WO2019120189A1 - 一种增材制造装置和制造方法 - Google Patents

一种增材制造装置和制造方法 Download PDF

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Publication number
WO2019120189A1
WO2019120189A1 PCT/CN2018/121742 CN2018121742W WO2019120189A1 WO 2019120189 A1 WO2019120189 A1 WO 2019120189A1 CN 2018121742 W CN2018121742 W CN 2018121742W WO 2019120189 A1 WO2019120189 A1 WO 2019120189A1
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WO
WIPO (PCT)
Prior art keywords
module
additive manufacturing
metal wiring
laser
additive
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Application number
PCT/CN2018/121742
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English (en)
French (fr)
Inventor
李会丽
唐世弋
李志丹
Original Assignee
上海微电子装备（集团）股份有限公司
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Publication of WO2019120189A1 publication Critical patent/WO2019120189A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326

Definitions

  • the invention relates to the field of internal embedded circuit additive manufacturing, in particular to an additive manufacturing device and a manufacturing method.
  • LDS Laser Direct Structure
  • the process of the LDS is to form a plastic shell by injection molding a composite plastic pellet containing metal structure. Since the metal component of the composition can be activated by laser light, laser scanning can be performed on the surface of the casing according to a prescribed path by a dedicated laser device, and the activated metal portion serves as a seed layer, which can be plated or electrolessly plated. Metal is deposited on the surface of the body to form the desired circuit pattern.
  • an in-line embedded three-dimensional circuit additive manufacturing apparatus and a forming method are also disclosed, and there is no limitation on the material of the housing, and the metal interconnection layer can be completed on the surface or inside of the housing according to product requirements.
  • the invention solves the problem that the metal conductive layer can only be fabricated on the surface of the casing, which is easy to be damaged and oxidized, and solves the problems of complicated process and limited plastic substrate.
  • the circuit line width is getting finer to the micron level, and many of them are below 5um.
  • the yield rate is particularly important.
  • the circuit should be inspected and repaired to improve the yield, and the middle line should be taken down for repair and reloading.
  • the way of the stage is very easy to cause the alignment error and the stress, so that the subsequent processing accuracy and yield cannot be guaranteed.
  • An object of the present invention is to provide an additive manufacturing apparatus and a manufacturing method, which solve the problem that a conventional repairing process requires moving a substrate to perform offline repair, which is time consuming, has large errors, and has poor processing accuracy.
  • the present invention provides an additive manufacturing apparatus comprising: a workpiece stage module; a housing additive module configured to form a housing on the workpiece stage module; and a metal wiring module configured to be Providing a metal wiring on the housing; a wiring repairing module configured to detect a defect of the metal wiring and repair the defect; wherein the housing additive module is further configured to repair the defect and form on the housing Shell cover.
  • the housing additive module includes a supply system and an additive processing module, the additive processing module configured to process the material provided by the supply system on the workpiece table module to form a housing.
  • the feeding system is configured to provide a plastic powder
  • the additive processing module includes a laser sintering unit and a dusting device, the powdering device including a first galvanometer and a first laser source, configured to be The plastic powder is laid on the workpiece stage module, and the laser sintering unit is configured to process the material to obtain the housing.
  • the housing additive module further includes a recovery system for recovering excess plastic powder after laser sintering.
  • the feed system is configured to provide a plastic wire
  • the additive processing module includes a plastic wire printhead.
  • the metal wiring module includes a metal slurry bearing cavity, a link mechanism, a metal deposition nozzle, a filtering system, and a heating module, and the metal slurry bearing cavity is connected to the metal deposition nozzle through the link mechanism.
  • the filtration system is coupled to the linkage mechanism, and the heating module is configured to cure the metal wiring.
  • the wiring repair module includes an image sensor, a laser unit, and a chemical vapor deposition unit, the image sensor detects the defect of the metal wiring, and the laser unit and the chemical vapor deposition unit according to the image sensor The detected condition fixes the defect.
  • the image sensor is fixed on the laser unit and moves synchronously with the laser head of the laser unit, or the image sensor is fixed on the metal wiring module and moves synchronously with the metal wiring module.
  • the laser unit includes a second galvanometer, a second laser source, and a laser head, and the second laser source is coupled to the laser head.
  • the chemical vapor deposition unit includes a gas storage unit, a connecting pipe, a gas nozzle, a gas pumping device, an inert gas unit, and a protective cover, and the gas pumping device is configured to discharge exhaust gas generated during the repair process.
  • a gas storage unit is connected to the gas nozzle through the connecting pipe to provide a reaction gas, and an inert gas supplied from the inert gas unit is emitted through the protective cover, and the protective cover is disposed on the outer ring of the gas nozzle .
  • the protective cover is provided with a gas flow regulating device to adjust the flow rate of the gas flowing through the protective cover.
  • the invention also provides an additive manufacturing method, comprising:
  • Step 1 constructing a housing on the workpiece table module through the housing additive module;
  • Step 2 providing a metal wiring on the housing through a metal wiring module
  • Step 3 detecting defects of the metal wiring through a wiring repair module and repairing the defects
  • Step 4 Forming a cover on the wired housing by the housing additive module.
  • step 1 specifically includes:
  • the housing reinforcement module is machined according to the target machining model to obtain the housing.
  • step 1 further comprises: providing material through the feeding system, processing the material through the additive processing module to obtain the casing.
  • the step 1 further comprises: providing plastic powder through the feeding system, laying the plastic powder on the workpiece table module through a powder spreading device, and processing the material through a laser sintering unit to obtain the casing.
  • step 1 further comprises: recycling the excess plastic powder produced by sintering to the recycling system by the powder spreading device.
  • processing the material by the additive processing module to obtain the casing further comprises: providing a plastic wire through the feeding system, and processing the material through a plastic wire print head to obtain Said housing.
  • the step 2 includes: providing a metal slurry through the metal slurry carrying cavity, and disposing the metal wiring on the casing after being transferred to the metal deposition nozzle through a link mechanism.
  • the step 2 further includes: providing a filtering system on the link mechanism to filter the metal slurry supplied from the metal slurry carrying cavity to the metal deposition nozzle, and passing the metal deposition nozzle After depositing the metal wiring on the case, the metal wiring is also cured by a heating module.
  • the step 3 specifically includes: detecting a metal wiring defect of the metal wiring module by an image sensor, and repairing the defect according to the image sensor detection condition by the laser unit and the chemical vapor deposition unit.
  • the step of detecting the metal wiring defect of the metal wiring module by the image sensor comprises:
  • the metal wiring of the metal wiring module is recorded and tracked by the image sensor during wiring.
  • the step of repairing the defect according to the image sensor detection condition by the laser unit and the chemical vapor deposition unit comprises: acquiring a metal wiring condition recorded by the image sensor, and obtaining a wiring defect generated by the metal wiring module wiring; The laser unit and the chemical vapor deposition unit are separately moved in accordance with the wiring defect so that laser light of the laser unit illuminates the reaction gas supplied from the chemical vapor deposition unit to repair the defect.
  • the invention provides an additive manufacturing device and a manufacturing method, which solves the problems of time-consuming, large error and poor processing precision of the existing offline repairing method, and can repair the embedded circuit online without unloading the workpiece table module and the substrate. It saves equipment purchase cost and production line space, and can reduce manufacturing time and shorten the manufacturing chain, and improve the subsequent processing precision of the substrate.
  • FIG. 1 is a schematic structural view of an additive manufacturing apparatus according to Embodiment 1 of the present invention.
  • FIG. 2a is a front view of a gas nozzle and a protective cover according to Embodiment 1 of the present invention
  • FIG. 2b is a bottom view of a gas nozzle and a protective cover according to Embodiment 1 of the present invention
  • Embodiment 3 is a flow chart of a method for manufacturing an additive according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural view of a housing manufactured by a casing additive module according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural view of a metal wiring module for manufacturing a metal wiring on a casing according to Embodiment 1 of the present invention
  • FIG. 6 is a schematic diagram of a wiring repair module for repairing wiring defects according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic view showing the structure of a casing additive module forming a casing cover on a casing according to Embodiment 1 of the present invention.
  • Figure 8 is a front elevational view showing an additive manufacturing apparatus according to a second embodiment of the present invention.
  • FIG. 9 is a flow chart of a method for manufacturing an additive according to a second embodiment of the present invention.
  • 1 workpiece table module
  • 2 housing additive module
  • 3 metal wiring module
  • 4 wiring repair module
  • 5 molding cavity
  • 101 housing
  • 102 metal wiring
  • 103 repaired defects
  • 104 shell cover
  • 21 feeding system
  • 22 laser sintering unit
  • 201 first galvanometer
  • 202 first laser source
  • 23 dusting device
  • 24 recycling system
  • 25 plastic silk print head
  • 26 motion mechanism
  • 31 metal paste carrier cavity
  • 32 linkage mechanism
  • 33 metal deposition nozzle
  • 34 filter system
  • 41 image sensor
  • 42 laser unit
  • 401 second galvanometer
  • 402 second Laser source
  • 43 chemical vapor deposition unit
  • 403 gas storage unit
  • 404 connecting line
  • 405 gas nozzle
  • 406 protective cover
  • 407 gas extraction device
  • 51 laser protection mirror.
  • an embodiment of the present invention provides an additive manufacturing apparatus, including: a workpiece table module 1 and a casing additive module 2 configured to be formed on the workpiece table module 1 .
  • a housing 101 a metal wiring module 3 configured to provide a metal wiring 102 on the housing 101; a wiring repairing module 4 configured to detect a wiring defect and repair the defect to form a repaired defect 103; wherein the housing is increased
  • the material module 2 is further configured to form a cover 104 on the casing 101 after repairing the defect, and the cover 104 can serve as a protective layer of the casing 101 and has a effect of stabilizing the metal wiring structure and preventing oxidation of the metal wiring.
  • the casing additive module 2 includes a feeding system 21 and an additive processing module, and the additive processing module is configured to process the material provided by the feeding system 21 on the workpiece table module 1 to form Housing 101.
  • the feeding system 21 is configured to provide plastic powder
  • the additive processing module includes a laser sintering unit 22 and a powder spreading device 23, and the laser sintering unit 22 may employ a laser scanning galvanometer system, specifically including A galvanometer 201 and a first laser source 202.
  • the housing additive module 2 further includes a recovery system 24 for recovering excess plastic powder after laser sintering.
  • the feeding system 21, the workpiece stage module 1 and the recovery system 24 can be arranged to be movable up and down in the Z direction, and the powdering and powder recovery can be completed in the X direction by the powder spreading device 23.
  • the plastic powder is layered and sintered, and the sintering path and pattern are determined according to the target processing model.
  • the workpiece table module 1 is moved downward, and the moving distance is equivalent to the thickness of the sintered layer.
  • the plastic powder is laid from the feeding system 21 to the workpiece table module 1 by the powder spreading device 23.
  • the excess plastic powder on the workpiece table module 1 will be transferred to the recovery system 24 through the powder spreading device 23.
  • the Z is moved downward and the powder spreading device 23 is returned to the starting position. The operation is repeated to form the housing 101 described.
  • the metal wiring module 3 includes a metal slurry bearing chamber 31, a link mechanism 32, a metal deposition nozzle 33, and a filtering system 34 through which the metal slurry bearing chamber 31 passes through the link mechanism 32 and the metal deposition nozzle 33 is connected and the filter system 34 is coupled to the linkage mechanism 32.
  • the link mechanism 32 is movable in three directions of X, Y, and Z
  • the metal deposition head 33 is movable in six degrees of freedom
  • the metal wiring module 3 forms a metal line width of, for example, 5 to 150 um.
  • the metal wiring module 3 further includes a heating module (not shown), the heating module is configured to solidify the metal wiring, and the heating module can be disposed on the workpiece table module 1 for example, and the heating temperature can be, for example, 100 to 200. °C.
  • the wiring repair module 4 includes an image sensor 41, a laser unit 42 and a chemical vapor deposition unit 43, which detects metal wiring defects of the metal wiring module 3, and the image sensor 41 can be mounted, for example.
  • the image sensor 41 can also be fixed to the laser head (not shown) of the laser unit 42 and moved along with the laser head.
  • the laser unit 42 and the chemical vapor deposition unit 43 repair the defect according to the detection condition of the image sensor 41.
  • the chemical vapor deposition unit 43 includes a gas storage unit 403, a connecting line 404, a gas nozzle 405, and a gas pumping unit 407.
  • the gas storage unit 403 is connected to the gas nozzle 405 through a connecting line 404 to provide a reaction. gas.
  • the laser head of the laser unit 42 is movable in six degrees of freedom
  • the connecting line 404 is movable in three directions of X, Y and Z
  • the gas nozzle 405 is movable in six degrees of freedom.
  • the chemical vapor deposition unit 43 further includes an inert gas unit, the inert gas supplied from the inert gas unit is emitted through the protective cover, and the protective cover is disposed on the outer ring of the gas nozzle.
  • the protective cover is provided with a gas flow regulating device (not shown) for adjusting the flow rate of the gas flowing through the protective cover, and the gas nozzle 405 together with the protective cover 406 can also move in six degrees of freedom. As shown in Fig. 2a and Fig.
  • the protective cover can control the opening of the semicircular portion and the other semicircular portion to be closed.
  • the opened hole ejects nitrogen or other inert gas to isolate the reaction gas from the reaction zone without going to the outer region.
  • a metal reaction gas is introduced, chemical vapor deposition is performed, and the wire breakage circuit defect is repaired, and the exhaust gas generated by the repair process is exhausted by the gas pumping device 407.
  • the additive manufacturing apparatus further includes a molding cavity 5 for effecting additive manufacturing, and the inside of the molding cavity 5 can be set to a vacuum to protect different metal materials in the metal wiring process.
  • the molding cavity 5 comprises a laser protection mirror 51.
  • both the laser sintering unit 22 and the laser unit 42 may be provided as a laser scanning galvanometer system, and the laser unit 42 includes a second galvanometer 401, a second laser source 402, and a laser head (not shown).
  • the functions of the laser sintering unit 22 and the laser unit 42 are realized by only one set of laser scanning galvanometer systems, and the functions of the laser sintering unit 22 and the laser unit 42 can also be realized by two sets of laser scanning galvanometer systems, respectively.
  • the embodiment of the invention further provides an additive manufacturing method, comprising:
  • Step 1 constructing the housing 101 on the workpiece table module 1 through the housing additive module 2;
  • Step 2 providing a metal wiring 102 on the housing 101 through the metal wiring module 3;
  • Step 3 detecting the wiring and repairing the defect through the wiring repair module 4;
  • Step 4 The cover 104 is overlaid on the rear housing by the casing additive module 2.
  • step 1 specifically includes:
  • Step 1.1 provide a target processing model
  • Step 1.2 The housing reinforcement module 2 is processed according to the target machining model to obtain the housing 101.
  • the material is supplied through the supply system 21, and the material is processed by the additive processing module to obtain the casing 101.
  • the plastic powder is supplied through the feeding system 21, the plastic powder is laid on the workpiece table module by the powder spreading device 23, and the material is processed by the laser sintering unit 22 to obtain the casing 101.
  • the excess plastic powder produced by sintering is recovered to the recovery system 24 by the spreading device 23.
  • the feeding system 21, the workpiece stage module 1 and the recovery system 24 can be arranged to be movable up and down in the z direction, and the powdering and powder recovery can be completed by the powder spreading device 23.
  • step 2 specifically includes:
  • the metal slurry is supplied through the metal slurry carrying chamber 31, and after being transported to the metal deposition head 33 via the link mechanism 32, a metal wiring 102 is disposed on the housing 101, and a filter system 34 is disposed on the link mechanism 32 to The metal paste supplied from the metal slurry carrier chamber to the metal deposition head is filtered.
  • the metal wiring 102 is deposited on the casing 101 by the metal deposition head 33, the metal wiring is also cured by a heating module.
  • step 3 specifically includes:
  • the metal wiring defect of the metal wiring module 3 is detected by the image sensor 41, and the defect is repaired by the laser unit 42 and the chemical vapor deposition unit 43 in accordance with the detection of the image sensor 41.
  • the step of detecting the metal wiring defect of the metal wiring module 3 by the image sensor 41 includes:
  • the metal wiring of the metal wiring module 3 is recorded and tracked by the image sensor 41 during wiring.
  • the step of repairing the defect according to the detection condition of the image sensor 41 by the laser unit and the chemical vapor deposition unit comprises:
  • the laser unit and the chemical vapor deposition unit 43 are separately moved in accordance with the wiring defect so that laser light of the laser unit illuminates the reaction gas supplied from the chemical vapor deposition unit to repair the defect.
  • the chemical vapor deposition unit 43 includes a gas storage unit 403, a connecting line 404, a gas nozzle 405, and a gas pumping unit 407.
  • the gas storage unit 403 is connected to the gas nozzle 405 through a connecting line 404.
  • the chemical vapor deposition unit 43 further includes an inert gas unit that controls the ejection through the protective cover 406.
  • the laser head (not shown) of the laser unit 42 can be six degrees of freedom. Movement, gas nozzle 405 along with protective cover 406 can also be moved in six degrees of freedom. As shown in Fig. 2a and Fig.
  • the protective cover can control the opening of the semicircular portion and the other semicircular portion to be closed.
  • the opened opening ejects nitrogen or other inert gas to isolate the reaction gas from the reaction zone without going to the outer region.
  • a metal reaction gas is introduced, chemical vapor deposition is performed, and the wire breakage circuit defect is repaired, and the exhaust gas generated by the repair process is exhausted by the gas pumping device 407.
  • the additive manufacturing apparatus further includes a molding cavity 5 for effecting additive manufacturing, and the inside of the molding cavity 5 can be set to a vacuum to protect different metal materials in the metal wiring process.
  • the molding cavity 5 comprises a laser protection mirror 51.
  • the specific implementation method of the additive processing provided by this embodiment includes:
  • the STL format file layered by the three-dimensional model is used as the target processing model
  • the powder spreading device 23 lays the plastic powder from the feeding system 21 to the workpiece table module 1 according to the layer thickness;
  • the laser sintering unit 22 sinters the plastic powder on the workpiece table module 1;
  • the metal wiring module 3 is used to deposit metal lines 102 at corresponding positions of the housing 101, and is heated and solidified;
  • the laser is irradiated with the reaction gas for chemical vapor deposition for repair, and the metal wire breakage defect is deposited;
  • the powder spreading device 23 is used to lay the plastic powder from the feeding system 21 to the workpiece table module 1 according to the layer thickness;
  • the laser sintering unit 22 sinters the plastic powder on the workpiece table module 1;
  • the feeding system 21 in the second embodiment is configured to provide a plastic wire
  • the additive processing module includes a plastic wire printing head.
  • a plastic wire is provided by the feeding system 21, and the additive manufacturing device further includes a moving mechanism 26, and the moving wire print head 25 is moved by the moving mechanism 26 to process the material to obtain the casing, and the moving mechanism 26
  • the plastic wire print head 25 can be moved in the X, Y, and Z directions, the plastic wire print head 25 can perform six degrees of freedom movement, and the motion mechanism 26 drives the metal deposition head 33 to move to realize metal wiring, such as six degrees of freedom motion.
  • the specific implementation method of the additive processing provided by this embodiment includes:
  • the STL format file layered by the three-dimensional model is used as the target processing model
  • the plastic wire print head 25 is controlled by the motion mechanism 26 to realize six-degree-of-freedom movement, and the plastic case is manufactured by adding materials;
  • step two by repeating step two, forming a basic plastic housing 101;
  • the metal deposition nozzle 33 is controlled by the motion mechanism 26 to realize the six-degree-of-freedom movement, and the metal line 102 is deposited at the corresponding position and solidified by heating;
  • the laser is irradiated with the reaction gas for chemical vapor deposition to repair, and the metal wire breakage defect 103 is deposited;
  • the plastic wire printhead 25 is controlled by the motion mechanism 26 to effect a six degree of freedom motion to form a cover 104 for use as a cover for the plastic housing.
  • the laser sintering unit 22 is illustrated in FIG. 8 and the laser unit 42 is not illustrated. Those skilled in the art can directly understand the other contents in the second embodiment without any doubt on the basis of the first embodiment, and therefore no further details are provided herein.
  • the embodiment of the invention provides an additive manufacturing device and a manufacturing method, which solves the problems of time-consuming, large error and poor processing precision of the existing offline repairing method, and the embedded circuit can be performed without unloading the workpiece table module and the substrate. Online repair, saving equipment purchase cost and production line space, and reducing manufacturing time and shortening the manufacturing chain, improving the subsequent processing accuracy of the substrate.

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Abstract

一种增材制造装置，包括：工件台模块（1）；壳体增材模块（2），配置为在工件台模块（1）上形成壳体（101）；金属布线模块（3），配置为在壳体（101）上设置金属布线（102）；布线修复模块（4），配置为检测金属布线（102）的缺陷并修补缺陷形成已修补缺陷（103）；壳体增材模块（2）还配置为修补缺陷后在壳体（101）上形成壳盖（104）；该增材制造装置无需卸载工件台模块（1）及基材就可对内嵌电路进行在线修补，节约设备购置成本和产线空间，且能减少制造时间和缩短制造链，提升了基材的后续加工精度。

Description

一种增材制造装置和制造方法 技术领域
本发明涉及一种内嵌入电路增材制造领域，尤其是一种增材制造装置和制造方法。
背景技术
随着电子设备集成度的提高，设备体积也越来越小，这时电子组件对于整个设备就显得过大，因此需要减小自身尺寸。通过在注塑成型的曲面塑料壳体上制作电气以及传感功能的导线、图形来制造和安装元器件，可将普通的电路板具有的电气互连功能、支撑元器件功能和塑料壳体的支撑、防护等功能结合，并且将机械实体和导电图形相结合而产生的屏蔽、天线、传感等功能集成于一体。
目前有多种方式可以实现该结构的制造，但都存在其局限性和不足。目前主流的制作工艺为LDS(Laser Direct Structure，激光直接成型)工艺。LDS的工艺流程是对一种含有金属组织的合成物塑料颗粒采用注塑的方式制作成塑料壳体。由于该合成物的金属成份能够通过激光进行激活，所以可通过专用激光设备在壳体表面按照规定的路径进行激光扫描，被激活的金属部分作为种子层，可通过电镀或者化学镀的方式在壳体表面沉积金属，形成所需要的电路图形。
在现有技术中，还公开了一种内嵌入立体电路增材制造装置与形成方法，提出了一种对壳体材料没有限制，可根据产品需求在壳体表面或内部完成金属互连层的制作，不需要进行化学镀(电镀)等工艺，整个制造工艺可全部完成的一种装置。解决了金属导电层只能制作在壳体表面，容易破损和氧化的问题，同时解决了工艺复杂以及塑料基材受限等问题。
目前由于各种天线和传感器的精密度越来越高，电路线宽越来越精细至微米级，很多已在5um以下。尤其随着增材制造产品附加值的升高，良品率显得尤为重要，内嵌金属电路制作完成后，要对其电路检查和修补以提升良率，中途取下做线下修补再装回载台的方式，极易引起对位误差以及产生应力，让后续加工精度和良率无法保证。
发明内容
本发明的目的在于提供一种增材制造装置和制造方法,以解决现有修补过程需要移动基材进行线下修补而耗时、误差大且加工精度差的问题。
为了达到上述目的，本发明提供了一种增材制造装置，包括：工件台模块；壳体增材模块，配置为在所述工件台模块上形成壳体；金属布线模块，配置为在所述壳体上设置金属布线；布线修复模块，配置为检测所述金属布线的缺陷并修补所述缺陷；其中，所述壳体增材模块还配置为修补所述缺陷后在所述壳体上形成壳盖。
进一步地，所述壳体增材模块包括供料系统和增材加工模块，所述增材加工模块配置为在所述工件台模块上加工所述供料系统提供的物料以形成壳体。
进一步地，所述供料系统配置为提供塑料粉，所述增材加工模块包括激光烧结单元和铺粉装置，所述铺粉装置包括第一振镜和第一激光源，配置为在所述工件台模块上铺设所述塑料粉，所述激光烧结单元配置为加工所述物料以获得所述壳体。
进一步地，所述壳体增材模块还包括用于回收激光烧结后多余塑料粉的回收系统。
进一步地，所述供料系统配置为提供塑料丝，所述增材加工模块包括塑 料丝打印头。
进一步地，所述金属布线模块包括金属浆料承载腔、连杆机构、金属沉积喷头、过滤系统和加热模块，所述金属浆料承载腔通过所述连杆机构和所述金属沉积喷头连接，所述过滤系统连接在所述连杆机构上，所述加热模块配置为固化所述金属布线。
进一步地，所述布线修复模块包括图像传感器、激光单元和化学气相沉积单元，所述图像传感器检测所述金属布线的所述缺陷，所述激光单元和所述化学气相沉积单元根据所述图像传感器检测的情况修复所述缺陷。
进一步地，所述图像传感器固定在所述激光单元上并随所述激光单元的激光头同步运动，或者所述图像传感器固定在所述金属布线模块上并随所述金属布线模块同步运动。
进一步地，所述激光单元包括第二振镜、第二激光源和激光头，所述第二激光源与所述激光头连接。
进一步地，所述化学气相沉积单元包括储气单元、连接管路、气体喷嘴、气体抽排装置、惰性气体单元和保护罩，所述气体抽排装置用于排放修复过程中产生的废气，所述储气单元通过所述连接管路和所述气体喷嘴连接，以提供反应气体，所述惰性气体单元提供的惰性气体通过所述保护罩出射，所述保护罩设置在所述气体喷嘴外圈。
进一步地，所述保护罩上设置有气体流量调节装置，以调节所述保护罩流通的气体流量。
本发明还提供了一种增材制造方法，包括：
步骤1：通过壳体增材模块在工件台模块上构建壳体；
步骤2：通过金属布线模块在所述壳体上设置金属布线；
步骤3：通过布线修复模块检测所述金属布线的缺陷并修复所述缺陷；
步骤4：通过壳体增材模块在布线后的壳体上形成壳盖。
进一步地，所述步骤1具体包括：
提供一目标加工模型；
将所述壳体增材模块根据所述目标加工模型加工获得所述壳体。
进一步地，所述步骤1还包括：通过供料系统提供物料，通过增材加工模块加工所述物料以获得所述壳体。
进一步地，所述步骤1还包括：通过所述供料系统提供塑料粉，通过铺粉装置在工件台模块上铺设所述塑料粉，通过激光烧结单元加工所述物料以获得所述壳体。
进一步地，所述步骤1还包括：通过所述铺粉装置将烧结产生的多余塑料粉回收至回收系统。
进一步地，通过供料系统提供物料，通过增材加工模块加工所述物料以获得所述壳体还包括：通过所述供料系统提供塑料丝，通过塑料丝打印头加工所述物料以获得所述壳体。
进一步地，所述步骤2包括：通过金属浆料承载腔提供金属浆料，并经过连杆机构传输至金属沉积喷头后在壳体上设置所述金属布线。
进一步地，所述步骤2还包括：在所述连杆机构上设置过滤系统，以过滤从所述金属浆料承载腔提供至所述金属沉积喷头的金属浆料，在通过所述金属沉积喷头在所述壳体上沉积所述金属布线后，还通过加热模块固化所述金属布线。
进一步地，所述步骤3具体包括：通过图像传感器检测所述金属布线模块的金属布线缺陷，通过激光单元和化学气相沉积单元根据所述图像传感器检测情况修复所述缺陷。
进一步地，通过图像传感器检测所述金属布线模块的金属布线缺陷的步 骤包括：
设置一与所述金属布线模块同步运动的图像传感器；
在布线过程中，通过所述图像传感器记录并追踪所述金属布线模块的金属布线情况。
进一步地，通过激光单元和化学气相沉积单元根据所述图像传感器检测情况修复所述缺陷的步骤包括：获取所述图像传感器记录的金属布线情况，并获得所述金属布线模块布线产生的布线缺陷；根据所述布线缺陷控制激光单元和化学气相沉积单元分别运动，使得激光单元的激光照射所述化学气相沉积单元提供的反应气体以修复所述缺陷。
本发明提供了一种增材制造装置和制造方法,解决了现有线下修补方式耗时、误差大且加工精度差的问题，无需卸载工件台模块及基材就可对内嵌电路进行在线修补，节约设备购置成本和产线空间，且能减少制造时间和缩短制造链，提升了基材的后续加工精度。
附图说明
图1为本发明实施例一提供的增材制造装置的结构示意图；
图2a为本发明实施例一提供的气体喷头和保护罩处的主视图；
图2b为本发明实施例一提供的气体喷头和保护罩处的仰视图；
图3为本发明实施例一提供的增材制造方法的流程图；
图4为本发明实施例一提供的壳体增材模块制造的壳体的结构示意图；
图5为本发明实施例一提供的金属布线模块在壳体上制造金属布线的结构示意图；
图6为本发明实施例一提供的布线修复模块修复布线缺陷的原理图；
图7为本发明实施例一提供的壳体增材模块在壳体上形成壳盖的结构示 意图；
图8为本发明实施例二提供的增材制造装置的主视图；
图9为本发明实施例二提供的增材制造方法的流程图。
图中，1：工件台模块，2：壳体增材模块，3：金属布线模块，4：布线修复模块，5:成型腔，101：壳体，102：金属布线，103：已修补缺陷，104：壳盖，21：供料系统，22：激光烧结单元，201：第一振镜，202：第一激光源，23：铺粉装置，24：回收系统，25：塑料丝打印头，26：运动机构，31：金属浆料承载腔，32：连杆机构，33：金属沉积喷头，34：过滤系统，41：图像传感器，42：激光单元，401：第二振镜，402:第二激光源，43：化学气相沉积单元，403：储气单元，404：连接管路，405：气体喷嘴，406：保护罩，407：气体抽排装置，51：激光保护镜。
具体实施方式
下面将结合示意图对本发明的具体实施方式进行更详细的描述。根据下列描述和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
实施例一
如图1所示，结合图4-7，本发明实施例提供了一种增材制造装置，包括：工件台模块1；壳体增材模块2，配置为在所述工件台模块1上形成壳体101；金属布线模块3，配置为在所述壳体101上设置金属布线102；布线修复模块4，配置为检测布线缺陷并修补该缺陷形成已修补缺陷103；其中，所述壳体增材模块2还配置为修补所述缺陷后在所述壳体101上形成壳盖104，壳盖104可以作为壳体101的保护层，并具有稳固金属布线结构、防止金属布线氧 化的效果。
进一步地，所述壳体增材模块2包括供料系统21和增材加工模块，所述增材加工模块配置为在所述工件台模块1上加工所述供料系统21提供的物料以形成壳体101。在本实施例中，所述供料系统21配置为提供塑料粉，所述增材加工模块包括激光烧结单元22和铺粉装置23，激光烧结单元22可以采用激光扫描振镜系统，具体包括第一振镜201和第一激光源202。
优选地，所述壳体增材模块2还包括用于回收激光烧结后多余塑料粉的回收系统24。在本实施例中，可以将供料系统21、工件台模块1和回收系统24均设置为能够在Z方向上下移动，通过铺粉装置23在X方向完成铺粉和粉末回收。
在本实施例中，对塑料粉进行分层烧结，烧结路径和图形根据目标加工模型而定，每完成一层烧结后，工件台模块1向下移动，移动距离与烧结层厚度相当。工件台模块1在Z向下移后，通过铺粉装置23从供料系统21中将塑料粉平铺到工件台模块1上。工件台模块1上多余的塑料粉将通过铺粉装置23转移到回收系统24上，回收系统24完成一层塑料粉回收后，将Z向下移动，最后铺粉装置23回到起始位置。反复操作以形成所述的壳体101。
进一步地，所述金属布线模块3包括金属浆料承载腔31、连杆机构32、金属沉积喷头33和过滤系统34，所述金属浆料承载腔31通过所述连杆机构32和金属沉积喷头33连接，所述过滤系统34连接在所述连杆机构32上。优选地，连杆机构32可以在X、Y和Z三方向运动，金属沉积喷头33可以六自由度运动，所述金属布线模块3形成的金属线条宽度例如为5～150um。
具体地，所述金属布线模块3还包括加热模块(图中未标注)，所述加热模块配置为固化金属布线，加热模块例如可以设置在工件台模块1上，加热温度例如可以为100～200℃。
在本实施例中，所述布线修复模块4包括图像传感器41、激光单元42和化学气相沉积单元43，所述图像传感器41检测所述金属布线模块3的金属布线缺陷，图像传感器41例如可以安装在金属布线模块3中的连杆机构32上，并随着金属沉积喷头33一起运动，图像传感器41也可以固定在激光单元42的激光头(未图示)上，并随激光头一起运动，所述激光单元42和所述化学气相沉积单元43根据所述图像传感器41检测情况修复所述缺陷。
请继续参考图1，化学气相沉积单元43包括储气单元403、连接管路404、气体喷嘴405和气体抽排装置407，储气单元403通过连接管路404和气体喷嘴405连接，以提供反应气体。优选地，激光单元42的激光头可以六自由度运动，连接管路404可以在X、Y和Z三方向运动，气体喷嘴405可以六自由度运动。
为了在修复过程中提供保护，所述化学气相沉积单元43还包括惰性气体单元，所述惰性气体单元提供的惰性气体通过所述保护罩出射，所述保护罩设置在所述气体喷嘴外圈，以使得惰性气体能够包围反应气体，形成相对隔绝的反应环境，避免反应过程受到干扰。在本实施例中，所述保护罩上设置有气体流量调节装置(未图示)，以调节所述保护罩流通的气体流量，气体喷嘴405连同保护罩406也可以六自由度运动。如图2a和图2b所示，保护罩可以控制半圆部分的孔开通而另半圆部分关闭，开通的孔喷出氮气或其它惰性气体，用以隔离反应气体在反应区而不跑到外部区域。在激光照射的同时，通入金属反应气体，进行化学气相沉积，修补断线电路缺陷，修补过程产生的废气由气体抽排装置407抽排。
在本实施例中，增材制造装置还包括用于实现增材制造的成型腔5，可以将成型腔5的内部设置为真空，以保护金属布线过程中的不同金属材料。优选地，成型腔5包括激光保护镜51。在本实施例中，可以将激光烧结单元22 和激光单元42均设置为激光扫描振镜系统，激光单元42包括第二振镜401、第二激光源402和激光头(未图示)，可以仅采用一套激光扫描振镜系统实现激光烧结单元22和激光单元42的功能，也可以采用两套激光扫描振镜系统分别实现激光烧结单元22和激光单元42的功能。
本发明实施例还提供了一种增材制造方法，包括：
步骤1：通过壳体增材模块2在工件台模块1上构建壳体101；
步骤2：通过金属布线模块3在壳体101上设置金属布线102；
步骤3：通过布线修复模块4对布线进行检测并修复缺陷；
步骤4：通过壳体增材模块2在布线后壳体上增覆壳盖104。
进一步地，所述步骤1具体包括：
步骤1.1：提供一目标加工模型；
步骤1.2：将所述壳体增材模块2根据所述目标加工模型加工获得所述壳体101。
进一步地，通过供料系统21提供物料，通过增材加工模块加工所述物料以获得所述壳体101。在本实施例中，通过所述供料系统21提供塑料粉，通过铺粉装置23在工件台模块上铺设所述塑料粉，通过激光烧结单元22加工所述物料以获得所述壳体101。
优选地，通过所述铺粉装置23将烧结产生的多余塑料粉回收至回收系统24。在本实施例中，可以将供料系统21、工件台模块1和回收系统24均设置为能够在z方向上下移动，通过铺粉装置23完成铺粉和粉末回收。
进一步地，所述步骤2具体包括：
通过金属浆料承载腔31提供金属浆料，并经过连杆机构32传输至金属沉积喷头33后在在壳体101上设置金属布线102，在所述连杆机构32上设置过滤系统34，以过滤从金属浆料承载腔提供至金属沉积喷头的金属浆料。
具体地，在通过所述金属沉积喷头33在所述壳体101上沉积金属布线102后，还通过加热模块固化所述金属布线。
进一步地，所述步骤3具体包括：
通过图像传感器41检测所述金属布线模块3的金属布线缺陷，通过激光单元42和化学气相沉积单元43根据所述图像传感器41检测情况修复所述缺陷。
进一步地，通过图像传感器41检测所述金属布线模块3的金属布线缺陷的步骤包括：
设置一与所述金属布线模块同步运动的图像传感器；
在布线过程中，通过所述图像传感器41记录并追踪所述金属布线模块3的金属布线情况。
进一步地，通过激光单元和化学气相沉积单元根据所述图像传感器41检测情况修复所述缺陷的步骤包括：
获取所述图像传感器41记录的金属布线情况，并获得所述金属布线模块3布线产生的布线缺陷；
根据所述布线缺陷控制激光单元和化学气相沉积单元43分别运动，使得激光单元的激光照射所述化学气相沉积单元提供的反应气体以修复所述缺陷。
请继续参考图1，化学气相沉积单元43包括储气单元403、连接管路404、气体喷嘴405和气体抽排装置407，储气单元403通过连接管路404和气体喷嘴405连接。为了在修复过程中提供保护，所述化学气相沉积单元43还包括惰性气体单元，惰性气体单元通过保护罩406控制喷射，修补过程中，激光单元42的激光头(未图示)可以六自由度运动，气体喷嘴405连同保护罩406也可以六自由度运动。如图2a和图2b所示，保护罩可以控制半圆部分的孔开通而另半圆部分关闭，开通的孔喷出氮气或其它惰性气体，用以隔离反应 气体在反应区而不跑到外部区域。在激光照射的同时，通入金属反应气体，进行化学气相沉积，修补断线电路缺陷，修补过程产生的废气由气体抽排装置407抽排。
在本实施例中，增材制造装置还包括用于实现增材制造的成型腔5，可以将成型腔5的内部设置为真空，以保护金属布线过程中的不同金属材料。优选地，成型腔5包括激光保护镜51。
请参考图3，本实施例提供的增材加工的具体实施方法包括:
一、采用三维立体模型分层切片的STL格式文件作为目标加工模型；
二、铺粉装置23根据分层厚度从供料系统21中将塑料粉平铺到工件台模块1上；
三、激光烧结单元22烧结工件台模块1上的塑料粉；
四、通过重复步骤二和步骤三，形成基础塑料壳体101；
五、根据STL格式文件的分层，采用金属布线模块3在壳体101对应的位置上沉积金属线条102，并加热固化；
六、根据金属沉积布线时图像传感器41记录和追踪到的电路缺陷，采用激光照射反应气体进行化学气相沉积进行修补，沉积金属断线缺陷；
七、根据STL格式文件的分层，采用铺粉装置23根据分层厚度从供料系统21中将塑料粉平铺到工件台模块1上；
八、激光烧结单元22烧结工件台模块1上的塑料粉；
九、重复步骤七和步骤八形成用于作为塑料壳体覆盖层的壳盖104。
实施例二
请参考图8，与实施例一不同，实施例二中的供料系统21配置为提供塑料丝，所述增材加工模块包括塑料丝打印头。进一步地，通过所述供料系统21提供塑料丝，增材制造装置还包括运动机构26，通过运动机构26带动塑 料丝打印头25运动以加工所述物料以获得所述壳体，运动机构26能够带动塑料丝打印头25在X、Y、Z向运动，塑料丝打印头25能够进行六自由度运动，运动机构26带动所述金属沉积喷头33运动以实现金属布线，例如六自由度运动。
请参考图9，本实施例提供的增材加工的具体实施方法包括:
一、采用三维立体模型分层切片的STL格式文件作为目标加工模型；
二、根据STL格式文件的分层，通过运动机构26控制塑料丝打印头25实现六自由度运动，增材制造塑料壳体；
三、通过重复步骤二，形成制造基础塑料壳体101；
四、根据STL格式文件的分层，通过运动机构26控制金属沉积喷头33实现六自由度运动，在对应的位置上沉积金属线条102，并通过加热固化；
五、根据金属沉积时图像传感器记录和追踪到的电路缺陷，采用激光照射反应气体进行化学气相沉积进行修补，沉积金属断线缺陷103；
六、根据STL格式文件的分层，通过运动机构26控制塑料丝打印头25实现六自由度运动，形成用于作为塑料壳体覆盖层的壳盖104。
图8中示意了激光烧结单元22，未示意激光单元42，本领域技术人员在实施例一基础上可以直接毫无疑义获知本实施例二中其他内容，故在此不再赘述。
本发明实施例提供了一种增材制造装置和制造方法,解决了现有线下修补方式耗时、误差大且加工精度差的问题，无需卸载工件台模块及基材就可对内嵌电路进行在线修补，节约设备购置成本和产线空间，且能减少制造时间和缩短制造链，提升了基材的后续加工精度。
上述仅为本发明的优选实施例而已，并不对本发明起到任何限制作用。任何所属技术领域的技术人员，在不脱离本发明的技术方案的范围内，对本 发明揭露的技术方案和技术内容做任何形式的等同替换或修改等变动，均属未脱离本发明的技术方案的内容，仍属于本发明的保护范围之内。

Claims (22)

  1. 一种增材制造装置，其特征在于，包括：
    工件台模块；
    壳体增材模块，配置为在所述工件台模块上形成壳体；
    金属布线模块，配置为在所述壳体上设置金属布线；
    布线修复模块，配置为检测所述金属布线的缺陷并修补所述缺陷；
    其中，所述壳体增材模块还配置为修补所述缺陷后在所述壳体上形成壳盖。
  2. 如权利要求1所述的增材制造装置，其特征在于，所述壳体增材模块包括供料系统和增材加工模块，所述增材加工模块配置为在所述工件台模块上加工所述供料系统提供的物料以形成所述壳体。
  3. 如权利要求2所述的增材制造装置，其特征在于，所述供料系统配置为提供塑料粉，所述增材加工模块包括激光烧结单元和铺粉装置，所述铺粉装置包括第一振镜和第一激光源，配置为在所述工件台模块上铺设所述塑料粉，所述激光烧结单元配置为加工所述物料以获得所述壳体。
  4. 如权利要求3所述的增材制造装置，其特征在于，所述壳体增材模块还包括用于回收激光烧结后多余塑料粉的回收系统。
  5. 如权利要求2所述的增材制造装置，其特征在于，所述供料系统配置为提供塑料丝，所述增材加工模块包括塑料丝打印头。
  6. 如权利要求1所述的增材制造装置，其特征在于，所述金属布线模块包括金属浆料承载腔、连杆机构、金属沉积喷头、过滤系统和加热模块，所述金属浆料承载腔通过所述连杆机构和所述金属沉积喷头连接，所述过滤系统连接在所述连杆机构上，所述加热模块配置为固化所述金属布线。
  7. 如权利要求1所述的增材制造装置，其特征在于，所述布线修复模块包括图像传感器、激光单元和化学气相沉积单元，所述图像传感器检测所述金属布线的所述缺陷，所述激光单元和所述化学气相沉积单元根据所述图像传感器检测的情况修复所述缺陷。
  8. 如权利要求7所述的增材制造装置，其特征在于，所述图像传感器固定在所述激光单元上并随所述激光单元的激光头同步运动，或者所述图像传感器固定在所述金属布线模块上并随所述金属布线模块同步运动。
  9. 如权利要求7所述的增材制造装置，其特征在于，所述激光单元包括第二振镜、第二激光源和激光头，所述第二激光源与所述激光头连接。
  10. 如权利要求7所述的增材制造装置，其特征在于，所述化学气相沉积单元包括储气单元、连接管路、气体喷嘴、气体抽排装置、惰性气体单元和保护罩，所述气体抽排装置用于排放修复过程中产生的废气，所述储气单元通过所述连接管路和所述气体喷嘴连接，以提供反应气体，所述惰性气体单元提供的惰性气体通过所述保护罩出射，所述保护罩设置在所述气体喷嘴外圈。
  11. 如权利要求10所述的增材制造装置，其特征在于，所述保护罩上设置有气体流量调节装置，以调节所述保护罩流通的气体流量。
  12. 一种增材制造方法，其特征在于，包括：
    步骤1：通过壳体增材模块在工件台模块上构建壳体；
    步骤2：通过金属布线模块在所述壳体上设置金属布线；
    步骤3：通过布线修复模块检测所述金属布线的缺陷并修复所述缺陷；
    步骤4：通过壳体增材模块在布线后的壳体上形成壳盖。
  13. 如权利要求12所述的增材制造方法，其特征在于，所述步骤1包括：
    提供一目标加工模型；
    将所述壳体增材模块根据所述目标加工模型加工获得所述壳体。
  14. 如权利要求13所述的增材制造方法，其特征在于，所述步骤1还包括：通过供料系统提供物料，通过增材加工模块加工所述物料以获得所述壳体。
  15. 如权利要求14所述的增材制造方法，其特征在于，所述步骤1还包括：通过所述供料系统提供塑料粉，通过铺粉装置在工件台模块上铺设所述塑料粉，通过激光烧结单元加工所述物料以获得所述壳体。
  16. 如权利要求15所述的增材制造方法，其特征在于，所述步骤1还包括：通过所述铺粉装置将烧结产生的多余塑料粉回收至回收系统。
  17. 如权利要求14所述的增材制造方法，其特征在于，通过供料系统提供物料，通过增材加工模块加工所述物料以获得所述壳体还包括：
    通过所述供料系统提供塑料丝，通过塑料丝打印头加工所述物料以获得所述壳体。
  18. 如权利要求12所述的增材制造方法，其特征在于，所述步骤2包括：
    通过金属浆料承载腔提供金属浆料，并经过连杆机构传输至金属沉积喷头后在壳体上设置所述金属布线。
  19. 如权利要求18所述的增材制造方法，其特征在于，所述步骤2还包括：在所述连杆机构上设置过滤系统，以过滤从所述金属浆料承载腔提供至所述金属沉积喷头的金属浆料，在通过所述金属沉积喷头在所述壳体上沉积所述金属布线后，还通过加热模块固化所述金属布线。
  20. 如权利要求12所述的增材制造方法，其特征在于，所述步骤3包括：
    通过图像传感器检测所述金属布线模块的金属布线缺陷，通过激光单元和化学气相沉积单元根据所述图像传感器检测情况修复所述缺陷。
  21. 如权利要求13所述的增材制造方法，其特征在于，通过图像传感器 检测所述金属布线的缺陷的步骤包括：
    设置一与所述金属布线模块同步运动的图像传感器；
    在布线过程中，通过所述图像传感器记录并追踪所述金属布线的情况。
  22. 如权利要求21所述的增材制造方法，其特征在于，通过激光单元和化学气相沉积单元根据所述图像传感器检测的情况修复所述缺陷的步骤包括：
    获取所述图像传感器记录的所述金属布线情况，并获得所述金属布线模块布线产生的所述缺陷；
    根据所述布线缺陷控制激光单元和所述化学气相沉积单元分别运动，使得激光单元的激光照射所述化学气相沉积单元提供的反应气体以修复所述缺陷。
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