WO2019090860A1 - 一种选择性厚铜线路制作方法 - Google Patents

一种选择性厚铜线路制作方法 Download PDF

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WO2019090860A1
WO2019090860A1 PCT/CN2017/112928 CN2017112928W WO2019090860A1 WO 2019090860 A1 WO2019090860 A1 WO 2019090860A1 CN 2017112928 W CN2017112928 W CN 2017112928W WO 2019090860 A1 WO2019090860 A1 WO 2019090860A1
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Prior art keywords
copper
speed
thick copper
drilling
plate
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PCT/CN2017/112928
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English (en)
French (fr)
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邹奎
饶西含
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建业科技电子（惠州）有限公司
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Publication of WO2019090860A1 publication Critical patent/WO2019090860A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Definitions

  • the invention relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing a selective thick copper line.
  • Thick copper wiring boards usually have a copper foil bonded to a glass epoxy substrate.
  • the thickness of the copper foil is usually 18 ⁇ m, 35 ⁇ m, 55 ⁇ m, and 70 ⁇ m.
  • the most common copper foil thickness is 35 ⁇ m.
  • the thickness of copper foil used in China is generally 35-50 ⁇ m.
  • printed circuit boards not only provide electrical and electrical connections and mechanical support for electronic components, but also have power supply integration, provide high current, etc. Additional features of the board. Therefore, the product design has higher and higher requirements for copper thickness, and has reached more than 350 ⁇ m.
  • the production of thick copper plates of 350 ⁇ m or more in the industry has the following problems: for plates with copper thickness requirements of 350 ⁇ m and above, the market cannot be purchased.
  • the ultra-thick copper circuit board refers to the circuit board with the outer layer of copper having a thickness of not less than 210 micrometers (60Z). .
  • the solder mask processing method of the ultra-thick copper circuit board is to cover the copper surface and the surface of the substrate by multiple solder mask exposure according to the screen printing or spraying process of the ordinary circuit board.
  • this method has a long processing flow and high production cost, and also has a large difference in height between the ultra-thick copper and the substrate, and the air bubble cannot be exhausted during the silk screen process, thereby causing ink bubble problems, and in the drilling process, Due to the mismatch between the resin drilling and the thick copper drilling, the resin at the edge of the hole is easily cracked.
  • the invention provides a method for manufacturing a selective thick copper line, which can be used without a special copper foil for a circuit board. It solves the problem that the thick copper plate market is difficult to purchase, and can solve the abnormal problems such as serious oil gathering on the side of the thick copper plate, no oil between the line and the line, and the equipment requirements are not high, and the general circuit board manufacturer can make it, so It can reduce the processing flow, reduce the production cost, and avoid the generation of ink bubbles. At the same time, it considers the problem of thick copper drilling and resin ink drilling. It is divided into three sections to prevent resin cracking at the hole edge, and the drilling is also different. The diameter of the drill tip, adjusting the proper resin drilling and thick copper drilling speed, the falling speed, the number of holes and the speed of reversal, further prevent cracking of the resin at the edge of the hole, and can effectively solve the problems in the above background art.
  • the present invention provides the following technical solution: a method for fabricating a selective thick copper line, comprising the following steps:
  • Drilling Drilling through a numerically controlled drilling machine and running through a predetermined level, specifically a three-stage drilling, each ratio of 1:0.9-1.1:0.9-1.1; the drill hole used in the drilling: If the diameter is 0.1mm, the rotation speed is 115-126krpm, the falling speed is 19-22ipm, the return speed is 500ipm, the number of drilled holes is up to 200; if the diameter is 0.15mm, the rotation speed is 110-125krpm, the falling speed is 20-24ipm The number of drilled holes is up to 300, the return speed is 500ipm; if the diameter is 0.20mm, the speed is 110-125krpm, the falling speed is 22-26ipm, the number of drilled holes is up to 500, the return speed is 500ipm; if the diameter is 0.25 Mm, the speed is 110-120krpm, the falling speed is 23-27ipm, the number of drilled holes is up to 500, and the return speed is 500ipm;
  • Ink silk screen printing using the air spraying method, performing the first whole board spraying ink on the ultra thick copper circuit board; performing the first pre-drying on the ultra thick copper circuit board;
  • the patterned negative film exposes the ultra-thick copper circuit board, and performs a first window opening in the middle of the copper upper surface of the ultra-thick copper circuit board; the side of the copper skin and the surface of the substrate are first performed Filling the ink; performing a second whole-plate spraying ink on the ultra-thick copper circuit board; performing the second pre-baking on the ultra-thick copper circuit board; performing the middle surface of the copper skin of the ultra-thick copper circuit board Opening a second time; performing a second filling of the side of the copper skin and the surface of the substrate; pre-curing the ultra-thick copper circuit board; Said ultra-thick copper circuit board for solder mask exposure;
  • Subsequent processing Subsequent processing of the board, including silk screen characters, surface treatment, shape processing, electrical performance testing, and surface inspection.
  • the first pre-baking and the second pre-baking in the step 3) are specifically at 75 ° C for 40 minutes.
  • the pre-curing temperature in the step 3) is 160-190 ° C, and the time is 50-75 min.
  • the optical substrate is prepared by using the shearing machine in the step 1), in particular, the copper plate is opened by using a shearing machine, and the first alignment hole is formed on the copper clad plate, and then the copper clad plate is self-contained.
  • the strip of copper is etched away to form a light substrate, and then a dense browning film is formed on the optical substrate to enhance the bonding force of subsequent press bonding.
  • the step 1) preparing a copper plate using a shearing machine, in particular, using a shearing machine to open a copper plate and forming a second alignment hole for aligning with the first alignment hole on the copper plate, Then, a photosensitive dry film is applied on the copper plate and selectively exposed by using a graphic film to form a desired pattern, followed by development, and then the exposed copper is etched away and the etching depth is 2/3 of the thickness of the copper plate.
  • the dry film as the resist layer is removed to form a copper plate having a line pattern on one side and a complete copper surface on the other side; then a brown organic metal film is formed on the surface of the copper plate, and the organic metal film is embedded in the surface of the copper plate and A grid-like conversion layer is formed between the plate and the resin to enhance the bonding force between the copper plate and the resin.
  • the falling speed is 25-29ipm, the number of drilled holes is up to 500, and the return speed is 500ipm; if the diameter is 0.35mm, the speed is 76-85krpm, the falling speed is 30-31ipm, the number of drilled holes is up to 800, and the return speed is 500ipm; if the diameter is 0.40mm, the speed is 70-76krpm, the falling speed is 30-32ipm, the number of drilled holes is up to 800, and the return speed is 500ipm.
  • the rotation speed is 63-67 krpm
  • the falling speed is 31-33 ipm
  • the number of drilled holes is at most 800
  • the return speed is 500 ipm
  • the diameter is 0.50 mm
  • the rotation speed is For 55-60krpm
  • the drop speed is 33-35ipm
  • the number of drilled holes is up to 800
  • the return speed is 500ipm
  • the diameter is 0.55mm
  • the rotation speed is 50-55krpm
  • the falling speed is 33-35ipm
  • the number of drilled holes is up to 800.
  • the return speed is 700ipm; if the diameter is 0.60mm, the rotation speed is 45-50krpm, the falling speed is 68-72ipm, the number of drilled holes is up to 1200, the return speed is 700ipm; if the diameter is 0.65mm, the rotation speed is 42-46krpm, The falling speed is 68-72ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm; if the diameter is 0.70mm, the rotation speed is 40-45krpm, the falling speed is 36-38ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm; if the diameter is 0.75mm, the speed is 35-40krpm, the falling speed is 37-40ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm.
  • the invention has the beneficial effects that the copper foil for the circuit board can be omitted, thereby solving the problem that the thick copper plate market is difficult to purchase, and the thick copper plate can be solved when the line edge is seriously concentrated, and the line and the line are not oiled.
  • Such abnormal problems, and the equipment requirements are not high, the general circuit board manufacturers can make, so it can reduce the processing flow, reduce the production cost, can also avoid the generation of ink bubbles, while considering the thick copper drilling and resin ink drilling
  • the problem is to drill holes in three sections to prevent resin cracking at the hole edge, and to adjust the appropriate resin drilling and thick copper drilling speed, falling speed, number of holes and speed of return according to different diameters of the drill holes. Cracking of the resin at the edge of the hole is further prevented.
  • Figure 1 is a flow chart of the fabrication of the present invention.
  • Embodiment As shown in FIG. 1 , the present invention provides a method for fabricating a selective thick copper line, comprising the following steps:
  • Drilling Drilling through a numerically controlled drilling machine and running through a predetermined level, specifically a three-stage drilling, each ratio of 1:0.9-1.1:0.9-1.1; the drill hole used in the drilling: If the diameter is 0.1mm, the rotation speed is 115-126krpm, the falling speed is 19-22ipm, the return speed is 500ipm, the number of drilled holes is up to 200; if the diameter is 0.15mm, the rotation speed is 110-125krpm, the falling speed is 20-24ipm The number of drilled holes is up to 300, the return speed is 500ipm; if the diameter is 0.20mm, the speed is 110-125krpm, the falling speed is 22-26ipm, the number of drilled holes is up to 500, the return speed is 500ipm; if the diameter is 0.25 Mm, the speed is 110-120krpm, the falling speed is 23-27ipm, the number of drilled holes is up to 500, and the return speed is 500ipm;
  • Ink silk screen printing using the air spraying method, performing the first whole board spraying ink on the ultra thick copper circuit board; performing the first pre-drying on the ultra thick copper circuit board;
  • the patterned negative film exposes the ultra-thick copper circuit board, and performs a first window opening in the middle of the copper upper surface of the ultra-thick copper circuit board; the side of the copper skin and the surface of the substrate are first performed Filling the ink; performing a second whole-plate spraying ink on the ultra-thick copper circuit board; performing the second pre-baking on the ultra-thick copper circuit board; performing the middle surface of the copper skin of the ultra-thick copper circuit board Opening a second time; performing a second filling of the side of the copper skin and the surface of the substrate; pre-curing the ultra-thick copper circuit board; and performing solder resist exposure on the ultra-thick copper circuit board;
  • Subsequent processing Subsequent processing of the board, including silk screen characters, surface treatment, shape processing, electrical performance testing, and surface inspection.
  • the first pre-baking and the second pre-baking in the step 3) are specifically at 75 ° C for 40 minutes.
  • the pre-curing temperature in the step 3) is 160-190 ° C, and the time is 50-75 min.
  • the optical substrate is prepared by using the shearing machine in the step 1), in particular, the copper plate is opened by using a shearing machine, and the first alignment hole is formed on the copper clad plate, and then the copper clad plate is self-contained.
  • the strip of copper is etched away to form a light substrate, and then a dense browning film is formed on the optical substrate to enhance the bonding force of subsequent press bonding.
  • the step 1) preparing a copper plate using a shearing machine, in particular, using a shearing machine to open a copper plate and forming a second alignment hole for aligning with the first alignment hole on the copper plate, Then, a photosensitive dry film is applied on the copper plate and selectively exposed by using a graphic film to form a desired pattern, followed by development, and then the exposed copper is etched away and the etching depth is 2/3 of the thickness of the copper plate.
  • the dry film as the resist layer is removed to form a copper plate having a line pattern on one side and a complete copper surface on the other side; then a brown organic metal film is formed on the surface of the copper plate, and the organic metal film is embedded in the surface of the copper plate and A grid-like conversion layer is formed between the plate and the resin to enhance the bonding force between the copper plate and the resin.
  • the rotation speed is 95-100 krpm, the falling speed is 25-29 ipm, the number of drilled holes is at most 500, the return speed is 500 ipm; if the diameter is 0.35 mm, the rotation speed is For 76-85krpm, the drop speed is 30-31ipm, the number of drilled holes is up to 800, and the return speed is 500ipm; if the diameter is 0.40mm, the rotation speed is 70-76krpm, the falling speed is 30-32ipm, and the number of drilled holes is at most 800, the return speed is 500ipm.
  • the rotation speed is 63-67 krpm
  • the falling speed is 31-33 ipm
  • the number of drilled holes is at most 800
  • the return speed is 500 ipm
  • the diameter is 0.50 mm
  • the rotation speed is For 55-60krpm
  • the drop speed is 33-35ipm
  • the number of drilled holes is up to 800
  • the return speed is 500ipm
  • the diameter is 0.55mm
  • the rotation speed is 50-55krpm
  • the falling speed is 33-35ipm
  • the number of drilled holes is up to 800.
  • the return speed is 700ipm; if the diameter is 0.60mm, the rotation speed is 45-50krpm, the falling speed is 68-72ipm, the number of drilled holes is up to 1200, the return speed is 700ipm; if the diameter is 0.65mm, the rotation speed is 42-46krpm, The falling speed is 68-72ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm; if the diameter is 0.70mm, the rotation speed is 40-45krpm, the falling speed is 36-38ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm; if the diameter is 0.75mm, the speed is 35-40krpm, the falling speed is 37-40ipm, the number of drilled holes is up to 1200, and the return speed is 700ipm.
  • the invention has the advantages that the copper foil for the circuit board can be omitted, thereby solving the problem that the thick copper plate market is difficult to purchase, and the abnormal problems such as serious oil gathering on the side of the thick copper plate and no oil between the wires and the line can be solved.
  • the equipment requirements are not high, the general circuit board manufacturers can make, so it can reduce the processing flow, reduce the production cost, can also avoid the generation of ink bubbles, while considering the problem of thick copper drilling and resin ink drilling, divided into three Drilling of the section to prevent cracking of the resin at the edge of the hole, and adjusting the appropriate resin drilling and thick copper drilling speed, falling speed, number of holes and return speed according to different diameters of the drill hole, further preventing the hole The resin is cracked.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种选择性厚铜线路制作方法，包括如下步骤：压合、钻孔、油墨丝印、制备线路和后续处理。该方法可以不用电路板专用铜箔，因而解决了厚铜板市场难购买的问题，可以解决厚铜板制作时线边严重聚油、线与线间不下油等异常问题，且对设备要求不高，一般线路板制造厂家都可以制作，因此能够减少加工流程，降低生产成本，也能避免油墨气泡的产生，同时考虑厚铜钻孔和树脂油墨钻孔的问题，分三段钻孔，防止孔边树脂开裂，以及钻孔时还根据不同的钻咀直径，调整合适的树脂钻孔和厚铜钻孔转速、落速、孔数和回速等因素，进一步防止了孔边树脂开裂。

Description

一种选择性厚铜线路制作方法 技术领域
本发明涉及电路板制造技术领域，具体为一种选择性厚铜线路制作方法。
背景技术
厚铜线路板通常在玻璃环氧基板上粘合一层铜箔，铜箔的厚度通常有18μm、35μm、55μm和70μm4种。最常用的铜箔厚度是35μm。国内采用的铜箔厚度一般为35-50μm，随着汽车电子的快速发展，印制电路板不仅要为电子元器件提供电器电气连接以及机械支撑，同时具有电源集成、提供大电流等也成为线路板的附加功能。所以产品设计对铜厚的要求也越来越高，已经达到350μm以上。目前行业的制作350μm以上的厚铜板存在以下几个问题点：对于铜厚要求在350μm及以上的板材，市场无法购买，制作厂家一般采用电镀的方式加厚铜，而直接电镀加厚会导致铜厚均匀性不佳，对后续品质造成不良影响。由于铜厚超厚，需要蚀刻的量相对大，则侧蚀效应严重，蚀刻后线宽较难保证。铜箔太厚导致阻焊制作时会造成线边严重聚油、线与线间不下油等异常，同时超厚铜线路板指的是外层成品铜厚度不小于210微米(60Z)的线路板。现有技术中，超厚铜线路板的阻焊加工方法就是按照普通线路板的丝印或喷涂的工艺，通过多次阻焊曝光的方式将油墨覆盖在铜面及基材表面。然而，这种方法加工流程长，生产成本高，还会因超厚铜与基材之间高度差较大，丝印过程中无法排尽空气，从而产生的油墨气泡问题，而钻孔工序中，由于树脂钻孔及厚铜钻孔的不匹配，易造成孔边缘树脂开裂。
所以，如何设计一种选择性厚铜线路制作方法，成为我们当前要解决的问题。
发明内容
本发明提供一种选择性厚铜线路制作方法，可以不用电路板专用铜箔，因 而解决了厚铜板市场难购买的问题，可以解决厚铜板制作时线边严重聚油、线与线间不下油等异常问题，且对设备要求不高，一般线路板制造厂家都可以制作，因此能够减少加工流程，降低生产成本，也能避免油墨气泡的产生，同时考虑厚铜钻孔和树脂油墨钻孔的问题，分三段钻孔，防止孔边树脂开裂，以及钻孔时还根据不同的钻咀直径，调整合适的树脂钻孔和厚铜钻孔转速、落速、孔数和回速等因素，进一步防止了孔边树脂开裂，可以有效解决上述背景技术中的问题。
为实现上述目的，本发明提供如下技术方案：一种选择性厚铜线路制作方法，包括如下步骤：
1)压合：先使用剪板机分别制备光基板和紫铜板，然后在所述光基板与所述紫铜板之间加入一层半固化片进行压合，以使所述光基板与所述紫铜板粘合到一起，其中，所述紫铜板的线路图形朝向所述光基板；
2)钻孔：使用数控钻孔机钻孔并贯穿预定的层次，具体为分3段钻孔，每段比例为1∶0.9-1.1∶0.9-1.1；所述钻孔中采用的钻咀：若直径为0.1mm，转速为115-126krpm，落速为19-22ipm，回速为500ipm，所钻孔数最多为200；若直径为0.15mm，转速为110-125krpm，落速为20-24ipm，所钻孔数最多为300，回速为500ipm；若直径为0.20mm，转速为110-125krpm，落速为22-26ipm，所钻孔数最多为500，回速为500ipm；若直径为0.25mm，转速为110-120krpm，落速为23-27ipm，所钻孔数最多为500，回速为500ipm；
3)油墨丝印：利用空气喷涂的方式，在所述超厚铜线路板上进行第一次整板喷涂油墨；对所述超厚铜线路板进行第一次预烘干；然后利用具有预设图案的底片对所述超厚铜线路板进行曝光，在所述超厚铜线路板的铜皮上表面中间进行第一次开窗；对所述铜皮的侧面以及基材表面进行第一次填充油墨；在超厚铜线路板上进行第二次整板喷涂油墨；对所述超厚铜线路板进行第二次预烘干；在所述超厚铜线路板的铜皮上表面中间进行第二次开窗；对所述铜皮的侧面以及基材表面进行第二次填充油墨；对所述超厚铜线路板进行预固化；对所 述超厚铜线路板进行阻焊曝光；
4)制备线路：使用化学沉积的方式将孔壁及板电表面金属化，使用整板电镀的方式将孔铜及面铜加厚5-8um；将处理后的板件上贴上一层感光性干膜，使用图形菲林进行选择性曝光，形成所需要的图形，再通过弱碱性药水进行显影；使用电镀的方式，对处理后的板件进行电镀铜加厚，然后电镀上一层抗蚀层，且抗蚀层为锡；用强碱药水将所述感光性干膜去掉，并使用强氧化性的药水将露出来的铜去掉，再使用带酸性的药水去掉抗蚀层的锡，最终形成线路；
5)后续处理：对板件进行后续处理，包括丝印字符、表面处理、外形加工、电性能测试、以及表面检测等工序。
根据上述技术方案，所述步骤3)中第一次预烘干和第二次预烘干的具体为在75℃下，持续40分钟。
根据上述技术方案，所述步骤3)中预固化温度为160-190℃，时间为50-75min。
根据上述技术方案，所述步骤1)中使用剪板机制备光基板具体为：使用剪板机开覆铜板并在该覆铜板上形成用于第一对位孔，然后再将覆铜板上自带的铜蚀刻掉以形成光基板，接着在光基板上形成一层致密的棕化膜以提升后续压合的结合力。
根据上述技术方案，所述步骤1)使用剪板机制备紫铜板具体为使用剪板机开紫铜板并在该紫铜板上形成用于与第一对位孔对位的第二对位孔，然后在紫铜板上贴一层感光性干膜并使用图形菲林进行选择性曝光以形成所需要的图形后进行显影，接着将露出来的铜蚀刻掉且蚀刻深度为紫铜板厚度的2/3，再除去作为抗蚀层的干膜以形成一面为线路图形、另一面为完整铜面的紫铜板；然后在紫铜板的表面形成一层棕色有机金属膜，有机金属膜嵌入紫铜板的表面并在压板时与树脂之间形成一层网格状转化层以增强紫铜板与树脂之间的结合力。
根据上述技术方案，所述步骤2)中若直径为0.30mm，转速为95-100krpm， 落速为25-29ipm，所钻孔数最多为500，回速为500ipm；若直径为0.35mm，转速为76-85krpm，落速为30-31ipm，所钻孔数最多为800，回速为500ipm；若直径为0.40mm，转速为70-76krpm，落速为30-32ipm，所钻孔数最多为800，回速为500ipm。
根据上述技术方案，所述步骤2)中若直径为0.45mm，转速为63-67krpm，落速为31-33ipm，所钻孔数最多为800，回速为500ipm；若直径为0.50mm，转速为55-60krpm，落速为33-35ipm，所钻孔数最多为800，回速500ipm；若直径为0.55mm，转速为50-55krpm，落速为33-35ipm，所钻孔数最多为800，回速为700ipm；若直径为0.60mm，转速为45-50krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.65mm，转速为42-46krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.70mm，转速为40-45krpm，落速为36-38ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.75mm，转速为35-40krpm，落速为37-40ipm，所钻孔数最多为1200，回速为700ipm。
与现有技术相比，本发明的有益效果：可以不用电路板专用铜箔，因而解决了厚铜板市场难购买的问题，可以解决厚铜板制作时线边严重聚油、线与线间不下油等异常问题，且对设备要求不高，一般线路板制造厂家都可以制作，因此能够减少加工流程，降低生产成本，也能避免油墨气泡的产生，同时考虑厚铜钻孔和树脂油墨钻孔的问题，分三段钻孔，防止孔边树脂开裂，以及钻孔时还根据不同的钻咀直径，调整合适的树脂钻孔和厚铜钻孔转速、落速、孔数和回速等因素，进一步防止了孔边树脂开裂。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。
在附图中：
图1是本发明的制作流程图。
具体实施方式
以下结合附图对本发明的优选实施例进行说明，应当理解，此处所描述的优选实施例仅用于说明和解释本发明，并不用于限定本发明。
实施例：如图1所示，本发明提供一种选择性厚铜线路制作方法，包括如下步骤：
1)压合：先使用剪板机分别制备光基板和紫铜板，然后在所述光基板与所述紫铜板之间加入一层半固化片进行压合，以使所述光基板与所述紫铜板粘合到一起，其中，所述紫铜板的线路图形朝向所述光基板；
2)钻孔：使用数控钻孔机钻孔并贯穿预定的层次，具体为分3段钻孔，每段比例为1∶0.9-1.1∶0.9-1.1；所述钻孔中采用的钻咀：若直径为0.1mm，转速为115-126krpm，落速为19-22ipm，回速为500ipm，所钻孔数最多为200；若直径为0.15mm，转速为110-125krpm，落速为20-24ipm，所钻孔数最多为300，回速为500ipm；若直径为0.20mm，转速为110-125krpm，落速为22-26ipm，所钻孔数最多为500，回速为500ipm；若直径为0.25mm，转速为110-120krpm，落速为23-27ipm，所钻孔数最多为500，回速为500ipm；
3)油墨丝印：利用空气喷涂的方式，在所述超厚铜线路板上进行第一次整板喷涂油墨；对所述超厚铜线路板进行第一次预烘干；然后利用具有预设图案的底片对所述超厚铜线路板进行曝光，在所述超厚铜线路板的铜皮上表面中间进行第一次开窗；对所述铜皮的侧面以及基材表面进行第一次填充油墨；在超厚铜线路板上进行第二次整板喷涂油墨；对所述超厚铜线路板进行第二次预烘干；在所述超厚铜线路板的铜皮上表面中间进行第二次开窗；对所述铜皮的侧面以及基材表面进行第二次填充油墨；对所述超厚铜线路板进行预固化；对所述超厚铜线路板进行阻焊曝光；
4)制备线路：使用化学沉积的方式将孔壁及板电表面金属化，使用整板电镀的方式将孔铜及面铜加厚5-8um；将处理后的板件上贴上一层感光性干膜，使用图形菲林进行选择性曝光，形成所需要的图形，再通过弱碱性药水进行显 影；使用电镀的方式，对处理后的板件进行电镀铜加厚，然后电镀上一层抗蚀层，且抗蚀层为锡；用强碱药水将所述感光性干膜去掉，并使用强氧化性的药水将露出来的铜去掉，再使用带酸性的药水去掉抗蚀层的锡，最终形成线路；
5)后续处理：对板件进行后续处理，包括丝印字符、表面处理、外形加工、电性能测试、以及表面检测等工序。
根据上述技术方案，所述步骤3)中第一次预烘干和第二次预烘干的具体为在75℃下，持续40分钟。
根据上述技术方案，所述步骤3)中预固化温度为160-190℃，时间为50-75min。
根据上述技术方案，所述步骤1)中使用剪板机制备光基板具体为：使用剪板机开覆铜板并在该覆铜板上形成用于第一对位孔，然后再将覆铜板上自带的铜蚀刻掉以形成光基板，接着在光基板上形成一层致密的棕化膜以提升后续压合的结合力。
根据上述技术方案，所述步骤1)使用剪板机制备紫铜板具体为使用剪板机开紫铜板并在该紫铜板上形成用于与第一对位孔对位的第二对位孔，然后在紫铜板上贴一层感光性干膜并使用图形菲林进行选择性曝光以形成所需要的图形后进行显影，接着将露出来的铜蚀刻掉且蚀刻深度为紫铜板厚度的2/3，再除去作为抗蚀层的干膜以形成一面为线路图形、另一面为完整铜面的紫铜板；然后在紫铜板的表面形成一层棕色有机金属膜，有机金属膜嵌入紫铜板的表面并在压板时与树脂之间形成一层网格状转化层以增强紫铜板与树脂之间的结合力。
根据上述技术方案，所述步骤2)中若直径为0.30mm，转速为95-100krpm，落速为25-29ipm，所钻孔数最多为500，回速为500ipm；若直径为0.35mm，转速为76-85krpm，落速为30-31ipm，所钻孔数最多为800，回速为500ipm；若直径为0.40mm，转速为70-76krpm，落速为30-32ipm，所钻孔数最多为800，回速为500ipm。
根据上述技术方案，所述步骤2)中若直径为0.45mm，转速为63-67krpm，落速为31-33ipm，所钻孔数最多为800，回速为500ipm；若直径为0.50mm，转速为55-60krpm，落速为33-35ipm，所钻孔数最多为800，回速500ipm；若直径为0.55mm，转速为50-55krpm，落速为33-35ipm，所钻孔数最多为800，回速为700ipm；若直径为0.60mm，转速为45-50krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.65mm，转速为42-46krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.70mm，转速为40-45krpm，落速为36-38ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.75mm，转速为35-40krpm，落速为37-40ipm，所钻孔数最多为1200，回速为700ipm。
基于上述，本发明的优点在于，可以不用电路板专用铜箔，因而解决了厚铜板市场难购买的问题，可以解决厚铜板制作时线边严重聚油、线与线间不下油等异常问题，且对设备要求不高，一般线路板制造厂家都可以制作，因此能够减少加工流程，降低生产成本，也能避免油墨气泡的产生，同时考虑厚铜钻孔和树脂油墨钻孔的问题，分三段钻孔，防止孔边树脂开裂，以及钻孔时还根据不同的钻咀直径，调整合适的树脂钻孔和厚铜钻孔转速、落速、孔数和回速等因素，进一步防止了孔边树脂开裂。
最后应说明的是：以上所述仅为本发明的优选实例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术患者来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种选择性厚铜线路制作方法，其特征在于：包括如下步骤：
    1)压合：先使用剪板机分别制备光基板和紫铜板，然后在所述光基板与所述紫铜板之间加入一层半固化片进行压合，以使所述光基板与所述紫铜板粘合到一起，其中，所述紫铜板的线路图形朝向所述光基板；
    2)钻孔：使用数控钻孔机钻孔并贯穿预定的层次，具体为分3段钻孔，每段比例为1∶0.9-1.1∶0.9-1.1；所述钻孔中采用的钻咀：若直径为0.1mm，转速为115-126krpm，落速为19-22ipm，回速为500ipm，所钻孔数最多为200；若直径为0.15mm，转速为110-125krpm，落速为20-24ipm，所钻孔数最多为300，回速为500ipm；若直径为0.20mm，转速为110-125krpm，落速为22-26ipm，所钻孔数最多为500，回速为500ipm；若直径为0.25mm，转速为110-120krpm，落速为23-27ipm，所钻孔数最多为500，回速为500ipm；
    3)油墨丝印：利用空气喷涂的方式，在所述超厚铜线路板上进行第一次整板喷涂油墨；对所述超厚铜线路板进行第一次预烘干；然后利用具有预设图案的底片对所述超厚铜线路板进行曝光，在所述超厚铜线路板的铜皮上表面中间进行第一次开窗；对所述铜皮的侧面以及基材表面进行第一次填充油墨；在超厚铜线路板上进行第二次整板喷涂油墨；对所述超厚铜线路板进行第二次预烘干；在所述超厚铜线路板的铜皮上表面中间进行第二次开窗；对所述铜皮的侧面以及基材表面进行第二次填充油墨；对所述超厚铜线路板进行预固化；对所述超厚铜线路板进行阻焊曝光；
    4)制备线路：使用化学沉积的方式将孔壁及板电表面金属化，使用整板电镀的方式将孔铜及面铜加厚5-8um；将处理后的板件上贴上一层感光性干膜，使用图形菲林进行选择性曝光，形成所需要的图形，再通过弱碱性药水进行显影；使用电镀的方式，对处理后的板件进行电镀铜加厚，然后电镀上一层抗蚀层，且抗蚀层为锡；用强碱药水将所述感光性干膜去掉，并使用强 氧化性的药水将露出来的铜去掉，再使用带酸性的药水去掉抗蚀层的锡，最终形成线路；
    5)后续处理：对板件进行后续处理，包括丝印字符、表面处理、外形加工、电性能测试、以及表面检测等工序。
  2. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤3)中第一次预烘干和第二次预烘干的具体为在75℃下，持续40分钟。
  3. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤3)中预固化温度为160-190℃，时间为50-75min。
  4. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤1)中使用剪板机制备光基板具体为：使用剪板机开覆铜板并在该覆铜板上形成用于第一对位孔，然后再将覆铜板上自带的铜蚀刻掉以形成光基板，接着在光基板上形成一层致密的棕化膜以提升后续压合的结合力。
  5. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤1)使用剪板机制备紫铜板具体为使用剪板机开紫铜板并在该紫铜板上形成用于与第一对位孔对位的第二对位孔，然后在紫铜板上贴一层感光性干膜并使用图形菲林进行选择性曝光以形成所需要的图形后进行显影，接着将露出来的铜蚀刻掉且蚀刻深度为紫铜板厚度的2/3，再除去作为抗蚀层的干膜以形成一面为线路图形、另一面为完整铜面的紫铜板；然后在紫铜板的表面形成一层棕色有机金属膜，有机金属膜嵌入紫铜板的表面并在压板时与树脂之间形成一层网格状转化层以增强紫铜板与树脂之间的结合力。
  6. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤2)中若直径为0.30mm，转速为95-100krpm，落速为25-29ipm，所钻孔数最多为500，回速为500ipm；若直径为0.35mm，转速为76-85krpm，落速为30-31ipm，所钻孔数最多为800，回速为500ipm；若直径为0.40mm，转速为70-76krpm，落速为30-32ipm，所钻孔数最多为800，回速为500ipm。
  7. 根据权利要求1所述的一种选择性厚铜线路制作方法，其特征在于：所述步骤2)中若直径为0.45mm，转速为63-67krpm，落速为31-33ipm，所钻孔数最多为800，回速为500ipm；若直径为0.50mm，转速为55-60krpm，落速为33-35ipm，所钻孔数最多为800，回速500ipm；若直径为0.55mm，转速为50-55krpm，落速为33-35ipm，所钻孔数最多为800，回速为700ipm；若直径为0.60mm，转速为45-50krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.65mm，转速为42-46krpm，落速为68-72ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.70mm，转速为40-45krpm，落速为36-38ipm，所钻孔数最多为1200，回速为700ipm；若直径为0.75mm，转速为35-40krpm，落速为37-40ipm，所钻孔数最多为1200，回速为700ipm。
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