WO2019099754A1 - System and method for improved electronic component interconnections - Google Patents
System and method for improved electronic component interconnections Download PDFInfo
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- WO2019099754A1 WO2019099754A1 PCT/US2018/061395 US2018061395W WO2019099754A1 WO 2019099754 A1 WO2019099754 A1 WO 2019099754A1 US 2018061395 W US2018061395 W US 2018061395W WO 2019099754 A1 WO2019099754 A1 WO 2019099754A1
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- Prior art keywords
- tray
- substrate
- magnet
- aca
- alignment
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 141
- 230000004907 flux Effects 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 9
- 150000002910 rare earth metals Chemical class 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 238000013507 mapping Methods 0.000 claims description 4
- 208000036758 Postinfectious cerebellitis Diseases 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 32
- 239000000203 mixture Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910052779 Neodymium Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000006249 magnetic particle Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 241000127225 Enceliopsis nudicaulis Species 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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- 230000000717 retained effect Effects 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Definitions
- This relates generally to establishing electrical connection of components in electronic circuitry. More particularly, this relates to improved methods for connecting components to a substrate using anisotropic conductive adhesives.
- circuitry is present on such components in ever-smaller spaces (i.e. the density of the circuitry has increased), with far tighter tolerances between different aspects of e.g. a given chip or component (i.e. the pitch has gotten smaller - "ultra-small pitch”).
- inter-connections such as traditional solder, anisotropic conductive films (ACFs), and anisotropic conductive adhesives (ACAs)
- ACFs anisotropic conductive films
- ACAs anisotropic conductive adhesives
- ACFs have been developed. These conductive films can reduce the local heat required for connection by soldering, but they can still require significant heat. In addition, both heat and pressure are generally applied to the components, which can be a significant limitation for sensitive components. ACFs also have a limitation with regards to the pitch of interconnections that it is suitable for or can accommodate.
- ACAs have also been developed to provide alternative solutions for creating difficult interconnects in particular applications. As with ACFs, these adhesives provide electrical conductivity in the Z-axis only. ACAs such as those produced by SunRay Scientific comprise magnetically-alignable particles that form interconnects among components when the particles are aligned along the Z-axis by exposure to a magnetic field. The adhesive matrix is then cured by e.g.
- ACAs good candidates for pressure-sensitive components. Further, curing may be accomplished in low heat for temperature sensitive components. Moreover, ACAs allow finer pitch applications than can be achieved using ACFs.
- the magnetic field applied across the large area includes the entire magnetic field, including flux lines that are not generally very perpendicular to the X-Y plane.
- connections in terms of the height, number and direction of the Z-axis columns.
- the methods allow for the construction of what the inventor calls a 'magnetic pallet' that provides consistent and optimal alignment and curing of ACA-based interconnects.
- the methods can provide
- this disclosure provides novel methods of aligning
- ACA magnetically-alignable anisotropic conductive adhesive
- the first electronic component to be placed on and connected to the
- Steps a) -d) are repeated for each additional component to be
- the method further comprises the steps of:
- the alignment tray and the magnetic tray are made of
- the magnet tray is adapted to receive and retain the first and each additional magnet in their respective placement locations on the tray.
- the assembled magnet tray (with magnets in place), and the alignment tray (with substrate populated with components and ACA) can be placed as an assembly directly into a curing oven.
- ACA magnetically-alignable anisotropic conductive adhesive
- the systems generally comprise a magnet tray comprising a nonmagnetic tray adapted to receive and retain each of one or more magnets placed therein in a location that corresponds to the location of one or more electronic components on a substrate to which the components are to be connected.
- the systems also comprise an alignment tray adapted to retain a substrate populated with one or more components to be connected thereto with an ACA during alignment and curing of the ACA.
- the systems also include an ACA comprising magnetically- alignable particles capable of forming interconnections conductive in the Z-axis.
- Both the alignment tray and the magnetic tray are preferably made of nonmagnetic material. If various embodiments, the substrate can only be placed in the alignment tray in one orientation.
- the magnets are permanent magnets.
- the magnetic flux lines are substantially parallel to each other and substantially perpendicular to the X-Y plane in an area corresponding to the area of the substrate upon which the component and ACA are located.
- the magnetic flux lines consist essentially of lines parallel to each other and perpendicular to the area of the substrate upon which the component and ACA are located.
- this disclosure provides kit for creating
- kits generally comprise:
- At least one magnetic tray comprising a nonmagnetic tray adapted to retain one or more magnets in locations corresponding to a desired placement of an electronic component on and connection of the component to a substrate using an ACA; [36] sufficient magnets to complete the magnet tray, each magnet of a desired size and strength for making an interconnection between the component and the substrate using the ACA;
- At least one alignment tray adapted to receive and retain the
- an ACA suitable for use with the kit to create at least one interconnect between a component and a substrate using the kit is
- the magnet tray and the alignment tray are configured to be oriented vertically with respect to each other. They are assembled such that an electronic component placed on a substrate (to be connected thereto with an ACA) on the alignment tray is brought into vertical alignment with a magnet on the magnet tray when the magnet tray and the alignment tray are assembled in that manner.
- Each component requiring a connection (interconnect) has a corresponding magnet with which it will be aligned when the trays are assembled.
- rare earth magnets or other permanent magnets.
- this disclosure provides oven systems
- the oven systems generally comprise a curing oven and one or more shelves or racks each comprising
- an alignment tray adapted to receive and retain a substrate
- FIG. V A cross-sectional overview of an embodiment of the system for
- magnetically aligning and curing ACA interconnects showing a magnet tray with magnets positioned therein, an alignment tray, substrate and components populated thereon.
- Fig. 2 A flow chart showing the steps of a method of magnetically aligning and curing components to substrate using an ACA to create the electrical connection.
- FIG. 3 A drawing showing an embodiment of an alignment tray for use
- the tray contains a plurality of substrates each with a populated component to be placed on and connected to the substrate.
- FIG. 4 A drawing showing an embodiment of an oven employing the
- AC A anisotropic conductive adhesive
- ACF anisotropic conductive film
- Gs Gauss, magnetic field units
- NIB neodymium-iron-boron
- PCB printed circuit board
- T Tesla, magnetic field units, SI.
- substantially may mean an amount that is larger or smaller than a reference item.
- substantially larger (or greater) or smaller (or lesser) means by at least about 10% to about 100% or more than the
- substantially in such instances means at least about 20% to about 100%, or more, larger or smaller than the reference item.
- the term 'substantially' can also be used as in “substantially all” which mean more than 51%, preferably more than 60%, 67%, 70%, 75%, 80%, 85%, 90%, or more of a referenced item, number, or amount.
- “Substantially all” can also mean more then 90% including 91, 92, 93, 94, 95, 96, 97, 98, 99 or more percent of the referenced item, number, or amount.
- references “a”, “an”, and “the” are generally inclusive of the plurals of the respective terms.
- reference to “an electrode” or “a diode” includes a plurality of such “electrodes” or “diodes”.
- ranges are provided in shorthand, so as to avoid having to list and describe each and every value within the range. Any appropriate value within the range can be selected, where appropriate, as the upper value, lower value, or the terminus of the range.
- alignment means aligning a magnetic material
- aligning refers to the arrangement of magnetic particles in the Z-axis under the influence of a magnetic field. Alignment is the process by which columns are formed in the Z-axis. As will be clear from the context, sometimes 'alignment' is also used herein to refer to ensuring the proper orientation of two things with respect to each other - such as the alignment tray and the magnetic tray, or the substrate and the alignment tray.
- the process of column formation is sometimes referred to as 'alignment'.
- the column properties (e.g. height, diameter, etc.) will be determined by the strength of the magnets and the properties of the ACA including the size and amount of the magnetic particles in the ACA, and the viscosity and other physical properties of the ACA matrix. Columns can and will form within seconds of exposure to a suitable magnetic field.
- a "magnet” is capable of producing a “magnetic field” which as used herein includes any magnetic field whether produced by an electromagnet or a permanent magnet.
- the "strength" of a magnet can be measured in Gs (or Ts). The skilled artisan will appreciate how to determine the strength of any given magnet, or how to determine the magnetic strength desired for a given magnet.
- Mapping a magnetic field means determining the specific shape of the magnetic field and path of the magnetic field lines. The skilled artisan will appreciate how to map the magnetic field of any magnet through various means.
- a "permanent magnet” means a magnet that does not require electrical current to flow in order to have a persistent magnetic field.
- Permanent magnets for use herein can comprise iron, nickel, cobalt, and rare earth metals. Certain presently preferred embodiments herein utilize rare earth magnets such as those comprising lanthanoid elements. Magnets comprising neodymium, or salts thereof, may be useful herein because of their magnetic strength. In one embodiment, the magnets comprise neodymium, iron, and boron ("NIB magnets"). Samarium, gadolinium, and even dysprosium, and salts thereof may be used for specific applications. Other types of permanent magnets such as ceramic magnets and other composite magnets, and even flexible magnets may be suitable for use herein for other specific applications.
- an "interconnect” is generally a connection between any two aspects of a system. Interconnect herein generally reflects an electrical
- Substrate is any material used to hold or contain other electronic components connected thereon for use in an electronic system or device, such as a printed circuit board ('PCB').
- Substrates can be flexible or rigid.
- Preferred rigid substrates include e.g. PCBs, composites, and rigid polymers; preferred flexible supports include e.g., flexible polymers.
- parallel means that two lines, such as lines representing magnetic flux are always the same distance apart and never touch each other and exist in the same plane, i.e. they are at 0 degrees with respect to each other.
- Parallel lines herein are generally reference magnetic flux lines in the Z-axis, which are generally perpendicular (i.e. 90 degrees) to the X-Y plane of the substrate. Because of the difficulty of having perfectly parallel flux lines throughout entire applications involving multiple magnets, parallel lines in various embodiments herein may include lines that are "substantially parallel" to each other and/ or substantially perpendicular to the X-Y. Such lines may be positioned at e.g. about -30 to about 30 degrees with respect to each other, and/ or at about 60 to about 120 degrees with respect to the Z-Y plane. More preferably such lines are positioned at e.g. about -15 to about 15 degrees with respect to each other, and/ or about 75 to about 105 degrees with respect to the Z- Y plane.
- substantially parallel flux lines are positioned at e.g. about -5 to about 5 degrees with respect to each, and/ or about 85 to about 95 degrees with respect to the X-Y plane of the substrate. Even more preferably the substantially parallel lines will be positioned within about 0 to about 2 degrees of each other and/ or within about 0 to about 2 degrees of perpendicular to the X-Y plane.
- the skilled artisan will appreciate that the more the magnetic flux lines approximate parallel to each other and perpendicular to the X-Y plane, the more the ACA will form parallel columns during the alignment which will be the basis of the interconnect, and the less shorts and other defects that negatively impact either the functionality or the durability of the interconnects so formed will be present.
- Z-axis means the direction that is perpendicular to the main plane in which the substrate lies, i.e. the X-Y plane.
- Systems and methods for creating improved and more consistent electronic interconnects with ACAs in electronic circuits are provided herein.
- Such systems generally comprise individual magnets placed in a location corresponding to each component being connected. The size and strength of each magnet is determined based on the component, the substrate, the ACA in use, and the application in question. Only components being connected with the ACA are exposed to any magnetic field, meaning sensitive components are not exposed to unneeded magnetic fields.
- the optimized interconnects provide better yields, less shorts and other failures, and longer lifetimes / more cycles.
- the inventors have surprisingly discovered that by employing strategic selection of magnet size, strength, and placement, the consistency and quality of interconnects can be substantially improved.
- disclosed herein are methods and systems for improving the creation of interconnects using ACAs.
- conductive adhesive generally comprise the steps of:
- the first electronic component to be placed on and connected to the
- Steps a) -d) are repeated for each additional component to be
- the method further comprises the steps of creating a magnetic tray and securing each magnet in its respective placement location on the tray; and creating an alignment tray and adapting the alignment tray to retain the substrate during alignment of the ACA in the Z-axis (i.e. column formation) and curing.
- the substrate is then placed on the alignment tray.
- the ACA is applied to the substrate where the components will be placed.
- the substrate is then populated with the first and each additional component.
- the alignment tray (including the substrate, components to be used
- the alignment tray and the magnetic tray are made of nonmagnetic material, such as aluminum or thermostable materials, such as plastics or composites.
- the magnet tray is generally adapted to receive the first and each additional magnet in their respective placement locations on the tray.
- the completed assembly comprising the magnet tray with magnets, and the alignment tray with substrate populated with components and ACA can be placed in a curing oven.
- the magnets comprise permanent magnets.
- magnets comprise rare earth magnets in one presently preferred embodiment.
- Rare earth magnets comprising neodymium or NIB magnets are used in one embodiment.
- interconnections can be determined empirically for each application to optimize the consistency and quality of the interconnects formed.
- selecting the size and strength of a particular magnet will relate to the process of column formation, and the magnet selection will be influenced by the desired properties of the columns, such as height, diameter, and the strength of the column.
- the connections of the column to both the component and the substrate are influenced by the magnet properties as well.
- the size and strength of the magnets are the same.
- Such attributes may include the height of the columns, the interconnection strength, the number of resultant shorts, the expected lifetime of the completed device or board, the yield of usable product, or the failure rate or number of rejects resulting from the process of creating the interconnections.
- the inventor has also determined that distinct benefits arise from utilizing magnetic flux lines that are substantially parallel to each other and/ or
- the magnetic flux lines consist essentially of such parallel and/ or perpendicular lines.
- the ACA forms substantially uniform columns in terms of height and diameter as a result of utilizing the methods provided.
- the ACA forms substantially uniform columns that are substantially perpendicular to the X-Y plane of the component and the substrate.
- the geometry of portion of the alignment tray that accommodates and / or retains the substrate is configured so that the substrate can only be placed in the alignment tray in one orientation.
- the alignment tray comprise alignment means such as placement pins, complementary structure, or the like to ensure the magnetic tray and the alignment tray can only be assembled in the proper orientation with respect to each other.
- the geometry of the alignment and magnetic trays only allows assembly in one (proper orientation). The skilled artisan will appreciate that there are a number of simply ways to provide for proper orientation. Again, such features will further increase consistency and allow any technician to use the method for production.
- the methods allow an assembly comprising the positioned magnet tray and alignment tray to be placed directly into a curing oven.
- the alignment tray and the magnet tray comprise materials that can withstand curing conditions for curing the ACA.
- the trays are aluminum or thermostable, nonmagnetic materials that can withstand e.g. 50-70 C, 60-80 C, 70-100 C, 75-120 C, 100-140 C, or even greater temperatures. It is expected that lower temperature curing methods will continue to be developed, in which case the materials used to the alignment and magnet trays can be revised accordingly.
- FIG. 2 shows a flow chart for one embodiment 200 of the methods described herein. As can be seen the methods generally start with an understanding of the substrate and the components to be placed thereon and connected thereto using the ACA as noted in step 210. The dimensions and location of each component can be mapped out to allow the design of a magnet tray and a determination of the placement location 220 of each magnet required.
- the size and strength of each magnet can be determined 225 based on the specifics of the application.
- the properties of the magnetic field, e.g. the magnetic flux lines for each magnet can be determined or mapped out 230.
- the skilled artisan will understand how to determine the size, strength, and magnetic flux lines for each magnet required.
- the skilled artisan will also appreciate that order of the foregoing steps may be altered as might be preferable in a given application.
- the properties of the magnet(s) will influence the development and formation of the columns in the Z-axis within the ACA. Stronger magnets will allow higher columns that form faster, however it is not desirable to have the magnet be too strong. In various embodiments, the ideal properties of the magnets are determined empirically for any given application.
- a magnet tray is created 235 and the magnets selected for the job are secured in their respective locations 240. It is understood that the magnet tray is designed to accommodate each of the magnets in its respective locations by any useful means that does not alter the position or magnetic field of the magnet with respect to the component and substrate.
- the magnetic tray is made of aluminum with holes cut out at the locations where each of the magnets is to be placed. The magnets may be secured in place 240 by any means again provided it does not alter the strength or flux lines of the magnet. Adhesives can be conveniently used to secure the magnets in the magnet tray in certain embodiments.
- An alignment tray is created 245 to serve as a carrier for the substrate and components and to ensure the substrate and each component populated thereon aligns with the corresponding magnet in the magnet tray.
- the alignment tray is adapted 250 to receive and retain the substrate during the alignment of the ACA and the subsequent curing.
- the tray can be adapted by any mean to secure the substrate during the process of creating the interconnections. In one
- a recessed area complementary to the shape of the substrate is created to receive and restrain the substrate passively during the process.
- the substrate can only be received in one orientation in the alignment tray, thereby minimizing the risk of misalignment with the magnets in the magnet tray.
- the ACA is applied 265 to the substrate at the locations where the
- components will be placed 260.
- the steps may vary, e.g. the components may be populated and the ACA may be applied at the same time.
- the skilled artisan will also appreciate the order of operation here may so vary provided the end result is that each component is correctly placed on the substrate in the desired location with the desired amount of AC A in between the two.
- the alignment tray and the magnet tray are then brought into proximity with each other.
- the trays must be brought into alignment while positioned vertically with respect to each. This is enforced by structure which prevent sliding the alignment tray with the substrate across the magnetic fields of the magnets in the magnet tray and initiating improper column formation.
- the column formation is optimized and restricted to substantially the Z-axis.
- the oven may be a batch oven wherein the assemblies are manually moved in and out of the oven, or it may be a semicontinuous or even continuous over, such as a reflow oven wherein the assemblies travel along a conveyor through the oven.
- flipping' can occur with certain components. If a component is magnetically polar - i.e. if the component has e.g. two separated magnetic poles, when exposed to the magnetic field of the magnet tray the component will 'flip' to align itself with the magnetic field. Because the ACA is not yet aligned or cured when the system is exposed to the magnet tray, there is nothing to prevent the chip(s) from doing so. In extreme cases the component could be pulled entirely from the substrate. While this only happens with certain components, if present it poses a problem. The inventor has developed a simple solution to solve this issue if such a component is present. It requires including an additional 'tacking' step to secure the component / chip prior to exposure to the magnet tray.
- the components of concern are secured to the substrate.
- One useful way is to apply a small amount of epoxy to hold the susceptible component in place in the presence of the magnetic field.
- Present methods include the use of UV-curable epoxy applied as a dab sufficient to secure the component, followed by a brief exposure to UV light of sufficient intensity and duration to ensure the epoxy is cured.
- the assembly of substrate, component, and ACA can then be placed in proper proximity to the magnet tray to allow the Z-axis columns to form without concerns regarding components / chips flipping.
- this disclosure provides systems for creating interconnects between a substrate and electronic components attached thereto using a magnetically-alignable anisotropic conductive adhesive (ACA).
- ACA magnetically-alignable anisotropic conductive adhesive
- the system comprises a magnet tray comprising a nonmagnetic tray adapted to receive and retain each of one or more magnets placed therein in a location that corresponds to the location of one or more electronic components on a substrate to which the components are to be connected.
- the system also comprises an alignment tray adapted to receive a substrate populated with one or more components to be connected thereto with an ACA.
- the alignment tray can retain the substrate during the alignment and curing of the ACA.
- the system also comprises an ACA comprising magnetically-alignable
- ACA formulation can be varied for specific applications as may be dictated by the electronic components or the nature of the device for which components are being interconnected.
- ACAs may be formulated with e.g. different sized electromagnetic/ conductive particles for applications having different pitch requirements.
- the alignment tray and the magnetic tray are made of nonmagnetic material.
- the substrate can only be placed in the alignment tray in one orientation to avoid confusion and mistakes and to allow nontechnical staff to assist with production.
- the magnet tray and the alignment tray are adapted to be arranged together vertically in removable fashion such that the components on the substrate are vertically aligned with the magnets in the magnet tray and the ACA is exposed to the magnetic field such that the flux lines are substantially perpendicular to an X-Y plane defining the substrate. Such arrangement is preferably maintained until curing of the ACA is complete.
- the magnets are permanent magnets.
- Rare earth magnets are useful for many applications herein, including magnets that comprise neodymium, such as NIB magnets. These magnets can provide a strong magnetic field.
- substrate populated with components can be placed directly into a curing oven in one embodiment. This enables the aligned ACA to be cured with minimal movement and little risk of disturbing the columns formed in the Z-axis upon exposure to the magnetic field.
- the assembly and/ or the magnet tray serves as a rack that can slide into the oven directly and does not requires any supporting shelf or additional rack for use.
- the assembly can be placed on a conveyor mechanism for use with a
- the conveyor may include a multitude of different assemblies with the same of different configurations of substrates and components - each matched with its own magnetic tray designed according to the specifics and the components and substrate to be interconnected.
- the magnetic flux lines are substantially parallel to each other and substantially perpendicular to the X-Y plane in an area corresponding to the area of the substrate upon which the component and ACA are located.
- substantially uniform columns which are substantially perpendicular to the X-Y plane of the component and the substrate in various embodiments.
- FIG 1 depicts an embodiment 100 of the system for magnetically aligning and curing ACA interconnects illustrating certain features of the system. Shown is a cross-sectional view of an embodiment for magnetically aligning and curing ACA interconnects showing a nonmagnetic magnet tray 110 with a plurality of magnets 120 positioned therein.
- the magnet tray 110 has openings (not numbered for convenience and clarity) to
- An alignment tray 130 has a recess that receives the substrate 140 which is retained in place during the alignment and curing of the ACA to form the interconnects.
- Substrate 140 has a plurality of electronic components 150 positioned thereon. ACA (not shown) is applied / positioned (or likely has been applied) between the
- each of magnets 120 corresponds to the location of component 150 on substrate 140 so that the magnets 120 are vertically aligned with the components 150.
- the magnetic field provides the force to align electromagnetic particles of the ACA (not shown) to form the Z-axis column.
- the area covered by each of magnets 120 is larger than the area covered by the corresponding component 150, such that the system 100 provides more optimal and consistent alignment as compared to prior art electromagnets that cover the entire surface of the substrate, or magnets that are the same size as the
- Fig. 3 depicts an embodiment of an alignment tray 300 illustrating various aspects thereof.
- the single tray 310 depicted comprises a plurality of substrates (not shown), each having a single component 320.
- a single alignment tray may hold a single substrate with one or more components.
- the presence of alignment means 330 are holes in this embodiment allow for proper alignment using e.g. pins or rods, with a magnet tray (not shown) such that the magnet tray and alignment tray are vertically arranged and the magnets in the magnet tray are aligned with the corresponding component to be interconnected to the substrate on the alignment tray.
- the alignment trays may include simple features e.g., varying hole geometry, hole patterns or offsets, differing hole size, a combination of holes and pins, along with complementary structures in the magnet tray to ensure the alignment tray and the magnet tray can only be aligned in a single orientation with respect to each other.
- the skilled artisan will appreciate that there are many art recognized methods for achieving proper alignment between two such objects.
- the disclosure provides kits for creating interconnects between a substrate and electronic components attached thereto using a magnetically-alignable anisotropic conductive adhesive.
- the kits generally comprise:
- At least one magnetic tray comprising a nonmagnetic tray adapted to retain one or more magnets in locations corresponding to a desired placement of an electronic component on and connection of the component to a substrate using an AC A;
- At least one alignment tray adapted to receive and retain the substrate and components populated thereon during the alignment and curing of the ACA to form the interconnect.
- kits further comprise an ACA suitable for use with the kit to create interconnects between components and the substrate using the kit.
- the magnet tray and the alignment tray are generally configured to be
- the oriented and assembled magnet tray and alignment tray can be placed into a curing oven.
- the magnet tray or the assembled trays function as a rack in the oven, or a rack for conveying into a semicontinuous or continuous oven such as a reflow oven, or a curing tunnel.
- the magnetic flux lines are substantially parallel to each other and substantially perpendicular to the X-Y plane in an area corresponding to the area of the substrate upon which the component is located.
- an ACA positioned between the substrate and a component thereon forms substantially uniform columns that are substantially perpendicular to the X-Y plane of the component and the substrate when the trays are oriented and assembled.
- the disclosure provides oven systems for creating interconnections between a substrate and an electronic component to be placed thereon and connected thereto using an ACA.
- the systems operate generally as described above for other systems described herein and in accordance with the methods.
- the oven systems comprise a curing oven and one or more shelves or racks each comprising a magnetic tray fitted with one or more magnets each placed in a location corresponding to the location of an electronic component to be placed on and connected to a substrate using an ACA; and an alignment tray adapted to receive and retain a substrate populated with one or more components to be placed thereon and connected via an ACA.
- the magnets in one embodiment are permanent magnets. Rare earth magnets are useful for many applications herein, including magnets that comprise neodymium, such as NIB magnets.
- the magnetic flux lines are substantially parallel to each other and substantially perpendicular to the X-Y plane in an area corresponding to the area of the substrate upon which the component and ACA are located.
- the ACA forms substantially uniform columns, which are substantially perpendicular to the X-Y plane of the component and the substrate in various embodiments.
- FIG 4 An embodiment 400 of the oven system is shown in FIG 4.
- each assembly 450 of a magnet tray 410 and an alignment tray 420 can serve as a rack 425 in the batch oven 401 which is generally designed to accommodate a plurality of such racks 425.
- a magnified view of an assembly 450 is shown as inset Fig 4B, which comprises an assembled magnet tray 410 and alignment tray 420 retaining the substrate, components and the ACA (generally, 430) during alignment of the columns in the Z-axis, and throughout the curing process.
- the alignment holes 435 ensure that the assembly can only be put together in the proper orientation.
- Inset Fig 4C shows a separate magnet tray 410 showing a plurality of permanent magnets 415 in place.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
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SG11202004250RA SG11202004250RA (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
CA3082894A CA3082894A1 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
AU2018368939A AU2018368939B2 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
EP18827292.6A EP3711463A1 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
JP2020545040A JP7193168B2 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnection |
KR1020207017125A KR102668129B1 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
CN201880073739.1A CN111512708A (en) | 2017-11-15 | 2018-11-15 | System and method for improving electronic component interconnection |
KR1020247016408A KR20240074921A (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
JP2022193064A JP7440120B2 (en) | 2017-11-15 | 2022-12-01 | Improved electronic component interconnection system and method |
AU2023274124A AU2023274124A1 (en) | 2017-11-15 | 2023-11-29 | System and method for improved electronic component interconnections |
Applications Claiming Priority (2)
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US201762586815P | 2017-11-15 | 2017-11-15 | |
US62/586,815 | 2017-11-15 |
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PCT/US2018/061395 WO2019099754A1 (en) | 2017-11-15 | 2018-11-15 | System and method for improved electronic component interconnections |
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EP (1) | EP3711463A1 (en) |
JP (2) | JP7193168B2 (en) |
KR (2) | KR20240074921A (en) |
CN (1) | CN111512708A (en) |
AU (2) | AU2018368939B2 (en) |
CA (1) | CA3082894A1 (en) |
SG (1) | SG11202004250RA (en) |
WO (1) | WO2019099754A1 (en) |
Cited By (1)
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CN111586979A (en) * | 2020-05-20 | 2020-08-25 | 郭琦 | Equipment for assisting in manufacturing electronic parts of integrated circuit board |
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US20240145330A1 (en) | 2021-05-27 | 2024-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
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2018
- 2018-11-15 JP JP2020545040A patent/JP7193168B2/en active Active
- 2018-11-15 AU AU2018368939A patent/AU2018368939B2/en active Active
- 2018-11-15 SG SG11202004250RA patent/SG11202004250RA/en unknown
- 2018-11-15 KR KR1020247016408A patent/KR20240074921A/en active Application Filing
- 2018-11-15 KR KR1020207017125A patent/KR102668129B1/en active IP Right Grant
- 2018-11-15 CN CN201880073739.1A patent/CN111512708A/en active Pending
- 2018-11-15 WO PCT/US2018/061395 patent/WO2019099754A1/en active Application Filing
- 2018-11-15 EP EP18827292.6A patent/EP3711463A1/en active Pending
- 2018-11-15 CA CA3082894A patent/CA3082894A1/en active Pending
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2022
- 2022-12-01 JP JP2022193064A patent/JP7440120B2/en active Active
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2023
- 2023-11-29 AU AU2023274124A patent/AU2023274124A1/en active Pending
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US20050039323A1 (en) * | 2003-08-22 | 2005-02-24 | Simens Medical Solutions Usa, Inc. | Transducers with electically conductive matching layers and methods of manufacture |
US20120106111A1 (en) * | 2010-10-31 | 2012-05-03 | Joseph Mazzochette | Anisotropic electrically and thermally conductive adhesive with magnetic nano-particles |
US20140237815A1 (en) * | 2013-02-25 | 2014-08-28 | Advanced Micro Devices, Inc. | Stiffener frame fixture |
US20160254244A1 (en) * | 2013-05-31 | 2016-09-01 | Sunray Scientific, Llc | Systems and Methods Utilizing Anisotropic Conductive Adhesives |
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CN111586979A (en) * | 2020-05-20 | 2020-08-25 | 郭琦 | Equipment for assisting in manufacturing electronic parts of integrated circuit board |
CN111586979B (en) * | 2020-05-20 | 2021-05-18 | 江西省开德电子科技有限公司 | Equipment for assisting in manufacturing electronic parts of integrated circuit board |
Also Published As
Publication number | Publication date |
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SG11202004250RA (en) | 2020-06-29 |
JP2023025166A (en) | 2023-02-21 |
KR20240074921A (en) | 2024-05-28 |
AU2018368939B2 (en) | 2023-08-31 |
JP7193168B2 (en) | 2022-12-20 |
JP7440120B2 (en) | 2024-02-28 |
CN111512708A (en) | 2020-08-07 |
CA3082894A1 (en) | 2019-05-23 |
AU2023274124A1 (en) | 2023-12-21 |
AU2018368939A1 (en) | 2020-06-25 |
KR20200111162A (en) | 2020-09-28 |
JP2021503186A (en) | 2021-02-04 |
EP3711463A1 (en) | 2020-09-23 |
KR102668129B1 (en) | 2024-05-23 |
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