WO2019109682A1 - 阵列基板、其制作方法及显示装置 - Google Patents

阵列基板、其制作方法及显示装置 Download PDF

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Publication number
WO2019109682A1
WO2019109682A1 PCT/CN2018/103346 CN2018103346W WO2019109682A1 WO 2019109682 A1 WO2019109682 A1 WO 2019109682A1 CN 2018103346 W CN2018103346 W CN 2018103346W WO 2019109682 A1 WO2019109682 A1 WO 2019109682A1
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Prior art keywords
sub
pixel
emitting layer
light
array substrate
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Ceased
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PCT/CN2018/103346
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English (en)
French (fr)
Inventor
任军
付潇
邹清华
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority to US16/334,811 priority Critical patent/US11222925B2/en
Publication of WO2019109682A1 publication Critical patent/WO2019109682A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to an array substrate, a method of fabricating the same, and a display device.
  • OLED display panels are widely used due to their high contrast, wide color gamut, fast response, and flexibility.
  • the sub-pixels in the OLED display panel are generally fabricated by using Fine Metal Mask (FFM) technology and evaporation technology to produce sub-pixels of respective colors, so that each sub-pixel of different colors adopts self-luminescence.
  • FAM Fine Metal Mask
  • the form obtains the light of the corresponding color of the sub-pixel.
  • the higher the resolution required for the display panel the more difficult it is to make the fine mask required to make the sub-pixels. Due to manufacturing limitations, fine masks cannot achieve the fineness required for higher resolution display panels, so the resolution of display panels that make subpixels in this manner is difficult to improve.
  • color mixing is also caused due to the problem that the opening of the fine mask is not accurately aligned or the deformation of the fine mask is affected, which affects the product quality.
  • Each of the pixel units includes: a pixel light emitting layer; and at least two different color filters located on a side of the pixel light emitting layer facing away from the substrate substrate;
  • the pixel light emitting layer includes a first sub-pixel light emitting layer and a second sub-pixel light emitting layer;
  • the orthographic projection of each of the filters on the substrate substrate has an overlapping area with the orthographic projection of the second sub-pixel emitting layer on the substrate.
  • the second sub-pixel light emitting layer comprises: a white sub-pixel emitting layer or a yellow sub-pixel emitting layer.
  • the material of the yellow sub-pixel light-emitting layer includes: a yellow light body material and a yellow light. Object material; or,
  • the material of the yellow sub-pixel light-emitting layer comprises: a red light material and a green light material; wherein the red light material comprises a red light host material and a red light guest material, the green light material comprises a green light host material and green light Guest material.
  • the first sub-pixel light emitting layer is a blue sub-pixel light emitting layer.
  • the filter comprises: a red filter and a green filter.
  • the orthographic projection of each of the filters on the substrate substrate does not overlap.
  • the orthographic projection of the second sub-pixel light-emitting layer on the substrate substrate covers each of the filters in the lining The orthographic projection of the base substrate.
  • the first sub-pixel light emitting layer is disposed in the same layer as the second sub-pixel light emitting layer.
  • the array substrate further includes: a first electrode layer between the filter and the second sub-pixel light-emitting layer, and the lining a second electrode layer between the base substrate and the second sub-pixel light emitting layer.
  • the array substrate further includes: an optical coupling layer between the first electrode and the filter.
  • the array substrate further includes: an electron injection layer between the first electrode and the second sub-pixel light emitting layer, where the electron injection layer is located An electron transport layer between the second sub-pixel light-emitting layer, a hole injection layer between the second electrode and the second sub-pixel light-emitting layer, the hole injection layer and the first A hole transport layer between the two sub-pixel light-emitting layers.
  • the array substrate further includes: an optical adjustment layer between the second sub-pixel light emitting layer and the hole transport layer.
  • the embodiment of the present disclosure further provides a display device, which includes the array substrate provided by the embodiment of the present disclosure.
  • the embodiment of the present disclosure further provides a method for fabricating an array substrate, including:
  • a pixel light emitting layer in each of the pixel units on the base substrate; wherein the pixel light emitting layer includes a first sub-pixel light emitting layer and a second sub-pixel light emitting layer;
  • each of the filters is in the same
  • the orthographic projections of the substrate substrate respectively have overlapping regions with the orthographic projection of the second sub-pixel light-emitting layer on the substrate substrate.
  • FIG. 1 is a schematic structural view of a sub-pixel fabricated by using a fine mask in the related art
  • FIG. 2 is a schematic structural view of a sub-pixel produced by using a color film technology in the related art
  • FIG. 3 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure.
  • 4a is a schematic top plan view of an array substrate provided in the related art
  • 4b is a schematic top plan view of an array substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a second schematic structural diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 6 is a third schematic structural diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 7 is a fourth schematic structural diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 9 is a flowchart of a method for fabricating an array substrate according to an embodiment of the present disclosure.
  • FIG. 10 is a second flowchart of a method for fabricating an array substrate according to an embodiment of the present disclosure.
  • the sub-pixels of the respective colors obtain the light corresponding to the color of the sub-pixels in the form of self-luminescence, as follows: Sub-pixels of three colors: red sub-pixel, blue sub-pixel, and green sub-pixel.
  • 210 is a region where a red sub-pixel is to be formed
  • 211 is a region where a blue sub-pixel is to be formed
  • 212 is a region where a green sub-pixel is to be formed.
  • the fine mask 23 is used to block the region 210 of the array substrate where the red sub-pixel is to be formed and the blue sub-form to be formed.
  • the area 211 of the pixel exposes the area 212 of the green sub-pixel to be evaporated;
  • the fine mask 23 includes an open area 22 and an occlusion area 21, and the occlusion area 21 of the fine mask 23 blocks the red color to be formed.
  • the area of the pixel 210 and the area of the area 211 where the blue sub-pixel is to be formed, the open area 22 of the fine mask 23 is the area where the area 212 of the green sub-pixel to be formed is to be evaporated.
  • the region 212 where the green sub-pixel is to be formed is formed through the opening region 22 to form a green sub-pixel. Accordingly, in the same manner as the principle of forming a green sub-pixel, red sub-pixels and blue sub-pixels are respectively formed to form self-illuminating sub-pixels of three different colors.
  • the resolution of the array substrate is higher, the opening degree of the desired opening region 22 is smaller, and the manufacturing method is more difficult.
  • sub-pixels are fabricated by the fine mask technology, at least one fine mask is required for each color, and in order to accurately expose the open area of the fine mask to the area of the sub-pixel to be formed, it is necessary to use High precision alignment operation. However, when the alignment operation is performed, it is easy to cause color mixing of sub-pixels of different colors, so reducing the number of times using the fine mask is also beneficial to improve product quality.
  • the array substrate includes three color sub-pixels: a red sub-pixel, a blue sub-pixel, and a green sub-pixel.
  • a white sub-pixel light emitting layer 062 is disposed on the base substrate 02, and a red color filter 053, a green color filter 054, and a blue color filter 057 are disposed on the white sub-pixel color light emitting layer 062 for emitting light from the white sub-pixel.
  • the white light emitted by the layer 062 extracts light of a color corresponding to the filter. Since the process of the color film technology is relatively mature, the area of the filters of the respective colors can be made smaller. Therefore, the display panel using the color film technology is easier to increase the resolution. On the other hand, the blue filter generally has a low light extraction rate, so the power consumption to extract blue light is large.
  • the array substrate may include a base substrate 02 and a plurality of pixel units on the side of the base substrate 02.
  • the pixel light emitting layer 03 includes at least a first sub-pixel light emitting layer 031 and a second sub-pixel light emitting layer 032.
  • the orthographic projection of each of the filters 04_m on the substrate substrate 01 has an overlapping area with the orthographic projection of the second sub-pixel light-emitting layer 032 on the substrate substrate 01, respectively.
  • the array substrate provided by the embodiment of the present disclosure improves the resolution of the array substrate by using the color film technology, reduces the probability of sub-pixel color mixing during the fabrication process of the array substrate, thereby reducing the process difficulty of fabricating the array substrate and improving the array.
  • the power consumption of the array substrate is reduced by using the self-luminous technology, thereby prolonging the service life of the array substrate, and the array substrate has low resolution while having high resolution.
  • the orthographic projections of the respective filters 04_1 and 04_2 on the substrate substrate 02 may not overlap.
  • the orthographic projection of the second sub-pixel light-emitting layer 032 on the substrate substrate 02 may cover the orthographic projection of each of the filters 04_m on the substrate substrate 02.
  • the area of the orthographic projection of the second sub-pixel light-emitting layer 032 on the substrate substrate 02 may be greater than the sum of the area of the orthographic projection of the filter 04_1 and the filter 04_2 on the substrate substrate 02, and second The portion of the sub-pixel light-emitting layer 032 in the orthographic projection of the base substrate 02 is larger than the portion of the area of the orthographic projection of the filter 04_1 and the filter 04_2 on the substrate substrate 02, and the second sub-pixel light-emitting layer 032 passes through the self-luminous The form emits light of the color of the second sub-pixel light-emitting layer 032 to form a pixel of the color.
  • the area of the orthographic projection of the second sub-pixel light-emitting layer 032 on the substrate substrate 02 may be equal to the sum of the area of the orthographic projection of the filter 04_1 and the filter 04_2 on the substrate substrate 02, which is not limited herein.
  • the colors of the light emitted by the first sub-pixel emitting layer and the second sub-pixel emitting layer are different, and the colors of the filters in the same pixel unit are also different.
  • the light of the color corresponding to the first sub-pixel light-emitting layer may be light having a lower light-emitting rate of the device for extracting light of the color in the color film technology, for example, may be blue light, that is, the first sub-pixel light-emitting layer may be It is a blue sub-pixel luminescent layer.
  • the light extraction device for example, the blue filter
  • the blue sub-pixel emits blue light by self-luminous form.
  • the illuminance of the blue sub-pixel is improved, and the power consumption of the array substrate is reduced.
  • the first pixel illuminating layer 031 can also be a pixel illuminating layer of other colors, and can be designed as needed, as long as it is feasible according to the principles of the present disclosure, and is not limited herein.
  • the filter 04_1 and the filter 04_2 may be disposed in each pixel unit.
  • the self-illuminated first sub-pixel light-emitting layer 031 and the second sub-pixel light-emitting layer 032 are disposed on the base substrate 02, and the filter 04_1 and the filter are disposed on the self-illuminating second sub-pixel light-emitting layer 032.
  • the film 04_2 is such that the filter 04_1 and the filter 04_2 pass through the light of the light extraction filter 04_1 emitted by the second sub-pixel light-emitting layer 032 and the light of the color corresponding to the color filter 04_2.
  • the area of the filter of each color in the color film technology can be made smaller, so the filter 04_1 and the filter are disposed on the second sub-pixel emitting layer 032.
  • the light of the color corresponding to the filter 04_1 and the filter 04_2 is extracted, so that the array substrate can have higher resolution.
  • three different color filters may be disposed in each pixel unit for extracting colors corresponding to the filters of the three colors by the light emitted by the second sub-pixel light emitting layer 032. Light to form a sub-pixel of a color corresponding to the third color filter.
  • the array substrate provided by the embodiment of the present disclosure, since only the sub-pixel light-emitting layers of the first sub-pixel light-emitting layer 031 and the second sub-pixel light-emitting layer 032 are evaporated, the number of times of using the fine mask is reduced. And the number of high-precision alignment operations in the process of using a fine mask, thereby reducing the probability of pixel color mixing during the fabrication of the array substrate, and improving the product quality of the array substrate.
  • three color pixel light-emitting layers are evaporated on the base substrate 02: as shown in FIG. 4a, the first sub-pixel light-emitting layer 031, the third sub-pixel light-emitting layer 0321, and the fourth sub-pixel.
  • the pixel light emitting layer 0322 In the array substrate provided by the embodiment of the present disclosure, only two color sub-pixels are evaporated, and as shown in FIG. 4b, two color pixel light-emitting layers are evaporated on the base substrate 02: the first sub-pixel light-emitting layer 031 and the second sub-pixel light emitting layer 032.
  • the area of the single second sub-pixel light-emitting layer 032 is larger than the area of the single third sub-pixel light-emitting layer 0321 or the single fourth sub-pixel light-emitting layer 0322, compared to the array substrate in FIG. 4a,
  • the area of the second sub-pixel light-emitting layer 032 is large, so the opening area of the corresponding fine mask is also large, thereby reducing the process difficulty of fabricating the fine mask, thereby reducing the process difficulty of fabricating the array substrate.
  • the first sub-pixel light-emitting layer 031 adopts a self-luminous form to obtain light of a color corresponding to the first sub-pixel light-emitting layer 031, that is, the first sub-pixel light-emitting layer 031 is fabricated using a fine mask technology and an evaporation technique, thereby reducing
  • the power consumption of the array substrate extends the life of the array substrate.
  • the filter 04_1 may be, for example, a red filter; the filter 04_2 may be, for example, a green filter, and the red filter and A green color filter is disposed on the second sub-pixel light emitting layer 032 for extracting red light from the light emitted by the second sub-pixel light emitting layer 032 through the red color filter, and emitting light from the second sub-pixel through the green color filter Green light is extracted from the light emitted by layer 032.
  • filters of other colors may also be provided, which may be specifically limited according to actual needs.
  • the first sub-pixel light-emitting layer 031 and the second sub-pixel light-emitting layer 032 may be disposed in the same layer. This can reduce the thickness of the array substrate.
  • a pixel defining layer 05 is disposed between the first sub-pixel emitting layer 031 and the second sub-pixel emitting layer 032.
  • the light-emitting layers of different colors are spaced apart from each other and insulated from each other.
  • the second sub-pixel light emitting layer 032 may include a white sub-pixel emitting layer or a yellow sub-pixel emitting layer.
  • the second sub-pixel illuminating layer 032 may also include a pixel illuminating layer of other colors, and may be designed as needed, as long as it conforms to the principles of the present disclosure, and is not limited herein.
  • the array substrate may include three sub-pixels of a red sub-pixel, a blue sub-pixel, and a green sub-pixel.
  • the substrate may include a substrate substrate 02, a first sub-pixel emitting layer on the side of the substrate substrate 02, and a second sub-pixel emitting layer.
  • the first sub-pixel emitting layer may be, for example, a blue sub-pixel emitting layer 051.
  • the second sub-pixel light emitting layer may be, for example, a yellow sub-pixel light emitting layer 052.
  • the blue sub-pixel light-emitting layer 051 and the yellow sub-pixel light-emitting layer 052 may be disposed in the same layer.
  • a pixel defining layer 05 is disposed between the blue sub-pixel emitting layer 051 and the yellow sub-pixel emitting layer 052 for insulating the light emitting layers of different pixels from each other.
  • Two different color filters are disposed on a side of the yellow sub-pixel light-emitting layer 052 facing away from the base substrate 02; wherein the first filter of the two different color filter types may be, for example, a red filter
  • the sheet 053, the second filter may be, for example, the green filter 054, the red filter 053 and the green filter 054 are projected on the base substrate 02 and the yellow sub-pixel emitting layer 052 is on the base substrate 02.
  • the orthographic projections overlap.
  • a pixel light-emitting layer of two colors of the self-luminous blue sub-pixel light-emitting layer 051 and the yellow sub-pixel light-emitting layer 052 is disposed on the base substrate 02, and a red color filter is disposed on the yellow sub-pixel light-emitting layer 052.
  • 053 and the green filter 054 red light is extracted from the yellow light emitted from the yellow sub-pixel emitting layer 052 through the red filter 053 to form a red sub-pixel, which is emitted from the yellow sub-pixel emitting layer 052 by the green filter 054.
  • Green light is extracted to form a green sub-pixel.
  • the area of the filter of each color in the color film technology can be made smaller, so the red filter 053 and the green filter 054 are disposed in the yellow sub-pixel light emitting layer 052. It is used to extract red and green light, so that the array substrate can have higher resolution.
  • the number of times of using the fine mask is reduced, and the fine mask is used.
  • the number of high-precision alignment operations is performed in the process, thereby reducing the probability of pixel color mixing during the fabrication of the array substrate and improving the product quality of the array substrate.
  • the opening area of the corresponding fine mask is also large, thereby reducing the process difficulty of fabricating the fine mask, thereby reducing the process difficulty of fabricating the array substrate.
  • blue light is obtained by using the blue sub-pixel light-emitting layer 051 in the form of self-luminescence, that is, using fine mask technology and evaporation technology.
  • the blue sub-pixel light-emitting layer 051 reduces the power consumption of the array substrate, thereby prolonging the service life of the array substrate.
  • the yellow sub-pixel light-emitting layer 052 in FIG. 5 may also be replaced with a white sub-pixel light-emitting layer, and correspondingly, in the white sub- Two different color filters are disposed on the side of the pixel light-emitting layer facing away from the base substrate 02.
  • the first filter of the two different color filters may be, for example, a red color filter 053, and the second color filter may be, for example, a green color filter 054, which is passed through the base substrate 02.
  • a pixel light emitting layer of two colors of a self-luminous blue sub-pixel light emitting layer 051 and a white sub-pixel light emitting layer is disposed, and a red color filter 053 and a green color filter 054 are disposed on the white sub-pixel light emitting layer, and are passed through a red color.
  • the filter 053 extracts red light from the white light emitted from the white sub-pixel light-emitting layer to form a red sub-pixel, and extracts green light from the white light emitted from the white sub-pixel light-emitting layer through the green filter 054 to form a green sub-pixel.
  • the array substrate may include four types of red sub-pixels, blue sub-pixels, green sub-pixels, and yellow sub-pixels.
  • the pixels of the color may include four types of red sub-pixels, blue sub-pixels, green sub-pixels, and yellow sub-pixels.
  • the array substrate may include: a substrate substrate 02, a first sub-pixel emitting layer and a second sub-pixel emitting layer on a side of the substrate substrate 02; wherein the first sub-pixel emitting layer may be, for example, a blue sub-pixel
  • the illuminating layer 051, the second sub-pixel illuminating layer may be, for example, a yellow sub-pixel luminescent layer 052, and the blue sub-pixel illuminating layer 051 is disposed in the same layer as the yellow sub-pixel luminescent layer 052; in the blue sub-pixel luminescent layer 051 and the yellow sub-pixel
  • a pixel defining layer 05 is disposed between the light emitting layers 052 for insulating the light emitting layers of different pixels from each other.
  • the first filter may be, for example, a red filter 053, and the second filter may be, for example, a green filter 054.
  • the area of the orthographic projection of the yellow sub-pixel luminescent layer 052 is larger than that of the red filter.
  • the yellow sub-pixel emitting layer 052 may include two parts: a first portion 0521 and a second portion 0522, wherein the area of the orthographic projection of the first portion 0521 is equal to the red color filter 053
  • the second portion 0522 of the yellow sub-pixel light-emitting layer is a portion where the yellow sub-pixel light-emitting layer 052 does not overlap with the orthographic projection of the red color filter 053 and the green color filter 054 in a direction perpendicular to the base substrate 02, and the yellow sub-pixel
  • the second portion 0522 of the luminescent layer emits yellow light by self-illuminating form to form a yellow sub-pixel.
  • a pixel light-emitting layer of two colors of a self-luminous blue sub-pixel light-emitting layer 051 and a yellow sub-pixel light-emitting layer 052 is disposed on the base substrate 02, and a red color filter 053 is disposed on the yellow sub-pixel light-emitting layer 052.
  • the green filter 054 extracts red light from the yellow light emitted from the yellow sub-pixel emitting layer 052 through the red filter 053 to form a red sub-pixel, which is extracted from the yellow light emitted from the yellow sub-pixel emitting layer 052 by the green filter 054.
  • Green light to form green sub-pixels so that the area of the filter of each color in the color film technology can be made smaller than the fine mask technology, so the red filter 053 and the green filter 054 are It is disposed above the yellow sub-pixel emitting layer 052 for extracting red light and green light, so that the array substrate can have higher resolution.
  • the number of times of using the fine mask is reduced, and the fine mask is used.
  • the number of high-precision alignment operations is performed in the process, thereby reducing the probability of pixel color mixing during the fabrication of the array substrate and improving the product quality of the array substrate.
  • the opening area of the corresponding fine mask is also large, thereby reducing the process difficulty of fabricating the fine mask, thereby reducing the process difficulty of fabricating the array substrate.
  • blue light is emitted by using the blue sub-pixel light-emitting layer 051 in the form of self-luminescence, that is, using fine mask technology and evaporation technology.
  • the blue sub-pixel light-emitting layer 051 is fabricated, which reduces the power consumption of the array substrate, thereby prolonging the service life of the array substrate.
  • the yellow sub-pixel light-emitting layer 052 in FIG. 6 may also be replaced with a white sub-pixel light-emitting layer, and correspondingly, in the array substrate.
  • the pixels of the four colors of the red sub-pixel, the blue sub-pixel, the green sub-pixel, and the white sub-pixel may be included, and two different color filters are disposed on the side of the white sub-pixel light-emitting layer facing away from the base substrate 02;
  • the first filter may be, for example, a red color filter 053, and the second color filter may be, for example, a green color filter 054, wherein the area of the white sub-pixel light-emitting layer is larger than the red color filter 053 and the green color filter.
  • the sum of the areas of 054, the white sub-pixel light emitting layer may include two parts: a first part and a second part, wherein the area of the first part is equal to the sum of the areas of the red color filter 053 and the green color filter 054, that is, the red color filter 053 And the orthographic projection of the green filter 054 on the base substrate 02 overlaps with the orthographic projection of the first portion of the white sub-pixel emitting layer; the second portion of the white sub-pixel emitting layer is the white sub-pixel emitting layer Orthogonal projection 02 of the base substrate 053 and the red color filter and the green filter orthogonal projection portion 054 does not overlap the second portion of the white sub-pixel emits white light by the light emitting layer in the form of self-luminous, to form a white sub-pixel.
  • the array substrate includes four types of red sub-pixels, blue sub-pixels, green sub-pixels, and yellow sub-pixels.
  • the pixels of the color are four types of red sub-pixels, blue sub-pixels, green sub-pixels, and yellow sub-pixels.
  • the array substrate may include: a substrate substrate 02, a first sub-pixel emitting layer on a side of the substrate substrate 02, and a second sub-pixel emitting layer; wherein the first sub-pixel emitting layer may be, for example, a blue sub-pixel emitting layer 051
  • the second sub-pixel light-emitting layer may be, for example, a white sub-pixel light-emitting layer 062, the blue sub-pixel light-emitting layer 051 and the white sub-pixel light-emitting layer 062 being disposed in the same layer; and the blue sub-pixel light-emitting layer 051 and the white sub-pixel light-emitting layer 062
  • a pixel defining layer 05 is provided between them for insulating the light emitting layers of different pixels from each other.
  • Three different color filters are disposed on the side of the white sub-pixel light emitting layer 062 facing away from the base substrate 02; wherein the first one of the three different color filters may be, for example, a red color filter.
  • the second filter may be, for example, a green filter 054, and the third filter may be, for example, a yellow filter 055; the red filter 053, the green filter 054, and the yellow filter 055 are
  • the orthographic projection of the base substrate 02 and the white sub-pixel light-emitting layer 062 at least partially overlap the orthographic projection of the base substrate 02.
  • more filters of different colors may be disposed, which is only better explained in FIG.
  • the examples given in the principles of the present disclosure are not limited to the present disclosure, and specifically, may be designed according to actual needs.
  • a red light filter 053 is disposed on the base substrate 02 by providing a self-luminous blue sub-pixel light-emitting layer 051 and a white sub-pixel light-emitting layer 062 in two colors, and a white sub-pixel light-emitting layer 062.
  • the green filter 054 and the yellow filter 055 extract red light from the white light emitted by the white sub-pixel emitting layer 062 through the red filter 053 to form a red sub-pixel; and pass the white sub-pixel through the green filter 054.
  • the green light emitted from the luminescent layer 062 extracts green light to form a green sub-pixel; the yellow light is extracted from the white light emitted by the white sub-pixel luminescent layer 062 by the yellow filter 055 to form a yellow sub-pixel, thereby being compared with the fine mask Membrane technology, the area of the filters of each color in the color film technology can be made smaller. Therefore, the red filter 053, the green filter 054, and the yellow filter 055 are disposed on the white sub-pixel emitting layer 062 for extracting red, green, and yellow light, so that the array substrate can have higher resolution. rate.
  • the number of times of using the fine mask is reduced, and the fine mask is used.
  • the number of high-precision alignment operations is performed in the process, thereby reducing the probability of pixel color mixing during the fabrication of the array substrate and improving the product quality of the array substrate.
  • the opening area of the corresponding fine mask is also large, thereby reducing the process difficulty of fabricating the fine mask, thereby reducing the process difficulty of fabricating the array substrate.
  • blue light is emitted by using the blue sub-pixel light-emitting layer 051 in the form of self-luminescence, that is, using fine mask technology and evaporation technology.
  • the blue sub-pixel light-emitting layer 051 is fabricated, which reduces the power consumption of the array substrate, thereby prolonging the service life of the array substrate.
  • the specific structure of the array substrate provided by the embodiment of the present disclosure may be designed according to actual needs. Since the specific structure of the array substrate is understood by those skilled in the art, it will not be described herein, nor should it be used as the disclosure. limit.
  • the array substrate provided by the embodiment of the present disclosure may be, for example, a glass cover plate.
  • other layer structures may be used, which may be specifically designed according to actual needs, and are not limited herein.
  • an opposite substrate disposed opposite to the substrate substrate 02 may be further disposed.
  • the opposite substrate 01 and the substrate substrate 02 are only used to indicate the positional relationship, and the specific structure thereof is not limited to the one shown in the drawing.
  • the layer structure may be specifically designed according to actual needs, and is not limited herein.
  • the material for fabricating the second sub-pixel light-emitting layer includes: a host material and a guest material.
  • the host material is used to inhibit guest concentration quenching and to efficiently transfer energy to the guest material.
  • the guest material has the characteristics of high luminous efficiency for emitting light of a desired color.
  • the specific components of the host material and the guest material may be designed according to actual needs. The specific components of the host material and the guest material are understood by those skilled in the art, and are not described herein, nor should they be construed as limiting the disclosure.
  • the host material includes at least one color of the host material; and correspondingly, the guest material includes at least one color of the guest material.
  • the material of the yellow sub-pixel light-emitting layer may include, for example, a yellow light host material and a yellow light guest material.
  • the yellow sub-pixel light-emitting layer may be compositely illuminated by a red light material and a green light material to obtain yellow light. Therefore, the material for forming the yellow sub-pixel light-emitting layer may include, for example, a red light material and a green light material; wherein the red light material A red light host material and a red light guest material may be included, and the green light material may include a green light host material and a green light guest material.
  • the material for fabricating the second sub-pixel light-emitting layer is not limited to the above several compositions. Specifically, it can be designed according to actual needs, as long as it is feasible in accordance with the principles of the present disclosure, and is not limited herein.
  • the array substrate provided by the embodiment of the present disclosure may further include: a first electrode layer 115 between the filter 04_m and the second sub-pixel emitting layer 032, And a second electrode layer 117 between the base substrate 02 and the second sub-pixel light emitting layer 032.
  • the first electrode layer 115 may be a cathode layer.
  • the second electrode layer 117 may be an anode layer, such that the first electrode layer 115 and the second electrode layer 117 are respectively loaded with corresponding voltages to drive the light-emitting layers of different colors to emit light.
  • the material of the first electrode layer 115 can be a transparent conductive material of a metal or indium tin oxide, and can be specifically designed according to actual needs, which is not limited herein.
  • the material of the second electrode layer 117 can be, for example, a conductive material such as indium tin oxide, and can be specifically designed according to actual needs, and is not limited herein.
  • the above array substrate provided by the embodiment of the present disclosure may further include: an optical coupling layer 116 between the first electrode 115 and the filter 04_m.
  • Light emitted by the second sub-pixel light-emitting layer 032 may be reflected in the layer structure of the array substrate due to different color light-emitting layers, thereby generating light loss.
  • the light emitted by the second sub-pixel light-emitting layer 032 is further extracted by providing the optical coupling layer 116 to increase the light-emitting rate of the second sub-pixel light-emitting layer 032.
  • the array substrate provided by the embodiment of the present disclosure may further include: an electron injection layer 114 between the first electrode 115 and the second sub-pixel light emitting layer 032, located at the electronic The electron transport layer 113 between the implant layer 114 and the second sub-pixel light-emitting layer 032, the hole injection layer 110 between the second electrode 117 and the second sub-pixel light-emitting layer 032, the hole injection layer 110 and the second The hole transport layer 111 between the sub-pixel light emitting layers 032.
  • the array substrate may further include: an optical adjustment layer 112 between the second sub-pixel light emitting layer 032 and the hole transport layer 111.
  • the optical adjustment layer 112 is located below the second sub-pixel illumination layer 032 for adjusting the chromaticity coordinate (CIE) of the light emitted by the second sub-pixel illumination layer 032, due to the spectrum of the second sub-pixel illumination layer 032.
  • CIE chromaticity coordinate
  • the first pixel light-emitting layer 031 has different spectra, and the required optical adjustment is different. Therefore, the first pixel light-emitting layer 031 may not be provided with an optical adjustment layer.
  • an optical adjustment layer or other layer structure may also be provided, and specifically, according to actual needs. design.
  • the optical coupling layer 116 in the above array substrate provided by the embodiment of the present disclosure, the optical coupling layer 116 , the electron injection layer 114 , the electron transport layer 113 , the hole injection layer 110 , and the hole transport layer
  • the manufacturing material of the optical adjustment layer 112 and the optical adjustment layer 112 include: an organic material, and of course, other materials may be used, and may be specifically designed according to actual needs, which is not limited herein.
  • an embodiment of the present disclosure further provides a display device, including the above array substrate provided by the embodiment of the present disclosure.
  • a display device including the above array substrate provided by the embodiment of the present disclosure.
  • the display device refer to the embodiment of the above array substrate, and the repeated description is omitted.
  • the display device provided by the embodiment of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • Other indispensable components of the display device are understood by those skilled in the art, and are not described herein, nor should they be construed as limiting the disclosure.
  • a method for fabricating an array substrate provided by an embodiment of the present disclosure may include the following steps:
  • S902 forming at least two filters of different colors in each pixel unit and a side of the pixel light emitting layer facing away from the substrate; wherein, in the same pixel unit, the orthographic projection of each filter on the substrate is respectively The two sub-pixel light-emitting layers have overlapping regions on the orthographic projection of the base substrate.
  • the step of forming the pixel light emitting layer includes at least the steps of: fabricating the first sub-pixel light emitting layer and fabricating the second sub-pixel light emitting layer.
  • step S1001 forming a second electrode layer in each pixel unit on one side of the substrate substrate by sputtering; wherein the material of the second electron layer can be, for example, indium tin oxide. Also included before step S1001 is forming a base substrate.
  • the material for forming the hole injection layer and the hole transport layer may be, for example, an organic material.
  • the material of the optical adjustment layer may be, for example, an organic material.
  • the first sub-pixel light emitting layer and the second sub-pixel light emitting layer may include, for example, a host material and a guest material.
  • S1004 sequentially depositing an electron transport layer, an electron injection layer, a first electrode layer, and an optical coupling layer on the first sub-pixel light-emitting layer and the second sub-pixel light-emitting layer by using an opening mask.
  • the material of the electron transport layer, the electron injection layer, and the optical coupling layer may be, for example, an organic material.
  • step S1005. Create a filter located on a side of the second sub-pixel light-emitting layer facing away from the substrate. Wherein, after step S1005, it may further comprise forming a counter substrate.
  • the array substrate, the manufacturing method thereof and the display device provided by the embodiments of the present disclosure improve the resolution of the array substrate by using the filter technology, and reduce the probability of pixel color mixing during the fabrication process of the array substrate, thereby reducing the fabrication of the array substrate.
  • the process difficulty increases the quality of the array substrate.
  • the power consumption of the array substrate is reduced by using the pixel self-luminous technology, thereby prolonging the service life of the array substrate, and the array substrate has low resolution while having high resolution.

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Abstract

阵列基板、其制作方法及显示装置，该阵列基板包括：衬底基板，位于衬底基板一侧的多个像素单元；各像素单元包括：像素发光层，以及位于像素发光层背离衬底基板一侧的至少两个不同颜色的滤光片；像素发光层包括第一子像素发光层和第二子像素发光层；同一像素单元中，各滤光片在衬底基板的正投影分别与第二子像素发光层在衬底基板的正投影具有交叠区域。

Description

阵列基板、其制作方法及显示装置
本公开要求在2017年12月05日提交中国专利局、公开号为201711268171.2、公开名称为“一种阵列基板、显示装置及其制作工艺”的中国专利公开的优先权，其全部内容以引入的方式并入本公开中。
技术领域
本公开涉及显示技术领域，尤其涉及一种阵列基板、其制作方法及显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示面板由于具有高对比度、宽色域、响应速度快、可柔性化等优异特性，应用越来越广泛。目前，OLED显示面板中的子像素的制作方法一般是通过精细掩膜版(Fine Metal Mask，FFM)技术及蒸镀技术制作各个颜色的子像素，使得每种不同颜色的子像素都采用自发光的形式获得该子像素对应颜色的光。当显示面板需要的分辨率越高时，制作子像素所需的精细掩膜版的制作方法越难。由于制作技术限制，精细掩膜版无法达到更高分辨率的显示面板所要求的精细度，因此采用这种方式制作子像素的显示面板的分辨率难以提升。并且，在制备子像素的过程中，还会由于精细掩膜版的开口没有准确对位或精细掩膜版发生形变等问题产生混色，影响产品质量。
发明内容
本公开实施例提供的阵列基板，其中，包括：
衬底基板，
位于所述衬底基板一侧的多个像素单元；
各所述像素单元包括：像素发光层，以及位于所述像素发光层背离所述衬底基板一侧的至少两个不同颜色的滤光片；
所述像素发光层包括第一子像素发光层和第二子像素发光层；
同一所述像素单元中，各所述滤光片在所述衬底基板的正投影分别与所述第二子像素发光层在所述衬底基板的正投影具有交叠区域。
可选地，在本公开实施例提供的阵列基板中，所述第二子像素发光层包括：白色子像素发光层或黄色子像素发光层。
可选地，在本公开实施例提供的阵列基板中，在所述第二子像素发光层包括黄色子像素发光层时，所述黄色子像素发光层的材料包括：黄光主体材料及黄光客体材料；或者，
所述黄色子像素发光层的材料包括：红光材料和绿光材料；其中，所述红光材料包括红光主体材料及红光客体材料，所述绿光材料包括绿光主体材料及绿光客体材料。
可选地，在本公开实施例提供的阵列基板中，所述第一子像素发光层为蓝色子像素发光层。
可选地，在本公开实施例提供的阵列基板中，所述滤光片包括：红色滤光片和绿色滤光片。
可选地，在本公开实施例提供的阵列基板中，各所述滤光片在所述衬底基板的正投影不交叠。
可选地，在本公开实施例提供的阵列基板中，同一所述像素单元中，所述第二子像素发光层在所述衬底基板的正投影覆盖各所述滤光片在所述衬底基板的正投影。
可选地，在本公开实施例提供的阵列基板中，所述第一子像素发光层与所述第二子像素发光层同层设置。
可选地，在本公开实施例提供的阵列基板中，所述阵列基板还包括：位于所述滤光片与所述第二子像素发光层之间的第一电极层，以及位于所述衬底基板与所述第二子像素发光层之间的第二电极层。
可选地，在本公开实施例提供的阵列基板中，所述阵列基板还包括：位于所述第一电极与所述滤光片之间的光学耦合层。
可选地，在本公开实施例提供的阵列基板中，所述阵列基板还包括：位于所述第一电极与所述第二子像素发光层之间的电子注入层，位于所述电子注入层与所述第二子像素发光层之间的电子传输层，位于所述第二电极与所述第二子像素发光层之间的空穴注入层、位于所述空穴注入层与所述第二子像素发光层之间的空穴传输层。
可选地，在本公开实施例提供的阵列基板中，所述阵列基板还包括：位于所述第二子像素发光层与所述空穴传输层之间的光学调整层。
本公开实施例还提供了显示装置，其中，包括本公开实施例提供的阵列基板。
本公开实施例还提供了阵列基板的制作方法，其中，包括：
在衬底基板上的每个像素单元中形成像素发光层；其中，所述像素发光层包括第一子像素发光层和第二子像素发光层；
在每个所述像素单元中且所述像素发光层背离所述衬底基板一侧形成至少两个不同颜色的滤光片；其中，同一所述像素单元中，各所述滤光片在所述衬底基板的正投影分别与所述第二子像素发光层在所述衬底基板的正投影具有交叠区域。
附图说明
图1为相关技术中利用精细掩膜版制作子像素的结构示意图；
图2为相关技术中利用彩膜技术制作子像素的结构示意图；
图3为本公开实施例提供的阵列基板的结构示意图之一；
图4a为相关技术中提供的阵列基板的俯视结构示意图；
图4b为本公开实施例提供的阵列基板的俯视结构示意图；
图5为本公开实施例提供的阵列基板的结构示意图之二；
图6为本公开实施例提供的阵列基板的结构示意图之三；
图7为本公开实施例提供的阵列基板的结构示意图之四；
图8为本公开实施例提供的阵列基板的具体结构示意图；
图9为本公开实施例提供的阵列基板的制作方法流程图之一；
图10为本公开实施例提供的阵列基板的制作方法流程图之二。
具体实施方式
为了使本公开的目的，技术方案和优点更加清楚，下面结合附图，对本公开实施例提供的阵列基板、其制作方法及显示装置的具体实施方式进行详细地说明。应当理解，下面所描述的优选实施例仅用于说明和解释本公开，并不用于限定本公开。并且在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。需要注意的是，附图中各层薄膜厚度和形状不反映阵列基板的真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
附图中各部件的形状和大小不反映真实比例，目的只是示意说明本公开内容。
参见图1，若通过精细掩膜版技术及蒸镀技术制作各个颜色的子像素，即各个颜色的子像素都采用自发光的形式获得该子像素对应颜色的光，具体如下：阵列基板中包括三个颜色的子像素：红色子像素、蓝色子像素以及绿色子像素。图1中210为待形成红色子像素的区域，211为待形成蓝色子像素的区域，212为待形成绿色子像素的区域。以制作绿色子像素为例，在使用精细掩膜版23通过蒸镀技术制作绿色子像素时，使用精细掩膜版23遮挡住阵列基板中待形成红色子像素的区域210以及待形成蓝色子像素的区域211，暴露出要蒸镀的待形成绿色子像素的区域212；精细掩膜版23包括开口区22和遮挡区21，精细掩膜版23的遮挡区21为遮挡住待形成红色子像素的区域210以及待形成蓝色子像素的区域211的区域，精细掩膜版23的开口区22为暴露出要蒸镀的待形成绿色子像素的区域212的区域。则在蒸镀过程中，通过开口区22使待形成绿色子像素的区域212形成绿色子像素。相应地，与形成绿色子像素的原理相同，分别形成红色子像素及蓝色子像素，以形成三种不同颜色的自发光的子像素。当阵列基板的分辨率越高，所需的开口区22的开 口度越小，制作方法的难度越大。另一方面，在通过精细掩膜版技术制作子像素时，每个颜色至少需要使用一次精细掩膜版，为了使精细掩膜版的开口区准确暴露出待形成的子像素的区域，需要使用高精度的对位操作。然而在进行对位操作时，容易使得不同颜色的子像素发生混色，因此减少使用精细掩膜版的次数也有利于提升产品质量。
目前，还可以采用彩膜技术获得各个不同颜色的子像素的光，即设置多个不同颜色的滤光片，通过滤光片提取各个颜色的光。参见图2，通过彩膜技术获得各个不同颜色的像素的光，具体如下：阵列基板中包括三个颜色的子像素：红色子像素、蓝色子像素以及绿色子像素。在衬底基板02之上设置白色子像素发光层062，在白子像素色发光层062上设置红色滤光片053、绿色滤光片054以及蓝色滤光片057，用以从白色子像素发光层062发出的白光中提取该滤光片对应颜色的光。由于彩膜技术的工艺较成熟，因此各个颜色的滤光片的面积可以制作得更小。因此使用彩膜技术的显示面板较容易提升分辨率。但另一方面，通常蓝色滤光片的出光率较低，因此要提取出蓝光产生的功耗较大。
基于此，本公开实施例提供的阵列基板，如图3所示，可以包括：衬底基板02、位于衬底基板02一侧的多个像素单元。各像素单元可以包括：像素发光层03，以及位于像素发光层03背离衬底基板02一侧的至少两个不同颜色的滤光片04_m(1≤m≤M且为整数，M代表滤光片的颜色的总数，图3以M＝2为例)。像素发光层03至少包括第一子像素发光层031以及第二子像素发光层032。同一像素单元中，各滤光片04_m在衬底基板01的正投影分别与第二子像素发光层032在衬底基板01的正投影具有交叠区域。
本公开实施例提供的上述阵列基板，通过使用彩膜技术提高了阵列基板的分辨率，降低了阵列基板制作过程中产生子像素混色的概率，从而降低了制作阵列基板的工艺难度，提高了阵列基板的产品质量。并且通过使用自发光技术降低了阵列基板的功耗，从而延长了阵列基板的使用寿命，使阵列基板在具有高分辨率的同时功耗较低。
可选地，在具体实施时，本公开实施例提供的上述阵列基板中，如图3所示，可以使各滤光片04_1、04_2在衬底基板02的正投影不交叠。进一步地，同一像素单元中，可以使第二子像素发光层032在衬底基板02的正投影覆盖各滤光片04_m在衬底基板02的正投影。其中，在同一像素单元中，第二子像素发光层032在衬底基板02的正投影的面积可以大于滤光片04_1与滤光片04_2在衬底基板02的正投影的面积总和，第二子像素发光层032在衬底基板02的正投影中面积大于滤光片04_1与滤光片04_2在衬底基板02的正投影的面积总和的那部分第二子像素发光层032，通过自发光的形式发出该第二子像素发光层032自身颜色的光，以形成该颜色的像素。当然，第二子像素发光层032在衬底基板02的正投影的面积也可以等于滤光片04_1与滤光片04_2在衬底基板02的正投影的面积总和，在此不作限定。
在具体实施时，本公开实施例提供的上述阵列基板，第一子像素发光层和第二子像素发光层发出的光的颜色不同，同一像素单元中的各滤光片的颜色也不相同。其中，第一子像素发光层对应的颜色的光，可以为在彩膜技术中提取该颜色的光的器件的出光率较低的光，例如，可以是蓝光，即第一子像素发光层可以为蓝色子像素发光层。由于在彩膜技术中提取蓝光的器件(例如蓝色滤光片)的出光率较低，使用彩膜技术提取蓝光的功耗较大，通过使蓝色子像素采用自发光的形式发出蓝光，提高了蓝色子像素的发光率，降低了阵列基板的功耗。当然，第一像素发光层031也可以为其他颜色的像素发光层，具体地可根据需要设计，只要符合本公开原理都是可行的，在此不做限定。
在具体实施时，在本公开实施例提供的阵列基板中，可以在每一个像素单元中设置两个不同颜色的滤光片，即滤光片04_1和滤光片04_2。这样通过在衬底基板02上设置自发光的第一子像素发光层031及第二子像素发光层032，且在自发光的第二子像素发光层032之上设置滤光片04_1及滤光片04_2，使得滤光片04_1及滤光片04_2通过第二子像素发光层032发出的光提取滤光片04_1对应颜色的光及滤光片04_2对应颜色的光。从而相较于精细掩膜 版技术，彩膜技术中各个颜色的滤光片的面积可以制作得更小，因此将滤光片04_1及滤光片设置在第二子像素发光层032之上用以提取滤光片04_1及滤光片04_2对应的颜色的光，使得阵列基板可以有更高的分辨率。或者，在具体实施时，也可以在每一个像素单元中设置三个不同颜色的滤光片，用以通过第二子像素发光层032发出的光提取三种颜色的滤光片对应的颜色的光，以形成第三种颜色滤光片对应的颜色的子像素。当然，还可以设置更多种颜色的滤光片，具体地可根据实际需要而设计，在此不做限定。
并且，本公开实施例提供的阵列基板，由于只需蒸镀第一子像素发光层031及第二子像素发光层032两种颜色的子像素发光层，减少了使用精细掩膜版的次数，以及在使用精细掩膜版的过程中进行高精度对位操作的次数，从而降低了阵列基板制作过程中产生像素混色的概率，提高了阵列基板的产品质量。
在常规的制作方法中，需在衬底基板02之上蒸镀三种颜色的像素发光层：如图4a所示，第一子像素发光层031、第三子像素发光层0321及第四子像素发光层0322。本公开实施例提供的阵列基板中，只需蒸镀两种颜色的子像素，如图4b所示，在衬底基板02之上蒸镀两种颜色的像素发光层：第一子像素发光层031及第二子像素发光层032。本公开实施例提供的阵列基板中相比图4a中的阵列基板，单个第二子像素发光层032的面积大于单个第三子像素发光层0321或单个第四子像素发光层0322的面积，由于第二子像素发光层032的面积较大，因此对应的精细掩膜版的开口区也较大，从而降低了制作精细掩膜版的工艺难度，进而降低了制作阵列基板的工艺难度。另一方面，如图图3所示，由于第一子像素发光层031对应的颜色的光，为在彩膜技术中，提取该颜色的光的器件的出光率较低的光，因此通过使第一子像素发光层031采用自发光的形式，获得第一子像素发光层031对应的颜色的光，即，使用精细掩膜版技术和蒸镀技术制作第一子像素发光层031，降低了阵列基板的功耗，从而延长了阵列基板的使用寿命。
可选地，在具体实施时，本公开实施例提供的上述阵列基板中，滤光片 04_1例如可以为红色滤光片；滤光片04_2例如可以为绿色滤光片，将红色滤光片及绿色滤光片设置在第二子像素发光层032之上，用于通过红色滤光片从第二子像素发光层032发出的光中提取红光，通过绿色滤光片从第二子像素发光层032发出的光中提取绿光。当然，也可以设置其他颜色的滤光片，具体可根据实际需要，在此不做限定。
进一步地，在具体实施时，本公开实施例提供的上述阵列基板中，可以使第一子像素发光层031与第二子像素发光层032同层设置。这样可以降低阵列基板的厚度。
进一步地，如图3所示，在具体实施时，本公开实施例提供的上述阵列基板中，第一子像素发光层031与第二子像素发光层032之间设置有像素界定层05，用于使不同颜色的发光层相互间隔开以及互相绝缘。
可选地，在具体实施时，本公开实施例提供的上述阵列基板中，第二子像素发光层032可以包括白色子像素发光层或黄色子像素发光层。当然，第二子像素发光层032也可以包括其他颜色的像素发光层，具体地可根据需要设计，只要符合本公开原理都是可行的，在此不做限定。
下面对本公开中的阵列基板的具体结构进行举例说明，所举的例子仅用于更好地说明本公开的原理，不对本公开做出限定。
具体地，在一些可选的实施方式中，参见图5，本公开实施例提供的阵列基板中，阵列基板可以包括红色子像素、蓝色子像素及绿色子像素三种颜色的子像素，阵列基板可以包括：衬底基板02、位于衬底基板02一侧的第一子像素发光层以及第二子像素发光层；其中，第一子像素发光层例如可以为蓝色子像素发光层051，第二子像素发光层例如可以为黄色子像素发光层052。并且，可以使蓝色子像素发光层051与黄色子像素发光层052同层设置。在蓝色子像素发光层051与黄色子像素发光层052之间设置有像素界定层05，用于使不同像素的发光层互相绝缘。在黄色子像素发光层052背离衬底基板02一侧设置有两个不同颜色的滤光片；其中，这两个不同颜色的滤光片种的第一个滤光片例如可以为红色滤光片053，第二个滤光片例如可以为绿色滤光 片054，红色滤光片053和绿色滤光片054在衬底基板02的正投影与黄色子像素发光层052在衬底基板02的正投影重叠。这样通过在衬底基板02之上设置自发光的蓝色子像素发光层051及黄色子像素发光层052两种颜色的像素发光层，且在黄色子像素发光层052之上设置红色滤光片053及绿色滤光片054，通过红色滤光片053从黄色子像素发光层052发出的黄光中提取红光，以形成红色子像素，通过绿色滤光片054从黄色子像素发光层052发出的黄光中提取绿光，以形成绿色子像素。从而相较于精细掩膜版技术，彩膜技术中各个颜色的滤光片的面积可以制作得更小，因此将红色滤光片053及绿色滤光片054设置在黄色子像素发光层052之上用以提取红光及绿光，使得阵列基板可以有更高的分辨率。
同时，由于只用蒸镀蓝色子像素发光层051及黄色子像素发光层052对应的两种颜色的子像素发光层，减少了使用精细掩膜版的次数，以及在使用精细掩膜版的过程中进行高精度对位操作的次数，从而降低了阵列基板制作过程中产生像素混色的概率，提高了阵列基板的产品质量。并且，由于黄色子像素发光层052的面积较大，因此对应的精细掩膜版的开口区也较大，从而降低了制作精细掩膜版的工艺难度，进而降低了制作阵列基板的工艺难度。另一方面，由于在彩膜技术中提取蓝光的器件的出光率较低，因此通过利用蓝色子像素发光层051采用自发光的形式获得蓝光，即使用精细掩膜版技术和蒸镀技术制作蓝色子像素发光层051，降低了阵列基板的功耗，从而延长了阵列基板的使用寿命。
在另一些可选地实施方式中，参见图5，本公开实施例提供的阵列基板中，图5中的黄色子像素发光层052也可以替换为白色子像素发光层，相应地，在白色子像素发光层背离衬底基板02一侧设置有两个不同颜色的滤光片。其中，这两个不同颜色的滤光片中的第一个滤光片例如可以为红色滤光片053，第二个滤光片例如可以为绿色滤光片054，通过在衬底基板02之上设置自发光的蓝色子像素发光层051及白色子像素发光层两种颜色的像素发光层，且在白色子像素发光层之上设置红色滤光片053及绿色滤光片054，通过红色滤 光片053从白色子像素发光层发出的白光中提取红光，以形成红色子像素，通过绿色滤光片054从白色子像素发光层发出的白光中提取绿光，以形成绿色子像素。
具体地，在另一些可选的实施方式中，参见图6，本公开实施例提供的阵列基板中，阵列基板中可以包括红色子像素、蓝色子像素、绿色子像素及黄色子像素四种颜色的像素。具体地，阵列基板可以包括：衬底基板02，位于衬底基板02一侧的第一子像素发光层以及第二子像素发光层；其中，第一子像素发光层例如可以为蓝色子像素发光层051，第二子像素发光层例如可以为黄色子像素发光层052，蓝色子像素发光层051与黄色子像素发光层052同层设置；在蓝色子像素发光层051与黄色子像素发光层052之间设置有像素界定层05，用于使不同像素的发光层互相绝缘。并且在黄色子像素发光层052背离衬底基板02一侧设置有两个不同颜色的滤光片。其中，第一个滤光片例如可以为红色滤光片053，第二个滤光片例如可以为绿色滤光片054，其中，黄色子像素发光层052的正投影的面积大于红色滤光片053与绿色滤光片054的正投影的面积总和，黄色子像素发光层052可包括两个部分：第一部分0521及第二部分0522，其中第一部分0521的正投影的面积等于红色滤光片053与绿色滤光片054的正投影的面积总和，即红色滤光片053和绿色滤光片054在垂直于衬底基板02的方向上与黄色子像素发光层的第一部分0521的正投影重叠。黄色子像素发光层的第二部分0522为黄色子像素发光层052在垂直于衬底基板02的方向上与红色滤光片053和绿色滤光片054的正投影不重叠的部分，黄色子像素发光层的第二部分0522通过自发光的形式发出黄光，以形成黄色子像素。通过在衬底基板02之上设置自发光的蓝色子像素发光层051及黄色子像素发光层052两种颜色的像素发光层，且在黄色子像素发光层052之上设置红色滤光片053及绿色滤光片054，通过红色滤光片053从黄色子像素发光层052发出的黄光中提取红光，以形成红色子像素，通过绿色滤光片054从黄色子像素发光层052发出的黄光中提取绿光，以形成绿色子像素，从而相较于精细掩膜版技术，彩膜技术中各个颜色的滤光片的面积可以制作得 更小，因此将红色滤光片053及绿色滤光片054设置在黄色子像素发光层052之上用以提取红光及绿光，使得阵列基板可以有更高的分辨率。
同时，由于只用蒸镀蓝色子像素发光层051及黄色子像素发光层052对应的两种颜色的子像素发光层，减少了使用精细掩膜版的次数，以及在使用精细掩膜版的过程中进行高精度对位操作的次数，从而降低了阵列基板制作过程中产生像素混色的概率，提高了阵列基板的产品质量。并且，由于黄色子像素发光层052的面积较大，因此对应的精细掩膜版的开口区也较大，从而降低了制作精细掩膜版的工艺难度，进而降低了制作阵列基板的工艺难度。另一方面，由于在彩膜技术中提取蓝光的器件的出光率较低，因此通过利用蓝色子像素发光层051采用自发光的形式发出蓝光，即，使用精细掩膜版技术和蒸镀技术制作蓝色子像素发光层051，降低了阵列基板的功耗，从而延长了阵列基板的使用寿命。
在一些可选地实施方式中，继续参见图6，本公开实施例提供的阵列基板中，图6中的黄色子像素发光层052也可以替换为白色子像素发光层，相应地，阵列基板中可以包括红色子像素、蓝色子像素、绿色子像素及白色子像素四种颜色的像素，在白色子像素发光层背离衬底基板02一侧设置有两个不同颜色的滤光片；其中，第一个滤光片例如可以为红色滤光片053，第二个滤光片例如可以为绿色滤光片054，其中，白色子像素发光层的面积大于红色滤光片053与绿色滤光片054的面积总和，白色子像素发光层可包括两个部分：第一部分及第二部分，其中第一部分的面积等于红色滤光片053与绿色滤光片054的面积总和，即红色滤光片053和绿色滤光片054在衬底基板02的正投影与白色子像素发光层的第一部分的正投影重叠；白色子像素发光层的第二部分为白色子像素发光层在衬底基板02的正投影与红色滤光片053和绿色滤光片054的正投影不重叠的部分，白色子像素发光层的第二部分通过自发光的形式发出白光，以形成白色子像素。
具体地，在又一种可选的实施方式中，参见图7，本公开实施例提供的阵列基板中，阵列基板中包括红色子像素、蓝色子像素、绿色子像素及黄色子 像素四种颜色的像素。阵列基板可以包括：衬底基板02、位于衬底基板02一侧的第一子像素发光层以及第二子像素发光层；其中，第一子像素发光层例如可以为蓝色子像素发光层051，第二子像素发光层例如可以为白色子像素发光层062，蓝色子像素发光层051与白色子像素发光层062同层设置；在蓝色子像素发光层051与白色子像素发光层062之间设置有像素界定层05，用于使不同像素的发光层互相绝缘。在白色子像素发光层062背离衬底基板02一侧设置有三种不同颜色的滤光片；其中，这三种不同颜色的滤光片中的第一个滤光片例如可以为红色滤光片053，第二个滤光片例如可以为绿色滤光片054，第三个滤光片例如可以为黄色滤光片055；红色滤光片053、绿色滤光片054和黄色滤光片055在衬底基板02的正投影与白色子像素发光层062在衬底基板02的正投影至少存在部分重叠，当然，还可以设置更多不同颜色的滤光片，图7所示仅为更好解释本公开原理所举的例子，并不对本公开进行限定，具体地，可根据实际需要设计。
通过在衬底基板02之上设置自发光的蓝色子像素发光层051及白色子像素发光层062两种颜色的像素发光层，且在白色子像素发光层062之上设置红色滤光片053、绿色滤光片054及黄色滤光片055，通过红色滤光片053从白色子像素发光层062发出的白光中提取红光，以形成红色子像素；通过绿色滤光片054从白色子像素发光层062发出的白光中提取绿光，以形成绿色子像素；通过黄色滤光片055从白色子像素发光层062发出的白光中提取黄光，以形成黄色子像素，从而相较于精细掩膜版技术，彩膜技术中各个颜色的滤光片的面积可以制作得更小。因此将红色滤光片053、绿色滤光片054及黄色滤光片055设置在白色子像素发光层062之上用以提取红光、绿光及黄光，使得阵列基板可以有更高的分辨率。
同时，由于只用蒸镀蓝色子像素发光层051及白色子像素发光层062对应的两种颜色的子像素发光层，减少了使用精细掩膜版的次数，以及在使用精细掩膜版的过程中进行高精度对位操作的次数，从而降低了阵列基板制作过程中产生像素混色的概率，提高了阵列基板的产品质量。并且，由于白色 子像素发光层062的面积较大，因此对应的精细掩膜版的开口区也较大，从而降低了制作精细掩膜版的工艺难度，进而降低了制作阵列基板的工艺难度。另一方面，由于在彩膜技术中提取蓝光的器件的出光率较低，因此通过利用蓝色子像素发光层051采用自发光的形式发出蓝光，即，使用精细掩膜版技术和蒸镀技术制作蓝色子像素发光层051，降低了阵列基板的功耗，从而延长了阵列基板的使用寿命。
进一步地，本公开实施例提供的阵列基板的具体结构可以根据实际需要设计，由于阵列基板的具体结构是本领域的普通技术人员应该理解的，在此不做赘述，也不应作为对本公开的限制。
进一步地，本公开实施例提供的阵列基板，衬底基板例如可以为玻璃盖板，当然，也可以是其他的层结构，具体可根据实际需要设计，在此不做限定。
需要说明的是，在将本公开实施例提供的阵列基板应用于显示装置中时，如图3、以及图5至图7所示，还可以设置有与衬底基板02相对设置的对向基板01。并且，图3、以及图5至图7所示的阵列基板的结构中，其中所示对向基板01和衬底基板02仅用于表示位置关系，其具体结构并不限于图中所示的层结构，具体地可结合实际需要设计，在此不做限定。
进一步地，在具体实施时，本公开实施例提供的上述阵列基板中，第二子像素发光层的制作材料包括：主体材料和客体材料。该主体材料用于抑制客体浓度猝灭(concentration quenching)以及用于将能量有效地传递给客体材料。该客体材料具有高发光效率的特点，用于发出所需的颜色的光。主体材料与客体材料的具体成分可根据实际需要设计，由于主体材料与客体材料的具体成分是本领域的普通技术人员应该理解的，在此不做赘述，也不应作为对本公开的限制。
进一步地，在具体实施时，本公开实施例提供的上述阵列基板中，主体材料至少包括一种颜色的主体材料；相应地，客体材料至少包括一种颜色的客体材料。
在具体实施时，在第二子像素发光层包括黄色子像素发光层时，黄色子像素发光层的制作材料例如可以包括：黄光主体材料及黄光客体材料。
或者，黄色子像素发光层可以由红光材料及绿光材料复合发光以得到黄光，因此，黄色子像素发光层的制作材料例如可以包括：红光材料和绿光材料；其中，红光材料可以包括的红光主体材料及红光客体材料，绿光材料可以包括绿光主体材料及绿光客体材料。当然，第二子像素发光层的制作材料不限于上述几种组成方式。具体地，可根据实际需要设计，只要符合本公开原理都是可行的，在此不做限定。
进一步地，在具体实施时，如图8所示，本公开实施例提供的上述阵列基板中还可以包括：位于滤光片04_m与第二子像素发光层032之间的第一电极层115，以及位于衬底基板02与第二子像素发光层032之间的第二电极层117。其中，第一电极层115可以为阴极层。第二电极层117可以为阳极层，这样可以通过对第一电极层115和第二电极层117分别加载对应的电压，以驱动不同颜色的发光层发光。
进一步地，第一电极层115的制作材料例如可以为金属或氧化铟锡的透明导电材料，具体地可根据实际需要设计，在此不做限定。第二电极层117的制作材料例如可以为氧化铟锡等导电材料，具体地可根据实际需要设计，在此不做限定。
进一步地，在具体实施时，如图8所示，本公开实施例提供的上述阵列基板中还可以包括：位于第一电极115与滤光片04_m之间的光学耦合层116。由于不同颜色发光层，例如第二子像素发光层032发出的光会在阵列基板的层结构中发生反射，从而产生光损失。通过设置光学耦合层116以进一步提取第二子像素发光层032发出的光，以提高第二子像素发光层032的发光率。
进一步地，在具体实施时，如图8所示，本公开实施例提供的上述阵列基板还可以包括：位于第一电极115与第二子像素发光层032之间的电子注入层114，位于电子注入层114与第二子像素发光层032之间的电子传输层113、位于第二电极117与第二子像素发光层032之间的空穴注入层110、位于空穴 注入层110与第二子像素发光层032之间的空穴传输层111。进一步地，阵列基板还可以包括：位于第二子像素发光层032与空穴传输层111之间的光学调整层112。其中，光学调整层112在衬底基板02的正投影与第二子像素发光层032在衬底基板02的正投影重叠。并且光学调整层112位于第二子像素发光层032之下，用于调整第二子像素发光层032发出的光的色坐标(chromaticity coordinate，CIE)，由于第二子像素发光层032的光谱与第一像素发光层031的光谱不同，所需的光学调整不同，因此第一像素发光层031可以不设置光学调整层，当然，也可以设置光学调整层或其他层结构，具体地可根据实际需要设计。
进一步地，在具体实施时，如图8所示，本公开实施例提供的上述阵列基板中，光学耦合层116、电子注入层114、电子传输层113、空穴注入层110、空穴传输层111以及所述光学调整层112的制作材料包括：有机材料，当然，也可以为其他材料，具体地可根据实际需要设计，在此不做限定。
基于同一发明构思，本公开实施例还提供了一种显示装置，包括本公开实施例提供的上述阵列基板。该显示装置的实施可以参见上述阵列基板的实施例，重复之处不再赘述。
在具体实施时，本公开实施例提供的显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。
基于同一发明构思，本公开实施例提供的阵列基板的制作方法，如图9所示，可以包括如下步骤：
S901、在衬底基板上的每个像素单元中形成像素发光层；其中，像素发光层包括第一子像素发光层和第二子像素发光层；
S902、在每个像素单元中且像素发光层背离衬底基板一侧形成至少两个不同颜色的滤光片；其中，同一像素单元中，各滤光片在衬底基板的正投影分别与第二子像素发光层在衬底基板的正投影具有交叠区域。
在具体实施时，形成像素发光层的步骤至少包括：制作第一子像素发光层以及制作第二子像素发光层的步骤。
参见图10，本发明实施例提供的阵列基板的制作方法的具体步骤如下：
S1001、通过溅镀(sputtering)在衬底基板一侧的各个像素单元中形成第二电极层；其中第二电子层的制作材料例如可以为氧化铟锡。在步骤S1001之前还包括形成衬底基板。
S1002、采用开口掩膜版依次在第二电极层上依次蒸镀空穴注入层、空穴传输层。其中，空穴注入层与空穴传输层的制作材料例如可以为有机材料。
S1003、采用精细掩膜版依次在空穴传输层上蒸镀光学调整层、第二子像素发光层，在空穴传输层111上蒸镀第一子像素发光层。其中，光学调整层的材料例如可以为有机材料。第一子像素发光层及第二子像素发光层例如可以包括主体材料及客体材料。
S1004、采用开口掩膜版在第一子像素发光层及第二子像素发光层上依次蒸镀电子传输层、电子注入层、第一电极层及光学耦合层。其中，电子传输层、电子注入层及光学耦合层的材料例如可以为有机材料。
S1005、制作位于第二子像素发光层背离衬底基板一侧的滤光片。其中，在步骤S1005之后还可以包括形成对向基板。
本公开实施例提供的上述阵列基板、其制作方法及显示装置，通过使用滤光片技术提高了阵列基板的分辨率，降低了阵列基板制作过程中产生像素混色的概率，从而降低了制作阵列基板的工艺难度，提高了阵列基板的产品质。并且通过使用像素自发光技术降低了阵列基板的功耗，从而延长了阵列基板的使用寿命，使阵列基板在具有高分辨率的同时功耗较低。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (14)

  1. 一种阵列基板，其中，包括：
    衬底基板，
    位于所述衬底基板一侧的多个像素单元；
    各所述像素单元包括：像素发光层，以及位于所述像素发光层背离所述衬底基板一侧的至少两个不同颜色的滤光片；
    所述像素发光层包括第一子像素发光层和第二子像素发光层；
    同一所述像素单元中，各所述滤光片在所述衬底基板的正投影分别与所述第二子像素发光层在所述衬底基板的正投影具有交叠区域。
  2. 如权利要求1所述的阵列基板，其中，所述第二子像素发光层包括：白色子像素发光层或黄色子像素发光层。
  3. 如权利要求2所述的阵列基板，其中，在所述第二子像素发光层包括黄色子像素发光层时，所述黄色子像素发光层的材料包括：黄光主体材料及黄光客体材料；或者，
    所述黄色子像素发光层的材料包括：红光材料和绿光材料；其中，所述红光材料包括红光主体材料及红光客体材料，所述绿光材料包括绿光主体材料及绿光客体材料。
  4. 如权利要求1所述的阵列基板，其中，所述第一子像素发光层为蓝色子像素发光层。
  5. 如权利要求1所述的阵列基板，其中，所述滤光片包括：红色滤光片和绿色滤光片。
  6. 如权利要求1所述的阵列基板，其中，各所述滤光片在所述衬底基板的正投影不交叠。
  7. 如权利要求6所述的阵列基板，其中，同一所述像素单元中，所述第二子像素发光层在所述衬底基板的正投影覆盖各所述滤光片在所述衬底基板的正投影。
  8. 如权利要求1所述的阵列基板，其中，所述第一子像素发光层与所述第二子像素发光层同层设置。
  9. 如权利要求1所述的阵列基板，其中，所述阵列基板还包括：位于所述滤光片与所述第二子像素发光层之间的第一电极层，以及位于所述衬底基板与所述第二子像素发光层之间的第二电极层。
  10. 如权利要求9所述的阵列基板，其中，所述阵列基板还包括：位于所述第一电极与所述滤光片之间的光学耦合层。
  11. 如权利要求9所述的阵列基板，其中，所述阵列基板还包括：位于所述第一电极与所述第二子像素发光层之间的电子注入层，位于所述电子注入层与所述第二子像素发光层之间的电子传输层，位于所述第二电极与所述第二子像素发光层之间的空穴注入层、位于所述空穴注入层与所述第二子像素发光层之间的空穴传输层。
  12. 如权利要求11所述的阵列基板，其中，所述阵列基板还包括：位于所述第二子像素发光层与所述空穴传输层之间的光学调整层。
  13. 一种显示装置，其中，包括如权利要求1～12任一项所述的阵列基板。
  14. 一种阵列基板的制作方法，其中，包括：
    在衬底基板上的每个像素单元中形成像素发光层；其中，所述像素发光层包括第一子像素发光层和第二子像素发光层；
    在每个所述像素单元中且所述像素发光层背离所述衬底基板一侧形成至少两个不同颜色的滤光片；其中，同一所述像素单元中，各所述滤光片在所述衬底基板的正投影分别与所述第二子像素发光层在所述衬底基板的正投影具有交叠区域。
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