WO2019180870A1 - Dispositif fluidique - Google Patents

Dispositif fluidique Download PDF

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Publication number
WO2019180870A1
WO2019180870A1 PCT/JP2018/011388 JP2018011388W WO2019180870A1 WO 2019180870 A1 WO2019180870 A1 WO 2019180870A1 JP 2018011388 W JP2018011388 W JP 2018011388W WO 2019180870 A1 WO2019180870 A1 WO 2019180870A1
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WO
WIPO (PCT)
Prior art keywords
substrate
processing
hole
substrates
pair
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Application number
PCT/JP2018/011388
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English (en)
Japanese (ja)
Inventor
直也 石澤
遼 小林
哲臣 高崎
太郎 上野
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2018/011388 priority Critical patent/WO2019180870A1/fr
Priority to JP2020507207A priority patent/JP6881671B2/ja
Publication of WO2019180870A1 publication Critical patent/WO2019180870A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N37/00—Details not covered by any other group of this subclass

Definitions

  • the present invention relates to a fluid device.
  • ⁇ -TAS is superior to conventional inspection devices in that it can be measured and analyzed with a small amount of sample, can be carried, and can be disposable at low cost. Furthermore, in the case of using an expensive reagent or in the case of testing a small amount of a large number of specimens, the method is attracting attention as a highly useful method.
  • Non-Patent Document 1 A device including a flow path and a pump disposed on the flow path as a component of ⁇ -TAS has been reported (Non-Patent Document 1).
  • a plurality of solutions are injected into the channel, and the pump is operated to mix the plurality of solutions in the channel.
  • a pair of substrates including a substrate provided with a groove that forms a flow path, and a processing substrate that is sandwiched between the pair of substrates and includes a processing unit that processes the solution
  • the processing substrate is provided with a through-hole penetrating in the thickness direction, and at least one of the pair of substrates is provided with a protruding portion that protrudes toward the other substrate and is inserted into the through-hole.
  • a fluidic device is provided in which a welding part for welding a pair of the substrates is provided at the tip of the protruding part.
  • FIG. 1 is a perspective view of a fluidic device according to one embodiment.
  • FIG. 2 is an exploded perspective view of the fluidic device according to the embodiment.
  • FIG. 3 is a plan view of a fluidic device according to one embodiment.
  • 4 is a cross-sectional view of the fluidic device taken along line IV-IV in FIG.
  • FIG. 5 is a plan view of a second substrate according to an embodiment.
  • 6 is a cross-sectional view of the fluidic device taken along line VI-VI in FIG. 7 is a cross-sectional view of the fluidic device taken along line VII-VII in FIG.
  • FIG. 8 is an enlarged view of region VIII in FIG.
  • FIG. 9 is a partial cross-sectional view of the fluidic device of the first modification.
  • FIG. 10 is a partial cross-sectional view of the fluidic device of the second modification.
  • FIG. 11 is a plan view of a fluidic device of Modification 3.
  • FIG. 1 is a perspective view of a fluidic
  • FIG. 1 is a perspective view of a fluidic device 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the fluidic device 1.
  • FIG. 3 is a plan view of the fluidic device 1.
  • the fluidic device 1 of the present embodiment includes a device that detects a sample substance that is a detection target included in a specimen sample by an immune reaction, an enzyme reaction, or the like.
  • the sample substance is, for example, a biomolecule such as nucleic acid, DNA, RNA, peptide, protein, extracellular vesicle.
  • the fluidic device 1 includes a base material 2 and a processing substrate 4. Further, as will be described later, the base member 2 is provided with a seal portion 5 (see FIG. 4). That is, the fluid device 1 includes the seal portion 5.
  • the processing substrate 4 includes a substrate body 40 and a processing unit 41.
  • the substrate body 40 is a rigid substrate provided with a circuit pattern (not shown) to which one or a plurality of biomolecules such as nucleic acids and antibodies are bonded.
  • the substrate body 40 is made of, for example, a glass substrate, a quartz glass substrate, a metal plate, a resin substrate, or glass epoxy.
  • the processing unit 41 is provided in the substrate body 40.
  • the processing unit 41 is in contact with the solution flowing through the flow path 50 provided in the base material 2 and performs some processing on the solution, reacts with a substance in the solution, or detects a substance in the solution. It is.
  • the processing unit 41 is a detection unit that detects a detection target in a solution, for example.
  • the processing unit 41 is, for example, a GMR sensor (Giant Magneto Resistive Sensor).
  • GMR sensor Green Magneto Resistive Sensor
  • an antibody that captures an antigen to be detected is fixed on the surface of each element of the GMR sensor.
  • Each element of the GMR sensor detects magnetic particles associated with the antigen to be detected. That is, in this embodiment, the GMR sensor as the processing unit 41 captures and detects the specimen in the solution.
  • Each element of the GMR sensor is connected to the circuit pattern of the substrate body 40.
  • the function of the processing unit 41 is not limited as long as the processing unit 41 is in contact with the solution flowing through the flow path 50 provided in the substrate 2 and performs some processing on the solution.
  • the process part 41 is a reaction part which reacts a solution, for example. Examples of processing that the processing unit 41 applies to the solution include capture processing, detection processing, heat processing, antigen-antibody reaction, nucleic acid cross-linking, and biomolecule interaction. Examples of the processing unit 41 include a DNA array chip, an electric field sensor, a heater, and an element for performing chromatography.
  • the base material 2 includes a first substrate (substrate, top plate) 10, a second substrate (substrate, middle plate) 20, and a third substrate (substrate, bottom plate) 30. That is, the base material 2 has three substrates.
  • the first substrate 10, the second substrate 20, and the third substrate 30 are stacked in the thickness direction of the substrate.
  • the first substrate 10 and the second substrate 20 are welded to each other by welding means such as laser welding or ultrasonic welding.
  • the second substrate 20 and the third substrate 30 are welded to each other by welding means such as laser welding or ultrasonic welding.
  • the first substrate 10, the second substrate 20, and the third substrate 30 are made of a resin material.
  • the first substrate 10 and the second substrate 20 and the second substrate 20 and the third substrate 30 are welded and joined by laser welding, one of the two substrates to be bonded transmits light.
  • the other is a resin material that absorbs light.
  • the first substrate 10 and the third substrate 30 are made of a translucent resin material that transmits light.
  • substrate 20 is comprised from the resin material with which the colored resin material which absorbs the light of the wavelength of a laser, or the coating material which absorbs the light of the wavelength of a laser was apply
  • the first substrate 10 the second substrate 20 and the third substrate 30, it is preferable to use a thermoplastic resin material.
  • the carbon fiber reinforced resin is not suitable for the first substrate 10, the second substrate 20, and the third substrate 30.
  • a resin material having extremely high heat resistance such as a fluororesin is not suitable for the first substrate 10, the second substrate 20, and the third substrate 30.
  • Resin materials that can be used for the first substrate 10, the second substrate 20, and the third substrate 30 include crystalline resin general-purpose resins (polypropylene; PP, polyvinyl chloride; PVC, etc.), engineering plastics (polyethylene terephthalate; PET Etc.), super engineering plastics (polyphenylene sulfide; PPS, polyetheretherketone; PEEK, etc.), and non-crystalline resin general-purpose resins (acrylonitrile butadiene styrene copolymer synthetic resin; ABS, polymethacrylic ;, PMMA, etc.), engineering plastics (Polycarbonate; PC, polyphenylene ether; PPE and the like) and super engineering plastic (polyether sulfone; PES and the like) are exemplified.
  • crystalline resin general-purpose resins polypropylene; PP, polyvinyl chloride; PVC, etc.
  • engineering plastics polyethylene terephthalate; PET Etc.
  • the first substrate 10, the second substrate 20, and the third substrate 30 are stacked in this order. That is, the second substrate 20 is disposed between the first substrate 10 and the third substrate 30. Further, the processing substrate 4 is disposed between the second substrate 20 and the third substrate 30. Therefore, a part of the processing substrate 4 is accommodated in the base material 2.
  • the processing substrate 4, the first substrate 10, the second substrate 20, and the third substrate 30 are plate members that extend in parallel along one plane.
  • the arrangement of the processing substrate 4, the first substrate 10, the second substrate 20, and the third substrate 30 will be described as being arranged along a horizontal plane for convenience of explanation.
  • the vertical direction is defined on the assumption that the first substrate 10, the second substrate 20, the processing substrate 4, and the third substrate 30 are sequentially stacked from the upper side. That is, the vertical direction in this specification is the stacking direction and the thickness direction of the first substrate 10, the second substrate 20, the processing substrate 4, and the third substrate 30.
  • the processing substrate 4, the first substrate 10, the second substrate 20, and the third substrate 30 each have an upper surface that faces the upper side (one side in the stacking direction) and a lower surface that faces the lower side (the other side in the stacking direction). More specifically, the first substrate 10 has an upper surface 10a and a lower surface 10b.
  • the second substrate 20 has an upper surface 20a and a lower surface (first opposing surface) 20b.
  • the third substrate 30 has an upper surface (third opposing surface) 30a and a lower surface 30b. That is, the base material 2 has upper surfaces 10a, 20a, and 30a and lower surfaces 10b, 20b, and 30b.
  • the processing substrate 4 has an upper surface (second opposing surface) 4a and a lower surface 4b.
  • the lower surface 10b of the first substrate 10 and the upper surface 20a of the second substrate 20 face each other in the vertical direction.
  • the lower surface 20b of the second substrate 20 and the upper surface 30a of the third substrate 30 face each other in the vertical direction.
  • a part of the upper surface 4 a of the processing substrate 4 faces a part of the lower surface 20 b of the second substrate 20 in the vertical direction.
  • a part of the lower surface 4 b of the processing substrate 4 faces a part of the upper surface 30 a of the third substrate 30 in the vertical direction.
  • a first accommodation recess (accommodation recess) 21 is provided on the lower surface 20 b of the second substrate 20.
  • a second accommodation recess (accommodation recess) 31 is provided on the upper surface 30 a of the third substrate 30.
  • the first housing recess 21 and the second housing recess 31 overlap each other when viewed from the up-down direction.
  • the first accommodation recess 21 and the second accommodation recess 31 each accommodate the processing substrate 4.
  • the bottom surface 21 a of the first housing recess 21 is in contact with the top surface 4 a of the processing substrate 4.
  • the bottom surface 31 a of the second housing recess 31 is in contact with the lower surface 4 b of the processing substrate 4.
  • the base material 2 sandwiches the processing substrate 4 between the lower surface 20b of the second substrate 20 and the upper surface 30a of the third substrate 30. That is, the base material 2 has a pair of substrates (second substrate 20 and third substrate 30) that sandwich the processing substrate 4 therebetween.
  • the base material 2 is provided with a reservoir 60 for storing the solution, a flow path 50 through which the solution flows, an injection hole 71, a supply hole 74, a waste liquid tank 72, a discharge hole 75, and an air hole 73. ing.
  • the reservoir 60 is provided between the second substrate 20 and the third substrate 30.
  • the reservoir 60 is a space surrounded by the inner wall surface of the groove 22 provided on the lower surface 20 b of the second substrate 20 and the upper surface 30 a of the third substrate 30.
  • the reservoir 60 is a space formed in, for example, a tube shape or a cylinder shape.
  • the substrate 2 of the present embodiment is provided with a plurality of reservoirs 60.
  • the reservoir 60 stores a solution.
  • the plurality of reservoirs 60 store solutions independently of each other.
  • the reservoir 60 of this embodiment is a flow path type reservoir.
  • One end of the reservoir 60 in the length direction is connected to the injection hole 71.
  • the supply hole 74 is connected to the other end of the reservoir 60 in the length direction.
  • the solution is injected into the reservoir 60 from the injection hole 71. Further, when the fluidic device 1 is used, the reservoir 60 supplies the solution accommodated through the supply hole 74 to the flow path 50.
  • the flow path 50 is provided between the first substrate 10 and the second substrate 20.
  • the flow path 50 is configured by, for example, a groove formed on the bonding surface between the first substrate 10 and the second substrate 20. It may be constituted by a space surrounded by the groove provided on the lower surface 10b of the first substrate 10 and the upper surface 20a of the second substrate 20, and provided on the lower surface 10b of the first substrate 10 and the upper surface 20a of the second substrate 20. May be configured as a space surrounded by the groove portion provided on the lower surface 10b of the first substrate 10 and a groove portion provided on the upper surface 20a of the second substrate 20. May be.
  • a part of the flow path 50 is configured as a space surrounded by the groove 13 provided on the lower surface 10 b of the first substrate 10 and the upper surface 20 a of the second substrate 20.
  • a part of the flow path 50 is configured as a space surrounded by the lower surface 10 b of the first substrate 10 and the groove portion 23 provided on the upper surface 20 a of the second substrate 20.
  • a part of the flow path 50 is configured as a space surrounded by the groove 13 provided on the lower surface 10 b of the first substrate 10 and the groove 23 provided on the upper surface 20 a of the second substrate 20.
  • the flow path 50 is a space formed in a tube shape or a cylindrical shape.
  • the solution is supplied from the reservoir 60 to the channel 50.
  • the solution flows in the flow path 50.
  • Each part of the flow channel 50 will be described later in detail with reference to FIG.
  • the injection hole 71 penetrates the first substrate 10 and the second substrate 20 in the plate thickness direction.
  • the injection hole 71 is connected to the reservoir 60 located at the boundary between the second substrate 20 and the third substrate 30.
  • the injection hole 71 connects the reservoir 60 to the outside.
  • One injection hole 71 is provided for one reservoir 60.
  • a septum 71 a is provided at the opening of the injection hole 71.
  • An operator or an injection device performs an operation of injecting the solution into the reservoir 60 using, for example, a syringe filled with the solution.
  • the operator injects the solution into the reservoir 60 by piercing the septum 71 a with a hollow needle attached to the syringe.
  • the septum 71 a may not be provided in the opening of the injection hole 71. In this case, the opening of the injection hole 71 is provided with a seal attached after the solution is injected into the reservoir 60.
  • the supply hole 74 is provided in the second substrate 20.
  • the supply hole 74 penetrates the second substrate 20 in the plate thickness direction.
  • the supply hole 74 connects the reservoir 60 and the flow path 50.
  • the solution stored in the reservoir 60 is supplied to the flow path 50 through the supply hole 74.
  • the waste liquid tank 72 is provided on the base material 2 in order to discard the solution in the flow path 50.
  • the waste liquid tank 72 is connected to the flow path 50 through the discharge hole 75.
  • the waste liquid tank 72 is configured in a space surrounded by the waste liquid recess 25 provided on the lower surface 20 b of the second substrate 20 and the upper surface 30 a of the third substrate 30.
  • the waste liquid tank 72 is filled with an absorbent material 79 that absorbs the waste liquid.
  • the discharge hole 75 penetrates the second substrate 20 in the plate thickness direction.
  • the discharge hole 75 connects the flow path 50 and the waste liquid tank 72.
  • the solution in the flow path 50 is discharged to the waste liquid tank 72 through the discharge hole 75.
  • the air hole 73 penetrates the first substrate 10 and the second substrate 20 in the plate thickness direction.
  • the air hole 73 is located immediately above the waste liquid tank 72.
  • the air hole 73 connects the waste liquid tank 72 to the outside. That is, the waste liquid tank 72 is opened to the outside through the air hole 73.
  • FIG. 5 is a plan view of the second substrate 20.
  • a part of the channel 50 is complemented and displayed by a two-dot chain line or a broken line.
  • the circulation channel 51 which is a part of the channel 50 is highlighted with a dot pattern.
  • the flow path 50 includes a circulation flow path 51, a plurality of introduction flow paths 52, and a plurality of discharge flow paths 53.
  • the circulation channel 51 is configured in a loop shape when viewed from the stacking direction.
  • a pump P is disposed in the path of the circulation channel 51.
  • the pump P is composed of three element pumps Pe arranged side by side in the flow path.
  • the element pump Pe is a so-called valve pump.
  • the pump P can convey the liquid in the circulation channel 51 by sequentially opening and closing the three element pumps Pe.
  • the number of element pumps Pe constituting the pump P may be three or more, and may be four or more.
  • a plurality (three in this embodiment) of metering valves V are provided in the circulation channel 51.
  • the plurality of metering valves V partitions the circulation channel 51 into a plurality of metering sections. By closing the plurality of metering valves V, a plurality of compartments are defined in the circulation channel 51.
  • the plurality of metering valves V are arranged so that each metering section has a predetermined volume.
  • An introduction channel 52 is connected to one end of each quantitative section.
  • a discharge channel 53 is connected to the other end of the quantitative section.
  • the introduction flow path 52 is a flow path for introducing the solution into the quantitative section of the circulation flow path 51. At least one introduction channel 52 is provided in one metering section. The introduction flow path 52 is connected to the supply hole 74 on one end side. The introduction flow path 52 is connected to the circulation flow path 51 on the other end side. An introduction valve Vi and an initial close valve Va are provided in the route of the introduction flow path 52.
  • the initial closing valve Va is a valve that is closed only in the initial state when the fluid device 1 is shipped.
  • the introduction valve Vi is opened when the solution is introduced from the reservoir 60 into the flow path 50, and is closed in another state.
  • the discharge channel 53 is a channel for discharging the solution in the circulation channel 51 to the waste liquid tank 72.
  • the discharge channel 53 is connected to the waste liquid tank 72 on one end side. Further, the discharge channel 53 is connected to the circulation channel 51 on the other end side.
  • a discharge valve Vo is provided in the path of the discharge channel 53.
  • the discharge valve Vo is opened when the solution is discharged from the flow path 50 to the waste liquid tank 72, and is closed in another state.
  • the processing channel 55 is included in the circulation channel 51.
  • the solution in the circulation channel 51 passes through the processing space 55 during circulation.
  • the processing unit 41 of the processing substrate 4 is arranged. That is, the processing unit 41 is located inside the processing space 55.
  • the processing unit 41 is provided on the upper surface 4 a of the processing substrate 4.
  • the processing unit 41 contacts the solution in the processing space 55 to process the solution.
  • the fluidic device 1 introduces the solutions in the plurality of reservoirs 60 into different quantification sections of the circulation channel 51, and quantifies the solution.
  • the fluidic device 1 opens the metering valve V and activates the pump P.
  • the solution quantified in each quantification section in the circulation channel 51 is circulated and mixed.
  • the sample in the solution for example, antigen is captured
  • the solution in the circulation channel 51 is discharged to the waste liquid tank 72.
  • a solution containing magnetic particles is supplied into the circulation channel 51. Accordingly, the magnetic particles are bound to the antigen captured by the processing unit 41. Further, the processing unit 41 detects the magnetic particles.
  • FIG. 6 is a cross-sectional view of the fluidic device 1 taken along line VI-VI in FIG.
  • a first accommodating recess 21 that accommodates the processing substrate 4 is provided on the lower surface 20 b of the second substrate 20.
  • the first accommodating recess 21 is a recess that is open on the lower surface 20b side of the second substrate 20.
  • the first receiving recess 21 includes a processing recess 26.
  • the portion on the side opposite to the opening surface and not connected to the processing recess 26 is referred to as a bottom surface 21 a of the first housing recess 21.
  • the bottom surface 21 a of the first housing recess 21 is in contact with the top surface 4 a of the processing substrate 4.
  • a processing recess (recess) 26 is provided on the bottom surface 21 a of the first receiving recess 21.
  • the bottom area of the processing recess 26 is smaller than the bottom area of the first accommodation recess 21. That is, the processing recess 26 is provided in a part of the bottom surface 21 a of the first accommodation recess 21.
  • a processing space 55 is formed inside the processing recess 26.
  • the bottom surface 26 a of the processing recess 26 faces the processing portion 41 of the processing substrate 4 in the vertical direction.
  • the processing space 55 is provided between the bottom surface of the processing recess 26 and the upper surface 4a of the processing substrate 4 in the vertical direction. That is, the processing space 55 is provided between the second substrate 20 and the processing substrate 4 in the vertical direction.
  • a pair of insertion holes 29 are provided on the bottom surface 26 a of the processing recess 26.
  • the insertion hole 29 is a through hole that penetrates the second substrate 20 in the plate thickness direction. That is, the second substrate 20 is provided with a pair of insertion holes 29.
  • the insertion hole 29 opens to the flow path 50 on the upper surface 20 a side of the second substrate 20 and opens to the processing space 55 on the lower surface 20 b side of the second substrate 20. That is, the pair of insertion holes 29 connects the flow path 50 between the first substrate 10 and the second substrate 20 and the processing space 55.
  • the solution flows into the processing space 55 through the one insertion hole 29 out of the pair of insertion holes 29, and flows out from the processing space 55 to the flow path 50 through the other insertion hole 29.
  • the processing unit 41 is disposed between the pair of insertion holes 29 when viewed in the vertical direction. For this reason, the solution contacts the surface of the processing unit 41 when passing through the processing space 55.
  • the processing space 55 is surrounded by the seal portion 5 when viewed in the vertical direction.
  • the processing space 55 is surrounded by the bottom surface 26 a of the processing recess 26 in the second substrate 20, the seal portion 5, and the top surface 4 a of the processing substrate 4.
  • the seal portion 5 is annular when viewed from the top and bottom directions.
  • the surface facing the upper side of the seal portion 5 is in contact with the lower surface 20 b (more specifically, the step surface 26 b) of the second substrate 20.
  • the surface facing the upper side of the seal portion 5 is in contact with the upper surface 4 a of the processing substrate 4.
  • the seal portion 5 surrounds the processing space 55 when viewed from the up and down direction.
  • annular when viewed from the vertical direction is not limited to a circular shape when viewed from the vertical direction. That is, the seal part 5 only needs to have a shape that surrounds a predetermined region (in this embodiment, the processing space 55 and the processing part 41 in the processing space 55) when viewed in the vertical direction.
  • the seal part 5 is made of, for example, an elastic material.
  • the elastic material that can be used for the seal portion 5 include rubber and elastomer resin.
  • the seal part 5 and the second substrate 20 may be integrally formed of different materials.
  • the seal portion 5 and the second substrate 20 are molded bodies that are integrally molded by two-color molding, injection molding, insert molding, or the like.
  • a plurality of valves V, Va, Vi, Vo and a septum 71 a may be integrally provided on the second substrate 20.
  • the seal part 5 and the plurality of valves V, Va, Vi, Vo and the septum 71a may be made of the same material.
  • the second substrate 20 and the plurality of valves V, Va, Vi, Vo and the septum 71a can be integrally molded by two-color molding using two kinds of resin materials.
  • the seal unit 5 may be a separate member independent of the second substrate 20 as long as it can seal the fluid that contacts the surface of the processing unit 41 in the processing space 55.
  • a step surface 26 b is provided on the inner peripheral surface of the processing recess 26.
  • the step surface 26 b faces the upper surface 4 a of the processing substrate 4.
  • the seal portion 5 is sandwiched between the step surface 26 b and the upper surface 4 a of the processing substrate 4. That is, the seal portion 5 is sandwiched between the lower surface 20 b of the second substrate 20 and the upper surface 4 a of the processing substrate 4.
  • a recessed groove 26 c is provided in the step surface 26 b of the processing recess 26.
  • the concave groove 26c is provided in an annular shape when viewed from the vertical direction.
  • the inside of the concave groove 26 c is filled with an elastic material that constitutes the seal portion 5.
  • the fluid device 1 includes the base material 2 provided with the flow path 50 and the processing substrate 4 on which the processing unit 41 for processing the solution is mounted. Further, the processing unit 41 is disposed in a processing space 55 connected to the flow path 50. For this reason, it is desirable to seal the processing space 55 in order to suppress the liquid leakage of the solution. Since the processing substrate 4 and the base material 2 are different materials, it is difficult to seal the processing space 55 by means such as welding.
  • the seal portion 5 is sandwiched between the base material 2 and the processing substrate 4. Further, a processing space 55 is provided inside the seal portion 5 when viewed from the vertical direction. For this reason, the processing space 55 can be sealed to prevent the solution in the processing space 55 from flowing out.
  • the processing space 55 is configured as an internal space of the processing recess 26 provided in the second substrate 20.
  • the bottom surface 26a of the processing recess 26 faces the processing unit 41 in the vertical direction.
  • the flow path width of the processing space 55 in the vertical direction can be reduced, and the frequency with which the analyte molecules in the solution passing through the processing space 55 collide with the processing unit 41 is increased. be able to. Thereby, the processing efficiency by the process part 41 can be improved.
  • the step surface 26 b is provided on the inner peripheral surface of the processing recess 26, and the seal portion 5 is sandwiched between the step surface 26 b and the upper surface 4 a of the processing substrate 4.
  • the seal portion 5 is formed integrally with the second substrate 20, but the seal portion 5 and the second substrate 20 may be separate members. When the seal part 5 is a separate member from the second substrate 20, the positional deviation of the seal part 5 with respect to the second substrate 20 can be suppressed by arranging the seal part 5 on the step surface 26 b.
  • the flow path 50 provided between the first substrate 10 and the second substrate 20 and the processing space 55 are connected by the pair of insertion holes 29 provided in the second substrate 20.
  • the solution can be supplied from the flow path 50 to the processing space 55 while ensuring the sealing by the seal portion 5.
  • the insertion hole 29 extends in parallel with the thickness direction of the second substrate 20.
  • the insertion hole 29 has a circular shape with a uniform cross-sectional area along the thickness direction.
  • the shape of the insertion hole 29 is not limited to this embodiment.
  • the insertion hole 29 may extend while being inclined with respect to the thickness direction of the second substrate 20. In this case, the solution can be smoothly introduced from the flow path 50 into the processing space 55 through the insertion hole 29.
  • the second substrate 20 and the third substrate 30 are provided with receiving recesses (the first receiving recess 21 and the second receiving recess 31) for receiving a part of the processing substrate 4 from above and below, respectively.
  • the lower surface 20b of the second substrate 20 and the upper surface 30a of the third substrate 30 are in contact with each other. Therefore, the processing substrate 4 can be easily fixed to the base material 2 by fixing the second substrate 20 and the third substrate 30 to each other by a fixing means such as welding.
  • the second substrate 20 and the third substrate 30 are brought into contact with each other and fixed, whereby the second substrate 20 and the processing substrate 4 are processed.
  • the seal portion 5 sandwiched between the substrate 4 can be steadily compressed. As a result, the reliability of sealing the processing space 55 can be improved.
  • the base material 2 should just be provided with either one of the 1st accommodation recessed part 21 and the 2nd accommodation recessed part 31. FIG.
  • FIG. 7 is a cross-sectional view of the fluidic device 1 taken along line VII-VII in FIG.
  • the lower surface 20 b of the second substrate 20 and the upper surface 30 a of the third substrate 30 are in contact with each other around the processing substrate 4.
  • a region in contact with each other on the lower surface 20 b of the second substrate 20 and the upper surface 30 a of the third substrate 30 is referred to as a contact surface 6. That is, the pair of substrates (second substrate 20 and third substrate 30) that sandwich the processing substrate 4 from above and below has the contact surfaces 6 that are in contact with the other substrate in the thickness direction.
  • At least a part of the contact surface 6 is provided with a welding portion 6a for welding a pair of substrates (the second substrate 20 and the third substrate 30).
  • the weld 6a joins the second substrate 20 and the third substrate 30 to each other.
  • the weld 6a joins the second substrate 20 and the third substrate together by melting and resolidifying a part of the contact surface 6 of the second substrate 20 and the third substrate 30.
  • Examples of the welding means include laser welding, ultrasonic welding, and thermal welding.
  • the processing substrate 4 is provided with a plurality of (three in this embodiment) through-holes 47 penetrating in the thickness direction. Moreover, as shown in FIG. 2, in this embodiment, the through-hole 47 is circular when seen from the up-down direction. The diameter of the through hole 47 is uniform over the entire length of the through hole 47.
  • the three through-holes 47 are disposed around the processing unit 41 so as to surround the processing unit 41 when viewed in the vertical direction.
  • the through hole 47 is provided in a portion other than the processing portion 41 in the processing substrate 4.
  • FIG. 8 is an enlarged view of region VIII in FIG.
  • the second substrate 20 is provided with first convex portions (convex portions, projecting portions) 27 that project toward the third substrate 30 side.
  • the first convex portion 27 extends downward from the bottom surface 21 a of the first housing concave portion 21 of the second substrate 20.
  • the 1st convex part 27 is circular seeing from the up-down direction.
  • the first convex portion 27 is inserted into the through hole 47 of the processing substrate 4.
  • the first convex portion 27 is fitted into the through hole 47.
  • the 1st convex part 27 is columnar and is a support
  • the same number of first protrusions 27 as the through holes 47 provided in the processing substrate 4 are provided in the second substrate 20. That is, the three first convex portions 27 are provided on the second substrate 20 of the present embodiment.
  • the third substrate 30 is provided with second convex portions (convex portions, projecting portions) 37 that project toward the second substrate 20 side.
  • the second convex portion 37 extends upward from the bottom surface 31 a of the second housing concave portion 31 of the third substrate 30.
  • the 2nd convex part 37 is circular seeing from the up-down direction.
  • the second convex portion 37 is inserted into the through hole 47 of the processing substrate 4.
  • the second convex portion 37 is fitted into the through hole 47.
  • the 2nd convex part 37 is columnar shape, and is a support
  • the same number of second convex portions 37 as the through holes 47 provided in the processing substrate 4 are provided in the third substrate 30. That is, three second convex portions 37 are provided on the third substrate 30 of the present embodiment.
  • the first convex portion 27 and the second convex portion 37 overlap each other when viewed in the vertical direction.
  • the 1st convex part 27 and the 2nd convex part 37 are each inserted in the through-hole 47 of the process board
  • the front end (lower end) of the first convex portion 27 and the front end (upper end) of the second convex portion 37 are in contact with each other inside the through hole 47. That is, the contact surface 6 on which the pair of substrates (the second substrate 20 and the third substrate 30) are in contact with each other is provided at the distal end of the first convex portion 27 and the distal end of the second convex portion 37.
  • the welded portion 6 a is located on the contact surface 6 at the tip of the first convex portion 27 and the tip of the second convex portion 37. Therefore, the second substrate 20 and the third substrate 30 are bonded to each other also inside the through hole 47 of the processing substrate 4.
  • the fluid device 1 includes the base material 2 provided with the flow path 50 and the processing substrate 4 on which the processing unit 41 for processing the solution is mounted. Further, as described above, the processing substrate 4 is fixed to the base material 2 by welding the second substrate 20 and the third substrate 30. In general, glass epoxy or the like that is generally excellent in insulation is used as a processing substrate having mounted components. On the other hand, since the substrate is provided with a flow path through which the solution flows, a resin material having excellent processability is employed. That is, the processing substrate 4 and the base material 2 are generally different materials. In general, in a fluid device, welding is preferably employed for fixing substrates for the purpose of downsizing and the like. When the processing substrate 4 and the base material 2 which are different materials are directly fixed by welding, there is a problem that it is difficult to obtain sufficient reliability.
  • the base material 2 has the second substrate 20 and the third substrate 30 that sandwich the processing substrate 4 in the plate thickness direction. Further, the second substrate 20 and the third substrate 30 have the contact surface 6 with each other, and the weld surface 6 a is provided on the contact surface 6. The welding part 6a welds the second substrate 20 and the third substrate 30 to each other. Therefore, even if the processing substrate 4 and the base material 2 are made of different materials, the processing substrate 4 can be fixed to the base material 2. Thereby, the reliability of fixation of the process board
  • the second substrate 20 and the third substrate 30 are preferably made of a material with good bonding properties. Further, when the second substrate 20 and the third substrate 30 are made of the same material, they are less affected by the difference in the coefficient of linear expansion than when they are joined to different materials.
  • a convex portion (first convex portion) that is inserted into the through hole 47 provided in the processing substrate 4 from the opposite side and contacts the inside of the through hole 47.
  • a part 27 and a second convex part 37) are respectively provided.
  • the contact surface 6 which contacts mutually is provided in the front-end
  • the welded portion 6a is located on the contact surface 6 at the tips of the first convex portion 27 and the second convex portion 37.
  • the welded portion 6a can be disposed on the inner side of the outer edge of the processing substrate 4 when viewed from the vertical direction. Since the welded portion 6a is positioned on the inner side of the outer edge of the processing substrate 4, even if stress is applied to the processing substrate 4 with respect to the base material 2, the peeling of the welded portion 6a can be effectively suppressed. As a result, the reliability of fixing the processing substrate 4 to the base material 2 can be further increased.
  • the welding part 6a since the welding part 6a is located inside the outer edge of the processing substrate 4, the welding part 6a is disposed close to the seal part 5 sandwiched between the second substrate 20 and the processing substrate 4. Can do. If the seal part 5 and the welded part 6a are arranged apart from each other, the second substrate 20 and the processing substrate 4 may bend due to the reaction force of the seal part 5 and the compression of the seal part 5 may be insufficient. According to the present embodiment, since the welded portion 6 a is located inside the outer edge of the processing substrate 4, the influence of the deflection of the second substrate 20 and the processing substrate 4 is reduced, and the processing space 55 is sealed by the seal portion 5. Can improve the reliability.
  • the case where the second substrate 20 and the third substrate 30 are provided with the convex portions (the first convex portion 27 and the second convex portion 37) that are inserted into the through holes 47 has been described.
  • a convex portion may be provided on any one of the pair of substrates (the second substrate 20 and the third substrate 30).
  • the first substrate 27 penetrates the entire length of the through hole 47 and At the lower end, it contacts and is welded to the second substrate.
  • At least one of the pair of substrates (the second substrate 20 and the third substrate 30) is provided with a convex portion that protrudes toward the other substrate and is inserted into the through hole 47, and the other substrate is provided at the tip of the convex portion.
  • the contact surface which contacts is provided, and the welding part should just be located in the contact surface of the front-end
  • the second substrate 20 is orthogonal to the thickness of the processing substrate 4. Can be aligned in direction.
  • the processing unit 41 can be accurately arranged in the center of the processing recess 26 of the second substrate 20.
  • the sealing portion 5 formed integrally with the lower surface 20b of the second substrate 20 can be accurately pressed against a predetermined position of the processing substrate 4 to improve the reliability of sealing the processing space 55.
  • the third substrate 30 is made thicker than the processing substrate 4. Can be aligned in a direction orthogonal to
  • the welded portion 6 a includes the periphery of the outer edge of the processing substrate 4 and the inner side of the through hole 47 positioned on the inner side of the outer edge of the processing substrate 4 when viewed from the vertical direction. , Respectively.
  • substrate 4 can be fixed more firmly with respect to the base material 2.
  • the height of the second convex portion 37 protruding from the bottom surface 31 a of the second accommodating recess 31 matches the depth of the second accommodating recess 31. Therefore, the position in the thickness direction of the contact surface 6 located at the tips of the first convex portion 27 and the second convex portion 37 is the contact surface 6 between the second substrate 20 and the third substrate 30 around the processing substrate 4. This matches the position in the plate thickness direction.
  • the welded portion 6a of the present embodiment is a laser welded portion formed by melting and resolidifying a part of the contact surface 6 with a laser beam.
  • the welding conditions can be the same. Therefore, according to this embodiment, the welding part 6a outside the outer edge of the processing substrate 4 and inside the through hole 47 can be formed by a single welding condition, and the productivity of the fluid device 1 can be improved. it can.
  • the plurality of through holes 47 provided in the processing substrate 4 are arranged so as to surround the periphery of the seal portion 5 when viewed in the vertical direction. For this reason, the seal part 5 can be uniformly compressed by the welding part 6a, and the reliability of sealing of the processing space 55 by the seal part 5 can be improved.
  • the pair of substrates (second substrate 20 and third substrate 30) welded to each other by the welding portion 6a are the same kind of resin material. Resin materials of the same type have close thermal expansion coefficients.
  • the second substrate 20 and the third substrate 30 are thermally expanded or contracted due to temperature changes in the surrounding environment and heat generated by the processing unit 41. Even if it is a case, the thermal stress added to the welding part 6a can be reduced. Thereby, it can suppress that damage arises in the welding part 6a, and can improve the reliability of fixation of the process board
  • the combination of the resin material constituting the second substrate 20 and the resin material constituting the third substrate 30 it is preferable to employ resin materials that are compatible with each other. It is possible to suppress the occurrence of interfacial peeling by welding resin materials having high compatibility. Examples of highly compatible resin materials include the combination of PC and ABS, PC and PET, etc., in addition to the same type of resin material.
  • first substrate 10 and the second substrate 20 are also welded to each other.
  • first substrate 10 and the second substrate 20 are also preferably the same type of resin material that satisfies the above-described relationship.
  • the welding part 6a is a laser welding part. That is, the weld 6a is formed by irradiating the contact surface 6 with laser light to melt and resolidify the second substrate 20 and the third substrate 30 on the contact surface 6. By using laser welding, local welding is possible. Further, by scanning the laser beam, the outside of the outer edge of the processing substrate 4 and the inside of the through hole 47 can be welded in a single welding step.
  • welding part 6a is a laser welding part
  • the third substrate 30 is made of a resin material that transmits light
  • the second substrate 20 is made of a resin material that absorbs light. Accordingly, the surface of the second substrate 20 that absorbs light can be heated by irradiating laser light from the side of the third substrate 30 that transmits light.
  • the first substrate 10 and the second substrate 20 are also laser-welded to each other. For this reason, the 1st board
  • substrate 10 is comprised from the resin material which permeate
  • FIG. 9 is a diagram corresponding to FIG. 8 in the description of the above-described embodiment.
  • symbol is attached
  • the base material 102 of this modification has the 2nd board
  • the processing substrate 4 is provided with a through hole 47.
  • the third substrate 130 is provided with a convex portion (protruding portion) 137 that protrudes toward the second substrate 120 side.
  • the convex portion 137 extends upward from the bottom surface 31 a of the second housing concave portion 31 of the third substrate 130.
  • the convex portion 137 is inserted into the through hole 47 of the processing substrate 4.
  • the convex portion 137 is in contact with the bottom surface 21 a of the first accommodating concave portion 21 of the second substrate 120 at the upper end of the through hole 47. That is, the contact surface 106 that contacts the second substrate 120 is provided at the tip of the convex portion. A welding portion 106 a is located on the contact surface 106 at the tip of the convex portion 137. Thereby, the second substrate 120 and the third substrate 130 are fixed to each other. In addition, the processing substrate 4 sandwiched between the second substrate 120 and the third substrate 130 is fixed to the base material 102.
  • FIG. 10 is a diagram corresponding to FIG. 8 in the description of the above-described embodiment.
  • symbol is attached
  • the base material 202 of this modification has the 2nd board
  • the processing substrate 204 is provided with a through hole 247 penetrating in the thickness direction.
  • the through hole 247 is circular as viewed from the up-down direction.
  • a stepped surface 247 a facing the third substrate 230 is provided on the inner peripheral surface of the through hole 247.
  • the diameter of the through hole 247 is different between the upper side and the lower side of the step surface 247a.
  • the diameter of the through hole 247 on the second substrate 220 side from the step surface 247a is smaller than the diameter on the third substrate 230 side from the step surface 247a.
  • the second substrate 220 is provided with a first convex portion (convex portion, protruding portion) 227 that protrudes toward the third substrate 230 side.
  • the first convex portion 227 extends downward from the bottom surface 21 a of the first receiving concave portion 21 of the second substrate 220.
  • the 1st convex part 227 is circular seeing from the up-down direction.
  • the first convex portion 227 is inserted into the through hole 247 of the processing substrate 204.
  • the position in the plate thickness direction of the tip of the first convex portion 227 coincides with the position in the plate thickness direction of the step surface 247a.
  • the third substrate 230 is provided with a second convex portion (convex portion, projecting portion) 237 that protrudes toward the second substrate 220 side.
  • the second convex portion 237 extends upward from the bottom surface 31 a of the second accommodation concave portion 31 of the third substrate 230.
  • the 2nd convex part 237 is circular seeing from the up-and-down direction.
  • the second convex portion 237 is inserted into the through hole 247 of the processing substrate 204.
  • the position of the tip of the second convex portion 237 in the thickness direction coincides with the position of the step surface 247a in the thickness direction.
  • the diameter of the first convex part 227 is larger than the diameter of the second convex part 237.
  • the first convex portion 227 and the second convex portion 237 overlap each other when viewed from the up-down direction.
  • the 1st convex part 227 and the 2nd convex part 237 are inserted in the through-hole 247 of the process board
  • the front end (lower end) of the first convex portion 227 and the front end (upper end) of the second convex portion 237 are in contact with each other inside the through hole 247. That is, the contact surfaces 206 that contact each other are provided at the tips of the first convex portion 227 and the second convex portion 237.
  • a welded portion 206a is located on the contact surface 206.
  • the second substrate 220 and the third substrate 230 are fixed to each other.
  • the processing substrate 204 sandwiched between the second substrate 220 and the third substrate 230 is fixed to the base material 202.
  • the tip of the second convex portion 237 contacts the step surface 247a.
  • the third substrate 230 can be positioned in the thickness direction with respect to the processing substrate 204.
  • the tip of the second convex portion 237 provided on the third substrate 230 contacts the step surface 247a has been described.
  • a step surface facing the second substrate 220 side may be provided in the through hole 247, and the tip of the first convex portion 227 provided on the second substrate 220 may contact the step surface.
  • the second substrate 220 can be positioned in the thickness direction with respect to the processing substrate 204. That is, a stepped surface facing one of the pair of substrates (the second substrate 220 and the third substrate 230) is provided on the inner peripheral surface of the through hole of the processing substrate, and the tip of the convex portion of the one substrate However, what is necessary is just to contact the said level
  • FIG. 11 is a diagram corresponding to a part of FIG. 3 in the description of the above-described embodiment.
  • symbol is attached
  • the fluidic device 301 of this modification has a base material 302 and a processing substrate 304 as in the above-described embodiment.
  • the base member 302 is provided with a seal portion 5. Further, the processing unit 41 is mounted on the processing substrate 304.
  • the processing substrate 304 is provided with a through hole 347.
  • the through holes 347 respectively penetrate the processing substrate 304 in the plate thickness direction.
  • Each through-hole 347 is inserted with a protruding portion (protruding portion) protruding from one of the pair of substrates constituting the base material 302. The tip of the convex portion comes into contact with the other substrate, and a welded portion 306a is formed on the contact surface.
  • the processing substrate 304 of the present modification is provided with four through holes 347.
  • the four through holes 347 are arranged at equal intervals on the virtual circle VC when viewed from the up-down direction.
  • the center VCO of the virtual circle VC overlaps with the processing unit 41 when viewed from the vertical direction.
  • the processing substrate 304 is provided with a plurality of (four in this modification) through-holes 347, and the plurality of through-holes 347 are on the same virtual circle VC when viewed from the plate thickness direction. Arranged at equal intervals. Further, in each through hole 347, a convex portion of the substrate is inserted, and a welded portion 306a is provided at the tip of the convex portion. For this reason, the welding part 306a can be arrange
  • the center VCO of the virtual circle VC overlaps the processing unit 41. For this reason, stress can be given to the seal part 5 surrounding the processing part 41 in a balanced manner, and the seal part 5 can be uniformly compressed. Thereby, the reliability of sealing by the seal part 5 can be improved.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

L'invention concerne un dispositif fluidique comprenant une paire de substrats comprenant un substrat dans lequel est située une rainure permettant de former un trajet d'écoulement, et un substrat de traitement maintenu entre la paire de substrats précitée et comprenant une section de traitement permettant de traiter une solution. Le substrat de traitement comprend un trou traversant qui pénètre dans la direction de l'épaisseur de la plaque ; sur au moins un substrat de la paire de substrats est située une section en saillie qui fait saillie vers l'autre substrat de la paire de substrats et qui est insérée dans le trou traversant ; et, au niveau de la pointe de la section en saillie est située une section de soudage permettant de souder la paire de substrats l'un à l'autre.
PCT/JP2018/011388 2018-03-22 2018-03-22 Dispositif fluidique WO2019180870A1 (fr)

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PCT/JP2018/011388 WO2019180870A1 (fr) 2018-03-22 2018-03-22 Dispositif fluidique
JP2020507207A JP6881671B2 (ja) 2018-03-22 2018-03-22 流体デバイス

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006170742A (ja) * 2004-12-15 2006-06-29 Meidensha Corp フローセル型ｑｃｍセンサ
JP2008224431A (ja) * 2007-03-13 2008-09-25 Konica Minolta Opto Inc マイクロチップの製造方法、及びマイクロチップ
JP2010145083A (ja) * 2008-12-16 2010-07-01 Nidec Sankyo Corp 樹脂製接合品およびその製造方法
US20110243813A1 (en) * 2010-03-30 2011-10-06 Jackinsky Steve W Diagnostic card with micro-fluidic channels and method of construction thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006030160A (ja) * 2004-04-14 2006-02-02 Hitachi Maxell Ltd 反応容器
JP2011161578A (ja) * 2010-02-10 2011-08-25 Fujifilm Corp 接合方法、及びマイクロ流路デバイスの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006170742A (ja) * 2004-12-15 2006-06-29 Meidensha Corp フローセル型ｑｃｍセンサ
JP2008224431A (ja) * 2007-03-13 2008-09-25 Konica Minolta Opto Inc マイクロチップの製造方法、及びマイクロチップ
JP2010145083A (ja) * 2008-12-16 2010-07-01 Nidec Sankyo Corp 樹脂製接合品およびその製造方法
US20110243813A1 (en) * 2010-03-30 2011-10-06 Jackinsky Steve W Diagnostic card with micro-fluidic channels and method of construction thereof

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