WO2019080630A1 - 驱动电路板和显示装置 - Google Patents

驱动电路板和显示装置

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Publication number
WO2019080630A1
WO2019080630A1 PCT/CN2018/102506 CN2018102506W WO2019080630A1 WO 2019080630 A1 WO2019080630 A1 WO 2019080630A1 CN 2018102506 W CN2018102506 W CN 2018102506W WO 2019080630 A1 WO2019080630 A1 WO 2019080630A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
driving circuit
substrate
lead
display
Prior art date
Application number
PCT/CN2018/102506
Other languages
English (en)
French (fr)
Inventor
冯彬峰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/330,471 priority Critical patent/US11665819B2/en
Publication of WO2019080630A1 publication Critical patent/WO2019080630A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a driving circuit board and a display device.
  • OLED Organic Light-Emitting Device
  • OLED has the advantages of active illumination, good temperature characteristics, low power consumption, fast response, wide viewing angle, ultra-thin and low cost, and has been widely used in display devices.
  • the number of leads on the display substrate of the display device increases, and the length of the driving circuit board increases accordingly. Therefore, the bending resistance of the driving circuit board is increased, so that the curvature of the bending portion of the driving circuit board is reduced, and the bending radius is increased, which is disadvantageous for the realization of the narrow bezel.
  • the present disclosure provides a driving circuit board for use in a display device, wherein the driving circuit board is bendable; wherein the driving circuit board is provided with a through hole penetrating the driving circuit board, and the through hole is located The bendable portion of the drive circuit board.
  • the display device comprises a display substrate, the display substrate comprises a display area and a lead area around the display area, the lead area is provided with a lead extending from the display area; the driving circuit One end of the board is for engaging with the lead area to be electrically connected to the lead of the lead area, and the other end of the driving circuit board is for engaging with a side of the display substrate that faces away from the light exiting direction.
  • the driving circuit board comprises a substrate, a signal line disposed on the substrate, and a driving chip, wherein the signal line is used for connecting the driving chip and the lead wire of the lead area, and the signal line is located at the driving The area of the circuit board where the through hole is not provided.
  • the driving circuit board further includes a first protective layer disposed on the substrate, the first protective layer covering at least a portion of the signal line at the bendable portion.
  • the number of the through holes is plural, and the plurality of the through holes are arranged in a direction perpendicular to a bending direction of the driving circuit board.
  • the number of the driving chips is plural; and the plurality of the through holes and the plurality of the driving chips are staggered along the arrangement direction of the through holes.
  • the substrate has a thickness between 20 ⁇ m and 50 ⁇ m.
  • the present disclosure also provides a display device including a display substrate and the aforementioned driving circuit board.
  • the display substrate comprises a display area and a lead area around the display area, the lead area is provided with a lead extending from the display area; one end of the driving circuit board and the lead area The bonding is electrically connected to the leads of the lead region, and the other end of the driving circuit board is joined to a side of the display substrate that faces away from the light emitting direction.
  • the driving circuit board includes a substrate, a signal line disposed on the substrate, and a driving chip, the display substrate including a substrate and a second protective layer disposed on one side of the substrate, the lead region A lead is disposed on a side of the substrate facing away from the second protective layer, the substrate being integral with the substrate.
  • the display substrate further includes a buffer layer, and the buffer layer is located on a side of the second protective layer facing away from the substrate.
  • the number of the driving circuit boards is multiple, and the plurality of driving circuit boards are located at different edges of the display substrate.
  • FIG. 1 is a schematic diagram of a driving circuit board in the related art for a display device
  • FIG. 2 is a schematic view showing the connection of the driving circuit board provided by the present disclosure to the display substrate when not bent;
  • FIG. 3 is a perspective view of a driving circuit board provided by the present disclosure for a display device
  • Figure 4 is a cross-sectional view taken along line B-B' of Figure 3;
  • FIG. 5 is another perspective view of a driving circuit board provided by the present disclosure for a display device.
  • the driving chip 11 is disposed on the driving circuit board 10, and is electrically connected to the leads on the display substrate 20 through signal lines on the driving circuit board, thereby being the display substrate 20. Provide drive signals.
  • One end of the driving circuit board 10 is connected to the display substrate 20, and is bent toward the side of the display substrate 20 facing away from the light emitting direction, so that the other end of the driving circuit board 10 is located on the side of the display substrate 20 facing away from the light emitting direction.
  • a driving circuit board 10 for a display device in which a driving circuit board 10 can be bent, wherein the driving circuit board 10 is provided with a driving circuit board 10 therethrough.
  • the through hole 12 is located at a bendable portion of the driving circuit board 10.
  • the bent position forms a certain curved structure.
  • the longitudinal section is formed in a U shape.
  • the drive circuit board 10 at this time is divided into a first plate portion 10a, a second plate portion 10b, and an arcuate connecting portion 10c that connects the first plate portion 10a and the second plate portion 10b.
  • the first plate portion 10a may be connected to the lead portion
  • the second plate portion 10b is located on a side of the first plate portion 10a that faces away from the light exiting direction
  • the curved connecting portion 10c serves as a bendable portion of the drive circuit board 10 and the display substrate 20.
  • the end faces are opposed to each other, and the through holes 12 are located at the arcuate connecting portion 10c.
  • the radius of the circumferential surface on which the surface of the curved connecting portion 10c is located is the bending radius when the driving circuit board 10 is bent. It should be noted that the arrangement of the through holes 12 should not affect the normal operation of the driving circuit board 10, that is, any conductive lines on the driving circuit board 10 are not disconnected due to the arrangement of the through holes 12.
  • the arrangement of the through holes 12 can reduce the cross-sectional area of the bend to reduce the bending resistance of the bent portion of the drive circuit board 10. Therefore, the driving circuit board is more easily bent, thereby increasing the bending curvature when the driving circuit board is bent, and the bending radius is correspondingly reduced, which is advantageous for the realization of the narrow frame.
  • the display device may include a display substrate 20 including a display area (AA area) and a lead area located around the display area (AA area), the lead area being disposed to extend from the display area Leads.
  • One end of the driving circuit board 10 is for engaging with the lead portion to be electrically connected to the lead of the lead portion, and the other end of the driving circuit board 10 is for a direction away from the display substrate 20 from the light emitting direction Side phase bonding.
  • the "light-emitting direction” is the orientation of the display surface of the display area (AA area). Taking FIG. 2 as an example, the "light-emitting direction" of the display substrate is the direction in which the paper of FIG.
  • the driving circuit board 10 may include a bendable substrate 13, a signal line 15 disposed on the substrate 13, and a driving chip 11, and the signal line 15 is used to connect the driving chip.
  • the signal line 15 is located in a region of the driving circuit board 10 where the through hole 12 is not provided.
  • the material of the substrate 13 may include polyimide (PI), and the thickness of the substrate 13 is between 20 ⁇ m and 50 ⁇ m.
  • the driving circuit board 10 further includes a first protective layer 14 disposed on the substrate 13, and the first protective layer 14 covers at least a portion of the signal line 15 at the bendable portion.
  • the object when the object is bent, there is a neutral layer inside, and the neutral layer is neither elongated nor compressed.
  • the first protective layer 14 is not provided on the substrate 13, when the substrate 13 is bent toward the side facing away from the signal line 15, the signal line 15 will be located on the stretched surface of the substrate 13 to be stretched.
  • the substrate 13 and the first protective layer 14 are simultaneously bent toward the side facing away from the first protective layer 14 (ie, the first protective layer 14 is located outside the substrate 13 after being bent)
  • the signal line 15 is located at or near the neutral layer of the integral structure of the substrate 13 and the first protective layer 14, thereby preventing the signal line 15 from being broken by stretching.
  • the arrangement of the first protective layer 14 can also prevent the signal line 15 from being scratched.
  • the first protective layer 14 may be made of an organic polymer. Specifically, a polyester urethane adhesive (for example, MCL adhesive) may be used to facilitate bending.
  • MCL adhesive polyester urethane adhesive
  • the drive circuit board 10 provided in an embodiment of the present disclosure is particularly suitable for use in a large-sized display device.
  • the length of the lead portion is long, and accordingly, the length of the drive circuit board 10 is long.
  • a plurality of through holes 12 may be provided.
  • the arrangement direction of the plurality of through holes 12 is perpendicular to the bending direction of the drive circuit board 10.
  • the bending direction may be defined as the direction in which the force is applied to the distal end of the driving circuit board 10 at the initial timing when the unbent driving circuit board 10 is bent.
  • the bending direction of the driving circuit board 10 is perpendicular to the paper surface.
  • the bending direction of the driving circuit board 10 is as indicated by an arrow in FIG. 4 (parallel to the thickness direction of the display substrate 20).
  • the arrangement direction of the plurality of through holes 12 can also be regarded as the extending direction of the internal neutral axis when the driving circuit board 10 is bent.
  • the "internal neutral axis" is the intersection of the inner neutral layer of the drive circuit board 10 and the plane parallel to the display surface of the display substrate 20.
  • the center of the plurality of through holes 12 may be located on the same straight line, and when bent, the center line of the plurality of through holes 12 (the line C-C' in FIG. 2) is bent.
  • the present disclosure does not limit the shape of the through hole 12, and may be, for example, a cylindrical through hole that is circular, elliptical, rectangular or polygonal in shape.
  • the number of the driving chips 11 may be plural; in the arrangement direction of the through holes 12, the plurality of through holes 12 and the plurality of driving chips 11 are alternately arranged. This facilitates the signal line 15 electrically connecting the driving chip 11 to the leads of the lead regions of the display substrate 20. It should be noted that the staggered arrangement of the through hole 12 and the driving chip 11 does not necessarily mean that the through hole 12 and the driving chip 11 are on the same straight line. As shown in FIG.
  • the alternating manner may be one-to-one interleaving or other alternating manners, for example, there is an orthographic projection of two driving chips 11 between the orthographic projections of each adjacent two through holes 12.
  • the display device includes a display substrate and the above-described driving circuit board 10.
  • the display substrate may include a display area (AA area) and a lead area located around the display area, and one end of the driving circuit board 10 is bonded to the lead area to be electrically connected to the lead of the lead area, and The other end of the driving circuit board 10 is joined to the side of the display substrate 20 that faces away from the light emitting direction.
  • the driving circuit board 10 is a bent structure.
  • the drive circuit board 10 as a whole can be divided into three parts: a first plate portion 10a, a second plate portion 10b, and an arcuate connecting portion 10c as a bendable portion.
  • the through hole 12 is located on the curved connecting portion.
  • the number of the through holes 12 may be plural, and each of the through holes 12 is located at a middle portion of the curved connecting portion 10c in the thickness direction of the display device.
  • the display substrate 20 may include a substrate 21 on which leads are disposed on a substrate 21 on which a display element such as a thin film transistor or the like may be disposed.
  • the display substrate of the present embodiment is particularly suitable for an organic electroluminescence display (OLED) device. Accordingly, the substrate 21 may further be provided with a light emitting unit and an encapsulation layer.
  • the present disclosure does not specifically limit the manner in which the driving circuit board 10 and the lead region of the display substrate 20 are bonded.
  • the surface of the driving circuit board 10 on which the signal line 15 is disposed may be opposed to the lead region, and the signal line 15 and the lead region may be The leads are bonded, after which the drive board 10 is bent.
  • the substrate 21 and the substrate 13 in the embodiment of the present disclosure may be formed in a unitary structure as shown in FIGS. 3 and 4.
  • the signal line 15 and the lead wire to which it is connected may also be formed in a unitary structure; after the driving circuit board 10 is bent, the signal line 15 is located outside the substrate 13 (i.e., the side facing away from the substrate 21).
  • the display substrate 20 further includes settings.
  • the size of the second protective layer 22 is the same as the size of the substrate 21.
  • the lead 25 of the lead region is disposed on a side of the substrate 21 facing away from the second protective layer 22.
  • the display substrate 20 may further include a buffer layer 23.
  • the buffer layer 23 is located on the side of the second protective layer 22 facing away from the substrate 21.
  • the buffer layer 22 spaces the substrate 21 from the second plate portion 10b of the drive circuit board 10.
  • the buffer layer 23 can be similar in size to the second plate portion 10b of the driving circuit board 10, so as to support the driving circuit board 10 during the moving of the display device, and prevent the driving circuit board 10 from being broken when subjected to an external force. .
  • the size of the buffer layer 23 can also be used for the same substrate 21, so that not only the driving circuit board 10 is prevented from being broken, but also the external impact on the entire display substrate 20 can be alleviated, and the damage of the display substrate 20 can be reduced.
  • the buffer layer 23 can be made of foam.
  • the display substrate 20 may further include a third protective layer 24 disposed on a side of the buffer layer 23 facing away from the substrate 21.
  • the size of the third protective layer 24 may be similar to the size of the second plate portion 10b of the drive circuit board 10. As shown in FIG. 4, the projection of the second plate portion 10b of the drive circuit board 10 toward the substrate 21 is covered by the projection of the third protective layer 24 toward the substrate 21.
  • the number of the driving circuit boards 10 is plural, and the plurality of driving circuit boards 10 are located at different edges of the display substrate 20. As shown in FIGS. 3 and 5, one side of the substrate 21 along its length direction and one side along the width direction thereof are respectively provided with a driving circuit board 10, and the two driving circuit boards 10 respectively provide gates for the display substrate 20. Pole drive signal and source drive signal.
  • the bending portion of the driving circuit board is provided with a through hole, so that the cross-sectional area of the bending portion can be reduced, thereby reducing the driving circuit board bending.
  • the bending resistance of the folding portion makes the driving circuit board more easily bent, thereby increasing the bending curvature when the driving circuit board is bent, and the bending radius is correspondingly reduced.
  • the width of the frame occupied by the driving circuit board in the display device can be reduced, so that the frame width of the display device using the driving circuit board is reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供一种驱动电路板，其用于显示装置中，所述驱动电路板能够弯折，所述驱动电路板上设置有贯穿该驱动电路板的通孔，所述通孔位于所述驱动电路板的可弯折部。本公开还提供一种显示装置。

Description

驱动电路板和显示装置 技术领域
本公开涉及显示技术领域，具体涉及一种驱动电路板和显示装置。
背景技术
有机电致发光器件(Organic Light-Emitting Device，OLED)具有主动发光、温度特性好、功耗小、响应快、视角宽、超轻薄和成本低等优点，已广泛应用于显示装置中。由于显示装置尺寸的增大及解析度的增加，导致显示装置的显示基板上引线增多，驱动电路板的长度相应增大。因此，导致驱动电路板的抗弯折能力增大，从而使得驱动电路板弯折处的曲率减小，弯曲半径增大，进而不利于窄边框的实现。
公开内容
本公开提供一种驱动电路板，其用于显示装置中，所述驱动电路板能够弯折；其中，所述驱动电路板上设置有贯穿所述驱动电路板的通孔，所述通孔位于所述驱动电路板的可弯折部。
可选地，所述显示装置包括显示基板，所述显示基板包括显示区和位于所述显示区周围的引线区，所述引线区设置有从所述显示区延伸出的引线；所述驱动电路板的一端用于与所述引线区相接合以与所述引线区的引线电连接，以及，所述驱动电路板的另一端用于与所述显示基板背离出光方向的一侧相接合。
可选地，所述驱动电路板包括基底、设置在基底上的信号线和驱动芯片，所述信号线用于连接所述驱动芯片与所述引线区的引线，所述信号线位于所述驱动电路板的未设置所述通孔的区域。
可选地，所述驱动电路板还包括设置在所述基底上的第一保护层，所述第一保护层至少覆盖所述信号线的位于所述可弯折部的部 分。
可选地，所述通孔的数量为多个，多个所述通孔的排列方向与所述驱动电路板弯折方向垂直。
可选地，所述驱动芯片的数量为多个；沿所述通孔的排列方向，多个所述通孔和多个所述驱动芯片交错设置。
可选地，所述基底的厚度在20μm～50μm之间。
相应地，本公开还提供一种显示装置，包括显示基板和前述的驱动电路板。
可选地，所述显示基板包括显示区和位于所述显示区周围的引线区，所述引线区设置有从所述显示区延伸出的引线；所述驱动电路板的一端与所述引线区相接合以与所述引线区的引线电连接，以及，所述驱动电路板的另一端与所述显示基板背离出光方向的一侧相接合。
可选地，所述驱动电路板包括基底、设置在基底上的信号线和驱动芯片，所述显示基板包括衬底和设置在所述衬底一侧的第二保护层，所述引线区的引线设置在所述衬底的背离所述第二保护层的一侧，所述衬底与所述基底为一体结构。
可选地，所述显示基板还包括缓冲层，所述缓冲层位于所述第二保护层背离所述衬底的一侧。
可选地，所述驱动电路板的数量为多个，所述多个驱动电路电路板位于所述显示基板的不同边缘。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1是相关技术中的驱动电路板用于显示装置的示意图；
图2是本公开提供的驱动电路板在未弯折时与显示基板的连接示意图；
图3是本公开提供的驱动电路板用于显示装置的立体示意图；
图4是沿图3中B-B’线的剖视图；
图5是本公开提供的驱动电路板用于显示装置的另一立体示意图。
具体实施方式
以下结合附图对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
如图1所示，在有机电致发光显示装置中，驱动芯片11设置在驱动电路板10上，并通过驱动电路板上的信号线与显示基板20上的引线电连接，从而为显示基板20提供驱动信号。驱动电路板10的一端与显示基板20相连后，朝向显示基板20背离出光方向的一侧弯折，以使驱动电路板10的另一端位于显示基板20背离出光方向的一侧。
作为本公开的一方面，提供一种驱动电路板10，该驱动电路板10用于显示装置中，驱动电路板10能够弯折，其中，驱动电路板10上设置有贯穿该驱动电路板10的通孔12，通孔12位于驱动电路板10的可弯折部。
应当理解的是，当驱动电路板10弯折时，弯折位置会形成一定的弧面结构。如图4所示，驱动电路板10弯折后，纵截面形成为U形。此时的驱动电路板10分为第一板部10a、第二板部10b以及连接第一板部10a和第二板部10b的弧形连接部10c。第一板部10a可以与引线区相连，第二板部10b位于第一板部10a的背离出光方向的一侧，弧形连接部10c作为驱动电路板10的可弯折部与显示基板20的端面相对，通孔12位于弧形连接部10c。弧形连接部10c表面所在的圆周面的半径即为驱动电路板10弯折时的弯折半径。需要说明的是，通孔12的设置不应影响驱动电路板10的正常工作，即，驱动电路板10上的任意导电线路均不会因通孔12的设置而断开。
在本公开的实施方式中，通孔12的设置可以减小弯折处的横截面积，以减小驱动电路板10弯折处的抗弯折能力。从而使得驱动电路板更容易弯折，进而使得驱动电路板弯折时的弯曲曲率增大，弯折 半径相应减小，有利于窄边框的实现。
在一实施方式中，显示装置可以包括显示基板20，显示基板20包括显示区(AA区)和位于显示区(AA区)周围的引线区，所述引线区设置有从所述显示区延伸出的引线。驱动电路板10的一端用于与所述引线区相接合以与所述引线区的引线电连接，以及，所述驱动电路板10的另一端用于与所述显示基板20背离出光方向的一侧相接合。此处，“出光方向”即为显示区(AA区)的显示面的朝向。以图2为例，显示基板的“出光方向”是垂直图2的纸面向外的方向，显示基板背离出光方向的方向即为垂直图2的纸面向内的方向。驱动电路板10的一端与显示基板20的引线区相接合，有利于改善驱动电路板10安装于显示基板20的装配性。此外，由于驱动电路板10的另一端接合于所述显示基板背离出光方向的一侧，在驱动电路板10的另一端可以布置其他部件而不影响显示区的显示面积。结合图2至图5所示，在一实施方式中，驱动电路板10可以包括能够弯折的基底13、设置在基底13上的信号线15和驱动芯片11，信号线15用于连接驱动芯片11与所述引线区的引线25，信号线15位于驱动电路板10的未设置通孔12的区域。由此，驱动电路板10弯折后，具有驱动芯片11的一端可以隐藏在显示基板20背离出光方向的一侧，这有利于增大显示基板的显示区的面积。另外，为了提高驱动电路板10的柔韧性，以便于对驱动电路板10进行弯折，制成基底13的材料可以包括聚酰亚胺(PI)，基底13的厚度在20μm～50μm之间。
进一步地，如图4所示，驱动电路板10还包括设置在基底13上的第一保护层14，第一保护层14至少覆盖信号线15的位于所述可弯折部的部分。
可以理解的是，当物体弯折时，其内部会存在一个中性层，该中性层既不伸长，也不压缩。在基底13上未设置第一保护层14的情况下，将基底13向背离信号线15的一侧弯折时，信号线15将位于基底13的受拉伸面上，从而受到拉伸。在基底13上设置第一保护层14后，将基底13和第一保护层14同时向背离第一保护层14的一侧弯折时(即，弯曲后第一保护层14位于基底13外侧)，信号线15 位于基底13和第一保护层14构成的整体结构的中性层或靠近该中性层，从而防止信号线15受到拉伸而断裂。另外，第一保护层14的设置还可以防止信号线15受到划伤。
其中，第一保护层14可以采用有机聚合物制成，具体地，可以采用聚酯型聚氨酯胶(例如，MCL胶)，以便于进行弯折。
本公开一实施方式中提供的驱动电路板10尤其适用于大尺寸的显示装置中。当显示装置尺寸较大时，引线区的长度较长，相应地，驱动电路板10的长度较长。这种情况下，可以设置多个通孔12。如图2所示，多个通孔12的排列方向与驱动电路板10的弯折方向垂直。其中，所述弯折方向可以按照如下定义：将未弯折的驱动电路板10进行弯折时的初始时刻，在驱动电路板10的远端施加力的方向。具体地，在图2中，驱动电路板10的弯折方向垂直于纸面。在图4中，驱动电路板10的弯折方向如图4中箭头所示(平行于显示基板20的厚度方向)。多个通孔12的排列方向也可以看作：驱动电路板10弯折时内部中性轴的延伸方向。如图4所示，“内部中性轴”是驱动电路板10的内部中性层与平行于显示基板20显示面的平面的交线。
其中，多个通孔12的中心可以位于同一直线上，在进行弯折时，沿多个通孔12的中心连线(图2中的C-C’线)进行弯折。本公开对通孔12的形状不做限定，例如，可以为开口成圆形、椭圆形、矩形或多边形的柱形通孔。
在本公开的一实施方式中，驱动芯片11的数量可以为多个；沿通孔12的排列方向，多个通孔12和多个驱动芯片11交错设置。这便于信号线15将驱动芯片11与显示基板20的引线区的引线电连接。需要说明的是，通孔12与驱动芯片11交错设置并不一定表示通孔12和驱动芯片11位于同一直线上。如图2所示，当驱动电路板10未进行弯折时，多个通孔12排成一行，多个驱动芯片11排成另一行，且多个通孔12朝向驱动芯片11下端的正投影与多个驱动芯片11朝向驱动电路板10下端的正投影交替设置。此外，该交替方式可以为一一交错，也可以为其他交替方式，如，每相邻两个通孔12的正投影之间存在两个驱动芯片11的正投影。
作为本公开的另一方面，提供一种显示装置。如图3和图5所示，所述显示装置包括显示基板和上述驱动电路板10。此外，所述显示基板可以包括显示区(AA区)和位于所述显示区周围的引线区，驱动电路板10的一端与所述引线区相接合以与所述引线区的引线电连接，以及，驱动电路板10的另一端与显示基板20的背离出光方向的一侧相接合。其中，驱动电路板10为弯折结构。
在所述显示装置中，如上所述，驱动电路板10整体可以分为三部分：第一板部10a、第二板部10b和作为可弯折部的弧形连接部10c。通孔12位于弧形连接部上。其中，通孔12的数量可以为多个，每个通孔12位于弧形连接部10c的沿显示装置厚度方向的中部。
显示基板20可以包括衬底21，所述引线区的引线设置在衬底21上，衬底21上还可以设置有薄膜晶体管等用于显示的显示元件。本实施方式的显示基板尤其适用于有机电致发光显示(OLED)装置，相应地，衬底21上还可以设置有发光单元和封装层。
本公开对驱动电路板10与显示基板20的引线区的接合方式不作具体限定，例如，可以将驱动电路板10设置有信号线15的表面与引线区相对，并将信号线15与引线区的引线进行绑定(bonding)，之后，将驱动电路板10进行弯折。
为了简化显示装置的整体结构，本公开的实施方式中的衬底21与基底13可以形成为一体结构，如图3和图4所示。这种情况下，信号线15与其所连接的引线也可以形成为一体结构；当驱动电路板10弯折后，信号线15位于基底13的外侧(即，背离衬底21的一侧)。
由于基底13的厚度较薄，即，衬底21的厚度较薄，因此，为了防止衬底21以及衬底21上的引线、显示元件受到损伤，如图4所示，显示基板20还包括设置在衬底21一侧的第二保护层22，第二保护层22的大小与衬底21的大小相同。所述引线区的引线25设置在衬底21的背离所述第二保护层22的一侧。
在本公开的一实施方式中，如图4所示，显示基板20还可以包括缓冲层23。缓冲层23位于第二保护层22背离衬底21的一侧。缓冲层22将衬底21与驱动电路板10的第二板部10b间隔开。其中， 缓冲层23可以与驱动电路板10的第二板部10b的大小相近，从而在显示装置的搬移过程中，对驱动电路板10起到支撑作用，防止驱动电路板10受到外力时被折断。当然，缓冲层23的大小也可用于衬底21相同，从而不仅防止驱动电路板10折断，还可以减缓外界对整个显示基板20的冲击，减少显示基板20受到的损伤。其中，缓冲层23可以采用泡棉制成。
在本公开的一实施方式中，显示基板20还可以包括第三保护层24，第三保护层24设置在缓冲层23背离衬底21的一侧。第三保护层24的大小可以与驱动电路板10的第二板部10b的大小相近。如图4所示，驱动电路板10的第二板部10b朝向衬底21的投影被第三保护层24朝向衬底21的投影覆盖。
在本公开的一实施方式中，驱动电路板10的数量为多个，所述多个驱动电路板10位于显示基板20的不同边缘。如图3和图5所示，衬底21的沿其长度方向的一侧和沿其宽度方向的一侧各设置有一个驱动电路板10，两个驱动电路板10分别为显示基板20提供栅极驱动信号和源极驱动信号。
以上为对本公开提供的驱动电路板和显示装置的描述，可以看出，驱动电路板的弯折处设置有通孔，因此可以减小弯折处的横截面积，从而减小驱动电路板弯折处的抗弯折能力，使得驱动电路板更容易弯折，进而使得驱动电路板弯折时的弯曲曲率增大，弯折半径相应减小。当弯折半径减小时，可以减小驱动电路板在显示装置中占用的边框宽度，从而使得采用该驱动电路板的显示装置的边框宽度减小。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (12)

  1. 一种驱动电路板，其用于显示装置中，所述驱动电路板能够弯折；其中，
    所述驱动电路板上设置有贯穿所述驱动电路板的通孔，所述通孔位于所述驱动电路板的可弯折部。
  2. 根据权利要求1所述的驱动电路板，其中，所述显示装置包括显示基板，所述显示基板包括显示区和位于所述显示区周围的引线区，所述引线区设置有从所述显示区延伸出的引线；所述驱动电路板的一端用于与所述引线区相接合以与所述引线区的引线电连接，以及，所述驱动电路板的另一端用于与所述显示基板背离出光方向的一侧相接合。
  3. 根据权利要求2所述的驱动电路板，其中，所述驱动电路板包括基底、设置在基底上的信号线和驱动芯片，所述信号线用于连接所述驱动芯片与所述引线区的引线，所述信号线位于所述驱动电路板的未设置所述通孔的区域。
  4. 根据权利要求3所述的驱动电路板，其中，所述驱动电路板还包括设置在所述基底上的第一保护层，所述第一保护层至少覆盖所述信号线的位于所述可弯折部的部分。
  5. 根据权利要求1-4任意一项所述的驱动电路板，其中，所述通孔的数量为多个，多个所述通孔的排列方向与所述驱动电路板弯折方向垂直。
  6. 根据权利要求5所述的驱动电路板，其中，所述驱动芯片的数量为多个；沿所述通孔的排列方向，多个所述通孔和多个所述驱动芯片交错设置。
  7. 根据权利要求3所述的驱动电路板，其中，所述基底的厚度在20μm～50μm之间。
  8. 一种显示装置，其中，包括显示基板和权利要求1至7中任意一项所述的驱动电路板。
  9. 根据权利要求8所述的显示装置，其中，所述显示基板包括显示区和位于所述显示区周围的引线区，所述引线区设置有从所述显示区延伸出的引线；所述驱动电路板的一端与所述引线区相接合以与所述引线区的引线电连接，以及，所述驱动电路板的另一端与所述显示基板背离出光方向的一侧相接合。
  10. 根据权利要求9所述的显示装置，其中，所述驱动电路板包括基底、设置在基底上的信号线和驱动芯片，
    所述显示基板包括衬底和设置在所述衬底一侧的第二保护层，所述引线区的引线设置在所述衬底的背离所述第二保护层的一侧，所述衬底与所述基底为一体结构。
  11. 根据权利要求10所述的显示装置，其中，所述显示基板还包括缓冲层，所述缓冲层位于所述第二保护层背离所述衬底的一侧。
  12. 根据权利要求9所述的显示装置，其中，所述驱动电路板的数量为多个，所述多个驱动电路电路板位于所述显示基板的不同边缘。
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