WO2019176534A1 - Circuit board and method for producing same - Google Patents

Circuit board and method for producing same Download PDF

Info

Publication number
WO2019176534A1
WO2019176534A1 PCT/JP2019/007401 JP2019007401W WO2019176534A1 WO 2019176534 A1 WO2019176534 A1 WO 2019176534A1 JP 2019007401 W JP2019007401 W JP 2019007401W WO 2019176534 A1 WO2019176534 A1 WO 2019176534A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
region
drip
proof material
material film
Prior art date
Application number
PCT/JP2019/007401
Other languages
French (fr)
Japanese (ja)
Inventor
昇 内田
信一 下野
長田　篤
孝真 伊奈
尚平 鳥居
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Publication of WO2019176534A1 publication Critical patent/WO2019176534A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present disclosure relates to a circuit board and a manufacturing method thereof.
  • Patent Document 1 provides a means for preventing the moisture-proofing agent applied to the printed circuit board from reaching the conductive through hole precisely and inexpensively.
  • a double dike is formed by screen printing around a through hole that opens close to a chip capacitor.
  • the moisture-proof agent can also be referred to as a drip-proof material.
  • the double dike is formed precisely and inexpensively together with the print on the substrate.
  • the circuit board comprises: A printed circuit board; Circuit elements mounted on the printed circuit board; A drip-proof material film formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction orthogonal to the thickness direction of the printed circuit board; With The printed circuit board is A first region where the circuit element is mounted and the drip-proof material film is formed; A second region having an application prohibition portion where the formation of the drip-proof material film is prohibited; A partition portion provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction, Have The partition part has a convex part formed by solder.
  • the manufacturing method of the circuit board according to claim 8 includes the following procedures. By providing the printed circuit board with a partition portion having a convex portion formed by solder, the formation of the first region where the circuit element is mounted and the drip-proof material film is formed and the drip-proof material film is prohibited.
  • the second region having the application prohibition portion is partitioned in the in-plane direction orthogonal to the thickness direction of the printed circuit board, Mounting the circuit element in the first region;
  • the drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application prohibited portion by the convex portion.
  • the convex portion is formed by solder, it can be formed higher than screen printing. Therefore, according to such a configuration, the drip-proof material can be satisfactorily prevented from reaching the application-prohibited portion by the convex portion formed by solder.
  • the circuit board comprises: A printed circuit board having an insulating layer formed of an insulating material, and a conductor pattern formed on the insulating layer; Circuit elements mounted on the printed circuit board; A drip-proof material film formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction along the surface of the insulating layer; With The printed circuit board is A first region where the circuit element is mounted and the drip-proof material film is formed; A second region having an application prohibition portion where the formation of the drip-proof material film is prohibited; A partition portion provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction, Have The partition has a groove formed by a portion where the conductor pattern is missing in the in-plane direction or by a hole formed in the insulating layer.
  • a circuit board manufacturing method includes the following procedure.
  • a printed circuit board having an insulating layer formed of an insulating material and a conductor pattern formed on the insulating layer, a portion where the conductor pattern is missing in an in-plane direction along the surface of the insulating layer or the insulating layer
  • a first region in which the circuit element is mounted and the drip-proof material film is formed, and a coating prohibiting portion in which the formation of the drip-proof material film is prohibited are provided.
  • the two regions are partitioned in the in-plane direction by the partition portion having the groove portion, Mounting the circuit element in the first region;
  • the drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application prohibited portion by the groove.
  • the groove portion can be formed deeper than between double embankments formed by screen printing. Therefore, according to this configuration, the drip-proof material can be satisfactorily prevented from reaching the application prohibited portion by the groove portion.
  • the partition portion further includes a convex portion formed by solder. Moreover, the said convex part is provided in the position different from the said groove part about the said in-plane direction.
  • the method for manufacturing a circuit board according to claim 10 includes the following procedure.
  • a printed circuit board having an insulating layer formed of an insulating material and a conductor pattern formed on the insulating layer, a portion where the conductor pattern is missing in an in-plane direction along the surface of the insulating layer or the insulating layer
  • the groove portion is formed by the drilled hole and the convex portion by the solder is formed at a position different from the groove portion in the in-plane direction, whereby the circuit element is mounted and the drip-proof material film is formed.
  • the groove portion can be formed deeper than the groove between the double dike formed by screen printing. Moreover, since the said convex part is formed with solder, it can be formed higher than screen printing. Furthermore, the groove and the convex are provided at different positions in the in-plane direction along the surface of the insulating layer. Therefore, according to this configuration, the drip-proof material can be satisfactorily prevented from reaching the application-prohibited portion by the groove portion and the convex portion.
  • reference numerals with parentheses attached to each element indicate an example of a correspondence relationship between the element and specific means described in an embodiment described later. Therefore, the present disclosure is not limited by the description of the above reference numerals.
  • FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1.
  • FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1.
  • FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1.
  • FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1.
  • the circuit board 1 includes a printed board 2, a circuit element 3, a conductive joint 4, and a drip-proof material film 5.
  • the printed circuit board 2 is formed in a substantially flat plate shape.
  • a right-handed XYZ orthogonal coordinate system is set as shown so that the Z-axis direction is parallel to the thickness direction of the printed circuit board 2.
  • an arbitrary direction orthogonal to the thickness direction that is, a direction parallel to the XY plane is referred to as an “in-plane direction”.
  • the circuit element 3 is mounted on the printed circuit board 2 using a conductive joint 4 that is solder.
  • the drip-proof material film 5 is formed on the printed circuit board 2 so as to cover at least the area around the circuit element 3 in the in-plane direction.
  • the circuit element 3, the conductive joint 4, and the drip-proof material film 5 are provided on the upper surface 20 side of the printed circuit board 2.
  • the upper surface 20 of the printed circuit board 2 has a first region 21, a second region 22, and a partition 23 in the in-plane direction.
  • the circuit element 3 is mounted and a drip-proof material film 5 is formed.
  • the second region 22 has an application prohibition portion 24 where the formation of the drip-proof material film 5 is prohibited.
  • the partition part 23 is provided between the first region 21 and the second region 22 so as to partition the first region 21 and the second region 22 in the in-plane direction. Details of the structure of the partition portion 23 will be described later.
  • the printed circuit board 2 is mainly composed of an insulating layer 25 which is a flat plate member formed of an insulating material such as glass epoxy.
  • the front surface 25a and the back surface 25b which are a pair of main surfaces in the insulating layer 25, are formed in a planar shape whose normal direction is the thickness direction. That is, the thickness direction is a direction that defines the thickness of the printed circuit board 2 and the insulating layer 25 and is a direction orthogonal to the front surface 25a and the back surface 25b.
  • the in-plane direction is a direction along the surface 25a of the insulating layer 25.
  • a through hole 25 c is formed at a position corresponding to the coating prohibition portion 24 in the insulating layer 25.
  • the application prohibition portion 24 has a through hole 25c.
  • the through hole 25c is formed as a so-called “non-through hole” that does not have a conductive portion such as a conductive plating layer.
  • a conductor pattern 26 is provided on the surface 25 a of the insulating layer 25.
  • the conductor pattern 26 is formed of copper foil or the like.
  • a protective film 27 such as a green mask is formed on the printed circuit board 2 at a position where the conductive portion including the conductive bonding portion 4 and the application prohibition portion 24 are not formed. That is, the protective film 27 is provided so as to cover the remainder while exposing a part of the conductor pattern 26 provided on the surface 25a.
  • the laminated body of the insulating layer 25, the conductor pattern 26, and the protective film 27 is referred to as a substrate body 28.
  • the partition part 23 has a groove part 231, a convex part 232, and an additional convex part 233.
  • the groove part 231, the convex part 232, and the additional convex part 233 are provided at different positions in the in-plane direction.
  • the groove portion 231 is disposed at a position farthest from the application prohibition portion 24.
  • the additional convex portion 233 is disposed at a position closest to the application prohibition portion 24.
  • the convex part 232 is disposed between the groove part 231 and the additional convex part 233.
  • the groove portion 231 is provided on the surface 25a side of the insulating layer 25 so as to open in the thickness direction. Specifically, in the present embodiment, the groove 231 is formed by a portion where the conductor pattern 26 is missing in the in-plane direction. That is, the groove 231 has a depth corresponding to the thickness of the conductor pattern 26.
  • the convex portion 232 is formed of solder. That is, the convex portion 232 is formed simultaneously with the conductive joint portion 4 when the conductive joint portion 4 that is solder is formed.
  • the additional protrusion 233 protrudes in the thickness direction on the protective film 27.
  • the additional convex portion 233 is formed of a synthetic resin using a printing technique such as screen printing.
  • a substrate body 28 is prepared.
  • a groove portion 231 is already formed in the substrate body 28 by a portion where the conductor pattern 26 is missing in the in-plane direction.
  • the additional convex portion 233 is formed at a position different from the groove portion 231 in the in-plane direction by a printing technique such as screen printing.
  • a solder layer is formed on the substrate body 28 by applying cream solder or the like.
  • the conductive joint portion 4 and the convex portion 232 are formed simultaneously.
  • the partition part 23 having the groove part 231, the convex part 232, and the additional convex part 233 is formed. That is, the printed circuit board 2 in which the conductive joint portion 4 and the partition portion 23 are formed is manufactured by the steps shown in FIGS.
  • the circuit element 3 is mounted on the first region 21 with respect to the printed circuit board 2 manufactured as described above. Thereafter, the drip-proof material is applied to the first region 21 while preventing the drip-proof material from reaching the application prohibited portion 24 by the groove portion 231, the convex portion 232, and the additional convex portion 233. Thereby, the drip-proof material film 5 is formed in the first region 21 as shown in FIG.
  • the partition part 23 has a groove part 231 and a convex part 232.
  • the groove part 231 can be formed deeper than the groove between the double embankments formed by screen printing.
  • the convex part 232 is formed of solder, it can be formed higher than screen printing.
  • the groove part 231 and the convex part 232 are provided at different positions in the in-plane direction. Therefore, according to such a configuration, the drip-proof material can be satisfactorily prevented from reaching the application prohibited portion 24 by the groove portion 231 and the convex portion 232.
  • the partition part 23 further has an additional convex part 233. Therefore, even if the amount of the drip-proof material is excessive and the drip-proof material gets over the groove portion 231 and the convex portion 232, the drip-proof material may reach the application prohibition portion 24. It can be well blocked by the part 233.
  • the present disclosure is not limited to the specific configuration shown in the above embodiment.
  • the circuit element 3, the conductive joint portion 4, and the drip-proof material film 5 can be provided on the side opposite to the upper surface 20 in the printed board 2, that is, on the back surface 25 b side in the insulating layer 25.
  • the groove 231 can be formed by a hole formed in the insulating layer 25.
  • Such holes can be formed, for example, by laser irradiation using the conductor pattern 26 as a mask. Thereby, the depth of the groove part 231 can be set still larger. Alternatively, the depth of the groove 231 can be set to an arbitrary dimension independently of the thickness of the conductor pattern 26.
  • a plurality of at least one of the groove part 231, the convex part 232, and the additional convex part 233 may be formed.
  • each positional relationship when the groove part 231, the convex part 232, and the additional convex part 233 are provided is not limited to the said specific example. That is, for example, the convex part 232 may be arranged at a position farthest from the application prohibition part 24.
  • the additional convex portion 233 may be formed of solder in the same manner as the convex portion 232.
  • Either one of the groove part 231 and the convex part 232 may be omitted. Further, the additional convex portion 233 can be omitted.
  • the through-hole 25c is not limited to what constitutes a so-called “non-through hole”. That is, for example, the through hole 25c may have a conductive portion such as a conductive plating layer. In other words, the coating prohibition unit 24 may have a so-called “conductive through hole”.
  • coating prohibition part 24 is not limited to the through-hole 25c. That is, for example, the application prohibiting unit 24 may be provided with a connection terminal for forming an electrical connection with the outside.
  • the plurality of components that are integrally formed with each other seamlessly may be formed by sticking separate members to each other.
  • a plurality of constituent elements formed by sticking separate members to each other may be formed integrally with each other without a seam.
  • the materials constituting each part can be changed as appropriate.
  • modified examples are not limited to the above examples.
  • a plurality of modification examples can be combined with each other.
  • all or a part of the above-described embodiment and all or a part of the modified examples can be combined with each other.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A circuit board (1) according to the present invention is provided with: a printed board (2); a circuit element (3) which is mounted on the printed board (2); and a drip proof material film (5) which is formed on the printed board so as to cover at least the region around the circuit element in the in-plane direction that is orthogonal to the thickness direction of the printed board. The printed board has: a first region (21) on which the circuit element is mounted and the drip proof material film is formed; a second region (22) which has a no-coating part (24) where the formation of the drip proof material film is inhibited; and a partition part (23) which is provided between the first region and the second region so as to divide the first region and the second region from each other in the in-plane direction that is orthogonal to the thickness direction of the printed board. The partition part (23) has a projection (232) which is formed of a solder.

Description

回路基板およびその製造方法Circuit board and manufacturing method thereof 関連出願への相互参照Cross-reference to related applications
　本出願は、２０１８年３月１５日に出願された日本特許出願番号２０１８－４７９３２号に基づくもので、ここにその記載内容が参照により組み入れられる。 This application is based on Japanese Patent Application No. 2018-47932 filed on Mar. 15, 2018, the contents of which are incorporated herein by reference.
　本開示は、回路基板およびその製造方法に関する。 The present disclosure relates to a circuit board and a manufacturing method thereof.
　特許文献１は、プリント回路板に塗布された防湿剤が導電スルーホールに達することを防止する手段を、精密かつ安価に提供する。具体的には、特許文献１に記載のプリント回路板においては、チップコンデンサに近接して開口するスルーホールの周囲に、二重堤防が、スクリーン印刷によって形成されている。なお、防湿剤は、防滴材とも称され得る。
　かかる構成においては、防湿剤が余分に塗布されて薄く拡がっても、防湿剤が導電スルーホールに達することが二重堤防によって阻止される。このため、防湿剤が導電スルーホールに達して導電スルーホールを汚染することが、良好に防止され得る。また、二重堤防は、基板上の印字と一緒に、精密かつ安価に形成される。 Patent Document 1 provides a means for preventing the moisture-proofing agent applied to the printed circuit board from reaching the conductive through hole precisely and inexpensively. Specifically, in the printed circuit board described in Patent Document 1, a double dike is formed by screen printing around a through hole that opens close to a chip capacitor. The moisture-proof agent can also be referred to as a drip-proof material.
In such a configuration, even if the moisture-proof agent is applied excessively and spreads thinly, the moisture-proof agent is prevented from reaching the conductive through hole by the double bank. For this reason, it is possible to satisfactorily prevent the moisture-proof agent from reaching the conductive through hole and contaminating the conductive through hole. The double dike is formed precisely and inexpensively together with the print on the substrate.
特開２００３－３０４０５３号公報JP 2003-304053 A
　特許文献１に開示された構成および製造方法においては、スクリーン印刷により形成される二重堤防の高さには限度があった。このため、防滴材の塗布量が多い場合、防滴材が導電スルーホール等の塗布禁止部に到達することを確実に阻止するためには、基板面積を大きくする必要があった。本開示は、上記に例示した事情等に鑑みてなされたものである。すなわち、例えば、本開示は、防滴材の塗布量が多い場合にも、基板の大型化を可及的に回避しつつ、防滴材が塗布禁止部に到達することを確実に阻止することが可能な、回路基板およびその製造方法を提供する。 In the configuration and manufacturing method disclosed in Patent Document 1, there is a limit to the height of the double dike formed by screen printing. For this reason, when the application amount of the drip-proof material is large, it is necessary to increase the substrate area in order to reliably prevent the drip-proof material from reaching the application prohibited portion such as the conductive through hole. The present disclosure has been made in view of the circumstances exemplified above. That is, for example, the present disclosure reliably prevents the drip-proof material from reaching the application-prohibited portion while avoiding the enlargement of the substrate as much as possible even when the amount of the drip-proof material is large. A circuit board and a manufacturing method thereof are provided.
　本開示の１つの観点によれば、回路基板は、
　プリント基板と、
　前記プリント基板上に実装される回路素子と、
　前記プリント基板の厚さ方向と直交する面内方向における少なくとも前記回路素子の周囲の領域を被覆するように、前記プリント基板上に形成された防滴材膜と、
　を備え、
　前記プリント基板は、
　前記回路素子が実装されるとともに前記防滴材膜が形成される第一領域と、
　前記防滴材膜の形成が禁止される塗布禁止部を有する第二領域と、
　前記面内方向について、前記第一領域と前記第二領域とを区画するように前記第一領域と前記第二領域との間に設けられた区画部と、
　を有し、
　前記区画部は、ハンダによって形成された凸部を有する。 According to one aspect of the present disclosure, the circuit board comprises:
A printed circuit board;
Circuit elements mounted on the printed circuit board;
A drip-proof material film formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction orthogonal to the thickness direction of the printed circuit board;
With
The printed circuit board is
A first region where the circuit element is mounted and the drip-proof material film is formed;
A second region having an application prohibition portion where the formation of the drip-proof material film is prohibited;
A partition portion provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction,
Have
The partition part has a convex part formed by solder.
　請求項８に記載の回路基板の製造方法は、以下の手順を含む。
　ハンダによって形成された凸部を有する区画部をプリント基板に設けることで、回路素子が実装されるとともに防滴材膜が形成される第一領域と、前記防滴材膜の形成が禁止される塗布禁止部を有する第二領域とを、前記プリント基板の厚さ方向と直交する面内方向について区画し、
　前記回路素子を前記第一領域に実装し、
　前記凸部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する。 The manufacturing method of the circuit board according to claim 8 includes the following procedures.
By providing the printed circuit board with a partition portion having a convex portion formed by solder, the formation of the first region where the circuit element is mounted and the drip-proof material film is formed and the drip-proof material film is prohibited. The second region having the application prohibition portion is partitioned in the in-plane direction orthogonal to the thickness direction of the printed circuit board,
Mounting the circuit element in the first region;
The drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application prohibited portion by the convex portion.
　かかる構成および製造方法においては、前記凸部はハンダによって形成されるため、スクリーン印刷よりも高く形成され得る。したがって、かかる構成によれば、防滴材が前記塗布禁止部に到達することが、ハンダによって形成された前記凸部によって良好に阻止され得る。 In such a configuration and manufacturing method, since the convex portion is formed by solder, it can be formed higher than screen printing. Therefore, according to such a configuration, the drip-proof material can be satisfactorily prevented from reaching the application-prohibited portion by the convex portion formed by solder.
　本開示の他の１つの観点によれば、回路基板は、
　絶縁材料によって形成された絶縁層と、前記絶縁層上に形成された導体パターンとを有するプリント基板と、
　前記プリント基板上に実装される回路素子と、
　前記絶縁層の表面に沿った面内方向における少なくとも前記回路素子の周囲の領域を被覆するように、前記プリント基板上に形成された防滴材膜と、
　を備え、
　前記プリント基板は、
　前記回路素子が実装されるとともに前記防滴材膜が形成される第一領域と、
　前記防滴材膜の形成が禁止される塗布禁止部を有する第二領域と、
　前記面内方向について、前記第一領域と前記第二領域とを区画するように前記第一領域と前記第二領域との間に設けられた区画部と、
　を有し、
　前記区画部は、前記面内方向について前記導体パターンが欠損した部分、または前記絶縁層に穿設された孔によって形成された、溝部を有する。 According to another aspect of the present disclosure, the circuit board comprises:
A printed circuit board having an insulating layer formed of an insulating material, and a conductor pattern formed on the insulating layer;
Circuit elements mounted on the printed circuit board;
A drip-proof material film formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction along the surface of the insulating layer;
With
The printed circuit board is
A first region where the circuit element is mounted and the drip-proof material film is formed;
A second region having an application prohibition portion where the formation of the drip-proof material film is prohibited;
A partition portion provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction,
Have
The partition has a groove formed by a portion where the conductor pattern is missing in the in-plane direction or by a hole formed in the insulating layer.
　本開示のさらに他の１つの観点によれば、回路基板の製造方法は、以下の手順を含む。
　絶縁材料によって形成された絶縁層と前記絶縁層上に形成された導体パターンとを有するプリント基板に、前記絶縁層の表面に沿った面内方向について前記導体パターンが欠損した部分または前記絶縁層に穿設された孔により溝部を形成することで、回路素子が実装されるとともに防滴材膜が形成される第一領域と、前記防滴材膜の形成が禁止される塗布禁止部を有する第二領域とを、前記溝部を有する区画部によって前記面内方向について区画し、
　前記回路素子を前記第一領域に実装し、
　前記溝部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する。 According to still another aspect of the present disclosure, a circuit board manufacturing method includes the following procedure.
In a printed circuit board having an insulating layer formed of an insulating material and a conductor pattern formed on the insulating layer, a portion where the conductor pattern is missing in an in-plane direction along the surface of the insulating layer or the insulating layer By forming the groove portion with the perforated hole, a first region in which the circuit element is mounted and the drip-proof material film is formed, and a coating prohibiting portion in which the formation of the drip-proof material film is prohibited are provided. The two regions are partitioned in the in-plane direction by the partition portion having the groove portion,
Mounting the circuit element in the first region;
The drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application prohibited portion by the groove.
　かかる構成および製造方法においては、前記溝部は、スクリーン印刷によって形成した二重堤防の間よりも深く形成され得る。したがって、かかる構成によれば、防滴材が前記塗布禁止部に到達することが、前記溝部によって良好に阻止され得る。 In such a configuration and manufacturing method, the groove portion can be formed deeper than between double embankments formed by screen printing. Therefore, according to this configuration, the drip-proof material can be satisfactorily prevented from reaching the application prohibited portion by the groove portion.
　本開示のさらに他の１つの観点によれば、回路基板においては、前記区画部は、ハンダによって形成された凸部をさらに有している。また、前記凸部は、前記面内方向について、前記溝部とは異なる位置に設けられている。 According to still another aspect of the present disclosure, in the circuit board, the partition portion further includes a convex portion formed by solder. Moreover, the said convex part is provided in the position different from the said groove part about the said in-plane direction.
　請求項１０に記載の回路基板の製造方法は、以下の手順を含む。
　絶縁材料によって形成された絶縁層と前記絶縁層上に形成された導体パターンとを有するプリント基板に、前記絶縁層の表面に沿った面内方向について前記導体パターンが欠損した部分または前記絶縁層に穿設された孔により溝部を形成するとともにハンダによる凸部を前記面内方向について前記溝部とは異なる位置に形成することで、回路素子が実装されるとともに防滴材膜が形成される第一領域と、前記防滴材膜の形成が禁止される塗布禁止部を有する第二領域とを、前記溝部および前記凸部を有する区画部によって前記面内方向について区画し、
　前記回路素子を前記第一領域に実装し、
　前記溝部および前記凸部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する。 The method for manufacturing a circuit board according to claim 10 includes the following procedure.
In a printed circuit board having an insulating layer formed of an insulating material and a conductor pattern formed on the insulating layer, a portion where the conductor pattern is missing in an in-plane direction along the surface of the insulating layer or the insulating layer The groove portion is formed by the drilled hole and the convex portion by the solder is formed at a position different from the groove portion in the in-plane direction, whereby the circuit element is mounted and the drip-proof material film is formed. Partitioning the region and the second region having the application prohibition portion where the formation of the drip-proof material film is prohibited with respect to the in-plane direction by the partition portion having the groove and the convex portion,
Mounting the circuit element in the first region;
The drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application-prohibited portion by the grooves and the protrusions.
　かかる構成および製造方法においては、前記溝部は、スクリーン印刷によって形成した二重堤防の間の溝よりも深く形成され得る。また、前記凸部はハンダによって形成されるため、スクリーン印刷よりも高く形成され得る。さらに、前記溝部と前記凸部とは、前記絶縁層の前記表面に沿った前記面内方向について、異なる位置に設けられている。したがって、かかる構成によれば、防滴材が前記塗布禁止部に到達することが、前記溝部と前記凸部とによって良好に阻止され得る。 In such a configuration and manufacturing method, the groove portion can be formed deeper than the groove between the double dike formed by screen printing. Moreover, since the said convex part is formed with solder, it can be formed higher than screen printing. Furthermore, the groove and the convex are provided at different positions in the in-plane direction along the surface of the insulating layer. Therefore, according to this configuration, the drip-proof material can be satisfactorily prevented from reaching the application-prohibited portion by the groove portion and the convex portion.
　なお、各欄における、各要素に付された括弧付きの参照符号は、同要素と後述する実施形態に記載の具体的手段との対応関係の一例を示すものである。よって、本開示は、上記の参照符号の記載によって、何ら限定されるものではない。 In each column, reference numerals with parentheses attached to each element indicate an example of a correspondence relationship between the element and specific means described in an embodiment described later. Therefore, the present disclosure is not limited by the description of the above reference numerals.
実施形態に係る回路基板の概略構成を示す側断面図である。It is a sectional side view showing the schematic structure of the circuit board concerning an embodiment. 図１に示された回路基板の製造工程の概略を示す側断面図である。FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1. 図１に示された回路基板の製造工程の概略を示す側断面図である。FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1. 図１に示された回路基板の製造工程の概略を示す側断面図である。FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1. 図１に示された回路基板の製造工程の概略を示す側断面図である。FIG. 2 is a side sectional view showing an outline of a manufacturing process of the circuit board shown in FIG. 1. 一変形例に係る回路基板の製造工程の概略を示す側断面図である。It is a sectional side view which shows the outline of the manufacturing process of the circuit board which concerns on one modification.
　（実施形態）
　以下、実施形態を、図面に基づいて説明する。なお、一つの実施形態に対して適用可能な各種の変形例については、当該実施形態に関する一連の説明の途中に挿入されると当該実施形態の理解が妨げられるおそれがあるため、当該実施形態の説明の後にまとめて記載する。 (Embodiment)
Hereinafter, embodiments will be described with reference to the drawings. Note that various modifications that can be applied to one embodiment may interfere with understanding of the embodiment if inserted in the middle of a series of descriptions related to the embodiment. It is described collectively after the explanation.
　図１を参照すると、回路基板１は、プリント基板２と、回路素子３と、導電接合部４と、防滴材膜５とを備えている。プリント基板２は、略平板状に形成されている。説明の便宜上、Ｚ軸方向がプリント基板２の厚さ方向と平行となるように、図示の通りに右手系ＸＹＺ直交座標系を設定する。このとき、厚さ方向と直交する任意の方向、すなわち、ＸＹ平面と平行な方向を、「面内方向」と称する。 Referring to FIG. 1, the circuit board 1 includes a printed board 2, a circuit element 3, a conductive joint 4, and a drip-proof material film 5. The printed circuit board 2 is formed in a substantially flat plate shape. For convenience of explanation, a right-handed XYZ orthogonal coordinate system is set as shown so that the Z-axis direction is parallel to the thickness direction of the printed circuit board 2. At this time, an arbitrary direction orthogonal to the thickness direction, that is, a direction parallel to the XY plane is referred to as an “in-plane direction”.
　回路素子３は、ハンダである導電接合部４を用いて、プリント基板２上に実装されている。防滴材膜５は、面内方向における少なくとも回路素子３の周囲の領域を被覆するように、プリント基板２上に形成されている。本実施形態においては、回路素子３、導電接合部４、および防滴材膜５は、プリント基板２における上面２０側に設けられている。 The circuit element 3 is mounted on the printed circuit board 2 using a conductive joint 4 that is solder. The drip-proof material film 5 is formed on the printed circuit board 2 so as to cover at least the area around the circuit element 3 in the in-plane direction. In the present embodiment, the circuit element 3, the conductive joint 4, and the drip-proof material film 5 are provided on the upper surface 20 side of the printed circuit board 2.
　プリント基板２の上面２０は、面内方向について、第一領域２１と、第二領域２２と、区画部２３とを有している。第一領域２１には、回路素子３が実装されるとともに、防滴材膜５が形成されている。第二領域２２は、防滴材膜５の形成が禁止される塗布禁止部２４を有している。 The upper surface 20 of the printed circuit board 2 has a first region 21, a second region 22, and a partition 23 in the in-plane direction. In the first region 21, the circuit element 3 is mounted and a drip-proof material film 5 is formed. The second region 22 has an application prohibition portion 24 where the formation of the drip-proof material film 5 is prohibited.
　区画部２３は、面内方向について、第一領域２１と第二領域２２とを区画するように、第一領域２１と第二領域２２との間に設けられている。区画部２３の構造の詳細については後述する。 The partition part 23 is provided between the first region 21 and the second region 22 so as to partition the first region 21 and the second region 22 in the in-plane direction. Details of the structure of the partition portion 23 will be described later.
　区画部２３の構造の詳細を説明する前に、まず、プリント基板２の全体構成について説明する。図１に示されているように、プリント基板２は、ガラスエポキシ等の絶縁性材料によって形成された平板状部材である絶縁層２５を主体として構成されている。 Before explaining the details of the structure of the partition part 23, first, the overall configuration of the printed circuit board 2 will be explained. As shown in FIG. 1, the printed circuit board 2 is mainly composed of an insulating layer 25 which is a flat plate member formed of an insulating material such as glass epoxy.
　絶縁層２５における一対の主面である表面２５ａおよび裏面２５ｂは、厚さ方向を法線方向とする平面状に形成されている。すなわち、厚さ方向は、プリント基板２および絶縁層２５の厚さを規定する方向であって、表面２５ａおよび裏面２５ｂと直交する方向である。また、面内方向は、絶縁層２５における表面２５ａに沿った方向である。絶縁層２５における、塗布禁止部２４に対応する位置には、貫通孔２５ｃが形成されている。すなわち、本実施形態においては、塗布禁止部２４は、貫通孔２５ｃを有している。貫通孔２５ｃは、導電メッキ層等の導電部を有しない、いわゆる「ノンスルーホール」として形成されている。 The front surface 25a and the back surface 25b, which are a pair of main surfaces in the insulating layer 25, are formed in a planar shape whose normal direction is the thickness direction. That is, the thickness direction is a direction that defines the thickness of the printed circuit board 2 and the insulating layer 25 and is a direction orthogonal to the front surface 25a and the back surface 25b. The in-plane direction is a direction along the surface 25a of the insulating layer 25. A through hole 25 c is formed at a position corresponding to the coating prohibition portion 24 in the insulating layer 25. In other words, in the present embodiment, the application prohibition portion 24 has a through hole 25c. The through hole 25c is formed as a so-called “non-through hole” that does not have a conductive portion such as a conductive plating layer.
　絶縁層２５における表面２５ａ上には、導体パターン２６が設けられている。導体パターン２６は、銅箔等によって形成されている。また、プリント基板２における、導電接合部４を含む導通部および塗布禁止部２４が形成されない位置には、グリーンマスク等の保護膜２７が形成されている。すなわち、保護膜２７は、表面２５ａ上に設けられた導体パターン２６の一部を露出させつつ残部を被覆するように設けられている。絶縁層２５と、導体パターン２６と、保護膜２７との積層体を、以下、基板本体２８と称する。 A conductor pattern 26 is provided on the surface 25 a of the insulating layer 25. The conductor pattern 26 is formed of copper foil or the like. Further, a protective film 27 such as a green mask is formed on the printed circuit board 2 at a position where the conductive portion including the conductive bonding portion 4 and the application prohibition portion 24 are not formed. That is, the protective film 27 is provided so as to cover the remainder while exposing a part of the conductor pattern 26 provided on the surface 25a. Hereinafter, the laminated body of the insulating layer 25, the conductor pattern 26, and the protective film 27 is referred to as a substrate body 28.
　本実施形態においては、区画部２３は、溝部２３１と、凸部２３２と、追加凸部２３３とを有している。溝部２３１と、凸部２３２と、追加凸部２３３とは、面内方向について、互いに異なる位置に設けられている。具体的には、本実施形態においては、溝部２３１は、塗布禁止部２４から最も遠い位置に配置されている。また、追加凸部２３３は、塗布禁止部２４に最も近い位置に配置されている。凸部２３２は、溝部２３１と追加凸部２３３との間に配置されている。 In the present embodiment, the partition part 23 has a groove part 231, a convex part 232, and an additional convex part 233. The groove part 231, the convex part 232, and the additional convex part 233 are provided at different positions in the in-plane direction. Specifically, in the present embodiment, the groove portion 231 is disposed at a position farthest from the application prohibition portion 24. Further, the additional convex portion 233 is disposed at a position closest to the application prohibition portion 24. The convex part 232 is disposed between the groove part 231 and the additional convex part 233.
　溝部２３１は、絶縁層２５における表面２５ａ側にて、厚さ方向に開口するように設けられている。具体的には、本実施形態においては、溝部２３１は、面内方向について導体パターン２６が欠損した部分によって形成されている。すなわち、溝部２３１は、導体パターン２６の厚さに相当する深さを有している。 The groove portion 231 is provided on the surface 25a side of the insulating layer 25 so as to open in the thickness direction. Specifically, in the present embodiment, the groove 231 is formed by a portion where the conductor pattern 26 is missing in the in-plane direction. That is, the groove 231 has a depth corresponding to the thickness of the conductor pattern 26.
　凸部２３２は、ハンダによって形成されている。すなわち、凸部２３２は、ハンダである導電接合部４を形成する際に、導電接合部４と同時に形成されるようになっている。追加凸部２３３は、保護膜２７上にて、厚さ方向に突設されている。具体的には、追加凸部２３３は、スクリーン印刷等の印刷技術を用いて、合成樹脂によって形成されている。 The convex portion 232 is formed of solder. That is, the convex portion 232 is formed simultaneously with the conductive joint portion 4 when the conductive joint portion 4 that is solder is formed. The additional protrusion 233 protrudes in the thickness direction on the protective film 27. Specifically, the additional convex portion 233 is formed of a synthetic resin using a printing technique such as screen printing.
　（製造方法）
　以下、図１に示された、本実施形態に係る回路基板１の製造方法について、図１～図５を参照しつつ説明する。 (Production method)
Hereinafter, a method for manufacturing the circuit board 1 according to the present embodiment shown in FIG. 1 will be described with reference to FIGS.
　まず、図２に示されているように、基板本体２８を用意する。基板本体２８には、すでに、面内方向について導体パターン２６が欠損した部分により、溝部２３１が形成されている。 First, as shown in FIG. 2, a substrate body 28 is prepared. A groove portion 231 is already formed in the substrate body 28 by a portion where the conductor pattern 26 is missing in the in-plane direction.
　次に、図３に示されているように、スクリーン印刷等の印刷技術により、追加凸部２３３を、面内方向について溝部２３１とは異なる位置に形成する。続いて、クリームハンダ塗布等により、基板本体２８上にハンダ層を形成する。これにより、図４に示されているように、導電接合部４と凸部２３２とが、同時に形成される。 Next, as shown in FIG. 3, the additional convex portion 233 is formed at a position different from the groove portion 231 in the in-plane direction by a printing technique such as screen printing. Subsequently, a solder layer is formed on the substrate body 28 by applying cream solder or the like. Thereby, as shown in FIG. 4, the conductive joint portion 4 and the convex portion 232 are formed simultaneously.
　このようにして、溝部２３１と凸部２３２と追加凸部２３３とを有する区画部２３が形成される。すなわち、図２～図４に示されている工程により、導電接合部４と区画部２３とが形成されたプリント基板２が製造される。 In this way, the partition part 23 having the groove part 231, the convex part 232, and the additional convex part 233 is formed. That is, the printed circuit board 2 in which the conductive joint portion 4 and the partition portion 23 are formed is manufactured by the steps shown in FIGS.
　上記のようにして製造されたプリント基板２に対して、図５に示されているように、回路素子３が第一領域２１に実装される。その後、溝部２３１、凸部２３２および追加凸部２３３によって防滴材が塗布禁止部２４に達しないようにしつつ、防滴材が第一領域２１に塗布される。これにより、図１に示されているように、防滴材膜５が第一領域２１に形成される。 As shown in FIG. 5, the circuit element 3 is mounted on the first region 21 with respect to the printed circuit board 2 manufactured as described above. Thereafter, the drip-proof material is applied to the first region 21 while preventing the drip-proof material from reaching the application prohibited portion 24 by the groove portion 231, the convex portion 232, and the additional convex portion 233. Thereby, the drip-proof material film 5 is formed in the first region 21 as shown in FIG.
　（効果）
　以下、本実施形態の構成および製造方法による効果について、各図を参照しつつ説明する。 (effect)
Hereinafter, effects of the configuration and the manufacturing method of the present embodiment will be described with reference to the drawings.
　本実施形態においては、区画部２３は、溝部２３１と凸部２３２とを有している。溝部２３１は、スクリーン印刷によって形成した二重堤防の間の溝よりも深く形成され得る。また、凸部２３２はハンダによって形成されるため、スクリーン印刷よりも高く形成され得る。さらに、溝部２３１と凸部２３２とは、面内方向について異なる位置に設けられている。したがって、かかる構成によれば、防滴材が塗布禁止部２４に到達することが、溝部２３１と凸部２３２とによって良好に阻止され得る。 In the present embodiment, the partition part 23 has a groove part 231 and a convex part 232. The groove part 231 can be formed deeper than the groove between the double embankments formed by screen printing. Moreover, since the convex part 232 is formed of solder, it can be formed higher than screen printing. Furthermore, the groove part 231 and the convex part 232 are provided at different positions in the in-plane direction. Therefore, according to such a configuration, the drip-proof material can be satisfactorily prevented from reaching the application prohibited portion 24 by the groove portion 231 and the convex portion 232.
　また、本実施形態においては、区画部２３は、さらに、追加凸部２３３を有している。このため、仮に防滴材の量が過剰であるために防滴材が溝部２３１および凸部２３２を乗り越えた場合であっても、防滴材が塗布禁止部２４に到達することが、追加凸部２３３によって良好に阻止され得る。 In the present embodiment, the partition part 23 further has an additional convex part 233. Therefore, even if the amount of the drip-proof material is excessive and the drip-proof material gets over the groove portion 231 and the convex portion 232, the drip-proof material may reach the application prohibition portion 24. It can be well blocked by the part 233.
　（変形例）
　本開示は、上記実施形態に限定されるものではない。故に、上記実施形態に対しては、適宜変更が可能である。以下、代表的な変形例について説明する。以下の変形例の説明においては、主として、上記実施形態と異なる部分について説明する。また、上記実施形態と変形例とにおいて、相互に同一または均等である部分には、同一符号が付されている。したがって、以下の変形例の説明において、上記実施形態と同一の符号を有する構成要素に関しては、技術的矛盾または特段の追加説明なき限り、上記実施形態における説明が適宜援用され得る。 (Modification)
The present disclosure is not limited to the above embodiment. Therefore, it can change suitably with respect to the said embodiment. Hereinafter, typical modifications will be described. In the following description of the modified examples, mainly the portions different from the above embodiment will be described. Moreover, in the said embodiment and a modification, the same code | symbol is attached | subjected to the part which is mutually the same or equivalent. Therefore, in the following description of the modified example, regarding the components having the same reference numerals as those in the above embodiment, the description in the above embodiment can be incorporated as appropriate unless there is a technical contradiction or special additional explanation.
　本開示は、上記実施形態にて示された具体的構成に限定されない。例えば、回路素子３、導電接合部４、および防滴材膜５は、プリント基板２における上面２０とは反対側、すなわち、絶縁層２５における裏面２５ｂ側にも設けられ得る。 The present disclosure is not limited to the specific configuration shown in the above embodiment. For example, the circuit element 3, the conductive joint portion 4, and the drip-proof material film 5 can be provided on the side opposite to the upper surface 20 in the printed board 2, that is, on the back surface 25 b side in the insulating layer 25.
　図６に示されているように、溝部２３１は、絶縁層２５に穿設された孔によって形成され得る。かかる孔は、例えば、導体パターン２６をマスクとしたレーザー照射によって形成され得る。これにより、溝部２３１の深さが、さらに大きく設定され得る。あるいは、溝部２３１の深さが、導体パターン２６の厚さとは独立に、任意の寸法に設定され得る。 As shown in FIG. 6, the groove 231 can be formed by a hole formed in the insulating layer 25. Such holes can be formed, for example, by laser irradiation using the conductor pattern 26 as a mask. Thereby, the depth of the groove part 231 can be set still larger. Alternatively, the depth of the groove 231 can be set to an arbitrary dimension independently of the thickness of the conductor pattern 26.
　溝部２３１、凸部２３２、および追加凸部２３３の少なくともいずれか一種は、複数個形成され得る。 A plurality of at least one of the groove part 231, the convex part 232, and the additional convex part 233 may be formed.
　溝部２３１と凸部２３２と追加凸部２３３とが設けられる場合の、それぞれの位置関係は、上記具体例に限定されない。すなわち、例えば、凸部２３２が塗布禁止部２４から最も遠い位置に配置されていてもよい。 Each positional relationship when the groove part 231, the convex part 232, and the additional convex part 233 are provided is not limited to the said specific example. That is, for example, the convex part 232 may be arranged at a position farthest from the application prohibition part 24.
　追加凸部２３３は、凸部２３２と同様に、ハンダにより形成されてもよい。 The additional convex portion 233 may be formed of solder in the same manner as the convex portion 232.
　溝部２３１と凸部２３２とのいずれか一方は、省略され得る。また、追加凸部２３３は、省略され得る。 Either one of the groove part 231 and the convex part 232 may be omitted. Further, the additional convex portion 233 can be omitted.
　いわゆる「ノンスルーホール」として形成された貫通孔２５ｃの用途についても、特段の限定はない。すなわち、例えば、貫通孔２５ｃは、コネクタ等の仮止め用に用いられ得る。あるいは、例えば、貫通孔２５ｃは、プリント基板２を収容するケーシングとプリント基板２との固定用に用いられ得る。 There is no particular limitation on the use of the through hole 25 c formed as a so-called “non-through hole”. That is, for example, the through hole 25c can be used for temporarily fixing a connector or the like. Alternatively, for example, the through hole 25 c can be used for fixing the casing that accommodates the printed circuit board 2 and the printed circuit board 2.
　貫通孔２５ｃは、いわゆる「ノンスルーホール」を構成するものに限定されない。すなわち、例えば、貫通孔２５ｃには、導電メッキ層等の導電部を有していてもよい。換言すれば、塗布禁止部２４は、いわゆる「導電スルーホール」を有していてもよい。 The through-hole 25c is not limited to what constitutes a so-called “non-through hole”. That is, for example, the through hole 25c may have a conductive portion such as a conductive plating layer. In other words, the coating prohibition unit 24 may have a so-called “conductive through hole”.
　塗布禁止部２４は、貫通孔２５ｃに限定されない。すなわち、例えば、塗布禁止部２４には、外部との電気接続を形成するための接続端子等が設けられ得る。 Application | coating prohibition part 24 is not limited to the through-hole 25c. That is, for example, the application prohibiting unit 24 may be provided with a connection terminal for forming an electrical connection with the outside.
　上記説明において、互いに継目無く一体に形成されていた複数の構成要素は、互いに別体の部材を貼り合わせることによって形成されてもよい。同様に、互いに別体の部材を貼り合わせることによって形成されていた複数の構成要素は、互いに継目無く一体に形成されてもよい。また、各部を構成する材料についても、適宜変更が可能である。 In the above description, the plurality of components that are integrally formed with each other seamlessly may be formed by sticking separate members to each other. Similarly, a plurality of constituent elements formed by sticking separate members to each other may be formed integrally with each other without a seam. Further, the materials constituting each part can be changed as appropriate.
　変形例も、上記の例示に限定されない。また、複数の変形例が、相互に組み合わされ得る。さらに、上記実施形態の全部または一部と、変形例の全部または一部とが、相互に組み合わされ得る。 The modified examples are not limited to the above examples. A plurality of modification examples can be combined with each other. Furthermore, all or a part of the above-described embodiment and all or a part of the modified examples can be combined with each other.
　上記実施形態および変形例を構成する要素は、特に必須であると明示した場合および原理的に明らかに必須であると考えられる場合等を除き、必ずしも必須のものではないことは言うまでもない。また、構成要素の個数、数値、量、範囲等の数値が言及されている場合、特に必須であると明示した場合および原理的に明らかに特定の数に限定される場合等を除き、その特定の数に本開示が限定されることはない。同様に、構成要素等の形状、方向、位置関係等が言及されている場合、特に必須であると明示した場合および原理的に特定の形状、方向、位置関係等に限定される場合等を除き、その形状、方向、位置関係等に本開示が限定されることはない。各要素を構成する材料についても、特段の限定はなく、上記の例示とは異なるものが適宜用いられ得る。 It goes without saying that the elements constituting the above-described embodiment and modification examples are not necessarily indispensable except for the case where it is clearly stated that it is essential and the case where it is considered that it is clearly essential in principle. In addition, when numerical values such as the number, numerical value, quantity, range, etc. of a component are mentioned, the specifics are specified unless explicitly stated as being essential, and clearly limited to a specific number in principle. The present disclosure is not limited to any number. Similarly, when the shape, direction, positional relationship, etc. of a component are mentioned, except when clearly stated as essential and in principle limited to a specific shape, direction, positional relationship, etc. The present disclosure is not limited to the shape, direction, positional relationship, and the like. There are no particular limitations on the material constituting each element, and materials different from the above examples may be used as appropriate.

Claims (10)

  1. 　回路基板（１）であって、
    　プリント基板（２）と、
    　前記プリント基板上に実装される回路素子（３）と、
    　前記プリント基板の厚さ方向と直交する面内方向における少なくとも前記回路素子の周囲の領域を被覆するように、前記プリント基板上に形成された防滴材膜（５）と、
    　を備え、
    　前記プリント基板は、
    　前記回路素子が実装されるとともに前記防滴材膜が形成される第一領域（２１）と、
    　前記防滴材膜の形成が禁止される塗布禁止部（２４）を有する第二領域（２２）と、
    　前記面内方向について、前記第一領域と前記第二領域とを区画するように前記第一領域と前記第二領域との間に設けられた区画部（２３）と、
    　を有し、
    　前記区画部は、ハンダによって形成された凸部（２３２）を有する、
    　回路基板。     A circuit board (1),
    A printed circuit board (2);
    A circuit element (3) mounted on the printed circuit board;
    A drip-proof material film (5) formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction orthogonal to the thickness direction of the printed circuit board;
    With
    The printed circuit board is
    A first region (21) on which the circuit element is mounted and the drip-proof material film is formed;
    A second region (22) having an application prohibition portion (24) where the formation of the drip-proof material film is prohibited;
    A partition (23) provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction;
    Have
    The partition part has a convex part (232) formed by solder,
    Circuit board.
  2. 　前記区画部は、合成樹脂によって形成された追加凸部（２３３）をさらに有し、
    　前記追加凸部は、前記面内方向について、前記凸部とは異なる位置に設けられた、
    　請求項１に記載の回路基板。     The partition part further includes an additional convex part (233) formed of a synthetic resin,
    The additional convex portion is provided at a position different from the convex portion in the in-plane direction.
    The circuit board according to claim 1.
  3. 　回路基板（１）であって、
    　絶縁材料によって形成された絶縁層（２５）と、前記絶縁層上に形成された導体パターン（２６）とを有するプリント基板（２）と、
    　前記プリント基板上に実装される回路素子（３）と、
    　前記絶縁層の表面（２５ａ）に沿った面内方向における少なくとも前記回路素子の周囲の領域を被覆するように、前記プリント基板上に形成された防滴材膜（５）と、
    　を備え、
    　前記プリント基板は、
    　前記回路素子が実装されるとともに前記防滴材膜が形成される第一領域（２１）と、
    　前記防滴材膜の形成が禁止される塗布禁止部（２４）を有する第二領域（２２）と、
    　前記面内方向について、前記第一領域と前記第二領域とを区画するように前記第一領域と前記第二領域との間に設けられた区画部（２３）と、
    　を有し、
    　前記区画部は、前記面内方向について前記導体パターンが欠損した部分、または前記絶縁層に穿設された孔によって形成された、溝部（２３１）を有する、
    　回路基板。     A circuit board (1),
    A printed circuit board (2) having an insulating layer (25) formed of an insulating material and a conductor pattern (26) formed on the insulating layer;
    A circuit element (3) mounted on the printed circuit board;
    A drip-proof material film (5) formed on the printed circuit board so as to cover at least a region around the circuit element in an in-plane direction along the surface (25a) of the insulating layer;
    With
    The printed circuit board is
    A first region (21) on which the circuit element is mounted and the drip-proof material film is formed;
    A second region (22) having an application prohibition portion (24) where the formation of the drip-proof material film is prohibited;
    A partition (23) provided between the first region and the second region so as to partition the first region and the second region with respect to the in-plane direction;
    Have
    The partition part has a groove part (231) formed by a part in which the conductor pattern is missing in the in-plane direction or a hole formed in the insulating layer.
    Circuit board.
  4. 　前記区画部は、ハンダによって形成された凸部（２３２）をさらに有し、
    　前記凸部は、前記面内方向について、前記溝部とは異なる位置に設けられた、
    　請求項３に記載の回路基板。     The partition part further has a convex part (232) formed by solder,
    The convex portion is provided at a position different from the groove portion in the in-plane direction.
    The circuit board according to claim 3.
  5. 　前記区画部は、合成樹脂によって形成された追加凸部（２３３）をさらに有し、
    　前記追加凸部は、前記面内方向について、前記溝部および前記凸部とは異なる位置に設けられた、
    　請求項４に記載の回路基板。     The partition part further includes an additional convex part (233) formed of a synthetic resin,
    The additional protrusion is provided at a position different from the groove and the protrusion in the in-plane direction.
    The circuit board according to claim 4.
  6. 　前記区画部は、合成樹脂によって形成された追加凸部（２３３）をさらに有し、
    　前記追加凸部は、前記面内方向について、前記溝部とは異なる位置に設けられた、
    　請求項３に記載の回路基板。     The partition part further includes an additional convex part (233) formed of a synthetic resin,
    The additional convex portion is provided at a position different from the groove portion in the in-plane direction.
    The circuit board according to claim 3.
  7. 　前記塗布禁止部は、導電スルーホールまたはノンスルーホールを構成する貫通孔を有する、
    　請求項１～６のいずれか１つに記載の回路基板。     The application prohibition portion has a through hole that constitutes a conductive through hole or a non-through hole,
    The circuit board according to any one of claims 1 to 6.
  8. 　回路基板（１）の製造方法であって、
    　ハンダによって形成された凸部（２３２）を有する区画部（２３）をプリント基板（２）に設けることで、回路素子（３）が実装されるとともに防滴材膜（５）が形成される第一領域（２１）と、前記防滴材膜の形成が禁止される塗布禁止部（２４）を有する第二領域（２２）とを、前記プリント基板の厚さ方向と直交する面内方向について区画し、
    　前記回路素子を前記第一領域に実装し、
    　前記凸部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する、
    　回路基板の製造方法。     A method for manufacturing a circuit board (1), comprising:
    By providing the printed circuit board (2) with the partition part (23) having the convex part (232) formed by the solder, the circuit element (3) is mounted and the drip-proof material film (5) is formed. A region (21) and a second region (22) having an application prohibition portion (24) where the formation of the drip-proof material film is prohibited are partitioned in an in-plane direction perpendicular to the thickness direction of the printed circuit board. And
    Mounting the circuit element in the first region;
    Applying the drip-proof material film to the first region while preventing the drip-proof material film from reaching the application-prohibited portion by the convex portion;
    A method of manufacturing a circuit board.
  9. 　回路基板（１）の製造方法であって、
    　絶縁材料によって形成された絶縁層（２５）と前記絶縁層上に形成された導体パターン（２６）とを有するプリント基板（２）に、前記絶縁層の表面（２５ａ）に沿った面内方向について前記導体パターンが欠損した部分または前記絶縁層に穿設された孔により溝部（２３１）を形成することで、回路素子（３）が実装されるとともに防滴材膜（５）が形成される第一領域（２１）と、前記防滴材膜の形成が禁止される塗布禁止部（２４）を有する第二領域（２２）とを、前記溝部を有する区画部（２３）によって前記面内方向について区画し、
    　前記回路素子を前記第一領域に実装し、
    　前記溝部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する、
    　回路基板の製造方法。     A method for manufacturing a circuit board (1), comprising:
    A printed circuit board (2) having an insulating layer (25) formed of an insulating material and a conductor pattern (26) formed on the insulating layer is arranged in an in-plane direction along the surface (25a) of the insulating layer. By forming the groove portion (231) by the portion where the conductor pattern is missing or the hole formed in the insulating layer, the circuit element (3) is mounted and the drip-proof material film (5) is formed. One region (21) and a second region (22) having an application prohibition portion (24) where the formation of the drip-proof material film is prohibited are separated in the in-plane direction by the partition portion (23) having the groove portion. Partition and
    Mounting the circuit element in the first region;
    The drip-proof material film is applied to the first region while preventing the drip-proof material film from reaching the application-prohibited portion by the grooves.
    A method of manufacturing a circuit board.
  10. 　回路基板（１）の製造方法であって、
    　絶縁材料によって形成された絶縁層（２５）と前記絶縁層上に形成された導体パターン（２６）とを有するプリント基板（２）に、前記絶縁層の表面（２５ａ）に沿った面内方向について前記導体パターンが欠損した部分または前記絶縁層に穿設された孔により溝部（２３１）を形成するとともにハンダによる凸部（２３２）を前記面内方向について前記溝部とは異なる位置に形成することで、回路素子（３）が実装されるとともに防滴材膜（５）が形成される第一領域（２１）と、前記防滴材膜の形成が禁止される塗布禁止部（２４）を有する第二領域（２２）とを、前記溝部および前記凸部を有する区画部（２３）によって前記面内方向について区画し、
    　前記回路素子を前記第一領域に実装し、
    　前記溝部および前記凸部によって前記防滴材膜が前記塗布禁止部に達しないようにしつつ、前記防滴材膜を前記第一領域に塗布する、
    　回路基板の製造方法。     A method for manufacturing a circuit board (1), comprising:
    A printed circuit board (2) having an insulating layer (25) formed of an insulating material and a conductor pattern (26) formed on the insulating layer is arranged in an in-plane direction along the surface (25a) of the insulating layer. By forming a groove portion (231) by a portion where the conductor pattern is missing or a hole formed in the insulating layer, and forming a convex portion (232) by solder at a position different from the groove portion in the in-plane direction. And a first region (21) where the circuit element (3) is mounted and the drip-proof material film (5) is formed, and a coating prohibiting portion (24) where the formation of the drip-proof material film is prohibited. The two regions (22) are partitioned in the in-plane direction by the partition portion (23) having the groove and the convex portion,
    Mounting the circuit element in the first region;
    Applying the drip-proof material film to the first region while preventing the drip-proof material film from reaching the application-prohibited portion by the grooves and the convex portions;
    A method of manufacturing a circuit board.
PCT/JP2019/007401 2018-03-15 2019-02-26 Circuit board and method for producing same WO2019176534A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018047932A JP2019161089A (en) 2018-03-15 2018-03-15 Circuit board and manufacturing method therefor
JP2018-047932 2018-03-15

Publications (1)

Publication Number Publication Date
WO2019176534A1 true WO2019176534A1 (en) 2019-09-19

Family

ID=67907740

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/007401 WO2019176534A1 (en) 2018-03-15 2019-02-26 Circuit board and method for producing same

Country Status (2)

Country Link
JP (1) JP2019161089A (en)
WO (1) WO2019176534A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003304053A (en) * 2002-04-10 2003-10-24 Denso Corp Printed circuit board and its manufacturing method
JP2013183079A (en) * 2012-03-02 2013-09-12 Sumitomo Wiring Syst Ltd Printed circuit board and manufacturing method of the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003304053A (en) * 2002-04-10 2003-10-24 Denso Corp Printed circuit board and its manufacturing method
JP2013183079A (en) * 2012-03-02 2013-09-12 Sumitomo Wiring Syst Ltd Printed circuit board and manufacturing method of the same

Also Published As

Publication number Publication date
JP2019161089A (en) 2019-09-19

Similar Documents

Publication Publication Date Title
JP4816647B2 (en) Circuit module manufacturing method and circuit module
TWI538573B (en) The flexible printed circuit board
CN107535080B (en) Electronic circuit module
WO2016181628A1 (en) Printed-wiring board, printed-circuit board and electronic apparatus
JPH0837251A (en) Laminated electronic part and manufacture thereof
US20170365540A1 (en) Package structure
WO2014030355A1 (en) Wiring board
JP5150246B2 (en) Multilayer printed wiring board and manufacturing method thereof
JP6373605B2 (en) WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
JP2009289790A (en) Printed wiring board with built-in component and its manufacturing method
JP2003243556A (en) Stacked substrate
JP2004064052A (en) Noise shielding type laminated substrate and its manufacturing method
WO2019176534A1 (en) Circuit board and method for producing same
JP2006261598A (en) Electronic component comprising shield case
JP2019192893A (en) Interposer and printed circuit board including the same
WO2012165111A1 (en) Method for producing multi-layer substrate and multi-layer substrate
JPH08316686A (en) High-frequency circuit device
JP2015144165A (en) Circuit module and manufacturing method thereof
JP2656585B2 (en) Integrated circuit components and their mounting structures
JP2013115110A (en) Printed wiring board of step structure
WO2019216292A1 (en) Resin multilayer substrate, package for electronic components, and package for optical components
US20180269122A1 (en) Printed substrate and electronic device
JP2005085807A (en) Wiring board, its manufacturing method, electro-optical device, and electronic equipment
JP2013179157A (en) Printed wiring board and printed wiring board with electronic component
WO2017038790A1 (en) Resin substrate, component-mounting resin substrate, and method for manufacturing component-mounting resin substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19768290

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19768290

Country of ref document: EP

Kind code of ref document: A1