WO2019109867A1 - 白光led器件及其制备方法、led灯 - Google Patents

白光led器件及其制备方法、led灯 Download PDF

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Publication number
WO2019109867A1
WO2019109867A1 PCT/CN2018/118582 CN2018118582W WO2019109867A1 WO 2019109867 A1 WO2019109867 A1 WO 2019109867A1 CN 2018118582 W CN2018118582 W CN 2018118582W WO 2019109867 A1 WO2019109867 A1 WO 2019109867A1
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Prior art keywords
phosphor
blue light
white led
blue
ratio
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PCT/CN2018/118582
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English (en)
French (fr)
Inventor
李玉容
潘利兵
谢志国
李福海
刘丽
Original Assignee
佛山市国星光电股份有限公司
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Publication of WO2019109867A1 publication Critical patent/WO2019109867A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • Embodiments of the present application relate to the field of LED packaging technologies, for example, to a white LED device, a method for fabricating the same, and an LED lamp.
  • a Light Emitting Diode is a solid-state semiconductor device that converts electricity directly into light. Because LED does not contain mercury, small size, long life, fast response, environmental protection, energy saving, and high color saturation, it is more and more widely used. For example, white LEDs are considered to be the third generation of illumination sources after incandescent lamps and fluorescent lamps, and are widely used in liquid crystal projection devices, mobile phone backlights, and display screens.
  • white LEDs there are many implementation technologies for white LEDs.
  • One of them is to use a blue LED chip with a yellow-green phosphor, or a blue LED chip with a mixed phosphor of yellow-green phosphor and red phosphor to produce white light. That is, the blue light emitted by the blue LED chip excites the phosphor to emit yellow-green fluorescence, or the mixed phosphor emits a mixture of yellow-green and red-colored fluorescence, which is combined with another part of the blue light that passes through the phosphor to form white light.
  • the white light emitted by the white LED produced in the above scheme has a discontinuous spectrum, and there is a spectral missing phenomenon between 480-500 nm, and the spectral color rendering index is poor; and the white light emitted by the white LED in the related art has a stronger blue light intensity. Large, easy to cause blue light hazard.
  • the embodiments of the present application provide a white LED device, a method for fabricating the same, and an LED lamp, to improve the spectral discontinuity of the white LED device and the large blue light intensity in the related art.
  • the embodiment of the present application provides a white LED device, comprising: a bracket, a blue light emitting chip disposed on the bracket, and a fluorescent glue covering the blue light emitting chip;
  • the fluorescent glue comprises blue phosphor, yellow green a phosphor and a red phosphor, wherein the blue phosphor, the yellow-green phosphor, and the red phosphor are uniformly mixed in the fluorescent gel in a predetermined ratio;
  • the blue phosphor has an emission peak wavelength ranging from 470 nm to 520 nm;
  • the yellow-green phosphor has an emission peak wavelength ranging from 520 nm to 560 nm;
  • the red phosphor has an emission peak wavelength ranging from 600 nm to 680 nm.
  • the embodiment of the present application further provides a method for preparing a white LED device, including:
  • a fluorescent glue is uniformly coated on the blue light emitting chip of the holder, the fluorescent glue coating the blue light emitting chip;
  • the fluorescent glue comprises a blue phosphor, a yellow green phosphor and a red phosphor, Blue phosphor, yellow-green phosphor and red phosphor are uniformly mixed in the fluorescent gel according to a preset ratio;
  • the blue phosphor has an emission peak wavelength ranging from 470 nm to 520 nm;
  • the yellow-green phosphor has an emission peak wavelength ranging from 520 nm to 560 nm;
  • the red phosphor has an emission peak wavelength ranging from 600 nm to 680 nm.
  • An embodiment of the present application further provides an LED lamp comprising the white LED device of the first aspect.
  • FIG. 1 is a schematic structural diagram of a white LED device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an excitation spectrum and an emission spectrum of a blue phosphor in a white LED device provided by an embodiment of the present application;
  • FIG. 3 is a schematic diagram showing the comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 4700K-6500K;
  • 4 is a comparison diagram of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art after the color temperature range of 4700K-6500K;
  • FIG. 5 is a schematic diagram showing the comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 3500K-4700K;
  • FIG. 6 is a schematic diagram showing a comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 2700K-3500K;
  • FIG. 7 is a schematic diagram showing a comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 1600K-2700K;
  • FIG. 8 is a schematic flow chart of a method for fabricating a white LED device according to an embodiment of the present application.
  • the white LED device provided by the embodiment of the present application comprises a bracket, a blue light emitting chip disposed on the bracket, and a fluorescent glue covering the blue light emitting chip of the bracket;
  • the fluorescent glue comprises a blue phosphor, a yellow green phosphor and a red phosphor.
  • the blue phosphor, the yellow-green phosphor and the red phosphor are uniformly mixed in the fluorescent gel according to a preset ratio; wherein the blue phosphor has an emission peak wavelength ranging from 470 nm to 520 nm; the yellow-green fluorescence
  • the peak emission wavelength of the powder ranges from 520 nm to 560 nm; the emission peak wavelength of the red phosphor ranges from 600 nm to 680 nm.
  • the fluorescent glue comprises a blue phosphor, a yellow-green phosphor and a red phosphor, and the blue phosphor, the yellow-green phosphor and the red phosphor are uniformly mixed in the fluorescent gel according to a preset ratio to ensure the fluorescent gel pair.
  • the blue light emitted by the blue light emitting chip has a strong absorption effect, and reduces the intensity of the blue light emitted by the blue light emitting chip in the white light emitted by the entire white LED device, thereby reducing the harm of the blue light.
  • the fluorescent light is excited by the blue light emitting chip to ensure that the light emitted by the white LED device has a continuous light emission spectrum, and the spectrum of the spectrum emitted by the white light LED is compensated between 480 nm and 500 nm, and the light emitted by the white LED device is strong. Color rendering index.
  • the white LED device provided by the embodiment of the present application may include: a bracket 10 , a blue light emitting chip 20 disposed on the bracket 10 , and a fluorescent glue 30 covering the blue light emitting chip 20 of the holder 10;
  • the fluorescent glue 30 comprises a blue phosphor, a yellow-green phosphor and a red phosphor, and the blue phosphor, the yellow-green phosphor and the red phosphor are in a preset ratio Evenly mixed in the fluorescent glue 30;
  • the blue phosphor has an emission peak wavelength ranging from 470 nm to 520 nm;
  • the emission peak wavelength range of the yellow-green phosphor is 520 nm-560 nm;
  • the red phosphor has an emission peak wavelength ranging from 600 nm to 680 nm.
  • the embodiment of the present application creatively proposes to include a blue phosphor in the fluorescent glue 30.
  • the fluorescent glue 30 includes a blue phosphor, a yellow-green phosphor, and a red phosphor, wherein
  • the emission peak wavelength range of the blue phosphor may be 470 nm-520 nm
  • the emission peak wavelength range of the yellow-green phosphor may be 520 nm-560 nm
  • the emission peak wavelength range of the red phosphor may be 600 nm-680 nm
  • the wavelength spectrum may range from 430 nm to 480 nm.
  • the blue phosphor can absorb the blue light emitted by the blue light emitting chip 20 through the fluorescent glue 30 to ensure the fluorescent glue 30.
  • the blue light emitted by the blue light emitting chip 20 has a strong absorption effect, and the intensity of the light emitted by the blue light emitting chip in the entire spectrum is reduced.
  • the blue light emitting chip 20 provided by the embodiment of the present application can excite the blue phosphor to have a strong emission peak in the range of 480 nm to 520 nm, and the emission peak can compensate for the defect of the blue light LED in which the light emission spectrum is missing in this wavelength. It is ensured that the spectrum generated by the laser of the white LED device provided by the embodiment of the present application is continuous from 430 nm to 780 nm, and there is no problem that the spectrum of some bands is missing.
  • FIG. 2 is a schematic diagram of laser spectrum and emission spectrum of a blue phosphor in a white LED device provided by an embodiment of the present application, wherein curve 1 represents a schematic diagram of an excitation spectrum of a blue phosphor, and curve 2 represents a blue color. Schematic diagram of the emission spectrum of the phosphor. It can be known from the excitation spectrum diagram of the blue phosphor shown by the curve 1 in FIG.
  • the blue phosphor has a strong absorption in the 440 nm to 460 nm band, and the peak wavelength corresponds to the peak wave of the blue light-emitting chip 20;
  • the blue phosphor is excited by the blue light emitting chip 20 of 430 nm to 480 nm, and the emission spectrum of the blue phosphor as shown by the curve 2 can be obtained. From the curve 2, it is known that the light emitting position of the blue phosphor corresponds to 460 nm to 540 nm. Therefore, it can be known from the schematic diagrams of the excitation spectrum and the emission spectrum of the blue phosphor shown in FIG.
  • the blue light emitted from the blue light-emitting chip 20 can be absorbed, and the blue light emission can be reduced.
  • the blue light emitted by the chip 20 occupies the intensity of the white light emitted by the entire white LED device, thereby reducing the hazard of the blue light; on the other hand, the blue phosphor emits blue light of 480 nm to 520 nm by the blue light emitting chip to compensate the blue light emitting chip 20 In the absence of this paragraph, the color rendering effect of the white LED device is improved as a whole.
  • the luminous efficiency of the phosphors of different colors is different under different color temperature conditions. Therefore, the proportional relationship between the blue phosphor, the yellow-green phosphor, and the red phosphor is not limited in the embodiment of the present application.
  • the phosphor of the plurality of colors only needs to satisfy the range of the illuminating wavelength, and the fluorescent glue formed after the mixing can absorb the blue light emitted by the blue light emitting chip 20, and the blue light emitted by the blue light emitting chip 20 is reduced in the white light emitted by the entire white LED device. The strength and the spectrum of the white LED device are guaranteed to be continuous.
  • the constituent material of the blue phosphor may include at least one of the following: an oxynitride system phosphor, an aluminate phosphor, and a silicate phosphor;
  • the constituent of the yellow-green phosphor may include At least one of the following: an aluminate system phosphor, a ⁇ -sialon system phosphor, and a silicate system phosphor;
  • the red phosphor composition material may include at least one of the following: nitride red powder, nitrogen oxide red powder, and sulfide Red powder.
  • constituent materials of the blue phosphor, the yellow-green fluorescent light, and the red phosphor include, but are not limited to, the above materials, as long as the constituent materials of the phosphors of the plurality of colors conform to the respective predetermined wavelength ranges.
  • the blue light emitting chip 20 provided by the embodiment of the present application may have a dominant wavelength spectrum ranging from 430 nm to 480 nm, which may be a single band spectrum, for example, a single wavelength spectrum having a dominant wavelength spectrum ranging from 430 nm to 480 nm;
  • a dominant wavelength spectrum ranging from 430 nm to 480 nm
  • the blue light emitting chip 20 provided by the embodiment of the present application may be a flip chip or a front mounted chip; and the bracket 10 includes an electrical connection portion (not shown) on the bracket 10 .
  • the blue light emitting chip 20 is a flip chip, the blue light emitting chip 20 is directly electrically connected to the electrical connection portion on the bracket 10, and obtains a voltage signal provided by the electrical connection portion to drive the blue light emitting chip 20 to emit light;
  • the blue light emitting chip 20 is a formal dressing In the case of the chip, the blue light emitting chip 20 needs to be electrically connected to the electrical connection portion on the bracket 10 by wire bonding to obtain a voltage signal provided by the electrical connection portion, and drive the blue light emitting chip 20 to emit light.
  • the electrical connection may be performed by one bonding wire or two bonding wires.
  • the white LED device provided by the embodiment of the present application may further include an insulating block 50 located in the bracket 10 for isolating the positive electrode and the negative electrode to ensure normal illumination of the blue light emitting chip 20 .
  • the white LED device and related technology provided by the embodiments of the present application are described in detail in the following, from the comparison of the illuminating spectrum of the white LED device provided by the embodiment of the present application and the illuminating spectrum of the white LED device in the related art.
  • the benefits of white LED devices are comparable.
  • FIG. 3 is a schematic diagram showing the comparison between the luminescence spectrum of the white LED device and the luminescence spectrum of the white LED device in the related art in the color temperature range of 4700K-6500K, wherein the curve 3 indicates the white LED provided by the embodiment of the present application.
  • the luminous intensity of blue light in the curve 3 is smaller than the luminous intensity of the blue light in the curve 4, for example, in the spectral range of 430 nm to 480 nm, which is implemented in the present application.
  • the blue light emitting intensity of the white LED is about 60% of the blue light emitting intensity of the white LED of the related art, which greatly reduces the luminous intensity of the blue light emitted by the blue light emitting chip 20 in the entire spectrum, and reduces the blue light hazard. Solve the problem that the blue light intensity is large and the blue light pollution is serious in the white LED device.
  • FIG. 4 is a comparison diagram of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 4700K-6500K, wherein the curve 6 represents the implementation of the present application.
  • the illuminating spectrum of the white LED device provided by the embodiment of the present application has a strong emission peak in the range of 480 nm to 520 nm, and the emission peak can compensate for the defect of the blue light LED in which the luminescence spectrum is absent in this band. It is ensured that the spectrum generated by the laser of the white LED device provided by the embodiment of the present application is continuous from 430 nm to 780 nm, and there is no problem that the spectrum of some bands is missing. At the same time, continuous luminescence spectrum can also achieve good color development.
  • curve 5 in FIG. 3 is a schematic diagram of the spectrum of saturated blue. It can be seen from the figure that the luminescence spectrum of the white LED device provided by the embodiment of the present application is close to the spectrum of saturated blue. There is a strong emission peak at around 480 nm. Therefore, the white LED device provided by the embodiment of the present application can compensate for the technical problem of saturated blue loss, and improve the defect of saturated blue luminance loss of light emitted by the white LED device. phenomenon.
  • the color rendering index R1-R15 of the white LED device provided by the embodiment of the present application is all greater than 90, and the color difference is small compared with the natural light, and the color rendering effect is good.
  • the proportion of the blue phosphor in the fluorescent glue 30 ranges from 5% to 15%, and the ratio of the yellow-green phosphor ranges from 80% to 90%, and the red phosphor The ratio ranges from 1% to 6%.
  • the ratio of blue phosphor is set to 5%-15%, the ratio of yellow-green phosphor is 80%-90%, and the ratio of red phosphor is 1%-6%.
  • the fluorescent glue 30 formed after the mixing can absorb the blue light emitted by the blue light emitting chip 20, reduce the intensity of the blue light emitted by the blue light emitting chip 20 in the white light emitted by the entire white LED device, and ensure that the white LED device emits a continuous spectrum and spectrum.
  • the color development effect is good.
  • an illuminating spectrum of the white LED device provided by the embodiment of the present application is exemplarily illustrated in the color temperature range of 4700K-6500K. It can be understood that, in the color temperature range of 4700K-6500K, the present application
  • the white LED device provided by the embodiment has a plurality of possible luminescence spectra, and Table 1 illustrates the energy intensity of the luminescence spectrum and the preferred energy intensity in different wavelength ranges.
  • Table 1 Energy intensity distribution table of white LED devices in different wavelength ranges under the color temperature range of 4700K-6500K
  • the energy range of the emitted white light of the white LED device is within the range of the energy intensity described in Table 1, it is within the protection scope of the embodiment of the present application.
  • the energy intensity described in the above table represents the absolute energy value of the luminescence spectrum. Due to the difference in the measurement system, the above four independent wavelength ranges can be increased in the same proportion.
  • FIG. 5 is a schematic diagram showing a comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 3500K-4700K, wherein the curve 8 indicates the white LED provided by the embodiment of the present application.
  • the luminous intensity of the blue light in the curve 8 is smaller than the luminous intensity of the blue light in the curved line 9, which greatly reduces the blue light emitted by the blue light emitting chip 20 in the entire spectrum.
  • Luminous intensity reduces blue light hazard.
  • the illuminating spectrum of the white LED device provided by the embodiment of the present application has a strong emission peak in the range of 480 nm to 520 nm, and the emission peak can compensate for the defect that the luminescence spectrum of the white LED is missing in this band, and the implementation of the present application is ensured.
  • the white LED device provided by the example produces a spectrum that is continuous from 430 nm to 780 nm, and there is no problem of spectral loss in some bands. At the same time, continuous luminescence spectrum can also achieve good color development.
  • the ratio of the blue phosphor in the fluorescent glue 30 ranges from 10% to 20%, and the ratio of the yellow-green phosphor ranges from 75% to 90%, and the red phosphor The ratio ranges from 3% to 8%.
  • the ratio of the blue phosphor is set to 10%-20%, the ratio of yellow-green phosphor is 75%-90%, and the ratio of red phosphor is 3%-8%.
  • the fluorescent glue 30 formed after the mixing can absorb the blue light emitted by the blue light emitting chip 20, reduce the intensity of the blue light emitted by the blue light emitting chip 20 in the white light emitted by the entire white LED device, and ensure that the white LED device emits a continuous spectrum, the spectrum The color development effect is good.
  • an illuminating spectrum of the white LED device provided by the embodiment of the present application is exemplarily illustrated in the color temperature range of 3500K-4700K. It can be understood that, in the color temperature range of 3500K-4700K, the present application
  • the white LED device provided by the embodiment may have a plurality of possible luminescence spectra, and Table 2 illustrates the energy intensity of the luminescence spectrum and the preferred energy intensity in different wavelength ranges.
  • FIG. 6 is a schematic diagram showing the comparison between the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 2700K-3500K, wherein the curve 10 represents the white LED provided by the embodiment of the present application.
  • the luminous intensity of the blue light in the curve 10 is smaller than the luminous intensity of the blue light in the curved line 11, and the light emission of the blue light emitted from the blue light emitting chip 20 in the entire spectrum can be reduced. Intensity reduces the risk of blue light.
  • the illuminating spectrum of the white LED device provided by the embodiment of the present application has an emission peak in the range of 480 nm to 520 nm, and the emission peak can compensate for the defect of the blue light LED in which the luminescence spectrum of the white LED is missing.
  • the spectrum produced by the laser of the white LED device is continuous from 430 nm to 780 nm, and there is no problem of spectral loss in some bands. At the same time, continuous luminescence spectrum can also achieve good color development.
  • the ratio of the blue phosphor in the fluorescent gel 30 ranges from 12% to 22%, and the ratio of the yellow-green phosphor ranges from 70% to 80%, and the red phosphor The ratio ranges from 5% to 11%.
  • the ratio of the blue phosphor is set to 12%-22%, the ratio of yellow-green phosphor is 70%-80%, and the ratio of red phosphor is 5%-11%.
  • the fluorescent glue 30 formed after the mixing can absorb the blue light emitted by the blue light emitting chip 20, reduce the intensity of the blue light emitted by the blue light emitting chip 20 in the white light emitted by the entire white LED device, and ensure that the white LED device emits a continuous spectrum, the spectrum The color development effect is good.
  • an illuminating spectrum of the white LED device provided by the embodiment of the present application is exemplarily illustrated in the color temperature range of 2700K-3500K. It can be understood that, in the color temperature range of 2700K-3500K, the present application
  • the white LED device provided by the embodiment may have a plurality of possible luminescence spectra, and Table 3 illustrates the energy intensity of the luminescence spectrum and the preferred energy intensity in different wavelength ranges.
  • Table 3 Energy intensity distribution of white LED devices in different wavelength ranges at 2700K-3500K color temperature range
  • FIG. 7 is a schematic diagram showing a comparison of the luminescence spectrum of the white LED device provided by the embodiment of the present application and the luminescence spectrum of the white LED device in the related art in the color temperature range of 1600K-2700K, wherein the curve 12 represents the white LED provided by the embodiment of the present application.
  • a schematic diagram of the absolute luminescence spectrum of the device, and curve 13 shows a schematic diagram of the absolute luminescence spectrum of the white LED device in the related art. As shown in FIG.
  • the illuminating spectrum of the white LED device provided by the embodiment of the present application has an emission peak in the range of 480 nm to 520 nm, and the emission peak can compensate for the defect of the blue light LED in which the luminescence spectrum of the white LED is missing.
  • the spectrum produced by the laser of the white LED device is continuous from 430 nm to 780 nm, and there is no problem of spectral loss in some bands. At the same time, continuous luminescence spectrum can also achieve good color development.
  • the ratio of the blue phosphor in the fluorescent glue 30 ranges from 14% to 24%, and the ratio of the yellow-green phosphor ranges from 70% to 80%, and the red phosphor The ratio ranges from 8% to 14%.
  • the ratio of the blue phosphor is set to 14%-24%, the ratio of yellow-green phosphor is 70%-80%, and the ratio of red phosphor is 6%-14%.
  • the fluorescent glue 30 formed after the mixing can absorb the blue light emitted by the blue light emitting chip 20, reduce the intensity of the blue light emitted by the blue light emitting chip 20 in the white light emitted by the entire white LED device, and ensure that the white LED device emits a continuous spectrum, the spectrum The color development effect is good.
  • an illuminating spectrum of the white LED device provided by the embodiment of the present application is exemplarily illustrated in the color temperature range of 1600K-2700K. It can be understood that, in the color temperature range of 1600K-2700K, the present application
  • the white LED device provided by the embodiment may have a plurality of possible luminescence spectra, and Table 4 illustrates the energy intensity of the luminescence spectrum and the preferred energy intensity in different wavelength ranges.
  • Table 4 Energy intensity distribution of white LED devices in different wavelength ranges at 1600K-2700K color temperature range
  • FIG. 8 is a schematic flowchart of a method for preparing a white LED device according to an embodiment of the present application.
  • the embodiment of the present application further provides a method for preparing a white LED device, which is used to prepare the embodiment of the present application.
  • the white LED device is provided.
  • the method for preparing the white LED device provided by the embodiment of the present application may include: step S110, step S120 to step S130.
  • step S110 a stand is provided.
  • step S120 a blue light emitting chip is disposed on the bracket.
  • the blue light emitting chip may be a flip chip or a front loading chip.
  • the blue light emitting chip is directly electrically connected to the electrical connection portion on the bracket to obtain the electrical connection portion.
  • the voltage signal drives the blue light emitting chip to emit light; when the blue light emitting chip is a positive loading chip, the blue light emitting chip needs to be electrically connected to the electrical connection portion on the bracket by wire bonding, obtain a voltage signal provided by the electrical connecting portion, and drive the blue light.
  • the light emitting chip emits light.
  • the electrical connection may be performed through a wire bond or two wire bonds. Not limited.
  • a fluorescent glue is uniformly covered on the blue light emitting chip of the holder, and the fluorescent glue covers the blue light emitting chip;
  • the fluorescent glue comprises blue phosphor, yellow green phosphor and red
  • the phosphor, the blue phosphor, the yellow-green phosphor, and the red phosphor are uniformly mixed in the fluorescent gel in a predetermined ratio.
  • the fluorescent glue is uniformly covered on the blue light emitting chip of the stent, and the fluorescent glue coats the blue light emitting chip, and the blue light emitted by the blue light emitting chip excites the phosphor in the fluorescent glue to emit light.
  • the blue phosphor has an emission peak wavelength in the range of 470 nm to 520 nm; the yellow-green phosphor has an emission peak wavelength in the range of 520 nm to 560 nm; and the red phosphor has an emission peak wavelength in the range of 600 nm. -680nm.
  • the method for preparing a white LED device covers a blue light emitting chip by preparing a fluorescent glue including a blue phosphor, a yellow-green phosphor and a red phosphor, thereby ensuring that the fluorescent gel has a strong blue light emitted from the blue light emitting chip.
  • the absorption function reduces the intensity of the blue light emitted by the blue light emitting chip in the white light emitted by the entire white LED device, thereby reducing the harm of the blue light.
  • the fluorescent light is excited by the blue light emitting chip to ensure that the light emitted by the white LED device has a continuous light emission spectrum, and the spectrum of the spectrum emitted by the white light LED is compensated between 480 nm and 500 nm, and the light emitted by the white LED device is strong. Color rendering index.
  • a fluorescent glue is uniformly coated on the blue light emitting chip of the holder, the fluorescent glue coating the blue light emitting chip;
  • the fluorescent glue comprises a blue phosphor, a yellow green phosphor, and a red phosphor, the blue phosphor, the yellow-green phosphor, and the red phosphor are uniformly mixed in the fluorescent gel according to a preset ratio, including:
  • the blue phosphor, the yellow-green phosphor and the red phosphor are uniformly mixed with the glue according to a preset ratio to form a fluorescent glue;
  • the fluorescent glue is uniformly prepared on one side of the stent by spraying, spin coating or by using a dispensing method, and the fluorescent glue covers the blue light emitting chip;
  • the fluorescent glue is subjected to a curing treatment, and the fluorescent glue coats the blue light emitting chip.
  • the blue phosphor, the yellow-green phosphor, and the red phosphor are uniformly mixed with the glue according to a preset ratio to form a fluorescent gel, and the fluorescent gel can also be subjected to centrifugal defoaming treatment to remove the fluorescent gel liquid crystal.
  • Bubbles, mixed fluorescent glue by spray coating, spin coating or dispensing, the fluorescent glue is evenly prepared inside the stent, after which it can be allowed to stand for a period of time, then placed in an oven to harden, the fluorescent glue is cured, and the fluorescent glue covers the blue light. chip.
  • the embodiment of the present application further provides an LED lamp, which includes the LED device described in the above embodiments of the present application, and has the beneficial effects of the LED device, and details are not described herein again.

Abstract

公开了一种白光LED器件及其制备方法、LED灯，其中，白光LED器件包括：支架、设置于支架上的蓝光发光芯片以及覆盖在蓝光发光芯片上的荧光胶；荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于荧光胶中；蓝色荧光粉的发射峰值波长范围为470nm-520nm；黄绿色荧光粉的发射峰值波长范围为520nm-560nm；红色荧光粉的发射峰值波长范围为600nm-680nm。

Description

白光LED器件及其制备方法、LED灯
本申请要求在2017年12月06日提交中国专利局、申请号为201711277599.3的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及LED封装技术领域，例如涉及一种白光LED器件及其制备方法、LED灯。
背景技术
发光二极管(Light Emitting Diode，LED)是一种固态的半导体器件，它可以直接把电转化成光。由于LED不含汞、体积小、寿命长、反应速度快、环保、节能，以及具有高色彩饱和度等特性，使其应用越来越广泛。例如白光LED，被认为是继白炽灯、荧光灯以后的第三代照明光源，被广泛应用在液晶投影装置、手机背光源、以及显示屏幕等。
目前，白光LED的实现技术有多种，其中一种技术是采用蓝光LED芯片配合黄绿色荧光粉，或者蓝光LED芯片配合黄绿色荧光粉与红色荧光粉的混合荧光粉，产生白光。即，蓝光LED芯片发出的蓝光，激励荧光粉发出黄绿色的荧光，或者激励混合荧光粉发出黄绿色和红色的混合荧光，通过黄绿光或者混合荧光与另一部分透过荧光粉的蓝光复合成白光。
但是，上述方案中产生的白光LED发出的白光，光谱是不连续的，在480-500nm之间存在光谱缺失现象，光谱显色指数较差；且相关技术中白光LED发出的白光，蓝光强度较大，容易造成蓝光危害。
发明内容
有鉴于此，本申请实施例提供一种白光LED器件及其制备方法、LED灯，以改善相关技术中白光LED器件光谱不连续以及蓝光强度较大的现象。
本申请实施例提供了一种白光LED器件，包括支架、设置于所述支架上的蓝光发光芯片以及覆盖在所述蓝光发光芯片上的荧光胶；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中；
其中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；
所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；
所述红色荧光粉的发射峰值波长范围为600nm-680nm。
本申请实施例还提供了一种白光LED器件的制备方法，包括：
提供一支架；
在所述支架上设置蓝光发光芯片；
将荧光胶均匀覆盖在所述支架的所述蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中；
其中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；
所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；
所述红色荧光粉的发射峰值波长范围为600nm-680nm。
本申请实施例还提供了一种LED灯，包括的第一方面所述的白光LED器件。
附图概述
为了更加清楚地说明本申请示例性实施例的技术方案，下面对描述实施例中所需要用到的附图做一简单介绍。显然，所介绍的附图只是本申请所要描述的一部分实施例的附图，而不是全部的附图，对于本领域普通技术人员，在不付出创造性劳动的前提下，还可以根据这些附图得到其他的附图。
图1是本申请实施例提供的一种白光LED器件的结构示意图；
图2是本申请实施例提供的白光LED器件中蓝色荧光粉的激发光谱和发射光谱的示意图；
图3是在4700K-6500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图；
图4是在4700K-6500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱归一化处理后的对比示意图；
图5是在3500K-4700K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图；
图6是在2700K-3500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图；
图7是在1600K-2700K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图；
图8是本申请实施例提供的一种白光LED器件的制备方法的流程示意图。
具体实施方式
以下将结合本申请实施例中的附图，通过具体实施方式，完整地描述本申请的技术方案。显然，所描述的实施例是本申请的一部分实施例，而不是全部的实施例，基于本申请的实施例，本领域普通技术人员在没有做出创造性劳动的前提下获得的所有其他实施例，均落入本申请的保护范围之内。
本申请实施例提供的白光LED器件，包括支架、设置于支架上的蓝光发光芯片以及覆盖在支架的蓝光发光芯片上的荧光胶；荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，其中，蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于荧光胶中；其中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；所述红色荧光粉的发射峰值波长范围为600nm-680nm。采用上述技术方案，荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于荧光胶中，保证荧光胶对蓝光发光芯片发出的蓝光具有较强的吸收作用，降低蓝光发光芯片发出的蓝光在整个白光LED器件发出的白光中的强度，达到降低蓝光危害的作用。同时通过蓝光发光芯片激发荧光胶发光，保证白光LED器件发出的光具备连续发光光谱，补偿白光LED发出的光谱在480nm-500nm之间存在光谱缺失的现象，保证白光LED器件发出的光具有较强的显色指数。
以上是本申请的核心思想，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下，所获得的所有其他实施例，都属于本申请保护的范围。
图1是本申请实施例提供的一种白光LED器件的结构示意图，如图1所示，本申请实施例提供的白光LED器件可以包括：支架10、设置于支架10上的蓝光发光芯片20以及覆盖在支架10的蓝光发光芯片20上的荧光胶30；荧光胶30包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于荧光胶30中；
其中，蓝色荧光粉的发射峰值波长范围为470nm-520nm；
黄绿色荧光粉的发射峰值波长范围为520nm-560nm；
红色荧光粉的发射峰值波长范围为600nm-680nm。
如图1所示，本申请实施例创造性的提出在荧光胶30中包括蓝色荧光粉，在一实施例中，荧光胶30中包括蓝色荧光粉、黄绿色荧光粉和红色荧光粉，其中，蓝色荧光粉的发射峰值波长范围可以为470nm-520nm，黄绿色荧光粉的发射峰值波长范围可以为520nm-560nm，红色荧光粉的发射峰值波长范围可以为600nm-680nm，蓝光发光芯片20主波长光谱范围可以为430nm-480nm，通过使用蓝光发光芯片20激发包括上述混合荧光粉的荧光胶30时，蓝色荧光粉可以吸收蓝光发光芯片20透过荧光胶30射出的蓝光，保证荧光胶30对蓝光发光芯片20发出的蓝光具有较强的吸收作用，降低蓝光发光芯片发出的光在整个光谱中的强度。同时，本申请实施例提供的蓝光发光芯片20可以激发蓝色荧光粉在480nm-520nm范围内有一个较强的发射峰，该发射峰可以弥补白光LED其中的发光光谱在此波段蓝光缺失的缺陷，保证本申请实施例提供的白光LED器件激光后产生的光谱从430nm-780nm都是连续的，不存在某些波段光谱缺失的问题。
如图2所示，图2是本申请实施例提供的白光LED器件中蓝色荧光粉的激光光谱和发射光谱的示意图，其中曲线1表示蓝色荧光粉的激发光谱示意图，曲线2表示蓝色荧光粉的发射光谱示意图。从图2中曲线1所示的蓝色荧光粉的激发光谱示意图可以知道，蓝色荧光粉在440nm-460nm波段内具有很强的吸收作用，该峰波长正好对应蓝光发光芯片20的峰波；用430nm-480nm的蓝光发光芯片20激发蓝色荧光粉，可以得到如曲线2所示的蓝色荧光粉的发射光谱，从曲线2可以知道，在460nm-540nm对应蓝色荧光粉的发光位置。因此，从图2所示的蓝色荧光粉的激发光谱和发射光谱的示意图可以知道，通过在荧光胶30中增加蓝色荧光粉，一方面可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度，这样可以降低蓝光的危害；另一方面，通过蓝光发光芯片激发蓝色荧光粉发射480nm-520nm的蓝光，补偿蓝光发光芯片20在这一段的缺失，从整体上提升白光LED器件的显色效果。
在一实施例中，由于不同色温条件下，不同颜色荧光粉的发光效率不同，因此，本申请实施例对蓝色荧光粉、黄绿荧光粉和红色荧光粉之间的比例关系不进行限定，多种颜色的荧光粉只需满足其发光波长范围，且混合后形成的荧 光胶可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度，并且保证白光LED器件的光谱连续即可。
在一实施例中，蓝色荧光粉的组成物质可以包括以下至少一种：氮氧化物体系荧光粉、铝酸盐体系荧光粉和硅酸盐体系荧光粉；黄绿色荧光粉的组成物质可以包括以下至少一种：铝酸盐体系荧光粉、β-sialon体系荧光粉和硅酸盐体系荧光粉；红色荧光粉的组成物质可以包括以下至少一种：氮化物红粉、氮氧化物红粉和硫化物红粉。需要说明的是，上述蓝色荧光粉、黄绿荧光光和红色荧光粉的组成物质包括但不限于上述材料，只要多个颜色的荧光粉的组成物质符合相应规定的波长范围即可。
在一实施例中，本申请实施例提供的蓝光发光芯片20主波长光谱范围可以为430nm-480nm，其可以是单一波段的光谱，例如主波长光谱范围为430nm-480nm的单一波段光谱；也可以为两种以上波段的光谱混合得到，例如主波长光谱范围分别为430nm-450nm以及450nm-480nm两个波段的光谱混合，本申请实施例对此不进行限定。
在一实施例中，继续参考图1，本申请实施例提供的蓝光发光芯片20可以为倒装芯片或者正装芯片；并且，支架10包括位于支架10上的电连接部(图中未示出)。当蓝光发光芯片20为倒装芯片时，蓝光发光芯片20直接与支架10上的电连接部电连接，获取电连接部提供的电压信号，驱动蓝光发光芯片20发光；当蓝光发光芯片20为正装芯片时，蓝光发光芯片20需要与支架10上的电连接部通过打线的方式电连接，获取电连接部提供的电压信号，驱动蓝光发光芯片20发光。在一实施例中，当蓝光发光芯片20为正装芯片，需要与支架上的电连接部通过打线的方式电连接时，可以通过一根焊线或者两根焊线进行电连接，本申请实施例对此不进行限定。图1仅以蓝光发光芯片20为正装芯片，蓝光发光芯片20通过两根焊线40与支架10上的电连接部电连接为例进行示例性说明。继续参考图1，本申请实施例提供的白光LED器件还可以包括位于支架10内的绝缘块50，绝缘块50用于隔离正极和负极，保证蓝光发光芯片20正常发光。
下面从不同色温的情况下，通过本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图，详细说明本申请实施例提供的白光LED器件与相关技术中白光LED器件相比具备的有益效果。
图3是在4700K-6500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图，其中，曲线3表示本申请实施例提供的白光LED器件的绝对发光光谱示意图，曲线4表示相关技术中白光LED器件的绝对发光光谱示意图。如图3所示，在蓝光发光芯片20的光谱范围430nm-480nm内，曲线3中蓝光的发光强度小于曲线4中蓝光的发光强度，例如可以为在430nm-480nm的光谱范围内，本申请实施例提供白光LED的蓝光发光强度大约为相关技术的白光LED的蓝光发光强度的60％左右，大大降低了蓝光发光芯片20发出的蓝光在整个光谱中的发光强度，减小了蓝光危害。解决白光LED器件中蓝光光强较大，蓝光污染较严重的问题。
图4是在4700K-6500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱归一化处理后的对比示意图，其中，曲线6表示本申请实施例提供的白光LED器件的归一化发光光谱示意图，曲线7表示相关技术中白光LED器件的归一化发光光谱示意图。如图4所示，本申请实施例提供的白光LED器件的发光光谱在480nm-520nm范围内有一个较强的发射峰，该发射峰可以弥补白光LED其中的发光光谱在此波段蓝光缺失的缺陷，保证本申请实施例提供的白光LED器件激光后产生的光谱从430nm-780nm都是连续的，不存在某些波段光谱缺失的问题。同时，连续的发光光谱还可以实现良好的显色效果。
在一实施例中，继续参考图3，图3中的曲线5表示饱和蓝色的光谱示意图，从图中可以知道，本申请实施例提供的白光LED器件的发光光谱与饱和蓝色的光谱接近，在480nm左右均存在一个较强的发射峰，因此本申请实施例提供的白光LED器件可以弥补饱和蓝色损失的技术问题，改善了白光LED器件发出的光存在饱和蓝色亮度损失的缺陷的现象。
在一实施例中，本申请实施例提供的白光LED器件的显色指数R1-R15全部大于90，与自然光照下的颜色相差较小，显色效果良好。
在一实施例中，在4700K-6500K的色温范围内，荧光胶30中蓝色荧光粉的比例范围为5％-15％、黄绿色荧光粉的比例范围为80％-90％，红色荧光粉的比例范围为1％-6％。在4700K-6500K的色温范围内，设置蓝色荧光粉的比例范围为5％-15％、黄绿色荧光粉的比例范围为80％-90％，红色荧光粉的比例范围为1％-6％，保证混合后形成的荧光胶30可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度， 并且保证白光LED器件发出连续光谱，光谱显色效果好。
可以理解的是，本申请实施例提供的％指的是质量百分比。
需要说明的是，图3仅以4700K-6500K色温范围下，本申请实施例提供的白光LED器件的一个发光光谱图进行示例性说明，可以理解的是，在4700K-6500K色温范围下，本申请实施例提供的白光LED器件存在多个可能的发光光谱，表1对不同波长范围内发光光谱的能量强度以及优选的能量强度进行说明。
表1 4700K-6500K色温范围下，白光LED器件在不同波长范围内的能量强度分布表
波长范围(nm) 能量强度 优选能量强度
430-480 70％-120％ 80％-110％
480-520 50％-70％ 55％-65％
530-580 45％-65％ 50％-60％
600-780 50％-70％ 55K-65％
可以理解的是，在4700K-6500K色温范围下，当白色LED器件的发出的白光的能量范围位于表1所述的能量强度范围内，均落入本申请实施例的保护范围，需要说明的是，上表中所述的能量强度表示的是发光光谱的绝对能量值，由于测量系统的差异，以上四段独立的波长范围可以成相同比例增加。
图5是在3500K-4700K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图，其中，曲线8表示本申请实施例提供的白光LED器件的绝对发光光谱示意图，曲线9表示相关技术中白光LED器件的绝对发光光谱示意图。如图5所示，在蓝光发光芯片20的光谱范围430nm-480nm内，曲线8中蓝光的发光强度小于曲线9中蓝光的发光强度，大大降低了蓝光发光芯片20发出的蓝光在整个光谱中的发光强度，减小了蓝光危害。同时本申请实施例提供的白光LED器件的发光光谱在480nm-520nm范围内有一个较强的发射峰，该发射峰可以弥补白光LED其中的发光光谱在此波段蓝光缺失的缺陷，保证本申请实施例提供的白光LED器件激 光后产生的光谱从430nm-780nm都是连续的，不存在某些波段光谱缺失的问题。同时，连续的发光光谱还可以实现良好的显色效果。
在一实施例中，在3500K-4700K的色温范围内，荧光胶30中蓝色荧光粉的比例范围为10％-20％、黄绿色荧光粉的比例范围为75％-90％，红色荧光粉的比例范围为3％-8％。在3500K-4700K的色温范围内，设置蓝色荧光粉的比例范围为10％-20％、黄绿色荧光粉的比例范围为75％-90％，红色荧光粉的比例范围为3％-8％，保证混合后形成的荧光胶30可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度，并且保证白光LED器件发出连续光谱，光谱显色效果好。
需要说明的是，图5仅以3500K-4700K色温范围下，本申请实施例提供的白光LED器件的一个发光光谱图进行示例性说明，可以理解的是，在3500K-4700K色温范围下，本申请实施例提供的白光LED器件可以存在多个可能的发光光谱图，表2对不同波长范围内发光光谱的能量强度以及优选的能量强度进行说明。
表2 3500K-4700K色温范围下，白光LED器件在不同波长范围内的能量强度分布表
波长范围(nm) 能量强度 优选能量强度
430-480 35％-70％ 45％-60％
480-520 40％-60％ 45％-55％
530-580 45％-65％ 50％-60％
600-780 60％-80％ 65％-75％
可以理解的是，在3500K-4700K色温范围下，当白色LED器件的发出的白光的能量范围位于表2所述的能量强度范围内，均落入本申请实施例的保护范围，需要说明的是，上表中所述的能量强度表示的是发光光谱的绝对能量值，由于测量系统的差异，以上四段独立的波长范围可以成相同比例增加。
图6是在2700K-3500K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图，其中，曲线10表示本申请实施例提供的白光LED器件的绝对发光光谱示意图，曲线11表示相关技术中白光LED器件的绝对发光光谱示意图。如图6所示，在蓝光发光芯片 20的光谱范围430nm-480nm内，曲线10中蓝光的发光强度小于曲线11中蓝光的发光强度，可以降低蓝光发光芯片20发出的蓝光在整个光谱中的发光强度，减小了蓝光危害。同时本申请实施例提供的白光LED器件的发光光谱在480nm-520nm范围内有一个发射峰，该发射峰可以弥补白光LED其中的发光光谱在此波段蓝光缺失的缺陷，保证本申请实施例提供的白光LED器件激光后产生的光谱从430nm-780nm都是连续的，不存在某些波段光谱缺失的问题。同时，连续的发光光谱还可以实现良好的显色效果。
在一实施例中，在2700K-3500K的色温范围内，荧光胶30中蓝色荧光粉的比例范围为12％-22％、黄绿色荧光粉的比例范围为70％-80％，红色荧光粉的比例范围为5％-11％。在2700K-3500K的色温范围内，设置蓝色荧光粉的比例范围为12％-22％、黄绿色荧光粉的比例范围为70％-80％，红色荧光粉的比例范围为5％-11％，保证混合后形成的荧光胶30可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度，并且保证白光LED器件发出连续光谱，光谱显色效果好。
需要说明的是，图6仅以2700K-3500K色温范围下，本申请实施例提供的白光LED器件的一个发光光谱图进行示例性说明，可以理解的是，在2700K-3500K色温范围下，本申请实施例提供的白光LED器件可以存在多个可能的发光光谱图，表3对不同波长范围内发光光谱的能量强度以及优选的能量强度进行说明。
表3 2700K-3500K色温范围下，白光LED器件在不同波长范围内的能量强度分布表
波长范围(nm) 能量强度 优选能量强度
430-480 20％-40％ 25％-35％
480-520 35％-55％ 40％-50％
530-580 40％-60％ 45％-55％
600-780 70％-95％ 75％-85％
可以理解的是，在2700K-3500K色温范围下，当白色LED器件的发出的白光的能量范围位于表3所述的能量强度范围内，均落入本申请实施例的保护范围，需要说明的是，上表中所述的能量强度表示的是发光光谱的绝对能量值， 由于测量系统的差异，以上四段独立的波长范围可以成相同比例增加。
图7是在1600K-2700K色温范围下，本申请实施例提供的白光LED器件的发光光谱与相关技术中白光LED器件的发光光谱的对比示意图，其中，曲线12表示本申请实施例提供的白光LED器件的绝对发光光谱示意图，曲线13表示相关技术中白光LED器件的绝对发光光谱示意图。如图7所示，在蓝光发光芯片20的光谱中心位置450nm处，曲线12中蓝光的发光强度小于曲线13中蓝光的发光强度，可以降低蓝光发光芯片20发出的蓝光在整个光谱中的发光强度，减小了蓝光危害。同时本申请实施例提供的白光LED器件的发光光谱在480nm-520nm范围内有一个发射峰，该发射峰可以弥补白光LED其中的发光光谱在此波段蓝光缺失的缺陷，保证本申请实施例提供的白光LED器件激光后产生的光谱从430nm-780nm都是连续的，不存在某些波段光谱缺失的问题。同时，连续的发光光谱还可以实现良好的显色效果。
在一实施例中，在1600K-2700K的色温范围内，荧光胶30中蓝色荧光粉的比例范围为14％-24％、黄绿色荧光粉的比例范围为70-80％，红色荧光粉的比例范围为8％-14％。在1600K-2700K的色温范围内，设置蓝色荧光粉的比例范围为14％-24％、黄绿色荧光粉的比例范围为70％-80％，红色荧光粉的比例范围为6％-14％，保证混合后形成的荧光胶30可以吸收蓝光发光芯片20发出的蓝光，降低蓝光发光芯片20发光的蓝光在整个白光LED器件发出的白光中所占强度，并且保证白光LED器件发出连续光谱，光谱显色效果好。
需要说明的是，图7仅以1600K-2700K色温范围下，本申请实施例提供的白光LED器件的一个发光光谱图进行示例性说明，可以理解的是，在1600K-2700K色温范围下，本申请实施例提供的白光LED器件可以存在多个可能的发光光谱图，表4对不同波长范围内发光光谱的能量强度以及优选的能量强度进行说明。
表4 1600K-2700K色温范围下，白光LED器件在不同波长范围内的能量强度分布表
波长范围(nm) 能量强度 优选能量强度
430-480 10％-30％ 15％-25％
480-520 30％-50％ 35％-45％
530-580 50％-70％ 55％-55％
600-780 70％-100％ 80％-90％
可以理解的是，在1600K-2700K色温范围下，当白色LED器件的发出的白光的能量范围位于表4所述的能量强度范围内，均落入本申请实施例的保护范围，需要说明的是，上表中所述的能量强度表示的是发光光谱的绝对能量值，由于测量系统的差异，以上四段独立的波长范围可以成相同比例增加。
在一实施例中，图8是本申请实施例提供的一种白光LED器件的制备方法的流程示意图，本申请实施例还提供了一种白光LED器件的制备方法，用于制备本申请实施例提供的白光LED器件，如图8所示，本申请实施例提供的白光LED器件的制备方法可以包括：步骤S110、步骤S120至步骤S130。
在步骤S110中，提供一支架。
在步骤S120中，在所述支架上设置蓝光发光芯片。
在一实施例中，蓝光发光芯片可以为倒装芯片或者正装芯片，当蓝光发光芯片为倒装芯片时，蓝光发光芯片直接与支架上的电连接部电连接，获取所述电连接部提供的电压信号，驱动蓝光发光芯片发光；当蓝光发光芯片为正装芯片时，蓝光发光芯片需要与支架上的电连接部通过打线的方式电连接，获取所述电连接部提供的电压信号，驱动蓝光发光芯片发光。可选的，当蓝光发光芯片为正装芯片，需要与支架上的电连接部通过打线的方式电连接时，可以通过一根焊线或者两根焊线进行电连接，本申请实施例对此不进行限定。
在步骤S130中，将荧光胶均匀覆盖在所述支架的所述蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中。
在一实施例中，将荧光胶均匀覆盖在支架的蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片，所述蓝光发光芯片发出的蓝光激发所述荧光胶内的荧光粉发光。在一实施例中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；所述红色荧光粉的发射峰值波长范围为600nm-680nm。
本申请实施例提供的白光LED器件的制备方法，通过制备包括蓝色荧光粉、黄绿色荧光粉和红色荧光粉的荧光胶覆盖蓝光发光芯片，保证荧光胶对蓝光发 光芯片发出的蓝光具有很强的吸收作用，降低蓝光发光芯片发出的蓝光在整个白光LED器件发出的白光中的强度，达到降低蓝光危害的作用。同时通过蓝光发光芯片激发荧光胶发光，保证白光LED器件发出的光具备连续发光光谱，补偿白光LED发出的光谱在480nm-500nm之间存在光谱缺失的现象，保证白光LED器件发出的光具有较强的显色指数。
在一实施例中，将荧光胶均匀覆盖在所述支架的所述蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中，包括：
将所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例与胶水均匀混合，形成荧光胶；
采用喷涂、旋涂或者采用点胶方式，将所述荧光胶均匀制备在所述支架一侧，所述荧光胶覆盖所述蓝光发光芯片；
对所述荧光胶进行固化处理，所述荧光胶包覆所述蓝光发光芯片。
在一实施例中，将蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例与胶水均匀混合，形成荧光胶后，还可以对荧光胶进行离心脱泡处理，去除荧光胶液晶中的气泡，混合好的荧光胶通过喷涂、旋涂或者采用点胶，将荧光胶均匀制备在支架内部，之后可以静置一段时间，再放入烘箱硬化，使荧光胶固化，荧光胶覆盖蓝光发光芯片。
在一实施例中，本申请实施例还提供一种LED灯，包括本申请上述实施例所述的LED器件，具备所述LED器件的有益效果，这里不再赘述。

Claims (10)

  1. 一种白光LED器件，包括：支架、设置于所述支架上的蓝光发光芯片以及覆盖在所述蓝光发光芯片上的荧光胶；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中；
    其中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；
    所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；
    所述红色荧光粉的发射峰值波长范围为600nm-680nm。
  2. 根据权利要求1所述的白光LED器件，其中，在4700K-6500K的色温范围内，在430nm-480nm的波长范围内，发光光谱的能量强度的比例范围为70％-120％；在480nm-520nm的波长范围内，所述发光光谱的能量强度的比例范围为50％-70％；在530nm-580nm的波长范围内，所述发光光谱的能量强度的比例范围为45％-65％；在600nm-780nm的波长范围内，所述发光光谱的能量强度的比例范围为50％-70％。
  3. 根据权利要求1所述的白光LED器件，其中，在3500K-4700K的色温范围内，在430nm-480nm的波长范围内，发光光谱的能量强度的比例范围为35％-70％；在480nm-520nm的波长范围内，所述发光光谱的能量强度的比例范围为40％-60％；在530nm-580nm的波长范围内，所述发光光谱的能量强度的比例范围为45％-65％；在600nm-780nm的波长范围内，所述发光光谱的能量强度的比例范围为60％-80％。
  4. 根据权利要求1所述的白光LED器件，其中，在2700K-3500K的色温范围内，在430nm-480nm的波长范围内，发光光谱的能量强度的比例范围为20％-40％；在480nm-520nm的波长范围内，所述发光光谱的能量强度的比例范围为35％-55％；在530nm-580nm的波长范围内，所述发光光谱的能量强度的比例范围为40％-60％；在600nm-780nm的波长范围内，所述发光光谱的能量强度的比例范围为70％-95％。
  5. 根据权利要求1所述的白光LED器件，其中，在1600K-2700K的色温范围内，在430nm-480nm的波长范围内，发光光谱的能量强度的比例范围为10％-10％；在480nm-520nm的波长范围内，所述发光光谱的能量强度的比例范围为30％-50％；在530nm-580nm的波长范围内，所述发光光谱的能量强度的比例范围为50％-70％；在600nm-780nm的波长范围内，所述发光光谱的能量强度的比例范围为70％-100％。
  6. 根据权利要求1所述的白光LED器件，其中，所述蓝色荧光粉的组成物质包括以下至少一种：氮氧化物体系荧光粉、铝酸盐体系荧光粉和硅酸盐体系荧光粉；所述黄绿色荧光粉的组成物质包括以下至少一种：铝酸盐体系荧光粉、β-sialon体系荧光粉和硅酸盐体系荧光粉；所述红色荧光粉的组成物质包括以下至少一种：氮化物红粉、氮氧化物红粉和硫化物红粉。
  7. 根据权利要求1所述的白光LED器件，其中，所述蓝光发光芯片主波长光谱范围为430nm-480nm。
  8. 一种白光LED器件的制备方法，包括：
    提供一支架；
    在所述支架上设置蓝光发光芯片；
    将荧光胶均匀覆盖在所述支架的所述蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中；
    其中，所述蓝色荧光粉的发射峰值波长范围为470nm-520nm；
    所述黄绿色荧光粉的发射峰值波长范围为520nm-560nm；
    所述红色荧光粉的发射峰值波长范围为600nm-680nm。
  9. 根据权利要求8所述的白光LED器件的制备方法，其中，将荧光胶均匀覆盖在所述支架的所述蓝光发光芯片上，所述荧光胶包覆所述蓝光发光芯片；所述荧光胶包含蓝色荧光粉、黄绿色荧光粉和红色荧光粉，所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例均匀混合于所述荧光胶中，包括：
    将所述蓝色荧光粉、黄绿色荧光粉和红色荧光粉按照预设比例与胶水均匀混合，形成荧光胶；
    采用喷涂、旋涂或者点胶方式，将所述荧光胶均匀制备在所述支架一侧，所述荧光胶覆盖所述蓝光发光芯片；
    对所述荧光胶进行固化处理，所述荧光胶包覆所述蓝光发光芯片。
  10. 一种LED灯，包括权利要求1-7任一项所述的白光LED器件。
PCT/CN2018/118582 2017-12-06 2018-11-30 白光led器件及其制备方法、led灯 WO2019109867A1 (zh)

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