WO2019091574A1

WO2019091574A1 - Method of aligning a carrier, apparatus for aligning a carrier, and vacuum system

Info

Publication number: WO2019091574A1
Application number: PCT/EP2017/078925
Authority: WO
Inventors: Sathiyamurthi GOVINDASAMY; Wolfgang Klein; Srinivas Salugu; Andreas Sauer; Sebastian Gunther ZANG
Original assignee: Applied Materials, Inc.
Priority date: 2017-11-10
Filing date: 2017-11-10
Publication date: 2019-05-16
Also published as: KR20190054032A; JP2020500413A; CN110024100A; TW201932999A

Abstract

Methods of aligning a carrier, particularly a mask carrier, are described. According to an embodiment, the method includes: transporting a carrier (110) in a transport direction (T), inserting a first alignment element (152) of an alignment assembly (150) into a second alignment element of the carrier, or vice versa, and horizontally aligning the carrier relative to the alignment assembly (150) in the transport direction (T) by lowering the carrier while the first alignment element is inserted in the second alignment element, or vice versa. According to further embodiments, an apparatus for aligning a carrier is provided. The apparatus may be configured for exchanging a mask device from a mask carrier. Yet further, a mask carrier is provided.

Description

METHOD OF ALIGNING A CARRIER, APPARATUS FOR ALIGNING A CARRIER, AND VACUUM SYSTEM

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to methods of aligning a carrier, particularly a mask carrier configured to carry a mask device. More specifically, embodiments of the present disclosure relate to methods of handling mask devices, wherein the mask devices are configured for a masked deposition process on a substrate in a vacuum system. Further embodiments relate to an apparatus for aligning a carrier. More specifically, an apparatus configured for exchanging a mask device from a mask carrier in a vacuum system is described. Further embodiments relate to a vacuum system for depositing materials on a substrate, the vacuum system including an apparatus for aligning a carrier. Further, carriers for carrying mask devices or other objects are provided.

BACKGROUND [0002] Opto-electronic devices that make use of organic materials are becoming increasingly popular for a number of reasons. Many of the materials used to make such devices are relatively inexpensive, so organic opto-electronic devices have the potential for cost advantages over inorganic devices. The inherent properties of organic materials, such as flexibility, may be advantageous for applications such as for the deposition on flexible or inflexible substrates. Examples of organic opto-electronic devices include organic light emitting devices (OLEDs), organic phototransistors, organic photovoltaic cells, and organic photodetectors.

[0003] The organic materials may have performance advantages over conventional materials. For example, the wavelength at which an organic emissive layer emits light may be readily tuned with appropriate dopants. OLEDs make use of thin organic films that emit light when a voltage is applied across the device. OLEDs are becoming an increasingly interesting technology for use in applications such as flat panel displays, illumination, and backlighting.

[0004] Materials, particularly organic materials, are typically deposited on a substrate in a vacuum system under sub-atmospheric pressure. During deposition, a mask device is arranged in front of the substrate, wherein the mask device may have one or more openings that define an opening pattern corresponding to a material pattern to be deposited on the substrate, e.g. by evaporation. The substrate is typically arranged behind the mask device during deposition and is aligned relative to the mask device. [0005] A mask carrier may be used to carry the mask device through the vacuum system, e.g., from a mask handling module to a vacuum deposition module, and a substrate carrier may be used to carry the substrate through the vacuum system, e.g. from a substrate loading module to the vacuum deposition module.

[0006] It may be beneficial to unload used mask devices from the vacuum system at regular time intervals, e.g. for cleaning, mask exchange or maintenance of the used mask devices. Further, it may be beneficial to load mask devices to be used into the vacuum system at regular time intervals, e.g. for mask exchange or for providing clean or unused masks in the vacuum system. However, mask exchange is time-consuming and may lead to idle times of the system which increase the cost of ownership. [0007] Accordingly, there is a need for a method and an apparatus for quick and efficient mask and substrate handling in a vacuum system. In particular, simplifying and accelerating the mask exchange in a vacuum system configured for masked deposition on substrates would be beneficial.

SUMMARY [0008] In light of the above, a method of aligning a carrier, an apparatus for aligning a carrier, a vacuum system for depositing a material on a substrate as well as a mask carrier for carrying a mask device are provided. [0009] According to an aspect of the present disclosure, a method of aligning a carrier is provided. The method includes transporting a carrier along a transportation path in a transport direction, inserting a first alignment element of an alignment assembly into a second alignment element of the carrier, and horizontally aligning the carrier in the transport direction by lowering or lifting the carrier while the first alignment element is inserted in the second alignment element.

[0010] Alternatively, a second alignment element of the mask carrier is inserted in a first alignment element of the alignment assembly, and the carrier is horizontally aligned in the transport direction by lowering or lifting the carrier while the second alignment element is inserted in the first alignment element.

[0011] In some embodiments, the carrier is a mask carrier configured to carry a mask device. The mask carrier may be aligned relative to a mask handling assembly which is configured for exchanging a mask device carried by the mask carrier.

[0012] According to a further aspect of the present disclosure, an apparatus for aligning a carrier is provided. The apparatus includes a transport system configured to transport a carrier along a transport path in a transport direction, and an alignment assembly including a first alignment element configured to be inserted in a second alignment element of a carrier, wherein the transport system is configured to lower or lift the carrier for horizontally aligning the carrier in the transport direction relative to the mask handling assembly.

[0013] The transport system may be configured to lower or lift the mask carrier while the first alignment element is inserted in the second alignment element, such that the mask carrier is aligned in the horizontal direction by a co-operation of the first and second alignment elements. [0014] Alternatively, a second alignment element of the carrier is configured to be inserted in a first alignment element of the alignment assembly, wherein the transport system is configured to lower or lift the carrier for horizontally aligning the carrier in the transport direction relative to the mask handling assembly while the second alignment element is inserted in the first alignment element. [0015] In some embodiments, the apparatus further includes a mask handling assembly configured to exchange a mask device carried by a mask carrier, wherein the alignment assembly is configured to align the mask carrier relative to the mask handling assembly. [0016] According to a further aspect of the present disclosure, an apparatus for handling mask devices is provided. The apparatus includes a transport system configured to transport a mask carrier along a transport path in a transport direction, a mask handling assembly with a mask holding portion, and an alignment assembly including a first alignment element configured to be inserted in a second alignment element of a mask carrier. The mask holding portion and the alignment assembly are configured to be movable toward and away from the transport path independently of each other.

[0017] According to a further aspect of the present disclosure, a vacuum system is provided. The vacuum system includes a vacuum deposition module, wherein one or more deposition sources for depositing a material on a substrate are arranged in the vacuum deposition module, and a mask handling module including an apparatus for aligning a carrier according to any of the embodiments described herein. The transport system may be configured to transport mask carriers between the mask handling module and the vacuum deposition module. [0018] According to a further aspect of the present disclosure, a carrier is provided. The carrier may be a mask carrier configured to carry a mask device. The carrier includes a second alignment element configured as a tapering recess into which a first alignment element of an alignment assembly can be inserted for horizontally aligning the mask carrier in a transport direction by lowering or lifting the carrier relative to the alignment assembly.

[0019] Further aspects, advantages and features of the present disclosure are apparent from the description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following. Typical embodiments are depicted in the drawings and are detailed in the description which follows.

[0021] FIGS. 1A-C are schematic illustrations of subsequent stages of a method of aligning a carrier according to embodiments described herein with an apparatus according to embodiments described herein. The apparatus is shown together with a carrier in a front view (left part) and in a sectional view (right part), respectively.

[0022] FIGS. 2A-K are schematic illustrations of subsequent stages of a method for aligning a carrier with an apparatus according to embodiments described herein. The apparatus is shown in a front view (left part), in a first sectional view (middle part) and in a second sectional view (right part).

[0023] FIG. 3A-C are schematic perspective views showing different positions of an apparatus according to embodiments described herein; and;

[0024] FIGS. 4 is a flow diagram illustrating a method of aligning a carrier according to embodiments described herein. DETAILED DESCRIPTION OF EMBODIMENTS

[0025] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. [0026] Within the following description of the drawings, same reference numbers refer to same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment applies to a corresponding part or aspect in another embodiment as well.

[0027] FIGS. 1A-C are schematic illustrations of subsequent stages of a method of aligning a carrier 110 with an apparatus 100 according to embodiments described herein. In some embodiments, the carrier 110 is a mask carrier 111 configured to carry a mask device 10, and the apparatus 100 is configured for exchanging the mask device 10 which is carried by the mask carrier 111 by a second mask device.

[0028] The right part of FIG. 1A shows the apparatus 100 in a sectional view in a sectional plane SI . The left part of FIG. 1A is a schematic front view. The sectional plane SI intersects a first alignment element 152 and a second alignment element 112, as is illustrated in the left part of FIG. 1A. [0029] The apparatus 100 includes a transport system 105 configured to transport the carrier 110 in a transport direction T and an alignment assembly 150 comprising a first alignment element 152 configured to be engaged with a second alignment element 112 of the carrier 110.

[0030] The carrier 110 is not a part of the apparatus 100. However, also a system including an apparatus 100 and a carrier 110 forms a part of the present disclosure and can be made subject matter of an independent claim.

[0031] In some embodiments, the transport system 105 may be configured for a contactless transport of the carrier 110 in the transport direction T along a transport path or transport track. In particular, the transport system 105 may be a magnetic levitation system configured to contactlessly hold and transport the carrier 110 along the transport path.

[0032] In some implementations, the transport system 105 may include one or more active magnetic bearings configured to contactlessly hold the carrier with respect to a transport track in a floating state. Alternatively or additionally, the transport system 105 may include one or more drive units, e.g. linear motors, configured to move the carrier 110 along the transport track while the carrier is maintained in the floating state. [0033] In the embodiment of FIG. 1A, the carrier 110 is contactlessly held at the transport track of the transport system 105.

[0034] A "carrier" as used herein may be understood as a carrier device configured to carry an object through a vacuum system. The carrier may include a guided portion configured to cooperate with the transport system 105, such that the carrier can be moved along the transport path, and a holding portion configured to hold the object, particularly in an essentially vertical orientation. In some embodiments, the carrier is a mask carrier configured to carry a mask device. In some embodiments, the carrier is a substrate carrier configured to carry a substrate. The carrier may be configured to carry a flat object having a size of lm² or more. The carrier may include a plate-like body configured to be transported by the transport system 105 in an essentially vertical orientation.

[0035] A "mask carrier" as used herein may be understood as a carrier 110 configured to carry a mask device 10. The mask carrier 111 can be transported along a transport path in a vacuum system while carrying the mask device 10. For example, the mask device 10 may be held at the mask carrier 111 by a chucking device, e.g. by an electrostatic and/or a magnetic chuck. In embodiments, the carrier 110 includes a magnetic chuck configured to hold the mask device 10 at a front side of the mask carrier 111, as is schematically depicted in FIG. 1A. In some embodiments, the mask carrier 111 includes an electropermanent magnet device (EPM) configured to hold the mask device 10 at the front side of the mask carrier 111.

[0036] The mask carrier 111 may be configured to carry a mask device 10 having a size of 1 m² or more. The mask carrier 111 may include a plate-like body portion having an opening which is covered by the mask device 10, such that the mask device which is carried by the mask carrier can be used for a masked deposition process. [0037] The mask device 10 can be attached to the mask carrier 111 or detached from the mask carrier 111 in a mask handling module of a vacuum system, and the mask carrier 111 can be transported to a vacuum deposition module of the vacuum system where the mask device 10 can be used for a masked deposition process on a substrate. [0038] A "mask device" is to be understood as a mask device configured for masked deposition on a substrate. In particular, the mask device is configured to be arranged in front of a substrate that is to be coated with a material pattern defined by the mask device. For example, the mask device may be configured for a masked evaporation process, wherein a material pattern is formed on a substrate by evaporation. The evaporated material may include organic compounds in some embodiments. For example, an OLED device may be manufactured.

[0039] In some embodiments, the mask device 10 may include a mask and a mask support. The mask support may be configured for supporting and holding the mask which is typically a delicate component. For example, the mask support may be a mask frame that surrounds the mask and has the shape of a frame. The mask may be permanently fixed to the mask frame, e.g. by welding, or the mask may be releasably fixed to the mask frame. A circumferential edge of the mask may be fixed to the mask frame.

[0040] The mask may include a plurality of openings formed in a pattern and configured to deposit a corresponding material pattern on a substrate by the masked deposition process. During deposition, the mask may be arranged at a close distance in front of the substrate or in direct contact with the front surface of the substrate. For example, the mask may be a fine metal mask (FMM) with a plurality of openings, e.g. 100.000 openings or more. For example, a pattern of organic pixels may be deposited on the substrate. Other types of masks are possible, e.g. edge exclusion masks.

[0041] In some embodiments, the mask device may be at least partially made of a metal, e.g. of a metal with a small thermal expansion coefficient such as invar. The mask may include a magnetic material so that the mask can be magnetically attracted toward the substrate during deposition. Alternatively or additionally, the mask frame may include a magnetic material so that the mask device can be attracted to a mask carrier via magnetic forces, e.g. by a magnetic chuck.

[0042] The mask device 10 may have an area of 0.5 m² or more, particularly 1 m² or more. For example, a height of the mask device may be 0.5 m or more, particularly 1 m or more, and/or a width of the mask device may be 0.5 m or more, particularly 1 m or more. A thickness of the mask device may be 1 cm or less, wherein the mask frame may be thicker than the mask.

[0043] As is schematically depicted in FIG. 1A, the carrier 110 carrying the mask device 10 (or another object) is transported by the transport system 105 along a transportation path in the transport direction T. The transport direction T is typically an essentially horizontal direction. During the transport, the carrier 110 may be essentially vertically oriented.

[0044] An "essentially vertical orientation" of the carrier as used herein may be understood as an orientation, wherein an angle between a main surface of the carrier and the gravity vector is between +10° and -10°, particularly between 0° and -5°. In some embodiments, the orientation of the carrier 110 may not be (exactly) vertical, e.g. during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle of between -1° and -5°. In other embodiments, the orientation of the carrier may be (exactly) vertical (+/- 1°). A negative angle refers to an orientation wherein the object that is carried by the carrier is inclined downward. The orientation of the carrier may correspond to the orientation of the object that is carried by the carrier.

[0045] The carrier 110 may be stopped at a position where the carrier 110 is arranged adjacent to an alignment assembly 150, as is schematically depicted in FIG. 1A (right part). However, it may be challenging to stop and hold the carrier 110 exactly at a predetermined position along the transport path. For example, for detaching the mask device 10 from the carrier 110 or for attaching a new mask device to the carrier 110, it may be beneficial to arrange the carrier 110 exactly at a predetermined horizontal position with respect to a mask handling assembly which is configured for exchanging the mask device. Also for other processes, e.g. for deposition processes, an exact horizontal alignment of the carrier may be beneficial.

[0046] According to embodiments described herein, a quick and exact horizontal alignment of the carrier 110 in the transport direction T is provided. For aligning the carrier 110, a first alignment element 152 of the alignment assembly 150, e.g. an alignment pin, is inserted in a second alignment element 112 of the carrier 110, e.g. an alignment recess provided in the carrier 110.

[0047] As is schematically depicted in FIG. IB, in some embodiments, the first alignment element 152 may be an alignment pin which protrudes from a plate of the alignment assembly 150. The plate may be moved toward the carrier 1 10 until the alignment pin engages with the second alignment element 112 that is provided in the form of an alignment recess in the carrier 110.

[0048] In some embodiments, a first drive unit 155 may be provided for moving the alignment assembly 150 toward the carrier and/or away from the carrier. For example, the first drive unit 155 may include an electric motor or a hydraulic or pneumatic actuator which may be arranged outside a vacuum chamber 101. The first drive unit 155 may include an air cylinder. The alignment assembly 150 including the plate and the first alignment element 152 may be provided inside the vacuum chamber 101 and may be movable via the first drive unit 155 in an essentially horizontal direction toward the transport path where the carrier 110 is to be arranged.

[0049] The first drive unit 155 may move the plate together with the alignment pin toward the carrier 110 until the alignment pin engages with the alignment recess of the carrier 110.

[0050] A lateral width of the alignment recess in a first section of the alignment recess may be larger than a lateral width of the alignment pin, as is schematically depicted in FIG. IB (left part). For example, the lateral width of the alignment recess in the first section into which the alignment pin is inserted may be more than twice the lateral width of the alignment pin. Accordingly, the alignment pin will engage with the alignment recess, even if the carrier is not yet exactly aligned relative to the alignment assembly 150.

[0051] As is schematically depicted in FIG. 1C, the carrier 110 is horizontally aligned in the transport direction T by lowering (or lifting) the carrier 110 while the first alignment element 152, i.e. the alignment pin, remains inserted in the second alignment element 112, i.e. the alignment recess.

[0052] In the depicted embodiment, the first alignment element 152 is an alignment pin of the alignment assembly 150, and the second alignment element 112 is an upwardly tapering alignment recess provided in the carrier 110. In this embodiment, the alignment pin is inserted in the alignment recess, and the carrier is then lowered, as is schematically depicted in FIG. 1C. By lowering the carrier 110 while the alignment pin engages with the upwardly tapering alignment recess, the carrier 110 is horizontally aligned. In some embodiments, the upwardly tapering recess may have essentially the shape of a triangle. [0053] In an alternative embodiment (not depicted), the first alignment element 152 is an alignment pin of the alignment assembly 150, and the second alignment element 112 is a downwardly tapering alignment recess provided in the carrier. In this embodiment, the carrier is lifted while the alignment pin engages with the downwardly tapering alignment recess, in order to horizontally align the carrier with respect to the alignment assembly in the transport direction T.

[0054] In a further alternative embodiment (not depicted), the first alignment element 152 is an upwardly (or downwardly) tapering recess provided in a plate of the alignment assembly 150, and the second alignment element 112 is an alignment pin protruding from the carrier 110. In this embodiment, the plate of the alignment assembly is moved toward the carrier, until the alignment pin of the carrier engages with the upwardly (or downwardly) tapering recess provided in the plate. The carrier is then lifted (or lowered) while the first alignment element is engaged with the second alignment element, in order to horizontally align the carrier with respect to the alignment assembly in the transport direction T. [0055] In the following description, only the embodiment depicted in the figures will be explained in more detail. However, it is to be understood that the above alternative embodiments are meant to be also covered by the claims.

[0056] In some embodiments, which may be combined with other embodiments described herein, the first alignment element 152 is an alignment pin, and/or the second alignment element 112 is an upwardly (or downwardly) tapering recess. Alternatively, the first alignment element 152 of the alignment assembly is an upwardly (or downwardly) tapering recess, and/or the second alignment element 112 of the carrier is an alignment pin. [0057] A tapering recess may be understood as a recess, opening or guiding section into which an alignment pin can be inserted and which includes at least two side surfaces which may approximate each other in an upward or downward direction. A distance between the two side surfaces of the tapering recess in a first section may be larger than a width of the alignment pin, and a distance between the two side surfaces of the tapering recess in a second section may be essentially equal to or smaller than the width of the alignment pin. A lateral width of the tapering recess may continuously decrease in an upward (or downward) direction at least in sections. Accordingly, when the alignment pin is guided inside the tapering recess from the first section toward the second section, the relative horizontal position between the alignment pin and the alignment recess can be adjusted to obtain a predetermined relative position.

[0058] Whereas the carrier 110 is movable in the transport direction T relative to the alignment assembly 150, the alignment assembly 150 may be connected to a wall of a vacuum chamber 101 such that a movement of the alignment assembly 150 in the transport direction T may be restricted or prevented. Accordingly, by lowering the carrier while the alignment pin engages with the upwardly tapering recess, the horizontal position of the carrier with respect to the vacuum chamber 101 can be set as appropriate. In particular, the carrier can be horizontally aligned with respect to a mask handling assembly (not depicted in FIG. 1C) which may be provided in the vacuum chamber 101 next to the alignment assembly 150. [0059] In some embodiments, which may be combined with other embodiments described herein, the first alignment element 152 is an alignment pin protruding from an attachment plate 151 of the alignment assembly 150. The attachment plate 151 can be attached to the carrier, e.g. using a magnetic chuck, in order to prevent a movement of the horizontally aligned carrier in the transport direction T. By attaching the attachment plate 151 to the carrier 110, the carrier 110 can be held at the predetermined horizontal position.

[0060] In some embodiments, which may be combined with other embodiments described herein, the second alignment element 112 is an upwardly tapering recess provided in the carrier 110 and including two side surfaces 153, 154 which approximate each other in an upward direction. When the carrier is lowered for horizontal alignment, both of the two side surfaces are brought into contact with the alignment pin.

[0061] In some implementations, the alignment assembly 150 is attached to the carrier after the horizontal alignment of the carrier. In particular, the alignment assembly 150 may be magnetically attached to the horizontally aligned carrier utilizing a first magnetic device 131. The first magnetic device 131 may be a magnetic chuck configured to magnetically attach the alignment assembly to the carrier. In some embodiments, the first magnetic device 131 may include an electropermanent magnet which may be integrated in the attachment plate 151 of the alignment assembly 150 or which may be integrated in the carrier 110. The first magnetic device 131 may be switchable between a holding state in which the alignment assembly is attached to the carrier and a releasing state in which the alignment assembly is released from the carrier. [0062] The alignment assembly 150 may be attached to the carrier 110 by the first magnetic device 131, in order to prevent a movement of the carrier 110 in the transport direction T after the horizontal alignment. Accordingly, the carrier may be horizontally aligned by lowering the carrier, and thereafter, the alignment assembly 150 may be attached to the carrier, in order to maintain the horizontal alignment, as is schematically depicted in FIG. 1C. [0063] In some embodiments, which may be combined with other embodiments described herein, lowering the carrier 110 includes reducing or deactivating a magnetic levitation force of the transport system 105 which may be configured as a magnetic levitation system. The magnetic levitation system may be configured for lowering the carrier from a first height depicted in FIG. IB to a second height depicted in FIG. 1C. After the lowering, the carrier may be supported at least partially by one or more alignment pins of the alignment assembly 150.

[0064] For example, the magnetic levitation force provided by active magnetic bearings of the transport system 105 can be reduced, in order to lower the carrier. Similarly, lifting the carrier may include increasing or activating a magnetic levitation force of the magnetic levitation system. In particular, the magnetic levitation force provided by active magnetic bearings of the transport system 105 may be increased, in order to lift the carrier to a first height wherein the first height may be suitable for transporting the carrier along the transport path. [0065] The transport system 105 may be configured to lower the carrier from a first height to a second height by a distance of 1 mm or more and/or 1 cm or less. When the carrier is arranged at the second height, the carrier may be at least partially supported by one or more alignment pins protruding into one or more alignment recesses of the carrier. For transporting the carrier along the transport path, the transport system 105 may lift the carrier from the second height back to the first height which may be the transport height of the carrier.

[0066] As is schematically depicted in FIGS. 1A-C, the carrier 110 may have more than one recess in some embodiments. A first recess may be the second alignment element 112 (i.e., the alignment recess) which may be arranged adjacent to a first end of the carrier 110 in the transport direction T and may be configured as a tapering recess. A further recess 116 may be arranged adjacent to a second end of the carrier 110 opposite the first end in the transport direction T. The further recess 116 may have a shape different from the shape of the alignment recess, e.g. a rectangular shape. In other words, only one of the recesses may be configured as an alignment recess. The further recess 116 may be adapted for the insertion of a further pin 156 which may support the carrier 110 after the lowering of the carrier 110, as is schematically depicted in FIG. 1C.

[0067] For aligning the carrier, the first alignment element 152 of the alignment assembly 150 may be inserted in the alignment recess, and a further pin 156 of a further alignment assembly may be inserted into the further recess 116. When the carrier is lowered onto the pins, the pins can support the carrier at a predetermined height.

[0068] In some embodiments, which may be combined with other embodiments described herein, the carrier includes at least two recesses, wherein a first recess is the second alignment element 112 and has an upwardly tapering shape, and a further recess has an essentially horizontally extending upper contact surface for contacting a further pin of a further alignment assembly.

[0069] An apparatus 100 for aligning a carrier 110 according to embodiments described herein includes a transport system 105 configured to transport the carrier 110 along a transport path in a transport direction T, wherein the transport system 105 may be configured to lower (and/or to lift) the carrier for horizontally aligning the carrier in the transport direction T. Further, the apparatus 100 includes an alignment assembly 150 including a first alignment element 152 configured to be engaged with a second alignment element 112 of the carrier. By lowering the carrier while the first alignment element 152 engages with the second alignment element 112, the carrier can be horizontally aligned. One of the alignment elements may be configured as a tapering recess configured for the engagement of an alignment pin.

[0070] In embodiments, the first alignment element 152 is an alignment pin protruding from an attachment plate 151 of the alignment assembly, and/or the second alignment element 112 is a tapering recess provided in the carrier, or vice versa.

[0071] A first drive unit 155 configured to move the alignment assembly 150 toward the transport path may be provided. Accordingly, the first alignment element and the second alignment element can be brought in engagement with each other by moving the alignment assembly 150 toward the carrier 1 10 which is arranged on the transport path.

[0072] In some embodiments, the transport system 105 is a magnetic levitation system configured to contactlessly transport the carrier along the transport path in the transport direction T. Further, the magnetic levitation system may be configured to lower (and/or lift) the carrier, e.g. by decreasing or increasing the magnetic levitation force provided by one or more magnetic bearings of the magnetic levitation system.

[0073] In some embodiments, the alignment assembly 150 includes an attachment plate 151 with a first magnetic device 131 configured to be magnetically attached to the carrier 110, e.g. when the carrier 110 has been horizontally aligned with respect to the alignment assembly 150. The first magnetic device 131 may include one or more electropermanent magnets (EPMs).

[0074] After aligning the carrier with respect to the alignment assembly, the mask device 10 that is carried by the carrier 110 can be exchanged, and a new mask device can be loaded on the carrier 110. For example, a mask handling assembly may be arranged next to the alignment assembly 150 in a vacuum chamber, wherein the mask handling assembly may be configured to remove a used mask device from the carrier and/or to load a mask device to be used on the carrier. Since the carrier is accurately aligned with respect to the mask handling assembly, an accurate attachment of the mask device to be used to the carrier is enabled according to embodiments described herein.

[0075] FIGS. 2A-K are schematic illustrations of subsequent stages of a method of aligning a carrier 110 with an apparatus 100 according to embodiments described herein. The apparatus 100 is shown together with the carrier 110 in a front view (left part), in a first sectional view taken in a first sectional plane SI (right part), and in a second sectional view taken in a second sectional plane S2 (middle part), respectively.

[0076] The first sectional plane SI intersects an alignment assembly 150 and a side portion of the carrier 110 where a second alignment element 112 is provided. The second sectional plane S2 intersects a central portion of the carrier 110 where the object is held.

[0077] In the embodiment depicted in FIGS. 2A-K, the carrier 110 is a mask carrier 111 which carries a mask device 10 (as is illustrated in the second sectional views, respectively). In other embodiments, the carrier 110 may be a substrate carrier configured to carry a substrate. Alternatively, the carrier may be configured to carry another object.

[0078] The embodiment depicted in FIGS. 2A-K may include some of the features or all the features of the embodiment depicted in FIGS. 1A-C, such that reference can be made to the above explanations, which are not repeated here.

[0079] In some embodiments, which may be combined with other embodiments described herein, a magnetic device (a third magnetic device 133) may be provided for holding the mask device 10 or another object at the carrier 110. The third magnetic device 133 may be integrated in the carrier 110 and may be configured to generate a magnetic field which attracts the object toward the carrier 110. In some implementations, two or more magnetic devices may be provided for holding the object at the carrier 110, e.g. four magnetic devices, as is schematically depicted in FIG. 2A (left part).

[0080] The third magnetic device 133 may include an electropermanent magnet (EPM) configured to switch between a holding state in which the object is attached to the carrier 110 and a releasing state in which the object is released from the carrier 110.

[0081] A transport system 105, particularly a magnetic levitation system, may be provided for contactlessly transporting the carrier 110 along a transport path in a transport direction T. The carrier 110 may be stopped at a handling position depicted in FIG. 2 A (right part) in which the carrier faces an alignment assembly 150 of the apparatus 100. [0082] The alignment assembly 150 may be connected to a wall of a vacuum chamber 101. In some implementations, the alignment assembly 150 may be movable from an idle position spaced apart from the transport path of the carrier (depicted in FIG. 2A) to an alignment position in which the alignment assembly 150 is arranged close to the transport path of the carrier (depicted in FIG. 2B). In particular, the alignment assembly 150 may be movable in an essentially horizontal movement direction toward a carrier arranged on the transport path.

[0083] A first drive unit 155 may be provided for moving the alignment assembly 150 toward the carrier 110 and away from the carrier 110. The first drive unit 155 may be a pneumatic device and include at least one air cylinder for moving the alignment assembly 150. In some embodiments, the first drive unit 155 is arranged outside the vacuum chamber 101, and the alignment assembly 150 is arranged inside the vacuum chamber 101.

[0084] In some embodiments, the alignment assembly 150 may be arranged close to a mask handling assembly 181 (not depicted in FIG. 2A) which may be configured to exchange the mask device that is carried by the carrier 110. In other words, the mask handling assembly 181 may be configured to detach a first mask device from the carrier 110 and to attach a second mask device to the carrier 110.

[0085] The apparatus 100 including the alignment assembly 150 and the mask handling assembly 181 is depicted in a perspective view in FIG. 3 A. In FIG. 3 A, the carrier 110 carrying a first mask device 10 is transported along the transport path in the transport direction T by the transport system 105 until the carrier is arranged next to the alignment assembly 150. In particular, the carrier is transported to a position next to the mask handling assembly 181, as is depicted in FIG. 3B in a perspective view.

[0086] As is depicted in FIG. 3B, the carrier 110 is stopped at a position where the carrier 110 faces a section of the wall of the vacuum chamber where the alignment assembly 150 is arranged. In some embodiments, the alignment assembly 150 is arranged on a first side of the mask handling assembly 181 in the transport direction T, and a second alignment assembly 160 is arranged on a second side of the mask handling assembly 181 opposite the first side in the transport direction T.

[0087] Returning to FIG. 2B, the alignment assembly 150 can be moved toward the carrier 110 in a direction transverse to the transport direction T until the first alignment element 152 of the alignment assembly 150 is inserted in a second alignment element 112 of the carrier 110, or vice versa. The first alignment element 152 may be an alignment pin, and the second alignment element 112 may be an alignment recess, particularly a tapering recess, or vice versa. Reference is made to the above described embodiments which are not repeated here. [0088] As is schematically depicted in FIG. 2C, the carrier 110 is then horizontally aligned in the transport direction T by lowering the carrier 110 while the alignment pin protrudes into the tapering recess. In some embodiments, the carrier 110 is lowered by 1 mm or more and 1 cm or less, particularly by 1.5 mm or more and 3 mm or less.

[0089] In some embodiments, the carrier 110 is lowered by reducing or switching off a magnetic levitation force of the transport system 105 which may result in a downward movement of the carrier, as is schematically depicted in FIG. 2C.

[0090] The carrier may be lowered until two side surfaces 153, 154 of the tapering recess are brought into contact with the alignment pin, as is schematically depicted in FIG. 2C (left part). Hence, a relative horizontal position between the carrier 110 and the alignment assembly 150 can be adjusted by lowering the carrier. After the lowering, the carrier 110 is correctly and accurately positioned relative to the mask handling assembly 181 in the transport direction T.

[0091] In some embodiments, which may be combined with other embodiments described herein, at least a part of the alignment assembly 150 may be movable in an upward and downward direction. For example, the alignment assembly includes an attachment plate 151, wherein the first alignment element 152 is provided at the attachment plate 151. The attachment plate 151 may be movable in an upward and downward direction together with the first alignment element 152 protruding therefrom, as is schematically depicted in FIG. 2C. [0092] On the other hand, a movement of the alignment assembly 150 in the transport direction T may be restricted. In particular, the attachment plate 151 of the alignment assembly 150 may be movable in the upward and downward direction together with the carrier attached thereto, whereas a movement of the attachment plate 151 in the transport direction T may be prevented. By preventing the movement of the attachment plate 151 in the transport direction T, a predetermined alignment position of the carrier in the transport direction T can be secured. By allowing a movement of the attachment plate 151 in the upward and downward direction, the attachment plate

151 can follow a lowering or lifting movement of the carrier 110, e.g. when the attachment plate 151 is attached to the carrier 110.

[0093] For example, by lowering the carrier 110 while the first alignment element

152 is engaged with the second alignment element 112, the attachment plate 151 may be moved downward together with the carrier against a restoring force of an elastic element 159 which may be connected to the attachment plate 151, as is schematically depicted in FIG. 2C (right part).

[0094] In some embodiments, which may be combined with other embodiments described herein, the alignment assembly 150 includes a plate holder portion 158 and the attachment plate 151, wherein the plate holder portion 158 and the attachment plate 151 are movable toward and away from the transport path by the first drive unit 155, particularly in an essentially horizontal direction. The attachment plate 151 may be movable relative to the plate holder portion 158 in an upward or downward direction. In particular, a guiding structure 157 may connect the attachment plate 151 to the plate holder portion 158, wherein the guiding structure 157 may allow an upward and downward movement of the attachment plate 151 relative to the plate holder portion 158. On the other hand, a movement of the attachment plate 151 in the transport direction T may be prevented. The attachment plate 151 may be attachable to the carrier 110, e.g. via a first magnetic device 131. When the attachment plate 151 is attached to the carrier 1 10, the attachment plate 151 moves together with the carrier 110 in the upward and downward direction, e.g. when the carrier is lifted or lowered by the transport system 105. [0095] In some embodiments, which may be combined with other embodiments described herein, the alignment assembly 150 is attached to the horizontally aligned carrier 110. In particular, the alignment assembly may include the attachment plate 151 that is magnetically attached to the horizontally aligned carrier utilizing the first magnetic device 131. The first magnetic device 131 may include an electropermanent magnet (EPM) which may be integrated in the attachment plate 151. By attaching the attachment plate 151 to the carrier 110, a predetermined relative position between the attachment plate 151 and the carrier can be secured.

[0096] As is schematically depicted in FIG. 2D, the attachment plate 151 of the alignment assembly 150 may include the first magnetic device 131 that is configured to generate an attractive magnetic force for attaching the attachment plate 151 to the carrier 110. The attached attachment plate can move together with the carrier in the upward or downward direction. On the other hand, a movement of the carrier in the transport direction T may be blocked since the attachment plate 151 cannot move in the transport direction T.

[0097] FIG. 3B is a perspective view of the apparatus 100 in the state depicted in FIG. 2D, in which the attachment plate 151 of the alignment assembly 150 has been attached to the carrier 110. In particular, two attachment plates may be attached to the carrier 110, wherein a first attachment plate is attached to the carrier on a first side of the mask handling assembly 181, and a second attachment plate is attached to the carrier on a second side of the mask handling assembly 181 opposite the first side in the transport direction T. Accordingly, the carrier can be held at a predetermined position with respect to the mask handling assembly 181, such that the mask handling assembly 181 can accurately handle the mask device that is carried by the carrier. [0098] In FIG. 2D, the attachment plate 151 is attached to the carrier 110. In particular, the first magnetic device 131 is provided in a holding state in which the attachment plate 151 is attracted toward the carrier. The carrier may push the attachment plate 151 against an elastic element 159 in a downward direction due to gravity. [0099] In some embodiments, which may be combined with other embodiments described herein, the method of aligning the carrier may further include vertically aligning the horizontally aligned carrier by lifting the carrier to a predetermined level. In particular, the carrier can be lifted by increasing or switching on a magnetic levitation force of the transport system 105 which may be configured as a magnetic levitation system.

[00100] FIG. 2E shows the carrier 110 that has been lifted to a first height by increasing or activating the magnetic levitation force. The attachment plate 151 may be lifted together with the carrier 110 when the attachment plate 151 is attached to the carrier 110.

[00101] By lifting the carrier 110 to the first height, the carrier 110 can be arranged at a predetermined vertical position at which the mask handling assembly 181 can interact with the mask device 10. Since the attachment plate 151 is attached to the carrier during the lifting, a predetermined horizontal position of the carrier 110 is secured and maintained. Accordingly, the carrier is aligned both in the transport direction T and in the vertical direction.

[00102] After the horizontal and vertical alignment of the carrier 110, the mask device 10 or another object that is carried by the carrier 110 can be handled. For example, the mask device that is carried by the carrier can be exchanged by the mask handling assembly 181, as is schematically depicted in FIG. 3C.

[00103] In some embodiments, which may be combined with other embodiments described herein, the mask handling assembly 181 may include a mask holding portion 180 configured to hold a mask device which is handed over from the carrier. The mask holding portion 180 may transfer the mask device from the carrier to a mask magazine. The mask holding portion 180 may be movable between an essentially vertical orientation and an essentially horizontal orientation. In particular, the mask handling assembly 181 may be configured for rotating or pivoting the mask holding portion 180 with respect to a rotation axis A. [00104] As is schematically depicted in FIG. 2F, the mask holding portion 180 of the mask handling assembly 181 may be moved toward the horizontally aligned carrier. For example, the mask holding portion 180 may be rotated toward the carrier 110 from an essentially horizontal orientation to an essentially vertical orientation that is illustrated in FIG. 2F.

[00105] FIG. 3C shows the mask handling assembly 181, wherein the mask holding portion 180 has been rotated toward the carrier 110 around the rotation axis A. When the mask holding portion 180 has moved toward the carrier, the mask device 10 that is carried by the carrier 110 can be transferred from the carrier 110 to the mask holding portion 180. The mask device 10 - which is also referred to herein as the first mask device 10 - may be a used mask device that is to be cleaned.

[00106] In particular, as is schematically depicted in FIG. 2F (middle part), the mask device 10 may be transferred from the carrier 110 to the mask holding portion 180. In some implementations, the mask device 10 is transferred from the carrier 110 to the mask holding portion 180 by activating a magnetic force of a second magnetic device 132 acting between the mask device 10 and the mask holding portion 180, and by deactivating a magnetic force of the third magnetic device 133 acting between the mask device and the carrier 110. After the deactivation of the third magnetic device 133, the mask device 10 is held at the mask holding portion 180 of the mask handling assembly 181.

[00107] The second magnetic device 132 and/or the third magnetic device 133 may include electropermanent magnets (EPMs) which can switch between a holding state and a releasing state, respectively.

[00108] In some embodiments, which may be combined with other embodiments described herein, transferring the first mask device 10 from the carrier 110 to the mask holding portion 180 may further include lowering the carrier 110 relative to the first mask device 10 which is held at the mask holding portion 180. For example, the carrier 110 can be lowered by deactivating or reducing the magnetic levitation force of the transport system 105. Since the first mask device 10 is held by the mask holding portion 180, lowering the carrier 110 will separate the first mask device 10 from the carrier 110, particularly when the carrier is arranged at an orientation that is slightly inclined with respect to a vertical orientation.

[00109] FIG. 2G (middle part) shows the carrier 110, after the carrier 110 has been lowered relative to the first mask device 10 that is held by the mask holding portion 180.

[00110] After the separation of the first mask device 10 from the carrier 110 by lowering the carrier 110, the mask holding portion 180 may be rotated together with the first mask device 10 to an essentially horizontal orientation, where the first mask device can be unloaded from the mask holding portion 180 and stored in a mask magazine and/or unloaded from the vacuum system.

[00111] In particular, in some embodiments, the mask holding portion 180 may be rotated from a non-horizontal orientation, particularly from the essentially vertical orientation depicted in FIG. 2G, to an essentially horizontal orientation after the transferal of the first mask device 10 from the carrier to the mask holding portion 180. Thereupon, the first mask device 10 may be unloaded from the mask holding portion 180, e.g. by storing the first mask device 10 in a mask magazine and/or by unloading the first mask device from the vacuum chamber 101 for cleaning.

[00112] In some embodiments, a second mask device 11 which may be a clean mask device that is to be used for a masked deposition process in the vacuum system may be loaded on the mask holding portion 180. The mask holding portion 180 having the second mask device 11 loaded thereon may be moved toward the carrier 110, and the second mask device 11 may be transferred to the carrier 110.

[00113] More specifically, the second mask device 11 may be loaded on the mask holding portion 180, particularly while the mask holding portion 180 is in an essentially horizontal orientation. The second mask device 11 may be attached to the mask holding portion 180, e.g. via the second magnetic device 132. The mask holding portion 180 may then be rotated from the essentially horizontal orientation to the essentially vertical orientation that is schematically depicted in FIG. 2H. [00114] When the mask holding portion 180 is arranged in the state depicted in FIG. 2H, the second mask device 11 may be transferred from the mask holding portion 180 to the carrier 110.

[00115] Optionally, transferring the second mask device 11 from the mask holding portion 180 to the carrier 110 may include lifting the carrier 110 relative to the second mask device 11 which is held at the mask holding portion 180. The lifting of the carrier 110 relative to the second mask device 1 1 is schematically depicted in FIG. 2H (middle part). The lifting of the carrier 110 relative to the second mask device 11 may bring the carrier 110 in contact with the second mask device 11, particularly when the carrier 110 and the second mask device 11 are slightly inclined with respect to a vertical orientation. In some embodiments, the carrier 110 may be lifted with respect to the second mask device 11 that is held at the mask holding portion 180 in order to correctly align the second mask device 11 with respect to the carrier 110. In particular, the carrier 110 may be lifted by activating or increasing a magnetic levitation force of the transport system 105.

[00116] As is schematically depicted in FIG. 21 (middle part), transferring the second mask device 11 from the mask holding portion 180 to the carrier 110 may include activating the magnetic force of the third magnetic device 133 acting between the second mask device 11 and the carrier 110, and deactivating the magnetic force of the second magnetic device 132 acting between the second mask device 11 and the mask holding portion 180. By activating the third magnetic device 133, the second mask device 11 is attached to the carrier 110 such that the carrier 110 can carry the second mask device 11 along the transport path.

[00117] In some embodiments, which may be combined with other embodiments described herein, the carrier 110 is aligned with respect to the alignment assembly 150 for at least one or more of the following: (i) transferring a first mask device 10, particularly a used mask device, from the carrier 110 to the mask holding portion 180 of the mask handling assembly 181, particularly for unloading the first mask device 10 from the vacuum system, and (ii) transferring a second mask device 11, particularly a clean mask device to be used for a masked deposition process, from the mask holding portion 180 to the carrier 110. In particular, after the horizontal and optionally vertical alignment of the carrier, a used mask device may be unloaded from the carrier 110, and a mask device to be used may be loaded on the carrier 110. The carrier 110 can then be transported by the transport system 105 toward a vacuum deposition module to be used for the deposition process.

[00118] FIG. 2 J shows the apparatus after the transferal of the second mask device 11 to the carrier 110. The mask holding portion 180 has moved away from the carrier 110, and the second mask device 11 is attached to the carrier 110 by the third magnetic device 133. [00119] For detaching the alignment assembly 150 from the carrier 110, the carrier may be lowered, as is schematically depicted in FIG. 2J. In the lowered state of the carrier 110, the first magnetic device 131 may be deactivated, in order to release the attachment plate 151 of the alignment assembly 150 from the carrier.

[00120] As is schematically depicted in FIG. 2K, the carrier can then be lifted, particularly by activating or increasing the magnetic levitation force of the transport system 105. By lifting the carrier 110 while the attachment plate 151 is detached from the carrier 110, the first alignment element 152 of the alignment assembly 150 can move with respect to the second alignment element 112 of the carrier in a vertical direction. In particular, the alignment pin of the alignment assembly 150 may move inside the alignment recess from the narrow second section to the wide first section of the alignment recess in which the alignment pin is arranged at a distance from at least one of the side surfaces of the alignment recess.

[00121] The alignment assembly 150 can then be retracted from the carrier 110, as is schematically depicted in FIG. 2K. In particular, the alignment assembly 150 is moved away from the transport path by the first drive unit 155 such that the first alignment element 152 is disengaged from the second alignment element 112.

[00122] The carrier 110 carrying the second mask device 11 can then be transported along the transport path away from the alignment assembly 150 and/or away from the mask handling assembly 181, e.g. toward a vacuum deposition module. [00123] Summarizing the above, an apparatus according to embodiments described herein may include a transport system 105, an alignment assembly 150, and a mask handling assembly 181 with a mask holding portion 180 configured for the exchange of mask devices from mask carriers. The mask handling assembly 181 may be arranged adjacent to the alignment assembly 150. The mask holding portion 180 may be movable toward and away from a carrier which is arranged on the transport path, in order to transfer a mask device between the carrier and the mask holding portion. The alignment assembly 150 may be movable toward and away from the carrier which is arranged on the transport path, in order to horizontally align the carrier in the transport direction T. According to embodiments described herein, the mask holding portion 180 and the alignment assembly 150 are movable independently of each other toward and away from the carrier which is arranged on the transport path. In other words, a movement of the mask holding portion 180 does not necessarily imply a movement of the alignment assembly 150, and vice versa. Accordingly, the alignment of the carrier is decoupled from the transfer of a mask device from the carrier. The alignment accuracy can be improved and the mask handling speed can be increased.

[00124] According to embodiments described herein, the alignment assembly 150 includes an attachment plate 151 with a first magnetic device 131 configured to be magnetically attached to the carrier 110. Accordingly, a relative position between the attachment plate and the carrier 110 can be fixed, while a movement of the mask holding portion 180 relative to the carrier is still possible.

[00125] The first magnetic device 131 may include an electropermanent magnet (EPM). The EPM may be integrated in the alignment assembly 150 and/or in the carrier 110. An EPM as used herein may be understood as a magnet assembly including permanent magnets in which the external magnetic field of the permanent magnets can be switched on or off by a pulse of electric current in a wire winding provided around a part of the magnets. The permanent magnets may include at least one magnet having a low coercivity magnetic material, wherein the direction of magnetization in the lower coercivity magnetic material can be switched by the pulse. Accordingly, the EPM can be switched between a holding state and a releasing state by applying a pulse of electric current.

[00126] In some embodiments, a second magnetic device 132 may be provided for attaching the mask device to the mask holding portion 180 and/or a third magnetic device 133 may be provided for attaching the mask device to the carrier. The second magnetic device and/or the third magnetic device may include an EPM.

[00127] According to a further aspect described herein, a vacuum system for depositing one or more materials on a substrate is provided. The vacuum system includes a mask handling module comprising an apparatus for aligning a carrier according to any of the embodiments described herein. The vacuum system further includes a vacuum deposition module, wherein one or more deposition sources are arranged in the vacuum deposition module. A transport system may be provided which is configured to transport mask carriers between the mask handling module and the vacuum deposition module. The transport system may be configured for a contactless transport. For example, the transport system may be a magnetic levitation system.

[00128] According to a further aspect described herein, a carrier for carrying an object in a vacuum system is provided. The carrier may be a mask carrier configured to carry a mask device or a substrate carrier configured to carry a substrate. The carrier includes a second alignment element 112 configured as a tapering recess into which a first alignment element 152 of an alignment assembly can be inserted for horizontally aligning the carrier in a transport direction T by lowering or lifting the carrier.

[00129] In some embodiments, the carrier may include a chucking device for holding the object to be carried. For example, the carrier may include a third magnetic device 133 configured to magnetically hold the object at the carrier. The carrier may further include any of the features of a mask carrier or of a substrate carrier described herein.

[00130] FIG. 4 is a flow diagram illustrating a method of aligning a carrier according to embodiments described herein. [00131] In box 410, a carrier is transported along a transport path in a transport direction T by a transport system 105, particularly by a magnetic levitation system.

[00132] In box 420, the carrier is stopped at an alignment position next to an alignment assembly 150. [00133] In box 430, the alignment assembly 150 is moved toward the carrier such that a first alignment element of the alignment assembly is engaged with a second alignment element provided at the carrier. The first alignment element may be an alignment pin, and the second alignment element may be an alignment recess, or vice versa. The alignment recess may be an upwardly tapering alignment recess. [00134] In box 440, the carrier 110 is horizontally aligned in the transport direction T by lowering the carrier 110 relative to the alignment assembly 150 while the first alignment element is engaged with the second alignment element. Optionally, an attachment unit such as an attachment plate 151 of the alignment assembly 150 may then be attached to the horizontally aligned carrier, e.g. in order to maintain the horizontal orientation. Optionally, the horizontally aligned carrier may also be vertically aligned, e.g. by lifting the carrier to a predetermined height.

[00135] In box 450, the object that is carried by the carrier 110 is handled. For example, a first mask device 10 that is carried by the carrier 110 may be detached from the carrier 110 and/or a second mask device 11 may be attached to the carrier. The alignment of the carrier allows for an exact positioning of the carrier with respect to a vacuum chamber and/or with respect to a handling apparatus that is provided in the vacuum chamber which may be configured to handle the object carried by the carrier.

[00136] According to embodiments described herein, mask devices and/or substrates are transported in the vacuum system in an essentially vertical orientation. The concept of a vertical transport allows for the handling of bigger substrate sizes as compared to a concept wherein mask devices and/or substrates are transported and processed in an essentially horizontal orientation. The transport of the mask devices and/or of the substrates in the essentially vertical orientation can be facilitated by mounting the mask devices and/or the substrates to respective carriers. According to embodiments described herein, the attachment or the detachment of the mask devices to or from the mask carriers is not conducted under atmospheric conditions, but inside the vacuum system. Therefore, the weight that has to be handled outside the vacuum system can be reduced.

[00137] Accordingly, in view of the above, it is to be understood that the embodiments as described herein provide for a quick and efficient mask exchange. In particular, embodiments as described herein have the advantage of simplifying and accelerating the mask exchange in a vacuum system configured for masked deposition on substrates.

[00138] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

[00139] In particular, this written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1. A method of aligning a carrier, comprising: transporting a carrier (110) in a transport direction (T); inserting a first alignment element (152) of an alignment assembly (150) in a second alignment element (112) of the carrier (110), or vice versa; and horizontally aligning the carrier (110) in the transport direction (T) by lowering or lifting the carrier (110).

2. The method of claim 1, wherein the first alignment element (152) is an alignment pin and the second alignment element (112) is an upwardly or downwardly tapering recess, or vice versa.

3. The method of claim 1 or 2, wherein the first alignment element (152) is an alignment pin protruding from an attachment plate (151) of the alignment assembly (150), and the second alignment element (112) is an upwardly tapering recess provided in the carrier (110) and comprising two side surfaces (153,154) which approximate each other in an upward direction, both of which are brought in contact with the alignment pin by lowering the carrier (110).

4. The method of any of claims 1 to 3, further comprising attaching the alignment assembly (150) to the horizontally aligned carrier, particularly magnetically attaching an attachment plate (151) of the alignment assembly (150) to the horizontally aligned carrier via a first magnetic device (131).

5. The method of any of claims 1 to 4, wherein an attachment plate (151) of the alignment assembly (150) is movable in an upward or downward direction together with the carrier attached thereto, whereas a movement of the attachment plate (151) in the transport direction (T) is prevented.

6. The method of any of claims 1 to 5, further comprising vertically aligning the horizontally aligned carrier (110) by lifting the carrier (110) to a predetermined level, particularly via a magnetic levitation system.

7. The method of any of claims 1 to 6, wherein the carrier (110) is a mask carrier (111) configured for carrying a mask device, the method further comprising: moving a mask holding portion (180) of a mask handling assembly (181) to the horizontally aligned carrier (110); and at least one of

(i) transferring a first mask device (10) from the carrier (110) to the mask holding portion (180), and

(ii) transferring a second mask device (11) from the mask holding portion (180) to the carrier (110).

8. The method of claim 7,

(i) wherein transferring the first mask device (10) from the carrier (110) to the mask holding portion comprises activating a magnetic force of a second magnetic device (132) acting between the first mask device (10) and the mask holding portion (180) and deactivating a magnetic force of a third magnetic device (133) acting between the first mask device (10) and the carrier (110), or

(ii) wherein transferring the second mask device (11) from the mask holding portion (180) to the carrier (110) comprises activating a magnetic force of a third magnetic device (133) acting between the second mask device (11) and the carrier (110) and deactivating a magnetic force of a second magnetic device (132) acting between the second mask device (11) and the mask holding portion (180).

9. The method of claim 7 or 8,

(i) wherein transferring the first mask device (10) from the carrier to the mask holding portion comprises lowering the carrier (110) relative to the first mask device which is held at the mask holding portion (180), or (ii) wherein transferring the second mask device (11) from the mask holding portion to the carrier comprises lifting the carrier (110) relative to the second mask device (11) which is held at the mask holding portion (180).

10. The method of any of claims 7 to 9, further comprising,

(i) after transferring the first mask device (10) from the carrier to the mask holding portion, rotating the mask holding portion (180) from an essentially vertical orientation to an essentially horizontal orientation; and unloading the first mask device from the mask holding portion (180), or

(ii) before transferring the second mask device (11) from the mask holding portion (180) to the carrier, loading the second mask device (11) on the mask holding portion (180), and rotating the mask holding portion from an essentially horizontal orientation to an essentially vertical orientation.

11. The method of any of claims 1 to 10, wherein lowering the carrier comprises reducing or deactivating a magnetic levitation force of a transport system (105), and/or wherein lifting the carrier comprises increasing or activating a magnetic levitation force of the transport system (105).

12. An apparatus (100) for aligning a carrier (110), comprising: a transport system (105) configured to transport a carrier (110) along a transport path in a transport direction (T); and an alignment assembly (150) comprising a first alignment element (152) configured to be inserted in a second alignment element (112) of the carrier, or vice versa, wherein the transport system (105) is configured to lower or lift the carrier for horizontally aligning the carrier (110) in the transport direction (T) relative to the alignment assembly (150).

13. The apparatus of claim 12, further comprising a mask handling assembly (181) with a mask holding portion (180) arranged adjacent to the alignment assembly (150), wherein the mask holding portion (180) and the alignment assembly (150) are movable independently of each other toward and away from a carrier which is arranged on the transport path.

14. The apparatus of claim 12 or 13, wherein the transport system (105) is a magnetic levitation system configured to contactlessly transport the carrier along the transport path and configured to lower or lift the carrier.

15. The apparatus of any of claims 12 to 14, wherein the alignment assembly (150) comprises an attachment plate (151) with a first magnetic device (131) configured to be magnetically attached to the carrier (110), particularly comprising an electropermanent magnet.

16. A vacuum system, comprising: a mask handling module comprising an apparatus (100) of any of claims 12 to 15; and a vacuum deposition module, wherein one or more deposition sources are arranged in the vacuum deposition module, wherein the transport system is configured to transport mask carriers between the mask handling module and the vacuum deposition module.

17. A mask carrier (1 11) for carrying a mask device (10), comprising a second alignment element (112) configured as a tapering recess into which a first alignment element (152) of an alignment assembly can be inserted for horizontally aligning the mask carrier in a transport direction (T) by lowering or lifting the mask carrier.