JPS6151893A - Flexible printed circuit board - Google Patents

Flexible printed circuit board

Info

Publication number
JPS6151893A
JPS6151893A JP17359784A JP17359784A JPS6151893A JP S6151893 A JPS6151893 A JP S6151893A JP 17359784 A JP17359784 A JP 17359784A JP 17359784 A JP17359784 A JP 17359784A JP S6151893 A JPS6151893 A JP S6151893A
Authority
JP
Japan
Prior art keywords
flexible printed
base material
printed wiring
wiring board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17359784A
Other languages
Japanese (ja)
Inventor
米山 勝広
和智 惟男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP17359784A priority Critical patent/JPS6151893A/en
Publication of JPS6151893A publication Critical patent/JPS6151893A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子回路の配線に用いるフレキシブル印刷配
線基板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible printed wiring board used for wiring electronic circuits.

〔従来の技術〕[Conventional technology]

従来、電子回路の配線に用いるフレキシブル印刷配線基
板は、その基材全体が耐熱性のあるポリイミド、ポリエ
ステルにて形成されたものである。
Conventionally, the entire base of a flexible printed wiring board used for wiring electronic circuits is made of heat-resistant polyimide or polyester.

また、かかる基材上に導電ハターンを形成するには一旦
形成された銅箔をエツチングして所定の回路パターンを
なすようにしてきた。。
Furthermore, in order to form a conductive pattern on such a base material, the copper foil once formed has been etched to form a predetermined circuit pattern. .

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、フレキシブル印刷配線基板の基材として用いる
ポリイミド、ポリエステルは高価で材料費が嵩んだ。ま
た、エツチング加工にてかかる基材上に導電パターンを
形成するので、その分の加工に係わる製造工程の手間も
多く、フレキシブル印刷配線基板の製造費が高くなる問
題があった。
However, polyimide and polyester used as base materials for flexible printed circuit boards are expensive and material costs have increased. In addition, since the conductive pattern is formed on the base material by etching, the manufacturing process involved in the etching process requires a lot of effort, which raises the problem of increasing the manufacturing cost of the flexible printed wiring board.

また、基材全体としてポリイミド、ポリエステルを用い
ているので、フレキシブル印刷配線基板を屈曲させたと
き復元させるための応力が働くため、屈曲させにくい欠
点があった。
In addition, since polyimide or polyester is used as the entire base material, stress is applied to restore the flexible printed wiring board to its original shape when the flexible printed wiring board is bent, making it difficult to bend the board.

本発明はかかる点に鑑み、良好な屈曲性が得られかつ安
価に製造できるフレキシブル印刷配線基板を提供するこ
とを目的とする。
In view of the above, an object of the present invention is to provide a flexible printed wiring board that has good flexibility and can be manufactured at low cost.

〔問題点を解決するための手段〕[Means for solving problems]

本発明ではフレキシブル印刷配線基板の基材を屈曲性の
ある絶縁性合成繊維による基材゛とし、この基材上に形
成する回路パターンを導電性インクを所定パターンに印
刷して得るものである。
In the present invention, the base material of the flexible printed wiring board is a flexible base material made of insulating synthetic fibers, and the circuit pattern formed on this base material is obtained by printing conductive ink in a predetermined pattern.

〔作用〕[Effect]

本発明では基材として絶縁性繊維を用いているので、基
材が外力による切れ裂けに対して強(できると共に、印
刷により導電パターンを形成するので製造工程から導電
パターンな得るためのエツチング工程が省かれる。
In the present invention, since insulating fibers are used as the base material, the base material is resistant to tearing and tearing due to external forces.In addition, since the conductive pattern is formed by printing, there is no need for an etching process to obtain the conductive pattern from the manufacturing process. omitted.

〔実施例〕〔Example〕

以下、第1図〜第4図を参照して本発明フレキシブル印
刷配線基板の一実施例について説明する。
Hereinafter, one embodiment of the flexible printed wiring board of the present invention will be described with reference to FIGS. 1 to 4.

(1)はフレキシブル印刷配線基板の基材を示し、この
基材(1)は絶縁性の合成繊維例えばポリエステル製の
縦糸(2)及び横糸(3)よりなる。ここで(4)はこ
れらを接着する絶縁性接着剤層である。
(1) indicates a base material of a flexible printed wiring board, and this base material (1) is made of warp threads (2) and weft threads (3) made of insulating synthetic fibers, such as polyester. Here, (4) is an insulating adhesive layer that bonds these together.

また(5)はウレタンシートよりなる絶縁層で、この絶
縁層(5)は基材(1)の一方の面に絶縁性接着剤層(
4)を介して接着される。
Further, (5) is an insulating layer made of a urethane sheet, and this insulating layer (5) has an insulating adhesive layer (
4).

また、(6)、(7)文び(8)は導電性インクを塗布
して得た導電パターンを示ス。
In addition, (6), (7), and (8) show conductive patterns obtained by applying conductive ink.

次に、この実施例の製造工(51の例につき説明する。Next, an example of the manufacturing process (51) of this embodiment will be explained.

まず1.絶は性の合成IR維例えばポリエステル製の縦
糸(2)及び横糸(3)の必要部分が絶縁性接着剤+4
1で接着され、−面に例えばウレタンシートよりなる絶
縁層(5)が接着されたものを用意する(第2図)。
First 1. Necessary parts of the warp (2) and weft (3) made of indispensable synthetic IR fibers such as polyester are coated with an insulating adhesive +4
1, and an insulating layer (5) made of, for example, a urethane sheet is adhered to the negative side (FIG. 2).

次に所定パターンで導電性インクをスクリーン印刷し、
導電パターン(6)、(7)及び(8)をスクリーン印
刷する。この場合、jj4電性インクが絶縁性の合成繊
維の糸f2+ (31の間に染み込む(第3図1)。
Next, screen print conductive ink in a predetermined pattern,
Screen print conductive patterns (6), (7) and (8). In this case, the jj4 electroconductive ink penetrates between the insulating synthetic fiber threads f2+ (31) (Fig. 3, 1).

次に電気的接続に供する部分以外のレジストを行なうた
めにソルダーレジスト(9)、ααを施しく第4図)だ
後、111(品数付孔1 (111G21の孔あけ工程
に移る(第5図)。曲の工程は従来のフレキシブル印刷
配線基板と同様とする。
Next, in order to resist the parts other than those used for electrical connection, solder resist (9) and αα are applied (Fig. 4), and then the process moves to the drilling process of 111 (number of holes 1 (111G21) (Fig. 5). ).The song process is the same as for conventional flexible printed wiring boards.

このような本実施例のフレキシブル印刷記法基板におい
ても従来同様に導電性インクにより形成された導電パタ
ーン及びランド部により所定の電子部品の配線が行なわ
れる。
In the flexible printed notation board of this embodiment as well, predetermined electronic components are wired using conductive patterns and land portions formed of conductive ink, as in the conventional case.

以上述べたように、本発明の一実施例によれば、絶縁性
接着剤λ、ILによる基材上に導11j;性インクによ
る導電パターンを形成するようにしたので、ポリイミド
、ポリエステルで全体的に基材を形成した従来のフレキ
シブル印刷配線基板に比し、安価洗これを供給できる。
As described above, according to one embodiment of the present invention, the conductive pattern is formed using the conductive ink on the base material using the insulating adhesive λ and IL. Compared to conventional flexible printed circuit boards that have a base material formed on them, it can be manufactured and supplied at a lower cost.

また、縦糸(2)と横糸(3)で織られた基材fl)と
したので外力による切れ、裂けに対して強いフレキシブ
ル印刷配線基板にできる。また、煩わしい化学的処理工
程となるエツチング加工な経ずに導電インクの塗布にて
回路パターンを簡単に形成できろ。
Furthermore, since the base material (fl) is woven with warp threads (2) and weft threads (3), a flexible printed wiring board that is resistant to cutting and tearing due to external forces can be obtained. In addition, circuit patterns can be easily formed by applying conductive ink without going through the troublesome chemical etching process.

なお本発明は上述実施例に限らず本発明の要旨を逸脱す
ることなくその他種々の414成が取り得ることは勿論
である。
Note that the present invention is not limited to the above-described embodiments, and it goes without saying that various other configurations can be taken without departing from the gist of the present invention.

〔発明の効果〕〔Effect of the invention〕

本発明は、絶縁性の合成繊維による基材上に導電性イン
クを所定パターンに印刷するようKしたので、従来に比
し材料費が安価になり、またエツチング工程を経ずに回
路パターンの導電部分を形成できるので安価にフレキシ
ブル印刷配線基板を製造できる利益がある。また、合成
tlR維による基材としたので外力による切れ、裂けに
対して強くでき、従来のフレキシブル印刷配線基板で使
用できなかったねじれのある屈曲使用の頻度の激しいと
ころでも使用できる利益がある。
Since the present invention prints conductive ink in a predetermined pattern on a base material made of insulating synthetic fibers, the material cost is lower than in the past, and the conductive ink of the circuit pattern can be printed without an etching process. There is an advantage in that a flexible printed wiring board can be manufactured at low cost because the parts can be formed. In addition, since the base material is made of synthetic tlR fiber, it is strong against cutting and tearing due to external force, and has the advantage of being usable even in places where conventional flexible printed wiring boards cannot be used, where they are frequently bent and twisted.

図面の1ム411iな説明 v、1図は本発明フレキシブル印刷配線基板の一実施例
を示す断面図、第2図、第3図、第4図及び第5図はそ
れぞれ第1図に示す例の製造工程例を示す線図である。
Figure 1 is a sectional view showing one embodiment of the flexible printed wiring board of the present invention, and Figures 2, 3, 4, and 5 are examples shown in Figure 1, respectively. FIG. 3 is a diagram showing an example of a manufacturing process.

(1)は基材、(2)は縦糸、(3)は横糸、+61 
(71及び(8)は導電性インクによる導電パターンで
ある。
(1) is the base material, (2) is the warp, (3) is the weft, +61
(71 and (8) are conductive patterns made of conductive ink.

第1図 第2図 第3図 第4図 第50Figure 1 Figure 2 Figure 3 Figure 4 50th

Claims (1)

【特許請求の範囲】[Claims] 絶縁性合成繊維による基材上に導電性インクを所定パタ
ーンに印刷したことを特徴とするフレキシブル印刷配線
基板。
A flexible printed wiring board characterized by having conductive ink printed in a predetermined pattern on a base material made of insulating synthetic fibers.
JP17359784A 1984-08-21 1984-08-21 Flexible printed circuit board Pending JPS6151893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17359784A JPS6151893A (en) 1984-08-21 1984-08-21 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17359784A JPS6151893A (en) 1984-08-21 1984-08-21 Flexible printed circuit board

Publications (1)

Publication Number Publication Date
JPS6151893A true JPS6151893A (en) 1986-03-14

Family

ID=15963546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17359784A Pending JPS6151893A (en) 1984-08-21 1984-08-21 Flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS6151893A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018123977A1 (en) * 2016-12-28 2018-07-05 株式会社フジクラ Wiring substrate and wiring substrate manufacturing method
WO2019150863A1 (en) * 2018-02-02 2019-08-08 株式会社フジクラ Wiring substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018123977A1 (en) * 2016-12-28 2018-07-05 株式会社フジクラ Wiring substrate and wiring substrate manufacturing method
WO2019150863A1 (en) * 2018-02-02 2019-08-08 株式会社フジクラ Wiring substrate

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