WO2019085169A1 - 触控式oled显示面板以及显示装置 - Google Patents

触控式oled显示面板以及显示装置 Download PDF

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Publication number
WO2019085169A1
WO2019085169A1 PCT/CN2017/116001 CN2017116001W WO2019085169A1 WO 2019085169 A1 WO2019085169 A1 WO 2019085169A1 CN 2017116001 W CN2017116001 W CN 2017116001W WO 2019085169 A1 WO2019085169 A1 WO 2019085169A1
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Prior art keywords
connection terminal
disposed
array substrate
touch
tft array
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PCT/CN2017/116001
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English (en)
French (fr)
Inventor
唐岳军
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武汉华星光电技术有限公司
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Priority to US15/739,829 priority Critical patent/US20190131353A1/en
Publication of WO2019085169A1 publication Critical patent/WO2019085169A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a touch-sensitive OLED display panel, and to a display device including the touch-sensitive OLED display panel.
  • touch technology has gradually replaced traditional mouse and keyboard due to its humanized design and simple and fast input. It is widely used in a variety of electronic products. Among them, the capacitive touch screen is widely used because of its high response speed, high sensitivity, good reliability and high durability.
  • the OLED (Organic Electroluminescent Diode) display device has the characteristics of self-luminous, wide viewing angle, high luminous efficiency, low power consumption, fast response time, good low temperature characteristics, simple manufacturing process, and low cost.
  • the touch OLED display device usually adopts the OLED display panel and the touch screen separately, and then the two are attached together, that is, the external structure is adopted.
  • the touch OLED display device of such a structure has disadvantages such as reduced light transmittance and thick display device.
  • the present invention provides a touch-sensitive OLED display panel in which a touch structure is embedded in an OLED display panel, which has the advantages of simple structure, thin thickness, and high light transmittance.
  • a touch-sensitive OLED display panel includes a TFT array substrate and a package cover plate disposed opposite to each other, wherein the TFT array substrate is provided with a chip bonding portion and a first connection terminal electrically connected to each other, and the package cover A touch electrode layer and a second connection terminal electrically connected to each other are disposed on a side of the TFT array substrate; a conductive connection member is further disposed between the TFT array substrate and the package cover plate, and the conductive The connector electrically connects the first connection terminal and the second connection terminal to each other.
  • An organic light emitting structure layer is disposed on the TFT array substrate, and a sealant frame is disposed between the TFT array substrate and the package cover, and the sealant frame is disposed around the organic light emitting junction.
  • a periphery of the layer; the chip bonding portion, the first connection terminal, the second connection terminal, and the conductive connection member are both located outside the sealant frame, and the touch electrode layer is located in the sealant frame Inside.
  • the chip bonding portion and the first connection terminal are respectively disposed on a first side other than the sealant frame, and the second connection terminal is located directly opposite to the first connection terminal.
  • the area of the package cover corresponding to the first side is formed with a notch, and the second connection terminal is disposed on a protrusion located on both sides of the notch.
  • the chip bonding portion is disposed on a first side of the sealant frame, and the first connection terminal is disposed on a second side of the sealant frame different from the first side.
  • the second connection terminal is located directly opposite to the first connection terminal; a connection trace between the first connection terminal and the chip bonding portion is disposed at an edge region of the TFT array substrate.
  • the area of the package cover corresponding to the second side is formed with a notch, and the second connection terminal is disposed on a protrusion located on both sides of the notch.
  • the organic light emitting structure layer includes an anode layer, a light emitting material layer, and a cathode layer which are sequentially disposed on the TFT array substrate.
  • the conductive connecting member is an anisotropic conductive adhesive.
  • a support post is further disposed between the TFT array substrate and the package cover and adjacent to the conductive connector.
  • the present invention also provides a display device including a driving unit and a touch OLED display panel as described above, wherein the driving unit provides a driving signal to the touch OLED display panel.
  • the touch-sensitive OLED display panel and the display device are provided in the OLED display panel, and the touch structure is disposed on a side of the package cover plate facing the TFT array substrate.
  • the utility model has the advantages of simple structure, thin thickness and high light transmittance.
  • a conductive connection member is disposed on the non-display area of the display panel, and the connection terminal of the touch structure is electrically connected to the TFT array substrate, and the display driver and the touch drive share the same chip binding portion, which not only reduces the binding. The difficulty of the bonding process and also reduces the cost.
  • FIG. 1 is a schematic structural diagram of a touch-sensitive OLED display panel according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic plan view showing a touch-sensitive OLED display panel in Embodiment 1 of the present invention
  • FIG. 3 is a schematic plan view showing a touch-sensitive OLED display panel according to another embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a touch-sensitive OLED display panel according to Embodiment 2 of the present invention.
  • FIG. 5 is a schematic plan view showing a touch-sensitive OLED display panel in Embodiment 2 of the present invention.
  • FIG. 6 is a schematic plan view showing a touch-sensitive OLED display panel according to another embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a touch-sensitive OLED display panel according to another embodiment of the second embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a display device according to Embodiment 3 of the present invention.
  • the touch-sensitive OLED display panel includes a TFT array substrate 10 and a package cover 20 disposed opposite to each other, and the TFT array substrate 10 and the An organic light emitting structure layer 30 and a sealant frame 40 are disposed between the package cover plates 20 .
  • the sealant frame 40 is disposed around the organic light emitting structure layer 30 .
  • the sealant frame 40 is an encapsulant.
  • the TFT array substrate 10 and the package cover 20 and the sealant frame 40 together form a sealed cavity, and the organic light emitting structure layer 30 is disposed in the sealed cavity.
  • the organic light emitting structure layer 30 includes an anode layer 31, a light emitting material layer 32, and a cathode layer 33 which are sequentially disposed on the TFT array substrate 10.
  • the TFT array substrate 10 is provided with a chip bonding portion 11 and a first connection terminal 12 electrically connected to each other, and the package cover 20 is disposed on one side of the TFT array substrate 10 with each other.
  • the touch electrode layer 21 and the second connection terminal 22 are electrically connected.
  • a conductive connecting member 50 is further disposed between the TFT array substrate 10 and the package cover 20, and the conductive connecting member 50 electrically connects the first connecting terminal 12 and the second connecting terminal 22 to each other.
  • the chip bonding portion 11, the first connection terminal 12, the second connection terminal 22, and the conductive connector 50 are located outside the sealant frame 40, and the touch electrode layer 21 is located in the Inside the sealant frame 40.
  • the conductive connector 50 is made of an anisotropic conductive paste.
  • the chip bonding portion 11 and the first connection terminal 12 are respectively disposed outside the sealant frame 40.
  • the chip bonding portion 11 and the first connection terminal 12 are electrically connected to each other through a connection trace 60.
  • the second connection terminal 22 is located directly opposite to the first connection terminal 12, and is also disposed on the first side A outside the sealant frame 40. It should be noted that, in FIG. 2, the positions of the first connection terminal 12 and the second connection terminal 22 in the view are coincident.
  • the package cover 20 corresponds to the first side A region of A is formed with a notch portion 23, and the second connection terminal 22 is provided on a protruding portion 24 located on both sides of the notch portion 23.
  • the first connection terminal 12 is located directly opposite to the second connection terminal 22, and in FIG. 3, the positions of the two are coincident in the view.
  • the position of the notch portion 23 can provide a space for some electronic devices (such as cameras, speakers, etc.).
  • a display driving circuit (not shown) is further disposed on the TFT array substrate 10.
  • the display driving circuit mainly includes a thin film transistor disposed in an array and signal traces such as a data line and a gate line.
  • the substrate of the TFT array substrate 10 may be a rigid substrate, such as a glass substrate, or a flexible substrate, such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES).
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • a flexible substrate formed of a polymer material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP).
  • the touch electrode layer 21 includes a touch electrode and a touch driving trace.
  • the touch electrode is electrically connected to the second connection terminal 22 through the touch driving trace.
  • the touch electrode layer 21 may be a self-capacitance touch electrode structure or a mutual-capacitance touch electrode structure, and the corresponding electrode and its driving trace adopt the invention.
  • the solution of the embodiment is electrically connected to the chip bonding portion 11.
  • the touch electrode layer 21 may be a single-layer touch electrode structure or a multi-layer touch electrode structure.
  • the touch-sensitive OLED display panel provided in the above embodiment has the touch structure disposed in the OLED display panel.
  • the touch structure is disposed on a side of the package cover facing the TFT array substrate, and has a simple structure.
  • a conductive connecting member is disposed in the non-display area of the display panel, and the connecting terminal of the touch structure is electrically connected to the TFT array substrate, and the display driving and the touch driving device can share the same chip binding portion, thereby not only reducing the binding. The difficulty of the bonding process and also reduces the cost.
  • the display driver and the touch driver can share the same driver chip, that is, the display driver chip and the touch driver chip integration (TDDI) are on the same chip.
  • the present embodiment provides a touch-sensitive OLED display panel.
  • the chip bonding portion 11 is disposed on the TFT array substrate 10.
  • a first side A other than the plastic frame 40 the first connection terminal 12 is disposed on the second side B of the sealant frame 40 different from the first side A, the first connection terminal A connection trace 60 between the 12 and the chip bonding portion 11 is disposed in an edge region of the TFT array substrate 10.
  • the second connection terminal 22 is located directly opposite to the first connection terminal 12, and is also disposed on the second side B outside the sealant frame 40. It should be noted that, in FIG. 5, the positions of the first connection terminal 12 and the second connection terminal 22 in the view are coincident.
  • the first connection terminal 12, the second connection terminal 22, and the conductive connection member 50 are disposed on a different side from the chip binding portion 11, mainly for better utilizing the frame area of the display panel. space.
  • the conductive connecting member 50 is made of an anisotropic conductive adhesive.
  • FIG. 1 A region corresponding to the second side B of the package cover 20 is formed with a notch portion 23, and the second connection terminal 22 is disposed on the protruding portion 24 on both sides of the notch portion 23.
  • the first connection terminal 12 is located directly opposite to the second connection terminal 22, and in FIG. 6, the positions of the two are coincident in the view.
  • the position of the notch portion 23 can provide a space for some electronic devices (such as cameras, speakers, etc.).
  • the position between the TFT array substrate 10 and the package cover 20 adjacent to the conductive connector 50 is further set.
  • the support post 70 may be disposed away from the seal of the conductive connector 50
  • One side of the plastic frame 40 (as illustrated in FIG. 7) may of course be disposed between the conductive connector 50 and the sealant frame 40.
  • a portion of the TFT array substrate 10 in which the first connection terminal 12 is disposed may have a bending property
  • a portion of the package cover 20 in which the second connection terminal 22 is disposed may also be It may have a bending property, whereby a superior electrical connection performance between the conductive connecting member 50 and the first connecting terminal 12 and the second connecting terminal 22 can be obtained.
  • the support post 70 is used to provide a supporting force to maintain a proper height between the TFT array substrate 10 and the package cover 20 to match the height of the conductive connector 50.
  • the present embodiment provides a display device.
  • the display device includes a driving unit 200 and an OLED display panel 100.
  • the driving unit 200 provides a driving signal to the OLED display panel 100.
  • the OLED display panel 100 adopts the touch OLED display panel according to the first embodiment or the second embodiment of the present invention.
  • the driving signal includes a display driving signal and a touch driving signal.
  • the driving unit 200 includes a display driving chip and a touch driving chip, and the display driving chip and the touch driving chip are respectively connected to the TFT array substrate. Chip binding on the chip.
  • the display driving chip and the touch driving chip can be integrated in the same chip having both the display driving function and the touch driving function.
  • the touch-sensitive OLED display panel and the display device provided by the embodiments of the present invention embed the touch structure in the OLED display panel, which has the advantages of simple structure, thin thickness, and high light transmittance.

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  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种包含触控式OLED显示面板（100）的显示装置，触控式OLED显示面板（100）包括相对设置的TFT阵列基板（10）和封装盖板（20），其中， TFT阵列基板（10）上设置有相互电性连接的芯片绑定部（11）和第一连接端子（12），封装盖板（20）朝向TFT阵列基板（10）的一侧设置有相互电性连接的触控电极层（21）和第二连接端子（22）；TFT阵列基板（10）和封装盖板（20）之间还设置有导电连接件（50），导电连接件（50）将第一连接端子（12）和第二连接端子（22）相互电性连接。

Description

触控式OLED显示面板以及显示装置 技术领域
本发明涉及显示技术领域,尤其涉及一种触控式OLED显示面板，还涉及包含所述触控式OLED显示面板的显示装置。
背景技术
随着信息时代的发展及生活节奏的加快，触控技术由于其人性化设计及简单快捷的输入等特点，已经逐渐取代传统的鼠标和键盘，广泛的应用到各式各样的电子产品中，其中，电容式触摸屏由于其具有反应速度快，灵敏度高，可靠度佳以及耐用度高等优点而被广为使用。
OLED(有机电致发光二极管)显示装置具有自发光、广视角、发光效率高、功耗低、响应时间快、低温特性好、制造工艺简单、成本低等特性。目前触控式OLED显示装置通常采用将OLED显示面板和触摸屏分开来做，然后再将二者贴合起来，也就是采用外挂式的结构。这种结构的触控式OLED显示装置存在降低光透过率、显示装置较厚等缺点。
发明内容
鉴于现有技术的不足，本发明提供了一种触控式OLED显示面板，将触控结构内嵌设置在OLED显示面板中，具有结构简单、厚度薄、透光率高的优点。
为了实现上述目的，本发明采用了如下的技术方案：
一种触控式OLED显示面板，包括相对设置的TFT阵列基板和封装盖板，其中，所述TFT阵列基板上设置有相互电性连接的芯片绑定部和第一连接端子，所述封装盖板朝向所述TFT阵列基板的一侧设置有相互电性连接的触控电极层和第二连接端子；所述TFT阵列基板和所述封装盖板之间还设置有导电连接件，所述导电连接件将所述第一连接端子和所述第二连接端子相互电性连接。
其中，所述TFT阵列基板上设置有有机发光结构层，所述TFT阵列基板和所述封装盖板之间设置有密封胶框，所述密封胶框环绕设置于所述有机发光结 构层的四周；所述芯片绑定部、第一连接端子、第二连接端子以及所述导电连接件均位于所述密封胶框之外，所述触控电极层位于所述密封胶框之内。
其中，所述芯片绑定部和所述第一连接端子分别设置于所述密封胶框之外的第一侧，所述第二连接端子位于所述第一连接端子相对的正上方。
其中，所述封装盖板的对应于所述第一侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的突出部上。
其中，所述芯片绑定部设置于所述密封胶框之外的第一侧，所述第一连接端子设置于所述密封胶框之外的与所述第一侧相异的第二侧，所述第二连接端子位于所述第一连接端子相对的正上方；所述第一连接端子和所述芯片绑定部之间的连接走线布置于所述TFT阵列基板的边缘区域。
其中，所述封装盖板的对应于所述第二侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的突出部上。
其中，所述有机发光结构层包括依次设置在所述TFT阵列基板上的阳极层、发光材料层和阴极层。
其中，所述导电连接件为异方性导电胶。
其中，所述TFT阵列基板和所述封装盖板之间、邻近于所述导电连接件的位置还设置有支撑柱。
本发明还提供一种显示装置，其包括驱动单元和如上所述的触控式OLED显示面板，所述驱动单元向所述触控式OLED显示面板提供驱动信号。
本发明实施例提供的触控式OLED显示面板以及显示装置，将触控结构内嵌设置在OLED显示面板中，具体是将触控结构设置在封装盖板的朝向TFT阵列基板的一侧，其具有结构简单、厚度薄、透光率高的优点。另外，在显示面板的非显示区设置导电连接件，将触控结构的连接端子电性连接到TFT阵列基板上，显示驱动和触控驱动共用同一个芯片绑定部，不仅减小了绑定(bonding)工艺的难度，并且也降低了成本。
附图说明
图1是本发明实施例1提供的触控式OLED显示面板的结构示意图；
图2是本发明实施例1中的触控式OLED显示面板的平面结构示意图；
图3是本发明实施例1中另一个具体实施方案的触控式OLED显示面板的平面结构示意图；
图4是本发明实施例2提供的触控式OLED显示面板的结构示意图；
图5是本发明实施例2中的触控式OLED显示面板的平面结构示意图；
图6是本发明实施例2中另一个具体实施方案的触控式OLED显示面板的平面结构示意图；
图7是本发明实施例2中另一个具体实施方案的触控式OLED显示面板的结构示意图；
图8是本发明实施例3提供的显示装置的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
实施例1
本实施例提供了一种触控式OLED显示面板，如图1所示，所述触控式OLED显示面板包括相对设置的TFT阵列基板10和封装盖板20，所述TFT阵列基板10和所述封装盖板20之间设置有有机发光结构层30和密封胶框40，所述密封胶框40环绕设置于所述有机发光结构层30的四周，所述密封胶框40为封装胶。具体地，所述TFT阵列基板10和所述封装盖板20以及所述密封胶框40共同包围形成一个密封腔体，所述有机发光结构层30设置在所述密封腔体中。其中，所述有机发光结构层30包括依次设置在所述TFT阵列基板10上的阳极层31、发光材料层32和阴极层33。
其中，所述TFT阵列基板10上设置有相互电性连接的芯片绑定部11和第一连接端子12，所述封装盖板20朝向所述TFT阵列基板10的一侧设置有相互 电性连接的触控电极层21和第二连接端子22。所述TFT阵列基板10和所述封装盖板20之间还设置有导电连接件50，所述导电连接件50将所述第一连接端子12和所述第二连接端子22相互电性连接。具体地，所述芯片绑定部11、第一连接端子12、第二连接端子22以及所述导电连接件50均位于所述密封胶框40之外，所述触控电极层21位于所述密封胶框40之内。
在本实施例中，所述导电连接件50采用异方性导电胶。
在本实施例中，参阅图1和图2，在所述TFT阵列基板10上，所述芯片绑定部11和所述第一连接端子12分别设置于所述密封胶框40之外的第一侧A，所述芯片绑定部11和所述第一连接端子12通过连接走线60相互电性连接。在所述封装盖板20上，所述第二连接端子22位于所述第一连接端子12相对的正上方，也是设置于所述密封胶框40之外的第一侧A。需要说明的是，图2中，所述第一连接端子12和所述第二连接端子22在视图上的位置是重合的。
对于所述第一连接端子12和所述第二连接端子22的具体布置结构，在另一个具体的实施方案中，如图3所示，所述封装盖板20的对应于所述第一侧A的区域形成有缺口部23，所述第二连接端子22设置在位于所述缺口部23两侧的突出部24上。此时，所述第一连接端子12位于所述第二连接端子22相对的正下方，在图3中，两者在视图上的位置是重合的。当所述触控式OLED显示面板应用于一些具体的显示装置时，例如应用于智能手机，所述缺口部23的位置可以为一些电子器件(例如摄像头、喇叭等配件)提供放置空间。
其中，在所述TFT阵列基板10上还设置有显示驱动电路(图中未示出)，所述显示驱动电路主要是包括阵列设置的薄膜晶体管以及数据线和栅极线等信号走线。所述TFT阵列基板10的衬底基板可以是采用刚性基板，例如玻璃基板，也可以是采用柔性基板，例如采用聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料形成的柔性基板。
其中，所述触控电极层21包括触控电极和触控驱动走线。所述触控电极通过所述触控驱动走线电性连接到所述第二连接端子22。进一步地，对于触控方式和类别，所述触控电极层21可以是采用自电容的触控电极结构或者是采用互电容的触控电极结构，并且对应的电极及其驱动走线采用本发明实施例的方案电性连接至所述芯片绑定部11。另外，在结构层的设置上，所述触控电极层21可以是采用单层的触控电极结构或者是多层的触控电极结构。
如上实施例提供的触控式OLED显示面板，将触控结构内嵌设置在OLED显示面板中，具体是将触控结构设置在封装盖板的朝向TFT阵列基板的一侧，其具有结构简单、厚度薄、透光率高的优点。另外，在显示面板的非显示区设置导电连接件，将触控结构的连接端子电性连接到TFT阵列基板上，显示驱动和触控驱动可以共用同一个芯片绑定部，不仅减小了绑定(bonding)工艺的难度，并且也降低了成本。进一步地，显示驱动和触控驱动还可以共用同一个驱动芯片，即，将显示驱动芯片和触控驱动芯片集成(Touch and Display Driver Integration，TDDI)在同一芯片上。
实施例2
本实施例提供了一种触控式OLED显示面板，与实施例1不同的是，参阅图4和图5，在所述TFT阵列基板10上，所述芯片绑定部11设置于所述密封胶框40之外的第一侧A，所述第一连接端子12设置于所述密封胶框40之外的与所述第一侧A相异的第二侧B，所述第一连接端子12和所述芯片绑定部11之间的连接走线60布置于所述TFT阵列基板10的边缘区域。在所述封装盖板20上，所述第二连接端子22位于所述第一连接端子12相对的正上方，也是设置于所述密封胶框40之外的第二侧B。需要说明的是，图5中，所述第一连接端子12和所述第二连接端子22在视图上的位置是重合的。
本实施例中，所述第一连接端子12、第二连接端子22以及导电连接件50设置在与所述芯片绑定部11不同的一侧，主要为了更好地利用显示面板的边框区域的空间。其中，所述导电连接件50采用异方性导电胶。
进一步地，与实施例1中类似的，对于所述第一连接端子12和所述第二连接端子22的具体布置结构，在本实施例的另一个具体的实施方案中，如图6所示，所述封装盖板20的对应于所述第二侧B的区域形成有缺口部23，所述第二连接端子22设置在位于所述缺口部23两侧的突出部24上。此时，所述第一连接端子12位于所述第二连接端子22相对的正下方，在图6中，两者在视图上的位置是重合的。当所述触控式OLED显示面板应用于一些具体的显示装置时，例如应用于智能手机，所述缺口部23的位置可以为一些电子器件(例如摄像头、喇叭等配件)提供放置空间。
进一步地，在本实施例的另一个具体的实施方案中，如图7所示，所述TFT阵列基板10和所述封装盖板20之间、邻近于所述导电连接件50的位置还设置有支撑柱70。所述支撑柱70可以是设置在所述导电连接件50的远离所述密封 胶框40的一侧(如图7的图示)，当然也可以是设置在所述导电连接件50与所述密封胶框40之间。在该实施例中，所述TFT阵列基板10中设置有所述第一连接端子12的部分可以是具有弯曲性能，而所述封装盖板20中设置有所述第二连接端子22的部分也可以是具有弯曲性能，由此可以使得所述导电连接件50与所述第一连接端子12和所述第二连接端子22之间获得更优的电连接性能。而所述支撑柱70用于提供支撑力，以使所述TFT阵列基板10和所述封装盖板20之间保持适当的高度，与所述导电连接件50的高度相互匹配。
实施例3
本实施例提供了一种显示装置，如图8所示，所述显示装置包括驱动单元200和OLED显示面板100，所述驱动单元200向所述OLED显示面板100提供驱动信号。所述OLED显示面板100采用了本发明如上实施例1或实施例2所述的触控式OLED显示面板。其中，所述驱动信号包括显示驱动信号和触控驱动信号，具体地，所述驱动单元200包括显示驱动芯片和触控驱动芯片，所述显示驱动芯片和触控驱动芯片分别连接到TFT阵列基板上的芯片绑定部。在一些具体的实施方案中，显示驱动芯片和触控驱动芯片可以集成在同时具有显示驱动功能和触控驱动功能的同一芯片中。
综上所述，本发明实施例提供的触控式OLED显示面板及显示装置，将触控结构内嵌在OLED显示面板中，其具有结构简单、厚度薄、透光率高的优点。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种触控式OLED显示面板，包括相对设置的TFT阵列基板和封装盖板，其中，所述TFT阵列基板上设置有相互电性连接的芯片绑定部和第一连接端子，所述封装盖板朝向所述TFT阵列基板的一侧设置有相互电性连接的触控电极层和第二连接端子；所述TFT阵列基板和所述封装盖板之间还设置有导电连接件，所述导电连接件将所述第一连接端子和所述第二连接端子相互电性连接。
  2. 根据权利要求1所述的触控式OLED显示面板，其中，所述TFT阵列基板上设置有有机发光结构层，所述TFT阵列基板和所述封装盖板之间设置有密封胶框，所述密封胶框环绕设置于所述有机发光结构层的四周；所述芯片绑定部、第一连接端子、第二连接端子以及所述导电连接件均位于所述密封胶框之外，所述触控电极层位于所述密封胶框之内。
  3. 根据权利要求2所述的触控式OLED显示面板，其中，所述芯片绑定部和所述第一连接端子分别设置于所述密封胶框之外的第一侧，所述第二连接端子位于所述第一连接端子相对的正上方。
  4. 根据权利要求3所述的触控式OLED显示面板，其中，所述封装盖板的对应于所述第一侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的突出部上。
  5. 根据权利要求2所述的触控式OLED显示面板，其中，所述芯片绑定部设置于所述密封胶框之外的第一侧，所述第一连接端子设置于所述密封胶框之外的与所述第一侧相异的第二侧，所述第二连接端子位于所述第一连接端子相对的正上方；所述第一连接端子和所述芯片绑定部之间的连接走线布置于所述TFT阵列基板的边缘区域。
  6. 根据权利要求5所述的触控式OLED显示面板，其中，所述封装盖板的对应于所述第二侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的突出部上。
  7. 根据权利要求2所述的触控式OLED显示面板，其中，所述有机发光结构层包括依次设置在所述TFT阵列基板上的阳极层、发光材料层和阴极层。
  8. 根据权利要求1所述的触控式OLED显示面板，其中，所述导电连接件 为异方性导电胶。
  9. 根据权利要求8所述的触控式OLED显示面板，其中，所述TFT阵列基板和所述封装盖板之间、邻近于所述导电连接件的位置还设置有支撑柱。
  10. 根据权利要求1所述的触控式OLED显示面板，其中，所述TFT阵列基板和所述封装盖板之间、邻近于所述导电连接件的位置还设置有支撑柱。
  11. 一种显示装置，其包括驱动单元和触控式OLED显示面板，所述驱动单元向所述触控式OLED显示面板提供驱动信号，所述触控式OLED显示面板包括相对设置的TFT阵列基板和封装盖板，其中，所述TFT阵列基板上设置有相互电性连接的芯片绑定部和第一连接端子，所述封装盖板朝向所述TFT阵列基板的一侧设置有相互电性连接的触控电极层和第二连接端子；所述TFT阵列基板和所述封装盖板之间还设置有导电连接件，所述导电连接件将所述第一连接端子和所述第二连接端子相互电性连接。
  12. 根据权利要求11所述的显示装置，其中，所述TFT阵列基板上设置有有机发光结构层，所述TFT阵列基板和所述封装盖板之间设置有密封胶框，所述密封胶框环绕设置于所述有机发光结构层的四周；所述芯片绑定部、第一连接端子、第二连接端子以及所述导电连接件均位于所述密封胶框之外，所述触控电极层位于所述密封胶框之内。
  13. 根据权利要求12所述的显示装置，其中，所述芯片绑定部和所述第一连接端子分别设置于所述密封胶框之外的第一侧，所述第二连接端子位于所述第一连接端子相对的正上方。
  14. 根据权利要求13所述的显示装置，其中，所述封装盖板的对应于所述第一侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的突出部上。
  15. 根据权利要求12所述的显示装置，其中，所述芯片绑定部设置于所述密封胶框之外的第一侧，所述第一连接端子设置于所述密封胶框之外的与所述第一侧相异的第二侧，所述第二连接端子位于所述第一连接端子相对的正上方；所述第一连接端子和所述芯片绑定部之间的连接走线布置于所述TFT阵列基板的边缘区域。
  16. 根据权利要求15所述的显示装置，其中，所述封装盖板的对应于所述第二侧的区域形成有缺口部，所述第二连接端子设置在位于所述缺口部两侧的 突出部上。
  17. 根据权利要求12所述的显示装置，其中，所述有机发光结构层包括依次设置在所述TFT阵列基板上的阳极层、发光材料层和阴极层。
  18. 根据权利要求11所述的触控式OLED显示面板，其中，所述导电连接件为异方性导电胶。
  19. 根据权利要求18所述的显示装置，其中，所述TFT阵列基板和所述封装盖板之间、邻近于所述导电连接件的位置还设置有支撑柱。
  20. 根据权利要求11所述的显示装置，其中，所述TFT阵列基板和所述封装盖板之间、邻近于所述导电连接件的位置还设置有支撑柱。
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