WO2019132275A1

WO2019132275A1 - Circuit board using lds technique and manufacturing method therefor

Info

Publication number: WO2019132275A1
Application number: PCT/KR2018/015102
Authority: WO
Inventors: 이성모; 조용주; 유진화
Original assignee: 유림특수화학 주식회사
Priority date: 2017-12-28
Filing date: 2018-11-30
Publication date: 2019-07-04
Also published as: KR101985795B1

Abstract

Disclosed are a circuit board using the LDS technique capable of strengthening the adhesion and bonding force between a substrate of a metallic material and a photo-reactive paint coating layer, and a manufacturing method therefor.

Description

Circuit board using LDS method and manufacturing method thereof

The present invention relates to a circuit board and a manufacturing method thereof, and more particularly, to a circuit board using an LDS method capable of enhancing adhesion and adhesion between a metal substrate and a photoreactive coating layer, and a manufacturing method thereof.

In recent years, laser direct structuring (LDS) has been used to form accurate patterns and circuits by laser processing and plating. LDS can form patterns and circuits in a simple process involving laser activation and electroless plating of the injection. Specifically, after activating the plastic surface at a position where the laser beam is moved on the injection molding device (MID) to place the conductive path, using a composition for direct direct structuring of the laser, a small conductive path width (for example, So that it is possible to express a fine pattern.

However, this method requires separate injection molding in order to form a fine pattern using the injection molding. Further, since the composition is not excellent in heat resistance and adhesion stability, there is a problem that when the composition is coated on a substrate, the substrate and the coating film peel off or float during laser processing.

A related prior art is Korean Patent Laid-Open Publication No. 10-2014-0091029 (published on July 18, 2014), which discloses a thermoplastic composition for use in forming a laser direct structure substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a circuit board using the LDS method capable of enhancing adhesion and adhesion between a metal base material and a photoreactive coating layer, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a method of manufacturing a circuit board using an LDS method, including: (a) coating a primer coating composition on a substrate and drying the primer coating composition to form a primer coating layer; (b) applying a photoreactive coating composition on the primer coating layer and drying to form a photoreactive coating layer; And (c) selectively irradiating the photoreactive coating layer with a laser to elute the photoreactive filler of the photoreactive coating layer, and plating the eluted photoreactive filler to form a circuit pattern .

According to an aspect of the present invention, there is provided a circuit board using an LDS method, comprising: a substrate; A primer coating layer disposed on the substrate; A photoreactive paint coating layer disposed on the primer coating layer and having a photoreactive filler added thereto; And a circuit pattern formed by plating the photoreactive paint coating layer with the photoreactive filler through selective laser irradiation.

The circuit board using the LDS method and its manufacturing method according to the present invention can be manufactured by coating a primer coating layer and a photoreactive coating layer on a base material and then selectively irradiating laser to elute the photoreactive layer of the photoreactive coating layer , It is possible to form a circuit pattern having the same shape as the eluted photoreactive filler by plating using only the eluted photoreactive filler as a seed.

As a result, the circuit board using the LDS method and its manufacturing method according to the present invention can be manufactured by forming a primer coating layer and a photoreactive coating layer on a metal substrate by a coating method, irradiating the photoreactive coating layer directly with a laser, The circuit pattern is formed using the photoreactive filler activated and eluted by the laser irradiation on the surface of the reactive paint coating layer as a seed so that it is possible to form a circuit pattern on the side portion of the substrate which is difficult to form a circuit pattern.

In addition, the circuit board using the LDS method and the method of manufacturing the same according to the present invention can enhance the adhesion and adhesion between the metal base material and the photoreactive paint coating layer by arranging the primer coating layer between the metal base material and the photoreactive coating layer. It is possible to prevent poor adhesion in the evaluation of the plating adhesion and to prevent a short defect in the lighting test after manufacturing the LED module.

1 is a sectional view showing a circuit board using an LDS method according to an embodiment of the present invention;

2 is a process flow diagram illustrating a method of manufacturing a circuit board using an LDS method according to an embodiment of the present invention.

3 to 6 are cross-sectional views illustrating a method of manufacturing a circuit board using an LDS method according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a circuit board using LDS method according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a circuit board using an LDS method according to an embodiment of the present invention.

Referring to FIG. 1, a circuit board 100 using an LDS method according to an embodiment of the present invention includes a substrate 120, a primer coating layer 140, a photoreactive coating layer 160, and a circuit pattern 180 do.

The base material 120 may be selected from metals, plastics, glass materials and the like, and more preferably, a metal material having excellent rigidity and strength is used. As the metal that can be used as the material of the substrate 120, Al, Cr, Ni, Cu, or the like can be selected.

The primer coating layer 140 is disposed on the substrate 120. Particularly, the primer coating layer 140 is attached between the substrate 120 made of a metal and the photoreactive coating layer 160 to improve adhesion and adhesion.

Therefore, when the photoreactive coating layer 160 is directly disposed on the base material 120 without forming the primer coating layer 140, the metal base material 120 and the photoreactive coating layer 160 are deposited on the plating solution The adhesive strength may be lowered due to insufficient resistance to the adhesive.

The primer coating layer 140 may be formed by applying a primer coating composition on the substrate 120 and drying at 130-170 캜 for 10-60 minutes.

The primer coating composition comprises 5 to 10% by weight of inorganic filler, 10 to 20% by weight of pigment, 10 to 30% by weight of organic solvent, 0.1 to 1.0% by weight of surface control agent, 0.05 to 1.0% by weight of dispersant, 0.01 to 0.5% %, Adhesion promoter 0.1 to 3.0 wt%, and the balance binder resin.

The inorganic filler is added to improve adhesion and adhesion. At this time, as the inorganic filler, at least one selected from talc, calcium carbonate and the like can be used. It is more preferable to use an inorganic filler having an average diameter of 1 mu m or less in order to ensure dispersibility.

When the addition amount of the inorganic filler is less than 5% by weight of the total weight of the primer coating composition, it may be difficult to secure adhesion and adhesion. On the contrary, when the addition amount of the inorganic filler exceeds 10 wt% of the total weight of the primer coating composition, the dispersibility may not be good due to excessive addition of the inorganic filler.

Pigments, like inorganic fillers, are added to improve adhesion and adhesion. At this time, TiO2 may be used as the pigment.

The organic solvent is added to adjust the viscosity of the primer coating composition. Examples of the organic solvent include methyl ethyl ketone, methyl isobutyl ketone, dimethyl ketone, isopropyl alcohol, isobutyl alcohol, At least one selected from the group consisting of normal butyl alcohol, ethyl acetate, ethyl cellusolve and butyl cellusolve may be used.

When the amount of the organic solvent to be added is less than 10% by weight of the total weight of the primer coating composition, the viscosity of the primer coating composition is low and the dispersibility is poor, so that it may be difficult to prepare the paste in a paste state. On the other hand, when the amount of the organic solvent added is more than 30% by weight of the total amount of the primer coating composition, it is difficult to ensure a proper thickness of the coating film due to the excessive amount of the organic solvent during the spray coating using the nozzle .

For this purpose, the primer coating layer 140 preferably has a thickness of 20 to 40 탆. If the thickness of the primer coating layer 140 is less than 20 탆, it may be difficult to exhibit the effect of improving the adhesion and adhesion, and since the thickness of the primer coating layer 140 is too thin, It can cause defects. On the contrary, when the thickness of the primer coating layer 140 is more than 40 탆, the thickness of the primer coating layer 140 may be increased only to increase the thickness of the coating layer without increasing the effect.

The surface control agent is added to improve the surface modification property of the coating film. For this purpose, polymeric elastomer, PDMS (Polydimethyl siloxane), may be used as the surface modifier. PDMS is a high molecular polymer made of silicon and has excellent durability and flexibility and is transparent.

If the addition amount of the surface modifier is less than 0.1 wt% of the total weight of the primer coating composition, it may be difficult to exert the surface modifying effect properly. On the other hand, if the addition amount of the surface modifier exceeds 1.0% by weight of the total weight of the primer coating composition, it is not preferable because the production cost is increased only without increasing the effect.

The dispersant is added to improve the dispersibility of the base resin, the inorganic filler and the pigment, and an acrylic copolymer may be used. The acrylic copolymer is characterized by being able to uniformly disperse the paint with the polymer polymer and to control the viscosity, and is excellent in thermal decomposition property, non-discoloration property, transparency, weather resistance and easy copolymerization with other components.

The anti-settling agent is added to exhibit the anti-settling effect. Such an anti-settling agent may be an amide wax to prevent layer separation. The amide wax means a wax in which polyamide is dispersed in water which is water-soluble and which is a solvent.

The adhesion promoter may comprise a copolymer having a hydrophilic functional group. For example, a copolymer having an acidic functional group, -COOH, can be used as the adhesion promoter. The adhesion reinforcing agent having such a functional group has an effect of improving the adhesion due to the interaction by the electric bonding, the van der Waals force and the acidic functional group.

As the binder resin, at least one selected from an acryl-based polyol, an ester-based polyol, a melamine resin and an epoxy resin may be used. The acrylic polyol may be, for example, acrylic polyol, and the acrylic polyol may have a weight average molecular weight of 5000 to 100,000.

The ester-based polyol is produced by a condensation reaction of a polybasic acid and a polyhydric alcohol. Examples thereof include polybasic acids such as isophthalic acid and phthalic anhydride, and ethylene glycol and butane. Diol, pentanediol, or other polyhydric alcohol to produce an ester-based polyol. The ester-based polyol is inexpensive and the manufacturing process is simple.

A melamine resin is a thermosetting resin that has excellent water resistance and heat resistance and is prepared by mixing melamine and formalin to form methinol melamine and then dehydrating and condensing the melamine resin.

Epoxy resins are synthesized by polymerization of epichlorohydrin and bisphenol A, and have excellent mechanical properties, abrasion resistance, and water resistance when cured. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, and the like.

The photoreactive coating layer 160 is disposed on the primer coating layer 140. The photoreactive coating layer 160 may be formed by applying a photoreactive coating composition on the primer coating layer 140 and drying at 130-170 ° C for 100-200 minutes.

In this case, the photoreactive coating composition comprises 10 to 20 wt% of a photoreactive filler, 10 to 40 wt% of an organic solvent, 0.1 to 1.0 wt% of a surface conditioner, 0.05 to 1.0 wt% of a dispersant, 0.01 to 0.5 wt% To 3.0% by weight and the balance binder resin.

When forming the circuit pattern 180 using the LDS method, the photoreactive filler 165 locally activates only the irradiated portion of the photoreactive coating layer 160 on the substrate 120 by selectively irradiating the laser to activate Reactive filler 165 is eluted to the surface of the photoreactive coating layer 160 and the circuit pattern 180 is formed by plating only the portion where the eluted photoreactive filler 165a is disposed.

For this, the photoreactive filler 165 may include a metal compound that can be activated by a laser. Examples of such photoreactive fillers 165 include copper nitrate (Cu (NO ₃ ) ₂ ), cupper nitrite Cu ₃ N, titanium dioxide (TiO ₂ ), antimony oxide may be selected from _{_{(antimony oxide, Sb 2 O 3}} ), copper phosphate (copper (II) phosphate, Cu 3 (PO 4) 2). As the photoreactive filler 165, those having an average diameter of about 1 mu m or less can be used.

If the addition amount of the photoreactive filler 165 is less than 10% by weight of the total weight of the photoreactive coating composition, the amount of the plating seed formed during laser irradiation may be insufficient to cause plating defects. On the contrary, when the addition amount of the photoreactive filler 165 exceeds 20% by weight of the total weight of the photoreactive coating composition, it may act as a factor to lower the physical properties of the coating film.

The organic solvent is added to control the viscosity of the photoreactive coating composition. Examples of the organic solvent include methyl ethyl ketone, methyl isobutyl ketone, dimethyl ketone, isopropyl alcohol, isobutyl alcohol, At least one selected from the group consisting of normal butyl alcohol, ethyl acetate, ethyl cellusolve and butyl cellusolve may be used.

When the amount of the organic solvent to be added is less than 10% by weight of the total weight of the photoreactive coating composition, the viscosity of the photoreactive coating composition may be lowered and the dispersibility may be poor. On the contrary, when the amount of the organic solvent added is more than 40% by weight of the total weight of the photoreactive coating composition, it is difficult to ensure the appropriate thickness of the coating film due to the excessive addition of the organic solvent during the spray coating using the nozzle Can be followed.

In addition, the surface conditioner, dispersant, anti-settling agent, adhesion promoter and binder resin added to the photoreactive coating composition may be substantially the same as the surface conditioner, dispersant, anti-settling agent, adhesion promoter and binder resin added to the primer coating composition Therefore, redundant description is omitted.

The circuit pattern 180 is formed by plating a photoreactive filler 165a, which is selectively irradiated with laser light to the photoreactive paint coating layer 160 to be eluted.

That is, a selective laser irradiation is applied to the photoreactive coating layer 160 to dissolve the photoreactive filler 165 of the photoreactive coating layer 160 to the surface, and then the eluted photoreactive filler 165a is used as a seed Plating can be performed to form a circuit pattern 180 having substantially the same shape as the eluted photoreactive filler 165a.

In the circuit board using the LDS method according to the embodiment of the present invention, a primer coating layer and a photoreactive coating layer are coated on a substrate, and selective laser irradiation is performed to dissolve the photoreactive layer of the photoreactive coating layer It is possible to form a circuit pattern having the same shape as the eluted photoreactive filler by performing plating using only the eluted photoreactive filler as a seed.

As a result, in the circuit board using the LDS method according to the embodiment of the present invention, a primer coating layer and a photoreactive coating layer were formed on a substrate made of metal by a coating method, and a laser was irradiated directly to the photoreactive coating layer, A circuit pattern can be formed using a photoreactive filler that is activated and eluted by the laser irradiation on the surface of the paint coating layer as a seed, so that it is possible to form a circuit pattern on the side surface of the substrate, which is difficult to form a circuit pattern.

In addition, the circuit board using the LDS method according to the embodiment of the present invention can improve the adhesion and adhesion between the metal base material and the photoreactive paint coating layer by disposing a primer coating layer between the metal base material and the photoreactive coating layer It is possible to prevent adhesion failure in the evaluation of the plating adhesion and to prevent a short defect in the lighting test after manufacturing the LED module.

Hereinafter, a method of manufacturing a circuit board using the LDS method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a process flow chart illustrating a method of manufacturing a circuit board using the LDS method according to an embodiment of the present invention, and FIGS. 3 to 6 are process sectional views illustrating a method of manufacturing a circuit board using the LDS method according to an embodiment of the present invention .

Referring to FIG. 2, a method of manufacturing a circuit board using an LDS method according to an embodiment of the present invention includes forming a primer coating layer (S110), forming a photoreactive coating layer (S120), and forming a circuit pattern (S130) do.

primer Formation of paint coating layer

2 and 3, in a primer coating layer formation step (S110), a primer coating composition is applied onto a base material 120 and dried to form a primer coating layer 140. [

The base material 120 may be selected from metal, plastic, and glass materials, and more preferably, a metal material having excellent rigidity and strength is used. As the metal that can be used as the material of the substrate 120, Al, Cr, Ni, Cu, or the like can be selected.

As described above, the primer coating composition comprises 5 to 10% by weight of inorganic filler, 10 to 20% by weight of pigment, 10 to 30% by weight of organic solvent, 0.1 to 1.0% by weight of surface control agent, 0.05 to 1.0% ~ 0.5 wt%, adhesion promoter 0.1 ~ 3.0 wt%, and the balance binder resin.

The drying is preferably performed at 130 to 170 ° C for 10 to 60 minutes. At this time, if the drying temperature is less than 130 ° C or the drying time is less than 10 minutes, the primer coating composition may not be sufficiently dried and may not uniformly adhere to the substrate. On the contrary, when the drying temperature exceeds 170 DEG C or the drying time exceeds 60 minutes, it may be a factor that raises the manufacturing cost without further increase in the effect, which is not preferable.

The primer coating layer 140 is preferably formed to a thickness of 20 to 40 탆. When the thickness of the primer coating layer 140 is less than 20 탆, it may be difficult to exhibit the adhesion improving effect properly, and the thickness of the primer coating layer 140 may be too thin to cause a short defect in the lighting test after the LED module is manufactured on the substrate . On the contrary, when the thickness of the primer coating layer 140 is more than 40 탆, the thickness of the primer coating layer 140 may be increased only to increase the thickness of the coating layer without increasing the effect.

Photoreactive Formation of paint coating layer

As shown in FIGS. 2 and 4, in the step of forming a photoreactive coating layer (S120), a photoreactive coating composition is coated on a primer coating layer 140 and dried to form a photoreactive coating layer 160. Referring to FIG.

The photoreactive coating composition comprises 10 to 20 wt% of a photoreactive filler, 10 to 40 wt% of an organic solvent, 0.1 to 1.0 wt% of a surface conditioner, 0.05 to 1.0 wt% of a dispersant, 0.01 to 0.5 wt% of an anticorrosive agent, Percent by weight, and the balance binder resin.

At this time, drying is preferably performed at 130 to 170 ° C for 100 to 200 minutes.

If the drying temperature is less than 130 ° C or the drying time is less than 100 minutes in this step, the photoreactive coating composition may not be sufficiently dried and may not be uniformly adhered to the primer coating layer 140, resulting in a decrease in adhesion and adhesion . On the contrary, when the drying temperature exceeds 170 ° C or the drying time exceeds 200 minutes, there is a fear that the film quality is not good due to excessive drying.

Circuit pattern formation

As shown in FIG. 2, in the circuit pattern forming step (S130), the photoreactive coating layer is selectively laser-irradiated to elute the photoreactive filler of the photoreactive coating layer, and the eluted photoreactive filler is plated Thereby forming a circuit pattern.

5, a selective laser L is irradiated from the laser beam 200 to the photoreactive coating layer 160 to form a photoreactive layer 165 of the photoreactive coating layer 160 on the surface . Accordingly, the photoreactive filler 165a, which is selectively eluted only to the portion irradiated with the laser beam 200 by the laser beam 200, is disposed on the surface of the photoreactive coating layer 160.

Next, as shown in Fig. 6, plating is performed using the eluted photoreactive filler as a seed to form a circuit pattern having the same shape as the eluted photoreactive filler.

The circuit substrate using the LDS method according to the embodiment of the present invention manufactured by the above-described processes (S110 to S130) is formed by coating a primer coating layer and a photoreactive coating layer on a substrate, It is possible to form a circuit pattern having the same shape as the eluted photoreactive filler by eluting the photoreactive filler of the reactive paint coating layer and plating using only the eluted photoreactive filler as a seed.

As a result, the circuit board using the LDS method, which is manufactured by the method according to the embodiment of the present invention, forms a primer coating layer and a photoreactive coating layer by coating on a metal substrate, A circuit pattern is formed using the photoreactive filler activated by laser irradiation on the surface of the photoreactive coating layer as a seed, so that it is possible to form a circuit pattern on the side portion of the substrate, which is difficult to form a circuit pattern have.

In addition, the circuit board using the LDS method manufactured by the method according to the embodiment of the present invention can improve the adhesion between the base material of the metal material and the photoreactive paint coating layer and the adhesion between the metal base material and the photoreactive paint coating layer, It is possible to prevent adherence failure in evaluating the adhesion of plating and to prevent a short defect in the lighting test after fabricating the LED module.

실시예Example

Hereinafter, a preferred embodiment will be described in order to facilitate understanding of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

1. 회로 기판 제조1. Circuit board manufacturing

Example One

Al (Talc) 7 wt%, TiO ₂ % Of a dispersant, 0.3 wt.% Of an amidewax, 2.0 wt.% Of an adhesion promoter, and the remaining acrylic polyol. Was applied to a thickness of 30 탆 and dried at 150 캜 for 30 minutes to prepare a primer coating layer.

Next, 15 wt% of copper nitride (cupper nitrite Cu ₃ N), 30 wt% of methyl ethyl ketone, 0.5 wt% of PDMS (Polydimethyl siloxane), 0.5 wt% of dispersant, and amidewax were coated on the primer coating layer. 0.3 wt%, adhesion reinforcing agent 2.0 wt%, and remaining acrylic polyol was coated at a thickness of 50 탆 and dried at 150 캜 for 120 min to prepare a photoreactive coating layer.

Next, the photoreactive paint coating layer was selectively irradiated with a laser of 3W power to elute the photoreactive filler of the photoreactive coating layer, and electroplated on the photoreactive reactive filler to form a circuit pattern, thereby forming a circuit board .

Example 2

A circuit board was prepared in the same manner as in Example 1, except that the primer coating composition was applied in a thickness of 25 탆 and dried at 130 캜 for 40 minutes to prepare a primer coating layer.

Example 3

A circuit board was prepared in the same manner as in Example 1, except that the primer coating composition was applied in a thickness of 35 탆 and dried at 160 캜 for 20 minutes to prepare a primer coating layer.

Example 4

A circuit board was prepared in the same manner as in Example 1, except that the photoreactive coating composition was applied in a thickness of 60 탆 and dried at 170 캜 for 110 minutes to prepare a photoreactive coating layer.

Comparative Example One

15 wt% of copper nitride (cupper nitrite Cu ₃ N), 30 wt% of methyl ethyl ketone, 0.5 wt% of PDMS (polydimethyl siloxane), 0.5 wt% of dispersant, 0.3 wt% of amide wax (amidewax) %, Adhesive reinforcement of 2.0 wt%, and the remainder of acrylic polyol was coated to a thickness of 50 탆 and dried at 150 캜 for 120 minutes to prepare a photoreactive coating layer.

2. 물성 평가2. Property evaluation

Table 1 shows the results of physical properties evaluation of the specimens prepared according to Examples 1 to 4 and Comparative Example 1. [

1) Adhesion test

The adhesion was evaluated based on the provisions of JIS K 5400. The sample was subjected to a humidifying treatment at 40 占 폚 and 92% RH for 12 hours, followed by a humidifying treatment at 80 占 폚 and 90% RH for 12 hours.

Number of peels / 100 Evaluation: 0/100 "Excellent", 1/100 to 50/100 "Normal", 51/100 to 100/100 "Bad"

2) Alkali resistance test

A 5% sodium hydroxide aqueous solution was immersed at room temperature for 96 hours and then measured. "Good" when it is the same as the initial state, "Normal" when the cracking and discoloration is 50% or less, and "Poor" when the crack or discoloration is 50% or more.

3) Acidity test

A 5% hydrochloric acid aqueous solution was immersed at room temperature for 96 hours and then measured.

"Good" when it is the same as the initial state, "Normal" when the cracking and discoloration is 50% or less, and "Poor" when the crack or discoloration is 50% or more.

4) Coating shear force

A shear test was performed on the coating film based on ASTM F1044-5 to evaluate the shear force characteristics. Above 70N is indicated as "Excellent", 30 to 69N as "Normal" and 0 to 29N as "Bad".

[Table 1]

Referring to Table 1, Examples 1 to 4 exhibited excellent adhesion, alkali resistance, and acid resistance. Particularly, when the coating film shear force was measured to be 86 N or more, it was confirmed that the adhesive properties were excellent.

On the other hand, Comparative Example 1 exhibited excellent alkali resistance and acid resistance, but the adhesion was moderate, and the film shear force measurement was only 53N.

Based on the above experimental results, it was confirmed that when the primer coating layer was formed between the base material of the metal material and the photoreactive coating layer as in Examples 1 to 4, adhesion and adhesion were enhanced.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

Claims

(a) applying a primer coating composition on a substrate and drying to form a primer coating layer;

(b) applying a photoreactive coating composition on the primer coating layer and drying to form a photoreactive coating layer; And

(c) selectively irradiating the photoreactive coating layer with a laser to elute the photoreactive filler of the photoreactive coating layer, and plating the eluted photoreactive filler to form a circuit pattern;

Wherein the method comprises the steps of:
The method according to claim 1,

In the step (a)

The primer coating composition

Wherein the inorganic filler is 5 to 10 wt%, the pigment is 10 to 20 wt%, the organic solvent is 10 to 30 wt%, the surface modifier is 0.1 to 1.0 wt%, the dispersant is 0.05 to 1.0 wt%, the sedimentation inhibitor is 0.01 to 0.5 wt% 3.0% by weight, and the balance binder resin.
The method according to claim 1,

In the step (a)

The drying

And then performing the annealing at 130 to 170 ° C for 10 to 60 minutes.
The method according to claim 1,

In the step (a)

The primer coating layer

And a thickness of 20 to 40 占 퐉.
The method according to claim 1,

In the step (b)

The drying

And then performing the annealing at 130 to 170 DEG C for 100 to 200 minutes.
The method according to claim 1,

In the step (b)

The photoreactive coating composition

The amount of the binder is 10 to 20 wt%, the amount of the organic solvent is 10 to 40 wt%, the amount of the surface control agent is 0.1 to 1.0 wt%, the amount of the dispersing agent is 0.05 to 1.0 wt%, the amount of the antireflection agent is 0.01 to 0.5 wt% Wherein the resin layer comprises a resin.
The method according to claim 1,

The step (c)

(c-1) selectively irradiating the photoreactive coating layer with a laser to elute the photoreactive filler of the photoreactive coating layer;

(c-2) performing plating using the eluted photoreactive filler as a seed to form a circuit pattern having the same shape as the eluted photoreactive filler;

Wherein the method comprises the steps of:
materials;

A primer coating layer disposed on the substrate;

A photoreactive paint coating layer disposed on the primer coating layer and having a photoreactive filler added thereto; And

A circuit pattern formed by plating on the photoreactive filler coated with the photoreactive coating layer by selective laser irradiation;

And a circuit board using the LDS method.
9. The method of claim 8,

The primer coating layer

And has a thickness of 20 to 40 占 퐉.