WO2019148452A1

WO2019148452A1 - Speaker assembly and electronic device

Info

Publication number: WO2019148452A1
Application number: PCT/CN2018/075123
Authority: WO
Inventors: 杨修康; 姚凯
Original assignee: 海能达通信股份有限公司
Priority date: 2018-02-02
Filing date: 2018-02-02
Publication date: 2019-08-08

Abstract

The present application discloses a speaker assembly and an electronic device. The speaker assembly is used in the electronic device. The speaker assembly comprises: a speaker excitation system, comprising a speaker magnetic circuit structure and a speaker vibration structure. Wherein the speaker vibration structure comprises a diaphragm, and the speaker magnetic circuit structure is used to receive an audio signal, and to drive the speaker vibration structure according to the audio signal, and to further drive the diaphragm to generate vibrations; a speaker support, disposed on a side of the speaker magnetic circuit structure away from the speaker vibration structure, and used to fix the speaker excitation system, the speaker support comprising a top surface and a side surface. Wherein the top surface is disposed away from the speaker excitation system, and a through hole corresponding to the position of the diaphragm is provided through the top surface and the side surface, such that sound emitted by vibrations of the diaphragm can be radiated to the periphery of the speaker support through the through hole. By the above means, the present application enables sound generated by vibrations of the diaphragm to radiate to the periphery of the speaker support, thereby increasing space utilization at the periphery of the speaker support.

Description

Speaker assembly and electronic equipment

[Technical Field]

The present application relates to the field of speaker technology, and in particular to a speaker assembly and an electronic device.

【Background technique】

The speaker, also known as the "horn", is a transducing device that converts an electrical signal into an acoustic signal, which is commonly found in electrical and electronic devices that emit sound. In a stable magnetic field, a varying audio signal flows through the voice coil to make a magnetic line motion, thereby causing the diaphragm to radiate sound forward and backward.

In order to meet the needs of users, the thin and light of electronic and electrical equipment has become a trend of development. However, the inventor of the present application found in the long-term development process that the thin and light type speaker in the prior art merely reduces the size of the speaker or thins the material of the speaker, and the sound propagation mode does not change, which causes the speaker to be made. When the sound generated by the vibration of the diaphragm is propagated, the space utilization rate is low, especially in a thin and light speaker, the sound quality is greatly affected, thereby affecting the user's use.

[Summary of the Invention]

The technical problem mainly solved by the present application is to provide a speaker assembly and an electronic device, which can make the sound generated by the vibration of the diaphragm radiate from the periphery of the speaker bracket, thereby improving the space utilization around the speaker bracket.

In order to solve the above technical problem, a technical solution adopted by the present application is to provide a speaker assembly for an electronic device, the speaker assembly comprising: a speaker excitation system, including a speaker magnetic circuit structure and a speaker vibration structure The speaker vibration structure includes a diaphragm, the speaker magnetic circuit structure is configured to receive an audio signal, and drive the speaker vibration structure vibration according to the audio signal, and further drive the diaphragm to generate vibration; a speaker bracket, setting Providing the speaker excitation system on a side of the speaker magnetic circuit structure facing away from the speaker vibration structure, the speaker bracket including a top surface and a side surface, wherein the top surface faces away from the speaker excitation system setting, A through hole corresponding to a position of the diaphragm is disposed through the top surface and the side surface such that sound emitted by the vibration of the diaphragm can be radiated to the periphery of the speaker holder through the through hole.

In order to solve the above technical problem, another technical solution adopted by the present application is to provide an electronic device including the above speaker assembly.

The utility model has the beneficial effects that the speaker bracket in the speaker assembly of the present application is provided with a through hole corresponding to the position of the diaphragm through the top surface and the side surface, so that the sound emitted by the diaphragm vibration can pass through the prior art. The through hole is radiated to the periphery, and in the prior art, the speaker bracket is only provided with a through hole at the top surface, so that the sound emitted by the diaphragm vibration can only propagate in the vertical direction of the diaphragm, and the diaphragm vibration is compared with the prior art. The generated sound is radiated around the speaker bracket, thereby increasing the space utilization around the speaker bracket without increasing the sound quality by increasing the space in the vertical direction of the speaker bracket, thereby appropriately reducing the distance of the speaker assembly in the vertical direction, thereby enabling Reducing the thickness of the speaker assembly does not affect the sound quality of the speaker assembly.

[Description of the Drawings]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application. Other drawings may also be obtained from those of ordinary skill in the art in light of the inventive work. among them:

1 is a schematic exploded view of a speaker assembly of the prior art;

2 is a schematic cross-sectional view of a speaker assembly in the prior art

3 is a schematic exploded view of an embodiment of a speaker assembly of the present application;

4 is a schematic cross-sectional view of an embodiment of a speaker assembly of the present application;

5 is a schematic exploded view of another embodiment of the speaker assembly of the present application;

6 is a schematic structural view of still another embodiment of the speaker assembly of the present application;

7 is a schematic structural diagram of an embodiment of a law enforcement recorder of the present application;

8 is a comparison diagram of frequency response curves of the speaker assembly of the present application and the speaker assembly of the prior art in an acoustic performance test;

9 is a comparison diagram of distortion curves of the speaker assembly of the present application and the speaker assembly of the prior art in an acoustic performance test;

10 is a comparison diagram of impedance curves of the speaker assembly of the present application and the speaker assembly of the prior art in an acoustic performance test;

11 is a simulation result diagram of the law enforcement recorder of the present application in the heat dissipation performance test;

Figure 12 is a graph showing the simulation results of the prior art law enforcement recorder in the heat dissipation performance test.

【Detailed ways】

Prior to the detailed description of the present application, the prior art related to the present application will be described.

Ultrathin speaker assemblies of the prior art typically include a metal upper cover, a metal lower cover, a speaker activation system, a speaker mount, and the like.

1 and FIG. 2, FIG. 1 is a schematic diagram of an explosion structure of a speaker assembly in the prior art, and FIG. 2 is a schematic cross-sectional view of a speaker assembly in the prior art.

In the speaker assembly of the prior art, the sound emitted by the vibration of the diaphragm 11 is emitted in the direction of the vertical sound hole 12, because the sound hole 12 is disposed on the top surface of the speaker holder 13 facing away from the diaphragm 11, and The sides of the speaker holder 13 are all surrounded by the speaker holder 13, and the sound generated by the vibration of the diaphragm 11 can only be emitted along the top surface of the speaker holder 13 along the sound hole 12, thereby forming the vertical sound hole 12 in the direction of transmission. the sound of. Moreover, since the printed circuit board 21 is vertically disposed in the direction in which the sound is emitted along the speaker in the electronic device, the sound is caused to be blocked by the printed circuit board 21 when the sound is propagated to the printed circuit board 21, so that a part of the sound is vertically reflected. On the one hand, because some of the sound is reflected, it cannot be transmitted, causing sound loss and lowering the volume. On the other hand, the reflected sound is returned to the diaphragm 11, so that the diaphragm 11 is reflected by the reflected sound, which affects the diaphragm. The original vibration of 11 emits a noise, which in turn affects the sound quality of the speaker. Conversely, if the sound quality of the speaker is to be good, the vertical distance between the diaphragm 11 and the printed circuit board 21 in the electronic device needs to be increased, thereby increasing the space occupied by the speaker, and the space utilization rate is low, which is disadvantageous for the speaker. Light and thin electronic devices.

Secondly, in the prior art, the speaker assembly is thinned and thinned mainly by reducing the size and thinning of the speaker assembly, and the overall weight of the speaker assembly is reduced due to the thinning of the speaker assembly material, thereby deteriorating stability. . In particular, some of the speaker assemblies of the prior art have a small sound hole 12, and the air flow caused by the vibration of the diaphragm 11 is concentrated. When the concentrated airflow vibrates, the vibration of the speaker holder 13 is caused, and the air caused by the vibration of the diaphragm 11 is additionally caused. The flow is directly struck on the printed circuit board 21 in the direction of the vertical diaphragm to further cause vibration, and at the same time, after hitting the printed circuit board 21, it is returned to hit the diaphragm 11, thereby causing accidental vibration of the diaphragm 11. When the material of the speaker assembly is thin, the above vibration is particularly fierce, and even when the volume is turned up, vibration is caused, which affects the user's use.

As the size of the speaker assembly is reduced, the acoustic resistance is increased, the sound power is reduced, resulting in an increase in heat generation, and the small size is not conducive to the heat dissipation of the speaker assembly, which may cause the temperature of the voice coil 14 to rise, which seriously affects the reliability of the product. . In order to solve the above technical problem, the prior art further increases the heat conduction area by providing a metal upper cover and a metal lower cover to improve the heat dissipation efficiency of the speaker. However, this obviously increases the overall thickness of the speaker assembly, which is disadvantageous to the product. Light and thin development.

The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.

Please refer to FIG. 3 and FIG. 4 together. FIG. 3 is a schematic exploded view of an embodiment of the speaker assembly of the present application, and FIG. 4 is a schematic cross-sectional view of an embodiment of the speaker assembly of the present application. The speaker component in the embodiment of the present application may be a speaker component in an electronic device such as a law enforcement recorder, a walkie-talkie, a mobile phone (such as a three-proof mobile phone), a tablet computer, or the like. The speaker assembly includes a speaker excitation system 31 and a speaker bracket 32.

Among them, the speaker excitation system 31 is the core of the speaker assembly for converting electrical energy into sound. Specifically, the speaker excitation system 31 includes a speaker magnetic circuit structure 311 and a speaker vibration structure 312, wherein the speaker vibration structure 312 includes a diaphragm 3121 for receiving an audio signal and driving the speaker according to the received audio signal. The vibrating structure 312 vibrates and further drives the diaphragm 3121 to generate vibration.

The speaker holder 32 is disposed on a side of the speaker magnetic circuit structure 311 facing away from the speaker vibration structure 312 for fixedly supporting the speaker excitation system 31. Specifically, the edge portion of the diaphragm 3121 facing the speaker holder 32 is attached to the edge of the speaker holder 32. It should be noted that the diaphragm 3121 and the speaker holder 32 do not affect the vibration of the diaphragm 3121 after being attached. Only the diaphragm 3121 is fixed.

The speaker holder 32 may be made of a metal material such as aluminum or the like, or the speaker holder 32 may be directly used, and the printed circuit board of the electronic device or the housing of the electronic device or the like may be used as the speaker holder 32.

Further, the speaker bracket 32 includes a top surface 321 and a side surface 322, wherein the top surface 321 is disposed away from the speaker excitation system 31, and the through hole 323 corresponding to the position of the diaphragm 3121 is disposed through the top surface 321 and the side surface 322, so that the diaphragm 3121 The sound emitted by the vibration can be radiated to the periphery through the through hole 323.

In the prior art, as shown in FIG. 1, only the through hole 12 is provided on the top surface of the speaker holder 13, and the sound generated by the vibration of the diaphragm 11 can only be emitted in a direction perpendicular to the sound hole 12, thus making the speaker bracket When the top surface of the 13 is blocked, the sound cannot be transmitted well enough, so that there must be enough space above the top surface of the speaker holder 13 to achieve sound transmission. In the present embodiment, the side surface of the speaker holder 32 is also provided with a hollow through hole 323, so that the sound emitted by the vibration of the diaphragm 3121 can be blocked from the side of the speaker holder 32, thereby being radiated from the side of the speaker holder 32. Even if there is occlusion above the diaphragm 3121, the sound can still be transmitted, which can greatly improve the space utilization. In addition, since the sound in the present application can be radiated to the periphery by the through hole in the speaker holder 32, the space around the speaker holder 32 can be fully utilized without the space in the vertical direction of the speaker holder 32, so that the speaker assembly can be appropriately reduced. The distance in the vertical direction can further reduce the thickness of the speaker assembly without affecting the sound quality of the speaker assembly. In addition, in the present embodiment, the sound generated by the vibration of the diaphragm 3121 is dispersed, and the sound is generated at the source of the sound to be released without being concentrated toward the direction perpendicular to the speaker holder 32, thereby greatly reducing the sound emission. After the rebound due to the internal components of the electronic device (such as the motherboard circuit board) striking the speaker stand 32, the loss of sound is reduced on the one hand, and the conversion rate of the sound is improved. On the other hand, the sound bounces back and the sound is struck. The film 3121 thus affects the vibration of the diaphragm 3121, and the influence on the sound quality of the speaker can be greatly reduced.

Specifically, the shape and number of the through holes 323 on the speaker holder 32 are not particularly limited. In one application scenario, two semi-annular through holes 323 disposed along the edge of the speaker holder 32 are oppositely disposed, and two opposite rectangular through holes 323 are further disposed in the opposing space between the two semi-annular through holes 323, or rounded The rectangular through hole 323 is specifically as shown in FIG. In another application scenario, referring to FIG. 5, the side surface of the speaker bracket 32 corresponding to the rounded rectangular through hole 323 in the previous application scenario can also be penetrated. In yet another application scenario, referring to FIG. 6, five through holes may be uniformly disposed on the top surface 321 and the side surface 322 of the speaker bracket 32.

In an embodiment, referring to FIG. 3, the speaker assembly further includes a heat dissipation upper cover 33 disposed on a side of the speaker excitation system 31 facing away from the speaker holder 32, and connected to the speaker holder 32, so that The speaker holder 32 is capable of conducting heat through the heat dissipation upper cover 33.

Specifically, the heat dissipation upper cover 33 is provided with a first accommodating hole 331 corresponding to the diaphragm 3121. The edge of the diaphragm 3121 is connected to the edge of the first accommodating hole 331. The edge of the first accommodating hole 331 is away from the speaker bracket. The direction of the recess 32 is stepped, the edge of the diaphragm 3121 is connected to the stepped edge of the first receiving hole 331, and the edge of the speaker bracket 32 is at least partially accommodated in the stepped edge to fasten the heat. The cover 33 is such that the speaker excitation system 31 is housed between the speaker holder 32 and the heat dissipation upper cover 33.

The speaker excitation system 31 converts some of the electrical energy into heat during operation to be transmitted to the speaker holder 32. In the present embodiment, the speaker holder 32 is further connected to the heat dissipation upper cover 33, so that heat can be further exported to the heat dissipation cover. 33, to improve the heat dissipation efficiency of the speaker assembly. Of course, it is easy to understand that the heat dissipation upper cover 33 is not necessarily necessary for the speaker assembly in the present application, and the heat dissipation upper cover 33 may not be provided when the heat dissipation performance of the speaker assembly itself is good.

It should be noted that the heat dissipation upper cover 33 in the present embodiment may be made of a metal material such as aluminum or the like, or a heat dissipation upper cover 33 may be directly used, and a printed circuit board of the electronic device may be directly used as the heat dissipation upper cover 31.

In one application scenario, the heat dissipation cover 33 is a heat sink of the electronic device, and the speaker bracket 32 is coupled to the heat dissipation cover 33 to dissipate heat from the heat sink of the electronic device. Other components in the electronic device can be further connected to dissipate heat from other components in the electronic device. In this way, when a component in the electronic device, such as a speaker component, generates heat, the heat dissipation platform can be used to further dissipate heat through other components in the electronic device, thereby increasing the heat dissipation area and reducing the long-term operation of some components. The resulting heat is concentrated, which is beneficial to the balance of heat inside the electronic device. Further, in the prior art, the heat dissipation upper cover and the speaker lower cover are provided to increase the heat dissipation area of the speaker assembly, thereby improving the heat dissipation efficiency of the speaker, and in this embodiment, the speaker assembly can be realized without additionally providing a speaker lower cover. Good heat dissipation, which further reduces the thickness of the speaker assembly, making the speaker assembly lighter and thinner.

Further, in an embodiment, the speaker magnetic circuit structure 311 includes an upper plate 3111 and a magnetic steel 3112. The speaker vibration structure 312 further includes a voice coil 3122 and a voice coil wire 3123. The speaker assembly 31 further includes a terminal plate 34.

Among them, the terminal block 34 fixes the voice coil 3122, and receives the audio signal, and transmits the audio signal to the speaker excitation system 31 for further conversion into sound. When the audio signal passes through the voice coil 3123 in the magnetic field, according to the left-hand rule of the Fleming, the voice coil 3123 is forced to move with the magnitude and direction of the current, and the diaphragm 3121 which is connected with the voice coil 3123 is vibrated. And radiate sound inside and outside.

Specifically, the voice coil 3122 is connected to the diaphragm 3121 from the side of the speaker bracket 21, and the upper plate 3111 and the magnetic steel 3112 are sequentially disposed on the side of the voice coil 3122 near the speaker holder 32, and the voice coil 3123 is connected to the voice coil 3122 at one end. The other end is connected to the terminal block 34 such that the voice coil 3122 receives the audio signal transmitted from the terminal block 34 through the voice coil line 3123.

The audio signal is specifically an electrical signal, and the electrical signal is received by the terminal board 34. After receiving the electrical signal, the terminal board 34 transmits the electrical signal to the voice coil 3122, the upper plate 3111, and the magnetic steel 3112 through the voice coil line 3123. The magnetic steel wire 3112 cuts the magnetic induction line to drive the voice coil 3122 to move.

Further, one side of the voice coil 3122 is connected to the diaphragm 3121. Specifically, the diaphragm 3121 can be attached to one side of the voice coil 3122, so that the diaphragm 3121 can be driven to vibrate when the voice coil 3122 moves.

The speaker magnetic circuit structure 311 may be disposed on a side of the speaker holder 32 facing the heat dissipation upper cover 31, specifically by attaching the magnetic steel 3112 to the side of the speaker holder 32 facing the heat dissipation upper cover 31. In one application scenario, a side of the speaker holder 32 facing the heat dissipation upper cover 31 is provided with a recess capable of accommodating a portion of the speaker magnetic circuit structure 311. At this time, one side of the speaker magnetic circuit structure 311 can be attached to the speaker. The bracket 32 faces in a recess formed in a side that dissipates the upper cover 31. Thereby, the diaphragm 3121 and the speaker magnetic circuit structure 311 are fixed between the speaker holder 32 and the heat dissipation upper cover 31.

In one embodiment of the present application, the heat dissipation upper cover 33 is provided with a second receiving hole 332 corresponding to the terminal plate 34, and the terminal plate 34 is received in the second receiving hole 332. Referring to FIG. 1 , in the prior art, the terminal boards 15 are stacked on the speaker bracket 13 , so that a part of the space of the speaker bracket 13 is occupied first, thereby further reducing the back leakage area of the sound, increasing the acoustic resistance, and reducing the sound conversion. Secondly, the stacking arrangement of the terminal strips 15 increases the height space occupied by the speaker assembly to some extent; again, the terminal strips 15 are stacked on the speaker holder 13 so that the connection between the terminal strips 15 and the voice coil 14 is The voice coil wire is suspended so that when the voice coil 14 vibrates, the terminal plate 15 is pulled through the voice coil wire, which is disadvantageous to the stability of the overall structure of the speaker assembly. In the present embodiment, referring to FIG. 3 , the terminal plate 34 is disposed in the second receiving hole 332 on one side of the heat dissipation upper cover 31 , and the position of the speaker bracket 32 is not occupied first, so that the prior art can be compared with the prior art. Increasing the back leakage area of the sound, reducing the acoustic resistance; secondly, since the terminal plate 34 is disposed at the side of the heat dissipation upper cover 31, the vertical height of the speaker assembly is not increased, thereby making the speaker assembly lighter and thinner; Since the terminal plate 34 is disposed at a position on the side of the heat dissipation upper cover 31, the voice coil wire 3123 between the connection terminal plate 34 and the voice coil 3122 can be attached to the diaphragm to form a support, thereby reducing the voice coil wire 3123 and the terminal plate 34. Pulling between them improves the stability of the speaker assembly.

Of course, the terminal board 34 is not limited to be disposed on the heat dissipation upper cover 31. For example, referring to FIG. 5, the speaker bracket 32 is provided with a third receiving hole 324 corresponding to the terminal board 34, and the terminal board 34 is accommodated in the third receiving position. Inside the hole 324. At this time, the thickness of the speaker and the back leak area of the diaphragm 3121 are not affected.

In addition, it should be noted that, referring to FIG. 2, in the prior art, the speaker assembly is further provided with a gasket and a ring 13 on the speaker bracket 13 correspondingly provided with the surrounding gasket 16. In the prior art, the diaphragm 11 is sandwiched between the gasket 16 and the collar 131 of the speaker holder 13 to fix the edge of the diaphragm 11 to the speaker holder 13. Continuing to refer to FIG. 3 and FIG. 4, the gasket and the retaining ring are omitted in the present application, so that the edge of the diaphragm 3121 and the edge of the speaker bracket 32 are directly disposed together, for example, bonded together, in this way, on the one hand, Further reducing the thickness of the speaker assembly, in particular, according to the current size of the components in the law enforcement recorder on the market, and the current equivalent sound quality, the speaker assembly of the present application can be reduced by 1.5 mm, wherein the circumference ring is reduced by 0.7 mm. The gasket is thinned by 0.8 mm; on the other hand, since the diaphragm 3121 and the speaker holder 32 are directly bonded together, the reliability of the speaker assembly can be improved to some extent.

In addition, it should be further pointed out that, since the sound radiation direction of the speaker assembly in the present application is changed from the original vertical direction to the lateral side radiation, the space utilization rate is improved, and the same sound quality is required, the height of the electronic device of 1 mm can be further reduced. That is to say, the electronic device as a whole can be lowered by a height of 2.5 mm.

Please refer to FIG. 7. FIG. 7 is a schematic structural diagram of an embodiment of an electronic device according to the present application. The electronic device of the present application includes the speaker assembly in the speaker assembly embodiment of the present application.

The electronic device in the embodiment may be a law enforcement recorder, a walkie-talkie, a mobile phone (such as a three-proof mobile phone), a tablet computer, an Mp3, etc., and the speaker component in the law enforcement recorder is the same as in the above embodiment, for details, please refer to the above. Implementation manners are not described here.

Let's take the law enforcement recorder as an example to test the acoustic performance and heat dissipation performance.

1. The law enforcement recorders in the present application and the prior art are respectively placed in a semi-anechoic chamber for testing, the test conditions are: temperature: 15 ° C to 35 ° C; relative humidity: 20% to 75%. For specific test results, please refer to FIG. 8, FIG. 9, and FIG. 10, respectively. FIG. 8, FIG. 9, and FIG. 10 are comparison diagrams of frequency response curves and distortion curves of the speaker assembly of the present application and the speaker assembly of the prior art, respectively. Comparison with the impedance curve. Wherein, the dotted line corresponds to the speaker assembly in the present application, achieving a speaker assembly corresponding to the prior art.

As can be seen from the above graph, the speaker assembly of the present application has a low frequency response value of 2.5 dB as compared with the prior art, and F0 also sinks 100 Hz, and the sound is larger and thicker. Therefore, the speaker assembly of the present application can improve the uniformity of the airflow, reduce the acoustic resistance, and improve the utilization of the sound chamber in the speaker assembly, thereby enabling the speaker assembly to achieve a better low frequency effect while the volume is large.

2. Perform heat dissipation performance tests on the law enforcement recorder in the present application and the law enforcement recorder in the prior art.

(1) Perform simulation tests on the law enforcement recorder in this application and the law enforcement recorder in the prior art. For the specific test results, please refer to Figure 11 (the original picture is a color picture) and Figure 12 (the original picture is a color picture). .

(2) Further confirm the surface temperature distribution of the product by infrared temperature scanning, set the temperature test points and the test results as shown in Table 1 below.

Table 1

As can be seen from FIG. 11, FIG. 12 and the above Table 1, the temperature of each component of the law enforcement recorder in the present application is significantly lower during the simulation test. The temperature of the surface of the product is lowered by about 1 to 3 ° C, and the internal chip is lowered by about 2 to 6 ° C.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformation made by the specification and the drawings of the present invention may be directly or indirectly applied to other related technical fields. The same is included in the scope of patent protection of the present invention.

Claims

A speaker assembly for an electronic device, characterized in that the speaker assembly comprises:

a speaker excitation system comprising a speaker magnetic circuit structure, a speaker vibration structure, the speaker vibration structure comprising a diaphragm, the speaker magnetic circuit structure for receiving an audio signal, and driving the speaker vibration structure vibration according to the audio signal, and Further driving the diaphragm to generate vibration;

a speaker bracket disposed on a side of the speaker magnetic circuit structure facing away from the speaker vibration structure for fixing the speaker excitation system, the speaker bracket including a top surface and a side surface, wherein the top surface faces away from the speaker The excitation system is disposed through the top surface and the side surface with a through hole corresponding to the position of the diaphragm, so that sound emitted by the diaphragm vibration can be radiated to the periphery of the speaker bracket through the through hole .
The speaker assembly according to claim 1, wherein said speaker assembly further comprises a heat dissipating upper cover, said heat dissipating upper cover being disposed on a side of said speaker excitation system facing away from said speaker holder, and said speaker The brackets are coupled such that the speaker bracket can conduct heat through the heat dissipation cover.
A speaker assembly according to claim 2, wherein

The heat dissipation upper cover is provided with a first receiving hole corresponding to the diaphragm, and an edge connection of the diaphragm is disposed on an edge of the first receiving hole;

An edge of the first receiving hole is recessed in a direction away from the speaker holder to form a step, and an edge of the diaphragm is connected to a stepped edge of the first receiving hole, and the speaker bracket is The edge is at least partially received in the stepped edge to fasten the heat dissipation cover such that the speaker excitation system is received between the speaker bracket and the heat dissipation cover.
A speaker assembly according to claim 2, wherein

The heat dissipation cover is a heat sink of the electronic device, and the speaker bracket is coupled to the heat sink to cause the speaker assembly to dissipate heat through the heat sink of the electronic device.
A speaker assembly according to claim 2, wherein

The heat dissipation cover is made of a metal material, or the heat dissipation cover is a printed circuit board of the electronic device.
The speaker assembly according to claim 2, wherein the speaker magnetic circuit structure comprises: an upper plate and a magnetic steel, and the speaker vibration structure further comprises a voice coil and a voice coil;

The speaker assembly further includes a terminal board for fixing the voice coil and receiving the audio signal, and transmitting the audio signal to the speaker excitation system for further conversion into sound;

Wherein, the side of the voice coil facing away from the speaker bracket is connected to the diaphragm, and the upper plate and the magnetic steel are sequentially disposed on a side of the voice coil close to the speaker bracket, the voice coil One end of the wire is connected to the voice coil, and the other end is connected to the terminal block, so that the voice coil receives the audio signal transmitted by the terminal board through the voice coil wire.
A speaker assembly according to claim 6 wherein:

The heat dissipation upper cover is provided with a second receiving hole corresponding to the terminal plate, and the terminal plate is received in the second receiving hole.
A speaker assembly according to claim 6 wherein:

The speaker bracket is disposed with a third receiving hole corresponding to the terminal board, and the terminal board is received in the third receiving hole.
A speaker assembly according to claim 1 wherein:

The speaker bracket is made of metal, or the speaker bracket is a printed circuit board of the electronic device or a housing of the electronic device.
An electronic device, comprising the speaker assembly of claim 1.