WO2019123829A1

WO2019123829A1 - Switch device

Info

Publication number: WO2019123829A1
Application number: PCT/JP2018/039689
Authority: WO
Inventors: 秀隆佐藤
Original assignee: アルプスアルパイン株式会社
Priority date: 2017-12-22
Filing date: 2018-10-25
Publication date: 2019-06-27
Also published as: JPWO2019123829A1; JP6934070B2; CN111492450A; CN111492450B

Abstract

Disclosed is a switch device including: a movable contact member; a fixed contact member having a fixed contact part working together with the movable contact member and a connection terminal part soldered to an external circuit; and a resin part joined to the fixed contact member, the resin part forming a concave accommodating part that opens to a first side in a first direction and accommodates the movable contact member, the fixed contact part being exposed in the accommodating part, and the connection terminal part being exposed from a side surface, in a second direction intersecting the first direction, of the resin part. The resin part has, on a second side opposite the first side in the first direction: a first surface; a hole extending to the fixed contact member; and a groove part formed adjacent to the first surface and around the hole, the groove part indenting further toward the first side than does the first surface and opening on the outside with respect to a third direction intersecting the first direction. The bottom surface of the groove part has an inclined surface inclined with respect to the first surface so that the first-direction distance with respect to the first surface progressively increases further on the outside in the third direction.

Description

Switch device

The present disclosure relates to a switch device.

A fixed contact member having an external connection terminal to be soldered and a contact portion to which an electrical connection state is switched, wherein the remaining amount of flux contained in the solder penetrates from the external connection terminal to the contact portion A switch device having a structure that avoids

JP, 2015-008084, A

By the way, in the switch device as in the above-mentioned prior art, the housing portion in which the fixed contact is positioned and the movable contact is accommodated is a substantially sealed space, but a slight space between the fixed contact member and the resin portion There is a gap. For example, a gap tends to occur in the mark (hole) of a pin that holds the fixed contact member during insert molding. For this reason, when reflow soldering is performed, the air in the housing portion expands, and at that time, part of the air is released to the outside from the gap between the fixed contact member and the resin portion. Thereafter, the air in the housing cools and contracts, and at this time, the outside air slightly intrudes from the gap into the housing. Such expansion and contraction exerts a pump-like effect and wicks the flux from the gap between the fixed contact member and the resin portion into the housing portion, which is one of the main causes of so-called fluxing. The flux buildup can cause inconveniences such as contact failure.

Therefore, in one aspect, the present invention aims to reduce the flux buildup due to the expansion and contraction of air in the housing portion accompanying reflow soldering.

In one aspect, a movable contact member,
A stationary contact member having a stationary contact portion cooperating with the movable contact member, and a connection terminal portion soldered to an external circuit;
A concave-shaped housing portion is formed which is joined to the fixed contact member and opened on the first side in the first direction to receive the movable contact member, and the fixed contact portion is exposed in the housing portion, and And a resin portion in which the connection terminal portion is exposed from a side surface in a second direction intersecting the first direction,
The resin portion is formed on a second surface opposite to the first side in the first direction, the first surface, a hole reaching the fixed contact member, and a hole adjacent to the first surface and around the hole And a groove which is recessed on the first side with respect to the first surface and which is open on the outer side in a third direction intersecting the first direction,
The switch device is provided, wherein the bottom surface of the groove includes an inclined surface that is inclined with respect to the first surface in a direction in which the distance in the first direction with the first surface increases toward the opening side.

In one aspect, according to the present invention, it is possible to reduce the flux rise due to the expansion and contraction of air in the housing portion accompanying reflow soldering.

1 is an exploded perspective view showing a switch device according to one embodiment. It is a perspective view which shows the integral molding of a resin part and a fixed contact member. It is sectional drawing which shows an example of the mounting state of a switch apparatus. It is the perspective view which looked the fixed contact member 20 from the upper side. It is the perspective view which looked the integral molding of a resin part and a fixed contact member from lower side. It is the top view which looked at the integral molding of a resin part and a fixed contact member from lower side. FIG. 6 is an explanatory view of the warpage of the switch device 1; It is sectional drawing of a part of switch apparatus 1A by the comparative example of the state without curvature. It is sectional drawing of a part of switch apparatus 1A by the comparative example of the state with curvature. It is sectional drawing of the switch apparatus 1 by the present Example in the state with curvature. It is a perspective view which shows switch apparatus 1B by another Example from lower side. It is a top view which shows the switch apparatus 1C by a 1st modification from lower side. It is a top view which shows switch apparatus 1D by a 2nd modification from lower side. It is a top view which shows the switch apparatus 1E by a 3rd modification from lower side.

Hereinafter, each example will be described in detail with reference to the attached drawings.

FIG. 1 is an exploded perspective view showing a switch device 1 according to one embodiment, in which three orthogonal axes X, Y, Z are defined. The Z direction (an example of the first direction) corresponds to the thickness direction of the switch device 1, and in the following, the positive side in the Z direction is referred to as “upper side” for the sake of description. Also, in the following, unless stated otherwise, the terms "inner" and "outer" are used with reference to the center C of the switch device 1 when viewed in the Z direction. For example, the inside indicates the side closer to the center C of the switch device 1. In the following, unless otherwise stated, the outside refers to the outside of the switch device 1. Moreover, a side surface points out the surface of the side which makes a direction perpendicular | vertical to a Z direction a normal line.

FIG. 2 is a perspective view showing an integrally molded product of the resin portion 30 and the fixed contact member 20. As shown in FIG. FIG. 3 is a cross-sectional view showing an example of the mounting state of the switch device 1. FIG. 3 is a partial cross-sectional view along the XZ plane passing through the center C of the switch device 1. FIG. 4 is a perspective view of the fixed contact member 20 as viewed from above. FIG. 5A is a perspective view of an integrally molded article of the resin portion 30 and the fixed contact member 20 as viewed from below, and FIG. 5B is a view of the integrally molded article of the resin portion 30 and the fixed contact member 20 from below. It is a plan view.

As shown in FIG. 3, the switch device 1 is mounted on a substrate 50 of an electronic device (not shown) and electrically connected to an electric circuit (not shown) on the substrate 50. The electronic device is optional, but may be, for example, a portable terminal such as a smartphone, an on-vehicle electronic device, or the like.

The switch device 1 includes a movable contact member 10, a fixed contact member 20, a resin portion 30, and a sealing member 40.

The movable contact member 10 is formed of a conductive material (for example, a metal material). The movable contact member 10 has elasticity and is movable by being elastically deformed. Specifically, the movable contact member 10 is formed in a dome shape by a thin plate, and can be reversely operated. The movable contact member 10 can provide the user with a "operation feeling (click feeling)" when performing the reverse operation. In the example shown in FIG. 1, the movable contact member 10 is formed, for example, by superposing three similar dome-shaped thin plates. In the present embodiment, as an example, the movable contact member 10 has a dome-shaped top near the center C of the switch device 1.

The stationary contact member 20 has a stationary contact portion cooperating with the movable contact member 10. The fixed contact member 20 has a connection terminal 24 soldered to an electrode (not shown) of the electrical circuit on the substrate 50. In the present embodiment, as an example, the fixed contact member 20 is composed of two members, and the fixed contact portion includes the central contact portion 2110 and the outer peripheral contact portion 2120, and the connection terminal 24 includes the first connection terminal 2401 and the second connection terminal 2401. And a connection terminal 2402.

Specifically, as shown in FIGS. 2 and 4, the fixed contact member 20 includes a central contact forming member 211 and an outer peripheral contact forming member 212. The central contact forming member 211 and the outer peripheral contact forming member 212 are formed of a conductive material (for example, a metal material). The central contact forming member 211 and the outer peripheral contact forming member 212 in the embodiments described below can be formed of sheet metal.

The central contact formation member 211 forms a central contact portion 2110 and a first connection terminal 2401 as shown in FIGS. 2 and 4. The central contact portion 2110 is a portion where a movable contact member 10 can form a fixed contact (hereinafter also referred to as a “central contact” for distinction) to which the movable contact member 10 can move. The central contact portion 2110 has an upper surface exposed from the resin portion 30 and faces the movable contact member 10 in the Z direction. In the present embodiment, the switch device 1 is, for example, a normally open type, and in the normal state, the movable contact member 10 is in contact with the outer peripheral contact portion 2120 described later. The central contact portion 2110 and the outer peripheral contact portion 2120 are not electrically connected. That is, the switch device 1 is turned off. When the user pushes the movable contact member 10 downward, the movable contact member 10 contacts the central contact portion 2110, and the central contact portion 2110 and the outer peripheral contact portion 2120 are electrically connected via the movable contact member 10, and the switch The device 1 is turned on (conductive).

The central contact portion 2110 is formed near the center C of the switch device 1. However, in the modification, the central contact portion 2110 may be formed to be offset from the center C. In the present embodiment, as an example, the central contact portion 2110 has a circular outer shape, has two semicircular convex portions 2112, and has an outer periphery on the circular outer peripheral side formed by the two convex portions 2112. The portion 2111 extends. The convex portion 2112 is convex above the surface of the outer peripheral portion 2111 and can function as a substantial contact (central contact) with the movable contact member 10.

The first connection terminal 2401 forms a connection terminal portion soldered to an external circuit on the substrate 50. In the present embodiment, as an example, the first connection terminals 2401 are formed on both sides in the X direction on the positive side in the Y direction with respect to the central contact portion 2110.

The outer peripheral contact forming member 212 does not make direct contact with the central contact forming member 211, and electrically connects only through the movable contact member 10. Specifically, in a state where the movable contact member 10 is in contact with the central contact portion 2110, the outer peripheral contact formation member 212 is electrically connected to the central contact formation member 211 via the movable contact member 10. Further, in a state where the movable contact member 10 is separated from the central contact portion 2110, the outer peripheral contact formation member 212 is electrically disconnected from the central contact formation member 211. In the switch device 1, the two states can be electrically taken out via the connection terminal 24 as the on / off signal.

The outer peripheral contact forming member 212 forms an outer peripheral contact portion 2120 and a second connection terminal 2402 as shown in FIGS. 2 and 4. In the present embodiment, as an example, the outer peripheral contact portions 2120 are provided on both sides in the X direction of the central contact portion 2110.

As shown in FIG. 2, the outer peripheral contact portion 2120 exposes the upper surface of the resin portion 30. The movable contact member 10 is placed on the upper surface of the outer peripheral contact portion 2120. The outer peripheral contact portion 2120 abuts on the lower edge of the outer periphery of the movable contact member 10 in the Z direction. Therefore, the outer peripheral contact portion 2120 is a portion that forms a fixed contact (hereinafter also referred to as “an outer peripheral contact” for distinction) which the movable contact member 10 always contacts. In this embodiment, as an example, the outer peripheral contact portion 2120 has convex portions 2122 at each of four corners, and the convex portion 2122 is convex on the upper side of the surface of the base portion 2121, and the movable contact member 10 and Function as a substantial contact point (peripheral contact point).

The second connection terminal 2402 forms a connection terminal portion to be soldered to an external circuit on the substrate 50. In the present embodiment, as an example, the second connection terminals 2402 are formed on both sides in the X direction on the negative side in the Y direction with respect to the central contact portion 2110.

The resin portion 30 forms a case (housing) of the switch device 1. The resin portion 30 is formed as a single-piece article with the fixed contact member 20 by injecting the resin into the mold using the fixed contact member 20 as an insert part. That is, the resin portion 30 and the fixed contact member 20 are an integrally molded article joined to each other. The resin portion 30 integrates the central contact forming member 211 and the outer peripheral contact forming member 212 while maintaining electrical insulation between the central contact forming member 211 and the outer peripheral contact forming member 212. Although resin portion 30 secures electrical insulation between central contact formation member 211 and outer peripheral contact formation member 212, as described above, central contact formation when movable contact member 10 is pushed downward. Electrical conduction between the member 211 and the peripheral contact forming member 212 is possible.

As shown in FIG. 2, the resin portion 30 exposes the first connection terminal 2401 and the second connection terminal 2402 from the side surfaces on both sides in the X direction (an example of the second direction), and the central contact portion 2110 and the outer peripheral contact The portion 2120 is joined to the fixed contact member 20 in such a manner that the portion 2120 is exposed from the upper surface.

As shown in FIGS. 2 and 3, the resin portion 30 is formed on the upper side (an example of the first side) to form a concave accommodating portion 70 in which the movable contact member 10 is accommodated. In the housing portion 70, the central contact portion 2110 and the outer peripheral contact portion 2120 are exposed from the upper surface (bottom surface of the housing portion 70).

As shown in FIGS. 5A and 5B, the resin portion 30 has the first surface 31, the second surface 32, the

holes

80, 81, 82, and the groove portion 90 on the lower side (the side facing the substrate 50). including.

The first surface 31 is a surface that contacts the substrate 50 in the mounted state of the switch device 1 as shown in FIG. 3. The first surface 31 extends in the XY plane.

The second surface 32 is parallel to the first surface 31. That is, the second surface 32 extends in the XY plane. The second surface 32 is offset above the first surface 31 as shown in FIGS. 3, 5A and 5B. That is, the distance between the second surface 32 and the fixed contact member 20 in the Z direction is shorter than that of the first surface 31. The amount of offset in the Z direction between the first surface 31 and the second surface 32 is arbitrary (for example, about the thickness of the fixed contact member 20), and may be 0 in a modification.

The lower surface of the second surface 32 is flush with the lower surface of the connection terminal 24 (the first connection terminal 2401 and the second connection terminal 2402) as shown in FIG. 5A. Therefore, the flux (described later) is likely to spread on the lower surface of the second surface 32. By offsetting the first surface 31 with respect to the second surface 32 in the Z direction, the possibility of the flux (described later) reaching the first surface 31 from the second surface 32 can be reduced. The flux is a liquid substance produced from the solder at a high temperature in reflow soldering, and is a substance contained in the solder. The flux is generated from the solder related to the connection terminal 24 due to the soldering performed at the connection terminal 24.

The

holes

80, 81, 82 are formed as marks of pins that hold the fixed contact member 20 during insert molding. Therefore, the

holes

80, 81, 82 extend to the accommodating portion 70 of the resin portion 30. That is, the

holes

80, 81, 82 extend to the fixed contact member 20. For example, the hole 80 extends to the outer peripheral contact forming member 212.

The groove portion 90 has a function of suppressing a flux rise (described later) through the hole 80 by forming a step with the first surface 31. That is, the bottom surface of the groove 90 is offset in the Z direction with respect to the first surface 31 to reduce the possibility of flux (described later) reaching the bottom surface of the groove 90 from the second surface 32 via the first surface 31 it can. Hereinafter, the function of the groove portion 90 is also referred to as a "flux rise suppressing function". The groove 90 is adjacent to the first surface 31 as shown in FIGS. 5A and 5B. The groove 90 is formed around the hole 80. The groove 90 is recessed above the first surface 31. That is, the bottom of the groove 90 is formed above the first surface 31. As shown in FIGS. 3, 5A, and 5B, the groove 90 opens in the X direction (an example of a third direction, which is the same as the second direction in this embodiment).

The bottom surface of the groove 90 includes an inclined surface (a tapered surface) 92 in order to enhance the flux rising suppressing function by the groove 90. By having the inclined surface 92, as described later, even when the entire switch device 1 is warped, it is possible to secure the flux rising suppressing function by the groove portion 90. The inclined surface 92 is inclined with respect to the first surface 31 in such a direction that the distance in the Z direction with the first surface 31 (substrate 50) increases as it goes to the opening side (that is, the outer side in the X direction). That is, the gap between the inclined surface 92 and the substrate 50 at the inner end in the X direction (see position P1 in FIG. 3) is the same as the distance between the inclined surface 92 and the base 50 at the end in the X direction (see position P2 in FIG. It is smaller than the gap.

In the present embodiment, as an example, the groove 90 includes a non-inclined surface 91 in addition to the inclined surface 92. The non-inclined surface 91 is continuous with the X-direction inner end of the inclined surface 92. The non-inclined surface 91 is parallel to the first surface 31. That is, the non-inclined surface 91 extends in the XY plane. The non-inclined surface 91 is located between the first surface 31 and the second surface 32 in the Z direction. By providing the non-inclined surface 91, the resin portion 30 caused by the groove portion 90 is formed as compared to the case where the entire groove portion is formed thin by a constant thickness (for example, a plate thickness at the X direction outer end of the inclined surface 92). Decrease in rigidity (lack of strength) can be reduced.

In the present embodiment, as an example, the boundary between the non-inclined surface 91 and the inclined surface 92 is set at the X-direction end position of the hole 80 on the outer side in the X direction. The boundary extends linearly in the Y direction. However, as described later, in the modification, the boundary line may be set at a position other than the end position of the hole 80 in the X direction in the X direction, or may extend non-linearly in the Y direction It is also good.

The sealing member 40 is a film-like member, and as shown in FIG. 3, closes the housing portion 70 on the upper side of the resin portion 30. For example, the sealing member 40 is laser welded to the resin portion 30, but may be joined by other methods. The sealing member 40 seals the upper side of the housing portion 70. As a result, while the thinness of the switch device 1 is maintained, foreign matter does not enter the contact position between the central contact portion 2110 and the movable contact member 10 and the contact position between the outer peripheral contact portion 2120 and the movable contact member 10, and the electrical connection is more Stabilize. As shown in FIG. 1, the sealing member 40 may have a configuration in which the periphery slightly bulges upward around a portion where the projection 42 is provided.

Next, the effects of the present embodiment will be described with reference to FIGS. 6 to 9 are explanatory diagrams of the effects, and therefore, are different from the above-described drawings, and are forms of simpler schematic diagrams.

FIG. 6 is an explanatory view of the warp of the switch device 1 and is a side view schematically showing the switch device 1 in a warped state. 7 and 8 are cross-sectional views of a part of the switch device 1A according to the comparative example, FIG. 7 shows a state without warpage, and FIG. 8 shows a state where warpage has occurred. FIG. 9 is a cross-sectional view of the switch device 1 according to the present example, showing a state in which warpage has occurred.

As shown in FIG. 6, the switch device 1 is easily warped under the influence of a pin (not shown) that holds the fixed contact member 20 during insert molding. The mode of warpage may vary, but in general, the switch device 1 tends to bow in such a manner that the center C is on the upper side. For this reason, as shown in FIG. 6, the switch device 1 makes it easy for the side portion of the resin portion 30 to approach the substrate 50 due to the warpage.

By the way, in the process of manufacturing the electronic device, when the switch device 1 is mounted on the substrate 50, reflow soldering is performed. In the reflow soldering, the air in the storage unit 70 sealed by the sealing member 40 expands more than the volume of the storage unit 70. At that time, a part of the air which can not be accommodated in the accommodating portion 70 escapes from a slight gap existing between the fixed contact member 20 and the resin portion 30 to the outside. Thereafter, the air in the storage unit 70 is contracted by cooling, and at this time, the external air tries to intrude into the storage unit 70. Such expansion and contraction exerts a pump-like effect (pumping action). Further, the gap between the fixed contact member 20 and the resin portion 30 is connected to the root portion where the connection terminal 24 to be actually soldered is exposed, and immediately after the reflow soldering is performed, the connection terminal 24 is formed. The flux remains in a fluid state. Therefore, when the airtightness of the accommodating portion 70 is high, the flux may be sucked into the accommodating portion 70 from the gap between the fixed contact member 20 and the resin portion 30, which may be one of the main causes of so-called fluxing.

In particular, since the fixed contact member 20 is exposed from the hole 80, suction of the flux through the hole 80 can be a problem.

Here, the switch device 1A according to the comparative example is different from the switch device 1 according to the present embodiment in that the resin portion 30 is replaced with the resin portion 30A, and the resin portion 30A is different from the resin portion 30 with respect to the resin portion 30. The groove 90 is replaced with the groove 90A, and the groove 90A differs from the groove 90 in that the inclined surface 92 is not provided.

When there is no warpage, also in the comparative example, as shown in FIG. 7, there is a sufficient gap Δ1 between the resin portion 30A (bottom of groove 90A) and substrate 50 at the side of switch device 1A. The flux 900 between the substrate 50 and the resin portion 30A is difficult to reach.

On the other hand, when warpage occurs, in the comparative example, as shown in FIG. 8, the gap Δ1 between the resin portion 30A (bottom of the groove 90A) and the substrate 50 decreases at the side portion of the switch device 1A (in FIG. 8) Approximately 0), the flux 900 on the substrate 50 is likely to reach the bottom of the groove 90A. Further, as schematically shown by the arrow R 1, when external air intrudes into the housing portion 70, the air tends to infiltrate from the center side of the switch device 1 instead of the outside of the side portion of the switch device 1. For this reason, the flux 900 between the substrate 50 and the resin portion 30A is likely to reach the bottom of the groove portion 90A by the above-described pump action associated with the intrusion of air. As a result, the possibility of the flux 901 reaching the upper surface of the peripheral contact forming member 212 is increased.

On the other hand, according to the present embodiment, as shown in FIG. 9, the groove 90 has the inclined surface 92, so that the resin portion 30 (groove 90A in the side portion of the switch device 1) The gap Δ1 between the bottom surface of the substrate 50 and the substrate 50 can be easily secured. As a result, the inconvenience caused in the comparative example can be reduced. That is, the flux 900 on the substrate 50 hardly reaches the bottom of the groove 90A. Further, as schematically shown by the arrow R 2, when external air intrudes into the housing portion 70, the air easily intrudes from the outside of the side portion of the switch device 1. For this reason, the flux 900 between the substrate 50 and the resin portion 30 is difficult to reach the bottom of the groove 90 even by the above-described pump action accompanying the intrusion of air. As a result, according to the present embodiment, even when the switch device 1 is warped, the possibility of flux rising can be reduced.

In the present embodiment, no groove is formed in the hole 81 (see FIG. 5A), but a groove similar to the groove 90 may be formed in the hole 81 as well. In this case, the groove portion related to the hole 81 opens in the Y direction outer side, and the inclined surface of the groove portion related to the hole 81 extends in the Z direction with the first surface 31 (substrate 50) toward the opening side Is inclined with respect to the first surface 31 in the direction in which the distance of.

For example, in the switch device 1B shown in FIG. 10, the resin portion 30B is offset to the lower side (the side facing the substrate 50) above the first surface 31B and the first surface 31B and below the connection terminal 24B. It includes a second surface 32B flush with the side surface and a groove 90B around the hole 80B. In this case, the groove 90B is opened on the outer side in the Y direction (an example of the third direction, and in this case, the direction perpendicular to the second direction), and the inclined surface 92B of the groove 90B associated with the hole 80B is on the opening side It inclines with respect to the 1st surface 31B in the direction which the distance of the Z direction with the 1st surface 31B (substrate 50) becomes large, so that it goes to the Y direction outside).

Next, with reference to FIG. 11 or later, a modification of the groove 90 according to the switch device 1 according to the above-described embodiment will be described. In the modification described below, the configuration other than the groove 90 may be the same as that of the above-described embodiment, and in FIG. 11 and later, the same reference numerals are used for the same components as the above-described embodiment. Is attached.

FIG. 11 is a plan view showing the switch device 1C according to the first modification from the lower side. The groove portion 90C of the resin portion 30C of the switch device 1C is not formed on the entire surface of the groove portion 90C in the Y direction, but is formed only on a portion of the groove portion 90C in the Y direction. Thus, the formation range of the inclined surface 92C in the Y direction may be part of the groove 90C. In the first modification, the non-inclined surface 91C extends to the X-direction outer end of the groove 90C in such a manner as to sandwich the inclined surface 92C from both sides in the Y direction. The first modification is also disadvantageous in that the range of the inclined surface 92C is reduced, but substantially the same effect as the above-described embodiment can be obtained.

In the first modification, the inclined surface 92C is formed at the center of the groove 90C in the Y direction, but the inclined surface 92C may be formed at one end of the groove 90C in the Y direction.

FIG. 12 is a plan view showing the switch device 1D according to the second modification from the lower side. In the groove portion 90D of the resin portion 30D of the switch device 1D, the boundary between the inclined surface 92D and the non-inclined surface 91D is set outside the X-direction outer end of the hole 80. Also in the case of the second modification, there is a disadvantage in that the range of the inclined surface 92D decreases (the possibility that the hole 80 will not communicate with the outside of the side portion of the switch device 1D if warpage occurs is slightly high) However, substantially the same effect as the above-described embodiment can be obtained.

FIG. 13 is a plan view showing the switch device 1E according to the third modification from the lower side. In the groove portion 90E of the resin portion 30E of the switch device 1E, the boundary between the inclined surface 92E and the non-inclined surface 91E is set at the X direction inner end of the hole 80. Also in the case of the third modification, substantially the same effect as that of the above-described embodiment can be obtained.

In the third modification, the boundary between the inclined surface 92E and the non-inclined surface 91E is set at the inner end of the hole 80 in the X direction, but the boundary between the inclined surface 92E and the non-inclined surface 91E The line may be set inside the X direction inner end of the hole 80 in the X direction. Moreover, the aspect in which the non-inclined surface 91E is not formed may be sufficient. That is, the entire bottom surface of the groove 90E may be formed by the inclined surface 92E.

As mentioned above, although each Example was explained in full detail, it is not limited to a specific example, A various deformation | transformation and change are possible within the range described in the claim. In addition, it is also possible to combine all or a plurality of the components of the above-described embodiment.

For example, although the inclined surface 92 is a flat surface in the above-described embodiment (the same applies to the first modification and the like), the inclined surface 92 may be formed to include a curved surface. Also, the bottom surface itself of the groove 90 may be formed in a mode including a curved surface.

This application is based on Japanese Patent Application No. 2017-246735 filed on Dec. 22, 2017, the entire contents of which are incorporated herein by reference.

1, 1B to 1E Switch Device 10 Movable Contact Member 20 Fixed Contact Member 24 Connection Terminal

24B Connection Terminal

30, 30A to

30E Resin Portion

31,

31B First Surface

32, 32B Second Surface 40 Sealing Member 42 Projection 50 Substrate 70 Housing 70

Part

80, 80B Hole 81 Hole 82

Hole

90, 90C to

90E Groove

91, 91C to

91E Non-inclined surface

92, 92B to 92E Inclined surface 211 Central contact forming member 212 Outer peripheral contact forming member 900 Flux 901 Flux 2110 Central contact portion 2111 Outer periphery Part 2112 Convex part 2120 Outer peripheral contact part 2121 Base part 2122 Convex part 2401 First connection terminal 2402 Second connection terminal

Claims

A movable contact member,
A stationary contact member having a stationary contact portion cooperating with the movable contact member, and a connection terminal portion soldered to an external circuit;
A concave-shaped housing portion is formed which is joined to the fixed contact member and opened on the first side in the first direction to receive the movable contact member, and the fixed contact portion is exposed in the housing portion, and And a resin portion in which the connection terminal portion is exposed from a side surface in a second direction intersecting the first direction,
The resin portion is formed on a second surface opposite to the first side in the first direction, the first surface, a hole reaching the fixed contact member, and a hole adjacent to the first surface and around the hole And a groove which is recessed on the first side with respect to the first surface and which is open on the outer side in a third direction intersecting the first direction,
The switch device according to claim 1, wherein the bottom surface of the groove portion includes an inclined surface which is inclined with respect to the first surface in a direction in which the distance in the first direction to the first surface increases as it goes to the outside in the third direction.
The bottom surface of the groove further includes a non-inclined surface parallel to the first surface,
The switch device according to claim 1, wherein a boundary between the inclined surface and the non-inclined surface is located within the hole in the third direction.
The resin portion further includes, on the second side in the first direction, a second surface parallel to the first surface and having a shorter distance in the first direction from the fixed contact member than the first surface. And
The bottom surface of the groove has a longer distance in the first direction from the fixed contact member than the second surface.
The switch device according to claim 2, wherein the surface on the second side in the first direction in the connection terminal portion is flush with the second surface.
The switch device according to claim 2, wherein the second direction is the same as the third direction or perpendicular to the third direction.