WO2019128115A1

WO2019128115A1 - Optical reference point identification method and system, and computer-readable storage medium and device

Info

Publication number: WO2019128115A1
Application number: PCT/CN2018/090382
Authority: WO
Inventors: 钱胜杰; 刘继硕; 刘丰收
Original assignee: 上海望友信息科技有限公司
Priority date: 2017-12-29
Filing date: 2018-06-08
Publication date: 2019-07-04
Also published as: CN108052771B; CN108052771A

Abstract

Disclosed are an optical reference point identification method and system, and a computer-readable storage medium and a device. The optical reference point identification method comprises: extracting all bonding pads and attribute information thereof from image design data of a PCB to be identified (S11); reading an identification parameter configuration for the identification of an optical reference point (S12); and determining all the bonding pads one by one or in parallel according to the attribute information of the bonding pads, the identification parameter configuration and a predetermined screening condition and in conjunction with a pre-set screening sequence of the predetermined screening condition, so as to mark the optical reference point (S13). The present invention can provide a predetermined optical reference point for the reference of a client, and the client does not need to look at a plate to manually find the optical reference point, thereby reducing the manual steps during an SMT manufacturing procedure, solving a critical problem in automatic program manufacturing, and providing technical support for the realization of intelligent manufacturing in the electronics industry.

Description

Optical reference point identification method, system, computer readable storage medium and device

Technical field

The invention belongs to the technical field of detection of PCB circuit boards, and relates to an identification method and system, in particular to an optical reference point identification method, system, computer readable storage medium and device.

Background technique

Two or more optical reference points are designed on the PCB board to locate the entire PCB, which is convenient for SMT equipment to identify the position, such as screen printers, placement machines, optical inspection machines, etc. This benchmark will be used.

At present, most of the programs in the industry for making SMT devices are manually moved to the PCB optical reference point to find it; or the engineer reads the graphics in the design file through software and then assigns this point as an optical reference point according to his work experience.

Intelligent manufacturing requires that the steps of manual intervention in the manufacturing process be minimized, and that the production equipment program can be completed in a short time or even automatically.

The definition of the optical reference point on the PCB board is an indispensable part. If the software can automatically identify the optical reference point and define it, it will be a key technical point to realize the automatic production program.

Therefore, an optical reference point identification method, a system, a computer readable storage medium, and a device are provided to solve the problem that the prior art cannot automatically identify and define optical reference points, which has become a technical problem to be solved by those skilled in the art.

Summary of the invention

In view of the above disadvantages of the prior art, an object of the present invention is to provide an optical reference point identification method, system, computer readable storage medium and device for solving the problem that the prior art cannot automatically identify and define an optical reference point. .

To achieve the above and other related objects, an aspect of the present invention provides an optical reference point identification method, including: extracting all pads and attribute information in graphic design data of a PCB to be identified; and reading for identifying an optical reference Point identification parameter configuration; determining, according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition, all the pads are judged one by one or in parallel to mark the optical reference point .

In an embodiment of the invention, the pad attribute information includes a pad shape, a pad size, a pad on a pad, a name of a component on the pad, and a network link state of the pad.

In an embodiment of the invention, the identification parameter configuration includes a predetermined pad shape, a predetermined pad size range, a value of a pin on a predetermined pad, a name prefix of a component on a predetermined pad, and a no network link state.

In an embodiment of the invention, the predetermined screening condition includes a screening condition that combines a name prefix of a component on a predetermined pad with a value of a pin on a predetermined pad, a screening condition including a network link state, and a predetermined pad. A filter condition that combines the shape with a predetermined range of pad sizes.

In an embodiment of the invention, the predetermined screening sequence is: first determining whether the name prefix of the component on the pad is a name prefix of the component on the predetermined pad, and whether the value of the pin on the pad is 1; then it is judged whether the pad network link state is represented as no network link state; finally, it is judged whether the pad shape and the pad size conform to the predetermined pad shape and the predetermined pad size range.

In an embodiment of the invention, the determining, according to the identification parameter/item, the predetermined screening condition and the preset screening order, determining all the pads one by one to mark the optical reference point comprises: determining the ith Whether the name prefix of the component on the pad is the name of the component on the predetermined pad, and whether the value of the pin on the i-th pad is 1; if so, the i-th pad is marked as an optical reference point; No, it is determined whether the network link state of the i-th pad is a no-network link state; if yes, determining whether the pad shape and the pad size value of the i-th pad meet the predetermined pad shape and the predetermined pad size range If yes, the i-th pad is marked as an optical reference point; if not, the determination of the i-th pad is terminated, and the step of determining the i-th pad is performed; if not, the process is ended The judgment of the i-th pad is carried out to the step of judging the i+1th pad; wherein i starts from 1.

In an embodiment of the invention, the step of determining, in accordance with the identification parameter value/item, the predetermined screening condition and the preset screening order, all the pads in parallel to mark the optical reference point comprises: determining all the welding Whether the name prefix of the component on the disk is the name of the component on the predetermined pad, and whether the value of the pin on all the pads is 1; if so, the name of the component is prefixed with the name of the component on the predetermined pad. And the pad with the value of 1 on the pad is marked as the optical reference point; if not, it is judged whether the network link status of all the pads is the no-network link state; if so, the pad shape of all the pads is determined and Whether the pad size value conforms to the predetermined pad shape and the predetermined pad size range, and if so, the pad mark conforming to the predetermined pad shape and the pad size value conforming to the predetermined pad size range is marked as an optical reference point; Otherwise, the determination of the pad is ended; if not, the determination of the pad is ended.

Another aspect of the present invention provides an optical reference point recognition system, including: an extraction module, configured to extract all pads and attribute information in graphic design data of a PCB to be identified; and a reading module for reading Identifying an identification parameter configuration of the optical reference point; and processing a module, configured to perform all the pads one by one or in parallel according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening sequence combined with the predetermined screening condition Judge to mark the optical reference point.

Yet another aspect of the present invention provides a computer readable storage medium having stored thereon a computer program that, when executed by a processor, implements the optical reference point identification method.

A final aspect of the invention provides an apparatus comprising: a processor and a memory; the memory for storing a computer program, the processor for executing the computer program of the memory storage, to cause the apparatus to perform the optical reference Point identification method.

As described above, the optical reference point identification method, system, computer readable storage medium and device of the present invention have the following beneficial effects:

The optical reference point identification method, system, computer readable storage medium and device provided by the invention can provide pre-determined optical reference points for reference to customers without requiring the customer to look at the board to manually find optical reference points, thereby reducing the SMT process. The steps of manual participation in the process solve a key problem in the production of automated programs and provide technical support for the intelligent manufacturing of the electronics industry.

DRAWINGS

FIG. 1A is a flow chart showing an optical reference point identification method according to an embodiment of the present invention.

FIG. 1B is a flow chart showing the judgment of all the pads one by one in S13 of the present invention.

2 is a schematic view showing the principle structure of an optical reference point identification system of the present invention in an embodiment.

Component label description

2 Optical reference point recognition system

21 extraction module

22 reading module

23 processing module

S11~S13 steps

S131～S135 steps

Detailed ways

The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily understand other advantages and effects of the present invention from the disclosure of the present disclosure. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. It should be noted that the features in the following embodiments and embodiments may be combined with each other without conflict.

It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the drawings, rather than the number and shape of components in actual implementation. Dimensional drawing, the actual type of implementation of each component's type, number and proportion can be a random change, and its component layout can be more complicated.

Embodiment 1

The embodiment provides an optical reference point identification method, including:

Extracting all pads and attribute information in the graphic design data of the PCB to be identified;

Reading an identification parameter configuration for identifying an optical reference point;

All the pads are judged one by one or in parallel according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition to mark the optical reference point.

The optical reference point identification method provided by the present embodiment will be described in detail below with reference to the drawings. The optical reference point identification method described in this embodiment is applied to graphic data of a PCB board. Referring to FIG. 1A, a flow chart showing an optical reference point identification method in an embodiment is shown. As shown in FIG. 1A, the optical reference point identification method specifically includes the following steps:

S11. Extract all the pads and attribute information in the graphic design data of the PCB to be identified. In this embodiment, all of the pads include pads of all front and back layers in the graphic design data of the PCB to be identified. The pad attribute information includes a pad shape, a pad size, a pin on a pad, a name of a component on the pad, and a network link state of the pad.

S12, reading an identification parameter configuration for identifying an optical reference point. The identification parameter configuration includes a predetermined pad shape, a predetermined pad size range, a value of a pin on a predetermined pad, a name prefix of a component on a predetermined pad, and a no-network link state.

For example, [MarkRefSetting]

//The name prefix of the component on the predetermined pad requires the component starting with FID or MARK.

MarkShapeName=FID, MARK

//The predetermined pad shape requirement must be round or square

Mark_TYPE=Circle, square

/ / The minimum size of the predetermined pad

Mark_Pad_Min=0.8

/Predetermined pad maximum size

Mark_Pad_Max=1.5

The predetermined pad size ranges between 0.8 and 1.5;

The value of the pin on the predetermined pad is =1.

S13. Determine, according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition, all the pads are determined one by one or in parallel to mark the optical reference point. In this embodiment, the predetermined screening condition includes a screening condition combining a name prefix of a component on a predetermined pad with a value of a pin on a predetermined pad, a screening condition including a network link state, and a predetermined pad shape and a predetermined A combination of pad size ranges for screening conditions. The predetermined screening sequence combined with the predetermined screening condition is: first determining whether the name prefix of the component on the pad is the name of the component on the predetermined pad, and whether the value of the pin on the pad is 1; It is judged whether the pad network link state value is represented as a no-network link state; finally, it is judged whether the type item and the pad size value of the pad shape conform to the predetermined pad shape and the predetermined pad size range.

Please refer to 1B, which is shown as a schematic diagram of the process of judging all the pads one by one in S13. As shown in FIG. 1B, the S13 includes:

S131, determining whether the name prefix of the component on the i-th pad is the name of the component on the predetermined pad, and whether the value of the pin on the i-th pad is 1; if yes, executing S132, ie, the ith The pad is marked as an optical reference point; if not, then executing S133;

S133, determining whether the network link state of the i-th pad is a no-network link state; if yes, executing S134; if not, ending the judgment of the i-th pad, and transferring to S135, that is, the i+1th The step of judging the pad until all the pads are judged. In the present embodiment, the step of judging the i+1th pad is to repeat S131-S135.

S134, determining whether the pad shape and the pad size value of the i-th pad meet the predetermined pad shape and the predetermined pad size range, and if yes, returning to perform S132, marking the i-th pad as an optical reference point; Otherwise, the judgment of the i-th pad is ended, and the process proceeds to S135 to judge the i+1th pad until all the pads are judged.

In this embodiment, i starts from 1.

For example, the first pad in the graphic design data of the PCB to be identified, the pad attribute information of the pad is 10652: the pad size SIZE=1.016, the name prefix of the component on the pad PARTNAME=fid2, the pad shape = square, the network link state of the pad NET = null value or it can be judged that there is no physical connection line.

The identification parameter configuration includes: a component prefix on the predetermined pad requires a component starting with FID or MARK;

For example, MarkShapeName=FID, MARK

//The predetermined pad shape requirement must be round or square

For example, Mark_TYPE=circle, square

/ / The minimum size of the predetermined pad

For example, Mark_Pad_Min=0.8

/Predetermined pad maximum size

For example, Mark_Pad_Max=1.5

The predetermined pad size ranges between 0.8 and 1.5;

The value of the pin on the predetermined pad is =1.

Therefore, the name prefix PARTNAME of the first pad component conforms to the FID start, and this pad is the only pad of the component fid2, that is, the component pad with only one pin. This pad can be marked as an optical reference point. The first pad screening ends.

For example, the second pad in the graphic design data of the PCB to be identified, the pad attribute information of the pad is 10950: the pad size SIZE=0.0889, the name prefix of the component on the pad PARTNAME=null, pad Shape = round, the network link status of the pad NET = XSIG100555, there is a network connection. The name prefix PARTNAME of the component on the pad is null and does not match the start of the fid or mark character. Then judge the network link status of the second pad as having a network link status, which does not meet the requirements. The second pad screening ends.

For example, the pad attribute information of the third pad in the graphic design data of the PCB to be identified is 10654: pad size SIZE=1.016, name prefix of the component on the pad PARTNAME=null value, pad shape=circle , the network link status of the pad NET = null value or it can be judged that there is no physical connection line. The name prefix PARTNAME of the component on the pad is null and does not match the start of the fid or mark character. Then, it is judged that the network link state of the second pad is no network connection state, and then the pad shape=circle is determined, the pad size is in the range of the predetermined pad size range of 0.8 and 1.5, and the third pad is marked as the optical reference. point. This pad screening ends.

The S13 further includes: judging all the pads in parallel according to the identification parameter value/item, the predetermined screening condition, and the preset screening order in combination with the predetermined screening condition to mark the optical reference point.

Specifically, it is determined whether the name prefix of the components on all the pads is the name of the component on the predetermined pad, and whether the value of the pin on all the pads is 1; if so, the name of the component is prefixed to the predetermined pad. The name of the upper component, and the pad with the value of 1 on the pad is marked as the optical reference point; if not, it is judged whether the network link status of all the pads is the no-network link state; if so, all the soldering is judged Whether the pad shape and the pad size value of the disk conform to the predetermined pad shape and the predetermined pad size range, and if so, the pad shape conforms to the predetermined pad shape and the pad size value conforms to the predetermined pad size range of the pad mark It is an optical reference point; if not, the determination of the pad is ended; if not, the determination of the pad is ended.

The embodiment further provides a computer readable storage medium having stored thereon a computer program, the program being implemented by the processor to implement the optical reference point identification method. One of ordinary skill in the art will appreciate that all or part of the steps to implement the various method embodiments described above can be accomplished by hardware associated with a computer program. The aforementioned computer program can be stored in a computer readable storage medium. The program, when executed, performs the steps including the foregoing method embodiments; and the foregoing storage medium includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.

The optical reference point identification method according to the embodiment can provide a pre-determined optical reference point for reference to the customer, without requiring the customer to look at the board to manually find the optical reference point, thereby reducing the steps of manual participation in the SMT process, and solving the problem. A key issue in the production of automated programs provides technical support for intelligent manufacturing in the electronics industry.

Embodiment 2

This embodiment provides an optical reference point identification system, including:

An extraction module, configured to extract all the pads and attribute information in the graphic design data of the PCB to be identified;

a reading module for reading an identification parameter configuration for identifying an optical reference point;

And a processing module, configured to judge all the pads one by one or in parallel according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition, to mark the optical reference point.

The optical reference point recognition system provided by the present embodiment will be described in detail below with reference to the drawings. It should be noted that the division of each module of the above optical reference point identification system is only a division of logic functions, and the actual implementation may be integrated into one physical entity in whole or in part, or may be physically separated. And these modules can all be implemented by software in the form of processing component calls; or all of them can be implemented in hardware form; some modules can be realized by processing component calling software, and some modules are realized by hardware. For example, the x module may be a separately set processing element, or may be integrated in one of the above-mentioned devices, or may be stored in the memory of the above device in the form of program code, by a processing element of the above device. Call and execute the functions of the above x modules. The implementation of other modules is similar. In addition, all or part of these modules can be integrated or implemented independently. The processing elements described herein can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules may be completed by an integrated logic circuit of hardware in the processor element or an instruction in a form of software.

For example, the above modules may be one or more integrated circuits configured to implement the above method, for example, one or more specific integrated circuits (ASICs), or one or more microprocessors (digitalsingnal processors, referred to as DSP), or one or more Field Programmable Gate Arrays (FPGAs). For another example, when one of the above modules is implemented by the processing component dispatcher code, the processing component may be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call the program code. As another example, these modules can be integrated and implemented in the form of a system-on-a-chip (SOC).

Referring to FIG. 2, a schematic structural diagram of an optical reference point identification system in an embodiment is shown. As shown in FIG. 2, the optical reference point recognition system 2 includes an extraction module 21, a reading module 22, and a processing module 23.

The extraction module 21 is configured to extract all the pads and attribute information in the graphic design data of the PCB to be identified. In this embodiment, all of the pads include pads of all front and back layers in the graphic design data of the PCB to be identified. The pad attribute information includes a pad shape, a pad size, a pin on a pad, a name of a component on the pad, and a network link state of the pad.

A reading module 22 coupled to the extraction module 21 is operative to read an identification parameter configuration for identifying an optical reference point. The identification parameter configuration includes a predetermined pad shape, a predetermined pad size range, a value of a pin on a predetermined pad, a name prefix of a component on a predetermined pad, and a no-network link state.

For example, [MarkRefSetting]

MarkShapeName=FID, MARK

//The predetermined pad shape requirement must be round or square

Mark_TYPE=Circle, square

/ / The minimum size of the predetermined pad

Mark_Pad_Min=0.8

/Predetermined pad maximum size

Mark_Pad_Max=1.5

The predetermined pad size ranges between 0.8 and 1.5;

The value of the pin on the predetermined pad is =1.

The processing module 23 coupled to the extraction module 21 and the reading module 22 respectively is configured to perform all the welding according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition. The discs are judged one by one or in parallel to mark the optical reference point. In this embodiment, the predetermined screening condition includes a screening condition combining a name prefix of a component on a predetermined pad with a value of a pin on a predetermined pad, a screening condition including a network link state, and a predetermined pad shape and a predetermined A combination of pad size ranges for screening conditions. The preset screening sequence is:

First, it is determined whether the name prefix of the component on the pad is the name of the component on the predetermined pad, and whether the value of the pin on the pad is 1; then determining whether the pad network link state value is represented as no network link state; Finally, it is judged whether the type item and the pad size value of the pad shape conform to the predetermined pad shape and the predetermined pad size range.

The processing module 23 is specifically configured to determine whether the name prefix of the component on the i-th pad is the name of the component on the predetermined pad, and whether the value of the pin on the i-th pad is 1; if yes, The i-th pad is marked as an optical reference point; if not, it is determined whether the network link state of the i-th pad is a no-network link state; if yes, determining the pad shape and pad size value of the i-th pad Whether the predetermined pad shape and the predetermined pad size range are met, and if so, the i-th pad is marked as an optical reference point; if not, the determination of the i-th pad is ended, for the i+1th pad If not, the determination of the i-th pad is ended, and the determination of the i+1th pad is continued; wherein i starts from 1.

The processing module 23 is specifically configured to determine whether the name prefix of the components on all the pads is the name of the component on the predetermined pad, and whether the value of the pin on all the pads is 1; if yes, the name of the component The prefix is the name of the component on the predetermined pad, and the pad with the value of the pin on the pad is marked as the optical reference point; if not, it is determined whether the network link state of all the pads is the no-network link state; , determining whether the pad shape and the pad size value of all the pads conform to the predetermined pad shape and the predetermined pad size range, and if so, conforming the pad shape to the predetermined pad shape and the pad size value according to the predetermined pad size The pad of the range is marked as an optical reference point; if not, the determination of the pad is ended; if not, the determination of the pad is ended.

Embodiment 3

The embodiment provides an apparatus, including: a processor, a memory, a transceiver, a communication interface, and a system bus; the memory and the communication interface are connected to the processor and the transceiver through the system bus, and complete communication with each other, and the memory is used for A computer program is stored, the communication interface is for communicating with other devices, and the processor and transceiver are for running a computer program to cause the device to perform various steps of the optical reference point identification method as described above.

The system bus mentioned above may be a Peripheral Pomponent Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The system bus can be divided into an address bus, a data bus, a control bus, and the like. The communication interface is used to implement communication between the database access device and other devices such as clients, read-write libraries, and read-only libraries. The memory may include random access memory (RAM), and may also include non-volatile memory, such as at least one disk storage.

The above processor may be a general-purpose processor, including a central processing unit (CPU), a network processor (Network Processor, NP for short), and the like; or a digital signal processor (DSP), an application specific integrated circuit (DSP). ApplicationSpecificIntegratedCircuit (ASIC), Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

In summary, the optical reference point identification method, system, computer readable storage medium and device provided by the present invention can provide a pre-determined optical reference point for reference to a customer without requiring the customer to look at the board to manually find an optical reference point. Thereby, the steps of manual participation in the SMT process can be reduced, a key problem in the production of the automation program is solved, and technical support for the intelligent manufacturing of the electronics industry is provided. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications or variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention will be covered by the appended claims.

Claims

An optical reference point identification method, comprising:

Extracting all pads and attribute information in the graphic design data of the PCB to be identified;

Reading an identification parameter configuration for identifying an optical reference point;

All the pads are judged one by one or in parallel according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition to mark the optical reference point.
The optical reference point identification method according to claim 1, wherein the pad attribute information comprises a pad shape, a pad size, a pin on a pad, a name of a component on the pad, and a network of pads. Link status.
The optical reference point identification method according to claim 2, wherein the identification parameter configuration comprises a predetermined pad shape, a predetermined pad size range, a value of a pin on a predetermined pad, and a component on the predetermined pad. Name prefix and no network link status.
The optical reference point recognition method according to claim 3, wherein

The predetermined screening condition includes a screening condition combining a name prefix of a component on a predetermined pad with a value of a pin on a predetermined pad, a screening condition including a network link state, and a predetermined pad shape combined with a predetermined pad size range. Filtering conditions.
The optical reference point recognition method according to claim 3, wherein

The preset screening sequence is:

First, it is judged whether the name prefix of the component on the pad is the name prefix of the component on the predetermined pad, and whether the value of the pin on the pad is 1;

Then determining whether the pad network link status is represented as no network link status;

Finally, it is judged whether the pad shape and the pad size conform to the predetermined pad shape and the predetermined pad size range.
The optical reference point identification method according to claim 5, wherein said determining, based on said identification parameter/item, a predetermined screening condition and a predetermined screening order, determining all of the pads one by one to mark an optical reference point The steps include:

Determining whether the name prefix of the component on the i-th pad is the name of the component on the predetermined pad, and whether the value of the pin on the i-th pad is 1; if so, marking the i-th pad as optical a reference point; if not, determining whether the network link state of the i-th pad is a no-network link state; if so, determining whether the pad shape and the pad size value of the i-th pad conform to a predetermined pad shape and predetermined The pad size range, if yes, the i-th pad is marked as an optical reference point; if not, the determination of the i-th pad is terminated, and the step of determining the i-th pad is performed; Otherwise, the determination of the i-th pad is terminated, and the step of judging the i+1th pad is performed; wherein i starts from 1.
The optical reference point identification method according to claim 5, wherein said determining, in accordance with said identification parameter value/item, a predetermined screening condition and a predetermined screening order, all the pads are judged in parallel to mark an optical reference The steps of the point include:

Determine whether the name prefix of the components on all pads is the name of the component on the predetermined pad, and whether the value of the pin on all pads is 1; if so, the name of the component is prefixed to the component on the predetermined pad. The name of the pad with the value of 1 on the pad is marked as the optical reference point; if not, it is judged whether the network link status of all the pads is the no-network link state; if so, the soldering of all the pads is judged Whether the disk shape and the pad size value conform to the predetermined pad shape and the predetermined pad size range, and if so, the pad shape conforming to the predetermined pad shape and the pad size value conforming to the predetermined pad size range is marked as an optical reference Point; if not, the judgment of the pad is ended; if not, the judgment of the pad is ended.
An optical reference point recognition system, comprising:

An extraction module, configured to extract all the pads and attribute information in the graphic design data of the PCB to be identified;

a reading module for reading an identification parameter configuration for identifying an optical reference point;

And a processing module, configured to judge all the pads one by one or in parallel according to the pad attribute information, the identification parameter configuration, the predetermined screening condition, and the preset screening order combined with the predetermined screening condition, to mark the optical reference point.
A computer readable storage medium having stored thereon a computer program, wherein the program is executed by a processor to implement the optical reference point identification method according to any one of claims 1 to 7.
An apparatus, comprising: a processor and a memory;

The memory is for storing a computer program for executing the computer program stored by the memory to cause the device to perform the optical reference point identification method according to any one of claims 1 to 7.