WO2019151237A1 - Système de moulage, procédé de moulage, dispositif de retenue de matériau, substrat, programme informatique, support d'enregistrement et dispositif de commande - Google Patents

Système de moulage, procédé de moulage, dispositif de retenue de matériau, substrat, programme informatique, support d'enregistrement et dispositif de commande Download PDF

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Publication number
WO2019151237A1
WO2019151237A1 PCT/JP2019/002948 JP2019002948W WO2019151237A1 WO 2019151237 A1 WO2019151237 A1 WO 2019151237A1 JP 2019002948 W JP2019002948 W JP 2019002948W WO 2019151237 A1 WO2019151237 A1 WO 2019151237A1
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WIPO (PCT)
Prior art keywords
modeling
base material
energy beam
substrate
modeled object
Prior art date
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PCT/JP2019/002948
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English (en)
Japanese (ja)
Inventor
和樹 上野
慧 関口
茂樹 江上
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株式会社ニコン
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Publication of WO2019151237A1 publication Critical patent/WO2019151237A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/16—Both compacting and sintering in successive or repeated steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to, for example, a technical field of a modeling system, a modeling method, a computer program, a recording medium and a control device for forming a modeled object on a substrate, and a material holding device and a substrate used in the modeling system.
  • Patent Document 1 describes a modeling system that forms a molded article on a base material by melting a powdered material with an energy beam and then solidifying the molten material.
  • a modeling system after forming a modeling object on a base material, it becomes a technical subject to remove a base material from a modeling object appropriately.
  • the support device that supports the first powder provided in a layered form, the irradiation device that irradiates the energy beam, the supply device that supplies the second powder, the irradiation device, and the supply
  • a control device for controlling the device, wherein the control device irradiates the energy beam from the irradiation device to the first powder on the support device to melt and solidify the first powder.
  • the second powder is applied onto the first modeled object by the supply device while irradiating the energy beam from the irradiation device onto the first modeled object.
  • a modeling system for controlling the irradiation apparatus and the supply apparatus is provided so as to supply the irradiation position of the energy beam.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with the energy beam, and the supply that supplies the modeling material to the irradiation position of the energy beam
  • a molded object having a second characteristic different from the first characteristic depending on the solidified modeling material, after melting at least a part of the modeling material at the irradiation position and solidifying the molten modeling material.
  • a modeling system is provided for forming on the substrate.
  • the supporting device that supports the first granular material, the irradiation device that irradiates the first granular material with the energy beam, and the second granular material that is supplied to the irradiation position of the energy beam.
  • a supply device that irradiates the energy beam to the supported first powder body to form a first modeled object, irradiates the energy beam to the first modeled object, and the second powder.
  • a modeling system is provided that supplies granules and models the second modeled object.
  • the supporting device for supporting the base material having the first melting point
  • the irradiation device for irradiating the base material with the energy beam
  • a supply system that supplies a modeling material having a melting point, irradiates the energy beam to the base material, supplies the modeling material by the supply device, and provides a modeling system for modeling a modeling object on the base material. Is done.
  • the supporting device that supports the base material having the first solubility in the solvent, the irradiation device that irradiates the base material with the energy beam, and the modeling material at the irradiation position of the energy beam.
  • a second supply device that irradiates the substrate with the energy beam and supplies the modeling material by the supply device, and has a second solubility different from the first solubility in the solvent.
  • the support device that supports the substrate having the first cutting property, the irradiation device that irradiates the substrate with the energy beam, and the supply that supplies the modeling material to the irradiation position of the energy beam
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with the energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam;
  • a modeling system that irradiates the substrate with the energy beam and supplies the modeling material with the supply device, and models a modeled object having a second characteristic different from the first characteristic on the substrate.
  • the apparatus includes: a support device that supports a base material; and an irradiation device that is disposed below the support device and irradiates the base material with the energy beam, and is shaped at the energy beam irradiation position.
  • a modeling system in which at least a part of the material is melted, the molten modeling material is solidified, and a modeled object is formed on the base material by the solidified modeling material.
  • preparing a base material having the first characteristic irradiating the base material with an energy beam and supplying the modeling material to an irradiation position of the energy beam
  • a modeling method including solidifying the molten modeling material after partly melting, and forming a modeled object having a second characteristic different from the first characteristic on the base material by the solidified modeling material Is done.
  • the tenth aspect supporting the first granular material, irradiating the first granular material with the energy beam, and supplying the second granular material to the irradiation position of the energy beam. Irradiating the energy beam to the supported first granular material to form a first modeled object, irradiating the first modeled object with the energy beam, and A modeling method for supplying and modeling the second modeled object is provided.
  • supporting a base material having a first melting point irradiating the base material with an energy beam, and providing a second melting point different from the first melting point at an irradiation position of the energy beam.
  • Supplying a modeling material having the modeling material irradiating the base material with the energy beam and supplying the modeling material to provide a modeling method for modeling a modeling object on the base material.
  • the base material having the first solubility in the solvent supporting the base material having the first solubility in the solvent, irradiating the base material with the energy beam, and supplying the modeling material to the irradiation position of the energy beam
  • a modeling object that includes a supply device irradiates the energy beam onto the substrate and supplies the modeling material, and has a second solubility different from the first solubility in the solvent to the substrate.
  • a modeling method for modeling is provided.
  • a modeling method is provided that irradiates the substrate with the energy beam and supplies the modeling material to model a model having a second cutting property different from the first cutting property on the substrate.
  • the method includes supporting a base material having a first characteristic, irradiating the base material with an energy beam, and supplying a modeling material to an irradiation position of the energy beam, A modeling method is provided in which the substrate is irradiated with the energy beam and the modeling material is supplied, and a modeling object having a second property different from the first property is modeled on the substrate.
  • the method includes supporting a base material and irradiating the base material with the energy beam from below the base material, and at least a part of the modeling material at the energy beam irradiation position.
  • a modeling method for solidifying the melted modeling material after melting and forming a modeled article on the substrate by the solidified modeling material is provided.
  • a modeling system comprising: a support device that supports a base material; an irradiation device that irradiates the base material with an energy beam; and a supply device that supplies a modeling material to the irradiation position of the energy beam.
  • a material holding device that can be used and supported by the support device and holds a modeling material as the base material.
  • a modeling system comprising: a support device that supports a base material; an irradiation device that irradiates the base material with an energy beam; and a supply device that supplies a modeling material to the irradiation position of the energy beam.
  • a base material is provided that can be used and supported by the support device and has a strength lower than that of a modeled object modeled by the modeling system.
  • a modeling system comprising: a support device that supports a base material; an irradiation device that irradiates the base material with an energy beam; and a supply device that supplies a modeling material to the irradiation position of the energy beam.
  • a substrate is provided that can be used and supported by the support device and has a melting point different from the melting point of the shaped object that is shaped by the shaping system.
  • a modeling system comprising: a supporting device that supports a base material; an irradiation device that irradiates the base material with an energy beam; and a supply device that supplies a modeling material to the irradiation position of the energy beam.
  • a substrate is provided that can be used and supported by the support device and has a solubility that is lower than the solubility of the modeled object modeled by the modeling system in a solvent.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with the energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam. Then, after melting at least a part of the modeling material at the irradiation position, the molten modeling material is solidified, and a modeled object having a second characteristic different from the first characteristic by the solidified modeling material is used as the base material.
  • a modeling system is provided that includes a receiving device that receives a control signal that controls at least one of the support device, the irradiation device, and the supply device.
  • the supporting device that supports the first granular material, the irradiation device that irradiates the first granular material with the energy beam, and the second granular material that is supplied to the irradiation position of the energy beam.
  • a supply device that performs the irradiation with the energy beam to form the first shaped object, irradiates the first shaped object with the energy beam, and the second granular material.
  • a receiving device that receives a control signal for controlling at least one of the support device, the irradiation device, and the supply device.
  • the support device for supporting the base material having the first melting point, the irradiation device for irradiating the base material with the energy beam, and the second position different from the first melting point at the irradiation position of the energy beam.
  • a supply device for supplying a modeling material having a melting point; and the support device for irradiating the energy beam to the base material and supplying the modeling material by the supply device to form a modeling object on the base material.
  • a modeling system including a receiving device that receives a control signal for controlling at least one of the irradiation device and the supply device.
  • the supporting device that supports the base material having the first solubility in the solvent, the irradiation device that irradiates the base material with the energy beam, and the modeling material at the irradiation position of the energy beam.
  • a supply device for supplying, a second solubility that irradiates the energy beam to the substrate and supplies the modeling material by the supply device, and is different from the first solubility in the solvent to the substrate;
  • a modeling system is provided that includes a receiving device that receives a control signal for controlling at least one of the support device, the irradiation device, and the supply device.
  • the support device that supports the substrate having the first cutting property, the irradiation device that irradiates the substrate with an energy beam, and the supply that supplies the modeling material to the irradiation position of the energy beam
  • a modeling object having a second cutting property different from the first cutting property is formed on the base material by irradiating the energy beam onto the base material and supplying the modeling material by the supply device.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with an energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam
  • the support is configured to irradiate the base material with the energy beam and supply the modeling material by the supply device to form a modeling object having a second characteristic different from the first characteristic on the base material.
  • a modeling system is provided that includes a receiving device that receives a control signal for controlling at least one of an apparatus, the irradiation device, and the supply device.
  • the supporting device that supports the base material
  • the irradiation device that is disposed below the supporting device and that irradiates the base material with the energy beam
  • the modeling material at the irradiation position of the energy beam.
  • At least one of the support device and the irradiation device is controlled so that the molten modeling material is solidified after at least a part is melted, and a modeled object is formed on the base material by the solidified modeling material.
  • a modeling system including a receiving device that receives a control signal.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with an energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam
  • a computer program for controlling a modeling system comprising: at least a part of the modeling material is melted at the irradiation position; and the molten modeling material is solidified, and the first modeling material is solidified by the solidified modeling material.
  • a computer program for causing the computer to execute a process of forming a shaped article having a second characteristic different from the one characteristic on the base material.
  • the supporting device that supports the first granular material, the irradiation device that irradiates the first granular material with the energy beam, and the second granular material that is supplied to the irradiation position of the energy beam.
  • a computer program that controls a modeling system including a supply device that performs a modeling of the first modeled object by irradiating the energy beam to the supported first powder particle;
  • the support device for supporting the base material having the first melting point
  • the irradiation device for irradiating the base material with the energy beam
  • the second different from the first melting point at the irradiation position of the energy beam is provided.
  • the supporting device that supports the base material having the first solubility in the solvent, the irradiation device that irradiates the base material with the energy beam, and the modeling material at the irradiation position of the energy beam.
  • a computer program for controlling a modeling system including a supply device to supply, irradiating the energy beam to the base material and supplying the modeling material by the supply device, There is provided a computer program for causing the computer to execute a process of modeling a model having a second solubility different from the first solubility in the solvent.
  • the support device that supports the base material having the first cutting property, the irradiation device that irradiates the base material with the energy beam, and the supply that supplies the modeling material to the irradiation position of the energy beam
  • a computer program for causing a computer to control a modeling system comprising an apparatus to irradiate the substrate with the energy beam and supply the modeling material with the supply device, and to the substrate with the first
  • a computer program that causes the computer to execute a process of modeling a model having a second cutting property different from the cutting property.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with an energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam
  • a computer program for controlling a modeling system comprising: irradiating the base material with the energy beam and supplying the modeling material with the supply device;
  • a computer that controls a modeling system including a support device that supports a base material and an irradiation device that is disposed below the support device and irradiates the base material with the energy beam is executed.
  • a computer program wherein at least a part of a modeling material is melted at an irradiation position of the energy beam, the molten modeling material is solidified, and a modeled object is formed on the base material by the solidified modeling material.
  • a computer program for causing the computer to execute processing is provided.
  • a recording medium on which the computer program provided by any one of the twenty-seventh to thirty-third aspects described above is recorded.
  • the support device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with an energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam
  • a control apparatus for controlling a modeling system comprising: at least a part of the modeling material is melted at the irradiation position, and then the molten modeling material is solidified, and differs from the first characteristic depending on the solidified modeling material.
  • a control device is provided that performs a process of forming a shaped article having a second characteristic on the base material.
  • the supporting device for supporting the first granular material, the irradiation device for irradiating the first granular material with the energy beam, and supplying the second granular material to the irradiation position of the energy beam.
  • a control device that controls a modeling system including a supply device that performs the modeling of the first modeled object by irradiating the supported first powder and the energy beam to the first modeled object.
  • a control device that performs a process of irradiating an energy beam and supplying the second granular material to form a second shaped object.
  • the support device for supporting the base material having the first melting point, the irradiation device for irradiating the base material with the energy beam, and the second position different from the first melting point at the irradiation position of the energy beam.
  • a control device for controlling a modeling system comprising a supply device for supplying a modeling material having a melting point, irradiating the energy beam to the base material and supplying the modeling material by the supply device; The control apparatus which performs the process which models a modeling thing is provided.
  • the supporting device that supports the substrate having the first solubility in the solvent, the irradiation device that irradiates the substrate with an energy beam, and the modeling material at the irradiation position of the energy beam.
  • a control device that controls a modeling system including a supply device that supplies the energy beam to the base material and supplies the modeling material by the supply device;
  • a control device that performs a process of modeling a model having a second solubility different from the first solubility.
  • the support device for supporting the base material having the first cutting property, the irradiation device for irradiating the base material with the energy beam, and the supply for supplying the modeling material to the irradiation position of the energy beam
  • An apparatus for controlling a modeling system wherein the base material is irradiated with the energy beam and the modeling material is supplied by the supply device, and the base material has the first cutting property.
  • a control device is provided that performs a process of modeling a model having different second cutting properties.
  • the supporting device that supports the base material having the first characteristic, the irradiation device that irradiates the base material with the energy beam, and the supply device that supplies the modeling material to the irradiation position of the energy beam.
  • a control apparatus for controlling a modeling system comprising: irradiating the base material with the energy beam and supplying the modeling material by the supply device; and supplying the base material with a second characteristic different from the first characteristic.
  • the control apparatus which performs the process which models the modeling thing which has is provided.
  • a control device that controls a modeling system including: a support device that supports a base material; and an irradiation device that is disposed below the support device and that irradiates the base material with the energy beam. Then, after melting at least a part of the modeling material at the irradiation position of the energy beam, the molten modeling material is solidified, and a process of forming a modeled object on the base material by the solidified modeling material is performed.
  • An apparatus is provided.
  • FIG. 1 is a cross-sectional view showing the structure of the modeling system of this embodiment.
  • FIG. 2 is a flowchart showing the flow of the first specific example of the modeling operation.
  • FIG. 3 is a cross-sectional view showing a substrate disposed on a stage in the first specific example of the modeling operation.
  • FIG. 4A and FIG. 4B is a cross-sectional view showing a state in which the first structural layer is formed by irradiating the substrate with light in the first specific example of the modeling operation.
  • FIG. 5A to FIG. 5C are cross-sectional views showing how the first structural layer is irradiated with light to form the second structural layer in the first specific example of the modeling operation. It is.
  • FIG. 1 is a cross-sectional view showing the structure of the modeling system of this embodiment.
  • FIG. 2 is a flowchart showing the flow of the first specific example of the modeling operation.
  • FIG. 3 is a cross-sectional view showing a substrate disposed on a stage in the first
  • FIG. 6 is a cross-sectional view showing the three-dimensional structure formed by the first specific example of the modeling operation.
  • FIG. 7 is a cross-sectional view showing a state in which the three-dimensional structure is separated from at least a part of the base material in the first specific example of the modeling operation.
  • FIG. 8 is a flowchart showing the flow of the second specific example of the modeling operation.
  • FIG. 9 is a cross-sectional view showing a substrate disposed on a stage in a second specific example of the modeling operation.
  • FIG. 10A and FIG. 10B is a cross-sectional view showing a state in which the first structural layer is formed by irradiating the base material with light in the second specific example of the modeling operation.
  • FIG. 10A and FIG. 10B is a cross-sectional view showing a state in which the first structural layer is formed by irradiating the base material with light in the second specific example of the modeling operation.
  • FIG. 11 is a cross-sectional view showing a three-dimensional structure formed by the second specific example of the modeling operation.
  • FIG. 12A and FIG. 12B is a cross-sectional view showing a state in which the three-dimensional structure is separated from at least a part of the base material in the second specific example of the modeling operation.
  • FIG. 13 is a flowchart showing the flow of the third specific example of the modeling operation.
  • FIG. 14 is a cross-sectional view showing a substrate disposed on a stage in a third specific example of the modeling operation.
  • FIG. 15A to FIG. 15C is a cross-sectional view showing a state in which the first structural layer is formed by irradiating the base material with light in the third specific example of the modeling operation.
  • FIG. 15A to FIG. 15C is a cross-sectional view showing a state in which the first structural layer is formed by irradiating the base material with light in the third specific example of the modeling operation.
  • FIG. 15A to FIG. 15C
  • FIG. 16A to FIG. 16C is a cross-sectional view showing a state in which the substrate is turned upside down in order to form the second and subsequent structural layers in the third specific example of the modeling operation.
  • FIG. 17 is a cross-sectional view showing a three-dimensional structure formed by the third specific example of the modeling operation.
  • FIG. 18 is a cross-sectional view illustrating a state in which the three-dimensional structure is separated from at least a part of the base material in the third specific example of the modeling operation.
  • FIG. 19 is a cross-sectional view illustrating the structure of a modeling system that performs the fourth specific example of the modeling operation.
  • FIG. 20 is a flowchart showing the flow of the fourth specific example of the modeling operation.
  • FIG. 21 is a cross-sectional view showing a substrate disposed on a stage in a fourth specific example of the modeling operation.
  • FIG. 22 is a cross-sectional view showing the modeling material supplied to the base material in the fourth specific example of the modeling operation.
  • FIG. 23 is a cross-sectional view showing how the first structural layer is formed by irradiating the base material with light in the fourth specific example of the modeling operation.
  • FIG. 24 is a cross-sectional view illustrating a state in which the base material on which the first structural layer is formed is conveyed in the fourth specific example of the modeling operation.
  • FIG. 25 is a cross-sectional view illustrating another structure of the modeling system that performs the fourth specific example of the modeling operation.
  • FIG. 22 is a cross-sectional view showing the modeling material supplied to the base material in the fourth specific example of the modeling operation.
  • FIG. 23 is a cross-sectional view showing how the first structural layer is formed by irradiating the base material with light in the fourth specific example of
  • FIG. 26 is a flowchart showing the flow of the fifth specific example of the modeling operation.
  • FIG. 27A to FIG. 27C is a cross-sectional view showing how the first structural layer is formed by irradiating the base material with light in the fifth specific example of the modeling operation.
  • FIG. 28A and FIG. 28B is a cross-sectional view showing a state in which the three-dimensional structure is separated from at least a part of the base material in the fifth specific example of the modeling operation.
  • FIG. 29 is a flowchart showing the flow of the sixth specific example of the modeling operation.
  • FIG. 30 is a cross-sectional view showing a substrate disposed on a stage in a sixth specific example of the modeling operation.
  • FIG. 31 is a cross-sectional view showing a substrate disposed on a stage in a sixth specific example of the modeling operation.
  • FIG. 32A to FIG. 32C is a cross-sectional view showing a state in which the three-dimensional structure is separated from at least a part of the base material in the sixth specific example of the modeling operation.
  • FIG. 33 is a cross-sectional view showing a base material on which cracks are formed in the sixth specific example of the modeling operation.
  • FIG. 34 is a flowchart showing the flow of the seventh specific example of the modeling operation.
  • FIG. 35 is a cross-sectional view showing a base material arranged on a stage in a seventh specific example of the modeling operation.
  • FIG. 36A and FIG. 36B is a cross-sectional view showing a state in which the three-dimensional structure is separated from at least a part of the base material in the seventh specific example of the modeling operation.
  • each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). Yes, it is substantially the vertical direction or the direction of gravity).
  • the rotation directions around the X axis, the Y axis, and the Z axis are referred to as a ⁇ X direction, a ⁇ Y direction, and a ⁇ Z direction, respectively.
  • FIG. 1 is a cross-sectional view showing an example of the structure of the modeling system 1 of the present embodiment.
  • the modeling system 1 is a three-dimensional structure (that is, a three-dimensional object having a size in any of the three-dimensional directions, and a three-dimensional object, in other words, an object having a size in the X, Y, and Z directions. ) ST can be formed.
  • the modeling system 1 can form the three-dimensional structure ST on the base material BM serving as a basis (that is, a base material) for forming the three-dimensional structure ST.
  • the modeling system 1 can form the three-dimensional structure ST by performing additional processing on the base material BM. When the base material BM is the stage 13 described later, the modeling system 1 can form the three-dimensional structure ST on the stage 13.
  • the modeling system 1 can form the three-dimensional structure ST on the object.
  • the modeling system 1 may form the three-dimensional structure ST integrated with the object.
  • the operation of forming the three-dimensional structure ST integrated with the object is equivalent to the operation of adding a new structure to the object.
  • the modeling system 1 may form a three-dimensional structure ST that can be separated from the object.
  • FIG. 1 shows an example in which the base material BM is an object held by the stage 13. In the following, description will be given using an example in which the base material BM is an object held by the stage 13.
  • the modeling system 1 forms the three-dimensional structure ST using the layered modeling technique. That is, it can be said that the modeling system 1 is a 3D printer that forms the three-dimensional structure ST using the layered modeling technique.
  • the additive manufacturing technique is also referred to as rapid prototyping, rapid manufacturing, or additive manufacturing.
  • the modeling system 1 forms the modeled object by processing the modeling material M with the light EL.
  • light LE for example, at least one of infrared light, visible light, and ultraviolet light can be used, but other types of light may be used.
  • the light EL is, for example, laser light.
  • the modeling material M is a material that can be melted by irradiation with light EL having a predetermined intensity or higher.
  • a modeling material M for example, at least one of a metal material and a resin material can be used.
  • the modeling material M other materials different from the metal material and the resin material may be used.
  • the modeling material M is a powdery or granular material. That is, the modeling material M is a granular material.
  • the modeling material M may not be a granular material, and for example, a wire-shaped modeling material or a gaseous modeling material may be used.
  • the modeling system 1 may form a modeled object by processing the modeling material M with an energy beam such as a charged particle beam.
  • the modeling system 1 includes a modeling head 11, a head drive system 12, a stage 13, and a control device 14. Furthermore, the modeling head 11 includes an irradiation system 111 and a material nozzle (that is, a supply system that supplies the modeling material M) 112. In addition, the modeling system 1 may accommodate the modeling head 11, the head drive system 12, and the stage 13 in a chamber not shown. Here, the inside of the chamber may be purged with an inert gas such as nitrogen or argon gas.
  • an inert gas such as nitrogen or argon gas.
  • the irradiation system 111 is an optical system (for example, a condensing optical system) for emitting the light EL from the emitting unit 113. Specifically, the irradiation system 111 is optically connected to a light source (not shown) that emits light EL via an optical transmission member (not shown) such as an optical fiber. The irradiation system 111 emits light EL propagating from the light source via the light transmission member. The irradiation system 111 irradiates light EL from the irradiation system 111 downward (that is, on the ⁇ Z side). A stage 13 is disposed below the irradiation system 111.
  • a light source not shown
  • an optical transmission member such as an optical fiber.
  • the irradiation system 111 emits light EL propagating from the light source via the light transmission member.
  • the irradiation system 111 irradiates light EL from the irradiation system 111 downward (that is, on the
  • the irradiation system 111 can irradiate the light EL toward the base material BM. Specifically, the irradiation system 111 irradiates the light EL to the irradiation region EA having a predetermined shape set on the base material BM as a region to which the light EL is irradiated (typically condensed). Furthermore, the state of the irradiation system 111 can be switched between a state in which the irradiation area EA is irradiated with the light EL and a state in which the irradiation area EA is not irradiated with the light EL under the control of the control device 14.
  • the direction of the light EL emitted from the irradiation system 111 is not limited to just below (that is, the direction that coincides with the Z axis), and may be, for example, a direction inclined by a predetermined angle with respect to the Z axis. .
  • the material nozzle 112 has a supply outlet 114 for supplying the modeling material M.
  • the material nozzle 112 supplies the modeling material M from the supply outlet 114 (specifically, injection, ejection, or injection).
  • the material nozzle 112 is physically connected to a material supply device (not shown) that is a supply source of the modeling material M via a powder transmission member such as a pipe (not shown).
  • the material nozzle 112 supplies the modeling material M supplied from the material supply device via the powder transmission member.
  • the material nozzle 112 is drawn in a tube shape, but the shape of the material nozzle 112 is not limited to this shape.
  • the material nozzle 112 supplies the modeling material M from the material nozzle 112 downward (that is, toward the ⁇ Z side).
  • a stage 13 is disposed below the material nozzle 112.
  • the material nozzle 112 supplies the modeling material M toward the base material BM.
  • the traveling direction of the modeling material M supplied from the material nozzle 112 is a direction inclined by a predetermined angle (an acute angle as an example) with respect to the Z axis, but is directly below (that is, a direction coincident with the Z axis). May be.
  • a plurality of material nozzles 112 may be provided.
  • the material nozzle 112 is aligned with the irradiation system 111 such that the irradiation system 111 supplies the modeling material M toward the irradiation area EA where the light EL is irradiated. That is, the material nozzle 112 and the irradiation are set so that the supply area MA and the irradiation area EA set in the base material BM as an area where the material nozzle 112 supplies the modeling material M coincides (or at least partially overlaps).
  • the system 111 is aligned. Note that the material nozzle 112 is positioned so as to supply the modeling material M to the molten pool MP (see FIG.
  • the material nozzle 112 may be aligned so that the supply area MA for supplying the modeling material M and the area of the molten pool MP partially overlap each other.
  • the head drive system 12 moves the modeling head 11.
  • the head drive system 12 moves the modeling head 11 along each of the X axis, the Y axis, and the Z axis.
  • the head drive system 12 may move the modeling head 11 along at least one of the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction in addition to the X axis, the Y axis, and the Z axis.
  • the head drive system 12 includes, for example, a motor.
  • the irradiation area EA also moves with respect to the work W on the work W.
  • the head drive system 12 can change the positional relationship between the workpiece W and the irradiation area EA (in other words, the positional relationship between the stage 13 holding the workpiece W and the irradiation area EA) by moving the modeling head 11. It is. Moreover, the head drive system 12 can change the positional relationship between the workpiece W and the supply area MA (in other words, the positional relationship between the stage 13 holding the workpiece W and the supply area MA) by moving the modeling head 11. It is. The head drive system 12 may move the irradiation system 111 and the material nozzle 112 separately.
  • the head drive system 12 may be capable of adjusting at least one of the position of the ejection unit 113, the direction of the ejection unit 113, the position of the supply outlet 114, and the direction of the supply outlet 114.
  • the irradiation area EA where the irradiation optical system 111 irradiates the light EL and the supply area MA where the material nozzle 112 supplies the modeling material M can be controlled separately.
  • the stage 13 can hold the base material BM.
  • the stage 13 can further release the held base material BM.
  • the irradiation system 111 described above irradiates the light EL in at least a part of the period in which the stage 13 holds the base material BM.
  • the material nozzle 112 described above supplies the modeling material M in at least a part of the period in which the stage 13 holds the base material BM.
  • a part of the modeling material M supplied by the material nozzle 112 may be scattered or spilled from the surface of the base material BM to the outside of the base material BM (for example, around the stage 13).
  • the modeling system 1 may include a recovery device that recovers the scattered modeling material M around the stage 13.
  • the control device 14 controls the operation of the modeling system 1.
  • the control device 14 may include a computing device such as at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit), and a storage device such as a memory.
  • the control device 14 functions as a device that controls the operation of the modeling system 1 when the arithmetic device executes a computer program.
  • This computer program is a computer program for causing the control device 14 (for example, a computing device) to perform (that is, execute) an operation to be described later that should be performed by the control device 14. That is, this computer program is a computer program for causing the control device 14 to function so as to cause the modeling system 1 to perform an operation described later.
  • the computer program executed by the arithmetic device may be recorded in a storage device (that is, a recording medium) included in the control device 14, or any storage that is built in the control device 14 or can be externally attached to the control device 14. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the arithmetic device may download a computer program to be executed from a device external to the control device 14 via a network interface.
  • a storage device that is, a recording medium included in the control device 14, or any storage that is built in the control device 14 or can be externally attached to the control device 14. It may be recorded on a medium (for example, a hard disk or a semiconductor memory).
  • the arithmetic device may download a computer program to be executed from a device external to the control device 14 via a network interface.
  • the program includes a program distributed in a download manner through a network line such as the Internet, in addition to a program stored and distributed in the recording medium.
  • the recording medium includes a device capable of recording the program, for example, a general purpose or dedicated device in which the program is implemented in a state where the program can be executed in the form of software, firmware, or the like.
  • a device capable of recording the program for example, a general purpose or dedicated device in which the program is implemented in a state where the program can be executed in the form of software, firmware, or the like.
  • each process and function included in the program may be executed by program software that can be executed by a computer, or each part process may be executed by hardware such as a predetermined gate array (FPGA, ASIC), or program software.
  • FPGA predetermined gate array
  • ASIC application specific integrated circuit
  • the control device 14 controls the emission mode of the light EL by the irradiation system 111.
  • the emission mode includes, for example, at least one of the intensity of the light EL and the light emission timing.
  • the emission mode includes, for example, at least one of the length of the light emission time of the pulsed light and the ratio of the light emission time of the pulsed light to the extinction time (so-called duty ratio). Also good.
  • the control device 14 controls the movement mode of the modeling head 11 by the head drive system 12.
  • the movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing.
  • the control device 14 controls the supply mode of the modeling material M by the material nozzle 112.
  • the supply mode includes, for example, a supply amount (particularly, a supply amount per unit time).
  • the control device 14 may not be arranged inside the modeling system 1, and may be arranged as a server or the like outside the modeling system 1, for example.
  • the control device 14 and the modeling system 1 may be connected by a wired or wireless communication line or network.
  • wired communication for example, IEEE1394, RS-232x, RS-422, RS-423, RS-485, USB, etc., serial connection, parallel connection, or 10BASE-T, 100BASE-TX, 1000BASE- An electrical connection via a network such as T may be used.
  • radio LAN such as IEEE 802.1x, OFDM, Bluetooth (registered trademark), infrared, optical communication, or the like may be used.
  • control device 14 and the modeling system 1 may be configured such that various types of information can be transmitted and received via a communication line or a network. Further, the control device 14 may be capable of transmitting information such as commands and control parameters to the modeling system 1 via the communication line or network.
  • the modeling system 1 may include a receiving device that receives information such as commands and control parameters from the control device 14 via the communication line or the network.
  • the modeling system 1 performs a modeling operation for forming the three-dimensional structure ST on the base material BM. Particularly in the present embodiment, the modeling system 1 relatively easily removes (that is, separates) at least a part of the base material BM from the formed three-dimensional structure ST after the three-dimensional structure ST is formed.
  • the three-dimensional structure ST is formed so that That is, the modeling system 1 performs a modeling operation for forming the three-dimensional structure ST that can be relatively easily separated from at least a part of the base material BM. In other words, the modeling system 1 performs a modeling operation for forming the three-dimensional structure ST that can relatively easily remove at least a part of the base material BM.
  • relatively easily removing is based on removing the three-dimensional structure ST from the base material BM (separating the three-dimensional structure ST from the base material BM). It may mean that it is easy for the case where the material BM and the three-dimensional structure are integrated.
  • the modeling system 1 determines the difference between the characteristics of the base material BM and the characteristics of the three-dimensional structure ST in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the modeling system 1 forms the three-dimensional structure ST that can be separated from at least a part of the base material BM by forming the three-dimensional structure ST having different characteristics from the base material BM on the base material BM.
  • the modeling system 1 can be separated from at least a part of the base material BM by forming the three-dimensional structure ST having the second characteristic different from the first characteristic on the base material BM having the first characteristic.
  • a three-dimensional structure ST is formed.
  • a first specific example to a seventh specific example of the modeling operation will be described in order.
  • the first specific example of the modeling operation is to form a three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • a modeling material M for example, a granular or powdery modeling material M
  • the three-dimensional structure ST is solidified, for example, a modeling having a size larger than that of the granular or powdered modeling material M
  • the difference in properties of material M is used.
  • a granular or powdery form that is a separable unit constituent that constitutes the base material BM.
  • a base material BM that is an accumulation of granular or powdery modeling material M (hereinafter, the base material BM used in the first specific example is appropriately referred to as “base material BM1”). Is arranged (that is, prepared) on the stage 13 (step S11 in FIG. 2).
  • the base material BM1 is simply arranged on the stage 13 as it is, there is a possibility that the accumulation of the modeling material M collapses due to the weight of the modeling material M constituting the base material BM1.
  • the base material BM1 in a state where the modeling material M is stacked in a cone shape or a convex shape may be disposed.
  • the possibility that the surface of the base material BM1 (specifically, the surface irradiated with the light EL and the surface on the + Z side) becomes a plane (particularly a plane along the XY plane) is relatively Low.
  • the modeling system 1 is configured such that the surface of the base material BM1 is not flat when the surface of the base material BM1 is flat.
  • the possibility that the three-dimensional structure ST can be appropriately formed is increased.
  • the base material BM ⁇ b> 1 that is an accumulation of granular or powdery modeling material M that is appropriately held by the material holding device may be arranged on the stage 13.
  • a base material BM ⁇ b> 1 that is an accumulation of granular or powdery modeling material M in a state of being accommodated in the case 1511 may be disposed on the stage 13.
  • the case 1511 can prevent the modeling material M constituting the base material BM1 from collapsing in order to prevent the surface of the base material BM1 from becoming flat due to the collapse of the modeling material M constituting the base material BM1.
  • a side wall member 1512 may be provided.
  • the modeling material M constituting the base material BM1 is held in a region surrounded by the side wall member 1512.
  • the side wall member 1512 may be a cylindrical member extending in the Z-axis direction.
  • the modeling system 1 (or an external device of the modeling system 1 or a user of the modeling system 1) uses a squeezing blade or the like so that the surface of the base material BM1 becomes a flat surface.
  • the surface of BM1 may be leveled.
  • At least one surface of the case 1511 may be an opening through which the light EL can pass. As a result, irradiation of the light EL to the base material BM1 accommodated in the case 1511 is not hindered by the case 1511.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM1 using the layered modeling technique under the control of the control device 14 (step S12 to step S13 in FIG. 2). Specifically, the modeling system 1 sequentially forms a plurality of structural layers SL obtained by cutting the three-dimensional structure ST along the Z-axis direction one by one in order. ST is formed. That is, the modeling system 1 forms the three-dimensional structure ST by sequentially forming a plurality of structural layers SL arranged along the Z-axis direction. As a result, a three-dimensional structure ST that is a stacked structure in which a plurality of structural layers SL are stacked is formed.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM1 based on the three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Also good.
  • the three-dimensional model data may include data representing the shape (particularly the three-dimensional shape) of the three-dimensional structure ST.
  • the modeling system 1 first uses the first additive manufacturing method to form the first structural layer SL among the plurality of structural layers SL constituting the three-dimensional structure ST. It forms in material BM1 (step S12 of FIG. 2). Thereafter, the modeling system 1 uses the second layered manufacturing method different from the first layered manufacturing method, and the second and subsequent structural layers SL among the plurality of structural layers SL constituting the three-dimensional structure ST. Are sequentially formed on the first structural layer SL (step S13 in FIG. 2).
  • the first layered modeling method is a modeling method capable of forming a modeled object (further, the structural layer SL) by irradiating the modeling material M constituting the base material BM1 with light EL. That is, the first layered modeling method is a modeling method that can form a modeled object (further, the structural layer SL) by irradiating the modeling material M supplied in advance with the light EL.
  • the forming system 1 includes a powder bed fusion bonding method (PBF: Powder Bed Fusion method) such as a powder sintered additive manufacturing method (SLS: Selective Laser Sintering method). ) Is used.
  • PPF Powder Bed Fusion method
  • SLS Selective Laser Sintering method
  • the modeling system 1 may use another modeling method (for example, a binder jetting method or the like) as the first additive manufacturing method.
  • the modeling system 1 performs modeling corresponding to the surface of the base material BM1 under the control of the control device 14.
  • An irradiation area EA is set in a desired area on the surface MS, and light EL is irradiated from the irradiation system 111 to the irradiation area EA. Note that an area occupied by the light EL emitted from the irradiation system 111 on the modeling surface MS may be referred to as an irradiation area EA.
  • the focus position of the light EL matches the modeling surface MS. However, it may be set at a position shifted from the modeling surface MS in the Z-axis direction.
  • the modeling material M below the irradiation area EA that is, the modeling material M constituting a part of the base material BM1 is melted by the light EL emitted from the irradiation system 111. To do.
  • the control apparatus 14 does not contact the case 1511 with the modeling material M melted by the irradiation with the light EL (for example, the unmelted modeling material M is interposed between the melted modeling material M and the case 1511).
  • the characteristics of the light EL for example, at least one of intensity and focus position
  • the control device 14 replaces at least one of the moving speed of the stage 13 and the scanning speed of the light EL so that the modeling material M melted by the irradiation of the light EL does not come into contact with the case 1511. May be controlled.
  • the molten modeling material M is cooled and solidified (that is, solidified) again.
  • a part of the base material BM1 is converted into a modeled object corresponding to the solidified modeling material M.
  • the melted modeling material M is not solidified so as to be relatively firmly bonded to the case 1511. That is, the molten modeling material M is solidified in a state where it is not relatively firmly coupled to the case 1511. Accordingly, the solidified modeling material M is not relatively firmly bonded to the case 1511.
  • a series of modeling processes including melting of the modeling material M by such light irradiation EL and solidification of the melted modeling material M is repeated while moving the modeling head 11 along the XY plane with respect to the modeling surface MS.
  • the light EL is selectively emitted to the irradiation area EA set in the area where the modeled object is to be formed, while the light EL is applied to the irradiation area EA set in the area where the modeled object is not desired to be formed. Not selectively irradiated.
  • the irradiation area EA is not set in the area where it is not desired to form the modeled object.
  • the modeling system 1 moves the irradiation area EA along the predetermined movement trajectory on the modeling surface MS, and emits light at a timing according to the distribution of the area where the object is to be formed (that is, the pattern of the structural layer SL1).
  • the EL is irradiated onto the modeling surface MS.
  • a structural layer SL that is, the first structural layer SL
  • the irradiation area EA is moved with respect to the modeling surface MS.
  • the modeling surface MS may be moved with respect to the irradiation area EA.
  • the second additive manufacturing method is a modeling method in which the modeling material M supplied from the material nozzle 112 is irradiated with the light EL to form a modeled object (further, the structural layer SL). That is, in the second additive manufacturing method, a modeling method capable of forming a modeled object (further, the structural layer SL) by irradiating the light EL from the irradiation system 111 while supplying the modeling material M from the material nozzle 112. It is.
  • the modeling system 1 uses a directional energy deposition method (DED: Direct Energy Deposition method).
  • the modeling system 1 uses a laser overlay welding (LMD) method which is an example of a directional energy deposition method.
  • Laser overlay welding methods include direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct write fabrication, laser consolidation, and shape deposition.
  • Deposition Manufacturing, Wire-Feed Laser Deposition, Gas Through Wire, Laser Powder Fusion, Laser Metal Forming, Selective Laser Powder Remelting, Laser Direct Casting, Laser -It may be called powder deposition, laser additive manufacturing, or laser rapid forming.
  • the modeling system 1 may use another modeling method (for example, at least one of a laser metal fusion (LMF) method and an inkjet method) as the second additive manufacturing method.
  • LMF laser metal fusion
  • the modeling system 1 controls the surface of the first structural layer SL under the control of the control device 14.
  • the irradiation area EA is set in a desired area on the modeling surface MS corresponding to the surface to which the light EL is irradiated and is the + Z side surface
  • the irradiation system 111 is applied to the irradiation area EA. Irradiate light EL.
  • the modeling material M constituting the molten pool that is, the first structural layer SL
  • the modeling material M constituting the molten pool that is, the first structural layer SL
  • the modeling material M constituting the molten pool is formed in a desired region on the modeling surface MS by the light EL emitted from the irradiation system 111.
  • a pool (MP of liquid modeling material M) MP formed by melting by irradiation with light EL is formed. Further, as shown in FIG. 5B, the modeling system 1 sets a supply area MA in a desired area on the modeling surface MS under the control of the control device 14, and the material nozzle 112 for the supply area MA.
  • the modeling material M is supplied from
  • the irradiation area EA and the supply area MA coincide with each other as described above, the supply area MA is set to an area where the molten pool MP is formed. For this reason, the modeling system 1 supplies the modeling material M from the material nozzle 112 with respect to the molten pool MP, as shown in FIG.5 (b). As a result, the modeling material M supplied to the molten pool MP melts.
  • the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified) again.
  • the solidified modeling material M is deposited on the modeling surface MS. That is, a modeled object is formed by the solidified modeling material M deposit. That is, a modeling object is formed by performing an additional process of adding a deposit of the modeling material M to the modeling surface MS.
  • a series of modeling processes including formation of the molten pool MP by such light irradiation EL, supply of the modeling material M to the molten pool MP, melting of the supplied modeling material M and solidification of the molten modeling material M is performed as modeling. It repeats, moving the modeling head 11 along the XY plane with respect to the surface MS. Also in this case, as described above, the light EL is selectively irradiated to the irradiation area EA set in the area where the modeled object is to be formed, while being set in the area where the modeled object is not desired to be formed. The irradiation area EA is not selectively irradiated. As a result, as shown in FIG. 5 (d), a structural layer SL corresponding to an aggregate of a modeled object by the solidified modeling material M is formed on the modeling surface MS. That is, the second structural layer SL is formed on the first structural layer SL.
  • the operation for forming the new structural layer SL using the second additive manufacturing method is repeated after setting the surface of the formed structural layer SL as a new modeling surface MS as necessary.
  • the third and subsequent structural layers SL are formed.
  • a three-dimensional structure is formed by a laminated structure in which a plurality of structural layers SL are laminated along the Z axis (that is, along the direction from the bottom surface to the top surface of the molten pool MP).
  • An object ST is formed.
  • the three-dimensional structure ST is separated from at least a part of the base material BM1 (Step S14 in FIG. 2). Specifically, in the first specific example, the three-dimensional structure ST is separated from at least a part of the base material BM1 by removing the three-dimensional structure ST from the case 1511.
  • the three-dimensional structure ST is in a floating state in the powdery or granular modeling material M constituting the base material BM1. Between the three-dimensional structure ST and the case 1511, there is a granular or powdery modeling material M that is not melted (and is not solidified as a result).
  • the three-dimensional structure ST is not relatively firmly coupled to the base material BM1 and is not relatively firmly coupled to the case 1511.
  • the three-dimensional structure ST is not integrated with the base material BM1 and is not integrated with the case 1511.
  • the lowermost layer (that is, the first layer) structural layer SL constituting the three-dimensional structure ST is not relatively firmly coupled to the case 1511.
  • the three-dimensional structure ST can be separated from the base material BM1 and can be separated from the case 1511. Therefore, in the first specific example, as shown in FIG. 7, the three-dimensional structure ST can be easily taken out from the case 1511.
  • the three-dimensional structure ST can be easily taken out from the base material BM1 accommodated in the case 1511. For this reason, the three-dimensional structure ST can be separated from at least a part of the base material BM1 (in the example shown in FIG. 7, most or the whole of the base material BM1). That is, it is possible to relatively easily remove at least a part of the base material BM1 (in the example illustrated in FIG. 7, most or all of the base material BM1) from the three-dimensional structure ST.
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM1. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM1 is positioned between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the modeling system of the comparative example in which all of the plurality of structural layers SL constituting the three-dimensional structure ST are formed by the second additive manufacturing method is generally the above-described modeling material.
  • a relatively hard solid base material for example, a metal plate
  • the modeling system of the comparative example needs to form the molten pool MP on the upper surface of the base material when the first structural layer SL is formed.
  • a three-dimensional structure ST that is relatively firmly integrated with a base material such as a metal plate is formed.
  • the base material BM1 can be relatively easily removed from the three-dimensional structure ST, which is beneficial compared to the modeling system of the comparative example. The technical effect can be enjoyed.
  • the base material BM1 is an accumulation of the modeling material M that is the same as the modeling material M supplied by the material nozzle 112.
  • the base material BM1 may be an accumulation of modeling material M1 different from the modeling material M supplied by the material nozzle 112.
  • the base material BM1 is an accumulation of modeling material M1 having different characteristics (for example, at least one of type, material, melting point, particle size, light EL absorption characteristics, etc.) from the modeling material M supplied by the material nozzle 112. It may be. Even in this case, as long as it is possible to form the modeled object (particularly, the first structural layer SL) by irradiating the modeling material M1 with the light EL, it is possible to enjoy the same effects as described above. .
  • the modeling system 1 is melted by irradiation with the light EL when the first structural layer SL is formed using the first layered modeling method (for example, powder bed fusion bonding method).
  • the modeling material M is melted so that the modeling material M does not come into contact with the case 1511.
  • the modeling system 1 may melt the modeling material M so that at least a part of the modeling material M melted by irradiation with the light EL is in contact with the case 1511. Even in this case, if the melted molding material M is not solidified so as to be relatively firmly bonded to the case 1511, it can be relatively easily separated from the base material BM1 (further, the case 1511).
  • the dimensional structure ST can be formed.
  • the smaller the area where the modeling material M melted by the irradiation of the light EL is in contact with the case 1511 the higher the possibility that the base material BM1 can be relatively easily removed from the three-dimensional structure ST. .
  • the modeling material M is supplied from the material nozzle 112 when the first structural layer SL of the plurality of structural layers SL constituting the three-dimensional structure ST is formed on the base material BM1. You may do it.
  • the surface of the base material BM1 is not limited to a flat surface and may be a curved surface.
  • the stage 13 may be moved instead of or in addition to the movement of the modeling head 11 and is injected from the modeling head 11.
  • the irradiation area EA may be moved by changing the direction of the light to be emitted.
  • the three-dimensional structure ST may be formed only by the first laminated molding method. Even in this case, since the three-dimensional structure ST can be in a floating state in the powdery or granular modeling material M constituting the base material BM1, the three-dimensional structure ST is separated from the base material BM1. It can be in a state where it can be separated from the case 1511.
  • the second specific example of the modeling operation is a physical application applied from the outside in order to form a three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • a difference in characteristics that the durability of the base material BM and the three-dimensional structure ST with respect to impact is different is utilized.
  • the strength for example, proportional limit, elastic limit, Differences in characteristics such as yield point or yield strength, tensile strength, compressive strength, shear strength, bending strength, fatigue strength, impact value, etc.
  • the flow of the second specific example of the modeling operation will be described with reference to the flowchart of FIG.
  • a base material BM including a lump of granular or powdery modeling material M (hereinafter, the base material BM used in the second specific example is appropriately referred to as “base material BM2”). It arrange
  • the modeling material M is hardened to such an extent that it can be placed on the stage 13 while maintaining the solid shape.
  • the base material BM2 is arranged on the stage 13 without the need for the case 1511 used for arranging the base material BM1 on the stage 13 in the first specific example described above. Is possible.
  • the modeling material M constituting the base material BM2 has a physical action, a chemical action, an electrical action, a magnetic action on the modeling material M collected in order to form a lump (that is, an accumulation of the modeling material M), It may be hardened by adding at least one of an optical action and a thermal action.
  • the modeling material M constituting the base material BM2 may be hardened by applying pressure (that is, compressed) to the accumulation of the modeling material M so as to solidify the accumulation.
  • the modeling material M constituting the base material BM2 is an accumulation of the modeling material M so that the modeling material M is partially melted (that is, partially melted) and partially fixed to the surrounding modeling material M. May be hardened by heating.
  • the base material BM2 made of the hardened modeling material M may be arranged on the stage 13.
  • the base material BM2 constituted by the solidified modeling material M may be disposed on the stage 13.
  • the modeling system 1 may include a solidifying device for solidifying the modeling material M constituting the base material BM2.
  • the modeling system 1 includes the solidified modeling material M on the stage 13 by irradiating the modeling material M supplied from the material nozzle 112 to the stage 13 with the light EL to solidify the modeling material M.
  • the base material BM2 may be formed.
  • the modeling system 1 can form the base material BM2 even without the solidification device described above.
  • the base material BM2 may be formed by bonding the modeling material M to each other with a binding material such as an adhesive.
  • the base material BM2 includes a mass of the modeling material M that is relatively weakly hardened so as to have lower durability against physical impact than the three-dimensional structure ST.
  • the base material BM2 includes a mass of the modeling material M that is not firmly hardened so as to have higher durability against physical impact than the three-dimensional structure ST.
  • the three-dimensional structure ST is a shaped object formed by solidifying the modeling material M once melted in a liquid state. For this reason, the durability of the three-dimensional structure ST against physical impact is relatively high.
  • the base material BM2 formed by applying pressure to the accumulation of the modeling material M is only that the modeling material M constituting the base material BM2 is fixed mainly by frictional force.
  • the durability against physical impact is relatively low.
  • the base material BM2 formed by partially melting the modeling material M and partially adhering to the surrounding modeling material M is partially formed by the modeling material M constituting the base material BM2. Because it is only fixed, the durability against physical impact is relatively low. Therefore, the base material BM2 composed of the modeling material M hardened so as to have lower durability against physical impact than the three-dimensional structure ST can be formed relatively easily.
  • the surface of the base material BM2 (specifically, the surface irradiated with the light EL and the surface on the + Z side) is a plane (in particular, a plane along the XY plane). Therefore, the base material BM2 has a plate shape or a disk shape. However, the surface of the base material BM2 may not be a flat surface (for example, may be a curved surface), and the base material BM2 may have an arbitrary shape.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM2 using the layered modeling technique under the control of the control device 14 (step S22 in FIG. 8).
  • the modeling system 1 can irradiate the modeling material M supplied from the material nozzle 112 with the light EL to form a modeled object (further, the structural layer SL) described above.
  • a plurality of structural layers SL constituting the three-dimensional structure ST are sequentially formed on the base material BM2 by using an additive manufacturing method (for example, the laser overlay welding method described above).
  • the modeling system 1 controls the surface (specifically, the surface of the base material BM2 under the control of the control device 14).
  • the irradiation area EA is set in a desired area on the modeling surface MS corresponding to the surface to which the light EL is irradiated and the surface on the + Z side), and the light EL is emitted from the irradiation system 111 to the irradiation area EA Irradiate.
  • the modeling system 1 sets a supply area MA in a desired area on the modeling surface MS under the control of the control device 14, and the material nozzle 112 for the supply area MA.
  • the modeling material M is supplied from As a result, as shown in FIG. 10A, the molten pool MP is formed in a desired region on the modeling surface MS, and the modeling material M is supplied to the molten pool MP. At this time, the molten pool MP may be formed by melting the modeling material M constituting a part of the base material BM2 in addition to the modeling material M supplied from the material nozzle 112. Thereafter, when the light EL is no longer applied to the molten pool MP as the modeling head 11 moves, the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified) again. As a result, as shown in FIG. 10B, a modeled object is formed on the modeling surface MS by the solidified deposit of the modeling material M.
  • a part of the base material BM2 becomes the solidified modeling material M. It is converted into a corresponding model.
  • a series of modeling processes including formation of the molten pool MP by such light irradiation EL, supply of the modeling material M to the molten pool MP, melting of the supplied modeling material M and solidification of the molten modeling material M is performed as modeling. Repeated while irradiating the light EL at a timing according to the distribution of the region where the object is to be formed (that is, the pattern of the structural layer SL) and moving the modeling head 11 relative to the modeling surface MS along the XY plane. It is. As a result, as shown in FIG. 10C, a structural layer SL corresponding to an aggregate of a modeled object by the solidified modeling material M is formed on the modeling surface MS. That is, the first structural layer SL is formed on the base material BM2.
  • the three-dimensional structure ST is separated from at least a part of the base material BM2 (Step S23 in FIG. 8).
  • the base material BM2 has lower durability against physical impact than the three-dimensional structure ST.
  • the base material BM2 has lower impact resistance than the three-dimensional structure ST. That is, the base material BM2 is more easily pulverized (in other words, destroyed) by physical impact than the three-dimensional structure ST.
  • the modeling system 1 in order to separate the three-dimensional structure ST from at least a part of the base material BM2, the modeling system 1 (or an external device of the modeling system 1 or a user of the modeling system 1) As shown in FIG. 12A, a physical impact having an appropriate strength is applied to the substrate BM2.
  • the modeling system 1 or the like may apply a physical impact having an appropriate strength (that is, a physical action caused by the kinetic energy of the impact application member) to the base material BM2 using an impact application member such as a hammer.
  • a physical impact having an appropriate strength that is, a physical action caused by the kinetic energy of the impact application member
  • the modeling system 1 or the like applies an ultrasonic wave or the like to the base material BM2 and applies a physical impact of an appropriate strength (that is, a physical action such as vibration caused by irradiation of an ultrasonic wave or the like) to the base material BM2.
  • the base material BM2 is pulverized as shown in FIG. That is, the base material BM2 is pulverized and separated into a powdery or granular modeling material M.
  • a three-dimensional structure is formed from at least a part of the base material BM2 (in the example shown in FIG. 12B, most or all of the base material BM2).
  • ST is separable. That is, it is possible to relatively easily remove at least a part of the base material BM2 from the three-dimensional structure ST (in the example shown in FIG. 12B, most or all of the base material BM2).
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM2. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM2 is positioned between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the material nozzle 112 sprays the modeling material M in the process in which the three-dimensional structure ST is formed on the base material BM2.
  • the physical impact typically physical action resulting from the impact which the modeling material M inject
  • the injection of the modeling material M can be added. There is sex.
  • the base material BM2 is crushed by a physical impact applied to the base material BM2 in the process of forming the three-dimensional structure ST on the base material BM2, the three-dimensional structure ST is formed on the base material BM2 in the first place. I can't. For this reason, even if the base material BM2 has high durability or impact resistance to the extent that the base material BM2 is not broken by a physical impact applied to the base material BM2 in the process of forming the three-dimensional structure ST on the base material BM2. Good.
  • the base material BM2 is a structure in which the same modeling material M as the modeling material M supplied by the material nozzle 112 is hardened.
  • the base material BM2 may be a structure in which a modeling material M2 different from the modeling material M supplied by the material nozzle 112 is hardened.
  • the base material BM2 is solidified with a modeling material M2 having different characteristics (for example, at least one of the kind, material, melting point, particle size, light EL absorption characteristics, etc.) from the modeling material M supplied by the material nozzle 112. It may be a structure.
  • the modeling material M does not have to be supplied from the material nozzle 112 to the supply area MA which is a desired area on the modeling surface MS.
  • the first structural layer SL may be formed by melting the modeling material M constituting a part of the base material BM2 and then solidifying it.
  • the modeling system 1 forms the three-dimensional structure ST using the same additive manufacturing method.
  • the modeling system 1 may change the layered modeling method to be used in the process of forming the three-dimensional structure ST. That is, since the modeling system 1 forms a part of the three-dimensional structure ST, a layered modeling method different from the additive manufacturing method used to form another part of the three-dimensional structure ST may be used. .
  • the third specific example of the modeling operation is to form the base material BM and the three-dimensional structure in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the difference between at least one of the absorption characteristic and the transmission characteristic of the object ST with respect to the light EL is used.
  • the flow of the third specific example of the modeling operation will be described with reference to the flowchart of FIG.
  • the base material BM having the property of allowing light EL to pass (hereinafter, the base material BM used in the third specific example is appropriately referred to as “base material BM3”). ) Is placed on the stage 13 (step S31 in FIG. 13). For this reason, base material BM contains the member which can let light EL pass.
  • the “member that transmits the light EL” is a member that has a light transmittance of at least a predetermined rate (for example, 50%, 60%, 70%, 80%, 90%, 95%, etc.). It may mean.
  • the base material BM3 is arranged on the stage 13 in a state of facing the counter substrate 1531.
  • the base material BM3 is disposed on the stage 13 with the counter substrate 1531 positioned below the base material BM3 (that is, on the stage 13 side or the ⁇ Z side). That is, the base material BM3 is disposed on the stage 13 in a state where the base material BM3 is located above the counter substrate 1531 (that is, the modeling head 11 side or the + Z side).
  • the counter substrate 1531 is positioned on the stage 13, and the base material BM3 is positioned above the counter substrate 1531.
  • the base material BM3 is arranged on the stage 13 in a state where a gap 1533 is secured between the base material BM3 and the counter substrate 1531 via the spacer 1532.
  • the spacer 1532 may be a cylindrical member, or may be a plurality of columnar members arranged so as to have an interval in the X or Y direction.
  • the modeling material M is accommodated in the gap 1533.
  • the modeling material M may be supplied to the gap 1533 in accordance with the timing at which the base material BM3 is arranged on the stage 13, or the modeling material M is preliminarily placed before the base material BM3 is arranged on the stage 13. It may be supplied.
  • the surface of the base material BM3 that faces the gap 1533 (the surface facing the ⁇ Z side in the example shown in FIG. 14) 1534 is a flat surface, but may include a curved portion, and may be a curved surface. Also good.
  • a surface (surface facing the + Z side in the example shown in FIG. 14) 1535 of the counter substrate 1531 facing the gap 1533 is a flat surface, but may include a curved surface portion or a curved surface. Good.
  • the surface 1534 of the base material BM3 that faces the gap 1533 is parallel to the face 1535 of the counter substrate 1531 that faces the gap 1533, but it may not be parallel.
  • the modeling system 1 irradiates the modeling material M accommodated in the gap 1533 via the base material BM3 with the light EL, thereby the first layer among the plurality of structural layers SL constituting the three-dimensional structure ST.
  • the structural layer SL is formed (step S32 in FIG. 13).
  • the modeling system 1 adjusts the focus position of the light EL to an arbitrary position in the gap 1533 in the Z-axis direction under the control of the control device 14.
  • the modeling system 1 then irradiates light EL from the irradiation system 111.
  • the light EL is irradiated to the modeling material M accommodated in the gap 1533 through the base material BM3.
  • the light EL passing through the base material BM3 is irradiated from the surface 1536 opposite to the surface 1534 of the base material BM3 toward the surface 1534 of the modeling material M accommodated in the gap 1533.
  • the modeling material M irradiated with the light EL among the modeling material M accommodated in the gap 1533 is melted.
  • the molten modeling material M is not irradiated with the light EL as the modeling head 11 moves, the molten modeling material M is cooled and solidified (that is, solidified) again.
  • a modeled object corresponding to the solidified modeling material M is formed in a part of the gap 1533 as shown in FIG.
  • a series of modeling processes including melting of the modeling material M and solidification of the melted modeling material M by such light irradiation EL correspond to the distribution pattern (that is, the pattern of the structural layer SL) in which the modeled object is to be formed.
  • the process is repeated while irradiating the light EL at the timing and moving the modeling head 11 relative to the base material BM3 along the XY plane.
  • a structural layer SL that is, the first structural layer SL
  • the structural layer SL facing the base material BM3 and the counter substrate 1531 is formed between the base material BM3 and the counter substrate 1531.
  • the first structural layer SL is formed by the light EL through the base material BM3.
  • the part corresponding to the modeling material M to be melted in order to form at least the first structural layer SL of the base material BM3 is formed of a member through which the light EL can pass. That is, the base material BM3 has a light passage region through which the light EL can pass in a portion corresponding to the modeling material M to be melted to form at least the first structural layer SL.
  • at least a portion of the base material BM3 facing the gap 1533 that accommodates the modeling material M may be formed of a member through which the light EL can pass.
  • the base material BM3 may have a light passage region through which the light EL can pass at least in a portion facing the gap 1533 that accommodates the modeling material M.
  • the whole base material BM3 may be a member through which the light EL can pass, or a part of the base material BM3 may be a member through which the light EL can pass.
  • the surface 1534 facing the gap 1533 is a flat surface of the surface of the base material BM3, when the structural layer SL is formed so as to contact the surface 1534, the surface of the surface of the structural layer SL facing the base material BM3. (In the example shown in FIG. 15C, the surface facing the + Z side) is also a flat surface. Similarly, the surface 1535 of the surface of the counter substrate 1531 that faces the gap 1533 is a flat surface. Therefore, when the structural layer SL is formed so as to be in contact with the surface 1535, the surface of the structural layer SL on the counter substrate 1531 The facing surface (in the example shown in FIG. 15C, the surface facing the -Z side) is also a flat surface.
  • the surface 1534 is parallel to the surface 1535, the surface of the structural layer SL that faces the base material BM3 and the surface of the structural layer SL that faces the counter substrate 1531 are parallel to each other. That is, in the third specific example, the first structural layer SL is formed in which two surfaces facing each other along the direction in which the plurality of structural layers SL are stacked (that is, the Z-axis direction) are parallel to each other. The Such a first structural layer SL contributes to appropriate formation of the second and subsequent structural layers SL on the first structural layer SL.
  • the base material BM3 has a characteristic that the light EL can pass therethrough.
  • the light EL is attenuated by the base material BM3 unless the transmittance of the base material BM3 with respect to the light EL is 100%.
  • the transmittance of the base material BM3 with respect to the light EL is relatively small, the intensity of the light EL through the base material BM3 becomes relatively small. If the intensity of the light EL through the base material BM3 becomes relatively small, there is a possibility that the modeling material M cannot be melted by irradiation with the light EL.
  • the base material BM3 may have a characteristic that a relatively large amount of light EL can be transmitted so that the modeling material M can be melted by the light EL via the base material BM3. .
  • the base material BM3 may have a characteristic that the light EL is not attenuated relatively large so that the modeling material M cannot be melted by the light EL via the base material BM3.
  • the base material BM3 has such a high transmittance that the modeling material M can be melted by the light EL through the base material BM3 by transmitting a relatively large amount of light EL. Also good.
  • the degree of attenuation of the light EL by the base material BM3 is not only the transmittance of the base material BM3 but also the thickness of the base material BM3 (that is, the size of the base material BM3 in the Z-axis direction along the optical path of the light EL). Also affected. For this reason, base material BM3 may have the transmittance
  • the modeling material M has a characteristic that it can absorb the light EL.
  • the more the modeling material M absorbs the light EL the less the light EL passes through the modeling material M.
  • the modeling material M has a characteristic that light is relatively difficult to pass.
  • the base material BM3 mentioned above has the characteristic that light EL passes substantially rather than modeling material M (Furthermore, three-dimensional modeling object ST formed from modeling material M). Good. That is, the base material BM3 may have a characteristic that the light EL is relatively easy to pass through.
  • the base material BM3 may have a characteristic that it is substantially less likely to absorb the light EL than the modeling material M (further, the three-dimensional model ST formed from the modeling material M). . That is, the base material BM3 may have a characteristic that it is relatively difficult to absorb the light EL.
  • the base material BM3 through which the light EL has passed is also irradiated with the light EL as long as the absorption rate of the base material BM3 with respect to the light EL is not 0%.
  • the resulting heat may be generated.
  • the base material BM3 may be melted. If the base material BM3 is melted in the process of forming the structural layer SL in the gap 1533, the structure layer SL (particularly, two surfaces facing the gap 1533 along the direction in which the plurality of structural layers SL are stacked) are formed.
  • the structural layer SL which is a plane parallel to each other cannot be appropriately formed. Furthermore, if the base material BM3 is melted in the process of forming the structural layer SL in the gap 1533, the base material BM3 and the structural layer SL (that is, the three-dimensional structure ST) may be integrated. is there. If the base material BM3 and the three-dimensional structure ST are integrated, the base material BM3 may not be easily removed from the three-dimensional structure. For this reason, the base material BM3 may have a high melting point to such an extent that the base material BM3 is not melted by irradiation with the light EL. As an example, the base material BM3 may have a higher melting point than the modeling material M.
  • the modeling system 1 is configured so that the base material BM3 is not melted by the light EL irradiation.
  • the characteristics may be controlled.
  • the characteristics of the light EL may include the focus position of the light EL.
  • the modeling system 1 may set the focus position of the light EL (that is, the position where the intensity of the light EL is the highest) at a position away from the base material BM3.
  • the modeling system 1 may set the focus position of the light EL to the gap 1533 that is out of the base material BM3.
  • the characteristics of the light EL may include the intensity (or intensity distribution) of the light EL.
  • the modeling system 1 controls the intensity (or intensity distribution) of the light EL so that the intensity of the light EL in the range in which the base material BM3 is distributed is an intensity that does not melt the base material BM3. Also good.
  • a sapphire glass substrate is an example of the base material BM3 that satisfies the above-described characteristics (particularly, at least one of transmittance for light EL, absorption for light EL, and melting point).
  • any structure for example, a quartz glass substrate
  • the base material BM3 may be used as the base material BM3.
  • the lower surface (the surface on the counter substrate 1531 side) of the structural layer SL may not be in contact with the counter substrate 1531.
  • an unmelted modeling material M may be interposed between the structural layer SL and the counter substrate 1531.
  • the modeling system 1 reverses the top and bottom of the base material BM3 using a robot arm (not shown) or the like (step S33 in FIG. 13).
  • the structural layer SL formed in the gap 1533 is positioned below the base material BM3 (that is, on the stage 13 side or the ⁇ Z side).
  • the upper and lower sides of the base material BM3 are inverted so that the structure layer SL formed in the gap 1533 is shifted from the base material BM3 to the information (that is, the modeling head 11 side or the + Z side). .
  • the information that is, the modeling head 11 side or the + Z side.
  • the base material BM3 is in a state where the base material BM3 is arranged on the stage 13 and the first structural layer SL is arranged on the base material BM3. 13 is arranged.
  • the modeling system 1 sets the surface of the first structural layer SL to the modeling surface MS, and then forms the second structural layer SL on the first structural layer SL (step in FIG. 13). S34). Furthermore, the modeling system 1 forms the third and subsequent structural layers SL by repeating the same operation after setting the surface of the formed structural layer SL as a new modeling surface MS as necessary. In this case, since the upper and lower sides of the base material BM3 are inverted in step S33 of FIG. 13, the modeling system 1 irradiates the light EL from the material nozzle 112 to the modeling surface MS without passing through the base material BM3. Thus, the structural layer SL is formed. Conversely, the process of step S33 in FIG.
  • the three-dimensional structure ST is separated from at least a part of the base material BM3 (step S35 in FIG. 13). Specifically, as described above, the modeling material M accommodated in the gap 1533 between the base material BM3 and the counter substrate 1531 is melted by irradiation with the light EL, while the base material BM3 itself is melted. Absent. For this reason, as shown in FIG. 17, the modeling material M solidified after melting is not integrated with the base material BM3. That is, the formed three-dimensional structure ST and the base material BM3 are not integrated. In other words, the formed three-dimensional structure ST and the base material BM3 are not relatively firmly bonded. Therefore, as shown in FIG.
  • the three-dimensional structure ST and the base material BM3 are relatively easily separated from each other as compared with the case where the formed three-dimensional structure ST and the base material BM3 are integrated. can do. Therefore, also in the third specific example, as in the first specific example, the three-dimensional structure ST is separated from at least a part of the base material BM3 (in the example shown in FIG. 18, most or all of the base material BM3). Is possible. That is, it is possible to relatively easily remove at least a part of the base material BM3 from the three-dimensional structure ST (in the example illustrated in FIG. 18, most or all of the base material BM3).
  • step S32 in FIG. 13 the first structural layer SL (that is, the three-dimensional structure ST) from the modeling material M accommodated in the gap 1533 between the base material BM3 and the counter substrate 1531. Is formed).
  • a base layer serving as a foundation of the three-dimensional structure ST may be formed from the modeling material M accommodated in the gap 1533.
  • step S34 in FIG. 13 a plurality of structural layers SL constituting the three-dimensional structure ST are sequentially formed on the base layer.
  • the upper and lower sides of the base material BM3 are inverted.
  • the base material BM3 is removed from the counter substrate 1531 without turning the base material BM3 upside down.
  • Step S34 and subsequent steps may be performed.
  • the lower surface (surface on the counter substrate 1531 side) of the first structural layer SL may be a flat surface.
  • the counter substrate 1531 may have a higher melting point than the modeling material M.
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM3. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM3 is positioned between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the gap 1533 may contain a modeling material M3 different from the modeling material M supplied by the material nozzle 112.
  • the gap 1533 accommodates a modeling material M3 having characteristics (for example, at least one of the type, material, melting point, particle size, light EL absorption characteristics, etc.) different from the modeling material M supplied by the material nozzle 112. It may be. Even in this case, as long as it is possible to form a modeled object (for example, the first structural layer SL) by irradiating the modeling material M3 with the light EL, it is possible to enjoy the same effects as those described above. .
  • the fourth specific example of the modeling operation is the same as the third specific example described above in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM. Similarly, the difference between at least one of the absorption characteristic and the transmission characteristic of the base material BM and the three-dimensional structure ST with respect to the light EL is used. However, in the fourth specific example, after the first structural layer SL is formed on the base material BM, the second and subsequent structural layers SL are formed without turning the base material BM upside down. This is different from the third specific example in which the second and subsequent structural layers SL are formed after the base layer BM is turned upside down after the second structural layer SL is formed.
  • a modeling system 1a in which a modeling head 11a and a stage 13a are added to the modeling system 1 is used to form the second and subsequent structural layers SL without inverting the base material BM upside down.
  • FIG. 19 After describing the configuration of the modeling system 1a that performs the fourth specific example of the modeling operation with reference to FIG. 19, the flow of the fourth specific example of the modeling operation will be described with reference to the flowchart of FIG.
  • the modeling system 1a further includes a modeling head 11a, a head drive system 12a, and a stage 13a as compared with the modeling system 1.
  • the modeling head 11a includes an irradiation system 111a.
  • the irradiation system 111a is an optical system (for example, a condensing optical system) for emitting the light ELa from the emitting unit 113a.
  • the irradiation system 111a is optically connected to a light source (not shown) that emits light ELa via a light transmission member (not shown) such as an optical fiber.
  • the irradiation system 111a emits light ELa propagating from the light source via the light transmission member.
  • the irradiation system 111a irradiates light ELa upward (that is, + Z side) from the irradiation system 111a.
  • a stage 13a is disposed above the irradiation system 111a.
  • the irradiation system 111a is located on the gravity direction side (that is, on the ⁇ Z side and below) with respect to the stage 13a.
  • the light ELa is light having the same characteristics as the light EL, but may be light having different characteristics from the light EL.
  • the head drive system 12a moves the modeling head 11a.
  • the head drive system 12a moves the modeling head 11a along each of the X axis, the Y axis, and the Z axis.
  • the head drive system 12a may move the modeling head 11a along at least one of the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction in addition to the X axis, the Y axis, and the Z axis.
  • the head drive system 12a includes, for example, a motor.
  • the stage 13a can hold the base material BM on its upper surface.
  • the stage 13a can further release the held base material BM.
  • the irradiation system 111a described above irradiates the light ELa in at least a part of the period in which the stage 13a holds the base material BM.
  • the irradiation system 111a is positioned below the stage 13a. Therefore, the irradiation system 111a is directed to the base material BM via the stage 13a. Irradiate.
  • the stage 13a includes a light passage region 131a through which the light ELa can pass.
  • a portion of the stage 13a that holds the base material BM may be a light passage region 131a through which the light ELa can pass.
  • the stage 13a may be movable along each of the X axis, the Y axis, and the Z axis, and may be rotatable in the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • Such a modeling system 1a performs the fourth specific example of the modeling operation shown in FIG. Specifically, first, the base material BM3 is placed on the stage 13a (step S41 in FIG. 20). However, as shown in FIG. 21, in the fourth specific example, the counter substrate 1531 and the spacer 1532 may not be arranged on the stage 13 together with the base material BM3. In this case, the base material BM3 is disposed on the stage 13a so that the above-described surface 1534 (that is, a surface that faces the gap 1533 and is a flat surface) faces upward.
  • the above-described surface 1534 that is, a surface that faces the gap 1533 and is a flat surface
  • the modeling material M is supplied to the base material BM3 (step S42 in FIG. 20). Specifically, as shown in FIG. 22, the modeling material M is supplied to the surface 1534 of the base material BM3.
  • the modeling material M may be supplied from the material nozzle 112 of the modeling head 11 or may be supplied from another supply device.
  • the base material BM3 in which the modeling material M is supplied to the surface 1534 in advance may be arranged on the stage 13a. If necessary, the modeling system 1 (or an apparatus outside the modeling system 1 or a user of the modeling system 1) may level the supplied modeling material M using a squeezing blade or the like. Good.
  • the modeling system 1 irradiates the modeling material M supplied to the surface 1534 via the base material BM3 with the light EL, and thereby the first layer among the plurality of structural layers SL constituting the three-dimensional structure ST.
  • the structural layer SL is formed (step S43 in FIG. 20).
  • the process for forming the first structural layer SL in the fourth specific example may be the same as the process for forming the first structural layer SL in the third specific example.
  • the irradiation system 111a is located below the stage 13a. Therefore, as illustrated in FIG.
  • the first structural layer SL is formed.
  • the modeling system 1a irradiates the modeling material M supplied to the surface 1534 with the light EL via the light transmission region 131a of the stage 13a in addition to the light transmission region of the base material BM3, thereby forming the first structural layer.
  • SL is formed.
  • the modeling system 1 transports the base material BM3 on which the first structural layer SL is formed (step S44 in FIG. 20). Specifically, the modeling system 1 transports the base material BM3 on which the first structural layer SL is formed from the stage 13a to the stage 13 using a transport device (not shown). That is, the modeling system 1 conveys the base material BM3 on which the first structural layer SL is formed to a position where the light EL from the irradiation system 111 can be irradiated. At this time, the upper and lower sides of the base material BM3 may not be reversed.
  • the irradiation system 111 is positioned above the stage 13, so that the irradiation system 111 does not pass through the base material BM3, and the first structural layer SL does not pass through the base material BM3. This is because it is possible to irradiate light EL.
  • the modeling system 1 sets the surface of the first structural layer SL to the modeling surface MS, and then forms the second structural layer SL on the first structural layer SL (step of FIG. 20). S45). Furthermore, the modeling system 1 forms the third and subsequent structural layers SL by repeating the same operation after setting the surface of the formed structural layer SL as a new modeling surface MS as necessary.
  • the operation of forming the second and subsequent structural layers SL in the fourth specific example is the same as the operation of forming the second and subsequent structural layers SL in the third specific example, and thus detailed description thereof is omitted. To do. As a result, a three-dimensional structure ST is formed.
  • the three-dimensional structure ST is separated from at least a part of the base material BM3 (step S46 in FIG. 20).
  • the operation of separating the three-dimensional structure ST from at least a part of the base material BM3 in the fourth specific example is the same as the operation of separating the three-dimensional structure ST from at least a part of the base material BM3 in the third specific example. Therefore, detailed description thereof is omitted.
  • the three-dimensional structure ST can be separated from at least a part of the base material BM4.
  • step S43 in FIG. 20 the first structural layer SL (that is, a part of the three-dimensional structure ST) is formed from the modeling material M supplied to the base material BM3.
  • a base layer serving as a base of the three-dimensional structure ST is formed from the modeling material M supplied to the base material BM3. May be.
  • the same modeling material M as the modeling material M supplied by the material nozzle 112 is accommodated in the surface 1534 of the base material BM3.
  • the surface 1534 may be supplied with a modeling material M4 different from the modeling material M supplied by the material nozzle 112.
  • the surface 1534 accommodates a modeling material M4 having different characteristics (for example, at least one of the type, material, melting point, particle size, light EL absorption characteristics, etc.) from the modeling material M supplied by the material nozzle 112. It may be. Even in this case, as long as it is possible to form a modeled object (for example, the first structural layer SL) by irradiating the modeling material M4 with the light EL, it is possible to enjoy the same effects as those described above. .
  • the base BM3 may be held when the single stage 13b forms the first structural layer SL and the second and subsequent structural layers SL.
  • a modeling system 1b including a stage 13b instead of the stage 13 and the stage 13a may perform a fourth specific example of the modeling operation.
  • the modeling system 1b forms the first structural layer SL by irradiating the substrate BM3 with the light EL from the irradiation system 111a via the substrate BM3 and the stage 13b, and then transports the substrate BM3.
  • the second structural layer SL may be formed by irradiating the base material BM3 with the light EL from the irradiation system 111 without passing through the base material BM3 and the stage 13b.
  • the stage 13b has the light passage area 131b through which the light ELa can pass, like the stage 13a.
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 (13b) through the base material BM3. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13 (13b). In addition, it may be considered that the base material BM3 is located between the entire three-dimensional structure ST and the stage 13 (13b), and the entire three-dimensional structure ST is regarded as being away from the stage 13 (13b). Also good.
  • the fifth specific example of the modeling operation is to form the base material BM and the three-dimensional structure to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the difference in the thermal characteristics of the object ST is used.
  • a base material BM (hereinafter referred to as a fifth specific example) having different thermal characteristics from the modeling material M (further, a three-dimensional structure ST formed from the modeling material M).
  • the material BM is appropriately referred to as “base material BM5”) is placed on the stage 13 (step S51 in FIG. 26).
  • the thermal characteristics include characteristics related to the melting point.
  • the melting point of the base material BM5 is lower than the melting point of the modeling material M (that is, the melting point of the three-dimensional structure ST).
  • the modeling material M has a melting point of approximately 1400 degrees.
  • the base material BM4 eutectic solder having a melting point of approximately 183 degrees, lead-free solder having a melting point of approximately 220 degrees, tin having a melting point of approximately 232 degrees, and melting point of approximately 327 degrees. At least one of lead and aluminum having a melting point of approximately 660 degrees may be used.
  • the base material BM5 may be made of at least one of other types of metals, arbitrary resins, and arbitrary materials in addition to or instead of the metals exemplified here.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM5 using the layered modeling technique under the control of the control device 14 (step S52 in FIG. 26).
  • the modeling system 1 can irradiate the modeling material M supplied from the material nozzle 112 with the light EL to form a modeled object (further, the structural layer SL) described above.
  • a plurality of structural layers SL constituting the three-dimensional structure ST are sequentially formed on the base material BM5 by using an additive manufacturing method (for example, the laser overlay welding method described above).
  • the modeling system 1 controls the surface of the base material BM5 (specifically, under the control of the control device 14).
  • the irradiation area EA is set in a desired area on the modeling surface MS corresponding to the surface to which the light EL is irradiated and the surface on the + Z side), and the light EL is emitted from the irradiation system 111 to the irradiation area EA. Irradiate.
  • the modeling system 1 sets a supply area MA in a desired area on the modeling surface MS under the control of the control device 14, and the material nozzle 112 for the supply area MA.
  • the modeling material M is supplied from As a result, as shown in FIG. 27A, the molten pool MP is formed in a desired region on the modeling surface MS, and the modeling material M is supplied to the molten pool MP.
  • the molten pool MP may be formed by melting the modeling material M constituting a part of the base material BM5 in addition to the modeling material M supplied from the material nozzle 112.
  • the base material BM5 since the melting point of the base material BM5 is lower than the melting point of the modeling material M, the base material BM5 is more easily melted than the modeling material M. If the base material BM5 is melted too much and a through hole extending from the upper surface to the lower surface of the base material BM5 is formed, the liquid material constituting the molten pool MP flows out through the through hole. That is, there is a possibility that the molten pool MP cannot be appropriately formed on the base material BM5. For this reason, the base material BM5 may have such a thickness that a through hole from the upper surface to the lower surface of the base material BM5 is not formed.
  • the modeling system 1 includes a through-hole extending from the upper surface to the lower surface of the base material BM5.
  • the characteristics of the light EL may be controlled so that no is formed.
  • the characteristics of the light EL may include the focus position of the light EL.
  • the modeling system 1 may set the focus position of the light EL (that is, the position where the intensity of the light EL is the highest) at a position away from the base material BM5.
  • the modeling system 1 may set the focus position of the light EL in the space above the base material BM5.
  • the characteristics of the light EL may include the intensity (or intensity distribution) of the light EL.
  • the modeling system 1 controls the intensity (or intensity distribution) of the light EL so that the intensity of the light EL in the range in which the base material BM5 is distributed becomes an intensity that does not melt the base material BM5. Also good. Further, the modeling system 1 may cool the lower surface of the base material BM5 to prevent formation of a through hole from the upper surface to the lower surface of the base material BM5.
  • the light EL is higher as long as the melting point of the base material BM5 is lower than the melting point of the modeling material M.
  • the modeling material M is melted by the irradiation, a part of the base material BM5 should be melted to some extent by the irradiation of the light EL.
  • a part of the molten base material BM5 is evaporated as it is without forming the molten pool MP. There is a possibility that. As a result, there is a possibility that the molten pool MP cannot be appropriately formed on the base material BM5. For this reason, the boiling point of the base material BM5 may be higher than the melting point of the modeling material M.
  • a structural layer SL corresponding to an aggregate of a modeled object by the solidified modeling material M is formed on the modeling surface MS. That is, the first structural layer SL is formed on the base material BM5.
  • the operation of forming the second and subsequent structural layers SL in the fifth specific example is the same as the operation of forming the second and subsequent structural layers SL in the first specific example, and thus detailed description thereof is omitted. To do.
  • the three-dimensional structure ST is separated from at least a part of the base material BM5 (Step S53 in FIG. 26). Specifically, as described above, the melting point of the base material BM5 is lower than the melting point of the three-dimensional structure ST. That is, the base material BM5 is more easily melted by heat than the three-dimensional structure ST. For this reason, if the base material BM5 can be melted and appropriate heat that does not melt the three-dimensional structure ST is applied to the base material BM5, the base material BM5 is melted to at least part of the base material BM5.
  • the modeling system 1 in order to separate the three-dimensional structure ST from at least a part of the base material BM5, the modeling system 1 (or an apparatus outside the modeling system 1 or a user of the modeling system 1) An appropriate amount of heat is applied to the substrate BM5.
  • the modeling system 1 or the like may add an appropriate amount of heat (that is, a thermal action caused by the heat generated by the heat source) to the base material BM5 using a heat source such as a heater.
  • the modeling system 1 or the like irradiates the base material BM5 with light, electromagnetic waves, etc., so that heat of an appropriate amount of heat (that is, thermal action caused by heat generated in the base material BM5 due to irradiation of light and electromagnetic waves). May be added to the base material BM5.
  • the base material BM5 is melted as shown in FIG.
  • the bonding force between the base material BM5 and the three-dimensional structure ST is also weakened.
  • the three-dimensional structure ST is relatively from at least a part of the base material BM5 (in the example shown in FIG. 28 (b), most or all of the base material BM5). It can be easily separated. That is, it is possible to relatively easily remove at least a part of the base material BM5 from the three-dimensional structure ST (in the example illustrated in FIG. 28B, most or all of the base material BM5).
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM5. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM5 is positioned between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the sixth specific example of the modeling operation is to form the base material BM and the three-dimensional structure in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the difference in chemical characteristics of the object ST is used.
  • the flow of the sixth specific example of the modeling operation will be described below with reference to the flowchart of FIG.
  • a base material BM (hereinafter referred to as a sixth specific example) having a different chemical property from the modeling material M (further, a three-dimensional structure ST formed from the modeling material M).
  • the material BM is appropriately referred to as “base material BM6”) is placed on the stage 13 (step S61 in FIG. 29).
  • the chemical characteristics include characteristics relating to reactivity (particularly solubility) with respect to a predetermined solvent.
  • the base material BM6 has a characteristic that it is more likely to react with a predetermined solvent than the modeling material M and the three-dimensional structure ST (in particular, it is likely to react and dissolve).
  • the base material BM6 has higher reactivity (high solubility) with respect to a predetermined solvent than the modeling material M and the three-dimensional structure ST.
  • the modeling material M and the three-dimensional structure ST have a characteristic that it is less likely to react with a predetermined solvent than the base material BM6 (particularly, it is difficult to react and dissolve).
  • the modeling material M and the three-dimensional structure ST may have a characteristic that they do not react with a predetermined solvent (in particular, they do not react and do not dissolve).
  • the base material BM6 has a characteristic of reacting with a predetermined solvent (particularly, reacting and dissolving).
  • the material constituting the base material BM6 having such characteristics is resin.
  • the material constituting the base material BM6 is acrylic resin, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) resin, polyamide (PA), polymethyl methacrylate (PMMA).
  • PPS polyphenylene sulfide
  • PBT polybutylene terephthalate
  • PA polyamide
  • PMMA polymethyl methacrylate
  • PS polystyrene
  • PS polypropylene
  • PC polycarbonate
  • ABS acrylonitrile butadiene styrene
  • an example of the predetermined solvent is an organic solvent that can dissolve these resins while not dissolving the modeling material M (or relatively difficult to dissolve).
  • the organic solvent examples include at least one of toluene, chloroform, acetone, methanol, and tetrahydrofuran.
  • the predetermined solvent may be, for example, a water-soluble inorganic acid.
  • An example of a water-soluble inorganic acid is nitric acid.
  • the material which comprises base material BM6 may contain other types of materials, such as a metal, in addition to or instead of resin.
  • the modeling material M is supplied to the base material BM6 (step S62 in FIG. 29). Specifically, as shown in FIG. 30, the modeling material M is supplied to the surface of the base material BM6 (specifically, the surface irradiated with the light EL and the surface on the + Z side). At this time, if necessary, the modeling system 1 (or an apparatus outside the modeling system 1 or a user of the modeling system 1) flattens the supplied modeling material M using a squeezing blade or the like. Also good.
  • the base material BM6a including the side wall member 1561 that can prevent the modeling material M from collapsing is used. Good.
  • the base material BM6a in which the concave portion 1562 surrounded by the side wall member 1561 is formed may be used.
  • the side wall member 1561 and the concave portion 1562 also contribute to forming a layer of the modeling material M having a certain thickness on the base material BM6a when the modeling material M is flattened using a squeezing blade or the like.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM6 using the layered modeling technique under the control of the control device 14 (from step S63 to step S64 in FIG. 29).
  • the operation of forming the three-dimensional structure ST in the sixth specific example is the same as the operation of forming the three-dimensional structure ST in the first specific example, and thus detailed description thereof is omitted.
  • the modeling material M melted on the base material BM6 is solidified in a state of being relatively firmly bonded to the base material BM6. Good. That is, the base material BM6 and the first structural layer SL (further, the three-dimensional structure ST) may be integrated.
  • the three-dimensional structure ST is separated from at least a part of the base material BM6 (Step S65 in FIG. 29).
  • the base material BM6 has a characteristic that it is easier to react to a predetermined solvent than the modeling material M and the three-dimensional structure ST. That is, the base material BM6 is easier to dissolve in a predetermined solvent than the three-dimensional structure ST. For this reason, the base material BM6 on which the three-dimensional structure ST is formed is immersed in a predetermined solvent, thereby dissolving the base material BM6 and separating the three-dimensional structure ST from at least a part of the base material BM6. It should be possible.
  • the modeling system 1 in order to separate the three-dimensional structure ST from at least a part of the base material BM6, the modeling system 1 (or an apparatus outside the modeling system 1 or a user of the modeling system 1) As shown in FIG. 32A, the base material BM6 on which the three-dimensional structure ST is formed is immersed in a predetermined solvent. As a result, as shown in FIG. 32B, the base material BM6 reacts with the solvent and dissolves. That is, the base material BM6 is dissolved by applying a chemical action via the solvent to the base material BM6. As the base material BM6 is dissolved, the bonding force between the base material BM6 and the three-dimensional structure ST is also weakened. Therefore, as shown in FIG.
  • the three-dimensional structure ST is relatively relative to at least a part of the base material BM6 (in the example shown in FIG. 32 (c), most or the whole of the base material BM6). It can be easily separated. That is, at least a part of the base material BM6 (in the example shown in FIG. 32 (c), most or all of the base material BM6) can be relatively easily removed from the three-dimensional structure ST.
  • the base material BM6 may be immersed in the solvent after a crack is formed in at least a part of the base material BM6.
  • the solvent easily penetrates into the base material BM6 through the crack, the reaction of the base material BM6 with respect to the solvent is promoted. For this reason, it becomes easy to separate the three-dimensional structure ST from at least a part of the base material BM6.
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM6. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM6 is positioned between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the modeling system 1 forms the three-dimensional structure ST by performing the same operation as the operation of forming the three-dimensional structure ST in the first specific example. That is, the modeling system 1 forms the first structural layer SL by using the first additive manufacturing method (for example, powder bed fusion bonding method), and then the second additive manufacturing method (for example, laser cladding). The second and subsequent structural layers SL are formed using a welding method.
  • the first additive manufacturing method for example, powder bed fusion bonding method
  • the second additive manufacturing method for example, laser cladding
  • the second and subsequent structural layers SL are formed using a welding method.
  • the modeling system 1 uses the second additive manufacturing method (for example, laser overlay welding).
  • the first structural layer SL and the second and subsequent structural layers SL may be formed using a method. This is because if the melting point of the base material BM6 is relatively high, even if the light EL is directly applied to the base material BM6, not much base material BM6 is melted. Furthermore, when the melting point of the base material BM6 is relatively high, even if the molten pool MP is formed in the base material BM6, the base material BM6 is excessively melted and there is a through hole extending from the upper surface to the lower surface of the base material BM6. This is because the possibility of being formed is relatively low.
  • the modeling system 1 forms the first structural layer SL using a first additive manufacturing method (for example, a powder bed melt bonding method), and then uses the first additive manufacturing method to form two layers.
  • the structure layers SL after the first may be formed.
  • the thickness of the base material BM is 3 in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM. A difference in characteristics that is different from the thickness of the dimensional structure ST is used.
  • the flow of the seventh specific example of the modeling operation will be described with reference to the flowchart of FIG.
  • the substrate 1571 is placed on the stage 13 (step S71 in FIG. 34).
  • the substrate 1571 has a characteristic that it is relatively hardly affected by heat (in other words, heat resistance is relatively high).
  • the substrate 1571 may be made of a material that is relatively less susceptible to heat (for example, at least one of copper and aluminum, or any other metal).
  • the substrate 1571 may have a structure (or shape) that is relatively less susceptible to heat. An example of such a structure is a honeycomb structure.
  • the “characteristic that is relatively less susceptible to heat” as used herein may mean a characteristic that is less susceptible to heat than a base material BM described later disposed on the substrate 1571. .
  • the “characteristic that is relatively less susceptible to the influence of heat” means that even if heat is transmitted to the substrate 1571 by the light EL irradiated to the base material BM described later, it is difficult to melt (or does not melt) by the heat. May mean the characteristic.
  • the base material BM (hereinafter, the base material BM used in the seventh specific example is appropriately referred to as “base material BM7”) is arranged on the stage 13 (step S72 in FIG. 34). Therefore, in the seventh specific example, as shown in FIG. 35, the base material BM7 is arranged on the stage 13 with the substrate 1571 sandwiched between the base material BM7.
  • the thickness of the base material BM7 (that is, the size in the Z-axis direction that is a direction intersecting the upper surface or the lower surface of the base material BM7) is different from the thickness of the three-dimensional structure ST formed by the modeling operation. Specifically, the thickness of the base material BM7 is thinner than the thickness of the three-dimensional structure ST. For example, the thickness of the base material BM7 may be thinner than the thickness of each structural layer SL constituting the three-dimensional structure ST.
  • the base material BM7 may be a so-called thin film member.
  • the modeling system 1 forms the three-dimensional structure ST on the base material BM7 using the layered modeling technique under the control of the control device 14 (step S73 in FIG. 34).
  • the modeling system 1 can irradiate the modeling material M supplied from the material nozzle 112 with the light EL to form a modeled object (further, the structural layer SL).
  • the three-dimensional structure ST is formed using an additive manufacturing method (for example, the laser overlay welding method described above). That is, the operation of forming the three-dimensional structure ST in the seventh specific example is the same as the operation of forming the three-dimensional structure ST in the second specific example. Therefore, detailed description thereof is omitted.
  • the modeling system 1 may form the three-dimensional structure ST using another additive manufacturing method.
  • the modeling system 1 can irradiate the modeling material M supplied in advance to the base material BM7 (or the modeling surface MS) with the light EL to form a modeled object (further, the structural layer SL).
  • a plurality of structural layers SL constituting the three-dimensional structure ST may be sequentially formed on the base material BM7 using the above-described first layered manufacturing method (for example, the above-described powder bed fusion method).
  • the base material BM7 is relatively thin, heat is likely to be locally applied to the base material BM7 by irradiation with light EL. For this reason, when the first structural layer SL is formed, there is a possibility that a through-hole extending from the upper surface to the lower surface of the base material BM7 may be formed by irradiation with the light EL. For this reason, the modeling system 1 may control the characteristics of the light EL so that a through hole from the upper surface to the lower surface of the base material BM7 is not formed.
  • the operation for controlling the characteristics of the light EL so that the through hole from the upper surface to the lower surface of the base material BM7 is not formed is the formation of the through hole from the upper surface to the lower surface of the base material BM5 described in the fifth specific example.
  • the operation may be the same as that for controlling the characteristics of the light EL. Therefore, detailed description thereof is omitted.
  • the modeling system 1 may cool the lower surface of the base material BM7 to prevent the formation of through holes from the upper surface to the lower surface of the base material BM7.
  • the three-dimensional structure ST is separated from at least a part of the base material BM7 (Step S74 in FIG. 34). Specifically, in the process of forming the above-described three-dimensional structure ST, a part of the base material BM7 is taken into the three-dimensional structure ST so as to constitute a part of the three-dimensional structure ST.
  • the other part of the base material BM7 is attached to the three-dimensional structure ST without being taken into the three-dimensional structure ST. That is, as shown in FIG. 36 (a), the other part of the base material BM7 not taken into the three-dimensional structure ST is attached to the three-dimensional structure ST so as to protrude from the three-dimensional structure ST.
  • the base material BM7 is relatively thin, the cutting ability of the base material BM7 (for example, an index indicating the ease of cutting) is higher than the cutting ability of the three-dimensional structure ST. That is, the base material BM7 is easier to cut than the three-dimensional structure ST. For this reason, the base material BM7 not taken into the three-dimensional structure ST can be cut (that is, excised) relatively easily using a cutting tool such as a cutter. For this reason, in the seventh specific example, in order to separate the three-dimensional structure ST from at least a part of the base material BM7, the modeling system 1 (or an apparatus outside the modeling system 1 or a user of the modeling system 1) The base material BM7 that is not taken into the three-dimensional structure ST is cut.
  • the modeling system 1 or the like may cut the base material BM7 that has not been taken into the three-dimensional structure ST by using a cutting tool such as a cutter, a nipper, or a cutting grindstone.
  • the modeling system 1 or the like has a base material BM7 (in particular, a boundary between the base material BM7 and the three-dimensional structure ST) in which an energy beam (for example, at least one of light and electromagnetic waves) is not taken into the three-dimensional structure ST. ),
  • the base material BM7 not taken into the three-dimensional structure ST may be cut.
  • the three-dimensional structure ST is relatively relative to at least a part of the base material BM7 (in the example shown in FIG.
  • the base material BM7 can be easily separated. That is, at least a part of the base material BM7 (in the example shown in FIG. 36B, most or all of the base material BM7) can be relatively easily removed from the three-dimensional structure ST.
  • the base material BM7 is disposed on the substrate 1571 after the substrate 1571 is disposed on the stage 13.
  • the substrate 1571 may not be disposed on the stage 13. That is, the base material BM7 may be disposed on the stage 13.
  • the lower surface of the three-dimensional structure ST (that is, the lower surface of the lowermost structural layer SL constituting the three-dimensional structure ST) is formed on the substrate 1571 that incorporates a part of the base material BM7 and / or has a honeycomb structure.
  • the modeling system 1 polishes the lower surface of the three-dimensional structure ST so that the lower surface of the three-dimensional structure ST is a flat surface. Also good.
  • the modeling system 1 or the like may polish the lower surface of the three-dimensional structure ST with a polishing member, or irradiate the lower surface of the three-dimensional structure ST with a laser beam or the like to lower the lower surface of the three-dimensional structure ST. You may grind
  • the three-dimensional structure ST may be regarded as being supported by the stage 13 via the base material BM7. Further, the three-dimensional structure ST may be regarded as not in contact with the stage 13. In addition, it may be considered that the base material BM7 is located between the entire three-dimensional structure ST and the stage 13, or the entire three-dimensional structure ST may be regarded as being away from the stage 13.
  • the modified modeling system 1 uses the difference in electrical characteristics between the base material BM and the three-dimensional structure ST in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM. May be.
  • the modeling system 1 applies an electric action to the base material BM (for example, a desired current is supplied to the base material BM and / or a desired voltage is applied).
  • the three-dimensional structure ST may be separated from at least a part of the base material BM by applying to the base material BM.
  • the modeling system 1 may use a difference in magnetic characteristics between the base material BM and the three-dimensional structure ST in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the modeling system 1 applies a magnetic action to the base material BM after the three-dimensional structure ST is formed (for example, the base material BM is disposed in a magnetic field having a desired magnetic field strength).
  • the three-dimensional structure ST may be separated from at least a part of the base material BM.
  • the modeling system 1 may use a difference in optical characteristics between the base material BM and the three-dimensional structure ST in order to form the three-dimensional structure ST that can be separated from at least a part of the base material BM.
  • the modeling system 1 applies an optical action to the base material BM (for example, irradiates the base material BM with desired light), thereby forming the base material.
  • the three-dimensional structure ST may be separated from at least a part of the BM.
  • the modeling system 1 uses the three-dimensional structure ST having different characteristics from the base material BM as the base material BM for the purpose of forming the three-dimensional structure ST separable from at least a part of the base material BM. Forming. However, the modeling system 1 may form the three-dimensional structure ST having different characteristics from the base material BM on the base material BM for other purposes.
  • the modeling system 1 includes the head drive system 12 that moves the modeling head 11.
  • the modeling system 1 may include a stage drive system that moves the stage 13 in addition to or instead of the head drive system 12.
  • the stage drive system may move the stage 13 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • the relative positional relationship between the stage 13 and the modeling head 11 that is, the modeling surface MS and the irradiation area EA. The relative positional relationship between the two is changed.
  • the modeling system 1 moves the irradiation area EA with respect to the modeling surface MS by moving the modeling head 11 using the head drive system 12.
  • the modeling system 1 may move the irradiation area EA with respect to the modeling surface MS by deflecting the light EL in addition to or instead of moving the modeling head 11.
  • the irradiation system 111 may include, for example, an optical system (for example, a galvanometer mirror) that can deflect the light EL.
  • the modeling system 1 melts the modeling material M by irradiating the modeling material M with the light EL.
  • the modeling system 1 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam.
  • the modeling system 1 may include a beam irradiation device that can irradiate an arbitrary energy beam in addition to or instead of the irradiation system 111.
  • Optional energy beams include, but are not limited to, charged particle beams such as electron beams, ion beams, or electromagnetic waves.
  • the modeling system 1 forms the three-dimensional structure ST by supplying the modeling material M from the material nozzle 112 toward the irradiation area EA where the irradiation system 111 irradiates the light EL.
  • the modeling system 1 may form the three-dimensional structure ST by supplying the modeling material M from the material nozzle 112 without irradiating the light EL from the irradiation system 111.
  • the modeling system 1 blows the modeling material M against the modeling surface MS from the material nozzle 112, thereby melting the modeling material M on the modeling surface MS and solidifying the molten modeling material M by 3
  • the dimensional structure ST may be formed.
  • the modeling system 1 melts the modeling material M on the modeling surface MS and solidifies the melted modeling material M by spraying a gas containing the modeling material M on the modeling surface MS from the material nozzle 112 at an ultra high speed.
  • the three-dimensional structure ST may be formed.
  • the modeling system 1 blows the heated modeling material M from the material nozzle 112 to the modeling surface MS, thereby melting the modeling material M on the modeling surface MS and solidifying the molten modeling material M.
  • a three-dimensional structure ST may be formed.
  • the modeling system 1 when forming the three-dimensional structure ST without irradiating the light EL from the irradiation system 111, the modeling system 1 (particularly, the modeling head 11) may not include the irradiation system 111.
  • the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification, and a modeling system with such changes, A modeling method, a material holding device, a base material, a computer program, a recording medium, and a control device are also included in the technical scope of the present invention.

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Abstract

La présente invention concerne un système de moulage comprenant : un dispositif de support qui supporte un substrat ayant des premières caractéristiques ; un dispositif de rayonnement qui expose le substrat au rayonnement d'un faisceau d'énergie ; et un dispositif d'alimentation qui amène un matériau de moulage à un emplacement de rayonnement du faisceau d'énergie, au moins une partie du matériau de moulage étant amenée à fondre au niveau de l'emplacement de rayonnement, puis le matériau de moulage fondu est solidifié, et un objet moulé ayant des secondes caractéristiques qui sont différentes des premières caractéristiques est formé sur le substrat à partir du matériau de moulage solidifié.
PCT/JP2019/002948 2018-01-31 2019-01-29 Système de moulage, procédé de moulage, dispositif de retenue de matériau, substrat, programme informatique, support d'enregistrement et dispositif de commande WO2019151237A1 (fr)

Applications Claiming Priority (2)

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JPPCT/JP2018/003187 2018-01-31
PCT/JP2018/003187 WO2019150479A1 (fr) 2018-01-31 2018-01-31 Système de mise en forme, procédé de mise en forme, dispositif de retenue de matériau et matériau de base

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WO2019151237A1 true WO2019151237A1 (fr) 2019-08-08

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08318573A (ja) * 1995-05-25 1996-12-03 Roland D G Kk 三次元造形方法およびそれに用いる装置
JP2001347572A (ja) * 2000-06-06 2001-12-18 Sanyo Electric Co Ltd 光造形装置
WO2015141032A1 (fr) * 2014-03-18 2015-09-24 株式会社 東芝 Dispositif de fabrication additive par couches et procédé pour la fabrication d'article formé par fabrication additive par couches

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061062B2 (ja) * 2008-08-08 2012-10-31 パナソニック株式会社 三次元形状造形物の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08318573A (ja) * 1995-05-25 1996-12-03 Roland D G Kk 三次元造形方法およびそれに用いる装置
JP2001347572A (ja) * 2000-06-06 2001-12-18 Sanyo Electric Co Ltd 光造形装置
WO2015141032A1 (fr) * 2014-03-18 2015-09-24 株式会社 東芝 Dispositif de fabrication additive par couches et procédé pour la fabrication d'article formé par fabrication additive par couches

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