準画像との位相を合わせたときの輝度差を算出し(S190)、汚染対象の推定結果を求める(S200)。CPU32は、撮像画像の輝度を分析し、撮像画像と基準画像との輝度差の大きさと輝度差が生じている面積とに基づいて基準マークMの汚染か部品撮像部15の汚染かを推定する。例えば、基準マークMに汚れが付着した場合は、図8の撮像画像表示欄62Bに示すように、輝度差の絶対値は比較的大きいが輝度差を生じる面積は大きくない傾向を示す。一方、部品撮像部15のガラス面に汚れが付着した場合は、図9の撮像画像表示欄62Cに示すように、輝度差の絶対値は小さいが輝度差を生じる面積は大きくなる傾向がある。このような関係を用いて、CPU32は、保守作業を要する汚染対象(保守要因)を推定することができる。 On the other hand, when contamination of the imaging-related member is estimated as a maintenance factor in S170, the CPU 32 calculates a luminance difference when the phase of the captured image showing the outlier and the reference image is matched (S190), Is obtained (S200). The CPU 32 analyzes the luminance of the captured image and estimates whether the reference mark M is contaminated or the component imaging unit 15 is contaminated based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated. . For example, when the reference mark M is contaminated, as shown in the captured image display field 62B of FIG. 8, the absolute value of the luminance difference tends to be relatively large but the area causing the luminance difference does not tend to be large. On the other hand, when dirt is attached to the glass surface of the component imaging unit 15, as shown in the captured image display field 62C of FIG. 9, the absolute value of the luminance difference tends to be small, but the area where the luminance difference occurs tends to increase. Using such a relationship, the CPU 32 can estimate a contamination target (maintenance factor) requiring maintenance work.
 S200で汚染対象が基準マークMであるときには、基準マークMの保守作業(清掃処理)を清掃部36に実行させる(S210、図2参照)。この保守作業により、基準マークMが清掃され、正常な形状に認識されるようになる。一方、S200で汚染対象が部品撮像部15であるときには、部品撮像部15の保守作業(清掃処理)を清掃部36に実行させる(S220、図3参照)。この保守作業により、部品撮像部15のガラス面が清掃され、正常な撮像画像になる。S210、S220のあと、CPU32は、S120以降の処理を実行する。即ち、CPU32は、保守作業を行ったのち、再度、S120で較正処理を実行し、S140で評価値が外れ値であるか否かを判定する。撮像関連部材の汚染が解消されると、評価値は基準範囲を満たすものとなる。なお、複数回に亘って保守作業を行っても評価値が基準範囲を超える外れ値であるときには、CPU32は、エラーを報知してこのルーチンを終了するものとしてもよい。 When the contamination target is the reference mark M in S200, the cleaning unit 36 is caused to perform maintenance work (cleaning process) of the reference mark M (see S210, FIG. 2). By this maintenance work, the reference mark M is cleaned and recognized in a normal shape. On the other hand, when the contamination target is the component imaging unit 15 in S200, the maintenance operation (cleaning process) of the component imaging unit 15 is performed by the cleaning unit 36 (see S220 and FIG. 3). By this maintenance work, the glass surface of the component imaging unit 15 is cleaned, and a normal captured image is obtained. After S210 and S220, the CPU 32 executes processing subsequent to S120. That is, after performing the maintenance work, the CPU 32 executes the calibration process again in S120, and determines whether or not the evaluation value is an outlier in S140. When the contamination of the imaging-related member is eliminated, the evaluation value satisfies the reference range. If the evaluation value is an outlier that exceeds the reference range even after maintenance work is performed multiple times, the CPU 32 may notify an error and terminate this routine.
 一方、S140で評価値が基準範囲内であるときには、CPU32は、基準範囲の更新設定処理を行い(S230)、較正結果を管理PC40や操作パネル16へ出力する(S240)。基準範囲の更新設定処理において、CPU32は、例えば、新たに得られた補正値を集積し、上述した所定期間及び所定数のデータに含めて基準範囲を設定する処理を行う。そして、S240のあと、CPU32は、S250以降の処理を実行し、このルーチンを終了する。 On the other hand, when the evaluation value is within the reference range in S140, the CPU 32 performs reference range update setting processing (S230), and outputs the calibration result to the management PC 40 and the operation panel 16 (S240). In the reference range update setting process, for example, the CPU 32 accumulates newly obtained correction values, and performs a process of setting the reference range by including it in the predetermined period and the predetermined number of data. Then, after S240, the CPU 32 executes the processing after S250 and ends this routine.
 ここで、本実施形態の構成要素と本開示の構成要素との対応関係を明らかにする。本実施形態の基準マークMが本開示の基準パターンに相当し、部品撮像部15が撮像部に相当し、CPU32が判定部、報知処理部及び保守要因推定部に相当し、制御部31が保守管理装置に相当する。また、実装装置11が実装装置に相当し、基板処理部12が基板処理部に相当し、実装部20が実装部に相当し、清掃部36が清掃部に相当する。なお、本実施形態では、制御部31の動作を説明することにより本開示の保守管理方法の一例も明らかにしている。 Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present disclosure will be clarified. The reference mark M of this embodiment corresponds to a reference pattern of the present disclosure, the component imaging unit 15 corresponds to an imaging unit, the CPU 32 corresponds to a determination unit, a notification processing unit, and a maintenance factor estimation unit, and the control unit 31 performs maintenance. It corresponds to a management device. The mounting device 11 corresponds to a mounting device, the substrate processing unit 12 corresponds to a substrate processing unit, the mounting unit 20 corresponds to a mounting unit, and the cleaning unit 36 corresponds to a cleaning unit. In the present embodiment, an example of the maintenance management method of the present disclosure is also clarified by describing the operation of the control unit 31.
 以上説明した本実施形態の実装装置11は、設けられた基準マークM及び基準マークMを撮像する部品撮像部15の少なくとも一方を含む撮像関連部材の保守作業を管理する保守管理装置の機能を有する。この実装装置11は、実装精度を保つために定期的に行われる較正処理時に部品撮像部15により撮像される撮像結果から得られた評価値に基づいて、撮像関連部材に対して保守作業の要否を判定する。この実装装置11では、定期的に同じ条件で繰り返し行われる較正処理において、安定した評価値を得ることができるため、撮像関連部材の保守作業をより適切に実行することができる。また、実装装置11では、保守作業を要することを操作パネル16から報知することにより、撮像関連部材の保守作業をより適切に実行することができる。更に、実装装置11は、基準マークM及び/又は部品撮像部15のガラス面の清掃保守作業を報知するため、基準マークMの汚れや部品撮像部15のガラス面の汚れなどに対して保守作業を適切に行うことができる。 The mounting apparatus 11 of the present embodiment described above has a function of a maintenance management apparatus that manages maintenance work of imaging related members including at least one of the provided reference mark M and the component imaging unit 15 that images the reference mark M. . The mounting apparatus 11 requires maintenance work on the imaging-related members based on the evaluation values obtained from the imaging results captured by the component imaging unit 15 during the calibration process periodically performed to maintain mounting accuracy. Determine no. In the mounting apparatus 11, since a stable evaluation value can be obtained in the calibration process that is periodically performed under the same conditions, the maintenance work for the imaging-related member can be performed more appropriately. In addition, the mounting apparatus 11 can more appropriately execute the maintenance work for the imaging-related member by notifying the operation panel 16 that the maintenance work is required. Furthermore, since the mounting apparatus 11 notifies the cleaning and maintenance work of the reference mark M and / or the glass surface of the component imaging unit 15, the maintenance work is performed against contamination of the reference mark M and the glass surface of the component imaging unit 15. Can be performed appropriately.
 また、CPU32は、評価値が所定の基準範囲を超える外れ値を示すときに保守作業が必要と判定する。評価値が外れ値を示す場合は、何らかの汚れが付着した場合や、強い衝撃などが撮像関連部材に与えられたことがあり得る。この実装装置11では、このような突発的な状態において、作業者は保守作業を実行することができる。更に、実装装置11は、報知処理を実行する際に、評価値が所定の基準範囲を超える外れ値を示すときに、この外れ値を示す撮像画像と基準画像とを出力する。この実装装置11では、作業者は、外れ値を示す撮像画像と基準画像とを見比べることができるため、より正確に保守作業の要否判断を行うことができる。更にまた、CPU32は、所定期間内に得られた複数の評価値又は2以上の所定数の評価値に基づいて基準範囲を設定する。この実装装置11では、より適切な基準範囲を用いることによって、撮像関連部材の保守作業をより適切に実行することができる。 Also, the CPU 32 determines that maintenance work is necessary when the evaluation value indicates an outlier that exceeds a predetermined reference range. When the evaluation value indicates an outlier, there may be a case where some dirt is attached or a strong impact is given to the imaging-related member. In the mounting apparatus 11, the worker can perform maintenance work in such a sudden state. Further, when executing the notification process, the mounting apparatus 11 outputs a captured image and a reference image indicating the outlier when the evaluation value indicates an outlier exceeding a predetermined reference range. In the mounting apparatus 11, the operator can compare the captured image indicating the outlier and the reference image, so that the necessity of maintenance work can be determined more accurately. Furthermore, the CPU 32 sets a reference range based on a plurality of evaluation values obtained within a predetermined period or a predetermined number of two or more evaluation values. In the mounting apparatus 11, the maintenance work for the imaging-related member can be performed more appropriately by using a more appropriate reference range.
 更に、実装装置11は、撮像関連部材に対して保守作業が必要であると判定された際に、撮像結果に基づいて保守作業が必要となった要因を推定する処理を実行する。この実装装置11では、保守作業が必要となった要因を推定することによって、保守作業の対象を特定することができ、より適切な保守作業を実行することができる。また、CPU32は、評価値が所定の基準範囲を超える外れ値を示す基準マークMの撮像画像と、基準マークMの基準画像との画像の一致度が閾値以上であるときには撮像関連部材の変位を保守要因として推定する一方、画像の一致度が閾値よりも低いときには撮像関連部材の汚染を保守要因として推定する。また、CPU32は、撮像画像の輝度を分析し、撮像画像と基準画像との輝度差の大きさと輝度差が生じている面積とに基づいて基準マークMの汚染か部品撮像部15のガラス面の汚染かを推定する。CPU32は、画像の一致度や輝度差の傾向に基づいて保守作業の対象を推定することができる。 Furthermore, when it is determined that the maintenance work is necessary for the imaging-related member, the mounting apparatus 11 performs a process of estimating a factor that requires the maintenance work based on the imaging result. In the mounting apparatus 11, by estimating the factor that required the maintenance work, the maintenance work target can be specified, and a more appropriate maintenance work can be executed. In addition, the CPU 32 determines the displacement of the imaging-related member when the degree of coincidence between the captured image of the reference mark M that shows an outlier whose evaluation value exceeds a predetermined reference range and the reference image of the reference mark M is equal to or greater than a threshold value. On the other hand, when the degree of coincidence of images is lower than the threshold value, contamination of the imaging-related member is estimated as a maintenance factor. Further, the CPU 32 analyzes the luminance of the captured image, and based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated, the CPU 32 may contaminate the reference mark M or the glass surface of the component imaging unit 15. Estimate contamination. The CPU 32 can estimate the object of maintenance work based on the degree of coincidence of images and the tendency of luminance difference.
 更にまた、実装装置11は、撮像関連部材を清掃部材37及び又は清掃治具38により清掃する清掃部36を備え、撮像関連部材に対して保守作業が必要と判定したあと、清掃部36に撮像関連部材を清掃させる。この実装装置11では、清掃部36によって保守作業をより確実に実行することができる。 Furthermore, the mounting apparatus 11 includes a cleaning unit 36 that cleans the imaging-related member with the cleaning member 37 and / or the cleaning jig 38. After determining that maintenance work is required for the imaging-related member, the mounting unit 11 performs imaging on the cleaning unit 36. Clean related members. In the mounting apparatus 11, maintenance work can be more reliably performed by the cleaning unit 36.
 なお、本開示の保守管理装置及び実装装置は上述した実施形態に何ら限定されることはなく、本開示の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。 It should be noted that the maintenance management device and the mounting device of the present disclosure are not limited to the above-described embodiments, and needless to say, can be implemented in various modes as long as they belong to the technical scope of the present disclosure.
 例えば、上述した実施形態では、保守情報表示欄68に保守情報を表示し、外れ値を示す撮像画像と基準画像とを表示出力するものとして説明したが、いずれか1以上を省略してもよい。実装装置11は、自動で保守作業を要する撮像関連部材の特定を行い、保守処理を実行するため、これらの表示出力を省略しても撮像関連部材の保守作業をより適切に実行することができる。 For example, in the above-described embodiment, the maintenance information is displayed in the maintenance information display column 68 and the captured image indicating the outlier and the reference image are displayed and output. However, one or more of them may be omitted. . Since the mounting apparatus 11 automatically identifies an imaging-related member that requires maintenance work and executes a maintenance process, the maintenance work for the imaging-related member can be more appropriately executed even if these display outputs are omitted. .
 上述した実施形態では、基準マークMを基準パターンとして説明したが、基準となる部位、形状及び構造などを含むものとすれば、特にこれに限定されず、例えば、図形や文字などとしてもよい。また、上述した実施形態では、保守作業の要否を判定する評価値は、実装処理に用いられる補正値としたが、これに限定されず、補正値以外に導出される値を用いるものとしてもよい。 In the above-described embodiment, the reference mark M is described as the reference pattern. However, the reference mark M is not particularly limited as long as it includes a reference portion, shape, structure, and the like, and may be, for example, a figure or a character. In the above-described embodiment, the evaluation value for determining whether maintenance work is necessary is a correction value used for the mounting process. However, the evaluation value is not limited to this, and a value derived other than the correction value may be used. Good.
 上述した実施形態では、保守情報の報知処理を実装装置11で行うものとしたが、実装システム10に含まれる装置であればよく、管理PC40で報知処理を実行してもよいし、他の装置(例えば、印刷装置や検査装置など)で報知処理を実行してもよい。また、上述した実施形態では、評価値の算出や外れ値の検出、保守要因の推定など、保守管理装置の機能を実装装置11が有するものとしたが、特にこれに限定されず、較正結果を実装装置11から取得するものとすれば、保守管理装置の機能を管理PC40が有するものとしてもよいし、他の装置が有するものとしてもよい。即ち、管理PC40や印刷装置、検査装置などの制御部が保守管理装置であるものとしてもよい。この場合においても、撮像関連部材の保守作業をより適切に実行することができる。 In the above-described embodiment, the notification process of the maintenance information is performed by the mounting apparatus 11. However, any apparatus included in the mounting system 10 may be used, and the notification process may be executed by the management PC 40, or another apparatus. For example, the notification process may be executed by a printing apparatus or an inspection apparatus. In the above-described embodiment, the mounting apparatus 11 has the functions of the maintenance management apparatus such as the evaluation value calculation, outlier detection, and maintenance factor estimation. If it is acquired from the mounting apparatus 11, the management PC 40 may have the function of the maintenance management apparatus, or another apparatus may have it. That is, the control unit such as the management PC 40, the printing apparatus, or the inspection apparatus may be a maintenance management apparatus. Even in this case, the maintenance work for the imaging-related member can be performed more appropriately.
 上述した実施形態では、実装装置11は、保守要因の推定や保守作業などを実行するものとしたが、保守作業を要する旨を作業者へ報知するものとすれば、特にこれに限定されず、これらのいずれかを省略してもよい。また、実装装置11は、清掃部36を備えるものとしたが、これを省略するものとしてもよい。この場合、作業者は、報知された保守情報に基づいて、保守要因を特定し、保守作業を実行するものとする。例えば、実装装置11は、保守要因が撮像関連部材の変位であるか、汚染であるかを判定したがこれらのいずれかを省略してもよい。また、実装装置11は、基準マークMの汚染か部品撮像部15のガラス面の汚染かを特定するものとしたが、これらを特定しないものとしてもよい。この実装装置11においても撮像関連部材の保守作業を作業者がより適切に実行することができる。 In the embodiment described above, the mounting apparatus 11 performs estimation of maintenance factors, maintenance work, and the like. However, the present invention is not particularly limited to this as long as it notifies the worker that the maintenance work is required. Any of these may be omitted. Moreover, although the mounting apparatus 11 shall be provided with the cleaning part 36, it is good also as a thing which abbreviate | omits this. In this case, it is assumed that the worker identifies a maintenance factor based on the notified maintenance information and executes the maintenance work. For example, the mounting apparatus 11 determines whether the maintenance factor is displacement of the imaging-related member or contamination, but any of these may be omitted. Further, although the mounting apparatus 11 specifies whether the reference mark M is contaminated or the glass surface of the component imaging unit 15 is contaminated, these may not be specified. In this mounting apparatus 11 as well, the operator can perform maintenance work for the imaging-related member more appropriately.
 上述した実施形態では、実装ヘッド22に配設された基準マークMを部品撮像部15により撮像する場合を説明したが、特にこれに限定されず、実装装置11の筐体(基台部分)に配設された基準マークをマーク撮像部25により撮像するものとし、この基準マークとマーク撮像部25を撮像関連部材としてもよい。この場合、清掃部材37は、マーク撮像部25を清掃し、清掃治具38は、基準マークを清掃することができる。 In the above-described embodiment, the case where the reference mark M arranged on the mounting head 22 is imaged by the component imaging unit 15 has been described. However, the present invention is not particularly limited thereto, and the housing (base portion) of the mounting apparatus 11 is not limited thereto. The arranged reference mark may be imaged by the mark imaging unit 25, and the reference mark and the mark imaging unit 25 may be used as an imaging-related member. In this case, the cleaning member 37 can clean the mark imaging unit 25, and the cleaning jig 38 can clean the reference mark.
 上述した実施形態では、本開示を実装装置11として説明したが保守管理装置としてもよいし、保守管理方法としてもよいし、この保守管理方法を実行するプログラムとしてもよい。 In the above-described embodiment, the present disclosure has been described as the mounting apparatus 11. However, a maintenance management apparatus, a maintenance management method, or a program for executing the maintenance management method may be used.
 ここで、本開示の実装装置及び実装方法は、以下のように構成してもよい。本開示の保守管理装置は、前記判定部による前記保守作業の要否の判定結果に基づき、前記撮像関連部材に対して保守作業を実行する旨の保守情報を報知する報知処理を実行する報知処理部、を備えるものとしてもよい。この保守管理装置では、保守作業を要することを報知することにより、撮像部に関連する部材の保守作業をより適切に実行することができる。ここで、報知処理を行う装置は、実装システムに含まれる装置であればよく、実装システムの管理装置で実行してもよいし、実装装置で実行してもよい。 Here, the mounting apparatus and the mounting method of the present disclosure may be configured as follows. The maintenance management device according to the present disclosure performs a notification process for performing a notification process for notifying maintenance information indicating that a maintenance operation is performed on the imaging-related member based on a determination result of the necessity of the maintenance operation by the determination unit. It is good also as a thing provided with a part. In this maintenance management apparatus, by notifying that maintenance work is required, maintenance work for members related to the imaging unit can be performed more appropriately. Here, the apparatus that performs the notification process may be an apparatus included in the mounting system, and may be executed by the management apparatus of the mounting system or may be executed by the mounting apparatus.
 報知処理部を備える本開示の保守管理装置において、前記報知処理部は、前記基準パターン及び/又は前記撮像部のガラス面の清掃保守作業の前記報知処理を実行するものとしてもよい。この保守管理装置では、基準パターンの汚れや撮像部のガラス面の汚れなどに対して保守作業を適切に行うことができる。 In the maintenance management device of the present disclosure including a notification processing unit, the notification processing unit may execute the notification processing of the cleaning maintenance work of the reference pattern and / or the glass surface of the imaging unit. In this maintenance management device, maintenance work can be appropriately performed against dirt on the reference pattern, dirt on the glass surface of the imaging unit, and the like.
 報知処理部を備える本開示の保守管理装置において、前記報知処理部は、前記報知処理を実行する際に、前記評価値が所定の基準範囲を超える外れ値を示すときに該外れ値を示す撮像画像と基準画像とを出力するものとしてもよい。この保守管理装置では、作業者は、外れ値を示す画像と基準画像とを見比べることができるため、より正確に保守作業の要否判断を行うことができる。この「所定の基準範囲」は、例えば、実装装置に突発的な事象が起き、評価値が大きく変動したことがわかる範囲に経験的に定められるものとしてもよい。 In the maintenance management device of the present disclosure including a notification processing unit, the notification processing unit, when executing the notification processing, captures an image that indicates an outlier when the evaluation value indicates an outlier that exceeds a predetermined reference range. The image and the reference image may be output. In this maintenance management apparatus, an operator can compare an image showing an outlier with a reference image, so that the necessity of maintenance work can be determined more accurately. This “predetermined reference range” may be determined empirically, for example, in a range in which a sudden event occurs in the mounting apparatus and the evaluation value is greatly changed.
 本開示の保守管理装置において、前記判定部は、前記評価値が所定の基準範囲を超える外れ値を示すときに前記保守作業が必要と判定するものとしてもよい。評価値が外れ値を示す場合は、何らかの汚れが付着した場合や、強い衝撃などが撮像関連部材に与えられたことがあり得る。この保守管理装置では、このような突発的な状態において、作業者は保守作業を実行することができる。 In the maintenance management device of the present disclosure, the determination unit may determine that the maintenance work is necessary when the evaluation value indicates an outlier exceeding a predetermined reference range. When the evaluation value indicates an outlier, there may be a case where some dirt is attached or a strong impact is given to the imaging-related member. In this maintenance management device, the operator can perform maintenance work in such a sudden state.
 所定の基準範囲を用いる本開示の保守管理装置において、前記判定部は、所定期間内に得られた複数の前記評価値又は2以上の所定数の前記評価値に基づいて前記基準範囲を設定するものとしてもよい。この保守管理装置では、より適切な基準範囲を用いることによって、撮像部に関連する部材の保守作業をより適切に実行することができる。 In the maintenance management device according to the present disclosure that uses a predetermined reference range, the determination unit sets the reference range based on a plurality of the evaluation values or two or more predetermined evaluation values obtained within a predetermined period. It may be a thing. In this maintenance management device, the maintenance work of the members related to the imaging unit can be performed more appropriately by using a more appropriate reference range.
 本開示の保守管理装置は、前記判定部によって撮像関連部材に対して保守作業が必要であると判定された際に、前記撮像結果に基づいて保守作業が必要となった要因を推定する保守要因推定部、を備えたものとしてもよい。この保守管理装置では、保守作業が必要となった要因を推定することによって、保守作業の対象を特定することができ、より適切な保守作業を実行することができる。この保守管理装置において、前記保守要因推定部は、前記評価値が所定の基準範囲を超える外れ値を示す撮像画像と基準画像とを比較することによって保守要因を推定するものとしてもよい。このとき、前記保守要因推定部は、前記評価値が所定の基準範囲を超える外れ値を示す基準パターンの撮像画像と、基準パターンの基準画像との画像の一致度が閾値以上であるときには前記撮像関連部材の変位を前記保守要因として推定するものとしてもよい。あるいは、前記保守要因推定部は、前記評価値が所定の基準範囲を超える外れ値を示す基準パターンの撮像画像と、基準パターンの基準画像との画像の一致度が閾値よりも低いときには前記撮像関連部材の汚染を前記保守要因として推定するものとしてもよい。また、前記保守要因推定部は、前記撮像画像の輝度を分析し、前記撮像画像と基準画像との輝度差の大きさと輝度差が生じている面積とに基づいて前記基準パターンの汚染か前記ガラス面の汚染かを推定するものとしてもよい。撮像部のガラス面に汚れが付着した場合は、撮像部の焦点位置では無いので、基準パターン側に汚れが付着した時と比べて輝度差は小さいが輝度差を有する面積は大きくなる傾向にある。保守要因推定部は、このような関係を用いて、保守作業の対象を推定することができる。 The maintenance management device according to the present disclosure is configured to estimate a factor that requires maintenance work based on the imaging result when the determination unit determines that maintenance work is required for the imaging-related member. An estimation unit may be provided. In this maintenance management apparatus, by estimating the factor that required maintenance work, the maintenance work target can be specified, and more appropriate maintenance work can be executed. In this maintenance management apparatus, the maintenance factor estimation unit may estimate a maintenance factor by comparing a captured image showing a deviated value whose evaluation value exceeds a predetermined reference range with a reference image. At this time, the maintenance factor estimation unit is configured to capture the image when the degree of coincidence between the image of the reference pattern indicating the outlier exceeding the predetermined reference range and the reference image of the reference pattern is equal to or greater than a threshold value. The displacement of the related member may be estimated as the maintenance factor. Alternatively, the maintenance factor estimation unit may perform the imaging-related when the degree of coincidence between the captured image of the reference pattern indicating the outlier that exceeds the predetermined reference range and the reference image of the reference pattern is lower than a threshold value. The contamination of the member may be estimated as the maintenance factor. In addition, the maintenance factor estimation unit analyzes the luminance of the captured image, and determines whether the reference pattern is contaminated based on the magnitude of the luminance difference between the captured image and the reference image and the area where the luminance difference is generated. It may be estimated whether the surface is contaminated. When dirt is attached to the glass surface of the image pickup unit, it is not the focal position of the image pickup unit, so the brightness difference is small but the area having the brightness difference tends to be larger than when the dirt is attached to the reference pattern side. . The maintenance factor estimation unit can estimate the target of the maintenance work using such a relationship.
 本開示の実装装置は、
 基板を処理する基板処理部と、
 部品を採取する採取部材を有し採取した部品を前記基板へ配置する実装部と、
 基準パターンを撮像する撮像部と、
 上述したいずれかの保守管理装置と、
 を備えたものである。
The mounting apparatus of the present disclosure is:
A substrate processing unit for processing the substrate;
A mounting part having a sampling member for sampling the component and arranging the sampled component on the substrate;
An imaging unit for imaging a reference pattern;
One of the maintenance management devices described above;
It is equipped with.
 この実装装置は、上述した保守管理装置と同様に、定期的に同じ条件で繰り返し行われる較正処理において、安定した評価値を得ることができるため、撮像部に関連する部材の保守作業をより適切に実行することができる。 As with the above-described maintenance management device, this mounting device can obtain a stable evaluation value in a calibration process that is periodically and repeatedly performed under the same conditions, so that maintenance work for members related to the imaging unit is more appropriate. Can be executed.
 本開示の実装装置は、前記撮像関連部材を清掃部材により清掃する清掃部、を備え、前記保守管理装置は、前記撮像関連部材に対して前記保守作業が必要と判定したあと、前記清掃部に前記撮像関連部材を清掃させるものとしてもよい。この実装装置では、清掃部によって保守作業をより確実に実行することができる。 The mounting device of the present disclosure includes a cleaning unit that cleans the imaging-related member with a cleaning member, and the maintenance management device determines that the maintenance work is necessary for the imaging-related member, and then the cleaning unit The imaging related member may be cleaned. In this mounting apparatus, maintenance work can be more reliably performed by the cleaning unit.
 本開示の保守管理方法は、
 部品を基板に実装する実装装置に設けられた基準パターン及び前記基準パターンを撮像する撮像部の少なくとも一方の保守作業を管理する保守管理方法であって、
 前記実装装置の実装精度を保つために定期的に行われる較正処理時に前記撮像部により撮像される撮像結果から得られた評価値に基づいて、前記基準パターン及び前記撮像部のいずれかである撮像関連部材に対して保守作業の要否を判定するステップ、
 を含むものである。
The maintenance management method of the present disclosure is:
A maintenance management method for managing maintenance work of at least one of a reference pattern provided in a mounting apparatus for mounting a component on a substrate and an imaging unit that images the reference pattern,
Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus Determining whether maintenance work is necessary for related members;
Is included.
 この保守管理方法は、上述した保守管理装置と同様に、定期的に同じ条件で繰り返し行われる較正処理において、安定した評価値を得ることができるため、撮像部に関連する部材の保守作業をより適切に実行することができる。この保守管理方法において、上述した保守管理装置及び実装装置の種々の態様を採用してもよいし、また、上述した保守管理装置及び実装装置の各機能を実現するような構成を追加してもよい。 This maintenance management method can obtain a stable evaluation value in a calibration process that is periodically and repeatedly performed under the same conditions as in the maintenance management apparatus described above. Can be implemented properly. In this maintenance management method, various aspects of the above-described maintenance management apparatus and mounting apparatus may be adopted, or a configuration that realizes the functions of the above-described maintenance management apparatus and mounting apparatus may be added. Good.
 本開示は、部品を実装処理する装置の技術分野に利用可能である。 The present disclosure can be used in the technical field of devices for mounting components.
10 実装システム、11 実装装置、12 基板処理部、14 部品供給部、15 部品撮像部、16 操作パネル、17 表示部、18 操作部、20 実装部、21 ヘッド移動部、22 実装ヘッド、23 ノズル、25 マーク撮像部 、31 制御部、32 CPU、33 記憶部、34 実装条件情報、35 較正関連情報、36 清掃部、37 清掃部材、38 清掃治具、40 管理PC、41 制御部、42 CPU、43 記憶部、44 実装条件情報、45 較正関連情報、47 表示部、48 入力装置、60 撮像画像表示画面、61 カーソル、62,62B,62C 撮像画像表示欄、63 基準画像表示欄、64 再較正指令キー、65 撮像部清掃指令キー、66 マーク清掃指令キー、67 再開キー、68 保守情報表示欄、M 基準マーク、P 部品、S 基板。 10 mounting system, 11 mounting device, 12 substrate processing unit, 14 component supply unit, 15 component imaging unit, 16 operation panel, 17 display unit, 18 operation unit, 20 mounting unit, 21 head moving unit, 22 mounting head, 23 nozzle , 25 mark imaging unit, 31 control unit, 32 CPU, 33 storage unit, 34 mounting condition information, 35 calibration related information, 36 cleaning unit, 37 cleaning member, 38 cleaning jig, 40 management PC, 41 control unit, 42 CPU , 43 storage unit, 44 mounting condition information, 45 calibration related information, 47 display unit, 48 input device, 60 captured image display screen, 61 cursor, 62, 62B, 62C captured image display column, 63 reference image display column, 64 re Calibration command key, 65 Image pickup unit cleaning command key, 66 Mark cleaning command key, 67 Restart key , 68 maintenance information display column, M reference marks, P parts, S substrate.

Claims (10)

  1.  部品を基板に実装する実装装置に設けられた基準パターン及び前記基準パターンを撮像する撮像部の少なくとも一方の保守作業を管理する保守管理装置であって、
     前記実装装置の実装精度を保つために定期的に行われる較正処理時に前記撮像部により撮像される撮像結果から得られた評価値に基づいて、前記基準パターン及び前記撮像部のいずれかである撮像関連部材に対して保守作業の要否を判定する判定部、
     を備えた保守管理装置。
    A maintenance management device that manages maintenance work of at least one of a reference pattern provided in a mounting device for mounting a component on a substrate and an imaging unit that images the reference pattern,
    Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus A determination unit that determines whether maintenance work is necessary for the related member,
    Maintenance management device with
  2.  請求項1に記載の保守管理装置であって、
     前記判定部による前記保守作業の要否の判定結果に基づき、前記撮像関連部材に対して保守作業を実行する旨の保守情報を報知する報知処理を実行する報知処理部、を備える保守管理装置。
    The maintenance management device according to claim 1,
    A maintenance management device comprising: a notification processing unit that executes a notification process for notifying maintenance information indicating that a maintenance operation is performed on the imaging-related member based on a determination result of whether or not the maintenance operation is necessary by the determination unit.
  3.  前記報知処理部は、前記基準パターン及び/又は前記撮像部のガラス面の清掃保守作業の前記報知処理を実行する、請求項2に記載の保守管理装置。 The maintenance management device according to claim 2, wherein the notification processing unit executes the notification processing of cleaning and maintenance work of the reference pattern and / or the glass surface of the imaging unit.
  4.  前記報知処理部は、前記報知処理を実行する際に、前記評価値が所定の基準範囲を超える外れ値を示すときに該外れ値を示す撮像画像と基準画像とを出力する、請求項2又は3に記載の保守管理装置。 The said notification process part outputs the captured image and reference image which show this outlier when the said evaluation value shows the outlier which exceeds a predetermined reference range, when performing the said notification process. 3. The maintenance management apparatus according to 3.
  5.  前記判定部は、前記評価値が所定の基準範囲を超える外れ値を示すときに前記保守作業が必要と判定する、請求項1~4のいずれか1項に記載の保守管理装置。 The maintenance management apparatus according to any one of claims 1 to 4, wherein the determination unit determines that the maintenance work is necessary when the evaluation value indicates an outlier exceeding a predetermined reference range.
  6.  前記判定部は、所定期間内に得られた複数の前記評価値又は2以上の所定数の前記評価値に基づいて前記基準範囲を設定する、請求項4又は5に記載の保守管理装置。 The maintenance management device according to claim 4 or 5, wherein the determination unit sets the reference range based on a plurality of the evaluation values obtained within a predetermined period or a predetermined number of evaluation values of two or more.
  7.  請求項1~6のいずれか1項に記載の保守管理装置であって、
     前記判定部によって撮像関連部材に対して保守作業が必要であると判定された際に、前記撮像結果に基づいて保守作業が必要となった要因を推定する保守要因推定部、を備えた保守管理装置。
    The maintenance management device according to any one of claims 1 to 6,
    Maintenance management provided with a maintenance factor estimation unit that estimates a factor that requires maintenance work based on the imaging result when the determination unit determines that maintenance work is required for the imaging-related member apparatus.
  8.  基板を処理する基板処理部と、
     部品を採取する採取部材を有し採取した部品を前記基板へ配置する実装部と、
     基準パターンを撮像する撮像部と、
     請求項1~7のいずれか1項に記載の保守管理装置と、
     を備えた実装装置。
    A substrate processing unit for processing the substrate;
    A mounting part having a sampling member for sampling the component and arranging the sampled component on the substrate;
    An imaging unit for imaging a reference pattern;
    The maintenance management device according to any one of claims 1 to 7,
    Mounting device.
  9.  請求項8に記載の実装装置であって、
     前記撮像関連部材を清掃部材により清掃する清掃部、を備え、
     前記保守管理装置は、前記撮像関連部材に対して前記保守作業が必要と判定したあと、前記清掃部に前記撮像関連部材を清掃させる、実装装置。
    The mounting apparatus according to claim 8, wherein
    A cleaning unit for cleaning the imaging-related member with a cleaning member;
    The maintenance management device causes the cleaning unit to clean the imaging-related member after determining that the maintenance work is necessary for the imaging-related member.
  10.  部品を基板に実装する実装装置に設けられた基準パターン及び前記基準パターンを撮像する撮像部の少なくとも一方の保守作業を管理する保守管理方法であって、
     前記実装装置の実装精度を保つために定期的に行われる較正処理時に前記撮像部により撮像される撮像結果から得られた評価値に基づいて、前記基準パターン及び前記撮像部のいずれかである撮像関連部材に対して保守作業の要否を判定するステップ、
     を含む保守管理方法。
    A maintenance management method for managing maintenance work of at least one of a reference pattern provided in a mounting apparatus for mounting a component on a substrate and an imaging unit that images the reference pattern,
    Imaging that is one of the reference pattern and the imaging unit based on an evaluation value obtained from an imaging result captured by the imaging unit during a calibration process periodically performed to maintain the mounting accuracy of the mounting apparatus Determining whether maintenance work is necessary for related members;
    Maintenance management method including.
PCT/JP2018/015461 2018-04-13 2018-04-13 Maintenance management device, mounting device, and maintenance management method WO2019198220A1 (en)

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