WO2019105294A1 - Élément de cadre intermédiaire, dispositif électronique et procédé de fabrication pour élément de cadre intermédiaire - Google Patents

Élément de cadre intermédiaire, dispositif électronique et procédé de fabrication pour élément de cadre intermédiaire Download PDF

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Publication number
WO2019105294A1
WO2019105294A1 PCT/CN2018/117164 CN2018117164W WO2019105294A1 WO 2019105294 A1 WO2019105294 A1 WO 2019105294A1 CN 2018117164 W CN2018117164 W CN 2018117164W WO 2019105294 A1 WO2019105294 A1 WO 2019105294A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic radiation
main body
body portion
gap
electronic device
Prior art date
Application number
PCT/CN2018/117164
Other languages
English (en)
Chinese (zh)
Inventor
杨璟
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019105294A1 publication Critical patent/WO2019105294A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use

Definitions

  • the present application relates to the field of electronic device technologies, and in particular, to a middle frame assembly, an electronic device, and a method of manufacturing a middle frame assembly.
  • the antenna is the main electronic component that realizes the communication function of the electronic device, and is also one of the indispensable electronic components.
  • the antenna is a separate electronic component, and needs to occupy a certain accommodation space, resulting in the prior art.
  • the electronic components disposed inside the electronic device are inferior in compactness.
  • the embodiment of the present application provides a method for manufacturing a middle frame assembly, an electronic device, and a middle frame assembly to improve compactness of electronic components disposed inside the electronic device.
  • a mid-frame component that includes:
  • main body portion is a flat plate structure
  • An electromagnetic radiation portion the electromagnetic radiation portion being disposed around the main body portion;
  • a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion.
  • An electronic device comprising:
  • the middle frame component includes:
  • main body portion is a flat plate structure
  • An electromagnetic radiation portion the electromagnetic radiation portion being disposed around the body portion;
  • a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion
  • the middle frame assembly is disposed between the display screen and the circuit board, the circuit board is provided with a feeding point and a matching circuit, and the electromagnetic radiation part is electrically connected to the feeding through a matching circuit point.
  • a manufacturing method of a middle frame assembly for supporting a display screen of an electronic device comprising:
  • the substrate being a flat plate structure
  • a patterning process on the substrate to form a frame structure including a main body portion, an electromagnetic radiation portion, and a bracket portion, a first gap is formed between the main body portion and the electromagnetic radiation portion, and the bracket portion is fixed The main body portion and the electromagnetic radiation portion, the bracket portion is located outside the first gap;
  • connection portion in the first gap to fixedly connect the main body portion and the electromagnetic radiation portion
  • At least the bracket portion is removed to form a mid-frame assembly.
  • the method for manufacturing a middle frame assembly, an electronic device, and a middle frame assembly provided by the embodiments of the present application, the middle assembly supporting a component inside the electronic device, the middle frame assembly including a main body portion, an electromagnetic radiation portion, and a connecting portion, the connecting portion is connected between the main body portion and the electromagnetic radiation portion, and the electromagnetic radiation portion is electrically connected to the feeding point through a matching circuit of the circuit board of the electronic device to transmit and receive signals, and at the same time, the supporting effect is achieved and
  • the signal transceiving function improves the compactness of the electronic components disposed inside the electronic device provided by the embodiments of the present application.
  • FIG. 1 is a perspective view showing a structure of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a side view of an electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a middle frame assembly according to an embodiment of the present application.
  • FIG. 4 is a cross-sectional view of the first embodiment of the middle frame assembly shown in FIG. 3 taken along line A-A.
  • Figure 5 is a cross-sectional view of the second embodiment of the middle frame assembly shown in Figure 3 taken along line A-A.
  • Fig. 6 is an enlarged view of a portion C of the middle frame assembly shown in Fig. 5.
  • FIG. 7 is a schematic structural diagram of a combination of a middle frame component and a circuit board according to an embodiment of the present application.
  • FIG. 8 is a first flowchart of a method for manufacturing a middle frame assembly according to an embodiment of the present application. .
  • FIG. 9 is a schematic structural diagram of a substrate of a method for manufacturing a middle frame assembly according to an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a frame structure of a method for manufacturing a middle frame assembly according to an embodiment of the present application.
  • FIG. 11 is a second flowchart of a method for manufacturing a middle frame assembly according to an embodiment of the present application.
  • FIG. 12 is a schematic structural view of a mold of a method for manufacturing a middle frame assembly according to an embodiment of the present application.
  • FIG. 13 is a schematic structural view of a method for manufacturing a middle frame assembly according to an embodiment of the present application, in which a frame structure is placed in a mold.
  • FIG. 14 is a schematic structural view of a frame structure of a method for manufacturing a middle frame assembly according to an embodiment of the present application combined with an injection molding material.
  • Figure 15 is a cross-sectional view taken along line B-B of the structure in which the frame structure of Figure 14 is combined with an injection molding material.
  • a mid-frame component that includes:
  • main body portion is a flat plate structure
  • An electromagnetic radiation portion the electromagnetic radiation portion being disposed around the body portion;
  • a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion.
  • the connecting portion is disposed within the first gap.
  • a plurality of first joint portions are formed on a side of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portions facing the side portions of the main body portion and the electromagnetic radiation portion
  • a second joint is provided, and the first joint and the second joint cooperate with each other.
  • the first joint portion is a protrusion formed by the body portion and the electromagnetic radiation portion toward a side surface of the first gap
  • the second joint portion is the connection portion A depression formed toward a side of the first gap
  • the first joint has a first end and a second end, the first end is connected to the main body or the electromagnetic radiation, and the second end is facing the A gap, the width of the second end being greater than the width of the first end.
  • the thickness of the connecting portion is less than or equal to the thickness of the main body portion.
  • connection portion is further disposed within the second gap.
  • the connecting portion is non-metal.
  • the main body portion and the electromagnetic radiation portion are integrally formed.
  • the main body portion and the electromagnetic radiation portion are both magnesium alloys.
  • An electronic device comprising:
  • the middle frame component includes:
  • main body portion is a flat plate structure
  • An electromagnetic radiation portion the electromagnetic radiation portion being disposed around the body portion;
  • a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion
  • the middle frame assembly is disposed between the display screen and the circuit board, the circuit board is provided with a feeding point and a matching circuit, and the electromagnetic radiation part is electrically connected to the feeding through a matching circuit point.
  • the connecting portion is disposed within the first gap.
  • a plurality of first joint portions are formed on a side of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portions being disposed toward a side of the main body portion and the electromagnetic radiation portion
  • There is a second joint and the first joint and the second joint cooperate with each other.
  • the first joint portion is a protrusion formed by the main body portion and the electromagnetic radiation portion toward a side surface of the first gap
  • the second joint portion is oriented toward the connection portion a recess formed by a side of the first gap
  • the first joint has a first end and a second end, the first end is connected to the main body or the electromagnetic radiation, and the second end is facing the first a gap, the width of the second end being greater than the width of the first end.
  • the thickness of the connecting portion is less than or equal to the thickness of the main body portion.
  • connection portion is further disposed within the second gap.
  • the connecting portion is non-metal.
  • the main body portion and the electromagnetic radiation portion are integrally formed.
  • a manufacturing method of a middle frame assembly for supporting a display screen of an electronic device comprising:
  • the substrate being a flat plate structure
  • a patterning process on the substrate to form a frame structure including a main body portion, an electromagnetic radiation portion, and a bracket portion, a first gap is formed between the main body portion and the electromagnetic radiation portion, and the bracket portion is fixed The main body portion and the electromagnetic radiation portion, the bracket portion is located outside the first gap;
  • connection portion in the first gap to fixedly connect the main body portion and the electromagnetic radiation portion
  • At least the bracket portion is removed to form a mid-frame assembly.
  • an embodiment of the present application provides an electronic device 100 .
  • the electronic device 100 includes a front case 101 and a rear case 102.
  • the front case 101 may include a protective cover 21, a display screen 22, and the like.
  • the front case 101 and the rear case 102 are collectively enclosed as a receiving space to accommodate other constituent elements, such as the middle frame assembly 23, the circuit board 24, the battery 25, and the like.
  • the front case 101 and the rear case 102 may be metal housings. It should be noted that the materials of the front case 101 and the rear case 102 in the embodiments of the present application are not limited thereto, and other methods may be used.
  • the front case 101 and the rear case 102 may include a plastic part. And metal parts.
  • the front case 101 and the rear case 102 may be plastic housings.
  • the protective cover 21 can be a glass cover, a sapphire cover, a plastic cover, etc., and provides protection to the display screen 22 to prevent dust, moisture or oil stains from adhering to the display screen 22, and avoiding The external environment corrodes the display screen 22, while preventing the impact of the external environment on the display screen 22, and avoiding the breakage of the display screen 22.
  • the protective cover 21 may include a display area 221 and a non-display area 222.
  • the display area 221 is transparent to correspond to the light exit surface of the display screen 22.
  • the non-display area 222 is non-transparent to shield the internal structure of the electronic device.
  • the non-display area 222 can be provided with an opening 2221 for sound and light conduction, a touch button 2222, and the like.
  • the electronic device 100 of the embodiment of the present application can also be designed in a full screen without retaining the non-display area.
  • the electronic device 100 may be provided with a headphone hole 105, a microphone hole 106, a speaker hole 108, and a universal serial bus interface hole 107 at its periphery.
  • the earphone hole 105, the microphone hole 106, the speaker hole 108, and the universal serial bus interface hole 107 are all through holes.
  • the middle frame assembly 23 is disposed in the receiving space to support the entire electronic device 100.
  • one side of the middle frame assembly 23 faces the front case 101 for setting the display screen 22, and the other side is disposed toward the rear case 102 for setting the circuit board. 24 and the battery 25.
  • the middle frame assembly 23 includes a main body portion 2311, an electromagnetic radiation portion 2312, and a connecting portion 233.
  • the main body portion 23 is a flat plate structure.
  • the electromagnetic radiation portion 2312 is provided around the main body portion 2311.
  • the connecting portion 233 is disposed between the main body portion 2311 and the electromagnetic radiation portion 2312 to fix the main body portion 2311 and the electromagnetic radiation portion 2312.
  • the electromagnetic radiation portion 2312 is installed inside the electronic device 100.
  • the electromagnetic radiation portion 2312 is for transmitting a wireless signal to the outside or receiving a wireless signal transmitted by another electronic device.
  • the electromagnetic radiation portion 2312 may be, for example, a radio frequency antenna, a Bluetooth antenna, a wireless fidelity (WiFi) antenna, or the like.
  • the electromagnetic radiation portion 2312 is staggered on the display screen 22 to reduce electromagnetic interference and enhance signal quality.
  • a first gap 232 is defined between the main body portion 2311 and the electromagnetic radiation portion 2312, and the connecting portion 233 is disposed within the first gap 232.
  • the terms "first” and “second” are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the main body portion 2311 and the electromagnetic radiation portion 2312 may be integrally formed. Both the main body portion 2311 and the electromagnetic radiation portion 2312 may be made of a magnesium alloy.
  • the connecting portion 233 is made of a non-metal material.
  • a plurality of first joint portions 237 are formed on the side of the main body portion 111 and the electromagnetic radiation portion 2312 toward the first gap 232.
  • the connecting portion 233 is provided with a second joint portion 238 toward a side surface of the main body portion 2311 and the electromagnetic radiation portion 2312.
  • the first joint portion 237 and the second joint portion 238 cooperate with each other to enhance the joint strength between the main body portion 2311 and the electromagnetic radiation portion 2312.
  • the first joint portion 237 is a protrusion formed by the main body portion 2311 and the electromagnetic radiation portion 2312 toward a side surface of the first gap 232, and the second joint portion 238 is the connection.
  • the portion 233 is formed toward a recess of the side surface of the first gap 232.
  • the first bonding portion 237 is a "T" type structure.
  • the first joint portion 237 has a first end 2371 and a second end 2372.
  • the first end 2371 is connected to the main body portion 2311 or the electromagnetic radiation portion 2312, and the second end 2372 faces the first gap 232.
  • the width D2 of the second end 2372 is greater than the width D1 of the first end 2371.
  • the connecting portion 233 When the connecting portion 233 is formed, the first end 2371 and the second end 2372 of the first joint portion 237 are fitted into the second joint portion 238 of the connecting portion 233, and the main body portion 2311 is added.
  • the bonding strength between the electromagnetic radiation portion 2312 and the connecting portion 233 improves stability.
  • the thickness of the connecting portion 233 is less than or equal to the thickness of the main body portion 2311.
  • a second gap 236 is further formed between the electromagnetic radiation portions 2312, and the connecting portion 233 is further disposed within the second gap 236.
  • the circuit board 24 is mounted in the electronic device 100, and the circuit board 24 may be a main board of the electronic device 100.
  • One or two of the functional components 60 such as a motor, a microphone 62, a speaker 64, a headphone interface 61, a universal serial bus interface 63, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the circuit board 24.
  • the circuit board 24 may be integrated with a microphone 62, a speaker 64, a headphone jack 61, and a universal serial bus interface 63.
  • the earphone interface 61 is disposed at the position of the earphone hole 105
  • the microphone 62 is disposed at the position of the microphone hole 106
  • the universal serial bus interface 63 is disposed at the position of the universal serial bus interface hole 107
  • the speaker 64 is disposed at the position of the speaker hole 108.
  • the circuit board 24 is secured within the electronic device 100.
  • the circuit board 24 can be screwed to the middle frame assembly 23 by screws, or can be snapped onto the middle frame assembly 23.
  • the manner in which the circuit board 24 of the embodiment of the present application is specifically fixed to the middle frame assembly 23 is not limited thereto, and may be otherwise fixed, for example, by a buckle and a screw.
  • the circuit board 24 is provided with a feeding point 241 and a matching circuit 242.
  • the electromagnetic radiation portion 2312 is electrically connected to the feeding point 241 through a matching circuit 242.
  • the battery 25 is mounted in an electronic device 100 that is electrically connected to the circuit board 24 to provide power to the electronic device 100.
  • the back cover 102 can serve as a battery cover for the battery 25.
  • the back cover 102 covers the battery 25 to protect the battery 25, specifically, the back cover 102 covers the battery 25 to protect the battery 25, and reduces the collision of the battery 25 due to the electronic device 100. Damage caused by falling, etc.
  • an embodiment of the present application provides a method of manufacturing the middle frame assembly 23 .
  • the method includes:
  • Step S1 Referring to FIG. 9 together, a substrate 230 is provided.
  • the substrate 230 is a flat plate structure.
  • the substrate 230 is made of a metallic material.
  • Step S2 Referring to FIG. 10 together, the substrate 230 is patterned to form a frame structure 231.
  • the frame structure 231 includes a main body portion 2311, an electromagnetic radiation portion 2312, and a bracket portion 2313.
  • a first gap 232 is formed between the 2311 and the electromagnetic radiation portion 2312.
  • the bracket portion 2313 fixes the main body portion 2311 and the electromagnetic radiation portion 2312, and the bracket portion 2313 is located outside the first gap 232.
  • the substrate 230 may be patterned by stamping to form the frame structure 231. In some embodiments, the substrate 230 may also be patterned by etching to form the frame structure 231. In other embodiments, the substrate 230 may also be patterned by a numerically controlled machine tool (CNC) to form the frame structure 231.
  • CNC numerically controlled machine tool
  • Step S3 Referring to FIGS. 11-15 together, at least the first gap 232 is provided with a connecting portion 233 for fixedly connecting the main body portion 2311 and the electromagnetic radiation portion 2312.
  • the step S3 may include:
  • Step S31 Referring to FIG. 12, a mold 234 is provided.
  • the mold 234 includes a receiving portion 2341.
  • Step S32 Referring to FIG. 13, the frame structure 231 is placed in the receiving portion 2341 of the mold 234.
  • Step S33 filling the liquid injection molding material 235 in the receiving portion 2341.
  • Step S34 Referring to FIG. 14, the injection molding material 235 is cured to remove the mold 234.
  • Step S35 Referring to FIG. 15, the injection molding material 235 is trimmed such that the thickness H1 of the injection molding material 235 is less than or equal to the thickness H2 of the frame structure 231.
  • the injection molding material 235 is a thermoset material or a photocurable material.
  • the liquid injection molding material 235 may be cured by baking.
  • the injection molding material 235 is a photocurable material, the liquid injection molding material 235 may be irradiated with ultraviolet light for curing.
  • the middle frame assembly 23 manufactured by the embodiment of the present application can be improved. Surface flatness.
  • the connecting portion 233 can be fixedly connected to the main body. Under the premise of the portion 2311 and the electromagnetic radiation portion 2312, the weight of the middle frame assembly 23 manufactured by the embodiment of the present application can be reduced, thereby adapting to the current trend of light and thin electronic devices.
  • Step S4 at least the bracket portion 2313 is removed to form the middle frame assembly 23.
  • the method for manufacturing a middle frame assembly, an electronic device, and a middle frame assembly provided by the embodiments of the present application, the middle assembly supporting a component inside the electronic device, the middle frame assembly including a main body portion, an electromagnetic radiation portion, and a connecting portion, the connecting portion is connected between the main body portion and the electromagnetic radiation portion, and the electromagnetic radiation portion is electrically connected to the feeding point through a matching circuit of the circuit board of the electronic device to transmit and receive signals, and at the same time, the supporting effect is achieved and
  • the signal transceiving function improves the compactness of the electronic components disposed inside the electronic device provided by the embodiments of the present application.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Des modes de réalisation de la présente invention concernent un élément de cadre intermédiaire, un dispositif électronique et un procédé de fabrication de l'élément de cadre intermédiaire. L'élément de cadre intermédiaire joue un rôle dans des composants de support à l'intérieur du dispositif électronique; l'élément de cadre intermédiaire comprend une partie de corps principal, une partie de rayonnement électromagnétique et une partie de connexion; la partie de liaison est connectée entre la partie de corps principal et la partie de rayonnement électromagnétique; et la partie de rayonnement électromagnétique est électriquement connectée à un point d'alimentation au moyen d'un circuit d'adaptation d'une carte de circuit imprimé du dispositif électronique pour émettre et recevoir des signaux; en même temps, l'effet de support et la fonction d'émission-réception de signal sont tous les deux réalisés.
PCT/CN2018/117164 2017-12-01 2018-11-23 Élément de cadre intermédiaire, dispositif électronique et procédé de fabrication pour élément de cadre intermédiaire WO2019105294A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711251660.7 2017-12-01
CN201711251660.7A CN108012002A (zh) 2017-12-01 2017-12-01 中框组件、电子设备及中框组件的制造方法

Publications (1)

Publication Number Publication Date
WO2019105294A1 true WO2019105294A1 (fr) 2019-06-06

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WO (1) WO2019105294A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012002A (zh) * 2017-12-01 2018-05-08 广东欧珀移动通信有限公司 中框组件、电子设备及中框组件的制造方法

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Publication number Priority date Publication date Assignee Title
CN204168352U (zh) * 2014-10-28 2015-02-18 广东欧珀移动通信有限公司 金属手机壳体及手机
CN205846212U (zh) * 2016-07-01 2016-12-28 瑞声科技(新加坡)有限公司 全频带手机天线结构
CN206181107U (zh) * 2016-08-26 2017-05-17 博罗县东明化工有限公司 手机中框及手机
CN107394354A (zh) * 2017-08-07 2017-11-24 广东欧珀移动通信有限公司 背板、前壳以及电子设备
CN108012002A (zh) * 2017-12-01 2018-05-08 广东欧珀移动通信有限公司 中框组件、电子设备及中框组件的制造方法

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Publication number Priority date Publication date Assignee Title
CN107293847A (zh) * 2017-07-31 2017-10-24 广东欧珀移动通信有限公司 中框、天线组件及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204168352U (zh) * 2014-10-28 2015-02-18 广东欧珀移动通信有限公司 金属手机壳体及手机
CN205846212U (zh) * 2016-07-01 2016-12-28 瑞声科技(新加坡)有限公司 全频带手机天线结构
CN206181107U (zh) * 2016-08-26 2017-05-17 博罗县东明化工有限公司 手机中框及手机
CN107394354A (zh) * 2017-08-07 2017-11-24 广东欧珀移动通信有限公司 背板、前壳以及电子设备
CN108012002A (zh) * 2017-12-01 2018-05-08 广东欧珀移动通信有限公司 中框组件、电子设备及中框组件的制造方法

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