WO2019148647A1 - Low-cost lamp cup - Google Patents
Low-cost lamp cup Download PDFInfo
- Publication number
- WO2019148647A1 WO2019148647A1 PCT/CN2018/082290 CN2018082290W WO2019148647A1 WO 2019148647 A1 WO2019148647 A1 WO 2019148647A1 CN 2018082290 W CN2018082290 W CN 2018082290W WO 2019148647 A1 WO2019148647 A1 WO 2019148647A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- cup
- low
- cup holder
- hole
- Prior art date
Links
- 239000011324 bead Substances 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 5
- 230000001070 adhesive effect Effects 0.000 abstract 5
- 230000000694 effects Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Definitions
- the invention relates to the technical field of illumination, in particular to a low-cost lamp cup.
- the lamp bead is an integral part of the illumination source. In order to adapt to the use of various lamps, the illumination angle is adjusted.
- the existing method on the market is realized by adding a lens, and the method of adding a lens has a higher secondary development cost and a thermal conduction speed. Slow, high temperature, low brightness.
- the present invention provides the following technical solutions:
- a low-cost lamp cup comprises a hardware frame, a cup holder and a light-emitting surface, the cup holder is mounted on an upper part of the metal frame, a circular through hole is arranged in the middle of the cup holder, and a light-emitting surface is installed inside the through hole, the light-emitting A light transmissive layer is provided on the top of the surface by dispensing.
- the light-emitting surface adopts a 35MM*35MM patch lamp bead.
- Figure 1 is a circuit diagram of a light bar circuit.
- Figure 2 is a side cross-sectional view of the present invention.
- Figure 3 is a diagram showing the arrangement of the beads in a row.
- a low-cost lamp cup includes a hardware frame, a cup holder and a light-emitting surface.
- the cup holder is installed on an upper part of the metal frame, and a circular through hole is arranged in the middle of the cup holder, and the through hole is internally installed.
- the light surface is made of 35MM*35MM patch light beads.
- the hardware frame and the cup holder together form a cup body, and the angle of the inner space of the lamp bead cup is 45.56°.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (4)
- 一种低成本灯杯,包括五金架、杯架和发光面,所述杯架安装在五金架的上部,杯架中间设有通孔,通孔内部安装有发光面,其特征在于,所述发光面的上方通过点胶的方式设有透光层。A low-cost lamp cup comprises a hardware frame, a cup holder and a light-emitting surface, the cup holder is mounted on an upper part of the metal frame, a through hole is arranged in the middle of the cup holder, and a light-emitting surface is installed inside the through hole, wherein the cup is A light transmitting layer is provided on the upper side of the light emitting surface by dispensing.
- 根据权利要求1所述的一种低成本灯杯,其特征在于,所述通孔为圆形通孔。A low cost light cup according to claim 1, wherein said through hole is a circular through hole.
- 根据权利要求1所述的一种低成本灯杯,其特征在于,所述发光面采用35MM*35MM贴片灯珠。The low-cost lamp cup according to claim 1, wherein the light-emitting surface adopts a 35MM*35MM patch lamp bead.
- 根据权利要求1所述的一种低成本灯杯,其特征在于,所述五金架和杯架共同组成杯体,灯珠杯体内空间的角度为45.56°。The low-cost lamp cup according to claim 1, wherein the hardware frame and the cup holder together form a cup body, and an angle of the inner space of the lamp bead cup is 45.56°.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810099396.8 | 2018-02-01 | ||
CN201810099396.8A CN108533990A (en) | 2018-02-01 | 2018-02-01 | Low-cost lamp cup |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019148647A1 true WO2019148647A1 (en) | 2019-08-08 |
Family
ID=63486246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/082290 WO2019148647A1 (en) | 2018-02-01 | 2018-04-09 | Low-cost lamp cup |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN108533990A (en) |
WO (1) | WO2019148647A1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201779526U (en) * | 2010-09-26 | 2011-03-30 | 蔡鸿 | Led light source |
CN203071121U (en) * | 2012-12-21 | 2013-07-17 | 深圳粤宝电子工业总公司 | LED lamp bead with good heat resistance performance |
CN203288638U (en) * | 2013-03-04 | 2013-11-13 | 陈广明 | Short cup type large-irradiation-range LED support structure |
US20160322539A1 (en) * | 2013-12-18 | 2016-11-03 | Jiangyin Changdian Advanced Packaging Co.,Ltd | Led packaging structure |
CN206516651U (en) * | 2016-12-23 | 2017-09-22 | 博罗县杰信塑胶五金制品有限公司 | A kind of big optically focused LED support of lighting angle |
CN206584958U (en) * | 2016-11-30 | 2017-10-24 | 佛山市国星光电股份有限公司 | The LED component and LED display of a kind of double-deck packaging plastic |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101414651B (en) * | 2007-10-17 | 2010-06-16 | 洪绢欲 | Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof |
CN103378274A (en) * | 2012-04-27 | 2013-10-30 | 台达电子工业股份有限公司 | Light-emitting device and manufacturing method thereof |
CN104393153B (en) * | 2014-11-28 | 2017-05-31 | 江阴长电先进封装有限公司 | A kind of wafer-level encapsulation method of semiconductor devices |
CN105140379B (en) * | 2015-06-29 | 2017-12-15 | 合肥工业大学 | One kind is in the uniform white light LED part of space multistory angle light emission color temperature and its method for packing |
CN106848041B (en) * | 2017-03-23 | 2019-07-16 | 电子科技大学 | A kind of preparation method of the LED light source for aquaculture |
-
2018
- 2018-02-01 CN CN201810099396.8A patent/CN108533990A/en active Pending
- 2018-04-09 WO PCT/CN2018/082290 patent/WO2019148647A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201779526U (en) * | 2010-09-26 | 2011-03-30 | 蔡鸿 | Led light source |
CN203071121U (en) * | 2012-12-21 | 2013-07-17 | 深圳粤宝电子工业总公司 | LED lamp bead with good heat resistance performance |
CN203288638U (en) * | 2013-03-04 | 2013-11-13 | 陈广明 | Short cup type large-irradiation-range LED support structure |
US20160322539A1 (en) * | 2013-12-18 | 2016-11-03 | Jiangyin Changdian Advanced Packaging Co.,Ltd | Led packaging structure |
CN206584958U (en) * | 2016-11-30 | 2017-10-24 | 佛山市国星光电股份有限公司 | The LED component and LED display of a kind of double-deck packaging plastic |
CN206516651U (en) * | 2016-12-23 | 2017-09-22 | 博罗县杰信塑胶五金制品有限公司 | A kind of big optically focused LED support of lighting angle |
Also Published As
Publication number | Publication date |
---|---|
CN108533990A (en) | 2018-09-14 |
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