JPS6156484A - Circuit board device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] 'The present invention relates to a wiring board device used for electrical wiring of electronic components.

[Conventional technology]

Conventionally, as wiring board devices used for electrical wiring of electronic components, a conductive pattern made of a metal conductor such as copper foil is formed by etching on a base material made of polyimide or polyester to form a desired circuit pattern. Flexible printed wiring boards for wiring electronic components have been proposed.

[Problem that the invention seeks to solve]

However, since the base material is made of expensive polyimide or polyester, there is an inconvenience that the manufacturing cost of the flexible printed wiring board increases.

Furthermore, base materials made of polyimide or polyester are weak against cutting or tearing and have the disadvantage that sufficient material strength cannot be obtained. Further, base materials made of polyimide or polyester have large bending stress when bent, and are not necessarily suitable for bending use.

In addition, when trying to connect to other wiring patterns at the ends of the flexible printed wiring board, since the ends are not rigid, the ends are difficult to flatten and the connection between the flexible printed wiring board and other wiring patterns tends to be poor. Ta.

In order to solve these problems, it is an object of the present invention to provide a wiring board device that can be manufactured at a low cost, has sufficient material strength, is suitable for bending use, and allows for easy attachment of electronic components.

[Means for solving problems]

The present invention provides a wiring board device in which a conductive pattern (3) is formed on a base material (2) made of synthetic fibers, and a rigid base material (5) is provided in a predetermined range. .

[Effect]

In the present invention, since the base material (2) is made of synthetic fiber, the material cost is low, and since the warp and weft threads are interwoven, it is strong against cutting or tearing. In addition, since the rigid base material (5) is provided in a predetermined area, the strength can be reinforced and electronic parts can be easily attached.

〔Example〕

An embodiment of the wiring board device of the present invention will be described below with reference to FIG.

In Fig. 1, (1) shows the wiring board device as a whole, and the wiring board device (1) has a conductive pattern (3) on a base material (2) made of synthetic fibers and a predetermined circuit pattern. It is shaped like an eggplant. Here, the base material (
2) is made of synthetic IA<Jj= and has warp and weft yarns woven together, so it is strong against tension in the vertical or horizontal direction. Further, it can be manufactured at a lower cost than a sheet-like 7-lexiple printed wiring board made of polyimide or polyester.

Further, the conductive pattern (3) is formed by applying conductive ink onto the base material (2), and the conductive ink permeates to the opposite surface of the base material (2). (4) indicates an insulating adhesive layer, and a rigid base material (5) is provided in a predetermined area on the opposite side of the conductive pattern (3) via this adhesive ICJ (4). . Here, (6) is a resistor, and (7) is a chemical capacitor, which are electrically connected to predetermined positions by solder burps.

In this embodiment configured in this way, the resistor (6)
and the terminals of the chemical capacitor (7) are connected to the conductive pattern (
It is electrically connected to the terminal of 3), and the electrical wiring of the desired electronic component can be done well. Here, the rigid base material (
5) Where Uσ is not provided □The portion consisting only of the base material (2) made of synthetic fibers has high strength against cutting or tearing and is also highly flexible. In addition, a predetermined area where the rigid base material (5) is provided on the opposite side to the circuit pattern is a chemical capacitor (7) and a resistor (6).
) The electronic components of v can be installed well.

According to the present embodiment described above, since the base material (2) made of synthetic fiber is used, the manufacturing cost is lower than that of the conventional wiring board device using polyimide, etc., and it is resistant to tearing. A wiring board device that is strong and has good flexibility can be obtained. Furthermore, since a rigid base material is provided in a predetermined area, the strength can be reinforced and connections with other wiring patterns or electronic components at the ends can be made well.

Further, FIGS. 2, 3, 4, 5 and 6 each show other embodiments of the present invention. In FIGS. 2, 3, 4, 5, and 6, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and detailed explanation thereof will be omitted.

First, in the example shown in FIG. 2, a rigid L-shaped base material (8) is provided in a predetermined range. Adhesive layer (9) and (1
Base materials αυ and α formed of synthetic fibers via 01
This is a double-sided board with a side plate. Here, it is easy to understand that the same effect as that of the above embodiment can be obtained by the example of α ri α ru α5), (IQ is an IC chip). (8) also serves as mutual insulation and strength reinforcement of the base materials αυa provided on both the front and back surfaces.

In Fig. 3, αη indicates the rigid base material on the other wiring pattern αυ side, and a force is applied as shown by arrow a using the flatness of this base material η and the rigid base material (5). ,
A desired electrical connection such as a8 with the conductive pattern (3) is obtained by press-contacting the conductive pattern (3).

Further, FIG. 4 shows another embodiment in which the present invention is applied when electrical connection is made by a connector.

In Fig. 4, (1') indicates the plug side of the connector,
Also, the wire is on the jack side of the connector, and these plug side a9
and jack side Cυ are made to correspond and connect as shown by the arrows. It is easy to understand that the same effects as those described above can be obtained in this example as well.

In addition, the example shown in FIG. 5 uses a contact (21
) is an example of electrically connecting. In this example as well, the same effects as in the example shown in FIG. 1 can be obtained.

In the example shown in Fig. 6, the electrical connection between the conductive pattern α arranged on the rigid substrate αη and the conductive pattern (3) on the base material (2) made of synthetic fiber is made by soldering. This is an example of how to do this. It is easy to understand that this example also provides the same effects as the example shown in FIG.

Note that the present invention is not limited to the above-described embodiments, and it goes without saying that various other configurations may be adopted without departing from the gist of the present invention.

〔Effect of the invention〕

According to the present invention, a conductive pattern is formed on a base material made of synthetic fibers, and a rigid base material is provided in a predetermined area, so manufacturing costs are lower than in the past, and there is no risk of tearing, etc. It also has the advantage of having good flexibility. Further, since a rigid base material is provided in a predetermined area, there are advantages in that insulation is ensured, strength is reinforced, and electronic parts can be mounted well.

[Brief explanation of the drawing]

1. FIG. 1 is a sectional view showing one embodiment of the wiring board device of the present invention, FIGS. 2 and 3 are sectional views showing other embodiments of the present invention, and FIGS. 4, 5, and 6 The figure is a diagram showing another embodiment of the invention. (2) is a base material, (3) is a conductive pattern, and (5) is a rigid base material. Hidemori Matsukuma “1～1・Pa・□、′・) Figure 4

Claims (1)

[Claims] A wiring board device characterized in that a conductive pattern is formed on a base material made of synthetic fiber, and a rigid base material is provided in a predetermined range.