WO2019141855A1 - Procédé de rectification et/ou de polissage d'un point de défaut ainsi que dispositif pour mettre en œuvre le procédé - Google Patents

Procédé de rectification et/ou de polissage d'un point de défaut ainsi que dispositif pour mettre en œuvre le procédé Download PDF

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Publication number
WO2019141855A1
WO2019141855A1 PCT/EP2019/051417 EP2019051417W WO2019141855A1 WO 2019141855 A1 WO2019141855 A1 WO 2019141855A1 EP 2019051417 W EP2019051417 W EP 2019051417W WO 2019141855 A1 WO2019141855 A1 WO 2019141855A1
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
polishing
defect
path
along
Prior art date
Application number
PCT/EP2019/051417
Other languages
German (de)
English (en)
Inventor
Werner Unnerstall
Christian Wall
Christian BURSTEIN
Stephan Kampmeyer
Original Assignee
Rud. Starcke Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rud. Starcke Gmbh & Co. Kg filed Critical Rud. Starcke Gmbh & Co. Kg
Priority to US16/963,565 priority Critical patent/US20210053185A1/en
Priority to BR112020010657-7A priority patent/BR112020010657A2/pt
Priority to CN201980007038.2A priority patent/CN111601680B/zh
Priority to KR1020207018776A priority patent/KR20200107947A/ko
Priority to RU2020116724A priority patent/RU2781551C2/ru
Priority to MX2020007387A priority patent/MX2020007387A/es
Priority to CA3084115A priority patent/CA3084115A1/fr
Priority to EP19701341.0A priority patent/EP3703905B1/fr
Priority to JP2020540402A priority patent/JP2021510639A/ja
Publication of WO2019141855A1 publication Critical patent/WO2019141855A1/fr
Priority to ZA2020/02988A priority patent/ZA202002988B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/26—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding workpieces with arcuate surfaces, e.g. parts of car bodies, bumpers or magnetic recording heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0038—Other grinding machines or devices with the grinding tool mounted at the end of a set of bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface

Definitions

  • the invention relates to a method for grinding and / or polishing a defect in the surface coating of a workpiece according to the preamble of claim 1 and a device for carrying out the proceedings procedural.
  • the contact pressure and the grinding or polishing movement are decisive for the machining result.
  • the contact pressure results in the processing of a horizontal surface of the mass of the grinding tool and the additional Lich manually applied force to the surface.
  • the invention has for its object to further develop a method of the generic type so that the grinding or polishing result is optimized, with simultaneous reproducibility.
  • the mass of the grinding tool is compensated insofar as it has no influence on the result.
  • the grinding movement of the grinding tool and its movement type, i. the orbital, rotary and / or vibratory movements are coordinated and stored in a computer to be executed grinding and polishing track in a computer.
  • the grinding or polishing disc is first performed along a con centric to the faulty inner slideway and then ent uninterrupted ent long led a spiral-shaped slideway in an outer concentric slideway.
  • the grinding or polishing wheel is tilted during the circular grinding movement with respect to the perpendicular to the defect by a predetermined angle inwards and defines a cone angle.
  • This Ke gelwinkel amplifies the grinding performance in the center of the circular path, so that the defect is targeted, easier and faster processed and creates a smooth transition to the edge of the grinding point.
  • the radius of the outer concentric grinding path is not greater than half the diameter of the grinding plate or the grinding or polishing wheel.
  • An apparatus of the method according to the invention is designed such that a grinding or polishing tool is formed as robot connected to a computer Ro, which has a fixed to an arm, orbital, rotating and / or vibrating movable support plate for holding a grinding or polishing pad, wherein the arm is computer-controlled movable.
  • Fig. 3 to 5 the movement of the polishing according to the invention, also in a schematic view, respectively.
  • the grinding movement and the movement type of a grinding tool are stored as an automatic grinding path in the computer as a work program.
  • the center point of the grinding wheel or of the support plate is aligned with the defect 1 to be ground, with the grinding path starting in an inner circle 2.
  • the center of the grinding wheel is tilted inwardly with respect to the perpendicular to the defect 1 by a predetermined angle, under at setting a cone angle.
  • the grinding tool and the workpiece to be machined are usually oriented orthogonal to each other.
  • the grinding wheel can be guided one or more times along the grinding path 2.
  • the grinding wheel is guided in a concentric grinding track 4 and although without employment of the grinding wheel in a cone angle, whereby the grinding transitions smoothed and a flat Endresul is achieved.
  • the sanding track 4 can also be sanded one or more times.
  • the distance between the defect 1, the grinding path 2 and the grinding path 4 is dependent on the size of the defect 1 and its expression as well as the diameter D of the grinding wheel.
  • the spiral track 3 can be different lengths depending on the extent of the defect.
  • the radii of the grinding tracks 2 and 4 must always be smaller than half the diameter D of the grinding disc or grinding wheel, whereby in particular special by the inner circular path 2, the faulty point of the workpiece to be machined undergoes a more intensive continuous processing and thereby the in Figure 2 represented so-called effective grinding surface F1 is ent.
  • the distance between the radii R1, R2 of the sliding tracks 2 and 4 can be adjusted accordingly depending on the defect to be processed.
  • the distance between the inner grinding path 2 and the outer grinding path 4 is chosen to be as small as possible to effectively handle defects in areas such as along edges of a body of a motor vehicle ent long the fat edges of the body modules and in tight radii of the body ,
  • the sliding tracks 2 and 4 are assigned grinding times, as well as to pressure forces of the grinding tool and speeds or stroke rates. In doing so, they always have the same shape and form in a shorter time than previously produced grinding points, so they are reproducible.
  • the cone angle is continuously reduced to 0 to start the grinding path 3 in a previously defined route.
  • Another advantage of the method according to the invention is that the shape of the abrasive can be made smaller on a support, whereby the abrasive requirement is significantly reduced, as well as the not agile energy needs.
  • a computer-aided statistical evaluation between a number of errors and the consumption of abrasives serves as the basis for a continuous improvement process.
  • FIGs 3-5 the sequence of movement of a Polierwerkzeu ges is shown schematically in an automated polishing.
  • the polishing movement and the movement of the polishing tool are also computer controlled, the corresponding parameters are stored in a computer.
  • the center of the polishing head is exactly aligned with the defect 1.
  • polishing contours for example, the surface of affyka rosette, the polishing tool and the surface are orthogonal to each other out.
  • a first polishing sheet 5 is shown, which starts at the defect 1 be and extends spirally outward.
  • the contact pressure is regulated in stages, where the adjustment takes place as a function of the track length.
  • the control of the contact pressure for example, is supported by corresponding pressure sensors in the robot.
  • the movement commences according to the Po lierbahn 5 with a contact pressure P1, which is reduced along the polishing path 5 to the outside Shen.
  • the contact pressure is reduced wei ter to smooth the polishing transition.
  • the contact pressure is reduced in order to prevent heating of the usually formed as a polishing sponge polishing pad.
  • the polishing times along the polishing tracks 5, 6 as well as the pressing pressures and the respective rotational or stroke numbers of the polishing tool are stored in a corresponding program of the computer.
  • the Po lierzeit is adapted to the size of the grinding point.
  • the polishing points are to produce by the inventive method in a much shorter rer time and, moreover, always the same expression and Shape, so are reproducible. As a result, the polish can be noticeably reduced, as well as the energy requirements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

L'invention concerne un procédé de rectification et/ou de polissage d'un point de défaut (1) dans le revêtement de surface d'une pièce. Un disque de rectification ou de polissage, maintenu au niveau d'un outil et effectuant des mouvements orbitaux, rotatifs et/ou vibratoires, est guidé avec une pression au-dessus du point de défaut (1). Le procédé est conçu de telle sorte que l'outil équipé du disque de rectification ou de polissage (7) est déplacé au-dessus du point de défaut (1) automatiquement et commandé par ordinateur à l'aide d'un programme enregistré. Le disque de rectification ou de polissage (7) est tout d'abord guidé le long d'une trajectoire de rectification intérieure (2) concentrique par rapport au point de défaut (1) et ensuite guidé sans interruption le long d'une trajectoire de rectification en forme de spirale (3) dans une trajectoire de rectification concentrique extérieure (4).
PCT/EP2019/051417 2018-01-22 2019-01-22 Procédé de rectification et/ou de polissage d'un point de défaut ainsi que dispositif pour mettre en œuvre le procédé WO2019141855A1 (fr)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US16/963,565 US20210053185A1 (en) 2018-01-22 2019-01-22 Method for grinding and/or polishing a defect and device for carrying out the method
BR112020010657-7A BR112020010657A2 (pt) 2018-01-22 2019-01-22 método para esmerilhar e/ou polir um defeito e dispositivo para executar o método
CN201980007038.2A CN111601680B (zh) 2018-01-22 2019-01-22 用于磨削和/或抛光缺陷的方法及用于执行该方法的装置
KR1020207018776A KR20200107947A (ko) 2018-01-22 2019-01-22 결함을 그라인딩 및/또는 폴리싱하는 방법 및 방법을 수행하는 장치
RU2020116724A RU2781551C2 (ru) 2018-01-22 2019-01-22 Способ шлифования и/или полирования дефекта и устройство для осуществления такого способа
MX2020007387A MX2020007387A (es) 2018-01-22 2019-01-22 Metodo para rectificar y/o pulir un defecto y dispositivo para llevar a cabo el metodo.
CA3084115A CA3084115A1 (fr) 2018-01-22 2019-01-22 Procede de rectification et/ou de polissage d'un point de defaut ainsi que dispositif pour mettre en ƒuvre le procede
EP19701341.0A EP3703905B1 (fr) 2018-01-22 2019-01-22 Procédé de rectification et/ou de polissage d'un point de défaut ainsi que dispositif pour mettre en uvre le procédé
JP2020540402A JP2021510639A (ja) 2018-01-22 2019-01-22 欠陥箇所を研削および／または研磨するための方法ならびにこの方法を実施するための装置
ZA2020/02988A ZA202002988B (en) 2018-01-22 2020-05-21 Method for grinding and/or polishing a defect and device for carrying out the method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018101293.4A DE102018101293A1 (de) 2018-01-22 2018-01-22 Verfahren zum Schleifen und/oder Polieren einer Fehlstelle sowie Vorrichtung zur Durchführung des Verfahrens
DE102018101293.4 2018-01-22

Publications (1)

Publication Number Publication Date
WO2019141855A1 true WO2019141855A1 (fr) 2019-07-25

Family

ID=65199424

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/051417 WO2019141855A1 (fr) 2018-01-22 2019-01-22 Procédé de rectification et/ou de polissage d'un point de défaut ainsi que dispositif pour mettre en œuvre le procédé

Country Status (11)

Country Link
US (1) US20210053185A1 (fr)
EP (1) EP3703905B1 (fr)
JP (1) JP2021510639A (fr)
KR (1) KR20200107947A (fr)
CN (1) CN111601680B (fr)
BR (1) BR112020010657A2 (fr)
CA (1) CA3084115A1 (fr)
DE (1) DE102018101293A1 (fr)
MX (1) MX2020007387A (fr)
WO (1) WO2019141855A1 (fr)
ZA (1) ZA202002988B (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3014997A1 (de) * 1979-04-27 1980-11-06 Diesel Kiki Co Schleifvorrichtung
CN101898325B (zh) * 2010-07-28 2012-05-30 中国人民解放军国防科学技术大学 光学元件表面的修形加工方法及用于该方法的数控机床
US20120220194A1 (en) * 2011-02-24 2012-08-30 Apple Inc. Smart automation of robotic surface finishing

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4128968A (en) * 1976-09-22 1978-12-12 The Perkin-Elmer Corporation Optical surface polisher
DE19532424C2 (de) * 1995-09-01 1998-01-29 Jenoptik Jena Gmbh Gerät zum örtlichen Schleifen oder Polieren von Oberflächen
SE510932C2 (sv) * 1997-02-17 1999-07-12 Volvo Ab Användning av en anordning för reproducerbar ytbearbetning av en provyta i samband med utveckling av lacker, lackerade detaljer eller poleringsutrustning för bilindustrin
DE102009039093A1 (de) * 2009-08-27 2011-03-03 Bayerische Motoren Werke Aktiengesellschaft Verfahren und System zum automatischen Schleifen und Polieren von lackierten Teilen
WO2012049074A1 (fr) * 2010-10-13 2012-04-19 Mbda Uk Limited Procédé et appareil pour positionnement de pièce à usiner
TWI532565B (zh) * 2011-03-21 2016-05-11 智勝科技股份有限公司 研磨方法以及研磨系統
CN102873628B (zh) * 2012-09-26 2015-02-18 清华大学 一种用于数控小工具抛光的螺旋线式加工路径的生成方法
US9056383B2 (en) * 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
DE102015115313B4 (de) * 2015-09-10 2017-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schleifwerkzeug und dessen Verwendung zur computergesteuerten Nachbearbeitung gefräster Freiformflächen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3014997A1 (de) * 1979-04-27 1980-11-06 Diesel Kiki Co Schleifvorrichtung
CN101898325B (zh) * 2010-07-28 2012-05-30 中国人民解放军国防科学技术大学 光学元件表面的修形加工方法及用于该方法的数控机床
US20120220194A1 (en) * 2011-02-24 2012-08-30 Apple Inc. Smart automation of robotic surface finishing

Also Published As

Publication number Publication date
JP2021510639A (ja) 2021-04-30
ZA202002988B (en) 2021-09-29
US20210053185A1 (en) 2021-02-25
EP3703905A1 (fr) 2020-09-09
EP3703905B1 (fr) 2024-03-20
CN111601680A (zh) 2020-08-28
DE102018101293A1 (de) 2019-07-25
CN111601680B (zh) 2022-07-08
MX2020007387A (es) 2020-09-03
RU2020116724A (ru) 2022-02-24
BR112020010657A2 (pt) 2020-11-10
CA3084115A1 (fr) 2019-07-25
KR20200107947A (ko) 2020-09-16

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