WO2019150863A1 - Wiring substrate - Google Patents

Abstract

A wiring substrate 1 is provided with a support 10 and an electrical conductor 40 supported on the support 10. The support 10 comprises: a woven fabric 20 woven using weaving yarns 21, 22 each configured by bundling insulating fibers 211, 221 together; and a support insulating layer 30 disposed over a region in a part of an upper surface 201 of the woven fabric 20. The electrical conductor 40 includes a first electrically conductive path 41 disposed on an upper surface 201 of the woven fabric 20, and a second electrically conductive path 42 which is disposed on the support insulating layer 30 and connected to the first electrically conductive path 41. The first electrically conductive path 41 includes a first conductor part 411 disposed in a basket hole 23 of the woven fabric 20.

Description

Wiring board

The present invention relates to a wiring board.
For the designated countries where incorporation by reference is permitted, the contents described in Japanese Patent Application No. 2018-016927 filed in Japan on February 2, 2018 are incorporated herein by reference. As part of

Flexible printed circuit board (FPC) formed by etching or plating on a film to form a circuit layer as a flexible wiring board, or membrane wiring formed by printing a silver paste on a film to form a circuit layer A plate is known (see, for example, Patent Document 1 (paragraph [0002])). As a usage application of such a wiring board, for example, a wearable application in a broad sense such as a seating sensor provided in a seat of an automobile is known (for example, see Patent Document 2 (paragraph [0002])).

JP 2011-014742 A Japanese Patent Laying-Open No. 2015-046226

The above-mentioned FPC and membrane wiring board are excellent in followability to a bent shape centered on one axis such as a U shape. However, there is a problem that the followability is remarkably lowered due to the tension of the film with respect to the deformation of the three-dimensional shape such as the sphere surface. For example, in a seating sensor arranged in a gap between a car skin and a cushion foam, an uncomfortable feeling may be given to an occupant due to unnatural rigidity or abnormal noise.

The problem to be solved by the present invention is to provide a wiring board excellent in followability to three-dimensional deformation.

[1] A wiring board according to the present invention includes a support and a conductor supported by the support, and the support is woven using woven yarns each formed by bundling insulating fibers. At least one woven fabric formed on the first main surface of the woven fabric, and the conductor includes a first insulating layer provided on the first main surface of the woven fabric. A first conductive path provided on a main surface; and a second conductive path provided on the first insulating layer and connected to the first conductive path. One conductive path is a wiring board having a first conductor portion present in the basket hole of the woven fabric.

[2] In the above invention, the conductor includes a third conductive path provided on a second main surface of the woven fabric, and the third conductive path exists in a basket hole of the woven fabric. At least a portion of the first conductor portion and at least a portion of the second conductor portion are joined to each other, and the first conductive path The third conductive path may be electrically connected via the first conductor portion and the second conductor portion.

[3] In the above invention, the woven yarn is composed of a warp extending in a first direction and a woven yarn of the same type or different from the warp in a second direction intersecting the first direction. And extending weft yarns.

[4] In the above invention, the composition of the material constituting the first conductive path is the same as the composition of the material constituting the second conductive path, and the first conductive path and the second conductive path are the same. The conductive path may be integrally formed.

[5] In the above invention, the composition of the material constituting the first conductive path is different from the composition of the material constituting the second conductive path, and a part of the first conductive path is It may overlap with a part of the second conductive path.

[6] In the above invention, the wiring board may include an adhesive layer or an adhesive layer that adheres or adheres the first insulating layer to the first main surface of the woven fabric.

[7] In the above invention, the wiring board may further include a second insulating layer that covers the conductor and the support and is also present in the woven fabric.

[8] In the above invention, the second insulating layer may have a window portion exposing a part of the conductor to the outside.

[9] In the above invention, the first insulating layer has at least one through hole, and the first conductive path corresponds to the through hole. A portion provided on the main surface of the main body may be included.

[10] In the above invention, the third conductive path may also include a portion provided on the second main surface of the woven fabric so as to correspond to the through hole.

[11] In the above invention, the first conductive path includes a first intervening portion existing in a gap between the insulating fibers of the woven fabric, and the third conductive path includes the woven fabric. A second intervening portion existing in a gap between the insulating fibers may be included.

[12] In the above invention, the insulating fiber may include at least one of glass fiber and resin fiber.

[13] In the above invention, the woven yarn may be configured by bundling single or plural kinds of insulating fibers.

[14] In the above invention, the support includes a plurality of woven fabrics stacked on each other, and the plurality of woven fabrics are composed of the same type of woven fabric or a plurality of types of woven fabric. May be.

[15] In the above invention, the conductor may contain a single kind or a plurality of kinds of metals.

[16] In the above invention, at least one of the first to third conductive paths may include a plurality of conductive layers stacked on each other.

[17] In the above invention, the plurality of conductive layers may include at least one plating layer.

According to the present invention, the support includes at least one woven fabric, and the first conductive portion provided on the first main surface of the woven fabric has the first conductor portion in the basket hole. have. For this reason, while maintaining the adhesion between the support and the conductor by the first conductor portion, the portion of the support where the first conductive path and the first insulating layer are not present is used. Therefore, excellent followability to three-dimensional deformation can be ensured.

According to the present invention, the first insulating layer is provided in a partial region of the first main surface of the woven fabric, and the second conductive path is provided on the first insulating layer. Yes. Since the unevenness of the woven fabric is smoothed by the first insulating layer, the pattern shape and thickness of the second conductive path can be made uniform, and the second conductive path can be formed with high accuracy. Can do.

FIG. 1 is a perspective view showing a wiring board according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is an enlarged view of a portion III in FIG. FIG. 4 is a plan view of a woven fabric used for the wiring board shown in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG. 7 is a cross-sectional view showing a modification of the woven fabric according to the first embodiment of the present invention. FIG. 8 is a cross-sectional view showing a modification of the conductor in the first embodiment of the present invention. FIG. 9 is a perspective view showing a wiring board according to the second embodiment of the present invention. FIG. 10 is a cross-sectional view taken along line XX in FIG. FIG. 11 is a perspective view showing a wiring board according to the third embodiment of the present invention. 12 is a cross-sectional view taken along line XII-XII in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
1 is a perspective view showing a wiring board according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, FIG. 3 is an enlarged view of section III in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4, and FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.

Note that FIG. 3 is not a strict enlarged view of part III in FIG. 2, but an understanding of the structure of the first and second conductor portions 411, 431 (described later) of the first and third conductive paths 41, 43. For ease of illustration, a cross-sectional view of the cut surface of FIG.

As shown in FIGS. 1 to 3, the wiring board 1 according to the first embodiment of the present invention covers the support 10, the conductor 40 supported by the support 10, and the support 10 and the conductor 40. And a covering insulating layer 50. The support 10 in the present embodiment corresponds to an example of the support in the present invention, the conductor 40 in the present embodiment corresponds to an example of the conductor in the present invention, and the covering insulating layer 50 in the present embodiment corresponds to the present invention. This corresponds to an example of a second insulating layer.

Examples of the usage of the wiring board 1 include applications that require a specific texture, complicated or precise three-dimensional shape, and specific examples include circuits installed on the steering wheel of a vehicle or leather of a seat, A circuit provided in a mirror or a bumper of a vehicle can be exemplified. The usage application of the wiring board according to the present invention is not particularly limited to the above. For example, the wiring board 1 may be used for a so-called wearable application such as a biological information sensor provided on a wearing item such as clothes or a hat, or various detection sensors provided on a medical care bedding. Or you may use the wiring board 1 as an inner layer of a multilayer printed wiring board. Depending on the intended use of the wiring board 1, the wiring board 1 may not include the coating insulating layer 50.

As shown in FIGS. 1 and 2, the support 10 includes a single woven fabric 20 and a support insulating layer 30 provided on a partial region of the upper surface 201 of the woven fabric 20. . The woven fabric 20 in the present embodiment corresponds to an example of the woven fabric in the present invention, and the support insulating layer 30 in the present embodiment corresponds to an example of the first insulating layer in the present invention.

As shown in FIGS. 4 to 6, the woven fabric 20 is woven by weaving the woven yarns 21 and 22 in a plain weave, and has flexibility. The woven yarn constituting the woven fabric 20 includes a warp yarn 21 extending in the longitudinal direction and a weft yarn 22 extending in a direction substantially orthogonal to the warp yarn 21 (that is, the lateral direction).

As described above, the woven fabric 20 is formed by weaving the woven yarns 21 and 22 in a lattice shape, and thus has a plurality of basket holes 23. The basket hole 23 is a gap (mesh) surrounded by the warp yarn 21 and the weft yarn 22, and penetrates the woven fabric 20 in the thickness direction of the woven fabric 20. The plurality of basket holes 23 have substantially the same shape and substantially the same opening area, and are regularly and uniformly arranged on the woven fabric 20 in plan view.

Note that the shape, opening area, arrangement interval, etc. of the basket hole 23 are the diameters of the insulating fibers 211 and 221, the number of insulating fibers 211 and 221 constituting the woven yarns 21 and 22, and the woven yarns 21 and 22. Although it depends on the density of the insulating fibers 211 and 221 and the weave of the woven fabric 20, it can be determined based on the mechanical characteristics and electrical characteristics required for the wiring board 1.

The warp yarns 21 are each formed by bundling about 10 to 200 insulating fibers 211 having substantially the same diameter, and a gap is formed between the insulating fibers 211 adjacent to each other. . Similarly, the wefts 22 are each formed by bundling about 10 to 200 insulating fibers 221 having substantially the same diameter, and a gap is formed between the adjacent insulating fibers 221. Has been. Insulating fibers 211 and 221 in the present embodiment are both made of glass fibers and have substantially the same diameter of about 1 to 20 μm.

Although not particularly limited, the following configuration can be exemplified as a specific example of the woven fabric 20. That is, the insulating fibers 211 of the warps 21 are made of glass fibers having a diameter of about 7 μm, and each warp 21 is made of a bundle of about 200 insulating fibers 211. The insulating fibers 221 of the wefts 22 are also composed of glass fibers having a diameter of about 7 μm, and each weft 22 is configured by bundling about 200 insulating fibers 221. By weaving these woven yarns 21 and 22, a woven fabric (glass cloth) 20 having a thickness of about 0.1 mm is woven. In this woven fabric 20, the woven yarns 21, 22 are woven in a plain weave so that the density of the warp yarns 21 is about 60 per 25 mm in the horizontal direction and the density of the weft yarns 22 is about 60 per 25 mm in the horizontal direction. In the woven fabric 20 having such specifications, a large number of basket holes 23 having a rectangular opening shape of about 20 μm × 20 μm are present at a pitch of about 0.3 mm.

The insulating fibers 211 and 221 are not particularly limited to the above glass fibers as long as they have electrical insulating properties, heat resistance, and flexibility. For example, the insulating fibers 211 and 221 may be made of resin fibers such as nylon fibers, rayon fibers, polyester fibers, polyamide fibers, vinyl fibers, and aramid fibers. Further, in order to improve performance such as adhesion strength with the conductor 40, strength of the support 10 and affinity with conductive ink (described later) forming the conductor 40, the surface of the insulating fibers 211 and 221 is improved. Chemical treatment or physical treatment may be performed.

Further, each warp 21 may be composed of the same type of insulating fiber, or may be composed of a plurality of types of insulating fiber. Similarly, each weft 22 may be made of the same type of insulating fiber, or may be made of a plurality of types of insulating fiber. For example, although not particularly illustrated, one woven yarn may be formed using both glass fibers and resin fibers. Here, as an element which makes the kind of insulating fiber different, the material which comprises an insulating fiber, the diameter of an insulating fiber, etc. can be illustrated, for example.

Further, the warp 21 and the weft 22 may be composed of the same type of woven yarn, or may be composed of mutually different types of woven yarn. Here, as the elements that make the type of the weaving yarn different, for example, the material of the insulating fiber, the diameter of the insulating fiber, the number of the insulating fibers constituting the weaving yarn, the density of the insulating fiber constituting the weaving yarn, etc. Can be illustrated.

Further, the weaving method of the woven fabric is not particularly limited to the above-described plain weaving as long as it is woven by regularly weaving the woven yarn. For example, a woven fabric woven by twill weaving or satin weaving may be used as the support 10.

Further, the crossing angle between the warp 21 and the weft 22 is not particularly limited to the right angle. The warp yarn 21 and the weft yarn 22 need only intersect with each other, and the intersection angle of the warp yarn 21 and the weft yarn 22 can be set arbitrarily.

Further, the number of woven fabrics that the support 10 has is not particularly limited, and the support may have a plurality of woven fabrics. FIG. 7 is a cross-sectional view showing a modification of the woven fabric according to the first embodiment of the present invention.

For example, as shown in FIG. 7, the support 10b may be configured by stacking two woven fabrics 20 stacked on each other. In FIG. 7, the supporting insulating layer 30 is not shown. After a pressure-sensitive adhesive material (or adhesive) having electrical insulation properties is uniformly and partially applied to the surface of one woven fabric 20, the other woven fabric 20 is stacked on the woven fabric 20 to form the support 10b. can do. In addition, the some woven fabric 20 may be comprised with the same kind of woven fabric, or may be comprised with the multiple types of woven fabric. Here, the elements that make the type of the woven fabric different include, for example, the material constituting the insulating fiber, the diameter of the insulating fiber, the number of insulating fibers constituting the woven yarn, and the insulating fiber constituting the woven yarn. The density, the weaving method of the woven fabric, the thickness of the woven fabric, etc. can be exemplified.

As shown in FIGS. 1 and 2, the support insulating layer 30 is directly provided on the upper surface 201 of the woven fabric 20, and in this embodiment, a second conductive path 42 (described later) of the conductor 40 is formed. Is provided in the planned area. The upper surface 301 of the support insulating layer 30 is flatter than the upper surface 201 of the woven fabric 20, and the unevenness of the upper surface 201 of the woven fabric 20 is smoothed by the support insulating layer 30. For this reason, in this embodiment, the pattern shape and thickness of the 2nd conductive path 42 can be equalize | homogenized, and the 2nd conductive path 42 can be formed with high precision.

The support insulating layer 30 is made of, for example, a resin material such as an epoxy acrylate resin or a novolac type phenol resin, and has an electrical insulating property. The insulating support layer 30 is formed in advance on the upper surface 201 of the woven fabric 20 before the conductor 40 is formed. For example, the support insulating layer 30 is formed by applying a liquid resin to the upper surface 201 of the woven fabric 20 and then performing a curing process. Has been. The insulating support layer 30 closes the basket hole 23 of the woven fabric 20 from the upper surface 201 side. For this reason, when the conductor 40 is formed, the conductive ink is prevented from penetrating into the lower surface 202 of the woven fabric 20 in the second conductive path 42.

The method for applying the liquid resin is not particularly limited, and either a contact coating method or a non-contact coating method may be used. Specific examples of the contact coating method include screen printing, gravure printing, offset printing, gravure offset printing, flexographic printing, and the like. On the other hand, specific examples of the non-contact coating method include inkjet printing, spray coating method, dispense coating method, jet dispensing method and the like. Moreover, the effect method of the liquid resin is not particularly limited, and examples thereof include heat treatment and ultraviolet irradiation treatment.

Note that the support insulating layer 30 may be formed of a plurality of layers. Although not particularly illustrated, the insulating support layer 30 may be formed by attaching an electrically insulating film to the upper surface 201 of the woven fabric 20 via an adhesive layer (or adhesive layer) (FIG. 10). reference). Furthermore, the support insulating layer 30 may be provided in a region where the formation of the conductive path is not planned. Thereby, the rigidity of a wiring board can be partially reinforced, for example, the deformation | transformation of the said wiring board 1 at the time of mounting an electronic component in the wiring board 1 can be suppressed.

The conductor 40 includes a first conductive path 41, a second conductive path 42, and a third conductive path 43 as shown in FIGS. 1 to 3. The first conductive path 41 is provided on the upper surface 201 of the woven fabric 20 and forms a pair of land portions 401 and 402. The second conductive path 42 is provided on the upper surface 301 of the support insulating layer 30 and forms a wiring portion 406. The third conductive path 43 is provided on the lower surface 202 of the woven fabric 20 and forms a pair of land portions 403 and 404. In the present embodiment, no wiring part is provided on the lower surface of the support 10.

On the upper surface 201 of the woven fabric 20, the pair of land portions 401 and 402 are provided at both ends of the wiring portion 406 and are connected to each other via the wiring portion 406. The land portions 403 and 404 on the lower surface 202 of the woven fabric 20 are provided so as to correspond to the land portions 401 and 402 on the upper surface 201, and the conductor portions 411 and 431 of the first and third conductive paths 41 and 43. The land portions 401 and 402 on the upper surface 201 and the land portions 403 and 404 on the lower surface 202 are electrically connected via (described later).

Note that the shape of the conductor 40 is not particularly limited to the above. For example, in addition to the wiring portion 406 formed by the second conductive path 42, other wiring portions may be formed by the first or third conductive paths 41 and 43 for portions that do not require high accuracy. .

The conductor 40 is made of, for example, conductive metal particles mainly composed of copper (Cu) or silver (Ag) and a binder resin, and has conductivity. In the present embodiment, the first to third conductive paths 41 to 43 are made of a material having the same composition. The conductor 40 may contain a plurality of types of conductive metal particles. The conductor 40 is formed by heating and baking the conductive ink applied to the support 10.

The conductive ink for forming the conductor 40 is a solution containing conductive metal particles and a binder resin that uniformly disperses the conductive metal particles. Specific examples of the conductive metal particles include conductive metal particles mainly composed of copper (Cu) or silver (Ag). Examples of the binder resin include one or a mixture of two or more thermosetting resins such as polyhydric phenol compounds, phenol resins, alkyd resins, unsaturated polyester resins, and epoxy resins. At this time, an appropriate amount of an aqueous solvent or an alcohol such as ethanol, methanol or 2-propanol, or an organic solvent such as isophorone, terpineol, triethylene glycol monobutyl ether or butyl cellosolve acetate is added to the binder resin as a dispersion medium. In addition, the compounding quantity of this solvent is suitably adjusted according to the size, shape, film forming conditions, etc. of electroconductive metal particle.

The method for applying the conductive ink to the support 10 is not particularly limited, and either a contact application method or a non-contact application method may be used. Specific examples of the contact coating method include screen printing, gravure printing, offset printing, gravure offset printing, flexographic printing, and the like. On the other hand, specific examples of the non-contact coating method include inkjet printing, spray coating method, dispense coating method, jet dispensing method and the like.

Note that the number of times of applying the conductive ink to the support 10 is not particularly limited to one, and the conductive ink may be applied to one main surface of the support 10 a plurality of times. Moreover, you may vary the component of a conductive ink for every application | coating of each time. Further, all the conductive paths (for example, the first and second conductive paths 41 and 42) provided on the same surface (for example, the upper surface 201) of the support 10 may be formed in the same process, or separate processes. May be formed.

The heat source for curing the conductive ink is not particularly limited, and examples thereof include an electric heating oven, an infrared oven, a far infrared furnace (IR), a near infrared furnace (NIR), and a laser irradiation device. A heat treatment combining these may also be used. As a specific example, when a far-infrared furnace is used, heat treatment is performed at about 150 ° C. for about 10 minutes.

Since the conductive ink applied to the upper surface 201 of the woven fabric 20 penetrates (infiltrates) into the woven fabric 20, the first conductive path 41 has a first conductor portion 411 and a first conductive portion 411 as shown in FIG. 1 intervening portion 412. The first conductor portion 411 and the first interposed portion 412 are formed integrally with the first conductive path 41. The first conductor portion 411 is present in the basket hole 23 of the woven fabric 20 (that is, the gap between the woven yarns 211 and 212). On the other hand, the first intervening portion 412 enters the gap formed between the insulating fibers 211 and 221 and exists in the gap.

On the other hand, the conductive ink applied to the upper surface 301 of the support insulating layer 30 does not penetrate into the support insulating layer 30. Therefore, the second conductive path 42 does not have a conductor portion or an interposed portion. As shown in FIG. 2, the end of the second conductive path 42 is connected to the end of the first conductive path 41, and the second conductive path 42 is integrated with the first conductive path 41. Since it is formed, the first conductive path 41 and the second conductive path 42 are electrically connected. As described above, since the second conductive path 42 is formed on the upper surface 301 of the flat support insulating layer 30, it is formed with high accuracy.

Since the conductive ink applied to the lower surface 202 of the woven fabric 20 penetrates into the woven fabric 20, as shown in FIG. 3, the third conductive path 43 is similar to the first conductive path 41. Two conductor portions 431 and a second intervening portion 432. The second conductor portion 431 and the second interposed portion 432 are formed integrally with the third conductive path 43. The second conductor portion 431 is present in the basket hole 23 of the woven fabric 20 (that is, the gap between the woven yarns 211 and 212). On the other hand, the second interposition part 432 enters the gap formed between the insulating fibers 211 and 212 and exists in the gap.

Further, in the present embodiment, the first conductor portion 411 and the second conductor portion 431 are joined to each other. Therefore, the first conductive path 41 and the third conductive path 43 are electrically connected to each other via the first and second conductor portions 411 and 431. That is, the first and second conductor portions 411 and 431 function as an interlayer connection between the first conductive path 41 and the third conductive path 43.

As shown in FIG. 8, the first conductive path 41b may be composed of a plurality of conductive layers 413 and 414. Similarly, as shown in FIG. 8, the third conductive path 43 b may be composed of a plurality of conductive layers 433 and 434. FIG. 8 is a sectional view showing a modification of the wiring board according to the first embodiment of the present invention.

The additional conductive layers 414 and 434 are formed by applying conductive ink to the support 10 a plurality of times. Alternatively, the additional conductive layers 414 and 434 may be formed by electrolytic plating or electroless plating. Note that the number of the additional conductive layers 414 and 434 is not particularly limited, and a plurality of conductive layers 414 and 434 may be formed.

By forming the additional conductive layers 414 and 434 by plating, the thickness of the first and third conductive paths 41b and 43b can be increased, and the first and third conductive paths 41b, It is also possible to improve the surface smoothness of 43b (such as surface irregularities and complementation of minute cracks).

The covering insulating layer 50 is made of, for example, a resin material, and has electrical characteristics such as electrical insulation, and mechanical characteristics such as flexibility and rigidity. The covering insulating layer 50 is formed by covering the entire support 10 with a liquid resin and allowing the liquid resin to permeate (infiltrate) the woven fabric 20 and cure. Therefore, as shown in FIGS. 1 to 3, the covering insulating layer 50 covers the conductor 40 and the support 10 and is also present in the woven fabric 20. In this embodiment, the coating insulating layer 50 ensures the mechanical strength of the wiring board 1, protection of the conductor 40, electrical insulation of the conductor 40, and electrical characteristics (dielectric constant, etc.) of the conductor 40. In addition to the above, the wiring board 1 can be provided with the above-mentioned specific texture, arbitrary color, arbitrary flexibility, and the like.

First and second window portions 51 and 52 are formed on the upper surface of the covering insulating layer 50, and third and fourth window portions 53 and 54 are formed on the lower surface of the covering insulating layer 50. . The first and second window portions 51 and 52 expose the land portions 401 and 402 of the first conductive path 41 upward, respectively. On the other hand, the third and fourth window portions 53 and 54 expose the land portions 403 and 404 of the third conductive path 43 downward, respectively. For this reason, it can be electrically connected to the conductor 40 of the wiring board 1 from both the upper and lower sides.

Although not particularly limited, specific examples of the liquid resin include polymer emulsions in which a copolymer is dispersed in water. Specific examples of the copolymer include acrylic acid esters and methacrylic compounds as main components. Examples include those obtained by copolymerizing an acid ester and an appropriate amount of styrene or acrylonitrile for imparting necessary characteristics. Moreover, as a method of apply | coating liquid resin, the above-mentioned contact application method or non-contact application method can be illustrated. The coating insulating layer 50 is formed by performing a curing process on the liquid resin covering the surfaces of the conductor 40 and the support 10 and impregnated in the woven fabric 20 by a heating process, an ultraviolet irradiation process, or the like. In the curing process, additional processes such as pressurization and decompression may be performed simultaneously.

It should be noted that the insulating coating layer 50 may be formed by an injection molding method using a molding die by using a powder molding resin such as silicon rubber instead of the liquid resin. Alternatively, the covering insulating layer 50 may be formed by applying pressure and heat treatment after a curable resin sheet having an opening corresponding to the window portion is stacked on the support 10.

As described above, in the present embodiment, the support 10 includes the woven fabric 20. Therefore, in the portion of the support 10 where the first and third conductive paths 41 and 43 and the support insulating layer 30 are not present, excellent followability to three-dimensional deformation is ensured by the flexibility of the woven fabric 20. be able to.

On the other hand, in the present embodiment, the first conductor portion 411 of the first conductive path 41 is present in the basket hole 23 of the woven fabric 20 and the first interposed portion of the first conductive path 41 is present. 412 exists in the gap between the insulating fibers 211 and 221. As described above, in the present embodiment, the first conductor portion 411 and the first interposition portion 412 bite into the woven fabric 20, and due to the anchor effect, the adhesion strength (bonding) between the support 10 and the first conductive path 41 is obtained. Strength and peel strength) are improved. For this reason, even if the electronic component is mounted on the wiring board 1, it is possible to suppress the occurrence of the phenomenon that the first conductive path 41 is peeled off from the support 10.

Similarly, in the present embodiment, the second conductor portion 431 of the third conductive path 43 exists in the basket hole 23 of the woven fabric 20, and the second interposed portion 432 of the third conductive path 43. Exists in the gap between the insulating fibers 211 and 221. As described above, in the present embodiment, the second conductor portion 431 and the second interposed portion 432 bite into the woven fabric 20, and due to the anchor effect, the adhesion strength (bonding) between the support 10 and the third conductive path 43. Strength and peel strength) are improved. For this reason, even if an electronic component is mounted on the wiring board 1, the occurrence of the phenomenon that the third conductive path 43 is peeled off from the support 10 can be suppressed.

Furthermore, in this embodiment, the support insulating layer 30 is provided in a partial region of the upper surface 201 of the woven fabric 20, and the second conductive path 42 is provided on the support insulating layer 30. Since the unevenness of the woven fabric 20 is smoothed by the support insulating layer 30, the pattern shape and thickness of the second conductive path 42 can be made uniform, and the second conductive path 42 can be formed with high accuracy. can do.

Here, for example, in a conventional flexible printed wiring board (FPC), since a conductor is formed on a substrate, a material (polyimide or the like) constituting the substrate cannot be arbitrarily changed.

On the other hand, in this embodiment, since the covering insulating layer 50 is formed after the conductor 40 is formed on the support 10, the resin material constituting the covering insulating layer 50 is arbitrarily selected according to the use application of the wiring board 1. Can be selected. For this reason, the above-mentioned peculiar texture can be given to wiring board 1, arbitrary colors can be given to wiring board 1, and flexibility superior to conventional FPC can be given to wiring board 1.

Furthermore, in this embodiment, the support 10 on which the conductor 40 is formed is deformed into a desired shape, and the support 10 is impregnated with a resin material and cured to form the covering insulating layer 50. Can do. For this reason, in this embodiment, the wiring board 1 can be used for an application that requires a complicated or precise three-dimensional shape.

<< Second Embodiment >>
FIG. 9 is a perspective view showing a wiring board according to the second embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the line XX of FIG. In this embodiment, although the structure of the support body 10B and the conductor 40B is different from 1st Embodiment, the structure of other than that is the same as that of 1st Embodiment. In the following, only the differences from the first embodiment of the wiring board 1B in the second embodiment will be described, and the same reference numerals will be given to portions having the same configuration as in the first embodiment, and the description thereof will be omitted.

In this embodiment, as shown in FIGS. 9 and 10, a child substrate 70 having a support insulating layer 30 </ b> B and a second conductive path 42 </ b> B is prepared in advance, and this is interposed via an adhesive layer (or adhesive layer) 60. After the sub board 70 is attached to the woven fabric 20, the first and third conductive paths 41 and 43 are formed, whereby the support 10B and the conductor 40B are formed. For this reason, the sub board | substrate 70 is comprised from well-known printed wiring boards, such as FPC. That is, for example, the support insulating layer 30B is made of a film made of polyimide or the like, and the second conductive path 42B is formed by patterning a metal foil such as a copper foil provided on the film. Is formed.

Moreover, in this embodiment, since the support body 10B and the conductor 40B are formed using the sub board | substrate 70 as mentioned above, the composition of the material which comprises the 2nd conductive path 42B is the 1st and 3rd electroconductivity. The composition of the material constituting the paths 41 and 43 is different. For this reason, as shown in FIG. 10, a part of the first conductive path 41 overlaps a part of the second conductive path 42B, and the first conductive path 41 and the second conductive path 42 are electrically connected. It is connected to the.

In the present embodiment, as in the first embodiment, the support 10 </ b> B includes the woven fabric 20, and the first conductive path 41 provided on the upper surface 201 of the woven fabric 20 exists in the basket hole 23. The first conductor portion 411 is provided. For this reason, while maintaining the adhesion between the support 10B and the conductor 40B by the first conductor portion 411, the portion of the support 10B where the first conductive path 41 and the support insulating layer 30B are not present is woven. The followability to the three-dimensional deformation excellent by the flexibility of the cloth 20 can be ensured.

In addition to this, in the present embodiment, the first and third conductive paths 41 and 43 are formed after the child substrate 70 prepared in advance is attached to the woven fabric 20, whereby the support 10 </ b> B and the conductive body 10 </ b> B are electrically connected. Form body 40B. For this reason, it is possible to form the second conductive path 42B by patterning the metal foil, so that it is possible to form a precise and fine wiring that is difficult to realize by the printing method.

Also, since the conductive path formed by the printing method contains a binder component, it is not possible to connect electronic components by soldering. On the other hand, in the present embodiment, as described above, the second conductive path 42B can be formed by patterning the metal foil, so that the electronic components can be connected by soldering.

«Third embodiment»
FIG. 11 is a perspective view showing a wiring board according to the third embodiment of the present invention, and FIG. 12 is a sectional view taken along line XII-XII in FIG. In FIGS. 11 and 12, the covering insulating layer 50 is not shown in order to make the conductor 40C easy to see.

In this embodiment, the configurations of the support 10C and the conductor 40C are different from those of the second embodiment, but the other configurations are the same as those of the first embodiment. Only the differences from the first embodiment will be described below with respect to the wiring board 1 </ b> C in the third embodiment, and portions having the same configurations as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

The support insulating layer 30C of this embodiment is different in that it has a pair of through holes 302 and 303. The woven fabric 20 is exposed from the through holes 302 and 303. In the present embodiment, the first conductive path 41 is formed on the upper surface 201 of the woven fabric 20 through these through holes 302 and 303.

The conductor 40C of the present embodiment includes a first conductive path 41, a second conductive path 42C, and a third conductive path 43, as shown in FIGS. The first conductive path 41 is provided on the upper surface 201 of the woven fabric 20 and forms a pair of land portions 401 and 402. The second conductive path 42C is provided on the upper surface 301 of the support insulating layer 30C, and forms a land portion 405 and a wiring portion 406. The third conductive path 43 is provided on the lower surface 202 of the woven fabric 20 and forms a pair of land portions 403 and 404 and a wiring portion 407.

In the present embodiment, the land portion 401 is provided on the upper surface 201 of the woven fabric 20 through the through hole 302 of the support insulating layer 30C. The land portion 403 is provided on the lower surface 202 of the woven fabric 20 so as to correspond to the through hole 302, and the land portions 401 and 403 are electrically connected to each other via the first and second conductor portions 411 and 431. Connected. The land portions 403 and 404 are electrically connected via a wiring portion 407 provided on the lower surface 202 of the woven fabric 20. The land portion 402 is provided on the upper surface 201 of the woven fabric 20 through the through hole 303 of the support insulating layer 30C. The land portion 404 is provided on the lower surface 202 of the woven fabric 20 so as to correspond to the through hole 303, and the land portions 402 and 404 are electrically connected to each other via the first and second conductor portions 411 and 431. Connected. The wiring part 406 has a planar coil shape with the center closed, and includes a land part 405 provided outside the wiring part 406 and a land part 402 provided inside the wiring part 406. Electrically connected. The land portion 405 is provided on the upper surface 301 of the support insulating layer 30C.

Note that the shape of the conductor 40C is not particularly limited to the above. For example, in addition to the wiring portion 406 formed by the second conductive path 42C, other wiring portions may be formed by the first or third conductive paths 41 and 43 for portions where high accuracy is not required. .

In the present embodiment, as in the second embodiment described above, as shown in FIGS. 11 and 12, a child substrate 70C having a support insulating layer 30C and a second conductive path 42C is prepared in advance, and an adhesive layer is prepared. After the child substrate 70C is affixed to the woven fabric 20 via the (or adhesive layer) 60, the first and third conductive paths 41 and 43 are formed, whereby the support 10C and the conductor 40C are formed. ing. For this reason, the sub board 70 </ b> C is composed of a known printed wiring board such as an FPC. That is, for example, the support insulating layer 30C is made of a film made of polyimide or the like, and the second conductive path 42C is formed by patterning a metal foil such as a copper foil provided on the film. Is formed.

In the present embodiment, since the support 10C and the conductor 40C are formed using the child substrate 70C as described above, the composition of the material constituting the second conductive path 42C is the first and third conductives. The composition of the material constituting the paths 41 and 43 is different. Therefore, as shown in FIG. 12, a part of the first conductive path 41 overlaps a part of the second conductive path 42C, and the first conductive path 41 and the second conductive path 42 are electrically connected. It is connected to the.

In the present embodiment, as in the first and second embodiments, the support 10C includes the woven fabric 20, and the first conductive path 41 provided on the upper surface 201 of the woven fabric 20 includes the basket hole. 23 has a first conductor portion 411. For this reason, while maintaining the adhesion between the support 10C and the conductor 40C by the first conductor portion 411, the portion of the support 10C where the first conductive path 41 and the support insulating layer 30C are not present is woven. The followability to the three-dimensional deformation excellent by the flexibility of the cloth 20 can be ensured.

In the present embodiment, similarly to the second embodiment, the first and third conductive paths 41 and 43 are formed after the previously prepared child substrate 70C is attached to the woven fabric 20, A support 10C and a conductor 40C are formed. For this reason, it is possible to form the second conductive path 42C by patterning the metal foil, so that it is possible to form a precise and fine wiring that is difficult to realize by the printing method.

Furthermore, in the present embodiment, as in the second embodiment, since the conductive path formed by the printing method contains a binder component, it is not possible to connect electronic components by soldering. On the other hand, in the present embodiment, as described above, the second conductive path 42C can be formed by patterning the metal foil, so that the electronic components can be connected by soldering.

The embodiment described above is described for easy understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, the support insulating layer 30 and the second conductive path 42 are provided only on the upper surface 201 of the woven fabric 20, but the present invention is not particularly limited thereto. Specifically, the support insulating layer 30 and the second conductive path 42 may be provided on the lower surface 202 of the woven fabric 20. Alternatively, the support insulating layer 30 and the second conductive path 42 may be provided on both surfaces 201 and 202 of the woven fabric 20.

DESCRIPTION OF SYMBOLS 1,1B, 1C ... Wiring board 10, 10B, 10C ... Support body 20 ... Woven cloth 201 ... Upper surface 202 ... Lower surface 21 ... Warp 211 ... Insulating fiber 22 ... Weft 221 ... Insulating fiber 23 ... Basket hole 30, 30B, 30C: Support insulating layer 301 ... Upper surface 302, 303 ... Through hole 40, 40B, 40C ... Conductor 401 to 405 ... Land part 406, 407 ... Wiring part 41, 41b ... First conductive path 411 ... First conductor part 412 ... 1st interposed part 413, 414 ... Conductive layer 42, 42B, 42C ... 2nd conductive path 43, 43B ... 3rd conductive path 431 ... 2nd conductor part 432 ... 2nd interposed part 433,434 ... Conductive layer 50 ... Coating insulating layers 51 to 54 ... Window part 60 ... Adhesive layer 70, 70C ... Sub-board

Claims (10)

1. A support;
   A conductor supported by the support, and
   The support is
   At least one woven fabric woven using woven yarns each formed by bundling insulating fibers;
   A first insulating layer provided on a partial region of the first main surface of the woven fabric,
   The conductor is
   A first conductive path provided on the first main surface of the woven fabric;
   A second conductive path provided on the first insulating layer and connected to the first conductive path;
   The first conductive path is a wiring board having a first conductor portion existing in a basket hole of the woven fabric.
2. The wiring board according to claim 1,
   The conductor includes a third conductive path provided on the second main surface of the woven fabric,
   The third conductive path has a second conductor portion present in the basket hole of the woven fabric,
   At least a portion of the first conductor portion and at least a portion of the second conductor portion are joined together;
   The wiring board in which the first conductive path and the third conductive path are electrically connected via the first conductor portion and the second conductor portion.
3. The wiring board according to claim 1, wherein:
   The woven yarn is
   A warp extending in a first direction;
   A wiring board comprising weft yarns made of the same kind or different types of warp yarns and extending in a second direction intersecting the first direction.
4. A wiring board according to any one of claims 1 to 3,
   The composition of the material constituting the first conductive path and the composition of the material constituting the second conductive path are the same,
   The wiring board in which the first conductive path and the second conductive path are integrally formed.
5. A wiring board according to any one of claims 1 to 3,
   The composition of the material constituting the first conductive path is different from the composition of the material constituting the second conductive path;
   A wiring board in which a part of the first conductive path overlaps a part of the second conductive path.
6. A wiring board according to any one of claims 1 to 5,
   The wiring board is provided with an adhesive layer or an adhesive layer that adheres or adheres the first insulating layer to the first main surface of the woven fabric.
7. A wiring board according to any one of claims 1 to 6,
   The wiring board further includes a second insulating layer that covers the conductor and the support and is also present in the woven fabric.
8. The wiring board according to claim 7,
   The second insulating layer is a wiring board having a window portion exposing a part of the conductor to the outside.
9. A wiring board according to any one of claims 1 to 8,
   The first insulating layer has at least one through hole;
   The first conductive path includes a portion provided on the first main surface of the woven fabric so as to correspond to the through hole.
10. The wiring board according to claim 2,
    The first conductive path includes a first intervening portion existing in a gap between the insulating fibers of the woven fabric,
    The third conductive path is a wiring board including a second intervening portion existing in a gap between the insulating fibers of the woven fabric.

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