WO2019139219A1 - Cooling device and method for manufacturing cooling device - Google Patents

Cooling device and method for manufacturing cooling device Download PDF

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Publication number
WO2019139219A1
WO2019139219A1 PCT/KR2018/011836 KR2018011836W WO2019139219A1 WO 2019139219 A1 WO2019139219 A1 WO 2019139219A1 KR 2018011836 W KR2018011836 W KR 2018011836W WO 2019139219 A1 WO2019139219 A1 WO 2019139219A1
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WO
WIPO (PCT)
Prior art keywords
wick
cover
working fluid
cooling device
base
Prior art date
Application number
PCT/KR2018/011836
Other languages
French (fr)
Korean (ko)
Inventor
여지원
오동훈
이성제
Original Assignee
한온시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한온시스템 주식회사 filed Critical 한온시스템 주식회사
Priority to CN201880028774.1A priority Critical patent/CN110574505A/en
Publication of WO2019139219A1 publication Critical patent/WO2019139219A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present invention relates to a cooling device and a manufacturing method of the cooling device, and more particularly, to a local heating cooling device for an automobile for cooling a local heat of a sensor, a controller,
  • the hybrid, electric, and autonomous vehicles described above are essentially equipped with electronic devices for driving and motor control of an automobile.
  • electronic devices for driving and motor control of an automobile.
  • a GPS signal receiving device for identifying the position of the autonomous traveling vehicle
  • various radars for monitoring objects around the autonomous traveling vehicle
  • a communication device for interacting with communication facilities including other autonomous traveling vehicles
  • various electronic equipments as well as a plurality of electronic elements, and thus a separate cooling means is necessarily required.
  • the cooling means for cooling the electronic device as described above there is a heat sink.
  • the heat sink absorbs and dissipates heat through contact with the heat generating part, but it is not suitable for an autonomous vehicle because the volume of the heat sink is increased to increase the heat capacity of the heat sink.
  • a radar-like detection device must be installed outside the autonomous vehicle. In summer when exposed to high-temperature solar heat and geothermal, the temperature of the detection device installed outside the automobile rises to about 100 degrees centigrade There is a problem that the above-mentioned electronic device can not be sufficiently cooled by the heat sink method in which heat is transmitted through the thermal contact and the heat is cooled through the surrounding air.
  • Prior Art 1 Korean Patent Registration No. 10-045268 (hereinafter referred to as Prior Art 1) discloses technology related thereto.
  • FIG. 1 schematically shows a cooling apparatus using the phase-change heat transfer system shown in the prior art 1.
  • FIG. 1 schematically shows a cooling apparatus using the phase-change heat transfer system shown in the prior art 1.
  • the cooling apparatus using the phase change heat transfer system of the prior art 1 includes a housing 20, a wick 30, a steam passage 31, and a fan 40. As shown in FIG.
  • a heat source 10 is in contact with a surface of the housing 20, and the heat generated by the heat source 10 is transmitted to the inside of the housing 20.
  • the wick 30 installed inside the housing 20 has a capillary structure and forms a steam flow path 31 by forming a protruding portion or a supporting portion downward.
  • a working fluid is inserted into the steam passage 31 and the working fluid is boiled by the heat transferred from the heat source 10 to the inside of the housing 20 to move upward in the vaporized state.
  • the working fluid in the vaporized state moved to the upper portion of the steam flow path 31 is cooled / condensed again by the air supplied by the fan 40 on the other side of the housing 20 and is liquefied again.
  • the liquefied working fluid flows through the wick 31 And flows back to the lower side by the capillary pressure. That is, the working fluid repeats the boiling at the lower portion of the housing 20 where the heat source 10 is located and the condensation at the upper portion, thereby transferring and cooling the heat generated in the heat source by the state change.
  • the wick 30 of the prior art 1 is manufactured by sintering a metal powder.
  • a metal powder is sintered to manufacture a rectangular wick, 30, it is necessary to process the manufacturing cost, so that the manufacturing cost is increased and when it is used in the vertical direction, the gravity is stronger than the capillary pressure, so that the working fluid can be buried in the lower part of the housing.
  • a cooling apparatus includes a base part 100 including at least one protruding member 110 formed on an upper surface thereof and receiving heat from a heat source, A wick 200 covering the upper part of the base part 100 to form a flow path 111 in which the working fluid is boiled and condensed so as to abut the upper end of the base part 100, And cooling means for cooling the working fluid vaporized and vaporized in the flow path 111.
  • the protruding member 110 protrudes upward from the upper surface of the base unit 100 and extends to one side along the upper surface of the base unit 100.
  • a plurality of the protruding members 110 are arranged on the upper surface of the base unit 100 at a predetermined interval in parallel.
  • a plurality of the protruding members 110 are arranged on the upper surface of the base part 100 at a predetermined interval and are arranged in two dimensions.
  • the base 100 includes a partition frame 120 formed on an upper surface thereof and separating the upper surface of the protrusion member 110 from the upper surface of the base member 100 and an insertion portion 310 protruding from the lower surface of the cover 300, (121).
  • partition frame 120 is formed so as to surround the protruding member 110.
  • the base portion 100 further includes an outer frame 130 formed on the outer surface of the upper surface and the insertion portion 121 is formed between the outer frame 130 and the partition frame 120 .
  • the upper end of the wick 200 is in close contact with the lower surface of the cover 300.
  • a gas space 210 is formed between the cover 300 and the wick 200, in which a vaporized working fluid is located.
  • the cover 300 is spaced apart from the upper end of the wick 200 by a predetermined distance.
  • the wick 200 may include a fluid passage 220 formed to connect the flow path 111 and the gas space 210.
  • the wick 200 includes an alignment assisting portion 201 that protrudes from a bottom surface of the wick 200 and is inserted between the adjacent protruding members 110.
  • the alignment assisting portion 201 may have a protruding side surface formed as an oblique surface.
  • the space between the base 100 and the cover 300 is vacuum.
  • the cover 300 may further include a heat sink 400 formed on the outer surface of the cover 300.
  • the cooling means is characterized in that the vaporized working fluid is supplied, cooled, condensed and liquefied, and the liquefied working fluid is supplied to the flow path (111).
  • cooling means supplies refrigerant to the outer surface of the cover (300).
  • a method of manufacturing a cooling device includes a first step of inserting a filler material or a filler material layer on a bonding surface of the base part 100 and the cover 300, A second step of disposing the wick 200 and inserting the fitting portion 310 formed on the lower surface of the cover 300 into the insertion portion 121 formed in the base portion 100 to form an assembly, And a fourth step of brazing the flux-applied assembly.
  • the apparatus since the flow path of the working fluid can be formed without any additional processing on the wick, the apparatus can be simplified, easy to manufacture, There is an effect that can be.
  • wicks are disposed on the upper ends of the protruding members, and a flow passage in which the working fluid is positioned is located on the side of the protruding member. So that boiling of the working fluid is promoted in the vicinity of the projecting member.
  • the wick is used to separate the flow path and the gas space, and the working fluid can be separated in each of the flow path and the gas space by the states of the liquid and the gas, the heat transfer efficiency is improved.
  • a single cooling device not only a single cooling device but also a base, a wick, and a cover can be used as a single evaporator and a plurality of evaporators can be connected to a single cooling device, It is possible to reduce the volume of the apparatus, and in particular, it is necessary to cool a plurality of heat sources such as autonomous vehicles, but it is useful for apparatuses with a large volume limitation.
  • the base portion, the wick and the cover having a simple structure can be manufactured by assembling and brazing, it is easy to manufacture.
  • FIG. 1 is a sectional view of a cooling device using a conventional phase change heat transfer method.
  • FIG. 2 is an exploded perspective view of a cooling device according to a first embodiment of the present invention
  • FIG. 3 is an exploded cross-sectional view of a cooling device according to a first embodiment of the present invention.
  • FIG. 4 is an assembled sectional view of a cooling device according to a first embodiment of the present invention.
  • FIG. 5 is a perspective view of a cooling apparatus according to a first embodiment of the present invention in a state where a heat sink and a cooling means are installed.
  • FIG. 6 is a perspective view of another embodiment of the projecting member of the present invention.
  • FIG. 7 is a sectional view of a cooling device according to a second embodiment of the present invention.
  • FIG 8 is a sectional view of a cooling device according to a third embodiment of the present invention.
  • FIG. 9 is a schematic view of a cooling apparatus according to a fourth embodiment of the present invention.
  • FIG. 10 is a schematic view of a cooling apparatus according to a fourth embodiment of the present invention applied to a vehicle.
  • FIG. 2 is an exploded perspective view of the cooling device according to the first embodiment of the present invention
  • FIG. 3 is an exploded sectional view of the cooling device according to the first embodiment of the present invention
  • FIG. 4 is a cross-sectional view showing a state where the cooling device according to the first embodiment of the present invention shown in FIG. 2 and FIG. 3 is engaged.
  • the cooling apparatus may include a base unit 100, a wick 200, and a cover 300.
  • the base portion 100 together with the cover 300 forms the appearance of the cooling device according to various embodiments of the present invention.
  • a plurality of protruding members 110 may be formed in a predetermined space on the upper surface of the base 100. As shown in FIG. 2, a plurality of protruding members 110 protrude upward from the upper surface of the base unit 100, and protrude upward from the upper surface of the base unit 100
  • the protruding member 110 of the present invention is not limited thereto but may be formed in various shapes to form a flow path of the working fluid.
  • a plurality of bar-shaped protruding members 110 may be disposed on the upper surface of the base 100 at a predetermined distance.
  • the flow path 111 is a space surrounded by the protruding member 110 and the base portion 100, and a working fluid can be injected into the portion, and the working fluid can be in a liquid state at the time of injection.
  • the working fluid is a medium for transferring heat in the present invention.
  • the working fluid When the heat is transferred from the heat source, the working fluid is boiled in the flow path 111 and vaporized, or condensed / cooled in a gaseous state to transfer heat while being liquefied.
  • an embodiment of the present invention may further include cooling means for supplying the cooling fluid to a portion where the working fluid in the gaseous state is located.
  • the working fluid can be easily boiled by reducing the boiling point of the refrigerant used as the working fluid by lowering the pressure of the space formed by the refrigerant flow path 300 to be lower than the atmospheric pressure of 1 atmospheric pressure.
  • the base portion 100 may further include a partition frame 120, an outer frame 130, and an insertion portion 121.
  • the partition frame 120 is formed to surround the plurality of protruding members 110.
  • the upper end of the partition frame 120 is higher than the upper end of the protruding member 110 in order to dispose the wick 200 to be described later in an inner space defined by the partition frame 120,
  • the outer frame 130 is located outside the dividing frame 120, and the insertion portion 121 is formed between the dividing frame 120 and the outer frame 130 .
  • the insertion portion 121 is a portion in which a fitting portion 310 which is a part of a cover 300 to be described later is inserted.
  • One side of the insertion portion 121 shown in FIG. 3 is divided into a compartment frame 120 and an outer frame 130, Lt; / RTI >
  • the reason for forming the insertion portion 121 between the partition frame 120 and the outer frame 130 is that when the various embodiments of the present invention are manufactured by the brazing method, the brazing flux to be sprayed is applied to the base portion 100 To the inner space defined by the partition frame 120 formed on the upper surface of the partition wall 120.
  • the wick 200 is covered with the base portion 100 so that one side abuts the upper end of the protruding member 110 and the working fluid flow path surrounded by the upper surface of the base portion 100, the protruding member 110 and the wick 200 110).
  • the wick 200 has a structure in which a capillary tube is formed by sintering a metal powder.
  • the liquid working fluid seeps into a capillary tube formed in the wick 200 by capillary pressure. That is, when the vaporized working fluid is cooled / condensed and liquefied, the liquefied working fluid seeps into the capillary of the wick 200, spreads evenly to the wick 200 by the capillary pressure, and then moves downward.
  • the metal powder forming the wick 200 may be formed of various materials, but in the first embodiment of the present invention, the wick 200 can be formed by sintering Ni powder that is easy to apply to a vehicle.
  • the wick 200 is plate-shaped, but the present invention is not limited to this, and the wick 200 may have various shapes.
  • the cover 300 covers the upper portion of the base portion 100 to complete the first embodiment of the present invention. Since the base part 100 and the cover 300 are easily exchanged with each other and the inner space must be maintained in a vacuum state, the base part 100 and the cover 300 can have high thermal conductivity, Or may have a structure capable of having the strength.
  • the first embodiment of the present invention is characterized in that the protrusion member 110 is formed on the base part 100 that is easier to process than the wick 200 and the wick 200 is covered on the upper part of the protrusion member 110 Since the flow path 111 for the working fluid is formed in the wick 200, it is not necessary to separately process the wick 200, so that it is easy to manufacture the cooling device, thereby reducing the manufacturing cost.
  • FIG. 5 shows a heat sink 400 and a cooling means provided on the upper part of the cooling device according to the first embodiment of the present invention shown in FIG. 2.
  • the cooling device according to the embodiment may be a fan 500 installed on the top of the heat sink 400.
  • the heat sink 400 shown in FIG. 5 may be composed of a plurality of heat sinks.
  • the heat sink 400 increases the cooling efficiency by widening the contact area with the cooling fluid.
  • the heat sink 400 may transmit heat from the inside of the cover 300, Take heat exchange with air used as cooling fluid.
  • the fan 500 is an example of cooling means for cooling the heat sink 400 by supplying a cooling fluid, that is, air to the heat sink 400.
  • the fan 500 is installed at the top of the heat sink 4000, The position where the fan 500 is installed is not limited to the upper portion of the heat sink 400 and the cooling fluid may be supplied using various methods, The vaporized working fluid can be cooled in various ways.
  • the fan 500 is coupled to the hollow bracket 510 at a central portion thereof and the bracket 510 is coupled to the side surface of the base portion 100 and installed at the upper portion of the heat sink 400.
  • the fan 500 is not always used as an example of the heat sink 400 and the cooling means, and the fan 500 can be used individually as an example of the heat sink 400 or the cooling means.
  • the protrusion member 110 formed on the base 100 may have a shape other than the bar shape shown in FIG.
  • FIG. 6 shows only the base part 100 having a shape different from that of the projecting part 110.
  • the protruding member 110 may have a square pin shape instead of a bar shape.
  • the rectangular pin-shaped protruding member 110 has an effect of increasing the degree of freedom when bubbles are generated / removed from the working fluid than the bar-shaped protruding member 110.
  • the rectangular pin- And can be arranged two-dimensionally on the upper surface of the base portion 100.
  • the cooling apparatus according to the second embodiment of the present invention differs from the cooling apparatus according to the first embodiment in the shape of the cover. Therefore, the second embodiment of the present invention will be described in detail with respect to the cover different from that of the first embodiment, and the configuration thus changed, and the configuration not described is regarded as the same as the first embodiment.
  • FIG. 7 is a cross-sectional view of a cooling apparatus according to a second embodiment of the present invention.
  • the cooling apparatus includes a gas space 210 formed between the cover 300 and the wick 200.
  • the gas space 210 is a portion in which the working fluid vaporized in the flow path 111 is located and the vaporized working fluid is located in the gas space 210 and the liquefied working fluid is located in the flow path 111. That is, the wick 200 separates the vaporized working fluid from the liquefied working fluid by partitioning the inner space formed by the base portion 100 and the cover 300.
  • the heat sink 400 or the fan 500 shown in FIG. 5 may be installed on the upper part of the gas space 210 to condense / cool the vaporized working fluid located in the gas space 210.
  • the working fluid changed from the liquid to the gaseous state in the flow path 111 by the heat transferred from the heat source can move through the wick 200 and into the gas space 210.
  • the fluid passage 220 may be formed in the wick 200 as shown in FIG. 7, so that the working fluid changed into the gaseous state easily moves from the flow passage 111 to the gas space 210.
  • the working fluid in the gaseous state through the fluid passage 220 can move in the A arrow direction. Since the fluid passage 220 can be formed in such a size that only the working fluid in the gaseous state can pass therethrough and the size of the surrounding capillary pores is smaller even if water seeps into the fluid passage 220 separately, And is absorbed into the surrounding capillary.
  • the cooling device according to the second embodiment of the present invention can increase the volume in the vertical direction by forming the gas space 210, compared with the first embodiment, The working fluid in the state of being separated from each other through the wick 200 to perform heat transfer and heat exchange. Therefore, the performance is improved as compared with the first embodiment of the present invention, the conventional cooling device or the heat transfer device.
  • the third embodiment of the present invention is different from the second embodiment in the shape of the wick and the remaining components are the same, so the shape of the wick that has been changed will be mainly described.
  • FIG. 8 shows a cross section of a third embodiment of the present invention.
  • the wick 200 may include an alignment assisting portion 201.
  • the alignment assisting portion 201 is for aligning the position of the wick 200 more easily when the wick 200 is disposed on the upper portion of the protruding member 110.
  • the alignment assisting portion 201 The wick 200 is protruded downward from the lower surface of the wick 200 by a certain amount and inserted between the protruding members 110 when the wick 200 is disposed on the protruding member 110 to align the wick 200 You can play a role in supporting this.
  • the shape of the alignment assisting portion 201 may protrude downward from the lower surface of the wick 200 to a certain extent, and may have a trapezoidal shape in which the side surface of the protruding surface is formed with a hypotenuse.
  • the shape of the alignment assisting portion 201 is not limited to the trapezoidal shape shown in FIG. 8, and the alignment assisting portion 201 may be formed in various shapes.
  • the cooling apparatus according to the first embodiment of the present invention shown in FIG. 5 includes a cover 300 and a heat sink 400 and a fan 500 formed on the cover 300 so that a single heat source or a single heat source It is used as cooling device for cooling.
  • the volume is limited as described above in the background art, but it is difficult to apply to an autonomous vehicle having a large number of heat sources (electronic devices such as radar) installed separately from each other.
  • the base 100, the wick 200, and the cover 300 are used as a kind of evaporator 50, and a plurality of evaporators 50 May be connected to a single condenser 60 as a cooling means and used. That is, the working fluid vaporized and vaporized in the flow path 11 is sent to the condenser 60 through the first pipe 51, and the condenser 60 liquefies the evaporated working fluid by cooling / condensing it, And the fluid is sent back to the flow path 11 through the second pipe 52.
  • the evaporator 50 is connected to the first and second pipes 51, It may be appropriate to use the second embodiment in which the working fluid and the liquefied working fluid are separated into the gas space 210 and the flow path 110, respectively.
  • This method can cool / condense the working fluid vaporized in the plurality of evaporators 50 in the single condenser 60, so that the cooling device can be efficiently implemented even in a relatively small space.
  • FIG. 10 schematically shows an autonomous vehicle 70 on which a plurality of heat sources (various sensors, radars) are installed.
  • the condenser 60 is installed at the rear of the autonomous vehicle 70, and the evaporator 50 can be installed at various sensors installed in the autonomous vehicle 70.
  • a plurality of sensors can be attached to the autonomous vehicle 70 at various positions, but a plurality of sensors are concentrated mainly on the trunk side of the vehicle.
  • the condenser 60 is installed at the rear of the vehicle, and is connected to each of the evaporators 50 installed in the sensors disposed at the rear of the vehicle, so that the heat generated by the sensors can be cooled.
  • the evaporator 50 installed at the rear of the vehicle is represented by a single unit in FIG. 10, but may be a plurality of units, that is, the condenser 60 and the evaporator 50 installed at the rear of the vehicle may be the embodiment shown in FIG.
  • the evaporator 50 installed on the autonomous vehicle 70 shown in FIG. 10 is not connected to the condenser 60 installed on the rear side of the vehicle and is not connected to the evaporator 50 itself, A heat sink or a cooling device may be installed. That is, the evaporator 50 installed on the autonomous vehicle 70 is conveniently referred to as an evaporator, and is used as a cooling device of its own.
  • brazing may be used in the method of manufacturing the cooling device according to the present invention.
  • Brazing is a technique of joining metal materials or nonmetal materials to heat the joints at a temperature below the melting point of the base metal of more than 450 degrees Celsius to melt the base material and melt the base material without melting,
  • the manufacturing method of the cooling device according to the present invention may include the first to fourth steps.
  • the first step is a step of inserting a filler material into the bonding surface of the base part 100 and the cover 300 or forming a filler layer.
  • the joining surface of the base part 100 and the cover 300 is inserted into the insertion part 121, the filler material is supplied to the insertion part 121, or the joining surface of the base part 100 and the cover 300
  • An excipient layer may be formed.
  • the wick 200 is disposed on the upper portion of the protruding member 110, and the insertion portion 121, which is defined by the protruding member 110 and the dividing frame 120, The insertion portion 310 formed on the lower surface of the cover 300 is inserted to form an assembly.
  • the third step is a step of applying a brazing flux to the outer surface of the assembly.
  • the brazing flux refers to a material used to prevent oxidation of the base material, that is, the base portion 100 and the cover 300, and generally uses a brazing flux in a liquid state.
  • the brazing flux when the brazing flux is applied in the liquid state, the brazing flux may flow into the joint between the base part 100 and the cover 300. However, as shown in FIG. 4, Since the insertion portion 121 and the protruding member 110 are partitioned from each other, the brazing flux can be prevented from flowing into the side where the protruding member 110 is located.
  • the assembly is heated at a temperature equal to or higher than the melting point of the base portion 100 and the cover 300, and the base portion 100 and the cover 300 are bonded to each other.
  • a cooling device according to the present invention can be manufactured by installing or adding a cooling device.
  • base portion 110 projecting member
  • gas space 220 fluid passage

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a cooling device and a method for manufacturing a cooling device and, more specifically, to a cooling device which is structurally simple compared with a conventional cooling device, and thus can be manufactured at a reduced manufacturing cost, prevent a working fluid from flowing downward even when used in a vertical direction, improve heat transfer and cooling efficiency, and can be easily used in a device having a plurality of heat sources although spatial limitation exists, and a method for manufacturing a cooling device.

Description

냉각장치 및 냉각장치의 제조방법Cooling device and manufacturing method of cooling device
본 발명은 냉각장치 및 냉각장치의 제조방법에 관한 것으로써, 보다 상세히는 자동차에 사용되는 센서, 제어기 등의 국부적인 발열을 냉각시키기 위한 자동차용 국소 발열 냉각 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device and a manufacturing method of the cooling device, and more particularly, to a local heating cooling device for an automobile for cooling a local heat of a sensor, a controller,
최근 환경 문제 대책의 일환으로, 모터의 구동력을 이용한 하이브리드 자동차와 전기 자동차가 주목을 받고 있고, 미국을 비롯한 몇몇 국가에서 실용화 단계에 접어든 자율주행 자동차도 주목을 받고 있는 실정이다.Recently, hybrid vehicles and electric vehicles using the driving force of a motor have been attracting attention as a part of measures for environmental problems, and autonomous vehicles having been put into practical use in some countries including the United States are getting attention.
상술한 하이브리드, 전기 및 자율주행 자동차는 대부분 자동차의 구동 및 모터 제어를 위한 전자소자들이 필수적으로 구비된다. 특히 자율주행 자동차의 경우 현재 자율주행 자동차의 위치를 판별하기 위한 GPS신호 수신 장치, 자율주행 자동차 주변의 물체 감시를 위한 각종 레이다, 다른 자율주행 자동차를 포함한 통신시설과의 상호작용을 위한 통신장치와 같이 다양한 전자 장비를 포함하게 되고, 이로 인해 다수의 전자소자를 포함할 수밖에 없으므로, 반드시 별도의 냉각수단이 필요하다.The hybrid, electric, and autonomous vehicles described above are essentially equipped with electronic devices for driving and motor control of an automobile. In particular, in the case of an autonomous vehicle, a GPS signal receiving device for identifying the position of the autonomous traveling vehicle, various radars for monitoring objects around the autonomous traveling vehicle, a communication device for interacting with communication facilities including other autonomous traveling vehicles But also various electronic equipments as well as a plurality of electronic elements, and thus a separate cooling means is necessarily required.
상기한 바와 같이 전자 장치를 냉각하기 위한 냉각수단의 대표적인 장치로는 히트싱크(Heat sink)가 있다. 히트싱크는 발열부와 접촉을 통해 열을 흡수하고 발산하는 방식이나, 히트싱크의 열용량을 높이려면 부피가 늘어나게 되므로 자율주행 자동차에는 적합하지 않다.As a typical example of the cooling means for cooling the electronic device as described above, there is a heat sink. The heat sink absorbs and dissipates heat through contact with the heat generating part, but it is not suitable for an autonomous vehicle because the volume of the heat sink is increased to increase the heat capacity of the heat sink.
또한, 자율주행 자동차의 외부에는 필수적으로 레이다와 같은 탐지장치가 설치될 수밖에 없는데, 고온의 태양열 및 지열에 노출되는 여름에는 자동차의 외부에 설치되는 탐지장치의 온도는 섭씨 약 100도까지 상승하여 단순히 열 접촉을 통해 열을 전달받고 주변 공기를 통해 열을 냉각하는 히트싱크 방식으로는 상기한 바와 같은 전자장치의 냉각을 충분히 할 수 없는 문제점이 있다.In addition, a radar-like detection device must be installed outside the autonomous vehicle. In summer when exposed to high-temperature solar heat and geothermal, the temperature of the detection device installed outside the automobile rises to about 100 degrees centigrade There is a problem that the above-mentioned electronic device can not be sufficiently cooled by the heat sink method in which heat is transmitted through the thermal contact and the heat is cooled through the surrounding air.
이러한 문제를 해결하려는 노력으로, 최근 단위당 열부하 밀도가 높은 전자소자의 냉각이 가능하도록 열전달 효율이 좋은 상변화 열전달 시스템을 이용한 냉각장치를 사용하고 있다. 상변화 열전달 시스템을 이용한 냉각장치의 일예로써 히트파이프 방식이 있으며, 한국등록특허공보 10-045268호(이하 선행기술 1)에 이에 관련된 기술이 소개되어 있다.In order to solve these problems, recently, a cooling device using a phase change heat transfer system having a good heat transfer efficiency is used so that an electronic device having a high thermal load density per unit can be cooled. A heat pipe type is an example of a cooling device using a phase change heat transfer system, and Korean Patent Registration No. 10-045268 (hereinafter referred to as Prior Art 1) discloses technology related thereto.
도 1은 선행기술 1에 도시된 상변화 열전달 방식을 이용한 냉각장치를 개략적으로 도시한 것이다.1 schematically shows a cooling apparatus using the phase-change heat transfer system shown in the prior art 1. In FIG.
도 1에 도시된 바와 같이, 선행기술 1의 상변화 열전달 방식을 이용한 냉각장치는 하우징(20), 윅(Wick)(30), 증기유로(31) 및 팬(40)을 포함한다.1, the cooling apparatus using the phase change heat transfer system of the prior art 1 includes a housing 20, a wick 30, a steam passage 31, and a fan 40. As shown in FIG.
도 1에 도시된 바와 같이, 하우징(20)의 일면에는 열원(10)이 접촉되어 있으며, 열원(10)에서 발생하는 열은 하우징(20)의 내부로 전달된다. 하우징(20)의 내부에 설치되는 윅(30)은 모세관구조로, 하측으로 돌출된 부분 또는 지지부를 형성하여 증기유로(31)를 형성한다. 증기유로(31) 내부에는 작동유체가 삽입되고, 작동유체는 열원(10)에서 하우징(20)의 내부로 전달되는 열에 의해 비등되어 기화상태로 상측으로 이동한다. 증기유로(31)의 상부로 이동한 기화상태의 작동유체는 하우징(20)의 타면에서 팬(40)에 의해 공급되는 공기에 의해 냉각/응축되어 다시 액화되며, 액화된 작동유체는 윅(31)에 형성되어 있는 모세관으로 유입되고, 모세관 압력에 의해 다시 하측으로 이동한다. 즉, 작동유체는 열원(10)이 위치한 하우징(20)의 하부에서의 비등과 상부에서의 응축을 반복함으로써, 상태변화에 의한 열원에서 발생하는 열의 전달-냉각이 이루어진다.1, a heat source 10 is in contact with a surface of the housing 20, and the heat generated by the heat source 10 is transmitted to the inside of the housing 20. The wick 30 installed inside the housing 20 has a capillary structure and forms a steam flow path 31 by forming a protruding portion or a supporting portion downward. A working fluid is inserted into the steam passage 31 and the working fluid is boiled by the heat transferred from the heat source 10 to the inside of the housing 20 to move upward in the vaporized state. The working fluid in the vaporized state moved to the upper portion of the steam flow path 31 is cooled / condensed again by the air supplied by the fan 40 on the other side of the housing 20 and is liquefied again. The liquefied working fluid flows through the wick 31 And flows back to the lower side by the capillary pressure. That is, the working fluid repeats the boiling at the lower portion of the housing 20 where the heat source 10 is located and the condensation at the upper portion, thereby transferring and cooling the heat generated in the heat source by the state change.
한편, 선행기술 1의 윅(30)은 금속 파우더를 소결해서 제작하는데, 도 1과 같이 윅(30)의 하부에 돌출부를 형성하려면 금속 파우더를 소결하여 직육면체 형상의 윅을 제조한 후, 윅(30)을 가공할 필요가 있어, 제작단가가 상승하고, 수직한 방향으로 사용할 경우 모세관 압력보다 중력이 강해 하우징의 하부에 작동유체가 몰릴 수 있어, 열전달 효율이 감소할 수 있는 문제점이 있다.The wick 30 of the prior art 1 is manufactured by sintering a metal powder. In order to form a protrusion on the lower part of the wick 30 as shown in FIG. 1, a metal powder is sintered to manufacture a rectangular wick, 30, it is necessary to process the manufacturing cost, so that the manufacturing cost is increased and when it is used in the vertical direction, the gravity is stronger than the capillary pressure, so that the working fluid can be buried in the lower part of the housing.
본 발명은 상기한 바와 같은 문제점을 해결하기 위해 안출된 것으로써, 본 발명에 의한 냉각장치 및 냉각장치의 제조방법의 목적은, 종래의 상변화 열전달 장치를 이용한 냉각장치보다 구조를 단순화해 제작이 용이하고, 제작단가를 절감할 수 있으며, 냉각장치를 수직한 방향으로 사용하더라도 하부에 작동유체가 몰리는 것을 일정 정도 방지할 수 있는 냉각장치 및 냉각장치의 제조방법을 제공함에 있다.It is an object of the present invention to provide a cooling device and a manufacturing method of a cooling device according to the present invention, which simplify the structure of a cooling device using a conventional phase change heat transfer device, And a manufacturing method of the cooling device which can prevent the working fluid from being pushed down to a certain degree even if the cooling device is used in the vertical direction.
상기한 바와 같은 문제점을 해결하기 위한 본 발명에 의한 냉각장치는, 상면에 적어도 하나 이상 형성된 돌출부재(110)를 포함하고, 열원과 맞닿아 열을 전달받는 베이스부(100), 일면이 상기 돌출부재(110)의 상단과 맞닿도록 상기 베이스부(100)에 덮여 작동유체의 비등 및 응축이 일어나는 유로(111)를 형성하는 윅(200), 상기 베이스부(100)의 상부를 덮는 커버(300) 및 상기 유로(111)에서 비등하여 기화된 작동유체를 냉각시키는 냉각수단을 포함하는 것을 특징으로 한다.In order to solve the above problems, a cooling apparatus according to the present invention includes a base part 100 including at least one protruding member 110 formed on an upper surface thereof and receiving heat from a heat source, A wick 200 covering the upper part of the base part 100 to form a flow path 111 in which the working fluid is boiled and condensed so as to abut the upper end of the base part 100, And cooling means for cooling the working fluid vaporized and vaporized in the flow path 111.
또한, 상기 돌출부재(110)는 상기 베이스부(100)의 상면에서 상측으로 돌출되고, 상기 베이스부(100)의 상면을 따라 일측으로 연장되는 것을 특징으로 한다.The protruding member 110 protrudes upward from the upper surface of the base unit 100 and extends to one side along the upper surface of the base unit 100.
또한, 상기 돌출부재(110)는 복수개가 상기 베이스부(100)의 상면에 일정 간격 이격되어 평행하게 배치되는 것을 특징으로 한다.In addition, a plurality of the protruding members 110 are arranged on the upper surface of the base unit 100 at a predetermined interval in parallel.
또한, 상기 돌출부재(110)는 복수개가 상기 베이스부(100)의 상면에 서로 일정간격 이격되어 이차원으로 배치되는 것을 특징으로 한다.In addition, a plurality of the protruding members 110 are arranged on the upper surface of the base part 100 at a predetermined interval and are arranged in two dimensions.
또한, 상기 베이스부(100)는 상면에 형성되어 상기 돌출부재(110)와 상면을 구획하는 구획 프레임(120) 및 상기 커버(300)의 하면에 돌출 형성된 끼움부(310)가 삽입되는 삽입부(121)를 포함하는 것을 특징으로 한다.The base 100 includes a partition frame 120 formed on an upper surface thereof and separating the upper surface of the protrusion member 110 from the upper surface of the base member 100 and an insertion portion 310 protruding from the lower surface of the cover 300, (121).
또한, 상기 구획 프레임(120)은 상기 돌출부재(110)를 둘러싸도록 형성되는 것을 특징으로 한다.Further, the partition frame 120 is formed so as to surround the protruding member 110.
또한, 상기 베이스부(100)는 상면의 외곽에 형성되는 외곽 프레임(130)을 더 포함하고, 상기 삽입부(121)는 상기 구획 프레임(120)과 상기 외곽 프레임(130) 사이에 형성되는 것을 특징으로 한다.The base portion 100 further includes an outer frame 130 formed on the outer surface of the upper surface and the insertion portion 121 is formed between the outer frame 130 and the partition frame 120 .
또한, 상기 윅(200)의 상단은 상기 커버(300)의 하면과 밀착되는 것을 특징으로 한다.Further, the upper end of the wick 200 is in close contact with the lower surface of the cover 300.
또한, 상기 커버(300)와 상기 윅(200) 사이에는 기화된 작동유체가 위치하는 기체공간(210)이 형성되는 것을 특징으로 한다.Further, a gas space 210 is formed between the cover 300 and the wick 200, in which a vaporized working fluid is located.
또한, 상기 커버(300)는 하면이 상기 윅(200)의 상단과 일정 간격 이격되는 것을 특징으로 한다.In addition, the cover 300 is spaced apart from the upper end of the wick 200 by a predetermined distance.
또한, 상기 윅(200)은 상기 유로(111)와 상기 기체공간(210)을 연결하도록 형성된 유체통로(220)를 포함하는 것을 특징으로 한다.The wick 200 may include a fluid passage 220 formed to connect the flow path 111 and the gas space 210.
또한, 상기 윅(200)은 하면에 돌출되어 인접한 돌출부재(110) 사이에 삽입되는 정렬 보조부(201)를 포함하는 것을 특징으로 한다.The wick 200 includes an alignment assisting portion 201 that protrudes from a bottom surface of the wick 200 and is inserted between the adjacent protruding members 110.
또한, 상기 정렬 보조부(201)는 돌출된 일면의 측면이 빗면으로 형성되는 것을 특징으로 한다.In addition, the alignment assisting portion 201 may have a protruding side surface formed as an oblique surface.
또한, 상기 베이스부(100)와 상기 커버(300) 사이의 공간은 진공인 것을 특징으로 한다.The space between the base 100 and the cover 300 is vacuum.
또한, 상기 커버(300)의 외면에 형성되는 히트 싱크(400)를 더 포함하는 것을 특징으로 한다.The cover 300 may further include a heat sink 400 formed on the outer surface of the cover 300.
또한, 상기 냉각수단은 기화된 작동유체를 공급받아 냉각 및 응축시켜 액화시키고, 액화된 작동유체를 상기 유로(111)로 공급하는 것을 특징으로 한다.The cooling means is characterized in that the vaporized working fluid is supplied, cooled, condensed and liquefied, and the liquefied working fluid is supplied to the flow path (111).
또한, 상기 냉각수단은 상기 커버(300)의 외면으로 냉매를 공급하는 것을 특징으로 한다.Further, the cooling means supplies refrigerant to the outer surface of the cover (300).
본 발명에 의한 냉각장치의 제조방법은, 상기 베이스부(100)와 상기 커버(300)의 접합면에 용가재를 삽입하거나 용가재층을 형성하는 제1단계, 상기 돌출부재(110)의 상부에 상기 윅(200)을 배치하고, 상기 베이스부(100)에 형성된 삽입부(121)에 커버(300)의 하면에 형성된 끼움부(310)를 삽입하여 조립체를 형성하는 제2단계, 상기 조립체의 외면에 브레이징 플럭스를 도포하는 제3단계 및 플럭스를 도포한 상기 조립체를 브레이징하는 제4단계를 포함하는 것을 특징으로 한다.A method of manufacturing a cooling device according to the present invention includes a first step of inserting a filler material or a filler material layer on a bonding surface of the base part 100 and the cover 300, A second step of disposing the wick 200 and inserting the fitting portion 310 formed on the lower surface of the cover 300 into the insertion portion 121 formed in the base portion 100 to form an assembly, And a fourth step of brazing the flux-applied assembly.
상기한 바와 같은 본 발명의 다양한 실시예들에 의한 냉각장치에 의하면, 윅에 별도의 가공을 하지 않아도 작동유체의 유로를 형성할 수 있기 때문에 장치가 단순화되어 제작이 용이하고, 제작단가를 절감할 수 있는 효과가 있다.According to the cooling device according to various embodiments of the present invention as described above, since the flow path of the working fluid can be formed without any additional processing on the wick, the apparatus can be simplified, easy to manufacture, There is an effect that can be.
또한, 본 발명에 의하면 베이스부의 상면에 다수의 돌출부재가 형성되고, 돌출부재의 상단에 윅이 배치되어 돌출부재의 측면에 작동유체가 위치하는 유로가 위치하기 때문에, 열원으로부터 돌출부재로 열이 전달되어 돌출부재의 인근에서 작동유체의 비등이 촉진되는 효과가 있다.According to the present invention, since a plurality of protruding members are formed on the upper surface of the base, wicks are disposed on the upper ends of the protruding members, and a flow passage in which the working fluid is positioned is located on the side of the protruding member. So that boiling of the working fluid is promoted in the vicinity of the projecting member.
또한, 본 발명에 의하면 냉각장치를 수직한 방향으로 사용하더라도, 윅에 스며든 액체 상태의 작동유체와 돌출부재 사이의 표면장력에 의해 작동유체가 돌출부재의 측면으로 이동하기 때문에, 작동유체가 하부로 몰리는 것을 일정 정도 방지할 수 있는 효과가 있다.Further, according to the present invention, even when the cooling device is used in the vertical direction, since the working fluid moves to the side surface of the projecting member by the surface tension between the working fluid in liquid state and the projecting member in the wick, There is an effect that it is possible to prevent a certain amount of driving.
또한 본 발명에 의하면, 윅을 이용해 유로와 기체공간으로 분리하여, 유로와 기체공간 각각에 작동유체를 액체 및 기체의 상태별로 분리할 수 있기 때문에, 열전달 효율이 향상되는 효과가 있다.Further, according to the present invention, since the wick is used to separate the flow path and the gas space, and the working fluid can be separated in each of the flow path and the gas space by the states of the liquid and the gas, the heat transfer efficiency is improved.
또한 본 발명에 의하면, 단일의 냉각장치로 사용할 수 있을 뿐 아니라 베이스부, 윅 및 커버를 단일의 증발기로 사용하고, 다수의 증발기를 단일의 냉각수단에 연결하여 사용할 수 있기 때문에 본 발명에 의한 냉각장치의 부피를 줄일 수 있고, 특히 자율주행 자동차와 같이 다수개의 열원을 냉각할 필요가 있되 부피의 제약이 큰 장치에 유용한 효과가 있다.According to the present invention, not only a single cooling device but also a base, a wick, and a cover can be used as a single evaporator and a plurality of evaporators can be connected to a single cooling device, It is possible to reduce the volume of the apparatus, and in particular, it is necessary to cool a plurality of heat sources such as autonomous vehicles, but it is useful for apparatuses with a large volume limitation.
또한 본 발명에 의하면, 단순한 구조의 베이스부, 윅과 커버를 조립 후 브레이징하여 제조할 수 있기 때문에 제작이 용이한 효과가 있다.Further, according to the present invention, since the base portion, the wick and the cover having a simple structure can be manufactured by assembling and brazing, it is easy to manufacture.
도 1은 종래 상변화 열전달 방식을 이용한 냉각장치의 단면도.1 is a sectional view of a cooling device using a conventional phase change heat transfer method.
도 2는 본 발명의 제1실시예에 의한 냉각장치의 분해 사시도.2 is an exploded perspective view of a cooling device according to a first embodiment of the present invention;
도 3은 본 발명의 제1실시예에 의한 냉각장치의 분해 단면도.3 is an exploded cross-sectional view of a cooling device according to a first embodiment of the present invention;
도 4는 본 발명의 제1실시예에 의한 냉각장치의 결합 단면도.4 is an assembled sectional view of a cooling device according to a first embodiment of the present invention;
도 5는 본 발명의 제1실시예에 의한 냉각장치에 히트싱크와 냉각수단을 설치한 상태의 사시도.5 is a perspective view of a cooling apparatus according to a first embodiment of the present invention in a state where a heat sink and a cooling means are installed.
도 6은 본 발명의 돌출부재의 다른 실시예의 사시도.6 is a perspective view of another embodiment of the projecting member of the present invention.
도 7은 본 발명의 제2실시예에 의한 냉각장치의 단면도.7 is a sectional view of a cooling device according to a second embodiment of the present invention;
도 8은 본 발명의 제3실시예에 의한 냉각장치의 단면도.8 is a sectional view of a cooling device according to a third embodiment of the present invention.
도 9는 본 발명의 제4실시예에 의한 냉각장치의 개략도.9 is a schematic view of a cooling apparatus according to a fourth embodiment of the present invention.
도 10은 본 발명의 제4실시예에 의한 냉각장치가 자동차에 적용된 개략도.10 is a schematic view of a cooling apparatus according to a fourth embodiment of the present invention applied to a vehicle.
이하 첨부된 도면을 참고하여 본 발명에 의한 냉각장치의 바람직한 실시예에 관하여 상세히 설명한다.BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of a cooling apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[제1실시예에 의한 냉각장치][Cooling Apparatus According to First Embodiment]
도 2는 본 발명의 제1실시예에 의한 냉각장치의 분해 사시도이고, 도 3은 도 2에 도시된 본 발명의 제1실시예에 의한 냉각장치를 수직한 평면으로 자른 상태로 도시한 분해 단면도이며, 도 4는 도 2 및 도 3에 도시된 본 발명의 제1실시예에 의한 냉각장치를 결합한 상태의 단면을 도시한 것이다.FIG. 2 is an exploded perspective view of the cooling device according to the first embodiment of the present invention, and FIG. 3 is an exploded sectional view of the cooling device according to the first embodiment of the present invention, And FIG. 4 is a cross-sectional view showing a state where the cooling device according to the first embodiment of the present invention shown in FIG. 2 and FIG. 3 is engaged.
도 2 내지 도 4에 도시된 바와 같이, 본 발명의 제1실시예에 의한 냉각장치는 베이스부(100), 윅(200) 및 커버(300)를 포함할 수 있다.2 to 4, the cooling apparatus according to the first embodiment of the present invention may include a base unit 100, a wick 200, and a cover 300.
도 2 내지 도 4에 도시된 바와 같이, 베이스부(100)는 커버(300)와 함께 본 발명의 다양한 실시예들에 의한 냉각장치의 외형을 이룬다.2 to 4, the base portion 100 together with the cover 300 forms the appearance of the cooling device according to various embodiments of the present invention.
도 2 내지 도 4에 도시된 바와 같이, 베이스부(100)의 상면 소정 공간에 다수개의 돌출부재(110)가 형성될 수 있다. 돌출부재(110)는 작동유체의 유로를 형성하기 위한 것으로, 도 2에 도시된 바와 같이 다수개가 각각이 베이스부(100)의 상면에 상측으로 돌출되되, 베이스부(100)의 상면에서 일측으로 연장형성된 일종의 바(bar) 형상으로 형성될 수 있지만, 본 발명의 돌출부재(110)는 이에 한정하지 않고 다양한 형상으로 형성되어 작동유체의 유로를 형성할 수 있다.As shown in FIGS. 2 to 4, a plurality of protruding members 110 may be formed in a predetermined space on the upper surface of the base 100. As shown in FIG. 2, a plurality of protruding members 110 protrude upward from the upper surface of the base unit 100, and protrude upward from the upper surface of the base unit 100 The protruding member 110 of the present invention is not limited thereto but may be formed in various shapes to form a flow path of the working fluid.
도 2에 도시된 바와 같이, 바 형상으로 형성된 돌출부재(110)는 다수개가 베이스부(100)의 상면상에 일정간격 이격되도록 배치될 수 있다.As shown in FIG. 2, a plurality of bar-shaped protruding members 110 may be disposed on the upper surface of the base 100 at a predetermined distance.
도 3 및 도 4에는 작동유체의 유로(111)가 도시되어 있다. 유로(111)는 돌출부재(110)와 베이스부(100)에 의해 둘러싸인 공간으로, 해당 부분으로 작동유체가 주입될 수 있고, 작동유체는 주입시 액체상태일 수 있다.3 and 4 show the flow path 111 of the working fluid. The flow path 111 is a space surrounded by the protruding member 110 and the base portion 100, and a working fluid can be injected into the portion, and the working fluid can be in a liquid state at the time of injection.
작동유체는 본 발명에서 열을 전달하는 매개체로, 열원에서 열을 전달받으면 유로(111)에서 비등되어 기화되거나, 기체 상태에서 응축/냉각되어 액화되면서 열을 전달한다. 작동유체를 기체 상태의 작동유체를 냉각하기 위해 본 발명의 일실시예는 냉각유체를 기체 상태의 작동유체가 위치하는 부분에 공급하는 냉각수단을 더 포함할 수 있다.The working fluid is a medium for transferring heat in the present invention. When the heat is transferred from the heat source, the working fluid is boiled in the flow path 111 and vaporized, or condensed / cooled in a gaseous state to transfer heat while being liquefied. In order to cool the working fluid in the gaseous working fluid, an embodiment of the present invention may further include cooling means for supplying the cooling fluid to a portion where the working fluid in the gaseous state is located.
작동유체로는 다양한 종류의 냉매류가 사용될 수 있으며, 본 발명의 제1실시예에 의한 냉각장치에서는 베이스부(100)와 커버(300)를 조립 및 결합시킨 후, 베이스부(100)와 커버(300)로 형성되는 공간의 기압을 외부 기압인 1기압보다 낮도록 강압하여 작동유체로 사용되는 냉매의 끓는점을 낮춤으로써, 작동유체가 보다 용이하게 비등되도록 할 수 있다.In the cooling apparatus according to the first embodiment of the present invention, after the base unit 100 and the cover 300 are assembled and coupled, the base unit 100 and the cover 300 are combined with each other, The working fluid can be easily boiled by reducing the boiling point of the refrigerant used as the working fluid by lowering the pressure of the space formed by the refrigerant flow path 300 to be lower than the atmospheric pressure of 1 atmospheric pressure.
도 2 내지 도 4에 도시된 바와 같이, 베이스부(100)는 구획 프레임(120), 외곽 프레임(130) 및 삽입부(121)를 더 포함할 수 있다.2 to 4, the base portion 100 may further include a partition frame 120, an outer frame 130, and an insertion portion 121. [
도 2 내지 도 4에 도시된 바와 같이, 구획 프레임(120)은 다수개의 돌출부재(110)를 둘러싸는 형태로 형성된다. 구획 프레임(120)의 상단은 돌출부재(110)의 상단보다 높은데, 이는 후술할 윅(200)을 구획 프레임(120)으로 구획되는 내부공간에 배치하기 위함이다,As shown in FIGS. 2 to 4, the partition frame 120 is formed to surround the plurality of protruding members 110. The upper end of the partition frame 120 is higher than the upper end of the protruding member 110 in order to dispose the wick 200 to be described later in an inner space defined by the partition frame 120,
도 2 내지 도 4에 도시된 바와 같이, 외곽 프레임(130)은 구획 프레임(120)보다 외곽에 위치하며, 구획 프레임(120)과 외곽 프레임(130) 사이에는 삽입부(121)가 형성되어 있다.2 to 4, the outer frame 130 is located outside the dividing frame 120, and the insertion portion 121 is formed between the dividing frame 120 and the outer frame 130 .
삽입부(121)는 후술할 커버(300)의 일부분인 끼움부(310)가 삽입되는 부분으로, 도 3에 도시된 삽입부(121)의 일면은 구획 프레임(120)과 외곽 프레임(130)의 상단보다 낮다. 삽입부(121)를 구획 프레임(120)과 외곽 프레임(130) 사이에 형성하는 이유는 본 발명의 다양한 실시예를 브레이징 방식으로 제조할 때, 분사하는 브레이징 플럭스(Brazing flux)가 베이스부(100)의 상면에 형성되는 구획 프레임(120)으로 구획되는 내부공간으로 유입되는 것을 방지하기 위한 것이다. 상술한 효과에 대해서는 본 발명에 의한 냉각장치 제조방법을 설명할 때 보다 상세히 설명한다.The insertion portion 121 is a portion in which a fitting portion 310 which is a part of a cover 300 to be described later is inserted. One side of the insertion portion 121 shown in FIG. 3 is divided into a compartment frame 120 and an outer frame 130, Lt; / RTI > The reason for forming the insertion portion 121 between the partition frame 120 and the outer frame 130 is that when the various embodiments of the present invention are manufactured by the brazing method, the brazing flux to be sprayed is applied to the base portion 100 To the inner space defined by the partition frame 120 formed on the upper surface of the partition wall 120. [ The above-described effects will be described in more detail when the method of manufacturing the cooling device according to the present invention is described.
윅(200)은 일면이 돌출부재(110)의 상단과 맞닿도록 베이스부(100)에 덮여, 베이스부(100)의 상면, 돌출부재(110) 및 윅(200)으로 둘러싸인 작동유체의 유로(110)를 형성한다.The wick 200 is covered with the base portion 100 so that one side abuts the upper end of the protruding member 110 and the working fluid flow path surrounded by the upper surface of the base portion 100, the protruding member 110 and the wick 200 110).
윅(200)은 금속 파우더를 소결하여 형성함으로써 내부에 모세관이 형성되는 구조로, 액체상태의 작동유체는 모세관 압력에 의해 윅(200)에 형성된 모세관으로 스며들어 이동한다. 즉, 기화된 작동유체가 냉각/응축되어 액화될 때, 액화된 작동유체는 윅(200)의 모세관에 스며들고, 모세관압에 의해 윅(200)에 고르게 퍼진 후 하측으로 이동한다.The wick 200 has a structure in which a capillary tube is formed by sintering a metal powder. The liquid working fluid seeps into a capillary tube formed in the wick 200 by capillary pressure. That is, when the vaporized working fluid is cooled / condensed and liquefied, the liquefied working fluid seeps into the capillary of the wick 200, spreads evenly to the wick 200 by the capillary pressure, and then moves downward.
윅(200)을 형성하는 금속 파우더는 다양한 재질로 형성될 수 있지만, 본 발명의 제1실시예에서는 차량에 적용하기 용이한 니켈(Ni) 파우더를 소결하여 윅(200)을 형성할 수 있다. 또한, 본 발명의 제1실시예에 의한 냉각장치에서 윅(200)은 판형이지만, 본 발명은 이에 한정하지 않고 윅(200)은 다양한 형상이 될 수 있다.The metal powder forming the wick 200 may be formed of various materials, but in the first embodiment of the present invention, the wick 200 can be formed by sintering Ni powder that is easy to apply to a vehicle. In the cooling apparatus according to the first embodiment of the present invention, the wick 200 is plate-shaped, but the present invention is not limited to this, and the wick 200 may have various shapes.
도 2 내지 도 4에 도시된 바와 같이, 커버(300)는 베이스부(100)의 상부를 덮어 본 발명의 제1실시예를 완성한다. 베이스부(100)와 커버(300)는 열교환이 용이하고 내부공간이 진공으로 유지되어야 하기 때문에, 베이스부(100)와 커버(300)는 열전도도가 높고 내부공간이 진공이어도 형체를 유지할 수 있을 정도의 강도를 가지는 재질로 형성되거나, 해당 강도를 가지도록 할 수 있는 구조를 포함할 수 있다.As shown in Figs. 2 to 4, the cover 300 covers the upper portion of the base portion 100 to complete the first embodiment of the present invention. Since the base part 100 and the cover 300 are easily exchanged with each other and the inner space must be maintained in a vacuum state, the base part 100 and the cover 300 can have high thermal conductivity, Or may have a structure capable of having the strength.
상술한 본 발명의 제1실시예는 윅(200)에 비해 가공이 용이한 베이스부(100)에 돌출부재(110)를 형성하고 판형의 윅(200)을 돌출부재(110)의 상부에 덮는 방식으로 작동유체의 유로(111)를 형성하므로, 윅(200)에 별도의 가공을 할 필요가 없어 냉각장치의 제작이 용이하고, 이에 따라 제조단가가 절감되는 효과가 있다.The first embodiment of the present invention is characterized in that the protrusion member 110 is formed on the base part 100 that is easier to process than the wick 200 and the wick 200 is covered on the upper part of the protrusion member 110 Since the flow path 111 for the working fluid is formed in the wick 200, it is not necessary to separately process the wick 200, so that it is easy to manufacture the cooling device, thereby reducing the manufacturing cost.
또한, 베이스부(100)의 하부에 위치한 열원으로부터 전달받은 열이 돌출부재(110)로 전달되기 때문에 돌출부재(110)의 측면 인근에서는 작동유체의 비등이 촉진되는 효과가 있으며, 윅(200)에 형성된 모세관에 흡수된 액체상태의 작동유체는 돌출부재(110)의 측면과의 표면장력에 의해 돌출부재(110)의 측면을 따라 이동하기 때문에, 본 발명에 의한 냉각장치를 수직한 방향으로 사용하더라도 작동유체가 하부에 몰리는 현상을 일정정도 방지할 수 있다.Since the heat transferred from the heat source located at the lower portion of the base unit 100 is transmitted to the protruding member 110, boiling of the working fluid is promoted near the side surface of the protruding member 110, The working fluid in the liquid state absorbed by the capillary formed in the capillary tube 110 moves along the side surface of the protruding member 110 due to the surface tension with the side surface of the protruding member 110, It is possible to prevent the working fluid from being pushed down to a certain degree.
도 5는 도 2에 도시된 본 발명의 제1실시예에 의한 냉각장치의 상부에 히트싱크(400)와 냉각수단을 설치한 것을 도시한 것으로, 도 5에 도시된 바와 같이 본 발명의 제1실시예에 의한 냉각장치는 히트싱크(400)의 상부에 설치되는 팬(500)일 수 있다.FIG. 5 shows a heat sink 400 and a cooling means provided on the upper part of the cooling device according to the first embodiment of the present invention shown in FIG. 2. As shown in FIG. 5, The cooling device according to the embodiment may be a fan 500 installed on the top of the heat sink 400.
도 5에 도시된 히트싱크(400)는 다수개의 방열판으로 구성될 수 있으며, 냉각용 유체와 접촉면적을 넓혀 냉각 효율을 증가시키며, 커버(300)의 내부, 즉 기화된 작동유체로부터 열을 전달받아 냉각용 유체로 사용되는 공기와 열 교환한다.The heat sink 400 shown in FIG. 5 may be composed of a plurality of heat sinks. The heat sink 400 increases the cooling efficiency by widening the contact area with the cooling fluid. The heat sink 400 may transmit heat from the inside of the cover 300, Take heat exchange with air used as cooling fluid.
팬(500)은 냉각유체, 즉 공기를 상기 히트싱크(400)로 공급하여 히트싱크(400)를 냉각시키는 냉각수단의 일예로써, 히트싱크(4000의 상부에 설치되어 회전하면서 공기를 지속적으로 히트싱크(400)측으로 공급한다. 단, 팬(500)이 설치되는 위치는 히트싱크(400)의 상부에 한정하는 것은 아니며, 다양한 방식을 이용해 냉각유체를 공급할 수 있고, 냉각부는 팬(500) 이외에도 다양한 방식으로 기화된 작동유체를 냉각시킬 수 있다.The fan 500 is an example of cooling means for cooling the heat sink 400 by supplying a cooling fluid, that is, air to the heat sink 400. The fan 500 is installed at the top of the heat sink 4000, The position where the fan 500 is installed is not limited to the upper portion of the heat sink 400 and the cooling fluid may be supplied using various methods, The vaporized working fluid can be cooled in various ways.
팬(500)은 중앙 일정 부분이 중공된 브라켓(510)에 결합되고, 브라켓(510)은 베이스부(100)의 측면과 결합되어 히트싱크(400)의 상부에 설치될 수 있다.The fan 500 is coupled to the hollow bracket 510 at a central portion thereof and the bracket 510 is coupled to the side surface of the base portion 100 and installed at the upper portion of the heat sink 400.
상기한 히트싱크(400)와 냉각수단의 일예로써 팬(500)은 항상 함께 사용해야하는 것은 아니며, 히트싱크(400) 또는 냉각수단의 일예로써 팬(500)을 개별적으로 사용할 수 있다.The fan 500 is not always used as an example of the heat sink 400 and the cooling means, and the fan 500 can be used individually as an example of the heat sink 400 or the cooling means.
상기 베이스부(100)에 형성된 돌출부재(110)는 도 2에 도시된 바(bar) 형상이 아닌 다른 형상일 수 있다.The protrusion member 110 formed on the base 100 may have a shape other than the bar shape shown in FIG.
도 6은 돌출부재(110)의 형상이 다른 베이스부(100)만을 도시한 것이다.6 shows only the base part 100 having a shape different from that of the projecting part 110. FIG.
도 6에 도시된 바와 같이, 돌출부재(110)는 바(bar) 형상이 아닌 사각 핀 형상일 수 있다. 사각 핀 형상의 돌출부재(110)는 바(bar) 형상의 돌출부재(110)보다 작동유체의 기포 생성/이탈 시 자유도가 증가하는 효과가 있으며, 이 경우 사각 핀 형상의 돌출부재(110)는 베이스부(100)의 상면에 이차원적으로 배열될 수 있다.As shown in FIG. 6, the protruding member 110 may have a square pin shape instead of a bar shape. The rectangular pin-shaped protruding member 110 has an effect of increasing the degree of freedom when bubbles are generated / removed from the working fluid than the bar-shaped protruding member 110. In this case, the rectangular pin- And can be arranged two-dimensionally on the upper surface of the base portion 100. [
[제2실시예에 의한 냉각장치][Cooling Apparatus According to Second Embodiment]
본 발명의 제2실시예에 의한 냉각장치는 제1실시예에 의한 냉각장치와 커버의 형상이 다르다. 따라서 이하 본 발명의 제2실시예는 제1실시예와 다른 커버와 이에 따라 변화된 구성에 대해 상세히 설명하고, 설명하지 않는 구성은 제1실시예와 동일한 것으로 간주한다.The cooling apparatus according to the second embodiment of the present invention differs from the cooling apparatus according to the first embodiment in the shape of the cover. Therefore, the second embodiment of the present invention will be described in detail with respect to the cover different from that of the first embodiment, and the configuration thus changed, and the configuration not described is regarded as the same as the first embodiment.
도 7은 본 발명의 제2실시예에 의한 냉각장치의 단면을 도시한 것이다.7 is a cross-sectional view of a cooling apparatus according to a second embodiment of the present invention.
도 7에 도시된 바와 같이, 본 발명의 제2실시예에 의한 냉각장치는 커버(300)와 윅(200) 사이에 기체공간(210)이 형성된다. 기체공간(210)은 유로(111)에서 비등되어 기화된 작동유체가 위치하는 부분으로, 기체공간(210)에는 기화된 작동유체가 위치하고, 유로(111)에는 액화된 작동유체가 위치한다. 즉, 윅(200)이 베이스부(100)와 커버(300)가 형성하는 내부공간을 구획함으로써 기화된 작동유체와 액화된 작동유체를 분리한다.7, the cooling apparatus according to the second embodiment of the present invention includes a gas space 210 formed between the cover 300 and the wick 200. The gas space 210 is a portion in which the working fluid vaporized in the flow path 111 is located and the vaporized working fluid is located in the gas space 210 and the liquefied working fluid is located in the flow path 111. That is, the wick 200 separates the vaporized working fluid from the liquefied working fluid by partitioning the inner space formed by the base portion 100 and the cover 300.
기체공간(210)의 상부에는 도 5에 도시된 히트싱크(400) 또는 팬(500)이 설치되어 기체공간(210)에 위치하는 기화된 작동유체를 응축/냉각시킬 수 있다. 커버(300)와 인접한 위치, 즉 기체공간(210)의 상부에서 응축/냉각되어 액화된 작동유체는 기체공간(210)을 구획하는 윅(200)에 형성된 모세관에 스며들어 모세관 압력과 중력에 의해 윅(200)의 하부에 위치한 유로(111)로 이동할 수 있다.(도 7에서 B화살표의 방향)The heat sink 400 or the fan 500 shown in FIG. 5 may be installed on the upper part of the gas space 210 to condense / cool the vaporized working fluid located in the gas space 210. The working fluid condensed / cooled and liquefied at a position adjacent to the cover 300, that is, above the gas space 210, seeps into the capillary formed in the wick 200 defining the gas space 210, It can move to the flow path 111 located at the lower part of the wick 200 (the direction of the arrow B in Fig. 7)
열원에서 전달된 열에 의해 유로(111)에서 액체에서 기체 상태로 변화한 작동유체는 윅(200)을 통과하여 기체공간(210)으로 이동할 수 있다. 기체 상태로 변화한 작동유체가 유로(111)에서 기체공간(210)으로 용이하게 이동하기 위해, 도 7에 도시된 바와 같이 윅(200)에는 유체통로(220)가 형성될 수 있다.The working fluid changed from the liquid to the gaseous state in the flow path 111 by the heat transferred from the heat source can move through the wick 200 and into the gas space 210. The fluid passage 220 may be formed in the wick 200 as shown in FIG. 7, so that the working fluid changed into the gaseous state easily moves from the flow passage 111 to the gas space 210.
유체통로(220)를 통해 기체 상태의 작동유체는 A화살표 방향으로 이동할 수 있다. 유체통로(220)는 기체 상태의 작동유체만이 통과 가능한 크기로 형성할 수 있고, 이와 별개로 물이 유체통로(220)로 스며들더라도 주변의 모세관 공극의 크기가 더 작으므로, 모세관 압력에 의해 주변 모세관으로 흡수된다.The working fluid in the gaseous state through the fluid passage 220 can move in the A arrow direction. Since the fluid passage 220 can be formed in such a size that only the working fluid in the gaseous state can pass therethrough and the size of the surrounding capillary pores is smaller even if water seeps into the fluid passage 220 separately, And is absorbed into the surrounding capillary.
도 7에 도시된 바와 같은 본 발명의 제2실시예에 의한 냉각장치는 기체공간(210)이 형성됨으로써 제1실시예에 비해 상하 방향의 부피가 증가할 수 있으나, 액체 상태의 작동유체와 기체 상태의 작동유체를 윅(200)을 통해 서로 분리하여 열 전달 및 열 교환이 이루어지기 때문에, 본 발명의 제1실시예, 기존의 냉각장치 또는 열전달 장치에 비해 성능이 향상되는 효과가 있다.As shown in FIG. 7, the cooling device according to the second embodiment of the present invention can increase the volume in the vertical direction by forming the gas space 210, compared with the first embodiment, The working fluid in the state of being separated from each other through the wick 200 to perform heat transfer and heat exchange. Therefore, the performance is improved as compared with the first embodiment of the present invention, the conventional cooling device or the heat transfer device.
[제3실시예에 의한 냉각장치][Cooling Apparatus According to Third Embodiment]
이하 첨부된 도면을 참고하여 본 발명의 제3실시예에 의한 냉각장치에 관하여 상세히 설명한다.Hereinafter, a cooling apparatus according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.
본 발명의 제3실시예는 제2실시예와 윅의 형상이 다르고, 나머지 구성은 동일하므로, 달라진 윅의 형상에 대해 중점적으로 설명한다.The third embodiment of the present invention is different from the second embodiment in the shape of the wick and the remaining components are the same, so the shape of the wick that has been changed will be mainly described.
도 8은 본 발명의 제3실시예의 단면을 도시한 것이다.8 shows a cross section of a third embodiment of the present invention.
도 8에 도시된 바와 같이, 본 발명의 제3실시예에 의한 냉각장치에서 윅(200)은 정렬 보조부(201)를 포함할 수 있다.As shown in FIG. 8, in the cooling apparatus according to the third embodiment of the present invention, the wick 200 may include an alignment assisting portion 201.
정렬 보조부(201)는 돌출부재(110)의 상부에 윅(200)을 배치할 때, 윅(200)의 위치를 보다 용이하게 정렬하기 위한 것으로, 도 8에 도시된 바와 같이 정렬 보조부(201)는 윅(200)의 하면에서 하측으로 일정 정도 돌출되어, 윅(200)이 돌출부재(110)의 상부에 배치될 때 돌출부재(110)의 사이에 삽입됨으로써 윅(200)의 위치를 정렬하고자 할 때, 이를 보조해주는 역할을 할 수 있다.The alignment assisting portion 201 is for aligning the position of the wick 200 more easily when the wick 200 is disposed on the upper portion of the protruding member 110. The alignment assisting portion 201, The wick 200 is protruded downward from the lower surface of the wick 200 by a certain amount and inserted between the protruding members 110 when the wick 200 is disposed on the protruding member 110 to align the wick 200 You can play a role in supporting this.
도 8에 도시된 바와 같이, 정렬 보조부(201)의 형상은 윅(200)의 하면에서 하측으로 일정정도 돌출되되, 돌출면의 측면이 빗변으로 형성된 사다리꼴 형상일 수 있다. 그러나 본 발명은 정렬 보조부(201)의 형상을 도 8에 도시된 사다리꼴 형상으로 한정하는 것은 아니며, 정렬 보조부(201)는 다양한 형상으로 형성될 수 있다.As shown in FIG. 8, the shape of the alignment assisting portion 201 may protrude downward from the lower surface of the wick 200 to a certain extent, and may have a trapezoidal shape in which the side surface of the protruding surface is formed with a hypotenuse. However, the shape of the alignment assisting portion 201 is not limited to the trapezoidal shape shown in FIG. 8, and the alignment assisting portion 201 may be formed in various shapes.
[제4실시예에 의한 냉각장치][Cooling Apparatus According to Fourth Embodiment]
이하 첨부된 도면을 참고하여 본 발명의 제4실시예에 의한 냉각장치에 관하여 상세히 설명한다.Hereinafter, a cooling apparatus according to a fourth embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 5에 도시된 본 발명의 제1실시예에 의한 냉각장치는 커버(300)의 상부에 히트싱크(400)와 팬(500)이 형성됨으로써, 단일 열원 또는 인접한 열원으로 이루어진 단일 그룹의 열원을 냉각하는 냉각장치로 사용된다. 도 5와 같은 제1실시예의 경우, 배경기술에서 상술한 바와 같이 부피의 제한이 있되, 서로 떨어져 설치되는 열원(레이다와 같은 전자장치)이 다수인 자율주행 자동차의 경우 적용하기 어려운 점이 있다.The cooling apparatus according to the first embodiment of the present invention shown in FIG. 5 includes a cover 300 and a heat sink 400 and a fan 500 formed on the cover 300 so that a single heat source or a single heat source It is used as cooling device for cooling. In the case of the first embodiment as shown in FIG. 5, the volume is limited as described above in the background art, but it is difficult to apply to an autonomous vehicle having a large number of heat sources (electronic devices such as radar) installed separately from each other.
상기한 바와 같은 문제점을 해결하기 위해, 본 발명은 도 9에 도시된 바와 같이 베이스부(100), 윅(200) 및 커버(300)를 일종의 증발기(50)로 사용하고, 다수개의 증발기(50)를 냉각수단으로써의 단일의 응축기(60)에 연결하여 사용하는 실시예가 있을 수 있다. 즉, 유로(11)에서 비등하여 기화된 작동유체를 제1배관(51)을 통해 응축기(60)로 보내고, 응축기(60)는 기화된 작동유체를 냉각/응축시켜 액화한 후, 액화된 작동유체를 제2배관(52)을 통해 다시 유로(11)로 보내는 방식을 사용한다.9, the base 100, the wick 200, and the cover 300 are used as a kind of evaporator 50, and a plurality of evaporators 50 May be connected to a single condenser 60 as a cooling means and used. That is, the working fluid vaporized and vaporized in the flow path 11 is sent to the condenser 60 through the first pipe 51, and the condenser 60 liquefies the evaporated working fluid by cooling / condensing it, And the fluid is sent back to the flow path 11 through the second pipe 52.
도 9와 같이 다수의 증발기(50)와 단일의 응축기(60)를 사용하는 냉각장치에서 증발기(50)는 제1 및 제2배관(51, 52)의 연결을 위해서 제1실시예보다 기화된 작동유체와 액화된 작동유체가 각각 기체공간(210)과 유로(110)에 분리되는 제2실시예를 사용하는 것이 적합할 수 있다.9, in a cooling apparatus using a plurality of evaporators 50 and a single condenser 60, the evaporator 50 is connected to the first and second pipes 51, It may be appropriate to use the second embodiment in which the working fluid and the liquefied working fluid are separated into the gas space 210 and the flow path 110, respectively.
이러한 방식은 다수의 증발기(50)에서 기화된 작동유체를 단일의 응축기(60)에서 냉각/응축시킬 수 있으므로 비교적 좁은 공간에서도 효율적으로 냉각장치를 구현할 수 있는 효과가 있다. This method can cool / condense the working fluid vaporized in the plurality of evaporators 50 in the single condenser 60, so that the cooling device can be efficiently implemented even in a relatively small space.
도 10은 다수의 열원(각종 센서, 레이다)이 설치되는 자율주행 자동차(70)를 개략적으로 도시한 것이다.10 schematically shows an autonomous vehicle 70 on which a plurality of heat sources (various sensors, radars) are installed.
도 10에 도시된 바와 같이, 응축기(60)는 자율주행 자동차(70)의 후방에 설치되고, 증발기(50)는 자율주행 자동차(70)에 설치되는 각종 센서에 설치될 수 있다. 자율주행 자동차(70)에는 다양한 위치에 다수의 센서가 부착될 수 있으나, 주로 차량의 트렁크 측에 다수의 센서가 밀집되어 있다. 따라서 응축기(60)는 차량의 후방에 설치되고, 차량의 후방에 밀집된 센서들에 설치된 증발기(50) 각각에 연결되어 해당 센서들에서 발생하는 열을 냉각시킬 수 있다. 차량의 후방에 설치된 증발기(50)는 도 10에서는 단일개로 표현되어 있지만 다수일 수 있으며, 즉 응축기(60)와 차량의 후방에 설치된 증발기(50)는 도 9에 도시된 실시예일 수 있다.10, the condenser 60 is installed at the rear of the autonomous vehicle 70, and the evaporator 50 can be installed at various sensors installed in the autonomous vehicle 70. As shown in FIG. A plurality of sensors can be attached to the autonomous vehicle 70 at various positions, but a plurality of sensors are concentrated mainly on the trunk side of the vehicle. Accordingly, the condenser 60 is installed at the rear of the vehicle, and is connected to each of the evaporators 50 installed in the sensors disposed at the rear of the vehicle, so that the heat generated by the sensors can be cooled. The evaporator 50 installed at the rear of the vehicle is represented by a single unit in FIG. 10, but may be a plurality of units, that is, the condenser 60 and the evaporator 50 installed at the rear of the vehicle may be the embodiment shown in FIG.
도 10에 도시된 자율주행 자동차(70)의 상부에 설치된 증발기(50)의 경우 차량의 후방에 설치된 응축기(60)와 거리가 멀기 때문에 별도로 연결되지 않고, 도 5에 도시된 바와 같이 증발기 자체에 히트싱크 또는 냉각장치가 설치될 수 있다. 즉, 자율주행 자동차(70)의 상부에 설치되는 증발기(50)는 편의상 증발기라고 표현할 뿐, 자체적인 냉각장치로 활용된다.The evaporator 50 installed on the autonomous vehicle 70 shown in FIG. 10 is not connected to the condenser 60 installed on the rear side of the vehicle and is not connected to the evaporator 50 itself, A heat sink or a cooling device may be installed. That is, the evaporator 50 installed on the autonomous vehicle 70 is conveniently referred to as an evaporator, and is used as a cooling device of its own.
[냉각장치의 제조방법][Manufacturing method of cooling device]
이하 본 발명에 의한 냉각장치의 제조방법에 대하여 상세히 설명한다. 먼저, 본 발명에 의한 냉각장치 제조방법은 브레이징(Brazing)이 사용될 수 있다. 브레이징은 금속재료나 비금속재료의 접합방법이 하나로, 섭씨 450도 이상 모재(base metal)의 용융점 이하의 온도에서 접합부를 가열하여 모재는 녹이지 않고 용가재만 녹여 모재를 접합하는 기술이며, 브레이징을 사용하는 본 발명에 의한 냉각장치의 제조방법은 제1 내지 제4단계를 포함할 수 있다.Hereinafter, a method of manufacturing a cooling apparatus according to the present invention will be described in detail. First, brazing may be used in the method of manufacturing the cooling device according to the present invention. Brazing is a technique of joining metal materials or nonmetal materials to heat the joints at a temperature below the melting point of the base metal of more than 450 degrees Celsius to melt the base material and melt the base material without melting, The manufacturing method of the cooling device according to the present invention may include the first to fourth steps.
제1단계는 베이스부(100)와 커버(300)의 접합면에 용가재를 삽입하거나, 용가재층을 형성하는 단계이다. 베이스부(100)와 커버(300)의 접합면은 도 3에 도시된 바와 같이 삽입부(121)로, 용가재는 삽입부(121)에 공급되거나, 베이스부(100)와 커버(300)에 용가재층이 형성될 수 있다.The first step is a step of inserting a filler material into the bonding surface of the base part 100 and the cover 300 or forming a filler layer. 3, the joining surface of the base part 100 and the cover 300 is inserted into the insertion part 121, the filler material is supplied to the insertion part 121, or the joining surface of the base part 100 and the cover 300 An excipient layer may be formed.
제2단계는 도 4에 도시된 바와 같이, 상기 돌출부재(110)의 상부에 상기 윅(200)을 배치하고, 상기 돌출부재(110)와 구획 프레임(120)으로 구획되는 삽입부(121)에 커버(300)의 하면에 형성된 끼움부(310)를 삽입하여, 조립체를 형성한다.4, the wick 200 is disposed on the upper portion of the protruding member 110, and the insertion portion 121, which is defined by the protruding member 110 and the dividing frame 120, The insertion portion 310 formed on the lower surface of the cover 300 is inserted to form an assembly.
제3단계는, 상기 조립체의 외면에 브레이징 플럭스(Brazing Flux)를 도포하는 단계이다. 브레이징 플럭스는 모재, 즉 베이스부(100)와 커버(300)의 산화를 방지하기 위해 사용되는 재료를 말하며, 일반적으로 액체 상태의 브레이징 플럭스를 사용한다.The third step is a step of applying a brazing flux to the outer surface of the assembly. The brazing flux refers to a material used to prevent oxidation of the base material, that is, the base portion 100 and the cover 300, and generally uses a brazing flux in a liquid state.
제3단계에서 액체 상태의 브레이징 플러스를 도포하면, 베이스부(100)와 커버(300)의 사이 접합면에 브레이징 플럭스가 유입될 수 있으나, 도 4에 도시된 바와 같이 구획 프레임(120)에 의해 삽입부(121)와 돌출부재(110)가 서로 구획되므로, 브레이징 플럭스는 돌출부재(110)가 위치한 측으로 유입되는 것을 막을 수 있다.In the third step, when the brazing flux is applied in the liquid state, the brazing flux may flow into the joint between the base part 100 and the cover 300. However, as shown in FIG. 4, Since the insertion portion 121 and the protruding member 110 are partitioned from each other, the brazing flux can be prevented from flowing into the side where the protruding member 110 is located.
제4단계는 베이스부(100)와 커버(300)의 용융점 이하이되, 용가재의 용융점 이상의 온도에서 조립체를 가열하여 베이스부(100)와 커버(300)를 서로 접합한다.In the fourth step, the assembly is heated at a temperature equal to or higher than the melting point of the base portion 100 and the cover 300, and the base portion 100 and the cover 300 are bonded to each other.
상기한 제1 내지 제4단계를 통해 베이스부(100)와 커버(300)를 접합하면, 냉각수단을 설치 또는 부가하여 본 발명에 의한 냉각장치를 제조할 수 있다.When the base part 100 and the cover 300 are bonded to each other through the first to fourth steps, a cooling device according to the present invention can be manufactured by installing or adding a cooling device.
본 발명은 상기한 실시예에 한정되지 아니하며, 적용범위가 다양함은 물론이고, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 다양한 변형 실시가 가능한 것은 물론이다.It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
[부호의 설명][Description of Symbols]
10 : 열원 20 : 하우징10: heat source 20: housing
30 : 윅 31 : 증기유로30: Wick 31: Steam channel
40 : 팬40: Fans
50 : 증발기 51 : 제1배관50: evaporator 51: first piping
52 : 제2배관 60 : 응축기52: Second piping 60: Condenser
70 : 자율주행 자동차70: Autonomous vehicle
100 : 베이스부 110 : 돌출부재100: base portion 110: projecting member
111 : 유로 120 : 구획 프레임111: EURO 120: Compartment frame
121 : 삽입부 130 : 외곽 프레임121: insertion part 130: outer frame
200 : 윅 201 : 정렬 보조부200: wick 201: alignment support
210 : 기체공간 220 : 유체통로210: gas space 220: fluid passage
300 : 커버 310 : 끼움부300: cover 310:
400 : 히트싱크400: Heatsink
500 : 팬 510 : 브라켓500: Fan 510: Bracket

Claims (18)

  1. 상면에 적어도 하나 이상 형성된 돌출부재(110)를 포함하고, 열원과 맞닿아 열을 전달받는 베이스부(100);A base part (100) including at least one protrusion (110) formed on an upper surface thereof and contacting the heat source to receive heat;
    일면이 상기 돌출부재(110)의 상단과 맞닿도록 상기 베이스부(100)에 덮여 작동유체의 비등 및 응축이 일어나는 유로(111)를 형성하는 윅(200);A wick (200) covering the base portion (100) so that one surface thereof abuts an upper end of the protruding member (110) and forming a flow path (111) in which boiling and condensation of working fluid occur;
    상기 베이스부(100)의 상부를 덮는 커버(300); 및A cover 300 covering an upper portion of the base 100; And
    상기 유로(111)에서 비등하여 기화된 작동유체를 냉각시키는 냉각수단;A cooling means for cooling the working fluid vaporized and vaporized in the flow path 111;
    을 포함하는 것을 특징으로 하는 냉각장치.And the cooling device.
  2. 제1항에 있어서,The method according to claim 1,
    상기 돌출부재(110)는 상기 베이스부(100)의 상면에서 상측으로 돌출되고, 상기 베이스부(100)의 상면을 따라 일측으로 연장되는 것을 특징으로 하는 냉각장치.Wherein the protruding member (110) protrudes upward from the upper surface of the base part (100) and extends to one side along the upper surface of the base part (100).
  3. 제2항에 있어서,3. The method of claim 2,
    상기 돌출부재(110)는 복수개가 상기 베이스부(100)의 상면에 일정 간격 이격되어 평행하게 배치되는 것을 특징으로 하는 냉각장치.Wherein a plurality of the projecting members (110) are arranged parallel to the upper surface of the base part (100) with a predetermined distance therebetween.
  4. 제1항에 있어서,The method according to claim 1,
    상기 돌출부재(110)는 복수개가 상기 베이스부(100)의 상면에 서로 일정간격 이격되어 이차원으로 배치되는 것을 특징으로 하는 냉각장치.Wherein a plurality of the projecting members (110) are arranged on the upper surface of the base part (100) at a certain distance from each other and arranged in two dimensions.
  5. 제1항에 있어서,The method according to claim 1,
    상기 베이스부(100)는 상면에 형성되어 상기 돌출부재(110)와 상면을 구획하는 구획 프레임(120) 및The base unit 100 includes a partition frame 120 formed on an upper surface thereof and partitioning the upper surface of the protrusion member 110,
    상기 커버(300)의 하면에 돌출 형성된 끼움부(310)가 삽입되는 삽입부(121)를 포함하는 것을 특징으로 하는 냉각장치.And an insertion portion (121) into which the fitting portion (310) protruding from the lower surface of the cover (300) is inserted.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 구획 프레임(120)은 상기 돌출부재(110)를 둘러싸도록 형성되는 것을 특징으로 하는 냉각장치.Wherein the partition frame (120) is formed to surround the projecting member (110).
  7. 제5항에 있어서,6. The method of claim 5,
    상기 베이스부(100)는 상면의 외곽에 형성되는 외곽 프레임(130)을 더 포함하고,The base unit 100 further includes an outer frame 130 formed at an outer periphery of the upper surface,
    상기 삽입부(121)는 상기 구획 프레임(120)과 상기 외곽 프레임(130) 사이에 형성되는 것을 특징으로 하는 냉각장치.Wherein the insertion portion (121) is formed between the partition frame (120) and the outer frame (130).
  8. 제1항에 있어서,The method according to claim 1,
    상기 윅(200)의 상단은 상기 커버(300)의 하면과 밀착되는 것을 특징으로 하는 냉각장치.Wherein an upper end of the wick (200) is in close contact with a lower surface of the cover (300).
  9. 제1항에 있어서,The method according to claim 1,
    상기 커버(300)와 상기 윅(200) 사이에는 기화된 작동유체가 위치하는 기체공간(210)이 형성되는 것을 특징으로 하는 냉각장치.Wherein a gas space (210) is formed between the cover (300) and the wick (200), in which a vaporized working fluid is located.
  10. 제9항에 있어서,10. The method of claim 9,
    상기 커버(300)는 하면이 상기 윅(200)의 상단과 일정 간격 이격되는 것을 특징으로 하는 냉각장치.Wherein the lower surface of the cover (300) is spaced apart from the upper end of the wick (200) by a predetermined distance.
  11. 제9항에 있어서,10. The method of claim 9,
    상기 윅(200)은 상기 유로(111)와 상기 기체공간(210)을 연결하도록 형성된 유체통로(220)를 포함하는 것을 특징으로 하는 냉각장치.Wherein the wick (200) includes a fluid passage (220) formed to connect the flow path (111) and the gas space (210).
  12. 제1항에 있어서,The method according to claim 1,
    상기 윅(200)은 하면에 돌출되어 인접한 돌출부재(110) 사이에 삽입되는 정렬 보조부(201)를 포함하는 것을 특징으로 하는 냉각장치.Wherein the wick (200) comprises an alignment assisting portion (201) protruding from a lower surface and inserted between adjacent protruding members (110).
  13. 제12항에 있어서,13. The method of claim 12,
    상기 정렬 보조부(201)는 돌출된 일면의 측면이 빗면으로 형성되는 것을 특징으로 하는 냉각장치.Wherein the alignment assisting portion (201) has a protruded one side surface formed as an oblique surface.
  14. 제1항에 있어서,The method according to claim 1,
    상기 베이스부(100)와 상기 커버(300) 사이의 공간은 진공인 것을 특징으로 하는 냉각장치.Wherein the space between the base (100) and the cover (300) is a vacuum.
  15. 제1항에 있어서,The method according to claim 1,
    상기 커버(300)의 외면에 형성되는 히트 싱크(400)를 더 포함하는 것을 특징으로 하는 냉각장치.And a heat sink (400) formed on the outer surface of the cover (300).
  16. 제1항에 있어서,The method according to claim 1,
    상기 냉각수단은 기화된 작동유체를 공급받아 냉각 및 응축시켜 액화시키고, 액화된 작동유체를 상기 유로(111)로 공급하는 것을 특징으로 하는 냉각장치.Characterized in that the cooling means is supplied with the vaporized working fluid, cooled, condensed and liquefied, and supplies the liquefied working fluid to the flow path (111).
  17. 제1항에 있어서,The method according to claim 1,
    상기 냉각수단은 상기 커버(300)의 외면으로 냉매를 공급하는 것을 특징으로 하는 냉각장치.Wherein the cooling means supplies refrigerant to an outer surface of the cover (300).
  18. 제1항 내지 제17항 중 선택되는 어느 한 항의 냉각장치의 제조방법에 있어서,A method of manufacturing a cooling device according to any one of claims 1 to 17,
    상기 베이스부(100)와 상기 커버(300)의 접합면에 용가재를 삽입하거나 용가재층을 형성하는 제1단계;A first step of inserting a filler material or forming a filler material layer on the joint surface of the base part 100 and the cover 300;
    상기 돌출부재(110)의 상부에 상기 윅(200)을 배치하고, 상기 베이스부(100)에 형성된 삽입부(121)에 커버(300)의 하면에 형성된 끼움부(310)를 삽입하여 조립체를 형성하는 제2단계;The wick 200 is disposed on the upper part of the protruding member 110 and the fitting part 310 formed on the lower surface of the cover 300 is inserted into the insertion part 121 formed in the base part 100, A second step of forming;
    상기 조립체의 외면에 브레이징 플럭스를 도포하는 제3단계; 및A third step of applying a brazing flux to the outer surface of the assembly; And
    플럭스를 도포한 상기 조립체를 브레이징하는 제4단계;A fourth step of brazing the assembly to which the flux is applied;
    를 포함하는 것을 특징으로 하는 냉각장치 제조방법.Wherein the cooling device comprises a cooling device.
PCT/KR2018/011836 2018-01-09 2018-10-08 Cooling device and method for manufacturing cooling device WO2019139219A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330329A (en) * 1998-05-20 1999-11-30 Denso Corp Vaporizing cooling device
KR200276384Y1 (en) * 2001-12-28 2002-05-22 엠쏘정보통신(주) Power amplifier unit having improved cooling structure
US20060124281A1 (en) * 2003-06-26 2006-06-15 Rosenfeld John H Heat transfer device and method of making same
KR20060109119A (en) * 2005-04-15 2006-10-19 엘에스전선 주식회사 Flat type heat transfer device
JP2008153423A (en) * 2006-12-18 2008-07-03 Yaskawa Electric Corp Vapor chamber, and electronic device using it
KR20160036470A (en) * 2014-09-24 2016-04-04 한국전자통신연구원 Sintered flat panel heat dissipation structure comprising outer pin

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452680B1 (en) 1997-03-25 2004-12-17 삼성전자주식회사 Method for selectively maintaining a reservation work of a facsimile device to maintain the reservation work although a memory clear work is performed
CN201421283Y (en) * 2009-01-15 2010-03-10 金积德 Uniform temperature heat transfer device
CN102778157B (en) * 2011-05-12 2014-03-19 北京芯铠电子散热技术有限责任公司 Flat plate soaking plate and manufacturing method thereof
CN105352352A (en) * 2015-11-18 2016-02-24 上海利正卫星应用技术有限公司 Ultra-thin even-temperature plate device and manufacturing method thereof
CN106602105B (en) * 2016-12-09 2019-02-12 淳铭散热科技股份有限公司 proton exchange membrane fuel cell thermal management system
CN106550588A (en) * 2016-12-09 2017-03-29 淳铭散热科技股份有限公司 Liquid cooling heat radiation system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330329A (en) * 1998-05-20 1999-11-30 Denso Corp Vaporizing cooling device
KR200276384Y1 (en) * 2001-12-28 2002-05-22 엠쏘정보통신(주) Power amplifier unit having improved cooling structure
US20060124281A1 (en) * 2003-06-26 2006-06-15 Rosenfeld John H Heat transfer device and method of making same
KR20060109119A (en) * 2005-04-15 2006-10-19 엘에스전선 주식회사 Flat type heat transfer device
JP2008153423A (en) * 2006-12-18 2008-07-03 Yaskawa Electric Corp Vapor chamber, and electronic device using it
KR20160036470A (en) * 2014-09-24 2016-04-04 한국전자통신연구원 Sintered flat panel heat dissipation structure comprising outer pin

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