WO2019154207A1 - 终端设备及其制作方法 - Google Patents

终端设备及其制作方法 Download PDF

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Publication number
WO2019154207A1
WO2019154207A1 PCT/CN2019/073852 CN2019073852W WO2019154207A1 WO 2019154207 A1 WO2019154207 A1 WO 2019154207A1 CN 2019073852 W CN2019073852 W CN 2019073852W WO 2019154207 A1 WO2019154207 A1 WO 2019154207A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
layer
terminal device
display
signal line
Prior art date
Application number
PCT/CN2019/073852
Other languages
English (en)
French (fr)
Inventor
王建峰
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to BR112020016264-7A priority Critical patent/BR112020016264A2/pt
Priority to EP19751258.5A priority patent/EP3751449A4/en
Priority to KR1020207024071A priority patent/KR20200111742A/ko
Priority to JP2020542996A priority patent/JP7132341B2/ja
Priority to AU2019218326A priority patent/AU2019218326B2/en
Publication of WO2019154207A1 publication Critical patent/WO2019154207A1/zh
Priority to US16/988,473 priority patent/US20200387689A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Definitions

  • the present disclosure relates to the field of terminal devices, and in particular, to a terminal device and a method for fabricating the same.
  • FIG. 1 is a schematic diagram showing the assembly structure of a fingerprint module on a mobile phone in the related art.
  • the fingerprint module on the mobile phone in the related art is independently designed, and mainly includes a fingerprint chip package 10 , a protective film 20 , a metal ring 30 , a flexible printed circuit (FPC) 40 , and a component 50 .
  • the connector 60 and the like wherein, as shown in FIG. 2, the fingerprint chip package 10 mainly includes a substrate 11, a fingerprint chip die 12 disposed on the substrate 11, and a die connected to the substrate 11 and the fingerprint chip.
  • a Die Attach Film (DAF) 13 and an encapsulation layer 14 are provided on the fingerprint chip die die with a fingerprint pattern for collecting finger information and generating a corresponding sensing signal.
  • DAF Die Attach Film
  • the fingerprint module in the related art is separately designed under the liquid crystal display (LCM).
  • the disadvantage of this design is that due to the limitation of the size of the fingerprint chip package, the whole machine needs to reserve a dedicated space for placing the fingerprint mode.
  • the general placement scheme is placed on the front, side and back of the phone. Wherein, the fingerprint module is placed on the front of the mobile phone, and the large screen ratio cannot be achieved; the fingerprint module is placed on the side of the mobile phone, and the recognition rate is low due to the size problem of the fingerprint identification component (sensor); the fingerprint module is placed on the back of the mobile phone. Will affect the ID.
  • the scheme for designing the fingerprint module under the liquid crystal display screen in the related art is limited by the thickness limit of the fingerprint module, affecting the structure of the whole machine or the battery volume; and the fingerprint module in the related art must be attached to the liquid crystal display. Below the screen (LCM).
  • the purpose of the technical solution of the present disclosure is to provide a terminal device and a manufacturing method thereof, which can solve the problem that the location of the fingerprint module is limited due to the limited size of the fingerprint module in the related art.
  • an embodiment of the present disclosure provides a terminal device, including a display module and a fingerprint recognition component, where the fingerprint recognition component includes:
  • the fingerprint collection layer is attached to the display module for collecting fingerprint information
  • a fingerprint identification module configured to identify the collected fingerprint information
  • an embodiment of the present disclosure provides a method for manufacturing a terminal device, where the method includes:
  • the terminal device sets the fingerprint collection layer on the display module, that is, separately integrates the fingerprint pattern on the fingerprint chip die of the fingerprint identification component into the display module.
  • the fingerprint identification layer is connected to the fingerprint identification module by means of a flexible circuit board, so that the fingerprint acquisition layer can be directly attached to the display module without being packaged, thereby maximizing the thinning of the fingerprint recognition component; and, the fingerprint collection
  • the area of the layer is not limited, and may be integrated anywhere on the display module or the entire display module is a fingerprint recognition area (ie, the fingerprint collection layer covers the entire display area of the display module); in addition, fingerprint collection
  • the layer is connected to the inductive processing module through the flexible circuit board, and does not affect the structure of the whole machine or the battery volume; in addition, since the fingerprint recognition reaction layer is attached to the display module, it can be disposed not only under the display screen but also Can be set above the display.
  • FIG. 1 is a schematic structural diagram of a fingerprint module in the related art
  • FIG. 2 is a schematic structural diagram of a fingerprint chip package in the related art
  • FIG. 3 is a schematic perspective structural view of a first embodiment of a terminal device according to the present disclosure.
  • FIG. 4 is a schematic cross-sectional view showing a first embodiment of a terminal device according to the present disclosure
  • FIG. 5 is a schematic perspective structural view of a second embodiment of a terminal device according to the present disclosure.
  • FIG. 6 is a schematic cross-sectional view showing a second embodiment of a terminal device according to the present disclosure.
  • FIG. 7 is a schematic structural diagram of signal lines in a fingerprint collection layer of a terminal device according to an embodiment of the present disclosure.
  • the fingerprint module is separately designed in the related art, the fingerprint module is limited in size, and the position of the fingerprint recognition module is limited.
  • the embodiment of the present disclosure provides a terminal device and a manufacturing method thereof, which can make the fingerprint
  • the setting location of the recognition component is not limited.
  • FIG. 3 to FIG. 6 are schematic diagrams showing the structure of a terminal device according to an embodiment of the present disclosure. Only components such as a display screen and a fingerprint recognition component are illustrated, and components such as a backlight module are not illustrated.
  • the terminal device includes a display module and a fingerprint identification component, and the fingerprint identification component includes:
  • the fingerprint collection layer is attached to the display module for collecting fingerprint information
  • the fingerprint identification module 300 is configured to identify the collected fingerprint information.
  • a flexible circuit board 400 is drawn from a side edge of the fingerprint collection layer, and is connected to the fingerprint identification module.
  • the terminal device provided by the embodiment of the present disclosure sets the fingerprint collection layer 200 on the display screen 100, and the fingerprint collection layer 200 is a fingerprint collection structure on the fingerprint chip die die of the fingerprint identification component in the related art (Sensor) Therefore, the above solution is to separately integrate the fingerprint collection structure on the fingerprint chip die die of the fingerprint recognition component in the related art on the display module, and connect with the fingerprint identification module 300 by means of the flexible circuit board 400. In this way, since the fingerprint collection layer 200 does not need to be packaged, but directly attached to the display module, the fingerprint recognition component can be minimized; and the area of the fingerprint collection layer 200 is not limited, and can be integrated into the display mode.
  • any position on the group or the entire display module is a fingerprint identification area (ie, the fingerprint collection layer 200 covers the entire display area of the display module); in addition, the fingerprint collection layer 200 is led out and inducted through the flexible circuit board 400.
  • the processing module is connected without affecting the structure of the whole machine or the battery volume; in addition, since the fingerprint recognition reaction layer is attached to On one surface of the display screen, it may be provided not only on the bottom of the screen may be provided over the display screen.
  • the display module refers to a screen portion of a terminal device including a display screen, and may include a display screen 100, a touch screen 500, and a protective cover 600, and the fingerprint collection layer may be attached. It is fitted to one side surface of any of the display panel 100, the touch screen 500, and the protective cover 600.
  • the fingerprint collection layer 200 includes: a substrate layer 210; a detecting component disposed on the substrate layer 210 (not shown); And a signal line 220 disposed on the substrate layer 210; wherein the signal line 220 includes a receiving signal line (Rx) 221 and a transmitting signal line (Tx) 222 that are vertically disposed.
  • Rx receiving signal line
  • Tx transmitting signal line
  • the detecting component and the signal line 220 in the structure of the fingerprint collecting layer 200 are fingerprint recognition sensing on the fingerprint identification chip die die of the fingerprint chip package in the fingerprint identification module of the related art.
  • a substrate pattern 210 is used to provide a sensing film layer for the detecting element and the signal line 220 to form the detecting element and the signal line 220 on the substrate layer 210.
  • the fingerprint identification component can be various types of fingerprint identification components, for example, an optical fingerprint identification component, a semiconductor fingerprint identification component, or an ultrasonic fingerprint identification component, and the semiconductor fingerprint identification component includes a capacitive fingerprint recognition component or an inductor. Fingerprint recognition component. It should be understood that the fingerprint recognition component is not limited to the above types of fingerprint recognition components.
  • the detection component in the fingerprint acquisition layer 200 may include a photoelectric sensitive component.
  • the signal line 220 may include a vertically intersecting receiving signal line.
  • the (Rx) 221 and the transmission signal line (Tx) 222 are familiar to those skilled in the art for the structure and working principle of the optical fingerprint identification component.
  • the terminal device provided by the embodiment of the present disclosure only uses optical fingerprint recognition. A fingerprint pattern on the fingerprint chip of the fingerprint chip package in the component is integrated on one side surface of the display screen 100. Therefore, the detecting component and the image in the optical fingerprint collecting layer 200 are The specific structure of the signal line 220 will not be described again.
  • the fingerprint identification component is a semiconductor fingerprint identification component and an ultrasonic fingerprint identification component
  • the specific structure of the detection component and the signal line 220 in the fingerprint collection layer 200 is not described again.
  • the substrate layer 210 serves as a forming film layer of the detecting element and the signal line 220, and may be made of an optically transparent material such as silicon, glass, acryl or optical film.
  • the display module includes a driving IC; the fingerprint identification module 300 is integrated with the driving IC.
  • the driving IC of the display screen 100 may be integrated with the fingerprint identification module 300, wherein the fingerprint identification module 300 and the driving IC of the display screen 100 are disposed away from the display screen 100.
  • the flexible circuit board 400 of the fingerprint recognition component is taken out from one side of the fingerprint acquisition layer 200 and bent toward a side of the fingerprint acquisition layer 200 that faces away from the display surface of the display screen 100.
  • another flexible circuit board 400 is connected to one edge of the display screen 100, and the flexible circuit board 400 on the display screen 100 is away from the fingerprint collection layer 200.
  • One side of the display surface of the display screen 100 is bent and connected to the driving IC, so that the occupied space can be further reduced, and the overall structure layout can be utilized. It can be understood that the fingerprint identification module 300 can also be separately set in practical applications.
  • the fingerprint collection layer 200 is integrated on the display module, and the fingerprint collection layer 200 may be disposed above or below the display screen 100.
  • the display screen 100 includes a display surface and The touch screen 500 is disposed on a side of the display surface of the display screen 100, and the protective cover 600 is disposed on a side of the touch screen 500 away from the display screen 100.
  • the fingerprint collection layer 200 is attached to the back surface of the display screen 100. In another embodiment, the fingerprint collection layer 200 is attached to the same. Between the display screen 100 and the touch screen 500; the fingerprint collection layer 200 may also be attached between the touch screen 500 and the protective cover 600.
  • the terminal device provided by the embodiment of the present disclosure has the setting of the fingerprint collection layer 200. Location can no longer be restricted.
  • the embodiment of the present disclosure further provides a method for manufacturing a terminal device, which is used to create a terminal device provided by an embodiment of the present disclosure, where the method includes:
  • Step S1 forming the fingerprint collection layer 200 on the display module
  • Step S2 binding the fingerprint collection layer 200 to the flexible circuit board 400;
  • Step S3 the flexible circuit board 400 is bound to the fingerprint identification module 300.
  • the fingerprint collection layer 200 is directly formed on the display module, and the fingerprint collection layer 200 is on the fingerprint chip die of the fingerprint identification component in the related art.
  • the fingerprint pattern is adopted. Therefore, the above solution is to separately integrate the fingerprint collection structure on the fingerprint chip die die of the fingerprint identification component in the related art on one side surface of the display screen 100, and pass through the flexible circuit board 400.
  • the fingerprinting layer 200 is connected to the fingerprint recognition module 300. Thus, since the fingerprint collection layer 200 is directly attached to the display module without packaging, the fingerprint recognition component can be minimized and the area of the fingerprint collection layer 200 is not limited.
  • the display module may be integrated in any position of the display module or the entire display module is a fingerprint identification area (ie, the fingerprint collection layer 200 covers the entire display area of the display module); and the fingerprint acquisition layer 200 passes through the flexible circuit
  • the board 400 is connected to the inductive processing module without affecting the structure of the whole machine or the battery; in addition, due to the fingers
  • the pattern recognition reaction layer is attached to one side surface of the display screen, and can be disposed not only under the display screen but also above the display screen.
  • the display module refers to a screen portion of a terminal device including a display screen, and may include a display screen 100, a touch screen 500, and a protective cover 600, and the fingerprint collection layer may be attached. It is fitted to one side surface of any of the display panel 100, the touch screen 500, and the protective cover 600.
  • step S1 can be implemented in the following two ways:
  • a substrate layer 210 is formed on a side surface of the display screen 100, the touch screen 500 or the protective cover 600, and the detecting element and the signal line 220 are formed on the substrate layer 210 to The fingerprint acquisition layer 200 is obtained.
  • the fingerprint collection layer 200 is directly formed on one side surface of the display screen 100, the touch screen 500 or the protective cover 600, wherein the fingerprint collection layer 200 can adopt the fingerprint chip bare in the related art.
  • the fingerprint pattern of the die is processed by a processing method, for example, by etching, exposure, development, etching, and the like.
  • the second method is: forming a substrate layer 210, forming the detecting component and the signal line 220 on the substrate layer 210 to obtain the fingerprint collecting layer 200; and bonding the fingerprint collecting layer 200 On one side surface of the display screen 100, the touch screen 500 or the protective cover 600.
  • the fingerprint collection layer 200 is separately fabricated, and then attached to one side surface of the display screen 100, the touch screen 500 or the protective cover 600 by using a full-fit (Glass+Film+Film, GFF) method.
  • the fingerprint collection layer 200 can be fabricated by using a fingerprint recognition sensing pattern on the fingerprint die die of the related art, for example, by etching, exposure, development, etching, etc. Process steps to form.

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  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
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Abstract

本公开提供一种终端设备及其制作方法，本公开提供的终端设备包括显示模组及指纹识别组件，指纹识别组件包括：指纹采集层，指纹采集层贴合于所述显示模组上，用于采集指纹信息；指纹识别模块，用于识别所采集的指纹信息；及，柔性电路板，柔性电路板自指纹采集层的一侧边缘引出，并与指纹识别模块连接。

Description

终端设备及其制作方法
相关申请的交叉引用
本申请主张在2018年2月9日在中国提交的中国专利申请号No.201810135386.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及终端设备技术领域，尤其涉及一种终端设备及其制作方法。
背景技术
图1所示为相关技术中手机上的指纹模组的组装结构示意图。如图1所示，相关技术中手机上的指纹模组为独立设计，主要包括指纹芯片封装件10、保护膜20、金属环30、柔性电路板(Flexible Printed Circuit，FPC)40、元器件50和连接器60等，其中，如图2所示，指纹芯片封装件10主要包括基板11、设置于基板11上的指纹芯片裸片die 12、连接于所述基板11与所述指纹芯片裸片die 12之间的连接层(Die Attach Film，DAF)13及封装层14，指纹芯片裸片die上设有用于采集手指的指纹信息，并产生相应的感应信号的指纹采集结构(Sensor pattern)。
相关技术中的指纹模组单独设计在液晶显示屏(Liquid Crystal Display Module，LCM)下方，这种设计的缺点为因指纹芯片封装尺寸的限制，整机需要预留专用的空间用于放置指纹模组，一般的放置方案有手机正面底部、侧面及背部放置。其中，手机正面底部放置指纹模组，无法做到大屏占比；手机侧面放置指纹模组，因指纹识别组件(sensor)尺寸问题导致识别率低，影响用户体验；手机背面放置指纹模组，会影响ID。
由此可见，相关技术中的液晶显示屏下设计指纹模组的方案，受制于指纹模组厚度的限制，影响整机结构或电池体积；且相关技术中的指纹模组必须贴合在液晶显示屏(LCM)的下方。
发明内容
本公开技术方案的目的是提供一种终端设备及其制作方法，能够解决相关技术中由于指纹模组尺寸受限，导致指纹模组放置位置受限的问题。
本公开所提供的技术方案如下：
一方面，本公开实施例提供一种终端设备，包括显示模组及指纹识别组件，所述指纹识别组件包括：
指纹采集层，所述指纹采集层贴合于所述显示模组上，用于采集指纹信息；
指纹识别模块，用于识别采集的所述指纹信息；
及，柔性电路板，所述柔性电路板自所述指纹采集层的一侧边缘引出，并与所述指纹识别模块连接。
另一方面，本公开实施例提供一种终端设备的制作方法，所述方法包括：
在所述显示模组上形成所述指纹采集层，将所述指纹采集层与所述柔性电路板绑定连接，将所述柔性电路板与所述指纹识别模块绑定连接。
本公开实施例所带来的有益效果如下：
本公开实施例所提供的终端设备，将所述指纹采集层设置于显示模组上，即，将指纹识别组件的指纹芯片裸片die上的指纹采集结构(Sensor pattern)单独集成于显示模组上，并通过柔性电路板引出的方式与指纹识别模块连接，这样，由于指纹采集层无需封装，而是直接贴合于显示模组上，可以实现指纹识别组件最大限度薄膜化；并且，指纹采集层的面积不受限制，可以是集成于显示模组上任意位置或者整个显示模组均为指纹识别区域(即，将所述指纹采集层覆盖显示模组的整个显示区域)；此外，指纹采集层上通过柔性电路板引出方式与感应处理模块连接，不会影响整机结构或电池体积；此外，由于所述指纹识别反应层贴合在显示模组上，不仅可以设置于显示屏下方，也可以设置在显示屏上方。
附图说明
图1为相关技术中的指纹模组的结构示意图；
图2为相关技术中指纹芯片封装件的结构示意图；
图3为本公开所提供的终端设备的第一种实施例的立体结构示意图；
图4为本公开所提供的终端设备的第一种实施例的断面示意图；
图5为本公开所提供的终端设备的第二种实施例的立体结构示意图；
图6为本公开所提供的终端设备的第二种实施例的断面示意图；
图7为本公开实施例中提供的终端设备的指纹采集层中的信号线的结构示意图。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
针对相关技术中指纹模组单独设计，由于指纹模组尺寸受限，而导致指纹识别模组放置位置受限的问题，本公开实施例中提供了一种终端设备及其制作方法，可以使得指纹识别组件的设置位置不受限。
图3至图6所示为本公开实施例中所提供的终端设备的结构示意图，其中仅示意出了显示屏及指纹识别组件等部件，对背光模组等部件未进行示意。
如图3至图6所示，本公开实施例所提供的终端设备包括显示模组及指纹识别组件，所述指纹识别组件包括：
指纹采集层200，所述指纹采集层贴合于所述显示模组上，用于采集指纹信息；
指纹识别模块300，用于识别采集的所述指纹信息；
及，柔性电路板400，所述柔性电路板自所述指纹采集层的一侧边缘引出，并与所述指纹识别模块连接。
本公开实施例所提供的终端设备，将所述指纹采集层200设置于显示屏100上，该指纹采集层200即为相关技术中指纹识别组件的指纹芯片裸片die上的指纹采集结构(Sensor pattern)，因此，上述方案是将相关技术中的指纹识别组件的指纹芯片裸片die上的指纹采集结构单独集成于显示模组上，并通过柔性电路板400引出的方式与指纹识别模块300连接，这样，由于指纹采集层200无需封装，而是直接贴合于显示模组上，可以实现指纹识别组件最大限度薄膜化；并且，指纹采集层200的面积不受限制，可以是集成于显示模组上任意位置或者整个显示模组均为指纹识别区域(即，将所述指纹采 集层200覆盖显示模组的整个显示区域)；此外，指纹采集层200上通过柔性电路板400引出方式与感应处理模块连接，不会影响整机结构或电池体积；此外，由于所述指纹识别反应层贴合在显示屏的一侧表面上，不仅可以设置于显示屏下方，也可以设置在显示屏上方。
需要说明的是，上述方案中，所述显示模组是指包括显示屏在内的终端设备的屏幕部分，其可以包括显示屏100、触摸屏500及保护盖板600，所述指纹采集层可贴合在显示屏100、触摸屏500及保护盖板600中任一部件的一侧表面上。
在本公开实施例所提供的终端设备中，如图3至图7所示，该指纹采集层200包括：基板层210；设置于所述基板层210上的检测元件(图中未示意)；及，设置于所述基板层210上的信号线220；其中所述信号线220包括垂直交叉设置的接收信号线(Rx)221和发送信号线(Tx)222。
在上述方案中，所述指纹采集层200的结构中所述检测元件及所述信号线220即为相关技术中指纹识别模组中指纹芯片封装件的指纹识别芯片裸片die上的指纹识别感应结构(Sensor pattern)，所述基板层210用于为所述检测元件及所述信号线220提供一成型膜层，以在该基板层210上形成所述检测元件和所述信号线220。
其中，该指纹识别组件可以为各种类型的指纹识别组件，例如，可以为光学指纹识别组件、半导体指纹识别组件或超声波指纹识别组件等，所述半导体指纹识别组件包括电容式指纹识别组件或者电感式指纹识别组件。应当理解的是，所述指纹识别组件并不局限于以上类型的指纹识别组件。
以所述指纹识别组件为光学指纹识别组件为例，所述指纹采集层200中所述检测元件可以包括光电敏感元件，如图7所示，所述信号线220可以包括垂直交叉的接收信号线(Rx)221和发送信号线(Tx)222，对于光学指纹识别组件的结构和工作原理，均为本领域技术人员所熟知的内容，本公开实施例所提供的终端设备仅是将光学指纹识别组件中指纹芯片封装件的指纹识别芯片裸片die上的指纹采集结构(Sensor pattern)集成于显示屏100的一侧表面上，因此，对于所述光学指纹采集层200中所述检测元件及所述信号线220的具体结构不再进行赘述。
同样的，对于所述指纹识别组件为半导体指纹识别组件及超声波指纹识别组件时，所述指纹采集层200中所述检测元件及所述信号线220的具体结构不再进行赘述。
在本公开实施例中，所述基板层210作为所述检测元件及所述信号线220的成型膜层，其可以为硅、玻璃、亚克力或光学膜片(Film)等光学透明材料制成。
此外，在本公开实施例中，所述显示模组包括驱动IC；所述指纹识别模块300与所述驱动IC集成设置。
采用上述方案，所述显示屏100的驱动IC可以是与所述指纹识别模块300集成设置，其中，所述指纹识别模块300与所述显示屏100的驱动IC设置于背离所述显示屏100的显示面的一侧，所述指纹识别组件的柔性电路板400自所述指纹采集层200的一侧引出，并向所述指纹采集层200的背离所述显示屏100的显示面的一侧弯曲，而与所述指纹识别模块300连接，所述显示屏100一侧边缘处连接有另一柔性电路板400，所述显示屏100上的柔性电路板400向所述指纹采集层200的背离所述显示屏100的显示面的一侧弯曲，并与所述驱动IC连接，这样，可以进一步的减少占用空间，利用整机结构布局。当然可以理解的是，在实际应用中，所述指纹识别模块300也可以是单独设置。
此外，由于本公开所提供的终端设备中，在显示模组上集成所述指纹采集层200，该指纹采集层200可以设置在显示屏100上方或下方，所述显示屏100包括显示面及与所述显示面相背设置的背面，所述触摸屏500设置于所述显示屏100的显示面一侧，所述保护盖板600设置于所述触摸屏500的远离所述显示屏100的一侧，在一种实施例中，如图3至图6所示，所述指纹采集层200贴合于所述显示屏100的背面；在另一种实施例中，所述指纹采集层200贴合于所述显示屏100与所述触摸屏500之间；此外，所述指纹采集层200也可以是贴合于所述触摸屏500与所述保护盖板600之间。
采用上述方案，相较于相关技术中的指纹识别模组由于尺寸大，只能设置在显示屏100的下方的方式，本公开实施例所提供的终端设备，其所述指纹采集层200的设置位置可以不再受限。
本公开实施例中还提供了一种终端设备的制作方法，用于制作本公开实施例所提供的终端设备，所述方法包括：
步骤S1、在所述显示模组上形成所述指纹采集层200；
步骤S2、将所述指纹采集层200与所述柔性电路板400绑定连接；
步骤S3、将所述柔性电路板400与所述指纹识别模块300绑定连接。
采用上述方案，本公开实施例所提供的方法，将所述指纹采集层200直接制作形成于显示模组上，该指纹采集层200即为相关技术中指纹识别组件的指纹芯片裸片die上的指纹采集结构(Sensor pattern)，因此，上述方案是将相关技术中的指纹识别组件的指纹芯片裸片die上的指纹采集结构单独集成于显示屏100的一侧表面上，并通过柔性电路板400引出的方式与指纹识别模块300连接，这样，由于指纹采集层200无需封装，而是直接贴合显示模组上，可以实现指纹识别组件最大限度薄膜化，且指纹采集层200的面积不受限制，可以是集成于显示模组任意位置或者整个显示模组均为指纹识别区域(即，将所述指纹采集层200覆盖显示模组的整个显示区域)；并且，指纹采集层200上通过柔性电路板400引出方式与感应处理模块连接，不会影响整机结构或电池体积；此外，由于所述指纹识别反应层贴合在显示屏的一侧表面上，不仅可以设置于显示屏下方，也可以设置在显示屏上方。
需要说明的是，上述方案中，所述显示模组是指包括显示屏在内的终端设备的屏幕部分，其可以包括显示屏100、触摸屏500及保护盖板600，所述指纹采集层可贴合在显示屏100、触摸屏500及保护盖板600中任一部件的一侧表面上。
还需要说明的是，上述方案中，步骤S1、步骤S2和步骤S3的步骤顺序不进行限定。
其中，上述步骤S1可以采用以下两种方式实现：
第一种方式：在所述显示屏100、触摸屏500或保护盖板600的一侧表面上首先形成基板层210，在所述基板层210上形成所述检测元件及所述信号线220，以得到所述指纹采集层200。
采用上述方案，所述指纹采集层200是在显示屏100、触摸屏500或保护盖板600的一侧表面上直接制作而成，其中，所述指纹采集层200可以采 用相关技术中的指纹芯片裸片die上的指纹采集结构(Sensor pattern)的加工方式来制作，例如，采用刻蚀方式，经曝光、显影、蚀刻等工艺步骤来形成。
第二种方式：形成一所述基板层210，在所述基板层210上形成所述检测元件及所述信号线220，以得到所述指纹采集层200；将所述指纹采集层200贴合于所述显示屏100、触摸屏500或保护盖板600的一侧表面上。
采用上述方案，所述指纹采集层200是单独制作好之后，再采用全贴合(Glass+Film+Film，GFF)方式贴合在显示屏100、触摸屏500或保护盖板600的一侧表面上，其中，所述指纹采集层200可以采用相关技术中的指纹芯片裸片die上的指纹识别感应结构(Sensor pattern)的加工方式来制作，例如，采用刻蚀方式，经曝光、显影、蚀刻等工艺步骤来形成。
以上所述的是本公开的可选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述原理前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (9)

  1. 一种终端设备，包括显示模组及指纹识别组件，
    所述指纹识别组件包括：
    指纹采集层，所述指纹采集层贴合于所述显示模组上，用于采集指纹信息；
    指纹识别模块，用于识别所述指纹信息；
    及，柔性电路板，所述柔性电路板自所述指纹采集层的一侧边缘引出，并与所述指纹识别模块连接。
  2. 根据权利要求1所述的终端设备，其中，
    所述指纹采集层包括：基板层、设置于所述基板层上的检测元件及设置于所述基板层上的信号线，所述信号线包括垂直交叉设置的接收信号线和发送信号线。
  3. 根据权利要求2所述的终端设备，其中，
    所述基板层的材质为硅、玻璃、亚克力或光学膜片。
  4. 根据权利要求1所述的终端设备，其中，
    所述指纹识别组件为光学指纹识别组件、半导体指纹识别组件或超声波指纹识别组件。
  5. 根据权利要求1所述的终端设备，其中，
    所述显示模组包括驱动IC；所述指纹识别模块与所述驱动IC集成设置。
  6. 根据权利要求1至4中任一项所述的终端设备，其中，
    所述显示模组包括：
    显示屏，所述显示屏包括显示面及与所述显示面相背设置的背面；
    触摸屏，所述触摸屏设置于所述显示屏的显示面一侧；
    及，保护盖板，所述保护盖板设置于所述触摸屏的远离所述显示屏的一侧；
    其中，所述指纹采集层贴合于所述显示屏的背面；或者，所述指纹采集层贴合于所述显示屏与所述触摸屏之间；或者，所述指纹采集层贴合于所述触摸屏与所述保护盖板之间。
  7. 一种终端设备的制作方法，用于制作如权利要求1至6中任一项所述的终端设备，所述方法包括：
    在所述显示模组上形成所述指纹采集层，将所述指纹采集层与所述柔性电路板绑定连接，将所述柔性电路板与所述指纹识别模块绑定连接。
  8. 根据权利要求7所述的方法，其中，所述指纹采集层包括：基板层、设置于所述基板层上的检测元件及设置于所述基板层上的信号线，所述信号线包括垂直交叉设置的接收信号线和发送信号线，所述显示模组包括显示屏、触摸屏及保护盖板，所述在所述显示模组上形成所述指纹采集层，包括：
    在所述显示屏、所述触摸屏或所述保护盖板的一侧表面上形成所述基板层，在所述基板层上形成所述检测元件及所述信号线，以得到所述指纹采集层。
  9. 根据权利要求8所述的方法，其中，在所述显示屏、所述触摸屏或所述保护盖板的一侧表面上形成所述基板层，包括：
    形成所述基板层，在所述基板层上形成所述检测元件及所述信号线，以得到所述指纹采集层；
    将所述指纹采集层贴合于所述显示屏、所述触摸屏或所述保护盖板的一侧表面上。
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JP7132341B2 (ja) 2022-09-06
EP3751449A1 (en) 2020-12-16
KR20200111742A (ko) 2020-09-29
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JP2021518937A (ja) 2021-08-05
CN108363976A (zh) 2018-08-03

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