WO2019129191A1 - 电子模组、电子设备和电子设备的装配方法 - Google Patents

电子模组、电子设备和电子设备的装配方法 Download PDF

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Publication number
WO2019129191A1
WO2019129191A1 PCT/CN2018/124792 CN2018124792W WO2019129191A1 WO 2019129191 A1 WO2019129191 A1 WO 2019129191A1 CN 2018124792 W CN2018124792 W CN 2018124792W WO 2019129191 A1 WO2019129191 A1 WO 2019129191A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
receiver
housing
sensor
Prior art date
Application number
PCT/CN2018/124792
Other languages
English (en)
French (fr)
Inventor
任志国
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019129191A1 publication Critical patent/WO2019129191A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets

Definitions

  • the present application relates to the field of electronic devices, and in particular, to an electronic module, an electronic device, and an assembly method of the electronic device.
  • the present application provides an assembly method of an electronic module, an electronic device, and an electronic device.
  • An embodiment of the present application provides an electronic module including a housing and an electronic component, the housing having at least one air vent and a cavity communicating with the at least one air vent; the electronic component including a sensor and a flexible circuit board
  • the flexible circuit board includes a first surface and a second surface disposed opposite to each other, the sensor is disposed on the first surface of the flexible circuit board, and the sensor is electrically connected to the flexible circuit board.
  • the receiver is disposed on the second surface of the flexible circuit board, and the sound channel of the receiver passes over or through the flexible circuit board to the outside, and the electronic component is received in the inner cavity of the housing. And the sound channel of the sensor and the receiver corresponds to at least one air vent of the housing.
  • an embodiment of the present application further provides an electronic device, including an electronic module.
  • the embodiment of the present application further provides an assembly method of an electronic device, including:
  • the display module has a non-display area, and the non-display area opens a receiving window;
  • the middle frame is stacked on the display module, and the fixing portion of the middle frame faces the non-display area;
  • the electronic module comprising a housing and an electronic component, the housing having at least one air cutout and a cavity communicating with the at least one air cutout;
  • the electronic component comprising a sensor, a flexible circuit board, and a receiver
  • the flexible circuit board includes a first surface and a second surface disposed opposite to each other, the sensor is disposed on the first surface of the flexible circuit board, and the sensor is electrically connected to the flexible circuit board,
  • the receiver is disposed on the second side of the flexible circuit board, the sound channel of the receiver passes over or through the flexible circuit board to the outside, and the electronic component is received in the inner cavity of the housing, and The sound channel of the sensor and the receiver corresponds to at least one air vent of the housing;
  • the display module is stacked on the middle frame, and the non-display area is opposite to the fixed portion of the middle frame.
  • FIG. 1 is a schematic diagram of an electronic device according to Embodiment 1 of the present application.
  • FIG. 2 is a schematic view of the electronic module shown in FIG. 1;
  • FIG. 3 is a schematic diagram of an electronic component of the electronic device shown in FIG. 1;
  • Figure 4 is a schematic view of an electronic component shown in Figure 3;
  • Figure 5 is a cross-sectional view of the electronic component shown in Figure 4 taken along line A-A;
  • Figure 6 is a schematic view of another perspective of the electronic component shown in Figure 4.
  • FIG. 7 is a schematic illustration of another electronic component shown in Figure 3.
  • Figure 8 is a cross-sectional view of a sealing member of the electronic component shown in Figure 7 taken along line A-A;
  • Figure 9 is a cross-sectional view of another seal member of the electronic component shown in Figure 7 taken along line A-A;
  • Figure 10 is a schematic view showing the relative relationship between the sensor and the receiver of the electronic component shown in Figure 3;
  • FIG. 11 is a schematic diagram showing another relative relationship between a sensor and a receiver of an electronic component in other embodiments
  • FIG. 12 is a schematic diagram showing still another relative relationship between a sensor and a receiver of an electronic component in other embodiments
  • Figure 13 is a schematic view showing the relative relationship between the receiving hole and the vibrating portion of the electronic component shown in Figure 3;
  • FIG. 14 is a schematic view showing another relative relationship between a receiving hole and a vibrating portion of an electronic component in another embodiment
  • 15 is a schematic view showing a non-side-by-side arrangement of a sensor and a receiver of an electronic component in other embodiments;
  • FIG. 16 is a schematic diagram of a display module of the electronic device shown in FIG. 1;
  • FIG. 17 is a schematic view of the electronic module and the middle frame shown in FIG. 1;
  • Figure 18 is a schematic view of the middle frame of Figure 17;
  • FIG. 19 is a schematic view of a screen assembly of the display module of FIG. 16;
  • 20 is a schematic diagram of another screen assembly of a display module in other embodiments.
  • 21 is a schematic diagram of still another screen assembly of the display module in other embodiments.
  • Figure 22 is a schematic view showing the electronic components in other embodiments all located in the grooves of the screen assembly;
  • FIG. 23 is a schematic flow chart of a method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 1 is a schematic diagram of a first perspective of the electronic device 100 .
  • the electronic device 100 includes an electronic module 10.
  • the electronic module 10 is housed inside the electronic device 100 for implementing functions such as receiving the electronic device 100.
  • the electronic device 100 can be any device having an electronic component, such as a smart device such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, or a wearable device.
  • the electronic device 100 is defined with reference to the first viewing angle.
  • the width direction of the electronic device 100 is defined as the X direction
  • the length direction of the electronic device 100 is defined as the Y direction
  • the thickness direction of the electronic device is defined as the Z direction. .
  • the electronic device 100 includes an electronic module 10, a display module 2, and a middle frame 4.
  • the electronic module 10 includes a housing 3 and an electronic component 1.
  • the housing 3 has at least one air vent 3a and communicates with the The inner cavity 3b of at least one air vent 3a;
  • the electronic component 1 includes a sensor 11, a flexible circuit board 12, and a receiver 13.
  • the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, and the flexible circuit board 12 includes a first surface 121 and a second surface 122 disposed opposite to each other.
  • the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12.
  • the sensor 11 is electrically connected to the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12, and the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12.
  • the sound channel 131 of the receiver 13 passes over or through the flexible circuit board 12 to the outside, the electronic component 1 is housed in the inner cavity 3b of the housing 3, and the sensor 11 and the receiver
  • the sound channel 131 of the 13 corresponds to at least one air vent 3a of the casing 3;
  • the display module 10 has a non-display area Z2, and the non-display area Z2 opens a receiving window 21a, and the middle frame 4 is stacked on the On the display module 10, the fixing portion 41 of the middle frame 4 is opposite to the non-display area Z2, and the electronic module 10 is fixed on the fixing portion 41 of the middle frame 4, and the electronic device
  • the sound channel 131 of the assembly 1 is connected to the called window 21a.
  • FIG. 2 is a schematic diagram of the electronic module 10 of the electronic device 100 shown in FIG.
  • the electronic module 10 includes a housing 3 and an electronic component 1.
  • the electronic component 1 is disposed in the housing 3 to form a modular electronic module 10. Conducive to the assembly of the electronic module 10.
  • the housing 3 has at least one air vent 3a and a cavity 3b that communicates with the at least one air vent 3a.
  • the electronic component 1 includes a sensor 11, a flexible circuit board 12, and a receiver 13.
  • the sensor 11, the flexible circuit board 12, and the receiver 13 are stacked, and when the electronic component 1 of the structure is disposed in the electronic device 100, the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, saving The size of the electronic component 1 and the electronic device 100 in the X direction.
  • the electronic module 10 is a structure in which the electronic component 1 is disposed in the casing 3 to form a module, which facilitates assembly of the electronic module 10 and improves assembly efficiency.
  • the plane of the sensor 11 is flush with the plane of the at least one air vent 3a. That is, the electronic component 1 is entirely located in the casing 3 and does not protrude from the casing 3, further reducing the size of the entire electronic module 10.
  • the partial sensor 11 can also extend out of the air vent 3a of the housing 3.
  • the housing 3 can be formed into a housing 3 by injection molding or by externally filling the electronic component 1.
  • the housing 3 has two air vents 3a, one of the air vents 3a of the housing 3 corresponds to the sensor, and the other of the housings 3 has a venting opening 3a corresponding to the The sound channel 131 of the receiver 13.
  • the housing 3 thus constructed ensures that the electronic component 1 and the housing 3 can be more tightly coupled, which facilitates the integration of the housing 3 with the electronic component 1.
  • the electronic module 10 is substantially formed by potting and packaging the electronic component 1.
  • the portion of the electronic component 1 that is glued forms the housing 3, correspondingly, filling the glue.
  • the portion of the material surrounding the electronic component 1 forms the inner wall 3c of the casing 3, and the region where the inner wall 3c is looped is the inner cavity 3b of the casing 3.
  • the sound channel 131 of the sensor 11 and the receiver 13 can interact with the external medium, for example, external light can reach the sensor 11, the sound signal 131 of the receiver 13 can be transmitted to the outside, and when the electronic component 1 is encapsulated, The sensor 11 and the receiver 13 are escaping, that is, the two air vents 3a are formed to respectively align the sound channels 131 of the sensor 11 and the receiver 13 to ensure the reliability operation of the electronic component 1 module.
  • the housing 3 has a cutout 3a, and the sensor 11 and the sound channel 131 of the receiver 13 correspond to the air outlet 3a of the housing 3.
  • the size of the air vent 3a is large, and it can be understood that the two air vents 3a in the above embodiment are opened to form one.
  • the housing 3 of the structure facilitates the placement of the electronic component 1 in the interior 3b of the housing 3.
  • the electronic module 10 facilitates processing, and the housing 3 is formed directly outside the electronic component, regardless of the assembly between the electronic component 1 and the housing 3.
  • the housing has a body and a cover plate, the body is a rectangular body having an open end, and the cover plate defines two airproof openings 3a, and the cover plate is attached to the open end of the body.
  • the electronic component is placed in the body, and then the cover is attached to the body.
  • the two airproof openings 3a on the cover are respectively aligned with the sound channel and the sensor of the receiver to ensure the reliability operation of the electronic component module.
  • the electronic module of the structure facilitates the detachment of the electronic component from the housing.
  • the housing 3 has a first mounting surface 3d, and the first mounting surface 3d defines the at least one air vent 3a, and the first mounting surface 3d is a flat surface. Specifically, the first mounting surface 3d defines two airproof openings 3a, and the first mounting surface 3d is a flat surface. When the first mounting surface 3d is disposed on the middle frame, there is no gap between the two, which facilitates the electronic mode. The seal of the sound channel 131 of the group 10.
  • the inner wall 3c of the casing 3 is wrapped on the electronic component 1.
  • the circumferential surface of the electronic component 1 abuts against the inner wall 3c of the casing 3, that is, the size of the area where the inner wall 3c of the casing 3 is looped is substantially the same as the circumferential dimension of the electronic component, thereby saving the entire electron.
  • the volume of the module 10 facilitates the placement of the electronic module 10 in the electronic device.
  • a portion of the electronic component 1 is embedded in the inner wall 3c of the housing 3.
  • a part of the outer peripheral surface of the electronic component 1 can be inserted into the inner wall 3c of the casing 3, so that the electronic component 1 is more tightly coupled with the casing 3.
  • the potting material flows into the gap of the electronic component 1 such that the electronic component 1 and the inner wall 3c of the casing 3 are in an embedded relationship.
  • the housing 3 is a structure of a body and a cover, a cutout is provided on the inner wall 3c of the housing 3, so that the side of the flexible circuit board 12 is embedded in the cutout so that the electronic component 1 and the housing Body 3 is more tightly bound.
  • the housing 3 further has a limiting portion 3e protruding from the inner wall 3c of the housing 3, the flexible circuit board 12 and the receiver 13 is located between the limiting portion 3e and the bottom wall of the casing 3.
  • the flexible circuit board 12 is restricted from moving outward by the limiting portion 3e, thereby further ensuring the reliability of the electronic module 10.
  • the electronic component 1 of the structure is disposed in the electronic device 100, and the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100.
  • the size of the electronic component 1 and the electronic device 100 in the X direction is saved.
  • the electronic module 10 is configured to form the module in the housing 3 , which facilitates assembly of the electronic module 10 and improves assembly efficiency.
  • the flexible circuit board 12 includes a first face 121 and a second face 122 disposed opposite each other.
  • the flexible circuit board 12 is for electrical connection with the sensor 11, which in turn is electrically coupled to a circuit board in the electronic device 100 to transmit electrical signals on the sensor 11 to a circuit board in the electronic device 100.
  • the first surface 121 and the second surface 122 of the flexible circuit board 12 are respectively opposite surface surfaces of the flexible circuit board 12, and the board surface area is large, and can carry components.
  • the edges of the board surface of the flexible circuit board 12 are respectively a first side S1 and a second side S2 disposed opposite each other, and a third side S3 and a fourth side S4 disposed opposite to each other, the third side S3 and The fourth side S4 is respectively connected between the first side S1 and the second side S2, and the second side S2 extends in a direction away from the first side S1 to make the flexible circuit
  • the board 12 is electrically connected to the board. That is, the flexible circuit board 12 is substantially long rectangular.
  • the first side S1 and the second side S2 are shorter sides of the flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the flexible circuit board 12 is disposed in the electronic device 100, it is arranged substantially in an elongated shape along the Y direction of the electronic device 100 so as to be extended to be electrically connected to the circuit board.
  • the senor 11 is disposed on the first side 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12.
  • the sensor 11 comprises at least one of a distance sensor, a light sensor or a photoelectric sensor.
  • the sensor 11 is a light sensor 11.
  • the light sensor 11 is disposed close to the screen of the electronic device 100 in order to adjust the brightness of the screen of the electronic device 100 according to the light of the environment in which the electronic device 100 is located.
  • the medium sensed by the light sensor 11 is light, and the electronic device 100 does not need to be specially drilled or provided with a special structure to pass the light, and the sensor 11 in the electronic component 1 is set as the light sensor 11 together with the receiver 13 in the Z direction. Stacking further optimizes the structure of the electronic device 100 to facilitate the direction of the X-direction of the electronic device 100.
  • the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12.
  • the sound channel 131 of the receiver 13 is connected to the outside through the flexible circuit board 12, so that after the receiver 13 converts the audio signal into a sound signal, the sound signal can pass through The sound channel 131 is propagated to the outside.
  • the receiver 13 is substantially rectangular, and the intermediate portion of the receiver 13 is the vibrating portion 132.
  • the vibrating portion 132 is generally hermetically connected to other members or structural members to form a vibrating cavity, and the vibration in the vibrating portion 132 can be propagated by opening on the member or the structural member.
  • the sound channel 131 of the receiver 13 refers to a channel through which the sound signal in the receiver 13 propagates, corresponding to the structure being the passage between the vibrating portion 132 and the opening of the component or the structural member. After the receiver 13 receives the audio signal, the sealed vibration chamber vibrates with the sound signal passing through the opening in the component or structural member.
  • the member sealingly connecting the vibrating portion 132 of the receiver 13 may be a flexible circuit board 12, that is, a carrier that stacks the sensor 11 and the receiver 13 together.
  • the device components of the electronic component 1 are reduced, the thickness of the electronic component 1 in the Z of the electronic device 100 is saved, and the electronic components are further optimized.
  • the flexible circuit board 12 covers and is sealed and connected to the receiver 13, and the flexible circuit board 12 defines a receiving hole 123 to make the vibrating portion 132 of the receiver 13 to the flexible circuit board 12.
  • the passage between the receiving holes 123 forms the sound passage 131.
  • the area of the second surface 122 of the flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the excess space of the electronic device 100 is not occupied by the excessive size of the flexible circuit board 12, and the receiver 13 can also be disposed in the flexible state.
  • the area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second side 122 of the flexible circuit board 12, that is, the flexible circuit board 12 entirely covers the receiver 13. .
  • the size of the flexible circuit board 12 can also be much larger than the area of the receiver 13.
  • the flexible circuit board 12 and the receiver 13 are bonded by the foam 14 so that the receiver 13 is sealed by the flexible circuit board 12 to facilitate the formation of the sound channel 131 of the receiver 13.
  • the foam 14 has a hollow annular shape and is disposed between the second surface 122 of the flexible circuit board 12 and the receiver 13 , and the foam 14 is just around the edge of the vibrating portion 132 of the receiver 13 .
  • a receiving hole 123 is opened in the flexible circuit board 12, and the receiving hole 123 communicates with a cavity formed between the vibrating portion 132 of the receiver 13 and the flexible circuit board 12 to form a sound passage 131.
  • the flexible circuit board 12 and the receiver 13 can also be sealed by various means such as welding or gluing.
  • the vibrating portion 132 of the receiver 13 vibrates to form a sound signal, and the sound signal is transmitted from the vibrating chamber to the receiving hole 123, and the speech hole 123 is transmitted to the outside to realize the receiving function of the receiver 13.
  • the component that seals the vibrating portion 132 of the receiver 13 may also be a sealing member 15, 15'.
  • the specific structure is that the flexible circuit board 12 partially covers and hermetically connects the receiver 13, and the electronic component 1 further includes The flexible circuit board 12 is spliced with sealing members 15, 15', and the sealing members 15, 15' cover and are sealingly connected to the remaining portion of the receiver 13, the sealing members 15, 15' opening the receiving holes 123, The passage between the vibrating portion 132 of the receiver 13 to the receiving hole 123 of the seal 15, 15' forms the sound passage 131.
  • the receiving hole 123 is disposed on the sealing member 15, 15', that is, the sound signal of the receiver 13 is propagated to the outside through the receiving hole 123 of the sealing member 15, 15', that is, the sound passage 131 of the receiver 13 bypasses the flexible circuit board. 12.
  • the structure of the seals 15, 15' is more practical and does not rely excessively on the structure of the flexible circuit board 12 to carry and seal the receiver 13, further optimizing the structure of the functional components.
  • the size of the flexible circuit board 12 is substantially the same as the size of the sensor 11, that is, the excessive space of the flexible circuit board 12 does not occupy too much space in the electronic device 100, and the sensor 11 can be preferably carried on the flexible circuit.
  • the flexible circuit board 12 is entirely covered on the board 12, i.e., the flexible circuit board 12.
  • the sealing members 15, 15' are substantially rectangular foams.
  • the size of the seals 15, 15' spliced with the flexible circuit board 12 is substantially the same as the size of the receiver 13.
  • the seals 15, 15' may also be reinforcing plates of materials such as metal or plastic.
  • the cavity formed by the vibrating portion 132 of the receiver 13 and the structure of the flexible circuit board 12 and the sealing members 15, 15' is the sound channel of the receiver 13.
  • the structure in which the sealing member 15 is spliced with the flexible circuit board 12 is as follows:
  • FIG. 8 is a cross-sectional view of the sealing member 15 of FIG. 7 taken along line AA.
  • the structure of the sealing member 15 is specifically that the sealing member 15 has a first sealing connected in sequence. a portion 151 and a second sealing portion 152, the first sealing portion 151 is fixedly coupled to the flexible circuit board 12 such that the flexible circuit board 12 partially covers the first sealing portion 151 and is sealingly connected to the receiver 13.
  • the second sealing portion 152 covers and seals the remaining portion of the receiver 13.
  • first sealing portion 151 and the second sealing portion 152 of the sealing member 15 are vertically connected, and the sealing member 15 has a substantially L-shaped cross section, so that when the second sealing portion 152 is fixedly connected with the flexible circuit board 12, the first sealing portion The 151 is on the same plane as the flexible circuit board 12. Since the sealing member 15 is a foam, the sealed connection between the flexible circuit board 12 and the receiver 13 is directly sealed by the second sealing portion 152 of the sealing member 15, and the structure of the electronic component 1 is optimized.
  • the first sealing portion 151 and the remaining portion of the receiver 13 are used to realize the sealed connection of the receiver 13 by the sealing member 15 and the flexible circuit board 12.
  • the first sealing portion 151 defines a receiving hole 123.
  • the structure of another sealing member 15 is specifically: the sealing member 15 is adhered to the side of the flexible circuit board 12 to make the sealing member 15 is spliced with the flexible circuit board 12.
  • the sealing member 15 has a flat plate shape.
  • the sealing member 15 is directly attached to the side (the third side S3) of the flexible circuit board 12 near a side of the flexible circuit board 12.
  • the connection between the flexible circuit board 12 and the receiver 13 needs to be further provided with foam, and the sealing member 15 is foamed, and directly bonded to the receiver 13 to realize the vibrating portion 132 of the receiver 13 and the flexible circuit board 12 and
  • the cavity formed between the structures in which the seals 15 are formed is a part of the sound passage 131 of the receiver 13.
  • the electronic component 1 and the electronic device 100 provided by the embodiment of the present application are stacked in a state in which the sensor 11, the flexible circuit board 12, and the receiver 13 are arranged.
  • the sensor 11 and the flexible circuit board 12 are provided.
  • the receivers 13 are sequentially stacked along the Z direction of the electronic device 100, saving the size of the electronic component 1 and the electronic device 100 in the X direction.
  • the area D1 of the orthographic projection of the sensor 11 on the flexible circuit board 12 is located in the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12.
  • the sensor 11 and the receiver 13 overlap in the Z direction, reducing the size of the carrier (such as the flexible circuit board 12, or the spliced structure in which the flexible circuit board 12 and the sealing member 15 are combined) carried between the sensor 11 and the receiver 13.
  • the carrier such as the flexible circuit board 12, or the spliced structure in which the flexible circuit board 12 and the sealing member 15 are combined
  • the area of the orthographic projection of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the orthographic projection of the sensor 11 on the flexible circuit board 12.
  • the area D1 partially overlaps the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12; or as shown in FIG. 12, the area of the sensor 11 on the flexible circuit board 12 is an orthographic projection D1
  • the area D2 of the orthographic projection of the receiver 13 on the flexible circuit board 12 is shifted from each other, and the like.
  • the sensor 11 is disposed near the junction of the first side S1 and the third side S3 of the flexible circuit board 12.
  • the sensor 11 is disposed at a corner of the flexible circuit board 12 and is far from the junction of the flexible circuit board 12 and the circuit board, so that when the electronic component 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing The size of the non-display area of the electronic device 100.
  • the sound channel 131 and the sensor 11 are arranged side by side along the direction of the third side S3 to the fourth side S4.
  • the area of the orthographic projection of the receiving hole 123 on the receiver 13 is located to overlap the range in which the vibrating portion 132 of the upper portion of the receiver 13 is located. That is, the receiving hole 123 is aligned with the vibrating portion 132 of the upper portion of the receiver 13. That is, the size of the receiving hole 123 is smaller than the size of the vibrating portion 132 of the receiver 13.
  • the area D3 of the orthographic projection 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibrating portion 132 of the receiver 13 on the flexible circuit board 12.
  • the sound guiding structure can be additionally covered on the receiving hole 123 to ensure the sound output of the receiver 13.
  • the area D3 of the orthographic projection of the receiving hole 123 on the flexible circuit board 12 is located in the area D4 of the orthographic projection of the vibrating portion 132 of the receiver 13 of the flexible circuit board 12.
  • the receiving hole 123 is close to the corners of the first side S1 and the fourth side S4, and the side arrangement of the sound channel 131 and the sensor 11 is realized.
  • the receiving hole 123 is arranged side by side with the sensor 11, which can reduce the demand for the non-display area of the electronic device 100 and increase the screen ratio of the electronic device 100.
  • the size of the receiving hole 123 may also be half of the vibrating portion 132 of the receiver 13, or, referring to FIG. 15, the receiving hole 123 is disposed in a different row from the sensor 11.
  • the electronic device 100 further includes a display module 2 and a middle frame 4 .
  • the display module 2 has a non-display area Z2, and the non-display area Z2 is opened.
  • the middle frame 4 is stacked on the display module 1, and the fixing portion 41 of the middle frame 4 faces the non-display area, and the electronic module 10 is fixed to the middle frame.
  • the fixing portion 41 of 4 is connected to the sound receiving passage 21a of the electronic component 1 via the sound passage 131.
  • the middle frame 4 is mainly a support plate of internal components of the electronic device.
  • the middle frame 4 is opposite to the fixing portion 41.
  • the fixing portion 41 is substantially a groove, so that the electronic module 10 is embedded in the groove, and the middle frame 4 is further provided with a first hole 42 on the bottom wall of the groove.
  • the first hole 42 and the second hole 43 are located in the non-display area Z2 of the display module 2, and the electronic module 10 is embedded in the fixing portion.
  • the one of the air vents 3a corresponding to the receiver 13 communicates with the first hole 42
  • the other air vent 3a corresponding to the sensor 11 communicates with the second hole 43.
  • the display module 2 includes a cover plate 21 and a screen assembly 22 which are sequentially stacked and connected.
  • the display module 2 is covered with the casing 3 of the electronic device 100 to form a closed cavity 3b of the electronic device 100.
  • the electronic component 1 is received in the inner cavity 3b, and the receiving hole 123 and the sensor 11 in the electronic component 1 are both
  • the non-display area Z2 of the display module 2 is aligned so that the sound signal in the receiver 13 can be transmitted to the receiving window 21a through the receiving hole 123, so that the user can listen to the sound signal through the receiving window 21a, and the sensor 11 pairs
  • the quasi display module 2 is also capable of enabling the sensor 11 to receive external light for operation.
  • the non-display area Z2 is an area of the electronic device 100 that is not used to display an electronic image.
  • the assembly of the electronic module, the middle frame 4 and the display module 2 is as follows: the electronic module 10 is embedded in the fixing portion 41 of the middle frame 4; then the display module 2 is stacked on the middle frame 4, wherein
  • the first surface 121 of the flexible circuit board 12 faces the screen assembly 22 to align the receiving hole 123 and the sensor 11 with the non-display area Z2, so that the sound signal in the receiver 13 can sequentially pass through the receiving hole 123, the air vent 3a,
  • the first hole 42 is transmitted to the receiving window 21a to enable the user to listen to the sound signal through the receiving window 21a, so that the sensor 11 can sequentially receive external light through the air vent 3a and the second hole 43 to operate.
  • the sensor 11, the flexible circuit board 12, and the receiver 13 are stacked, when the electronic component 1 of the structure is disposed in the electronic device 100, the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100.
  • the size of the X-direction of the non-display area Z2 in the electronic device 100 is saved, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be increased.
  • the display module 2 further has a display area Z1, and the display area Z1 surrounds the non-display area Z2.
  • the display module 2 includes a cover plate 21 and a screen assembly 22 which are sequentially connected and connected, and the screen assembly 22 has two short sides S5 disposed opposite to each other, and opposite to each other.
  • Two long sides S6 the two long sides S6 are respectively connected between the two short sides S5, and one of the short sides S5 is recessed toward the other short side S5 to form a recess 22a.
  • the area of the display module 2 within the recess 22a is the non-display area Z2, and the area of the display module 2 other than the recess 22a is the display area Z1, and the cover 21 is opened.
  • the receiving window 21a is the area of the display module 2 other than the recess 22a.
  • the display module 2 formed by the cover 21 and the panel assembly 22 is the display area Z1 except for the groove 22a.
  • the groove 22a is opened at an intermediate position of one short side of the screen assembly 22.
  • a receiving window 21a corresponding to the receiving hole 123 is opened in the cover plate 21. It can be understood that the receiving window 21a has an elongated shape and is approximately twice as large as the receiving hole 123.
  • the portion of the cover plate 21 corresponding to the recess 22a can be printed to form a non-display area Z2 of the display module 2.
  • the size of the groove 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is increased.
  • the recess 22a may also be located at other corners of the screen assembly 22.
  • the ratio of the length of the received window to the length of the received hole along the short side direction is 3:1 or 4:1.
  • the electronic component 1 that is, the electronic module 10
  • the receiver 13 is at least partially aligned with the non-display area Z2 .
  • an edge of the display module 2 defines a recess 22a to form a non-display area Z2, and the display module 2 is outside the non-display area Z2.
  • the electronic component 1 is disposed on the display module 2
  • the receiver 13 is at least partially aligned with the non-display area Z2, that is, at least part of the receiver 13 on the display module 2.
  • the area of the orthographic projection is located in the non-display area Z2.
  • the portion of the receiver 13 is aligned with the non-display area Z2, which further reduces the size of the non-display area Z2 in the Y direction, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is further increased.
  • At least part of the orthographic projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.
  • Part of the structure of the receiver 13 and the sensor 11 is located in the recess 22a, and the range of the orthographic projection of the remaining structure of the receiver 13 and the sensor 11 on the display module 2 is within the range of the display area Z1 of the display module 2, further
  • the size of the non-display area Z2 in the Y direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is further increased.
  • the entire electronic component 1 can be located in the recess 22a.
  • the electronic component 1 is located at the corner of the recess 22a to facilitate further arrangement of other components, such as a camera module, etc., in the X direction of the recess 22a.
  • the electronic component 1 may also be located at an intermediate position of the recess 22a, and other components are respectively located at two sides of the electronic component 1.
  • the sensor 11 When the electronic device 100 provided by the embodiment of the present application is assembled, the sensor 11 is first disposed on the flexible circuit board 12 and electrically connected to the flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the flexible circuit board 12 opposite to each other.
  • the range of the orthographic projection on the display module 2 is within the range of the display area Z1 of the display module 2.
  • the electronic module and the electronic device 100 provided by the embodiments of the present application stack the sensor 11, the flexible circuit board 12, and the receiver 13, and when the electronic components of the structure are disposed in the electronic device 100, the sensor 11, the flexible circuit board 12, and the receiver 13 is sequentially stacked along the Z direction of the electronic device 100, which saves the size of the electronic component 1 and the electronic device 100 in the X direction; in addition, the electronic module 10 is configured in the housing 3 to form a module, which facilitates the electronic The assembly of the module 10 improves assembly efficiency.
  • the present application further provides an assembly method of an electronic device, including:
  • the display module 2 has a non-display area Z2, the non-display area Z2 opens a call window 21a;
  • the middle frame 4 is stacked on the display module 2, and the fixed portion 41 of the middle frame 4 is opposite to the non-display area Z2;
  • the electronic module 10 includes a housing 3 and an electronic component 1 having at least one air vent 3a and a cavity 3b communicating with the at least one air vent 3a; the electronic component 1 includes a sensor 11.
  • the flexible circuit board 12 and the receiver 13 include a first surface 12a and a second surface 12b disposed opposite each other, and the sensor 11 is disposed on the first surface 12a of the flexible circuit board 12, The sensor 11 is electrically connected to the flexible circuit board 12, and the receiver 13 is disposed on the second surface 12b of the flexible circuit board 12.
  • the sound channel 131 of the receiver 13 passes over or passes through the flexible circuit board. 12 is connected to the outside, the electronic component 1 is housed in the inner cavity 3b of the housing 3, and the sound channel 131 of the sensor 11 and the receiver 13 corresponds to at least one air vent 3a of the housing 3. .
  • the electronic module 10 is obtained by injection molding into the casing 3 and placing the electronic component 1 in the casing 3.
  • the electronic component 1 is potted and packaged to obtain the electronic module 10 , wherein the portion of the electronic component 1 that is glued forms the housing 3 .
  • the electronic module 10 is fixed on the fixing portion 41 of the middle frame 4;
  • the display module 2 is stacked on the middle frame 4, and the non-display area Z1 is opposite to the fixing portion 41 of the middle frame 4.
  • the mounting method of the electronic device provided by the embodiment of the present application installs the modular electronic module 10 on the middle frame 4, and then stacks the display modules on the middle frame 4. Since the electronic module 10 is an integrated structure, When installing, it is only necessary to pay attention to the installation relationship between the electronic module 10 and the middle frame 4, which reduces the assembly difficulty and improves the assembly efficiency.

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Abstract

本申请实施例提供了一种电子模组，其包括壳体和电子组件，壳体具有至少一个避空口和连通至少一个避空口的内腔；电子组件包括传感器、柔性电路板、受话器，柔性电路板包括相背设置的第一面和第二面，传感器设置于柔性电路板的第一面上，且传感器电连接于柔性电路板，受话器设置于柔性电路板的第二面上，受话器的声音通道越过或经过柔性电路板连通至外部，电子组件容置于壳体的内腔中，且传感器和受话器的声音通道对应壳体的至少一个避空口。本申请实施例提供的电子模组通过使传感器、柔性电路板和受话器呈堆叠状省了电子组件与电子设备的X向的尺寸。另外，本申请实施例还提供了一种电子设备。

Description

电子模组、电子设备和电子设备的装配方法 技术领域
本申请涉及一种电子设备领域，尤其涉及一种电子模组、电子设备和电子设备的装配方法。
背景技术
随着电子设备技术的日趋发展，对手机轻薄化的需求越来越高。现有技术，手机等电子设备中为了实现越来越多的功能，手机内部集成越来越多的器件，各个器件之间的位置关系越来越复杂，随着对手机轻薄化的影响也越来越大，不利于手机的外观设计。
发明内容
本申请提供了一种电子模组、电子设备和电子设备的装配方法。
本申请实施例提供了一种电子模组，包括壳体和电子组件，所述壳体具有至少一个避空口和连通所述至少一个避空口的内腔；所述电子组件包括传感器、柔性电路板、受话器，所述柔性电路板包括相背设置的第一面和第二面，所述传感器设置于所述柔性电路板的第一面上，且所述传感器电连接于所述柔性电路板，所述受话器设置于所述柔性电路板的第二面上，所述受话器的声音通道越过或经过所述柔性电路板连通至外部，所述电子组件容置于所述壳体的内腔中，且所述传感器和所述受话器的声音通道对应所述壳体的至少一个避空口。
另一方面，本申请实施例还提供了一种电子设备，包括电子模组。
再一方面，本申请实施例还提供了一种电子设备的装配方法，包括：
提供显示模组，所述显示模组具有非显示区，所述非显示区开设受话窗口；
提供中框，所述中框层叠设置于所述显示模组上，且所述中框的固定部正对所述非显示区；
提供电子模组，所述电子模组包括壳体和电子组件，所述壳体具有至少一个避空口和连通所述至少一个避空口的内腔；所述电子组件包括传感器、柔性电路板、受话器，所述柔性电路板包括相背设置的第一面和第二面，所述传感器设置于所述柔性电路板的第一面上，且所述传感器电连接于所述柔性电路板，所述受话器设置于所述柔性电路板的第二面上，所述受话器的声音通道越过或经过所述柔性电路板连通至外部，所述电子组件容置于所述壳体的内腔中，且所述传感器和所述受话器的声音通道对应所述壳体的至少一个避空口；
将所述电子模组固定于所述中框的固定部上；
将显示模组层叠设置于所述中框上，且使所述非显示区正对所述中框的固定部。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例一提供的一种电子设备的示意图；
图2是图1所示的电子模组的示意图；
图3是图1所示的电子设备的电子组件的示意图；
图4是图3所示的一种电子组件的示意图；
图5是图4所示的电子组件沿着A-A线的剖视图；
图6是图4所示的电子组件的另一视角的示意图；
图7是图3所示的另一种电子组件的示意图；
图8是图7所示的电子组件中的一种密封件沿着A-A线的剖视图；
图9是图7所示的电子组件中的另一种密封件沿着A-A线的剖视图；
图10是图3所示的电子组件的传感器与受话器的相对关系的示意图；
图11是其它实施例中的电子组件的传感器与受话器的另一相对关系的示意图；
图12是其它实施例中的电子组件的传感器与受话器的再一相对关系的示意图；
图13是图3所示的电子组件的受话孔与振动部的相对关系的示意图；
图14是其它实施例中的电子组件的受话孔与振动部的另一相对关系的示意图；
图15是其它实施例中的电子组件的传感器与受话器非并排设置的示意图；
图16是图1所示的电子设备的显示模组的示意图；
图17是图1所示的电子模组与中框的示意图；
图18是图17中的中框的示意图；
图19是图16的显示模组的屏组件的示意图；
图20是其它实施例中的显示模组的另一屏组件的示意图；
图21是其它实施例中的显示模组的再一屏组件的示意图；
图22是其它实施例中的电子组件全部位于屏组件的凹槽中的示意图；
图23是本申请实施例提供的电子设备的装配方法的流程示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述。
为了能够更清楚地理解本申请的上述目的、特征和优点，下面结合附图和具体实施方式对本申请进行详细描述。需要说明的是，在不冲突的情况下，本申请的实施方式及实施方式中的特征可以相互组合。
请参照图1，图1为电子设备100的第一视角示意图。电子设备100包括电子模组10。电子模组10收容于电子设备100的内部，用以实现电子设备100的受话等功能。所述电子设备100可以是任何具备电子组件的设备，例如：平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、可穿戴设备等智能设备。其中，为了便于描述，以电子设备100处于第一视角为参照进行定义，电子设备100的宽度方向定义为X向，电子设备100的长度方向定义为Y向，电子设备的厚度方向定义为Z向。
所述电子设备100包括电子模组10、显示模组2和中框4，所述电子模组10包括壳体3和电子组件1，所述壳体3具有至少一个避空口3a和连通所述至少一个避空口3a的内腔3b；所述电子组件1包括传感器11、柔性电路板12和受话器13。传感器11、柔性电路板12和受话器13呈堆叠状，所述柔性电路板12包括相背设置的第一面121和第二面122，所述传感器11设置于柔性电路板12的第一面121上，且所述传感器11电连接于所述柔性电路板12，且所述传感器11电连接于所述柔性电路板12，所述受话器13设置于所述柔性电路板12的第二面122上，所述受话器13的声音通道131越过或经过所述柔性电路板12连通至外部，所述电子组件1容置于所述壳体3的内腔3b中，且所述传感器11和所述受话器13的声音通道131对应所述壳体3的至少一个避空口3a；所述显示模组10具有非显示区Z2，所述非显示区Z2开设受话窗口21a，所述中框4层叠设置于所述显示模组10上，且所述中框4的固定部41正对所述非显示区Z2，所述电子模组10固定于所述中框4的固定部41上，且所述电子组件1的声音通道131连通至所述受话窗口21a。
请参照图2，图2是图1所示的电子设备100的电子模组10的示意图。电子模组10包括壳体3和电子组件1。电子组件1设置于壳体3中，以形成模块化的电子模组10。利于电子模组10的装配。
请参照图2，所述壳体3具有至少一个避空口3a和连通所述至少一个避空口3a的内腔3b。 电子组件1包括传感器11、柔性电路板12和受话器13。传感器11、柔性电路板12和受话器13呈堆叠状，该结构的电子组件1设置于电子设备100中时，传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，节省了电子组件1与电子设备100的X向的尺寸。
请参照图2，所述电子组件1容置于所述壳体3的内腔3b中，且所述传感器11和所述受话器13的声音通道131对应所述壳体3的至少一个避空口3a。电子模组10为电子组件1设置于壳体3中形成模块的结构，利于电子模组10的装配，提高装配效率。
可以理解的，请参照图2，所述传感器11所在的平面与所述至少一个避空口3a所在的平面平齐。即电子组件1整个位于壳体3内，并未从壳体3中伸出，进一步减少整个电子模组10的尺寸。当然，在其它实施例中，部分传感器11还可以伸出壳体3的避空口3a。
壳体3可以通过注塑成型、或者于电子组件1的外部灌胶形成壳体3。
可以理解的，请参照图2，所述壳体3具有两个避空口3a，一个所述壳体3的避空口3a对应所述传感器，另一个所述壳体3的避空口3a对应所述受话器13的声音通道131。如此结构的壳体3保证了电子组件1与壳体3能够结合得更紧密，更利于壳体3与电子组件1的一体化。
一种实施方式中，请参照图2，所述电子模组10实质为对电子组件1进行灌胶封装形成，其中所述电子组件1上灌胶的部分形成壳体3，对应的，灌胶材料环绕电子组件1的部分形成壳体3的内壁3c，该内壁3c环接的区域为壳体3的内腔3b。并且为了保证传感器11和受话器13的声音通道131能够与外部交互介质，比如外部的光线能够到达传感器11上，受话器13的声音信号131能够传输至外部，在对电子组件1进行灌胶封装时，避让传感器11和受话器13，即形成两个避空口3a分别对准传感器11和受话器13的声音通道131，以保证电子组件1模块后的可靠性工作。当然，在其它实施例中，所述壳体3具有一个避空口3a，所述传感器11和所述受话器13的声音通道131对应所述壳体3的避空口3a。具体的，该避空口3a的尺寸较大，可以理解为上述实施例中的两个避空口3a打通形成一个。该结构的壳体3利于电子组件1设置于壳体3的内腔3b中。该电子模组10利于加工，壳体3直接在电子组件的外部形成，无需考虑电子组件1与壳体3之间的装配。当然，在其它实施例中，壳体具有本体和盖板，本体为具有一个开口端的矩形体，盖板开设两个避空口3a，盖板盖接于本体的开口端上。将电子组件放入本体中，接着将盖板相对本体盖接，盖板上的两个避空口3a分别对准受话器的声音通道和传感器，以保证电子组件模块后的可靠性工作。该结构的电子模组利于电子组件从壳体中拆装出来。
可以理解的，请参照图2，所述壳体3具有第一安装面3d，所述第一安装面3d开设所述至少一个避空口3a，所述第一安装面3d为平直面。具体的，第一安装面3d上开设两个避空口3a，第一安装面3d为平直面，保证第一安装面3d设置于中框上时，两者之间不会存在缝隙，利于电子模组10的声音通道131的密封。
可以理解的，请参照图2，所述壳体3的内壁3c包裹于所述电子组件1上。本实施例中，电子组件1的周面抵靠于壳体3的的内壁3c上，即壳体3的内壁3c环接的区域的尺寸与电子组件周向的尺寸大致相同，节省了整个电子模组10的体积，利于电子模组10于电子设备中的设置。当然，在其它实施例中，部分所述电子组件1嵌设于所述壳体3的内壁3c上。具体的，电子组件1的外周面的部分部位可以插入壳体3的内壁3c中，使得电子组件1与壳体3结合得更紧密。其中，在对电子组件1进行灌胶封装时，使灌胶材料流入电子组件1的缝隙中，以使得电子组件1与壳体3的内壁3c为嵌入的关系。其中，壳体3为本体和盖板的结构时，在壳体3的内壁3c上设置避空槽，让柔性电路板12的侧边嵌设于避空槽中，以使得电子组件1与壳体3结合得更紧密。
可以理解的，请参照图2，所述壳体3还具有限位部3e，所述限位部3e凸设于所述壳体3的内壁3c上，所述柔性电路板12和所述受话器13位于所述限位部3e与所述壳体3的底壁之间。通过限位部3e限制柔性电路板12往外移动，进一步保证电子模组10的可靠性。
通过使传感器11、柔性电路板12和受话器13呈堆叠状，该结构的电子组件1设置于电子设备100中时，传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，节省了电子组件1与电子设备100的X向的尺寸；另外，电子模组10为电子组件1设置于壳体3中形成模块的结构，利于电子模组10的装配，提高装配效率。
以下为电子组件1的结构的具体结构：
在一实施例中，如图3所示，柔性电路板12包括相背设置的第一面121和第二面122。柔性电路板12用于与传感器11电连接，柔性电路板12再与电子设备100中的电路板电连接，以将传感器11上的电信号传输至电子设备100中的电路板。
请一并参照图3和图4，柔性电路板12中的第一面121和第二面122分别为柔性电路板12相背设置的板面，板面面积较大，能够承载元器件。对应的，柔性电路板12的板面的边缘则分别为相背设置的第一边S1和第二边S2、相背设置的第三边S3和第四边S4，所述第三边S3和所述第四边S4分别连接于所述第一边S1和所述第二边S2之间，所述第二边S2朝着远离所述第一边S1的方向延伸，以使所述柔性电路板12与电路板电连接。即，柔性电路板12大致呈长矩形。第一边S1和第二边S2相较于第三边S3和第四边S4，为柔性电路板12中较短的边。即，柔性电路板12设置于电子设备100中时，沿着电子设备100的Y向大致呈长条形排布，以便于延伸来与电路板电连接。
在一实施例中，如图3所示，传感器11设置于柔性电路板12的第一面121上，且所述传感器11电连接于所述柔性电路板12。
可以理解的，传感器11包括距离传感器、光线传感器或光电传感器中的至少一种。本实施例中，传感器11为光线传感器11。光线传感器11靠近电子设备100的屏幕设置，以便于根据电子设备100所处环境的光线来调节电子设备100的屏幕的亮度。光线传感器11感应的介质为光线，电子设备100并不需特别进行钻孔或设置特别的结构来通过光线，将电子组件1中的传感器11设置为光线传感器11，与受话器13一并在Z向堆叠，进一步优化了电子设备100的结构，利于电子设备100的X向的方向。
在一实施例中，请参照图3，所述受话器13设置于所述柔性电路板12的第二面122上。请参照图5或图7，所述受话器13的声音通道131越过或经过所述柔性电路板12连通至外部，以使得所述受话器13将音频信号转换为声音信号后，所述声音信号能够经所述声音通道131传播至外部。
如图6所示，受话器13大致呈矩状，受话器13的中间区域为振动部132。该振动部132一般与其它部件或结构件密闭连接以形成振动腔，通过在部件或结构件上开口，即可将振动部132中的振动传播出来。其中受话器13的声音通道131指的实为受话器13中的声音信号传播的通道，对应到结构上即为振动部132自与部件或结构件上开口之间的通道。受话器13接收到音频信号后，被密闭形成的振动腔随之振动，声音信号自部件或结构件上的开口穿过。
在一实施例中，如图4至图6所示，密封连接受话器13的振动部132的部件可以为柔性电路板12，柔性电路板12即作为将传感器11和受话器13堆叠在一起的承载件，又作为受话器13的声音通道131组成的一部分，减少了电子组件1的器件组件，节省了电子组件1于电子设备100的Z的厚度，进一步优化了电子元器件。
请参照图5，所述柔性电路板12覆盖且密封连接所述受话器13，所述柔性电路板12开设受话孔123，以使所述受话器13的振动部132至所述柔性电路板12的受话孔123之间的通道形成所述声音通道131。
请参照图5，由于受话孔123开设柔性电路板12上，受话器13的振动部132与柔性电路板12的受话孔123之间的通道形成声音通道131，故受话器13的声音通道131经过柔性电路板12。
其中，柔性电路板12的第二面122的面积稍大于受话器13的面积，即不因柔性电路板 12的尺寸过大而占据电子设备100内过多的空间，亦可以使受话器13设置于柔性电路板12的第二面122上时，受话器13于柔性电路板12上的正投影的区域位于柔性电路板12的第二面122所占据的区域内，即柔性电路板12整个覆盖住受话器13。当然，在其它实施例中，柔性电路板12的尺寸还可以远大于受话器13的面积。
其中，请参照图5，柔性电路板12与受话器13之间通过泡棉14粘接，以使得受话器13被柔性电路板12密封起来，利于受话器13的声音通道131的形成。具体的，请参照图6，泡棉14为中空的环状，设置于柔性电路板12的第二面122与受话器13之间，且泡棉14刚好围接于受话器13的振动部132的边缘处，如此柔性电路板12与受话器13密封连接后，受话器13的振动部132与柔性电路板12之间形成腔体则为受话器13的声音通道131的一部分，为了便于将受话器13的声音信号传递至外部，在柔性电路板12上开设受话孔123，该受话孔123连通至受话器13的振动部132与柔性电路板12之间形成的腔体，以形成声音通道131。当然，在其它实施例中，柔性电路板12与受话器13还可以通过焊接或胶接等多种方式密封连接。
受话器13接收到音频信号后，受话器13的振动部132振动形成声音信号，声音信号自振动腔传递至受话孔123，经受话孔123传递至外部，即可实现受话器13的受话功能。
在另一实施例中，请参照图7。密封连接受话器13的振动部132的部件还可以为密封件15、15’，具体结构为：所述柔性电路板12部分覆盖且密封连接所述受话器13，所述电子组件1还包括与所述柔性电路板12相拼接的密封件15、15’，所述密封件15、15’覆盖且密封连接于所述受话器13余下的部分，所述密封件15、15’开设受话孔123，以使所述受话器13的振动部132至所述密封件15、15’的受话孔123之间的通道形成所述声音通道131。
由于受话孔123设置于密封件15、15’上，即受话器13的声音信号是经过密封件15、15’的受话孔123传播至外部，即受话器13的声音通道131绕过柔性电路板12。
该密封件15、15’的结构的实用性更强，不过度依赖柔性电路板12的结构来对受话器13进行承载和密封，进一步优化了功能组件的结构。
其中，柔性电路板12的尺寸与传感器11的尺寸大致相同，即不因柔性电路板12的尺寸过大而占据电子设备100内过多的空间，亦可以使传感器11较佳的承载于柔性电路板12上，即柔性电路板12整个覆盖住柔性电路板12。
其中，密封件15、15’实质为矩形的泡棉。该密封件15、15’与柔性电路板12拼接形成的尺寸与受话器13的尺寸大致相同。当然，在其它实施例中，密封件15、15’还可以为金属或塑胶等材质的补强板。
如此密封件15、15’与受话器13密封连接后，受话器13的振动部132、与柔性电路板12和密封件15、15’拼接而成的结构之间形成腔体则为受话器13的声音通道131的一部分，为了便于将受话器13的声音信号传递至外部，在密封件15、15’上开设受话孔123，该受话孔123连通至受话器13的振动部132、与柔性电路板12和密封件15、15’拼接而成的结构之间形成的腔体，以形成声音通道131。
密封件15与柔性电路板12拼接的结构具体如下所示：
可以理解的，请参照图8，图8为图7中的一种密封件15沿着A-A线的剖视图.一种密封件15的结构具体为：所述密封件15具有依次连接的第一密封部151和第二密封部152，所述第一密封部151固定连接有所述柔性电路板12，以使所述柔性电路板12经所述第一密封部151部分覆盖且密封连接所述受话器13，所述第二密封部152覆盖且密封连接与所述受话器13余下的部分。
其中，密封件15的第一密封部151和第二密封部152垂直连接，密封件15的截面大致呈L形，以使第二密封部152固定连接有柔性电路板12时，第一密封部151与柔性电路板12同在一个平面上。由于密封件15为泡棉，故柔性电路板12与受话器13之间的密封连接直接通过密封件15的第二密封部152进行密封连接，优化了电子组件1的结构。
第一密封部151与受话器13余下的部分，以实现受话器13被密封件15和柔性电路板12 一起密封连接。第一密封部151开设受话孔123。
可以理解的，在其它实施例中，请参照图9另一种密封件15的结构具体为：所述密封件15粘接于所述柔性电路板12的侧边上，以使所述密封件15与所述柔性电路板12相拼接。
其中，密封件15为平直的板状。密封件15靠近柔性电路板12的一侧面直接粘贴于柔性电路板12上的侧边(第三边S3)上。柔性电路板12与受话器13之间的连接需要再设置泡棉，而密封件15为泡棉，则直接与受话器13直接粘接即可，实现受话器13的振动部132、与柔性电路板12和密封件15拼接而成的结构之间形成腔体则为受话器13的声音通道131的一部分。
本申请实施例提供的电子组件1和电子设备100通过使传感器11、柔性电路板12和受话器13呈堆叠状，该结构的电子组件1设置于电子设备100中时，传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，节省了电子组件1与电子设备100的X向的尺寸。
进一步的，请参照图10，所述传感器11于所述柔性电路板12上的正投影的区域D1位于所述受话器13于所述柔性电路板12上的正投影的区域D2中。传感器11与受话器13在Z向重叠，减少了承载于传感器11与受话器13之间的承载件(如柔性电路板12、或柔性电路板12与密封件15组合而成的拼接结构)的尺寸，使得电子组件1装配于电路板中时，节省了电子组件1在X向的尺寸，进一步优化了电子设备100的结构。当然，其它实施例中，如图11所示，传感器11与受话器13于柔性电路板12上的正投影的区域还可以部分重叠，即所述传感器11于所述柔性电路板12上的正投影的区域D1与所述受话器13于所述柔性电路板12上的正投影的区域D2部分重叠；或如图12所示，所述传感器11于所述柔性电路板12上的正投影的区域D1位于所述受话器13于所述柔性电路板12上的正投影的区域D2相互错开，等。
可以理解的，请参照图10，所述传感器11靠近所述柔性电路板12的第一边S1与所述第三边S3的连接处设置。传感器11设置于柔性电路板12的边角，且离柔性电路板12与电路板的连接处较远，使得电子组件1设置于电子设备100上时，传感器11靠近电子设备100的顶部，从而减少了电子设备100的非显示区的尺寸。
可以理解的，请参见图13，所述声音通道131与所述传感器11沿着所述第三边S3至所述第四边S4的方向并排设置。
其中，如图13所示，所述受话孔123于所述受话器13上的正投影的区域位于与所述受话器13上部分的振动部132所在的范围重叠。即所述受话孔123对准所述受话器13上一部分的振动部132。即受话孔123的尺寸小于受话器13的振动部132的尺寸。对应的，受话孔123于柔性电路板12上的正投影的区域D3位于受话器13的振动部132于柔性电路板12上的正投影的区域D4中。可以在受话孔123上额外罩接导音结构，保证受话器13的声音输出。即受话孔123孔于柔性电路板12上的正投影的区域D3位于受话器13的振动部132于柔性电路板12的正投影的区域D4内。受话孔123靠近第一边S1与第四边S4的边角，实现声音通道131与传感器11的并排设置。受话孔123与传感器11并排，可以减少对电子设备100的非显示区的需求，提高电子设备100的屏占比。当然，在其它实施例中，请参照图14，受话孔123的尺寸还可以为受话器13的振动部132的一半，或者，请参照图15，受话孔123与传感器11不同排设置。
进一步的，请参照图1、图16和图17，所述电子设备100还包括显示模组2和中框4，所述显示模组2具有非显示区Z2，所述非显示区Z2开设受话窗口21a，所述中框4层叠设置于所述显示模组1上，且所述中框4的固定部41正对所述非显示区，所述电子模组10固定于所述中框4的固定部41上，且所述电子组件1的声音通道131连通至所述受话窗口21a。
在一实施例中，请参照图17和图18，中框4主要为电子设备的内部元器件的支撑板。中框4正对开设固定部41，该固定部41实质为凹槽，利于电子模组10嵌装于凹槽中，并且中框4在凹槽的底壁上还开设有第一孔42和第二孔43，在显示模组2设置于中框4上时，第一孔42和第二孔43位于正对显示模组2的非显示区Z2，而电子模组10嵌装于固定部41中后， 受话器13对应的一个避空口3a连通第一孔42，传感器11对应的另一避空口3a连通第二孔43。
在一实施例中，请一并参照图16和图19，显示模组2包括依次层叠连接的盖板21和屏组件22。显示模组2与电子设备100的壳体3外壳盖接形成电子设备100封闭的内腔3b，电子组件1收容于该内腔3b中，且电子组件1中的受话孔123和传感器11皆对准显示模组2的非显示区Z2，以使得受话器13中的声音信号能够通过受话孔123传输至受话窗口21a，以使用户能够通过受话窗口21a听取声音信号，并且传感器11对准显示模组2还能够使得传感器11能够接收外部的光线进行工作。其中，非显示区Z2为电子设备100中非用于显示电子图像的区域。电子模组、中框4与显示模组2的装配如下所示：电子模组10嵌设于中框4的固定部41中；接着将显示模组2层叠设置于中框4上，其中，柔性电路板12的第一面121朝向屏组件22，以使受话孔123和传感器11对准非显示区Z2，以使得受话器13中的声音信号能够依次通过受话孔123、避空口3a、第一孔42传输至受话窗口21a，以使用户能够通过受话窗口21a听取声音信号，以使得传感器11能够通过避空口3a、第二孔43依次接收外部的光线进行工作。
由于传感器11、柔性电路板12和受话器13呈堆叠状，故该结构的电子组件1设置于电子设备100中时，传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，节省了电子设备100的中的非显示区Z2的X向的尺寸，即能够增加显示区Z1的尺寸，提高电子设备100屏占比。
在一实施例中，如图16所示，所述显示模组2还具有显示区Z1，所述显示区Z1包围所述非显示区Z2。
可以理解的，如图19所示，所述显示模组2包括依次层叠连接的盖板21和屏组件22，所述屏组件22具有相背设置的两条短边S5、和相背设置的两条长边S6，所述两条长边S6分别连接于所述两条短边S5之间，一条所述短边S5朝着另一条所述短边S5的方向凹陷形成凹槽22a，所述显示模组2于所述凹槽22a以内的区域为所述非显示区Z2，所述显示模组2于所述凹槽22a以外的区域为所述显示区Z1，所述盖板21开设所述受话窗口21a。
如图1和图19所示，即盖板21和屏组件22形成的显示模组2在除了凹槽22a以外的区域皆为显示区Z1。其中，凹槽22a开设于屏组件22的一条短边的中间位置。盖板21上开设与受话孔123对应的受话窗口21a。可以理解的，该受话窗口21a呈长条形，其尺寸大致为受话孔123的2倍。盖板21对应该凹槽22a的部分可以印刷涂层形成显示模组2的非显示区Z2。由于传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，减少了凹槽22a在X方向的尺寸，即能够增加显示区Z1的尺寸，提高电子设备100屏占比。当然，在其它实施例中，如图20所示，凹槽22a还可以位于屏组件22的边角等其它位置。当然，在其它实施例中，所述受话窗口与所述受话孔沿着所述短边方向的长度的比例范围为3：1或者4：1。
可以理解的，所述电子组件1即电子模组10正对所述显示模组2设置，且所述受话器13至少部分对准所述非显示区Z2。
在一实施例中，请参照图1和图19，所述显示模组2的一边缘开设凹槽22a形成非显示区Z2，所述显示模组2于所述非显示区Z2以外的区域为显示区Z1，所述电子组件1正对所述显示模组2设置，且所述受话器13至少部分对准所述非显示区Z2即所述受话器13于所述显示模组2上的至少部分的正投影的区域位于所述非显示区Z2中。使得受话器13部分对准非显示区Z2，进一步减少了非显示区Z2于Y向的尺寸，即能够增加显示区Z1的尺寸，进一步提高电子设备100屏占比。
进一步的，所述传感器11于所述显示模组2上的至少部分的正投影区域位于所述非显示区Z2中。
使受话器13和传感器11的部分结构位于凹槽22a内，而受话器13和传感器11余下的结构于显示模组2上的正投影的范围则位于显示模组2的显示区Z1的范围内，进一步减少了非显示区Z2于Y向的尺寸，即能够增加显示区Z1的尺寸，进一步提高电子设备100屏占比。当然， 在其它实施例中，请参照图22，整个电子组件1皆可以位于凹槽22a内。
可以理解的，如图19所示，电子组件1位于凹槽22a的边角处，以利于凹槽22a的X向中继续设置其它元器件，比如摄像头模组等。当然，在其它实施例中，如图21所示，电子组件1还可以为位于凹槽22a的中间位置，其它元器件分别位于电子组件1的两侧。
本申请实施例提供的电子设备100装配时，首先将传感器11设置于柔性电路板12上，且与柔性电路板12相电连接，接着将受话器13与传感器11相背设置于柔性电路板12上形成电子组件1，将形成的电子组件1与壳体3模块化安装在一起；接着将电子模组10嵌设于中框4的固定部41中；再将显示模组2层叠设置于中框4上，使电子组件1的受话孔123对准盖板21上的受话窗口21a，受话器13和传感器11的部分结构的正投影位于凹槽22a内，而受话器13和传感器11余下的结构于显示模组2上的正投影的范围则位于显示模组2的显示区Z1的范围内。
本申请实施例提供的电子模块和电子设备100通过使传感器11、柔性电路板12和受话器13呈堆叠状，该结构的电子组件设置于电子设备100中时，传感器11、柔性电路板12和受话器13依次沿着电子设备100的Z向堆叠，节省了电子组件1与电子设备100的X向的尺寸；另外，电子模组10为电子组件1设置于壳体3中形成模块的结构，利于电子模组10的装配，提高装配效率。
请参照图23，本申请还提供了一种电子设备的装配方法，包括：
101：提供显示模组2，所述显示模组2具有非显示区Z2，所述非显示区Z2开设受话窗口21a；
103：提供中框4，所述中框4层叠设置于所述显示模组2上，且所述中框4的固定部41正对所述非显示区Z2；
105：提供电子模组10；
具体的，所述电子模组10包括壳体3和电子组件1，所述壳体3具有至少一个避空口3a和连通所述至少一个避空口3a的内腔3b；所述电子组件1包括传感器11、柔性电路板12、受话器13，所述柔性电路板12包括相背设置的第一面12a和第二面12b，所述传感器11设置于所述柔性电路板12的第一面12a上，且所述传感器11电连接于所述柔性电路板12，所述受话器13设置于所述柔性电路板12的第二面12b上，所述受话器13的声音通道131越过或经过所述柔性电路板12连通至外部，所述电子组件1容置于所述壳体3的内腔3b中，且所述传感器11和所述受话器13的声音通道131对应所述壳体3的至少一个避空口3a。
可以理解的，通过注塑成型成壳体3，将电子组件1放置于所述壳体3获得电子模组10。当然，在其它实施例中，对电子组件1进行灌胶封装以获得电子模组10，其中所述电子组件1上灌胶的部分形成壳体3。
107：将所述电子模组10固定于所述中框4的固定部41上；
109：将显示模组2层叠设置于所述中框4上，且使所述非显示区Z1正对所述中框4的固定部41。
其中，电子设备的结构请参见本申请实施例提供的电子设备中的具体描述。
本申请实施例提供的电子设备的安装方法将模块化的电子模组10整个安装于中框4上，再将显示模组层叠设置于中框4上，由于电子模组10为一体式结构，安装时只需注意电子模组10与中框4的安装关系即可，降低了装配难度，提高了装配效率。
以上是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (20)

  1. 一种电子模组，其特征在于，包括壳体和电子组件，所述壳体具有至少一个避空口和连通所述至少一个避空口的内腔；所述电子组件包括传感器、柔性电路板、受话器，所述柔性电路板包括相背设置的第一面和第二面，所述传感器设置于所述柔性电路板的第一面上，且所述传感器电连接于所述柔性电路板，所述受话器设置于所述柔性电路板的第二面上，所述受话器的声音通道越过或经过所述柔性电路板连通至外部，所述电子组件容置于所述壳体的内腔中，且所述传感器和所述受话器的声音通道对应所述壳体的至少一个避空口。
  2. 根据权利要求1所述的电子模组，其特征在于，所述壳体具有两个避空口，一个所述壳体的避空口对应所述传感器，另一个所述壳体的避空口对应所述受话器的声音通道。
  3. 根据权利要求2所述的电子模组，其特征在于，所述壳体还具有限位部，所述限位部凸设于所述壳体的内壁上，所述柔性电路板和所述受话器位于所述限位部与所述壳体的底壁之间。
  4. 根据权利要求1至3任意一项所述的电子模组，其特征在于，所述壳体的内壁包裹于所述电子组件上。
  5. 根据权利要求1至3任意一项所述的电子模组，其特征在于，部分所述电子组件嵌设于所述壳体的内壁上。
  6. 根据权利要求1至5任意一项所述的电子模组，其特征在于，所述壳体具有第一安装面，所述第一安装面开设所述至少一个避空口，所述第一安装面为平直面。
  7. 根据权利要求1至6任意一项所述的电子模组，其特征在于，所述传感器所在的平面与所述至少一个避空口所在的平面平齐。
  8. 根据权利要求1至7任意一项所述的电子模组，其特征在于，所述传感器于所述柔性电路板上的正投影的区域位于所述受话器于所述柔性电路板上的正投影的区域中。
  9. 根据权利要求1至8任意一项所述的电子模组，其特征在于，所述柔性电路板部分覆盖且密封连接所述受话器，所述电子组件还包括与所述柔性电路板相拼接的密封件，所述密封件覆盖且密封连接于所述受话器余下的部分，所述密封件开设受话孔，以使所述受话器的振动部至所述密封件的受话孔之间的通道形成所述声音通道。
  10. 根据权利要求9所述的电子模组，其特征在于，所述密封件具有依次连接的第一密封部和第二密封部，所述第一密封部固定连接有所述柔性电路板，以使所述柔性电路板经所述第一密封部部分覆盖且密封连接所述受话器，所述第二密封部覆盖且密封连接与所述受话器余下的部分。
  11. 根据权利要求9所述的电子模组，其特征在于，所述密封件粘接于所述柔性电路板的侧边上，以使所述密封件与所述柔性电路板相拼接。
  12. 根据权利要求9至11任意一项所述的电子模组，其特征在于，所述密封件为泡棉。
  13. 根据权利要求1至8任意一项所述的电子模组，其特征在于，所述柔性电路板覆盖且密封连接所述受话器，所述柔性电路板开设受话孔，以使所述受话器的振动部至所述柔性电路板的受话孔之间的通道形成所述声音通道。
  14. 一种电子设备，其特征在于，所述电子设备包括电子模组、显示模组和中框，所述电子模组包括壳体和电子组件，所述壳体具有至少一个避空口和连通所述至少一个避空口的内腔；所述电子组件包括传感器、柔性电路板、受话器，所述柔性电路板包括相背设置的第一面和第二面，所述传感器设置于所述柔性电路板的第一面上，且所述传感器电连接于所述柔性电路板，所述受话器设置于所述柔性电路板的第二面上，所述受话器的声音通道越过或经过所述柔性电路板连通至外部，所述电子组件容置于所述壳体的内腔中，且所述传感器和所述受话器的声音通道对应所述壳体的至少一个避空口；所述显示模组具有 非显示区，所述非显示区开设受话窗口，所述中框层叠设置于所述显示模组上，且所述中框的固定部正对所述非显示区，所述电子模组固定于所述中框的固定部上，且所述电子组件的声音通道连通至所述受话窗口。
  15. 根据权利要求14所述的电子设备，其特征在于，所述显示模组还具有显示区，所述显示区包围所述非显示区。
  16. 根据权利要求15所述的电子设备，其特征在于，所述显示模组包括依次层叠连接的盖板和屏组件，所述屏组件具有相背设置的两条短边、和相背设置的两条长边，所述两条长边分别连接于所述两条短边之间，一条所述短边朝着另一条所述短边的方向凹陷形成凹槽，所述显示模组于所述凹槽以内的区域为所述非显示区，所述显示模组于所述凹槽以外的区域为所述显示区，所述盖板开设所述受话窗口。
  17. 根据权利要求14所述的电子设备，其特征在于，所述壳体具有两个避空口，一个所述壳体的避空口对应所述传感器，另一个所述壳体的避空口对应所述受话器的声音通道。
  18. 一种电子设备的装配方法，其特征在于，包括：
    提供显示模组，所述显示模组具有非显示区，所述非显示区开设受话窗口；
    提供中框，所述中框层叠设置于所述显示模组上，且所述中框的固定部正对所述非显示区；
    提供电子模组，所述电子模组包括壳体和电子组件，所述壳体具有至少一个避空口和连通所述至少一个避空口的内腔；所述电子组件包括传感器、柔性电路板、受话器，所述柔性电路板包括相背设置的第一面和第二面，所述传感器设置于所述柔性电路板的第一面上，且所述传感器电连接于所述柔性电路板，所述受话器设置于所述柔性电路板的第二面上，所述受话器的声音通道越过或经过所述柔性电路板连通至外部，所述电子组件容置于所述壳体的内腔中，且所述传感器和所述受话器的声音通道对应所述壳体的至少一个避空口；
    将所述电子模组固定于所述中框的固定部上；
    将显示模组层叠设置于所述中框上，且使所述非显示区正对所述中框的固定部。
  19. 根据权利要求18所述的电子设备的装配方法，其特征在于，所述提供电子模组的步骤包括：
    对电子组件进行灌胶封装以获得电子模组，其中所述电子组件上灌胶的部分形成壳体。
  20. 根据权利要求18所述的电子设备的装配方法，其特征在于，所述提供电子模组的步骤包括：
    通过注塑成型成壳体，
    将电子组件放置于所述壳体获得电子模组。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140078708A1 (en) * 2012-09-17 2014-03-20 Lg Electronics Inc. Mobile terminal
CN106940584A (zh) * 2017-03-07 2017-07-11 广东欧珀移动通信有限公司 终端
CN107395812A (zh) * 2017-08-23 2017-11-24 广东欧珀移动通信有限公司 电子组件及电子装置
CN208128300U (zh) * 2017-12-29 2018-11-20 广东欧珀移动通信有限公司 电子组件和电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204119279U (zh) * 2014-06-18 2015-01-21 锤子科技（北京）有限公司 一种移动终端
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140078708A1 (en) * 2012-09-17 2014-03-20 Lg Electronics Inc. Mobile terminal
CN106940584A (zh) * 2017-03-07 2017-07-11 广东欧珀移动通信有限公司 终端
CN107395812A (zh) * 2017-08-23 2017-11-24 广东欧珀移动通信有限公司 电子组件及电子装置
CN208128300U (zh) * 2017-12-29 2018-11-20 广东欧珀移动通信有限公司 电子组件和电子设备

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