WO2019078290A1

WO2019078290A1 - Single-layer film and heat-resistant adhesive tape using same

Info

Publication number: WO2019078290A1
Application number: PCT/JP2018/038802
Authority: WO
Inventors: 純平藤原; 貴之岩崎
Original assignee: デンカ株式会社
Priority date: 2017-10-19
Filing date: 2018-10-18
Publication date: 2019-04-25
Also published as: JP7204658B2; JPWO2019078290A1; TW201922869A

Abstract

Provided is a single-layer film that exhibits superior heat resistance and UV permeability, and has a low thermogravimetric loss rate even in a high-temperature atmosphere. Also provided is a heat-resistant adhesive tape that uses said film. The single-layer film is formed by using a thermoplastic resin having a glass transition temperature of 210°C or higher. The arithmetic mean surface roughness Ra of at least one surface of the single-layer film is greater than 0.10μm and less than 10μm. The heat-resistant adhesive tape is obtained by laminating an acrylic-based or silicone-based adhesive layer onto at least one surface of the single-layer film.

Description

Single layer film and heat resistant adhesive tape using the same

The present invention relates to a monolayer film and a heat-resistant adhesive tape using the same.

In recent years, due to the tendency to reduce the size and weight of electronic members, plastic is often used. In particular, plastic films are often used for portions requiring flexibility. Along with this, compounding techniques such as a technique of laminating a plastic film and a metal foil, a technique of depositing a film on a plastic film, and a technique of sputtering have been actively performed. Also, solder may be used to fix electronic components on a plastic film substrate.

High heat is generally applied to the plastic film during compounding or during the solder reflow process. With the recent demand for higher performance, the heat resistance required for plastic films is becoming increasingly severe. The specific heat resistance required for the plastic film is that the plastic film does not easily change in size due to heat, for example, in the case of laminating metal foils, when the heat causes dimensional change in the plastic film, the lamination is performed. Since the body is warped, a film having a small heat shrinkage rate is required.

A polyimide resin is often used as a plastic film satisfying the heat resistance described above (for example, Patent Document 1). However, the polyimide resin is not thermoplastic, and the film is obtained by a solvent casting method, so that the molding process is difficult, the product cost is high, and the solvent remaining in the polyimide film is exposed to a high temperature environment. It could be generated as outgassing and contaminate electronic parts. Therefore, a thermoplastic plastic film that is less expensive, less outgassing, and heat resistant than a polyimide film has been required. In addition, such plastic films are increasingly important because they are useful, for example, as films for heat-resistant adhesive tapes, films for electronic components, films for household electric appliance parts, or parts for automobile parts described below. It was getting high.

Hereinafter, the base for heat-resistant adhesive tape which laminated | stacked the adhesive is demonstrated. Paper, fabric, non-woven fabric, plastic film, etc. are widely used as substrates for adhesive tapes, but heat-resistant adhesive tapes used for fixing masking tapes and other electronic parts especially when producing printed circuit boards are 200 ° C. It is required to have a heat-resistant adhesive performance that does not peel off in a solder bath or firing process at a temperature higher than that. As a substrate for such a heat-resistant adhesive tape, single-layer films made of melt-extrudable thermoplastics such as polyethylene naphthalate film, polyphenylene sulfide film, polyether ether ketone film and the like have been proposed (for example, Patent Documents 2 and 3) ). However, in recent electronic component manufacturing processes, particularly in vacuum deposition processes and vacuum sputtering processes, it is not uncommon to be exposed to high temperatures with adhesive tapes attached, and the above-mentioned films have large heat shrinkage and insufficient heat resistance. There was also a case.

Although the heat resistant film using a polyether sulfone is proposed with respect to these subjects, it had the subject in film formability. Patent Document 4 proposes a polyether sulfone sheet having a maximum value (Rmax) of surface roughness of 0.1 μm or less. However, for example, when the thickness of the sheet is small, if the surface roughness is small, the coefficient of friction of the surface becomes too large, and wrinkles may easily occur when the sheet is wound, and a desired sheet may not be obtained. .

In addition, addition of a plate-like filler to polyether sulfone resin has been reported. (For example, Patent Documents 5 and 6) However, the addition of the plate-like filler not only causes the transparency to be significantly reduced, but also the flowability is deteriorated, which may make melt extrusion molding difficult.

JP, 2013-193413, A JP 01-266177 A Unexamined-Japanese-Patent No. 2003-249617 JP 2000-233436 A JP 2004-168962 JP 2005-103951 A

It is an object of the present invention to provide a single layer film which is excellent in moldability, heat resistance and UV permeability, has a small heat shrinkage ratio under a high temperature atmosphere, and a small heating weight reduction ratio, and a heat resistant adhesive tape using the same. Do. Another object of the present invention is to provide a film for electronic members, a film for household electric appliance members, or a film for automobile parts.

That is, the present invention comprises the following.
(1) A single layer film formed using a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, and having an arithmetic average surface roughness Ra of at least one surface of more than 0.10 μm and less than 10 μm. Layer film.
(2) The monolayer according to (1), wherein the thermoplastic resin comprises one or more selected from the group consisting of polyetherimide, polyethersulfone, polyphenylsulfone, thermoplastic polyimide, and heat resistant polyarylate. the film.
(3) The monolayer film as described in (1) or (2) in which the said thermoplastic resin contains 15 mass% or more of thermoplastic resins whose glass transition temperature is 245 degreeC or more.
(4) (1) to (3), wherein the thermoplastic resin contains one or more additives selected from the group consisting of a heat stabilizer, an ultraviolet light absorber, an antistatic agent, a lubricant, a dye, a pigment, and an inorganic filler. The single layer film as described in any one of the).
(5) The monolayer film according to any one of (1) to (4), which has a thermal shrinkage of 15% or less after exposure to an environment at 250 ° C. for 1 hour.
(6) The monolayer film according to (3) or (4), which has a thermal shrinkage of 5% or less after exposure to an environment at 250 ° C. for 1 hour.
(7) The monolayer film according to any one of (1) to (6), wherein the heating weight reduction rate after exposure to an environment at 250 ° C. for 1 hour is 5% or less.
(8) The monolayer film according to any one of (1) to (7), which has a UV transmittance of 80% or more.
(9) For film capacitors, for speaker diaphragms, for circuit boards, for heater insulation, for glass protection, for protective films for vacuum pressure forming, for protective films for insert molding, for protective films for in-mold molding, household appliances The single-layer film according to any one of (1) to (8), which is a film for a member or an automobile part member.
(10) A heat-resistant adhesive tape having an acrylic or silicone adhesive layer laminated on at least one surface of the single-layer film according to any one of (1) to (9).
(11) The heat-resistant adhesive tape according to (10), wherein the thickness of the single layer film constituting the heat-resistant adhesive tape is 5 μm or more and 100 μm or less, and the adhesive layer thickness is 5 μm or more and 70 μm or less.
(12) The adhesive layer is laminated on one surface of a single layer film, and the arithmetic average surface roughness Ra of the surface of the single layer film opposite to the surface on which the adhesive layer is laminated is larger than 0.10 μm The heat-resistant adhesive tape as described in (10) or (11) which is less than 10 micrometers.
(13) The heat-resistant adhesive tape according to any one of (10) to (12), which is for masking tape.
(14) The heat-resistant adhesive tape according to (13), which is a tape for a vacuum deposition process or a vacuum sputtering process.
(15) A monolayer film comprising a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, and an adhesive layer formed on one surface of the monolayer film, wherein the adhesive layer of the monolayer film is formed The heat-resistant adhesive tape which has an uneven structure in the surface on the opposite side of the made surface.
(16) The heat-resistant adhesive tape according to (12) or (15) attached to an adherend via an adhesive layer.
(17) The method for producing a single-layer film according to any one of (1) to (9), wherein a thermoplastic resin having a glass transition temperature of 210 ° C. or more is extruded from a T die into a temperature of 300 ° C. to 400 ° C. C. Melting extrusion is carried out at a temperature of not higher than .degree. C., and a molding method is characterized in that molding is carried out by sandwiching between a concavo-convex roll having a surface temperature of 110.degree. C. or more and 230.degree.

According to the present invention, it is possible to provide a single layer film which is excellent in moldability, heat resistance and UV transmittance, and which has a small heating weight reduction rate even in a high temperature atmosphere, and a heat resistant adhesive tape using the same. In addition, a film for an electronic member, a film for a home appliance member, or a film for an automobile part member can be provided.

It is sectional drawing which shows an example of the laminated constitution of the heat-resistant adhesive tape which concerns on one Embodiment.

The invention is illustrated in more detail by the following examples. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications as long as the effects of the present invention are not impaired. The first aspect of the present invention is a single-layer heat-resistant film which is excellent in moldability and UV transmittance, and which has a small heating weight reduction rate even in a high temperature atmosphere. A second aspect of the present invention is a heat-resistant adhesive tape, wherein the single-layer film is laminated with one or two adhesive layers, and at least one surface of the single-layer film is an adhesive layer. is there. 1 and 2 show an example of the heat-resistant adhesive tape of the present invention. In the case of FIG. 1, the heat-resistant adhesive tape is obtained by laminating an adhesive layer on one side of a single layer film. In the case of FIG. 2, it is a heat-resistant adhesive tape in which an adhesive layer is laminated on both sides of a single layer film. A third of the present invention is a heat-resistant adhesive tape, comprising: a single layer film made of a thermoplastic resin having a glass transition temperature of 210 ° C. or higher; and an adhesive layer formed on one surface of the single layer film, The surface (surface side of the single-layer film) opposite to the surface on which the layer is formed (the surface to which the adherend is attached when the adherend is attached to the single-layer film (adherend pressure-sensitive adhesive surface)) A heat-resistant adhesive tape having a concavo-convex structure).

<Single-layer film>
The single layer film is a film formed using a thermoplastic resin having a glass transition temperature of 210 ° C. or higher. The thermoplastic resin in the present specification may be a single resin or a composition containing a plurality of resins. Furthermore, the thermoplastic resin can contain other additives as required. When the glass transition temperature of the thermoplastic resin is less than 210 ° C., the heat shrinkage may be increased. Preferably, the single layer film contains a thermoplastic resin having a glass transition temperature of 210 ° C. or more, and contains at least 15% by mass or more of a thermoplastic resin having a glass transition temperature of 245 ° C. or more in the resin component. Most preferably, the monolayer film mainly comprises a thermoplastic resin having a glass transition temperature of 245 ° C. or higher. In the present specification, “mainly contained” means that the resin component contains 50% by mass or more, 70% by mass or more, 90% by mass or more, or 100% by mass.

Specific examples of main constituent resins of thermoplastic resin include polyphenylsulfone (PPSU, glass transition temperature 220 ° C.), polyether sulfone (PES, glass transition temperature 225 ° C.), polyetherimide (PEI, glass transition) Temperature of 217 ° C.), thermoplastic polyimide (TPI, glass transition temperature of 260 ° C.), heat resistant polyarylate (PAR, glass transition temperature of 263 ° C.) and the like can be mentioned.

In view of heat resistance, at least 15% by mass or more of resin components selected from thermoplastic polyimide (TPI) or heat-resistant polyarylate (PAR) as a thermoplastic resin having a glass transition temperature of 245 ° C. or higher It is more preferable to contain, and it is especially preferable to contain 25 mass% or more and 95 mass% or less. Most preferably, the single layer film is a single layer film mainly comprising at least one resin selected from thermoplastic polyimide (TPI) or heat resistant polyarylate (PAR) as a thermoplastic resin having a glass transition temperature of 245 ° C. or higher It is.

The glass transition temperature refers to the midpoint glass transition temperature described in JIS K 7121. In the DSC curve obtained from DSC measurement, a straight line equidistant from the extended straight line of each baseline in the vertical axis direction, and glass Let it be the temperature of the point where the curve of the step change part of the transition intersects. Measurement conditions are a nitrogen atmosphere, a temperature rising rate of 10 ° C./min, and a measurement temperature range is from room temperature to 390 ° C.

The polysulfone-based resin that can be used as a thermoplastic resin is not particularly limited, but polyphenylsulfone having a repeating unit represented by Formula (1) is preferable, and represented by Formula (2) Even more preferred are polyether sulfones having repeating units. One or more types of polyphenyl sulfone and / or polyether sulfone can be selected and used.

The polyphenyl sulfone (PPSU) may be a homopolymer consisting only of the chemical structure of the formula (1) or may contain one or more chemical structures selected from the formulas (2) to (10) It is also good. However, since the higher the ratio of the chemical structure of the formula (1) in the polyphenyl sulfone, the better the film strength, the heat resistance and the molding processability, the total of 100 mol% of the polysulfone units of the formulas (1) to (10) On the other hand, the unit of the formula (1) is preferably 50 mol% or more, more preferably 80% mol% or more.

When the polyphenyl sulfone is a copolymer having a chemical structure of formulas (2) to (10), the copolymerization form may be any of a block copolymer, a random copolymer and an alternating copolymer . Moreover, the terminal modified body which has another chemical structure only in the polymer terminal may be sufficient. As a specific example of polyphenyl sulfone, brand name made from Solvay Specialty Polymers: Radel R series, brand name made by BASF: Ultra Zone P series can be mentioned.

The polyether sulfone (PES) may be a homopolymer consisting only of the chemical structure of the formula (2), or one or more chemical structures selected from (1) and (3) to (10) You may have. However, since the ratio of the chemical structure of the formula (2) in the polyether sulfone is excellent in film strength, heat resistance and molding processability, 100 mol% in total of the polysulfone unit of the formulas (1) to (10) The unit of the formula (2) is preferably 50 mol% or more, and more preferably 80% mol% or more. When the polyether sulfone is a copolymer having one or more chemical structures selected from (1) and (3) to (10), the copolymer form is a block copolymer, It may be either a random copolymer or an alternating copolymer. Moreover, the terminal modified body which has another chemical structure only in the polymer terminal may be sufficient. Specific examples of polyether sulfone include Sumitomo Chemical's trade name: Sumika Excel PES series, BASF trade name: Ultrazone E series, Solvay Specialty Polymers trade name: Belladel series, etc. Be

As thermoplastic polyimide (TPI) resin, thermoplastic polyimide, polyether imide, etc. can be considered. In addition, thermoplastic polyimides include crystallinity and non-crystallinity. For example, as a thermoplastic polyimide, the thermoplastic polyimide which has a repeating unit represented by following formula (11) is mentioned. As a commercial item, it can be purchased, and specifically, trade name: Aurum manufactured by Mitsui Chemicals, Inc. can be mentioned.

Specific examples of polyetherimide (PEI) include Ultem manufactured by Subic.

In the embodiment, the heat-resistant polyarylate (PAR) is a polycondensate of a dihydric phenol component and an aromatic dicarboxylic acid or an aromatic dicarboxylic acid dihalide, and is a repeating unit represented by the general formula (12). And the Tg (glass transition temperature) thereof is 245 ° C. or more, preferably 255 ° C. or more. Typical heat-resistant polyarylates which are commercially available include those composed of bisphenol A as dihydric phenol and a mixed phthalic acid of terephthalic acid and isophthalic acid as aromatic dicarboxylic acid, and changing their monomer composition ratio Thus, the heat resistance can be improved (Tg can be increased). As a specific example, for example, among the trade names of Unitika Co., Ltd .: U polymer and UNIFINER (Unifiner), a resin having a Tg of 245 ° C. or higher, preferably 255 ° C. or higher.

The monolayer film of the present embodiment preferably contains a thermoplastic resin containing one or more selected from polyetherimide, polyethersulfone, polyphenylsulfone, thermoplastic polyimide, and heat resistant polyarylate. . It may be a resin composition containing each of the above-described thermoplastic resins in an arbitrary ratio, as long as the effects of the present invention are not impaired. For example, the heat shrinkage can be reduced by alloying two or more resins having a high glass transition temperature. The single-layer film contains a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, preferably a thermoplastic resin having a glass transition temperature of 245 ° C. or higher in the resin component, at least 15% by mass or more, more preferably 25% by mass It contains a thermoplastic resin containing 95% by mass or less. This makes it possible to exhibit more preferable high heat resistance and low heat shrinkage. Specifically, it is a single layer film containing a thermoplastic resin containing at least 15% by mass or more, more preferably 25% by mass or more and 95% by mass or less of thermoplastic polyimide (TPI) and / or heat resistant polyarylate (PAR) . In consideration of the cost of the resin, the thermoplastic resin containing at least 15% by mass, more preferably 25% by mass to 95% by mass, of the heat resistant polyarylate (PAR) is most preferable as the single layer film of the present invention. It is a single layer film containing. It is surprising that the resin component of the thermoplastic resin having a glass transition temperature of 210 ° C. or more contains at least 15% by mass or more of a thermoplastic resin having a glass transition temperature of 245 ° C. or more, more preferably 25% by mass or more By containing 95 mass% or less, it is possible to make heat contraction rate in 250 degreeC and 60 minutes small remarkably compared with the case of less than these.

The thermoplastic resin constituting the single layer film may, if necessary, be a heat stabilizer, an ultraviolet absorber, an antistatic agent, a lubricant, a dye, a pigment, a glass fiber, a carbon fiber, etc. within the range not inhibiting the effects of the present invention. Fibrous fillers, inorganic fillers such as particulate fillers such as talc, clay and silica, flaky fillers such as mica, and one or more of known additives generally added to films. In addition, scrap resins generated in the film manufacturing process can be mixed and used.

The total amount of additives is preferably 25 parts by mass or less, more preferably 10 parts by mass or less, and still more preferably 5 parts by mass or less, with respect to 100 parts by mass of the thermoplastic resin constituting the single layer film. If the compounding quantity of an additive is in the said range, it can be used, without the handling property as a tape falling.

Arithmetic mean surface roughness Ra of at least one surface of the single layer film of the present embodiment is more than 0.10 μm and less than 10 μm, more preferably more than 0.30 μm and less than 8.0 μm, further preferably Is greater than 0.30 μm and less than 5.0 μm. When the arithmetic average surface roughness Ra is 0.10 μm or less, wrinkles easily occur when winding the film, and it is difficult to obtain a good film roll, and in some cases, the winding itself becomes difficult. . When the arithmetic average surface roughness Ra is larger than 0.10 μm, preferably larger than 0.30 μm, a single layer film or a heat-resistant adhesive tape using the same is used in the vacuum evaporation process and particularly severe vacuum sputtering process And deformation of the film or the tape or floating can be suppressed, and the effect of suppressing peeling at the attachment portion of the heat-resistant adhesive tape peeling is easily improved. When the pressure-sensitive adhesive is laminated on a surface having an arithmetic average surface roughness Ra of 10 μm or more, air bubbles are mixed and the appearance is likely to be deteriorated. In the present invention, the arithmetic mean surface roughness Ra can be calculated according to JIS B0601: 2001.
The other surface of the single layer film may or may not have a concavo-convex structure. Specifically, the arithmetic average roughness Ra may be less than 0.10 μm, may be more than 0.10 μm and less than 10 μm, or may be 10 μm or more.

In order to make the arithmetic average surface roughness Ra of at least one surface of the single layer film larger than 0.10 μm and less than 10 μm, the method of forming fine irregularities on the surface of the single layer film is (a) Melt-kneaded resin Is extruded from a T-die, and the extruded resin is sandwiched between an uneven roll and another pressure-bonding roll, for example, a mirror-shaped pressure-bonded roll to form a film, wherein the film is formed using an uneven roll having fine unevenness. The method of performing simultaneously cooling of formation of an unevenness | corrugation, and the method of making it contact | adhere to the unevenness | corrugation roll which has fine unevenness | corrugation after producing (ii) single layer film, and forming an unevenness | corrugation. Among these, from the viewpoint of simplification of the apparatus, the method (A) is preferable. In addition, when it is desired to impart surface roughness to both surfaces of a single layer film, it is possible to use a pressure bonding roll which is processed to be uneven by blasting, for example, on the pressure bonding roll surface.

The method of mixing and kneading the thermoplastic resin and the additive constituting the single layer film is not particularly limited, and various mixing and kneading means may be used. For example, they may be separately fed to the extruder and mixed. The resin and additives constituting the single layer film can be preliminarily dry-kneaded using a mixer such as a Henschel mixer, a ball mixer, a blender, a tumbler, etc., and can be melt-kneaded using a melt kneader.

As a melt-kneader, a mixing roll, a pressure kneader, a single-screw extruder, and a multi-screw extruder can be used. When a single-screw extruder or a multi-screw extruder is used, since it is in the form of a strand, a sheet or a rod, it is preferable to process it into powder, granules or pellets with a grinder or a cutter.

The thickness of the single layer film is preferably 5 μm to 100 μm, more preferably 20 μm to 70 μm, and still more preferably 20 μm to 40 μm. When the thickness is increased, the handling property as the tape is improved, but when it exceeds 100 μm, the adhesive residue at the affixing portion tends to be generated when the tape is peeled off. By making the total thickness 5 μm or more, it is possible to prevent the heat shrinkage rate from increasing, and to prevent the wrinkles from being easily formed when winding the film. When the glass transition point of the thermoplastic resin is 210 ° C. or more and less than 245 ° C., the thickness of the single layer film is preferably more than 30 μm, and when the glass transition point is 245 ° C. or more, the thickness is more than 20 μm Is preferred.

The preferable heat contraction rate of the single layer film is as follows. The absolute value of the thermal contraction rate after exposure for 60 minutes in a 250 ° C. environment is 15% or less, more preferably 10% or less, and still more preferably 5% or less. If the thermal contraction rate is in the above-mentioned range, the heat resistant dimensional stability is practically sufficient. In addition, even when the heat-resistant adhesive tape using this single-layer film is exposed to a high temperature of 200 ° C. or more, the tape peels off or is anchored (the phenomenon that the adhesive layer separates from the base layer and migrates to the adherend side Can be used without causing any adhesive residue on the adherend after peeling off the tape.

In the present specification, the thermal shrinkage was measured in accordance with JIS C2151. Specifically, a test piece (long axis 150 mm × short axis 20 mm) was cut out in each of the MD direction and the TD direction, and marked lines with a distance of 100 mm were attached centering on the central part in the long axis direction of the test piece. The test piece was exposed to no load for 60 minutes in an environment at an ambient temperature of 200 ° C. and 250 ° C., cooled to room temperature, and then the length between the marked lines was measured, and it was calculated from the following formula. . As for the value of thermal contraction rate, a positive value means contraction, and a negative value means expansion. MD indicates the length (extrusion) direction of the film, and TD indicates the width direction of the film.
Thermal shrinkage (%) = (length before test-length after test) / (length before test) x 100
The preferable single layer film of this embodiment can satisfy the above-mentioned heat shrinkage ratio condition in both MD and TD directions.

The thermal weight loss rate of the single layer film when exposed to an environment of 250 ° C. for 1 hour is 5.0% or less, more preferably 3.0% or less, still more preferably 1.5% or less is there. The heating weight reduction rate is a temperature reduction rate from the TG curve obtained when the temperature is raised to 250 ° C at a heating rate of 10 ° C / min according to JIS K7102 and the temperature is further maintained at 250 ° C for 30 minutes. You can ask for If the heating weight reduction rate exceeds 5%, outgassing may occur in the high temperature process during the manufacture of electronic components, which may contaminate the electronic components and surrounding equipment. Also, the vacuum process takes time to reach a predetermined degree of vacuum, which is not economical.

The UV transmittance of the single layer film is 80% or more, and most preferably 85% or more. If it is in the said range, after laminating | stacking an adhesive layer on a single layer film, it can be used suitably in the process of irradiating an ultraviolet-ray from the single layer film surface side, and hardening an adhesive. In the present specification, UV transmittance can be measured in accordance with JIS K0115.

As a method of molding a monolayer film, an extrusion molding method using a T-die is preferable. The temperature of the resin extruded from the tip of the T die slip is preferably 300 ° C. or more and 400 ° C. or less, more preferably 310 ° C. or more and 390 ° C. or less. If it is said range, the film excellent in the uniformity of thickness will be easy to be obtained. On the other hand, if the temperature is less than 300 ° C., it becomes difficult to obtain a film of uniform thickness. Moreover, if it is 300 degreeC or more, it can prevent that a thermal contraction rate becomes large. When the temperature exceeds 400 ° C., the resin is apt to be thermally deteriorated and the appearance of the film is apt to be deteriorated.

The surface temperature of the uneven roll is preferably 110 ° C. or more and 230 ° C. or less, more preferably 130 ° C. or more and 200 ° C. or less, and still more preferably 140 ° C. or more and 190 ° C. or less. If it is in the above-mentioned range, a film with a small heat contraction rate and a film surface with a good appearance can be obtained. Moreover, although the manufacturing method and processing method of the concavo-convex roll are arbitrary, the surface is matted (blast processing etc.) and concavo-convex processing (laser engraving method, mill engraving method, diamond bite processing method, electroforming method, etc.) It is also possible to obtain a film surface having a predetermined surface roughness. Surfaces to be subjected to matting and concavo-convex processing can be made of metal, ceramic, and rubber materials. When the uneven roll temperature is 230 ° C. or more, the film and the uneven roll adhere to each other, it becomes difficult to peel the film smoothly from the uneven roll, and the appearance of the film is likely to be deteriorated.

In order to improve the wettability of the single layer film surface, the single layer film may be subjected to corona treatment, plasma treatment, ozone treatment, flame treatment, alkali treatment, vapor deposition treatment, primer treatment, etc. The well-known easy adhesion process can be applied. By these treatments, adhesion to a single layer film can be improved in lamination with a metal foil or lamination of an adhesive layer described later.

A single-layer film is excellent in heat resistance and UV transmittance, and has a small heat shrinkage and a decrease in heating weight reduction rate under a high temperature atmosphere. Therefore, a flexible printed circuit (FPC) as a substitute for a polyimide film, a film-like substrate for semiconductor mounting Substrate film used for laminates such as (TAB and COF) and heat-resistant adhesive tape, substrate film used for laminates of flexible solar cells and touch panels, or conductor circuit protection for protecting the surface of a substrate It can be suitably used as a coverlay film of the above, a film for a film capacitor, and the like.

Further, since they are excellent in heat resistance and molding processability, they can be suitably used as a film for a speaker diaphragm, a protective film for vacuum pressure forming, a protective film for insert molding, a protective film for in-mold molding, and the like. As a film in the case of this application, a sulfone type film is preferable. Moreover, it can be suitably used also as a film for circuit boards, a film for heater insulating material, a film for glass protection, a film for household appliance parts, or a film for automobile parts.

(Heat resistant adhesive tape)
The following is a description of the heat-resistant pressure-sensitive adhesive tape using a single-layer film, which is the second aspect of the present invention. The heat-resistant adhesive tape of the present embodiment has the above-described single-layer film and an adhesive layer formed on at least one surface of the single-layer film. The pressure-sensitive adhesive layer is a single-layer film having only a concavo-convex roll surface (a surface formed on the concavo-convex roll side and being a concavo-convex processed surface) or a pressure-bonding roll surface (a surface formed on the crimp roll) It is an uneven | corrugated unmachined surface.) It may be formed only on both surfaces. Preferably, the adhesive layer is formed only on the pressure roll surface (uneven surface).

The thickness of the single layer film of the heat-resistant adhesive tape is preferably 5 μm or more and 100 μm or less, more preferably 20 μm or more and 70 μm or less. The thickness of the adhesive layer is preferably 5 to 70 μm, and more preferably 15 to 50 μm.

In the heat-resistant adhesive tape using a single layer film, the most preferable form is the surface opposite to the adherend pressure-sensitive adhesive surface to which the adherend is adhered when the heat-resistant adhesive tape is adhered to the adherend etc. When it adheres to an adherend etc., it has an uneven | corrugated structure in the surface used as the surface of a single layer film. In other words, the heat-resistant adhesive tape has a single-layer film and an adhesive layer formed on one surface of the single-layer film, and has an uneven structure on the surface opposite to the surface on which the adhesive layer is formed. Have. Specifically, the concavo-convex structure has an arithmetic average surface roughness Ra of more than 0.10 μm and less than 10 μm, preferably more than 0.30 μm and less than 10 μm. Such a structure is a case where the surface on the opposite side of the adherend adhesive surface of the single-layer film is a concavo-convex roll surface.

In another embodiment, even if the surface on the opposite side of the adherend adhesive surface of the single-layer film is a pressure-bonding roll surface (uneven surface), a known unevenness processing is performed on this surface to make the unevenness It is also possible to form a structure. In the heat-resistant adhesive tape, the uneven surface structure is provided on the surface opposite to the adherend adhesive surface of the single-layer film, so that the tape is prevented from floating even when vacuum sputtering is performed in the temperature range of 200 ° C to 250 ° C. it can. In addition, after the tape is peeled off after vacuum sputtering processing is performed in a temperature range of 200 ° C. to 250 ° C., generation of adhesive residue can be suppressed. This is because even under high temperature and severe conditions such as vacuum sputtering treatment, the uneven surface provided in advance on the surface absorbs the elongation stress and contraction stress generated on the surface due to the severe treatment, so that the tape is deformed. It is considered to be to suppress.

The present invention is the above-mentioned heat-resistant adhesive tape to which an adherend is further attached. That is, in one embodiment, it can be set as the heat-resistant adhesive tape stuck to a to-be-adhered body through the adhesive layer which comprises a base-material adhesive surface. The adherend is preferably a semiconductor component, an electric material component, or an optical component, and the base may be a substrate.
On the other hand, in the heat-resistant pressure-sensitive adhesive tape using the single-layer film of the present embodiment, when the tape is adhered to an adherend or the like, the adherend pressure-sensitive adhesive side of the single-layer film has an uneven structure. You do not have to. That is, in the heat-resistant pressure-sensitive adhesive tape in which the adherend is laminated via the pressure-sensitive adhesive layer, the single-layer film surface at the interface between the pressure-sensitive adhesive layer and the single-layer film has an arithmetic average roughness Ra of less than 0.10 μm, It may be more than 0.10 μm and less than 10 μm, or 10 μm or more.

In the third aspect of the present invention, a single layer film made of a thermoplastic resin having a glass transition temperature of 210 ° C. or higher and an adhesive layer are laminated, and the surface opposite to the adherend adhesive surface of the single layer film ( It is a heat-resistant adhesive tape which has an uneven | corrugated structure in the surface of the surface side of a single layer film. The single-layer film according to the third aspect of the present invention is preferably made of a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, and a thermoplastic resin having a glass transition temperature of 245 ° C. or higher in at least 15% by mass in the resin component. Preferably, 25 mass% or more is included. The monolayer film in the third aspect of the present invention most preferably comprises mainly a thermoplastic resin having a glass transition temperature of 245 ° C. or higher.
The concavo-convex structure preferably has an arithmetic average surface roughness Ra of more than 0.10 μm and less than 10 μm, and more preferably more than 0.30 μm and less than 10 μm. Further, the present invention is the above-mentioned heat-resistant adhesive tape attached to an adherend. That is, in one embodiment, the heat-resistant pressure-sensitive adhesive tape may be attached to one surface of the heat-resistant pressure-sensitive adhesive tape via the pressure-sensitive adhesive layer constituting the adherend pressure-sensitive adhesive surface. The adherend is preferably a semiconductor component, an electrical material part, or an optical component, and the adherend may be a substrate.
On the other hand, in the heat-resistant adhesive tape using the single-layer film of the present invention, when the tape is adhered to an adherend or the like, the adherend pressure-sensitive adhesive side of the single-layer film has an uneven structure. You do not have to. That is, in the heat-resistant pressure-sensitive adhesive tape in which the adherend is laminated via the pressure-sensitive adhesive layer, the single-layer film surface at the interface between the pressure-sensitive adhesive layer and the single-layer film has an arithmetic average roughness Ra of less than 0.10 μm, It may be more than 0.10 μm and less than 10 μm, or 10 μm or more. The thickness of the single-layer film of the heat-resistant pressure-sensitive adhesive tape is preferably 5 μm to 100 μm, and more preferably 20 μm to 70 μm. The thickness of the adhesive layer is preferably 5 μm to 70 μm, and more preferably 10 μm to 50 μm.

In the heat-resistant adhesive tape described above, the adhesive component of the adhesive constituting the adhesive layer is not particularly limited, and a resinous film substrate or casing to which the heat-resistant adhesive tape using the single layer film is attached In consideration of the adhesiveness of the above, it may be appropriately selected from known adhesives. Specifically, for example, (meth) acrylic resins, urethane resins, silicones, synthetic rubbers, natural rubbers, etc. are used. Among them, (Meta) is preferable in that it has good adhesion and excellent heat resistance. ) Acrylic resin type and silicone type are preferable. The thickness of the adhesive layer is preferably as described above, and in particular, 10 to 50 μm is more preferable. When the thickness of the adhesive layer is 10 μm or more, sufficient adhesiveness can be easily ensured, and when the thickness is 50 μm or less, the adhesive layer can be easily formed.

In the heat-resistant adhesive tape of the present embodiment, as described above, a known additive generally added to a film can be added to the thermoplastic resin used for the single layer film. In order to prevent the adhesive force of the adhesive from decreasing due to the effect of the added additive on the adhesive side, etc., the configuration of the (meth) acrylic composition constituting the adhesive may be changed, or the tackifier may be used. It can be further added. Specifically, cohesion of glycidyl methacrylate to an adhesive and / or addition of a terpene phenol resin having a softening point of 70 ° C. or more and 180 ° C. or less as a tackifier, for example, suppresses a decrease in adhesive strength. can do. Here, as the terpene phenol resin having a softening point of 70 ° C. or more and 180 ° C. or less, a terpene phenol resin of “YS polystar” series manufactured by Yashara Chemical Co., Ltd. is preferably mentioned. The content of the tackifier can be 0 parts by mass to 20 parts by mass with respect to 100 parts by mass of the adhesive component (for example, (meth) acrylic acid ester polymer). The pressure-sensitive adhesive composition may contain, for example, various additives such as a softener, an antiaging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer. The content of the other additives is not particularly limited, and can be 0 parts by mass to 20 parts by mass with respect to 100 parts by mass of the adhesive component (for example, (meth) acrylic acid ester polymer).

The heat-resistant adhesive tape was produced, for example, by a method of directly applying an adhesive on the surface of a single layer film (direct coating method), or applying an adhesive on the surface of release paper or release film to form an adhesive layer. Later, a method (transfer method) in which the pressure-sensitive adhesive layer and the single-layer film are laminated may be mentioned. The method for applying the pressure-sensitive adhesive is not particularly limited, and a conventionally known method can be used. The formation method by printing includes, for example, a gravure printing method, a flexographic printing method, an offset printing method, and the like. Examples of the method by coating include roll coating, reverse coating, comma coating, knife coating, die coating, gravure coating and the like. In order to crosslink the adhesive layer by heating after forming the adhesive layer, for example, it is preferable to age at a temperature of 40 to 100 ° C. for several hours to 3 days. The crosslinking reaction can be advanced by aging to ensure sufficient adhesiveness during use and releasability after use.

Since the heat-resistant adhesive tape of this embodiment uses the above-mentioned single-layer film, it is excellent in heat resistance and UV transmittance, and has a small shrinkage even under high temperature atmosphere and a small heating weight reduction ratio. It can be suitably used as a manufacturing tape, a masking tape, a tape for fixing a substrate in a chip size package mounting process, a space tape for a film-like substrate manufacturing process, and the like. In particular, when the heating weight reduction rate is small, when used as various heat-resistant adhesive tapes and films used in vacuum processes, the amount of outgas generation is small, so contamination of process equipment is small, or the time to reach a predetermined degree of vacuum is short. Therefore, it is suitable.
A preferred application is, specifically, a masking heat-resistant adhesive tape used to protect the treated surface in the apparatus when it is used in a vacuum deposition process step or a sputtering process step. When used in this application, heat resistance, low heating weight reduction rate, and low heat shrinkage are required, so the thermoplastic resin of the single layer film is a resin selected from PES resin, thermoplastic polyimide, and heat resistant polyarylate. preferable. When the heat-resistant adhesive tape of the present invention is used, it is possible to suppress the floating of the heat-resistant tape after vacuum sputtering and to suppress the adhesive residue after heat treatment, so it can be suitably used for this application.

Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.
Resins used in the monolayer film in Examples and Comparative Examples are as follows.

Polyether sulfone (PES): SUMIKA EXCEL (trade name), Sumitomo Chemical Co., Ltd., glass transition temperature 225 ° C.
Polyphenyl sulfone (PPSU): Ultrazone (trade name), manufactured by BASF, glass transition temperature 220 ° C.
Polyether imide (PEI): ULTEM (trade name) manufactured by SABIC, glass transition temperature 217 ° C.
Heat resistant polyarylate (PAR): U polymer (trade name), manufactured by Unitika, glass transition temperature 263 ° C.
Thermoplastic polyimide (TPI): Aurum (trade name), Mitsui Chemicals, Inc., glass transition temperature 260 ° C.
Polyether ether ketone (PEEK): VESTAKEEP (trade name), manufactured by Daicel Evonik, glass transition temperature 146 ° C.
Polycarbonate (PC): Panlite (trade name), manufactured by Teijin Limited, glass transition temperature 150 ° C.
Organic pigment Paliotol Yellow K 0961 (trade name), manufactured by BASF

<Measurement of glass transition temperature>
The glass transition temperature of the thermoplastic resin used for the single layer film was measured from room temperature to 380 ° C. at a temperature rising rate of 10 ° C./min under a nitrogen atmosphere using a differential scanning calorimeter “DSC 3100 SA” manufactured by Bruker. Then, in the DSC curve, a straight line equidistant from the extended straight line of each baseline in the vertical axis direction and the curve of the step change portion of the glass transition intersect.

Example 1
<Production of single layer film>
Organic resin: Paliotol Yellow K 0961 (trade name), 1 part by mass made by BASF Corp. is added to 100 parts by mass of polyether sulfone as a resin constituting a single layer film, and it is charged into a container and used with a tumbler. Preblended to give a stirred mixture. The stirred mixture was fed to a twin screw extruder having a diameter of 30 mm, melt-kneaded, and discharged from a die at the tip into a bar shape to form a strand. Melt-kneading conditions were cylinder temperature: 350-370 ° C., adapter temperature: 370 ° C., and die temperature: 370 ° C. Next, the formed strand was water-cooled and then cut by a pelletizer to obtain a molding material of pellet form 2-3 mm in length and 1-2 mm in diameter.
This molding material is extruded from a single screw extruder having a diameter of 40 mm and discharged from a 600 mm wide T die at a resin temperature of 360 ° C., and a silicone rubber pressure roll of a take-off machine and arithmetic mean surface roughness Ra of roll surface The film was sandwiched between a metal concavo-convex roll (surface temperature: 140 ° C.) having a fine concavo-convex shape of 0.7 μm, and was continuously transferred toward the winding machine to obtain a single layer film having a fine concavo-convex shape.

<Production of heat-resistant adhesive tape>
Next, the heat-resistant adhesive tape was produced in the following procedure using the produced single layer film.
A (meth) acrylic acid ester copolymer was synthesized as follows as an acrylic pressure-sensitive adhesive for forming a pressure-sensitive adhesive layer. In a 1-liter separable flask, 200 parts by mass of water containing 0.2% by mass of polyvinyl alcohol, 72 parts by mass of n-butyl acrylate, 20 parts by mass of methyl methacrylate, 3 parts by mass of glycidyl methacrylate, 2 A homogeneous liquid mixture containing 5 parts by mass of hydroxyethyl methacrylate, 0.1 parts by mass of benzoyl peroxide as a polymerization initiator, and a chain transfer agent for molecular weight adjustment was charged. The mixture was heated to 70 ° C. with stirring under a nitrogen atmosphere, and was subjected to suspension polymerization for 4 hours. The suspension was then dewatered by decantation. The solid was washed with water while suction filtering, and after drying at room temperature, vacuum drying was performed at 60 ° C. to obtain a copolymer resin having a water content of 0.5% or less. The obtained (meth) acrylic acid ester copolymer was melted and stirred in toluene. An isocyanate-based curing agent and a tackifier resin (terpene phenol resin: "YS polystar G150" manufactured by Yashara Chemical Co., Ltd., softening temperature: 150 ° C.) were added thereto and stirred and mixed to obtain a pressure-sensitive adhesive composition.
The pressure-sensitive adhesive composition is coated on a single-layer film with a width of 300 mm, a length of 400 mm and a thickness of 50 μm using an applicator such that the thickness after curing is 20 μm, and then 100 ° C. for 2 minutes Heated to conditions and dried. As a protective film, a polyester film having a width of 300 mm, a length of 400 mm, and a release treatment thickness of 38 μm was attached to the adhesive surface to obtain an adhesive tape. The resultant was subjected to aging treatment at 40 ° C. for 3 days in an oven to obtain a crosslinked adhesive layer, to obtain an adhesive tape having a width of 300 mm, a length of 400 mm and a thickness of 0.070 mm. The pressure sensitive adhesive was formed on the uneven roll surface of the single layer film.

(Examples 2 to 17)
Except that the resin used for the single layer film, the thickness, the surface roughness, the coated surface of the pressure-sensitive adhesive, and the thickness are as shown in Table 1 using rolls different in surface roughness of the concavo-convex roll and the pressure bonding roll In the same manner as in Example 1, a single-layer film and a heat-resistant adhesive tape were produced. The pressure-sensitive adhesive was formed on the uneven roll surface of the single layer film, the pressure roll surface, or on both sides thereof. Moreover, in Example 4, 9, 10, 16, 17, the pressure bonding roll which carried out the blast process on the surface was used.

(Comparative Examples 1 to 3)
Except that the resin used for the single layer film, the thickness, the surface roughness, the coated surface of the pressure-sensitive adhesive, and the thickness are as shown in Table 2 using rolls different in surface roughness of the unevenness roll and the pressure bonding roll, Based on Example 1, a monolayer film and a heat-resistant adhesive tape were produced. However, only the comparative example 1 produced the film using the roll of a mirror surface, without using an uneven | corrugated roll.

(Comparative example 4)
A commercially available polyimide film (manufactured by Ube Industries, Upirex 25S, thickness 25 μm) was used. Moreover, the heat-resistant adhesive tape was produced using this film. The adhesive was applied on any one side.

(Comparative example 5)
A commercially available biaxially stretched polyethylene naphthalate film (PEN, manufactured by Teijin Ltd., Theonex Q51, thickness 25 μm) was used. Moreover, the heat-resistant adhesive tape was produced using this film. The adhesive was applied on any one side. The glass transition temperature of the PEN film used was 140 ° C., and the crystalline melting point was 260 ° C.

<Evaluation of single layer film>
The following evaluation was performed about the film produced by each Example and each comparative example. These results are summarized in Table 1 and Table 2 respectively.

(Surface roughness)
Arithmetic mean surface roughness was calculated according to JIS B0601. Specifically, the arithmetic mean surface roughness Ra of each surface of a single layer film made of silicone rubber pressure contact roll or metal uneven roll is measured by using a contact surface roughness tester (Surftest SJ-210 manufactured by Mitutoyo) Using the above, 5 points in the width direction of the single layer film were measured with a scan width of 2 mm, and the average value was calculated.

(Thickness)
The thickness was measured using a commercially available Mitutoyo standard dial gauge (type 547-401). Specifically, 300 mm was measured at intervals of 100 mm in the film longitudinal direction, measured at intervals of 10 mm in the film width direction, their average value was determined, and the average value was taken as the thickness of the film.

(Thermal shrinkage rate)
The thermal contraction rate was measured in accordance with JIS C2151. Specifically, a test piece (long axis 150 mm × short axis 20 mm) was cut out in each of the MD direction and the TD direction, and marked lines with a distance of 100 mm were attached centering on the central part in the long axis direction of the test piece. The test piece was exposed to no load in an atmosphere temperature of 200 ° C. or 250 ° C. for 60 minutes, cooled to room temperature, and then the length between the marked lines was measured and calculated from the following formula. As for the value of thermal contraction rate, a positive value means contraction, and a negative value means expansion. MD indicates the length (extrusion) direction of the film, and TD indicates the width direction of the film.
Thermal shrinkage (%) = (length before test-length after test) / (length before test) x 100

(UV transmittance)
The UV transmittance was measured in accordance with JIS K0115. Specifically, the UV transmittance at a wavelength of 400 nm was measured using a commercially available spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). If the UV transmittance is 80% or more, for example, after laminating the adhesive layer on the single layer film, it is suitable in the process of irradiating the ultraviolet ray from the single layer film side to cure the adhesive.

(Winding wrinkles)
After the films of Examples 1 to 17 and Comparative Examples 1 to 3 are wound by 100 m with a winder, the full width is confirmed, and those with appearance wrinkles confirmed as "OK", those not confirmed are "None"".

(Heating weight reduction rate)
The heating weight reduction rate is raised to 250 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere by thermogravimetric measurement using (BRUKER TG-DTA 2000SA) according to JIS K7102. Furthermore, the weight loss rate was determined from the TG curve obtained when maintaining the environment at 250 ° C. for 30 minutes.

<Evaluation of heat-resistant adhesive tape>
The following evaluation was performed about the heat-resistant adhesive tape produced by each Example and each comparative example. These results are summarized in Table 1 and Table 2 respectively.

(Initial adhesion)
The heat-resistant adhesive tape obtained above is slit to a width of 10 mm, and then the protective film, the polyester film, is peeled off, and the exposed surface of the adhesive layer is an adherend aluminum plate (100 mm square, 0.5 mm thick, arithmetic) The roller was crimped once with a 2 kg roller to an average surface roughness Ra = 1.0 μm). The pressure-bonded sample was left at 23 ° C. for 30 minutes, and then the initial tack was measured under the conditions of peeling angle 180 °, peeling speed 300 mm / min, and peeling distance 50 mm according to JIS Z0237: 2000. In addition, the universal material testing machine (made by Instron Japan) was used for the measurement.

In addition, the evaluation criteria of initial stage adhesive force are as follows.
Excellent: 1.0N to 6.0N / 20mm
Good: 0.4 N to less than 1.0 N / 20 mm, greater than 6.0 N to 10.0 N / 20 mm
Defect: less than 0.4 N / 20 mm, greater than 10.0 N / 20 mm

(Confirmation of tape floating after vacuum sputtering)
The heat-resistant adhesive tape obtained above was slit into a width of 10 mm and crimped once to a aluminum plate (100 mm square, thickness 0.5 mm, arithmetic average surface roughness Ra = 1.0 μm) with a 2 kg roller. The crimped sample is allowed to stand at 23 ° C. for 30 minutes, and then vacuum sputtering is performed for 60 minutes in a vacuum degree of 10 ^-3 to 10 ^-4 Pa using a vacuum sputtering apparatus (manufactured by Syncron Co., Ltd.)
An SiO ₂ / SiN alternate film was laminated at a total thickness of 0.5 μm. Meanwhile, it is estimated that the temperature of the sample reached up to 200-250.degree. Immediately after that, the floating of the heat-resistant adhesive tape (partial peeling of the heat-resistant adhesive tape) was visually observed, and evaluated according to the following criteria.
Excellent: The heat-resistant adhesive tape does not have a floating part: The heat-resistant adhesive tape has 1 to 9 floating parts: The heat-resistant adhesive tape has a floating part of 10 or more It was judged as "passing" above the evaluation.

(Confirmation of adhesive residue after vacuum sputtering)
After checking the heat-resistant adhesive tape for floating or not, leave it at room temperature for 1 hour and then use a universal testing machine (Instron Japan) to peel at a peel angle of 180 °, peel speed of 300 mm / min, peel distance of 50 mm. The heat-resistant adhesive tape was peeled off, and the range of 10 mm × 40 mm of the aluminum plate was observed with a microscope at a magnification of 100 times and evaluated according to the following criteria. In addition, what the tape had peeled from the aluminum plate after heating was described as measurement impossible.
Excellent: No adhesive residue is good: 1 to 9 adhesive residue defects: 10 or more adhesive residue spots The evaluation criteria were “good” or better.

The single layer films obtained in Examples 1 to 17 have no generation of wrinkles at the time of winding, are excellent in formability (film film formability), have a small thermal contraction rate and a small decrease in heating weight, and are heat resistant single layer It can be suitably used as a film. Furthermore, since the UV transmittance is good, it can be suitably used as a heat-resistant monolayer film or as a heat-resistant adhesive tape substrate having an adhesive layer. In addition, as shown in Examples 2, 3, 4, 6, and 7, the surface roughness of the surface (surface on the surface side of the single layer film) opposite to the adherend adhesive surface of the single layer film is increased. Thus, it is possible to use the heat-resistant adhesive tape more suitably with little peeling after the sputtering treatment and no adhesive residue. Furthermore, a single-layer film of a resin composition containing a sulfone resin (PES, PPSU) and a heat-resistant polyarylate or thermoplastic polyimide having a glass transition temperature of 245 ° C. or more, and Examples 15 to In the case of a single layer film using only a resin having a glass transition temperature of 245 ° C. or higher, the heat shrinkage rate at 250 ° C. is excellent. As shown in Examples 8 to 13 and 15 to 17, the heat-resistant pressure-sensitive adhesive tapes using these single-layer films are less likely to float or peel after sputtering, and are more preferable as heat-resistant pressure-sensitive tapes. It can be used.

1 Example showing the layer configuration of heat resistant adhesive tape 2 adhesive layer 3 single layer film layer (single layer film)

Claims

A monolayer film formed using a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, wherein the arithmetic average surface roughness Ra of at least one surface is larger than 0.10 μm and smaller than 10 μm.
The monolayer film according to claim 1, wherein the thermoplastic resin comprises one or more selected from the group consisting of polyetherimide, polyethersulfone, polyphenylsulfone, thermoplastic polyimide, and heat-resistant polyarylate.
The monolayer film according to claim 1, wherein the thermoplastic resin contains 15% by mass or more of a thermoplastic resin having a glass transition temperature of 245 ° C. or higher.
The thermoplastic resin according to any one of claims 1 to 3, wherein the thermoplastic resin comprises one or more additives selected from the group consisting of a heat stabilizer, an ultraviolet light absorber, an antistatic agent, a lubricant, a dye, a pigment and an inorganic filler. The single layer film as described in a term.
The monolayer film according to any one of claims 1 to 4, having a thermal shrinkage of 15% or less after exposure to an environment at 250 ° C for 1 hour.
The monolayer film according to claim 3 or 4, which has a thermal shrinkage of 5% or less after exposure to an environment at 250 ° C for 1 hour.
The monolayer film according to any one of claims 1 to 6, wherein the heating weight loss after exposure to an environment at 250 ° C for 1 hour is 5% or less.
The monolayer film according to any one of claims 1 to 7, wherein the UV transmittance is 80% or more.
For film capacitors, for speaker diaphragms, for circuit boards, for heater insulation, for glass protection, for protective films for vacuum pressure forming, for protective films for insert molding, for protective films for in-mold molding, for household electric appliance members The single-layer film according to any one of claims 1 to 8, which is a film for an automobile part member or.
The heat-resistant adhesive tape in which the acryl type or silicone type adhesive layer was laminated | stacked on the surface of the at least one side of the single layer film as described in any one of Claims 1-9.
The heat-resistant adhesive tape according to claim 10, wherein the thickness of the single layer film constituting the heat-resistant adhesive tape is 5 μm to 100 μm, and the thickness of the adhesive layer is 5 μm to 70 μm.
The pressure-sensitive adhesive layer is laminated on one surface of a single-layer film, and the arithmetic average surface roughness Ra of the surface of the single-layer film opposite to the surface on which the pressure-sensitive adhesive layer is laminated is greater than 0.10 μm and less than 10 μm. The heat-resistant adhesive tape according to claim 10 or 11.
The heat-resistant adhesive tape according to any one of claims 10 to 12, which is for masking tape.
The heat-resistant adhesive tape according to claim 13, which is a tape for a vacuum deposition process or a vacuum sputtering process.
A surface of the monolayer film on which the adhesive layer is formed, having a monolayer film containing a thermoplastic resin having a glass transition temperature of 210 ° C. or higher, and an adhesive layer formed on one surface of the monolayer film. Heat-resistant adhesive tape with a concavo-convex structure on the opposite side of.
The heat-resistant adhesive tape according to claim 12 or 15, which is attached to an adherend via an adhesive layer.
A method for producing a monolayer film according to any one of claims 1 to 9,
A thermoplastic resin with a glass transition temperature of 210 ° C. or more is melt extruded from a T die at 300 ° C. or more and 400 ° C. or less by an extrusion molding method, and a surface temperature of 110 ° C. or more and 230 ° C. or less Manufacturing method characterized by molding.