WO2019186775A1

WO2019186775A1 - Vapor deposition mask and method for manufacturing vapor deposition mask

Info

Publication number: WO2019186775A1
Application number: PCT/JP2018/012777
Authority: WO
Inventors: 山渕　浩二
Original assignee: シャープ株式会社
Priority date: 2018-03-28
Filing date: 2018-03-28
Publication date: 2019-10-03

Abstract

A vapor deposition mask (10) is a fine metal mask (FMM) for depositing vapor deposition particles onto a plurality of pixels, wherein physical treatment by means of laser irradiation is applied to at least one of two end sections of a mask sheet (15) in the width direction, along the longitudinal direction, thereby forming adjustment sections (A-D) such as a depression or a through-hole.

Description

Vapor deposition mask and method of manufacturing vapor deposition mask

The present invention relates to a vapor deposition mask and a method for manufacturing the vapor deposition mask.

As shown in FIG. 14 (a), a plurality of cover sheets 112 and a plurality of howling sheets 113, each of which is in the form of a sheet, are orthogonal to each other on a frame-like mask frame 111 having a frame opening 111a. Attach to

When the plurality of cover sheets 112 and the plurality of howling sheets 113 are attached to the mask frame 111, both ends thereof are welded to the mask frame 111 while stretching both ends outward (while pulling).

Accordingly, the plurality of cover sheets 112 are attached to the mask frame 111 so as to be parallel to the short direction (left and right direction on the paper surface) perpendicular to the longitudinal direction (up and down direction on the paper surface) of the mask frame 111. A plurality of howling sheets 113 are attached to the mask frame 111 so as to be parallel to the longitudinal direction of the mask frame 111.

Next, the alignment sheet 114 on which the alignment mark is formed is attached to the mask frame 111 along the short side of the frame opening 111a so that the alignment mark is at a predetermined position.
Then, a plurality of strip-shaped mask sheets 115 are welded to the mask frame 111 in the vicinity of both ends while stretching both ends outward (pulling) with the alignment mark as a reference.

A plurality of effective portions 115 a are formed on the mask sheet 115. The effective portion 115a is a region in which a plurality of vapor deposition holes for vapor depositing a vapor deposition layer are formed side by side for each pixel of the vapor deposition substrate.

In the example of FIG. 14, the effective portion 115a has a shape corresponding to the active region of the deposition target substrate.

As shown in FIG. 14, the plurality of mask sheets 115 are stretched and welded so that the effective portions 115a are included in all the openings defined by the plurality of cover sheets 112 and the plurality of howling sheets 113. . Then, unnecessary portions outside the welded portions of each of the plurality of mask sheets 115 are cut. Thereby, the vapor deposition mask 110 is completed.

When performing vapor deposition using the vapor deposition mask 110, vapor deposition particles evaporated or sublimated from the vapor deposition source pass through the vapor deposition holes of the effective portion 115a and adhere to the pixels of the vapor deposition substrate. The vapor deposition particles adhering to this pixel become the light emitting layer.

Therefore, the effective portion 115a has a shape corresponding to the active region of the deposition target substrate, and is patterned in a region having a smaller area than the opening defined by the plurality of cover sheets 112 and the plurality of howling sheets 113. Is formed. The position where the light emitting layer is deposited on the evaporation target substrate is determined by the position of the opening pattern provided in each evaporation hole in the evaporation mask, and the outer shape of the active region where the light emitting layer is evaporated on the evaporation target substrate is the effective portion 115a. It depends on the external shape.

As described above, the mask sheet 115 on which the effective portion 115a is formed has a plurality of vapor deposition holes corresponding to the pixels, and therefore needs to be attached to the mask frame 111 with high positional accuracy.

According to the mask sheet 115, since the effective portion 115a is rectangular, even when an outward force is applied to the end of the mask sheet 115 when the mask sheet 115 is attached to the mask frame 111, it is applied to the periphery of the effective portion 115a. The stress can be easily made uniform, and the mask sheet 115 can be attached to the mask frame 111 with relatively high positional accuracy.

Japanese Patent Publication “JP 2012-132096”

It is difficult to manufacture a plurality of strip-shaped mask sheets (Fine Metal） Mask sheet) with homogeneous materials and homogeneous etching conditions. As a result, the conventional vapor deposition mask has a problem that it is difficult to satisfy the accuracy required for the vapor deposition mask because the mask sheet is curved or undulated when the mask sheet is stretched. .

One aspect of the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a vapor deposition mask and a vapor deposition mask manufacturing method capable of eliminating curvature, undulation, and the like that occur when a mask sheet is stretched. Is to provide.

In order to solve the above problems, an evaporation mask according to one embodiment of the present invention is formed with an adjustment portion that is physically treated by laser irradiation along at least one of both end portions in the width direction along the longitudinal direction. Has been.

In order to solve the above-described problem, the method for manufacturing a vapor deposition mask according to one aspect of the present invention includes the following steps (a) to (c).

(A) a step of stretching the mask sheet in the longitudinal direction;
(B) a step of irradiating at least one of both end portions in the width direction of the mask sheet; and (c) a step of welding a pixel mask to the mask sheet.

According to the above aspect of the present invention, when the mask sheet is stretched, it is possible to achieve the accuracy required for the vapor deposition mask even if the mask sheet swells, etc., and to improve the yield efficiency of the mask sheet of the vapor deposition mask. It is possible to provide a vapor deposition mask that can be improved and a method for manufacturing the vapor deposition mask.

It is a figure showing the structure of the organic electroluminescence display which concerns on this embodiment. It is a figure showing the manufacturing process of the organic electroluminescence display panel which concerns on this embodiment. It is a top view of the board | substrate of the organic electroluminescence display panel which concerns on this embodiment. It is sectional drawing of the organic electroluminescent display panel formation area of the board | substrate of FIG. It is a schematic diagram which shows the mode of the vapor deposition process at the time of forming the light emitting layer of the organic electroluminescence display which concerns on this embodiment. It is the figure which expanded a part of active area 3 of this embodiment. It is a figure showing the vapor deposition process of the light emitting layer in the organic electroluminescence display panel which concerns on this embodiment. It is a figure showing a mode that the vapor deposition mask which concerns on this embodiment is produced. It is a figure showing the structure of the mask sheet | seat of this embodiment. It is a figure which shows the state before pulling the mask sheet of this embodiment to a longitudinal direction. When the mask sheet of this embodiment is curving so that it may become convex upward, it is a figure explaining how curvature lose | disappears. It is a case where the mask sheet of this embodiment is curving, Comprising: It is a figure which illustrates the case where an adjustment part is formed in two places. It is a figure which is a case where the mask sheet | seat of this embodiment undulates in S shape, Comprising: The case where an adjustment part is formed in two places. The state which is producing the conventional vapor deposition mask is represented, (a) is a figure showing a mode that the mask sheet | seat is attached to the mask frame, (b) is a top view showing the produced vapor deposition mask.

Hereinafter, an embodiment of the present invention will be described in detail.

(Configuration of electronic device 30)
FIG. 1A is a perspective view illustrating an appearance of an electronic apparatus 30 in which an organic EL display device according to an embodiment of the present invention is used, and FIG. 1B is a cross-sectional view of FIG. An example of the electronic device 30 is a smartphone. However, the electronic device 30 is not limited to a smartphone, and may be any electronic device in which the organic EL display panel 42 is incorporated, such as other mobile information terminals such as a mobile phone terminal or a tablet, a television receiver, a personal computer, or the like. .

The electronic device 30 has a housing 32. And the electronic device 30 has the touch panel 40, the speaker 34, the camera 36, and the microphone which are not shown in figure provided in the housing | casing 32, respectively. In addition, the electronic device 30 may have various buttons such as a power button for switching power on and off.

The touch panel 40 includes a touch sensor 41 and an organic EL display panel 42. The organic EL display panel 42 has an irregular display area 43 for displaying various images. The organic EL display panel 42 includes a display area 43 and a frame area surrounding the display area 43. An organic EL display device (display device) is configured by attaching various components to the organic EL display panel 42.

The touch sensor 41 is provided on the organic EL display panel 42. The touch sensor 41 is an input device that receives an input of a coordinate position on the organic EL display panel 42 from a user by detecting an input operation by contact or proximity of a finger, a stylus pen, or the like.

The touch sensor 41 may be formed integrally with the organic EL display panel 42, or may be formed as a configuration different from the organic EL display panel 42. The touch sensor 41 may be any method that can accept an input operation from the user, such as a capacitance method or an infrared method.

(Outline of manufacturing method of organic EL display panel)
FIG. 2 is a diagram illustrating a manufacturing process of the organic EL display panel according to the embodiment. FIG. 3 is a plan view of the substrate 1 of the organic EL display panel according to the embodiment of the present invention. FIG. 4 is a cross-sectional view of the organic EL display panel formation region of the substrate of FIG. FIG. 3 shows a configuration in the case where 18 organic EL display panels are cut from a single mother glass. The number of chamfered organic EL display panels from one mother glass is not limited to 18 and may be 17 or less, or 19 or more.

Eighteen organic EL display panel forming regions 9 are arranged on the substrate 1. The organic EL display panel formation region 9 is a region that becomes an organic EL display panel after being cut into pieces by being cut out from the mother glass.

The substrate 1 includes a TFT substrate (deposition substrate) 2, an active region 3, a frame bank 4, and a sealing layer 5.

A plurality of active regions 3 are provided in a matrix. The active area 3 is an area where, for example, RGB pixels are formed. Of the organic EL display panel formation region 9, the region where the active region 3 is formed is the display region 43. Of the organic EL display panel formation region 9, the surrounding region surrounding the active region 3 is the frame region 44. . In FIG. 3, the frame area 44 is an area outside the area (active area 3) indicated by the broken line in the organic EL display panel forming area 9.

As shown in FIGS. 2 to 4, first, the TFT substrate 2 is manufactured in the TFT step S11. The TFT substrate 2 forms a film serving as a base of a flexible substrate with a material such as polyimide on mother glass. On this film, TFTs (transistors, drive elements), gate wirings and source wirings, and other various wirings included in the pixel circuit arranged in each pixel are formed by a known method, a passivation film (protective film), and An interlayer insulating film (planarization film) or the like is formed. Further, the pixel electrode (edge cover) for defining the reflective electrode layer in contact with the anode, the ITO layer, and the light emitting region is formed on the inorganic insulating film. As a result, a light emitting region is formed in the active region 3.

The passivation film prevents peeling of the metal film in the TFT and protects the TFT. The passivation film is formed on the mother glass or through another layer, and covers the TFT. The passivation film is an inorganic insulating film made of silicon nitride, silicon oxide, or the like.

The interlayer insulating film flattens the unevenness on the passivation film. The interlayer insulating film is formed on the passivation film. The interlayer insulating film is an organic insulating film made of a photosensitive resin such as acrylic or a thermoplastic resin such as polyimide.

Further, when the active region 3 is formed, a frame bank 4 surrounding the active region 3 in a frame shape is also formed on the TFT substrate 2. The frame bank 4 is made of a photosensitive resin such as acrylic or a thermoplastic resin such as polyimide.

Next, in the organic EL step S12, an organic EL layer is formed on the reflective electrode layer in each pixel of the TFT substrate 2 (that is, in the opening of the pixel bank formed in the TFT step S11). The organic EL layer includes a light emitting layer, a hole transport layer, and other functional layers. The light emitting layer emits light of different colors such as red, green, or blue for each pixel. A layer (evaporation layer) deposited for each pixel such as a light-emitting layer and a hole transport layer is formed at a predetermined position of each pixel by vapor deposition using a vapor deposition mask according to the present embodiment in a vacuum in a vapor deposition process. Is done.

A vapor deposition mask used in a vapor deposition step for forming a vapor deposition layer deposited for each pixel such as a light emitting layer and a hole transport layer is prepared in advance by a vapor deposition mask production step S20 before the vapor deposition step. Details of the deposition mask manufacturing step S20 will be described later. Moreover, the layer formed using this vapor deposition mask is not limited to the light emitting layer and the hole transport layer, and may be a layer formed for each pixel (that is, in the opening of the pixel bank). Then, a transparent electrode facing the reflective electrode through the organic EL layer is formed so as to cover the organic EL layer.

Next, the sealing layer 5 is formed in sealing process S13. As an example, the sealing layer 5 may have a three-layer structure in which an inorganic film 6, an organic film 7, and an inorganic film 8 are stacked in this order from the TFT substrate 2 side. Since the frame-like bank 4 is formed, the organic film 7 can be formed to a thickness of, for example, 1.0 μm or more.

After forming this sealing layer 5, flexible process S14 is performed. In flexible process S14, the film etc. which peel the glass of a board | substrate and become a support body are affixed.

Next, in the individualization step S15, each organic EL display panel forming region 9 is cut out. Thereby, each organic EL display panel formation region 9 is separated into pieces. Thereby, a flexible and odd-shaped display panel (organic EL display panel) is formed.

Next, in a mounting step S <b> 16, a member such as a driver is mounted on each of the separated organic EL display panel formation regions 9. Thereby, an organic EL display device is completed.

In the present embodiment, since the active region 3 is an irregular shape other than a rectangle or a square, for example, the outer shape of the display panel is also irregular according to the shape of the active region 3.

FIG. 5 is a schematic diagram showing a state of a vapor deposition process when forming a vapor deposition layer of the organic EL display device according to the embodiment of the present invention.
In the vapor deposition process for depositing the vapor deposition layer, the vapor deposition mask 10 provided with the mask sheet 15 having a plurality of through holes is closely attached to the TFT substrate 2, and the vapor deposition particles Z (for example, evaporated by the vapor deposition source 70 in a vacuum) Organic light-emitting material) is deposited on the pixels of the TFT substrate 2 through the mask sheet 15. Thereby, a vapor deposition pattern having a pattern corresponding to the through hole of the mask sheet 15 is formed on the TFT substrate 2.

FIG. 6 is an enlarged view of a part of the active region 3 of the embodiment. In the active area 3, pixels pix contributing to image display are arranged in a matrix. A light emitting layer 80 is formed in the pixel pix. A peripheral area surrounding the pixel pix is a pixel bank bk.

As an example, in FIG. 6, a red pixel Rpix having a red light emitting layer 80R that emits red light, a green pixel Gpix having a green light emitting layer 80G that emits green light, and a blue light emitting layer 80B that emits blue light. A blue pixel Bpix having a pen tile arrangement. However, the pixel arrangement is not particularly limited to the pen tile arrangement, and may be another arrangement such as a stripe arrangement.

The shape of the light emitting layer 80 is the shape of the opening of the pixel bank bk in which the light emitting layer 80 is formed.

(Deposition mask)
Next, a deposition mask manufacturing process S20 used in the deposition process will be described.
FIG. 7 is a diagram illustrating a vapor deposition step of the light emitting layer in the organic EL display panel according to the embodiment. FIG. 8 is a diagram illustrating a state in which the vapor deposition mask according to the embodiment is manufactured. FIG. 8A is a plan view of the mask frame. FIG. 8B is a diagram illustrating a state in which the cover sheet is attached to the mask frame. FIG. 8C is a diagram illustrating a state where a howling sheet is attached to the mask frame. FIG. 8D is a diagram illustrating a state in which the alignment sheet is attached to the mask frame. FIG. 8E is a diagram illustrating a state in which the mask sheet is attached to the mask frame. FIG. 8F is a plan view of the produced deposition mask.

As shown in step Sa of FIG. 7 and FIGS. 8A and 8B, a plurality of cover sheets 12 are attached to a frame-shaped mask frame 11 having a frame opening 11a in a region surrounded by the frame.

(Cover sheet attachment process)
The mask frame 11 is made of, for example, an invar material having a thickness of 20 mm to 30 mm with very little thermal expansion as a base material. The mask frame 11 is sufficiently thicker than the mask sheet and has high rigidity so that sufficient accuracy can be secured even when the mask sheet is stretched and welded.

The cover sheet 12 plays a role of filling a gap between mask sheets to be attached to the mask frame 11 later or closing a dummy pattern formed on the mask sheet.

In the cover sheet 12, for example, an invar material having a thickness of 30 μm to 50 μm is used as a base material. The cover sheet 12 has an elongated shape and extends linearly from one end to the other end.

When the cover sheet 12 is attached to the mask frame 11, as shown by the arrow F1 in FIG. 8B, the cover sheet 12 is stretched by applying a force in the outward direction (the direction away from each other) to both ends of the cover sheet 12. While (pulling), both ends of the cover sheet 12 are welded into grooves provided in the mask frame 11. And the unnecessary part outside a welded part in the cover sheet 12 is cut.

Thereby, each cover sheet 12 is attached to a predetermined position of the mask frame 11. In the present embodiment, each cover sheet 12 is attached to the mask frame 11 so as to be parallel to the short side direction of the mask frame 11. Each cover sheet 12 is attached to the mask frame 11 so as to be parallel to each other along the long side of the mask frame 11.

Next, as shown in step Sb of FIG. 7 and (c) of FIG. 8, a howling sheet 13 (also called a support sheet) is attached to the mask frame 11 to which the cover sheet 12 is attached (howling sheet attaching step).

The howling sheet 13 plays a role of supporting a mask sheet to be attached to the mask frame 11 so as not to be loosened.

In the howling sheet 13, for example, an invar material having a thickness of 30 μm to 100 μm is used as a base material. The width of the howling sheet 13 is, for example, about 8 mm to 10 mm, and is determined by the layout on the substrate on which the panel is arranged. The howling sheet 13 has an elongated shape, and extends linearly from one end to the other end.

Usually, in a portrait-shaped display panel, since the terminal portion is masked by a howling sheet, the width of the howling sheet is wider than that of the cover sheet. However, the howling sheet has a display area (that is, a mask sheet). Are arranged at positions that do not overlap.

When the howling sheet 13 is attached to the mask frame 11, it is as follows. That is, both ends of the howling sheet 13 are stretched (tensioned) by applying a force in an outward direction (a direction away from each other) to each end of the howling sheet 13 (see arrow F2 in FIG. 8C). Is welded into a groove provided in the mask frame 11. And the unnecessary part outside a welded part in the howling sheet 13 is cut. Thereby, each howling sheet 13 is attached to a predetermined position of the mask frame 11.

In the present embodiment, each howling sheet 13 is attached to the mask frame 11 so as to be parallel to the long side of the mask frame 11. The howling sheets 13 are attached to the mask frame 11 so as to be parallel to each other in the short-side direction of the mask frame 11.

The order of attaching the cover sheet 12 and the howling sheet 13 to the mask frame 11 is reversed (replacement of the steps Sa and Sb in FIG. 7), and the howling sheet 13 is first attached to the mask frame 11. Then, you may attach the cover sheet | seat 12 next.

As shown in FIG. 8C, by attaching a plurality of cover sheets 12 and a plurality of howling sheets 13 to the mask frame 11 in a lattice pattern, the cover sheets 12 facing each other and the howling sheets facing each other. 13 are formed side by side.

Next, as shown in step Sc of FIG. 7 and FIG. 8D, the alignment sheet 14 on which the alignment mark is formed is attached to the mask frame 11 so that the alignment mark is at a predetermined position (alignment sheet attaching step). ).
When the alignment sheet 14 is attached to the mask frame 11, the following is performed. That is, force is applied to both ends of the alignment sheet 14 in the outward direction (the direction away from each other) and in the direction parallel to the short direction of the mask frame 11 (see the arrow F3 in FIG. 8D). While being stretched (pulled), the welding is performed at a predetermined position of the mask frame 11.

Then, an unnecessary portion outside the welded portion in the alignment sheet 14 is cut. Thereby, each alignment sheet 14 is attached to a predetermined position of the mask frame 11. In the present embodiment, the two alignment sheets 14 are attached to the mask frame 11 so as to be parallel to each other along the short side of the frame opening 11 a of the mask frame 11.

Next, as shown in step Sd of FIG. 7 and (e) of FIG. 8, a plurality of mask sheets 15 are attached to the mask frame 11 (mask sheet attaching step). The mask sheet 15 is a sheet for separately coating each of RGB, for example, in order to form a deposition layer in the pixels in the active region 3 shown in FIGS. 3 and 4.

Before this step Sd, as the step S101, before attaching the mask sheet 15 to the mask frame 11, the effective portion YA is formed in the mask sheet 15 by forming the vapor deposition holes in a square or rectangular shape (effective). Part forming step). The effective portion YA has an area so as to extend over the plurality of active regions 3, i.e., overlap with the plurality of active regions 3. Details of the structure of the effective portion YA will be described later.

In step Sd, as shown by an arrow F4 in FIG. 8E, when attaching the mask sheet 15 to the mask frame 11, a force is applied to each of both end portions of the mask sheet 15 in an outward direction (a direction away from each other). It will be stretched. While stretching (pulling) in this way, both ends of the mask sheet 15 are mask frames so that the vapor deposition holes constituting the effective portion YA are at predetermined positions with reference to the alignment marks formed on the alignment sheet 14. 11 is accurately welded to a predetermined position.

Further, when the mask sheet 15 is stretched and welded, it is stretched and welded while applying a counter force to the mask frame 11 in accordance with the amount of deformation of the mask sheet 15 after stretching and welding.

Then, as shown in FIG. 8 (f), the mask sheet 15 is masked for all necessary sheets so that the openings defined by the cover sheet 12 and the howling sheet 13 are all covered with the effective portion YA. After attaching the sheet 15 to the mask frame 11, as shown in step Se of FIG. 7 and (f) of FIG. 8, an unnecessary portion outside the welded portion of each mask sheet 15 is cut.

Next, as shown in step Sf of FIG. 7, the completed vapor deposition mask 10 is cleaned, and various mask inspections such as foreign matter inspection and accuracy inspection are performed. Thereafter, the vapor deposition mask 10 having no problem in the mask inspection is stored in a stocker and supplied to a vapor deposition apparatus used in the vapor deposition process as necessary.

(Effective part YA)
FIG. 9 is a diagram illustrating the configuration of the mask sheet 15. 9A is a plan view of the mask sheet 15, FIG. 9B is an enlarged view of the effective portion shown in FIG. 9A, and FIG. FIG. 9B is a sectional view taken along line BB shown in FIG. 9B, and FIG. 9D is a sectional view taken along line CC shown in FIG.

An effective portion YA extending in the longitudinal direction of the mask sheet 15 is formed between both end portions of the mask sheet 15. In the effective portion YA, a plurality of vapor deposition holes H (openings) corresponding to the pixels are formed.

The outer shape of the effective portion YA is not an irregular shape so that the stress is as uniform as possible, but is a square or a rectangle. In the present embodiment, the effective portion YA has a rectangular outer shape. The effective portion YA has an area that overlaps the plurality of active regions 3 of the TFT substrate 2.

When the light emitting layer is vapor-deposited on the TFT substrate through the mask sheet 15, the vapor deposition hole H corresponds to the formation region of the light emitting layer that emits light of any color among the colors emitted by the light emitting layer in the effective portion YA. Is formed. For example, when a light emitting layer that emits red light, a light emitting layer that emits green light, and a light emitting layer that emits blue light are formed in the active region 3, the vapor deposition hole H emits light that emits red light. The light emitting layer that emits green light and the light emitting layer that emits blue light are formed in the same pattern as the light emitting layer.

In the mask sheet 15, in step S <b> 101 shown in FIG. 7, for example, vapor deposition holes are formed in the sheet portion 15 a as follows.

First, a negative or positive photosensitive resist material is applied to both surfaces of a sheet portion 15a which is a long plate made of an invar material or the like, and a resist film is formed on both main surfaces (first surface and second surface). .

Next, a resist pattern is formed on both surfaces of the sheet portion 15a by exposing and developing the resist films on the first surface and the second surface using an exposure mask. Next, using the first surface resist pattern as a mask, the first surface 15b of the effective portion YA (the surface facing the TFT substrate 2 during vapor deposition) is etched (the upper surface of the edge portion is not etched), and the first surface 15b of the effective portion YA is etched. An opening K is formed in a pattern. At this stage, the vapor deposition hole does not penetrate.

Next, the first surface 15b is covered with a resistant resin having etching resistance, and the second surface 15c (surface opposite to the surface facing the TFT substrate 2 at the time of vapor deposition) is used as a mask to form the effective portion YA and the edge portion. Etch the lower surface of. Thereby, in the effective portion YA, the vapor deposition hole H (through hole) is formed by erosion from the second surface 15c side, and a plurality of dents are formed on the lower surface of the edge portion.

The plurality of vapor deposition holes H of the effective portion YA are formed in a matrix shape or an oblique lattice shape in the longitudinal direction and the short direction (width direction) of the mask sheet 15, and the opening K (opening on the upper surface) is a pixel on the substrate. A square shape with rounded corners, a circular shape, or an elliptical shape is formed so as to correspond to the opening shape of the bank layer. In the effective portion YA, etching is performed on the second surface 15c side more extensively and deeply than the first surface 15b side with respect to each vapor deposition hole H, so that a shadowed portion (the partition height between two adjacent vapor deposition holes is high). And the deposition accuracy and deposition efficiency for the substrate are increased.

In the effective portion YA, when the cross section is taken along the line BB passing through the centers of the two openings K adjacent in the horizontal direction, the base material is minimum (the cavity is maximum) as shown in FIG. When the cross section is taken along the CC line parallel to the BB line, passing through a point equidistant from the two openings K adjacent in the vertical direction, the base material is maximum as shown in FIGS. The structure (maximum thickness is the thickness Ti of the base material) is obtained.

Thereby, the mask sheet 15 for stretching and welding to the mask frame 11 ((e) of FIG. 8) is produced.

(Disappearance of deposition mask curvature and undulation)
Here, the disappearance of the curvature and undulation generated in the vapor deposition mask will be described below with reference to FIGS.

The vapor deposition mask is an FMM (Fine Metal Mask) for depositing vapor deposition particles on a plurality of picture elements. This vapor deposition mask is welded while accurately stretching a number of strip-shaped mask sheets 15 (see FIG. 8), but it is not easy to manufacture under uniform conditions.

In addition, when stretching, both ends in the longitudinal direction of the mask sheet 15 (or the vicinity thereof) are gripped at two or more locations (not shown), and the opening positions are set at predetermined positions. The mask sheet 15 is pulled while adjusting the tension so as to come to.

At this time, the rigidity changes according to the film thickness and the opening state, and the mask sheet 15 is bent or wavy during stretching (see, for example, FIGS. 11 to 13). For example, the mask sheet 15 undulates into an S shape (see FIG. 13), or bends into a W shape or an M shape (not shown).

This is due to the following reason. In other words, the etching is not performed uniformly in the stick-shaped surface due to variations in the raw material and etching. Therefore, the mask sheet 15 (FMM sheet) has a portion where the film thickness is thin (the opening is large) and a portion where the film thickness is thick (the opening is small). For this reason, rigidity changes according to the thickness (size of opening) of the film thickness, and the mask sheet 15 undulates during stretching.

If the etching is performed uniformly and the mask sheet 15 is pulled in the longitudinal direction, the mask sheet 15 extends straight in the longitudinal direction (see FIG. 10). However, in reality, for the reasons described above, the thickness of the mask sheet 15 in the vertical direction (width direction perpendicular to the longitudinal direction, in other words, the direction perpendicular to the pulling direction) becomes thin or thick. As described above, when the thickness of the mask sheet 15 is uneven, the rigidity is changed accordingly, and the mask sheet 15 is bent or bent.

Under such circumstances, the mask sheet 15 is stretched when a portion where the thickness is thin is pulled, whereas it is difficult to stretch even when a portion where the thickness is thick is pulled. If the mask sheet 15 is pulled in such a state, the mask sheet 15 does not extend in a predetermined direction, and is curved or wavy.

For example, in the case of a stick whose mask sheet 15 exceeds 1 meter, if it is pulled, it will be stretched or bent by only a few microns to a few tens of microns, although it is an amount that cannot be seen with the eyes. This causes a minute difference in thickness (size of opening), a difference in finish, and the like in the mask sheet 15. For example, in the mask sheet 15, a portion having a low rigidity (a portion having a small thickness (a large opening)) extends well, and a portion having a high rigidity (a portion having a thick thickness (a small opening)) hardly extends. As a result, the mask sheet 15 is curved or undulated.

As described above, when the mask sheet 15 is curved or undulated, and when the curve or undulation is not adjusted by pulling the mask sheet 15, it is not expected to realize a highly accurate vapor deposition mask. In addition, since the mask sheet 15 is pulled only in the longitudinal direction, it is possible to make a general adjustment using grips on the upper and lower sides (width direction perpendicular to the longitudinal direction) of the vapor deposition mask (FMM).

For example, as shown in FIG. 11, when the mask sheet 15 is curved so as to protrude upward, and the mask sheet 15 is pulled in the longitudinal direction, the grip (not shown) Pull strongly and pull the upper side weakly. Thereby, the disappearance of the curvature may be possible.

However, for example, as shown in FIG. 13, when the mask sheet 15 undulates in an S shape or bends in a W shape / M shape (not shown), there is a limit to adjusting with the grip alone. There is.

Therefore, the following measures are taken in the vapor deposition mask of the present embodiment. That is, as shown in FIG. 11 to FIG. 13, physical treatment is performed by laser irradiation or the like along the longitudinal direction at least one end portion or the vicinity thereof in both ends of the width direction of the mask sheet 15 or in the vicinity thereof. The adjustment part to which is given is formed.

Examples of the adjustment unit include the following. That is, at least one end portion of the mask sheet 15 in the width direction or the vicinity thereof, or the vicinity thereof, is irradiated with a laser to form an adjustment portion that has been subjected to physical processing.

Specifically, this adjustment unit damages the laser irradiation site to make a laser mark, forms a convex or concave portion at the irradiation site, or forms a minute opening (through hole) at the laser irradiation site. It can be realized by doing. More preferably, a concave portion is formed at the irradiation site, and most preferably, a very small through hole is formed.

Regarding the number of places where the adjustment part is formed, the number is formed at both ends in the width direction of the place where the panel is formed or in the vicinity thereof, and formed between the display panel and the display panel. It is preferable that the number formed between the panels is larger than the number formed.

For example, when the mask sheet 15 is curved, as shown in FIG. 12, the adjustment part A and the adjustment part B are formed so as not to overlap in the width direction of the mask sheet 15. The adjustment unit A and the adjustment unit B can be formed so as to overlap each other.

Similarly, when waviness is generated in the mask sheet 15, the following can be said. That is, as shown in FIG. 13, the adjustment portion C and the adjustment portion D are provided at the end portion (or the vicinity thereof) near the center of curvature and the end portion (or the vicinity thereof) far from the center of curvature in the curved portion of the mask sheet 15. Are formed so as not to overlap each other in the width direction of the mask sheet 15.

In both the cases of FIGS. 12 and 13, since the number of adjustment portions is larger than in the case of FIG. 11, it is possible to perform a more accurate adjustment in a shorter time. 12 and 13 exemplify the case where the adjustment portions are formed at two locations, but the present invention is not limited to this, and the adjustment portions are provided at three or more locations according to the state of the mask sheet 15. Each may be formed.

As described above, in the mask sheet 15, when there is a portion that is difficult to stretch due to bending, undulation or the like, by taking the following measures, the rigidity of the portion becomes weak, and as a result, the above portion becomes the mask sheet 15. It becomes easy to extend in the longitudinal direction.

As measures that can be taken, for example, the following measures can be taken. That is, as shown in FIG. 11 and the like, it is possible to take measures such as irradiating a portion with high rigidity with a laser or irradiating a laser to form a minute opening (for example, a through hole). Or you may take the measure of giving a damage (for example, making a laser trace) with respect to the location where rigidity is strong.

For example, as shown in FIG. 11, when the mask sheet 15 is curved and has an upwardly convex shape when stretched, a laser is applied to the frame portion (the portion that does not affect the performance of the vapor deposition mask) at the lower end of FIG. Irradiate. Thereby, the rigidity of the said frame part becomes weak, and it tries to be in a straight state (state parallel to the said longitudinal direction) from the curved state. In such a state, welding is performed while pulling the mask sheet 15.

In addition, the said lower end part points out the lower end part of the curved location nearer to the curvature center in the curved location of the mask sheet 15. In addition, in the curved portion of FIG. 11, the curved portion far from the center of curvature has a weak rigidity because the mask sheet 15 is thin, and is well stretched.

As described above, as a method of stretching and welding, it is possible to employ a method of welding while adjusting the undulation such as the curvature of the mask sheet 15 by irradiating the laser with the mask sheet 15 stretched. .

In addition to the above method, it is also possible to eliminate the curvature and waviness of the mask sheet 15 by employing the following method.

For example, regardless of the strength of the rigidity, the mask sheet 15 is irradiated with laser on a portion with a small elongation (inner curved portion: a curved portion closer to the center of curvature) so that the portion becomes parallel to the longitudinal direction. It may be extended.

Or you may irradiate a laser from the back surface of the mask sheet | seat 15, and may form a dent (recess). In addition, since the surface of the mask sheet 15 is in close contact with the deposition target substrate, the mask sheet 15 may be raised by irradiation with a laser. Therefore, it is preferable to irradiate the laser from the back side of the mask sheet 15.

Alternatively, instead of just applying heat by laser irradiation, a minute opening (through hole) may be formed by laser irradiation. However, in this case, the vapor deposition material may protrude from a minute opening (through hole). Therefore, the location where the minute opening is formed is not limited to anywhere, and it is preferable to form the minute opening at the location overlapping the cover sheet.

Alternatively, a minute opening (through hole) may be formed in the frame portion in the width direction perpendicular to the longitudinal direction of the mask sheet 15. Alternatively, a minute opening may be formed at a location overlapping the howling sheet. Alternatively, a minute opening (through hole) may be formed at a location that does not affect the above-described sealing process or the like. In this way, the minute opening may be formed at a location where the cover sheet or howling sheet closes. In other words, the minute opening may be formed at a position where no problem occurs even if it is deposited.

For example, when the mask sheet 15 is wavy in an S shape, the laser sheet is irradiated to each of the curved portions near and far from the center of curvature so that the mask sheet 15 is adjusted to be parallel to the longitudinal direction of the mask sheet 15. Good.

Note that the timing of laser irradiation is at the time of position adjustment by stretching before welding is performed. While the mask sheet 15 is stretched and welded, the degree of parallelism with respect to the longitudinal direction of the mask sheet 15 is measured, and after confirming that the measurement result is within a predetermined range, the welding process is performed. The

Even if the laser is not irradiated to form minute openings, the mask sheet 15 may be locally damaged by the laser irradiation to reduce the physical rigidity.
As described above, the method for manufacturing the vapor deposition mask 10 includes the following steps (a) to (c) in order to eliminate the curvature and waviness.

(A) A step of stretching the mask sheet 15 in the longitudinal direction (b) A step of irradiating at least one end portion or the vicinity thereof among both end portions in the width direction of the mask sheet 15 or the vicinity thereof, and c) The process of welding the mask for pixels to the mask sheet 15

The method for manufacturing a vapor deposition mask further includes a step of detecting a curvature in the width direction of the mask sheet 15 before the step (b), and irradiates the concave side curved in the step (b) with a laser. It may be.

The step (a) may further include a step of detecting the degree of curvature of the mask sheet 15, and in the step (b), the number of times of laser irradiation may be changed according to the detected degree of curvature. .

Said process (b) may form a recessed part or a through-hole by irradiating a laser.

Of the both end portions in the width direction of the mask sheet 15 or in the vicinity thereof, at least one end portion or the vicinity thereof may be formed with an adjustment portion that has been subjected to physical treatment by laser irradiation. . In the step (b), it is preferable that a laser mark, a convex portion, a concave portion, or a through hole is formed as the adjustment portion in a laser irradiation portion. In particular, it is preferable to form a concave portion or a through hole as the adjustment portion in a laser irradiation portion.

Summary

In the vapor deposition mask according to the aspect 1, at least one of the both end portions in the width direction of the mask sheet or the vicinity thereof is provided with an adjustment portion that is subjected to physical treatment by laser irradiation along the longitudinal direction. It is characterized by.

The vapor deposition mask according to Aspect 2 is an FMM (FineＦMetal Mask) for depositing vapor deposition particles on a plurality of picture elements.

In the vapor deposition mask according to Aspect 3, the adjustment part is a concave part.

The vapor deposition mask according to aspect 4 is characterized in that the adjustment portion is a concave portion.

The vapor deposition mask according to aspect 5 is characterized in that at least one of the adjusting portions is formed in an inter-panel portion between the display panels.

In the vapor deposition mask according to the aspect 6, the number of the adjustment parts to be formed is the both ends in the width direction of the place where the display panel is formed or the vicinity thereof, and the panel-to-panel part between the panels. It is characterized by having more between the panels.

In the vapor deposition mask according to Aspect 7, a plurality of the adjustment portions are formed, and the plurality of adjustment portions are formed in the width direction.

The vapor deposition mask according to aspect 8 is characterized in that the plurality of adjusting portions are formed on both of the both end portions or in the vicinity thereof, and are formed so as not to overlap in the width direction.

The vapor deposition mask manufacturing method according to Aspect 9 includes a step (a) of stretching the mask sheet in the longitudinal direction and a physical treatment by irradiating at least one of both end portions of the mask sheet in the width direction. A step (b) of forming the adjusted portion and a step (c) of welding a mask for pixels to the mask sheet.

The manufacturing method of the vapor deposition mask which concerns on aspect 10 further includes the process of detecting the curvature of the width direction of the said mask sheet | seat before the said process (b), and is a laser on the concave side curved in the said process (b). It is characterized by irradiating.

In the vapor deposition mask according to the aspect 11, the step (a) further includes a step of detecting the degree of curvature of the mask sheet, and the number of times of laser irradiation is changed according to the amount of curvature in the step (b). It is characterized by.

The vapor deposition mask manufacturing method according to aspect 12 is characterized in that, in the step (b), a concave portion or a through hole is formed as the adjustment portion in a laser irradiation portion.

1 Substrate 2 TFT substrate (deposition substrate)
3 Active region 4 Frame-shaped bank 5 Sealing layer 6 Inorganic film 8 Inorganic film 7 Organic film 9 Organic EL display panel forming region 10 Deposition mask 10a First region 10b Second region 11 Mask frame 12 Cover sheet 13 Howling sheet 14 Alignment sheet 15 Mask sheet 15a Sheet part 30 Electronic device 40 Touch panel 41 Touch sensor 42 Organic EL display panel 43 Display area 44 Frame area 70 Vapor source 80 Light emitting layer H Pixel hole A Pixel adjustment part B Adjustment part C Adjustment part D Adjustment part

Claims

A vapor deposition mask in which an adjustment portion subjected to a physical treatment by laser irradiation is formed at least at one end portion or in the vicinity of both ends in the width direction of the mask sheet or the vicinity thereof.
The vapor deposition mask according to claim 1, wherein the vapor deposition mask is an FMM (Fine Metal Mask) for depositing vapor deposition particles on a plurality of pixels.
The vapor deposition mask according to claim 1 or 2, wherein the adjustment portion is a concave portion.
The vapor deposition mask according to claim 1 or 2, wherein the adjustment portion is a through hole.
5. The vapor deposition mask according to any one of claims 1 to 4, wherein at least one of the adjusting portions is formed in an inter-panel portion between the display panels.
The number of the adjustment parts to be formed is that there are more between the panel-to-panel parts at or near both ends in the width direction of the place where the display panel is formed and between the panels. The vapor deposition mask according to claim 5, wherein
The evaporation mask according to any one of claims 1 to 6, wherein a plurality of the adjustment portions are formed, and the plurality of adjustment portions are formed in the width direction.
The vapor deposition mask according to claim 7, wherein the plurality of adjusting portions are formed on both of the both end portions or in the vicinity thereof, and are formed so as not to overlap in the width direction.
(A) stretching the mask sheet in the longitudinal direction;
(B) a step of forming an adjustment portion that has been subjected to physical treatment by irradiating at least one of both end portions in the width direction of the mask sheet;
(C) welding a pixel mask to the mask sheet;
The manufacturing method of the vapor deposition mask containing this.
10. The method according to claim 9, further comprising a step of detecting a curvature in the width direction of the mask sheet before the step (b), and irradiating the concave side curved in the step (b). The manufacturing method of the vapor deposition mask of description.
The step (a) further includes a step of detecting the degree of curvature of the mask sheet, and the number of times of laser irradiation is changed in accordance with the amount of curvature in the step (b). The manufacturing method of the vapor deposition mask of description.
The method for manufacturing a vapor deposition mask according to any one of claims 9 to 11, wherein in the step (b), a concave portion or a through hole is formed as the adjustment portion in a laser irradiation portion.