WO2019197102A1 - Procédé de fabrication d'un dispositif de détection, procédé d'agencement d'un dispositif de détection et composant de châssis équipé d'un dispositif de détection - Google Patents

Procédé de fabrication d'un dispositif de détection, procédé d'agencement d'un dispositif de détection et composant de châssis équipé d'un dispositif de détection Download PDF

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Publication number
WO2019197102A1
WO2019197102A1 PCT/EP2019/056095 EP2019056095W WO2019197102A1 WO 2019197102 A1 WO2019197102 A1 WO 2019197102A1 EP 2019056095 W EP2019056095 W EP 2019056095W WO 2019197102 A1 WO2019197102 A1 WO 2019197102A1
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WO
WIPO (PCT)
Prior art keywords
sensor device
chassis component
layer
transfer
carrier film
Prior art date
Application number
PCT/EP2019/056095
Other languages
German (de)
English (en)
Inventor
Hermann Frye
Alexander LUNDBERG
Stefan Krahn
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Publication of WO2019197102A1 publication Critical patent/WO2019197102A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance

Definitions

  • the invention relates to a method for producing a sensor device for a chassis component, wcbei which the sensor device is designed to detect a change in state of the chassis component. Furthermore, the invention relates to a method for arranging a sensor device on a chassis component as well as a chassis component with such a sensor device.
  • Such a chassis component with a sensor device for detecting a change in state of the chassis component is known from DE 10 2014 223 657 A1.
  • the sensor device has a layer of carbon nanotubes (CNT) or carbon nanotubes. This layer is formed as a adhering to a surface of the chassis component paint layer.
  • CNT carbon nanotubes
  • an additional electrical contact has to be produced.
  • the sensor device is produced only on the surface of the chassis component.
  • strain gauges are known. However, this has the disadvantage that the arrangement of such strain gauges on a chassis component is expensive. In addition, strain gauges are relatively expensive to purchase.
  • the method is designed for producing a sensor device for a chassis component.
  • the sensor device may be a sensor or a sensor element.
  • the sensor device can interact with a further sensor device or a further sensor element to form a sensor.
  • the sensor device can be designed as a fully functional sensor.
  • the sensor device is further designed to detect a change in state of the chassis component.
  • a change of state of the chassis component can be understood to mean a change in position and / or a change in position of the chassis component, in particular in relation to a vehicle body or vehicle frame.
  • the detection of a force acting on the chassis component is preferably to be understood as detecting a change in state of the chassis component.
  • a deformation of the chassis component can be detected by means of the sensor device.
  • the sensor device is arranged and / or produced on a transfer and / or carrier film.
  • the sensor device can be arranged or applied in a simple manner on a surface of a chassis component.
  • the sensor device can be formed at least partially or completely even before the sensor device is arranged on the chassis component.
  • the sensor device is produced on the transfer and / or carrier film. This allows prefabrication of the sensor device, in particular independently of the chassis component.
  • the transfer and / or carrier film is formed from a flexible plastic material and / or polymer. The trans- Fer- and / or carrier film can serve as a kind of carrier material for the sensor device.
  • this preferably exclusively, serve for transferring and / or applying the sensor device to a surface of the chassis component.
  • the transfer film can be removed after the transfer and / or application of the sensor device.
  • this can serve to carry the sensor device.
  • the carrier film preferably remains on the sensor device and / or on the chassis component.
  • the sensor device is applied with a multilayer structure to the transfer and / or carrier film and / or produced on the transfer and / or carrier film.
  • the sensor device can have at least two or more layers.
  • several layers of the sensor device are applied successively.
  • a first layer can be applied directly to the transfer and / or carrier film.
  • at least one further layer can be applied to the first layer.
  • further layers in particular in the form of stacks or layers, can be applied to the transfer and / or carrier film and / or the first layer in a similar manner.
  • the use of a transfer and / or carrier film makes it possible to apply the individual layers and / or the sensor device on a plane of the transfer and / or carrier film.
  • the multiple layers are deposited in individual layers on the transfer and / or carrier film and / or on each other. This makes it possible to manufacture the sensor device with high accuracy and low manufacturing tolerances.
  • the multiple layers are applied in reverse order to the transfer and / or carrier film and / or one another.
  • an outermost layer of the sensor device is applied as a first layer to the transfer and / or carrier film.
  • the position specification as the outermost layer refers to an intended arrangement of the sensor device on a chassis component.
  • the outermost layer of the sensor device is at a Arrangement of the sensor device on a chassis component facing away from a surface of the chassis component.
  • an application of the plurality of layers in reverse order is to be understood that, in relation to an arrangement of the sensor device on a chassis component, not the lowest or directly on the surface of the chassis component resting layer is first applied to the transfer and / or carrier film, Instead, the outermost and from the surface of the chassis component facing away layer is first applied to the transfer and / or carrier film. Subsequently, the desired layer-like structure of the sensor device can take place. In particular, at least one further layer is applied to the first layer and / or the transfer and / or carrier film.
  • the first layer and / or the outermost layer may be formed as a protective layer.
  • the protective layer can serve to protect the sensor device against environmental influences and / or damage.
  • the protective layer is formed from a plastic material and / or polymer.
  • the transfer and / or carrier film form an innermost layer on which subsequently at least one or further layers are applied.
  • the last applied layer may be formed as an outermost layer.
  • the transfer and / or carrier film can be arranged directly or directly on the surface of the chassis component.
  • the contact layer serves to provide an electrical contacting of a sensor layer.
  • the sensor layer can be connected to an evaluation device.
  • the contact layer may have electrical conduction regions and / or electrically non-conductive isolation regions. Due to a suitable arrangement of the nonconductive isolation regions and the electrical conduction regions, suitably designed electrical contact points and / or electrical interconnects can be realized in the contact layer for the contacting of the sensor layer.
  • the electrical Leit Schemee see formed and / or manufactured by means of a conductive medium or a conductive ink.
  • the contact layer can be applied as a first layer, inner layer and / or outermost layer directly on the transfer and / or carrier film.
  • the contact layer is applied to a protective layer after the protective layer has been applied to the transfer and / or carrier film as a first layer, inner layer and / or outermost layer.
  • a sensor layer can be applied to the contact layer. If the chassis component or at least a portion of the surface of the chassis component is made of an electrically non-conductive material, in particular of a plastic material and / or a fiber-plastic composite, the sensor device can be arranged on the surface of the chassis component such that the sensor layer directly on the surface of the chassis component rests.
  • a fiber-reinforced plastic composite must therefore be an electrically non-conductive fiber-plastic composite, for example a fiber-reinforced plastic composite (GFRP).
  • GFRP fiber-reinforced plastic composite
  • CFRP carbon fiber plastic composite
  • an insulating layer is provided, which rests directly on the surface of the chassis component, when the sensor device is arranged on the surface of the chassis component.
  • At least one sensor layer is applied to form the sensor device.
  • the sensor layer can be applied directly to the transfer and / or carrier film as a first layer, inner layer or as an outermost layer.
  • the sensor layer can be applied to a previously applied to the transfer and / or carrier film protective layer.
  • the sensor layer is produced as a last layer, an outermost layer or as an innermost layer.
  • the sensor layer is applied to a previously prepared contact layer.
  • the sensor layer may have force-sensitive components.
  • the force-sensitive components are formed as carbon nanotubes. Such carbon nanotubes are also referred to as so-called carbon nanotubes (CNT). In particular, it is here microscopic tubular structures made of carbon.
  • Carbon nanotubes are electrically conductive and also have the property that they change their electrical resistance under mechanical stress, for example, an expansion or compression due to a force. This effect can be used to use carbon nanotubes as force-sensitive components of the sensor device.
  • the carbon nanotubes are part of a plastic matrix.
  • the sensor layer is formed as a plastic matrix with carbon nanotubes.
  • the force sensitive components may be formed as graphene, graphene oxide, carbon black or nanowires.
  • the sensor layer can be arranged directly or indirectly on the surface of the chassis component.
  • the senor layer is formed from a plastic material and / or a polymer, wherein the plastic material and / or the polymer is mixed with the force-sensitive components.
  • At least one insulating layer is applied to form the sensor device.
  • the insulating layer is applied as a last layer.
  • the last layer can also be regarded as an outermost layer or innermost layer.
  • the insulating layer is applied to a sensor layer during manufacture of the sensor device.
  • the insulating layer can be arranged, which isolates the electrically conductive sensor layer relative to an electrically conductive chassis component. Is the chassis component or the surface for arranging the sensor device made of an electrically non-conductive material can be dispensed with the insulating layer.
  • the insulation layer can be applied directly to the surface of the chassis component.
  • the insulating layer may be used as an adhesive layer be educated.
  • at least the sensor layer is applied by means of the transfer and / or carrier film on the already arranged on the chassis component insulation layer.
  • the insulating layer may be formed as an outermost layer, which faces away from the surface of the chassis component in an arrangement of the sensor device on the chassis component and for example, the sensor layer is isolated from the environment and / or protects
  • the sensor device is applied to the transfer and / or carrier film by means of a printing method, a screen printing method or a digital printing method, in particular in layers.
  • a printing method a screen printing method or a digital printing method, in particular in layers.
  • the sensor device can be produced independently of the provision of the chassis component.
  • the sensor device can be completely prefabricated and provided for the arrangement on a chassis component. As a result, the sensor device can be manufactured inexpensively with high accuracy, low manufacturing tolerances and / or mass production.
  • the sensor device is dried and / or cured after application to the transfer and / or carrier film.
  • the applied layer is dried and / or cured.
  • drying and / or curing can be carried out. Only after the last applied layer has been dried and / or cured is the subsequent layer applied. As a result, a high-quality construction of the sensor device can be ensured.
  • the sensor device is applied to the chassis component by means of the transfer and / or carrier film.
  • the sensor device on the transfer and / or carrier The film can be completely formed and / or prefabricated. This considerably reduces the effort required for arranging the sensor device on the chassis component.
  • a side of the sensor device facing away from the transfer and / or carrier film is placed on a surface of the chassis component.
  • This side of the sensor device which is remote from the transfer and / or carrier film, has preferably been produced as a last layer during the production of the sensor device.
  • the side remote from the transfer and / or carrier film side of the sensor device may be formed as an insulating layer or as a sensor layer.
  • the sensor device when arranging the sensor device on the chassis component, the sensor device is arranged between the surface of the chassis component and the transfer and / or carrier film.
  • the transfer and / or carrier film may be facing away from the surface of the chassis component in arranging the sensor device on the chassis component.
  • the sensor device can be arranged and / or applied both on a flat or three-dimensional contoured or curved surface of the chassis component.
  • the transfer and / or carrier film is removed and / or detached from the sensor device.
  • the transfer and / or carrier film can serve or be formed as a carrier material for applying the sensor device on the surface of the chassis component.
  • the transfer and / or carrier film in particular as one or another protective layer, remain on the sensor device.
  • the sensor device is designed to be flexible. This allows the sensor device to adapt to the contour of the surface of the chassis component.
  • the transfer and / or carrier film is placed directly on a surface of the chassis component for arranging the sensor device on the chassis component.
  • the transfer and / or carrier film can be arranged directly on the surface of the chassis component.
  • the transfer and / or carrier film is bonded to the surface, preferably by means of an adhesive bond.
  • the transfer and / or carrier film remains in this case permanently and together with the sensor device on the chassis component.
  • the transfer and / or carrier film is arranged between the surface of the chassis component and the sensor device.
  • On a protective layer between the transfer and / or carrier film and the contact layer and / or the sensor layer can be omitted here.
  • the transfer and / or carrier film can also take over the function of an insulating layer in this case.
  • the sensor device is arranged and / or fixed on the surface of the chassis component by means of pressure and / or under the action of heat.
  • the sensor device is arranged, applied and / or fixed by means of a hot transfer pressure on the surface of the chassis component.
  • a hot stamp can be used.
  • the hot stamp can act directly on the transfer and / or carrier film for arranging the sensor device on the chassis component or contact the transfer and / or carrier film directly.
  • pressure and heat can simultaneously act on the sensor device through the transfer and / or carrier film. In this way, a cohesive, adhesive and / or adhesive connection can be established between the sensor device and the surface of the chassis component.
  • a chassis component with a sensor device is advantageous, which is produced according to a method according to the invention and / or arranged on the chassis component according to a method according to the invention.
  • the sensor device can be connected to an evaluation device, in particular by means of electrical conductors.
  • the sensor device and / or the evaluation unit is direction connected to a power source.
  • an electrical signal and / or a voltage signal in particular of the sensor device and / or the sensor layer, can be converted into a signal which is representative of a measured state change and / or load of the chassis component.
  • the chassis component can be designed as a structural part, handlebar, wheel carrier, joint, a tie rod or a pendulum support.
  • the sensor device produced or arranged in accordance with the method according to the invention is a previously described sensor device.
  • the methods are developed in accordance with all the embodiments explained in connection with the sensor device described here and / or the suspension component described here.
  • the sensor device described here and / or the suspension component described here can be further developed according to all embodiments explained in connection with the method.
  • FIG. 1 is a sectional side view of a sensor device according to the invention
  • Fig. 2 is a plan view of a sensor device according to the invention according to
  • Fig. 3 is a partially sectioned side view of a chassis component according to the invention with the sensor device according to FIGS. 1 and 2, and
  • FIG. 4 shows a schematic flowchart for a method according to the invention.
  • FIG. 1 shows a sectional side view of a sensor device 1 according to the invention.
  • the sensor device 1 is designed to detect a change in state of a chassis component not shown here.
  • the sensor device 1 is arranged on a transfer and / or carrier film 2.
  • the transfer and / or carrier film 2 is formed from a flexible plastic material or polymer.
  • the sensor device 1 is designed to be flexible, whereby the sensor device 1 can adapt to a contour or surface of the chassis component.
  • the sensor device 1 is produced directly on the transfer and / or carrier film 2.
  • the sensor device 1 has a layer-like construction of a plurality of layers 3, 4, 5, 6.
  • the sensor device 1 thus consists of a total of four layers 3, 4, 5, 6 together.
  • the layer 3 is formed in this embodiment as a protective layer.
  • the protective layer 3 is arranged or applied directly on the transfer and / or carrier film 2. In the production of the sensor device 1, the protective layer 3 is applied as a first layer to the transfer and / or carrier film 2.
  • the protective layer 3 represents an outermost layer of the sensor device 1.
  • the protective layer 3 serves to protect the further layers 4, 5 and / or 6 from environmental influences or minimizes the risk of damage.
  • the layer 4 is formed in this embodiment as a contact layer. After the protective layer 3 has been produced, the contact layer 4 is applied to a side of the protective layer 3 facing away from the transfer and / or carrier film 2.
  • the contact layer 4 has electrical conduction regions 7. Furthermore, the contact layer 4 has electrically non-conductive insulation regions 8.
  • the electrical conducting regions 7 are separated from one another by means of the non-conducting insulating regions 8 or are decoupled from each other in electrical terms. In this embodiment, the electrically conductive regions 7 are by means of an electrically conductive ink educated.
  • the non-conductive insulating regions 8 may be formed, for example, from a plastic material or polymer.
  • the contact layer 4 serves to realize an electrical contacting of the layer 5, which is formed in this embodiment as a sensor layer.
  • the sensor layer 5 has been applied to a side of the contact layer 4 facing away from the protective layer 3 or the transfer and / or carrier film 2.
  • the sensor layer 5 has not shown here force-sensitive components. In this embodiment, these force sensitive components are formed as carbon nanotubes. The carbon nanotubes are located in a plastic material or polymer of the sensor layer 5.
  • the layer 6 is formed in this embodiment as an insulating layer. After the sensor layer 5 has been produced, the insulation layer 6 has been applied to a side of the sensor layer 5 facing away from the contact layer 4, the protective layer 3 or the transfer and / or carrier film 2.
  • the insulating layer 6 is electrically non-conductive.
  • the insulating layer 6 is formed of a plastic material or polymer.
  • the sensor layer 5 is also bordered laterally by the insulation layer 6. As a result, the sensor layer 5 is completely encapsulated between the insulating layer 6 and the contact layer 4.
  • the electrically conductive sensor layer 5 is isolated with respect to the surface of an electrically conductive chassis component.
  • the insulating layer 6 is arranged directly on the surface of the chassis component.
  • FIG. 2 shows a plan view of the sensor device 1 according to FIG. 1 according to the invention.
  • the insulation layer 6 is omitted in this illustration.
  • a total of four electrical conduction regions 7 are formed.
  • the electrical conduction regions 7 realize an electrical contact with the sensor layer 5.
  • two electrical conduction regions are respectively arranged on two sides of the sensor layer 5 facing away from one another.
  • the electrical conducting regions 7 are electrically insulated from one another.
  • the electrical conduction regions 7 are electrically in contact only via the sensor layer 5.
  • the electrical conductive areas 7 are connected by means not shown here electrical conductors or conductors with a likewise not shown here evaluation. Furthermore, by means of the electrical conductive areas 7, the connection with a power source not shown here can be realized.
  • FIG. 3 shows a partially cutaway side view of a chassis component 9 according to the invention with the sensor device 1 according to the invention.
  • the transfer and / or carrier film 2 has been removed or removed after arranging the sensor device 1 on a surface 10 of the chassis component 9.
  • the position and positioning of the sensor device 1 is merely exemplary here.
  • the sensor device 1 can also be arranged on the chassis component 9 at a location other than that shown here or in a different orientation than shown here.
  • the chassis member 9 is formed as a tie rod. Accordingly, the chassis component 9 is formed substantially rod-shaped or rod-like. In this case, the chassis component 9 has a thread 11 in the region of a first end. The thread 11 serves to connect the chassis component 9 to, for example, a further link section or to a connection component. At one end remote from the thread 11, the chassis component 9 has a ball joint 12.
  • the ball joint 12 has a joint ball 13, which is accommodated in a joint housing 14 with a connecting thread 15.
  • FIG. 4 shows a schematic flow diagram for a method according to the invention.
  • a transfer and / or carrier film 2 is provided in accordance with step S11.
  • the sensor device 1 is arranged or produced on the transfer and / or carrier film 2 in accordance with step S12.
  • the layers 3, 4, 5, 6 are applied successively to the transfer and / or carrier film 2.
  • the application of the individual layers 3, 4, 5, 6 takes place by means of a screen printing method or a digital printing method.
  • the sensor device is applied to the chassis component 9 by means of the transfer and / or carrier film 2 in accordance with step S13.
  • a side facing away from the transfer and / or carrier film 2 side or the insulating layer 6 is placed on the surface 10 of the chassis component 9.
  • the sensor device 1 is arranged between the surface 10 of the chassis component 9 and the transfer and / or carrier film 2.
  • the sensor device 1 is fixed on the surface 10 of the chassis component 9 by means of pressure and / or under the action of heat.
  • the application of the sensor device 1 from the transfer and / or carrier film 2 to the surface 10 takes place by means of a hot transfer pressure.
  • the transfer and / or carrier film 2 is removed from the sensor device 1 or replaced.
  • the transfer and / or carrier film 2 itself can be applied directly or directly to the surface 10 of the chassis component 9.
  • the transfer and / or carrier film 2 can be bonded to the surface 10 with a material fit.
  • the transfer and / or carrier film 2 thus remains permanently on the chassis component 9.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un dispositif de détection (1) pour un composant de châssis (9), le dispositif de détection (1) étant conçu pour détecter une modification d'état du composant de châssis (9). L'invention vise à simplifier l'agencement du dispositif de détection (1) sur le composant de châssis (9) et/ou la fabrication du dispositif de détection (1). A cet effet, le procédé est caractérisé en ce que le dispositif de détection (1) est disposé sur une feuille de transfert et/ou de support (2).
PCT/EP2019/056095 2018-04-12 2019-03-12 Procédé de fabrication d'un dispositif de détection, procédé d'agencement d'un dispositif de détection et composant de châssis équipé d'un dispositif de détection WO2019197102A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018205552.1 2018-04-12
DE102018205552.1A DE102018205552A1 (de) 2018-04-12 2018-04-12 Verfahren zum Herstellen einer Sensoreinrichtung, Verfahren zum Anordnen einer Sensoreinrichtung sowie Fahrwerkbauteil mit einer Sensoreinrichtung

Publications (1)

Publication Number Publication Date
WO2019197102A1 true WO2019197102A1 (fr) 2019-10-17

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PCT/EP2019/056095 WO2019197102A1 (fr) 2018-04-12 2019-03-12 Procédé de fabrication d'un dispositif de détection, procédé d'agencement d'un dispositif de détection et composant de châssis équipé d'un dispositif de détection

Country Status (2)

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DE (1) DE102018205552A1 (fr)
WO (1) WO2019197102A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019204177B4 (de) 2019-03-26 2022-08-04 Zf Friedrichshafen Ag Sensoreinrichtung zum Messen einer momentanen Belastung eines Bauteils sowie Bauteil und/oder Fahrwerkbauteil mit einer solchen Sensoreinrichtung

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Publication number Priority date Publication date Assignee Title
EP2208461A1 (fr) * 2009-01-20 2010-07-21 Leonh. Lang Bioélectrode
DE102010054970A1 (de) * 2010-12-09 2012-06-14 Hydac Electronic Gmbh Vorrichtung zum Wandeln einer Dehnung und/oder Stauchung in ein elektrisches Signal, insbesondere Dehnungsmessfolie
DE102014200443A1 (de) * 2014-01-13 2015-07-16 Technische Universität Dresden Sensorelement zur Bestimmung von Dehnungen
DE102014223657A1 (de) 2014-11-20 2016-05-25 Zf Friedrichshafen Ag Mechanisches Bauteil mit einem Kraftsensor
DE102016204557A1 (de) * 2016-03-18 2017-09-21 Zf Friedrichshafen Ag Sensoreinrichtung, Messeinrichtung, Kraftfahrzeug und Verfahren zum Erfassen einer momentanen Verformung eines Bauteils

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US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
DE4024128A1 (de) * 1990-07-30 1992-02-13 Hottinger Messtechnik Baldwin Verfahren zum herstellen und applizieren eines dehnungsmessstreifens
DE4236985C1 (de) * 1992-11-04 1994-02-24 Hottinger Messtechnik Baldwin Dehnungsmeßstreifen
JP2007271285A (ja) * 2006-03-30 2007-10-18 Millenium Gate Technology Co Ltd ひずみゲージの製造方法
DE102006061798A1 (de) * 2006-12-21 2008-06-26 Simons, Gisela Verfahren zur Anbringung von Kennzeichen auf Substratoberflächen mit Hilfe eines Transferverfahrens
US8698645B2 (en) * 2010-10-19 2014-04-15 Palo Alto Research Center Incorporated Method for event sensing employing a printed event sensor

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
EP2208461A1 (fr) * 2009-01-20 2010-07-21 Leonh. Lang Bioélectrode
DE102010054970A1 (de) * 2010-12-09 2012-06-14 Hydac Electronic Gmbh Vorrichtung zum Wandeln einer Dehnung und/oder Stauchung in ein elektrisches Signal, insbesondere Dehnungsmessfolie
DE102014200443A1 (de) * 2014-01-13 2015-07-16 Technische Universität Dresden Sensorelement zur Bestimmung von Dehnungen
DE102014223657A1 (de) 2014-11-20 2016-05-25 Zf Friedrichshafen Ag Mechanisches Bauteil mit einem Kraftsensor
DE102016204557A1 (de) * 2016-03-18 2017-09-21 Zf Friedrichshafen Ag Sensoreinrichtung, Messeinrichtung, Kraftfahrzeug und Verfahren zum Erfassen einer momentanen Verformung eines Bauteils

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