WO2019098015A1 - Capacitance-type pressure sensor - Google Patents

Capacitance-type pressure sensor Download PDF

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Publication number
WO2019098015A1
WO2019098015A1 PCT/JP2018/040368 JP2018040368W WO2019098015A1 WO 2019098015 A1 WO2019098015 A1 WO 2019098015A1 JP 2018040368 W JP2018040368 W JP 2018040368W WO 2019098015 A1 WO2019098015 A1 WO 2019098015A1
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WO
WIPO (PCT)
Prior art keywords
pressure sensor
substrate
electrode
movable
fixed
Prior art date
Application number
PCT/JP2018/040368
Other languages
French (fr)
Japanese (ja)
Inventor
淳也 山本
貴弘 増田
千紘 宮原
Original Assignee
オムロン株式会社
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Publication of WO2019098015A1 publication Critical patent/WO2019098015A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes

Definitions

  • the present invention relates to a capacitive pressure sensor.
  • the pressure sensor mainly detects the pressure of gas or liquid, and is applied to various devices as an air pressure sensor, an altitude sensor, and a water pressure sensor. Also, in recent years, as an aspect of using this as an altitude sensor, its application range is applicable to a navigation device for obtaining position information, an application to a measuring instrument that precisely measures the user's exercise amount, etc. It is spreading.
  • a capacitive pressure sensor is known as a MEMS (Micro Electro Mechanical System) sensor chip.
  • a flexible pressure sensor has been proposed that includes a flexible substrate having flexibility and an active element having flexibility and mounted on the flexible substrate (see Patent Document 1).
  • an object of the present invention is to provide a capacitive pressure sensor with improved mountability.
  • the present invention adopts the following means in order to solve the above problems. That is, the present invention includes a flexible substrate including a flexible sheet substrate and a plurality of first electrodes provided on the sheet substrate, and a second electrode disposed to face the first electrode, And a plurality of rigid substrates disposed opposite to the flexible substrate via the hollow portion between the flexible substrate and the flexible substrate, and in the hollow portion, electrostatic caused by the first electrode bending with respect to the second electrode
  • a capacitive pressure sensor that measures a pressure applied to a surface of a first electrode facing a second electrode by detecting a change in capacitance, which is a longitudinal direction of a plurality of hard substrates
  • the plurality of rigid substrates are disposed on the sheet substrate so that the plurality of rigid substrates coincide with or are perpendicular to the longitudinal direction of the sheet substrate.
  • the mountability of the capacitive pressure sensor is improved.
  • the joints of the human body can be easily bent by matching the longitudinal directions of the plurality of fixed base portions with the axial direction of the joints of the human body, for example.
  • the pitch of the hard substrates is reduced, so that the measurement accuracy of the capacitive pressure sensor is improved.
  • the plurality of hard substrates is a rectangle having short sides and long sides, and the direction in which the long sides of the plurality of hard substrates extend extends in the same direction as the longitudinal direction of the sheet substrate.
  • the plurality of rigid substrates may be disposed on the sheet substrate, and the short sides of two adjacent rigid substrates of the plurality of rigid substrates may face each other.
  • the plurality of hard substrates is a rectangle having short sides and long sides, and a direction in which the short sides of the plurality of hard substrates extend is coincident with a longitudinal direction of the sheet substrate.
  • the plurality of hard substrates may be disposed on the sheet substrate, and the long sides of two adjacent hard substrates of the plurality of hard substrates may face each other.
  • FIG. 1 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 2 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 3 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 4 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 5 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 6 is a diagram showing an example of the configuration of a capacitance measurement circuit.
  • FIG. 7 is a diagram showing an example of a state before pressure is applied to the pressure sensor.
  • FIG. 8 is a diagram showing an example of a state when pressure is applied to the pressure sensor.
  • FIG. 9 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 10 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 11 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 12 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 13 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 14 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 15 is a view showing an example of a pressure sensor according to the embodiment.
  • FIG. 16A is a first view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16B is a second view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16A is a first view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16B is a second view showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16C is a third diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16D is a fourth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16E is a fifth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16F is a sixth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16G is a seventh drawing showing the example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16H is an eighth diagram showing the example of the manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 16I is a ninth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment.
  • FIG. 1 is a view showing an example of a pressure sensor 100 according to the embodiment.
  • FIG. 1 is an example of a cross-sectional view of a pressure sensor 100.
  • the pressure sensor 100 is an example of a capacitive pressure sensor.
  • the pressure sensor 100 includes a sheet substrate 11 and a plurality of movable electrodes 12 provided on the sheet substrate 11, and includes a flexible movable portion 10.
  • the pressure sensor 100 includes a substrate portion 21, a fixed electrode 22, and a fixed substrate side plated portion 24, and includes a fixed substrate portion 20 disposed opposite to the movable portion 10 via the hollow portion 13 between the movable portion 10.
  • the fixed electrode 22 is disposed to face the movable electrode 12.
  • the movable portion 10 is an example of a flexible substrate.
  • the movable electrode 12 is an example of a first electrode.
  • the fixed substrate unit 20 is an example of a hard substrate.
  • the fixed electrode 22 is an example of a second electrode.
  • the pressure sensor 100 includes a fixed substrate side plated portion 24 provided so as to surround the hollow portion 13 between the movable portion 10 and the fixed substrate portion 20.
  • the fixed substrate side plated portion 24 joins the movable portion 10 and the fixed substrate portion 20.
  • the pressure sensor 100 is directed toward the surface of the movable electrode 12 facing the fixed electrode 22 by detecting a change in electrostatic capacitance caused by the movable electrode 12 bending relative to the fixed electrode 22 in the hollow portion 13. Measure the applied pressure.
  • the pressure sensor 100 includes a plurality of sensor elements 101, and the plurality of sensor elements 101 share the sheet substrate 11. Each sensor element 101 has a movable electrode 12 and a fixed substrate portion 20.
  • FIG. 2 and 3 are diagrams showing an example of the pressure sensor 100 according to the embodiment. 2 and 3 are examples of plan views of the pressure sensor 100.
  • FIG. 2 the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the longitudinal direction of the plurality of fixed substrate portions 20 coincides with the longitudinal direction of the sheet substrate 11.
  • the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 such that the longitudinal direction of the plurality of fixed substrate units 20 is orthogonal to the longitudinal direction of the sheet substrate 11.
  • the short direction of the fixed substrate portion 20 is orthogonal to the longitudinal direction of the movable electrode 12.
  • the fixed substrate portion 20 has a shape having a long side and a short side, and is, for example, a rectangle or an oval.
  • FIG. 4 and 5 are diagrams showing an example of the pressure sensor 100 according to the embodiment.
  • FIG. 4 is an example of a plan view of the pressure sensor 100
  • FIG. 5 is an example of a cross-sectional view taken along the line AA of FIG.
  • the fixed-substrate-side plated portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21 which are not visible in plan view are shown by dotted lines.
  • three pressure sensors 100 (100a, 100b, 100c) are illustrated, and a connector 200 and a capacitance measuring circuit 300 are also illustrated.
  • the three pressure sensors 100 a, 100 b and 100 c share the sheet substrate 11.
  • FIG. 4 is an example of a plan view of the pressure sensor 100
  • FIG. 5 is an example of a cross-sectional view taken along the line AA of FIG.
  • the pressure sensor 100 includes the movable portion 10 having the movable electrode 12 and the fixed substrate portion 20 including the flexible electrode 22.
  • the pressure sensor 100 is formed by bonding the movable portion 10 and the fixed substrate portion 20 so that the movable electrode 12 of the movable portion 10 and the fixed electrode 22 of the fixed substrate portion 20 face each other.
  • the movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided separately from the first movable electrode 121.
  • a first hollow portion 18 is formed between the first movable electrode 121 and the fixed electrode 22. By forming the first hollow portion 18, the movable portion 10 can be deformed toward the fixed substrate portion 20 when pressure is applied to a region on the sheet substrate 11 corresponding to the first movable electrode 121.
  • a second hollow portion 19 is formed between the second movable electrode 122 and the fixed electrode 22.
  • the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are substantially circular, but the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are limited to substantially circular. is not.
  • the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 may be formed into a substantially polygonal shape, and may be, for example, a substantially square, a substantially hexagonal, a substantially octagonal, or the like.
  • the direction from the second hollow portion 19 to the first hollow portion 18 in FIG. 4 is referred to as the right, and the opposite direction is referred to as the left.
  • the direction from the pressure sensor 100 a toward the pressure sensor 100 c is rear, and the opposite direction is front.
  • the direction from the movable portion 10 to the fixed substrate portion 20 in FIG. 5 is downward, and the opposite direction is upward.
  • the movable portion 10 includes a sheet substrate 11, a movable electrode 12, and a movable portion side plated portion 14.
  • the sheet substrate 11 is formed of a flexible member (for example, polyimide).
  • the thickness of the sheet substrate 11 is, for example, 25 ⁇ m.
  • the thickness of the sheet substrate 11 is the length of the sheet substrate 11 in the vertical direction.
  • the lower surface of the sheet substrate 11 is provided with a movable electrode 12 formed of a conductive member (for example, copper).
  • the movable electrode 12 includes the first movable electrode 121 and the second movable electrode 122 provided to be separated from the first movable electrode 121 as described above.
  • the thickness of the movable electrode 12 is, for example, 10 ⁇ m.
  • the length of the first movable electrode 121 in the left-right direction is, for example, 2.0 mm.
  • the length of the second movable electrode 122 in the left-right direction is, for example, 0.5 mm.
  • the lengths of the first movable electrode 121 and the second movable electrode 122 in the front-rear direction are, for example, 1 mm to 2 mm.
  • the distance between the first movable electrode 121 and the second movable electrode 122 is, for example, 0.1 mm.
  • the movable portion side plated portion 14 is provided on the lower surface of the movable electrode 12.
  • the movable portion-side plated portion 14 includes a first plated portion 141 provided on the lower surface of the first movable electrode 121 and a second plated portion 142 provided on the lower surface of the second movable electrode 122.
  • the movable portion-side plated portion 14 is formed, for example, by gold plating.
  • the fixed substrate portion 20 includes a substrate portion 21, a fixed electrode 22, an insulating portion 23 and a fixed substrate side plated portion 24.
  • the substrate unit 21 is formed of a member (for example, glass) which is not easily deformed.
  • the thickness of the substrate portion 21 is, for example, 300 ⁇ m to 600 ⁇ m. Since the substrate portion 21 is formed of a member that is not easily deformed, deformation of the fixed substrate portion 20 is suppressed even if the movable portion 10 is bent by the application of pressure to the sheet substrate 11.
  • a fixed electrode 22 formed of a conductive member (for example, chromium) is disposed on the upper surface of the substrate unit 21.
  • an insulating portion 23 is provided which surrounds the periphery of the fixed electrode 22 and covers a part of the upper side of the fixed electrode 22.
  • the insulating portion 23 is formed of an insulator (for example, tetraethoxysilane (TEOS) or silicon dioxide).
  • TEOS tetraethoxysilane
  • the thickness of the insulating portion 23 is, for example, 0.5 ⁇ m.
  • a portion for forming a part of the first hollow portion 18 described above is provided in a part of a region where the first movable electrode 121 and the fixed electrode 22 overlap in a plan view.
  • a part for forming the above-described second hollow portion 19 is provided in a part of a region where the second movable electrode 122 and the fixed electrode 22 overlap in plan view.
  • a portion for forming a part of the first hollow portion 18 and the second hollow portion 19 is formed as a through hole extending from the surface on the movable portion 10 side of the insulating portion 23 to the surface on the fixed electrode 22 side. Be done.
  • the diameter of the first hollow portion 18 in plan view is, for example, 0.6 mm to 1.2 mm. When the pressure sensor 100 is viewed in plan, the area of the second hollow portion 19 is smaller than the area of the first hollow portion 18.
  • the diameter of the second hollow portion 19 in plan view is smaller than the diameter of the first hollow portion 18 in plan view.
  • the distance d between the first movable electrode 121 of the first hollow portion 18 and the fixed electrode 22 when no pressure is applied is, for example, 1 ⁇ m.
  • a fixed substrate plating portion 24 is provided on the inner side surface and the bottom of the second hollow portion 19 in addition to a part of the upper surface of the insulating portion 23.
  • the fixed substrate plating portion 24 includes a third plating portion 241 and a fourth plating portion 242.
  • the third plated portion 241 is provided in a region near the edge of the through hole that forms a part of the first hollow portion 18 on the upper surface of the insulating portion 23 so as to surround the region.
  • a space formed by the portion surrounded by the third plated portion 241 and the through hole provided in the insulating portion 23 in this manner is a first hollow portion.
  • the fourth plated portion 242 is provided in a region near the edge of the through hole for forming the second hollow portion 19 on the upper surface of the insulating portion 23 so as to surround the region, and the inner side surface of the through hole And the upper surface of the fixed electrode 22 corresponding to the bottom of the through hole. That is, the fourth plated portion 242 is formed of a portion which is formed to project from the upper surface of the insulating portion 23 toward the second movable electrode 122 and a portion which covers the inside of the through hole, and is surrounded by these The space is the second hollow portion 19.
  • the fixed substrate plating portion 24 is formed, for example, by gold plating. By bonding the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24, the movable portion 10 and the fixed substrate portion 20 are integrated to form the pressure sensor 100. In addition, the second movable portion 122 and the fixed electrode 22 are electrically connected by joining the second plated portion 142 and the fourth plated portion 242.
  • the second movable electrode 122 and the connector 200 are connected by a signal line 15 extending from the second movable electrode 122.
  • the ground (GND) line 16a extending from the first movable electrode 121 is connected between the first movable electrodes 121 of the pressure sensors 100a and 100b and between the first movable electrodes 121 of the pressure sensors 100b and 100c.
  • the distance between adjacent pressure sensors 100 is, for example, 0.1 mm to 0.3 mm. That is, the length of the GND line 16a is 0.1 mm to 0.3 mm.
  • the first movable electrode 121 of the pressure sensor 100 c is connected to the connector 200 by the GND line 16 b extending from the first movable electrode 121.
  • GND is shared by the pressure sensors 100a, 100b, and 100c.
  • both the signal line 15 and the GND line 16 are formed on the lower surface of the sheet substrate 11. That is, in the pressure sensor 100, the wiring extending from the first movable electrode 121 and the wiring extending from the fixed electrode 22 are formed in the same layer.
  • the pressure sensor 100 can realize a simple wiring structure by adopting such a configuration.
  • the pressure sensor 100 having the above-described configuration includes an area overlapping the fixed electrode 22 of the first movable electrode 121 and an area overlapping the first movable electrode 121 of the fixed electrode 22 which are arranged at a distance d (see FIG. 5). It works as a plate capacitor.
  • the capacitance C of the capacitor is calculated, for example, by the following equation 1 using the distance d described above and the area S of the area where the first movable electrode 121 and the fixed electrode 22 overlap (see FIG. 5). .
  • ⁇ 0 is the dielectric constant of vacuum
  • ⁇ r is the dielectric constant of the atmosphere. That is, according to (Expression 1), the electrostatic capacitance C fluctuates according to the fluctuation of the distance d between the first movable electrode 121 and the fixed electrode 22 which is caused by the force applied to the movable portion 10. I understand.
  • the pressure P is calculated by the following (Formula 2), for example using the area S mentioned above.
  • F is the magnitude of the force applied to the pressure sensor 100.
  • the substrate unit 21 is formed of a member that is not easily deformed, even if a force is applied to the pressure sensor 100, the fluctuation of the area S serving as a reference of pressure calculation is suppressed. Therefore, the pressure sensor 100 can detect the pressure with higher accuracy than a pressure sensor formed of a member that the substrate portion 21 is easily deformed.
  • FIG. 6 is a diagram showing an example of the configuration of the capacitance measuring circuit 300. As shown in FIG. In FIG. 6, the pressure sensors 100a, 100b, and 100c are also illustrated. Further, in FIG. 6, the illustration of the connector 200 is omitted.
  • the capacitance measurement circuit 300 includes two multiplexers 301 and 301 (denoted as MUX in the drawing) and a converter 302. Signals associated with fluctuations in capacitance of the pressure sensors 100 a, 100 b, 100 c are input to the multiplexers 301, 301 via the signal line 15. Each of the multiplexers 301 and 301 outputs a selected one of the signals input from the pressure sensors 100a, 100b and 100c.
  • MUX multiplexers
  • the illustration of selection signals used for selecting the signals output from the multiplexers 301 and 301 is omitted.
  • the signal output from each of the multiplexers 301 and 301 is input to the converter 302.
  • the converter 302 stores, for example, the correspondence between signal values input from the multiplexers 301 and 301 and pressure.
  • the correspondence relationship managed by the converter 302 may be, for example, a table indicating the correspondence between the input signal value and the pressure, or may be a mathematical expression for calculating the pressure from the input signal value.
  • the converter 302 converts, for example, the signal value input from the multiplexers 301 and 301 into a signal value indicating pressure according to the correspondence relationship, and outputs a signal value indicating pressure.
  • FIG. 7 shows an example of a state before pressure is applied to the pressure sensor 100
  • FIG. 8 shows an example of a state when pressure is applied to the pressure sensor 100.
  • the pressure sensor 100 when a pressure is applied from above the first hollow portion 18, as illustrated in FIG. 8, the pressure is applied according to the force to which the movable portion 10 including the sheet substrate 11 and the first movable electrode 121 is applied. And bend toward the fixed substrate portion 20. Also, when no force is applied to the pressure sensor 100, the pressure sensor 100 returns from the state of FIG. 8 to the state of FIG. That is, in the pressure sensor 100, the distance d between the first movable electrode 121 and the fixed electrode 22 fluctuates according to the applied force.
  • the capacitance of the pressure sensor 100 changes according to (Expression 1).
  • the pressure applied to the pressure sensor 100 is detected by measuring the fluctuation of the capacitance of the pressure sensor 100 by the capacitance measuring circuit 300 illustrated in FIG. 4.
  • the pressure sensor 100 has a second hollow portion 19 in addition to the first hollow portion 18.
  • the cylindrical fourth plating portion 242 which reaches from the fixed electrode 22 to the second movable electrode 122 is formed. If the fixed electrode 22 and the second movable electrode 122 are only electrically connected, it is sufficient to connect only one wire instead of forming the fourth plated portion 242 in a cylindrical shape.
  • both of the first movable electrode 121 and the second movable electrode 122 provided apart from each other are provided on the sheet substrate 11.
  • the first movable electrode 121 when a force is applied from above the first movable electrode 121, the first movable electrode 121 is bent to the fixed electrode 22 side, and the second movable electrode 122 is also distorted to the fixed electrode 22 side.
  • the first movable electrode 121 bends with respect to the fixed electrode 22 without deviation in the front-rear direction and the left-right direction.
  • the second movable electrode 122 is distorted to the fixed electrode 22 side, the first movable electrode 121 is affected by the deflection, and it becomes difficult to deflect the fixed electrode 22 uniformly.
  • the cross-sectional shape when planarly viewing the 4th plated part 242 is formed in substantially circle shape or substantially polygon shape.
  • distortion in the second movable electrode 122 portion when pressure is applied is suppressed as compared with the configuration in which the fixed electrode 22 and the second movable electrode 122 are connected by one wire.
  • the fourth plated portion 242 having a substantially circular or polygonal cross-sectional shape can support the second movable electrode 122 more stably than in the case where the second movable electrode 122 is supported by one wire. .
  • FIG. 9 to 13 show an example of the pressure sensor 100 according to the embodiment.
  • 9 to 13 show an example of a state in which the pressure sensor 100 is attached to the arm 31.
  • FIG. FIG. 13 shows a part of a cross section taken along the line BB in FIG. 10 to 11 show a cross section taken along the line CC of FIG. Since the sheet substrate 11 has flexibility, the pressure sensor 100 can be easily wound around the arm 31 or the wrist, and the discomfort when the pressure sensor 100 is wound around the arm 31 or the wrist can be reduced.
  • the pressure sensor 100 may be wound around the arm 31 or the wrist by forming the sheet substrate 11 in a band shape.
  • the pressure sensor 100 may be attached to the arm 31 or the wrist by attaching a double-sided adhesive sheet to the sheet substrate 11.
  • the pressure sensor 100 is not limited to the arm 31 or the wrist, and may be wound or attached to another part of the human body.
  • the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 in a state in which the longitudinal direction of the plurality of fixed substrate units 20 matches the longitudinal direction of the sheet substrate 11.
  • the pressure sensor 100 is attached to the arm 31 in a state where the longitudinal direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the arm 31. Therefore, the short side direction of each fixed substrate portion 20 coincides with the longitudinal direction of the arm 31.
  • the short direction of the fixed substrate portion 20 is orthogonal to the longitudinal direction of the fixed substrate portion 20.
  • the pitch of the fixed substrate unit 20 is increased. The pitch of the fixed substrate portions 20 in the arrangement example of the fixed substrate portions 20 shown in FIG.
  • FIG. 9 is a total value of the distance between two adjacent fixed substrate portions 20 and the width in the longitudinal direction of the fixed substrate portions 20. According to the arrangement example of the fixed substrate portion 20 shown in FIG. 9, since the longitudinal direction of each fixed substrate portion 20 coincides with the short direction of the arm 31, the wrist is easily bent.
  • FIG. 10 shows the state in which the wrist is bent inward
  • FIG. 11 shows the state in which the wrist is bent outward.
  • the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 in a state in which the longitudinal direction of the plurality of fixed substrate units 20 is orthogonal to the longitudinal direction of the sheet substrate 11.
  • the pressure sensor 100 is attached to the arm 31 in a state where the longitudinal direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the arm 31. Therefore, the longitudinal direction of each fixed substrate portion 20 coincides with the longitudinal direction of the arm 31.
  • the pitch of the fixed substrate unit 20 is reduced.
  • the pitch of the fixed substrate portions 20 in the arrangement example of the fixed substrate portions 20 shown in FIG. 12 is a total value of the distance between the two adjacent fixed substrate portions 20 and the width in the short direction of the fixed substrate portions 20.
  • the pitch of the fixed substrate unit 20 is reduced, so that the pressure applied in a narrow range with respect to the pressure sensor 100 can be measured.
  • the blood vessel 33 between the tendon 32 of the arm 31 and the tendon 32 is several mm.
  • the pitch of the fixed substrate portion 20 is small, it is easy to arrange the movable electrode 12 in the vicinity of the blood vessel 33, and the mounting property of the pressure sensor 100 is improved.
  • Ribs 34 exist below the tendon 32 and the blood vessel 33.
  • FIG. 14 and 15 are diagrams showing an example of the pressure sensor 100 according to the embodiment.
  • 14 and 15 are examples of plan views of the fixed substrate portion 20.
  • FIG. The fixed substrate portion 20 is a rectangle having a long side 41 and a short side 42.
  • the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the direction in which the long sides 41 of the plurality of fixed substrate portions 20 extend and the longitudinal direction of the sheet substrate 11 coincide.
  • Short sides 42 of two adjacent fixed substrate portions 20 among the plurality of fixed substrate portions 20 face each other.
  • the width in the short direction of the sheet substrate 11 is narrowed, so that the pressure sensor 100 can be wound or attached to a portion where the width is narrow. .
  • the short direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the sheet substrate 11.
  • the plurality of fixed substrate units 20 are arranged in a line, but the plurality of fixed substrate units 20 may be arranged in two or more lines. That is, the plurality of fixed substrate units 20 may be arranged in an array (a lattice).
  • the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the direction in which the short sides 42 of the plurality of fixed substrate portions 20 extend and the longitudinal direction of the sheet substrate 11 coincide.
  • the long sides 41 of two adjacent fixed substrate portions 20 of the plurality of fixed substrate portions 20 face each other.
  • the plurality of fixed substrate units 20 are arranged in a line, but the plurality of fixed substrate units 20 may be arranged in two or more lines. That is, the plurality of fixed substrate units 20 may be arranged in an array (a lattice).
  • the plurality of sensor elements 101 by sharing the sheet substrate 11. That is, by providing the plurality of movable electrodes 12 on the single sheet substrate 11, the plurality of movable electrodes 12 and the plurality of fixed substrate portions 20 are arranged in a row or array (lattice) on the single sheet substrate 11. It is possible. In this case, the plurality of movable electrodes 12 are separated, and the plurality of fixed substrate portions 20 are separated. Therefore, when pressure is applied to the pressure sensor 100, one of the plurality of adjacent movable portions 10 does not inhibit the deformation of the other of the plurality of adjacent movable portions 10. Therefore, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not inhibited, and the pressure applied to the pressure sensor 100 can be measured with high accuracy.
  • 16A to 16I illustrate an example of a manufacturing process of the pressure sensor 100.
  • FIG. Hereinafter, an example of a manufacturing process of the pressure sensor 100 will be described with reference to FIGS. 16A to 16I.
  • FIG. 16A to 16E show an example of the manufacturing process of the fixed substrate portion 20.
  • FIG. 16A the fixed electrode 22 is formed on the surface of the substrate 21 facing the movable portion 10.
  • FIG. 16B the insulating film 231 is formed so as to cover the fixed electrode 22.
  • a resist film 51 is formed on the surface of the insulating film 231 facing the movable portion 10.
  • FIG. 16C a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing photoresist on the resist film 51 using a photomask in which a desired pattern is formed.
  • FIG. 16C a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing photoresist on the resist film 51 using a photomask in which a desired pattern is formed.
  • the etching process is performed, and the resist film 51 is further removed, whereby the insulating portion 23 is formed.
  • the fixed substrate side plated portion 24 is formed on the surface of the insulating portion 23 facing the movable portion 10.
  • the plating resist is performed on the area where the fixed substrate side plated portion 24 is not formed, and then the plating process is performed to form the fixed substrate side plated portion 24 in a desired area.
  • the fixed substrate side plated portion 24 may be formed by sputtering. That is, after a plating layer is formed on the surface of the insulating portion 23 facing the movable portion 10 by a sputtering apparatus, a resist is applied and etched to form a pattern of the fixed substrate plating portion 24. May be
  • FIG. 16F and 16G show an example of the manufacturing process of the movable part 10.
  • the movable electrode 12 is formed on the surface of the flexible sheet substrate 11 facing the fixed substrate portion 20.
  • the plating process is performed on the surface of the movable electrode 12 facing the fixed substrate portion 20, whereby the movable portion-side plated portion 14 is formed.
  • FIG. 16G etching is performed on the area corresponding to the first movable electrode 121 and the second movable electrode 122 on the surface facing the fixed substrate portion 20 of the movable portion-side plated portion 14 and then the etching is performed.
  • the first movable electrode 121 and the second movable electrode 122 are formed.
  • Step of bonding movable portion 10 and fixed substrate portion 20 16H and 16I show an example of the process of joining the fixed substrate part 20 and the movable part 10. As shown in FIG. In FIG. 16H, the movable portion 10 and the fixed substrate portion 20 are joined. There is no limitation in particular in the joining method. The movable portion 10 and the fixed substrate portion 20 may be joined by, for example, normal temperature bonding.
  • the surface of the movable portion side plated portion 14 of the movable portion 10 facing the fixed substrate portion 20 and the surface of the fixed substrate portion 20 facing the movable portion 10 of the fixed substrate side plated portion 24 are A process of smoothing the surface and a process of removing impurities from the surface to clean the surface are performed.
  • the movable-part-side plated part 14 subjected to these treatments comes into contact with the fixed-substrate-side plated part 24, the intermolecular force acting between the movable-part-side plated part 14 and the fixed-substrate-side plated part 24 causes the movable part to move. 10 and the fixed substrate portion 20 are joined.
  • FIG. 16I illustrates a state in which three pressure sensors 100 manufactured by the steps of FIGS. 16A to 16H are arranged side by side so as to share the sheet substrate 11. As illustrated in FIG. 16I, the pressure sensor 100 can widen the area to be subjected to pressure detection by sharing the sheet substrate 11 and arranging the plurality of sensor elements 101.
  • manufacturing of the movable portion 10 and the fixed substrate portion 20 is performed without performing a process of flattening the surfaces of the movable portion side plated portion 14 and the fixed substrate side plated portion 24.
  • the flatness of the surface may be ensured in the process.
  • metal for example, copper
  • CMP Chemical Mechanical Polishing
  • Second hollow portion 20 Fixed substrate portion 21: Substrate portion 22: Fixed electrode 23: Insulation portion 24: Fixed substrate side plated portion 241: Third plating Part 242: Fourth plated part 51: Resist film 200: Connector 231: Insulating film 300: Capacitance measurement circuit 301: Multiplexer 302: Converter

Abstract

Provided is a capacitance-type pressure sensor in which mountability is improved. This capacitance-type pressure sensor is provided with: a flexible substrate including a flexible sheet substrate and a plurality of first electrodes provided on the sheet substrate; and a plurality of hard substrates including second electrodes disposed so as to face the first electrodes, the hard substrates being disposed facing the flexible substrate across a hollow part formed between the hard substrates and the flexible substrate. In the hollow part, the plurality of hard substrates are disposed on the sheet substrate such that pressure applied toward a surface of the first electrodes facing the second electrodes is measured by detecting a change in capacitance produced due to flexing of the first electrodes relative to the second electrodes, and such that the longitudinal direction of the plurality of hard substrates coincides with or intersects the longitudinal direction of the sheet substrate.

Description

静電容量式圧力センサCapacitive pressure sensor
　本発明は、静電容量式圧力センサに関する。 The present invention relates to a capacitive pressure sensor.
　圧力センサは、主として気体や液体の圧力を検出するものであり、気圧センサや高度センサ、水圧センサとして各種の装置に適用されている。また、近年においては、これを高度センサとして利用する場合の一態様として、位置情報を得るためのナビゲーション装置への応用やユーザの運動量を精緻に計測する計測器への応用等、その適用範囲が広がりつつある。 The pressure sensor mainly detects the pressure of gas or liquid, and is applied to various devices as an air pressure sensor, an altitude sensor, and a water pressure sensor. Also, in recent years, as an aspect of using this as an altitude sensor, its application range is applicable to a navigation device for obtaining position information, an application to a measuring instrument that precisely measures the user's exercise amount, etc. It is spreading.
　ＭＥＭＳ（Micro Electro Mechanical System）センサチップとしての静電容量式圧力センサが知られている。柔軟性を有する柔軟基板と、柔軟性を有し、柔軟基板上に取り付けられる能動素子と、を含む柔軟圧力センサが提案されている（特許文献１参照）。 A capacitive pressure sensor is known as a MEMS (Micro Electro Mechanical System) sensor chip. A flexible pressure sensor has been proposed that includes a flexible substrate having flexibility and an active element having flexibility and mounted on the flexible substrate (see Patent Document 1).
特開２００６－１０８６５７号公報JP, 2006-108657, A
　例えば、圧力センサを人体に装着する場合、圧力センサの装着の仕方によっては、圧力センサの測定精度が良くなかったり、圧力センサ自体が硬くて人体に装着しづらかったりするという課題がある。このような状況に鑑み、本発明は、装着性を向上した静電容量式圧力センサを提供することを目的とする。 For example, when the pressure sensor is attached to the human body, there are problems that the measurement accuracy of the pressure sensor is not good or the pressure sensor itself is hard to attach to the human body depending on the method of attaching the pressure sensor. In view of such a situation, an object of the present invention is to provide a capacitive pressure sensor with improved mountability.
　本発明では、上記課題を解決するために、以下の手段を採用した。すなわち、本発明は、可撓性を有するシート基板およびシート基板に設けられた複数の第１の電極を含むフレキシブル基板と、第１の電極に対向して配置される第２の電極を含み、フレキシブル基板との間に中空部を介してフレキシブル基板に対向配置された複数の硬質基板と、を備え、中空部において、第１の電極が第２の電極に対して撓むことで生じる静電容量の変化を検出することにより、第１の電極における第２の電極との対向面に向けて印加される圧力を測定する、静電容量式圧力センサであって、複数の硬質基板の長手方向が、シート基板の長手方向と一致又は直交するように、複数の硬質基板がシート基板に配置されている。 The present invention adopts the following means in order to solve the above problems. That is, the present invention includes a flexible substrate including a flexible sheet substrate and a plurality of first electrodes provided on the sheet substrate, and a second electrode disposed to face the first electrode, And a plurality of rigid substrates disposed opposite to the flexible substrate via the hollow portion between the flexible substrate and the flexible substrate, and in the hollow portion, electrostatic caused by the first electrode bending with respect to the second electrode A capacitive pressure sensor that measures a pressure applied to a surface of a first electrode facing a second electrode by detecting a change in capacitance, which is a longitudinal direction of a plurality of hard substrates The plurality of rigid substrates are disposed on the sheet substrate so that the plurality of rigid substrates coincide with or are perpendicular to the longitudinal direction of the sheet substrate.
　複数の硬質基板の長手方向が、シート基板の長手方向と一致又は直交するように、複数の硬質基板がシート基板に配置されることにより、静電容量式圧力センサの装着性が向上する。複数の固定基板部の長手方向が、例えば、人体の関節の軸方向と一致することで、人体の関節が曲げやすくなる。複数の硬質基板の長手方向が、シート基板の長手方向と直交する場合、硬質基板のピッチが小さくなるため、静電容量式圧力センサの測定精度が向上する。 By arranging the plurality of hard substrates on the sheet substrate such that the longitudinal directions of the plurality of hard substrates coincide with or are perpendicular to the longitudinal direction of the sheet substrate, the mountability of the capacitive pressure sensor is improved. The joints of the human body can be easily bent by matching the longitudinal directions of the plurality of fixed base portions with the axial direction of the joints of the human body, for example. When the longitudinal directions of the plurality of hard substrates are orthogonal to the longitudinal direction of the sheet substrate, the pitch of the hard substrates is reduced, so that the measurement accuracy of the capacitive pressure sensor is improved.
　上記静電容量式圧力センサにおいて、複数の硬質基板が、短辺と長辺とを有する長方形であり、複数の硬質基板の長辺が伸びる方向と、シート基板の長手方向とが一致するように、複数の硬質基板がシート基板に配置され、複数の硬質基板のうち隣り合う２つの硬質基板の短辺同士が向かい合っていてもよい。 In the above-mentioned capacitance type pressure sensor, the plurality of hard substrates is a rectangle having short sides and long sides, and the direction in which the long sides of the plurality of hard substrates extend extends in the same direction as the longitudinal direction of the sheet substrate. The plurality of rigid substrates may be disposed on the sheet substrate, and the short sides of two adjacent rigid substrates of the plurality of rigid substrates may face each other.
　上記静電容量式圧力センサにおいて、複数の硬質基板が、短辺と長辺とを有する長方形であり、複数の硬質基板の短辺が伸びる方向と、シート基板の長手方向とが一致するように、複数の硬質基板がシート基板に配置され、複数の硬質基板のうち隣り合う２つの硬質基板の長辺同士が向かい合っていてもよい。 In the capacitive pressure sensor, the plurality of hard substrates is a rectangle having short sides and long sides, and a direction in which the short sides of the plurality of hard substrates extend is coincident with a longitudinal direction of the sheet substrate. The plurality of hard substrates may be disposed on the sheet substrate, and the long sides of two adjacent hard substrates of the plurality of hard substrates may face each other.
　本発明によれば、装着性を向上した静電容量式圧力センサを提供することができる。 According to the present invention, it is possible to provide a capacitive pressure sensor with improved mountability.
図１は、実施形態に係る圧力センサの一例を示す図である。FIG. 1 is a view showing an example of a pressure sensor according to the embodiment. 図２は、実施形態に係る圧力センサの一例を示す図である。FIG. 2 is a view showing an example of a pressure sensor according to the embodiment. 図３は、実施形態に係る圧力センサの一例を示す図である。FIG. 3 is a view showing an example of a pressure sensor according to the embodiment. 図４は、実施形態に係る圧力センサの一例を示す図である。FIG. 4 is a view showing an example of a pressure sensor according to the embodiment. 図５は、実施形態に係る圧力センサの一例を示す図である。FIG. 5 is a view showing an example of a pressure sensor according to the embodiment. 図６は、静電容量測定回路の構成の一例を示す図である。FIG. 6 is a diagram showing an example of the configuration of a capacitance measurement circuit. 図７は、圧力センサに圧力が印加される前の状態の一例を示す図である。FIG. 7 is a diagram showing an example of a state before pressure is applied to the pressure sensor. 図８は、圧力センサに圧力が印加されたときの状態の一例を示す図である。FIG. 8 is a diagram showing an example of a state when pressure is applied to the pressure sensor. 図９は、実施形態に係る圧力センサの一例を示す図である。FIG. 9 is a view showing an example of a pressure sensor according to the embodiment. 図１０は、実施形態に係る圧力センサの一例を示す図である。FIG. 10 is a view showing an example of a pressure sensor according to the embodiment. 図１１は、実施形態に係る圧力センサの一例を示す図である。FIG. 11 is a view showing an example of a pressure sensor according to the embodiment. 図１２は、実施形態に係る圧力センサの一例を示す図である。FIG. 12 is a view showing an example of a pressure sensor according to the embodiment. 図１３は、実施形態に係る圧力センサの一例を示す図である。FIG. 13 is a view showing an example of a pressure sensor according to the embodiment. 図１４は、実施形態に係る圧力センサの一例を示す図である。FIG. 14 is a view showing an example of a pressure sensor according to the embodiment. 図１５は、実施形態に係る圧力センサの一例を示す図である。FIG. 15 is a view showing an example of a pressure sensor according to the embodiment. 図１６Ａは、実施形態に係る圧力センサの製造工程の一例を示す第１の図である。FIG. 16A is a first view showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１６Ｂは、実施形態に係る圧力センサの製造工程の一例を示す第２の図である。FIG. 16B is a second view showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１６Ｃは、実施形態に係る圧力センサの製造工程の一例を示す第３の図である。FIG. 16C is a third diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. 図１６Ｄは、実施形態に係る圧力センサの製造工程の一例を示す第４の図である。FIG. 16D is a fourth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment. 図１６Ｅは、実施形態に係る圧力センサの製造工程の一例を示す第５の図である。FIG. 16E is a fifth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. 図１６Ｆは、実施形態に係る圧力センサの製造工程の一例を示す第６の図である。FIG. 16F is a sixth drawing showing an example of the manufacturing process of the pressure sensor according to the embodiment. 図１６Ｇは、実施形態に係る圧力センサの製造工程の一例を示す第７の図である。FIG. 16G is a seventh drawing showing the example of the manufacturing process of the pressure sensor according to the embodiment. 図１６Ｈは、実施形態に係る圧力センサの製造工程の一例を示す第８の図である。FIG. 16H is an eighth diagram showing the example of the manufacturing process of the pressure sensor according to the embodiment. 図１６Ｉは、実施形態に係る圧力センサの製造工程の一例を示す第９の図である。FIG. 16I is a ninth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment.
　以下、実施形態について図を参照しながら説明する。以下に示す実施形態は、本願の一態様であり、本願の技術的範囲を限定するものではない。 Hereinafter, embodiments will be described with reference to the drawings. The embodiment described below is an aspect of the present application, and does not limit the technical scope of the present application.
　＜適用例＞
　図１は実施形態に係る圧力センサ１００の一例を示す図である。図１は圧力センサ１００の断面図の一例である。圧力センサ１００は、静電容量式圧力センサの一例である。圧力センサ１００は、シート基板１１およびシート基板１１に設けられた複数の可動電極１２を含み、可撓性を有する可動部１０を備える。圧力センサ１００は、基板部２１、固定電極２２および固定基板側メッキ部２４を含み、可動部１０との間に中空部１３を介して可動部１０に対向配置された固定基板部２０を備える。固定電極２２は、可動電極１２に対向して配置されている。可動部１０は、フレキシブル基板の一例である。可動電極１２は、第１の電極の一例である。固定基板部２０は、硬質基板の一例である。固定電極２２は、第２の電極の一例である。また、圧力センサ１００は、可動部１０と固定基板部２０との間であって、中空部１３を囲むように設けられた固定基板側メッキ部２４を備える。固定基板側メッキ部２４は、可動部１０と固定基板部２０とを接合する。圧力センサ１００は、中空部１３において、可動電極１２が固定電極２２に対して撓むことで生じる静電容量の変化を検出することにより、可動電極１２における固定電極２２との対向面に向けて印加される圧力を測定する。図１に示すように、圧力センサ１００は、複数のセンサ素子１０１を備え、複数のセンサ素子１０１がシート基板１１を共有している。各センサ素子１０１は、可動電極１２および固定基板部２０を有する。 <Example of application>
FIG. 1 is a view showing an example of a pressure sensor 100 according to the embodiment. FIG. 1 is an example of a cross-sectional view of a pressure sensor 100. The pressure sensor 100 is an example of a capacitive pressure sensor. The pressure sensor 100 includes a sheet substrate 11 and a plurality of movable electrodes 12 provided on the sheet substrate 11, and includes a flexible movable portion 10. The pressure sensor 100 includes a substrate portion 21, a fixed electrode 22, and a fixed substrate side plated portion 24, and includes a fixed substrate portion 20 disposed opposite to the movable portion 10 via the hollow portion 13 between the movable portion 10. The fixed electrode 22 is disposed to face the movable electrode 12. The movable portion 10 is an example of a flexible substrate. The movable electrode 12 is an example of a first electrode. The fixed substrate unit 20 is an example of a hard substrate. The fixed electrode 22 is an example of a second electrode. Further, the pressure sensor 100 includes a fixed substrate side plated portion 24 provided so as to surround the hollow portion 13 between the movable portion 10 and the fixed substrate portion 20. The fixed substrate side plated portion 24 joins the movable portion 10 and the fixed substrate portion 20. The pressure sensor 100 is directed toward the surface of the movable electrode 12 facing the fixed electrode 22 by detecting a change in electrostatic capacitance caused by the movable electrode 12 bending relative to the fixed electrode 22 in the hollow portion 13. Measure the applied pressure. As shown in FIG. 1, the pressure sensor 100 includes a plurality of sensor elements 101, and the plurality of sensor elements 101 share the sheet substrate 11. Each sensor element 101 has a movable electrode 12 and a fixed substrate portion 20.
　図２および図３は実施形態に係る圧力センサ１００の一例を示す図である。図２および図３は圧力センサ１００の平面図の一例である。図２では、複数の固定基板部２０の長手方向が、シート基板１１の長手方向と一致するように、複数の固定基板部２０がシート基板１１に配置されている。図３では、複数の固定基板部２０の長手方向が、シート基板１１の長手方向と直交するように、複数の固定基板部２０がシート基板１１に配置されている。固定基板部２０の短手方向が、可動電極１２の長手方向と直交している。固定基板部２０は、長手および短手を有する形状であり、例えば、長方形、楕円形である。 2 and 3 are diagrams showing an example of the pressure sensor 100 according to the embodiment. 2 and 3 are examples of plan views of the pressure sensor 100. FIG. In FIG. 2, the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the longitudinal direction of the plurality of fixed substrate portions 20 coincides with the longitudinal direction of the sheet substrate 11. In FIG. 3, the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 such that the longitudinal direction of the plurality of fixed substrate units 20 is orthogonal to the longitudinal direction of the sheet substrate 11. The short direction of the fixed substrate portion 20 is orthogonal to the longitudinal direction of the movable electrode 12. The fixed substrate portion 20 has a shape having a long side and a short side, and is, for example, a rectangle or an oval.
　＜実施例＞
　図４および図５は実施形態に係る圧力センサ１００の一例を示す図である。図４は圧力センサ１００を平面視した図の一例であり、図５は図４のＡ－Ａ線における断面図の一例である。図４では、平面視においては目視できない固定基板側メッキ部２４、第１中空部１８、第２中空部１９、固定電極２２および基板部２１が点線で示されている。図４では、３つの圧力センサ１００（１００ａ、１００ｂ、１００ｃ）が例示されるとともに、コネクタ２００および静電容量測定回路３００も例示される。３つの圧力センサ１００ａ、１００ｂ、１００ｃは、シート基板１１を共有する。図５を参照すると理解できるように、圧力センサ１００は、可動電極１２を含み可撓性を有する可動部１０と固定電極２２を含む固定基板部２０とを備える。圧力センサ１００は、可動部１０の可動電極１２と固定基板部２０の固定電極２２とが対向するように、可動部１０と固定基板部２０とを接合して形成される。可動電極１２は、第１可動電極１２１および第１可動電極１２１と離間して設けられる第２可動電極１２２を含む。第１可動電極１２１と固定電極２２との間には、第１中空部１８が形成される。第１中空部１８が形成されることで、シート基板１１上の第１可動電極１２１に相当する領域に圧力が印加されたときに、可動部１０は固定基板部２０に向けて変形可能となる。また、第２可動電極１２２と固定電極２２との間には、第２中空部１９が形成される。図４では、第１中空部１８および第２中空部１９の断面形状は略円形に形成されているが、第１中空部１８および第２中空部１９の断面形状が略円形に限定されるわけではない。第１中空部１８および第２中空部１９の断面形状は、略多角形に形成されていてもよく、例えば、略四角形、略六角形、略八角形等であってもよい。以下、本明細書において、図４における第２中空部１９から第１中空部１８に向かう方向を右、その逆方向を左とする。また、図４において、圧力センサ１００ａから圧力センサ１００ｃに向かう方向を後ろ、その逆方向を前とする。さらに、図５における可動部１０から固定基板部２０に向かう方向を下、その逆方向を上とする。 <Example>
4 and 5 are diagrams showing an example of the pressure sensor 100 according to the embodiment. FIG. 4 is an example of a plan view of the pressure sensor 100, and FIG. 5 is an example of a cross-sectional view taken along the line AA of FIG. In FIG. 4, the fixed-substrate-side plated portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21 which are not visible in plan view are shown by dotted lines. In FIG. 4, three pressure sensors 100 (100a, 100b, 100c) are illustrated, and a connector 200 and a capacitance measuring circuit 300 are also illustrated. The three pressure sensors 100 a, 100 b and 100 c share the sheet substrate 11. As can be understood with reference to FIG. 5, the pressure sensor 100 includes the movable portion 10 having the movable electrode 12 and the fixed substrate portion 20 including the flexible electrode 22. The pressure sensor 100 is formed by bonding the movable portion 10 and the fixed substrate portion 20 so that the movable electrode 12 of the movable portion 10 and the fixed electrode 22 of the fixed substrate portion 20 face each other. The movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided separately from the first movable electrode 121. A first hollow portion 18 is formed between the first movable electrode 121 and the fixed electrode 22. By forming the first hollow portion 18, the movable portion 10 can be deformed toward the fixed substrate portion 20 when pressure is applied to a region on the sheet substrate 11 corresponding to the first movable electrode 121. . In addition, a second hollow portion 19 is formed between the second movable electrode 122 and the fixed electrode 22. In FIG. 4, the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are substantially circular, but the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are limited to substantially circular. is not. The cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 may be formed into a substantially polygonal shape, and may be, for example, a substantially square, a substantially hexagonal, a substantially octagonal, or the like. Hereinafter, in the present specification, the direction from the second hollow portion 19 to the first hollow portion 18 in FIG. 4 is referred to as the right, and the opposite direction is referred to as the left. Further, in FIG. 4, the direction from the pressure sensor 100 a toward the pressure sensor 100 c is rear, and the opposite direction is front. Furthermore, the direction from the movable portion 10 to the fixed substrate portion 20 in FIG. 5 is downward, and the opposite direction is upward.
　可動部１０は、シート基板１１、可動電極１２、可動部側メッキ部１４を含む。シート基板１１は、可撓性を有する部材（例えば、ポリイミド）で形成される。シート基板１１の厚さは、例えば、２５μｍである。ここで、シート基板１１の厚さは、シート基板１１の上下方向の長さである。シート基板１１の下方向の面には導電性を有する部材（例えば銅）によって形成される可動電極１２が設けられる。可動電極１２は、上述のように、第１可動電極１２１および第１可動電極１２１と離間して設けられる第２可動電極１２２を含む。可動電極１２の厚さは、例えば、１０μｍである。第１可動電極１２１の左右方向の長さは、例えば、２．０ｍｍである。第２可動電極１２２の左右方向の長さは、例えば、０．５ｍｍである。第１可動電極１２１および第２可動電極１２２の前後方向の長さは、例えば、１ｍｍから２ｍｍである。第１可動電極１２１と第２可動電極１２２との間の距離は、例えば、０．１ｍｍである。可動電極１２の下方向の面には、可動部側メッキ部１４が設けられる。可動部側メッキ部１４は、第１可動電極１２１の下方向の面に設けられる第１メッキ部１４１と第２可動電極１２２の下方向の面に設けられる第２メッキ部１４２を含む。可動部側メッキ部１４は、例えば、金メッキによって形成される。 The movable portion 10 includes a sheet substrate 11, a movable electrode 12, and a movable portion side plated portion 14. The sheet substrate 11 is formed of a flexible member (for example, polyimide). The thickness of the sheet substrate 11 is, for example, 25 μm. Here, the thickness of the sheet substrate 11 is the length of the sheet substrate 11 in the vertical direction. The lower surface of the sheet substrate 11 is provided with a movable electrode 12 formed of a conductive member (for example, copper). The movable electrode 12 includes the first movable electrode 121 and the second movable electrode 122 provided to be separated from the first movable electrode 121 as described above. The thickness of the movable electrode 12 is, for example, 10 μm. The length of the first movable electrode 121 in the left-right direction is, for example, 2.0 mm. The length of the second movable electrode 122 in the left-right direction is, for example, 0.5 mm. The lengths of the first movable electrode 121 and the second movable electrode 122 in the front-rear direction are, for example, 1 mm to 2 mm. The distance between the first movable electrode 121 and the second movable electrode 122 is, for example, 0.1 mm. The movable portion side plated portion 14 is provided on the lower surface of the movable electrode 12. The movable portion-side plated portion 14 includes a first plated portion 141 provided on the lower surface of the first movable electrode 121 and a second plated portion 142 provided on the lower surface of the second movable electrode 122. The movable portion-side plated portion 14 is formed, for example, by gold plating.
　固定基板部２０は、基板部２１、固定電極２２、絶縁部２３および固定基板側メッキ部２４を含む。基板部２１は、容易には変形しない部材（例えば、ガラス）で形成される。基板部２１の厚さは、例えば、３００μｍから６００μｍである。基板部２１は容易には変形しない部材で形成されるため、シート基板１１への圧力の印加により可動部１０が撓んでも、固定基板部２０の変形は抑制される。基板部２１の上側の面上には導電性を有する部材（例えばクロム）によって形成された固定電極２２が配置される。さらに、固定電極２２の周囲を囲むとともに、固定電極２２の上方の一部を覆う絶縁部２３が設けられる。絶縁部２３は絶縁体（例えば、テトラエトキシシラン（ＴＥＯＳ）や二酸化ケイ素）によって形成される。絶縁部２３の厚さは、例えば、０．５μｍである。絶縁部２３には、平面視において第１可動電極１２１と固定電極２２とが重なる領域の一部には上述した第１中空部１８の一部を形成する箇所が設けられる。また、平面視において第２可動電極１２２と固定電極２２とが重なる領域の一部には上述した第２中空部１９を形成するための箇所が設けられる。絶縁部２３において、第１中空部１８の一部および第２中空部１９を形成するための箇所は、絶縁部２３の可動部１０側の面から固定電極２２側の面まで達する貫通孔として形成される。第１中空部１８を平面視したときの直径は、例えば、０．６ｍｍから１．２ｍｍである。圧力センサ１００を平面視した場合において、第２中空部１９の面積は、第１中空部１８の面積よりも小さい。すなわち、第２中空部１９を平面視したときの直径は、第１中空部１８を平面視したときの直径よりも小さい。圧力が印加されていないときにおける第１中空部１８の第１可動電極１２１と固定電極２２との間の距離ｄは、例えば、１μｍである。絶縁部２３の上側の面の一部の他、第２中空部１９の内側面および底部には、固定基板側メッキ部２４が設けられる。固定基板側メッキ部２４は、第３メッキ部２４１と第４メッキ部２４２を含む。第３メッキ部２４１は、絶縁部２３の上側の面において、第１中空部１８の一部を形成する貫通孔の縁近傍の領域に当該領域を囲むようにして設けられる。このようにして第３メッキ部２４１に囲まれた部分と絶縁部２３に設けられた貫通孔によって形成される空間が第１中空部である。第４メッキ部２４２は、絶縁部２３の上側の面において、第２中空部１９を形成するための貫通孔の縁近傍の領域に、当該領域を囲むようにして設けられるとともに、該貫通孔の内側面、及び該貫通孔の底部に該当する固定電極２２の上面にも設けられる。即ち、第４メッキ部２４２は、絶縁部２３の上側の面から第２可動電極１２２に向けて突出して形成される部分と、貫通孔の内部を覆う部分とから形成され、これらに囲まれた空間が第２中空部１９となる。なお、固定基板側メッキ部２４は、例えば、金メッキによって形成される。可動部側メッキ部１４と固定基板側メッキ部２４とが接合されることで可動部１０と固定基板部２０とが一体となり、圧力センサ１００が形成される。また、第２メッキ部１４２と第４メッキ部２４２とが接合されることで、第２可動電極１２２と固定電極２２とが電気的に接続される。 The fixed substrate portion 20 includes a substrate portion 21, a fixed electrode 22, an insulating portion 23 and a fixed substrate side plated portion 24. The substrate unit 21 is formed of a member (for example, glass) which is not easily deformed. The thickness of the substrate portion 21 is, for example, 300 μm to 600 μm. Since the substrate portion 21 is formed of a member that is not easily deformed, deformation of the fixed substrate portion 20 is suppressed even if the movable portion 10 is bent by the application of pressure to the sheet substrate 11. A fixed electrode 22 formed of a conductive member (for example, chromium) is disposed on the upper surface of the substrate unit 21. Furthermore, an insulating portion 23 is provided which surrounds the periphery of the fixed electrode 22 and covers a part of the upper side of the fixed electrode 22. The insulating portion 23 is formed of an insulator (for example, tetraethoxysilane (TEOS) or silicon dioxide). The thickness of the insulating portion 23 is, for example, 0.5 μm. In the insulating portion 23, a portion for forming a part of the first hollow portion 18 described above is provided in a part of a region where the first movable electrode 121 and the fixed electrode 22 overlap in a plan view. Further, a part for forming the above-described second hollow portion 19 is provided in a part of a region where the second movable electrode 122 and the fixed electrode 22 overlap in plan view. In the insulating portion 23, a portion for forming a part of the first hollow portion 18 and the second hollow portion 19 is formed as a through hole extending from the surface on the movable portion 10 side of the insulating portion 23 to the surface on the fixed electrode 22 side. Be done. The diameter of the first hollow portion 18 in plan view is, for example, 0.6 mm to 1.2 mm. When the pressure sensor 100 is viewed in plan, the area of the second hollow portion 19 is smaller than the area of the first hollow portion 18. That is, the diameter of the second hollow portion 19 in plan view is smaller than the diameter of the first hollow portion 18 in plan view. The distance d between the first movable electrode 121 of the first hollow portion 18 and the fixed electrode 22 when no pressure is applied is, for example, 1 μm. A fixed substrate plating portion 24 is provided on the inner side surface and the bottom of the second hollow portion 19 in addition to a part of the upper surface of the insulating portion 23. The fixed substrate plating portion 24 includes a third plating portion 241 and a fourth plating portion 242. The third plated portion 241 is provided in a region near the edge of the through hole that forms a part of the first hollow portion 18 on the upper surface of the insulating portion 23 so as to surround the region. A space formed by the portion surrounded by the third plated portion 241 and the through hole provided in the insulating portion 23 in this manner is a first hollow portion. The fourth plated portion 242 is provided in a region near the edge of the through hole for forming the second hollow portion 19 on the upper surface of the insulating portion 23 so as to surround the region, and the inner side surface of the through hole And the upper surface of the fixed electrode 22 corresponding to the bottom of the through hole. That is, the fourth plated portion 242 is formed of a portion which is formed to project from the upper surface of the insulating portion 23 toward the second movable electrode 122 and a portion which covers the inside of the through hole, and is surrounded by these The space is the second hollow portion 19. The fixed substrate plating portion 24 is formed, for example, by gold plating. By bonding the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24, the movable portion 10 and the fixed substrate portion 20 are integrated to form the pressure sensor 100. In addition, the second movable portion 122 and the fixed electrode 22 are electrically connected by joining the second plated portion 142 and the fourth plated portion 242.
　第２可動電極１２２とコネクタ２００とは第２可動電極１２２から延びる信号線１５によって接続される。また、圧力センサ１００ａ、１００ｂの第１可動電極１２１の間および圧力センサ１００ｂ、１００ｃの第１可動電極１２１の間は、第１可動電極１２１から延びるグランド（ＧＮＤ）線１６ａによって接続される。図４において、隣り合った圧力センサ１００の間の距離は、例えば、０．１ｍｍから０．３ｍｍである。すなわち、ＧＮＤ線１６ａの長さは、０．１ｍｍから０．３ｍｍである。さらに、圧力センサ１００ｃの第１可動電極１２１は、第１可動電極１２１から延びるＧＮＤ線１６ｂによってコネクタ２００と接続される。すなわち、圧力センサ１００ａ、１００ｂ、１００ｃでは、ＧＮＤが共有される。図４および図５を参照すると理解できるように、圧力センサ１００では、信号線１５とＧＮＤ線１６のいずれもがシート基板１１の下側の面に形成される。すなわち、圧力センサ１００では、第１可動電極１２１から延びる配線と固定電極２２から延びる配線とが同一の層に形成される。圧力センサ１００は、このような構成を採用することで、簡易な配線構造が実現される。 The second movable electrode 122 and the connector 200 are connected by a signal line 15 extending from the second movable electrode 122. The ground (GND) line 16a extending from the first movable electrode 121 is connected between the first movable electrodes 121 of the pressure sensors 100a and 100b and between the first movable electrodes 121 of the pressure sensors 100b and 100c. In FIG. 4, the distance between adjacent pressure sensors 100 is, for example, 0.1 mm to 0.3 mm. That is, the length of the GND line 16a is 0.1 mm to 0.3 mm. Furthermore, the first movable electrode 121 of the pressure sensor 100 c is connected to the connector 200 by the GND line 16 b extending from the first movable electrode 121. That is, GND is shared by the pressure sensors 100a, 100b, and 100c. As can be understood with reference to FIGS. 4 and 5, in the pressure sensor 100, both the signal line 15 and the GND line 16 are formed on the lower surface of the sheet substrate 11. That is, in the pressure sensor 100, the wiring extending from the first movable electrode 121 and the wiring extending from the fixed electrode 22 are formed in the same layer. The pressure sensor 100 can realize a simple wiring structure by adopting such a configuration.
　上述した構成を有する圧力センサ１００は、距離ｄ（図５参照）離れて配置された第１可動電極１２１の固定電極２２と重なり合う領域と固定電極２２の第１可動電極１２１と重なり合う領域とを電極板とするコンデンサとして動作する。コンデンサの静電容量Ｃは、例えば、上述した距離ｄおよび第１可動電極１２１と固定電極２２とが重なり合う領域の面積Ｓ（図５参照）を用いて、以下の（式１）によって算出される。 The pressure sensor 100 having the above-described configuration includes an area overlapping the fixed electrode 22 of the first movable electrode 121 and an area overlapping the first movable electrode 121 of the fixed electrode 22 which are arranged at a distance d (see FIG. 5). It works as a plate capacitor. The capacitance C of the capacitor is calculated, for example, by the following equation 1 using the distance d described above and the area S of the area where the first movable electrode 121 and the fixed electrode 22 overlap (see FIG. 5). .
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000001
　上記（式１）において、ε0は真空の誘電率であり、εrは大気の比誘電率である。すなわち、（式１）によれば、可動部１０に力が加えられることによって生じる第１可動電極１２１と固定電極２２との間の距離ｄの変動に応じて、静電容量Ｃが変動することがわかる。 In the above (formula 1), ε 0 is the dielectric constant of vacuum, and ε r is the dielectric constant of the atmosphere. That is, according to (Expression 1), the electrostatic capacitance C fluctuates according to the fluctuation of the distance d between the first movable electrode 121 and the fixed electrode 22 which is caused by the force applied to the movable portion 10. I understand.
　また、圧力Ｐは、例えば、上述した面積Ｓを用いて以下の（式２）によって算出される。 Moreover, the pressure P is calculated by the following (Formula 2), for example using the area S mentioned above.
Figure JPOXMLDOC01-appb-M000002
Figure JPOXMLDOC01-appb-M000002
　上記（式２）において、Ｆは圧力センサ１００に印加される力の大きさである。上述の通り、基板部２１は容易には変形しない部材によって形成されるため、圧力センサ１００に力が印加されても圧力算出の基準となる面積Ｓの変動が抑制される。そのため、圧力センサ１００は、基板部２１が容易に変形する部材で形成された圧力センサよりも高い精度で圧力を検出できる。 In the above (Formula 2), F is the magnitude of the force applied to the pressure sensor 100. As described above, since the substrate unit 21 is formed of a member that is not easily deformed, even if a force is applied to the pressure sensor 100, the fluctuation of the area S serving as a reference of pressure calculation is suppressed. Therefore, the pressure sensor 100 can detect the pressure with higher accuracy than a pressure sensor formed of a member that the substrate portion 21 is easily deformed.
　図６は、静電容量測定回路３００の構成の一例を示す図である。図６では、圧力センサ１００ａ、１００ｂ、１００ｃも例示されている。また、図６では、コネクタ２００の図示は省略している。静電容量測定回路３００は、２つのマルチプレクサ３０１、３０１（図中では、MUXと記載）とコンバータ３０２を備える。マルチプレクサ３０１、３０１の各々には、圧力センサ１００ａ、１００ｂ、１００ｃの静電容量の変動に伴う信号が信号線１５を介して入力される。マルチプレクサ３０１、３０１の各々は、圧力センサ１００ａ、１００ｂ、１００ｃから入力された信号のうち選択されたひとつを出力する。図６において、マルチプレクサ３０１、３０１が出力する信号の選択に用いられる選択信号の図示は省略されている。コンバータ３０２は、マルチプレクサ３０１、３０１の各々から出力された信号はコンバータ３０２に入力される。コンバータ３０２は、例えば、マルチプレクサ３０１、３０１から入力される信号値と圧力との対応関係を記憶している。コンバータ３０２が管理する対応関係は、例えば、入力される信号値と圧力との対応を示すテーブルであってもよいし、入力される信号値から圧力を算出する数式であってもよい。コンバータ３０２は、例えば、当該対応関係にしたがって、マルチプレクサ３０１、３０１から入力された信号値を圧力を示す信号値に変換し、圧力を示す信号値を出力する。 FIG. 6 is a diagram showing an example of the configuration of the capacitance measuring circuit 300. As shown in FIG. In FIG. 6, the pressure sensors 100a, 100b, and 100c are also illustrated. Further, in FIG. 6, the illustration of the connector 200 is omitted. The capacitance measurement circuit 300 includes two multiplexers 301 and 301 (denoted as MUX in the drawing) and a converter 302. Signals associated with fluctuations in capacitance of the pressure sensors 100 a, 100 b, 100 c are input to the multiplexers 301, 301 via the signal line 15. Each of the multiplexers 301 and 301 outputs a selected one of the signals input from the pressure sensors 100a, 100b and 100c. In FIG. 6, the illustration of selection signals used for selecting the signals output from the multiplexers 301 and 301 is omitted. In the converter 302, the signal output from each of the multiplexers 301 and 301 is input to the converter 302. The converter 302 stores, for example, the correspondence between signal values input from the multiplexers 301 and 301 and pressure. The correspondence relationship managed by the converter 302 may be, for example, a table indicating the correspondence between the input signal value and the pressure, or may be a mathematical expression for calculating the pressure from the input signal value. The converter 302 converts, for example, the signal value input from the multiplexers 301 and 301 into a signal value indicating pressure according to the correspondence relationship, and outputs a signal value indicating pressure.
　図７は、圧力センサ１００に圧力が印加される前の状態の一例を示し、図８は、圧力センサ１００に圧力が印加されたときの状態の一例を示す。圧力センサ１００では、第１中空部１８の上方から圧力が印加されると、図８に例示されるように、シート基板１１および第１可動電極１２１を含む可動部１０が印加された力に応じて固定基板部２０の方向に向けて撓む。また、圧力センサ１００に力が印加されなくなると、圧力センサ１００は図８の状態から図７の状態に戻る。すなわち、圧力センサ１００では、印加された力に応じて、第１可動電極１２１と固定電極２２との間の距離ｄが変動する。距離ｄが変動すると、（式１）により、圧力センサ１００の静電容量が変動する。例えば、図４に例示される静電容量測定回路３００によって圧力センサ１００の静電容量の変動が測定されることで、圧力センサ１００に印加された圧力が検出される。 FIG. 7 shows an example of a state before pressure is applied to the pressure sensor 100, and FIG. 8 shows an example of a state when pressure is applied to the pressure sensor 100. As shown in FIG. In the pressure sensor 100, when a pressure is applied from above the first hollow portion 18, as illustrated in FIG. 8, the pressure is applied according to the force to which the movable portion 10 including the sheet substrate 11 and the first movable electrode 121 is applied. And bend toward the fixed substrate portion 20. Also, when no force is applied to the pressure sensor 100, the pressure sensor 100 returns from the state of FIG. 8 to the state of FIG. That is, in the pressure sensor 100, the distance d between the first movable electrode 121 and the fixed electrode 22 fluctuates according to the applied force. When the distance d changes, the capacitance of the pressure sensor 100 changes according to (Expression 1). For example, the pressure applied to the pressure sensor 100 is detected by measuring the fluctuation of the capacitance of the pressure sensor 100 by the capacitance measuring circuit 300 illustrated in FIG. 4.
　ところで、圧力センサ１００は、第１中空部１８の他に第２中空部１９を有する。第２中空部１９の内側面には、上述の通り、固定電極２２から第２可動電極１２２に達する円筒形状の第４メッキ部２４２が形成される。固定電極２２と第２可動電極１２２とを電気的に接続するだけであれば、第４メッキ部２４２を円筒形状に形成せずに、一本の配線で接続するだけでも足りる。しかしながら、実施形態に係る圧力センサ１００は、離間して設けられる第１可動電極１２１と第２可動電極１２２とのいずれもがシート基板１１に設けられている。そのため、第１可動電極１２１の上方から力が印加されると、第１可動電極１２１が固定電極２２側に撓むとともに、第２可動電極１２２も固定電極２２側に歪む。圧力の高精度な検出のためには、第１可動電極１２１は、前後方向および左右方向において偏りなく固定電極２２に対して撓むことが好ましい。しかしながら、第２可動電極１２２が固定電極２２側に歪んでしまうと、第１可動電極１２１は当該撓みの影響を受け、固定電極２２に対して偏りなく撓むことが困難となる。そこで、実施形態に係る圧力センサ１００では、第４メッキ部２４２を平面視したときの断面形状を略円形または略多角形に形成している。このことにより、固定電極２２と第２可動電極１２２とを一本の配線で接続する構成に比べて、圧力が印加された際の第２可動電極１２２部分における歪みが抑制される。これによって、第１可動電極１２１が固定電極２２に対して撓む際に、前後方向および左右方向に偏りが生じることが抑制される。さらに、一本の配線で第２可動電極１２２を支える場合よりも、断面形状が略円形または略多角形に形成された第４メッキ部２４２は安定して第２可動電極１２２を支えることができる。 The pressure sensor 100 has a second hollow portion 19 in addition to the first hollow portion 18. On the inner side surface of the second hollow portion 19, as described above, the cylindrical fourth plating portion 242 which reaches from the fixed electrode 22 to the second movable electrode 122 is formed. If the fixed electrode 22 and the second movable electrode 122 are only electrically connected, it is sufficient to connect only one wire instead of forming the fourth plated portion 242 in a cylindrical shape. However, in the pressure sensor 100 according to the embodiment, both of the first movable electrode 121 and the second movable electrode 122 provided apart from each other are provided on the sheet substrate 11. Therefore, when a force is applied from above the first movable electrode 121, the first movable electrode 121 is bent to the fixed electrode 22 side, and the second movable electrode 122 is also distorted to the fixed electrode 22 side. In order to detect the pressure with high accuracy, it is preferable that the first movable electrode 121 bends with respect to the fixed electrode 22 without deviation in the front-rear direction and the left-right direction. However, when the second movable electrode 122 is distorted to the fixed electrode 22 side, the first movable electrode 121 is affected by the deflection, and it becomes difficult to deflect the fixed electrode 22 uniformly. So, in the pressure sensor 100 which concerns on embodiment, the cross-sectional shape when planarly viewing the 4th plated part 242 is formed in substantially circle shape or substantially polygon shape. Thereby, distortion in the second movable electrode 122 portion when pressure is applied is suppressed as compared with the configuration in which the fixed electrode 22 and the second movable electrode 122 are connected by one wire. As a result, when the first movable electrode 121 bends with respect to the fixed electrode 22, the occurrence of the deviation in the front-rear direction and the left-right direction is suppressed. Furthermore, the fourth plated portion 242 having a substantially circular or polygonal cross-sectional shape can support the second movable electrode 122 more stably than in the case where the second movable electrode 122 is supported by one wire. .
　図９～図１３は、実施形態に係る圧力センサ１００の一例を示す図である。図９～図１３は、圧力センサ１００を腕３１に装着した状態の一例を示す。図１３は図１２のＢ－Ｂ線に沿った断面の一部を示す。図１０～図１１は図９のＣ－Ｃ線に沿った断面を示す。シート基板１１は可撓性を有するため、圧力センサ１００を腕３１や手首に巻き易く、圧力センサ１００を腕３１や手首に巻いた際の違和感が低減される。シート基板１１をバンド状にすることにより、圧力センサ１００を腕３１や手首に巻き付けてもよい。シート基板１１に両面粘着シートを貼付することにより、圧力センサ１００を腕３１や手首に貼付してもよい。圧力センサ１００は、腕３１や手首に限らず、人体の他の部位に巻き付けたり、貼付したりしてもよい。 9 to 13 show an example of the pressure sensor 100 according to the embodiment. 9 to 13 show an example of a state in which the pressure sensor 100 is attached to the arm 31. FIG. FIG. 13 shows a part of a cross section taken along the line BB in FIG. 10 to 11 show a cross section taken along the line CC of FIG. Since the sheet substrate 11 has flexibility, the pressure sensor 100 can be easily wound around the arm 31 or the wrist, and the discomfort when the pressure sensor 100 is wound around the arm 31 or the wrist can be reduced. The pressure sensor 100 may be wound around the arm 31 or the wrist by forming the sheet substrate 11 in a band shape. The pressure sensor 100 may be attached to the arm 31 or the wrist by attaching a double-sided adhesive sheet to the sheet substrate 11. The pressure sensor 100 is not limited to the arm 31 or the wrist, and may be wound or attached to another part of the human body.
　図９では、複数の固定基板部２０の長手方向が、シート基板１１の長手方向と一致した状態で、複数の固定基板部２０がシート基板１１に配置されている。図９では、シート基板１１の長手方向が、腕３１の長手方向と直交した状態で、圧力センサ１００が腕３１に装着されている。したがって、各固定基板部２０の短手方向が、腕３１の長手方向と一致している。固定基板部２０の短手方向は、固定基板部２０の長手方向と直交している。図９に示す固定基板部２０の配置例では、固定基板部２０のピッチが大きくなる。図９に示す固定基板部２０の配置例における固定基板部２０のピッチは、隣接する２つの固定基板部２０の間の距離と固定基板部２０の長手方向の幅との合計値である。図９に示す固定基板部２０の配置例によれば、各固定基板部２０の長手方向が腕３１の短手方向と一致するため、手首を曲げやすい。図１０は、手首を内側に曲げた状態を示しており、図１１は、手首を外側に曲げた状態を示している。 In FIG. 9, the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 in a state in which the longitudinal direction of the plurality of fixed substrate units 20 matches the longitudinal direction of the sheet substrate 11. In FIG. 9, the pressure sensor 100 is attached to the arm 31 in a state where the longitudinal direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the arm 31. Therefore, the short side direction of each fixed substrate portion 20 coincides with the longitudinal direction of the arm 31. The short direction of the fixed substrate portion 20 is orthogonal to the longitudinal direction of the fixed substrate portion 20. In the arrangement example of the fixed substrate unit 20 shown in FIG. 9, the pitch of the fixed substrate unit 20 is increased. The pitch of the fixed substrate portions 20 in the arrangement example of the fixed substrate portions 20 shown in FIG. 9 is a total value of the distance between two adjacent fixed substrate portions 20 and the width in the longitudinal direction of the fixed substrate portions 20. According to the arrangement example of the fixed substrate portion 20 shown in FIG. 9, since the longitudinal direction of each fixed substrate portion 20 coincides with the short direction of the arm 31, the wrist is easily bent. FIG. 10 shows the state in which the wrist is bent inward, and FIG. 11 shows the state in which the wrist is bent outward.
　図１２では、複数の固定基板部２０の長手方向が、シート基板１１の長手方向と直交した状態で、複数の固定基板部２０がシート基板１１に配置されている。図１２では、シート基板１１の長手方向が、腕３１の長手方向と直交した状態で、圧力センサ１００が腕３１に装着されている。したがって、各固定基板部２０の長手方向が、腕３１の長手方向と一致している。図１２に示す固定基板部２０の配置例では、固定基板部２０のピッチが小さくなる。図１２に示す固定基板部２０の配置例における固定基板部２０のピッチは、隣接する２つの固定基板部２０の間の距離と固定基板部２０の短手方向の幅との合計値である。図１２に示す固定基板部２０の配置例によれば、固定基板部２０のピッチが小さくなるため、圧力センサ１００に対して狭い範囲で印加された圧力を測定することができる。例えば、図１３に示すように、腕３１の腱３２と腱３２との間における血管３３は数ｍｍである。固定基板部２０のピッチが小さい場合、血管３３の近傍に可動電極１２を配置することが容易であり、圧力センサ１００の装着性が向上する。また、血管３３の近傍に可動電極１２を配置することで、脈拍を測定する際の圧力センサ１００の測定精度が向上する。なお、腱３２及び血管３３の下部には橈骨３４が存在している。 In FIG. 12, the plurality of fixed substrate units 20 are disposed on the sheet substrate 11 in a state in which the longitudinal direction of the plurality of fixed substrate units 20 is orthogonal to the longitudinal direction of the sheet substrate 11. In FIG. 12, the pressure sensor 100 is attached to the arm 31 in a state where the longitudinal direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the arm 31. Therefore, the longitudinal direction of each fixed substrate portion 20 coincides with the longitudinal direction of the arm 31. In the arrangement example of the fixed substrate unit 20 shown in FIG. 12, the pitch of the fixed substrate unit 20 is reduced. The pitch of the fixed substrate portions 20 in the arrangement example of the fixed substrate portions 20 shown in FIG. 12 is a total value of the distance between the two adjacent fixed substrate portions 20 and the width in the short direction of the fixed substrate portions 20. According to the arrangement example of the fixed substrate unit 20 shown in FIG. 12, the pitch of the fixed substrate unit 20 is reduced, so that the pressure applied in a narrow range with respect to the pressure sensor 100 can be measured. For example, as shown in FIG. 13, the blood vessel 33 between the tendon 32 of the arm 31 and the tendon 32 is several mm. When the pitch of the fixed substrate portion 20 is small, it is easy to arrange the movable electrode 12 in the vicinity of the blood vessel 33, and the mounting property of the pressure sensor 100 is improved. Further, by disposing the movable electrode 12 in the vicinity of the blood vessel 33, the measurement accuracy of the pressure sensor 100 when measuring the pulse is improved. Ribs 34 exist below the tendon 32 and the blood vessel 33.
　図１４および図１５は実施形態に係る圧力センサ１００の一例を示す図である。図１４および図１５は固定基板部２０の平面図の一例である。固定基板部２０は、長辺４１および短辺４２を有する長方形である。図１４では、複数の固定基板部２０の長辺４１が伸びる方向と、シート基板１１の長手方向とが一致するように、複数の固定基板部２０がシート基板１１に配置されている。複数の固定基板部２０のうち隣り合う２つの固定基板部２０の短辺４２同士が向かい合っている。図１４に示す固定基板部２０の配置例によれば、シート基板１１の短手方向の幅が細くなるため、幅が細い部位に対して圧力センサ１００を巻き付けたり、貼付したりすることができる。シート基板１１の短手方向は、シート基板１１の長手方向と直交している。図１４に示す例では、複数の固定基板部２０を一列に並べているが、複数の固定基板部２０を二列以上に並べてもよい。すなわち、複数の固定基板部２０をアレイ状（格子状）に並べてもよい。 14 and 15 are diagrams showing an example of the pressure sensor 100 according to the embodiment. 14 and 15 are examples of plan views of the fixed substrate portion 20. FIG. The fixed substrate portion 20 is a rectangle having a long side 41 and a short side 42. In FIG. 14, the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the direction in which the long sides 41 of the plurality of fixed substrate portions 20 extend and the longitudinal direction of the sheet substrate 11 coincide. Short sides 42 of two adjacent fixed substrate portions 20 among the plurality of fixed substrate portions 20 face each other. According to the arrangement example of the fixed substrate portion 20 shown in FIG. 14, the width in the short direction of the sheet substrate 11 is narrowed, so that the pressure sensor 100 can be wound or attached to a portion where the width is narrow. . The short direction of the sheet substrate 11 is orthogonal to the longitudinal direction of the sheet substrate 11. In the example shown in FIG. 14, the plurality of fixed substrate units 20 are arranged in a line, but the plurality of fixed substrate units 20 may be arranged in two or more lines. That is, the plurality of fixed substrate units 20 may be arranged in an array (a lattice).
　図１５では、複数の固定基板部２０の短辺４２が伸びる方向と、シート基板１１の長手方向とが一致するように、複数の固定基板部２０がシート基板１１に配置されている。複数の固定基板部２０のうち隣り合う２つの固定基板部２０の長辺４１同士が向かい合っている。図１５に示す固定基板部２０の配置例によれば、固定基板部２０のピッチが小さくなるため、圧力センサ１００に対して狭い範囲で印加された圧力を測定することができ、圧力センサ１００の測定精度が向上する。図１５に示す例では、複数の固定基板部２０を一列に並べているが、複数の固定基板部２０を二列以上に並べてもよい。すなわち、複数の固定基板部２０をアレイ状（格子状）に並べてもよい。 In FIG. 15, the plurality of fixed substrate portions 20 are disposed on the sheet substrate 11 such that the direction in which the short sides 42 of the plurality of fixed substrate portions 20 extend and the longitudinal direction of the sheet substrate 11 coincide. The long sides 41 of two adjacent fixed substrate portions 20 of the plurality of fixed substrate portions 20 face each other. According to the arrangement example of the fixed substrate portion 20 shown in FIG. 15, since the pitch of the fixed substrate portion 20 is reduced, the pressure applied in a narrow range with respect to the pressure sensor 100 can be measured. Measurement accuracy is improved. In the example shown in FIG. 15, the plurality of fixed substrate units 20 are arranged in a line, but the plurality of fixed substrate units 20 may be arranged in two or more lines. That is, the plurality of fixed substrate units 20 may be arranged in an array (a lattice).
　シート基板１１を共有して複数のセンサ素子１０１を並べることが可能である。すなわち、単一のシート基板１１に複数の可動電極１２を設けることにより、単一のシート基板１１に複数の可動電極１２および複数の固定基板部２０を列状またはアレイ状（格子状）に配置することが可能である。この場合、複数の可動電極１２同士が離間し、複数の固定基板部２０同士が離間している。そのため、圧力センサ１００に圧力が印加された際、隣接する複数の可動部１０の一方が、隣接する複数の可動部１０の他方の変形を阻害しない。したがって、圧力センサ１００に圧力が印加された際における可動部１０の変形が阻害されず、圧力センサ１００に印加された圧力を高い精度で測定することができる。 It is possible to arrange the plurality of sensor elements 101 by sharing the sheet substrate 11. That is, by providing the plurality of movable electrodes 12 on the single sheet substrate 11, the plurality of movable electrodes 12 and the plurality of fixed substrate portions 20 are arranged in a row or array (lattice) on the single sheet substrate 11. It is possible. In this case, the plurality of movable electrodes 12 are separated, and the plurality of fixed substrate portions 20 are separated. Therefore, when pressure is applied to the pressure sensor 100, one of the plurality of adjacent movable portions 10 does not inhibit the deformation of the other of the plurality of adjacent movable portions 10. Therefore, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not inhibited, and the pressure applied to the pressure sensor 100 can be measured with high accuracy.
　＜圧力センサ１００の製造工程＞
　図１６Ａから図１６Ｉは、圧力センサ１００の製造工程の一例を示す図である。以下、図１６Ａから図１６Ｉを参照して、圧力センサ１００の製造工程の一例について説明する。 <Manufacturing process of pressure sensor 100>
16A to 16I illustrate an example of a manufacturing process of the pressure sensor 100. FIG. Hereinafter, an example of a manufacturing process of the pressure sensor 100 will be described with reference to FIGS. 16A to 16I.
　（固定基板部２０の製造工程）
　図１６Ａから図１６Ｅは固定基板部２０の製造工程の一例を示す。図１６Ａでは、基板部２１の可動部１０に対向する面上に固定電極２２が形成される。続いて、図１６Ｂでは、固定電極２２を覆うように絶縁膜２３１が形成される。さらに、図１６Ｂでは、絶縁膜２３１の可動部１０に対向する面上にレジスト膜５１が形成される。図１６Ｃでは、レジスト膜５１に対して所望のパターンが形成されたフォトマスクを用いてフォトレジストを行うことで、絶縁膜２３１上に所定パターンのレジスト膜５１が形成される。図１６Ｄでは、エッチング処理が行われ、さらにレジスト膜５１が除去されることで、絶縁部２３が形成される。図１６Ｅでは、絶縁部２３の可動部１０に対向する面上に固定基板側メッキ部２４が形成される。図１６Ｅに例示される工程では、固定基板側メッキ部２４を形成しない領域にメッキレジストが行われた上でメッキ処理を行うことで、所望の領域に固定基板側メッキ部２４が形成される。なお、固定基板側メッキ部２４の形成はスパッタリングにより形成してもよい。即ち、スパッタ装置にて絶縁部２３の可動部１０に対向する面上にメッキ層を成膜した後で、レジストを塗布してエッチングすることによって固定基板側メッキ部２４のパターンを形成するのであってもよい。 (Manufacturing process of fixed substrate portion 20)
16A to 16E show an example of the manufacturing process of the fixed substrate portion 20. FIG. In FIG. 16A, the fixed electrode 22 is formed on the surface of the substrate 21 facing the movable portion 10. Subsequently, in FIG. 16B, the insulating film 231 is formed so as to cover the fixed electrode 22. Furthermore, in FIG. 16B, a resist film 51 is formed on the surface of the insulating film 231 facing the movable portion 10. In FIG. 16C, a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing photoresist on the resist film 51 using a photomask in which a desired pattern is formed. In FIG. 16D, the etching process is performed, and the resist film 51 is further removed, whereby the insulating portion 23 is formed. In FIG. 16E, the fixed substrate side plated portion 24 is formed on the surface of the insulating portion 23 facing the movable portion 10. In the process illustrated in FIG. 16E, the plating resist is performed on the area where the fixed substrate side plated portion 24 is not formed, and then the plating process is performed to form the fixed substrate side plated portion 24 in a desired area. The fixed substrate side plated portion 24 may be formed by sputtering. That is, after a plating layer is formed on the surface of the insulating portion 23 facing the movable portion 10 by a sputtering apparatus, a resist is applied and etched to form a pattern of the fixed substrate plating portion 24. May be
　（可動部１０の製造工程）
　図１６Ｆおよび図１６Ｇは可動部１０の製造工程の一例を示す。図１６Ｆでは、可撓性を有するシート基板１１の固定基板部２０に対向する面上に可動電極１２が形成される。さらに、可動電極１２の固定基板部２０に対向する面に対してメッキ処理が行われることで、可動部側メッキ部１４が形成される。図１６Ｇでは、可動部側メッキ部１４の固定基板部２０に対向する面上において、第１可動電極１２１および第２可動電極１２２に相当する領域に対してエッチングレジストが行われた上でエッチングが行われることで、第１可動電極１２１および第２可動電極１２２が形成される。 (Manufacturing process of movable part 10)
16F and 16G show an example of the manufacturing process of the movable part 10. In FIG. 16F, the movable electrode 12 is formed on the surface of the flexible sheet substrate 11 facing the fixed substrate portion 20. Furthermore, the plating process is performed on the surface of the movable electrode 12 facing the fixed substrate portion 20, whereby the movable portion-side plated portion 14 is formed. In FIG. 16G, etching is performed on the area corresponding to the first movable electrode 121 and the second movable electrode 122 on the surface facing the fixed substrate portion 20 of the movable portion-side plated portion 14 and then the etching is performed. By being performed, the first movable electrode 121 and the second movable electrode 122 are formed.
　（可動部１０と固定基板部２０の接合工程）
　図１６Ｈおよび図１６Ｉは、固定基板部２０と可動部１０とを接合する工程の一例を示す。図１６Ｈでは、可動部１０と固定基板部２０とが接合される。接合方法には特に限定は無い。可動部１０と固定基板部２０とは、例えば、常温接合によって接合されてもよい。常温接合では、例えば、可動部１０の可動部側メッキ部１４の固定基板部２０に対向する面と固定基板部２０の固定基板側メッキ部２４の可動部１０に対向する面に対して、当該面を平滑にする処理と、当該面から不純物を除去して清浄にする処理が行われる。これらの処理が施された可動部側メッキ部１４と固定基板側メッキ部２４とが接触すると、可動部側メッキ部１４と固定基板側メッキ部２４との間で働く分子間力によって、可動部１０と固定基板部２０とが接合される。図１６Ｉでは、図１６Ａから図１６Ｈまでの工程によって製造された圧力センサ１００をシート基板１１を共有する形で３つ並べた様子を例示する。圧力センサ１００は、図１６Ｉに例示するように、シート基板１１を共有して複数のセンサ素子１０１を並べることで、圧力検出の対象とする面積を広げることが可能である。 (Step of bonding movable portion 10 and fixed substrate portion 20)
16H and 16I show an example of the process of joining the fixed substrate part 20 and the movable part 10. As shown in FIG. In FIG. 16H, the movable portion 10 and the fixed substrate portion 20 are joined. There is no limitation in particular in the joining method. The movable portion 10 and the fixed substrate portion 20 may be joined by, for example, normal temperature bonding. In the normal temperature bonding, for example, the surface of the movable portion side plated portion 14 of the movable portion 10 facing the fixed substrate portion 20 and the surface of the fixed substrate portion 20 facing the movable portion 10 of the fixed substrate side plated portion 24 are A process of smoothing the surface and a process of removing impurities from the surface to clean the surface are performed. When the movable-part-side plated part 14 subjected to these treatments comes into contact with the fixed-substrate-side plated part 24, the intermolecular force acting between the movable-part-side plated part 14 and the fixed-substrate-side plated part 24 causes the movable part to move. 10 and the fixed substrate portion 20 are joined. FIG. 16I illustrates a state in which three pressure sensors 100 manufactured by the steps of FIGS. 16A to 16H are arranged side by side so as to share the sheet substrate 11. As illustrated in FIG. 16I, the pressure sensor 100 can widen the area to be subjected to pressure detection by sharing the sheet substrate 11 and arranging the plurality of sensor elements 101.
　また、可動部１０と固定基板部２０の接合工程において可動部側メッキ部１４及び固定基板側メッキ部２４の表面を平坦化する処理を行わずに、可動部１０、固定基板部２０それぞれの製造工程で、表面の平坦性を担保するようにしてもよい。例えば、可動部１０の製造工程において、シート基板１１に対して可動電極１２となる金属（例えば銅）をＣＭＰ（Chemical Mechanical Polishing）処理して平坦にし、その上にスパッタ装置で可動部側メッキ部１４を成膜するのであってもよい。 In addition, in the bonding step of the movable portion 10 and the fixed substrate portion 20, manufacturing of the movable portion 10 and the fixed substrate portion 20 is performed without performing a process of flattening the surfaces of the movable portion side plated portion 14 and the fixed substrate side plated portion 24. The flatness of the surface may be ensured in the process. For example, in the manufacturing process of the movable portion 10, metal (for example, copper) to be the movable electrode 12 is planarized by CMP (Chemical Mechanical Polishing) processing to the sheet substrate 11 and planarized, and the movable portion side plated portion 14 may be formed into a film.
　以上で開示した実施形態や変形例はそれぞれ組み合わせる事ができる。 The embodiments and modifications disclosed above can be combined with each other.
　１００、１００ａ、１００ｂ、１００ｃ・・・圧力センサ
　１０・・・可動部
　１１・・・シート基板
　１２・・・可動電極
　１３・・・中空部
　１２１・・・第１可動電極
　１２２・・・第２可動電極
　１４・・・可動部側メッキ部
　１４１・・・第１メッキ部
　１４２・・・第２メッキ部
　１５・・・信号線
　１６、１６ａ、１６ｂ・・・ＧＮＤ線
　１８・・・第１中空部
　１９・・・第２中空部
　２０・・・固定基板部
　２１・・・基板部
　２２・・・固定電極
　２３・・・絶縁部
　２４・・・固定基板側メッキ部
　２４１・・・第３メッキ部
　２４２・・・第４メッキ部
　５１・・・レジスト膜
　２００・・・コネクタ
　２３１・・・絶縁膜
　３００・・・静電容量測定回路
　３０１・・・マルチプレクサ
　３０２・・・コンバータ 100, 100a, 100b, 100c ... pressure sensor 10 ... movable portion 11 ... sheet substrate 12 ... movable electrode 13 ... hollow portion 121 ... first movable electrode 122 ... second Movable electrode 14 Movable part side plated part 141 First plated part 142 Second plated part 15 Signal line 16, 16a, 16b GND line 18 First hollow Section 19: Second hollow portion 20: Fixed substrate portion 21: Substrate portion 22: Fixed electrode 23: Insulation portion 24: Fixed substrate side plated portion 241: Third plating Part 242: Fourth plated part 51: Resist film 200: Connector 231: Insulating film 300: Capacitance measurement circuit 301: Multiplexer 302: Converter

Claims (3)

  1. 　可撓性を有するシート基板および前記シート基板に設けられた複数の第１の電極を含むフレキシブル基板と、
    　前記第１の電極に対向して配置される第２の電極を含み、前記フレキシブル基板との間に中空部を介して前記フレキシブル基板に対向配置された複数の硬質基板と、
    　を備え、
    　前記中空部において、前記第１の電極が前記第２の電極に対して撓むことで生じる静電容量の変化を検出することにより、前記第１の電極における前記第２の電極との対向面に向けて印加される圧力を測定する、静電容量式圧力センサであって、
    　複数の前記硬質基板の長手方向が、前記シート基板の長手方向と一致又は直交するように、複数の前記硬質基板が前記シート基板に配置されている、
    　静電容量式圧力センサ。     A flexible substrate including a flexible sheet substrate and a plurality of first electrodes provided on the sheet substrate;
    A plurality of hard substrates including a second electrode disposed to face the first electrode, and disposed to face the flexible substrate via the hollow portion between the second electrode and the flexible substrate;
    Equipped with
    In the hollow portion, a surface of the first electrode facing the second electrode is detected by detecting a change in capacitance caused by the first electrode bending with respect to the second electrode. A capacitive pressure sensor that measures the pressure applied towards the
    The plurality of hard substrates are disposed on the sheet substrate such that the longitudinal direction of the plurality of hard substrates coincides with or is orthogonal to the longitudinal direction of the sheet substrate.
    Capacitive pressure sensor.
  2. 　複数の前記硬質基板が、短辺と長辺とを有する長方形であり、
    　複数の前記硬質基板の前記長辺が伸びる方向と、前記シート基板の長手方向とが一致するように、複数の前記硬質基板が前記シート基板に配置され、
    　複数の前記硬質基板のうち隣り合う２つの前記硬質基板の前記短辺同士が向かい合っている、
    　請求項１に記載の静電容量式圧力センサ。     The plurality of hard substrates are rectangles having short sides and long sides,
    The plurality of hard substrates are disposed on the sheet substrate such that the direction in which the long sides of the plurality of hard substrates extend and the longitudinal direction of the sheet substrate coincide with each other.
    The short sides of two adjacent ones of the rigid substrates of the plurality of rigid substrates face each other,
    The capacitive pressure sensor according to claim 1.
  3. 　複数の前記硬質基板が、短辺と長辺とを有する長方形であり、
    　複数の前記硬質基板の前記短辺が伸びる方向と、前記シート基板の長手方向とが一致するように、複数の前記硬質基板が前記シート基板に配置され、
    　複数の前記硬質基板のうち隣り合う２つの前記硬質基板の前記長辺同士が向かい合っている、
    　請求項１に記載の静電容量式圧力センサ。     The plurality of hard substrates are rectangles having short sides and long sides,
    The plurality of hard substrates are arranged on the sheet substrate such that the direction in which the short sides of the plurality of hard substrates extend and the longitudinal direction of the sheet substrate coincide with each other.
    The long sides of two adjacent ones of the plurality of rigid substrates adjacent to each other face each other,
    The capacitive pressure sensor according to claim 1.
PCT/JP2018/040368 2017-11-15 2018-10-30 Capacitance-type pressure sensor WO2019098015A1 (en)

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